ACT4529MYH-T0010 [ACTIVE-SEMI]

40V/3.0A CV/CC Buck Converter Featuring QC2.0, USB Auto-Detect and USB-PD;
ACT4529MYH-T0010
型号: ACT4529MYH-T0010
厂家: ACTIVE-SEMI, INC    ACTIVE-SEMI, INC
描述:

40V/3.0A CV/CC Buck Converter Featuring QC2.0, USB Auto-Detect and USB-PD

光电二极管
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ACT4529M  
Rev 1, 23-Feb-17  
40V/3.0A CV/CC Buck Converter Featuring QC2.0, USB Auto-Detect and USB-PD  
GENERAL DESCRIPTION  
FEATURES  
ACT4529 is a wide input voltage, high efficiency  
step-down DC/DC converter that operates in either  
CV (Constant Output Voltage) mode or CC  
(Constant Output Current) mode. This device has  
QC2.0 built in to provide 5.1V/9.1V/12.1V outputs  
as requested by attached portable devices. Besides  
building in QC2.0 decoding, it also supports Apple,  
Samsung and BC1.2 devices to charge at full  
current rate. ACT4529 has an interface for USB-PD  
control via a tri-state digital pin. Vout is 5.1V if this  
pin is floating, Vout is 9.1V when this pin voltage is  
less than 0.8V and Vout is 12.1V while this pin  
voltage is more than 2.0V.  
 AEC-Q100 Automotive Qualified  
 -40°C~125°C Junction Temperature Range  
Automotive Qualified  
 Passes SAE J1752 M8A EMC testing  
 Quick Charge™ 2.0 Certified by Qualcomm®  
and UL.  
 UL Certificate No. 4787083099-1  
 http://www.qualcomm.com/documents/quickc  
harge-device-list  
 40V Input Voltage Surge  
 4.5V-36V Operational Input Voltage  
 5.1V/9.1V/12.1V Output with +/-1% Accuracy  
 Up to 3.0A Output current  
ACT4529 has accurate output current limits under  
constant current regulation. It provides up to 3.0A  
output current at 125kHz switching frequency.  
ACT4529 utilizes adaptive drive technique to  
achieve good EMI performance while main >90%  
efficiency at full load for mini size CLA designs. It  
also has output short circuit protection with hiccup  
mode. The average output current is reduced to  
below 6mA when output is shorted to ground. Other  
features include output over voltage protection and  
thermal shutdown.  
 Constant Current Regulation Limit  
 QC2.0 + Auto-Detect + USB-PD Type-C Support  
 Hiccup Mode Protection at Output Short  
 >90% Efficiency at Full Load  
 0.5mA Low Standby Input Current  
 5.7V/10.1V/13.5V Output Over-voltage  
Protection for 5.1V/9.1V/12.1V Outputs  
 Cord Voltage Compensation  
 Meet EN55022 Class B Radiated EMI Standard  
 8kV ESD HBM Protection on DP and DM  
 SOP-8EP Package  
This device is available in a SOP-8EP package and  
requires very few external components for  
operation.  
APPLICATIONS  
 Automotive Applications  
 Car Charger  
 Cigarette Lighter Adaptor (CLA)  
 CV/CC regulation DC/DC converter  
For details on SAE J1752 M8A EMC performance  
and testing, refer to Active-Semi application note  
AN-106, ACT4529M Automotive EMC Performance.  
Typical Application Circuit  
V/I Profile  
* Patent Pending  
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Copyright © 2016-2017 Active-Semi, Inc.  
ACT4529M  
Rev 1, 23-Feb-17  
ORDERING INFORMATION  
USB AUTO  
DETECT  
PART NUMBER  
PDC  
QC2.0  
CERTIFICATION PACKAGE  
ACT4529MYH-T0010  
ACT4529MYH-T1011  
Yes  
Yes  
No  
Yes  
Yes  
QC 2.0  
N/A  
SOP-8EP  
SOP-8EP  
Yes  
PIN CONFIGURATION  
Top View  
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Copyright © 2016-2017 Active-Semi, Inc.  
ACT4529M  
Rev 1, 23-Feb-17  
PIN DESCRIPTIONS  
PIN  
NAME  
DESCRIPTION  
Voltage Feedback Input. Connect to node of the inductor and output capacitor. CSP  
and CSN Kevin sense is recommended.  
1
CSP  
Negative input terminal of output current sense. Connect to the negative terminal of  
current sense resistor.  
2
3
CSN  
PDC  
USB-PD Control Pin. floating: 5.1V, pulled high: 12.1V, pulled low: 9.1V. Do not  
drive this pin higher than 5V.  
Data Line Positive Input. Connected to D+ of attached portable device data line.  
This pin passes 8kV HBM ESD.  
4
5
DP  
Data Line Negative Input. Connected to D- of attached portable device data line.  
This pin passes 8kV HBM ESD.  
DM  
Power Supply Input. Bypass this pin with a 10μF ceramic capacitor to GND, placed  
as close to the IC as possible.  
6
7
8
IN  
SW  
HSB  
Power Switching Output to External Inductor.  
High Side Bias Pin. This provides power to the internal high-side MOSFET gate  
driver. Connect a 22nF capacitor from HSB pin to SW pin.  
Ground and Heat Dissipation Pad. Connect this exposed pad to large ground  
copper area with copper and vias.  
9
GND  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
IN to GND  
VALUE  
-0.3 to 40  
-1 to VIN +1  
SW - 0.3 to VSW + 7  
-0.3 to +15  
-0.3 to +6  
-0.3 to +6  
46  
UNIT  
V
SW to GND  
V
HSB to GND  
V
V
CSP, CSN to GND  
V
PDC to GND  
V
All other pins to GND  
V
Junction to Ambient Thermal Resistance  
Operating Junction Temperature  
Storage Junction Temperature  
Lead Temperature (Soldering 10 sec.)  
°C/W  
°C  
°C  
°C  
-40 to 150  
-55 to 150  
300  
: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may  
affect device reliability.  
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ACT4529M  
Rev 1, 23-Feb-17  
ELECTRICAL CHARACTERISTICS  
(VIN = 12V, TJ = -40°C~125°C, , unless otherwise specified.)  
Parameter  
Symbol  
Condition  
Min  
Typ  
Max Units  
Input Over Voltage Protection  
Input Over Voltage Hysteresis  
Input Over Voltage Response Time  
Input Under Voltage Lockout (UVLO)  
Input UVLO Hysteresis  
VIN_OVP  
Rising  
40  
42  
4
44  
V
V
T_VIN_OVP VIN step from 30V to 45V  
250  
4.5  
200  
ns  
V
VIN  
Rising  
4.15  
4.75  
mV  
Input Voltage Power Good Deglitch  
Time  
No OVP  
40  
ms  
Input Voltage Power Good Deglitch  
Time  
No UVP  
10  
us  
Input Standby Current  
Vin=12V, Vout=5.1V, Iload=0  
500  
uA  
4.92  
8.78  
5.1  
9.1  
5.28  
9.42  
Output Voltage Regulation  
CSP  
CSP  
At Full Temperature  
At Room Temperature  
Output rising  
V
V
V
11.67 12.1  
12.53  
5.05  
9.0  
5.1  
9.1  
5.15  
9.2  
Output Voltage Regulation  
11.95 12.1  
12.25  
5.5  
9.7  
5.7  
6.0  
Output Over Voltage Protection  
(OVP)  
10.1  
13.5  
10.5  
14.0  
13.0  
Falling Threshold  
Hysteresis  
7.5  
8.0  
8.5  
V
VIN Drop  
Threshold  
200  
mV  
ms  
ms  
us  
Input Brownout Protection  
(ACT4529MYH-T1011 only)  
Vout Drop Delay Time  
416  
416  
480  
480  
QC and PDC Restart time  
Output Over Voltage Deglitch Time  
Output Voltage Cord Compensation  
1.0  
ACT  
4529MYH-  
T0010  
-25%  
200  
+25%  
mV  
66mV between CSP and CSN  
ACT  
4529MYH-  
T1011  
-25%  
-10%  
200  
3.2  
+25%  
10%  
mV  
V
Output Under Voltage Protection  
(UVP)  
VOUT  
VOUT falling  
VOUT rising  
UVP Hysteresis  
VOUT  
VOUT  
0.55  
10  
V
UVP Deglitch Time  
us  
ms  
UVP Blanking Time at Startup  
3.5  
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Copyright © 2016-2017 Active-Semi, Inc.  
ACT4529M  
Rev 1, 23-Feb-17  
ELECTRICAL CHARACTERISTICS  
(VIN = 12V, TJ = -40°C~125°C, unless otherwise specified.)  
Unit  
s
Parameter  
Symbol  
Condition  
Min  
Typ  
Max  
Output Constant Current Limit  
Hiccup Waiting Time  
Rcs=20mΩ  
2.95  
3.3  
3.63  
A
4.13  
S
A
Top FET Cycle by Cycle Current  
Limit  
4.5  
5.8  
Top FET Rds on  
70  
mΩ  
Ω
Bot FET Rds on  
4.7  
Maximum Duty Cycle  
Switching Frequency  
Soft-start Time  
99  
%
-10%  
125  
2.0  
80  
+10%  
kHz  
ms  
mV  
Out Voltage Ripples  
Cout=220uF/22uF ceramic  
For high to lower voltage transi-  
tions  
VOUT Discharge Current  
60  
mA  
ms  
ms  
Voltage transition time for QC 2.0  
transition or USB PD Type C  
12V-5V  
5V-12V  
100  
100  
Voltage transition time for QC 2.0  
transition or USB PD Type C  
Input 12V-40V-12V with 1V/us  
slew rate, Vout=5V, Iload=0A  
and 2.4A  
Line Transient Response  
4.75  
4.9  
5.25  
5.4  
V
V
80mA-1.0A-80mA load with  
0.1A/us slew rate  
Vout=5V  
5.15  
80mA-1.0A-80mA load with  
0.1A/us slew rate  
Load Transient Response  
Vout=9V  
8.7  
9.1  
9.5  
V
V
80mA-1.0A-80mA load with  
0.1A/us slew rate  
Vout=12V  
11.6  
12.1  
12.6  
Thermal Shut Down  
Thermal Shut Down Hysteresis  
ESD of DP, DM  
160  
30  
8
°C  
°C  
kV  
V
HBM  
PDC High Threshold  
PDC Low Threshold  
PDC Drive Current  
2.2  
0.6  
V
10  
uA  
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ACT4529M  
Rev 1, 23-Feb-17  
FUNCTIONAL BLOCK DIAGRAM  
FUNCTIONAL DESCRIPTION  
Output Current Sensing and Regulation  
Output Under-Voltage Protection /  
Hiccup Mode  
Sense resistor is connected to CSP and CSN. The  
sensed differential voltage is compared with interval  
reference to regulate current. CC loop and CV loop  
are in parallel. The current loop response is allowed  
to have slower response compared to voltage loop.  
However, during current transient response, the  
inductor current overshoot/undershoot should be  
controlled within +/-25% to avoid inductor  
saturation.  
There is  
a
under voltage protection (UVP)  
threshold. If the UVP threshold is hit for 10us, an  
over current or short circuit is assumed, and the  
converter goes into hiccup mode by disabling the  
converter and restarts after hiccup waiting period.  
Input Brownout Protection  
(ACT4529MYH-T1011 only)  
Cycle-by-Cycle Current Control  
If the input voltage drops below 8V but higher than  
UVLO for 450ms while in QC or PDC mode, the  
output voltage turns off and QC or PDC mode is  
disabled. If the output voltage drops below 3.7V, the  
timer restarts and waits for 450ms before  
attempting to restart the output voltage. When  
output voltage rises above 3.9V and detects the  
input voltage below 8V, timer restarts. If the input  
voltage is below 8V after 450ms, the output turns  
off. The cycle continues until the input voltage  
increases above 8.2V,for longer than 450ms, then  
output turns on, the IC renegotiates the PD and QC  
protocols, and normal operation restarts.  
The conventional cycle-by-cycle peak current mode  
is implemented with high-side FET current sense.  
Input Over Voltage Protection  
The converter is disabled if the input voltage is  
above 42V (+/-2V). Device resumes operation  
automatically 40ms after OVP is cleared.  
Output Over Voltage Protection  
Device stops switching when output over-voltage is  
sensed, and resumes operation automatically when  
output voltage drops to OVP- hysteresis.  
Thermal Shutdown  
Output Over Voltage Discharge  
If the TJ increases beyond 160°C, ACT4529 goes  
into HZ mode and the timer is preserved until TJ  
drops by 30°C.  
Discharge circuit starts to discharge output through  
CSP pins when output over voltage is detected.  
Discharge circuit brings 12V down to 5V in less  
than 100ms.  
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ACT4529M  
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FUNCTIONAL DESCRIPTION  
Cord Compensation  
Cord Compensation increases the output voltage  
with increased output current to compensate for the  
voltage drop across the output connector and output  
cable.  
The compensation voltage is derived as:  
ΔVout = RCS*Iout*K  
Where RCS is the current sense resistance, Iout is the  
load current, and K = 3.03  
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ACT4529M  
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APPLICATIONS INFORMATION  
may also be used provided that the RMS ripple  
current rating is higher than 50% of the output  
current. The input capacitor should be placed close  
to the IN and GND pins of the IC, with the shortest  
traces possible. In the case of tantalum or  
Inductor Selection  
The inductor maintains a continuous current to the  
output load. This inductor current has a ripple that is  
dependent on the inductance value.  
Higher inductance reduces the peak-to-peak ripple  
current. The trade off for high inductance value is  
the increase in inductor core size and series  
resistance, and the reduction in current handling  
capability. In general, select an inductance value L  
based on ripple current requirement:  
electrolytic types,  
a
ceramic capacitor is  
recommended to parallel with tantalum or  
electrolytic capacitor, which should be placed right  
next to the IC.  
Output Capacitor  
The output capacitor also needs to have low ESR to  
keep low output voltage ripple. The output ripple  
voltage is:  
(1)  
(5)  
Where VIN is the input voltage, VOUT is the output  
voltage, fSW is the switching frequency, ILOADMAX is  
the maximum load current, and KRIPPLE is the ripple  
Where IOUTMAX is the maximum output current,  
KRIPPLE is the ripple factor, RESR is the ESR of the  
output capacitor, fSW is the switching frequency, L is  
the inductor value, and COUT is the output  
capacitance. From the equation above, VRIPPLE is  
the combination of ESR and real capacitance.  
In the case of ceramic output capacitors, RESR is very  
small and does not contribute to the ripple.  
Therefore, a lower capacitance value can be used  
for ceramic type. In the case of tantalum or  
electrolytic capacitors, the ripple is dominated by  
factor. Typically, choose KRIPPLE  
=
30% to  
correspond to the peak-to-peak ripple current being  
30% of the maximum load current.  
With a selected inductor value the peak-to-peak  
inductor current is estimated as:  
(2)  
R
ESR multiplied by the ripple current. In that case, the  
output capacitor is chosen to have sufficiently low  
ESR.  
Tt is estimated as:  
For ceramic output capacitor, typically choose a  
capacitance of about 22µF. For tantalum or  
electrolytic capacitors, choose a capacitor with less  
than 50mΩ ESR. When 330uF or 470uF electrolytic  
cap or tantalum cap is used, where ripple is  
dominantly caused by ESR, a 2.2uF ceramic in  
parallel is recommended.  
(3)  
The selected inductor should not saturate at ILPK.  
The maximum output current is calculated as:  
Rectifier Schottky Diode  
(4)  
Use a Schottky diode as the rectifier to conduct  
current when the High-Side Power Switch is off.  
The Schottky diode must have current rating higher  
than the maximum output current and a reverse  
voltage rating higher than the maximum input  
voltage. Further more, the low forward voltage  
Schottky is preferable for high efficiency and  
smoothly operation.  
LLIM is the internal current limit.  
Input Capacitor  
The input capacitor needs to be carefully selected  
to maintain sufficiently low ripple at the supply input  
of the converter. A low ESR capacitor is highly  
recommended. Since large current flows in and out  
of this capacitor during switching, its ESR also  
affects efficiency.  
The input capacitance needs to be higher than  
10µF. The best choice is the ceramic type.  
However, low ESR tantalum or electrolytic types  
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ACT4529M  
Rev 1, 23-Feb-17  
APPLICATIONS INFORMATION  
Current Sense Resistors  
The traces leading to and from the sense resistor  
can be significant error sources. With small value  
sense resistors, trace resistance shared with the  
load can cause significant errors. It is recommended  
to connect the sense resistor pads directly to the  
CSP and CSN pins using “Kelvin” or “4-wire”  
connection techniques as shown below.  
he IC  
-cycle  
p the  
k  
(6)  
Where Rcs is current sense resistor.  
The maximum output current is defined by  
(7)  
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ACT4529M  
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APPLICATIONS INFORMATION  
4) Schottky anode pad and IC exposed pad  
should be placed close to ground clips in CLA  
applications  
PCB Layout Guidance  
When laying out the printed circuit board, the  
following checklist should be used to ensure proper  
operation of the IC.  
5) Use “Kelvin” or “4-wire” connection techniques  
from the sense resistor pads directly to the CSP  
and CSN pins. The CSP and CSN traces  
should be in parallel to avoid interference.  
1) Arrange the power components to reduce the  
AC loop size consisting of CIN, IN pin, SW pin,  
the Schottky diode, and GND  
6) Place multiple vias between top and bottom  
GND planes for best heat dissipation and noise  
immunity.  
2) Place input decoupling ceramic capacitor CIN as  
close to VIN pin as possible. The GND side of  
CIN must be placed as close as possible to to  
power GND on the top layer. The traces should  
be short and wide.  
7) Use short traces connecting HSB-CHSB-SW  
loop.  
8) SW node is noisy, switching from VIN to GND.  
Its size should be minimized and it should be  
isolated away from the rest of circuit for good  
EMI and low noise operation.  
3) The high power loss components, e.g. the  
controller, Schottky diode, and the inductor  
should be placed carefully to make the thermal  
spread evenly on the board.  
Example PCB Layout  
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ACT4529M  
Rev 1, 23-Feb-17  
Typical Application Circuit  
BOM List for 2.4A Car Charger  
ITEM REFERENCE  
DESCRIPTION  
IC, ACT4529, SOP-8EP  
MANUFACTURER  
Active-Semi  
QTY  
1
1
2
U1  
C1  
C2  
C3  
C4  
C5  
C6  
L1  
Capacitor, Electrolytic, 47µF/35V  
Murata, TDK  
Murata, TDK  
Murata, TDK  
Murata, TDK  
Murata, TDK  
Murata, TDK  
1
3
Capacitor, Ceramic, 10µF/25V, 1206, SMD  
Capacitor, Ceramic, 22nF/25V, 0603, SMD  
Capacitor, Ceramic, 22µF/16V, 1206, SMD  
Capacitor, Electrolytic, 220µF/16V  
Capacitor, Ceramic, 2.2µF/16V, 0805, SMD  
Inductor, 40µH, 4A, 20%  
1
4
1
5
1
6
1
7
1
8
1
9
D1  
Rcs  
Diode, Schottky, 40V/5A, SK54L  
Panjit  
1
10  
Chip Resistor, 20mΩ, 1206, 1%  
Murata, TDK  
1
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ACT4529M  
Rev 1, 23-Feb-17  
TYPICAL PERFORMANCE CHARACTERISTICS  
(Schematic as show in typical application circuit, Ta = 25°C, unless otherwise specified)  
Efficiency vs. Load current ( 5V Vout)  
Efficiency vs. Load current ( 9V Vout)  
100  
95  
100  
95  
VIN =12V  
90  
90  
VIN =12V  
VIN =24V  
85  
80  
75  
85  
80  
75  
VIN =24V  
70  
70  
65  
60  
65  
60  
0
500  
1000  
1500  
2000  
2500  
3000  
0
500  
1000  
1500  
2000  
2500  
3000  
Load Current (mA)  
Load Current (mA)  
Output CC/CV Curve (5V Vout)  
Efficiency vs. Load current ( 12V Vout)  
6.0  
5.0  
4.0  
3.0  
2.0  
100  
95  
90  
VIN =12V  
VIN =24V  
VIN =12V  
VIN =24V  
85  
80  
75  
70  
1.0  
0
65  
60  
0
500  
1000  
1500  
2000  
2500  
3000  
0
5000  
1000  
1500  
2000  
2500  
3000  
3500  
Load Current (mA)  
Output Current (mA)  
Output CC/CV Curve (12V Vout)  
Output CC/CV Curve (9V Vout)  
10.0  
8.0  
14.0  
12.0  
10.0  
8.0  
VIN =24V  
VIN =12V  
VIN =12V  
6.0  
VIN =24V  
6.0  
4.0  
4.0  
2.0  
0
2.0  
0
0
5000  
1000  
1500  
2000  
2500  
3000  
3500  
0
5000  
1000  
1500  
2000  
2500  
3000  
3500  
Output Current (mA)  
Output Current (mA)  
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ACT4529M  
Rev 1, 23-Feb-17  
TYPICAL PERFORMANCE CHARACTERISTICS  
(Schematic as show in typical application circuit, Ta = 25°C, unless otherwise specified)  
Output Over Voltage (5V Vout)  
Start up into CC Mode  
CH1  
CH1  
CH2  
CH2  
CH3  
CH1: VIN, 10V/div  
CH1: VOUT, 1V/div  
CH2: SW, 10V/div  
TIME: 1ms/div  
CH2: VOUT, 2V/div  
CH3: IOUT, 2A/div  
TIME: 400µs/div  
Load Transient (80mA-1A-80mA)  
Vin=12V, Vout=5V  
Load Transient (1A-2.4A-1A)  
Vin=12V, Vout=5V  
CH1  
CH2  
CH1  
CH2  
CH1: VOUT, 100mV/div  
CH2: IOUT, 1A/div  
TIME: 400us//div  
CH1: VOUT, 200mV/div  
CH2: IOUT, 1A/div  
TIME: 400us//div  
Load Transient (80mA-1A-80mA)  
Vin=12.6V, Vout=12V  
Load Transient (1A-2.4A-1A)  
Vin=12.6V, Vout=12V  
CH1  
CH2  
CH1  
CH2  
CH1: VOUT, 200mV/div  
CH2: IOUT, 1A/div  
TIME: 400us//div  
CH1: VOUT, 200mV/div  
CH2: IOUT, 1A/div  
TIME: 400us//div  
Innovative PowerTM  
- 13 -  
www.active-semi.com  
Copyright © 2016-2017 Active-Semi, Inc.  
ACT4529M  
Rev 1, 23-Feb-17  
TYPICAL PERFORMANCE CHARACTERISTICS  
(Schematic as show in typical application circuit, Ta = 25°C, unless otherwise specified)  
Voltage Transient (5V-9V)  
Voltage Transient (9V-5V)  
CH1  
CH1  
CH1: VOUT, 2V/div  
TIME: 10ms//div  
CH1: VOUT, 2V/div  
TIME: 10ms//div  
Voltage Transient (5V-12V)  
Voltage Transient (12V-5V)  
CH1  
CH1  
CH1: VOUT, 2V/div  
TIME: 10ms//div  
CH1: VOUT, 2V/div  
TIME: 10ms//div  
Innovative PowerTM  
- 14 -  
www.active-semi.com  
Copyright © 2016-2017 Active-Semi, Inc.  
ACT4529M  
Rev 1, 23-Feb-17  
PACKAGE OUTLINE  
SOP-8EP PACKAGE OUTLINE AND DIMENSIONS  
DIMENSION IN  
MILLIMETERS  
DIMENSION IN  
INCHES  
SYMBOL  
MIN  
MAX  
1.727  
0.152  
1.550  
0.510  
0.250  
5.100  
3.402  
4.000  
6.200  
2.513  
MIN  
MAX  
A
A1  
A2  
b
1.350  
0.000  
1.245  
0.330  
0.170  
4.700  
3.202  
3.734  
5.800  
2.313  
0.053 0.068  
0.000 0.006  
0.049 0.061  
0.013 0.020  
0.007 0.010  
0.185 0.200  
0.126 0.134  
0.147 0.157  
0.228 0.244  
0.091 0.099  
0.050 TYP  
c
D
D1  
E
E1  
E2  
e
1.270 TYP  
0.400  
0°  
1.270  
8°  
0.016 0.050  
L
0°  
8°  
θ
Active-Semi, Inc. reserves the right to modify the circuitry or specifications without notice. Users should evaluate each  
product to make sure that it is suitable for their applications. Active-Semi products are not intended or authorized for use  
as critical components in life-support devices or systems. Active-Semi, Inc. does not assume any liability arising out of  
the use of any product or circuit described in this datasheet, nor does it convey any patent license.  
Active-Semi and its logo are trademarks of Active-Semi, Inc. For more information on this and other products, contact  
sales@active-semi.com or visit http://www.active-semi.com.  
is a registered trademark of Active-Semi.  
Innovative PowerTM  
- 15 -  
www.active-semi.com  
Copyright © 2016-2017 Active-Semi, Inc.  

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