1SC5050VGB00CB05--Datasheet/数据表在线中文翻译

The RGB Series

1SC5050VGB00CB05

◆Outline (L* W*H): 5.0*5.0*1.6mm

◆Good thermal dissipation & optical uniformity

Features

Table of Contents

 Forward current: R≦50mA ;G&B≦30mA

 Typical view angle 50% Iv: 120°

 Lens color: water transparent

 RoHS and REACH-compliant

 Qualified according to JEDEC moisturevity

Level 5

Product Code Method------------------------------------------2

Maximum Rating-----------------------------------------------2

Typical Product Characteristics------------------------------3

Range of Bins---------------------------------------------------3

Color Coordinate Comparison-------------------------------5

Electronic-Optical Characteristics---------------------------6

Dimensions -----------------------------------------------------7

Reflow Profile--------------------------------------------------8

Test Circuit and Handling Precautions----------------------9

Packing------------------------------------------------------------10

Precautions -----------------------------------------------------12

Test Items and Results of Reliability------------------------13

 ESD level 1kV(HBM)

Applications

 Indoor decorating

 Outdoor lighting for amusement

 Consumer electronics

 Other applications

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The RGB Series

 Product Code Method

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1 - S - C - 5050 - VGB0 - 0 - C - B - 05

①

② ③

④

⑤

⑥

⑦

⑧

⑨

①

②

③

④

⑤

Dice wavelength

&luminous rank

V:red

Process Type

Category

LED Type

Lead Frame Size

C: PLCC top view

D: PLCC side view

5050:

1: normal process

S: SMD LED

G:green

5.0*5.0mm

B:blue

⑥

⑦

⑧

⑨

Lap Polarity

Cap Color

PCB Module Code

Flow Code

0: non-common anode and

non-common cathode

05: no expression above

meaning for company

C: water transparent

B: article mode

 Maximum Rating(Ta=25℃)

------------------------------------------------------------------------------------------------------------------------------------

Characteristics

Symbol

Rating

Unit

G&B≦30 / R≦50

DC Forward Current

Pulse Forward Current^*3

Reverse Voltage

I_F

I_PF

mA

V

100

V_R

P_D

5

G&B:80 / R:100

110

Power Dissipation

mW

^oC

Junction Temperature

Operating Temperature Range

Storage Temperature Range

Soldering Temperature^*4

T_J

T_OP

T_STG

T_SD

-40~85

^oC

-40~100

260

^oC

Notes 1: There is no maximum or typical voltage parameter

2: For other ambient, limited setting of current will be depended on de-rating curves.

3: Duty 1/10, pulse width 0.1ms

4: The maximum of soldering time is 5 seconds in T_SD

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The RGB Series

 Typical Product Characteristics(Ta=25℃)

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Characteristics

Symbol

Min.

Typ.

Max.

Unit

Test condition

R

1.8

2.8

-

2.0

3.2

-

2.6

3.6

10

-

I_F=20mA

V_R= 5V

Forward Voltage

Reverse Current

V_F

G

B

V

I_R

μA

R

G

B

R

G

B

575

1280

245

615

520

461

-

700

1750

320

-

I_F=20mA

Luminous Intensity

Iv

-

mcd

-

630

535

476

-

Dominant Wavelength

λd

-

nm

-

View Angle

2θ_1/2

120

deg

Notes: 1. Measurement Errors:

Forward Voltage: ±0.1V, Luminous Intensity: ±10%Iv, Dominant Wavelength: ±1.0nm

2. Electrical-Optical Characteristics (Ta=25℃)

 Range of Bins (I_F=20mA)

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1).Forward Voltage Bins (I_F=20mA)

Min. V_F

(V)

Max. V_F

(V)

Bin code

1.8

2.0

C

D

E

F

2.0

2.2

2.4

2.2

2.4

2.6

R

J

2.8

3.0

3.2

3.4

3.0

3.2

3.4

3.6

K

L

M

G&B

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The RGB Series

 Range of Bins

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2).Luminous Intensity Bins

Min. Iv

(mcd)

575

Max. Iv

(mcd)

720

Bin code

13

14

15

12

13

14

11

12

13

720

900

1125

1600

2000

2500

305

R

1280

1600

2000

245

G

B

305

385

480

3).Dominant Wavelength Bins (I_F=20mA)

Min. λd

Max. λd

(nm)

Bin Code

(nm)

2

3

4

2

3

4

2

3

4

615

620

625

630

525

530

535

466

471

476

R

620

625

520

525

530

461

466

471

G

B

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The RGB Series

 Color Coordinate Comparison

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Color Rank

Bin code

x

y

x

y

x

y

x

y

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

0.307

0.3072

0.2948

0.2819

0.2712

0.2578

0.2482

0.2605

0.2134

0.2607

0.3332

0.3196

0.3064

0.294

0.3287

0.3504

0.3091

0.3318

0.2899

0.3132

0.3524

0.3132

0.3504

0.2797

0.3036

0.2609

0.2849

0.2408

0.2646

0.1996

0.2244

0.1792

0.2056

0.1588

0.1862

0.2948

0.2824

0.2712

0.2605

0.2482

0.2387

0.2513

0.2387

0.2824

0.355

0.3091

0.3318

0.2899

0.3132

0.27

0.2712

0.2605

0.2482

0.2387

0.2227

0.2134

0.2299

0.2719

0.342

0.2865

0.3091

0.2667

0.2899

0.247

0.2819

0.2712

0.2578

0.2482

0.232

0.3287

0.2865

0.3091

0.2667

0.2899

0.3318

0.293

0.27

0.2227

0.2387

0.204

0.3358

0.3695

0.3036

0.3243

0.2849

0.3068

0.2643

0.2863

0.225

0.3132

0.315

0.3319

0.2609

0.2851

0.2406

0.264

0.3524

0.2849

0.3066

0.2648

0.2863

0.2444

0.2671

0.2444

0.2669

0.225

0.2513

0.3191

0.3064

0.2944

0.282

0.342

0.328

0.3332

0.3196

0.3068

0.294

0.3196

0.3072

0.294

0.22

0.2783

0.2672

0.2783

0.2672

0.2513

0.241

0.2672

0.2585

0.2672

0.2579

0.241

0.2444

0.22

0.282

0.2513

0.2407

0.2243

0.2148

0.1973

0.1886

0.241

0.2444

0.1996

0.225

0.2471

0.2056

0.2273

0.1862

0.2075

0.232

0.2148

0.2061

0.1886

0.1802

0.2471

0.2056

0.2273

0.232

0.1792

0.2056

0.2243

0.2148

0.2061

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The RGB Series

 Electronic-Optical Characteristics

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1). Relative Spectral Distribution

2). Typical Spatial Distribution

Wavelength (nm)

3). Relative Luminous Flux .Current

4). Relative Luminous Flux .Ambient Temperature

10000

110%

100%

1000

90%

80%

70%

100

10

0

20

40

60

80

100

30

25

20

0

5

10

15

Ambient Temperature(℃)

)

urrent (mA

rd C

Forwa

5). Electrical Characteristics

6). Forward Voltage Temperature

30

25

20

15

10

3.4

3.2

3.0

2.0

1.8

1.6

5

0

1.5

2.5

Forward Voltage VF(V)

3

3.5

2

25

45

65

85

Ambient Temperature(℃)

105

7). Wavelength and current

8). Thermal Design

50

620

600

40

30

20

520

500

470

450

10

0

420

50

40

0

10

20

30

(mA)

rrent

ard Cu

Forw

0

20

40

60

80

100

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The RGB Series

 Dimensions

------------------------------------------------------------------------------------------------------------------------------------

Recommend Padlayout

RECOMMEND PADLAYOUT

2

2.4

§ All dimensions are in millimeters.

§ Tolerance is ±0.1mm unless other specified

§ Specifications are subject to change without notice

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The RGB Series

 Reflow Profile

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1. I_Rreflow soldering Profile for Lead Free solder

300

℃

10sec. max

1-5℃/sec

260℃ max

230℃ max

250

2-5℃/sec

Pre heating 150-180℃

2-5℃/sec

200

150

100

50

120sec.Max

50sec.max

25℃

0

50

100

150

200

250

300

sec

Time

Notes:

1. We recommend the reflow temperature 240℃ (±5℃).the maximum soldering temperature should be

limited to 260℃.

2. Don’t cause stress to the silicone resin while it is exposed to high temperature.

3. Number of reflow process shall be less than 3 times.

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The RGB Series

 Test Circuit and Handling Precautions

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1. Test circuit

V

LED

2. Handling precautions

2.1. Over-current-proof

Customer must apply resistors for protection; otherwise slight voltage shift will cause big current

change (Burn out will happen).

2.2. Storage

1). It is recommended to store the products in the following conditions:

Humidity: 60% R.H. Max.

Temperature : 5℃~30℃(41℉~86℉)

2). Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is Opened,

the products should be used within 48 hours or they should be keeping to stored at ≦20%R.H. with

zip-lock sealed.

2.3. Baking

Suggest packing open after 48 hours, before use baking products, conditions as follows:

1). 60±3℃ X 6hrs and ＜5%RH, for reel

2). 125±3℃ X 2hrs, for single LED

It shall be normal to see slight color fading of carrier (light yellow) after baking in process

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The RGB Series

 Packing

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

Dimensions of Reel (Unit: mm)

13±0.5

12.4±0.2

18.4max

Note: 01.The tolerance unless mentioned is ±0.2mm.

02.The measured unit is "mm".



Dimensions of Tape (Unit: mm)



Arrangement of Tape

Empty parts

(min.10)

s

Empty

Parts

Loaded Part

(LED)

(min.40)

Feeding Direction

Cover Tape

Emboss Tape

Introduction Parts

(Min.160mm)

Conclusion Parts

(Min.40mm)

Notes:

1. Empty component pockets are sealed with top cover tape

2. The max loss number of SMD is 2pcs

3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481

specifications

4. 1000pcs per reel

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The RGB Series

 Packing

-----------------------------------------------------------------------------------------------------------------------------------



Packaging specifications

Moisture-poof bag

Reel(1000pcs)

Label

inspection request form

Inner box(Max. 5 reels)

Label

Outer box(Max. 4 inner boxes)

Notes:

Reeled product (max.1000) is packed in a sealed moisture-proof bag. Five bags are packed in an inner

box (size: about 260 X 230 X 100 mm) and four inner boxes are in an outer box (size: about 480 X 275 X

215mm). On the label of moisture-poof bag, there should be the information of Part No., Lot No. and

quantity number; also the total quantity number should be on inspection request form on outer box.

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The RGB Series

 Precautions

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1. Abnormal situation caused by improper setting of collet

To choose the right collet is the key issue in improving the product’s quality. LED is different from other

electronic components, which is not only about electrical output but also for optical output. This

characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not well

set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the

LED fail to light up, light up now and then or other quality problems

2. How to choose the collet

During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in

case that improper position of collet will damage the gold wire inside the LED. Different collets fit for

different products, please refer to the following pictures cross out

Outer diameter of collet should be larger than the lighting area

Picture 1()

Picture 2(X)

3. Other points for attention

A. No pressure should be exerted to the epoxy shell of the SMD under high temperature.

B. Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out

easy to break.

C. LED should be used as soon as possible when being taken out of the original package, and should

be stored in anti-moisture and anti-ESD package.

4. This usage and handling instruction is only for your reference.

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The RGB Series

 Test Items and Results of Reliability

------------------------------------------------------------------------------------------------------------------------------

Duration/

Cycle

Number of

Damage

Test Item

Ac/Re

Test Conditions

Reference

Ta＝23℃(±5℃)

Normal Temperature Life

High Temperature Life

JESD22 A-108

1008 hrs

0/1

0/22

I_F=20mA

Ta＝85℃(±5℃)

I_F=20mA

Ta＝85℃(±5℃)

RH=85%

High Humidity Heat Life

Thermal shock

JESD22 A-108

JESD22 A-104

1008 hrs

0/1

0/22

I_F=20mA

-45℃/30min~105℃

/30min

(±5℃)

According to the

SPEC

Electrostatic Discharge (ESD)

Test

AEC Q101-001

JESD22-A103D

3 cycles

1008 hrs

0/1

0/22

Low Temperature Storage

High Temperature Storage

T_a=-40℃

T_a=125℃

*Criteria for Judging

Item

Criteria for Judgment of Pass

Symbol

Condition

Min

Max

USL*¹×1.1

10μA

Forward Voltage

Reverse Current

V_F

I_R

I_F=20mA

V_R= 5V

-

Luminous Intensity

Iv

I_F=20mA

LSL^*2×0.7

-

[Note] USL*¹: Upper Specification Level

LSL*²: Lower Specification Level

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