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HSDL - 9100  
Surface-Mount Proximity Sensor  
Data Sheet  
Description  
Features  
The HSDL-9100 is an analog-output reflective sensor with  
an integrated high efficiency infrared emitter and photo-  
diode housed in a small form factor SMD package. The  
optical proximity sensor is housed in a specially designed  
metal-shieldtoensureexcellentopticalisolationresulting  
in low optical cross-talk.  
•
•
•
Excellent optical isolation resulting in near zero optical  
cross-talk  
Highefficiencyemitterandhighsensitivityphotodiode  
for high signal-to-noise ratio  
Low cost & lead-free miniature surface-mount  
package  
HSDL-9100 is a class of its own with its small form SMD  
packageandatadetectionrangefromnearzeroto60mm.  
Itisspecificallyoptimizedforsize,performanceandeaseof  
design in mobile constrained applications such as mobile  
phones and notebooks.  
Height – 2.70 mm  
Width – 2.75 mm  
Length – 7.10 mm  
•
•
•
Detect objects from near zero to 60mm  
Low dark current  
HSDL-9100 has extremely low dark current and high  
signal to noise ratio (SNR) where high SNR is achieved  
with a pair of highly efficient infrared emitter and highly  
sensitive detector.  
Guaranteed Temperature Performance  
-40°C to 85°C  
•
Lead-free and RoHS Compliant  
Application Support Information  
Applications  
The Application Engineering Group is available to assist  
youwiththeapplicationdesignassociatedwithHSDL-9100  
ProximitySensor.Youcancontactthemthroughyourlocal  
sales representatives for additional details.  
•
•
•
•
•
•
Mobile phones  
Notebooks  
Industrial Control  
Printers, Photocopiers and Facsimile machines  
Home Appliances  
Vending Machines  
Order Information  
Part Number  
Packaging Type  
Package  
Quantity  
HSDL-9100-001  
HSDL-9100-021  
Tape and Reel  
Tape and Reel  
PCB Substrate, moulded package  
PCB Substrate, moulded package  
500  
2500  
Block Layout  
Pins Configuration Table  
Pin Symbol Description  
Notes  
Photodiode  
LED  
1
ꢂ
LED_A  
DET_K  
1
2
3
LED_A  
LED_K  
DET_A  
DET_K  
LED Anode  
1
-
ꢀ
ꢁ
LED Cathode  
LED_K  
DET_A  
Photodiode Anode  
Photodiode Cathode  
-
4
-
TOP VIEW  
Figure 1. Block Layout of HSDL-9100  
Notes:  
Voltage to supply across the LED; VLED  
Absolute Maximum Ratings (Ta=25°C)  
Ratings  
Parameter  
Symbol  
Min.  
Max  
Units  
Emitter  
Continuous Forward Current  
I
-
100  
mA  
DC  
Coupled  
Total Power Dissipation (refer to Figure 1)  
Operating Temperature  
Storage Temperature  
P
-
165  
mW  
°C  
°C  
TOT  
T
OP  
-40  
-40  
-
+85  
+100  
260  
T
T
STG  
SOL  
Reflow Soldering Temperature  
°C  
Electrical-Optical Characteristics (Ta=25°C)  
Ratings  
Test Condition Min  
Parameter  
Symbol  
Typ  
Max  
Units  
Emitter  
Forward Voltage  
Reverse Voltage  
Peak Wavelength  
Spectrum Width of Half Value  
V
V
I = 100mA  
-
5
-
1.50  
-
940  
50  
1.65  
V
V
nm  
nm  
F
F
I = 10uA  
-
-
-
R
R
l
p
I = 20mA  
F
D
I = 20mA  
F
-
p
Detector  
Dark Current  
Forward Voltage  
Reverse Breakdown Voltage  
I
V
V
V = 10V, L**  
= 0  
I = 10mA , L=0  
F
-
2
-
-
10  
1.3  
35  
nA  
V
V
Dark  
R
0.5  
-
F
BR  
I = 100uA, L  
R
= 0  
Coupled  
Output Current  
Peak Output Distance  
Operating Cross Talk Current  
Rise Time (LED)  
Fall Time (LED)  
Rise Time (Photodiode)  
Fall Time (Photodiode)  
I
Refer to Fig 2  
Refer Note 1  
Refer to Fig 3  
-
-
-
-
-
-
-
0.1  
5
-
50  
50  
6
-
-
mA  
mm  
nA  
ns  
ns  
ms  
ms  
O
D
I
T
T
T
T
200  
O
R = 50W  
-
-
-
-
FD  
L
R = 50W  
RL  
FL  
L
R = 5.1KW  
L
R = 5.1KW  
L
6
RD  
RD  
** L = 0 (zero light condition)  
Note:  
1.  
I
= 300mA Pulse, 5% Duty Cycle (Kodak 18% Reflectance Gray Card)  
Led  
ꢀ
Output Current Test Condition (Ta=25°C)  
Dark Current Test Condition (Ta=25°C)  
LIGHT SEALED DARK BOX  
D
KODAK GRAY CARD  
1ꢃ% REFLECTION  
LED  
PHOTODIODE  
LED  
PHOTODIODE  
IF  
IO  
IF  
IDARK  
Figure 2.  
Test Condition used are D = 5mm 18% Gray Card,  
I
= 300mA Pulse, 5% Duty Cycle  
LED  
Figure 3.  
Test Condition used are I  
= 300mA Pulse, 5% Duty Cycle  
LED  
Response Time Test Condition (Ta=25°C)  
ꢄmm  
KODAK GRAY CARD  
1ꢃ% REFLECTION  
INPUT  
LED  
PHOTODIODE  
ꢅ0%  
IF  
IO  
RLED  
OUTPUT  
TR  
10%  
PULSE  
GENERATOR  
RL  
SCOPE  
TF  
Figure 4. Response Time Test Condition  
ꢁ
Typical Characteristics  
LED Forward Current Vs Temperature  
Power Dissipation Vs Temperature  
ꢀ00  
1ꢃ0  
1ꢆ0  
1ꢂ0  
1ꢀ0  
100  
ꢃ0  
100  
ꢅ0  
ꢃ0  
ꢇ0  
ꢆ0  
ꢄ0  
ꢂ0  
ꢁ0  
ꢀ0  
10  
0
ꢆ0  
ꢂ0  
ꢀ0  
0
0
10  
ꢀ0  
ꢁ0  
ꢂ0  
ꢄ0  
ꢆ0  
ꢇ0  
ꢃ0  
ꢅ0  
0
10  
ꢀ0  
ꢁ0  
ꢂ0  
ꢄ0  
ꢆ0  
ꢇ0  
ꢃ0  
ꢅ0  
Temperature (˚C)  
Temperature (˚C)  
LED Forward Current Vs Forward Voltage @ Across Temperature  
ꢀꢄ  
-ꢀꢄ  
ꢃꢄ  
(Photodiode) Forward Current Vs Forward Voltage@Across Temp  
ꢀꢄ  
-ꢀꢄ  
ꢃꢄ  
0.1ꢀ  
0.1  
1ꢀ0.0E-ꢁ  
100.0E-ꢁ  
ꢃ0.0E-ꢁ  
0.0ꢃ  
0.0ꢆ  
0.0ꢂ  
0.0ꢀ  
0
ꢆ0.0E-ꢁ  
ꢂ0.0E-ꢁ  
ꢀ0.0E-ꢁ  
0
0.ꢀ  
0.ꢂ  
0.ꢆ  
0.ꢃ  
1
1.ꢀ  
1.ꢂ  
1.ꢆ  
0
0.ꢀ  
0.ꢂ  
0.ꢆ  
0.ꢃ  
1
1.ꢀ  
1.ꢂ  
1.ꢆ  
000.0E+0  
Forward Voltage (V)  
Forward Voltage (V)  
Forward Current (A) Vs Temperature (degC) @Vcc=1V and 1.ꢁV  
(Photodiode) Rise/Fall Time Vs Load Resistance@Room Temp,  
ILED=ꢁ00mA Pulse  
0.1  
0.0ꢅ  
1.0E+ꢁ  
(Rise  
(Fall)  
0.0ꢃ  
0.0ꢇ  
0.0ꢆ  
0.0ꢄ  
0.0ꢂ  
0.0ꢁ  
0.0ꢀ  
0.01  
0
ꢅ00.0E+0  
ꢃ00.0E+0  
ꢇ00.0E+0  
ꢆ00.0E+0  
ꢄ00.0E+0  
ꢂ00.0E+0  
ꢁ00.0E+0  
ꢀ00.0E+0  
100.0E+0  
000.0E+0  
1V  
1.ꢁV  
Mean  
(Fall)  
1
10  
100  
1000  
10000  
-ꢂ0  
-ꢀ0  
0
ꢀ0  
ꢂ0  
ꢆ0  
ꢃ0  
100  
0.1  
Load Resistance (kohm)  
Temperature (˚C)  
ꢂ
(Photodiode) Dark Current Vdet = ꢁ/ꢆ/ꢅV vs Across Temperature  
Output Voltage vs Distance @ Room Temp and RL = 100K  
Ohm ILED = 100mA, ꢀ00mA and ꢁ00mA Pulse  
ꢁV  
ꢆV  
ꢅV  
1.0E-ꢆ  
ꢁ00mA  
ꢀ00mA  
100mA  
1.0E+ꢁ  
100.0E-ꢅ  
10.0E-ꢅ  
100.0E+0  
10.0E+0  
ꢅ0  
-ꢂ0  
-ꢀ0  
0
ꢀ0  
ꢂ0  
ꢆ0  
ꢃ0  
100  
1.0E-ꢅ  
ꢀ
ꢁ
ꢄ
10 ꢀ0 ꢁ0 ꢂ0 ꢄ0 ꢆ0 ꢃ0 100 1ꢀ0 ꢁ00 ꢂ00 ꢂꢄ0  
Distance (mm)  
Temperature (˚C)  
1.0E+0  
Output Voltage Vs Edge Distance @ Room Temp  
and RL=100K Ohm ILED=ꢁ00mA, D=ꢁ/ꢂ/ꢄmm  
The diagram below illustrates the explanation of edge  
distance. Edge detection is labeled as D in the diagram  
below.  
1000  
ꢁmm  
ꢂmm  
ꢄmm  
ꢅ00  
ꢃ00  
ꢇ00  
ꢆ00  
ꢄ00  
ꢂ00  
ꢁ00  
ꢀ00  
100  
0
1ꢃ% Reflection  
Gray Card  
-10  
-ꢃ  
-ꢆ  
-ꢂ  
-ꢀ  
0
ꢀ
ꢂ
ꢆ
Edge Distance (mm)  
Distance = D(mm)  
LED  
Distance = -D(mm)  
PIN  
ꢄmm  
ꢄ
HSDL-9100 Package Outline  
Mounting Centre  
1.ꢄ1  
ꢁ.ꢃꢃ  
ꢁ.ꢄꢄ  
Rx  
1.ꢁ  
Tx  
UNIT: mm  
Tolerance: 0.ꢀmm  
0.1  
ꢆ.ꢅ  
ꢆ.ꢇ  
ꢀ.ꢁꢄ  
ꢀ.ꢁꢄ  
ꢇ.1  
LED Cathode  
Photodiode Anode  
LED Anode  
Photodiode Cathode  
0.ꢂ  
Figure 5. Package outline dimensions  
ꢆ
HSDL-9100-021 Tape and Reel Dimensions  
1.ꢁ  
1.ꢁꢁ 0.0ꢁ  
2 0.1  
0.3ꢁ  
4 0.1  
B
ꢀ 0.1  
A
A
B
2.7ꢀ 0.07  
2.9ꢁ 0.1  
PROGRESSIVE DIRECTION  
UNIT: MM  
EMPTY  
PARTS MOUNTED  
LEADER  
(400 mm MIN.)  
(40 mm MIN.)  
EMPTY  
(40 mm MIN.)  
OPTION #  
"B" "C"  
17ꢀ 60  
330 ꢀ0  
QUANTITY  
ꢁ00  
001  
021  
2ꢁ00  
UNIT: mm  
DETAIL A  
2.0 0.ꢁ  
B
C
� 13.0 � 0.ꢁ  
�
R 1.0  
LABEL  
21 � 0.ꢀ  
�
DETAIL A  
+ 2  
0
16.4  
2.0 � 0.ꢁ  
�
Figure 6. Tape and Reel Dimensions  
ꢇ
HSDL-9100 Moisture Proof Packaging  
Baking Conditions Chart  
AllHSDL-9100optionsareshippedinmoistureproofpack-  
age. Once opened, moisture absorption begins.  
Units in A Sealed  
Moisture-Proof  
Package  
This part is compliant to JEDEC Level 4.  
Baking Conditions  
Package Is  
Opened (Unsealed)  
If the parts are not stored in dry conditions, they must be  
baked before reflow to prevent damage to the parts.  
PACKAGE  
Environment  
less than ꢀꢄ deg C,  
and less than  
ꢆ0% RH  
Temp  
Time  
In reels  
In bulk  
ꢆ0 °C  
100 °C  
1ꢀꢄ °C  
1ꢄ0 °C  
≥ ꢂꢃhours  
≥ ꢂhours  
≥ ꢀ hours  
≥ 1 hour  
Yes  
Package Is  
Opened less  
Than ꢇꢀ hours  
Yes  
No Baking  
Is Necessary  
No  
No  
Baking should only be done once.  
Perform Recommended  
Baking Conditions  
Recommended Storage Conditions  
STORAGE  
Figure 7. Baking conditions chart  
10°C to 30°C  
TEMPERATURE  
Relative Humidity  
below 60% RH  
Time from unsealing to soldering  
After removal from the bag, the parts should be soldered  
within three days if stored at the recommended storage  
conditions.  
ꢃ
Recommended Reflow Profile  
Process zone P3 is the solder reflow zone. In zone P3, the  
temperature is quickly raised above the liquidus point of  
solderto255°C(491°F)foroptimumresults.Thedwelltime  
above the liquidus point of solder should be between 20  
and 60 seconds. It usually takes about 20 seconds to as-  
surepropercoalescingofthesolderballsintoliquidsolder  
and the formation of good solder connections. Beyond a  
dwell time of 60 seconds, the intermetallic growth within  
the solder connections becomes excessive, resulting in  
the formation of weak and unreliable connections. The  
temperature is then rapidly reduced to a point below the  
solidustemperatureofthesolder,usually200°C(392°F),to  
allow the solder within the connections to freeze solid.  
The reflow profile is a straight-line representation of a  
nominal temperature profile for a convective reflow sol-  
der process. The temperature profile is divided into four  
process zones, each with different DT/Dtime temperature  
changerates.TheDT/Dtimeratesaredetailedintheabove  
table. The temperatures are measured at the component  
to printed circuit board connections.  
In process zone P1, the PC board and HSDL-9100 castella-  
tion pins are heated to a temperature of 160°C to activate  
the flux in the solder paste.The temperature ramp up rate,  
R1, is limited to 4°C per second to allow for even heating  
of both the PC board and HSDL-9100 castellations.  
Process zone P2 should be of sufficient time duration (60  
to 120 seconds) to dry the solder paste.The temperature is  
raised to a level just below the liquidus point of the solder,  
usually 200°C (392°F).  
Process zone P4 is the cool down after solder freeze. The  
cooldownrate, R5, fromtheliquiduspointofthesolderto  
25°C (77°F) should not exceed 6°C per second maximum.  
ThislimitationisnecessarytoallowthePCboardandHSDL-  
9100 castellations to change dimensions evenly, putting  
minimal stresses on the HSDL-9100 transceiver.  
MAX ꢀꢆ0C  
ꢀꢄꢄ  
ꢀꢁ0  
Rꢁ  
Rꢂ  
ꢀꢀ0  
ꢀ00  
Rꢀ  
ꢆ0 sec  
MAX  
Above ꢀꢀ0 C  
1ꢃ0  
1ꢆ0  
Rꢄ  
R1  
1ꢀ0  
ꢃ0  
ꢀꢄ  
0
100  
Pꢀ  
SOLDER PASTE DRY  
1ꢄ0  
ꢀ00  
ꢀꢄ0  
Pꢂ  
COOL DOWN  
ꢁ00  
ꢄ0  
P1  
HEAT  
UP  
Pꢁ  
SOLDER  
REFLOW  
t-TIME  
(SECONDS)  
Figure 8. Reflow graph  
P
R
O
C
E
S
S
 Z
O
N
E
Symbol  
D
T
Maximum  
D
T/time  
D
Heat Up  
P1, R1  
P2, R2  
25°C to 160°C  
160°C to 200°C  
4°C/s  
Solder Paste Dry  
0.5°C/s  
200°C to 255°C (260°C at 10 seconds max)  
255°C to 200°C  
4°C/s  
-6°C/s  
Solder Reflow  
Cool Down  
P3, R3P3, R4  
P4, R5  
200°C to 25°C  
-6°C/s  
ꢅ
Recommended land pattern  
Appendix A:  
Component  
placement  
HSDL-9100 SMT Assembly Application Note  
0.ꢂ  
FIDUCIAL  
1.ꢇ  
FIDUCIAL  
Recommended Metal solder Stencil Aperture  
It is recommended that only a 0.152 mm (0.006 inch) or a  
0.127mm(0.005inch)thickstencilbeusedforsolderpaste  
printing. This is to ensure adequate printed solder paste  
volumeandnoshorting.SeeTable1belowthedrawingfor  
combinations of metal stencil aperture and metal stencil  
thicknessthatshouldbeused.Apertureopeningforshield  
pad is 3.05 mm x 1.1 mm as per land pattern.  
0.ꢆ  
1.ꢆ  
Mounting Center  
ꢁ.ꢆꢄ  
ꢂ.ꢇꢄ  
Figure 10. Recommended land pattern  
Table 1. Combinations of metal stencil aperture and  
metal stencil thickness  
t
Apertures as per  
Land Dimensions  
S
t
 n
 c
  i
t
  i
 k
 n
 e
 s
,
Aperture size (mm)  
t
(mm)  
Length,  
l
Width,  
w
l
0.1ꢄꢀ  
0.1ꢀꢇ  
1.ꢆ0+/-0.0ꢄ  
1.ꢅꢀ  
0.ꢄꢄ+/-0.0ꢄ  
0.ꢄꢄ+/-0.0ꢄ  
w
Figure 11. Solder stencil aperture  
Dim.  
mm  
ꢂ.1ꢄ  
11  
Adjacent Land Keep out and Solder Mask Areas  
h
l
Adjacent land keep out is the maximum space occupied  
by the unit relative to the land pattern. There should be  
no other SMD components within this area.The minimum  
solder resist strip width required to avoid solder bridg-  
ing adjacent pads is 0.2mm.It is recommended that two  
fiducial crosses be placed at mid length of the pads for  
unit alignment. Also do take note that there should not  
be any electrical routing with the component placement  
compartment.  
k
j
ꢄ.ꢄ  
ꢁ.ꢄ  
k
Component placement  
j
Note:  
Wet/Liquid Photo-imaginable solder resist/mask is recommended  
h
Solder Pad, Mask and Metal Stencil  
Metal stencil for  
solder paste printing  
Mounting Center  
Solder Mask  
Stencil Aperture  
l
Figure 12. Keep-out area  
Land Pattern  
Solder Mask  
PCBA  
Figure 9. Stencil and PCBA  
10  
Appendix B: General Application Guide for the HSDL-9100  
Description  
Interface to the Recommended I/O chip  
The Proximity sensor has several possible applications for The HSDL-9100 is general interface with the GPIO pin of  
multimedia product, Automation, and Personal handled. thecontrollerchipset. TheLED_A,pin1isconnectedtothe  
The proximity sensor is basically made up of the emitter PWM port alternatively the external timer circuitry can be  
(infrared LED) and detector (photodiode). The block dia- used to drive the LED. The DET_K, pin 4 is interface to the  
gram of the sensor is shown in Figure 13. The emitter will signal conditioning before driving the GPIO port.  
emit IR light pulse. This light travels out in the field of view  
Figure 14 shows the hardware reference design with  
and will either hit an object or continue. No light will be  
HSDL-9100.  
reflected when no object is detected. On the other hand,  
the detector will detect the reflected IR light when it hits  
the object.  
Photodiode  
ꢁ
ꢀ
ꢂ
1
Photodiode  
anode  
Photodiode  
cathode  
LED  
LED  
anode  
cathode  
LED  
Figure 13. Proximity sensor block diagram  
(refer to Pins Configuration Table)  
Key Pad  
STN/TFT LCD Panel  
LCD Control  
A/D  
Peripherial  
interface  
IR Transceiver  
Touch Panel  
IrDA  
interface  
Mobile Application  
chipset  
ACꢅꢇ  
sound  
PCM Sound  
Audio Input  
Memory I/F  
Memory Expansion  
Logic Bus Driver  
IꢀS  
Baseband  
controller  
GPIO  
PWM  
Power Management  
Antenna  
ROM  
FLASH  
SDRAM  
*IR LED driver  
Signal Conditional  
HSDL-ꢅ100  
*
The LED can be driven by the PWM output or the external timer circuitry.  
Figure 14. Mobile Application Platform  
11  
Interfacing circuitry with signal conditional circuitry  
Thenextsectiondiscussesinterfacingconfigurationwith  
general processor including the recommended signal  
conditional circuitry.  
VCC  
HSDL-ꢅ100  
LEDA  
LEDK  
DETK  
DETA  
The DET_K pin of HSDL-9100 is connected to the filter  
circuit then to the comparator before interfacing with  
the GPIO pin. The filter circuit is implement to provide  
the ambient light filter. The PWM is pulse to drive the  
LED_K pin alternative the external timer 555 can also be  
replaced. The detector distance can be varies with the  
increase/decrease of the LED current supply.  
VCC  
ꢀꢀ0 Ohm  
PWM  
VCC  
ꢁꢆK Ohm  
BCꢃꢂꢃ  
ꢀꢀK Ohm  
ꢀꢀ0 pf  
BCꢃꢂꢆB  
1M Ohm  
10 Ohm  
ꢀꢂK Ohm  
GND  
GND  
VCC  
GND  
ꢂꢇk Ohm  
GPIO  
ꢁ00 Ohm  
controller chipset  
GND  
Signal conditioning circuitry  
Figure 15. HSDL9100 configuration with controller chipset  
For product information and a complete list of distributors, please go to our web site: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.  
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.  
5989-3179EN - March 29, 2006