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June 2006  
rev 0.1  
ASM3P2187A/B  
Spread Spectrum Clock Generator for Mobile Applications  
Features  
Product Description  
Generates a 4X EMI optimized clock signal at the  
The ASM3P2187A/B is a versatile spread spectrum  
frequency modulator designed specifically for a wide  
range of clock frequencies. The ASM3P2187A/B reduces  
electromagnetic interference (EMI) at the clock source,  
allowing system wide reduction of EMI of all clock  
dependent signals. The ASM3P2187A/B allows  
significant system cost savings by reducing the number of  
circuit board layers ferrite beads, shielding that are  
traditionally required to pass EMI regulations.  
Output.  
Input frequency : 12.5MHz to 20MHz  
Output frequency : 50MHz to 80MHz  
REFOUT is same as input frequency  
Selectable Centre Spread :  
± 0.5%, ± 1.0%  
Low power CMOS design  
3.3V ± 0.3V Operating Voltage  
Available in Industrial Temperature range  
(-40to 85°C)  
ASM3P2187A device has an option of Spread ON/OFF  
and ASM3P2187B device has Powerdown option  
Available in 8-pin TSSOP  
Drop-in replacement for MB88155-412 Device  
Applications  
The ASM3P2187A/B is targeted towards mobile phones,  
mobile audio players and PDAs.  
Block Diagram  
VDD  
SEL SSON/PDB  
PLL  
Modulation  
XIN  
Frequency  
Divider  
Crystal  
Oscillator  
ModOUT  
Output  
XOUT  
Phase  
Loop  
Filter  
VCO  
Divider  
Detector  
Feedback  
Divider  
REFOUT  
VSS  
PulseCore Semiconductor Corporation  
1715 S. Bascom Ave Suite 200, Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018  
www.pulsecoresemi.com  
Notice: The information in this document is subject to change without notice.  
June 2006  
rev 0.1  
ASM3P2187A/B  
Pin Configurations  
VDD  
8
7
XIN  
XOUT  
SSON  
SEL  
1
2
3
4
ModOUT  
ASM3P2187A  
6
5
VSS  
REFOUT  
VDD  
XIN  
XOUT  
PDB  
8
7
6
5
1
2
3
4
ModOUT  
VSS  
ASM3P2187B  
SEL  
REFOUT  
Pin Description  
Pin#  
Pin Name  
Type  
Description  
Crystal connection or external reference frequency input. This pin has dual  
1
XIN  
I
functions. It can be connected either to an external crystal or an external reference  
clock.  
Crystal connection. If using an external reference, this pin must be left  
unconnected.  
Modulation enable pin/ Power down pin. Has an Internal pull up resistor  
2
3
XOUT  
O
I
SSON / PDB*  
Modulation rate setting pin  
Centre spread, SEL = “L” : Frequency Deviation ± 0.5%  
Centre spread, SEL = “H” : Frequency Deviation ± 1.0%  
Has an Internal pull up resistor.  
4
SEL  
I
Non-modulated clock output pin. The Frequency is same as input  
5
6
7
8
REFOUT  
VSS  
O
P
O
P
frequency. This pin becomes to “L” at power-down.  
Ground Connection. Connect to system ground.  
Modulated clock output pin  
ModOUT  
VDD  
This pin becomes to“L” at power-down.  
Power Supply Voltage Pin. Connect to +3.3V.  
* SSON Pin is available in ASM3P2187A Device and PDB Pin is available in ASM3P2187B Device  
Spread Spectrum Clock Generator for Mobile Applications  
2 of 9  
Notice: The information in this document is subject to change without notice.  
June 2006  
rev 0.1  
ASM3P2187A/B  
Modulation Enable Setting Table  
SSON  
Modulation  
No Modulation  
Modulation  
L
H
Power down Status Table  
PDB  
Status  
L
Power Down Status  
H
Operating Status  
Spread Range Selection Table  
SEL  
Spreading Range  
L
± 0.50%  
H
± 1.00%  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
-0.5 to +4.6  
VSS-0.5 to VSS+0.5  
VSS-0.5 to VSS+0.5  
-55 to +125  
Unit  
V
V
VDD  
VIN  
VOUT  
TSTG  
TA  
Supply Voltage pin with respect to Ground  
Input Voltage pin with respect to Ground  
Output Voltage pin with respect to Ground  
Storage temperature  
V
°C  
°C  
°C  
°C  
Operating temperature  
-40 to +85  
260  
-40 to +125  
Ts  
TJ  
Max. Soldering Temperature (10 sec)  
Junction Temperature  
Static Discharge Voltage  
TDV  
2
KV  
(As per JEDEC STD22- A114-B)  
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect  
device reliability.  
Spread Spectrum Clock Generator for Mobile Applications  
3 of 9  
Notice: The information in this document is subject to change without notice.  
June 2006  
rev 0.1  
ASM3P2187A/B  
DC Electrical Characteristics  
( Test condition: All parameters are measured at -40°C to +85°C, 3.3V ± 0.3V , VSS =0V , unless otherwise stated)  
Symbol  
VIL  
Parameter  
Min  
Typ  
Max  
Unit  
V
Input low voltage  
Input high voltage  
Input low current  
Input high current  
VSS – 0.3  
-
-
0.8  
VIH  
2.0  
VDD+ 0.3  
V
IIL  
-
-
-
-
-
-35  
µA  
µA  
mA  
mA  
IIH  
-
+35  
IXOL  
IXOH  
XOUT output low current ( VXOL @ 0.4V, VDD = 3.3V)  
3
3
-
-
XOUT output high current ( VXOH @ 2.5V, VDD = 3.3V)  
For ModOUT, IOL = 4mA  
Output low voltage  
VOL  
VOH  
VSS  
-
-
0.4  
V
V
For REFOUT, IOL = 3mA  
For ModOUT, IOH = -4mA  
Output high voltage  
VDD-0.5  
VDD  
TBD  
For REFOUT, IOH = -3mA  
ICC  
IDD  
Dynamic supply current , TBD MHz Output, no load  
TBD  
TBD  
3.3  
mA  
uA  
V
Static supply current standby mode  
VDD  
tON  
Operating voltage  
3.3  
3.6  
Power up time (first locked clock cycle after power up)  
-
-
-
2
5
-
mS  
For ModOUT  
For REFOUT  
TBD  
TBD  
Clock output  
impedance  
ZOUT  
CIN  
-
Input Capacitance, Ta=25°C, VDD=VIN=0V, f =1MHz  
REFOUT 12.5MHz to 50MHz  
-
-
-
-
-
-
-
-
16  
15  
15  
7
pF  
CL  
Load Capacitance  
pF  
12.5MHz to 50MHz  
50MHz to 80MHz  
ModOUT  
AC Electrical Characteristics  
( Test condition: All parameters are measured at -40°C to +85°C, 3.3V ± 0.3V , VSS =0V , unless otherwise stated)  
Symbol  
Parameter  
Min  
12.5  
Typ  
-
Max  
20  
Unit  
MHz  
fIN  
Input frequency  
ModOUT  
REFOUT  
50  
-
80  
fOUT  
Output frequency  
MHz  
12.5  
-
20  
tLH*  
tHL*  
Output rise time ( Measured from 0.8V to 2.0V )  
Output fall time ( Measured from 2.0V to 0.8V )  
-
-
TBD  
TBD  
-
-
nS  
nS  
Jitter (Cycle to cycle), Ta=25°C and VDD=3.3V  
No Load Capacitance  
Output duty cycle  
tJC  
tD  
-
-
TBD  
60  
pS  
%
40  
50  
Modulation Frequency ,  
MF  
32.4  
KHz  
Input Frequency =12.5MHz  
*tLH and tHL are measured with a capacitive load of 15pF  
Spread Spectrum Clock Generator for Mobile Applications  
4 of 9  
Notice: The information in this document is subject to change without notice.  
June 2006  
rev 0.1  
ASM3P2187A/B  
OUT PUT CLOCK DUTY CYCLE (tD, tDCR = tb / ta )  
ta  
tb  
1.5V  
ModOUT,  
REFOUT  
INPUT FREQUENCY (fIN = 1/tIN )  
tin  
0.8VDD  
XIN  
CYCLE -- CYCLE JITTER (tJC = [tn -tn + 1])  
ModOUT  
tn  
tn+1  
Note: Cycle-cycle jitter indicates the difference between a certain cycle and the immediately  
succeeding (or preceding) cycle  
Spread Spectrum Clock Generator for Mobile Applications  
5 of 9  
Notice: The information in this document is subject to change without notice.  
June 2006  
rev 0.1  
ASM3P2187A/B  
Typical Crystal Oscillator Circuit  
R1 = 510  
C1 = 27 pF  
C2 =27 pF  
Typical Crystal Specifications  
Fundamental AT cut parallel resonant crystal  
Nominal frequency  
Frequency tolerance  
Operating temperature range  
Storage temperature  
Load capacitance  
14.31818MHz  
± 50 ppm or better at 25°C  
-25°C to +85°C  
-40°C to +85°C  
18pF  
Shunt capacitance  
ESR  
7pF maximum  
25  
Spread Spectrum Clock Generator for Mobile Applications  
6 of 9  
Notice: The information in this document is subject to change without notice.  
June 2006  
rev 0.1  
ASM3P2187A/B  
Package Information  
Mechanical Package Outline 8-Pin TSSOP  
H
E
D
A2  
A
C
θ
e
A1  
L
B
Dimensions  
Symbol  
Inches  
Millimeters  
Min  
Max  
Min  
Max  
A
A1  
A2  
B
0.043  
1.10  
0.002  
0.033  
0.008  
0.004  
0.114  
0.169  
0.006  
0.037  
0.012  
0.008  
0.122  
0.177  
0.05  
0.85  
0.19  
0.09  
2.90  
4.30  
0.15  
0.95  
0.30  
0.20  
3.10  
4.50  
c
D
E
e
0.026 BSC  
0.252 BSC  
0.65 BSC  
6.40 BSC  
H
L
0.020  
0°  
0.028  
8°  
0.50  
0°  
0.70  
8°  
θ
Note: Controlling dimensions are millimeters  
TSSOP – 0.034 grams unit weight  
Spread Spectrum Clock Generator for Mobile Applications  
7 of 9  
Notice: The information in this document is subject to change without notice.  
June 2006  
rev 0.1  
ASM3P2187A/B  
Ordering Codes  
Part Number  
ASM3P2187AG-08TT  
ASM3P2187AG-08TR  
ASM3I2187AG-08TT  
ASM3I2187AG-08TR  
ASM3P2187BG-08TT  
ASM3P2187BG-08TR  
ASM3I2187BG-08TT  
ASM3I2187BG-08TR  
Marking  
3P2187AG  
3P2187AG  
3I2187AG  
3I2187AG  
3P2187BG  
3P2187BG  
3I2187BG  
3I2187BG  
Package Type  
Temperature  
Commercial  
Commercial  
Industrial  
8-Pin TSSOP, TUBE, Green  
8-Pin TSSOP, TAPE & REEL, Green  
8-Pin TSSOP, TUBE, Green  
8-Pin TSSOP, TAPE & REEL, Green  
8-Pin TSSOP, TUBE, Green  
Industrial  
Commercial  
Commercial  
Industrial  
8-Pin TSSOP, TAPE & REEL, Green  
8-Pin TSSOP, TUBE, Green  
8-Pin TSSOP, TAPE & REEL, Green  
Industrial  
Device Ordering Information  
A S M 3 P 2 1 8 7 A G - 0 8 T R  
R = Tape & Reel, T = Tube or Tray  
O = SOT  
U = MSOP  
E = TQFP  
L = LQFP  
U = MSOP  
P = PDIP  
S = SOIC  
T = TSSOP  
A = SSOP  
V = TVSOP  
B = BGA  
D = QSOP  
X = SC-70  
Q = QFN  
DEVICE PIN COUNT  
F = LEAD FREE AND RoHS COMPLIANT PART  
G = GREEN PACKAGE, LEAD FREE, and RoHS  
PART NUMBER  
X= Automotive  
I= Industrial  
P or n/c = Commercial  
(0C to +70C)  
(-40C to +125C) (-40C to +85C)  
1 = Reserved  
6 = Power Management  
7 = Power Management  
8 = Power Management  
9 = Hi Performance  
0 = Reserved  
2 = Non PLL based  
3 = EMI Reduction  
4 = DDR support products  
5 = STD Zero Delay Buffer  
PulseCore Semiconductor Mixed Signal Product  
Licensed under U.S Patent Nos 5,488,627 and 5,631,921  
Spread Spectrum Clock Generator for Mobile Applications  
8 of 9  
Notice: The information in this document is subject to change without notice.  
June 2006  
rev 0.1  
ASM3P2187A/B  
PulseCore Semiconductor Corporation  
1715 S. Bascom Ave Suite 200  
Campbell, CA 95008  
Copyright © PulseCore Semiconductor  
All Rights Reserved  
Preliminary Information  
Tel: 408-879-9077  
Part Number: ASM3P2187A/B  
Document Version: v0.1  
Fax: 408-879-9018  
www.pulsecoresemi.com  
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003  
© Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or  
registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their  
respective companies. PulseCore reserves the right to make changes to this document and its products at any time without  
notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein  
represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct  
this data at any time, without notice. If the product described herein is under development, significant changes to these  
specifications are possible. The information in this product data sheet is intended to be general descriptive information for  
potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or  
customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product  
described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products  
including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual  
property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from  
PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale.  
The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights,  
trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products  
for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result  
in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the  
manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use..  
Spread Spectrum Clock Generator for Mobile Applications  
9 of 9  
Notice: The information in this document is subject to change without notice.