| 品牌 | 图片 | 型号 | 描述 | 用途标签 | 供应商 | |
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0010879805
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 80 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin(Sn) P | PC | |||
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0010897060
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 6 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) P | 连接器 集管和边缘连接器 PC | ||
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0010897082
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 8 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) P | PC | ||
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0010897102
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 10 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897162
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 16 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897180
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 18 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) | 连接器 集管和边缘连接器 PC | ||
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0010897220
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 22 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897240
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897242
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) | 连接器 集管和边缘连接器 PC | ||
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0010897282
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 28 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897303
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 30 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897321
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 32 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail 2.54毫米（ |
PC | ||
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0010897322
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 32 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) | 连接器 集管和边缘连接器 PC | ||
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0010897400
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 40 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897440
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 44 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897460
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 46 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) | PC | |||
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0010897462
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 46 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897482
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 48 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897540
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 54 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897542
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 54 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897582
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 58 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897620
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 62 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) | 连接器 集管和边缘连接器 PC | ||
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0010897622
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 62 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897722
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 72 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897762
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 76 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) | PC | ||
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0010897800
中文翻译 品牌: MOLEX |
2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 80 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) | 连接器 集管和边缘连接器 PC | ||
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008283021100000K
中文翻译 品牌: KYOCERA AVX |
2.0mm间距的锡镀层连接器，有垂直嵌合和水平嵌合两种类型。插座连接器与公插针的接点采用多接点构造，防止磨耗。无须剥开绝缘线的一次结线IDC(压接)式得插座连接器，插头部分使用8283系列。电线可 | 插座 连接器 | |||
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008283021100000K+
中文翻译 品牌: KYOCERA AVX |
2.0mm间距的锡镀层连接器，有垂直嵌合和水平嵌合两种类型。插座连接器与公插针的接点采用多接点构造，防止磨耗。无须剥开绝缘线的一次结线IDC(压接)式得插座连接器，插头部分使用8283系列。电线可 | 插座 连接器 | |||
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008283021100001K+
中文翻译 品牌: KYOCERA AVX |
2.0mm间距的锡镀层连接器，有垂直嵌合和水平嵌合两种类型。插座连接器与公插针的接点采用多接点构造，防止磨耗。无须剥开绝缘线的一次结线IDC(压接)式得插座连接器，插头部分使用8283系列。电线可 | 插座 连接器 | |||
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008283021100002K+
中文翻译 品牌: KYOCERA AVX |
2.0mm间距的锡镀层连接器，有垂直嵌合和水平嵌合两种类型。插座连接器与公插针的接点采用多接点构造，防止磨耗。无须剥开绝缘线的一次结线IDC(压接)式得插座连接器，插头部分使用8283系列。电线可 | 插座 连接器 |