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ASDL-3007  
IrDA Data Compliant Low Power 115.2 Kbit/s  
with Remote Control Infrared Transceiver  
Data Sheet  
Description  
Features  
General Features  
• Operating temperature from -25°C to +85°C  
The ASDL-3007 is a new generation ultra-low profile  
enhanced infrared (IR) transceiver module that provides  
the capability of (1) interface between logic and IR signals  
for through-air, serial, half-duplex IR data link, and (2) IR  
remote control transmission for universal remote control  
applications. The ASDL-3007 can be used for IrDA as well  
as remote control application without the need of any  
additional external components for multiplexing.  
-
Critical parameters are guaranteed over  
temperature and supply voltage  
• Vcc Supply 2.4 to 3.6V  
• Miniature Package  
-
-
-
Height : 1.60 mm  
Width : 7.00 mm  
Depth : 2.80 mm  
The ASDL-3007 is fully compliant to IrDA Physical Layer  
specification version 1.4 low power from 9.6 kbit/s to  
115.2 kbit/s (SIR) and IEC825 Class 1 eye safety standards.  
• Moisture Level 3  
ASDL-3007 can be shutdown completely to achieve very  
low power consumption. In the shutdown mode, the PIN  
diode will be inactive and thus producing very little pho-  
tocurrent even under very bright ambient light. It is also  
designed especially for battery operated mobile devices  
such as PDAs and mobile phones that require low power  
consumption.  
• Integrated remote control LED driver  
• LED Stuck-High Protection  
• High EMI performance without shield  
• Designed to Accommodate Light Loss with Cosmetic  
Windows  
• IEC 825-Class 1 Eye Safe  
• Lead Free and ROHS Compliant  
Applications  
• Mobile data communication and universal remote  
IrDAFeatures  
control  
• Fully Compliant to IrDA 1.4 Physical Layer Low Power  
-
-
-
-
Mobile Phones  
PDAs  
Printers  
Specifications from 9.6 kbit/s to 115.2 kbit/s  
• Link distance up to 50cm typically  
• Complete shutdown  
Industrial and Medical Instrument  
• Low Power Consumption  
-
-
Low shutdown current  
Low idle current  
Remote Control Features  
• Wide angle and high radiant intensity  
• Spectrally suited to remote control transmission  
function  
• Typical link distance up to 8 meter  
Figure 1. Functional Block Diagram of ASDL-3007  
8
7
6
5
4
3
2
1
Figure 2. Pin out for ASDL-3007  
2
Application Support Information  
Marking Information  
The Application Engineering Group is available to assist  
you with the application design associated with ASDL-  
3007 infrared transceiver module. You can contact them  
through your local sales representatives for additional  
details.  
The unit is marked with ‘PYWWLL’ on the back of the PCB  
for front option without shield.  
P = Product Code  
Y = Year  
WW = Work Week  
LL = Lot Number  
Order Information  
Part Number  
Packaging Type Package  
Tape and Reel Front Option  
Quantity  
ASDL-ꢀ007-021  
2500  
I/O Pins Configuration Table  
Pin  
1
Symbol  
LEDA  
SD  
Description  
LED Anode  
Shutdown  
I/O Type  
Notes  
Note 1  
Note 2  
Note ꢀ  
Note 4  
Note 5  
Note 6  
Note 7  
Note 8  
2
Input. Active High  
Input. Active High  
Output. Active Low  
ꢀ
TxD_IR  
RxD  
IrDA transmitter data input.  
IrDA receive data  
4
5
Vcc  
Supply Voltage  
6
TxD_RC  
NC  
RC transmitter data input.  
Input. Active High  
7
8
GND  
Ground  
Notes:  
1. Tied through external resistor, R1, to Vled. Refer to the table below for recommended series resistor value.  
2. Complete shutdown of IC and PIN diode. The pin is used for setting receiver bandwidth and RC drive  
programming mode. Refer to section on “Bandwidth Selection Timing” and “Remote Control Drive Modes” for  
more information. Do NOT float this pin.  
3. This pin is used to transmit serial data when SD pin is low. If held high for longer than 50 ms, the LED is turned  
off. Do NOT float this pin.  
4. This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull-down resistor is  
required. The pin is in tri-state when the transceiver is in shutdown mode.  
5. Regulated, 2.4V to 3.6V  
6. Logic high turns on the RC LED. If held high longer than 50 ms, the RC LED is turned off. Do NOT float the pin.  
7. NC.  
8. Connect to system ground.  
CAUTIONS: The CMOS inherent to the design of this component increases the component’s susceptibility  
to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling  
and assembly of this component to prevent damage and/or degradation which may be induced by ESD  
ꢀ
Recommended Application Circuit Components  
Component  
R1  
Recommended Value  
Note  
2.7 ohm ±5%, 0.25W for 2.4V≤Vled≤2.7V  
ꢀ.9 ohm ±5%, 0.25W for 2.7V≤Vled≤ꢀ.0V  
5.6 ohm ±5%, 0.25W for ꢀ.0V≤Vled≤ꢀ.ꢀV  
9.1 ohm ±5%, 0.25W for ꢀ.ꢀV≤Vled≤4.2V  
R2  
4.7 ohm ±5%  
2
1
1
CX1  
100 nF, ± 20%, X7R Ceramic  
4.7mF, ± 20%, Tantalum  
CX2,CXꢀ  
Notes :  
1. CX1, CX2 must be placed within 0.7cm of ASDL-3007 to obtain optimum noise immunity  
2. To reduce noise at VCC.  
Absolute Maximum Ratings  
For implementations where case to ambient thermal resistance is ≤ 50°C/W.  
Parameter  
Symbol  
Min.  
Max.  
Units  
Notes  
Conditions  
Storage Temperature  
Operating Temperature  
LED Anode Voltage  
T
-40  
-25  
0
+100  
+85  
6.5  
6.5  
Vcc  
Vcc  
Vcc  
ꢀ2  
°C  
°C  
V
S
T
A
V
VledA < Vcc + 4V  
LEDA  
Supply Voltage  
V
V
V
V
0
V
CC  
Input Voltage : TXD  
0
V
TXD  
SD  
Input Voltage : SD/Mode  
Output Voltage : RXD  
DC LED Transmit Current  
Peak Transmit Current (RC)  
Peak Transmit Current (IrDA)  
0
V
0
V
O
I
I
I
(DC)  
mA  
A
LED  
LED  
LED  
(PK)_RC  
(PK)_IR  
1
≤ 8% duty cycle, ≤ 90 ms pulse width  
≤ 20% duty cycle, ≤ 90 ms pulse width  
1
2
0.5  
A
Notes:  
1. This peak current is specified for RC mode  
2. This peak current is specified for IrDA mode  
4
Recommended Operating Conditions  
Parameter  
Symbol  
Min.  
-25  
Typ.  
Max.  
+85  
ꢀ.6  
Units  
Conditions  
Operating Temperature  
Supply Voltage  
T
A
°C  
V
V
V
V
V
V
V
V
2.4  
V
CC  
LED Anode Voltage  
5.5  
V
VledA < Vcc + 4V  
LEDA  
IH-IR  
IL-IR  
IH-RC  
IL-RC  
IH-SD  
IL-SD  
Logic Input Voltage for TXD IR  
Logic Input Voltage for TXD RC  
Logic Input Voltage for SD  
Receiver Input Irradiance  
Logic High  
Logic Low  
Logic High  
Logic Low  
Logic High  
Logic Low  
Logic High  
Vcc-0.5  
0
Vcc  
V
0.4  
V
Vcc-0.5  
0
Vcc  
V
0.4  
V
Vcc-0.5  
0
Vcc  
V
0.4  
V
EI  
H
0.0090  
500  
mW/cm2  
For in-band signals ≤  
[ꢀ]  
115.2kbit/s  
[ꢀ]  
Logic Low  
EI  
0.ꢀ  
mW/cm2  
mA  
For in-band signals  
L
LED (Logic High) Current Pulse Amplitude (IR)  
LED (Logic High) Current Pulse Amplitude (RC)  
Receiver Data Rate  
I
I
40  
LEDA  
150  
9.6  
mA  
LEDA  
115.2  
kbit/s  
Ambient Light  
See IrDA Serial Infrared  
Physical Layer Link  
Specification, Appendix A  
for ambient levels  
Note :  
[1] An in-band optical signal is a pulse/sequence where the peak wavelength, lp, is defined as 850 ≤ lp ≤ 900 nm, and the pulse characteristics are  
compliant with the IrDA Serial Infrared Physical Layer Link Specification v1.4.  
5
Electrical and Optical Specifications  
Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted.  
Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C, Vcc set to  
3.0V unless otherwise noted.  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Units  
Conditions  
Receiver  
°
Viewing Angle  
2q  
1/2  
ꢀ0  
Peak Sensitivity Wavelength  
RxD_IrDA Output Voltage  
l
875  
nm  
V
P
Logic High  
Logic Low  
V
OH  
Vcc-0.5  
Vcc  
0.4  
4
I = -200 mA, EI ≤ 0.ꢀ mW/cm2  
OH  
V
OL  
0
1
V
[2]  
RxD_IrDA Pulse Width (SIR)  
RxD_IrDA Rise & Fall Times  
t
ms  
ns  
ms  
ms  
q ≤ 15°, C =9pF  
1/2 L  
RPW(SIR)  
t , t  
r
60  
C =9pF  
L
f
[ꢀ]  
Receiver Latency Time  
t
t
200  
200  
EI = 4.0 mW/cm2  
L
[4]  
Receiver Wake Up Time  
EI = 10 mW/cm2  
RW  
EH  
Transmitter (IrDA Mode)  
IR Radiant Intensity  
I
4
19  
mW/sr  
I =40mA, TxD_I ≥V ,  
LEDA R IH  
T = 25°C  
A
°
IR Viewing Angle  
2q  
1/2  
ꢀ0  
60  
IR Peak Wavelength  
TxD_IrDA Logic Levels  
l
885  
nm  
V
P
High  
V
Vcc-0.5  
0
Vcc  
0.5  
1
IH-IR  
IL-IR  
H-IR  
L-IR  
Low  
V
V
TxD_IrDA Input Current  
LED Current  
High  
I
I
I
0.01  
2
mA  
mA  
mA  
ms  
ms  
ms  
ns  
V
V ≥V  
I IH  
Low  
10  
10  
10  
120  
0 ≤V ≤V  
I IL  
Shutdown  
0.01  
0.2  
50  
V ≥V  
SD  
,
H-SD  
VLED  
[5]  
Wake Up Time  
t
t
t
TW  
[6]  
Maximum Optical Pulse Width  
TXD Pulse Width (SIR)  
PW(Max)  
PW(SIR)  
1.6  
t (TXD_IR)=1.6ms at 115.2 kbit/s  
PW  
TxD Rise & Fall Times (Optical)  
LED Anode On-State Voltage  
t , t  
r
600  
t (TXD_IR)=1.6ms at 115.2 kbit/s  
PW  
f
V
2.8  
70  
I =40mA,  
LEDA  
ON (LEDA)  
V
I(TxD)  
≥V  
IH  
Transmitter (Remote Control Mode)  
RC Radiant Intensity  
I
EH  
mW/sr  
I = 150mA, q ≤ 15°,  
LEDA 1/2  
TxD_RC ≥V , T = 25 °C  
IH  
A
°
RC Viewing Angle  
2q  
1/2  
ꢀ0  
60  
RC Peak Wavelength  
l
885  
nm  
V
P
TxD_RC Logic Levels  
TxD_RC Input Current  
High  
Low  
High  
Low  
V
IH  
V
IL  
Vcc-0.5  
0
VCC  
0.5  
1
V
I
I
0.01  
2
mA  
mA  
ms  
V
V ≥V  
I IH  
H
10  
0 ≤V ≤V  
I IL  
L
Maximum Optical Pulse Width [8]  
LED Anode On-State Voltage  
t
60  
PW(Max)  
V
1.9  
I =150mA, V ≥V  
LEDA I(TxD) IH  
ON (LEDA)  
6
Transceiver  
Parameters  
Symbol  
Logic High  
Vcc-0.5  
Logic Low  
0
Min.  
Typ.  
Max.  
Units  
Conditions  
Logic Input Voltage for SD  
VIH-SD  
Vcc  
V
VIL-SD  
0.4  
0.0ꢀ  
60  
V
Supply Current  
Shutdown  
ICC1  
1
mA  
mA  
mA  
Vsd ≥ 1.5V  
Idle (Standby)  
Active  
ICC2  
80  
VI(TxD) ≤VIL, EI=0  
VI(TxD) ≥VIL, EI=10mW/cm2  
ICCꢀ  
ꢀ50  
Note:  
[2] For in-band signals 9.6 kbit/s to 115.2 kbit/s where 3.6 μW/cm2 ≤ EI ≤ 500 mW/cm2.  
[3] Latency is defined as the time from the last TxD_IrDA light output pulse until the receiver has recovered full sensitivity.  
[4] Receiver Wake Up Time is measured from Vcc power ON to valid RxD_IrDA output.  
[5] Transmitter Wake Up Time is measured from Vcc power ON to valid light output in response to a TxD_IrDA pulse.  
[6] The Optical PW is defined as the maximum time which the LED will turn on. This is to prevent the long turn on time for the LED.  
SIR Mode Typical LOP vs ILED at VCC=3.6V and Temp=25C  
SIR Mode Typical ILED vs VLEDA at VCC=3.6V and Temp=25C  
22  
20  
18  
16  
14  
12  
10  
8
0.044352  
0.042336  
0.04032  
0.038304  
0.036288  
0.02  
0.025  
0.03  
0.035  
0.04  
0.045  
2
2.2  
2.4  
2.6  
2.8  
3
3.2  
ILED (A)  
VLEDA (V)  
RC Mode Typical LOP vs ILED at VCC=3.6V and Temp=25C  
RC Mode Typical ILED vs VLEDA at VCC=3.6V and Temp=25C  
140  
130  
120  
110  
100  
90  
0.35  
0.3  
0.25  
0.2  
0.15  
0.1  
80  
70  
60  
0.05  
50  
0
40  
1.2  
1.7  
2.2  
2.7  
3.2  
0.1  
0.15  
0.2  
0.25  
0.3  
ILED (A)  
VLEDA (V)  
7
Timing Diagram  
LED Optical Waveform  
TXD “Stuck ON” Protection  
RXD Output Waveform  
TXD wakeup time waveform  
Receiver wakeup time waveform  
8
Package Dimension  
Tape and Reel Dimensions  
9
Tape and Reel Dimensions (Cont.)  
10  
ASDL-3007 Moisture Proof Packaging  
All ASDL-3007 options are shipped in moisture proof package. Once opened, moisture absorption begins.  
This part is compliant to JEDEC Level 3.  
UNITS IN A SEALED  
MOISTURE-PROOF  
PACKAGE  
PACKAGE IS OPENED  
(UNSEALED)  
ENVIRONMENT  
PARTS ARE NOT  
RECOMMENDED TO  
BE USED  
NO  
LESS THAN 30 oC  
AND LESS THAN  
60% RH  
YES  
PACKAGE IS  
OPENED LESS  
THAN 168  
YES  
NO BAKING IS  
NECESSARY  
HOURS  
NO  
NO  
PACKAGE IS  
OPENED LESS  
THAN 15 DAYS  
YES  
PERFORM RECOMMENDED  
BAKING CONDITIONS  
11  
Baking Conditions Chart  
Recommended Storage Conditions  
Storage Temperature  
Baking Conditions  
If the parts are not stored per the recommended storage  
conditions they must be baked before reflow to prevent  
damage to the parts.  
10 °C to ꢀ0 °C  
Relative Humidity  
Below 60% RH  
Package  
In reels  
In bulk  
Temp  
60 °C  
Time  
Time from unsealing to soldering  
≥ 48hours  
≥ 4hours  
After removal from the bag, the parts should be soldered  
within 7 days if stored at the recommended storage con-  
ditions. When MBB (Moisture Barrier Bag) is opened and  
the parts are exposed to the recommended storage con-  
ditions more than 7 days but less than 15 days the parts  
must be baked before reflow to prevent damage to the  
parts.  
100 °C  
Note: Baking should only be done once.  
Note: To use the parts that exposed for more than 15 days is not  
recommended.  
12  
Recommended Reflow Profile  
MAX 260°C  
255  
R3  
R4  
230  
217  
200  
R2  
180  
60 sec to 90 sec  
Above 217°C  
150  
R5  
R1  
120  
80  
25  
0
100  
150  
200  
P3  
SOLDER  
REFLOW  
250  
P4  
COOL DOWN  
300  
t-TIME  
(SECONDS)  
50  
P1  
HEAT  
UP  
P2  
SOLDER PASTE DRY  
Process Zones  
Heat Up  
Symbol  
P1, R1  
DT  
Maximum DT/Dtime or Duration  
25°C to 150°C  
150°C to 200°C  
ꢀ°C/s  
Solder Paste Dry  
Solder Reflow  
P2, R2  
100s to 180s  
Pꢀ, Rꢀ  
Pꢀ, R4  
200°C to 260°C  
260°C to 200°C  
ꢀ°C/s  
-6°C/s  
Cool Down  
P4, R5  
200°C to 25°C  
> 217°C  
260°C  
-6°C/s  
60s to 90s  
-
Time maintained above liquidus point , 217°C  
Peak Temperature  
Time within 5°C of actual Peak Temperature  
Time 25°C to Peak Temperature  
-
20s to 40s  
8mins  
25°C to 260°C  
The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder  
process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change  
rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at  
the component to printed circuit board connections.  
In process zone P1, the PC board and ASDL-3007 pins are heated to a temperature of 150°C to activate the flux in the  
solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC  
board and ASDL-3007 pins.  
Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is  
raised to a level just below the liquidus point of the solder.  
Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of  
solder to 260°C (500°F) for optimum results. The dwell time above the liquidus point of solder should be between 60  
and 90 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good  
solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections  
becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly  
reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze  
solid.  
Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to  
25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and ASDL-  
3007 pins to change dimensions evenly, putting minimal stresses on the ASDL-3007.  
It is recommended to perform reflow soldering no more than twice.  
1ꢀ  
Appendix A: ASDL-3007 SMT Assembly Application Note  
Solder Pad, Mask and Metal Stencil  
Table 1  
Aperture size (mm)  
Metal Stencil  
For Solder  
Paste Printing  
Stencil  
Aperture  
Stencil thickness, t (mm)  
0.127mm  
Length, l  
1.7+/-0.05  
Width, w  
0.5+/-0.05  
Land  
Pattern  
Adjacent Land Keepout and Solder Mask Areas  
Solder  
Mask  
Adjacent land keepout is the maximum space occupied  
by the unit relative to the land pattern. There should be  
no other SMD components within this area. The minimum  
solder resist strip width required to avoid solder bridging  
adjacent pads is 0.25mm.It is recommended that two fi-  
ducially crosses be placed at mid length of the pads for  
unit alignment.  
PCBA  
Figure A1. Stencil and PCBA  
Note: Wet/Liquid Photo-imaginable solder resist/mask is recommended  
Recommended land pattern  
MOUNTING  
CENTER  
0.10  
Dimension  
mm  
0.25  
1.5  
h
l
0.75  
+
1.7  
k
j
ꢀ.0  
8.0  
FIDUCIAL  
0.425  
0.35  
0.50  
0.85  
j
Figure A2. Recommended Land Pattern  
Recommended Metal solder Stencil Aperture  
h
k
It is recommended that a 0.127 mm (0.005 inch) thick  
stencil be used for solder paste printing. This is to ensure  
adequate printed solder paste volume and no shorting.  
See the Table 1 below the drawing for combinations of  
metal stencil aperture and metal stencil thickness that  
should be used.  
l
SOLDER MASK  
Apertures As Per  
Land Dimensions  
UNITS: mm  
t
Figure A4. Adjacent Land Keepout and Solder Mask Area  
w
l
Figure A3. Solder stencil aperture  
14  
Appendix B: PCB Layout Suggestion  
The ASDL-3007 is a shieldless part and hence does not  
contain a shield trace unlike the other transceivers. The  
effects of EMI and power supply noise can potentially  
reduce the sensitivity of the receiver, resulting in reduced  
link distance. The following PCB layout guidelines should  
be followed to obtain a good PSRR and EM immunity  
resulting in good electrical performance. Things to note:  
3. CX1 is generally a ceramic capacitor of low inductance  
providing a wide frequency response while CX2 and  
CX3 are tantalum capacitor of big volume and fast  
frequency response. The use of a tantalum capacitor  
is more critical on the VLED line, which carries a high  
current.  
4. Preferably a multi-layered board should be used  
to provide sufficient ground plane. Use the layer  
underneath and near the transceiver module as Vcc,  
and sandwich that layer between ground connected  
board layers. The diagrams below demonstrate an  
example of a 4-layer board :  
1. The ground plane should be continuous under the  
part.  
2. VLED and Vcc can be connected to either unfiltered  
or unregulated power supply. If VLED and Vcc share  
the same power supply, CX3 need not be used. The  
connections for CX1 and CX2 should be connected  
before the current limiting resistor R1.  
The area underneath the module at the second layer, and  
3cm in all direction around the module is defined as the  
critical ground plane zone. The ground plane should be  
maximized in this zone. The layout below is based on a  
2-layer PCB.  
Top layer  
Connect the module ground pin to  
bottom ground layer  
Layer 2  
Critical ground plane zone. Do not connect  
directly to the module ground pin  
Layer 3  
Keep data bus away from critical ground  
plane zone  
Bottom layer (GND)  
Top Layer  
Bottom Layer  
15  
Appendix C: General Application Guide for the ASDL-3007 Infrared IrDA® Compliant 115.2kb/s Transceiver  
Selection of Resistor R1  
Description  
Resistor R1 should be selected to provide the appropri-  
ate peak pulse LED current at different ranges of Vcc as  
shown on page 4 under “Recommended Application  
circuit components”.  
The ASDL-3007, a wide-voltage operating range infrared  
transceiver, is a low-cost and ultra small form factor  
device that is designed to address the mobile computing  
market such as PDAs, as well as small embedded mobile  
products such as digital cameras and cellular phones. It  
is spectrally suited to universal remote control transmis-  
sion function. It is fully compliant to IrDA 1.4 low power  
specification from 9.6kb/s to 115.2kb/s, and support  
most remote control codes. The design of ASDL-3007 also  
includes the following unique features:  
Interface to the Recommended I/O chip  
The ASDL-3007’s TXD data input is buffered to allow  
for CMOS drive levels. No peaking circuit or capacitor  
is required. Data rate from 9.6kb/s up to 115.2kb/s is  
available at RXD pin. The TXD_RC, pin6, is used to select  
the remote control transmit mode. Alternatively, the  
TXD_IR, pin3, is used for infrared transmit selection.  
• Spectrally suited to universal remote control  
transmission function;  
Figures C1 and C2 show how ASDL-3007 fits into a mobile  
phone and PDA platform respectively.  
• Low passive component count;  
• Shutdown mode for low power consumption  
requirement;  
Speaker  
Audio Interface  
DSP Core  
Microphone  
RF Interface  
IR  
RC  
Microcontroller  
User Interface  
Figure C1. Mobile Application Platform  
LCD  
Panel  
RAM  
CPU for embedded  
application  
ROM  
Touch  
Panel  
PCMCIA  
Controller  
RS232C  
Driver  
COM  
Port  
Figure C2. PDA Platform  
16  
Remote Control Operation  
The ASDL-3007 is spectrally suited to universal remote  
control transmission function. Remote control applica-  
tions are not governed by any standards, owing to which  
there are numerous remote codes in market. Each of  
those standards results in receiver modules with different  
sensitivities, depending on the carries frequencies and  
responsively to the incident light wavelength.  
nication commonly known as Infrared Communications  
Port (ICP). The remote control commands can be sent  
through one of the available General Purpose IO pins  
(GPIO). It is not recommended to turn on both IrDA data  
transmission and Remote control transmission simulta-  
neously to prevent mixing and corruption of data. During  
IrDA data transmission, TxD_RC pin should be pull-down  
but not letting it floating. Same condition applied for  
Remote control transmission, which TxD_IR pin should  
not be left floating.  
Figure C3 illustrate a reference interfacing circuit to  
implement both IrDA and RC functionality using ASDL-  
3007. The transceiver is directly interface with the micro-  
processor provided it has support for infrared commu-  
VCC  
CX1  
GND  
CX2  
(5) V  
(8) GND  
CC  
(6) TXD_RC  
GPIO  
IR_RXD  
(4) RXD  
(2) SD  
GPIO  
(3) TXD_IR  
IR_TXD  
100Kohm  
GND  
VLED  
(7) NC  
R1  
(1) LEDA  
A SDL -3007  
100Kohm  
GND  
CX3  
GND  
Figure C3. Reference design circuit for IrDA+RC transceiver  
17  
Appendix D: Window Design for ASDL-3007  
Window Dimension  
Aperture Width  
(x, mm)  
Aperture Height  
(y, mm)  
Module  
Depth  
(z) mm  
Max  
min  
7.42  
Max  
4.99  
Min  
2.ꢀ2  
2.85  
ꢀ.ꢀ9  
ꢀ.92  
4.46  
4.99  
5.5ꢀ  
6.07  
6.60  
7.14  
To ensure IrDA compliance, some constraints on the  
height and width of the window exist. The minimum  
dimensions ensure that the IrDA cones angles are met  
without vignetting. The maximum dimensions minimize  
the effects of stray light. The minimum size corresponds  
to a cone angle of 300 and the maximum size corre-  
sponds to a cone angle of 600.  
0
1
2
ꢀ
4
5
6
7
8
9
10.09  
11.24  
12.40  
1ꢀ.55  
14.71  
15.86  
17.02  
18.17  
19.ꢀꢀ  
20.48  
7.95  
8.49  
6.14  
7.ꢀ0  
9.02  
9.56  
8.45  
9.61  
10.09  
10.6ꢀ  
11.17  
11.70  
12.24  
10.76  
11.92  
1ꢀ.07  
14.2ꢀ  
15.ꢀ8  
OPAQUE MATERIAL  
IR Transparent Window  
25  
20  
15  
10  
5
Y
IR Transparent Window  
OPAQUE MATERIAL  
X
K
Z
A
Xmax  
Xmin  
D
0
0
1
2
3
4
5
6
7
8
9
Module Depth (z) mm  
Figure D1. Window Design for ASDL-3007  
Figure D2. Aperture Height (x) vs. Module Depth (z)  
18  
16  
14  
12  
10  
8
In figure D1, X is the width of the window, Y is the height  
of the window and Z is the distance from the ASDL-3007  
to the back of the window. The distance from the center  
of the LED lens to the center of the photodiode lens, K, is  
5.1mm. The equations for computing the window dimen-  
sions are as follows:  
6
X = K + 2*(Z+D)*tanA  
Y = 2*(Z+D)*tanA  
4
Ymax  
Ymin  
2
The above equations assume that the thickness of the  
window is negligible compared to the distance of the  
module from the back of the window (Z). If they are com-  
parable, Z’ replaces Z in the above equation. Z’ is defined  
as  
0
0
1
2
3
4
5
6
7
8
9
Module Depth (z) mm  
Figure D3. Aperture Height (y) vs. Module Depth (z)  
The recommended minimum aperture width and height  
is based on the assumption that the center of the window  
and the center of the module are the same. It is recom-  
mended that the tolerance for assembly be considered  
as well. The minimum window size which will take into  
acount of the assembly tolerance is defined as:  
Z’=Z+t/n  
where ‘t’ is the thickness of the window and ‘n’ is the re-  
fractive index of the window material.  
The depth of the LED image inside the ASDL-3007, D, is  
4.32mm. ‘A’ is the required half angle for viewing. For IrDA  
compliance, the minimum is 150 and the maximum is  
300. Assuming the thickness of the window to be neg-  
ligible, the equations result in the following table and  
figures:  
X (min + assembly tolerance) = Xmin + 2*(assembly  
tolerance) (Dimensions are in mm)  
Y (min + assembly tolerance) = Ymin + 2*(assembly  
tolerance) (Dimensions are in mm)  
18  
Window Material  
Shape of the Window  
Almost any plastic material will work as a window  
material. Polycarbonate is recommended. The surface  
finish of the plastic should be smooth, without any  
texture. An IR filter dye may be used in the window to  
make it look black to the eye, but the total optical loss  
of the window should be 10% or less for best optical  
performance. Light loss should be measured at 885 nm.  
The recommended plastic materials for use as a cosmetic  
window are available from General Electric Plastics.  
From an optics standpoint, the window should be flat.  
This ensures that the window will not alter either the  
radiation pattern of the LED, or the receive pattern of the  
photodiode. If the window must be curved for mechani-  
cal or industrial design reasons, place the same curve on  
the backside of the window that has an identical radius as  
the front side. While this will not completely eliminate the  
lens effect of the front curved surface, it will significantly  
reduce the effects. The amount of change in the radiation  
pattern is dependent upon the material chosen for the  
window, the radius of the front and back curves, and the  
distance from the back surface to the transceiver. Once  
these items are known, a lens design can be made which  
will eliminate the effect of the front surface curve. The  
following drawings show the effects of a curved window  
on the radiation pattern. In all cases, the center thickness  
of the window is 1.5 mm, the window is made of polycar-  
bonate plastic, and the distance from the transceiver to  
the back surface of the window is 3 mm.  
Recommended Plastic Materials:  
Material #  
Lexan 141  
Light Transmission Haze Refractive Index  
88%  
85%  
85%  
1%  
1%  
1%  
1.586  
1.586  
1.586  
Lexan 920A  
Lexan 940A  
Note: 920A and 940A are more flame retardant than 141.  
Recommended Dye: Violet #21051 (IR transmissant above 625mm)  
Flat Window  
(First Choice)  
Curved Front and Back  
(Second Choice)  
Curved Front, Flat Back  
(Do not use)  
For product information and a complete list of distributors, please go to our web site: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.  
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.  
AV02-0454EN - June 21, 2007