S-8209BAO-I8T1U [ABLIC]
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION;
| 型号： | S-8209BAO-I8T1U |
| 厂家： | 
ABLIC |
| 描述： | BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION 局域网 |
| 文件： | 总26页 (文件大小：473K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
S-8209B Series
BATTERY PROTECTION IC
WITH CELL-BALANCE FUNCTION
www.ablic.com
© ABLIC Inc., 2008-2019
Rev.3.8_00
The S-8209B Series is a protection IC for lithium-ion / lithium polymer rechargeable batteries and includes a high-accuracy
voltage detection circuit and a delay circuit.
The S-8209B Series has a transmission function and two types of cell-balance function so that users are also able to configure
a protection circuit with series multi-cell.
Features
• High-accuracy voltage detection circuit
Overcharge detection voltage*1
Overcharge release voltage*1
Cell-balance detection voltage*1
Cell-balance release voltage*1
Overdischarge detection voltage
Overdischarge release voltage
3.55 V to 4.40 V (5 mV step)
3.50 V to 4.40 V*2
3.55 V to 4.40 V (5 mV step)*3
3.50 V to 4.40 V*4
2.0 V to 3.0 V (10 mV step)
2.0 V to 3.4 V*5
Accuracy 25 mV
Accuracy 50 mV
Accuracy 25 mV
Accuracy 50 mV
Accuracy 50 mV
Accuracy 100 mV
• Settable delay time by external capacitor for output pin
• Control charging, discharging, cell-balance by CTLC pin, CTLD pin
• Two types of cell-balance function; charge / discharge*6
• Wide range of operation temperature
• Low current consumption
Ta = −40°C to +85°C
7.0 μA max.
• Lead-free, Sn 100%, halogen-free*7
*1. Regarding selection of overcharge detection voltage, overcharge release voltage, cell-balance detection voltage
and cell-balance release voltage, refer to Remark 3 in "3. Product name list" of " Product Name Structure".
*2. Overcharge release voltage = Overcharge detection voltage − Overcharge hysteresis voltage
(Overcharge hysteresis voltage is selectable in 0 V to 0.4 V in 50 mV step.)
*3. Select as to overcharge detection voltage > cell-balance detection voltage.
*4. Cell-balance release voltage = Cell-balance detection voltage − Cell-balance hysteresis voltage
(Cell-balance hysteresis voltage is selectable in 0 V to 0.4 V in 50 mV step.)
*5. Overdischarge release voltage = Overdischarge detection voltage + Overdischarge hysteresis voltage
(Overdischarge hysteresis voltage is selectable in 0 V to 0.7 V in 100 mV step.)
*6. Also available the product without discharge cell-balance function
*7. Refer to " Product Name Structure" for details.
Applications
• Lithium-ion rechargeable battery pack
• Lithium polymer rechargeable battery pack
Packages
• SNT-8A
• 8-Pin TSSOP
1
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
Block Diagram
Delay circuit
DO
8.31 M
Ω
CDT
VDD
CO
+
−
Overcharge
CB
detection
comparator
+
−
Cell-balance
detection
comparator
CTLD
+
400 nA
−
CTLC
Overdischarge
detection
comparator
VSS
400 nA
Remark The diodes in the IC are parasitic diodes.
Figure 1
2
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
Product Name Structure
1. Product name
1. 1 8-Pin TSSOP
S-8209B xx
-
T8T1
x
Environmental code
U: Lead-free (Sn 100%), halogen-free
S: Lead-free, halogen-free
Package name abbreviation and IC packing specifications*1
T8T1: 8-Pin TSSOP, Tape
Serial code
Sequentially set from AA to ZZ
*1. Refer to the tape drawing.
1. 2 SNT-8A
S-8209B xx
-
I8T1
U
Environmental code
U: Lead-free (Sn 100%), halogen-free
Package name abbreviation and IC packing specifications*1
I8T1: SNT-8A, Tape
Serial code
Sequentially set from AA to ZZ
*1. Refer to the tape drawing.
2. Packages
Table 1 Package Drawing Codes
Package Name
Environmental code = S
Environmental code = U FT008-A-P-SD FT008-E-C-SD FT008-E-R-S1
Dimension
Tape
Reel
Land
FT008-A-P-SD FT008-E-C-SD FT008-E-R-SD
8-Pin TSSOP
SNT-8A
−
PH008-A-P-SD PH008-A-C-SD PH008-A-R-SD PH008-A-L-SD
3
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
3. Product name list
3. 1 8-Pin TSSOP
Table 2
Overcharge
Detection
Voltage
Overcharge
Release
Voltage
Cell-balance
Detection
Voltage
Cell-balance Overdischarge Overdischarge
Discharge
Cell-balance
Function
Release
Voltage
Detection
Voltage
Release
Voltage
Product Name
(VCU
)
(VCL
)
(VBU
)
(VBL
)
(VDL
)
(VDU)
S-8209BAA-T8T1y
S-8209BAD-T8T1y
S-8209BAG-T8T1y
S-8209BAH-T8T1y
S-8209BAI-T8T1y
S-8209BAJ-T8T1y
S-8209BAK-T8T1y
S-8209BAL-T8T1y
S-8209BAN-T8T1U
S-8209BAO-T8T1U
S-8209BAP-T8T1U
S-8209BAU-T8T1U
S-8209BAW-T8T1U
S-8209BAX-T8T1U
S-8209BAY-T8T1U
S-8209BAZ-T8T1U
S-8209BBA-T8T1U
S-8209BBB-T8T1U
S-8209BBC-T8T1U
4.100 V
4.150 V
3.800 V
4.250 V
4.250 V
4.150 V
4.215 V
4.300 V
4.250 V
4.300 V
3.900 V
4.225 V
4.225 V
4.210 V
4.210 V
4.195 V
3.700 V
4.275 V
4.200 V
4.000 V
3.950 V
3.650 V
4.150 V
4.150 V
3.950 V
4.215 V
4.100 V
4.150 V
4.200 V
3.900 V
4.175 V
4.175 V
4.160 V
4.160 V
4.145 V
3.500 V
4.225 V
4.100 V
4.050 V
3.900 V
3.700 V
4.200 V
4.100 V
3.900 V
4.190 V
4.225 V
4.200 V
4.200 V
3.700 V
4.215 V
4.215 V
4.190 V
4.190 V
4.100 V
3.550 V
4.145 V
4.145 V
4.000 V
3.900 V
3.700 V
4.200 V
4.050 V
3.900 V
4.190 V
4.225 V
4.200 V
4.200 V
3.700 V
4.165 V
4.165 V
4.140 V
4.140 V
4.050 V
3.550 V
4.095 V
4.095 V
2.50 V
2.00 V
2.20 V
2.50 V
2.50 V
2.30 V
2.00 V
2.00 V
2.00 V
2.30 V
2.00 V
2.30 V
2.30 V
2.50 V
2.50 V
2.50 V
2.00 V
2.00 V
2.00 V
2.70 V
2.70 V
2.50 V
2.80 V
2.70 V
3.00 V
2.50 V
2.50 V
2.10 V
3.00 V
2.50 V
3.00 V
3.00 V
3.20 V
3.00 V
2.70 V
2.50 V
2.30 V
2.30 V
Yes
Yes
No
No
Yes
No
Yes
Yes
No
No
Yes
Yes
No
No
No
No
Yes
No
No
3. 2 SNT-8A
Table 3
Overcharge
Detection
Voltage
Overcharge
Release
Voltage
Cell-balance
Detection
Voltage
Cell-balance Overdischarge Overdischarge
Discharge
Cell-balance
Function
Release
Voltage
Detection
Voltage
Release
Voltage
Product Name
(VCU
)
(VCL
)
(VBU
)
(VBL
)
(VDL
)
(VDU)
S-8209BAA-I8T1U
S-8209BAM-I8T1U
S-8209BAO-I8T1U
S-8209BAP-I8T1U
S-8209BAR-I8T1U
4.100 V
4.000 V
4.300 V
3.900 V
4.230 V
4.000 V
3.800 V
4.200 V
3.900 V
4.170 V
4.050 V
3.900 V
4.200 V
3.700 V
4.180 V
4.000 V
3.850 V
4.200 V
3.700 V
4.180 V
2.50 V
3.00 V
2.30 V
2.00 V
2.80 V
2.70 V
3.40 V
3.00 V
2.50 V
3.00 V
Yes
No
No
Yes
No
Remark 1. y: S or U
2. Please select products of environmental code = U for Sn 100%, halogen-free products.
4
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
3. Please contact our sales representatives for products other than the above.
Users are able to select the overcharge detection voltage, overcharge release voltage, cell-balance
detection voltage and cell-balance release voltage from the range shown in Figure 2 and Figure 3.
Users are able to select how to combine the overcharge detection voltage (VCU) and the overcharge release
voltage (VCL) from the range A or B shown in Figure 2*1.
Similarly, select how to combine the cell-balance detection voltage (VBU) and the cell-balance release
voltage (VBL) from the range of C or D in Figure 3*2.
In selecting the combination of VCU and VCL from the range A, select the combination of VBU and VBL from
the range C. Similarly, in selecting the combination of VCU and VCL from the B range, select the combination
of VBU and VBL from the range D*3.
4.40
4.20
4.40
A
4.20
3.90
C
3.90
3.55
B
D
3.55
3.50 3.55
3.80 3.90 4.00
4.40
3.50 3.55
3.80 3.90 4.00
4.40
Overcharge release voltage (VCL) [V]
Cell-balance release voltage (VBL) [V]
Figure 2
Figure 3
*1. Users are able to select the overcharge hysteresis voltage (VCU − VCL) in 0 V to 0.4 V, in 50 mV step.
*2. Users are able to select the cell-balancce hysteresis voltage (VBU − VBL) in 0 V to 0.4 V, in 50 mV step.
*3. Select as to set VCU > VBU
.
5
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
Pin Configurations
1. 8-Pin TSSOP
Table 4
Top view
Pin No.
Symbol
CTLC
Description
Pin for charge control
1
2
1
2
3
4
8
7
6
5
CTLD
Pin for dischage control
Input pin for positive power supply;
3
VDD
Connection pin for battery's positive voltage
Capacitor connection pin for overcharge detection
delay, cell-balance detection delay and
overdischarge detection delay
4
CDT
Figure 4
Input pin for negative power supply;
Connection pin for batter's negative voltage
Output pin for discharge control
(Pch open-drain output)
5
6
7
8
VSS
DO
CO
CB
Output pin for charge control
(Pch open-drain output)
Output pin for cell-balance control
(CMOS output)
2. SNT-8A
Table 5
Top view
Pin No.
Symbol
Description
1
2
CTLC
CTLD
Pin for charge control
1
2
3
4
8
7
6
5
Pin for dischage control
Input pin for positive power supply;
Connection pin for battery's positive voltage
Capacitor connection pin for overcharge detection
delay, cell-balance detection delay and
overdischarge detection delay
Input pin for negative power supply;
Connection pin for battery's negative voltage
Output pin for discharge control
(Pch open-drain output)
3
VDD
4
CDT
Figure 5
5
6
7
8
VSS
DO
CO
CB
Output pin for charge control
(Pch open-drain output)
Output pin for cell-balance control
(CMOS output)
6
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
Absolute Maximum Ratings
Table 6
(Ta = +25°C unless otherwise specified)
Item
Input voltage between VDD and VSS
CB pin output voltage
CDT pin voltage
Symbol Applied pin
Absolute Maximum Rating
VSS − 0.3 to VSS + 12
VSS − 0.3 to VDD + 0.3
VSS − 0.3 to VDD + 0.3
VDD − 24 to VDD + 0.3
VDD − 24 to VDD + 0.3
VSS − 0.3 to VSS + 24
VSS − 0.3 to VSS + 24
700*1
Unit
V
VDS
VDD
CB
VCB
V
VCDT
VDO
CDT
DO
V
DO pin output voltage
CO pin output voltage
CTLC pin input voltage
CTLD pin input voltage
V
VCO
CO
V
VCTLC
VCTLD
CTLC
CTLD
V
V
8-Pin TSSOP
Power dissipation
mW
mW
°C
°C
PD
−
SNT-8A
450*1
Operating ambient temperature
Storage temperature
Topr
Tstg
−
−
−40 to +85
−55 to +125
*1. When mounted on board
[Mounted board]
(1) Board size: 114.3 mm × 76.2 mm × t1.6 mm
(2) Board name: JEDEC STANDARD51-7
Caution The absolute maximum ratings are rated values exceeding which the product could suffer physical
damage. These values must therefore not be exceeded under any conditions.
800
600
8-Pin TSSOP
400
200
SNT-8A
0
100
Ambient Temperature (Ta) [°C]
Figure 6 Power Dissipation of Package (When mounted on board)
150
50
0
7
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
Electrical Characteristics
Table 7
(Ta = +25°C unless otherwise specified)
Test
Circuit
Item
Symbol
VCU
Condition
Min.
Typ.
Max.
Unit
Overcharge detection
voltage
−
VCU − 0.025
VCU
VCU + 0.025
V
1
VCL ≠ VCU
VCL = VCU
VCL − 0.05
VCL − 0.05
VCL
VCL
VCL + 0.05
VCL + 0.025
V
V
1
1
Overcharge release
voltage
VCL
Cell-balance detection
voltage
VBU
−
VBU − 0.025
VBU
VBU + 0.025
V
1
VBL ≠ VBU
VBL = VBU
VBL − 0.05
VBL − 0.05
VBL
VBL
VBL + 0.05
VBL + 0.025
V
V
1
1
Cell-balance release
voltage
VBL
Overdischarge
detection
voltage
VDL
−
−
VDL − 0.05
VDL
VDL + 0.05
V
V
1
Overdischarge release
voltage
VDU
VDU − 0.10
4.76
VDU
8.31
VDU + 0.10
10.9
1
2
3
CDT pin resistance*1
RCDT
VCDET
MΩ
VDS = 3.5 V，VCDT = 0 V
CDT pin
detection voltage*1
VDS = 3.5 V
VDS × 0.65
VDS × 0.70
VDS × 0.75
V
Operating voltage
between VDD and VSS
CTLC pin H voltage
CTLD pin H voltage
CTLC pin L voltage
CTLD pin L voltage
Current consumption
during operation*2
Sink current CTLC*2
Sink current CTLD*2
Source current CB
Sink current CB
Output voltage of CO pin, DO
pin and CB pin are determined
VDSOP
1.5
−
8.0
V
−
VCTLCH VDS = 3.5 V
VCTLDH VDS = 3.5 V
VCTLCL VDS = 3.5 V
VCTLDL VDS = 3.5 V
VDS × 0.55
VDS × 0.55
VDS × 0.10
VDS × 0.10
−
−
−
−
VDS × 0.90
VDS × 0.90
VDS × 0.45
VDS × 0.45
V
V
V
V
4
4
4
4
IOPE
VDS = 3.5 V
−
3.5
7.0
μA
5
ICTLCL
ICTLDL
ICBH
VDS = 3.5 V, VCTLC = 3.5 V
VDS = 3.5 V, VCTLD = 3.5 V
VCB = 4.0 V, VDS = 4.5 V
VCB = 0.5 V, VDS = 3.5 V
VCO = 3.0 V, VDS = 3.5 V
VCO = 24 V, VDS = 4.5 V
VDO = 3.0 V, VDS = 3.5 V
VDO = 24 V, VDS = 1.8 V
320
320
30
30
30
−
400
400
−
−
−
−
−
−
480
480
−
−
−
nA
nA
μA
μA
μA
μA
μA
μA
6
6
7
7
7
8
7
8
ICBL
Source current CO
Leakage current CO
Source current DO
Leakage current DO
ICOH
ICOL
IDOH
IDOL
0.1
30
−
0.1
−
*1. In the S-8209B Series, users are able to set delay time for the output pins. By using the following formula, delay time is
calculated with the value of CDT pin’s resistance in the IC (RCDT) and the value of capacitor set externally at the CDT pin
(CCDT).
tD [s] = −ln (1−VCDET / VDS) × CCDT [μF] × RCDT [MΩ]
= −ln (1−0.7 (typ.) ) × CCDT [μF] × 8.31 MΩ (typ.)
= 10.0 MΩ (typ.) × CCDT [μF]
In case of the capacitance of CDT pin CCDT = 0.01 μF, the output pin delay time tD is calculated by using the above
formula and as follows.
tD [s] = 10.0 MΩ (typ.) × 0.01 μF = 0.1 s (typ.)
Test RCDT and the CDT pin detection voltage (VCDET) by test circuits shown in this datasheet after applying the power
supply while pulling-up the CTLC pin, CTLD pin to the level of VDD pin outside the IC.
*2. In case of using CTLC pin, CTLD pin pulled-up to the level of VDD pin externally, the current flows from the VSS pin (ISS) is
calculated by the following formula.
ISS = IOPE + ICTLCL + ICTLDL
8
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
Test Circuits
CTLC
CTLD
CB
CO
CTLC
CTLD
CB
CO
S-8209B Series
S-8209B Series
VDD
DO
VDD
DO
100 100
kΩ kΩ
CDT
VSS
CDT
VSS
V
V
V
A
COM
COM
Figure 8 Test circuit 2
Figure 7 Test circuit 1
CTLC
CTLD
CTLC
CTLD
CB
CO
CB
CO
S-8209B Series
S-8209B Series
VDD
DO
VDD
DO
100
kΩ
100 100
kΩ kΩ
CDT
VSS
CDT
VSS
V
V
V
COM
COM
Figure 9 Test circuit 3
Figure 10 Test circuit 4
CTLC
CTLD
A
A
CTLC
CTLD
CB
CO
CB
CO
S-8209B Series
S-8209B Series
A
VDD
DO
VDD
DO
CDT
VSS
CDT
VSS
COM
Figure 11 Test circuit 5
COM
Figure 12 Test circuit 6
9
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
A
A
CTLC
CTLD
CB
CO
CTLC
CTLD
CB
CO
S-8209B Series
S-8209B Series
VDD
DO
DO
VDD
A
A
A
CDT
VSS
CDT
VSS
COM
COM
Figure 13 Test circuit 7
Figure 14 Test circuit 8
10
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
Operation
Figure 15 shows the operation transition of the S-8209B Series
[Overcharge status]
VCTLD ≤ VCTLDL
VCTLD ≥ VCTLDH
VCTLC ≤ VCTLCL
VCTLC ≥ VCTLCH
CO = High-Z
DO = High-Z
CB = H *1
CO = High-Z
DO = H
CB = H *1
CO = High-Z
DO = H
CB = H *1
Charge
VDS ≤ VCL
VDS ≥ VCU
VDS ≤ VCL
VDS ≥ VCU
VDS ≤ VCL
VCTLD ≤ VCTLDL
VCTLD ≥ VCTLDH
CO = H
DO = High-Z
CB = H *1
CO = High-Z
DO = H
CB = H *1
CO = H
DO = H
CB = H *1
VCTLC ≤ VCTLCL
VCTLC ≥ VCTLCH
VDS ≤ VBL
VDS ≥ VBU
[Normal status]
VDS ≤ VBL
VDS ≤ VBL
VDS ≥ VBU
VCTLD ≤ VCTLDL
VCTLD ≥ VCTLDH
VCTLC ≤ VCTLCL
VCTLC ≥ VCTLCH
CO = H
DO = High-Z
CB = H *2
CO = H
DO = H
CB = L
CO = High-Z
DO = H
CB = L
VDS ≤ VDL
VDS ≥ VDU
VDS ≤ VDL
VDS ≥ VDU
[Overdischarge status]
VDS ≤ VDL
Discharge
VCTLC ≤ VCTLCL
VCTLC ≥ VCTLCH
CO = H
DO = High-Z
CB = L
CO = H
DO = High-Z
CB = L
CO = High-Z
DO = High-Z
CB = L
VCTLD ≤ VCTLDL
VCTLD ≥ VCTLDH
VDS < 1.5 V
Indefinite status
CO = Indefinite
DO = Indefinite
CB = Indefinite
*1. Operation of charge cell-balance function
*2. Operation of discharge cell-balance function
Figure 15 Operation Transition
11
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
1. Normal status
In the S-8209B Series, both of CO and DO pin get the VDD level; the voltage between VDD and VSS (VDS) is more
than the overdischarge detection voltage (VDL), and is less than the overcharge detection voltage (VCU) and
respectively, the CTLC pin input voltage (VCTLC) > the CTLC pin voltage "L" (VCTLCL), the CTLD pin input voltage
(VCTLD) > the CTLD pin voltage "L" (VCTLDL). This is the normal status.
2. Overcharge status
In the S-8209B Series, the CO pin is in high impedance; when VDS gets VCU or more, or VCTLC gets VCTLCL or less.
This is the overcharge status.
If VDS gets the overcharge release voltage (VCL) or less, and VCTLC gets the CTLC pin voltage "H" (VCTLCH) or more,
the S-8209B Series releases the overcharge status to return to the normal status.
3. Overdischarge status
In the S-8209B Series, the DO pin is in high impedance; when VDS gets VDL or less, or VCTLD gets VCTLDL or less. This
is the overdischarge status.
If VDS gets the overdischarge release voltage (VDU) or more, and VCTLD gets the CTLD pin voltage "H" (VCTLDH) or
more, the S-8209B Series releases the overdischarge status to return to the normal status.
4. Cell-balance function
In the S-8209B Series, the CB pin gets the level of VDD pin; when VDS gets the cell-balance detection voltage (VBU
)
or more. This is the charge cell-balance function.
If VDS gets the cell-balance release voltage (VBL) or less again, the S-8209B Series sets the CB pin the level of VSS
pin.
In addition, the CB pin gets the level of VDD pin; when VDS is more than VDL, and VCTLD is VCTLDL or less. This is the
discharge cell-balance function.
If VCTLD gets VCTLDH or more, or VDS is VDL or less again, the S-8209B Series sets the CB pin the level of VSS pin.
5. Delay circuit
In the S-8209B Series, users are able to set delay time which is from detection of changes in VDS, VCTLC, VCTLD to
output to the CO, DO, CB pin.
For example in the detection of overcharge status, when VDS exceeds VCU, or VCTLC gets VCTLCH or less, charging to
CCDT starts via RCDT. If the voltage between CDT and VSS (VCDT) reaches the CDT pin detection voltage (VCDET), the
CO pin is in high impedance. The output pin delay time tD is calculated by the following formula.
tD [s] = 10.0 M (typ.) × CCDT [μF]
Ω
The electric charge in CCDT starts to be discharged when the delay time has finished.
The delay time that users have set for the CO pin, as seen above, is settable for each output pin DO, CB.
12
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
Battery Protection IC Connection Examples
Regarding the operation of protection circuit with the S-8209B Series for series-connected batteries, refer to the
application note "S-8209B Series Usage Guidelines".
1. Example of Protection Circuit with the S-8209B Series (Without Discharge Cell-balance Function)
for Series Multi-Cells
Figure 16 shows the example of protection circuit with the S-8209B Series (without discharge cell-balance function)
for series multi-cells.
P+
CFET DFET
1 M
Ω
1 k
Ω
1 M
Ω
1 kΩ
CO1
VDD1
CDT1
0.1 μF
DO1
S-8209B
(1)
CB1
1 k
Ω
1 k
Ω
BAT1
CTLC1
VSS1
CTLD1
470
0.1
Ω
CO2
DO2
VDD2
CDT2
μ
F
S-8209B
(2)
1 k
Ω
1 k
Ω
CB2
BAT2
CTLC2
VSS2
CTLD2
470
Ω
CO3
DO3
VDD3
CDT3
0.01 μF
0.1
μF
S-8209B
(3)
CB3
BAT3
CTLC3
510 k
Ω
510 k
Ω
VSS3
CTLD3
470
Ω
1 M
Ω
1 M
Ω
P−
Figure 16
13
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
2. Example of Protection Circuit with the S-8209B Series (With Discharge Cell-balance Function) for
Series Multi-Cells
Figure 17 shows the example of protection circuit with the S-8209B Series (with discharge cell-balance function) for
series multi-cells.
P+
1 M
Ω
CFET DFET
1 M
Ω
1 M
Ω
1 k
Ω
4.7 M
Ω
CO1
DO1
VDD1
CDT1
4.7 M
Ω
0.1 μF
1 k
Ω
S-8209B
(1)
1 M
Ω
CB1
1 k
Ω
1 k
Ω
BAT1
CTLC1
VSS1
CTLD1
470
0.1
Ω
CO2
DO2
VDD2
CDT2
μ
F
S-8209B
(2)
1 k
Ω
1 kΩ
CB2
BAT2
CTLC2
VSS2
CTLD2
470
Ω
CO3
DO3
VDD3
CDT3
0.01 μF
0.1 μF
S-8209B
(3)
CB3
BAT3
CTLC3
510 k
Ω
510 k
Ω
VSS3
CTLD3
470
Ω
1 M
Ω
1 M
Ω
P−
Figure 17
Caution 1. The constants may be changed without notice.
2. It has not been confirmed whether the operation is normal or not in circuits other than the
connection examples. In addition, the connection examples and the constants do not guarantee
proper operation. Perform thorough evaluation using the actual application to set the constants.
14
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
Precautions
• The application conditions for the input voltage, output voltage, and load current should not exceed the package power
dissipation.
• Do not apply an electrostatic discharge to this IC that exceeds the performance ratings of the built-in electrostatic
protection circuit.
• ABLIC Inc. claims no responsibility for any and all disputes arising out of or in connection with any infringement by
products including this IC of patents owned by a third party.
15
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
Characteristics (Typical Data)
1. Current consumption
1. 1 IOPE vs. Ta
1. 2 IOPE vs. VDS
8
7
6
5
4
3
2
1
0
0
5
4
3
2
1
0
40 25
0
25
Ta [C]
50
75 85
1
2
3
4
5
6
7
8
V
DS [V]
2. Overcharge detection / release voltages, Cell-balance detection / release voltages, Overdischarge
detection / release voltages
2. 1 VCU vs. Ta
2. 2 VCL vs. Ta
4.12
4.11
4.10
4.09
4.08
4.07
4.04
4.02
4.00
3.98
3.96
3.94
40 25
0
0
0
25
50
50
50
75 85
75 85
75 85
40 25
0
0
0
25
50
50
50
75 85
75 85
75 85
Ta [C]
Ta [C]
2. 3 VBU vs. Ta
2. 4 VBL vs. Ta
4.07
4.06
4.05
4.04
4.03
4.02
4.04
4.02
4.00
3.98
3.96
3.94
40 25
25
Ta [C]
40 25
25
Ta [C]
2. 5 VDU vs. Ta
2. 6 VDL vs. Ta
2.82
2.78
2.74
2.70
2.66
2.62
2.56
2.54
2.52
2.50
2.48
2.46
40 25
25
Ta [C]
40 25
25
Ta [C]
16
BATTERY PROTECTION IC WITH CELL-BALANCE FUNCTION
S-8209B Series
Rev.3.8_00
3. CO / DO / CB pin current
3. 1 ICOH vs. VCO (VDS = 3.5 V)
3. 2 IDOH vs. VDO (VDS = 3.5 V)
2000
1750
1500
1250
1000
750
2000
1750
1500
1250
1000
750
500
500
250
250
0
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5
VCO [V]
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5
V
DO [V]
3. 3 ICBH vs. VCB (VDS = 4.5 V)
3. 4 ICBL vs. VCB (VDS = 3.5 V)
2000
1750
1500
1250
1000
750
2000
1750
1500
1250
1000
750
500
500
250
250
0
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5
V
CB [V]
VCB [V]
4. CTLC / CTLD pin current
4. 1 ICTLCL vs. Ta (VDS = 3.5 V)
4. 2 ICTLDL vs. Ta (VDS = 3.5 V)
600
500
400
300
200
100
0
600
500
400
300
200
100
0
40 25
0
25
Ta [C]
50
75 85
40 25
0
25
Ta [C]
50
75 85
5. CDT pin resistance / CDT pin detection voltage
5. 1 RCDT vs. Ta
5. 2 VCDET / VDS vs. Ta
12.0
10.0
8.0
6.0
4.0
2.0
0
0.720
0.715
0.710
0.705
0.700
0.695
0.690
0.685
0.680
40 25
40 25
0
25
Ta [C]
50
75 85
0
25
Ta [C]
50
75 85
17
+0.3
-0.2
3.00
5
8
1
4
0.17±0.05
0.2±0.1
0.65
No. FT008-A-P-SD-1.2
TSSOP8-E-PKG Dimensions
FT008-A-P-SD-1.2
TITLE
No.
ANGLE
UNIT
mm
ABLIC Inc.
4.0±0.1
2.0±0.05
ø1.55±0.05
0.3±0.05
+0.1
-0.05
8.0±0.1
ø1.55
(4.4)
+0.4
-0.2
6.6
8
1
4
5
Feed direction
No. FT008-E-C-SD-1.0
TITLE
TSSOP8-E-Carrier Tape
FT008-E-C-SD-1.0
No.
ANGLE
UNIT
mm
ABLIC Inc.
13.4±1.0
17.5±1.0
Enlarged drawing in the central part
ø21±0.8
2±0.5
ø13±0.5
No. FT008-E-R-SD-1.0
TSSOP8-E-Reel
FT008-E-R-SD-1.0
TITLE
No.
3,000
QTY.
ANGLE
UNIT
mm
ABLIC Inc.
13.4±1.0
17.5±1.0
Enlarged drawing in the central part
ø21±0.8
2±0.5
ø13±0.5
No. FT008-E-R-S1-1.0
TITLE
TSSOP8-E-Reel
FT008-E-R-S1-1.0
No.
QTY.
ANGLE
UNIT
4,000
mm
ABLIC Inc.
1.97±0.03
6
5
8
7
+0.05
-0.02
0.08
1
2
3
4
0.5
0.48±0.02
0.2±0.05
No. PH008-A-P-SD-2.1
TITLE
SNT-8A-A-PKG Dimensions
PH008-A-P-SD-2.1
No.
ANGLE
UNIT
mm
ABLIC Inc.
+0.1
-0
4.0±0.1
2.0±0.05
0.25±0.05
ø1.5
0.65±0.05
ø0.5±0.1
4.0±0.1
2.25±0.05
4 3 2 1
5 6 7 8
Feed direction
No. PH008-A-C-SD-2.0
TITLE
SNT-8A-A-Carrier Tape
PH008-A-C-SD-2.0
No.
ANGLE
UNIT
mm
ABLIC Inc.
12.5max.
9.0±0.3
Enlarged drawing in the central part
ø13±0.2
(60°)
(60°)
No. PH008-A-R-SD-1.0
SNT-8A-A-Reel
TITLE
No.
PH008-A-R-SD-1.0
5,000
QTY.
ANGLE
UNIT
mm
ABLIC Inc.
0.52
2
2.01
0.52
1
0.2
0.3
1.
2.
(0.25 mm min. / 0.30 mm typ.)
(1.96 mm ~ 2.06 mm)
1.
2.
0.03 mm
3.
4.
SNT
1. Pay attention to the land pattern width (0.25 mm min. / 0.30 mm typ.).
2. Do not widen the land pattern to the center of the package (1.96 mm to 2.06mm).
Caution 1. Do not do silkscreen printing and solder printing under the mold resin of the package.
2. The thickness of the solder resist on the wire pattern under the package should be 0.03 mm
or less from the land pattern surface.
3. Match the mask aperture size and aperture position with the land pattern.
4. Refer to "SNT Package User's Guide" for details.
(0.25 mm min. / 0.30 mm typ.)
(1.96 mm ~ 2.06 mm)
1.
2.
SNT-8A-A
-Land Recommendation
TITLE
No.
No. PH008-A-L-SD-4.1
PH008-A-L-SD-4.1
ANGLE
UNIT
mm
ABLIC Inc.
Disclaimers (Handling Precautions)
1. All the information described herein (product data, specifications, figures, tables, programs, algorithms and
application circuit examples, etc.) is current as of publishing date of this document and is subject to change without
notice.
2. The circuit examples and the usages described herein are for reference only, and do not guarantee the success of
any specific mass-production design.
ABLIC Inc. is not liable for any losses, damages, claims or demands caused by the reasons other than the products
described herein (hereinafter "the products") or infringement of third-party intellectual property right and any other
right due to the use of the information described herein.
3. ABLIC Inc. is not liable for any losses, damages, claims or demands caused by the incorrect information described
herein.
4. Be careful to use the products within their ranges described herein. Pay special attention for use to the absolute
maximum ratings, operation voltage range and electrical characteristics, etc.
ABLIC Inc. is not liable for any losses, damages, claims or demands caused by failures and / or accidents, etc. due to
the use of the products outside their specified ranges.
5. Before using the products, confirm their applications, and the laws and regulations of the region or country where they
are used and verify suitability, safety and other factors for the intended use.
6. When exporting the products, comply with the Foreign Exchange and Foreign Trade Act and all other export-related
laws, and follow the required procedures.
7. The products are strictly prohibited from using, providing or exporting for the purposes of the development of
weapons of mass destruction or military use. ABLIC Inc. is not liable for any losses, damages, claims or demands
caused by any provision or export to the person or entity who intends to develop, manufacture, use or store nuclear,
biological or chemical weapons or missiles, or use any other military purposes.
8. The products are not designed to be used as part of any device or equipment that may affect the human body, human
life, or assets (such as medical equipment, disaster prevention systems, security systems, combustion control
systems, infrastructure control systems, vehicle equipment, traffic systems, in-vehicle equipment, aviation equipment,
aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle use or other uses by
ABLIC, Inc. Do not apply the products to the above listed devices and equipments.
ABLIC Inc. is not liable for any losses, damages, claims or demands caused by unauthorized or unspecified use of
the products.
9. In general, semiconductor products may fail or malfunction with some probability. The user of the products should
therefore take responsibility to give thorough consideration to safety design including redundancy, fire spread
prevention measures, and malfunction prevention to prevent accidents causing injury or death, fires and social
damage, etc. that may ensue from the products' failure or malfunction.
The entire system in which the products are used must be sufficiently evaluated and judged whether the products are
allowed to apply for the system on customer's own responsibility.
10. The products are not designed to be radiation-proof. The necessary radiation measures should be taken in the
product design by the customer depending on the intended use.
11. The products do not affect human health under normal use. However, they contain chemical substances and heavy
metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips may be sharp. Be
careful when handling these with the bare hands to prevent injuries, etc.
12. When disposing of the products, comply with the laws and ordinances of the country or region where they are used.
13. The information described herein contains copyright information and know-how of ABLIC Inc. The information
described herein does not convey any license under any intellectual property rights or any other rights belonging to
ABLIC Inc. or a third party. Reproduction or copying of the information from this document or any part of this
document described herein for the purpose of disclosing it to a third-party is strictly prohibited without the express
permission of ABLIC Inc.
14. For more details on the information described herein or any other questions, please contact ABLIC Inc.'s sales
representative.
15. This Disclaimers have been delivered in a text using the Japanese language, which text, despite any translations into
the English language and the Chinese language, shall be controlling.
2.4-2019.07
www.ablic.com
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