BPW272-1270-20AC11 [ACTEL]

272-27 x 27mm, 1.27mm E-TEC BGA SOCKET; 272-27 X 27毫米， 1.27毫米E- TEC BGA插座


型号：	BPW272-1270-20AC11
厂家：	Actel Corporation
描述：	272-27 x 27mm, 1.27mm E-TEC BGA SOCKET 272-27 X 27毫米， 1.27毫米E- TEC BGA插座插座
文件：	总4页 (文件大小：1199K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

EP patents 0829188, 0897655

Patents pending in other countries.

Ball / Land Grid Array Sockets

Screw Lock Type

E-tec

the Swiss connection

E-tec is now the leading BGA socket manufacturer.

Sockets range from 5 x 5 upwards contacts with even larger parts

currently in design. Some of the existing patterns are shown on the

following pages, many more exist and your exact requirements can easily

be added to our extensive product library. The SMD socket is simply

placed and reflowed onto the PCB in the same way as the chip and

occupies only a small amount of additional board space. The screw lock

socket extends ≈ 6,00 mm beyond the outer ballrow with no fixing holes.

We aim to solve your requirements - many different terminals and

configurations are available. Your custom sets our standards!

Please note, we will always request the chip data

to ensure we offer a compatible socket.

SMT Style

PCB Pad Layout

Ø 0,70mm/.028“ if pitch 1,27mm

Ø 0,60mm/.023“ if pitch 1,00mm

Ø 0,50mm/.019“ if pitch 0,80mm

dimensions if BGA Socket pitch 1,27mm with contact type 30

Specifications

Soldertail Style

Mechanical data

Contact life

Retention System life

Solderability

100000 cycles min.

100 cycles min.

exceeds MIL-STD-202 Method 208

Soldertail:

Ø 0,45mm/.017“ if pitch 1,27mm

Ø 0,45mm/.017“ if pitch 1,00mm

Ø 0,40mm/.015“ if pitch 0,80mm

Individual contact force

Max. torque for retention screws

40 grams max.

7 cN per meter, or 10oz per inch

Material

Insulator

Terminal

Contact

Glass Epoxy FR 4

Brass

BeCu

PCB Hole Layaut

PCB Hole:

Electrical data

Contact resistance

Current rating

Insulation resistance at 500V DC

Breakdown voltage at 60 Hz

Inductance

Ø 0,60mm/.024“ if pitch 1,27mm

Ø 0,60mm/.024“ if pitch 1,00mm

Ø 0,55mm/.021“ if pitch 0,80mm

< 30 mΩ

1 A max.

>10⁴MΩ

1 KV min.

< 5 nH

The pitch dimension depends on your Ball Grid Array

Operating temperature

−55°C to +130°C ; 220°C for 10 sec.

How to order

X X W x x x x - x x x x - x x X X x x

Device Type

Device Material

Pitch

Grid Code Config Code

Plating

07 = 0,75mm

08 = 0,80mm

10 = 1,00mm

12 = 1,27mm

15 = 1,50mm

Ball Grid

please refer to

the footprint

pages

will be given by

the factory after

receipt of the chip

datasheet

01 = tin/gold

Ceramic

Plastic

Land Grid

Column Grid

42 to 50

Nbr of contacts

Contact Type

30 = standard SMD ( „A“ = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm & 0,80mm pitch )

refer to the next pages

29 = raised SMD

70 = solder tail

( „A“ = 5,00mm; other dim. on request )

( „A“ = 3,30mm if 1,27mm pitch; 2,80mm if 1,00mm & 0,80mm pitch )

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