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Document Number: MC34844  
Rev. 5.0, 5/2009  
Freescale Semiconductor  
Advance Information  
10 Channel LED Backlight Driver  
with Integrated Power Supply  
34844  
The 34844 is a high efficiency, LED driver for use in backlighting  
LCD displays from 10" to 20"+. Operating from supplies of 7.0 to 28 V,  
the MC34844 is capable of driving up to 160 LEDs in 10 parallel  
strings. Current in the 10 strings is matched to within 2%, and can be  
programmed via the I2C/SM Bus interface.  
LED DRIVER  
The 34844 also includes a Pulse Width Monitor (PWM) generator  
for LED dimming. The LEDs can be dimmed to one of 256 levels,  
programmed through the I2C/SM Bus interface. Up to 65,000:1 (256:1  
PWM, 256:1 Current DAC) dimming ratio.  
The integrated boost converter generates the minimum output  
voltage required to keep all LEDs illuminated with the selected current,  
providing the highest efficiency possible. The integrated boost self-  
clocks at a default frequency of 600 kHz, but may be programmed via  
I2C to 150/300/600/1200 kHz. The PWM frequency can be set from  
100 Hz to 25 kHz, or can be synchronized to an external input. If not  
synchronized to another source, the internal PWM rate outputs on the  
CK pin. This enables multiple devices to be synchronized together.  
EP SUFFIX (PB-FREE)  
98ASA10800D  
32-PIN QFN-EP  
The 34844 also supports optical/temperature closed loop operation  
and also features LED over-temperature protection, LED short  
protection, and LED open circuit protection. The IC also includes over-  
voltage protection, over-current protection, and under-voltage lockout.  
ORDERING INFORMATION  
Temperature  
Package  
Features  
Device  
Range (T )  
A
• Input voltage of 7.0 to 28 V  
MC34844EP/R2  
-40°C to 105°C  
32 QFN-EP  
• Boost output voltage up to 60 V, with Dynamic  
Headroom Control (DHC)  
• 3.0 A integrated boost FET  
Applications  
• Up to 50 mA LED current per channel  
• 90% efficiency (DC:DC)  
• 10 channel current mirror with ±2% current matching  
• I2C/SM Bus interface  
• Monitors - up to 27 inch  
• Personal Computer Notebooks  
• GPS Screens  
• Small screen Televisions  
• PWM frequency programmable or synchronizable from  
100 to 25,000Hz  
• 32-Ld 5x5x1.0 mm TQFN Package  
• Pb-free packaging designated by suffix code EP  
34844  
7.0 to 28V  
VIN  
SWA  
SWB  
VDC1  
VDC2  
VDC3  
VOUT  
PGNDA  
PGNDB  
COMP  
VCC  
SLOPE  
FAIL  
SCK  
SDA  
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
Control Unit  
VDC1  
VDC1  
I0  
I1  
I2  
I3  
I4  
I5  
I6  
I7  
I8  
I9  
PWM  
A0/SEN  
CK  
M/~S  
EN  
ISET  
VDC1  
PIN  
NIN  
GND  
Figure 1. Simplified Application Diagram (SM Bus Mode)  
* This document contains certain information on a new product.  
Specifications and information herein are subject to change without notice.  
© Freescale Semiconductor, Inc., 2009. All rights reserved.  
INTERNAL BLOCK DIAGRAM  
INTERNAL BLOCK DIAGRAM  
SWA  
SWB  
VIN  
VDC1  
VDC2  
VDC3  
LDO  
A0/SEN  
OVP  
PGNDA  
PGNDB  
COMP  
BOOST  
CONTROLLER  
SLOPE  
VOUT  
CK  
V SENSE  
FAIL  
CLOCK/PLL  
EN  
M/~S  
I0  
I1  
I2  
I3  
I4  
I5  
I6  
I7  
I8  
I9  
PWM  
PWM GENERATOR  
SCK  
SDA  
10 CHANNEL  
50mA CURRENT  
MIRROR  
I2C INTERFACE  
CURRENT DAC  
ISET  
PIN  
NIN  
TEMP/OPTO  
LOOP CONTROL  
GND  
OCP/OTP/UVLO  
Figure 2. 34844 Simplified Internal Block Diagram  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
2
PIN CONNECTIONS  
PIN CONNECTIONS  
32  
31  
30  
29  
28  
27  
26  
25  
1
2
3
4
5
6
7
8
24  
23  
22  
21  
20  
19  
18  
17  
VIN  
PGNDB  
SWB  
CK  
VDC3  
SLOPE  
NIN  
TRANSPARENT  
TOP VIEW  
SWA  
QFN - EP  
5MM X 5MM  
32 LEAD  
PGNDA  
A0/SEN  
EN  
PIN  
EP GND  
ISET  
FAIL  
I9  
IO  
9
10  
I2  
11  
I3  
12  
I4  
13  
I5  
14  
I6  
15  
I7  
16  
I8  
EP = Exposed Pad  
I1  
Figure 3. 34844 Pin Connections  
Table 1. 34844 Pin Definitions  
A functional description of each pin can be found in the Functional Pin Description section beginning on page 11.  
Pin Number Pin Name Pin Function  
Formal Name  
Input voltage  
Power Ground  
Switch node B  
Switch node A  
Power Ground  
Device Select  
Enable  
Definition  
1
VIN  
Input supply  
Power  
Power  
Input  
2
Power ground  
PGNDB  
SWB  
3
Boost switch connection B  
Boost switch connection A  
Power ground  
4
5
SWA  
Input  
PGNDA  
A0/SEN  
EN  
Power  
Input  
6
Address select, device select pin or OVP HW control  
Enable pin (active high, internal pull-up)  
LED string connections  
7
Input  
8 - 17  
18  
LED Channel  
Fault detection  
I0-I9  
FAIL  
Input  
Fault detected pin (open drain):  
No Failure = Low-impedance  
Failure = High-impedance  
Open Drain  
19  
20  
21  
22  
23  
24  
ISET  
PIN  
Current set  
LED current setting resistor  
Passive  
Input  
Positive current scale Positive input analog current control  
Negative current scale Negative input analog current control  
NIN  
Input  
SLOPE  
VDC3  
CK  
Boost Slope  
Internal Regulator 3  
Clock signal  
Boost slope compensation Setting resistor  
Passive  
Output  
Decoupling capacitor for internal phase locked loop power  
Clock synchronization pin (input for M/~S = low - internal pull-up, output  
for M/~S = high)  
Input/Output  
25  
PWM  
External PWM  
External PWM input (internal pull-down)  
Input  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
3
PIN CONNECTIONS  
Table 1. 34844 Pin Definitions (continued)  
A functional description of each pin can be found in the Functional Pin Description section beginning on page 11.  
Pin Number Pin Name Pin Function  
Formal Name  
Definition  
I2C data  
I2C data Line  
I2C clock line  
26  
27  
28  
29  
30  
31  
32  
EP  
SDA  
SCK  
Bidirectional  
Bidirectional  
Output  
Passive  
Input  
I2C clock  
VDC1  
COMP  
M/~S  
Internal Regulator 1  
Decoupling capacitor for internal logic rail  
Boost converter Type compensation pin  
Compensation pin  
Master/Slave selector Selects Master mode (1) or Slave mode (0)  
Internal Regulator 2  
Voltage Output  
Ground  
Decoupling capacitor for internal regulator  
Boost Output voltage sense pin  
VDC2  
VOUT  
GND  
Output  
Input  
Ground Reference for all internal circuits other than Boost FET  
-
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
4
MAXIMUM RATINGS  
MAXIMUM RATINGS  
Table 2. Maximum Ratings  
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or  
permanent damage to the device.  
Ratings  
Symbol  
Value  
Unit  
ELECTRICAL RATINGS  
Maximum Pin Voltages  
A0/SEN  
VMAX  
V
7.0  
45  
I0, I1, I2, I3, I4, I5, I6, I7, I8, I9,EN(4)  
VIN  
30  
65  
SWA, SWB, VOUT  
FAIL, PIN, NIN, ISET, M/~S, CK, PWM  
6.0  
Maximum LED Current  
IMAX  
55  
mA  
V
ESD Voltage(1)  
VESD  
Human Body Model (HBM)  
Machine Model (MM)  
+2000  
+200  
THERMAL RATINGS  
Ambient Temperature Range  
T
A
-40 to 105  
32  
°C  
°C/W  
°C/W  
°C  
Junction to Ambient Temperature(2)  
Junction to Case Temperature(2)  
Maximum junction temperature  
Storage temperature range  
T
JA  
θ
T
3.5  
JC  
θ
T
J
150  
TSTO  
-40 to 150  
260  
°C  
Peak Package Reflow Temperature During Reflow(3)  
TPPRT  
°C  
Power Dissipation  
TA = 25°C  
W
3.9  
2.5  
2.0  
1.4  
TA = 70°C  
TA = 85°C  
TA = 105°C  
Notes  
1. ESD testing is performed in accordance with the Human Body Model (HBM) (AEC-Q100-2), and the Machine Model (MM) (AEC-Q100-  
003), RZAP = 0 Ω  
2. Per JEDEC51 Standard for Multilayer PCB  
3. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may  
cause malfunction or permanent damage to the device.  
4. 45 V is the Maximum allowable voltage on all LED channels in off-state.  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
5
ELECTRICAL CHARACTERISTICS  
ELECTRICAL CHARACTERISTICS  
Table 3. Electrical Characteristics  
Characteristics noted under conditions VIN = 12 V, VOUT = 42 V, ILED = 50 mA, PWM = VDC1, M/~S = VDC1,  
PIN & NIN = VDC1, -40°C TA 105°C, PGND = 0 V, unless otherwise noted.  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
SUPPLY  
Supply Voltage  
VIN  
7.0  
12  
28  
V
Supply Current when Shutdown Mode  
ISHUTDOWN  
Manual & SM Bus: EN = Low, SCK & SDA=Low  
-
-
2.0  
17  
-
-
μA  
I2C: EN = Low, SETI2C bit = 1, CLRI2C bit = 0  
Supply Current when Sleep Mode  
ISLEEP  
-
3.0  
-
mA  
SM-Bus: EN = low, SCK & SDA= Active, SETI2C bit = 0, EN bit = 0  
I2C: EN = High, SETI2C bit = 1, CLRI2C bit = 0, EN bit = 0  
Supply Current when Operational Mode  
IOPERATIONAL  
-
10.0  
-
mA  
Manual: EN= High, SCK & SDA=Low, PWM=Low  
SM-Bus: EN= Low, SCK & SDA=Active, EN bit= 1, PWM=Low  
I2C: EN = High, SETI2C bit = 1, CLRI2C bit = 0, EN bit = 1, PWM=Low  
Under-voltage Lockout  
VIN Rising  
UVLO  
UVLOHYST  
VDC1  
5.4  
150  
2.4  
6.0  
200  
2.5  
6.4  
250  
2.6  
V
mV  
V
Under-voltage Hysteresis  
VIN Falling  
VDC1 Voltage(5)  
CVDC1 = 2.2 μF  
VDC2 Voltage(5)  
VDC2  
5.5  
2.4  
6.0  
2.5  
6.5  
2.6  
V
V
CVDC2 = 2.2 μF  
VDC3 Voltage(5)  
VDC3  
CVDC3 = 2.2 μF  
BOOST  
Output Voltage Range(6)  
VIN = 7.0 V  
VOUT1  
VOUT2  
8.0  
31  
-
-
43  
60  
V
VIN = 28 V  
Boost Switch Current Limit  
IFET  
2.6  
-
2.8  
3.0  
A
RDSON of Internal FET  
IDRAIN= 1.0 A  
RDSON  
250  
500  
mΩ  
Boost Switch Off-state Leakage Current  
VSWA,SWB = 65 V  
IBOOST_LEAK  
-
-
-
10  
-
μA  
Peak Boost Efficiency(7)  
EFFBOOST  
90  
%
Notes  
5. This output is for internal use only and not to be used for other purposes  
6. Minimum and Maximum output voltages are dependent on Min/Max duty cycle condition.  
7. Guaranteed by design  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
6
ELECTRICAL CHARACTERISTICS  
Table 3. Electrical Characteristics (continued)  
Characteristics noted under conditions VIN = 12 V, VOUT = 42 V, ILED = 50 mA, PWM = VDC1, M/~S = VDC1,  
PIN & NIN = VDC1, -40°C TA 105°C, PGND = 0 V, unless otherwise noted.  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Line Regulation (8)  
VIN=7.0 to 28 V  
IOUT/VIN  
-0.2  
-
0.2  
%/V  
Load Regulation (8)  
IOUT/VLED  
-0.2  
-
-
0.2  
-
%/V  
VLED = 8.0 to 65 V (all Channels)  
Slope compensation voltage ramp  
VSLOPE  
0.49  
V/μs  
RSLOPE = 68 kΩ  
Current Sense Amplifier Gain  
Current Sense Resistor  
ACSA  
RSENSE  
GM  
-
9.0  
22  
-
-
-
mΩ  
μS  
μA  
V
OTA Transconductance  
-
-
200  
100  
0.5  
-
-
Transconductance Sink and Source Current Capability  
Output Voltage Precharge  
FAIL PIN  
ISS  
VHOLD  
0.45  
0.55  
Off-state Leakage Current  
VFAIL = 5.5 V  
IFAIL_LEAK  
-
-
-
-
5
μA  
On-state Voltage Drop  
ISINK = 4.0 mA  
VOL  
0.4  
V
LED CHANNELS  
Sink Current  
ISINK  
49  
50  
51  
mA  
mV  
ICHx Register = 255, RISET=5.1 kΩ 0.1%, PIN&NIN = Disabled,  
TA=25°C  
Regulated minimum voltage across drivers  
VMIN  
675  
750  
825  
Pulse Width > 4.0 μs  
Current Matching Accuracy  
IMATCH  
VSET  
-2.0  
-
2.0  
%
V
ISET Pin Voltage  
2.017  
2.048  
2.079  
RISET=5.1 kΩ 0.1%  
LED Current Amplitude Resolution  
1.0 mA < ILED < 50 mA  
ILEDRES  
-
-
1.5  
-
-
%
Off-state Leakage Current, All channels  
(VCH = 45 V)  
ICH_LEAK  
10  
μA  
PIN INPUT  
Voltage to Disable PIN mode  
VPIN_DIS  
IPIN  
2.2  
-
-
-
V
PIN Bias Current  
PIN = VSET  
-2.0  
2.0  
μA  
Analog Dimming Current  
ICHx Register = 255, RISET=5.1 kΩ 0.1%  
PIN = VSET/2  
IDIM_PIN  
23.75  
47.50  
25  
50  
26.25  
52.50  
mA  
PIN = VSET  
Notes  
8. Guaranteed by design  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
7
ELECTRICAL CHARACTERISTICS  
Table 3. Electrical Characteristics (continued)  
Characteristics noted under conditions VIN = 12 V, VOUT = 42 V, ILED = 50 mA, PWM = VDC1, M/~S = VDC1,  
PIN & NIN = VDC1, -40°C TA 105°C, PGND = 0 V, unless otherwise noted.  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
NIN INPUT  
Voltage to Disable NIN mode  
VNIN_DIS  
ININ  
2.2  
-
-
-
V
NIN Bias Current  
NIN = VSET  
-2.0  
2.0  
μA  
Analog Dimming Current  
ICHx Register = 255, RISET=5.1 kΩ 0.1%  
NIN = VSET/2  
IDIM_NIN  
23.75  
47.50  
25  
50  
26.25  
52.50  
mA  
°C  
NIN = 0 V  
OVER-TEMPERATURE PROTECTION  
Over-temperature Threshold(9)  
OTT  
Rising  
150  
-
165  
25  
175  
-
Hysteresis  
I2C/SM BUS PHYSICAL LAYER [SCK, SDA]  
I2C Address  
ADRI2C  
ADRSMB  
VILI  
-
-
1110110  
-
-
Binary  
SM-Bus Address  
1110110  
Binary  
Input Low Voltage  
-0.3  
2.1  
0.3  
-
-
-
-
-
0.8  
5.5  
-
V
V
V
V
Input High Voltage  
VIHI  
Input Hysteresis  
VHYSI  
VOLI  
Output Low Voltage  
0.4  
Sink Current < 4.0 mA  
Input Current  
IINI  
-5.0  
-
-
-
5.0  
10  
μA  
ρF  
Input Capacitance(9)  
CINI  
LOGIC INPUTS / OUTPUTS (CK, M/~S, PWM, A0/SEN)  
Input Low Voltage  
VILL  
VIHL  
VHYSL  
IIIL  
-0.3  
1.5  
-
-
0.5  
5.5  
-
V
V
Input High Voltage  
-
0.1  
-
Input Hysteresis  
V
Input Current  
-5.0  
-
5.0  
0.2  
μA  
V
Output Low Voltage (CK)  
ISINK < 2.0 mA  
VOLL  
-
Output High Voltage (CK)  
ISOURCE < 2.0 mA  
VOHL  
2.2  
-
-
-
5.5  
5.0  
V
Input Capacitance(9)  
CINI  
ρF  
Notes  
9. Guaranteed by design  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
8
ELECTRICAL CHARACTERISTICS  
Table 3. Electrical Characteristics (continued)  
Characteristics noted under conditions VIN = 12 V, VOUT = 42 V, ILED = 50 mA, PWM = VDC1, M/~S = VDC1,  
PIN & NIN = VDC1, -40°C TA 105°C, PGND = 0 V, unless otherwise noted.  
Characteristic  
OVER-VOLTAGE PROTECTION  
Symbol  
Min  
Typ  
Max  
Unit  
Over-voltage Clamp - OVP Register Table:  
OVP = Fh  
OVP = Eh  
OVP = Dh  
OVP = Ch  
OVP = Bh  
OVP = Ah  
OVP = 9h  
OVP = 8h  
OVP = 7h  
OVP = 6h  
OVP = 5h  
OVP = 4h  
OVP = 3h  
OVP = 2h  
OVPFH  
OVPEH  
OVPDH  
OVPCH  
OVPBH  
OVPAH  
OVP9H  
OVP8H  
OVP7H  
OVP6H  
OVP5H  
OVP4H  
OVP3H  
OVP2H  
OVPHW  
60.5  
56.5  
53  
62.5  
58  
54  
51  
47  
43  
39  
36  
32  
28  
24  
20  
16  
12  
6.5  
64.5  
60  
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
56  
49  
52.5  
48.5  
44.5  
40.5  
37.5  
33.5  
30  
45  
41  
38  
34  
30.5  
26  
23  
25  
19  
21  
15  
17  
11  
13  
Over-voltage threshold,  
6.15  
6.85  
Set by Hardware, Voltage at A0/SEN  
A0/SEN Sink Current  
I
-
100  
-
μA  
SINK_OVP  
BOOST  
Switching Frequency (BST [1:0]=0)  
Switching Frequency (BST [1:0]=1)  
Switching Frequency (BST [1:0]=2)  
Switching Frequency (BST [1:0]=3)  
Minimum Duty Cycle  
fSW0  
fSW1  
fSW2  
fSW3  
DMIN  
DMAX  
tSS  
0.14  
0.15  
0.30  
0.60  
1.2  
10  
0.17  
MHz  
MHz  
MHz  
MHz  
%
0.27  
0.33  
0.54  
0.66  
1.08  
1.32  
-
80  
-
15  
-
Maximum Duty Cycle  
85  
%
Soft Start Period  
6.5  
15  
-
ms  
Boost Switch Rise Time(9)  
Boost Switch Fall Time(9)  
tTR  
-
-
ns  
tF  
-
25  
-
ns  
Notes  
10. Guaranteed by design  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
9
ELECTRICAL CHARACTERISTICS  
Table 3. Electrical Characteristics (continued)  
Characteristics noted under conditions VIN = 12 V, VOUT = 42 V, ILED = 50 mA, PWM = VDC1, M/~S = VDC1,  
PIN & NIN = VDC1, -40°C TA 105°C, PGND = 0 V, unless otherwise noted.  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
PWM GENERATOR  
PWM Frequency Range (12)  
M/~S = Low (Slave Mode)  
fPWMS  
fPWMM  
100  
-
25000  
Hz  
PWM Frequency  
M/~S = High (Master Mode)  
FPWM Register = 768  
22500  
90  
25000  
100  
27500  
110  
Hz  
%
FPWM Register = 192,000  
PWM dimming resolution  
tfPWM  
-
0.39  
-
PWM PIN (DIRECT PWM CONTROL)  
Input PWM Pin Minimum Pulse(12)  
Input PWM Frequency Range  
PHASE LOCK LOOP  
tPWM_IN  
fPWM  
150  
100  
-
-
-
ns  
23000  
Hz  
CK Slave Mode Frequency Lock Range(11)  
M/~S = Low (Slave Mode)  
fCKS  
fCKS_JITTER  
TS_ACQ  
100  
-
-
-
25000  
0.1  
Hz  
%
CK Slave Mode Input Jitter(12)  
M/~S = Low (Slave Mode)  
Slave Mode Acquisition Time  
M/~S = Low (Slave Mode)  
FPWMS=25 kHz  
-
-
-
50  
-
ms  
ms  
FPWMS=100 Hz  
2000  
CK Frequency (Master Mode)  
FPWM Register = 768  
fCKMASTER  
22500  
90  
25000  
100  
27500  
110  
Hz  
FPWM Register = 192,000  
I2C/SM BUS PHYSICAL LAYER [SCK, SDA]  
Interface Frequency Range  
fSCK  
tRST  
tF  
400  
100  
160  
kHz  
ms  
ns  
SM Bus Power-on-Reset Time  
-
-
-
Output fall time  
40  
10 ρF < CL < 400 ρF  
Output rise time  
tR  
20  
-
-
-
80  
25  
50  
ns  
ns  
ns  
10 ρF<CL<400 ρF  
LOGIC OUTPUT (CK)  
Output Rise and Fall time(11)  
tR/tF  
CL<100 ρF  
LED CHANNELS  
Channels Rise and Fall Time(12)  
Notes  
tR/tF  
-
23  
11. Special considerations should be made for frequencies between 100 Hz to 1.0 KHz. Please refer to Functional Device Operation for  
further details.  
12. Guaranteed by design  
34844  
Analog Integrated Circuit Device Data  
10  
Freescale Semiconductor  
FUNCTIONAL DESCRIPTION  
INTRODUCTION  
FUNCTIONAL DESCRIPTION  
INTRODUCTION  
LED backlighting has become very popular for small and  
medium LCDs, due to some advantages over other  
backlighting schemes, such as the widely used cold cathode  
fluorescent lamp (CCFL). The advantages of LED  
backlighting are low cost, long life, immunity to vibration, low  
operational voltage, and precise control over its intensity.  
the LCD surface. Each row or column is formed by a number  
of LEDs in series, forcing a single current to flow through all  
LEDs in each string.  
Using a current control driver, per row or column, helps the  
system to maintain a constant current flowing through each  
line, keeping a steady amount of light even with the presence  
of line or load variations. They can also be use as a light  
intensity control by increasing or decreasing the amount of  
current flowing through each LED string.  
However, there is an important drawback of this method. It  
requires more power than most of the other methods, and this  
is a major problem if the LCD size is large enough.  
To address the power consumption problem, solid state  
optoelectronics technologies are evolving to create brighter  
LEDs with lower power consumption. These new  
technologies together with highly efficient power  
To achieve enough voltage to drive a number of LEDs in  
series, a boost converter is implemented, to produce a higher  
voltage from a smaller one, which is typically used by the  
logical blocks to do their function.  
management LED drivers are turning LEDs, a more suitable  
solution for backlighting almost any size of LCD panel, with  
really conservative power consumption.  
The 34844 implements a single channel boost converter  
together with 10 input channels, for driving up to 16 LEDs per  
string to create a matrix of more than 160 LEDs. Together  
with its 90% efficiency and I2C programmable or external  
current control, among other features, makes the 34844 a  
perfect solution for backlighting small and medium size LCD  
panels, on low power portable and high definition devices.  
One of the most common schemes for backlighting with  
LED is the one known as “Array backlighting”. This creates a  
matrix of LEDs all over the LCD surface, using defraction and  
diffused layers to produce an homogenous and even light at  
FUNCTIONAL PIN DESCRIPTION  
INPUT VOLTAGE SUPPLY (VIN)  
IC ENABLE (EN)  
IC Power input supply voltage, is used internally to  
produce internal voltage regulation (VDC1, VDC3) for logic  
functioning, and also as an input voltage for the boost  
regulator.  
The active high enable terminal is internally pulled high  
through pull-up resistors. Applying 0V to this terminal would  
stop the IC from working.  
INPUT/OUTPUT CLOCK SIGNAL (CK)  
INTERNAL VOLTAGE REGULATOR 1 (VDC1)  
This terminal can be used as an output clock signal  
(master mode), or input clock signal (slave mode), to  
synchronize more than one device.  
This pin is for internal use only, and not to be used for other  
purposes. A capacitor of 2.2 μF should be connected  
between this pin and ground for decoupling purposes.  
MASTER/SLAVE MODE SELECTION (M/~S)  
INTERNAL VOLTAGE REGULATOR 2 (VDC2)  
Setting this pin High puts the device into Master mode,  
producing an output synchronization clock at the CK terminal.  
Setting this pin low, puts the device in Slave mode, using the  
CK pin as an input clock.  
This pin is for internal use only, and not to be used for other  
purposes. A capacitor of 2.2 μF should be connected  
between this pin and ground for decoupling purposes.  
INTERNAL VOLTAGE REGULATOR 3 (VDC3)  
EXTERNAL PWM INPUT (PWM)  
This pin is for internal use only, and not to be used for other  
purposes. A capacitor of 2.2 μF should be connected  
between this pin and ground for decoupling purposes.  
This terminal is internally pulled down. An external PWM  
signal can be applied to modulate the LED channel directly in  
absence of an I2C interface.  
2
BOOST COMPENSATION PIN (COMP)  
CLOCK I C SIGNAL (SCK)  
Passive terminal used to compensate the boost converter.  
Add a capacitor and a resistor in series to GND to stabilize  
the system.  
Clock line for I2C communication.  
2
ADDRESS I C SIGNAL (SDA)  
Address line for I2C communication.  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
11  
FUNCTIONAL DESCRIPTION  
FUNCTIONAL PIN DESCRIPTION  
applying a voltage higher than 2.2 V, the scaling factor is  
disabled and the internal pull-ups are activated in both pins.  
A0/SEN  
Address select, device select pin, or Hardware Over-  
voltage Protection (OVP) Control.  
GROUND (GND)  
Ground Reference for all internal circuits other than the  
Boost FET.  
CURRENT SET (ISET)  
Each LED string can drive up to 50 mA. The maximum  
current can be set by using a resistor from this pin to GND.  
The Exposed Pad (EP) should be used for thermal heat  
dissipation.  
POSITIVE CURRENT SCALING (PIN)  
I0-I9  
Positive current scaling factor for the external analog  
current control. Applying 0 V to this pin, scales the current to  
0%, and in the same way, applying 2.048 V (Vset), the scale  
factor is 100%. By applying a voltage higher than 2.2 V, the  
scaling factor is disabled, and the internal pull-ups are  
activated.  
Current LED driver, each line has the capability of driving  
up to 50 mA.  
FAULT DETECTION PIN (FAIL)  
When a fault situation is detected, this pin goes into high  
impedance.  
If PIN pin and NIN pin are used at the same time then by  
applying 0 V to the PIN pin and 2.048 V to NIN pin, scales the  
current to 0%, and in the same way, applying 2.048 V to the  
PIN pin and 0 V to NIN pin, scales the current to 100%. By  
applying a voltage higher than 2.2 V, the scaling factor is  
disabled and the internal pull-ups are activated in both pins.  
BOOST SLOPE COMPENSATION SETTING  
RESISTOR (SLOPE)  
Use an external resistor of about 68 kΩ to configure the  
Boost compensation slope.  
NEGATIVE CURRENT SCALING (NIN)  
POWER GROUND TERMINALS (PGNDA, PGNDB)  
Negative current scaling factor for the external analog  
current control. Setting 0 V to this pin scales the current to  
100%, in the same way, setting 2.048 V (Vset) the scale  
factor is 0%. By applying a voltage higher than 2.2 V, the  
scaling factor is disabled and the internal pull-ups are  
activated.  
Ground terminal for the internal Boost FET.  
OUTPUT VOLTAGE SENSE TERMINAL (VOUT)  
Input terminal to monitor the output voltage. It also  
supplies the input voltage for the internal regulator 2 (VDC2).  
If PIN pin and NIN pin are used at the same time then by  
applying 0 V to the PIN pin and 2.048 V to NIN pin, scales the  
current to 0%, and in the same way, applying 2.048 V to the  
PIN pin and 0 V to NIN pin, scales the current to 100%. By  
SWITCHING NODE TERMINALS (SWA, SWB)  
Switching node of boost converter.  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
12  
FUNCTIONAL DESCRIPTION  
FUNCTIONAL INTERNAL BLOCK DESCRIPTION  
FUNCTIONAL INTERNAL BLOCK DESCRIPTION  
MC34844 - Functional Block Diagram  
Regulators / Power Down  
Boost  
3 Internal Regulators  
Protection / Failure Detection  
Over-temperature Protection  
Over-current Protection  
Under-voltage Protection  
Over-voltage Protection  
LED Channels  
LED Open Protection  
Logic Control  
Optical and Temperature Control  
PWM Dimming  
Serial Interface Control  
Regulator / Power down  
Protection / Failure Detection  
LED Channels  
Boost  
Logic Control  
Figure 4. Functional Internal Block Diagram  
• SM Bus mode, EN pin must be tied low and the device is  
REGULATORS/ POWER DOWN  
turned ON by any activity on the bus lines. The part shuts  
down if the bus lines are held low for more than 27 ms, the  
27 ms watchdog timer can be disabled by I2C (setting  
SETI2C bit high) or tying the EN pin high. In Sleep mode  
(EN bit=0) the device reduces the power consumption by  
leaving “alive” only the blocks required for I2C  
The 34844 is designed to operate from input voltages in  
the 7.0 to 28 V range. This is stepped down internally by  
LDOs to 2.5 V (VDC1 and VDC3) and 6 V (VDC3) for  
powering internal circuitry. If the input voltage falls below the  
UVLO threshold, the device automatically enters in power  
down mode.  
communication.  
Operating Modes:  
• I2C mode, has to be configured by I2C communication  
(SETI2C bit = 1) right after the IC is turned ON, it prevents  
the part from being turned ON/OFF by the bus. Sleep  
mode is also present and it is intended to save power, but  
still keep the IC prepared to communicate by I2C. Turning  
the EN pin OFF, the chip enters into a low power mode.  
The device can be operated by the EN pin and/or SDA/  
SCK bus lines, resulting in three distinct operation modes:  
• Manual mode, there is no I2C capability, the bus line pins  
must be tied low, and the EN pin controls the ON/OFF  
operation.  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
13  
FUNCTIONAL DESCRIPTION  
FUNCTIONAL INTERNAL BLOCK DESCRIPTION  
Current Consumption  
Mode  
MODE  
EN Pin  
SCK/SDA Pins  
I2C Bit Command  
Comments  
Low  
High  
Low  
Low  
Low  
Low  
Low  
N/A  
Shutdown  
Operational  
Shutdown  
Sleep  
Manual  
N/A  
Low (> 27 ms)  
Active  
EN bit = X  
SM Bus  
EN bit = 0  
Active  
EN bit = 1  
Operational  
SETI2C bit = 1  
CLRI2C bit = 0  
EN bit = X  
I2C Low Power  
(Shutdown)  
Part Doesn’t  
Wake-up  
Low  
High  
High  
X
X
X
SETI2C bit = 1  
CLRI2C bit = 0  
EN bit = 0  
I2C  
Sleep  
SETI2C bit = 1  
CLRI2C bit = 0  
EN bit = 1  
Operational  
Table 4. Operation Current Consumption Modes  
BOOST  
HARDWARE OVP:  
The integrated boost converter operates in non-  
The OVP value should be set to greater than the maximum  
LED voltage over the whole temperature range. A good  
practice is to set it 5.0 V or so above the max LED voltage.  
synchronous mode and integrates a 3.0 A FET. An integrated  
sense circuit is used to sense the voltage at the LED current  
mirror inputs and automatically sets the boost output voltage  
(DHC) to the minimum voltage needed to keep all LEDs  
biased with the required current. The DHC is designed to  
operate under specific pulse width conditions in the LED  
drivers. It operates for pulse widths higher than 4.0 μs  
If the pulse widths are shorter than specified, the DHC  
circuit will not operate and the voltage across the LED drivers  
will increase to a value given by the OVP minus the total LED  
voltage in the LED string. Therefore it is imperative to select  
the proper OVP level to minimize power dissipation.  
The boost converter also features internal Over-current  
Protection (OCP) and has a user programmable Over-  
voltage Protection (OVP).  
The OCP operates on a cycle by cycle basis. However, if  
the OCP condition remains for more than 10ms then the  
device turns off the LED Drivers, the Boost goes to Sleep  
mode and the output FAULT pin goes into high-impedance.  
The device can only be restarted by recycling the enable or  
creating a Power On Reset (POR).  
The user can program the boost frequency by I2C  
(BST[1:0]) only after the IC is powered up and before the  
boost circuit is turned ON for the first time (PWM pin low to  
high). This sequence avoids boost frequency to be changed  
inadvertently during operation. The first I2C command has to  
wait for 5.0 ms after the part is turned ON, in order to allow  
sufficient time for the device power up sequence to be  
completed.  
The OVP can be set from 11 to 62 V, ~4.0 V spaced, using  
the I2C interface (OVP Register). If I2C capability is not  
present, the OVP can be controlled by a resistor divider  
connected from VOUT to GND with its mid point tied to A0/  
SEN pin (threshold = 6.5 V). During an OVP condition, the  
output voltage will go to the OVP level which is programmed  
via the I2C interface or settled by a resistor divider on A0/SEN  
pin, or by a zener diode. The formulas to calculate the  
hardware OVP using any of the two methods are as follows:  
The boost controller has an integral track and hold  
amplifier with indefinite hold time capability, to enable  
immediate LED on cycles after extended off times. During  
extended off times, the external LEDs cool down from their  
normal quiescent operating temperature and thereby  
experience a forward voltage change, typically an increase in  
the forward voltage. This change can be significant for  
applications with a large number of series LEDs in a string  
operating at high current. If the boost controller did not track  
this increased change, the potential on the LED drivers would  
saturate for a few cycles once the LED channels are re-  
enabled.  
Method 1  
Method 2  
VOUT  
R
V
ZENER2  
UPPER  
A0/SEN  
A0/SEN  
R
LOWER  
OVP = V  
+ 6.5 V  
ZENER2  
OVP = 6.5 V [(R / R  
) + 1] + (100E-6 x R )  
UPPER  
UPPER  
LOWER  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
14  
FUNCTIONAL DESCRIPTION  
FUNCTIONAL INTERNAL BLOCK DESCRIPTION  
Also the device has a precharge voltage that add 0.5 Volts  
to the Boost, cycle by cycle of the PWM. It helps the boost to  
respond faster every time the load turns back on again.  
of the PWM duty cycle. This pin can also be used to modulate  
the LED at a lower frequency than the PWM dimming  
frequency (Minimum pulse width = 150 ns).  
A pulsed mode can also be programmed using the I2C  
interface (STROBE bit = 1). In this mode, each rising edge of  
the PWM signal turns on the next channel, while turning off  
all other channels. The duration that the channel is  
illuminated is set by the duty cycle of the PWM input pin. This  
can be used to scan the output channels.  
CURRENT MIRROR  
The programmable current mirror matches the current in  
10 LED strings to within 2%. The maximum current is set  
using a resistor to GND from the ISET pin. This can be scaled  
down using the I2C interface to 255 levels.  
Zero current is achieved by turning off the LED Driver by  
I2C (registers CHENx = 0h) for a duty cycle from 0% to 99%  
or by pulling PWM pin low regardless of the duty cycle.  
I2C capability allows the channels to be controlled  
individually or in parallel.  
DISABLING LED CHANNELS  
MC34844 allows the user to enable and disable each of  
the 10 channels separately by writing the corresponding  
CHENx bit on Registers 08 and 09 thru I2C.  
When a channel is disabled thru I2C prior the device starts  
to operate, the corresponding LED driver is disabled but the  
feedback circuit is still connected. This may interfere with the  
operation of the dynamic headroom control (DHC) which can  
lead to erratic output voltage regulation. For this condition,  
the output voltage may ramp up to the OVP level if the  
voltage on the LED driver is not substantially above the DHC  
regulation voltage (0.75 V typ). Because of this operation  
under I2C/SMBUS Mode, we recommend to connect the  
unused channels to VDC2 thru a100 kohm resistor and also  
follow the below powering up sequence:  
Current on LED Channel (PIN and NIN mode disabled)  
Eqn. 1  
ICH[RegisterValue]  
Current[A] = -----------------------------------------------------------  
RSET[ohms]  
In the off state, the LEDs current is set to 0 and the boost  
converter stops switching.  
This feature allows to drive more than 50 mA of current by  
connecting the LED string to 2 or more LED channels in  
parallel. For example; if the application requires to drive 5  
channels at 100 mA, then the bottom of each LED string  
should be connected to two channels in order to duplicate the  
current capability (Example: CH0+CH1 = 100 mA).  
1. PWM pin = Low.  
2. Power up the part.  
PWM GENERATOR  
3. Program the I2C commands and disable the unused  
channels.  
The PWM generator can operate in either master or slave  
modes, as set by the M/~S pin.  
4. Enable the Boost and current drivers by taking PWM  
pin to HIGH.  
In master mode, the internal PWM generator frequency is  
programmed through the I2C interface (registers FPWM).  
The default programmed value set the number of 25 kHz  
clocks (40 μs) in one PWM cycle. The 18-bit resolution allows  
minimum PWM frequencies of 100 Hz to be programmed.  
The resulting frequency is output on the CK pin.  
This previous device's operation does not happen when all  
channels are being used because the voltage across the LED  
drivers is always equal or higher than the DHC regulation  
voltage (0.75 V typ). For this condition, the user can disable/  
enable any of the channels thru I2C without causing any  
erratic behavior but the FAIL pin cannot be cleared. If FAIL  
pin is to be cleared thru I2C, it will be necessary to use the  
suggested configuration shown at the FAIL PIN session.  
PWM Frequency  
Eqn. 2  
19.2Mhz  
PWMFrequency[Hz] = -------------------------------------------------------------------  
FPWM[RegisterValue]  
FAIL PIN  
In slave mode, the CK pin acts as an input. The internal  
digital PLL uses this frequency as the PWM frequency. By  
setting one device as master, and connecting the CK output  
to the input on a number of slave configured devices, all  
PWM frequencies are synchronized together.  
If a LED fails open in any of the LED strings, the voltage in  
that particular LED channel will be close to ground and the  
LED open failure is detected. When this happens, a failure is  
registered, the FAIL pin is set to its high-impedance stage,  
and the channel is turned off.  
The duty cycle of the PWM waveform in both master and  
slave modes is set using a second register on the I2C  
interface (register DPWM), and can be controlled from 100%  
duty cycle to 1/256 Tpwm = 0.39%. Zero percent of duty cycle  
is achieved by turning LED drivers off (register CHENx = 0h)  
or pulling PWM pin low.  
The FAIL pin cannot be cleared for manual mode unless a  
complete power on reset is applied. However for I2C/SMBUS  
mode, the FAIL pin is cleared by disabling the malfunction  
channels (CHENx = 0) and clearing the failure bit (CLRFAIL  
bit = 1).  
If the application only requires clearing the failure for the  
floating or unused channels, then the unused channels must  
be connected to VDC2 thru a 100 kohm resistor to avoid  
An external PWM can also be used. The PWM input is  
'AND'ed with the internal signal. By setting the serial interface  
to 100% duty cycle (default), the external pin has full control  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
15  
FUNCTIONAL DESCRIPTION  
FUNCTIONAL INTERNAL BLOCK DESCRIPTION  
reach instability problems. This will allow detecting another  
failure from the connected channels. (See Figure 5)  
If I2C communication is not present, FAIL condition should  
be reset by removing the failure and re-enabling the device  
thru the EN pin.  
OPTICAL AND TEMPERATURE CONTROL LOOP  
The 34844 supports both optical and temperature loop  
control.  
For temperature loop control, the LED brightness can be  
adjusted depending on the temperature of the LEDs.  
For optical loop control, the 34844 supports both optical  
closed loop backlight control, where the brightness of the  
backlight is maintained at a required level by adjusting the  
light output, until the desired level is achieved, or with  
ambient light control, where the backlight brightness  
increases as ambient light increases.  
Both temperature and optical loops are supported through  
the PIN and NIN pins. Each pin supports a 0-2.048 V input  
range which affects the current through the LEDs. The PIN  
pin increases current as the voltage rises from 0-2.048 V.  
The NIN pin reduces current as the voltage rises from 0-  
2.048 V.  
Figure 5. Single Channel Disconnect Circuit.  
For applications where multiple failure detection is  
required, then one 100 kohm resistor must be placed from  
each channel to a diode (D2) connected to VDC2. The  
resistor will provide a pull up voltage to the disconnected  
channels so that they do not interfere with the DHC circuit.  
The diode (D2) ensures that when the connected channels  
are in PWM off state the LED strings do no conduct current  
to VDC2. (See Figure 6)  
A 10.2 k resistor or higher value must be used at the ISET  
pin if the part is configured to use PIN+NIN control loop  
functionality, the 50 mA maximum current is achieved at the  
higher allowed level of PIN/NIN pins, ensuring the maximum  
current of the LED Drivers are not exceeded.  
The optical and temperature control loop can be disabled  
by I2C setting bits (PINEN & NINEN), or by tying PIN and NIN  
pins high (>2.2 V) it is called VSET mode, and the LED Driver  
maximum current is set to 50 mA by using a 5.1 k resistor at  
the ISET pin.  
Current on LED Channel (PIN mode)  
Eqn. 3  
(VPIN × ICH[RegisterValue])  
Current[A] = ---------------------------------------------------------------------------------------  
RSET[ohms]  
Current on LED Channel (NIN mode)  
Eqn. 4  
(2.048 VNIN) × ICH[RegisterValue]  
Current[A] = ------------------------------------------------------------------------------------------------------------  
RSET[ohms]  
Current on LED Channel (PIN+NIN mode)  
Eqn. 5  
(2.048 VNIN + VPIN) × ICH[RegisterValue]  
Current[A] = ----------------------------------------------------------------------------------------------------------------------------------  
RSET[ohms]  
Figure 6. Resistor/Diode placement for multiple open  
circuit detection  
If the fail pin cannot be cleared by software then it indicates  
that the failure is because of t an over-current in the Boost.  
LED FAILURE PROTECTION  
Open LED Protection  
Since this is a critical failure the only way to clear it is by  
releasing the part from the over-current condition and then  
shutdown the part (Refer to Table 4)  
If LED fails open in any of the LED strings, the voltage in  
that channel will be pulled close to zero, which will cause the  
channel to be disabled. As a result, the boost output voltage  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
16  
FUNCTIONAL DESCRIPTION  
FUNCTIONAL INTERNAL BLOCK DESCRIPTION  
will go to the OVP level and then come down to the regulation  
level to continue powering the rest of the LED strings.  
OTT threshold, the IC will turn off all power sources inside the  
IC (LED drivers, boost and internal regulators) until the  
temperature falls below the falling OTT threshold. Once it  
comes back on, it will operate with the default configuration  
(refer to Table 6).  
Short LED Protection  
If an LED shorted in any of the LED strings, the device will  
continue to operate without interruption. However, if the  
shorted LED happens to be in the LED string with the highest  
forward voltage, the DHC circuit will automatically regulate  
the output voltage with respect to the new highest LED  
voltage. If more LEDs are shorted in the same LED string, it  
may cause excessive power dissipation in the channel which  
may cause the OTT circuit to trip which will completely  
shutdown the device.  
SERIAL INTERFACE CONTROL  
The 34844 uses an I2C interface capable of operating in  
standard (100 kHz) or fast (400 kHz) modes.  
The A0/SEN pin can be used an address select pin to  
allow more than 2 devices in the system. The A0/SEN pin  
should be held low on all chips expect the one to be  
addressed, where it is taken HIGH.  
OVER-TEMPERATURE PROTECTION  
The 34844 has an on-chip temperature sensor that  
measures die temperature. If the IC temperature exceeds the  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
17  
FUNCTIONAL DEVICE OPERATION  
OPERATIONAL MODES  
FUNCTIONAL DEVICE OPERATION  
OPERATIONAL MODES  
perceivable short flash on the backlight immediately after the  
load change.  
NORMAL MODE  
In normal operation the 34844 is programed via I2C to  
drive up to 50 mA of current through each one of the LED  
channels. The 34844 can be configured in master or slave  
mode as set by the M/~S pin.  
To avoid this problem, one can simply limit large  
instantaneous changes in die temperature by invoking only  
small power steps when raising or lowering the display power  
at low PWM frequencies. For example, to maintain lock while  
transitioning from 0% to 100% duty cycle at 20 W load power  
and a PWM frequency of 100 Hz would entail stepping the  
power at a rate not to exceed 1% per 10 ms. If a load of less  
than 20 W is used, then the rate of rise can be increased. As  
the locked PWM frequency increases (i.e. use 600 Hz  
instead of 100 Hz), the step rate can be further increased to  
approximately 4% per 2.0 ms. The exact step rate to avoid  
loss of PLL lock is a function of essentially three things: (a)  
the composite thermal resistance of the user's PCB  
assembly, (b) the load power, and (c) the PWM frequency.  
For all cases below 1.0 KHz, simply using a rate of 1% duty  
cycle change per PWM period will be adequate. If this is too  
slow, the value can be optimized experimentally once the  
hardware design is complete. At PWM rates above 1.0 KHz,  
it is not necessary to control the rate of change in PWM duty  
cycle.  
In Master mode, the internal PWM generator frequency is  
programmed through the I2C interface. The programmed  
value sets the number of 25 kHz clocks (40μs) in one PWM  
cycle. The 18-bit resolution allows minimum PWM  
frequencies of 100 Hz to be programmed. The resulting  
frequency is output on the CK pin.  
In slave mode, the CK pin acts as an input. The internal  
digital PLL uses this frequency as the PWM frequency.  
By setting one device as a master, and connecting the CK  
output to the input on a number of slave configured devices,  
all PWM frequencies are synchronized together. For this  
application A0/SEN pin indicates which device is enable for  
I2C control.  
In Slave mode, an internal phase lock loop will lock the  
internal PWM generator period to the period of the signal  
present at the CK pin. The PLL can lock to any frequency  
from 100 Hz to 25 KHz provided the jitter is below 1000 ppm.  
At frequencies above 1.0 KHz, the PLL will maintain lock  
regardless of the transient power conditions imposed by the  
user (i.e. going from 0% duty cycle to 100% at 20W LED  
display power). Below 1.0 kHz, thermal time constants on the  
die are such that the PLL may momentarily lose lock if the die  
temperature changes substantially during a large load power  
step. As explained below, this anomaly can be avoided by  
controlling the rate of change in PWM duty cycle.  
It is important to point out that when operating in the  
master mode, one does not need to concern themselves with  
loss of lock since the reference clock and the VCO clock are  
collocated on the die, and therefore experience the same  
thermal shift. Hence in master mode, once lock is initially  
acquired, it is not lost and no blanking of the display occurs.  
The duty cycle of the PWM in both master and slave mode  
is set using a second register on the I2C interface.  
An external PWM signal can also be applied in the PWM  
pin. This pin is AND’ed with the internal signal, giving the  
ability to control the duty cycle either via I2C or externally by  
setting any of the 2 signals to 100% duty cycle.  
To better understand this issue, consider that the on chip  
PLL uses a VCO that is subject to thermal drift on the order  
of 1000 ppm/C. Further consider that the thermal time  
constant of the chip is on the order of single digit  
milliseconds. Therefore, if a large power load step is imposed  
by the user (i.e. going from 0% duty cycle to 100% duty cycle  
with a load power of 20 W), the die will experience a large  
temperature wave gradient that will propagate across the  
chip surface and thereby affect the instantaneous frequency  
of the VCO. As long as such changes are within the  
bandwidth of the PLL, the PLL will be able to track and  
maintain lock. Exceeding this rate of change may cause the  
PLL to lose lock and the backlight will momentarily be  
blanked until lock is reacquired.  
STROBE MODE  
A strobe mode can be programmed via I2C.  
In this mode, each rising edge of the PWM signal turns on  
the next channel, while turning off all other channels. The  
duration that the channel is illuminated is set by the duty cycle  
of the PWM input pin.  
This mode can be also programmed by controlling the ON  
and OFF state of each LED channel via I2C.  
At 100 Hz lock, the PLL has a bandwidth of approximately  
10 Hz. This means that temperature changes on the order of  
100 ms are tolerable without losing lock. But full load power  
changes on the order of 10 ms (i.e. 100 Hz PWM) are not  
tracked out and the PLL can momentarily lose lock. If this  
happens, as stated above, the LED drivers are momentarily  
disabled until lock is reacquired. This will be manifested as a  
MANUAL MODE  
The 34844 can also be used in Manual mode without using  
the I2C interface. By setting the pin M/~S High, the LED  
dimming will be controlled by the external PWM signal. The  
over-voltage protection limit can be settled by a resistor  
divider on A0/SEN pin.  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
18  
FUNCTIONAL DEVICE OPERATION  
I2C BUS SPECIFICATION  
During manual mode, all internal Registers are in Default  
Configuration, refer Table 6, under this configuration the PIN  
and NIN pins are enabled to scale the current capability per  
string and may be disable by setting 2.2 V in the  
corresponding terminal.  
PWM signal applied to PWM pin will be in charge of  
controlling LED dimming and enable the device every time  
the PWM is active. For this configuration EN pin should be  
LOW.  
POWER DOWN MODE  
Also in this mode, the device can be enabled as follows:  
If the input voltage falls below the UVLO threshold, the  
device enters automatically into power down mode. When in  
power down, the supply current is reduced below 2.0 μA  
when there is no I2C activity, and it rises up when I2C  
interface is enabled.  
+ EN pin + PWM signal (Two Signals): In this  
configuration, the PWM signal applied to PWM pin will be in  
charge of controlling the LED dimming and a second signal  
will enable or disable the chip through the EN pin. Figure 20  
+ PWM Signal tied to SDA pin (Just ONE signal): In this  
configuration the PWM pin should be tied to SDA pin. The  
I2C BUS SPECIFICATION  
MC34844 is a unidirectional device that can only be written by an external control unit. Since the device is a 7 bit address  
device (1110110), the control unit needs to follow a specific data transfer format which is shown below.  
Figure 7. A complete data transfer  
For a complete data transfer, please use this format in the  
following order:  
The receiver (MC34844) must pull down the SDA line  
during this acknowledge pulse to indicate that the data  
was correctly written.  
1. START condition  
• Bits in the first byte: The first seven bits of the first bite  
make up the slave address. The eighth bit is the LSB (least  
significant bit), which determines the direction of the  
message (Write = 0)  
2. MC34844 device address and Write instruction (R/W =  
0)  
3. First data pack, it corresponds to the MC34844  
Register that needs to be written. (refer to Table 5)  
For the MC34844 device, when an address is sent, each  
of the devices in a system compares the first seven bits  
after the START condition with its address. If they match,  
the device considers itself addressed by the control unit as  
a slave-receiver.  
4. Second data pack, it corresponds to the value that  
should be written to that register. (refer to Table 5)  
5. STOP condition  
I2C variables description:  
• STOP: this condition occurs when SDA changes from  
LOW to HIGH while SCK is HIGH  
• START: this condition occurs when SDA changes from  
HIGH to LOW while SCK is HIGH.  
• ACKNOWLEDGE: The acknowledge clock pulse is  
generated by the Master (Control Unit).  
• The transmitter releases the SDA line (HIGH) during the  
acknowledge clock pulse.  
For more information about “I2C BUS SPECIFICATION”  
please refer to the following link:  
http://www.nxp.com/acrobat_download/literature/  
9398/39340011.pdf  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
19  
FUNCTIONAL DEVICE OPERATION  
LOGIC COMMANDS AND REGISTERS  
LOGIC COMMANDS AND REGISTERS  
Table 5. Write Registers  
REG / DB D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
OVP3  
OVP2  
OVP1  
OVP0  
NINEN  
PINEN  
EN  
00  
01  
04  
05  
06  
07  
08  
09  
14  
F0  
F1  
F2  
F3  
F4  
F5  
F6  
F7  
F8  
F9  
FA  
CLRI2C  
FPWM1  
FPWM7  
FPWM13  
DPWM1  
CHEN1  
CHEN6  
BST1  
SETI2C  
FPWM0  
FPWM6  
FPWM12  
DPWM0  
CHEN0  
CHEN5  
BST0  
FPWM5  
FPWM11  
FPWM17  
DPWM5  
FPWM4  
FPWM10  
FPWM16  
DPWM4  
CHEN4  
FPWM3  
FPWM2  
FPWM8  
FPWM14  
DPWM2  
CHEN2  
CHEN7  
FPWM9  
FPWM15  
DPWM3  
CHEN3  
CHEN8  
DPWM7  
STRB  
DPWM6  
CLRFAIL  
ALL_OFF  
CHEN9  
ICH0_7  
ICH1_7  
ICH2_7  
ICH3_7  
ICH4_7  
ICH5_7  
ICH6_7  
ICH7_7  
ICH8_7  
ICH9_7  
ICHG_7  
ICH0_6  
ICH1_6  
ICH2_6  
ICH3_6  
ICH4_6  
ICH5_6  
ICH6_6  
ICH7_6  
ICH8_6  
ICH9_6  
ICHG_6  
ICH0_5  
ICH1_5  
ICH2_5  
ICH3_5  
ICH4_5  
ICH5_5  
ICH6_5  
ICH7_5  
ICH8_5  
ICH9_5  
ICHG_5  
ICH0_4  
ICH1_4  
ICH2_4  
ICH3_4  
ICH4_4  
ICH5_4  
ICH6_4  
ICH7_4  
ICH8_4  
ICH9_4  
ICHG_4  
ICH0_3  
ICH1_3  
ICH2_3  
ICHG_3  
ICH4_3  
ICH5_3  
ICH6_3  
ICH7_3  
ICH8_3  
ICH9_3  
ICHG_3  
ICH0_2  
ICH1_2  
ICH2_2  
ICH3_2  
ICH4_2  
ICH5_2  
ICH6_2  
ICH7_2  
ICH8_2  
ICH9_2  
ICHG_2  
ICH0_1  
ICH1_1  
ICH2_1  
ICH3_1  
ICH4_1  
ICH5_1  
ICH6_1  
ICH7_1  
ICH8_1  
ICH9_1  
ICHG_1  
ICH0_0  
ICH1_0  
ICH2_0  
ICH3_0  
ICH4_0  
ICH5_0  
ICH6_0  
ICH7_0  
ICH8_0  
ICH9_0  
ICHG_0  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
20  
FUNCTIONAL DEVICE OPERATION  
LOGIC COMMANDS AND REGISTERS  
Table 6. Register Description  
DEFAULT VALUE  
(HEX)  
REGISTER NAME  
DESCRIPTION  
1
1
Chip Enable by software. This signal is ‘OR’ed with external EN (0=off, 1 =on)  
PIN pin enable (0=off, 1 =on)  
EN  
PINEN  
1
NIN pin enable (0=off, 1 =on)  
NINEN  
F
OVP voltage  
OVP[3:0]  
SETI2C  
0
SET I2C communication (Disable SM Bus Mode)  
Clear set I2C  
0
CLRI2C  
300  
FF  
3FF  
0
PWM Frequency  
FPWM[17:0]  
DPWM[7:0]  
CHEN[9:0]  
ALL_OFF  
CLRFAIL  
STRB  
PWM Duty Cycle (FFh =100%)  
Channel Enable (0=off, 1=on)  
All 10 channels OFF at the same. In order to reactivate channels this bit should be clear.  
Clear fail if channels are re-enable.  
0
0
Strobe MODE (0=Parallel, 1=Strobe)  
Boost Frequency (150,300,600,1200 kHz) [0h=150 Hz]  
Channel Current Program (FFh = Maximum Current)  
Global Current Program  
2
BST[1:0]  
ICH#[7:0]  
ICHG[7:0]  
FF  
FF  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
21  
FUNCTIONAL DEVICE OPERATION  
LOGIC COMMANDS AND REGISTERS  
Table 7. Over Voltage Protection  
REGISTER (HEX)  
OVP VALUE (VOLTS)  
11  
15  
19  
23  
27  
31  
35  
39  
43  
47  
51  
55  
59  
62  
2
3
4
5
6
7
8
9
A
B
C
D
E
F
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
22  
TYPICAL PERFORMANCE CURVES (TA=25°C)  
LOGIC COMMANDS AND REGISTERS  
TYPICAL PERFORMANCE CURVES (T =25°C)  
A
95%  
94%  
93%  
92%  
91%  
90%  
89%  
88%  
87%  
86%  
85%  
Fs = 600KHz  
L=22uH, DCR=52mO  
Schottky V12P10-E3/86A  
COUT = 2x4.7µF, 2x2.2µF/100V  
FPWM=600Hz, 100% duty  
Load = 16 LEDs, 50mA/channel  
VLED = 48V, ±1V /channel  
10  
12  
14  
16  
18  
20  
22  
24  
26  
28  
30  
Vin, volts  
Figure 8. Boost efficiency vs Input Voltage  
50.50  
50.45  
50.40  
50.35  
50.30  
50.25  
50.20  
50.15  
50.10  
50.05  
50.00  
Fs = 600KHz  
L=22uH, DCR=52mO  
Schottky V12P10-E3/86A  
OUT = 2x4.7µF, 2x2.2µF/100V  
FPWM=600Hz, 100% duty  
C
Load = 16 LEDs, 50mA/channel  
VLED = 48V, ±1V /channel  
15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30  
Vin, volts  
Figure 9. Line Regulation, VIN Changing  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
23  
TYPICAL PERFORMANCE CURVES (TA=25°C)  
LOGIC COMMANDS AND REGISTERS  
50.0  
45.0  
40.0  
35.0  
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
50.01 mA  
37.59 mA  
25.03 mA  
12.46 mA  
FPWM=25KHz  
0.14 mA  
0.0  
0.4%  
25.0%  
50.0%  
PWM Duty Cycle (%)  
75.0%  
99.6%  
Figure 10. PWM Dimming Linearity  
10.10  
10.08  
10.06  
10.04  
10.02  
10.00  
9.98  
9.96  
9.94  
I2C Mode  
SM_Bus Mode  
Manual Mode  
9.92  
9.90  
15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30  
Vin, volts  
Figure 11. Bias Current vs Input Voltage (Operational Mode)  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
24  
TYPICAL PERFORMANCE CURVES (TA=25°C)  
LOGIC COMMANDS AND REGISTERS  
3.12  
3.10  
3.08  
3.06  
3.04  
3.02  
3.00  
2.98  
I2C Mode  
SM_Bus Mode  
15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30  
Vin, volts  
Figure 12. Bias Current vs Input Voltage (Sleep Mode)  
COMP  
Vin=24V  
Load=16 LEDs, 50mA/channel  
VLED = 47V, ±1V  
VOUT  
INDUCTOR  
CURRENT  
Figure 13. Boost Soft Start  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
25  
TYPICAL PERFORMANCE CURVES (TA=25°C)  
LOGIC COMMANDS AND REGISTERS  
ILED, CH1  
ISET=40mA(all channels)  
FPWM=600Hz, 40% duty  
VCH1  
VOUT  
(ac coupled)  
Precharge  
INDUCTOR  
CURRENT  
Figure 14. Typical Operation Waveforms for FPWM=600 Hz, 40% Duty  
SWA  
SWB  
INDUCTOR  
CURRENT  
VOUT  
(ac coupled)  
ILED, CH1  
ISET=50mA (all channels)  
FPWM=600Hz, 100% duty  
Figure 15. Typical Operation Waveforms for FPWM=600 Hz, 100% Duty  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
26  
TYPICAL PERFORMANCE CURVES (TA=25°C)  
LOGIC COMMANDS AND REGISTERS  
VCh1  
ISET = 20mA,  
FPWM=20KHz, Duty=0.78% (2LSB)  
ILED1  
Figure 16. Low Duty Dimming Operation Waveforms (FPWM=20 kHz, 2LSB)  
ISET = 20mA,  
FPWM=20KHz, Duty=0.39% (1LSB)  
VCh1  
ILED1  
Figure 17. Low Duty Dimming Operation Waveforms (FPWM=20 kHz, 1LSB)  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
27  
TYPICAL APPLICATIONS  
LOGIC COMMANDS AND REGISTERS  
TYPICAL APPLICATIONS  
MANUAL MODE (Single Wire Control)  
22uH  
VIN = 24V  
1
2
LED MATRIX (16S10P)  
VOUT  
U1  
D1  
1
4
3
2
1
VIN  
SWA  
SWB  
13.8uF  
+
47uF  
+
28  
31  
23  
VDC1  
VDC2  
VDC3  
32  
VOUT  
2.2uF  
5
2
PGNDA  
PGNDB  
2.2uF  
29  
22  
COMP  
SLOPE  
2.2uF  
0
5.6K  
1.8nF  
309K  
0
56pF  
VCC  
Master CK  
Output  
3.3K  
24  
7
18  
CK  
EN  
FAIL  
0
0
0
25  
8
9
PWM  
I0  
I1  
I2  
I3  
I4  
I5  
I6  
I7  
I8  
I9  
CLK  
27  
26  
10  
11  
12  
13  
14  
15  
16  
17  
SCK  
SDA  
VOUT  
0
150K  
OVP  
= 55V  
6
30  
A0/SEN  
M/~S  
20K  
VDC1  
5.1K  
19  
ISET  
VDC1  
20  
21  
PIN  
NIN  
33  
GND  
0
34844  
0
Figure 18. Manual Mode (Single Wire Control)  
MANUAL MODE (Two Wire Control)  
22uH  
VIN = 24V  
1
2
LED MATRIX (16S10P)  
VOUT  
U2  
D5  
1
4
3
2
1
VIN  
SWA  
SWB  
13.8uF  
+
47uF  
+
28  
31  
23  
VDC1  
VDC2  
VDC3  
32  
VOUT  
2.2uF  
5
2
PGNDA  
PGNDB  
2.2uF  
29  
22  
COMP  
SLOPE  
2.2uF  
0
5.6K  
1.8nF  
309K  
0
56pF  
VCC  
Master CK  
Output  
3.3K  
24  
7
18  
CK  
EN  
FAIL  
0
0
0
EN  
25  
8
9
PWM  
I0  
I1  
I2  
I3  
I4  
I5  
I6  
I7  
I8  
I9  
Control  
Unit  
PWM  
27  
26  
10  
11  
12  
13  
14  
15  
16  
17  
SCK  
SDA  
VOUT  
150K  
0
OVP  
= 55V  
6
30  
A0/SEN  
M/~S  
20K  
VDC1  
5.1K  
19  
ISET  
VDC1  
20  
21  
PIN  
NIN  
33  
GND  
0
34844  
0
Figure 19. Manual Mode (Two Wire Control)  
22uH  
VIN = 24V  
1
2
LED MATRIX (16S10P)  
VOUT  
U3  
D8  
1
4
3
2
1
VIN  
SWA  
SWB  
13.8uF  
+
47uF  
+
28  
31  
23  
VDC1  
VDC2  
VDC3  
32  
VOUT  
2.2uF  
5
2
PGNDA  
PGNDB  
2.2uF  
29  
22  
COMP  
SLOPE  
2.2uF  
0
5.6K  
1.8nF  
309K  
0
56pF  
VCC  
Master CK  
3.3K  
24  
7
18  
CK  
EN  
FAIL  
0
0
0
25  
8
9
VDC1  
0
PWM  
I0  
I1  
I2  
I3  
I4  
I5  
I6  
I7  
I8  
I9  
SCK  
SDA  
27  
26  
10  
11  
12  
13  
14  
15  
16  
17  
SCK  
SDA  
Control  
Unit  
6
30  
A0/SEN  
M/~S  
VDC1  
5.1K  
19  
ISET  
VDC1  
20  
21  
PIN  
NIN  
33  
GND  
0
34844  
0
Figure 20. SM Bus Mode  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
28  
TYPICAL APPLICATIONS  
LOGIC COMMANDS AND REGISTERS  
MASTER - SLAVE Connection  
22uH  
VIN = 24V  
1
2
LED MATRIX (16S10P)  
VOUT  
U4  
D1  
1
4
3
2
1
VIN  
SWA  
SWB  
13.8uF  
+
47uF  
+
28  
31  
23  
VDC1  
VDC2  
VDC3  
32  
VOUT  
2.2uF  
5
2
PGNDA  
PGNDB  
2.2uF  
29  
22  
COMP  
SLOPE  
2.2uF  
0
5.6K  
1.8nF  
309K  
0
56pF  
VCC  
Master CK  
3.3K  
24  
7
18  
CK  
EN  
FAIL  
0
0
0
25  
8
9
VDC1  
PWM  
I0  
I1  
I2  
I3  
I4  
I5  
I6  
I7  
I8  
I9  
27  
26  
10  
11  
12  
13  
14  
15  
16  
17  
SCK  
SDA  
6
30  
A0/SEN  
M/~S  
VDC1  
5.1K  
VDC1  
19  
ISET  
20  
21  
PIN  
NIN  
33  
GND  
0
34844  
0
A0/SEN (Master)  
A0/SEN (Slave)  
MASTER Device  
SLAVE Device  
22uH  
SDA  
SCK  
Control  
Unit  
VIN = 24V  
1
2
LED MATRIX (16S10P)  
VOUT  
U5  
D2  
1
4
3
2
1
VIN  
SWA  
SWB  
13.8uF  
+
47uF  
+
28  
31  
23  
VDC1  
VDC2  
VDC3  
32  
VOUT  
2.2uF  
5
2
PGNDA  
PGNDB  
2.2uF  
29  
22  
COMP  
SLOPE  
2.2uF  
0
5.6K  
1.8nF  
309K  
Input  
0
56pF  
VCC  
3.3K  
24  
7
18  
CK  
EN  
FAIL  
0
Master CK  
0
0
25  
8
9
VDC1  
PWM  
I0  
I1  
I2  
I3  
I4  
I5  
I6  
I7  
I8  
I9  
27  
26  
10  
11  
12  
13  
14  
15  
16  
17  
SCK  
SDA  
6
30  
A0/SEN  
M/~S  
5.1K  
19  
ISET  
VDC1  
20  
21  
PIN  
NIN  
33  
GND  
0
34844  
0
Figure 21. Master - Slave Connection  
34844  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
29  
TYPICAL APPLICATIONS  
COMPONENTS CALCULATION  
COMPONENTS CALCULATION  
The following formulas are intended for the calculation of  
all external components related with the Boost converter and  
Network compensation.  
CSG = ACSA × RSense  
In order to calculate a Duty Cycle, the internal losses of the  
MOSFET and Diode should be taken into consideration.  
RComp × 5 × G × Iout × L  
(1 – D) × Vout × CSG  
-------------------------------------M------------------------------  
Cout =  
The output voltage ripple (ΔVout) depends on the ESR of  
the Output capacitor, for a low output voltage ripple it is  
recommended to use Ceramic capacitors that usually have  
very low ESR. Since ceramic capacitor are expensive,  
Electrolytic or Tantalum capacitors can be mixed with  
ceramic capacitors to have a cheaper solution.  
Vout + VD – Vin  
--------------------------------------------  
D =  
Vout + VD – VSW  
The average input current depends directly to the output  
current when the internal switch is off.  
Iout  
1 – D  
------------  
=
Iinavg  
Vout × ΔVout × FSW × L  
--------------------------------------------------------------  
=
ESRCout  
Vout × (1 – D)  
Inductor  
The output capacitor should handle at least the following  
RMS current.  
For calculating the Inductor we should consider the losses  
of the internal switch and winding resistance of the inductor.  
Network Compensation  
Since this Boost converter is current controlled, Type II  
compensation is needed.  
(Vin – VSW (Iinavg × rw)) × D  
---------------------------------------------------------------------------------  
L =  
Iinavg × r × FSW  
It is important to look for an inductor rated at least for the  
maximum input current.  
D
1 – D  
IrmsCout = Iout × ------------  
I order to calculate the Network Compensation, first we  
need to calculate all Boost Converter components.  
Vin × (Vout – Vin)  
-------------------------------------------------  
+
Iinmax = Iinavg  
Input Capacitor  
2 × L × FSW × Vout  
For this type of compensations we need to push out the  
Right Half Plane Zero to higher frequencies where it can’t  
affect the overall loop significantly.  
The input capacitor should handle at least the following  
RMS current.  
Vout × (1 – D)2  
---------------------------------------  
=
fRHPZ  
Iout × 2 × π × L  
Vin × (Vout – Vin)  
-------------------------------------------------  
IrmsCin  
=
× 0.3  
The Crossover frequency must be set much lower than the  
location of the Right half plane zero  
2 × L × FSW × Vout  
Output Capacitor  
For the output capacitor selection the internal current  
sense gain (CSG) and the Transconductance should be  
taken in consideration.  
fRHPZ  
--------------  
=
fCross  
5
The CSG is the internal RSense times the current sense  
amplifier gain (ACSA).  
Since our system has a fixed Slope compensation set by  
RSLOPE, RComp should be fixed for all configurations.  
RComp = 5.6Kohm  
CComp1 and CComp2 should be calculated as follows:  
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TYPICAL APPLICATIONS  
COMPONENTS CALCULATION  
Variable Definition  
D= Boost Duty Cycle  
Vout= Output Voltage  
VD= Diode Forward Voltage  
Vin= Input Voltage  
2
-------------------------------------------------------  
CComp1  
=
fCross × RComp × π × 2  
GM  
VSW= VDROP of Internal Switch  
ΔVout= Output Voltage Ripple Ratio  
Iinavg= Average Input Current  
---------------------------  
=
CComp2  
6.28 × FSW  
Slope Compensation  
Iout= Output Current  
Slope Compensation can be expressed either in terms of  
Ampers/Second or as Volts/Second, through the use of the  
transfer resistance.  
r=Input Current Ratio  
Iinmax= Maximum input current  
IrmsCin= RMS current for Input Capacitor  
IrmsCout= RMS current for Output Capacitor  
L= Inductor  
The following formula express the Slope Compensation in  
terms of V/μs:  
rw= Inductor winding DC Resistance  
FSW= Boost Switching Frequency  
CSG= Current Sense Gain = 0.2 V/A  
ACSA= Current Sense Amplifier Gain = 9  
RSense= Current Sense Resistor = 22mohm  
Cout= Output Capacitor  
(Vout – Vin) × CSG  
---------------------------------------------------  
=
VSLOPE  
L × 2  
Where “L” is in μH  
In order to have this slope compensation, the following  
resistor should be set.  
RComp= Compensation Resistor  
GM= OTA Transconductance  
33×103  
-------------------  
=
RSLOPE  
VSLOPE  
ESRCout= ESR of Output Capacitor  
fRHPZ= Right Half Plane Zero Frequency  
fCross= Crossover Frequency  
CComp1= Compensation Capacitor  
CComp2= Shunt Compensation Capacitor  
VSLOPE= Slope Compensation (V/μs)  
RSLOPE= External Resistor for Slope Compensation  
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TYPICAL APPLICATIONS  
LAYOUT GUIDELINES  
LAYOUT GUIDELINES  
cross or to be routed close to a power signal, it is a good  
RECOMMENDED STACK-UP  
practice to trace them perpendicularly or at 45° on a different  
layer to avoid coupling noise.  
The following table shows the recommended layer stack-  
up for the signals to have good shielding and Thermal  
Dissipation.  
SWITCHING NODE (SWA & SWB)  
Table 8. Layer Stacking Recommendations  
The components associated to this node must be placed  
as close as possible to each other to keep the switching loop  
small enough so that it does not contaminate other signals.  
However, care must be taken to ensure the copper traces  
used to connect these components together on this node are  
capable to handle the necessary current and voltage.  
Stack-Up  
Layer 1 (Top)  
Signal  
Ground  
Signal  
Layer 2 (Inner 1)  
Layer 3(Inner 2)  
Layer 4 (Bottom)  
As a reference, a 10 mils trace with a thickness of 1.0 oz.  
of copper is capable of handling one ampere.  
Ground  
Traces for connecting the inductor, input and output caps  
should be as wide and short as possible to avoid adding  
inductance or resistance to the loop. The placement of these  
components should be selected far away from sensitive  
signals like compensation, feedback and internal regulators  
to avoid power noise coupling.  
DECOUPLING CAPS  
It is recommended to place decoupling caps of 100 pf at  
the beginning and at the end of any power signal traces to  
filter high frequency noise.  
Decoupling caps of 100 pf should be also placed at the  
end of any long trace to cancel antenna effects on it.  
These caps should be located as closed as possible to the  
point to be decoupled and the connection to GND should be  
as short as possible.  
COMPENSATION COMPONENTS  
Components related with COMP pin need to be placed as  
close as possible to the pin.  
SM-BUS/I2C COMMUNICATION AND CLOCK  
SIGNALS (SDA, SCK AND CK)  
FEEDBACK SIGNAL  
The trace of the feedback signal (VOUT) should be routed  
perpendicularly or at 45° on a different layer to avoid coupling  
noise, preferably between ground or power planes.  
To avoid contamination of these signals by nearby high  
power or high frequency signals, it is a good practice to shield  
them with ground planes placed on adjacent layers. Make  
sure the ground plane is uniform through the whole signal  
trace length.  
u C  
p
Input Cap  
n
t
DO  
Switching Node  
Switching Node  
w c  
e
On State  
Off State  
Signal  
Signal  
Feedback  
Feedback  
Signal  
n
e
b ck  
Signal  
e sa i n  
Compensation  
o
n
t
Ground Planes  
Output Cap  
u p t Ca  
Ground Plane  
Figure 22. Recommended shielding for critical signals.  
These signals shall not run parallel to power signals or  
other clock signals in the same routing layer. If they have to  
Figure 23. Feedback Signal Tracing  
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PACKAGING  
PACKAGE DIMENSIONS  
PACKAGING  
PACKAGE DIMENSIONS  
For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below.  
EP SUFFIX  
32-PIN  
98ASA10800D  
REVISION O  
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PACKAGING  
PACKAGE DIMENSIONS  
EP SUFFIX  
32-PIN  
98ASA10800D  
REVISION O  
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34  
PACKAGING  
PACKAGE DIMENSIONS  
EP SUFFIX  
32-PIN  
98ASA10800D  
REVISION O  
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REVISION HISTORY  
REVISION HISTORY  
REVISION  
DATE  
DESCRIPTION OF CHANGES  
11/2008  
3/2009  
• Initial Release  
3.0  
4.0  
• Added PWM Pin to Maximum Voltages in Maximum Rating Table.  
• Added Disabling LED Channels  
• Rewrote Fail Pin section  
• Added I2C Bus Specification  
5/2009  
• Corrected Compensasion Components paragraph on page 32.  
5.0  
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MC34844  
Rev. 5.0  
5/2009