BPW484-0670-22AB95L [ACTEL]

IC Socket, BGA484, 484 Contact(s), ROHS COMPLIANT;


型号：	BPW484-0670-22AB95L
厂家：	Actel Corporation
描述：	IC Socket, BGA484, 484 Contact(s), ROHS COMPLIANT
文件：	总8页 (文件大小：1282K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Ball / Land Grid Array Sockets

Twist Lock Type

E-tec is now the leading BGA socket manufacturer.

EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries.

Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed

and reflowed onto the PCB in the same way as the chip and occupies only a small amount of additional

board space. The 1.27mm pitch screw lock socket extends ≈ 6,00 mm beyond the outer ball row with

no fixing holes.

We aim to solve your requirements - many different terminals and configurations are available.

Your custom sets our standards!

Please note, we will always request the chip data to ensure we offer a compatible socket.

Important Note:

SMT Style

Please check the ball diameters & heights of your chip prior to

ordering the standard E-tec BGA (BPW, BCW) sockets. Any deviation

has to be communicated to E-tec in order to check compatibility with

the standard socket design and if necessary to obtain a special order

code adapted to your chip dimensions.

The standard solderball diameters & heights are the following:

PCB Pad Layout

Pitch

ball diameters

min/max

ball height

min/max

0.50mm

0.65mm

0.75mm

0.80mm

0.25mm / 0.35mm

0.25mm / 0.45mm

0.40mm / 0.55mm

0.50mm / 0.70mm

0.15mm / 0.30mm

0.15mm / 0.40mm

0.25mm / 0.45mm

0.30mm / 0.50mm

1.00mm

1.27mm & 1.50mm

a) plastic chips (BPW)

b) ceramic chips (BCW)

Ø 0,60mm/.024“ if pitch 1,27mm

Ø 0,50mm/.020“ if pitch 1,00mm

Ø 0,40mm/.016“ if pitch 0,80mm

Ø 0,35mm/.014“ if pitch 0,75mm

Ø 0,35mm/.014“ if pitch 0,65mm

Ø 0,30mm/.012“ if pitch 0,50mm

0.60mm / 1.00mm

0.50mm / 0.70mm

0.80mm / 1.00mm

You may request any specific socket dimension from

info@e-tec.com

If the minimum ball diameter of a given chip falls below the above

indications, then a BUW socket will generally be proposed.

For top view socket dimension

pls. ref. to separate catalog page

Specifications

Soldertail Style

Mechanical data

Contact life

Retention System life

Solderability

10.000 cycles min.

1.000 cycles min.

exceeds MIL-STD-202 Method 208

40 grams max.

Soldertail:

Ø 0,42mm/.016” if pitch 1,27mm

Ø 0,29mm/.011” if pitch 1,00mm

Ø 0,29mm/.011” if pitch 0,80mm

Ø 0,27mm/.010” if pitch 0,75mm

Ø 0,27mm/.010” if pitch 0,65mm

Ø 0,27mm/.010” if pitch 0,50mm

Individual contact force

Max. torque for retention screws up to 800 pins = 7cNm or 10 oz-inch

as of 800 pins = 7cNm to 10cNm or 10 oz

to 14 oz-inch

Material

Insulator (RoHS compliant)

Terminal (RoHS compliant)

Contact (RoHS compliant)

High temp plastic or epoxy FR4

Brass

BeCu

PCB Hole Layout

Electrical data

Contact resistance

Current rating

< 100 mΩ

PCB solder hole:

500 mA max.

Ø 0,60mm/.024” if pitch 1,27mm

Ø 0,50mm/.020” if pitch 1,00mm

Ø 0,40mm/.016” if pitch 0,80mm

Ø 0,35mm/.014” if pitch 0,75mm

Ø 0,35mm/.014” if pitch 0,65mm

Ø 0,35mm/.014” if pitch 0,50mm

Insulation resistance at 500V DC 100 MΩ if 0.50 to 0.80mm pitch

500 MΩ 1.00mm pitch upwards

Breakdown voltage at 60 Hz

Capacitance

Inductance

500V min.

< 1 pF

< 2 nH

Operating temperature

−55°C to +125°C ; 260°C for 60 sec.

Recommendations

Torque limiting screw driver

Solder paste

Solder profile

Refer to page “Tools” of this catalog

Please use a solder paste w/o any silver!

Please refer to our website www.e-tec.com

The pitch dimension depends on your Ball Grid Array

How to order

optional for locating pegs

X X W x x x x - x x x x - x x X X 95 L

Device Type

Device Material

Pitch

Grid Code Config Code

Plating

std. socket for

ceramic device

05 = 0,50mm 10 = 1,00mm

06 = 0,65mm 12 = 1,27mm

07 = 0,75mm 15 = 1,50mm

Ball Grid

will be given by the factory

after receipt of the chip

datasheet

Land Grid

Column Grid

95 = tin/gold

std. socket for

plastic device

08 = 0,80mm

(tin leadfree)

others on

socket adapted to

small diameter solderballs

request

Nbr of contacts

Contact Type

30 = standard SMT...( „A“ = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm pitch, 0.60 if 0,80mm pitch; 0,40mm if <0.80mm pitch )

29 = raised SMT..( „A“ = 5,00mm if 1,27mm pitch; 3,20mm if 1,00mm pitch; 2,80mm if 0,80mm pitch, 2.30mm if <0.80mm pitch )

28 = special raised SMT - only for 1.00 & 0.80mm pitch…..... ( „A“ = 4,50mm )

depends on

ballcount of chip

70 = standard solder tail……..…...….( „A“ = 3.30 if 1.27mm pitch, 2.80 if 1.00mm or 0.80mm pitch, 2,30mm if <0.80mm pitch )

Socket Mounting Recommendations and Reflow Profile

Purpose

This document is meant to serve as a guide for mounting E-tec surface mount device (SMD)

sockets to the printed circuit board (PCB). The recommendations described here are guidelines

only, and modifications may be needed for your particular socket, PCB, and process.

Application

The sockets this document applies to are as follows: Clam Shell, Knob Lock, Screw Lock, Twist

Lock, Quick Lock and Lever Lock in SMD style. These sockets utilize the E-tec patented spring-

pin technology. This technology allows the pins to be soldered to the PCB while still providing

compliance to the device under test (DUT) via springs located at the other end of the pin. The

pins themselves do not have solder pre-forms as a BGA would with its solder balls. However, the

sockets are designed to mount to the same PCB footprint and pads as required by the BGA, or

any other IC package the socket was designed for (except if locating pegs are used; see ‘Locating

Pegs’ section of this document). When compared to mounting a BGA, an extra volume of solder

paste is required to mount the sockets to the PCB. To effect this, a properly dimensioned stencil

is required. Once the paste has been applied, a standard reflow process is then used to solder the

socket to the PCB. After the socket is verified to have proper electrical connection to the PCB,

the system is then ready to be used.

Locating Pegs

Although designed to mount to the same footprint as the IC, with just a small amount of

additional keep-out area, E-tec sockets can also be offered with locating pegs. The sockets are

typically mounted with two locating pegs, which require two thru-holes drilled into the PCB.

These pegs help to align the socket on the PCB, and hence align the socket’s pins to the PCB’s

pads, during the soldering process. Furthermore, plating the thru-holes allows the locating pegs

to be soldered to the PCB for better mechanical stability during everyday use and handling of the

socket. If the PCB design permits, E-tec recommends the use of these locating pegs. For fine-

pitch, low pin-count sockets without locating pegs, the mechanical strength of the solder joints

may be insufficient. In these cases, it is recommended to epoxy the socket body to the PCB. 3M

Scotch-Weld 2216 B/A is a suitable epoxy. In any case, the proper volume of solder paste is

required to ensure mechanical and electrical integrity. Recommended stencil dimensions are

given in the next section of this document.

E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland

Phone +41-21-781 08 10 · www.e-tec.com · info@e-tec.com

E-tec Socket Mounting Recommendations

PRELIMINARY

Socket Mounting Recommendations and Reflow Profile

Stencil

Table 1 shows the recommended stencil dimensions. A laser-cut, electro-polished and Ni-plated

stainless steel stencil is recommended to give the most consistent paste release. The apertures

can be made round except for smaller pitches, where square apertures are recommended.

Remember to keep the stencil small enough to fit within the keep-out area of the socket, but yet

have provisions to remove it from the PCB once the paste has been applied.

Table 1: Recommended stencil dimensions.

Device Pitch

(mm)

1.27

PCB Pad Diameter

(mm / in)

Stencil Thickness

(mm/in)

Stencil Aperture

(mm/in)

min. 0.60 / 0.023

min. 0.50 / 0.019

min. 0.40 / 0.016

min. 0.35 / 0.014

min. 0.30 / 0.012

0.15 / 0.006

0.13 / 0.005

round 0.66 / 0.026

round 0.55 / 0.022

round 0.44 / 0.017

square 0.39 / 0.015

square 0.33 / 0.013

1.00

0.80

0.75

0.65

0.50

Solder Paste

E-tec recommends using solder paste without ( or <0.5%) silver (Ag) to reduce the solder’s

wetting ability and prevent the paste from running up the pins, thus maximizing the volume of

solder left on the pads. Brands such as Qualitek (www.qualitek.com) or Alpha Metals

(www.alphametals.com) produce such solder paste on customer request. For Sn/Pb solder paste

we recommend Ecorel 803S offered by Avantec (www.avantec.dehon.com).

Reflow Profile

Both standard Sn-Pb eutectic and Pb-free reflow profiles are shown below.

E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland

Phone +41-21-781 08 10 · www.e-tec.com · info@e-tec.com

E-tec Socket Mounting Recommendations

PRELIMINARY

Socket Mounting Recommendations and Reflow Profile

E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland

Phone +41-21-781 08 10 · www.e-tec.com · info@e-tec.com

E-tec Socket Mounting Recommendations

PRELIMINARY

Socket Mounting Recommendations and Reflow Profile

Verifying the Assembly

After the socket has been reflowed to the PCB, open and short testing should be partaken to

ensure proper assembly. The assembly house typically performs x-ray inspection to verify non-

shorting of pins. However, as this is only a visual inspection, we recommend using a continuity

tester or ohmmeter and simply sweeping random rows and columns of pins to ensure no shorting

of pins. No damage to the springs will occur if very slight pressure from the meter’s tips is

applied (just touch the probes to the springs). For fine pitch sockets, a microscope would be

helpful in placing the meter’s tips appropriately.

After verifying the absence of shorts, open testing should be performed. The most direct, yet

tedious, method is to use the continuity tester to directly probe each pin to a breakout or test

point on the board. Again no damage will occur if the probes are touched to the springs. If heavy

pressure is required to push the socket body towards the PCB to achieve continuity, this means a

poor solder joint. If no such test points exist, then the BGA’s via field on the backside of the

PCB should be kept solder-mask free to allow for such probing. If the via field is kept open, a

simpler open testing method can be performed. Simply use a wet sponge (or some other

conductive material) and hold it onto the via field. This shorts all the pins together on the PCB.

Insert one probe of the continuity tester into the sponge. Now sweep the pins of the socket with

the other probe and check for continuity.

If the above procedures show any shorts or opens, then it is advisable to have the assembly house

re-evaluate the assembly method used. An incorrect stencil can lead to too much or too little

solder paste, easily leading short or open conditions and a solder paste with Ag contents

(>=0.5%) may also result in solder joint failures. These are the primary reasons for socket

mounting failures.

Important Notes:

a) Screw/Twist Lock Socket

When tightening the lid of a Screw or Twist Lock socket, it is imperative to not over-tighten the

retention screws, otherwise irreparable damage may occur. Such damage is not covered by

warranty and will be solely the end user’s responsibility. The maximum allowed torque on these

retention screws is 7cN-m (10oz-in) for sockets up to 800 pins and for sockets as of 800 pins the

torque value needs to be increased but should not exceed a maximum of 10cN-m (14oz-in). E-tec

sells the torque screwdriver TOL-7CN-TORQUE which is preset to 7cN-m, but which can be

adjusted to higher torque values for the high pin count sockets.

E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland

Phone +41-21-781 08 10 · www.e-tec.com · info@e-tec.com

E-tec Socket Mounting Recommendations

PRELIMINARY

Socket Mounting Recommendations and Reflow Profile

b) Knob Lock / Quick Lock / Clamshell Socket

It is recommended to remove the Knob Lock, Quick Lock and Clamshell retainer from the socket

base prior to soldering the sockets to the PCB. This will avoid socket displacement during the

soldering process due to the weight of these retainers. User instructions on how to remove and

reassemble the Clamshell retainer from the socket base can be obtained from E-tec.

c) Pick & Place Pads

Pick & place pad options can be obtained on request for all SMT sockets. If required, please

contact E-tec prior to placing a purchase order, since such pick & place pad options may require

special fixtures on the socket base which are not included in the standard socket design.

E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland

Phone +41-21-781 08 10 · www.e-tec.com · info@e-tec.com

E-tec Socket Mounting Recommendations

PRELIMINARY

BPW484-0670-22AB95L [ACTEL]

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