S-1003NB21I-M5T1U [ABLIC]

MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR;
S-1003NB21I-M5T1U
型号: S-1003NB21I-M5T1U
厂家: ABLIC    ABLIC
描述:

MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR

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中文:  中文翻译
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S-1003 Series  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING)  
HIGH-ACCURACY VOLTAGE DETECTOR  
www.ablic.com  
© ABLIC Inc., 2013  
Rev.1.0_03  
The S-1003 Series is a high-accuracy voltage detector developed using CMOS technology. The detection voltage is fixed  
internally with an accuracy of 1.0% (VDET 2.2 V). It operates with current consumption of 500 nA typ.  
The release signal can be delayed by setting a capacitor externally. Delay time accuracy is 15%.  
Moreover, since the S-1003 Series includes the manual reset function, the reset signal can be also output forcibly.  
Two output forms Nch open-drain output and CMOS output are available.  
Features  
Detection voltage:  
Detection voltage accuracy:  
1.2 V to 5.0 V (0.1 V step)  
1.0% (2.2 V  VDET 5.0 V)  
22 mV (1.2 V  VDET 2.2 V)  
500 nA typ.  
Current consumption:  
Operation voltage range:  
Hysteresis width:  
0.95 V to 10.0 V  
5% 2%  
Manual reset function:  
Delay time accuracy:  
Output form:  
MR pin logic active "L", active "H"  
15% (CD = 4.7 nF)  
Nch open-drain output (Active "L")  
CMOS output (Active "L")  
Ta = 40°C to 85°C  
Operation temperature range:  
Lead-free (Sn 100%), halogen-free  
Applications  
Power supply monitor for microcomputer and reset for CPU  
Constant voltage power supply monitor for TV, Blu-ray recorder and home appliance  
Power supply monitor for portable devices such as notebook PC, digital still camera and mobile phone  
Packages  
SOT-23-5  
SNT-6A  
1
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
Block Diagrams  
1. Nch open-drain output product (S-1003NAxxI)  
Function  
Status  
VDD  
Output logic Active "L"  
MR pin logic Active "L"  
*1  
  
Delay  
OUT  
circuit  
*1  
  
*1  
VREF  
MR  
*1  
circuit  
*1  
VSS  
MR  
CD  
*1. Parasitic diode  
Figure 1  
2. Nch open-drain output product (S-1003NBxxI)  
Function  
Status  
VDD  
Output logic Active "L"  
MR pin logic Active "H"  
*1  
  
Delay  
OUT  
circuit  
*1  
  
*1  
VREF  
MR  
*1  
circuit  
*1  
VSS  
MR  
CD  
*1. Parasitic diode  
Figure 2  
2
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
3. CMOS output product (S-1003CAxxI)  
Function  
Status  
Output logic Active "L"  
MR pin logic Active "L"  
VDD  
*1  
*1  
  
Delay  
circuit  
*1  
  
OUT  
*1  
VREF  
MR  
circuit  
*1  
*1  
VSS  
MR  
CD  
*1. Parasitic diode  
Figure 3  
4. CMOS output product (S-1003CBxxI)  
Function  
Status  
VDD  
Output logic Active "L"  
MR pin logic Active "H"  
*1  
*1  
  
Delay  
circuit  
*1  
  
OUT  
*1  
VREF  
MR  
circuit  
*1  
*1  
VSS  
MR  
CD  
*1. Parasitic diode  
Figure 4  
3
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
Product Name Structure  
Users can select the output form, MR pin logic, detection voltage value, and package type for the S-1003 Series. Refer  
to "1. Product name" regarding the contents of product name, "2. Product type list" regarding the product types,  
"3. Packages" regarding the package drawings and "4. Product name list" regarding details of product name.  
1. Product name  
S-1003  
x
x
xx  
I
-
xxxx  
U
Environmental code  
U:  
Lead-free (Sn 100%), halogen-free  
Package abbreviation and IC packing specifications*1  
M5T1: SOT-23-5, Tape  
I6T1: SNT-6A, Tape  
Operation temperature  
I:  
Ta = 40C to 85C  
Detection voltage value  
12 to 50  
(e.g., when the detection voltage is 1.2 V, it is expressed as 12.)  
MR pin logic*2  
A:  
B:  
Active "L"  
Active "H"  
Output form*2  
N:  
C:  
Nch open-drain output (Active "L")*3  
CMOS output (Active "L")*3  
*1. Refer to the tape drawing.  
*2. Refer to "2. Product type list".  
*3. If you request the product with output logic active "H", contact our sales office.  
2. Product type list  
Table 1  
Product Type  
Output Form  
MR Pin Logic  
Active "L"  
Output Logic  
Active "L"  
NA  
NB  
CA  
CB  
Nch open-drain output  
Active "H"  
Active "L"  
Active "H"  
Active "L"  
Active "L"  
Active "L"  
CMOS output  
3. Packages  
Table 2 Package Drawing Codes  
Package Name  
SOT-23-5  
Dimension  
Tape  
Reel  
Land  
MP005-A-P-SD  
PG006-A-P-SD  
MP005-A-C-SD  
PG006-A-C-SD  
MP005-A-R-SD  
PG006-A-R-SD  
SNT-6A  
PG006-A-L-SD  
4
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
4. Product name list  
4. 1 S-1003 Series NA type  
Output form: Nch open-drain output (Active "L")  
MR pin logic: Active "L"  
Table 3  
Detection Voltage  
SOT-23-5  
SNT-6A  
1.2 V 22 mV  
1.3 V 22 mV  
1.4 V 22 mV  
1.5 V 22 mV  
1.6 V 22 mV  
1.7 V 22 mV  
1.8 V 22 mV  
1.9 V 22 mV  
2.0 V 22 mV  
2.1 V 22 mV  
2.2 V 1.0%  
2.3 V 1.0%  
2.4 V 1.0%  
2.5 V 1.0%  
2.6 V 1.0%  
2.7 V 1.0%  
2.8 V 1.0%  
2.9 V 1.0%  
3.0 V 1.0%  
3.1 V 1.0%  
3.2 V 1.0%  
3.3 V 1.0%  
3.4 V 1.0%  
3.5 V 1.0%  
3.6 V 1.0%  
3.7 V 1.0%  
3.8 V 1.0%  
3.9 V 1.0%  
4.0 V 1.0%  
4.1 V 1.0%  
4.2 V 1.0%  
4.3 V 1.0%  
4.4 V 1.0%  
4.5 V 1.0%  
4.6 V 1.0%  
4.7 V 1.0%  
4.8 V 1.0%  
4.9 V 1.0%  
5.0 V 1.0%  
S-1003NA12I-M5T1U  
S-1003NA13I-M5T1U  
S-1003NA14I-M5T1U  
S-1003NA15I-M5T1U  
S-1003NA16I-M5T1U  
S-1003NA17I-M5T1U  
S-1003NA18I-M5T1U  
S-1003NA19I-M5T1U  
S-1003NA20I-M5T1U  
S-1003NA21I-M5T1U  
S-1003NA22I-M5T1U  
S-1003NA23I-M5T1U  
S-1003NA24I-M5T1U  
S-1003NA25I-M5T1U  
S-1003NA26I-M5T1U  
S-1003NA27I-M5T1U  
S-1003NA28I-M5T1U  
S-1003NA29I-M5T1U  
S-1003NA30I-M5T1U  
S-1003NA31I-M5T1U  
S-1003NA32I-M5T1U  
S-1003NA33I-M5T1U  
S-1003NA34I-M5T1U  
S-1003NA35I-M5T1U  
S-1003NA36I-M5T1U  
S-1003NA37I-M5T1U  
S-1003NA38I-M5T1U  
S-1003NA39I-M5T1U  
S-1003NA40I-M5T1U  
S-1003NA41I-M5T1U  
S-1003NA42I-M5T1U  
S-1003NA43I-M5T1U  
S-1003NA44I-M5T1U  
S-1003NA45I-M5T1U  
S-1003NA46I-M5T1U  
S-1003NA47I-M5T1U  
S-1003NA48I-M5T1U  
S-1003NA49I-M5T1U  
S-1003NA50I-M5T1U  
S-1003NA12I-I6T1U  
S-1003NA13I-I6T1U  
S-1003NA14I-I6T1U  
S-1003NA15I-I6T1U  
S-1003NA16I-I6T1U  
S-1003NA17I-I6T1U  
S-1003NA18I-I6T1U  
S-1003NA19I-I6T1U  
S-1003NA20I-I6T1U  
S-1003NA21I-I6T1U  
S-1003NA22I-I6T1U  
S-1003NA23I-I6T1U  
S-1003NA24I-I6T1U  
S-1003NA25I-I6T1U  
S-1003NA26I-I6T1U  
S-1003NA27I-I6T1U  
S-1003NA28I-I6T1U  
S-1003NA29I-I6T1U  
S-1003NA30I-I6T1U  
S-1003NA31I-I6T1U  
S-1003NA32I-I6T1U  
S-1003NA33I-I6T1U  
S-1003NA34I-I6T1U  
S-1003NA35I-I6T1U  
S-1003NA36I-I6T1U  
S-1003NA37I-I6T1U  
S-1003NA38I-I6T1U  
S-1003NA39I-I6T1U  
S-1003NA40I-I6T1U  
S-1003NA41I-I6T1U  
S-1003NA42I-I6T1U  
S-1003NA43I-I6T1U  
S-1003NA44I-I6T1U  
S-1003NA45I-I6T1U  
S-1003NA46I-I6T1U  
S-1003NA47I-I6T1U  
S-1003NA48I-I6T1U  
S-1003NA49I-I6T1U  
S-1003NA50I-I6T1U  
5
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
4. 2 S-1003 Series NB type  
Output form: Nch open-drain output (Active "L")  
MR pin logic: Active "H"  
Table 4  
Detection Voltage  
SOT-23-5  
SNT-6A  
1.2 V 22 mV  
1.3 V 22 mV  
1.4 V 22 mV  
1.5 V 22 mV  
1.6 V 22 mV  
1.7 V 22 mV  
1.8 V 22 mV  
1.9 V 22 mV  
2.0 V 22 mV  
2.1 V 22 mV  
2.2 V 1.0%  
2.3 V 1.0%  
2.4 V 1.0%  
2.5 V 1.0%  
2.6 V 1.0%  
2.7 V 1.0%  
2.8 V 1.0%  
2.9 V 1.0%  
3.0 V 1.0%  
3.1 V 1.0%  
3.2 V 1.0%  
3.3 V 1.0%  
3.4 V 1.0%  
3.5 V 1.0%  
3.6 V 1.0%  
3.7 V 1.0%  
3.8 V 1.0%  
3.9 V 1.0%  
4.0 V 1.0%  
4.1 V 1.0%  
4.2 V 1.0%  
4.3 V 1.0%  
4.4 V 1.0%  
4.5 V 1.0%  
4.6 V 1.0%  
4.7 V 1.0%  
4.8 V 1.0%  
4.9 V 1.0%  
5.0 V 1.0%  
S-1003NB12I-M5T1U  
S-1003NB13I-M5T1U  
S-1003NB14I-M5T1U  
S-1003NB15I-M5T1U  
S-1003NB16I-M5T1U  
S-1003NB17I-M5T1U  
S-1003NB18I-M5T1U  
S-1003NB19I-M5T1U  
S-1003NB20I-M5T1U  
S-1003NB21I-M5T1U  
S-1003NB22I-M5T1U  
S-1003NB23I-M5T1U  
S-1003NB24I-M5T1U  
S-1003NB25I-M5T1U  
S-1003NB26I-M5T1U  
S-1003NB27I-M5T1U  
S-1003NB28I-M5T1U  
S-1003NB29I-M5T1U  
S-1003NB30I-M5T1U  
S-1003NB31I-M5T1U  
S-1003NB32I-M5T1U  
S-1003NB33I-M5T1U  
S-1003NB34I-M5T1U  
S-1003NB35I-M5T1U  
S-1003NB36I-M5T1U  
S-1003NB37I-M5T1U  
S-1003NB38I-M5T1U  
S-1003NB39I-M5T1U  
S-1003NB40I-M5T1U  
S-1003NB41I-M5T1U  
S-1003NB42I-M5T1U  
S-1003NB43I-M5T1U  
S-1003NB44I-M5T1U  
S-1003NB45I-M5T1U  
S-1003NB46I-M5T1U  
S-1003NB47I-M5T1U  
S-1003NB48I-M5T1U  
S-1003NB49I-M5T1U  
S-1003NB50I-M5T1U  
S-1003NB12I-I6T1U  
S-1003NB13I-I6T1U  
S-1003NB14I-I6T1U  
S-1003NB15I-I6T1U  
S-1003NB16I-I6T1U  
S-1003NB17I-I6T1U  
S-1003NB18I-I6T1U  
S-1003NB19I-I6T1U  
S-1003NB20I-I6T1U  
S-1003NB21I-I6T1U  
S-1003NB22I-I6T1U  
S-1003NB23I-I6T1U  
S-1003NB24I-I6T1U  
S-1003NB25I-I6T1U  
S-1003NB26I-I6T1U  
S-1003NB27I-I6T1U  
S-1003NB28I-I6T1U  
S-1003NB29I-I6T1U  
S-1003NB30I-I6T1U  
S-1003NB31I-I6T1U  
S-1003NB32I-I6T1U  
S-1003NB33I-I6T1U  
S-1003NB34I-I6T1U  
S-1003NB35I-I6T1U  
S-1003NB36I-I6T1U  
S-1003NB37I-I6T1U  
S-1003NB38I-I6T1U  
S-1003NB39I-I6T1U  
S-1003NB40I-I6T1U  
S-1003NB41I-I6T1U  
S-1003NB42I-I6T1U  
S-1003NB43I-I6T1U  
S-1003NB44I-I6T1U  
S-1003NB45I-I6T1U  
S-1003NB46I-I6T1U  
S-1003NB47I-I6T1U  
S-1003NB48I-I6T1U  
S-1003NB49I-I6T1U  
S-1003NB50I-I6T1U  
6
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
4. 3 S-1003 Series CA type  
Output form: CMOS output (Active "L")  
MR pin logic: Active "L"  
Table 5  
Detection Voltage  
SOT-23-5  
SNT-6A  
1.2 V 22 mV  
1.3 V 22 mV  
1.4 V 22 mV  
1.5 V 22 mV  
1.6 V 22 mV  
1.7 V 22 mV  
1.8 V 22 mV  
1.9 V 22 mV  
2.0 V 22 mV  
2.1 V 22 mV  
2.2 V 1.0%  
2.3 V 1.0%  
2.4 V 1.0%  
2.5 V 1.0%  
2.6 V 1.0%  
2.7 V 1.0%  
2.8 V 1.0%  
2.9 V 1.0%  
3.0 V 1.0%  
3.1 V 1.0%  
3.2 V 1.0%  
3.3 V 1.0%  
3.4 V 1.0%  
3.5 V 1.0%  
3.6 V 1.0%  
3.7 V 1.0%  
3.8 V 1.0%  
3.9 V 1.0%  
4.0 V 1.0%  
4.1 V 1.0%  
4.2 V 1.0%  
4.3 V 1.0%  
4.4 V 1.0%  
4.5 V 1.0%  
4.6 V 1.0%  
4.7 V 1.0%  
4.8 V 1.0%  
4.9 V 1.0%  
5.0 V 1.0%  
S-1003CA12I-M5T1U  
S-1003CA13I-M5T1U  
S-1003CA14I-M5T1U  
S-1003CA15I-M5T1U  
S-1003CA16I-M5T1U  
S-1003CA17I-M5T1U  
S-1003CA18I-M5T1U  
S-1003CA19I-M5T1U  
S-1003CA20I-M5T1U  
S-1003CA21I-M5T1U  
S-1003CA22I-M5T1U  
S-1003CA23I-M5T1U  
S-1003CA24I-M5T1U  
S-1003CA25I-M5T1U  
S-1003CA26I-M5T1U  
S-1003CA27I-M5T1U  
S-1003CA28I-M5T1U  
S-1003CA29I-M5T1U  
S-1003CA30I-M5T1U  
S-1003CA31I-M5T1U  
S-1003CA32I-M5T1U  
S-1003CA33I-M5T1U  
S-1003CA34I-M5T1U  
S-1003CA35I-M5T1U  
S-1003CA36I-M5T1U  
S-1003CA37I-M5T1U  
S-1003CA38I-M5T1U  
S-1003CA39I-M5T1U  
S-1003CA40I-M5T1U  
S-1003CA41I-M5T1U  
S-1003CA42I-M5T1U  
S-1003CA43I-M5T1U  
S-1003CA44I-M5T1U  
S-1003CA45I-M5T1U  
S-1003CA46I-M5T1U  
S-1003CA47I-M5T1U  
S-1003CA48I-M5T1U  
S-1003CA49I-M5T1U  
S-1003CA50I-M5T1U  
S-1003CA12I-I6T1U  
S-1003CA13I-I6T1U  
S-1003CA14I-I6T1U  
S-1003CA15I-I6T1U  
S-1003CA16I-I6T1U  
S-1003CA17I-I6T1U  
S-1003CA18I-I6T1U  
S-1003CA19I-I6T1U  
S-1003CA20I-I6T1U  
S-1003CA21I-I6T1U  
S-1003CA22I-I6T1U  
S-1003CA23I-I6T1U  
S-1003CA24I-I6T1U  
S-1003CA25I-I6T1U  
S-1003CA26I-I6T1U  
S-1003CA27I-I6T1U  
S-1003CA28I-I6T1U  
S-1003CA29I-I6T1U  
S-1003CA30I-I6T1U  
S-1003CA31I-I6T1U  
S-1003CA32I-I6T1U  
S-1003CA33I-I6T1U  
S-1003CA34I-I6T1U  
S-1003CA35I-I6T1U  
S-1003CA36I-I6T1U  
S-1003CA37I-I6T1U  
S-1003CA38I-I6T1U  
S-1003CA39I-I6T1U  
S-1003CA40I-I6T1U  
S-1003CA41I-I6T1U  
S-1003CA42I-I6T1U  
S-1003CA43I-I6T1U  
S-1003CA44I-I6T1U  
S-1003CA45I-I6T1U  
S-1003CA46I-I6T1U  
S-1003CA47I-I6T1U  
S-1003CA48I-I6T1U  
S-1003CA49I-I6T1U  
S-1003CA50I-I6T1U  
7
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
4. 4 S-1003 Series CB type  
Output form: CMOS output (Active "L")  
MR pin logic: Active "H"  
Table 6  
Detection Voltage  
SOT-23-5  
SNT-6A  
1.2 V 22 mV  
1.3 V 22 mV  
1.4 V 22 mV  
1.5 V 22 mV  
1.6 V 22 mV  
1.7 V 22 mV  
1.8 V 22 mV  
1.9 V 22 mV  
2.0 V 22 mV  
2.1 V 22 mV  
2.2 V 1.0%  
2.3 V 1.0%  
2.4 V 1.0%  
2.5 V 1.0%  
2.6 V 1.0%  
2.7 V 1.0%  
2.8 V 1.0%  
2.9 V 1.0%  
3.0 V 1.0%  
3.1 V 1.0%  
3.2 V 1.0%  
3.3 V 1.0%  
3.4 V 1.0%  
3.5 V 1.0%  
3.6 V 1.0%  
3.7 V 1.0%  
3.8 V 1.0%  
3.9 V 1.0%  
4.0 V 1.0%  
4.1 V 1.0%  
4.2 V 1.0%  
4.3 V 1.0%  
4.4 V 1.0%  
4.5 V 1.0%  
4.6 V 1.0%  
4.7 V 1.0%  
4.8 V 1.0%  
4.9 V 1.0%  
5.0 V 1.0%  
S-1003CB12I-M5T1U  
S-1003CB13I-M5T1U  
S-1003CB14I-M5T1U  
S-1003CB15I-M5T1U  
S-1003CB16I-M5T1U  
S-1003CB17I-M5T1U  
S-1003CB18I-M5T1U  
S-1003CB19I-M5T1U  
S-1003CB20I-M5T1U  
S-1003CB21I-M5T1U  
S-1003CB22I-M5T1U  
S-1003CB23I-M5T1U  
S-1003CB24I-M5T1U  
S-1003CB25I-M5T1U  
S-1003CB26I-M5T1U  
S-1003CB27I-M5T1U  
S-1003CB28I-M5T1U  
S-1003CB29I-M5T1U  
S-1003CB30I-M5T1U  
S-1003CB31I-M5T1U  
S-1003CB32I-M5T1U  
S-1003CB33I-M5T1U  
S-1003CB34I-M5T1U  
S-1003CB35I-M5T1U  
S-1003CB36I-M5T1U  
S-1003CB37I-M5T1U  
S-1003CB38I-M5T1U  
S-1003CB39I-M5T1U  
S-1003CB40I-M5T1U  
S-1003CB41I-M5T1U  
S-1003CB42I-M5T1U  
S-1003CB43I-M5T1U  
S-1003CB44I-M5T1U  
S-1003CB45I-M5T1U  
S-1003CB46I-M5T1U  
S-1003CB47I-M5T1U  
S-1003CB48I-M5T1U  
S-1003CB49I-M5T1U  
S-1003CB50I-M5T1U  
S-1003CB12I-I6T1U  
S-1003CB13I-I6T1U  
S-1003CB14I-I6T1U  
S-1003CB15I-I6T1U  
S-1003CB16I-I6T1U  
S-1003CB17I-I6T1U  
S-1003CB18I-I6T1U  
S-1003CB19I-I6T1U  
S-1003CB20I-I6T1U  
S-1003CB21I-I6T1U  
S-1003CB22I-I6T1U  
S-1003CB23I-I6T1U  
S-1003CB24I-I6T1U  
S-1003CB25I-I6T1U  
S-1003CB26I-I6T1U  
S-1003CB27I-I6T1U  
S-1003CB28I-I6T1U  
S-1003CB29I-I6T1U  
S-1003CB30I-I6T1U  
S-1003CB31I-I6T1U  
S-1003CB32I-I6T1U  
S-1003CB33I-I6T1U  
S-1003CB34I-I6T1U  
S-1003CB35I-I6T1U  
S-1003CB36I-I6T1U  
S-1003CB37I-I6T1U  
S-1003CB38I-I6T1U  
S-1003CB39I-I6T1U  
S-1003CB40I-I6T1U  
S-1003CB41I-I6T1U  
S-1003CB42I-I6T1U  
S-1003CB43I-I6T1U  
S-1003CB44I-I6T1U  
S-1003CB45I-I6T1U  
S-1003CB46I-I6T1U  
S-1003CB47I-I6T1U  
S-1003CB48I-I6T1U  
S-1003CB49I-I6T1U  
S-1003CB50I-I6T1U  
8
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
Pin Configurations  
1. SOT-23-5  
Table 7  
Top view  
Pin No.  
Symbol  
Description  
5
4
1
2
3
4
5
CD  
Connection pin for delay capacitor  
GND pin  
VSS  
MR  
Manual reset pin  
OUT  
VDD  
Voltage detection output pin  
Voltage input pin  
1
2
3
Figure 5  
2. SNT-6A  
Table 8  
Top view  
Pin No.  
Symbol  
Description  
Connection pin for delay capacitor  
Voltage input pin  
1
2
3
6
5
4
1
2
3
4
5
6
CD  
VDD  
OUT  
MR  
NC*1  
VSS  
Voltage detection output pin  
Manual reset pin  
Figure 6  
No connection  
GND pin  
*1. The NC pin is electrically open.  
The NC pin can be connected to the VDD pin or the VSS pin.  
9
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
Absolute Maximum Ratings  
Table 9  
(Ta = 25°C unless otherwise specified)  
Item  
Power supply voltage  
CD pin input voltage  
Symbol  
Absolute Maximum Rating  
12.0  
Unit  
V
VDDVSS  
VCD  
VSS0.3 to VDD 0.3  
VSS0.3 to VDD 0.3  
VSS0.3 to 12.0  
VSS0.3 to VDD 0.3  
50  
V
MR pin input voltage  
VMR  
V
Nch open-drain output product  
V
Output voltage  
Output current  
Power dissipation  
VOUT  
IOUT  
PD  
CMOS output product  
V
mA  
mW  
mW  
°C  
°C  
SOT-23-5  
SNT-6A  
600*1  
400*1  
Operation ambient temperature  
Storage temperature  
Topr  
Tstg  
40 to 85  
40 to 125  
*1. When mounted on board  
[Mounted board]  
(1) Board size: 114.3 mm 76.2 mm t1.6 mm  
(2) Name: JEDEC STANDARD51-7  
Caution The absolute maximum ratings are rated values exceeding which the product could suffer  
physical damage. These values must therefore not be exceeded under any conditions.  
700  
600  
500  
SOT-23-5  
400  
300  
SNT-6A  
200  
100  
0
100  
150  
50  
0
Ambient Temperature (Ta) [C]  
Figure 7 Power Dissipation of Package (When Mounted on Board)  
10  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
Electrical Characteristics  
1. Nch open-drain output product  
Table 10  
(Ta = 25°C unless otherwise specified)  
Test  
Circuit  
Item  
Symbol  
Condition  
1.2 V  VDET 2.2 V  
Min.  
Typ.  
Max.  
Unit  
V
VDET(S)  
0.022  
VDET(S)  
0.99  
VDET  
0.03  
VDET(S)  
0.022  
VDET(S)  
1.01  
VDET  
0.07  
0.90  
10.0  
VDET(S)  
VDET(S)  
1
Detection voltage*1  
Hysteresis width  
VDET  
2.2 V  VDET 5.0 V  
V
1
1
VDET  
0.05  
0.50  
1.00  
1.33  
2.39  
2.50  
VHYS  
V
Current consumption ISS  
VDD = VDET(S) 1.0 V  
A  
V
2
1
3
3
3
3
Operation voltage  
Output current  
VDD  
0.95  
V
DD = 0.95 V  
0.59  
mA  
mA  
mA  
mA  
Output transistor  
Nch  
VDD = 1.2 V  
VDD = 2.4 V  
VDD = 4.8 V  
0.73  
IOUT  
VDS*2 = 0.5 V  
MR pin active  
1.47  
1.86  
Output transistor  
Nch  
Leakage current  
ILEAK  
0.08  
11.5  
A  
3
V
DD = 10.0 V, VOUT = 10.0 V  
MR pin non-active  
CD = 4.7 nF  
Delay time*3  
tD  
8.5  
10.0  
ms  
4
1
Detection voltage  
temperature  
coefficient*4  
VDET  
Ta  VDET  
Ta = 40°C to 85°C  
100  
350 ppm/°C  
NA type  
(MR pin logic active "L")  
NB type  
(MR pin logic active "H")  
NA type  
(MR pin logic active "L")  
NB type  
VDD  
0.3  
  
  
  
  
V
V
6
6
6
6
6
MR pin  
input voltage "H"  
VMRH  
1.2  
  
VDD  
1.2  
  
V
MR pin  
input voltage "L"  
VMRL  
  
  
0.3  
1.6  
V
(MR pin logic active "H")  
MR pin  
input resistance  
RMR  
0.5  
1.0  
M  
*1. VDET: Actual detection voltage value, VDET(S): Set detection voltage value (the center value of the detection voltage  
range in Table 3 or Table 4.)  
*2.  
VDS: Drain-to-source voltage of the output transistor  
*3. The time period from when the pulse voltage of 0.95 V  VDET(S)1.0 V is applied to the VDD pin to when VOUT  
reaches VDD 0.9, after the output pin is pulled up to VDD by the resistance of 100 k  
*4. The temperature change of the detection voltage [mV/°C] is calculated by using the following equation.  
  VDET  
Ta  
  VDET  
Ta  VDET  
mV/°C *1 = VDET(S) (typ.) V *2   
ppm/°C *3 1000  
]
[
]
[ ]  
[
*1. Temperature change of the detection voltage  
*2. Set detection voltage  
*3. Detection voltage temperature coefficient  
11  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
2. CMOS output product  
Table 11  
(Ta = 25°C unless otherwise specified)  
Test  
Circuit  
Item  
Symbol  
Condition  
1.2 V  VDET 2.2 V  
Min.  
Typ.  
Max.  
Unit  
V
VDET(S)  
0.022  
VDET(S)  
0.99  
VDET  
0.03  
VDET(S)  
0.022  
VDET(S)  
1.01  
VDET  
0.07  
0.90  
10.0  
VDET(S)  
VDET(S)  
1
Detection voltage*1  
Hysteresis width  
VDET  
2.2 V  VDET 5.0 V  
V
1
1
VDET  
0.05  
0.50  
1.00  
1.33  
2.39  
2.50  
VHYS  
V
Current consumption ISS  
VDD = VDET(S) 1.0 V  
A  
V
2
1
3
3
3
3
Operation voltage  
VDD  
0.95  
V
DD = 0.95 V  
0.59  
mA  
mA  
mA  
mA  
Output transistor  
Nch  
VDD = 1.2 V  
0.73  
VDS*2 = 0.5 V  
MR pin active  
VDD = 2.4 V  
1.47  
VDD = 4.8 V  
1.86  
Output current  
IOUT  
VDD = 4.8 V  
S-1003Cx12 to 43  
Output transistor  
Pch  
1.62  
2.60  
mA  
5
VDS*2 = 0.5 V  
VDD = 6.0 V  
1.78  
8.5  
2.86  
10.0  
  
mA  
ms  
5
4
Delay time*3  
tD  
CD = 4.7 nF  
11.5  
Detection voltage  
temperature  
coefficient*4  
VDET  
Ta  VDET  
Ta = 40°C to 85°C  
CA type  
(MR pin logic active "L")  
CB type  
(MR pin logic active "H")  
CA type  
(MR pin logic active "L")  
CB type  
100  
350 ppm/°C  
1
VDD  
0.3  
  
  
  
  
V
V
6
6
6
6
6
MR pin  
input voltage "H"  
VMRH  
1.2  
  
VDD  
1.2  
  
V
MR pin  
input voltage "L"  
VMRL  
  
  
0.3  
1.6  
V
(MR pin logic active "H")  
MR pin  
input resistance  
RMR  
0.5  
1.0  
M  
*1. VDET: Actual detection voltage value, VDET(S): Set detection voltage value (the center value of the detection voltage  
range in Table 5 or Table 6.)  
*2.  
VDS: Drain-to-source voltage of the output transistor  
*3. The time period from when the pulse voltage of 0.95 V  VDET(S)1.0 V is applied to the VDD pin to when VOUT  
reaches VDD 0.9.  
*4. The temperature change of the detection voltage [mV/°C] is calculated by using the following equation.  
  VDET  
Ta  
  VDET  
Ta  VDET  
mV/°C *1 = VDET(S) (typ.) V *2   
ppm/°C *3 1000  
]
[
]
[ ]  
[
*1. Temperature change of the detection voltage  
*2. Set detection voltage  
*3. Detection voltage temperature coefficient  
12  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
Test Circuits  
A
R*1  
100 k  
VDD  
VDD  
  
VDD  
VDD  
OUT  
CD  
V
MR  
VSS  
OUT  
CD  
MR  
*2  
V
*1  
VSS  
*1. R is unnecessary for CMOS output product.  
*2. Set to VDD or GND (MR pin non-active).  
*1. Set to VDD or GND (MR pin non-active).  
Figure 8 Test Circuit 1  
Figure 9 Test Circuit 2  
Oscilloscope  
R*1  
100 k  
VDD  
VDD  
VDD  
  
MR  
OUT  
CD  
P.G.  
OUT  
CD  
MR  
V
A
VDS  
  
*2  
VOUT  
VSS  
VSS  
*1  
V
CD  
*1. Set to VDD or GND.  
*1. R is unnecessary for CMOS output product.  
*2. Set to VDD or GND (MR pin non-active).  
Figure 10 Test Circuit 3  
Figure 11 Test Circuit 4  
VDS  
  
R*1  
V
VDD  
MR  
VSS  
100 k  
VDD  
VDD  
VDD  
  
V
OUT  
CD  
A
OUT  
CD  
A
MR  
VMR  
VSS  
*1  
V
V
*1. Set to VDD or GND (MR pin non-active).  
*1. R is unnecessary for CMOS output product.  
Figure 12 Test Circuit 5  
Figure 13 Test Circuit 6  
13  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
Timing Charts  
1. Nch open-drain output product  
VDD  
Release voltage (VDET  
)
Hysteresis width  
Detection voltage (VDET  
)
(VHYS  
)
Minimum operation voltage  
VSS  
R
VDD  
MR  
100 k  
VDD  
OUT  
*1 VSS CD  
VDD  
  
V
Output from OUT pin  
VSS  
*1. Set to VDD or GND (MR pin non-active).  
tD  
Figure 14  
2. CMOS output product  
VDD  
Release voltage (VDET  
Detection voltage (VDET  
)
Hysteresis width  
)
(VHYS  
)
Minimum operation voltage  
VSS  
VDD  
MR  
VDD  
OUT  
VSS CD  
*1  
  
V
VDD  
Output from OUT pin  
*1. Set to VDD or GND (MR pin non-active).  
VSS  
tD  
Remark When VDD is the minimum operation voltage or less, the output voltage from the OUT pin is indefinite  
in the shaded area.  
Figure 15  
14  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
Operation  
1. Basic operation: CMOS output (active "L") product  
(1)  
When the power supply voltage (VDD) is the release voltage (VDET) or more, the Nch transistor is OFF and  
the Pch transistor is ON to output VDD ("H"). Since the Nch transistor N1 in Figure 16 is OFF, the comparator  
(RB RC ) VDD  
RA RB RC  
input voltage is  
.
(2)  
Although VDD decreases to VDET or less, VDD is output when VDD is higher than the detection voltage (VDET).  
When VDD decreases to VDET or less (point A in Figure 17), the Nch transistor is ON and the Pch transistor  
is OFF so that VSS ("L") is output. At this time, the Nch transistor N1 in Figure 16 is turned on, and the input  
RB VDD  
voltage to the comparator is  
.
RA RB  
The output is indefinite by decreasing VDD to the IC's minimum operation voltage or less. If the output is  
pulled up, it will be VDD  
VSS is output by increasing VDD to the minimum operation voltage or more. Although VDD exceeds VDET and  
VDD is less than VDET, the output is VSS  
(3)  
(4)  
(5)  
.
.
When increasing VDD to VDET or more (point B in Figure 17), the Nch transistor is OFF and the Pch  
transistor is ON so that VDD is output. At this time, VDD is output from the OUT pin after the passage of the  
delay time (tD).  
VDD  
*1  
*1  
Pch  
RA  
  
  
Delay  
circuit  
OUT  
*1  
*1  
RB  
RC  
Nch  
VREF  
MR  
circuit  
*1  
*1  
N1  
VSS  
MR  
CD  
CD  
*1. Parasitic diode  
Figure 16 Operation 1  
(2) (3)  
(4)  
B
(5)  
VDD  
Release voltage (VDET  
Detection voltage (VDET  
(1)  
)
A
Hysteresis width  
(VHYS  
)
)
Minimum operation voltage  
VSS  
VDD  
Output from OUT pin  
VSS  
tD  
Remark When VDD is the minimum operation voltage or less, the output voltage from the OUT pin is indefinite  
in the shaded area.  
Figure 17 Operation 2  
15  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
2. Manual reset function  
The OUT pin voltage can be changed to detection status forcibly by the MR pin input voltage (VMR).  
When not using the manual reset function, set VMR = VDD in the S-1003 Series xA type, and VMR = VSS in the  
S-1003 Series xB type.  
Caution Perform thorough evaluation in the actual application when using the MR pin in open. Due to the  
parasitic capacitance of the MR pin, the manual reset function may malfunction when the power supply  
fluctuates.  
2. 1 S-1003 Series xA type (MR pin logic active "L")  
(1) MR pin = "L"  
When the VDD pin voltage is the release voltage (VDET) or more, the OUT pin changes to the detection status  
from the release status immediately if a voltage of the MR pin input voltage "L" (VMRL) or less is applied to the  
MR pin.  
(2) MR pin = "H"  
If a voltage of the MR pin input voltage "H" (VMRH) or more is applied to the MR pin, output from the OUT pin is  
determined to be "H" or "L" depending on the VDD pin voltage.  
After the passage of the delay time (tD), the OUT pin changes to the release status from the detection status.  
(1)  
(2)  
Input from VDD pin  
Input from MR pin  
VDD (VDET)  
MR pin input voltage "H" (VMRH  
)
MR pin input voltage "L" (VMRL  
)
VDD  
Output from OUT pin  
VSS  
tD  
Figure 18 Timing Chart of MR Pin Logic Active "L"  
Remark Since the MR pin is pulled up to the VDD pin internally, output from the OUT pin is determined to be "H" or "L" in  
the floating status depending on the VDD pin voltage (Refer to Figure 19).  
VDD  
*1  
RMR  
MR  
*1  
VSS  
*1. Parasitic diode  
Figure 19  
16  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
2. 2 S-1003 Series xB type (MR pin logic active "H")  
(1) MR pin = "H"  
When the VDD pin voltage is the release voltage (VDET) or more, the OUT pin changes to the detection status  
from the release status immediately if a voltage of the MR pin input voltage "H" (VMRH) or more is applied to the  
MR pin.  
(2) MR pin = "L"  
If a voltage of the MR pin input voltage "L" (VMRL) or less is applied to the MR pin, output from the OUT pin is  
determined to be "H" or "L" depending on the VDD pin voltage.  
After the passage of the delay time (tD), the OUT pin changes to the release status from the detection status.  
(1)  
(2)  
Input from VDD pin  
Input from MR pin  
VDD (VDET)  
MR pin input voltage "H" (VMRH  
)
MR pin input voltage "L" (VMRL  
)
VDD  
Output from OUT pin  
VSS  
tD  
Figure 20 Timing Chart of MR Pin Logic Active "H"  
Remark Since the MR pin is pulled down to the VSS pin internally, output from the OUT pin is determined to be "H" or  
"L" in the floating status depending on the VDD pin voltage (Refer to Figure 21).  
VDD  
*1  
MR  
*1  
RMR  
VSS  
*1. Parasitic diode  
Figure 21  
17  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
2. 3 Cautions of manual reset function  
2. 3. 1 Slew rate when switching manual reset function  
Although there is a hysteresis width between the MR pin input voltage "L" (VMRL) and the MR pin input voltage "H"  
(VMRH), note that the IC may malfunction if the slew rate (Refer to Figure 22, Figure 23) is low when the MR pin  
voltage is changed.  
The slew rate is calculated by using the following equation.  
VMRH VMRL  
Slew rate =  
t  
(1) When MR pin logic is active "L"  
The OUT pin voltage may oscillate if the parasitic resistance (RP) between the power supply and the VDD pin is  
high.  
In case of RP 8 k  
Connect a capacitor of 1 nF or more between the VDD pin and the VSS pin.  
In case of 5 k  RP 8 kCapacitors are unnecessary if the slew rate is 100 V/s or higher.  
In case of RP 5 k  
Capacitors are unnecessary if the slew rate is 1 V/s or higher.  
VMR  
VMRH  
VMRL  
Time  
t  
Figure 22  
(2) When MR pin logic is active "H"  
Connect a capacitor of 100 pF or more to the CD pin, and set the slew rate 20 V/s or higher.  
VMR  
VMRH  
VMRL  
Time  
t  
Figure 23  
18  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
2. 4 When connecting resistance (RA) between power supply voltage (VDD) and VDD pin  
When the MR pin voltage (VMR) is an intermediate voltage (especially VMRLVMRVMRH), the current consumption  
increases by 25 A max. A voltage drop occurs since this current flows through RA. If the VDD pin voltage (VIN)  
becomes the detection voltage (VDET) or less for that reason, the OUT pin changes to the detection status, and the  
detection status or the release status are not controlled by VMR. The OUT pin may not be able to change to the  
release status unless VDD is raised (Refer to Figure 24).  
(1) When MR pin logic is active "L"  
In case of VIN VMR, a current also flows through the MR pin input resistance (RMR). For example, when VIN  
=
10 V, VMR = 1 V, RMR = 0.5 M (min.), a current of 18 A flows from the VDD pin to the MR pin. Therefore, set  
RA so as to satisfy the following equation.  
RA (VDD (VDET)) / (25 AMR pin current)  
(2) When MR pin logic is active "H"  
Set RA so as to satisfy the following equation.  
RA (VDD (VDET)) / 25 A  
VDD  
RA  
VIN  
VDD  
OUT  
MR  
VSS  
CD  
VMR  
(Nch open-drain output product)  
GND  
Figure 24  
19  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
3. Delay circuit  
The delay circuit delays the output signal to the OUT pin from the time at which the power supply voltage (VDD  
)
exceeds the release voltage (VDET) when VDD is turned on. The output signal is not delayed when VDD decreases  
to the detection voltage (VDET) or less (refer to "Figure 17 Operation 2").  
The delay time (tD) is determined by the time constant of the built-in constant current (approx. 100 nA) and the  
attached delay capacitor (CD), or the delay time (tD0) when the CD pin is open, and calculated from the following  
equation. When the CD value is sufficiently large, the tD0 value can be disregarded.  
tD [ms] = Delay coefficient CD [nF] tD0 [ms]  
Table 12 Delay Coefficient  
Delay Coefficient  
Operation  
Temperature  
Min.  
1.60  
1.78  
2.01  
Typ.  
1.89  
2.05  
2.31  
Max.  
2.13  
2.30  
2.71  
Ta = 85°C  
Ta = 25°C  
Ta = 40°C  
Table 13 Delay Time  
Delay Time (tD0)  
Typ.  
0.044 ms  
Operation Temperature  
Min.  
Max.  
0.147 ms  
Ta = 40°C to 85°C  
0.021 ms  
Caution 1. When the CD pin is open, a double pulse shown in Figure 25 may appear at release.  
To avoid the double pulse, attach a 100 pF or larger capacitor to the CD pin. Do not apply  
voltage to the CD pin from the exterior.  
VOUT  
Time  
Figure 25  
2. Mounted board layout should be made in such a way that no current flows into or flows from  
the CD pin since the impedance of the CD pin is high, otherwise correct delay time cannot be  
provided.  
3. There is no limit for the capacitance of CD as long as the leakage current of the capacitor can  
be ignored against the built-in constant current value. Leakage current causes deviation in  
delay time. When the leakage current is larger than the built-in constant current, no release  
takes place.  
20  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
4. Other characteristics  
4. 1 Temperature characteristics of detection voltage  
The shaded area in Figure 26 shows the temperature characteristics of detection voltage in the operation  
temperature range.  
VDET [V]  
0.945 mV/°C  
*1  
VDET25  
0.945 mV/°C  
40  
25  
85  
Ta [°C]  
*1. VDET25 is an actual detection voltage value at Ta = 25°C.  
Figure 26 Temperature Characteristics of Detection Voltage (Example for VDET = 2.7 V)  
4. 2 Temperature characteristics of release voltage  
  VDET  
Ta  
The temperature change  
of the release voltage is calculated by using the temperature change  
  VDET  
Ta  
of the detection voltage as follows:  
  VDET  
Ta  
VDET  
VDET  
  VDET  
Ta  
=
The temperature change of the release voltage and the detection voltage has the same sign consequently.  
4. 3 Temperature characteristics of hysteresis voltage  
  VDET  
Ta  
  VDET  
Ta  
The temperature change of the hysteresis voltage is expressed as  
follows:  
and is calculated as  
  VDET  
Ta  
  VDET  
Ta  
VHYS  
VDET  
  VDET  
Ta  
=
21  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
Standard Circuit  
R*1  
100 k  
VDD  
MR  
OUT  
CD  
VSS  
*2  
CD  
*1. R is unnecessary for CMOS output product.  
*2. The delay capacitor (CD) should be connected directly to the CD pin and the VSS pin.  
Figure 27  
Caution The above connection diagram and constant will not guarantee successful operation.  
Perform thorough evaluation using the actual application to set the constant.  
22  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
Explanation of Terms  
1. Detection voltage (VDET  
)
The detection voltage is a voltage at which the output in Figure 30 turns to "L". The detection voltage varies slightly  
among products of the same specification. The variation of detection voltage between the specified minimum  
(VDET min.) and the maximum (VDET max.) is called the detection voltage range (Refer to Figure 28).  
Example: In the S-1003Cx15, the detection voltage is either one in the range of 1.478 V  VDET 1.522 V.  
This means that some S-1003Cx15 have VDET = 1.478 V and some have VDET = 1.522 V.  
2. Release voltage (VDET  
)
The release voltage is a voltage at which the output in Figure 30 turns to "H". The release voltage varies slightly  
among products of the same specification. The variation of release voltage between the specified minimum (VDET  
min.) and the maximum (VDET max.) is called the release voltage range (Refer to Figure 29). The range is  
calculated from the actual detection voltage (VDET) of a product and is in the range of VDET 1.03  VDET  VDET  
1.07.  
Example: For the S-1003Cx15, the release voltage is either one in the range of 1.522 V  VDET 1.629 V.  
This means that some S-1003Cx15 have VDET = 1.522 V and some have VDET = 1.629 V.  
VDD  
VDD  
Release voltage  
Detection voltage  
VDET max.  
VDET min.  
VDET max.  
VDET min.  
Release voltage  
range  
Detection voltage  
range  
OUT  
OUT  
tD  
Figure 28 Detection Voltage  
Figure 29 Release Voltage  
R*1  
100 k  
VDD  
VDD  
  
OUT  
CD  
V
MR  
VSS  
*2  
V
*1. R is unnecessary for CMOS output product.  
*2. Set to VDD or GND (MR pin non-active).  
Figure 30 Test Circuit of Detection Voltage and Release Voltage  
23  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
3. Hysteresis width (VHYS  
)
The hysteresis width is the voltage difference between the detection voltage and the release voltage (the voltage at  
point B the voltage at point A = VHYS in "Figure 17 Operation 2"). Setting the hysteresis width between the  
detection voltage and the release voltage, prevents malfunction caused by noise on the input voltage.  
4. Delay time (tD)  
The delay time in the S-1003 Series is a period from the input voltage to the VDD pin exceeding the release voltage  
(VDET) until the output from the OUT pin inverts. The delay time changes according to the delay capacitor (CD).  
VDD  
VDET  
OUT  
tD  
Figure 31 Delay Time  
5. Feed-through current  
Feed-through current is a current that flows instantaneously at the time of detection and release of a voltage  
detector. The feed-through current is large in CMOS output product, small in Nch open-drain output product.  
6. Oscillation  
In applications where a resistor is connected to the voltage detector input (Figure 32), taking a CMOS active "L"  
product for example, the feed-through current which is generated when the output goes from "L" to "H" (release)  
causes a voltage drop equal to [feed-through current] [input resistance] across the resistor. When the input  
voltage drops below the detection voltage (VDET) as a result, the output voltage goes to "L". In this status, the  
feed-through current stops and its resultant voltage drop disappears, and the output goes from "L" to "H". The  
feed-through current is then generated again, a voltage drop appears, and repeating the process finally induces  
oscillation.  
VDD  
RA  
VIN  
VDD  
OUT  
MR  
CD  
VSS  
RB  
(CMOS output product)  
GND  
Figure 32 Example for Bad Implementation Due to Detection Voltage Change  
24  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
Precautions  
Do not apply an electrostatic discharge to this IC that exceeds the performance ratings of the built-in electrostatic  
protection circuit.  
In CMOS output product of the S-1003 Series, the feed-through current flows at the detection and the release. If the  
input impedance is high, oscillation may occur due to the voltage drop by the feed-through current when releasing.  
In CMOS output product oscillation may occur when a pull-down resistor is used, and falling speed of the power  
supply voltage (VDD) is slow near the detection voltage.  
When designing for mass production using an application circuit described herein, the product deviation and  
temperature characteristics of the external parts should be taken into consideration. ABLIC Inc. shall not bear any  
responsibility for patent infringements related to products using the circuits described herein.  
ABLIC Inc. claims no responsibility for any disputes arising out of or in connection with any infringement by  
products including this IC of patents owned by a third party.  
As seen in Figure 33, when connecting an input resistance (RA) in Nch open-drain output product of the S-1003  
Series, RA should be 100 kor less to prevent oscillation. Moreover, note that the hysteresis width may be larger  
as the following equation.  
Maximum hysteresis width = VHYSRA 20 A  
When using the manual reset function, refer to "2. 4 When connecting resistance (RA) between power supply  
voltage (VDD) and VDD pin" in "Operation" to set the constant.  
VDD  
RA  
(RA 100 k)  
VIN  
VDD  
MR  
VSS  
OUT  
CD  
(Nch open-drain output product)  
Set to VIN or GND (MR pin non-active)  
GND  
Figure 33  
Caution The above connection diagram and constant will not guarantee successful operation.  
Perform thorough evaluation using the actual application to set the constant.  
25  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
Characteristics (Typical Data)  
1. Detection voltage (VDET) vs. Temperature (Ta)  
S-1003CA12  
S-1003CA24  
1.40  
2.60  
+VDET  
VDET  
1.30  
1.20  
1.10  
1.00  
2.50  
2.40  
2.30  
2.20  
+VDET  
VDET  
40  
25  
0
25  
Ta [C]  
50  
75 85  
40  
25  
0
25  
50  
75 85  
Ta [C]  
S-1003CA50  
5.40  
+VDET  
5.20  
5.00  
4.80  
4.60  
VDET  
40  
25  
0
25  
Ta [C]  
50  
75 85  
2. Hysteresis width (VHYS) vs. Temperature (Ta)  
S-1003CA12  
S-1003CA24  
7
7
6
5
4
3
6
5
4
3
40  
25  
0
25  
50  
75 85  
40  
25  
0
25  
50  
75 85  
Ta [C]  
Ta [C]  
S-1003CA50  
7
6
5
4
3
40  
25  
0
25  
50  
75 85  
Ta [C]  
26  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
3. Current consumption (ISS) vs. Input voltage (VDD)  
S-1003CA12  
Ta = 25°C  
S-1003CA24  
Ta = 25°C  
1.50  
1.50  
1.25  
1.00  
0.75  
0.50  
0.25  
1.25  
1.00  
0.75  
0.50  
0.25  
0
0
0
0
2
4
6
8
10  
2
4
6
8
10  
VDD [V]  
VDD [V]  
S-1003CA50  
Ta = 25°C  
1.50  
1.25  
1.00  
0.75  
0.50  
0.25  
0
0
2
4
6
8
10  
VDD [V]  
4. Current consumption (ISS) vs. Temperature (Ta)  
S-1003NA12  
V
DD = VDET(S) 1.0 V  
S-1003NA24  
VDD = VDET(S) 1.0 V  
1.00  
1.00  
0.75  
0.50  
0.25  
0
0.75  
0.50  
0.25  
0
40  
25  
0
25  
Ta [C]  
50  
75 85  
40  
25  
0
25  
Ta [C]  
50  
75 85  
S-1003NA50  
VDD = VDET(S) 1.0 V  
1.00  
0.75  
0.50  
0.25  
0
40  
25  
0
25  
Ta [C]  
50  
75 85  
27  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
5. Nch transistor output current (IOUT  
)
vs. VDS  
6. Pch transistor output current (IOUT  
)
vs. VDS  
S-1003NA12  
Ta = 25°C, MR pin active  
S-1003CA12  
Ta = 25°C  
20.0  
17.5  
15.0  
12.5  
10.0  
7.5  
5.0  
2.5  
0
40.0  
V
DD = 6.00 V  
V
DD = 8.4 V  
30.0  
20.0  
10.0  
V
DD = 4.80 V  
V
DD = 7.2 V  
DD = 6.0 V  
DD = 4.8 V  
DD = 3.6 V  
V
DD = 3.60 V  
V
V
V
DD = 2.40 V  
V
V
V
DD = 1.20 V  
V
DD = 2.4 V  
DD = 0.95 V  
0
0
0
1.0 2.0 3.0 4.0 5.0 6.0 7.0  
2.0  
4.0  
6.0  
8.0  
10.0  
V
DS [V]  
VDS [V]  
7. Nch transistor output current (IOUT  
Input voltage (VDD)  
)
vs.  
8. Pch transistor output current (IOUT  
Input voltage (VDD)  
) vs.  
S-1003NA12  
VDS = 0.5 V, MR pin active  
S-1003CA12  
VDS = 0.5 V  
4.0  
5.0  
Ta = 40°C  
Ta = 40°C  
4.0  
3.0  
2.0  
1.0  
3.0  
2.0  
1.0  
Ta = +25°C  
Ta = +85°C  
Ta = +25°C  
Ta = +85°C  
0
0
0
0
2.0  
4.0  
6.0  
8.0  
10.0  
2.0  
4.0  
6.0  
8.0  
10.0  
V
DD [V]  
VDD [V]  
Remark VDS: Drain-to-source voltage of the output transistor  
28  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
9. Minimum operation voltage (VOUT) vs. Input voltage (VDD)  
S-1003NA12  
Pull-up to VDD  
S-1003NA24  
Pull-up to VDD  
Pull-up resistance: 100 k  
Pull-up resistance: 100 k  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
Ta = 40°C  
Ta = +25°C  
Ta = 40°C  
Ta = +25°C  
Ta = +85°C  
Ta = +85°C  
0
0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6  
0.4 0.8 1.2 1.6 2.0 2.4 2.8  
V
DD [V]  
VDD [V]  
S-1003NA50  
Pull-up to VDD  
Pull-up resistance: 100 k  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
Ta = 40°C  
Ta = +25°C  
Ta = +85°C  
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
VDD [V]  
S-1003NA12  
Pull-up to 10 V  
Pull-up resistance: 100 k  
S-1003NA24  
Pull-up to 10 V  
Pull-up resistance: 100 k  
12.0  
10.0  
8.0  
12.0  
10.0  
8.0  
Ta = 40°C  
Ta = 40°C  
Ta = +25°C  
Ta = +85°C  
Ta = +25°C  
Ta = +85°C  
6.0  
6.0  
4.0  
4.0  
2.0  
2.0  
0
0
0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6  
0.4 0.8 1.2 1.6 2.0 2.4 2.8  
V
DD [V]  
VDD [V]  
S-1003NA50  
Pull-up to 10 V  
Pull-up resistance: 100 k  
12.0  
10.0  
8.0  
Ta = 40°C  
Ta = +25°C  
Ta = +85°C  
6.0  
4.0  
2.0  
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
VDD [V]  
29  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
10. Dynamic response vs. Output pin capacitance (COUT) (CD pin; open)  
S-1003CA12  
S-1003CA24  
1
1
t
PLH  
0.1  
0.01  
t
PLH  
0.1  
0.01  
t
PHL  
t
PHL  
0.001  
0.001  
0.00001 0.0001  
0.001  
0.01  
0.1  
0.1  
0.1  
0.1  
0.00001 0.0001  
0.001  
0.01  
0.1  
Output pin capacitance [μF]  
Output pin capacitance [μF]  
S-1003CA50  
1
t
PLH  
0.1  
0.01  
t
PHL  
0.001  
0.00001 0.0001  
0.001  
0.01  
Output pin capacitance [μF]  
S-1003NA12  
S-1003NA24  
100  
100  
10  
1
10  
1
t
PLH  
PHL  
t
t
PLH  
PHL  
0.1  
0.1  
0.01  
0.01  
t
0.001  
0.001  
0.00001 0.0001  
0.001  
0.01  
0.00001 0.0001  
0.001  
0.01  
0.1  
Output pin capacitance [μF]  
Output pin capacitance [μF]  
S-1003NA50  
100  
10  
1
t
PLH  
PHL  
0.1  
0.01  
t
0.001  
0.00001 0.0001  
0.001  
0.01  
Output pin capacitance [μF]  
30  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
1 s  
1 s  
*1  
VIH  
R*1  
Input voltage  
VDD  
100 k  
VDD  
MR  
VSS  
*2  
OUT  
CD  
VIL  
tPHL  
tPLH  
*1  
V
VDD1  
VDD*3 90%  
*3  
COUT  
*2  
VDD  
V
Output voltage  
VDD*3 10%  
*1. R and VDD1 are unnecessary for CMOS output  
product.  
*1. VIH = 10 V  
*2. Set to VDD or GND (MR pin non-active).  
*2. VIL = 0.95 V  
*3. CMOS output product: VDD  
Nch open-drain product: VDD1  
Figure 34 Test Condition of Response Time  
Figure 35 Test Circuit of Response Time  
Caution 1. The above connection diagram and constant will not guarantee successful operation.  
Perform thorough evaluation using the actual application to set the constant.  
2. When the CD pin is open, a double pulse may appear at release.  
To avoid the double pulse, attach a 100 pF or more capacitor to the CD pin.  
Response time when detecting (tPHL) is not affected by CD pin capacitance. Besides, response  
time when releasing (tPLH) can set the delay time by attaching the CD pin.  
Refer to "11. Delay time (tD) vs. CD pin capacitance (CD) (Without output pin capacitance)" for  
details.  
11. Delay time (tD) vs. CD pin capacitance (CD) (Without output pin capacitance)  
S-1003NA12  
Ta = 25°C  
S-1003NA24  
Ta = 25°C  
10000  
10000  
1000  
100  
10  
1000  
100  
10  
1
1
0.1  
0.1  
0.01  
0.01  
0.01  
0.01  
0.1  
1
10  
[nF]  
100  
1000  
0.1  
1
10  
[nF]  
100  
1000  
C
D
C
D
S-1003NA50  
Ta = 25°C  
10000  
1000  
100  
10  
1
0.1  
0.01  
0.01  
0.1  
1
10  
[nF]  
100  
1000  
C
D
31  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
12. Delay time (tD) vs. Temperature (Ta)  
S-1003NA12  
S-1003NA24  
CD = 4.7 nF, VDD = 0.95 V  VDET(S) 1.0 V  
CD = 4.7 nF, VDD = 0.95 V  VDET(S) 1.0 V  
12  
11  
10  
9
12  
11  
10  
9
8
8
40  
25  
0
25  
50  
75 85  
40  
25  
0
25  
50  
75 85  
Ta [C]  
Ta [C]  
S-1003NA50  
CD = 4.7 nF, VDD = 0.95 V  VDET(S) 1.0 V  
12  
11  
10  
9
8
40  
25  
0
25  
50  
75 85  
Ta [C]  
1 s  
*1  
VIH  
R*1  
VDD  
100 k  
VDD  
MR  
VSS  
*2  
Input voltage  
OUT  
CD  
V
*2  
VIL  
tD  
V
CD  
VDD 90%  
Output voltage  
VSS  
*1. R is unnecessary for CMOS output product.  
*2. Set to VDD or GND (MR pin non-active).  
*1.  
VIH = VDET(S)1.0 V  
*2. VIL = 0.95 V  
Figure 36 Test Condition for Delay Time  
Figure 37 Test Circuit for Delay Time  
Caution The above connection diagram and constant will not guarantee successful operation.  
Perform thorough evaluation using the actual application to set the constant.  
32  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
Rev.1.0_03  
S-1003 Series  
Application Circuit Examples  
1. Microcomputer reset circuits  
In microcomputers, when the power supply voltage is lower than the guaranteed operation voltage, an unspecified  
operation may be performed or the contents of the memory register may be lost. When power supply voltage  
returns to the normal level, the microcomputer needs to be initialized. Otherwise, the microcomputer may  
malfunction after that. Reset circuits to protect microcomputer in the event of current being momentarily switched  
off or lowered.  
Using the S-1003 Series which has the low operation voltage, a high accuracy detection voltage and hysteresis,  
reset circuits can be easily constructed as seen in Figure 38 and Figure 39.  
VDD  
VDD1  
VDD  
VDD  
MR  
VSS CD  
VDD  
OUT  
Microcomputer  
OUT  
CD  
MR  
*1  
Microcomputer  
*1  
VSS  
GND  
GND  
*1. Set to VDD or GND (MR pin non-active).  
*1. Set to VDD or GND (MR pin non-active).  
Figure 38 Example of Reset Circuit  
(CMOS Output Product)  
Figure 39 Example of Reset Circuit  
(Nch Open-drain Output Product)  
Caution The above connection diagram and constant will not guarantee successful operation.  
Perform thorough evaluation using the actual application to set the constant.  
33  
MANUAL RESET BUILT-IN DELAY CIRCUIT (EXTERNAL DELAY TIME SETTING) HIGH-ACCURACY VOLTAGE DETECTOR  
S-1003 Series  
Rev.1.0_03  
2. Change of detection voltage (Nch open-drain output product only)  
If there is not a product with a specified detection voltage value in the S-1003N Series, the detection voltage can be  
changed by using a resistance divider or a diode, as seen in Figure 40 and Figure 41.  
In Figure 40, hysteresis width also changes.  
VDD  
VDD  
Vf1  
R
R
*1  
RA  
100 k  
100 k  
VIN  
VIN  
(RA 100 k)  
VDD  
MR  
VSS  
VDD  
MR  
VSS  
OUT  
CD  
OUT  
CD  
*1  
(Nch open-drain  
output product)  
RB  
(Nch open-drain  
output product)  
*2  
GND  
GND  
RA RB  
Detection voltage = Vf1 (VDET  
)
Detection voltage =  
Hysteresis width =  
 VDET  
VHYS  
RB  
*1. Set to VIN or GND (MR pin non-active).  
RA RB  
RB  
*1. RA should be 100 kor less to prevent oscillation.  
*2. Set to VIN or GND (MR pin non-active).  
Caution If RA and RB are large, the hysteresis width  
may also be larger than the value given by  
the above equation due to the feed-through  
current.  
Figure 40  
Figure 41  
Caution 1. The above connection diagram and constant will not guarantee successful operation.  
Perform thorough evaluation using the actual application to set the constant.  
2. Note that the hysteresis width may be larger as the following equation shows when using the  
above connections. Perform thorough evaluation using the actual application to set the  
constant.  
RA RB  
Maximum hysteresis width =  
VHYSRA 20 A  
RB  
3. When using the manual reset function, refer to "2. 4 When connecting resistance (RA)  
between power supply voltage (VDD) and VDD pin" in "Operation" to set the constant.  
34  
2.9±0.2  
1.9±0.2  
4
5
+0.1  
-0.06  
1
2
3
0.16  
0.95±0.1  
0.4±0.1  
No. MP005-A-P-SD-1.3  
TITLE  
SOT235-A-PKG Dimensions  
MP005-A-P-SD-1.3  
No.  
ANGLE  
UNIT  
mm  
ABLIC Inc.  
4.0±0.1(10 pitches:40.0±0.2)  
+0.1  
-0  
2.0±0.05  
0.25±0.1  
ø1.5  
+0.2  
-0  
4.0±0.1  
ø1.0  
1.4±0.2  
3.2±0.2  
3
4
2 1  
5
Feed direction  
No. MP005-A-C-SD-2.1  
TITLE  
SOT235-A-Carrier Tape  
MP005-A-C-SD-2.1  
No.  
ANGLE  
UNIT  
mm  
ABLIC Inc.  
12.5max.  
9.0±0.3  
Enlarged drawing in the central part  
ø13±0.2  
(60°)  
(60°)  
No. MP005-A-R-SD-1.1  
TITLE  
SOT235-A-Reel  
MP005-A-R-SD-1.1  
No.  
ANGLE  
UNIT  
QTY.  
3,000  
mm  
ABLIC Inc.  
1.57±0.03  
6
5
4
+0.05  
-0.02  
0.08  
1
2
3
0.5  
0.48±0.02  
0.2±0.05  
No. PG006-A-P-SD-2.1  
SNT-6A-A-PKG Dimensions  
PG006-A-P-SD-2.1  
TITLE  
No.  
ANGLE  
UNIT  
mm  
ABLIC Inc.  
+0.1  
-0  
ø1.5  
4.0±0.1  
2.0±0.05  
0.25±0.05  
+0.1  
ø0.5  
-0  
4.0±0.1  
0.65±0.05  
1.85±0.05  
3
2
5
1
6
4
Feed direction  
No. PG006-A-C-SD-2.0  
TITLE  
SNT-6A-A-Carrier Tape  
PG006-A-C-SD-2.0  
No.  
ANGLE  
UNIT  
mm  
ABLIC Inc.  
12.5max.  
9.0±0.3  
Enlarged drawing in the central part  
ø13±0.2  
(60°)  
(60°)  
No. PG006-A-R-SD-1.0  
SNT-6A-A-Reel  
TITLE  
No.  
PG006-A-R-SD-1.0  
ANGLE  
UNIT  
5,000  
QTY.  
mm  
ABLIC Inc.  
0.52  
2
1.36  
0.52  
1
0.3  
0.2  
1.  
2.  
(0.25 mm min. / 0.30 mm typ.)  
(1.30 mm ~ 1.40 mm)  
0.03 mm  
SNT  
1. Pay attention to the land pattern width (0.25 mm min. / 0.30 mm typ.).  
2. Do not widen the land pattern to the center of the package ( 1.30 mm ~ 1.40 mm ).  
Caution 1. Do not do silkscreen printing and solder printing under the mold resin of the package.  
2. The thickness of the solder resist on the wire pattern under the package should be 0.03 mm  
or less from the land pattern surface.  
3. Match the mask aperture size and aperture position with the land pattern.  
4. Refer to "SNT Package User's Guide" for details.  
(0.25 mm min. / 0.30 mm typ.)  
(1.30 mm ~ 1.40 mm)  
1.  
2.  
SNT-6A-A  
-Land Recommendation  
TITLE  
No. PG006-A-L-SD-4.1  
No.  
PG006-A-L-SD-4.1  
ANGLE  
UNIT  
mm  
ABLIC Inc.  
Disclaimers (Handling Precautions)  
1. All the information described herein (product data, specifications, figures, tables, programs, algorithms and application  
circuit examples, etc.) is current as of publishing date of this document and is subject to change without notice.  
2. The circuit examples and the usages described herein are for reference only, and do not guarantee the success of  
any specific mass-production design.  
ABLIC Inc. is not responsible for damages caused by the reasons other than the products described herein  
(hereinafter "the products") or infringement of third-party intellectual property right and any other right due to the use  
of the information described herein.  
3. ABLIC Inc. is not responsible for damages caused by the incorrect information described herein.  
4. Be careful to use the products within their specified ranges. Pay special attention to the absolute maximum ratings,  
operation voltage range and electrical characteristics, etc.  
ABLIC Inc. is not responsible for damages caused by failures and / or accidents, etc. that occur due to the use of the  
products outside their specified ranges.  
5. When using the products, confirm their applications, and the laws and regulations of the region or country where they  
are used and verify suitability, safety and other factors for the intended use.  
6. When exporting the products, comply with the Foreign Exchange and Foreign Trade Act and all other export-related  
laws, and follow the required procedures.  
7. The products must not be used or provided (exported) for the purposes of the development of weapons of mass  
destruction or military use. ABLIC Inc. is not responsible for any provision (export) to those whose purpose is to  
develop, manufacture, use or store nuclear, biological or chemical weapons, missiles, or other military use.  
8. The products are not designed to be used as part of any device or equipment that may affect the human body, human  
life, or assets (such as medical equipment, disaster prevention systems, security systems, combustion control  
systems, infrastructure control systems, vehicle equipment, traffic systems, in-vehicle equipment, aviation equipment,  
aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle use or other uses. Do  
not apply the products to the above listed devices and equipments without prior written permission by ABLIC Inc.  
Especially, the products cannot be used for life support devices, devices implanted in the human body and devices  
that directly affect human life, etc.  
Prior consultation with our sales office is required when considering the above uses.  
ABLIC Inc. is not responsible for damages caused by unauthorized or unspecified use of our products.  
9. Semiconductor products may fail or malfunction with some probability.  
The user of the products should therefore take responsibility to give thorough consideration to safety design including  
redundancy, fire spread prevention measures, and malfunction prevention to prevent accidents causing injury or  
death, fires and social damage, etc. that may ensue from the products' failure or malfunction.  
The entire system must be sufficiently evaluated and applied on customer's own responsibility.  
10. The products are not designed to be radiation-proof. The necessary radiation measures should be taken in the  
product design by the customer depending on the intended use.  
11. The products do not affect human health under normal use. However, they contain chemical substances and heavy  
metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips may be sharp. Be  
careful when handling these with the bare hands to prevent injuries, etc.  
12. When disposing of the products, comply with the laws and ordinances of the country or region where they are used.  
13. The information described herein contains copyright information and know-how of ABLIC Inc.  
The information described herein does not convey any license under any intellectual property rights or any other  
rights belonging to ABLIC Inc. or a third party. Reproduction or copying of the information from this document or any  
part of this document described herein for the purpose of disclosing it to a third-party without the express permission  
of ABLIC Inc. is strictly prohibited.  
14. For more details on the information described herein, contact our sales office.  
2.2-2018.06  
www.ablic.com  

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