2 Lead Metal Package Quartz Crystal, 3 mm x 10 mm  
					39 Series  
					Pb Free Solder Reflow Profile:  
					Typical Circuit:  
					*Units are backward compatible with 240C reflow processes  
					Package Information:  
					MSL = 1  
					Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).  
					Environmental Specifications  
					Thermal Shock  
					MIL-STD-883, Method 1011, Condition A  
					MIL-STD-883, Method 1004  
					MIL-STD-883, Method 2002, Condition B  
					MIL-STD-883, Method 2007, Condition A  
					J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)  
					Pb-Free / RoHS / Green Compliant  
					JESD22-B102-D Method 2 (Preconditioning E)  
					MIL-STD-883, Method 2004, Test Condition D  
					MIL-STD-883, Method 1014, Condition C  
					Moisture Resistance  
					Mechanical Shock  
					Mechanical Vibration  
					Resistance to Soldering Heat  
					Hazardous Substance  
					Solderability  
					Terminal Strength  
					Gross Leak  
					Fine Leak  
					Solvent Resistance  
					MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s  
					MIL-STD-202, Method 215  
					Marking  
					Line 1: Frequency  
					ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com  
					06/09  
					Specifications subject to change without notice  
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