ASM3I2111BG-08SR--Datasheet/数据表在线中文翻译

February 2007

rev 0.2

ASM3P2111B

Peak EMI Reducing Solution

Features

allows significant system cost savings by reducing the

number of circuit board layers and shielding that are

required to pass EMI regulations. The ASM3P2111B

modulates the output of PLL in order to spread the

bandwidth of a synthesized clock, thereby decreasing the

peak amplitudes of its harmonics. This results in

significantly lower system EMI compared to the typical

narrow band signal produced by oscillators and most

clock generators. Lowering EMI by increasing a signal’s

bandwidth is called spread spectrum clock generation.

•

Generates an EMI optimized clock at the output.

Input frequency: 25MHz.

Frequency outputs:

• 60MHz (unmodulated)

• 2 x 48MHz (unmodulated)

• 66.6MHz (modulated): -1.7% down spread

Modulation rate: 30KHz.

Supply voltage range: 3.3V ± 0.3V.

Available in 8-pin SOIC Package.

Commercial and Industrial Temperature range.

RoHS Compliant

•

Applications

ASM3P2111B is targeted towards EMI management for

high speed digital applications such as PC peripheral

devices, consumer electronics and embedded controller

systems.

Product Description

The ASM3P2111B is

a versatile spread spectrum

frequency modulator that reduces electromagnetic

interference (EMI) at the clock source. The ASM3P2111B

Block Diagram

V

DD

60 MHz

XIN /CLKIN

XOUT

Crystal

PLL1

48 MHz_1

Oscillator

48 MHz_2

48 MHz_1

PLL2

66.6 MHz

Modulated

V

SS

PulseCore Semiconductor Corporation

1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018

www.pulsecoresemi.com

Notice: The information in this document is subject to change without notice.

February 2007

rev 0.2

ASM3P2111B

Pin Configuration

8

V_SS

XIN/ CLKIN

1

2

66.6MHz

48MHz_1

7

6

5

XOUT

V_DD

ASM3P2111B

3

4

48MHz_2

60MHz

Pin Description

Description

Pin #

Pin Name

Type

Connection to crystal

1

2

3

4

5

6

7

8

XIN / CLKIN

XOUT

I

Connection to crystal

O

P

O

P

Power supply for the analog and digital blocks (+3.3V)

Clock output-1 60MHz un-modulated

V_DD

60MHz

48MHz_2

48MHz_1

66.6MHz

V_SS

Clock output-2 48MHz_2 un-modulated

Clock output-3 48MHz_1 un-modulated

Clock output-4 66.6MHz modulated

Ground to entire chip. Connect to System Ground

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Notice: The information in this document is subject to change without notice.

February 2007

rev 0.2

ASM3P2111B

Absolute Maximum Ratings

Symbol

Parameter

Voltage on any pin with respect to Ground

Rating

-0.5 to +4.6

-65 to +125

-40 to +85

260

Unit

V

°C

V_DD, V_IN

T_STG

T_A

Storage temperature

Operating temperature

T_s

T_J

Max. Soldering Temperature (10 sec)

Junction Temperature

150

Static Discharge Voltage

T_DV

2

KV

(As per JEDEC STD22- A114-B)

Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect

device reliability.

Operating Conditions

Symbol

V_DD

Parameter

Supply Voltage

Crystal Resonator Frequency

Output Driver Load Capacitance

Condition / Description

Min

3

25

-

Typ

3.3

-

Max

3.6

-

Unit

V

MHz

pF

3.3V ± 0.3V

F_XIN

C_L

15

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Notice: The information in this document is subject to change without notice.

February 2007

rev 0.2

ASM3P2111B

DC Electrical Characteristics

Parameter

Symbol

Conditions / Description

Min

Typ

Max

Unit

Overall

Supply Current,

Dynamic

Supply Current,

Static

I_DD

V_DD=3.3V, F_CLK=25MHz, C_L=15pF

V_DD= 3.3V, Clock Input = 0

41

20

48

25

62

35

mA

I_DDL

All input pins

High-Level Input

Voltage

Low-Level Input

Voltage

V_IH

V_IL

I_IH

V_DD=3.3V

2.0

-

V_DD+0.3

V

V_SS-0.3

0.8

1

V

High-Level Input

Current

µ A

-1

-20

-

Low-Level Input

Current (pull-up)

High-Level Output

Source Current

Low-Level Output

Sink Current

µ A

I_IL

-36

3

-80

-

I_xOH

I_xOL

V_DD=V (XIN) = 3.3V, V_O=0.4V

V_DD=3.3V, V (XIN)=V_O=2.5V

mA

-

3

-

Clock Outputs

High-Level Output

Source Current

Low-Level Output

Sink Current

I_OH

I_OL

V_O=2.5V

V_O=0.4V

-

-20

23

-

mA

Ω

Z_OH

Z_OL

V_O=0.5 V_DD; output driving high

Vo=0.5 V_DD; output driving low

-

29

27

-

Output Impedance

AC Electrical Characteristics

Parameter

Symbol

Conditions/ Description

V_O= 0.8V to 2.0V;

C_L= 15pF

Min

Typ

Max

Unit

Rise Time

t_r

300

800

900

pS

V_O= 2.0V to 0.8V;

C_L= 15pF

Ratio of pulse width (as measured from

rising edge to next falling edge at V_DD/2) to

one clock period

Fall Time

t_f

360

45

800

900

55

pS

%

Clock Duty

Cycle

-

* C_L= 15 pF, Input clock frequency = 25MHz

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Notice: The information in this document is subject to change without notice.

February 2007

rev 0.2

ASM3P2111B

Typical Crystal Oscillator Circuit

R1 = 510ꢀ

Crystal

C1 =18 pF

C2 = 18 pF

Typical Crystal Specifications

Fundamental AT cut parallel resonant crystal

Nominal frequency

25MHz

Frequency tolerance

Operating temperature range

Storage temperature

Load capacitance

Shunt capacitance

ESR

± 50 ppm or better at 25°C

-25°C to +85°C

-40°C to +85°C

18pF

7pF maximum

25Ω

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Notice: The information in this document is subject to change without notice.

February 2007

rev 0.2

ASM3P2111B

Package Information

8-lead (150-mil) SOIC Package

H

E

D

A2

A

C

θ

e

A1

L

B

Dimensions

Symbol

Inches

Millimeters

Min

Max

0.010

0.069

0.059

0.020

0.010

Min

0.10

1.35

1.25

0.31

0.18

Max

0.25

1.75

1.50

0.51

0.25

A1

A

0.004

0.053

0.049

0.012

0.007

A2

B

C

D

E

0.193 BSC

0.154 BSC

0.050 BSC

0.236 BSC

4.90 BSC

3.91 BSC

1.27 BSC

6.00 BSC

e

H

L

0.016

0°

0.050

8°

0.41

0°

1.27

8°

θ

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Notice: The information in this document is subject to change without notice.

February 2007

rev 0.2

ASM3P2111B

Ordering Codes

Part number

ASM3P2111BF-08ST

ASM3P2111BF-08SR

ASM3I2111BF-08ST

ASM3I2111BF-08SR

ASM3P2111BG-08ST

ASM3P2111BG-08SR

ASM3I2111BG-08ST

ASM3I2111BG-08SR

Marking

3P2111BF

3I2111BF

3P2111BG

3I2111BG

Package Configuration

8-pin SOIC TUBE, Pb Free

Temperature Range

Commercial

Industrial

8-pin SOIC TAPE & REEL, Pb Free

8-pin SOIC TUBE, Pb Free

8-pin SOIC TAPE & REEL, Pb Free

8-pin SOIC TUBE, Green

Industrial

Commercial

Industrial

8-pin SOIC TAPE & REEL, Green

8-pin SOIC TUBE, Green

8-pin SOIC TAPE & REEL, Green

Industrial

Ordering Information

A S M 3 P 2 1 1 1 B F - 0 8 S R

R = Tape & Reel, T = Tube or Tray

O = SOT

U = MSOP

E = TQFP

L = LQFP

U = MSOP

P = PDIP

S = SOIC

T = TSSOP

A = SSOP

V = TVSOP

B = BGA

D = QSOP

X = SC-70

Q = QFN

DEVICE PIN COUNT

F = LEAD FREE AND RoHS COMPLIANT PART

G = GREEN PACKAGE, LEAD FREE, and RoHS

PART NUMBER

X= Automotive

I= Industrial

P or n/c = Commercial

(0C to +70C)

(-40C to +125C) (-40C to +85C)

1 = Reserved

6 = Power Management

7 = Power Management

8 = Power Management

9 = Hi Performance

0 = Reserved

2 = Non PLL based

3 = EMI Reduction

4 = DDR support products

5 = STD Zero Delay Buffer

PulseCore Semiconductor Mixed Signal Product

Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.

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Notice: The information in this document is subject to change without notice.

February 2007

rev 0.2

ASM3P2111B

PulseCore Semiconductor Corporation

1715 S. Bascom Ave Suite 200

Campbell, CA 95008

Part Number: ASM3P2111B

Document Version: v0.2

Tel: 408-879-9077

Fax: 408-879-9018

www.pulsecoresemi.com

Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003

registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their

respective companies. PulseCore reserves the right to make changes to this document and its products at any time without

notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein

represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct

this data at any time, without notice. If the product described herein is under development, significant changes to these

specifications are possible. The information in this product data sheet is intended to be general descriptive information for

potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or

customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product

described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products

including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual

property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from

PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale.

The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights,

trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products

for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result

in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the

manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use.

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Notice: The information in this document is subject to change without notice.