型号起始:0510* (258) 0510-* (3) 05100* (23) 05101* (28) 05102* (30) 05103* (32) 05104* (51) 05105* (14) 05106* (32) 05108* (18) 05109* (27)
所属品牌:不限 MOLEX(243) MICROSEMI(10) WEIDMULLER(2) ETC(1) GHZTECH(1) NXP(1)
功能分类:不限 连接器(83) 集管和边缘连接器(81) 锁存器(14) 插座(6) (6) 栅极(6) 可控硅整流器(4) AK系列(1)
品牌 图片 型号 描述 用途标签 PDF 供应商
0510671400
中文翻译 品牌: MOLEX
3.50mm (.138") Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, 14Circuits
3.50毫米( 0.138 “ )间距线对线和线对板房,锁扣, 14Circuits
连接器 集管和边缘连接器
0510671500
中文翻译 品牌: MOLEX
3.50mm (.138") Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, 15Circuits
3.50毫米( 0.138 “ )间距线对线和线对板房,锁扣, 15Circuits
05106G0F
中文翻译 品牌: MICROSEMI
Silicon Controlled Rectifier
可控硅整流器
可控硅整流器
05106GOF
中文翻译 品牌: MICROSEMI
Silicon Controlled Rectifier, 80A I(T)RMS, 600V V(DRM), 600V V(RRM), 1 Element, TO-208AC, CERAMIC, TO-65, 2 PIN 栅极
05106GOFE3
中文翻译 品牌: MICROSEMI
Silicon Controlled Rectifier, 80A I(T)RMS, 600V V(DRM), 600V V(RRM), 1 Element, TO-208AC, CERAMIC, TO-65, 2 PIN 栅极
0510891005
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 10 Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,双排, 10电路
0510891205
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 12Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,双排, 12Circuits
连接器 集管和边缘连接器
0510891405
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 14Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,双排, 14Circuits
0510891605
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 16Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,双排, 16Circuits
连接器 集管和边缘连接器
0510891805
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 18Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,双排, 18Circuits
连接器 集管和边缘连接器
0510892005
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 20Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,双排, 20Circuits
0510892205
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 22 Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,双行, 22电路
0510892405
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 24Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,双排, 24Circuits
0510892605
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 26Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,双排, 26Circuits
连接器 集管和边缘连接器
0510892805
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 28Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,双排, 28Circuits
0510893005
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 30Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,双排, 30Circuits
连接器 集管和边缘连接器
0510893405
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 34Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,双排, 34Circuits
连接器 集管和边缘连接器
0510894005
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 40Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,双排, 40Circuits
0510895005
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 50Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,双排, 50Circuits
连接器 集管和边缘连接器
0510896005
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 60Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,双排, 60Circuits
05108G0F
中文翻译 品牌: MICROSEMI
Silicon Controlled Rectifier
可控硅整流器
可控硅整流器
05108GOF
中文翻译 品牌: MICROSEMI
Silicon Controlled Rectifier, 80A I(T)RMS, 800V V(DRM), 800V V(RRM), 1 Element, TO-208AC, CERAMIC, TO-65, 2 PIN 栅极
05108GOFE3
中文翻译 品牌: MICROSEMI
Silicon Controlled Rectifier, 80A I(T)RMS, 800V V(DRM), 800V V(RRM), 1 Element, TO-208AC, CERAMIC, TO-65, 2 PIN 栅极
0510900200
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Single Row, 2 Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,单列, 2个电路
0510900300
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Single Row, 3Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,单列, 3Circuits
连接器 集管和边缘连接器
0510900400
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Single Row, 4Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,单列, 4Circuits
连接器 集管和边缘连接器
0510900500
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Single Row, 5Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,单列, 5Circuits
连接器 集管和边缘连接器
0510900600
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Single Row, 6Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,单列, 6Circuits
0510900700
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Single Row, 7Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,单列, 7Circuits
0510900800
中文翻译 品牌: MOLEX
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Single Row, 8 Circuits
2.00毫米( .079 “ )间距弥II ™系统线对板压接房,单列, 8电路
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总267条记录,每页显示30条记录分9页显示。