6SD4516VGB01MAZ1--Datasheet/数据表在线中文翻译

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6SD4516VGB01MAZ1

◆ Outline (L* W*H): 4.5*1.6*1.7mm

◆Good thermal dissipation & Optical uniformity

Features

Table of Contents

Product Code Method --------------------------------------------3



Forward current: red&blue&green:≦30mA ,

Typical view angle 50% Iv: 120°

Lens color code: white diffused

EIA STD package

Maximum Rating -------------------------------------------------3

Typical Product Characteristics --------------------------------4

Range of Bins -----------------------------------------------------5

Relative Spectral Power Distribution---------------------------6

Typical Diagram Characteristics of Radiation----------------6

Relative Spectral Power Distribution--------------------------7

Dimensions -------------------------------------------------------9

PIN Configuration ---------------------------------------------10

Reflow Profile----------------------------------------------------11

Test Circuit and Handling Precautions-----------------------12

Packing-------------------------------------------------------------13

Precautions-------------------------------------------------------15

Test Items and Results of Reliability-------------------------16

RoHS2.0 and REACH-compliant

Preconditioning: accelerate to JEDEC level 2a

ESD level 2KV(HBM)\

Reliability Test: AEC Q-102qualified

Applications



Indoor signage display applications

Indoor decorating and entertainment design

Flat backlight for LCD. Switch and symbol

Indicator and backlighting for all consumer

electronics



Automotive electronics

Others applications

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 Product Code Method

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6 - S - D -4516 - VGB0 - 1 - M - A - Z1

①

② ③

④

⑤

⑥ ⑦

⑧

⑨

①

②

③

④

⑤

Dice Wavelength

&Luminous Rank

V : red

Process Type

Category

LED Type

Lead Frame Size

4516:

6: special product

S: SMD LED

D: PLCC side view

G : green

4.5*1.6mm

B : blue

⑥

⑦

⑧

⑨

Lap Polarity

Cap Color

PCB Module Code

Flow Code

Z: Zener

1: no expression above meaning for

company

1: common anode

M: white diffused

A :article mode

 Maximum Rating(Ta=25℃)

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Characteristics

Symbol

Typical

Unit

R&G&B≦30

DC Forward Current

Pulse Forward Current^*3

Reverse Voltage

I_F

I_PF

mA

V

80

V_R

P_D

5

G&B: ≦100 / R: ≦80

125

Power Dissipation

mW

^oC

Junction Temperature

Operating Temperature Range

Storage Temperature Range

Soldering Temperature^*4

T_J

T_OP

T_STG

T_SD

-40℃to+105℃

260

Thermal Resistance Junction/

Solder Point

℃/W

RTH_J-S

130

Notes 1: There is no maximum or typical voltage parameter

2: For other ambient, limited setting of current will be depended on de-rating curves.

3: Duty 1/10, pulse width 0.1ms

4: The maximum of soldering time is 10 seconds in T_SD

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 Typical Product Characteristics(Ta=25℃)

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Characteristics

Symbol

Min

Typical

Max

Unit

Test condition

R

1.8

2.9

2.8

-

2.1

3.1

3.2

-

2.4

3.5

3.6

10

--

Forward Voltage

Reverse Current

V_F

G

B

V

I_F=20mA

V_R= 5V

I_R

μA

R

G

B

R

G

B

--

650

1800

400

-

Luminous Intensity

Iv

--

mcd

I_F=20mA

--

618

520

460

-

628

530

470

-

λd

Dominant Wavelength

-

nm

I_F=20mA

-

View Angle

2θ_1/2

120

deg

Notes: 1. Measurement Errors:

Forward Voltage: ±0.1V, Luminous Intensity: ±10%Iv, Dominant Wavelength: ±1.0nm

2. Electrical-Optical Characteristics (Ta=25℃)

3. We will amend the Bin code to maintain Bin Code centralize,

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 Range of Bins (Ta=25℃)

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1).Luminous Intensity Bins (I_F=20mA)

Min. Iv

(mcd)

Max. Iv

(mcd)

Bin code

19

20

21

23

24

25

16

17

18

500

630

800

R

800

1000

1600

2000

2500

320

1250

1600

2000

250

G

B

320

400

500

2).Dominant Wavelength Bins (I_F=20mA)

Min. λd

Max. λd

(nm)

Bin Code

(nm)

V1

V2

G5

G6

B3

B4

618

623

628

525

530

465

470

R

623

520

525

460

465

G

B

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 Relative Spectral Power Distribution

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100%

80%

60%

40%

20%

0%

380

420

460

500

540

580

620

660

700

740

780

Wavelength(nm)

 Typical Diagram Characteristics of Radiation

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 Electronic-Optical Characteristics

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Relative Forward Current vs. Forward Voltage

Relative Forward Voltage vs. Solder Temperature

30

0.8

0.6

0.4

0.2

0

25

20

15

10

5

-0.2

-0.4

-0.6

0

-40

-10

20

50

80

110

140

1.6

2

2.4

2.8

3.2

3.6

Forward Voltage VF(V)

Solder Temperature(℃)

Relative Intensity vs. Forward Current

Relative Intensity vs. Solder Temperature

200%

160%

120%

80%

40%

0%

150%

100%

50%

0%

0

5

10

15

20

25

30

-40

-10

20

50

80

110 140

Forward Current(mA)

Solder Temperature(℃)

Wavelength shift vs. Forward Current

Wavelength shift vs. Solder Temperature

6.0

8

6

4.0

2.0

4

2

0.0

0

-2.0

-4.0

-2

-4

-40 -20

0

20 40 60 80 100 120 140

0

5

10

15

20

25

30

Solder Temperature(℃)

Forward Current（mA）

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 Thermal Design for De-rating

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The maximum forward current is determined by the thermal resistance between the LED junction and

solder point. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance

from the solder point to ambient in order to optimize lamp life and optical characteristics. The graph is lighting

with one chip on board

40

35

30

25

20

15

10

5

0

20

40

60

80

100

120

Solder Point Temperature(℃)

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 Dimensions

§

All dimensions are in millimeters.

Tolerance is ±0.1mm unless other specified

Specifications are subject to change without notice

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 PIN Configuration

No.

1

Symbol

B led +

B led -

G led +

G led -

R led +

R led -

Function description

Blue led anode

Blue led cathode

Green led anode

Green led cathode

Red led anode

2

3

4

5

6

Red led cathode

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 Reflow Profile

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SMT Reflow Soldering Profile

tp

Critical Zone

T

P

L

T to T

L

P

Ramp-up

t_L

TS max

TS min

ts

Preheat

Ramp-down

25

t 25℃ to Peak

Time

Pb-Free (SnAgCu) Assembly

Profile Feature

Symbol

Unit

Min.

Recommendation

Max.

Ramp-up rate to preheat (25°C to 150°C)

Time t_S(T_{S min}to T_{S max}

-

t_S

-

60

-

2

3

120

3

K/s

s

100

2

)

-

K/s

°C

s

Ramp-up rate to peak (T_{S max}to T_P)

Liquidus temperature

T_L

t_L

T_P

-

217

80

-

Time above liquidus temperature

Peak temperature

-

100

260

-

245

°C

Time within 5 °C of the specified

peak temperature T_P- 5 K

t_P

-

10

s

Ramp-down Rate (T_Pto 100 °C)

Time 25 °C to T_P

-

3

-

4

K/s

s

480

Notes:

1. Do not stress the silicone resin while it is exposed to high temperature.

2. The reflow process should not exceed 3 times.

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 Test Circuit and Handling Precautions

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1. Test circuit

V

LED

2. Handling precautions

2.1. Over-current-proof

Customer must apply resistors for protection; otherwise slight voltage shift will cause big current

change (Burn out will happen).

2.2. Storage

1). It is recommended to store the products in the following conditions:

Humidity: 60% R.H. Max.

Temperature: 5℃~30℃(41℉~86℉)

2). Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is Opened,

the products should be used within four weeks or they should be keeping to stored at ≦20%R.H. with

zip-lock sealed.

2.3. Baking

If the package has been opened for more than 4 weeks or over than 12 months in sealed bag. it is

recommended to bake the products with the following instruction:

1). for reel type , backing at 60~65℃ for 6 hours

2). for single LED, backing at 125±3℃ for 1hrs,

It shall be normal to see slight color fading of carrier (light yellow) after baking in process

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 Packing

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

Dimensions of Reel (Unit: mm)

13±0.5

12.5±0.5

18max

Note: 01.The tolerance unless mentioned is ±0.2mm.

02.The measured unit is "mm".



Dimensions of Tape (Unit: mm)



Arrangement of Tape

Empty parts

(min.10)

Empty Parts

(min.40)

Loaded Parts

(LED)

Feeding Direction

Cover Tape

Emboss Tape

Introduction Parts

(Min.160mm)

Conclusion Parts

(Min.40mm)

Notes:

1. Empty component pockets sealed with top cover tape

2. The max number of consecutive missing SMD is 2pcs;

3. The cathode is put towards the tape sprocket hole in accordance with ANSI/EIA

RS-481 specifications;

4. 2000 pcs per reel;

5. The remainders will be packed in a multiplication of 500pcs.

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 Packing

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

Packaging Specifications

Moisture-poof bag

Reel(4000pcs)

Label

inspection request form

Inner box(Max. 6 reels)

Label

Outer box(Max. 4 inner boxes)

Notes:

Reeled product (max. 2000) is packed in a sealed moisture-proof bag. Six bags are packed in an

inner box (size: about 260 X 230 X 100 mm) and four inner boxes are in an outer box (size: about 480 X

275 X 215 mm). On the label of moisture-poof bag, there should be the information of Part No., Lot No.

and quantity number; also the total quantity number should be on inspection request form on outer box.

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 Precautions

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1. Abnormal situation caused by improper setting of collet

To choose the right collet is the key issue in improving the product’s quality. LED is different from other

electronic components, which is not only about electrical output but also for optical output. This characteristic

made LED more fragile in the process of SMT. If the collet’s lowering down height is not well set, it will bring

damage to the gold wire at the time of collet’s picking up and loading which will cause the LED fail to light up,

light up now and then or other quality problems

2. How to choose the collet

During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case

that improper position of collet will damage the gold wire inside the LED. Different collets fit for different

products, please refer to the following pictures cross out

Outer diameter of collet should be larger than the lighting area

Picture 1()

3. Other points for attention

Picture 2(X)

A. No pressure should be exerted to the epoxy shell of the SMD under high temperature.

B. Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy

to break.

C. LED should be used as soon as possible when being taken out of the original package, and should be

stored in anti-moisture and anti-ESD package.

4. This usage and handling instruction is only for your reference.

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 Test Items and Results of Reliability

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Duration/

Cycle

Number of

Damage

Test Item

Test Conditions

Reference

–40℃ 30min

↑↓5min

105℃ 30min

1000 cycles

1000 hrs

0/26

JESD22 A-106

JESD22 A-103B

Thermal Shock

High Temperature

Storage

T_a=105℃

T_a=-40℃

Low Temperature

Storage

1000 hrs

0/26

JESD22 A-119

JESD22 A-108

JESD22 A-101

T_a=25℃

If=20mA

Life Test

85℃ RH=85%

High Humidity Heat

Operation

If=20mA

T_a=105℃

If=20mA

High Temperature

Operation

1000 hrs

3 times

0/26

0/30

JESD22 A-108C

ANSI/JEDEC

JS-001

2KV at 1.5kΩ;100pF

ESD(HBM)

Failure Criteria

Criteria for Judgment

Item

Symbol

Condition

Min

Max

USL¹×1.1

10μA

-

V_F

I_R

If=20mA

V_R=5V

-

Forward Voltage

Reverse Current

Luminous Intensity

-

Iv

If=20mA

LSL²×0.7

[Note] USL*¹: Upper Specification Level

LSL*²: Lower Specification Level

Note: Version updates will not be announced and Yellow Stone Corp. will have the final interpretation rights

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