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L-25R2G12CD45-01-T-A  
◆Features  
l2*5mm Squareness LED Lamps  
lEmitting Color: Red  
lLens Color: Red Diffuse  
lMaterial: AIGaInP  
lLow power consumption  
lExcellent product quality and reliability  
lLead-free device  
◆Applications  
l Electronic sign
l Bright ambient
l Backlight  
l General purpos
◆ Package Di
Notes:  
1. All dimensions are in millimeters.  
2. Tolerance is ±0.25 unless otherwise noted.  
3. Lead spacing is measured where the leads emerge from the package.  
4. Specifications are subject to change without notice.  
5.The design and working Current for Led is not less than2mA.  
http://www.ystone.com.tw  
◆ Absolute Maximum Ratings at TA=25°C  
Parameter  
Symbol  
PD  
Value  
80  
Unit  
mW  
mA  
mA  
V
Power Dissipation  
Forward Current  
IF  
30  
Peak Forward Current*1  
Reverse Voltage  
IFP  
100  
5
VR  
Operating Temperature  
Storage Temperatu
Soldering Tempera
Topr  
-40°C To +85°C  
▲
°C  
nds  
∆
Notes:  
*1: Pulse width≤0.1ms,
*2:∆At the position of 3
*3:▲Plese refer to the
◆ Electrical /
Parameter  
st Conditions  
Forward Voltage  
Reverse Current  
IF=20mA  
VR=5V  
Dominant Wavelength  
λd  
618  
621  
628  
nm  
IF=20mA  
Peak Wavelength  
Spectral line Half-width  
Luminous Intensity  
Power Angle  
λP  
Δλ  
—
—
630  
19  
—
—
nm  
nm  
IF=20mA  
IF=20mA  
IF=20mA  
IF=20mA  
IV  
100  
—
200  
136  
400  
—
mcd  
Deg.  
2θ1/2  
Remarks:  
If special sorting is required (e.g. binning based on forward voltage, luminous intensity, or dominant wavelength),  
the typical accuracy of the sorting process is as follows:  
1.Dominant Wavelength:+/-1nm  
2.Chromatic Coordinates:+/-0.01  
3. Luminous Intensity: +/-15%  
4. Forward Voltage: +/-0.1V  
http://www.ystone.com.tw  
◆
VF Rank  
VF(V)  
Rank  
Condition  
Min  
1.8  
2.0  
2.2  
2.4  
Max  
2.0  
A2B1  
B2C1  
C2D1  
D2E1  
2.2  
IF=20mA  
2.4  
2.6  
Tolerance:±0.1V  
◆ λD Rank  
Rank  
ondition  
R2  
R3  
IF=20mA  
Tolerance:±1nm  
◆ IV Rank  
IV(mcd)  
Rank  
Condition  
Min  
Max  
I
100  
150  
J
K
150  
250  
250  
400  
IF=20mA  
Tolerance:±15%  
http://www.ystone.com.tw  
◆
Typical Electrical/Optical Characteristics Curves  
50  
40  
2.5  
2.0  
30  
20  
10  
0
1.5  
1.0  
0.5  
1.5 1.7  
50  
Fo
)  
FORW
FORW
Vs.  
50  
40  
30  
20  
10  
0
0
20  
60  
80 90  
Ambient Temperature(°C)  
Ambient Temperature(°C)  
FORWARD CURRENT  
DERATING CURVE  
LUMINOUS INTENSITY Vs.  
AMBIENT TEMPARATURE  
10°  
20°  
0°  
30°  
40°  
50°  
1.0  
0.8  
60°  
70°  
80°  
90°  
0.5  
0
SPATIAL DISTRIBUTION  
http://www.ystone.com.tw  
◆
Reliability Test Items and Conditions  
Test  
Classification  
Test Dura-  
tion  
Sample  
Size  
Test ltim  
Test Conditions  
AC/RE  
0/1  
Room Temperature DC  
Operating Life Test  
Ta=25°C±5°C,  
Life Test  
1000hrs  
22pcs  
22pcs  
If=20mA  
100°C±5°C 15min  
↓↑  
-40°C±5°C 15min  
100°C±5°C 30min  
Thermal Shock Test  
20 cycles  
0/1  
0/1  
Temperature  
C
22pcs  
Environment  
Test  
Hi
Hi
2pcs  
2pcs  
0/1  
0/1  
Hi
ag
Lo
St
2pcs  
2pcs  
0/1  
0/1  
Re
He
Mechanical  
Test  
◆
Criteria for
Criteria for Judgement  
Item  
Symbol  
VF（V）  
IR（uA）  
IV（mcd）  
condition  
IF=20mA  
VR=5V  
MIN.  
MAX.  
Forward Voltage  
Reverse Current  
---  
U.S.L*1.1  
---  
10uA  
---  
Luminous Inten-  
sity  
IF=20mA  
L.S.L*0.5  
【Note】1.USL：Upper Specification Level  
2.LSL：Lower Specification Level  
http://www.ystone.com.tw  
◆ CAUTIONS  
:
1.Lead Forming & Assembly  
• Lead forming or bending must be done before soldering, at normal temperature.  
• During lead forming, the leads should be bent at a point at least 3mm from the base  
of LED lens.  
• Do not use the base of the lead frame as a fulcrum during lead forming.  
• Avoid bending the leads at the same point more than once.  
• During assembly on PCB, use minimum clinch force possible to avoid excessive  
mechanicalstress.  
2.LED Mounting Method  
•The lead pitch os on the PCB  
during componere the lead pitch  
matches the hols
• When soldering o insulate the  
exposed leads to
•Use stand-offs oB.  
3.Soldering  
• When solderingom the epoxy  
edge. After soldo normal  
temperature.DO the lead frame  
during the solde
温度℃  
焊接时间  
时间（秒）  
• When using soldering iron .please solder once for less than 5 seconds at a maximum  
Temperature of 300°C.When soldering a row of LED on a PCB. Please do not solder  
both  
Leads of a LED in sequence. (Solder all the positive lead first .then all the negative  
leads).  
• Do not dip the epoxy encapsulation part of LED into any soldering paste liquid.  
• After soldering .do not adjust the location of the LED anymore .  
http://www.ystone.com.tw  
• When attaching electronic parts to a PCB with LEDs .the curing time for the whole  
PCB  
Should be less than 60 seconds .at less than a temperature of 120°C.  
4.Cleaning:  
• Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if  
necessary.  
5.Storage  
• The storage ambient for the LEDs should not exceed 30℃ temperature or 70% rela-  
tive humidity.  
• It is recommendd within three  
months. For extcommended that  
the LEDs be stoor in desiccators  
with nitrogen am
6.ESD ( Electros
Static Electricity
Suggestions to p
• All devices, equ
• Use a conductivg these LEDs.  
• Maintain a hum
• Use anti-static p
7.Recommended
• Please only use s whether one  
LED or multipl
• Sudden surge cign circuit with  
care to no suddeing the circuit on  
or off.  
http://www.ystone.com.tw