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January 2006  
ADC081S021  
Single Channel, 50 to 200 ksps, 8-Bit A/D Converter  
General Description  
Features  
n Specified over a range of sample rates.  
n 6-lead LLP and SOT-23 packages  
n Variable power management  
The ADC081S021 is a low-power, single channel CMOS  
8-bit analog-to-digital converter with a high-speed serial in-  
terface. Unlike the conventional practice of specifying per-  
formance at a single sample rate only, the ADC081S021 is  
fully specified over a sample rate range of 50 ksps to 200  
n Single power supply with 2.7V - 5.25V range  
n SPI /QSPI /MICROWIRE/DSP compatible  
ksps. The converter is based upon  
a successive-  
approximation register architecture with an internal track-  
and-hold circuit.  
Key Specifications  
n DNL  
+0.04/-0.03 LSB (typ)  
+0.04/-0.03 LSB (typ)  
49.6 dB (typ)  
The output serial data is straight binary, and is compatible  
n INL  
n SNR  
with several standards, such as SPI  
,
QSPI  
,
MICROWIRE, and many common DSP serial interfaces.  
n Power Consumption  
— 3.6V Supply  
— 5.25V Supply  
The ADC081S021 operates with a single supply that can  
range from +2.7V to +5.25V. Normal power consumption  
using a +3.6V or +5.25V supply is 1.3 mW and 7.7 mW,  
respectively. The power-down feature reduces the power  
consumption to as low as 2.6 µW using a +5.25V supply.  
1.3 mW (typ)  
7.7 mW (typ)  
Applications  
n Portable Systems  
n Remote Data Acquisition  
The ADC081S021 is packaged in 6-lead LLP and SOT-23  
packages. Operation over the industrial temperature range  
of −40˚C to +85˚C is guaranteed.  
n Instrumentation and Control Systems  
Pin-Compatible Alternatives by Resolution and Speed  
All devices are fully pin and function compatible.  
Resolution  
Specified for Sample Rate Range of:  
200 to 500 ksps  
50 to 200 ksps  
ADC121S021  
ADC101S021  
ADC081S021  
500 ksps to 1 Msps  
ADC121S101  
12-bit  
10-bit  
8-bit  
ADC121S051  
ADC101S051  
ADC101S101  
ADC081S051  
ADC081S101  
Connection Diagram  
20145405  
Ordering Information  
Order Code  
Temperature Range  
Description  
Top Mark  
ADC081S021CISD  
ADC081S021CISDX  
ADC081S021CIMF  
ADC081S021CIMFX  
ADC081S021EVAL  
−40˚C to +85˚C  
−40˚C to +85˚C  
−40˚C to +85˚C  
−40˚C to +85˚C  
6-Lead LLP Package  
X9C  
X9C  
6-Lead LLP Package, Tape & Reel  
6-Lead SOT-23 Package  
X09C  
X09C  
6-Lead SOT-23 Package, Tape & Reel  
SOT-23 Evaluation Board  
TRI-STATE® is a trademark of National Semiconductor Corporation  
QSPI and SPI are trademarks of Motorola, Inc.  
© 2006 National Semiconductor Corporation  
DS201454  
www.national.com  
Block Diagram  
20145407  
Pin Descriptions and Equivalent Circuits  
Pin No.  
Symbol  
Description  
ANALOG I/O  
3
VIN  
Analog input. This signal can range from 0V to VA.  
DIGITAL I/O  
4
SCLK  
SDATA  
CS  
Digital clock input. This clock directly controls the conversion and readout processes.  
Digital data output. The output samples are clocked out of this pin on falling edges of  
the SCLK pin.  
5
6
Chip select. On the falling edge of CS, a conversion process begins.  
POWER SUPPLY  
Positive supply pin. This pin should be connected to a quiet +2.7V to +5.25V source  
and bypassed to GND with a 1 µF capacitor and a 0.1 µF monolithic capacitor located  
within 1 cm of the power pin.  
1
VA  
2
GND  
GND  
The ground return for the supply and signals.  
For package suffix CISD(X) only, it is recommended that the center pad should be  
connected to ground.  
PAD  
www.national.com  
2
Absolute Maximum Ratings (Notes 1, 2)  
Operating Ratings (Notes 1, 2)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Operating Temperature Range  
−40˚C TA +85˚C  
VA Supply Voltage  
+2.7V to +5.25V  
−0.3V to 5.25V  
Digital Input Pins Voltage Range  
(regardless of supply voltage)  
Analog Input Pins Voltage Range  
Clock Frequency  
Analog Supply Voltage VA  
Voltage on Any Analog Pin to GND  
Voltage on Any Digital Pin to GND  
Input Current at Any Pin (Note 3)  
Package Input Current (Note 3)  
Power Consumption at TA = 25˚C  
ESD Susceptibility (Note 5)  
Human Body Model  
−0.3V to 6.5V  
−0.3V to (VA +0.3V)  
−0.3V to 6.5V  
10 mA  
0V to VA  
1 MHz to 4 MHz  
up to 200 ksps  
Sample Rate  
20 mA  
See (Note 4)  
Package Thermal Resistance  
Package  
θJA  
3500V  
300V  
6-lead LLP  
94˚C / W  
265˚C / W  
Machine Model  
6-lead SOT-23  
Junction Temperature  
+150˚C  
Storage Temperature  
−65˚C to +150˚C  
Soldering process must comply with National Semiconduc-  
tor’s Reflow Temperature Profile specifications. Refer to  
www.national.com/packaging. (Note 6)  
ADC081S021 Converter Electrical Characteristics (Notes 7, 9)  
The following specifications apply for VA = +2.7V to 5.25V, fSCLK = 1 MHz to 4 MHz, fSAMPLE = 50 ksps to 200 ksps,  
CL = 15 pF, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25˚C.  
Limits  
(Note 9)  
Symbol  
Parameter  
Conditions  
Typical  
Units  
STATIC CONVERTER CHARACTERISTICS  
Resolution with No Missing Codes  
8
Bits  
VA = +2.7V to +3.6V  
0.03  
+0.04  
−0.03  
0.03  
0.3  
LSB (max)  
LSB (max)  
LSB (min)  
LSB (max)  
LSB (max)  
LSB (min)  
LSB (max)  
LSB (max)  
LSB (max)  
LSB (max)  
LSB (max)  
LSB (min)  
LSB (max)  
LSB (min)  
INL  
Integral Non-Linearity  
VA = +4.75V to +5.25V  
VA = +2.7V to +3.6V  
VA = +4.75V to +5.25V  
0.3  
0.2  
0.2  
DNL  
Differential Non-Linearity  
+0.04  
−0.03  
−0.01  
+0.03  
+0.04  
+0.1  
VA = +2.7V to +3.6V  
VA = +4.75V to +5.25V  
VA = +2.7V to +3.6V  
VA = +4.75V to +5.25V  
0.2  
0.2  
0.4  
0.4  
VOFF  
GE  
Offset Error  
Gain Error  
+0.055  
−0.065  
+0.03  
−0.06  
VA = +2.7V to +3.6V  
0.3  
0.3  
TUE  
Total Unadjusted Error  
VA = +4.75V to +5.25V  
DYNAMIC CONVERTER CHARACTERISTICS  
VA = +2.7 to 5.25V  
SINAD  
SNR  
Signal-to-Noise Plus Distortion Ratio  
Signal-to-Noise Ratio  
49.5  
49.6  
−77  
68  
49  
49  
dBFS (min)  
dBFS (min)  
dBFS (max)  
dBFS (min)  
Bits (min)  
fIN = 100 kHz, −0.02 dBFS  
VA = +2.7 to 5.25V  
fIN = 100 kHz, −0.02 dBFS  
VA = +2.7 to 5.25V  
THD  
Total Harmonic Distortion  
Spurious-Free Dynamic Range  
Effective Number of Bits  
−65  
65  
fIN = 100 kHz, −0.02 dBFS  
VA = +2.7 to 5.25V  
SFDR  
ENOB  
fIN = 100 kHz, −0.02 dBFS  
VA = +2.7 to 5.25V  
7.9  
7.8  
fIN = 100 kHz, −0.02 dBFS  
3
www.national.com  
ADC081S021 Converter Electrical Characteristics (Notes 7, 9) (Continued)  
The following specifications apply for VA = +2.7V to 5.25V, fSCLK = 1 MHz to 4 MHz, fSAMPLE = 50 ksps to 200 ksps,  
CL = 15 pF, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25˚C.  
Limits  
(Note 9)  
Symbol  
Parameter  
Conditions  
Typical  
Units  
DYNAMIC CONVERTER CHARACTERISTICS  
Intermodulation Distortion, Second  
VA = +5.25V  
−83  
−82  
dBFS  
dBFS  
Order Terms  
IMD  
fa = 103.5 kHz, fb = 113.5 kHz  
VA = +5.25V  
Intermodulation Distortion, Third  
Order Terms  
fa = 103.5 kHz, fb = 113.5 kHz  
VA = +5V  
11  
8
MHz  
MHz  
FPBW  
-3 dB Full Power Bandwidth  
VA = +3V  
ANALOG INPUT CHARACTERISTICS  
VIN  
Input Range  
0 to VA  
V
µA (max)  
pF  
IDCL  
DC Leakage Current  
1
Track Mode  
Hold Mode  
30  
4
CINA  
Input Capacitance  
pF  
DIGITAL INPUT CHARACTERISTICS  
VA = +5.25V  
VA = +3.6V  
VA = +5V  
2.4  
2.1  
0.8  
0.4  
1
V (min)  
V (min)  
VIH  
VIL  
Input High Voltage  
Input Low Voltage  
V (max)  
V (max)  
µA (max)  
pF (max)  
VA = +3V  
IIN  
Input Current  
VIN = 0V or VA  
0.1  
2
CIND  
Digital Input Capacitance  
4
DIGITAL OUTPUT CHARACTERISTICS  
ISOURCE = 200 µA  
ISOURCE = 1 mA  
ISINK = 200 µA  
ISINK = 1 mA  
VA − 0.07 VA − 0.2  
V (min)  
VOH  
VOL  
Output High Voltage  
VA − 0.1  
V
V (max)  
V
0.03  
0.1  
0.4  
Output Low Voltage  
IOZH  
IOZL  
COUT  
,
TRI-STATE® Leakage Current  
0.1  
2
10  
4
µA (max)  
TRI-STATE® Output Capacitance  
Output Coding  
pF (max)  
Straight (Natural) Binary  
POWER SUPPLY CHARACTERISTICS  
2.7  
V (min)  
VA  
Supply Voltage  
5.25  
V (max)  
VA = +5.25V,  
1.47  
0.36  
500  
60  
2.2  
0.9  
mA (max)  
fSAMPLE = 200 ksps  
VA = +3.6V,  
Supply Current, Normal Mode  
(Operational, CS low)  
mA (max)  
fSAMPLE = 200 ksps  
fSCLK = 0 MHz, VA = +5.25V  
fSAMPLE = 0 ksps  
IA  
nA  
µA  
Supply Current, Shutdown (CS high)  
VA = +5.25V, fSCLK = 4 MHz,  
fSAMPLE = 0 ksps  
VA = +5.25V  
7.7  
1.3  
11.6  
3.24  
mW (max)  
mW (max)  
Power Consumption, Normal Mode  
(Operational, CS low)  
VA = +3.6V  
fSCLK = 0 MHz, VA = +5.25V  
fSAMPLE = 0 ksps  
PD  
2.6  
µW  
µW  
Power Consumption, Shutdown (CS  
high)  
fSCLK = 4 MHz, VA = +5.25V,  
fSAMPLE = 0 ksps  
315  
AC ELECTRICAL CHARACTERISTICS  
fSCLK Clock Frequency  
1.0  
4.0  
MHz (min)  
MHz (max)  
(Note 8)  
www.national.com  
4
ADC081S021 Converter Electrical Characteristics (Notes 7, 9) (Continued)  
The following specifications apply for VA = +2.7V to 5.25V, fSCLK = 1 MHz to 4 MHz, fSAMPLE = 50 ksps to 200 ksps,  
CL = 15 pF, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25˚C.  
Limits  
(Note 9)  
Symbol  
Parameter  
Conditions  
Typical  
Units  
AC ELECTRICAL CHARACTERISTICS  
50  
200  
16  
ksps (min)  
ksps (max)  
SCLK cycles  
% (min)  
fS  
Sample Rate  
(Note 8)  
tCONV  
DC  
Conversion Time  
SCLK Duty Cycle  
40  
fSCLK = 4 MHz  
50  
60  
% (max)  
ns (max)  
SCLK cycles  
ns (min)  
ns  
tACQ  
Track/Hold Acquisition Time  
Throughput Time  
(Note 10)  
400  
20  
Acquisition Time + Conversion Time  
tQUIET  
tAD  
50  
Aperture Delay  
3
tAJ  
Aperture Jitter  
30  
ps  
ADC081S021 Timing Specifications  
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, fSCLK = 1.0 MHz to 4.0 MHz, CL = 25 pF,  
fSAMPLE = 50 ksps to 200 ksps, Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25˚C.  
Symbol  
tCS  
Parameter  
Minimum CS Pulse Width  
Conditions  
Typical  
Limits  
10  
Units  
ns (min)  
ns (min)  
tSU  
CS to SCLK Setup Time  
10  
Delay from CS Until SDATA TRI-STATE®  
Disabled (Note 11)  
tEN  
tACC  
tCL  
20  
ns (max)  
VA = +2.7V to +3.6V  
40  
20  
ns (max)  
ns (max)  
Data Access Time after SCLK Falling Edge  
(Note 12)  
VA = +4.75V to +5.25V  
0.4 x  
tSCLK  
0.4 x  
tSCLK  
7
SCLK Low Pulse Width  
ns (min)  
ns (min)  
tCH  
tH  
SCLK High Pulse Width  
SCLK to Data Valid Hold Time  
VA = +2.7V to +3.6V  
ns (min)  
ns (min)  
ns (max)  
ns (min)  
ns (max)  
ns (min)  
µs  
VA = +4.75V to +5.25V  
5
25  
VA = +2.7V to +3.6V  
6
SCLK Falling Edge to SDATA High  
Impedance (Note 13)  
tDIS  
25  
VA = +4.75V to +5.25V  
5
tPOWER-UP  
Power-Up Time from Full Power-Down  
1
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is  
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed  
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test  
conditions.  
Note 2: All voltages are measured with respect to GND = 0V, unless otherwise specified.  
<
>
V ), the current at that pin should be limited to 10 mA. The 20  
Note 3: When the input voltage at any pin exceeds the power supply (that is, V  
GND or V  
IN  
IN  
A
mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two. The Absolute  
Maximum Rating specification does not apply to the V pin. The current into the V pin is limited by the Analog Supply Voltage specification.  
A
A
Note 4: The absolute maximum junction temperature (T max) for this device is 150˚C. The maximum allowable power dissipation is dictated by T max, the  
J
J
junction-to-ambient thermal resistance (θ ), and the ambient temperature (T ), and can be calculated using the formula P MAX = (T max − T )/θ . The values  
JA  
A
D
J
A
JA  
for maximum power dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven  
beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.  
Note 5: Human body model is 100 pF capacitor discharged through a 1.5 kresistor. Machine model is 220 pF discharged through zero ohms  
Note 6: Reflow temperature profiles are different for lead-free and non-lead-free packages.  
Note 7: Tested limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).  
Note 8: This is the frequency range over which the electrical performance is guaranteed. The device is functional over a wider range which is specified under  
Operating Ratings.  
Note 9: Data sheet min/max specification limits are guaranteed by design, test, or statistical analysis.  
Note 10: Minimum Quiet Time required by bus relinquish and the start of the next conversion.  
5
www.national.com  
ADC081S021 Timing Specifications (Continued)  
Note 11: Measured with the timing test circuit shown in Figure 1 and defined as the time taken by the output signal to cross 1.0V.  
Note 12: Measured with the timing test circuit shown in Figure 1 and defined as the time taken by the output signal to cross 1.0V or 2.0V.  
Note 13: t  
is derived from the time taken by the outputs to change by 0.5V with the timing test circuit shown in Figure 1. The measured number is then adjusted  
DIS  
to remove the effects of charging or discharging the output capacitance. This means that t  
is the true bus relinquish time, independent of the bus loading.  
DIS  
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6
Timing Diagrams  
20145408  
FIGURE 1. Timing Test Circuit  
20145406  
FIGURE 2. ADC081S021 Serial Timing Diagram  
7
www.national.com  
MISSING CODES are those output codes that will never  
appear at the ADC outputs. The ADC081S021 is guaranteed  
not to have any missing codes.  
Specification Definitions  
ACQUISITION TIME is the time required to acquire the input  
voltage. That is, it is time required for the hold capacitor to  
charge up to the input voltage.  
OFFSET ERROR is the deviation of the first code transition  
(000...000) to (000...001) from the ideal (i.e. GND + 1 LSB).  
APERTURE DELAY is the time between the fourth falling  
SCLK edge of a conversion and the time when the input  
signal is acquired or held for conversion.  
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in  
dB, of the rms value of the input signal to the rms value of the  
sum of all other spectral components below one-half the  
sampling frequency, not including harmonics or d.c.  
APERTURE JITTER (APERTURE UNCERTAINTY) is the  
variation in aperture delay from sample to sample. Aperture  
jitter manifests itself as noise in the output.  
SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD)  
Is the ratio, expressed in dB, of the rms value of the input  
signal to the rms value of all of the other spectral compo-  
nents below half the clock frequency, including harmonics  
but excluding d.c.  
CONVERSION TIME is the time required, after the input  
voltage is acquired, for the ADC to convert the input voltage  
to a digital word.  
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of  
the maximum deviation from the ideal step size of 1 LSB.  
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the differ-  
ence, expressed in dB, between the desired signal ampli-  
tude to the amplitude of the peak spurious spectral compo-  
nent, where a spurious spectral component is any signal  
present in the output spectrum that is not present at the input  
and may or may not be a harmonic.  
DUTY CYCLE is the ratio of the time that a repetitive digital  
waveform is high to the total time of one period. The speci-  
fication here refers to the SCLK.  
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE  
BITS) is another method of specifying Signal-to-Noise and  
TOTAL HARMONIC DISTORTION (THD) is the ratio, ex-  
pressed in dB or dBc, of the rms total of the first five  
harmonic components at the output to the rms level of the  
input signal frequency as seen at the output. THD is calcu-  
lated as  
Distortion  
or  
SINAD.  
ENOB  
is  
defined  
as  
(SINAD − 1.76) / 6.02 and says that the converter is equiva-  
lent to a perfect ADC of this (ENOB) number of bits.  
FULL POWER BANDWIDTH is a measure of the frequency  
at which the reconstructed output fundamental drops 3 dB  
below its low frequency value for a full scale input.  
GAIN ERROR is the deviation of the last code transition  
(111...110) to (111...111) from the ideal (VREF − 1 LSB), after  
adjusting for offset error.  
INTEGRAL NON-LINEARITY (INL) is a measure of the  
where Af1 is the RMS power of the input frequency at the  
output and Af2 through Af6 are the RMS power in the first 5  
harmonic frequencies.  
deviation of each individual code from a line drawn from  
negative full scale (1⁄  
2
LSB below the first code transition)  
through positive full scale (1⁄  
2
LSB above the last code  
THROUGHPUT TIME is the minimum time required between  
the start of two successive conversion. It is the acquisition  
time plus the conversion time.  
transition). The deviation of any given code from this straight  
line is measured from the center of that code value.  
INTERMODULATION DISTORTION (IMD) is the creation of  
additional spectral components as a result of two sinusoidal  
frequencies being applied to the ADC input at the same time.  
It is defined as the ratio of the power in the second and third  
order intermodulation products to the sum of the power in  
both of the original frequencies. IMD is usually expressed in  
dB.  
TOTAL UNADJUSTED ERROR is the worst deviation found  
from the ideal transfer function. As such, it is a comprehen-  
sive specification which includes full scale error, linearity  
error, and offset error.  
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8
Typical Performance Characteristics TA = +25˚C, fSAMPLE = 50 ksps to 200 ksps,  
fSCLK = 1 MHz to 4 MHz, fIN = 100 kHz unless otherwise stated.  
DNL  
INL  
fSCLK = 1 MHz  
fSCLK = 1 MHz  
20145420  
20145421  
DNL  
INL  
fSCLK = 4 MHz  
fSCLK = 4 MHz  
20145460  
20145461  
DNL vs. Clock Frequency  
INL vs. Clock Frequency  
20145465  
20145466  
9
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Typical Performance Characteristics TA = +25˚C, fSAMPLE = 50 ksps to 200 ksps,  
fSCLK = 1 MHz to 4 MHz, fIN = 100 kHz unless otherwise stated. (Continued)  
Total Unadjusted Error vs. Clock Frequency  
VA = 3.0V or 5.0V  
SNR vs. Clock Frequency  
20145467  
20145463  
SINAD vs. Clock Frequency  
SFDR vs. Clock Frequency  
20145464  
20145472  
Spectral Response, VA = 5V  
fSCLK = 1 MHz  
THD vs. Clock Frequency  
20145468  
20145469  
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10  
Typical Performance Characteristics TA = +25˚C, fSAMPLE = 50 ksps to 200 ksps,  
fSCLK = 1 MHz to 4 MHz, fIN = 100 kHz unless otherwise stated. (Continued)  
Spectral Response, VA = 5V  
fSCLK = 4 MHz  
Power Consumption vs. Throughput,  
fSCLK = 4 MHz  
20145470  
20145455  
11  
www.national.com  
Figure 4 shows the device in hold mode: switch SW1 con-  
nects the sampling capacitor to ground, maintaining the  
sampled voltage, and switch SW2 unbalances the compara-  
tor. The control logic then instructs the charge-redistribution  
DAC to add or subtract fixed amounts of charge from the  
sampling capacitor until the comparator is balanced. When  
the comparator is balanced, the digital word supplied to the  
DAC is the digital representation of the analog input voltage.  
The device moves from hold mode to track mode on the 13th  
rising edge of SCLK.  
Applications Information  
1.0 ADC081S021 OPERATION  
The ADC081S021 is a successive-approximation analog-to-  
digital converter designed around a charge-redistribution  
digital-to-analog converter core. Simplified schematics of the  
ADC081S021 in both track and hold modes are shown in  
Figure 3 and Figure 4, respectively. In Figure 3, the device is  
in track mode: switch SW1 connects the sampling capacitor  
to the input, and SW2 balances the comparator inputs. The  
device is in this state until CS is brought low, at which point  
the device moves to hold mode.  
20145409  
FIGURE 3. ADC081S021 in Track Mode  
20145410  
FIGURE 4. ADC081S021 in Hold Mode  
2.0 USING THE ADC081S021  
mode on the 13th rising edge of SCLK (see Figure 2). The  
SDATA pin will be placed back into TRI-STATE after the 16th  
falling edge of SCLK, or at the rising edge of CS, whichever  
occurs first. After a conversion is completed, the quiet time  
(tQUIET) must be satisfied before bringing CS low again to  
begin another conversion.  
The serial interface timing diagram for the ADC081S021 is  
shown in Figure 2. CS is chip select, which initiates conver-  
sions on the ADC081S021 and frames the serial data trans-  
fers. SCLK (serial clock) controls both the conversion pro-  
cess and the timing of serial data. SDATA is the serial data  
out pin, where a conversion result is found as a serial data  
stream.  
Sixteen SCLK cycles are required to read a complete  
sample from the ADC081S021. The sample bits (including  
leading or trailing zeroes) are clocked out on falling edges of  
SCLK, and are intended to be clocked in by a receiver on  
subsequent rising edges of SCLK. The ADC081S021 will  
produce three leading zero bits on SDATA, followed by eight  
data bits, most significant first. After the data bits, the  
ADC081S021 will clock out four trailing zeros.  
Basic operation of the ADC081S021 begins with CS going  
low, which initiates a conversion process and data transfer.  
Subsequent rising and falling edges of SCLK will be labelled  
with reference to the falling edge of CS; for example, "the  
third falling edge of SCLK" shall refer to the third falling edge  
of SCLK after CS goes low.  
If CS goes low before the rising edge of SCLK, an additional  
(fourth) zero bit may be captured by the next falling edge of  
SCLK.  
At the fall of CS, the SDATA pin comes out of TRI-STATE  
and the converter moves from track mode to hold mode. The  
input signal is sampled and held for conversion on the falling  
edge of CS. The converter moves from hold mode to track  
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12  
5.0 ANALOG INPUTS  
Applications Information (Continued)  
An equivalent circuit for the ADC081S021’s input is shown in  
Figure 7. Diodes D1 and D2 provide ESD protection for the  
analog inputs. At no time should the analog input go beyond  
(VA + 300 mV) or (GND − 300 mV), as these ESD diodes will  
begin to conduct, which could result in erratic operation.  
3.0 ADC081S021 TRANSFER FUNCTION  
The output format of the ADC081S021 is straight binary.  
Code transitions occur midway between successive integer  
LSB values. The LSB width for the ADC081S021 is VA/256.  
The ideal transfer characteristic is shown in Figure 5. The  
transition from an output code of 0000 0000 to a code of  
0000 0001 is at 1/2 LSB, or a voltage of VA/512. Other code  
transitions occur at steps of one LSB.  
The capacitor C1 in Figure 7 has a typical value of 4 pF, and  
is mainly the package pin capacitance. Resistor R1 is the on  
resistance of the track / hold switch, and is typically 500  
ohms. Capacitor C2 is the ADC081S021 sampling capacitor  
and is typically 26 pF. The ADC081S021 will deliver best  
performance when driven by a low-impedance source to  
eliminate distortion caused by the charging of the sampling  
capacitance. This is especially important when using the  
ADC081S021 to sample AC signals. Also important when  
sampling dynamic signals is an anti-aliasing filter.  
20145414  
20145411  
FIGURE 7. Equivalent Input Circuit  
FIGURE 5. Ideal Transfer Characteristic  
6.0 DIGITAL INPUTS AND OUTPUTS  
4.0 TYPICAL APPLICATION CIRCUIT  
The ADC081S021 digital inputs (SCLK and CS) are not  
limited by the same maximum ratings as the analog inputs.  
The digital input pins are instead limited to +5.25V with  
respect to GND, regardless of VA, the supply voltage. This  
allows the ADC081S021 to be interfaced with a wide range  
of logic levels, independent of the supply voltage.  
A typical application of the ADC081S021 is shown in  
Figure 6. Power is provided in this example by the National  
Semiconductor LP2950 low-dropout voltage regulator, avail-  
able in a variety of fixed and adjustable output voltages. The  
power supply pin is bypassed with a capacitor network lo-  
cated close to the ADC081S021. Because the reference for  
the ADC081S021 is the supply voltage, any noise on the  
supply will degrade device noise performance. To keep noise  
off the supply, use a dedicated linear regulator for this de-  
vice, or provide sufficient decoupling from other circuitry to  
keep noise off the ADC081S021 supply pin. Because of the  
ADC081S021’s low power requirements, it is also possible to  
use a precision reference as a power supply to maximize  
performance. The three-wire interface is shown connected to  
a microprocessor or DSP.  
7.0 MODES OF OPERATION  
The ADC081S021 has two possible modes of operation:  
normal mode, and shutdown mode. The ADC081S021 en-  
ters normal mode (and a conversion process is begun) when  
CS is pulled low. The device will enter shutdown mode if CS  
is pulled high before the tenth falling edge of SCLK after CS  
is pulled low, or will stay in normal mode if CS remains low.  
Once in shutdown mode, the device will stay there until CS is  
brought low again. By varying the ratio of time spent in the  
normal and shutdown modes, a system may trade-off  
throughput for power consumption, with a sample rate as low  
as zero.  
7.1 Normal Mode  
The fastest possible throughput is obtained by leaving the  
ADC081S021 in normal mode at all times, so there are no  
power-up delays. To keep the device in normal mode con-  
tinuously, CS must be kept low until after the 10th falling  
edge of SCLK after the start of a conversion (remember that  
a conversion is initiated by bringing CS low).  
If CS is brought high after the 10th falling edge, but before  
the 16th falling edge, the device will remain in normal mode,  
but the current conversion will be aborted, and SDATA will  
return to TRI-STATE (truncating the output word).  
20145413  
FIGURE 6. Typical Application Circuit  
Sixteen SCLK cycles are required to read all of a conversion  
word from the device. After sixteen SCLK cycles have  
13  
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To enter shutdown mode, a conversion must be interrupted  
by bringing CS high anytime between the second and tenth  
falling edges of SCLK, as shown in Figure 8. Once CS has  
been brought high in this manner, the device will enter  
shutdown mode, the current conversion will be aborted and  
SDATA will enter TRI-STATE. If CS is brought high before the  
second falling edge of SCLK, the device will not change  
mode; this is to avoid accidentally changing mode as a result  
of noise on the CS line.  
Applications Information (Continued)  
elapsed, CS may be idled either high or low until the next  
conversion. If CS is idled low, it must be brought high again  
before the start of the next conversion, which begins when  
CS is again brought low.  
After sixteen SCLK cycles, SDATA returns to TRI-STATE.  
Another conversion may be started, after tQUIET has  
elapsed, by bringing CS low again.  
7.2 Shutdown Mode  
Shutdown mode is appropriate for applications that either do  
not sample continuously, or it is acceptable to trade through-  
put for power consumption. When the ADC081S021 is in  
shutdown mode, all of the analog circuitry is turned off.  
20145416  
FIGURE 8. Entering Shutdown Mode  
20145417  
FIGURE 9. Entering Normal Mode  
To exit shutdown mode, bring CS back low. Upon bringing  
CS low, the ADC081S021 will begin powering up (power-up  
time is specified in the Timing Specifications table). This  
microsecond of power-up delay results in the first conversion  
result being unusable. The second conversion performed  
after power-up, however, is valid, as shown in Figure 9.  
When the VA supply is first applied, the ADC081S021 may  
power up in either of the two modes: normal or shutdown. As  
such, one dummy conversion should be performed after  
start-up, as described in the previous paragraph. The part  
may then be placed into either normal mode or the shutdown  
mode, as described in Sections 7.1 and 7.2.  
If CS is brought back high before the 10th falling edge of  
SCLK, the device will return to shutdown mode. This is done  
to avoid accidentally entering normal mode as a result of  
noise on the CS line. To exit shutdown mode and remain in  
normal mode, CS must be kept low until after the 10th falling  
edge of SCLK. The ADC081S021 will be fully powered-up  
after 16 SCLK cycles.  
When the ADC081S021 is operated continuously in normal  
mode, the maximum throughput is fSCLK / 20. Throughput  
may be traded for power consumption by running fSCLK at its  
maximum specified rate and performing fewer conversions  
per unit time, raising the ADC081S021 CS line after the 10th  
and before the 15th fall of SCLK of each conversion. A plot of  
typical power consumption versus throughput is shown in  
the Typical Performance Curves section. To calculate the  
power consumption for a given throughput, multiply the frac-  
tion of time spent in the normal mode by the normal mode  
power consumption and add the fraction of time spent in  
shutdown mode multiplied by the shutdown mode power  
consumption. Note that the curve of power consumption vs.  
throughput is essentially linear. This is because the power  
consumption in the shutdown mode is so small that it can be  
ignored for all practical purposes.  
8.0 POWER MANAGEMENT  
The ADC081S021 takes time to power-up, either after first  
applying VA, or after returning to normal mode from shut-  
down mode. This corresponds to one "dummy" conversion  
for any SCLK frequency within the specifications in this  
document. After this first dummy conversion, the  
ADC081S021 will perform conversions properly. Note that  
the tQUIET time must still be included between the first  
dummy conversion and the second valid conversion.  
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14  
noise in the substrate that will degrade noise performance if  
that current is large enough. The larger the output capaci-  
tance, the more current flows through the die substrate and  
the greater is the noise coupled into the analog channel,  
degrading noise performance.  
Applications Information (Continued)  
9.0 POWER SUPPLY NOISE CONSIDERATIONS  
The charging of any output load capacitance requires cur-  
rent from the power supply, VA. The current pulses required  
from the supply to charge the output capacitance will cause  
voltage variations on the supply. If these variations are large  
enough, they could degrade SNR and SINAD performance  
of the ADC. Furthermore, discharging the output capaci-  
tance when the digital output goes from a logic high to a logic  
low will dump current into the die substrate, which is resis-  
tive. Load discharge currents will cause "ground bounce"  
To keep noise out of the power supply, keep the output load  
capacitance as small as practical. It is good practice to use a  
100 series resistor at the ADC output, located as close to  
the ADC output pin as practical. This will limit the charge and  
discharge current of the output capacitance and maintain  
noise performance.  
15  
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Physical Dimensions inches (millimeters) unless otherwise noted  
6-Lead LLP  
Order Number ADC081S021CISD or ADC081S021CISDX  
NS Package Number SDB06A  
6-Lead SOT-23  
Order Number ADC081S021CIMF, ADC081S021CIMFX  
NS Package Number MF06A  
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16  
Notes  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
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