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Document Number: MC34713  
Rev. 4.0, 5/2007  
Freescale Semiconductor  
Advance Information  
5.0 A 1.0 MHz Fully Integrated  
Single Switch-Mode Power  
Supply  
34713  
The 34713 is a highly integrated, space efficient, low cost, single  
synchronous buck switching regulator with integrated N-channel  
power MOSFETs. It is a high performance point-of-load (PoL) power  
supply with the ability to track an external reference voltage in  
different configurations.  
SWITCH-MODE POWER SUPPLY  
Its high efficient 5.0 A continuous output current capability  
combined with its voltage tracking/sequencing ability and tight output  
regulation, makes it ideal as a single power supply.  
The 34713 offers the designer the flexibility of many control,  
supervisory, and protection functions to allow for easy implementation  
of complex designs. It is housed in a Pb-Free, thermally enhanced,  
and space-efficient 24-Pin Exposed Pad QFN.  
Features  
• 45 mIntegrated N-Channel Power MOSFETs  
• Input Voltage Operating Range from 3.0 V to 6.0 V  
EP SUFFIX  
98ARL10577D  
24-PIN QFN  
±1 % Accurate Output Voltage, Ranging from 0.7 V to 3.6 V  
• Voltage Tracking Capability in different configurations.  
• Programmable Switching Frequency Range from 200 kHz to  
1.0 MHz with a default of 1.0 MHz  
• Programmable Soft Start Timing  
• Over Current Limit and Short Circuit Protection  
• Thermal Shutdown  
• Output Overvoltage and Undervoltage Detection  
• Active Low Power Good Output Signal  
• Active Low Shutdown Input  
ORDERING INFORMATION  
Temperature  
Package  
Device  
Range (T )  
A
MC34713EP/R2  
-40 to 85°C  
24 QFN  
• Pb-Free Packaging Designated by Suffix Code EP.  
(3.0V TO 6.0V) VIN  
34713  
VMASTER  
VIN  
PVIN  
BOOT  
SW  
VREFIN  
PGND  
VDDI  
V
OUT  
INV  
FREQ  
ILIM  
COMP  
VOUT  
VIN  
MICROCONTROLLER  
DSP,  
FPGA,  
ASIC  
PG  
SD  
GND  
Figure 1. 34713 Simplified Application Diagram  
* This document contains certain information on a new product.  
Specifications and information herein are subject to change without notice.  
© Freescale Semiconductor, Inc., 2007. All rights reserved.  
INTERNAL BLOCK DIAGRAM  
INTERNAL BLOCK DIAGRAM  
SD  
Internal  
Voltage  
Regulator  
VIN  
Thermal  
Monitoring  
PG  
M2  
System  
Reset  
System  
Control  
M1  
VDDI  
BOOT  
PVIN  
ILIMIT  
Discharge  
VIN VBOOT  
Buck  
Control  
Logic  
Oscillator  
FSW  
Prog Frequency  
M3  
M4  
FREQ  
ILIM  
Gate  
Driver  
ISENSE  
SW  
Prog Soft Start  
ISENSE  
Current  
Monitoring  
ILIMIT  
PWM  
Comparator  
VDDI  
PGND  
COMP  
VDDI  
Ramp  
Generator  
VBG  
Bandgap  
Regulator  
Error  
Amplifier  
INV  
VREFIN  
GND  
Reference  
Selection  
VBG  
M5  
VOUT  
Discharge  
Figure 2. 34713 Simplified Internal Block Diagram  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
2
PIN CONNECTIONS  
PIN CONNECTIONS  
20 19  
22 21  
24  
23  
GND  
FREQ  
ILIM  
1
PVIN  
18  
17  
16  
2
3
SW  
SW  
Transparent  
Top View  
4
15 SW  
PG  
NC  
14  
13  
PGND  
PGND  
5
6
SD  
12  
8
9
10  
11  
7
Figure 3. 34713 Pin Connections  
Table 1. 34713 Pin Definitions  
A functional description of each pin can be found in the Functional Pin Description section beginning on page 9.  
Pin Number Pin Name Pin Function  
Formal Name  
Definition  
Analog signal ground of IC  
1
2
3
4
GND  
FREQ  
ILIM  
Ground  
Passive  
Input  
Signal Ground  
Frequency Adjustment  
Soft Start  
Buck converter switching frequency adjustment pin  
Soft Start adjustment  
Active-low (open drain) power-good status reporting pin  
PG  
Output  
Power Good  
No internal connections to these pins. Recommend attaching a 0.1µF  
capacitor from pin 8 to GND.  
5, 8  
6
None  
Input  
No Connect  
Shutdown  
NC  
Shutdown mode input control pin  
SD  
VREFIN  
COMP  
INV  
Voltage-Tracking-  
Reference Input  
Voltage-Tracking-Reference voltage input  
7
Input  
Buck converter external compensation network pin  
Buck converter error amplifier inverting input pin  
9
Passive  
Input  
Compensation  
Error Amplifier  
Inverting Input  
10  
Discharge FET drain connection (connect to buck converter output  
capacitors)  
Output Voltage  
Discharge FET  
11  
VOUT  
Output  
Ground return for buck converter and discharge FET  
Buck converter power switching node  
12,13,14  
15,16,17  
PGND  
SW  
Ground  
Power  
Power Ground  
Switching Node  
Power-Circuit Supply Buck converter main supply voltage input  
Input  
18,19,20  
21  
PVIN  
BOOT  
VIN  
Supply  
Passive  
Supply  
Bootstrap switching node (connect to bootstrap capacitor)  
Bootstrap  
Logic-Circuit Supply  
Input  
Logic circuits supply voltage input  
22,23  
Internal Voltage  
Regulator  
Internal Vdd Regulator (connect filter capacitor to this pin)  
24  
VDDI  
Passive  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
3
ELECTRICAL CHARACTERISTICS  
MAXIMUM RATINGS  
ELECTRICAL CHARACTERISTICS  
MAXIMUM RATINGS  
Table 2. Maximum Ratings  
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or  
permanent damage to the device.  
Ratings  
Symbol  
Value  
Unit  
ELECTRICAL RATINGS  
Input Supply Voltage (VIN) Pin  
VIN  
-0.3 to 7.0  
-0.3 to 7.0  
-0.3 to 7.5  
-0.3 to 7.5  
-0.3 to 7.0  
-0.3 to 3.0  
+5.0  
V
V
V
V
V
V
A
High-Side MOSFET Drain Voltage (PVIN) Pin  
Switching Node (SW) Pin  
PVIN  
VSW  
BOOT Pin (Referenced to SW Pin)  
PG, VOUT,and SD Pins  
VBOOT - VSW  
-
-
VDDI, FREQ, ILIM, INV, COMP, and VREFIN Pins  
Continuous Output Current (1)  
ESD Voltage (2)  
IOUT  
VESD1  
±2000  
±750  
V
Human Body Model  
Charge Device Model  
V
ESD3  
THERMAL RATINGS  
Operating Ambient Temperature (3)  
Storage Temperature  
TA  
TSTG  
TPPRT  
TJ(MAX)  
PD  
-40 to 85  
-65 to +150  
Note 5  
°C  
°C  
°C  
Peak Package Reflow Temperature During Reflow (4)  
Maximum Junction Temperature  
Power Dissipation (TA = 85 °C) (6)  
Notes  
,
(5)  
+150  
2.9  
°C  
W
1. Continuous output current capability so long as T is TJ(MAX)  
.
J
2. ESD1 testing is performed in accordance with the Human Body Model (C  
accordance with the Charge Device Model (CDM).  
=100 pF, R  
=1500 ), ESD3 testing is performed in  
ZAP  
ZAP  
3. The limiting factor is junction temperature, taking into account power dissipation, thermal resistance, and heatsinking.  
4. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may  
cause malfunction or permanent damage to the device.  
5. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow  
Temperature and Moisture Sensitivity Levels (MSL),  
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.  
MC33xxxD enter 33xxx), and review parametrics.  
6. Maximum power dissipation at indicated ambient temperature  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
4
ELECTRICAL CHARACTERISTICS  
MAXIMUM RATINGS  
Table 2. Maximum Ratings (continued)  
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or  
permanent damage to the device.  
Ratings  
Symbol  
Value  
Unit  
THERMAL RESISTANCE (7)  
Thermal Resistance, Junction to Ambient, Single-Layer Board (1s) (8)  
Thermal Resistance, Junction to Ambient, Four-Layer Board (2s2p) (9)  
Thermal Resistance, Junction to Board (10)  
RθJA  
RθJMA  
RθJB  
139  
43  
°C/W  
°C/W  
°C/W  
22  
Notes  
7. The PVIN, SW, and PGND pins comprise the main heat conduction paths.  
8. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.  
9. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. There are no thermal vias connecting the package to the two planes in the  
board.  
10. Thermal resistance between the device and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top  
surface of the board near the package.  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
5
ELECTRICAL CHARACTERISTICS  
STATIC ELECTRICAL CHARACTERISTICS  
STATIC ELECTRICAL CHARACTERISTICS  
Table 3. Static Electrical Characteristics  
Characteristics noted under conditions 3.0 V VIN 6.0 V, -40°C TA 85°C, GND = 0 V unless otherwise noted. Typical  
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.  
Characteristic  
IC INPUT SUPPLY VOLTAGE (VIN)  
Symbol  
Min  
Typ  
Max  
Unit  
Input Supply Voltage Operating Range  
VIN  
IIN  
3.0  
-
-
-
6.0  
25  
V
Input DC Supply Current (11)  
mA  
Normal Mode: SD = 1, Unloaded Outputs  
Input DC Supply Current (11)  
Shutdown Mode, SD = 0  
IINOFF  
-
-
100  
µA  
V
INTERNAL SUPPLY VOLTAGE OUTPUT (VDDI)  
Internal Supply Voltage Range  
VDDI  
2.35  
2.5  
2.65  
BUCK CONVERTER (PVIN, SW, PGND, BOOT, INV, COMP, ILIM)  
Output Voltage Adjustment Range (12), (13)  
Output Voltage Accuracy (12), (14)  
VOUT  
-
0.7  
-
-
3.6  
1.0  
V
-1.0  
%
Line Regulation (12)  
REGLN  
REGLD  
-1.0  
-1.0  
-
-
1.0  
1.0  
%
%
Normal Operation, VIN = 3.0 V to 6.0 V, IOUT = +5.0 A  
Load Regulation (12)  
Normal Operation, IOUT = 0.0 A to 5.0 A  
Error Amplifier Common Mode Voltage Range (12), (13)  
Output Undervoltage Threshold  
Output Overvoltage Threshold  
Continuous Output Current  
V
0.0  
-1.5  
1.5  
-
-
1.35  
-8.0  
8.0  
5.0  
-
V
%
%
A
REF  
VUVR  
VOVR  
IOUT  
-
-
-
Over Current Limit  
ILIM  
-
6.5  
-
A
Soft start Adjusting reference Voltage Range  
Short Circuit Current Limit  
VILIM  
ISHORT  
1.25  
-
VDDI  
-
V
8.5  
A
(12)  
High-Side N-CH Power MOSFET (M3) RDS(ON)  
RDS(ON)HS  
10  
10  
-
-
45  
45  
mΩ  
mΩ  
IOUT = 1.0 A, VBOOT - VSW = 3.3 V  
(12)  
Low-Side N-CH Power MOSFET (M4) RDS(ON)  
RDS(ON)LS  
IOUT = 1.0 A, VIN = 3.3 V  
Notes  
11. Section “MODES OF OPERATION”, page 12 has a detailed description of the different operating modes of the 34713  
12. Design information only, this parameter is not production tested.  
13. The ±1% accuracy is only guaranteed for VEFOUT greater then or equal 0.7V at room tempreature.  
14. Overall output accuracy is directly affected by the accuracy of the external feedback network, 1% feedback resistors are recommended  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
6
ELECTRICAL CHARACTERISTICS  
STATIC ELECTRICAL CHARACTERISTICS  
Table 3. Static Electrical Characteristics  
Characteristics noted under conditions 3.0 V VIN 6.0 V, -40°C TA 85°C, GND = 0 V unless otherwise noted. Typical  
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
M2 RDS(ON)  
RDS(ON)M2  
1.5  
-
4.0  
VIN = 3.3 V, M2 is on  
PVIN Pin Leakage Current  
Shutdown Mode  
IPVIN  
-10  
-
10  
µA  
INV Pin Leakage Current  
IINV  
-1.0  
-
1.0  
µA  
°C  
°C  
Thermal Shutdown Threshold (15)  
Thermal Shutdown Hysteresis (15)  
OSCILLATOR (FREQ)  
TSDFET  
TSDHYFET  
-
-
170  
25  
-
-
Oscillator Frequency Adjusting Reference Voltage Range  
VFREQ  
0.0  
-
VDDI  
V
TRACKING (VREFIN, VOUT)  
VREFIN External Reference Voltage Range (15)  
VOUT Total Discharge Resistance(15)  
CONTROL AND SUPERVISORY (SD, PG)  
SD High Level Input Voltage  
VREFIN  
0.0  
-
-
1.35  
-
V
RTDR(M5)  
50  
VSDHI  
VSDLO  
RSDUP  
2.0  
-
-
-
-
-
V
V
SD Low Level Input Voltage  
0.4  
2.0  
SD Pin Internal Pull Up Resistor (15)  
1.0  
MΩ  
PG Low Level Output Voltage  
IPG = 3.0 mA  
VPGLO  
-
-
-
0.4  
1.0  
V
PG Pin Leakage Current  
M1 is off, Pulled up to VIN  
IPGLKG  
-1.0  
µA  
Notes  
15. Design information only, this parameter is not production tested.  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
7
ELECTRICAL CHARACTERISTICS  
DYNAMIC ELECTRICAL CHARACTERISTICS  
DYNAMIC ELECTRICAL CHARACTERISTICS  
Table 4. Dynamic Electrical Characteristics  
Characteristics noted under conditions 3.0 V VIN 6.0 V, -40°C TA 85°C, GND = 0 V unless otherwise noted. Typical  
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
BUCK CONVERTER (PVIN, SW, PGND, BOOT)  
Switching Node (SW) Rise Time (16)  
(PVIN = 3.3 V, IOUT = 5.0 A)  
tRISE  
-
-
14  
20  
-
-
ns  
ns  
Switching Node (SW) Fall Time (16)  
(PVIN = 3.3 V, IOUT = 5.0 A)  
tFALL  
Soft Start Duration (Normal Mode)  
ILIM= 1.25 - 1.49 V  
1.50 - 1.81 V  
-
-
-
-
3.2  
1.6  
0.8  
0.4  
-
-
-
-
t
ms  
SS  
1.82 - 2.13 V  
2.14 - 2.50 V  
Over Current Limit Timer  
t
-
10  
-
-
ms  
ms  
µs  
LIM  
Over Current Limit Retry Time-out Period  
Output Undervoltage/Overvoltage Filter Delay Timer  
OSCILLATOR (FREQ)  
t
80  
5.0  
120  
25  
TIMEOUT  
t
-
FILTER  
Oscillator Default Switching Frequency  
f
f
-
1.0  
-
-
MHz  
KHz  
SW  
SW  
Oscillator Frequency tolerance is ±10% (FREQ = GND)  
Oscillator Switching Frequency Range  
200  
1000  
CONTROL AND SUPERVISORY (SD, PG)  
PG Reset Delay  
t
8.0  
80  
-
-
12  
ms  
ms  
PGRESET  
Thermal Shutdown Retry Time-out Period (16)  
t
120  
TIMEOUT  
Notes  
16. Design information only, this parameter is not production tested.  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
8
FUNCTIONAL DESCRIPTION  
INTRODUCTION  
FUNCTIONAL DESCRIPTION  
INTRODUCTION  
Advanced microprocessor-based systems require  
compact, efficient, and accurate point-of-load (PoL) power  
supplies. These PoL supply high current and fast transient  
response capability while maintaining regulation accuracy.  
Voltage monitoring (power sequencing) and increased  
operating frequency are also key features for PoL power  
supplies.  
efficiency operation. It provides an output voltage with an  
accuracy of less than ±2.0 %, capable of supplying up to  
5.0 A of continuous current. Its power sequencing/tracking  
abilities makes it ideal for systems with multiple related  
supply rails. It has an adjustable switching frequency, thus  
permitting greater design flexibility and optimization over a  
wide range of operating conditions, and can operate at up to  
1.0 MHz to significantly reduce the external components size  
and cost. It also features an over-current limit control, and  
protects against output overvoltage, undervoltage, and  
overtemperature conditions. It also protects the system from  
short circuit events and incorporates a power-good output  
signal to alert the host MCU should a fault occur.  
PoL power supplies are non-isolated DC to DC converters  
that are physically located near their load (on the same  
printed circuit board) and take their input supply from an  
intermediate bus. Their close proximity to the load allows for  
higher efficiency, localized protection, and minimum  
distribution losses. Their compact design and low  
component-count also reduces overall system cost.  
Operation can be enabled or disabled by controlling the  
SD pin, which offers power sequencing capabilities.  
The 34713 is a PoL single-output power supply that  
embodies an integrated solution that’s both highly cost-  
effective and reliable. It utilizes a voltage-mode synchronous  
buck switching converter topology with integrated low  
RDS(ON) (45 m) N-channel power MOSFETs for high-  
By monolithically integrating the control and supervisory  
circuitry along with power-FETs, the 34713 offers a complete,  
compact, cost-effective, and simple solution to satisfy the  
PoL needs of today’s systems.  
FUNCTIONAL PIN DESCRIPTION  
REFERENCE VOLTAGE INPUT (VREFIN)  
ERROR AMPLIFIER INVERTING INPUT (INV)  
The 34713 will track the voltage applied at this pin.  
Buck converter error amplifier inverting input. Connect the  
output voltage feedback network to this pin.  
FREQUENCY ADJUSTMENT INPUT (FREQ)  
COMPENSATION INPUT (COMP)  
The buck converter switching frequency can be adjusted  
by connecting this pin to an external resistor divider between  
VDDI and GND pins. The default switching frequency (FREQ  
pin connected to ground, GND) is set at 1.0 MHz.  
Buck converter external compensation network connects  
to this pin. Use a type III compensation network.  
INPUT SUPPLY VOLTAGE (VIN)  
SOFT START ADJUSTMENT INPUT (ILIM)  
IC power supply input voltage. Input filtering is required for  
the device to operate properly.  
Soft start timing can be adjusted by applying an external  
voltage between 1.25 and VDDI on this pin.  
POWER GROUND (PGND)  
SIGNAL GROUND (GND)  
Buck converter and discharge MOSFET power ground. It  
is the source of the buck converter low-side power MOSFET.  
Analog ground of the IC. Internal analog signals are  
referenced to this pin voltage.  
SWITCHING NODE (SW)  
INTERNAL SUPPLY VOLTAGE OUTPUT (VDDI)  
Buck converter switching node. This pin is connected to  
the output inductor.  
This is the output of the internal bias voltage regulator.  
Connect a 1.0 µF, 6 V low ESR ceramic filter capacitor  
between this pin and the GND pin. Filtering any spikes on this  
output is essential to the internal circuitry stable operation.  
POWER INPUT VOLTAGE (PVIN)  
Buck converter power input voltage. This is the drain of the  
buck converter high-side power MOSFET.  
OUTPUT VOLTAGE DISCHARGE PATH (VOUT)  
Output voltage of the Buck Converter is connected to this  
pin. it only serves as the output discharge path once the SD  
signal is asserted.  
BOOTSTRAP INPUT (BOOT)  
Bootstrap capacitor input pin. Connect a capacitor (as  
discussed on page 17) between this pin and the SW pin to  
enhance the gate of the high-side Power MOSFET during  
switching.  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
9
FUNCTIONAL DESCRIPTION  
FUNCTIONAL INTERNAL BLOCK DESCRIPTION  
SHUTDOWN INPUT (SD)  
POWER GOOD OUTPUT SIGNAL (PG)  
If this pin is tied to the GND pin, the device will be in  
Shutdown Mode. If left unconnected or tied to the VIN pin, the  
device will be in Normal Mode. The pin has an internal pull up  
of 1.5 M.  
This is an active low open drain output that is used to  
report the status of the device to a host. This output activates  
after a successful power up sequence and stays active as  
long as the device is in normal operation and is not  
experiencing any faults. This output activates after a 10 ms  
delay and must be pulled up by an external resistor to a  
supply voltage (e.g., VIN).  
FUNCTIONAL INTERNAL BLOCK DESCRIPTION  
System Control  
& Logic  
Internal Bias  
Circuits  
Oscillator  
Control &  
Supervisory  
Functions  
Tracking &  
Sequencing  
Protection  
Functions  
Buck Converter  
Figure 4. 34713 Block Diagram  
down commands. It communicates with the buck converter to  
INTERNAL BIAS CIRCUITS  
manage the switching operation and protects it against any  
faults.  
This block contains all circuits that provide the necessary  
supply voltages and bias currents for the internal circuitry. It  
consists of:  
OSCILLATOR  
• Internal Voltage Supply Regulator: This regulator  
supplies the VDDI voltage that is used to drive the digital/  
analog internal circuits. It is equipped with a Power-On-  
Reset (POR) circuit that watches for the right regulation  
levels. External filtering is needed on the VDDI pin. This  
block will turn off during the shutdown mode.  
• Internal Bandgap Reference Voltage: This supplies the  
reference voltage to some of the internal circuitry.  
• Bias Circuit: This block generates the bias currents  
necessary to run all of the blocks in the IC.  
This block generates the clock cycles necessary to run the  
IC digital blocks. It also generates the buck converter  
switching frequency. The switching frequency has a default  
value of 1.0 MHz and can be programmed by connecting a  
resistor divider to the FREQ pin, between VDDI and GND  
pins (See Figure 1).  
PROTECTION FUNCTIONS  
This block contains the following circuits:  
• Over Current Limit and Short Circuit Detection: This  
block monitors the output of the buck converter for over  
current conditions and short circuit events and alerts the  
system control for further command.  
• Thermal Limit Detection: This block monitors the  
temperature of the device for overheating events. If the  
temperature rises above the thermal shutdown  
SYSTEM CONTROL AND LOGIC  
This block is the brain of the IC where the device  
processes data and reacts to it. Based on the status of the SD  
pin, the system control reacts accordingly and orders the  
device into the right status. It also takes inputs from all of the  
monitoring/protection circuits and initiates power up or power  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
10  
FUNCTIONAL DESCRIPTION  
FUNCTIONAL INTERNAL BLOCK DESCRIPTION  
threshold, this block will alert the system control for  
further commands.  
• Output Overvoltage and Undervoltage Monitoring: This  
block monitors the buck converter output voltage to  
ensure it is within regulation boundaries. If not, this  
block alerts the system control for further commands.  
during shutdown mode. Using this block along with  
controlling the SD pin can offer the user power sequencing  
capabilities by controlling when to turn the 34713 output on or  
off.  
BUCK CONVERTER  
This block provides the main function of the 34713: DC to  
DC conversion from an un-regulated input voltage to a  
regulated output voltage used by the loads for reliable  
operation. The buck converter is a high performance, fixed  
frequency (externally adjustable), synchronous buck PWM  
voltage-mode control. It drives integrated 45 mN-channel  
power MOSFETs saving board space and enhancing  
efficiency. The switching regulator output voltage is  
adjustable with an accuracy of less than ±2 % to meet today’s  
requirements. Its output has the ability to track the voltage  
applied at the VREFIN pin. The regulator's voltage control  
loop is compensated using a type III compensation network,  
with external components to allow for optimizing the loop  
compensation, for a wide range of operating conditions. A  
typical Bootstrap circuit with an internal PMOS switch is used  
to provide the voltage necessary to properly enhance the  
high-side MOSFET gate.  
CONTROL AND SUPERVISORY FUNCTIONS  
This block is used to interface with an outside host. It  
contains the following circuits:  
• Shutdown Control Input: An outside host can put the  
34713 device into shutdown mode by sending a logic  
“0” to the SD pin.  
• Power Good Output Signal PG: The 34713 can  
communicate to an external host that a fault has  
occurred by releasing the drive on the PG pin high,  
allowing the signal/pin to be pulled high by the external  
pull-up resistor.  
TRACKING AND SEQUENCING  
This block allows the output of the 34713 to track the  
voltage applied at the VREFIN pin in different tracking  
configurations. This will be discussed in further details later in  
this document. For power down during a shutdown mode, the  
34713 uses internal discharge MOSFET (Figure 2) to  
discharge the output. The discharge MOSFET is only active  
The 34713 has the ability to supply up to 5.0 A of  
continuous current, making it suitable for many high current  
applications.  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
11  
FUNCTIONAL DEVICE OPERATION  
OPERATIONAL MODES  
FUNCTIONAL DEVICE OPERATION  
OPERATIONAL MODES  
VIN < 3.0V  
SD = 0  
Power Off  
VOUT = OFF  
VREF = OFF  
PG = 1  
Shutdown  
VOUT = Discharge  
VREF = Discharge  
PG = 1  
3.0V < = VIN < = 6.0V  
SD = 1  
Short Circuit  
VOUT = OFF  
VREF = OFF  
Overvoltage  
VOUT = ON  
VREF = ON  
Normal  
VOUT= ON  
VREF = ON  
VOUT  
< VOV  
tTIMEOUT Expired  
VOUT  
> VOV  
IOUT > = ISHORT  
PG = 1  
PG = 1  
PG = 0  
t
TIMEOUT Expired  
VOUT > VUV  
Over Current  
VOUT = OFF  
VREF = ON  
Undervoltage  
VOUT= ON  
VREF = ON  
TJ < = 145°C &  
TIMEOUT Expired  
IOUT > = ILIM  
For > = 10ms  
t
VOUT < VUV  
Thermal  
Shutdown  
VOUT = OFF  
VREF = OFF  
PG = 1  
PG = 1  
PG = 1  
TJ > = 170°C  
Figure 5. Operation Modes Diagram  
switching frequency and soft start values are determined by  
reading the FREQ and ILIM pins respectively. A soft start  
cycle is then initiated to ramp up the output of the buck  
converter. The buck converter error amplifier uses the  
voltage on the VREFIN pin as its reference voltage until  
VREFIN is equal to 0.7 V, then the error amplifier defaults to  
the internal 0.7 V reference voltage. This method helps  
achieve multiple tracking configurations as will be explained  
later in this document.  
MODES OF OPERATION  
The 34713 has two primary modes of operation:  
Normal Mode  
In normal mode, all functions and outputs are fully  
operational. To be in this mode, the VIN needs to be within its  
operating range, Shutdown input is high, and no faults are  
present. This mode consumes the most amount of power.  
Soft start is used to prevent the output voltage from  
overshooting during startup. At initial startup, the output  
capacitor is at zero volts; VOUT = 0 V. Therefore, the voltage  
across the inductor will be PVIN during the capacitor charge  
phase which will create a very sharp di/dt ramp. Allowing the  
inductor current to rise too high can result in a large  
difference between the charging current and the actual load  
current that can result in an undesired voltage spike once the  
capacitor is fully charged. The soft start is active each time  
the IC goes out of standby or shutdown mode, power is  
recycled, or after a fault retry.  
Shutdown Mode  
In this mode, activated by pulling the SD pin low, the chip  
is in a shutdown state and the output is disabled and  
discharged. In this mode, the 34713 consumes the least  
amount of power since almost all of the internal blocks are  
disabled.  
START-UP SEQUENCE  
When power is first applied, the 34713 checks the status  
of the SD pin. If the device is in a shutdown mode, no block  
will power up and the output will not attempt to ramp. Once  
the SD pin is released to enable the device, the VDDI internal  
supply voltage and the bias currents are established and the  
internal VDDI POR signal is also released. The rest of the  
internal blocks will be enabled and the buck converter  
After a successful start-up cycle where the device is  
enabled, no faults have occurred, and the output voltage has  
reached its regulation point, the 34713 pulls the power good  
output signal low after a 10 ms reset delay, to indicate to the  
host that the device is in normal operation.  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
12  
FUNCTIONAL DEVICE OPERATION  
PROTECTION AND DIAGNOSTIC FEATURES  
PROTECTION AND DIAGNOSTIC FEATURES  
The 34713 monitors the application for several fault  
conditions to protect the load from overstress. The reaction of  
the IC to these faults ranges from turning off the outputs to  
just alerting the host that something is wrong. In the following  
paragraphs, each fault condition is explained:  
operation to limit the current, and a 10 ms over current limit  
timer (tLIM) starts. The converter will stay in this mode of  
operation until one of the following occurs:  
• The current is reduced back to the normal level before  
tLIM expires, and in this case normal operation is  
regained.  
• tLIM expires without regaining normal operation, at  
which point the device turns off the output and the  
power good output signal is pulled high. At the end of a  
time-out period of 100 ms (tTIMEOUT), the device will  
attempt another soft start cycle.  
Output Overvoltage  
An overvoltage condition occurs once the output voltage  
goes higher than the rising overvoltage threshold (VOVR). In  
this case, the power good output signal is pulled high, alerting  
the host that a fault is present, but the output will stay active.  
To avoid erroneous overvoltage conditions, a 20 µs filter is  
implemented. The buck converter will use its feedback loop  
to attempt to correct the fault. Once the output voltage falls  
below the falling overvoltage threshold (VOVF), the fault is  
cleared and the power good output signal is pulled low, the  
device is back in normal operation.  
• The device reaches the thermal shutdown limit (TSDFET  
)
and turns off the output. The power good output signal  
is pulled high.  
• The output current keeps increasing until it reaches the  
short circuit current limit (ISHORT). See below for more  
details.  
Output Undervoltage  
Short Circuit Current Limit  
An undervoltage condition occurs once the output voltage  
falls below the falling undervoltage threshold (VUVF). In this  
case, the power good output signal is pulled high, alerting the  
host that a fault is present, but the output will stay active. To  
avoid erroneous undervoltage conditions, a 20 µs filter is  
implemented. The buck converter will use its feedback loop  
to attempt to correct the fault. Once the output voltage rises  
above the rising undervoltage threshold (VUVR), the fault is  
cleared and the power good output signal is pulled low, the  
device is back in normal operation.  
This block uses the same current detection mechanism as  
the over current limit detection block. If the load current  
reaches the ISHORT value, the device reacts by shutting down  
the output immediately. This is necessary to prevent damage  
in case of a permanent short circuit. Then, at the end of a  
time-out period of 100 ms (tTIMEOUT), the device will attempt  
another soft start cycle.  
Thermal Shutdown  
Thermal limit detection block monitors the temperature of  
the device and protects against excessive heating. If the  
temperature reaches the thermal shutdown threshold  
(TSDFET), the converter output switches off and the power  
good output signal indicates a fault by pulling high. The  
device will stay in this state until the temperature has  
decreased by the hysteresis value and then After a time-out  
period (TTIMEOUT) of 100 ms, the device will retry  
Output Over Current  
This block detects over current in the Power MOSFETs of  
the buck converter. It is comprised of a sense MOSFET and  
a comparator. The sense MOSFET acts as a current  
detecting device by sampling a ratio of the load current. That  
sample is compared via the comparator with an internal  
reference to determine if the output is in over current or not.  
If the peak current in the output inductor reaches the over  
current limit (ILIM), the converter will start a cycle-by-cycle  
automatically and the output will go through a soft start cycle.  
If successful normal operation is regained, the power good  
output signal is asserted low to indicate that.  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
13  
TYPICAL APPLICATIONS  
PROTECTION AND DIAGNOSTIC FEATURES  
TYPICAL APPLICATIONS  
VIN  
BOOT  
VIN  
BOOT  
VDDI  
C15  
SW  
I/O SIGNALS  
4.7_nopop  
VDDI  
0.1uF  
PVIN  
PVIN  
J2  
C14  
U1  
R16  
0.1uF  
PVIN  
3
2
1
VIN  
GND  
R12  
10k_nopop FREQ  
R10  
10k  
1
2
3
4
5
6
18  
17  
16  
15  
14  
13  
J3  
SGND  
FREQ  
ILIM  
PG  
PVIN  
SW  
SW  
ILIM  
R11  
10k  
GND  
VMASTER  
VOUT  
FREQ  
3
2
1
R13  
10k_nopop  
SW  
SW  
ILIM  
PG  
MC34713  
PG  
SW  
N/C  
GND  
GND  
SD  
SD  
GND  
VMASTER PGOOD LED  
SD  
VMASTER  
VIN  
R7  
VREFIN  
VREFIN  
R8  
1k  
10k  
C11  
VREFIN  
D1  
C13  
0.1uF  
LED  
0.1uF  
VOUT  
R9  
VOUT  
10k  
LED  
INV  
INV  
C12  
0.1uF  
COMP  
COMP  
JUMPERS  
BUCK CONVERTER  
VOUT1 VOUT2  
L1  
J1  
SW  
VOUT  
PVIN  
VMASTER  
VREFIN  
1
2
1
3
5
7
9
2
4
6
8
STBY_nopop  
2
1.5uH  
LED  
PG  
R3  
1
1
D2  
PMEG2010EA_nopop  
C6  
100uF  
C7  
100uF  
C8  
100uF  
SD  
10  
4.7_nopop  
C9  
CON10A  
2
1nF_nopop  
SD  
COMPENSATION NETWORK  
PVIN CAPACITORS  
OPTIONAL nopop  
VOUT  
VDDI  
PVIN  
ILIM  
FREQ  
C20  
1nF  
C1  
0.1uF  
C2  
1uF  
C3  
100uF  
C4  
100uF  
C5  
100uF  
R6  
POT_50K_nopop  
R5  
POT_50K_nopop  
R1  
INV  
20k  
C18  
COMP  
R14  
300  
0.02nF  
VIN CAPACITORS  
R15  
15k  
C19  
R2  
VIN  
12.7k  
1.9nF  
C17  
C16  
10uF  
0.1uF  
Figure 6. Typical Applications  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
14  
TYPICAL APPLICATIONS  
PROTECTION AND DIAGNOSTIC FEATURES  
COMPONENT SELECTION  
SWITCHING FREQUENCY SELECTION  
The switching frequency defaults to a value of 1.0 MHz  
when the FREQ pin is grounded, and 200 KHz when the  
FREQ pin is connected to VDDI. Intermediate switching  
frequencies can be obtained by connecting an external  
resistor divider to the FREQ pin. The table below shows the  
resulting switching frequency versus FREQ pin voltage.  
where,  
Maximum OFF time percentage  
Switching period.  
Table 5. Switching Frequency Adjustment  
FREQUENCY  
200  
VOLTAGE APPLIED TO PIN FREQ  
2.341 – 2.500  
2.185 - 2.340  
253  
307  
2.029 - 2.184  
Drain – to – source resistance of FET  
Winding resistance of Inductor  
360  
1.873 - 2.028  
413  
1.717 – 1.872  
1.561 – 1.716  
1.405 - 1.560  
466  
520  
573  
1.249 - 1.404  
Output current ripple.  
627  
1.093 - 1.248  
OUTPUT FILTER CAPACITOR  
680  
0.936 - 1.092  
For the output capacitor, the following considerations are  
more important than the actual capacitance value, the  
physical size, the ESR and the voltage rating:  
733  
0.781 - 0.936  
787  
0.625 - 0.780  
Transient Response percentage, TR_%  
Maximum Transient Voltage, TR_v_dip = Vo*TR_%  
Maximum current step,  
840  
0.469 - 0.624  
893  
0.313 - 0.468  
947  
0.157 - 0.312  
1000  
0.000 - 0.156  
Inductor Current rise time,  
where,  
D_max = Maximum ON time percentage.  
IO = Rated output current.  
Vin_min = Minimum input voltage at PVIN  
Figure 7. Resistor Divider for Frequency Adjustment  
As a result, it is possible to calculate  
SELECTION OF THE INDUCTOR  
Inductor calculation is straight forward, being  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
15  
TYPICAL APPLICATIONS  
PROTECTION AND DIAGNOSTIC FEATURES  
CBOOT  
L
BOOT  
SW  
Gate  
Driver  
F
C
SW  
VOUT  
O
In order to find the maximum allowed ESR,  
R
S
R
O
C
S
INV  
PWM  
Comparitor  
RB  
R
F
Ramp  
Generator  
CX  
C
F
Error  
Amplifier  
COMP  
The effects of the ESR is often neglected by the designers  
and may present a hidden danger to the ultimate supply  
stability. Poor quality capacitors have widely disparate ESR  
value, which can make the closed loop response  
inconsistent.  
V
DDI  
REFIN  
Reference  
Selection  
V
RO  
VO = VREF ------- + 1  
Bandgap  
Regulator  
RB  
34713  
Figure 9. Type III Compensation Network  
Consider the crossover frequency, FCROSS, of the open loop  
gain at one-sixth of the switching frequency, FSW.  
Then,  
Io  
Io_step  
Current  
response  
Worst case  
dt_I_rise  
where RO is a user selected resistor. Knowing the LC  
frequency, it can be obtained the values of RF and CS:  
assumption  
Figure 8. Transient Parameters  
TYPE III COMPENSATION NETWORK  
Power supplies are desired to offer accurate and tight  
regulation output voltages. To accomplish this requires a high  
DC gain. But with high gain comes the possibility of instability.  
The purpose of adding compensation to the internal error  
amplifier is to counteract some of the gains and phases  
contained in the control-to-output transfer function that could  
jeopardized the stability of the power supply. The Type III  
compensation network used for 34713 comprises two poles  
(one integrator and one high frequency pole to cancel the  
zero generated from the ESR of the output capacitor) and two  
zeros to cancel the two poles generated from the LC filter as  
shown in Figure 9.  
This gives as a result,  
&
Calculate Rs by placing the Pole 1 at the ESR zero  
frequency:  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
16  
TYPICAL APPLICATIONS  
PROTECTION AND DIAGNOSTIC FEATURES  
node, so it is not ground and it is floating and moving in  
voltage, so we cannot just apply a voltage directly to the gate  
of the high side that is referenced to ground, we need a  
voltage referenced to the SW node. That is why the bootstrap  
capacitor is needed for. This capacitor charges during the  
high side off time, since the low side will be on during that  
time, so the SW node and the bottom of the bootstrap  
capacitor will be connected to ground and the top of the  
capacitor will be connected to a voltage source, so the  
capacitor will charge up to that voltage source (say 5V). Now  
when the low side MOSFET switches off and the high side  
MOSFET switches on, the SW nodes rises up to Vin, and the  
voltage on the boot pin will be Vcap + Vin. So the gate of the  
high side will have Vcap across it and it will be able to stay  
enhanced. A 0.1µF capacitor is a good value for this  
bootstrap element.  
Equating the Pole 2 at Crossover Frequency to achieve a  
faster response and a proper phase margin,  
SOFT START SELECTION  
Table 6 shows the voltage that should be applied to the  
terminal ILIM to get the desired configuration of the soft start  
timing.  
Table 6. ILIM Table  
Soft Start (ms)  
Voltage Applied to ILIM  
3.2  
1.6  
0.8  
0.4  
1.25 - 1.49  
1.50 - 1.81  
1.82 - 2.13  
2.14 - 2.50  
BOOTSTRAP CAPACITOR  
The bootstrap capacitor is needed to supply the gate  
voltage for the high side MOSFET. This N-Channel MOSFET  
needs a voltage difference between its gate and source to be  
able to turn on. The high side MOSFET source is the SW  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
17  
PACKAGING  
PACKAGING DIMENSIONS  
PACKAGING  
PACKAGING DIMENSIONS  
EP SUFFIX  
24-PIN  
PLASTIC PACKAGE  
98ARL10577D  
ISSUE B  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
18  
PACKAGING  
PACKAGING DIMENSIONS  
EP SUFFIX  
24-PIN  
PLASTIC PACKAGE  
98ARL10577D  
ISSUE B  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
19  
REVISION HISTORY  
REVISION HISTORY  
REVISION  
DATE  
DESCRIPTION OF CHANGES  
Pre-release version  
Implemented Revision History page  
2/2006  
1.0  
Initial release  
11/2006  
2.0  
Converted format from Market Assessment to Product Preview  
Major updates to the data, form, and style  
2/2007  
5/2007  
Major updates to the data, form, and style  
3.0  
4.0  
Changed Feature fom 2% to 1%, relabeled to include soft start  
Changed 34713 Simplified Application Diagram  
Made change to 34713 Simplified Internal Block Diagram  
Removed Machine Model in Maximum Ratings  
Changed Input DC Supply Current (11) Normal mode and Input DC Supply Current (11) Shutdown  
mode  
(14)  
Changed Output Voltage Accuracy (12)  
,
Changed Soft start Adjusting reference Voltage Range and Short Circuit Current Limit  
Changed High-Side N-CH Power MOSFET (M3) RDS(ON) (12) and Low-Side N-CH Power  
MOSFET (M4) RDS(ON) (12)  
Changed M2 RDS(ON) and PVIN Pin Leakage Current  
Changed SD Pin Internal Pull Up Resistor (15)  
Changed Changed Soft Start Duration (Normal Mode)  
Changed Over Current Limit Retry Time-out Period and Output Undervoltage/Overvoltage Filter  
Delay Timer  
Changed PG Reset Delay and Thermal Shutdown Retry Time-out Period (16)  
Changed definition for Soft Start Adjustment input (ILIM)  
Changed drawings in Typical Applications  
Changed drawing in Type III Compensation Network  
Changed table for Soft Start Selection  
Removed PC34713EP/R2 from the ordering information and added MC34713EP/R2  
Changed the data sheet status to Advance Information  
34713  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
20  
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MC34713  
Rev. 4.0  
5/2007