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November 2006  
rev 2.2  
ASM3P18S19B  
Notebook LCD Panel EMI Reduction IC  
Features  
allows significant system cost savings by reducing the  
number of circuit board layers, ferrite beads, shielding, and  
other passive components that are traditionally required to  
pass EMI regulations.  
•
•
•
FCC approved method of EMI attenuation.  
Provides up to 15dB EMI reduction.  
Generates a low EMI Spread Spectrum clock and a  
non-spread reference clock of the input frequency.  
Optimized for Frequency range from 20 to 40MHz.  
Internal loop filter minimizes external components and  
board space.  
The ASM3P18S19B modulates the output of a single PLL  
in order to “spread” the bandwidth of a synthesized clock,  
and more importantly, decreases the peak amplitudes of its  
harmonics. This results in significantly lower system EMI  
compared to the typical narrow band signal produced by  
oscillators and most frequency generators. Lowering EMI  
by increasing a signal’s bandwidth is called ‘Spread  
Spectrum Clock Generation’.  
•
•
•
•
•
•
•
Low Inherent Cycle-to-Cycle jitter.  
Two spread % selections: -1.25% to -1.75%.  
3.3V Operating Voltage.  
Low power CMOS design.  
Supports notebook VGA and other LCD timing  
controller applications.  
The ASM3P18S19B uses the most efficient and optimized  
modulation profile approved by the FCC and is  
implemented in a proprietary all digital method.  
•
•
•
•
Power Down function for mobile application.  
Available in Commercial temperature range.  
Available in 8-pin SOIC and TSSOP Packages.  
RoHS Compliant  
Applications  
Product Description  
The ASM3P18S19B is targeted towards EMI management  
for memory and LVDS interfaces in mobile graphic chipsets  
and high-speed digital applications such as PC peripheral  
devices, consumer electronics, and embedded controller  
systems.  
The ASM3P18S19B is a Versatile Spread Spectrum  
Frequency Modulator designed specifically for input clock  
frequencies from 20 to 40MHz. (Refer Input Frequency and  
Modulation Rate Table). The ASM3P18S19B reduces  
electromagnetic interference (EMI) at the clock source,  
allowing system wide reduction of EMI of down stream  
clock and data dependent signals. The ASM3P18S19B  
VDD  
Block Diagram  
SRS  
PD#  
PLL  
Modulation  
XIN/CLKIN  
XOUT  
Crystal  
Frequency  
Divider  
Oscillator  
Output  
Divider  
Phase  
Loop  
Filter  
VCO  
Detector  
Feedback  
Divider  
ModOUT  
REF  
VSS  
PulseCore Semiconductor Corporation  
1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018  
www.pulsecoresemi.com  
Notice: The information in this document is subject to change without notice.  
November 2006  
rev 2.2  
ASM3P18S19B  
Pin Configuration  
XOUT  
1
2
3
4
8
7
6
5
XIN/ CLKIN  
VSS  
VDD  
PD#  
REF  
ASM3P18S19B  
SRS  
ModOUT  
Pin Description  
Pin#  
Pin Name  
Type  
Description  
Crystal Connection or external frequency input.This pin has dual  
functions. It can be connected to either an external crystal or an external  
reference clock  
1
2
3
XIN / CLKIN  
VSS  
I
P
I
Ground Connection. Connect to system ground.  
Spread range select. Digital logic input used to select frequency deviation  
(Refer Spread Deviation Selection Table). This pin has an internal pull-up  
resistor.  
Spread spectrum clock output. (Refer Input Frequency and Modulation  
Rate Table and Spread Deviation Selection Table)  
Non-modulated Reference clock output of the input frequency.  
Power down control pin. Pull LOW to enable Power-Down mode. This pin  
has an internal pull-up resistor.  
Power Supply for the entire chip.  
Crystal Connection. Input connection for an external crystal. If using an  
external reference, this pin must be left unconnected.  
SRS  
4
5
6
7
8
ModOUT  
REF  
O
O
I
PD#  
VDD  
P
O
XOUT  
Input Frequency and Modulation Rate  
Part Number  
Input Frequency Range  
Output Frequency range  
Modulation rate  
ASM3P18S19B  
20MHz to 40MHz  
20MHz to 40MHz  
Input Frequency / 512  
Spread Deviation Selection  
Part Number  
SRS  
0
Spread Deviation  
-1.25% (DOWN)  
-1.75% (DOWN)  
ASM3P18S19B  
1
Low Power Mobile VGA EMI Reduction IC  
2 of 7  
Notice: The information in this document is subject to change without notice.  
November 2006  
rev 2.2  
ASM3P18S19B  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
-0.5 to +4.6  
-65 to +125  
0 to +70  
260  
Unit  
V
°C  
°C  
°C  
VDD, VIN  
TSTG  
TA  
Voltage on any pin with respect to Ground  
Storage temperature  
Operating temperature  
Ts  
TJ  
Max. Soldering Temperature (10 sec)  
Junction Temperature  
150  
°C  
TDV  
2
KV  
Static Discharge Voltage (As per JEDEC STD22- A114-B)  
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect  
device reliability.  
DC Electrical Characteristics  
(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated)  
Symbol  
VIL  
Parameter  
Min  
Typ  
Max  
Unit  
V
Input Low voltage  
Input High voltage  
VSS - 0.3  
-
-
0.8  
VIH  
2.0  
VDD + 0.3  
V
IIL  
Input Low current (inputs PD#, SRS)  
Input High current  
-60.0  
-
-20.0  
µA  
µA  
mA  
mA  
V
IIH  
-
-
-
1.0  
IXOL  
IXOH  
VOL  
VOH  
XOUT Output low current @ 0.4V, VDD = 3.3V  
XOUT Output high current @ 2.5V, VDD = 3.3V  
Output Low voltage VDD = 3.3V, IOL = 20mA  
Output High voltage VDD = 3.3V, IOH = 20mA  
3
3
-
-
-
-
-
0.4  
-
2.5  
-
V
Dynamic supply current normal mode  
3.3V and 25pF probe loading  
7.1  
26.9  
ICC  
-
mA  
fIN - min  
fIN - max  
IDD  
VDD  
tON  
Static supply current standby mode  
-
-
-
-
4.5  
3.3  
-
-
-
-
mA  
V
Operating Voltage  
Power up time (first locked clock cycle after power up)  
Clock Output impedance  
0.18  
50  
mS  
Ω
ZOUT  
AC Electrical Characteristics  
Symbol  
Parameter  
Min  
20  
Typ  
-
Max  
40  
Unit  
MHz  
fIN  
Input Frequency  
fOUT  
Output Frequency  
20  
-
40  
MHz  
Output Rise time  
tLH*  
tHL*  
-
-
0.66  
0.65  
-
-
nS  
nS  
Measured from 0.8V to 2.0V  
Output Fall time  
Measured from 0.8V to 2.0V  
tJC  
tD  
Jitter (Cycle to cycle)  
Output Duty cycle  
-200  
45  
-
50  
200  
55  
pS  
%
*tLH and tHL are measured into a capacitive load of 15pF  
Low Power Mobile VGA EMI Reduction IC  
3 of 7  
Notice: The information in this document is subject to change without notice.  
November 2006  
rev 2.2  
ASM3P18S19B  
Package Information  
8-lead (150-mil) SOIC Package  
Dimensions  
Millimeters  
Symbol  
Inches  
Min  
Max  
Min  
Max  
A1  
A
0.004  
0.053  
0.049  
0.012  
0.007  
0.010  
0.069  
0.059  
0.020  
0.010  
0.10  
1.35  
1.25  
0.31  
0.18  
0.25  
1.75  
1.50  
0.51  
0.25  
A2  
B
C
D
E
0.193 BSC  
0.154 BSC  
0.050 BSC  
0.236 BSC  
4.90 BSC  
3.91 BSC  
1.27 BSC  
6.00 BSC  
e
H
L
0.016  
0°  
0.050  
8°  
0.41  
0°  
1.27  
8°  
θ
Package length (Excluding end flash)D - 188 ~ 193 mils.  
Package length (Including end flash) D1 - 198 ~ 207 mils.  
Low Power Mobile VGA EMI Reduction IC  
4 of 7  
Notice: The information in this document is subject to change without notice.  
November 2006  
rev 2.2  
ASM3P18S19B  
8-lead TSSOP (4.40-MM Body)  
H
E
D
A2  
A
C
θ
e
A1  
L
B
Dimensions  
Symbol  
Inches  
Millimeters  
Min  
Max  
Min  
Max  
A
A1  
A2  
B
0.043  
0.006  
0.037  
0.012  
0.008  
0.122  
0.177  
1.10  
0.15  
0.95  
0.30  
0.20  
3.10  
4.50  
0.002  
0.033  
0.008  
0.004  
0.114  
0.169  
0.05  
0.85  
0.19  
0.09  
2.90  
4.30  
C
D
E
e
0.026 BSC  
0.252 BSC  
0.65 BSC  
6.40 BSC  
H
L
0.020  
0°  
0.028  
8°  
0.50  
0°  
0.70  
8°  
θ
Note: Controlling dimensions are millimeters  
TSSOP – 0.0325 grams unit weight  
Low Power Mobile VGA EMI Reduction IC  
5 of 7  
Notice: The information in this document is subject to change without notice.  
November 2006  
rev 2.2  
ASM3P18S19B  
Ordering Information  
Part Number  
Marking  
3P18S19BF  
Package Type  
8-Pin TSSOP, TUBE, Pb Free  
8-Pin TSSOP, TAPE & REEL , Pb Free  
8-Pin SOIC, TUBE, Pb Free  
8-Pin SOIC, TAPE & Pb Free  
8-Pin TSSOP, TUBE, Green  
8-Pin TSSOP, TAPE & REEL, Green  
8-Pin SOIC, TUBE, Green  
8-Pin SOIC, TAPE & REEL, Green  
Temperature  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
Commercial  
ASM3P18S19BF-08TT  
ASM3P18S19BF-08TR  
ASM3P18S19BF-08ST  
ASM3P18S19BF-08SR  
ASM3P18S19BG-08TT  
ASM3P18S19BG-08TR  
ASM3P18S19BG-08ST  
ASM3P18S19BG-08SR  
3P18S19BF  
3P18S19BF  
3P18S19BF  
3P18S19BG  
3P18S19BG  
3P18S19BG  
3P18S19BG  
Products are available for industrial temperature range operation. Please contact factory for more information.  
Device Ordering Information  
A S M 3 P 1 8 S 1 9 B F - 0 8 T R  
R = Tape & Reel, T = Tube or Tray  
O = SOT  
U = MSOP  
S = SOIC  
T = TSSOP  
A = SSOP  
V = TVSOP  
B = BGA  
E = TQFP  
L = LQFP  
U = MSOP  
P = PDIP  
D = QSOP  
X = SC-70  
Q = QFN  
DEVICE PIN COUNT  
F = LEAD FREE AND RoHS COMPLIANT PART  
G = GREEN PACKAGE, LEAD FREE, and RoHS  
PART NUMBER  
X= Automotive  
I= Industrial  
P or n/c = Commercial  
(0C to +70C)  
(-40C to +125C) (-40C to +85C)  
1 = Reserved  
6 = Power Management  
7 = Power Management  
8 = Power Management  
9 = Hi Performance  
0 = Reserved  
2 = Non PLL based  
3 = EMI Reduction  
4 = DDR support products  
5 = STD Zero Delay Buffer  
PulseCore Semiconductor Mixed Signal Product  
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.  
Low Power Mobile VGA EMI Reduction IC  
6 of 7  
Notice: The information in this document is subject to change without notice.  
November 2006  
rev 2.2  
ASM3P18S19B  
PulseCore Semiconductor Corporation  
1715 S. Bascom Ave Suite 200  
Campbell, CA 95008  
Copyright © PulseCOre Semiconductor  
All Rights Reserved  
Part Number: ASM3P18S19B  
Document Version: 2.2  
Tel: 408-879-9077  
Fax: 408-879-9018  
www.pulsecoresemi.com  
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003  
© Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or  
registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their  
respective companies. PulseCore reserves the right to make changes to this document and its products at any time without  
notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein  
represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct  
this data at any time, without notice. If the product described herein is under development, significant changes to these  
specifications are possible. The information in this product data sheet is intended to be general descriptive information for  
potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or  
customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product  
described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products  
including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual  
property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from  
PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale.  
The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights,  
trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products  
for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result  
in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the  
manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use.  
Low Power Mobile VGA EMI Reduction IC  
7 of 7  
Notice: The information in this document is subject to change without notice.