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APDS-9002  
Miniature Surface-Mount Ambient Light  
Photo Sensor  
DataSheet  
Description  
Features  
The APDS-9002 is a low-cost analog-output ambient  
light photo sensor in lowest cost miniature chipLED  
lead-free surface mount package. It consists of a  
spectrally suited phototransistor, which peaks in  
human luminosity curve. Hence, it provides an  
excellent responsivity that is close to the response of  
human eyes, as shown in Figure 2. It provides a  
design-alternative to the HSDL-9000 digital-output  
ambient light photo sensor is suitable for portable  
applications with its ultra small package design.  
• Excellent responsivity which peaks in the human  
luminosity curve  
Close responsivity to the human eye  
• Miniature chipLED lead-free surface-mount package  
Height – 0.80 mm  
Width – 2.00 mm  
Depth – 1.25 mm  
• Good output linearity across wide illumination range  
• Low sensitivity variation across various light sources  
• Guaranteed temperature performance  
The APDS-9002 is ideal for applications in which  
the measurement of ambient light is used to control  
display backlighting. Mobile appliances such as the  
mobile phones and PDAs that draw heavy current  
from display backlighting will benefit from  
incorporating these photo sensor products in  
their designs by reducing power consumption  
significantly.  
-40°C to 85°C  
• V supply 2.4 to 5.5 V  
CC  
• Lead-free package  
Applications  
• Detection of ambient light to control display  
backlighting  
Mobile devices – mobile phones, PDAs  
Computing devices – notebooks, webpads  
Consumer devices – TVs, video cameras, digital still  
cameras  
• Automatic residential and commercial lighting  
management  
• Electronic signs and signals  
• Daylight and artificial light exposed devices  
Application Support Information  
The Application Engineering  
Group is available to assist you  
with the application design  
associated with APDS-9002  
ambient light photo sensor  
module. You can contact them  
through your local sales  
representatives for additional  
details.  
Ordering Information  
Part Number  
Packaging Type  
Package  
Quantity  
APDS-9002-021  
Tape and Reel  
4-pins Chipled package  
2500  
Typical Application Circuit  
PIN 2: VCC  
PIN 3: VCC  
PIN 1: IOUT  
APDS-9002  
R
LOAD  
PIN 4: NC  
Figure 1. Typical application circuit for APDS-9002.  
Figure 1 Table  
Recommended Application  
Circuit Components  
Component  
RLOAD  
1 kW  
I/ O Pins Configuration Table  
Pin  
1
Symbol  
IOUT  
VCC  
Description  
IOUT  
2
V
CC  
3
VCC  
V
CC  
4
NC  
No Connect  
2
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
APDS-9002  
SILICON  
EYE RESPONSE  
350 450 550 650 750 850 950 1050 1150 1250  
WAVELENGTH (nm)  
Figure 2. Relative spectral response vs. wavelength.  
CAUTIONS: It is advised that normal static precautions be taken in handling and assembly of this  
component to prevent damage and/or degradation which may be induced by ESD.  
Absolute Maximum Ratings  
For implementations where case to ambient thermal resistance is ≤ 50°C/ W  
Parameter  
Symbol  
TS  
Min.  
-40  
Max.  
85  
Units  
°C  
Storage Temperature  
Operating Temperature  
Supply Voltage  
TA  
-40  
85  
°C  
V
CC  
2.4  
5.5  
V
Recommended Operating Conditions  
Parameter  
Symbol  
Min.  
Max.  
85  
Units Conditions  
Operating Temperature  
Supply Voltage  
TA  
-40  
2.4  
°C  
V
CC  
5.5  
V
3
Electrical & Optical Specifications (TA = 25°C)  
Parameter  
Symbol  
I_PH1  
Min.  
Typ.  
20  
Max.  
33  
410  
-
Units  
µA  
µA  
µA  
nA  
-
Conditions  
Photo Current (I)  
Photo Current (II)  
10  
V = 3.0 V, Lux = 10[2]  
CC  
I_PH2  
136  
250  
300  
50  
V = 3.0 V, Lux = 100[2]  
CC  
Photo Current (III) I_PH3  
Dark Current I_DARK  
Light Current Ratio I_PH3 / I_PH2  
-
-
-
-
-
V = 3.0 V, Lux = 100[1]  
CC  
160  
-
V = 3.0 V, Lux = 0  
CC  
1.2  
-
Rise Time  
Fall Time  
Notes:  
T_RISE  
T_FALL  
0.95  
0.8  
2
ms  
ms  
V = 3.0 V, Lux = 100, Rload = 1 kΩ[3]  
CC  
2
V = 3.0 V, Lux = 100, Rload = 1 kΩ[3]  
CC  
1. Illuminance by CIE standard light source (incandescent lamp).  
2. Fluorescent light is used as light source. White LED is substituted in mass production.  
3. White LED is used as light source.  
Light Measurement Circuit and Waveforms  
I_pulse  
PIN 2: VCC PIN 3: VCC  
I_pulse  
PIN 1: IOUT  
V
OUT  
90%  
10%  
APDS-9002  
R
GND  
LOAD  
tr  
tf  
PIN 4: NC  
4
2.5  
2.0  
1.5  
1.0  
0.5  
0
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
0.01  
0.001  
0.0001  
Fluorescent  
Normalized  
Photocurrent  
Incandescent  
Normalized  
Photocurrent  
0.00001  
10  
100  
1000  
-80 -60 -40 -20  
20 40 60 80  
-50  
0
50  
100  
0
LUX  
ANGLE  
TEMPERATURE (°C)  
Figure 3. Photocurrent vs. luminence  
Figure 4. Normalized photocurrent vs.  
Figure 5. Normalized photocurrent vs. angle  
(V = 3 V, T = 25°C).  
(V = 3 V, T = 25°C).  
temperature (V = 3 V, 100 LUX).  
CC  
A
CC  
CC  
A
10  
1
1.4E-3  
1.2E-3  
1.8E-3  
1.6E-3  
1.4E-3  
1.2E-3  
1.0E-3  
T
= 25°C  
= 3 V  
A
V
CC  
LIGHT SOURCE: WHITE LED  
1.0E-3  
800.0E-6  
600.0E-6  
400.0E-6  
200.0E-6  
000.0E+0  
0.1  
800.0E-6  
600.0E-6  
400.0E-6  
200.0E-6  
000.0E+0  
R = 1 kW  
0.01  
AVERAGE  
2000  
AVERAGE  
2000  
R = 5.1 kW  
R = 11 kW  
R = 51 kW  
0.001  
10  
100  
1000  
0
500  
1000  
R
1500  
2500  
0
500  
1000  
R
1500  
2500  
LUMINANCE, Ev (LUX)  
(W)  
(W)  
LOAD  
LOAD  
Figure 6. Output voltage vs. luminance at  
different load resistor.  
Figure 7. Fall time vs. R  
.
Figure 8. Rise time vs. R  
.
LOAD  
LOAD  
5
APDS-9002 Package Outline  
1.25  
0.35  
MOLDING BODY (LENS)  
R0.20  
P1  
P2  
0.45  
1.40  
2.00  
0.45  
P3  
P4  
0.20  
P.C. BOARD  
0.45  
UNITS: in mm  
PIN 1: IOUT  
PIN 2: VCC  
PIN 3: VCC  
TOLERANCE: ±0.2 mm  
0.80  
0.14  
PIN 4: NC (NO CONNECT)  
0.30  
6
APDS-9002 Tape and Reel Dimensions  
2.00 ± 0.05  
1.25  
4.00 ± 0.1  
4.00 ± 0.1  
P1  
P2  
0.20  
1.56 ± 0.1  
1.75 ± 0.1  
3.50 ± 0.05  
8 ± 0.1  
2.00  
ORIENTATION OF UNIT  
IN TAPE AND REEL POCKETS  
IN PROGRESSIVE DIRECTION  
1.00 ± 0.1  
1.96 ± 0.1  
1.04 ± 0.1  
P3  
P4  
0.20  
1.04 ± 0.1  
PROGRESSIVE DIRECTION  
MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE  
MATERIAL OF COVER TAPE: PVC  
METHOD OF COVER: HEAT SENSITIVE ADHESIVE  
EMPTY  
PARTS MOUNTED  
LEADER  
(40 mm MIN.)  
(400 mm MIN.)  
"B" "C"  
178 75  
UNIT: mm  
EMPTY  
(40 mm MIN.)  
18.4 (MAX.)  
DETAIL A  
2.0 ± 0.50  
C
B
DIA. 13.0 ± 0.50  
R1.0  
LABEL  
20.2 (MIN.)  
DETAIL A  
15.4 (MAX.)  
7
Moisture Proof Packaging  
All APDS-9002 options are  
shipped in moisture proof  
package. Once opened, moisture  
absorption begins.  
Baking Conditions  
If the parts are not stored in dry  
conditions, they must be baked  
before reflow to prevent damage  
to the parts.  
This part is compliant to JEDEC  
Level 4.  
Package  
In Reels  
In Bulk  
Temp.  
60°C  
Time  
20 hours  
5 hours  
125°C  
Baking should only be done  
once.  
UNITS IN A SEALED  
MOISTURE-PROOF  
PACKAGE  
Recommended Storage Conditions  
Storage Temperature  
Relative Humidity  
10°C to 30°C  
Below  
60% RH  
PACKAGE IS  
OPENED (UNSEALED)  
Time from Unsealing to Soldering  
After removal from the bag, the  
parts should be soldered within  
three days if stored at the  
ENVIRONMENT  
LESS THAN 30°C,  
AND LESS THAN  
60% RH  
recommended storage  
conditions. If times longer than  
three days are needed, the parts  
must be stored in a dry box.  
YES  
PACKAGE IS  
OPENED LESS  
THAN 72 HOURS  
NO BAKING  
IS NECESSARY  
YES  
NO  
PERFORM RECOMMENDED  
BAKING CONDITIONS  
NO  
8
Recommended Reflow Profile  
MAX. 260°C  
R3 R4  
255  
230  
220  
200  
R2  
180  
60 sec.  
MAX.  
ABOVE  
220°C  
160  
R1  
R5  
120  
80  
25  
0
50  
100  
P2  
150  
200  
250  
300  
t-TIME (SECONDS)  
P1  
HEAT  
UP  
P3  
P4  
SOLDER PASTE DRY  
SOLDER  
REFLOW  
COOL  
DOWN  
Process Zone  
Heat Up  
Symbol  
P1, R1  
P2, R2  
P3, R3  
P3, R4  
P4, R5  
DT  
Maximum DT/ DTime  
4°C/ s  
25°C to 160°C  
160°C to 200°C  
Solder Paste Dry  
0.5°C/ s  
200°C to 255°C (260°C at 10 seconds max.)  
255°C to 200°C  
4°C/ s  
Solder Reflow  
Cool Down  
-6°C/ s  
200°C to 25°C  
-6°C/ s  
growth within the solder  
Process zone P2 should be of  
sufficient time duration (60 to 120  
seconds) to dry the solder paste.  
The temperature is raised to a  
level just below the liquidus point  
of the solder, usually 200°C  
(392°F).  
The reflow profile is a straight-  
line representation of a nominal  
temperature profile for a  
connections becomes excessive,  
resulting in the formation of weak  
and unreliable connections. The  
temperature is then rapidly  
reduced to a point below the  
solidus temperature of the solder,  
usually 200°C (392°F), to allow  
the solder within the connections  
to freeze solid.  
convective reflow solder process.  
The temperature profile is divided  
into four process zones, each with  
different DT/Dtime temperature  
change rates. The DT/Dtime rates  
are detailed in the above table.  
The temperatures are measured  
at the component to printed  
Process zone P3 is the solder  
reflow zone. In zone P3, the  
temperature is quickly raised  
above the liquidus point of solder  
to 255°C (491°F) for optimum  
results. The dwell time above the  
liquidus point of solder should be  
between 20 and 60 seconds. It  
usually takes about 20 seconds to  
assure proper coalescing of the  
solder balls into liquid solder and  
the formation of good solder  
Process zone P4 is the cool down  
after solder freeze. The cool down  
rate, R5, from the liquidus point  
of the solder to 25°C (77°F)  
should not exceed 6°C per second  
maximum. This limitation is  
necessary to allow the PC board  
and APDS-9002 castellations to  
change dimensions evenly,  
putting minimal stresses on the  
APDS-9002.  
circuit board connections.  
In process zone P1, the PC board  
and APDS-9002 castellation pins  
are heated to a temperature of  
160°C to activate the flux in the  
solder paste. The temperature  
ramp up rate, R1, is limited to 4°C  
per second to allow for even  
heating of both the PC board and  
APDS-9002 castellations.  
connections. Beyond a dwell time  
of 60 seconds, the intermetallic  
9
Appendix A: SMT Assembly Application Note  
Avago APDS-9002: Miniature Surface-Mount Ambient Light Sensor  
METAL STENCIL  
FOR SOLDER PASTE  
PRINTING  
STENCIL APERTURE  
LAND PATTERN  
SOLDER MASK  
PCBA  
Figure 9. Stencil and PCBA.  
1.1 Recommended Land Pattern  
0.55  
0.55  
0.45  
0.55  
1
0.55  
10  
1.2 Recommended Metal Solder  
Stencil Aperture  
APERTURE OPENING  
0.1  
It is recommended that a  
0.10 mm (0.004 inches) thick  
stencil be used for solder paste  
printing. Aperture opening for  
shield pad is 0.6 mm x 0.6 mm.  
This is to ensure adequate  
printed solder paste volume and  
no shorting.  
1.65  
2.2  
UNIT: mm  
Figure 10. Solder stencil aperture.  
2.65  
1.3 Adjacent Land Keepout and  
Solder Mask Areas  
Adjacent land keep-out is the  
maximum space occupied by the  
unit relative to the land pattern.  
There should be no other SMD  
components within this area.  
MOUNTING  
CENTER  
The minimum solder resist strip  
width required to avoid solder  
bridging adjacent pads is  
0.2 mm.  
3.2  
Note: Wet/Liquid Photo-  
Imageable solder resist/mask is  
recommended.  
UNIT: mm  
0.2 MIN.  
Figure 11. Adjacent land keepout and solder mask areas.  
11  
Appendix B: Optical Window Design  
for APDS-9002  
photo light sensor, so that it will  
not affect the angular response of  
the APDS-9002. This minimum  
dimension that is recommended  
will ensure at least a ±35° light  
reception cone.  
The thickness of the window  
should be kept as minimum as  
possible because there is a loss of  
power in every optical window of  
about 8% due to reflection (4% on  
each side) and an additional loss  
of energy in the plastic material.  
2.0 Optical Window Dimensions  
To ensure that the performance of  
the APDS-9002 will not be affected  
by improper window design, there  
are some constraints on the  
dimensions and design of the  
window. There is a constraint on  
the minimum size of the window,  
which is placed in front of the  
If a smaller window is required, a  
light pipe or light guide can be  
used. A light pipe or light guide is  
a cylindrical piece of transparent  
plastic, which makes use of total  
internal reflection to focus the light.  
Figures 12(a) and 12(b) illustrate  
the two types of windows that we  
have recommended which could  
either be a flat window or a flat  
window with light guide.  
FLAT  
PHOTO LIGHT SENSOR  
Figure 12(a). Window size determination for flat window.  
Figure 12(b). Window design of flat window with light guide.  
12  
Table 1 and Figure 13 below show  
the recommended dimensions of  
the window. These dimension  
values are based on a window  
thickness of 1.0 mm with a  
refractive index 1.585.  
The window should be placed  
directly on top of the photo light  
sensor to achieve better  
window with a light pipe is used,  
dimension D2 should be 1.5 mm  
to optimize the performance of  
APDS-9002.  
performance and if a flat  
D1  
TOP VIEW  
T
D1  
L
Z
D1 WINDOW DIAMETER  
T
L
Z
THICKNESS  
PHOTO LIGHT SENSOR  
LENGTH OF LIGHT PIPE  
DISTANCE BETWEEN WINDOW REAR PANEL  
AND APDS-9002  
Figure 13. Recommended window dimensions.  
Table 1: Recommended Dimension for Optical Window  
All dimensions are in mm  
Flat Window  
Flat Window  
(L = 0.0)  
with Light Pipe  
(D2 = 1.5; Z = 0.5)  
WD  
(T+L+Z)  
Z
D1  
D1  
-
L
-
1.5  
2.0  
2.5  
3.0  
0.5  
1.0  
1.5  
2.0  
2.25  
3.25  
4.25  
5.00  
-
-
-
-
2.5  
1.5  
2.1 Optical Window Material  
The material of the window is  
Table 2: Recommended Plastic Materials  
Material Number  
recommended to be polycarbonate.  
The surface finish of the plastic  
should be smooth, without any  
texture.  
Visible Light Transmission  
Refractive Index  
1.587  
Makrolon LQ2647  
Makrolon LQ3147  
Makrolon LQ3187  
87%  
87%  
85%  
1.587  
1.587  
The recommended plastic material  
for use as a window is available  
from Bayer AG and Bayer Antwerp  
N. V. (Europe), Bayer Corp. (USA)  
and Bayer Polymers Co., Ltd.  
(Thailand), as shown in Table 2.  
13  
Appendix C: General Application  
Guide for APDS-9002  
The amount of converted voltage,  
VOUT, is mainly dependant  
Brightness is measured as “LUX”  
unit, which describes how intense  
a light source that our eyes  
perceive. LUX meter is the  
equipment for “LUX”  
measurement. Light sources with  
the same LUX level appear at the  
same brightness to the human  
eyes.  
proportionally on the photo  
current which is generated by the  
brightness of the light shone on  
the photo sensor and the load  
resistor used, RL. Increasing the  
brightness of the light and/or the  
load resistor will increase the  
output voltage.  
The APDS-9002 is a low cost  
analog-output ambient light photo  
sensor which spectral response  
closely emulates the human eyes.  
APDS-9002 consists of a  
phototransistor that enables the  
photo sensor to produce a high  
gain photo current to a sufficient  
level that can be converted to  
voltage with a standard value of  
external resistor. APDS-9002 is  
then easily integrated into  
V
V
CC  
CC  
2
3
systems that use ADC input which  
is available for sampling of the  
external source, as shown in  
Figure 14 below.  
LIGHT  
SOURCE  
V
1
OUT  
APDS-9002  
A/ D  
C
R
L
4
MICRO-  
CONTROLLER  
NC  
Figure 14. Configuration of APDS-9002 being used directly.  
10  
Selection of the load resistor RL  
will determine the amount of  
current-to-voltage conversion in  
the circuit. Based on Figure 14  
and using white LED as the light  
source, measurement has been  
carried out by using different  
load resistors to examine the  
variation of the output voltage  
towards the intense of LUX. The  
result is shown in Graph 1.  
APDS-9002 allows output  
T
= 25°C  
= 3 V  
A
V
CC  
LIGHT SOURCE: WHITE LED  
1
0.1  
R = 1 kW  
0.01  
0.001  
R = 5.1 kW  
R = 11 kW  
R = 51 kW  
10  
100  
1000  
voltage hits around 2.3 V, after  
this it saturates.  
LUMINANCE, Ev (LUX)  
Light source, e.g., fluorescent  
light, consists of ac noise about  
100 Hz frequency. A capacitor of  
10 µF, which acts as a low-pass  
filter, is recommended to add in  
parallel with resistor to by-pass  
the ripples.  
Graph 1. Output voltage vs. luminance at different load resistor.  
14  
Avago has fabricated an  
evaluation board based on the  
configuration shown in Figure 14  
for the designer to test the  
ambient light sensor under  
different lighting conditions. A  
reference layout of a 2-layout  
Avago evaluation board for APDS-  
9002 is shown in Figure 15 below.  
Figure 15. Evaluation board layout.  
15  
For product information and a complete list of distributors, please go to our website: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.  
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved.  
5989-3051EN June 7, 2006