型号起始: | MTFDKC* (70) MTFDKCB* (15) MTFDKCC* (51) MTFDKCE* (4) |
所属品牌: | 不限 MICRON(70) |
功能分类: | 不限 |
品牌 | 图片 | 型号 | 描述 | 用途标签 | 供应商 | |
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MTFDKCC800TGQ-1BK1JAB
中文翻译 品牌: MICRON |
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction t | ||||
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MTFDKCC960TFR-1BC15AB
中文翻译 品牌: MICRON |
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction t | ||||
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MTFDKCC960TFR-1BC1ZAB
中文翻译 品牌: MICRON |
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction t | ||||
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MTFDKCC960TFR-1BC1ZHE
中文翻译 品牌: MICRON |
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction t | ||||
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MTFDKCC960TGP-1BK1DAB
中文翻译 品牌: MICRON |
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction t | ||||
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MTFDKCC960TGP-1BK1JAB
中文翻译 品牌: MICRON |
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction t | ||||
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MTFDKCE1T9TFR-1BC15AB
中文翻译 品牌: MICRON |
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction t | ||||
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MTFDKCE3T8TFR-1BC15AB
中文翻译 品牌: MICRON |
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction t | ||||
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MTFDKCE7T6TFR-1BC15AB
中文翻译 品牌: MICRON |
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction t | ||||
![]() |
MTFDKCE960TFR-1BC15AB
中文翻译 品牌: MICRON |
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction t |