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Document Number: MC33199  
Rev. 4.0, 10/2006  
Freescale Semiconductor  
Technical Data  
Automotive ISO 9141 Serial Link  
Driver  
33199  
The MC33199 is a serial interface circuit used in diagnostic  
applications. It is the interface between the microcontroller and the  
special K and L lines of the ISO diagnostic port. The MC33199 has  
been designed to meet the «Diagnosis System ISO9141»  
specification.  
LIN, ISO-9141 J-1850 PHYSICAL  
INTERFACES  
The device has a bi-directional bus K line driver, fully protected  
against short circuits and over temperature. It also includes the L line  
receiver, used during the wake up sequence in the ISO transmission.  
The MC33199 has a unique feature which allow transmission Baud  
rate up to 200kBaud.  
D SUFFIX  
EF SUFFIX (PB-FREE)  
PLASTIC PACKAGE  
98ASB42565B  
Features  
• Electrically Compatible with Specification “Diagnosis System  
ISO9141”  
14 PIN SOIC  
• Transmission speed up to 200kBaud  
• Internal Voltage Reference Generator for Line Comparator  
Thresholds  
• TXD, RXD and LO pins are 5V CMOS Compatible  
• High Current Capability of DIA pin (K line)  
• Short Circuit Protection for the K Line Input  
• Over Temperature Shutdown with Hysteresis  
• Large Operating Range of Driver Supply Voltage  
• Large Operating Temperature Range  
• ESD Protected pins  
ORDERING INFORMATION  
Temperature  
Device  
Package  
Range (T )  
A
MC33199D  
MCZ33199EF/R2  
-40°C to 125°C  
14 SOIC  
• Pb-Free Packaging Designated by Suffix Code EF  
V
BAT  
V
DD  
33199  
VDD  
I/O  
VCC  
VS  
ISO L-LINE  
ISO K-LINE  
LO  
L
I1  
MCU  
SCIRXD  
RXD  
TXD  
(BUS)  
SCITXD  
DIA  
GND  
Figure 1. Simplified Application Diagram  
Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as  
may be required, to permit improvements in the design of its products.  
© Freescale Semiconductor, Inc., 2006. All rights reserved.  
INTERNAL BLOCK DIAGRAM  
INTERNAL BLOCK DIAGRAM  
33199  
VCC  
VS  
Reference  
Generator  
Protection  
REF-OUT  
LO  
L
+
C2  
I1  
Source  
REF-IN-L  
I1  
REF-IN-K  
RXD  
V
CC  
C1  
DIA  
+
Thermal  
Shutdown  
TXD  
Driver  
GND  
Current  
Limit  
Figure 2. 33199 Simplified Internal Block Diagram  
33199  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
2
PIN CONNECTIONS  
PIN CONNECTIONS  
33199  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
VCC  
REF-IN-L  
REF-IN-K  
LO  
REF-OUT  
VS  
L
I1  
RXD  
GND  
DIA  
NC  
TXD  
8
NC  
Figure 3. 33199 Pin Connections  
Table 1. Pin Definitions  
A functional description of each pin can be found in the Functional Pin Description section, beginning on page 12.  
Pin Number  
Pin Name  
VCC  
Definition  
5V typical power supply pin. typical supply current is less than 1.5mA  
Input reference for C2 comparator.  
1
2
3
4
5
REF-IN-L  
REF-IN-K  
LO  
Input reference for C1 comparator.  
This pin control Sleep Mode, Transmit Level, and Speed. It has a weak pulldown.  
RXD  
Open drain output of the data on BUS. A recessive bus = a logic [1], a dominant bus = logic [0]. An  
external pullup is required.  
6
TXD  
Data input here will appear on the BUS pin. A logic [0] will assert the bus, a logic [1] will make the bus  
go to the recessive state.  
7, 8  
9
NC  
DIA  
No internal connection to these pins.  
Provides a battery-level logic signal.  
10  
GND  
Electrical Common Ground and Heat removal. A good thermal path will also reduce the die  
temperature.  
11  
12  
I1  
L
Power input. An external diode is needed for reverse battery protection.  
The external bus load resistor connects here to prevent bus pullup in the event of loss of module  
ground.  
13  
14  
This pin connects to the bus through external components.  
Internal reference voltage generator output pin.  
VS  
REF-OUT  
33199  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
3
ELECTRICAL CHARACTERISTICS  
MAXIMUM RATINGS  
ELECTRICAL CHARACTERISTICS  
MAXIMUM RATINGS  
Table 2. Maximum Ratings  
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or  
permanent damage to the device.  
Ratings  
Symbol  
Value  
Unit  
ELECTRICAL RATINGS (1)  
VS Supply Pin  
V
VS  
0.5 to + 40  
2 to + 40  
DC Voltage Range  
Transient Pulse (2)  
VPULSE  
VCC Supply DC Voltage Range  
VCC  
0.3 to + 6.0  
V
DIA and L Pins (2)  
DC Voltage Range  
- 0.5 TO + 38  
-2  
V
V
Transient Pulse (clamped by internal diode)  
DC Source Current  
- 50  
mA  
mA  
DIA Low Level Sink Current  
INT. LIMIT  
TXD DC Voltage Range  
-0.3 TO VCC +0.3  
V
V
REF-IN DC Voltage Range  
VS < VCC  
-0.3 TO VCC  
-0.3 TO VS  
VS > VCC  
ESD Voltage Capability  
VESD  
+/-2000  
V
THERMAL RATINGS  
Storage Temperature  
TSTG  
TJ  
55 to + 150  
40 to + 150  
180  
°C  
°C  
Operating Junction Temperature  
Thermal Resistance, Junction to air  
Max Power Dissipation (@ TA=105 °C)  
Peak Package Reflow Temperature During Reflow (3)  
Notes  
RTJA  
PD  
C/W  
250  
mW  
°C  
(4)  
,
TPPRT  
Note 4.  
1. The device is compatible with Specification: “Diagnosis System ISO9141”  
2. See the test Circuit (Figure 26). Transient test pulse according to ISO76371 and DIN 40839, highest test levels  
3. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may  
cause malfunction or permanent damage to the device.  
4. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow  
Temperature and Moisture Sensitivity Levels (MSL),  
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.  
MC33xxxD enter 33xxx), and review parametrics.  
33199  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
4
ELECTRICAL CHARACTERISTICS  
STATIC ELECTRICAL CHARACTERISTICS  
STATIC ELECTRICAL CHARACTERISTICS  
Table 3. Static Electrical Characteristics  
Characteristics noted under conditions VCC from 4.5V to 5.5V, VS from 4.5V to 20V unless otherwise note. Typical values  
reflect approximate mean at 25°C, nominal VCC and VS, at time of device characterization. Typical values noted reflect the  
approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
VCC PIN 1  
VCC Supply Voltage Range  
VCC Supply Current (6)  
VCC  
ICC  
4.5  
0.5  
5.5  
1.5  
V
1.0  
V
REF-IN-L PIN 2 AND REF-IN-K PIN 3  
REF-IN-L & REF-IN-K Input Voltage Range:  
for 0 <VS< VCC  
VINREF  
V
2.0  
2.0  
VCC -2.0  
VS -1.0  
for VCC <VS< 40V  
REF-IN-L & REF-IN-K Inputs Currents  
IVIN  
-5.0  
5.0  
µΑ  
LO PIN 4  
LO open Collector Output  
VOL  
V
Low Level Voltage @ IOUT = 1mA  
Low Level Voltage @ IOUT = 4mA  
0.34  
0.7  
0.8  
RXD PIN 5  
Pull up resistor to VCC  
Low Level Voltage @ IOUT=1mA  
TXD PIN 6  
RRXD  
VOL  
1.5  
2.0  
0.3  
2.5  
0.7  
kΩ  
V
High Level Input Voltage  
Low Level Input Voltage  
VIH  
VIL  
0.7VCC  
2.8  
2.0  
V
V
0.3VCC  
Input Current @ 0<VS<40V  
TXD at High Level  
µΑ  
IH  
II  
-200  
-600  
30  
TXD at Low Level  
-100  
DIA INPUT / OUTPUT PIN 9  
Low Level Output Voltage @ I = 30mA  
Drive Current Limit  
VOL  
ILIM  
VIH  
0.0  
40  
0.35  
0.8  
V
mA  
V
120  
High Level Input Threshold Voltage  
(REF-IN-K connected to REF-OUT)  
VREF MIN  
0.25V  
VREF  
VREF MAX  
0.4V  
0.325V  
Low Level Input Threshold Voltage  
(REF-IN-K connected to REF-OUT)  
VIL  
VREF MIN  
-0.2V  
VREF  
VREF MAX  
-0.05V  
V
-0.125V  
Input Hysteresis  
Leakage Current  
Over temperature Shutdown  
Notes  
VHYST  
ILEAK  
TLIM  
300  
4.0  
450  
10  
600  
16  
mV  
µΑ  
°C  
155  
5. Measured with TXD=Vcc, I1=Vs, DIA & L high, no load, REF-IN-L and REF-IN-K connected to REF-OUT  
33199  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
5
ELECTRICAL CHARACTERISTICS  
STATIC ELECTRICAL CHARACTERISTICS  
Table 3. Static Electrical Characteristics (continued)  
Characteristics noted under conditions VCC from 4.5V to 5.5V, VS from 4.5V to 20V unless otherwise note. Typical values  
reflect approximate mean at 25°C, nominal VCC and VS, at time of device characterization. Typical values noted reflect the  
approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
L INPUT PIN 12  
High Level Input Threshold Voltage  
(REF-IN-L connected to REF-OUT)  
VIH  
VIL  
VREF MIN  
0.25V  
VREF  
VREF MAX  
0.4V  
V
V
0.325V  
Low Level Input Threshold Voltage  
(REF-IN-L connected to REF-OUT)  
VREF MIN  
-0.2V  
VREF  
VREF MAX  
-0.05V  
-0.125V  
Input Hysteresis  
VHYST  
ILEAK  
300  
4.0  
450  
10  
600  
16  
mV  
Leakage Current  
µΑ  
L1 INPUT PIN 11  
Static Source Current  
Static Saturation Voltage @ I1S=-2mA  
Dynamic Source Current  
Dynamic Saturation Voltage @ I1S=-40mA  
VS PIN 13  
I1S  
VI1SAT  
I1D  
-4.0  
-3.0  
VS - 0.8  
-80  
-2.0  
VS  
mA  
V
VS - 1.2  
-120  
-40  
VS  
mA  
V
VI1DSAT  
VS - 2.7  
VS - 0.85  
VS Supply Voltage Range  
VS Supply Current  
VS  
IS  
4.5  
0.5  
20  
V
1.3  
2.0  
mA  
REF-OUT PIN 14  
Output Voltage :  
VREF  
V
@ 3 < VS < 5.6V & IRO = +-10µΑ  
@ 5.6 < VS < 18V & IRO = +-10µΑ  
@ 18 < VS < 40V & IRO = +-10µΑ  
2.7  
0.5 x VS  
8.5  
3.3  
0.56 x VS  
10.8  
Maximum output current  
Pull-up resistor to VCC  
IOUT  
RPU  
-50  
3.0  
50  
12  
µΑ  
8.0  
kΩ  
6.  
Measured with TXD=VCC, I1=VS, DIA & L high, no load, REF-IN-L and REF-IN-K connected to REF-OUT  
33199  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
6
ELECTRICAL CHARACTERISTICS  
DYNAMIC ELECTRICAL CHARACTERISTICS  
DYNAMIC ELECTRICAL CHARACTERISTICS  
Table 4. Dynamic Electrical Characteristics  
Characteristics noted under conditions Vcc from 4.5V to 5.5V, Vs from 4.5V to 20V unless otherwise noted. Typical values  
noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
DELAY TIMING  
Transmission Speed  
High or Low Bit Time  
Rxd Output :  
1/T BIT  
T BIT  
0.0  
5.0  
200k  
Baud  
µs  
ns  
Low to High Transition Delay Time  
High to Low Transition Delay Time  
tRDR  
tDRF  
450  
450  
LO Output :  
µs  
ns  
µs  
Low to High Transition Delay Time  
High to Low Transition Delay Time  
tLDR  
tLDF  
2.0  
2.0  
DIA Output :  
Low to High Transition Delay Time  
High to Low Transition Delay Time  
tDDR  
tDDF  
650  
650  
I1 Output @ VS-I1 > 2.7V :  
Rise time  
tI1R  
tI1F  
0.3  
4.5  
Hold Time  
1.5  
33199  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
7
ELECTRICAL CHARACTERISTICS  
TIMING DIAGRAMS  
TIMING DIAGRAMS  
+5V  
+12V  
5V  
TXD Input  
Signal  
t
BIT  
VCC VBAT  
0V  
I1  
REF-OUT  
t
t
DDF  
DDR  
Test  
REF-IN-L  
REF-IN-K  
TxD  
Point  
10V  
Input  
DIA  
1nF  
DIA Output  
Signal  
Signal  
GND  
2V  
Figure 4. TXD to DIA AC Characteristic  
+5V  
+12V  
12V  
DIA and L  
Input Signal  
t
BIT  
VCC VBAT  
REF-OUT  
0V  
t
/ t  
RDF LDF  
2K  
t
/ t  
RDR LDR  
REF-IN-L  
REF-IN-K  
TXD  
L
Input  
Signal  
4.5V  
DIA  
RXD ot LO  
Output  
Signal  
Test  
Points  
LO  
GND  
0.4V  
RXD  
2x30pF  
Figure 5. DIA to TxD and L to LO AC Characteristics  
.
t
BIT  
5V  
TXD Signal  
120mA  
0V  
t
I1F  
t
I1H  
Current Source I1  
Maximum Limit  
Typical I1  
Waveform  
40mA  
4mA  
2mA  
Current Source I1  
Minimum Limit  
t
I1R  
Figure 6. Current Source I1 AC Characteristics  
At static HIGH or LOW level TXD, the current source I1 delivers a current of 3mA (typ). Only during LOW to HIGH transition,  
does this current increase to a higher value in order to charge the K Line capacitor (Cl<4nF) in a short time.  
33199  
Analog Integrated Circuit Device Data  
8
Freescale Semiconductor  
ELECTRICAL CHARACTERISTICS  
ELECTRICAL PERFORMANCE CURVES  
+5V  
+12V  
I1 pulse  
current  
VBAT  
VCC  
I1  
REF-OUT  
REF-IN-L  
REF-IN-K  
TXD  
Input  
DIA  
DIA discharge  
current  
Signal  
33nF  
To Oscilloscope  
LO  
10  
GND  
RXD  
Figure 7. Current Source I1 and DIA Discharge current test schematic  
ELECTRICAL PERFORMANCE CURVES  
Figure 10. IS Supply Voltage versus VS Supply Voltage  
Figure 8. ICC Supply Current versus Temperature  
-40°C  
125°C  
25°C  
Figure 9. VS Supply Current versus VS Supply Voltage  
Figure 11. VS Voltage versus IS Current  
(VCC=5.5V, VDIA, L, I1=20V  
33199  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
9
ELECTRICAL CHARACTERISTICS  
ELECTRICAL PERFORMANCE CURVES  
Figure 12. REF-OUT Voltage versus VS Supply Voltage  
Figure 13. REF-OUT Voltage versus REF-OUT Current  
Figure 14. L and DIA Hysteresis versus Temperature  
Figure 15. L and DIA Current versus L and DIA Voltage  
I DIA = 40mA  
Figure 16. DIA Saturation Voltage versus Temperature  
Figure 17. DIA Current Limit versus Temperature  
33199  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
10  
ELECTRICAL CHARACTERISTICS  
ELECTRICAL PERFORMANCE CURVES  
Figure 18. RXD Pull-up Resistor versus Temperature  
Figure 21. I1 Output DC Current versus Temperature  
LO  
RXD  
Figure 19. TXD and LO Saturation Voltage versus  
Temperature  
Figure 22. I1 Output Pulse Current versus VS Supply  
Voltage  
I=40mA  
I=2mA  
Figure 20. I1 Saturation Voltage versus Temperature  
Figure 23. I1 Pulse Current Width versus Temperature  
33199  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
11  
FUNCTIONAL DESCRIPTION  
INTRODUCTION  
FUNCTIONAL DESCRIPTION  
INTRODUCTION  
The MC33199 is a serial interface circuit used in diagnostic applications. It is the interface between the microcontroller and  
the special K and L lines of the ISO diagnostic port. The MC33199 has been designed to meet the «Diagnosis System ISO9141»  
specification.  
This product description will detail the functionality of the device (see Figure 2, 33199 Simplified Internal Block Diagram). First,  
the power supply and reference voltage generator will be discussed, then the paths functions between MCU, K and L lines will  
be detailed. A dedicated paragraph will tell about the special functionality of the I1 pin, which allow high Baud rates transmission.  
FUNCTIONAL PIN DESCRIPTION  
circuit to VBAT (VS). When turning ON (TXD low), this pin will  
pull the Bus line to Gnd, the current into DIA will be internally  
limited to 60mA typ.  
VCC (VCC)  
5V typical power supply pin. Typical supply current is less  
than 1.5mA.  
The internal power transistor has a thermal shutdown  
circuit, which forces the DIA output OFF in case of over  
temperature.  
REF-IN-L (REF-IN-L)  
Input reference for C2 comparator. This input can be  
connected directly to REF-OUT, with or without a resistor  
network, or to an external reference.  
DIA is also the C1 comparator input. It is protected against  
both positive and negative over voltage by a 38V zener diode.  
This pin exhibits a constant input current of 7.5?A.  
REF-IN-K (REF-IN-K)  
GND (GND)  
Input reference for C1 comparator. This input can be  
connected directly to REF-OUT, with or without a resistor  
network, or to an external reference.  
Gnd reference for the entire device.  
I1 (I1)  
LO (LO)  
Bus source current pin. It is normally tied to DIA pin and to  
the Bus line.  
Output of C2 comparator, normally connected to a micro-  
controller I/O. If L input > (REF-IN-L + Hyst/2) then output LO  
is in high state. If L< (REF-IN-L - Hyst/2) then output LO is in  
low state, output transistor ON.  
At static HIGH or LOW level Txd, the current source I1  
delivers a current of 3mA (typ). Only during LOW to HIGH  
transition, does this current increase to a higher value in  
order to charge the key line capacitor (Cl<4nF) in a short time  
(see fig 3 and 4).  
This pin is an open collector structure. A Pull up resistor  
should be added to VCC.  
Drive capability of this output is 5mA.  
L (L)  
Input for C2 comparator. This pin is protected against both  
positive and negative over voltage by a 38V zener diode.  
RXD (RXD)  
Receive output, normally connected to a microcontroller I/  
O.  
This L line is a second independent input. It can be used  
for wake up sequence in ISO diagnosis or as an additional  
input bus line.  
If DIA input > (REF-IN-L + Hyst/2) then output LO is in high  
state.  
This pin exhibits a constant input current of 7.5µΑ.  
If DIA < (REF-IN-L - Hyst/2) then output LO is in low state,  
output transistor ON. This pin has an internal pull up resistor  
to VCC (2Kohm typ). Drive capability of this output is 5mA  
VS (VS)  
12V typical, or Vbat supply pin for the device. This pin is  
protected against over voltage transients.  
TXD (TXD)  
Transmission input, is normally connected to a  
microcontroller I/O.This pin controls DIA output. If Txd is high,  
the output DIA transistor is OFF. If Txd is low the DIA output  
transistor is ON.  
REF-OUT (REF-OUT)  
Internal reference voltage generator output pin. Its value  
depends on Vs (Vbat) values. This output can be directly  
connected to REF-IN L and REF-IN-K, or through a resistor  
network. Maximum current capability is 50µΑ.  
DIA (DIA)  
Input / Output Diagnosis Bus line pin. This pin is an open  
collector structure, protected against over current and short  
33199  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
12  
FUNCTIONAL DEVICE OPERATION  
FUNCTIONAL DEVICE OPERATION  
connected to L pin. The output of the comparator is available  
on LO output pin, which is an open collector structure. LO is  
normally connected to a MCU I/O port.  
POWER SUPPLIES AND REFERENCE VOLTAGE  
The device has two power supplies :  
A 5V supply, VCC, normally connected to the MCU supply  
voltage. This pin sinks typically 1mA during operation. A  
VBAT supply voltage, VS, normally tied to the car battery  
voltage. This pin can sustain up to 40V DC. Care should be  
taken for reverse battery protection and transient voltages  
higher than 40V.  
The DIA, and L pins can sustain up to 38V DC. Care  
should be taken for reverse battery protection and transient  
voltages higher than 38V.  
The DIA and L pins both have internal pull down current  
source of typically 7.5µΑ (see Figure 15). So the L line  
exhibits a 10µΑ pull down current. The DIA pin has the same  
behavior when it is in OFF state, that is when TXD is at logic  
high level.  
The voltage reference generator is supplied from both  
VCC and VBAT. It provides reference voltage for the K and L  
lines comparators thresholds. The reference voltage is  
dependant on VBAT voltage : it is linear versus VBAT  
voltage, for VBAT from 5.6V to 18V. Below 5.6V and over  
18V the reference voltage is clamped (see Figure 12). The  
reference is connected externally to the device, through REF-  
OUT pin. It is available for other needs. It can supplied 50µΑ  
max (see Figure 13).  
SPECIAL FUNCTIONALITY OF I1 PIN  
The MC33199 has a unique feature which allows the  
transmission Baud rate to be up to 200kBaud. In practice, the  
K line can be several meters long, and thus can have a large  
parasitic capacitor value. This parasitic capacitor value will  
slow down the low to high transition of the K line, and indeed  
will limit the Baud rate transmission. For the K line to go from  
low to high level, the parasitic capacitor need to be charged,  
and it can only be charged by the pull up resistor. A low pull  
up resistor value would result in fast charge time of the  
capacitor, but also in large output current, and large power  
dissipation in the driver.  
PATH FUNCTIONS BETWEEN MCU, K AND L  
LINES  
The path function from the MCU to the K line is composed  
of a driver interfacing directly with the MCU through the TXD  
pin. The TXD pin is CMOS compatible. This driver controls a  
power transistor which can be turned ON or OFF. When it is  
ON, it pull the DIA pin low. This pin is known as K line in the  
ISO 9141 specification. The DIA pin structure is open  
collector, without pull up component. This allow the  
connection of several MC33199 on the K line and the use of  
a single pull up resistor per system (see Figure 25). In order  
to protect the DIA pin against short circuits to VBAT, the  
device incorporates a current limitation (see Figure 17) and a  
thermal shutdown. This current limitation will also act when  
the device drives a K line bus exhibiting large parasitic  
capacitor value (see Special functionality of I1 pin).  
To avoid this problem, the MC33199 incorporates a  
dynamic current source, which is temporary activated at the  
low to high transition of the TXD pin, that is when the DIA pin  
or K line should switch from low to high level (see Figure 6 &  
Figure 7).  
This current source is available at I1 pin. It has a typical  
value of 80mA. It is activated for 4µs (see Figure 22 &  
Figure 23) and is automatically disabled after this time.  
During that time it will charge the K line parasitic capacitor.  
This extra current will quickly rise the K line voltage up to the  
Vbat, and will result in reduce rise time on the K line. With this  
feature the MC33199 can ensure Baud rate transmission of  
up to 200kBaud.  
The path from this DIA pin, or K line, to the MCU is done  
through a comparator. The comparator threshold voltage is  
connected to REF-IN-K pin. It can be tied to the REF-OUT  
voltage, if the VBAT dependant threshold is to be achieved.  
The second input of this comparator is internally connected  
to DIA pin. The output of the comparator is available on RXD  
output pin, normally connected to a MCU I/O port. RXD pin  
has a 2kOhms internal pull up resistor.  
During high to low transition on the K line, the parasitic  
capacitor of the bus line will be discharged by the output  
transistor of the DIA pin. In this case, the total current may  
exceed the internal current limitation of the DIA pin. If so, the  
current limitation will act, and discharge current will be limited  
to typically 60mA (See Figure 7 & Figure 17).  
The path from the L line, used during wake-up sequence  
of the transmission, to the MCU is done through a second  
comparator. The comparator threshold voltage is connected  
to REF-IN-L pin. As the REF-IN-K pin, it can be tied to the  
REFOUT voltage, if the VBAT dependant threshold need to  
be achieved. The second input of this comparator is internally  
If a high Baud rate is necessary, the I1 pin need to be  
connected to the DIA as shown in the typical application  
Figure 24. The I1 pin can also be left open, if the I1  
functionality and high Baud rate are not suited in the  
application.  
33199  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
13  
TYPICAL APPLICATIONS  
TYPICAL APPLICATIONS  
+VBAT  
VCC : 5V  
VS  
REF-OUT  
Reference  
Generator  
Protection  
LO  
L Line  
L
+
C2  
-
REF-IN-L  
REF-IN-K  
I1  
source  
RPU  
TxD  
RxD  
I1  
Vcc  
RXD  
-
C1  
+
K Line  
DIA  
Thermal  
Shutdown  
MCU  
TXD  
Driver  
GND  
Current  
Limit  
SERVICE TESTER  
or  
End of Line  
manufacturer  
programmation or  
checking system  
CAR ELECTRONIC CONTROL UNIT  
Figure 24. Logic Diagram and Application Schematic  
33199  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
14  
TYPICAL APPLICATIONS  
+Vbat  
RPU  
L Line  
K Line  
SERVICE TESTER  
or  
End of Line  
MC33199  
MCU  
manufacturer  
programmation or  
checking system  
E.C.U # 1  
CAR ISO DIAGNOSTIC CONNECTOR  
MC33199  
MCU  
E.C.U # 2  
CAR  
Other ECUs  
Figure 25. Typical Application with Several ECUs  
+12V  
D2  
100nF  
D1  
Schaffner  
Generator  
VBAT  
I1  
2x1nF  
L
DIA  
GND  
2x330pF  
Figure 26. Test Circuit for Transient Schaffner Pulses  
Test pulses are directly applied to VS and via a capacitor of 1nF to DIA and L. The voltage VS is limited to -2V/38V by the  
transient suppressor diode D1. Pulses can occor simultaneously or separately.  
33199  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
15  
PACKAGING  
PACKAGE DIMENSIONS  
PACKAGING  
PACKAGE DIMENSIONS  
For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below.  
D SUFFIX  
EF-SUFFIX (PB-FREE)  
PLASTIC PACKAGE  
98ASB42565B  
ISSUE H  
33199  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
16  
REVISION HISTORY  
REVISION HISTORY  
Revision  
Date  
Description of Changes  
Implemented Revision History page  
Added EF Pb-FREE suffix  
Revised Figure 1, Simplified Application Drawing.  
Converted to Freescale format and updated to the prevailing form and style  
Removed MC33199EF/R2 and replaced with MCZ33199EF/R2 in the Ordering Information block  
8/2006  
2.0  
Made unit label corrections on Transmission Speed, High or Low Bit Time, LO Output :, and I1  
Output @ VS-I1 > 2.7V : on page 7.  
9/2006  
3.0  
4.0  
Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from  
Maximum Ratings on page 4. Added note with instructions to obtain this information from  
www.freescale.com.  
10/2006  
33199  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
17  
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MC33199  
Rev. 4.0  
10/2006