ACT8935QJ1E2-T [ACTIVE-SEMI]

Advanced PMU for SiRF PrimaTM and Atlas IVTM;
ACT8935QJ1E2-T
型号: ACT8935QJ1E2-T
厂家: ACTIVE-SEMI, INC    ACTIVE-SEMI, INC
描述:

Advanced PMU for SiRF PrimaTM and Atlas IVTM

文件: 总46页 (文件大小:710K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ACT8935  
Rev 4, 17-Sep-13  
Advanced PMU for SiRF PrimaTM and Atlas IVTM  
FEATURES  
GENERAL DESCRIPTION  
Optimized for SiRF PrimaTM/Atlas IVTM Processors  
Three Step-Down DC/DC Converters  
Four Low-Dropout Linear Regulators  
Integrated ActivePathTM Charger  
The ACT8935 is a complete, cost effective, highly-  
efficient ActivePMUTM power management solution,  
optimized for the unique power, voltage-  
sequencing, and control requirements of the SiRF  
PrimaTM and Atlas IVTM processors.  
I2CTM Serial Interface  
This device features three step-down DC/DC  
converters and four low-noise, low-dropout linear  
regulators, along with a complete battery charging  
solution featuring the advanced ActivePathTM  
system-power selection function.  
Advanced Enable/Disable Sequencing Controller  
Minimal External Components  
Tiny 5×5mm TQFN55-40 Package  
0.75mm Package Height  
The three DC/DC converters utilize  
a high-  
efficiency, fixed-frequency (2MHz), current-mode  
PWM control architecture that requires a minimum  
number of external components. Two DC/DCs are  
capable of supplying up to 900mA of output current,  
while the third supports up to 700mA. All four low-  
dropout linear regulators are high-performance,  
low-noise regulators that each supply up to 150mA.  
Pb-Free and RoHS Compliant  
The ACT8935 is available in a compact, Pb-Free  
and RoHS-compliant TQFN55-40 package.  
TYPICAL APPLICATION DIAGRAM  
Innovative PowerTM  
www.active-semi.com  
- 1 -  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
I2CTM is a trademark of NXP.  
Copyright © 2013 Active-Semi, Inc.  
SiRF PrimaTM and Atlas IVTM are trademarks of SiRF Technology, Inc.  
ACT8935  
Rev 4, 17-Sep-13  
TABLE OF CONTENTS  
General Information.....................................................................................................................................p. 01  
Functional Block Diagram............................................................................................................................p. 03  
Ordering Information....................................................................................................................................p. 04  
Pin Configuration .........................................................................................................................................p. 04  
Pin Descriptions...........................................................................................................................................p. 05  
Absolute Maximum Ratings.........................................................................................................................p. 07  
I2C Interface Electrical Characteristics ........................................................................................................p. 08  
Global Register Map....................................................................................................................................p. 09  
Register and Bit Descriptions ......................................................................................................................p. 10  
System Control Electrical Characteristics....................................................................................................p. 15  
Step-Down DC/DC Electrical Characteristics..............................................................................................p. 16  
Low-Noise LDO Electrical Characteristics...................................................................................................p. 17  
ActivePathTM Charger Electrical Characteristics..........................................................................................p. 18  
Typical Performance Characteristics...........................................................................................................p. 20  
Application Information ................................................................................................................................p. 27  
Interfacing with the SiRF PrimaTM/Atlas IVTM ...................................................................................p. 27  
Control Signals.................................................................................................................................p. 28  
Push-Button Control.........................................................................................................................p. 29  
Control Sequences...........................................................................................................................p. 29  
Functional Description .................................................................................................................................p. 33  
I2C Interface .....................................................................................................................................p. 33  
Voltage Monitor and Interrupt...........................................................................................................p. 33  
Thermal Shutdown ...........................................................................................................................p. 34  
Step-Down DC/DC Regulators ....................................................................................................................p. 35  
General Description..........................................................................................................................p. 35  
100% Duty Cycle Operation.............................................................................................................p. 35  
Synchronous Rectification................................................................................................................p. 35  
Soft-Start ..........................................................................................................................................p. 35  
Compensation ..................................................................................................................................p. 35  
Configuration Options.......................................................................................................................p. 35  
OK[ ] and Output Fault Interrupt.......................................................................................................p. 36  
PCB Layout Considerations.............................................................................................................p. 36  
Low-Noise, Low-Dropout Linear Regulators................................................................................................p. 37  
General Description..........................................................................................................................p. 37  
Output Current Limit.........................................................................................................................p. 37  
Compensation ..................................................................................................................................p. 37  
Configuration Options.......................................................................................................................p. 37  
OK[ ] and Output Fault Interrupt.......................................................................................................p. 37  
PCB Layout Considerations.............................................................................................................p. 37  
ActivePathTM Charger ..................................................................................................................................p. 39  
General Description..........................................................................................................................p. 39  
ActivePath Architecture....................................................................................................................p. 39  
System Configuration Optimization..................................................................................................p. 39  
Input Protection ................................................................................................................................p. 39  
Battery Management........................................................................................................................p. 39  
Charge Current Programming..........................................................................................................p. 40  
Charger Input Interrupts ...................................................................................................................p. 40  
Charge-Control State Machine.........................................................................................................p. 42  
State Machine Interrupts..................................................................................................................p. 42  
Thermal Regulation..........................................................................................................................p. 43  
Charge Safety Timers ......................................................................................................................p. 43  
Charge Timer Interrupts ...................................................................................................................p. 43  
Charge Status Indicator....................................................................................................................p. 43  
Reverse-Current Protection .............................................................................................................p. 43  
Battery Temperature Monitoring ......................................................................................................p. 43  
Battery Temperature Interrupts........................................................................................................p. 44  
TQFN55-40 Package Outline and Dimensions ...........................................................................................p. 45  
Innovative PowerTM  
- 2 -  
www.active-semi.com  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
Copyright © 2013 Active-Semi, Inc.  
ACT8935  
Rev 4, 17-Sep-13  
FUNCTIONAL BLOCK DIAGRAM  
(Optional)  
BODY  
SWITCH  
CHGIN  
ACIN  
AC Adaptor  
USB  
ACT8935  
4.35V to 6V  
System Supply  
VSYS  
BODY  
SWITCH  
ActivePath  
Control  
BAT  
Li+ Battery  
VSYS  
+
nSTAT  
102µA  
CURRENT SENSE  
VOLTAGE SENSE  
CHARGE STATUS  
TH  
PRE-  
CONDITION  
CHGLEV  
ISET  
Charge  
Control  
2.85V  
VP1  
To VSYS  
THERMAL  
REGULATION  
OUT2  
110°C  
SW1  
OUT1  
GP12  
OUT1  
nRSTO  
PBIN  
PUSH BUTTON  
VP2  
To VSYS  
OUT2  
SW2  
OUT2  
GP12  
nPBSTAT  
OUT2  
OUT2  
nIRQ  
VP3  
To VSYS  
SW3  
OUT3  
GP3  
PWRHLD  
OUT3  
System  
Control  
PWREN  
EXTON  
SCL  
INL  
To VSYS  
OUT4  
OUT4  
REG4  
LDO  
SDA  
BAT  
OUT5  
OUT6  
OUT7  
LBI  
REG5  
LDO  
-
OUT5  
OUT6  
OUT7  
1.2V  
OUT2  
+
nLBO  
REG6  
LDO  
REG7  
LDO  
REFBP  
Reference  
GA  
EP  
Innovative PowerTM  
- 3 -  
www.active-semi.com  
Copyright © 2013 Active-Semi, Inc.  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
ACT8935  
Rev 4, 17-Sep-13  
ORDERING INFORMATIONꢀꢁ  
TEMPERATURE  
RANGE  
PART NUMBER  
VOUT1  
VOUT2  
VOUT3 VOUT4 VOUT5 VOUT6 VOUT7 PACKAGE PINS  
ACT8935QJ10D-T  
ACT8935QJ1E2-T  
1.8V  
2.5V  
3.3V  
3.3V  
1.2V  
1.2V  
1.2V 1.2V 2.5V 3.3V TQFN55-40  
1.2V 1.2V 2.5V 3.3V TQFN55-40  
40  
40  
-40°C to +85°C  
-40°C to +85°C  
: All Active-Semi components are RoHS Compliant and with Pb-free plating unless otherwise specified.  
: Standard product options are listed in this table. Contact factory for custom options. Minimum order quantity is 12,000 units.  
ACT8935QJ_ _ _-T  
Active-Semi  
Product Number  
Package Code  
Pin Count  
Option Code  
Tape and Reel  
PIN CONFIGURATION  
TOP VIEW  
ACTIVE  
AA33  
DATE CODE  
Thin - QFN (TQFN55-40)  
Innovative PowerTM  
- 4 -  
www.active-semi.com  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
Copyright © 2013 Active-Semi, Inc.  
ACT8935  
Rev 4, 17-Sep-13  
PIN DESCRIPTIONS  
PIN  
NAME  
DESCRIPTION  
Reference Bypass. Connect a 0.047μF ceramic capacitor from REFBP to GA. This pin is  
discharged to GA in shutdown.  
1
REFBP  
2
3
4
5
6
7
8
OUT1  
GA  
Output Feedback Sense for REG1.  
Analog Ground. Connect GA directly to a quiet ground node. Connect GA, GP12 and GP3  
together at a single point as close to the IC as possible.  
REG4 output. Capable of delivering up to 150mA of output current. Connect a 1.5µF ceramic  
capacitor from OUT4 to GA. The output is discharged to GA with 1.5kresistor when disabled.  
OUT4  
OUT5  
INL  
REG5 output. Capable of delivering up to 150mA of output current. Connect a 1.5µF ceramic  
capacitor from OUT5 to GA. The output is discharged to GA with 1.5kresistor when disabled.  
Power Input for REG4, REG5, REG6, and REG7. Bypass to GA with a high quality ceramic  
capacitor placed as close to the IC as possible.  
REG7 output. Capable of delivering up to 150mA of output current. Connect a 1.5µF ceramic  
capacitor from OUT7 to GA. The output is discharged to GA with 1.5kresistor when disabled.  
OUT7  
OUT6  
REG6 output. Capable of delivering up to 150mA of output current. Connect a 1.5µF ceramic  
capacitor from OUT6 to GA. The output is discharged to GA with 1.5kresistor when disabled.  
Master Enable Input. Drive PBIN to VSYS through a 50kresistor to enable the IC, drive PBIN  
directly to VSYS to assert a manual reset condition. Refer to the PBIN Multi-Function Input section  
for more information. PBIN is internally pulled down to GA through a 35kresistor.  
9
PBIN  
10  
11  
PWRHLD Power Hold Input. Refer to the Control Sequences section for more information.  
nRSTO  
nIRQ  
Active Low Reset Output. See the nRSTO Output section for more information.  
Open-Drain Interrupt Output. nIRQ is asserted any time an unmasked fault condition exists or a  
charger interrupt occurs. See the nIRQ Output section for more information.  
12  
13  
Active-Low Open-Drain Push-Button Status Output. nPBSTAT is asserted low whenever the PBIN  
is pushed, and is high-Z otherwise. See the nPBSTAT Output section for more information.  
nPBSTAT  
Power Ground for REG3. Connect GA, GP12, and GP3 together at a single point as close to the  
IC as possible.  
14  
15  
16  
GP3  
SW3  
VP3  
Switching Node Output for REG3.  
Power Input for REG3. Bypass to GP3 with a high quality ceramic capacitor placed as close to the  
IC as possible.  
17  
18  
19  
OUT3  
Output Feedback Sense for REG3.  
PWREN Power Enable Input. Refer to the Control Sequences section for more information.  
Low Battery Indicator Output. nLBO is asserted low whenever the voltage at LBI is lower than  
nLBO  
1.2V, and is high-Z otherwise. See the Precision Voltage Detector section for more information.  
Low Battery Input. The input voltage is compared to 1.2V and the output of this comparison drives  
nLBO. See the Precision Voltage Detector section for more information.  
20  
LBI  
21  
22  
ACIN  
AC Input Supply Detection. See the Charge Current Programming section for more information.  
CHGLEV Charge Current Selection Input. See the Charge Current Programming section for more information.  
Innovative PowerTM  
- 5 -  
www.active-semi.com  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
Copyright © 2013 Active-Semi, Inc.  
ACT8935  
Rev 4, 17-Sep-13  
PIN DESCRIPTIONS CONT’D  
PIN  
NAME  
DESCRIPTION  
Charge Current Set. Program the charge current by connecting a resistor (RISET) between ISET  
and GA. See the Charge Current Programming section for more information.  
23  
ISET  
Temperature Sensing Input. Connect to battery thermistor. TH is pulled up with a 102µA (typ) current  
internally. See the Battery Temperature Monitoring section for more information.  
24  
25  
TH  
System Wake Up Input. Drive to VSYS or a logic high to wake up the IC from Sleep Mode or  
Deep Sleep Mode.  
EXTON  
26  
27  
SCL  
SDA  
Clock Input for I2C Serial Interface.  
Data Input for I2C Serial Interface. Data is read on the rising edge of SCL.  
Active-Low Open-Drain Charger Status Output. nSTAT has a 8mA (typ) current limit, allowing it  
to directly drive an indicator LED without additional external components. See the Charge Status  
Indicator section for more information.  
28  
nSTAT  
29, 30  
31, 32  
BAT  
Battery Charger Output. Connect this pin directly to the battery anode (+ terminal)  
System Output Pin. Bypass to GA with a 10µF or larger ceramic capacitor.  
VSYS  
Power Input for the Battery Charger. Bypass CHGIN to GA with a capacitor placed as close to  
the IC as possible. The battery charger is automatically enabled when a valid voltage is present  
on CHGIN .  
33  
34  
CHGIN  
OUT2  
Output Feedback Sense for REG2.  
Power Input for REG2. Bypass to GP12 with a high quality ceramic capacitor placed as close to  
the IC as possible.  
35  
36  
37  
38  
39  
VP2  
SW2  
GP12  
SW1  
VP1  
Switching Node Output for REG2.  
Power Ground for REG1 and REG2. Connect GA, GP12 and GP3 together at a single point as  
close to the IC as possible.  
Switching Node Output for REG1.  
Power Input for REG1. Bypass to GP12 with a high quality ceramic capacitor placed as close to  
the IC as possible.  
40  
NC  
EP  
No Connect. Not internally connected.  
EP  
Exposed Pad. Must be soldered to ground on PCB.  
Innovative PowerTM  
www.active-semi.com  
- 6 -  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
Copyright © 2013 Active-Semi, Inc.  
ACT8935  
Rev 4, 17-Sep-13  
ABSOLUTE MAXIMUM RATINGSꢀ  
PARAMETER  
VALUE  
UNIT  
VP1, VP2 to GP12  
VP3 to GP3  
-0.3 to + 6  
V
BAT, VSYS, INL to GA  
CHGIN to GA  
-0.3 to + 6  
-0.3 to +14  
V
V
V
V
V
V
SW1, OUT1 to GP12  
-0.3 to (VVP1 + 0.3)  
-0.3 to (VVP2 + 0.3)  
-0.3 to (VVP3 + 0.3)  
-0.3 to + 6  
SW2, OUT2 to GP12  
SW3, OUT3 to GP3  
nIRQ, nLBO, nPBSTAT, nRSTO, nSTAT to GA  
PBIN, ACIN, CHGLEV, ISET, LBI, PWRHLD, PWREN, REFBP, SCL, SDA, TH,  
EXTON to GA  
-0.3 to (VSYS +  
0.3)  
V
OUT4, OUT5, OUT6, OUT7 to GA  
GP12, GP3 to GA  
-0.3 to (VINL + 0.3)  
-0.3 to + 0.3  
-40 to 85  
V
V
Operating Ambient Temperature  
Maximum Junction Temperature  
°C  
°C  
125  
Maximum Power Dissipation  
2.7  
W
TQFN55-40 (Thermal Resistance θJA = 30oC/W)  
Storage Temperature  
-65 to 150  
300  
°C  
°C  
Lead Temperature (Soldering, 10 sec)  
: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may  
affect device reliability.  
Innovative PowerTM  
- 7 -  
www.active-semi.com  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
Copyright © 2013 Active-Semi, Inc.  
ACT8935  
Rev 4, 17-Sep-13  
I2C INTERFACE ELECTRICAL CHARACTERISTICS  
(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)  
PARAMETER  
SCL, SDA Input Low  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
V
VVSYS = 3.1V to 5.5V, TA = -40ºC to 85ºC  
0.35  
SCL, SDA Input High  
SDA Leakage Current  
SCL Leakage Current  
SDA Output Low  
V
VSYS = 3.1V to 5.5V, TA = -40ºC to 85ºC  
1.55  
V
1
µA  
µA  
V
8
18  
I
OL = 5mA  
0.35  
SCL Clock Period, tSCL  
SDA Data Setup Time, tSU  
SDA Data Hold Time, tHD  
Start Setup Time, tST  
Stop Setup Time, tSP  
1.5  
100  
300  
100  
100  
µs  
ns  
ns  
ns  
ns  
For Start Condition  
For Stop Condition  
Figure 1:  
I2C Compatible Serial Bus Timing  
tSCL  
SCL  
tST  
tHD  
tSU  
tSP  
SDA  
Start  
Stop  
condition  
condition  
Innovative PowerTM  
- 8 -  
www.active-semi.com  
Copyright © 2013 Active-Semi, Inc.  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
ACT8935  
Rev 4, 17-Sep-13  
GLOBAL REGISTER MAP  
BITS  
OUTPUT ADDRESS  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
NAME  
DEFAULTꢀ  
TRST  
nSYSMODE nSYSLEVMSK nSYSSTAT SYSLEV[3] SYSLEV[2] SYSLEV[1] SYSLEV[0]  
SYS  
0x00  
0
1
0
R
0
1
1
1
NAME  
Reserved  
Reserved  
PWRDS  
Reserved  
SCRATCH SCRATCH  
DSRDY  
SDREQ  
SYS  
0x01  
0x20  
0x21  
0x22  
0x30  
0x31  
0x32  
0x40  
0x41  
0x42  
0x50  
0x51  
0x54  
0x55  
0x60  
0x61  
0x64  
0x65  
0x70  
0x71  
0x78  
0x79  
0x7A  
DEFAULTꢀ  
NAME  
DEFAULTꢀ  
0
0
0
0
0
0
0
0
Reserved  
Reserved  
VSET[5]  
VSET[4]  
VSET[3]  
VSET[2]  
VSET[1]  
VSET[0]  
REG1  
REG1  
REG1  
REG2  
REG2  
REG2  
REG3  
REG3  
REG3  
REG4  
REG4  
REG5  
REG5  
REG6  
REG6  
REG7  
REG7  
APCH  
APCH  
APCH  
APCH  
APCH  
0
0
1
0
0
1
Reserved  
1
0
Reserved  
0
0
NAME  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
DEFAULTꢀ  
NAME  
DEFAULTꢀ  
0
0
1
0
0
0
ON  
PHASE  
MODE  
DELAY[2]  
DELAY[1]  
DELAY[0] nFLTMSK  
OK  
0
0
0
0
1
1
0
R
NAME  
Reserved  
Reserved  
VSET[5]  
VSET[4]  
VSET[3]  
VSET[2]  
VSET[1]  
VSET[0]  
DEFAULTꢀ  
NAME  
DEFAULTꢀ  
0
0
1
1
1
0
Reserved  
0
0
Reserved  
0
1
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
0
0
1
1
1
1
NAME  
ON  
PHASE  
MODE  
DELAY[2]  
DELAY[1]  
DELAY[0] nFLTMSK  
OK  
DEFAULTꢀ  
NAME  
DEFAULTꢀ  
0
0
0
0
1
1
0
R
Reserved  
Reserved  
VSET[5]  
VSET[4]  
VSET[3]  
VSET[2]  
VSET[1]  
VSET[0]  
0
0
0
1
1
0
Reserved  
0
0
Reserved  
0
0
NAME  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
DEFAULTꢀ  
NAME  
DEFAULTꢀ  
0
0
0
1
1
0
ON  
PWRSTAT  
MODE  
DELAY[2]  
DELAY[1]  
DELAY[0] nFLTMSK  
OK  
0
0
0
0
0
0
VSET[2]  
0
0
VSET[1]  
0
R
NAME  
Reserved  
Reserved  
VSET[5]  
VSET[4]  
VSET[3]  
VSET[0]  
DEFAULTꢀ  
NAME  
DEFAULTꢀ  
0
0
0
1
1
0
ON  
DIS  
LOWIQ  
DELAY[2]  
DELAY[1]  
DELAY[0] nFLTMSK  
OK  
0
1
0
0
0
0
VSET[2]  
0
0
VSET[1]  
0
R
NAME  
Reserved  
Reserved  
VSET[5]  
VSET[4]  
VSET[3]  
VSET[0]  
DEFAULTꢀ  
NAME  
DEFAULTꢀ  
0
0
0
1
1
0
ON  
DIS  
LOWIQ  
DELAY[2]  
DELAY[1]  
DELAY[0] nFLTMSK  
OK  
0
1
0
0
0
0
VSET[2]  
0
0
VSET[1]  
0
R
NAME  
Reserved  
Reserved  
VSET[5]  
VSET[4]  
VSET[3]  
VSET[0]  
DEFAULTꢀ  
NAME  
DEFAULTꢀ  
0
0
1
1
0
1
ON  
DIS  
LOWIQ  
DELAY[2]  
DELAY[1]  
DELAY[0] nFLTMSK  
OK  
0
1
0
0
0
0
VSET[2]  
0
0
VSET[1]  
0
R
NAME  
Reserved  
Reserved  
VSET[5]  
VSET[4]  
VSET[3]  
VSET[0]  
DEFAULTꢀ  
NAME  
DEFAULTꢀ  
0
0
1
1
1
1
ON  
DIS  
LOWIQ  
DELAY[2]  
DELAY[1]  
DELAY[0] nFLTMSK  
OK  
0
1
0
Reserved  
0
0
Reserved  
1
0
Reserved  
0
0
Reserved  
0
0
Reserved  
0
R
Reserved  
0
NAME  
Reserved  
Reserved  
DEFAULTꢀ  
NAME  
DEFAULTꢀ  
0
SUSCHG  
0
1
Reserved  
0
TOTTIMO[1] TOTTIMO[0] PRETIMO[1] PRETIMO[0] OVPSET[1] OVPSET[0]  
1
0
CHGSTAT  
0
1
0
0
INDAT  
R
0
NAME  
TIMRSTAT TEMPSTAT  
INSTAT  
TIMRDAT TEMPDAT  
CHGDAT  
DEFAULTꢀ  
NAME  
DEFAULTꢀ  
0
0
0
R
R
R
TIMRTOT  
TEMPIN  
INCON  
CHGEOCIN TIMRPRE TEMPOUT  
INDIS  
0
CHGEOCOUT  
0
Reserved  
0
0
Reserved  
0
0
CSTATE[0]  
R
0
0
0
0
Reserved  
R
NAME  
DEFAULTꢀ  
CSTATE[1] Reserved  
Reserved ACINSTAT  
R
R
R
R
: Default values of ACT8935QJ10D-T.  
2: All bits are automatically cleared to default values when the input power is removed or falls below the system UVLO.  
Innovative PowerTM  
- 9 -  
www.active-semi.com  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
Copyright © 2013 Active-Semi, Inc.  
ACT8935  
Rev 4, 17-Sep-13  
REGISTER AND BIT DESCRIPTIONS  
Table 1:  
Global Register Map  
OUTPUT ADDRESS BIT  
NAME  
ACCESS  
DESCRIPTION  
Reset Timer Setting. Defines the reset time-out threshold. Reset  
time-out is 65ms when value is 1, reset time-out is 260ms when  
value is 0. See nRSTO Output section for more information.  
SYS  
SYS  
0x00  
0x00  
[7]  
TRST  
R/W  
SYSLEV Mode Select. Defines the response to the SYSLEV  
voltage detector, 1: Generate an interrupt when VVSYS falls  
below the programmed SYSLEV threshold, 0: automatic  
shutdown when VVSYS falls below the programmed SYSLEV  
threshold.  
[6]  
nSYSMODE  
R/W  
System Voltage Level Interrupt Mask. SYSLEV interrupt is  
masked by default, set to 1 to unmask this interrupt. See the  
Programmable System Voltage Monitor section for more  
information  
SYS  
SYS  
0x00  
0x00  
[5] nSYSLEVMSK R/W  
System Voltage Status. Value is 1 when VVSYS is lower than the  
SYSLEV voltage threshold, value is 0 when VVSYS is higher than  
the system voltage detection threshold.  
[4]  
nSYSSTAT  
R
System Voltage Detect Threshold. Defines the SYSLEV voltage  
threshold. See the Programmable System Voltage Monitor  
section for more information.  
SYS  
SYS  
SYS  
SYS  
SYS  
0x00  
0x01  
0x01  
0x01  
0x01  
[3:0]  
[7:6]  
[5]  
SYSLEV  
R/W  
R/W  
R/W  
R/W  
R/W  
-
Reserved.  
DEEP-SLEEP Enable Bit. Set bit to 1 to enter DEEP-SLEEP  
mode, clear bit to 0 to wake from DEEP-SLEEP. Bit  
automatically cleared to 0 when PBIN asserted.  
PWRDS  
-
[4]  
Reserved.  
Scratchpad Bits. Non-functional bits, maybe be used by user to  
store system status information. Volatile bits, which are cleared  
when system voltage falls below UVLO threshold.  
[3:2]  
SCRATCH  
Deep-Sleep Ready Flag. Set bit to 1 before entering DEEP-  
SLEEP mode, then read bit during enable sequence to identify  
system status: if bit value is 1 the system is waking from DEEP-  
SLEEP mode, if bit value is 0 the system is waking from a  
disabled state.  
SYS  
0x01  
[1]  
DSRDY  
R/W  
R/W  
Shutdown Request Flag. Set the bit value right after start-up  
then microprocessor could check whenever the second push-  
button is asserted.  
SYS  
0x01  
[0]  
SDREQ  
REG1  
REG1  
REG1  
REG1  
0x20  
0x20  
0x21  
0x22  
[7:6]  
[5:0]  
[7:0]  
[7]  
-
VSET  
-
R
Reserved.  
Output Voltage Selection. See the Output Voltage Programming  
section for more information.  
R/W  
R
Reserved.  
Regulator Enable Bit. Set bit to 1 to enable the regulator, clear  
bit to 0 to disable the regulator.  
ON  
R/W  
Regulator Phase Control. Set bit to 1 for the regulator to operate  
180° out of phase with the oscillator, clear bit to 0 for the  
regulator to operate in phase with the oscillator.  
REG1  
REG1  
0x22  
0x22  
[6]  
[5]  
PHASE  
MODE  
R/W  
R/W  
Regulator Mode Select. Set bit to 1 for fixed-frequency PWM  
under all load conditions, clear bit to 0 to transit to power-  
savings mode under light-load conditions.  
Regulator Turn-On Delay Control. See the REG1, REG2, REG3  
Turn-on Delay section for more information.  
REG1  
REG1  
REG1  
0x22  
0x22  
0x22  
[4:2]  
[1]  
DELAY  
nFLTMSK  
OK  
R/W  
R/W  
R
Regulator Fault Mask Control. Set bit to 1 enable fault-interrupts,  
clear bit to 0 to disable fault-interrupts.  
Regulator Power-OK Status. Value is 1 when output voltage  
exceeds the power-OK threshold, value is 0 otherwise.  
[0]  
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ACT8935  
Rev 4, 17-Sep-13  
REGISTER AND BIT DESCRIPTIONS CONT’D  
OUTPUT ADDRESS BIT  
NAME  
ACCESS  
DESCRIPTION  
REG2  
REG2  
REG2  
REG2  
0x30  
0x30  
0x31  
0x32  
[7:6]  
[5:0]  
[7:0]  
[7]  
-
R
Reserved.  
Output Voltage Selection. See the Output Voltage  
Programming section for more information.  
VSET  
-
R/W  
R
Reserved.  
Regulator Enable Bit. Set bit to 1 to enable the regulator, clear  
bit to 0 to disable the regulator.  
ON  
R/W  
Regulator Phase Control. Set bit to 1 for the regulator to  
operate 180° out of phase with the oscillator, clear bit to 0 for  
the regulator to operate in phase with the oscillator.  
REG2  
REG2  
0x32  
0x32  
[6]  
[5]  
PHASE  
MODE  
R/W  
R/W  
Regulator Mode Select. Set bit to 1 for fixed-frequency PWM  
under all load conditions, clear bit to 0 to transit to power-  
savings mode under light-load conditions.  
Regulator Turn-On Delay Control. See the REG1, REG2,  
REG3 Turn-on Delay section for more information.  
REG2  
REG2  
0x32  
0x32  
[4:2]  
[1]  
DELAY  
R/W  
R/W  
Regulator Fault Mask Control. Set bit to 1 enable fault-  
interrupts, clear bit to 0 to disable fault-interrupts.  
nFLTMSK  
Regulator Power-OK Status. Value is 1 when output voltage  
exceeds the power-OK threshold, value is 0 otherwise.  
REG2  
REG3  
REG3  
REG3  
REG3  
0x32  
0x40  
0x40  
0x41  
0x42  
[0]  
OK  
R
R
[7:6]  
[5:0]  
[7:0]  
[7]  
-
VSET  
-
Reserved.  
Output Voltage Selection. See the Output Voltage  
Programming section for more information.  
R/W  
R
Reserved.  
Regulator Enable Bit. Set bit to 1 to enable the regulator, clear  
bit to 0 to disable the regulator.  
ON  
R/W  
Configures regulator behavior with respect to the PBIN input.  
Set bit to 0 to enable regulator when PBIN is asserted  
REG3  
REG3  
0x42  
0x42  
[6]  
[5]  
PWRSTAT  
MODE  
R/W  
R/W  
Regulator Mode Select. Set bit to 1 for fixed-frequency PWM  
under all load conditions, clear bit to 0 to transit to power-  
savings mode under light-load conditions.  
Regulator Turn-On Delay Control. See the REG1, REG2,  
REG3 Turn-on Delay section for more information.  
REG3  
REG3  
0x42  
0x42  
[4:2]  
[1]  
DELAY  
R/W  
R/W  
Regulator Fault Mask Control. Set bit to 1 enable fault-  
interrupts, clear bit to 0 to disable fault-interrupts.  
nFLTMSK  
Regulator Power-OK Status. Value is 1 when output voltage  
exceeds the power-OK threshold, value is 0 otherwise.  
REG3  
REG4  
REG4  
0x42  
0x50  
0x50  
[0]  
OK  
-
R
R
[7:6]  
[5:0]  
Reserved.  
Output Voltage Selection. See the Output Voltage  
Programming section for more information.  
VSET  
R/W  
Regulator Enable Bit. Set bit to 1 to enable the regulator, clear  
bit to 0 to disable the regulator.  
REG4  
REG4  
0x51  
0x51  
[7]  
[6]  
ON  
R/W  
R/W  
Output Discharge Control. When activated, LDO output is  
discharged to GA through 1.5kresistor when in shutdown.  
Set bit to 1 to enable output voltage discharge in shutdown,  
clear bit to 0 to disable this function.  
DIS  
LDO Low-IQ Mode Control. Set bit to 1 for low-power  
operating mode, clear bit to 0 for normal mode.  
REG4  
REG4  
REG4  
0x51  
0x51  
0x51  
[5]  
[4:2]  
[1]  
LOWIQ  
DELAY  
R/W  
R/W  
R/W  
Regulator Turn-On Delay Control. See the REG4, REG5,  
REG6, REG7 Turn-on Delay section for more information.  
Regulator Fault Mask Control. Set bit to 1 enable fault-  
interrupts, clear bit to 0 to disable fault-interrupts.  
nFLTMSK  
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ACT8935  
Rev 4, 17-Sep-13  
REGISTER AND BIT DESCRIPTIONS CONT’D  
OUTPUT ADDRESS BIT  
NAME  
ACCESS  
DESCRIPTION  
Regulator Power-OK Status. Value is 1 when output voltage  
exceeds the power-OK threshold, value is 0 otherwise.  
REG4  
REG5  
REG5  
0x51  
0x54  
0x54  
[0]  
OK  
-
R
R
[7:6]  
[5:0]  
Reserved.  
Output Voltage Selection. See the Output Voltage  
Programming section for more information.  
VSET  
R/W  
Regulator Enable Bit. Set bit to 1 to enable the regulator,  
clear bit to 0 to disable the regulator.  
REG5  
REG5  
0x55  
0x55  
[7]  
[6]  
ON  
R/W  
R/W  
Output Discharge Control. When activated, LDO output is  
discharged to GA through 1.5kresistor when in shutdown.  
Set bit to 1 to enable output voltage discharge in shutdown,  
clear bit to 0 to disable this function.  
DIS  
LDO Low-IQ Mode Control. Set bit to 1 for low-power  
operating mode, clear bit to 0 for normal mode.  
REG5  
REG5  
REG5  
0x55  
0x55  
0x55  
[5]  
[4:2]  
[1]  
LOWIQ  
DELAY  
R/W  
R/W  
R/W  
Regulator Turn-On Delay Control. See the REG4, REG5,  
REG6, REG7 Turn-on Delay section for more information.  
Regulator Fault Mask Control. Set bit to 1 enable fault-  
interrupts, clear bit to 0 to disable fault-interrupts.  
nFLTMSK  
Regulator Power-OK Status. Value is 1 when output voltage  
exceeds the power-OK threshold, value is 0 otherwise.  
REG5  
REG6  
REG6  
0x55  
0x60  
0x60  
[0]  
OK  
-
R
R
[7:6]  
[5:0]  
Reserved.  
Output Voltage Selection. See the Output Voltage  
Programming section for more information.  
VSET  
R/W  
Regulator Enable Bit. Set bit to 1 to enable the regulator,  
clear bit to 0 to disable the regulator.  
REG6  
REG6  
0x61  
0x61  
[7]  
[6]  
ON  
R/W  
R/W  
Output Discharge Control. When activated, LDO output is  
discharged to GA through 1.5kresistor when in shutdown.  
Set bit to 1 to enable output voltage discharge in shutdown,  
clear bit to 0 to disable this function.  
DIS  
LDO Low-IQ Mode Control. Set bit to 1 for low-power  
operating mode, clear bit to 0 for normal mode.  
REG6  
REG6  
REG6  
0x61  
0x61  
0x61  
[5]  
[4:2]  
[1]  
LOWIQ  
DELAY  
R/W  
R/W  
R/W  
Regulator Turn-On Delay Control. See the REG4, REG5,  
REG6, REG7 Turn-on Delay section for more information.  
Regulator Fault Mask Control. Set bit to 1 enable fault-  
interrupts, clear bit to 0 to disable fault-interrupts.  
nFLTMSK  
Regulator Power-OK Status. Value is 1 when output voltage  
exceeds the power-OK threshold, value is 0 otherwise.  
REG6  
REG7  
REG7  
0x61  
0x64  
0x64  
[0]  
OK  
-
R
R
[7:6]  
[5:0]  
Reserved.  
Output Voltage Selection. See the Output Voltage  
Programming section for more information.  
VSET  
R/W  
Regulator Enable Bit. Set bit to 1 to enable the regulator,  
clear bit to 0 to disable the regulator.  
REG7  
REG7  
0x65  
0x65  
[7]  
[6]  
ON  
R/W  
R/W  
Output Discharge Control. When activated, LDO output is  
discharged to GA through 1.5kresistor when in shutdown.  
Set bit to 1 to enable output voltage discharge in shutdown,  
clear bit to 0 to disable this function.  
DIS  
LDO Low-IQ Mode Control. Set bit to 1 for low-power  
operating mode, clear bit to 0 for normal mode.  
REG7  
REG7  
REG7  
0x65  
0x65  
0x65  
[5]  
[4:2]  
[1]  
LOWIQ  
DELAY  
R/W  
R/W  
R/W  
Regulator Turn-On Delay Control. See the REG4, REG5,  
REG6, REG7 Turn-on Delay section for more information.  
Regulator Fault Mask Control. Set bit to 1 enable fault-  
interrupts, clear bit to 0 to disable fault-interrupts.  
nFLTMSK  
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ACT8935  
Rev 4, 17-Sep-13  
REGISTER AND BIT DESCRIPTIONS CONT’D  
OUTPUT ADDRESS BIT  
NAME  
ACCESS  
DESCRIPTION  
Regulator Power-OK Status. Value is 1 when output voltage  
exceeds the power-OK threshold, value is 0 otherwise.  
REG7  
APCH  
0x65  
0x70  
[0]  
OK  
R
[7:0]  
-
R
Reserved.  
Charge Suspend Control Input. Set bit to 1 to suspend  
charging, clear bit to 0 to allow charging to resume.  
APCH  
APCH  
APCH  
0x71  
0x71  
0x71  
[7]  
[6]  
SUSCHG  
-
R/W  
R/W  
R/W  
Reserved.  
Total Charge Time-out Selection. See the Charge Safety  
Timers section for more information.  
[5:4]  
TOTTIMO  
Precondition Charge Time-out Selection. See the Charge  
Safety Timers section for more information.  
APCH  
APCH  
0x71  
0x71  
[3:2]  
[1:0]  
PRETIMO  
OVPSET  
R/W  
R/W  
Input Over-Voltage Protection Threshold Selection. See the  
Input Over-Voltage Protection section for more information.  
Charge Time-out Interrupt Status. Set this bit with  
TIMRPRE[ ] and/or TIMRTOT[ ] to 1 to generate an interrupt  
when charge safety timers expire, read this bit to get charge  
time-out interrupt status. See the Charge Safety Timers  
section for more information.  
APCH  
APCH  
APCH  
APCH  
0x78  
0x78  
0x78  
0x78  
[7]  
TIMRSTAT1  
R/W  
R/W  
R/W  
R/W  
Battery Temperature Interrupt Status. Set this bit with  
TEMPIN[ ] and/or TEMPOUT[ ] to 1 to generate an interrupt  
when a battery temperature event occurs, read this bit to get  
the battery temperature interrupt status. See the Battery  
Temperature Monitoring section for more information.  
[6] TEMPSTAT1  
Input Voltage Interrupt Status. Set this bit with INCON[ ] and/  
or INDIS[ ] to generate an interrupt when UVLO or OVP  
condition occurs, read this bit to get the input voltage  
interrupt status. See the Charge Current Programming  
section for more information.  
[5]  
[4]  
INSTAT  
Charge State Interrupt Status. Set this bit with  
CHGEOCIN[ ] and/or CHGEOCOUT[ ] to 1 to generate an  
interrupt when the state machine gets in or out of EOC state,  
read this bit to get the charger state interrupt status. See the  
State Machine Interrupts section for more information.  
CHGSTAT1  
Charge Timer Status. Value is 1 when precondition time-out  
or total charge time-out occurs. Value is 0 in other case.  
APCH  
APCH  
APCH  
APCH  
0x78  
0x78  
0x78  
0x78  
[3]  
[2]  
[1]  
[0]  
TIMRDAT1  
TEMPDAT1  
INDAT  
R
R
R
R
Temperature Status. Value is 0 when battery temperature is  
outside of valid range. Value is 1 when battery temperature is  
inside of valid range.  
Input Voltage Status. Value is 1 when a valid input at CHGIN  
is present. Value is 0 when a valid input at CHGIN is not  
present.  
Charge State Machine Status. Value is 1 indicates the  
charger state machine is in EOC state, value is 0 indicates  
the charger state machine is in other states.  
CHGDAT1  
Total Charge Time-out Interrupt control. Set both this bit and  
TIMRSTAT[ ] to 1 to generate an interrupt when a total  
charge time-out occurs. See the Charge Safety Timers  
section for more information.  
APCH  
APCH  
0x79  
0x79  
[7]  
[6]  
TIMRTOT  
TEMPIN  
R/W  
R/W  
Battery Temperature Interrupt Control. Set both this bit and  
TEMPSTAT[ ] to 1 to generate an interrupt when the battery  
temperature goes into the valid range. See the Battery  
Temperature Monitoring section for more information.  
: Valid only when CHGIN UVLO Threshold<VCHGIN<CHGIN OVP Threshold.  
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ACT8935  
Rev 4, 17-Sep-13  
REGISTER AND BIT DESCRIPTIONS CONT’D  
OUTPUT ADDRESS BIT  
NAME  
ACCESS  
DESCRIPTION  
Input Voltage Interrupt Control. Set both this bit and  
INSTAT[ ] to 1 to generate an interrupt when CHGIN input  
voltage goes into the valid range. See the Charge Current  
Programming section for more information.  
APCH  
APCH  
APCH  
APCH  
APCH  
APCH  
0x79  
0x79  
0x79  
0x79  
0x79  
0x79  
[5]  
[4]  
[3]  
[2]  
[1]  
INCON  
R/W  
Charge State Interrupt Control. Set both this bit and  
CHGSTAT[ ] to 1 to generate an interrupt when the state  
machine goes into the EOC state. See the State Machine  
Interrupts section for more information.  
CHGEOCIN  
TIMRPRE  
TEMPOUT  
INDIS  
R/W  
R/W  
R/W  
R/W  
R/W  
PRECHARGE Time-out Interrupt control. Set both this bit  
and TIMRSTAT[ ] to 1 to generate an interrupt when a  
PRECHARGE time-out occurs. See the Charge Safety  
Timers section for more information.  
Battery Temperature Interrupt Control. Set both this bit and  
TEMPSTAT[ ] to 1 to generate an interrupt when the battery  
temperature goes out of the valid range. See the Battery  
Temperature Monitoring section for more information.  
Input Voltage Interrupt Control. Set both this bit and  
INSTAT[ ] to 1 to generate an interrupt when CHGIN input  
voltage goes out of the valid range. See the Charge Current  
Programming section for more information.  
Charge State Interrupt Control. Set both this bit and  
CHGSTAT[ ] to 1 to generate an interrupt when the state  
machines jumps out of the EOC state. See the State  
Machine Interrupts section for more information.  
[0] CHGEOCOUT  
APCH  
APCH  
APCH  
0x7A  
0x7A  
0x7A  
[7:6]  
[5:4]  
[3:2]  
-
R
R
R
Reserved.  
Charge State. Values indicate the current charging state.  
See the State Machine Interrupts section for more  
information.  
CSTATE  
-
Reserved.  
ACIN Status. Indicates the state of the ACIN input, typically  
in order to identify the type of input supply connected. Value  
is 1 when ACIN is above the 1.2V precision threshold, value  
is 0 when ACIN is below this threshold.  
APCH  
APCH  
0x7A  
0x7A  
[1]  
[0]  
ACINSTAT  
-
R
R
Reserved.  
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Copyright © 2013 Active-Semi, Inc.  
ACT8935  
Rev 4, 17-Sep-13  
SYSTEM CONTROL ELECTRICAL CHARACTERISTICS  
(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)  
PARAMETER  
Input Voltage Range  
TEST CONDITIONS  
MIN  
2.7  
TYP  
MAX  
5.5  
UNIT  
V
UVLO Threshold Voltage  
UVLO Hysteresis  
V
VSYS Rising  
VSYS Falling  
2.2  
2.45  
200  
2.65  
V
V
mV  
REG1 Enabled. REG2, REG3, REG4,  
REG5, REG6 and REG7 Disabled  
155  
260  
420  
REG1, REG2 and REG5 Enabled. REG3,  
REG4, REG6 and REG7 Disabled  
Supply Current  
µA  
REG1, REG2, REG3, REG4, REG5,  
REG6 and REG7 Enabled  
Shutdown Supply Current  
Oscillator Frequency  
All Regulators Disabled  
8
2
18  
µA  
MHz  
V
1.8  
1.4  
2.2  
Logic High Input Voltage1  
Logic Low Input Voltage  
Leakage Current  
0.4  
1
V
V
V
nIRQ = VnRSTO = 4.2V  
BAT Falling  
µA  
V
LBI Threshold Voltage  
LBI Hysteresis Threshold  
Low Level Output Voltage2  
nRSTO Delay  
1.03  
1.2  
1.31  
VBAT Rising  
ISINK = 5mA  
200  
mV  
V
0.35  
260ꢂ  
160  
20  
ms  
°C  
°C  
Thermal Shutdown Temperature  
Thermal Shutdown Hysteresis  
Temperature rising  
: PWRHLD, PWREN, EXTON are logic inputs.  
2: nLBO, nPBSTAT, nIRQ, nRSTO are open drain outputs.  
3: Typical value shown. Actual value may vary from 227.9ms to 291.2ms.  
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ACT8935  
Rev 4, 17-Sep-13  
STEP-DOWN DC/DC ELECTRICAL CHARACTERISTICS  
(VVP1 = VVP2 = VVP3 = 3.6V, TA = 25°C, unless otherwise specified.)  
PARAMETER  
Operating Voltage Range  
UVLO Threshold  
CONDITIONS  
MIN  
2.7  
TYP  
MAX  
5.5  
UNIT  
V
Input Voltage Rising  
2.5  
2.6  
100  
65  
0
2.7  
V
UVLO Hysteresis  
Input Voltage Falling  
Regulator Enabled  
mV  
µA  
µA  
Quiescent Supply Current  
Shutdown Current  
90  
1
V
V
V
V
VP = 5.5V, Regulator Disabled  
OUT 1.2V, IOUT = 10mA  
-1%  
-2%  
VNOM  
VNOM  
1%  
2%  
Output Voltage Accuracy  
V
OUT < 1.2V, IOUT = 10mA  
VP = Max(VNOM1 +1, 3.2V) to 5.5V  
I
OUT = 10mA to IMAX2  
Line Regulation  
0.15  
0.0017  
93  
%/V  
%/mA  
%VNOM  
%VNOM  
MHz  
kHz  
Load Regulation  
Power Good Threshold  
Power Good Hysteresis  
V
V
V
V
OUT Rising  
OUT Falling  
2
OUT 20% of VNOM  
OUT = 0V  
1.8  
2
2.2  
Oscillator Frequency  
500  
400  
75  
Soft-Start Period  
Minimum On-Time  
REG1  
µs  
ns  
Maximum Output Current  
Current Limit  
0.9  
1.2  
A
A
1.4  
0.18  
0.16  
0
1.7  
1
PMOS On-Resistance  
NMOS On-Resistance  
SW1 Leakage Current  
REG2  
I
SW1 = -100mA  
SW1 = 100mA  
I
V
VP1 = 5.5V, VSW1 = 0 or 5.5V  
µA  
Maximum Output Current  
Current Limit  
0.7  
0.9  
A
A
1.1  
0.21  
0.16  
0
1.3  
1
PMOS On-Resistance  
NMOS On-Resistance  
SW2 Leakage Current  
REG3  
I
SW2 = -100mA  
SW2 = 100mA  
I
V
VP2 = 5.5V, VSW2 = 0 or 5.5V  
µA  
Maximum Output Current  
Current Limit  
0.9  
1.2  
A
A
1.4  
0.18  
0.16  
0
1.7  
PMOS On-Resistance  
I
SW3 = -100mA  
ISW3 = 100mA  
VP3 = 5.5V, VSW3 = 0 or 5.5V  
NMOS On-Resistance  
SW3 Leakage Current  
V
1
µA  
: VNOM refers to the nominal output voltage level for VOUT as defined by the Ordering Information section.  
2: IMAX Maximum Output Current.  
Innovative PowerTM  
- 16 -  
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Copyright © 2013 Active-Semi, Inc.  
ACT8935  
Rev 4, 17-Sep-13  
LOW-NOISE LDO ELECTRICAL CHARACTERISTICS  
(VINL = 3.6V, COUT4 = COUT5 = COUT6 = COUT7 = 1.5µF, TA = 25°C, LOWIQ[-] = [0], unless otherwise specified.)  
PARAMETER  
TEST CONDITIONS  
MIN  
2.5  
TYP  
MAX  
5.5  
UNIT  
Operating Voltage Range  
V
V
V
V
OUT 1.2V, TA = 25°C, IOUT = 10mA  
OUT < 1.2V, TA = 25°C, IOUT = 10mA  
INL = Max (VOUT + 0.5V, 3.6V) to 5.5V  
-1%  
-2%  
VNOM  
VNOM  
2%  
Output Voltage Accuracy  
Line Regulation  
V
4%  
0.05  
0.5  
LOWIQ[ ] = [0]  
mV/V  
VINL = Max (VOUT + 0.5V, 3.6V) to 5.5V  
LOWIQ[ ] = [1]  
Load Regulation  
IOUT = 1mA to IMAXꢃ  
0.08  
75  
65  
37  
31  
0
V/A  
dB  
f = 1kHz, IOUT = 20mA, VOUT = 1.2V  
f = 10kHz, IOUT = 20mA, VOUT = 1.2V  
Regulator Enabled, LOWIQ[ ] = [0]  
Regulator Enabled, LOWIQ[ ] = [1]  
Regulator Disabled  
Power Supply Rejection Ratio  
60  
52  
1
Supply Current per Output  
µA  
Soft-Start Period  
VOUT = 2.9V  
VOUT Rising  
VOUT Falling  
140  
89  
3
µs  
Power Good Threshold  
Power Good Hysteresis  
%VNOM  
%VNOM  
I
OUT = 20mA, f = 10Hz to 100kHz, VOUT =  
Output Noise  
50  
µVRMS  
1.2V  
Discharge Resistance  
REG4  
LDO Disabled, DIS[ ] = 1  
1.5  
kꢀ  
Dropout Voltageꢁ  
Maximum Output Current  
Current Limitꢂ  
IOUT = 80mA, VOUT > 3.1V  
90  
140  
90  
180  
mV  
mA  
mA  
µF  
150  
200  
1.5  
VOUT = 95% of regulation voltage  
Stable COUT4 Range  
REG5  
20  
Dropout Voltage  
Maximum Output Current  
Current Limit  
IOUT = 80mA, VOUT > 3.1V  
280  
mV  
mA  
mA  
µF  
150  
200  
1.5  
VOUT = 95% of regulation voltage  
Stable COUT5 Range  
REG6  
20  
Dropout Voltage  
Maximum Output Current  
Current Limit  
IOUT = 80mA, VOUT > 3.1V  
180  
mV  
mA  
mA  
µF  
150  
200  
1.5  
VOUT = 95% of regulation voltage  
Stable COUT6 Range  
REG7  
20  
Dropout Voltage  
Maximum Output Current  
Current Limit  
IOUT = 80mA, VOUT > 3.1V  
140  
280  
mV  
mA  
mA  
µF  
150  
200  
1.5  
VOUT = 95% of regulation voltage  
Stable COUT7 Range  
20  
: VNOM refers to the nominal output voltage level for VOUT as defined by the Ordering Information section.  
2: IMAX Maximum Output Current.  
3: Dropout Voltage is defined as the differential voltage between input and output when the output voltage drops 100mV below the  
regulation voltage (for 3.1V output voltage or higher).  
: LDO current limit is defined as the output current at which the output voltage drops to 95% of the respective regulation voltage.  
Under heavy overload conditions the output current limit folds back by 30% (typ)  
Innovative PowerTM  
- 17 -  
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Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
Copyright © 2013 Active-Semi, Inc.  
ACT8935  
Rev 4, 17-Sep-13  
ActivePathTM CHARGER ELECTRICAL CHARACTERISTICS  
(VCHGIN = 5.0V, TA = 25°C, unless otherwise specified.)  
PARAMETER  
ActivePath  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
CHGIN Operating Voltage Range  
CHGIN UVLO Threshold  
CHGIN UVLO Hysteresis  
CHGIN OVP Threshold  
4.35  
3.1  
6.0  
3.9  
V
V
CHGIN Voltage Rising  
3.5  
0.5  
6.6  
0.4  
35  
CHGIN Voltage Falling  
CHGIN Voltage Rising  
CHGIN Voltage Falling  
VCHGIN < VUVLO  
V
6.0  
7.2  
V
CHGIN OVP Hysteresis  
V
70  
µA  
µA  
VCHGIN < VBAT + 50mV, VCHGIN > VUVLO  
100  
200  
CHGIN Supply Current  
V
CHGIN > VBAT + 150mV, VCHGIN > VUVLO  
1.3  
2.0  
mA  
Charger disabled, IVSYS = 0mA  
IVSYS = 100mA  
CHGIN to VSYS On-Resistance  
CHGIN to VSYS Current Limit  
0.3  
2
ACIN = VSYS  
1.5  
80  
A
ACIN = GA, CHGLEV = GA  
ACIN = GA, CHGLEV = VSYS  
90  
450  
100  
500  
mA  
400  
VSYS REGULATION  
VSYS Regulated Voltage  
nSTAT OUTPUT  
IVSYS = 10mA  
VnSTAT = 2V  
4.45  
4
4.6  
8
4.8  
V
nSTAT Sink current  
12  
1
mA  
µA  
nSTAT Leakage Current  
ACIN AND CHGLEV INPUTS  
CHGLEV Logic High Input Voltage  
CHGLEV Logic Low Input Voltage  
CHGLEV Leakage Current  
ACIN Voltage Thresholds  
ACIN Hysteresis Voltage  
ACIN Leakage Current  
TH INPUT  
VnSTAT = 4.2V  
1.4  
V
V
0.4  
1
VCHGLEV = 4.2V  
µA  
V
ACIN voltage rising  
ACIN voltage falling  
1.03  
1.2  
1.31  
200  
mV  
µA  
V
ACIN = 4.2V  
1
TH Pull-Up Current  
VCHGIN > VBAT + 100mV, Hysteresis = 50mV  
Hot Detect NTC Thermistor  
91  
102  
110  
µA  
V
VTH Upper Temperature Voltage  
2.44  
2.51  
2.58  
Threshold (VTHH  
)
VTH Lower Temperature Voltage  
Cold Detect NTC Thermistor  
Upper and Lower Thresholds  
0.47  
0.50  
30  
0.53  
V
Threshold (VTHL  
)
VTH Hysteresis  
mV  
Innovative PowerTM  
- 18 -  
www.active-semi.com  
Copyright © 2013 Active-Semi, Inc.  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
ACT8935  
Rev 4, 17-Sep-13  
ActivePathTM CHARGER ELECTRICAL CHARACTERISTICS CONT’D  
(VCHGIN = 5.0V, TA = 25°C, unless otherwise specified.)  
PARAMETER  
CHARGER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
BAT Reverse Leakage Current VCHGIN = 0V, VBAT = 4.2V, IVSYS = 0mA  
BAT to VSYS On-Resistance  
8
µA  
70  
mꢀ  
Fast Charge  
ISET Pin Voltage  
1.2  
0.13  
4.2  
4.2  
V
Precondition  
TA = -20°C to 70°C  
4.179  
4.170  
4.221  
V
Charge Termination Voltage  
VTERM  
TA = -40°C to 85°C  
4.230  
1
ACIN = VSYS, CHGLEV = VSYS -10%  
ICHG  
+10%  
ACIN = VSYS, CHGLEV = GA  
ACIN = GA, CHGLEV = VSYS  
-10%  
400  
80  
I
CHG/5  
+10%  
mA  
VBAT = 3.8V  
RISET = 6.8K  
Charge Current  
450  
500  
ACIN = GA, CHGLEV = GA  
ACIN = VSYS, CHGLEV = VSYS  
ACIN = VSYS, CHGLEV = GA  
ACIN = GA, CHGLEV = VSYS  
ACIN = GA, CHGLEV = GA  
90  
10% ICHG  
10% ICHG  
45  
100  
VBAT = 2.7V  
Precondition Charge Current  
mA  
RISET = 6.8K  
45  
Precondition Threshold Voltage VBAT Voltage Rising  
Precondition Threshold  
2.75  
2.85  
3.0  
V
V
BAT Voltage Falling  
150  
mV  
Hysteresis  
ACIN = VSYS, CHGLEV = VSYS  
10% ICHG  
ACIN = VSYS, CHGLEV = GA  
ACIN = GA, CHGLEV = VSYS  
ACIN = GA, CHGLEV = GA  
10% ICHG  
45  
END-OF-CHARGE Current  
Threshold  
VBAT = 4.15V  
mA  
45  
Charge Restart Threshold  
Precondition Safety Timer  
Total Safety Timer  
VTERM - VBAT, VBAT Falling  
PRETIMO[ ] = 10  
190  
205  
80  
220  
mV  
min  
hr  
TOTTIMO[ ] = 10  
5
Thermal Regulation Threshold  
100  
°C  
: RISET (k) = 2336 × (1V/ICHG (mA)) - 0.205  
Innovative PowerTM  
- 19 -  
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Copyright © 2013 Active-Semi, Inc.  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
ACT8935  
Rev 4, 17-Sep-13  
TYPICAL PERFORMANCE CHARACTERISTICS  
(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)  
VREF vs. Temperature  
Frequency vs. Temperature  
0.84  
0.42  
0
2.5  
2
1.5  
1
0.5  
0
-0.42  
-0.84  
-0.5  
-1  
Typical VREF=1.2V  
Typical Oscillator Frequency=2MHz  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
-40  
-20  
0
20  
40  
60  
80 85  
Temperature (°C)  
Temperature (°C)  
PBIN Startup Sequence  
PWRHLD Startup Sequence  
CH1  
CH1  
CH2  
CH2  
CH3  
CH3  
CH4  
CH4  
CH5  
REG3/PWRSTAT[ ] = 0  
CH1: VPBIN, 5V/div  
CH2: VOUT3, 1V/div  
CH3: VOUT5, 1V/div  
CH4: VOUT1, 1.5V/div  
CH5: VOUT2, 3V/div  
TIME: 2ms/div  
CH1: VPWRHRD, 5V/div  
CH2: VOUT5, 1V/div  
CH3: VOUT1, 1.5V/div  
CH4: VOUT2, 3V/div  
TIME: 2ms/div  
PWREN Sequence  
CH1  
CH2  
CH3  
CH4  
CH5  
CH1: VPWREN, 5V/div  
CH2: VOUT3, 1V/div  
CH3: VOUT4, 1V/div  
CH4: VOUT6, 2.5V/div  
CH5: VOUT7, 3V/div  
TIME: 2ms/div  
Innovative PowerTM  
- 20 -  
www.active-semi.com  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
Copyright © 2013 Active-Semi, Inc.  
ACT8935  
Rev 4, 17-Sep-13  
TYPICAL PERFORMANCE CHARACTERISTICS CONT’D  
(TA = 25°C, unless otherwise specified.)  
Push-Button Response (First Power-Up)  
Manual Reset Response  
CH1  
CH1  
CH2  
CH2  
CH3  
CH3  
CH1: VPBIN, 1V/div  
CH1: VPBIN, 2V/div  
CH2: VnPBSTAT, 2V/div  
CH3:VnRSTO , 2V/div  
TIME: 100ms/div  
PBIN Resistor = 50k  
CH2: VnPBSTAT, 2V/div  
PBIN Resistor = 0ꢀ  
CH3: VnRSTO, 2V/div  
TIME: 100ms/div  
REG1 Efficiency vs. Output Current  
REG2 Efficiency vs. Output Current  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
VOUT = 1.8V  
VOUT = 3.3V  
VIN = 5.0V  
VIN = 5.0V  
VIN = 3.6V  
VIN = 3.6V  
VIN = 4.2V  
VIN = 4.2V  
1
10  
100  
1000  
1
10  
100  
1000  
Output Current (mA)  
Output Current (mA)  
REG3 Efficiency vs. Output Current  
100  
VOUT = 1.2V  
80  
60  
40  
20  
0
VIN = 5.0V  
VIN = 3.6V  
VIN = 4.2V  
1
10  
100  
1000  
Output Current (mA)  
Innovative PowerTM  
- 21 -  
www.active-semi.com  
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Copyright © 2013 Active-Semi, Inc.  
ACT8935  
Rev 4, 17-Sep-13  
TYPICAL PERFORMANCE CHARACTERISTICS CONT’D  
(TA = 25°C, unless otherwise specified.)  
REG1 Output Voltage vs. Temperature  
REG2 Output Voltage vs. Temperature  
1.815  
1.809  
1.803  
1.797  
1.791  
1.785  
3.310  
3.306  
3.302  
3.298  
3.294  
3.290  
VOUT1 = 1.8V  
ILOAD = 100mA  
VOUT2 = 3.3V  
ILOAD = 100mA  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
Temperature (°C)  
Temperature (°C)  
REG2 MOSFET Resistance  
REG3 Output Voltage vs. Temperature  
1.210  
1.206  
1.202  
1.198  
1.194  
1.190  
350  
300  
250  
200  
150  
100  
50  
ILOAD = 100mA  
VOUT3 = 1.2V  
ILOAD = 100mA  
PMOS  
NMOS  
0
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
Input Voltage (V)  
Temperature (°C)  
REG1, 3 MOSFET Resistance  
350  
ILOAD = 100mA  
300  
250  
200  
150  
100  
50  
PMOS  
NMOS  
0
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
Input Voltage (V)  
Innovative PowerTM  
- 22 -  
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Copyright © 2013 Active-Semi, Inc.  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
ACT8935  
Rev 4, 17-Sep-13  
TYPICAL PERFORMANCE CHARACTERISTICS CONT’D  
(TA = 25°C, unless otherwise specified.)  
Output Voltage vs. Output Current  
Output Voltage vs. Output Current  
3.70  
3.50  
3.30  
3.10  
2.90  
2.70  
2.50  
2.30  
2.10  
1.300  
1.260  
1.220  
1.180  
1.140  
1.180  
REG7  
REG4, REG5  
REG6  
0
20  
40  
60  
80  
100  
120  
140  
160  
0
20  
40  
60  
80  
100  
120  
140  
160  
Output Current (mA)  
Output Current (mA)  
Dropout Voltage vs. Output Current  
Dropout Voltage vs. Output Current  
160  
140  
250  
200  
150  
100  
50  
120  
REG5  
100  
80  
60  
40  
20  
0
REG4  
VIN = 3.3V  
VIN = 3.3V  
0
0
20  
40  
60  
80  
100 120 140 160  
0
20  
40  
60  
80  
100 120 140 160  
Output Current (mA)  
Output Current (mA)  
Dropout Voltage vs. Output Current  
Dropout Voltage vs. Output Current  
180  
160  
140  
120  
100  
80  
300  
250  
200  
150  
100  
50  
REG6  
REG7  
60  
40  
20  
VIN = 3.3V  
VIN = 3.3V  
0
0
0
50  
100  
150  
200  
250  
300  
0
50  
100  
150  
200  
250  
300  
Output Current (mA)  
Output Current (mA)  
Innovative PowerTM  
- 23 -  
www.active-semi.com  
Copyright © 2013 Active-Semi, Inc.  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
ACT8935  
Rev 4, 17-Sep-13  
TYPICAL PERFORMANCE CHARACTERISTICS CONT’D  
(TA = 25°C, unless otherwise specified.)  
Output Voltage vs. Temperature  
Region of Stable COUT ESR vs. Output Current  
4.00  
3.50  
3.00  
2.50  
2.00  
1.50  
1.00  
0.50  
0
1
REG7  
REG6  
0.1  
Stable ESR  
REG4, REG5  
0.01  
0
50  
100  
150  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
Output Current (mA)  
Temperature (°C)  
LDO Output Voltage Noise  
CH1  
CH1: VOUTx, 200µV/div (AC COUPLED)  
TIME: 200ms/div  
Innovative PowerTM  
- 24 -  
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Copyright © 2013 Active-Semi, Inc.  
ACT8935  
Rev 4, 17-Sep-13  
TYPICAL PERFORMANCE CHARACTERISTICS CONT’D  
(TA = 25°C, unless otherwise specified.)  
VSYS Voltage vs. CHGIN Voltage  
VSYS Voltage vs. VSYS Current  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0
5.2  
5.0  
4.8  
4.6  
4.4  
4.2  
4.0  
ACIN/CHGLEV = 01  
ACIN/CHGLEV = 11  
VVSYS = 4.6V  
0
2
4
6
8
10  
0
500  
1000  
1500  
2000  
2500  
CHGIN Voltage (V)  
VSYS Current (mA)  
Charger Current vs. Battery Voltage  
Charger Current vs. Battery Voltage  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
VCHGIN = 5V  
ACIN = 0  
CHGLEV = 1  
450mA USB  
VBAT Falling  
VBAT Rising  
VCHGIN = 5V  
ACIN = 0  
VBAT Falling  
CHGLEV = 0  
VBAT Rising  
90mA USB  
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5  
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5  
Battery Voltage (V)  
Battery Voltage (V)  
Charger Current vs. Battery Voltage  
DCCC and Battery Supplement Modes  
1200  
1000  
800  
600  
400  
200  
0
RISET = 2.4k  
VCHGIN = 5V  
CH4  
CH3  
CH2  
ACIN/CHGLEV = 11  
VBAT = 3.5V  
VVSYS = 4.6V  
VSYS = 0-1.8A  
ICHARGE = 1000mA  
CHGIN = 5.1V-3A  
I
VBAT Falling  
VBAT Rising  
CH1  
V
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5  
CH1: IVSYS, 1.00A/div  
CH2: IBAT, 1.00A/div  
CH3: VBAT, 1.00V/div  
CH4: VVSYS, 1V/div  
TIME: 200ms/div  
Battery Voltage (V)  
Innovative PowerTM  
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Copyright © 2013 Active-Semi, Inc.  
ACT8935  
Rev 4, 17-Sep-13  
TYPICAL PERFORMANCE CHARACTERISTICS CONT’D  
(TA = 25°C, unless otherwise specified.)  
VAC Applied  
VAC Removed  
CH4  
CH4  
CH3  
CH2  
CH3  
CH2  
CH1  
CH1  
VCHGIN = 5V  
VBAT = 3.5V  
RVSYS = 100ꢀ  
ACIN/CHGLEV = 01  
VCHGIN = 5V  
VBAT = 3.5V  
RVSYS = 100ꢀ  
ACIN/CHGLEV = 01  
CH1: IBAT, 400mA/div  
CH2: VBAT, 1V/div  
CH3: VVSYS, 2V/div  
CH4: VCHGIN, 5V/div  
TIME: 40ms/div  
CH1: IBAT, 200mA/div  
CH2: VVSYS, 2V/div  
CH3: VBAT, 1V/div  
CH4: VCHGIN, 5V/div  
TIME: 100ms/div  
VAC Applied  
VAC Removed  
CH4  
CH4  
CH3  
CH2  
CH3  
CH2  
CH1  
CH1  
VCHGIN = 5V  
VBAT = 3.97V  
VCHGIN = 5V  
VBAT = 3.97V  
CH1: IBAT, 1A/div  
CH2: VBAT, 2V/div  
CH3: VVSYS, 2V/div  
CH4: VCHGIN, 5V/div  
TIME: 40ms/div  
CH1: IBAT, 1A/div  
CH2: VVSYS, 2V/div  
CH3: VBAT, 2V/div  
CH4: VCHGIN, 5V/div  
TIME: 40ms/div  
RVSYS = 47ꢀ  
RVSYS = 47ꢀ  
ACIN/CHGLEV = 11  
ACIN/CHGLEV = 11  
Innovative PowerTM  
- 26 -  
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ACT8935  
Rev 4, 17-Sep-13  
APPLICATION INFORMATION  
Interfacing with the SiRF PrimaTM/Atlas IVTM  
The ACT8935 is optimized for use in applications  
using the SiRF PrimaTM and Atlas IVTM processors,  
supporting both the power domains as well as the  
signal interface for these processors.  
the ACT8935 pin names and the Prima/Atlas IV pin  
names are provided. When this is done, the  
Prima/Atlas IV pin names are located after the  
ACT8935 pin names, and are italicized and located  
inside parentheses. For example, PWREN  
(X_PWR_EN) refers to the logic signal applied to  
the ACT8935's PWREN input, identifying that it is  
driven from the Prima/Atlas IV's X_PWR_EN  
output. Likewise, REG2 (VDD_IO) refers to  
ACT8935's OUT2 pin, identifying that it is  
connected to the Prima/Atlas IV's VDD_IO power  
domain.  
While the ACT8935 supports many possible  
configurations for powering these processors, one  
of the most common configurations is detailed in  
this datasheet. In general, this document refers to  
the ACT8935 pin names and functions. However, in  
cases where the description of interconnections  
between these devices benefits by doing so, both  
Table 2:  
ACT8935 and SiRF Power Domains  
SiRF POWER DOMAIN  
VDDIO_MEM  
VDD_IO  
ACT8935 CHANNEL  
REG1  
TYPE  
DC/DC  
DC/DC  
DC/DC  
LDO  
DEFAULT VOLTAGE  
CURRENT CAPABILITY  
900mA  
1.8V  
3.3V  
1.2V  
1.2V  
1.2V  
REG2  
700mA  
VDD_PDN/VDD_TSC  
VDD_PLL  
REG3  
900mA  
REG4  
150mA  
VDD_PRE  
REG5  
LDO  
150mA  
VREF_ADC  
VDDA_TSC  
REG6  
LDO  
LDO  
2.5V  
3.3V  
150mA  
150mA  
VDD2V5_USB  
VDD3V3_USB  
REG7  
Table 3:  
ACT8935 and SiRF Power Modes  
POWER MODE  
CONTROL STATE  
POWER DOMAIN STATE  
QUIESCENT CURRENT  
PWRHLD is asserted, PWREN is REG1, REG2, REG3, REG4, REG5,  
ALL ON  
420µA  
asserted, PWRDS[ ] is 0  
REG6 and REG7 are on  
PWRHLD is asserted, PWREN is  
de-asserted, PWRDS[ ] is 0  
REG1, REG2 and REG5 are on.  
REG3, REG4, REG6 and REG7 are off  
SLEEP  
260µA  
155µA  
PWRHLD is asserted, PWREN is  
de-asserted, PWRDS[ ] is 1  
REG1 is on. REG2, REG3, REG4,  
REG5, REG6 and REG7 are off  
DEEP-SLEEP  
Table 4:  
ACT8935 and SiRF Signal Interface  
ACT8935  
PWREN  
SCL  
DIRECTION  
SiRF Prima / Atlas IV  
X_PWR_EN  
X_SCL_0  
SDA  
X_SDA_0  
EXTON  
nRSTO  
nIRQ  
X_RTC_Alarm  
X_Reset_B  
X_GPIO[1]1  
X_GPIO[0]2  
X_GPIO[4] ꢂ  
X_VIP_PXD[6]ꢃ  
GPIO5  
nPBSTAT  
nLBO  
CHGLEV  
PWRHLD  
1, 2, , : Typical connections shown, actual connections may vary.  
5: Optional connection for power hold control.  
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ACT8935  
Rev 4, 17-Sep-13  
Table 5:  
Control Pins  
PIN NAME  
IF PWRSTAT[ ] = 0  
IF PWRSTAT[ ] = 1  
PBIN  
REG1, REG2, REG3, REG5  
REG1, REG2, REG3, REG5  
REG1, REG2, REG5  
REG1, REG2, REG5  
EXTON  
PWRHLD  
PWREN  
REG1, REG2, REG5  
REG3, REG4, REG6, REG7  
Manual Reset Function  
Control Signals  
The second major function of the PBIN input is to  
provide a manual-reset input for the processor. To  
manually-reset the processor, drive PBIN directly to  
VSYS through a low impedance (less than 2.5k).  
When this occurs, nRSTO immediately asserts low,  
then remains asserted low until the PBIN input is  
de-asserted and the reset time-out period expires.  
Enable Inputs  
The ACT8935 features a variety of control inputs,  
which are used to enable and disable outputs  
depending upon the desired mode of operation.  
PWREN, PWRHLD, and EXTON are logic inputs,  
while PBIN is a unique, multi-function input. Refer  
to Table 5 for a description of which channels are  
controlled by each input.  
nPBSTAT Output  
nPBSTAT is an open-drain output that reflects the  
state of the PBIN input; nPBSTAT is asserted low  
whenever PBIN is asserted, and is high-Z  
otherwise. This output is typically used as an  
interrupt signal to the processor, to initiate a  
software-programmable routine such as operating  
mode selection or to open a menu. Connect  
nPBSTAT to an appropriate supply voltage  
(typically OUT2) through a 10kor greater resistor.  
PBIN Multi-Function Input  
ACT8935 features the PBIN multi-function pin,  
which combines system enable/disable control with  
a hardware reset function. Select either of the two  
pin functions by asserting this pin, either through a  
direct connection to VSYS, or through a 50kꢀ  
resistor to VSYS, as shown in Figure 2.  
Figure 2:  
nRSTO Output  
PBIN Input  
nRSTO is an open-drain output which asserts low  
upon startup or when manual reset is asserted via  
the PBIN input. When asserted on startup, nRSTO  
remains low until reset time-out period expires after  
OUT2 reaches its power-OK threshold. When  
asserted due to manual-reset, nRSTO immediately  
asserts low, then remains asserted low until the  
PBIN input is de-asserted and the reset time-out  
period expires.  
Connect a 10kor greater pull-up resistor from  
nRSTO to an appropriate voltage supply (typically  
OUT2) .  
Enable / Wake-Up  
nIRQ Output  
The most common application for PBIN is to drive it  
to VSYS through a 50kresistor. In this case, PBIN  
initiates system enable, if the system is disabled, or  
is used to initiate a wake up routine from SLEEP  
mode.  
nIRQ is an open-drain output that asserts low any  
time an interrupt is generated. Connect a 10kor  
greater pull-up resistor from nIRQ to an appropriate  
voltage supply. nIRQ is typically used to drive the  
interrupt input of the system processor.  
In order to initiate a wake up routine or any other  
function that is initiated through push-button  
assertion, the processor should monitor the  
ACT8935's nPBSTAT output. See the nPBSTAT  
Output section for more information.  
Many of the ACT8935's functios support interrupt-  
generation as a result of various conditions. These  
are typically masked by default, but may be  
unmasked via the I2C interface. For more  
information about the available fault conditions,  
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ACT8935  
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unmasked via the I2C interface. For more  
information about the available fault conditions,  
refer to the appropriate sections of this datasheet.  
PWRHLD, holding REG1, REG2, and REG5, and  
assert PWREN (X_PWR_EN), enabling REG4,  
REG6, REG7 and holding REG3 to ensure that the  
system remains powered after PBIN is released.  
Note that under some conditions a false interrupt  
may be generated upon initial startup. For this  
reason, it is recommended that the interrupt service  
routine check and validate nSYSLEVMSK[-] and  
nFLTMSK[-] bits before processing an interrupt  
generated by these bits. These interrupts may be  
validated by nSYSSTAT[-], OK[-] bits.  
The logic required to control the Prima and Atlas IV  
processors requires that REG3 is enabled when  
PBIN is asserted during power-up, but then operate  
independently of PBIN during SLEEP mode. For  
this reason, the ACT8935 features the  
REG3/PWRSTAT[-] bit, which controls how REG3  
responds when the PBIN input is asserted. The  
required functionality may be achieved either by  
setting PWRSTAT[-] to 1 during the boot sequence  
or, alternatively, as part of the process of entering  
SLEEP mode.  
Push-Button Control  
The ACT8935 is designed to initiate a system  
enable sequence when the PBIN multi-function  
input is asserted. Once this occurs, a power-on  
sequence commences, as described below. The  
power-on sequence must complete and the  
microprocessor must take control (by asserting  
PWREN or PWRHLD) before PBIN is de-asserted.  
If the microprocessor is unable to complete its  
power-up routine successfully before the user  
releases the push-button, the ACT8935  
automatically shuts the system down. This provides  
protection against accidental or momentary  
assertions of the push-button. If desired, longer  
“push-and-hold” times can be implemented by  
simply adding an additional time delay before  
asserting PWREN or PWRHLD.  
Once the power-up routine is completed, the  
system remains enabled after the push-button is  
released as long as either PWRHLD or PWREN are  
asserted high. If the processor does not assert  
PWRHLD or PWREN before the user releases the  
push-button, the boot-up sequence is terminated  
and all regulators are disabled. This provides  
protection against "false-enable", when the push-  
button is accidentally depressed, and also ensures  
that the system remains enabled only if the  
processor successfully completes the boot-up  
sequence.  
Alternatively, an enable sequence may initiate as a  
result of asserting the EXTON input. EXTON  
enables the ACT8935 in an identical manner as  
PBIN, but does not assert nPBSTAT. EXTON is  
normally driven by the Prima/Atlas IV's RTC Alarm  
signal in order to enable or wake the system from  
SLEEP, DEEP-SLEEP, or shut down modes.  
Control Sequences  
The ACT8935 features  
a
variety of control  
sequences that are optimized for supporting system  
enable and disable, as well as both SLEEP and  
DEEP-SLEEP modes of the SiRF Prima and Atlas  
IV processors.  
Enable Sequence  
A typical enable sequence initiates as a result of  
asserting PBIN, and begins by enabling REG3 and  
REG5. When REG5 reaches its power-OK  
threshold, REG1 and REG2 are enabled and  
nRSTO is asserted low, resetting the  
microprocessor. If REG5 is above its power-OK  
threshold when the reset timer expires, nRSTO is  
de-asserted, allowing the microprocessor to begin  
its boot sequence.  
During the boot sequence, the processor should  
read the DSRDY[ ] bit; if the value of DSRDY[ ] is 0  
then the software should proceed with a typical  
enable sequence, whereas if the value of DSRDY[-]  
is 1 then the software should proceed with a “wake  
from DEEP-SLEEP” routine. See the DEEP-SLEEP  
Sequence section for more information. During the  
boot sequence, the microprocessor must assert  
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ACT8935  
Rev 4, 17-Sep-13  
Figure 3:  
Power Enable Sequence  
Power Up Sequence  
PBIN  
nPBSTAT  
260ms  
nRSTO  
PWREN  
PWRHLD  
OUT3  
OUT5  
93% of regulation  
8ms  
OUT1  
OUT2  
OUT4, OUT6, OUT7  
REG3/PWRSTAT[ ]  
SDREQ[ ]  
DEEP-SLEEP Mode Sequence  
SLEEP Mode Sequence  
The ACT8935 supports Prima/Atlas IV DEEP-  
SLEEP mode operation. Once a successful power-  
up routine has been completed, DEEP-SLEEP  
mode may be initiated through a variety of software-  
controlled mechanisms.  
The ACT8935 supports Prima/Atlas IV SLEEP  
mode operation. Once a successful power-up  
routine has been completed, SLEEP mode may be  
initiated through a variety of software-controlled  
mechanisms.  
DEEP-SLEEP mode is typically initiated when the  
user presses the push-button during normal  
operation. Pressing the push-button asserts, the  
nPBSTAT output, which interrupts the processor. In  
response to this interrupt the processor should first  
set the DSRDY[ ] bit to 1, then set the PWRDS[-] bit  
to 1, disabling REG2, REG3, REG4, REG5, REG6,  
and REG7.  
The Prima and Atlas IV processors require that  
REG3 is enabled by PBIN, but then operate  
independently of PBIN in SLEEP mode. Therefore,  
it is important that REG3/PWRSTAT[-] be set to 1  
prior to entering SLEEP mode. This may be done  
as part of the boot sequence or as part of the  
sequence to enter SLEEP mode.  
SLEEP mode is typically initiated when the user  
presses the push-button during normal operation.  
Pressing the push-button asserts, the nPBSTAT  
output, which interrupts the processor. In response  
to this interrupt the processor should de-assert  
PWREN (X_PWR_EN), disabling REG3, REG4,  
REG6 and REG7. PWRHLD should remain  
asserted during SLEEP mode so that REG1, REG2  
and REG5 remain enabled.  
Waking from DEEP-SLEEP mode is initiated when  
the user presses the push-button again. Asserting  
PBIN clears the PWRDS[-] bit to 0, enabling REG3  
and REG5. Once REG5 reaches regulation, REG2  
is enabled and the nRSTO timer begins. Once the  
reset timer period expires the nRSTO output is de-  
asserted and the processor initiates a boot-up  
sequence, during which it should determine the  
system status by reading the DSRDY[-] bit; if the  
value of DSRDY[-] is 0 then the software should  
proceed with a typical enable sequence, whereas if  
the value of DSRDY[-] is 1 then the software should  
proceed with a “wake from DEEP-SLEEP” routine.  
To complete the wake process, the processor should  
assert PWRHLD to ensure that the system remains  
enabled after the push-button is released, and assert  
PWREN to enable REG4, REG6, and REG7, then set  
DSRDY[-] to 0 to complete a full wake-up routine.  
Waking from SLEEP mode is initiated when the  
user presses the push-button again, which asserts  
nPBSTAT. Processors should respond by asserting  
PWREN (X_PWR_EN), which enables REG3,  
REG4, REG6 and REG7, so that normal operation  
may resume.  
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ACT8935  
Rev 4, 17-Sep-13  
Figure 4:  
Sleep Mode Sequence  
Figure 5:  
Deep Sleep Mode Sequence  
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ACT8935  
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completely software-controlled, but typically  
involved initiating various “clean-up” processes  
before clear SDREQ[-] bit to 0, disabling all  
regulators and shutting the system down.  
Disable Sequence  
As with the enable sequence, a typical disable  
sequence is initiated when the user presses the  
push-button, which interrupts the processor via the  
nPBSTAT output. The actual disable sequence is  
Figure 6:  
Power Disable Sequence  
Shutdown Sequence  
PBIN  
nPBSTAT  
nRSTO  
PWREN  
PWRHLD  
OUT3  
OUT5  
OUT1  
OUT2  
OUT4, OUT6, OUT7  
SDREQ[ ]  
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ACT8935  
Rev 4, 17-Sep-13  
FUNCTIONAL DESCRIPTION  
I2C Interface  
below the SYSLEV[-] voltage threshold:  
1) If nSYSMODE[-] = 1 (default case), when system  
The ACT8935 features an I2C interface that allows  
advanced programming capability to enhance  
overall system performance. To ensure  
voltage level interrupt is unmasked  
(nSYSLEVMSK[ ]=1) and VVSYS falls below the  
programmable threshold, the ACT8935 asserts  
nIRQ, providing a software “under-voltage alarm”.  
The response to this interrupt is controlled by the  
CPU, but will typically initiate a controlled shutdown  
sequence either or alert the user that the battery is  
low. In this case the interrupt is cleared when VVSYS  
rises up again above the SYSLEV rising threshold  
and nSYSSTAT[-] is read via I2C.  
compatibility with  
a
wide range of system  
processors, the I2C interface supports clock speeds  
of up to 400kHz (“Fast-Mode” operation) and uses  
standard I2C commands. I2C write-byte commands  
are used to program the ACT8935, and I2C read-  
byte commands are used to read the ACT8935’s  
internal registers. The ACT8935 always operates as  
a slave device, and is addressed using a 7-bit slave  
address followed by an eighth bit, which indicates  
whether the transaction is a read-operation or a  
write-operation, [1011011x].  
2) If nSYSMODE[-] = 0, when VVSYS falls below the  
programmable threshold the ACT8935 shuts down,  
immediately disabling all regulators. This option is  
useful for implementing a programmable “under-  
voltage lockout” function that forces the system off  
when the battery voltage falls below the SYSLEV  
threshold voltage. Since this option does not  
support a controlled shutdown sequence, it is  
generally used as a "fail-safe" to shut the system  
down when the battery voltage is too low.  
SDA is a bi-directional data line and SCL is a clock  
input. The master device initiates a transaction by  
issuing a START condition, defined by SDA  
transitioning from high to low while SCL is high.  
Data is transferred in 8-bit packets, beginning with  
the MSB, and is clocked-in on the rising edge of  
SCL. Each packet of data is followed by an  
“Acknowledge” (ACK) bit, used to confirm that the  
data was transmitted successfully.  
Table 6:  
SYSLEV Falling Threshold  
For more information regarding the I2C 2-wire serial  
interface, go to the NXP website: http://www.nxp.com.  
SYSLEV Falling Threshold  
SYSLEV[3:0]  
(Hysteresis = 200mV)  
0000  
0001  
0010  
0011  
0100  
0101  
0110  
0111  
1000  
1001  
1010  
1011  
1100  
1101  
1110  
1111  
2.3  
2.4  
2.5  
2.6  
2.7  
2.8  
2.9  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
3.7  
3.8  
Voltage Monitor and Interrupt  
Programmable System Voltage Monitor  
The ACT8935 features a programmable system-  
voltage monitor, which monitors the voltage at  
VSYS and compares it to  
a programmable  
threshold voltage. The programmable voltage  
threshold is programmed by SYSLEV[3:0], as  
shown in Table 6.  
SYSLEV[ ] is set to 3.0V by default. There is a  
200mV rising hysteresis on SYSLEV[ ] threshold  
such that VVSYS needs to be 3.2V(typ) or higher in  
order to power up the IC.  
The nSYSSTAT[-] bit reflects the output of an  
internal voltage comparator that monitors VVSYS  
relative to the SYSLEV[-] voltage threshold, the  
value of nSYSTAT[-] = 1 when VVSYS is lower than  
the SYSLEV[-] voltage threshold, and nSYSTAT[-] =  
0 when VVSYS is higher than the SYSLEV[-] voltage  
threshold. Note that the SYSLEV[-] voltage  
threshold is defined for falling voltages, and that the  
comparator produces about 200mV of hysteresis at  
VSYS. As a result, once VVSYS falls below the  
SYSLEV threshold, its voltage must increase by  
more than about 200mV to clear that condition.  
Precision Voltage Detector  
The LBI input connects to one input of a precision  
voltage comparator, which can be used to monitor a  
system voltage such as the battery voltage. An  
external resistive-divider network can be used to set  
voltage monitoring thresholds, as shown in  
Functional Block Diagram. The output of the  
comparator is present at the nLBO open-drain  
output.  
After the IC is powered up, the ACT8935 responds  
in one of two ways when the voltage at VSYS falls  
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ACT8935  
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Thermal Shutdown  
The ACT8935 integrates thermal shutdown  
protection circuitry to prevent damage resulting  
from excessive thermal stress, as may be  
encountered under fault conditions. This circuitry  
disables all regulators if the ACT8935 die  
temperature exceeds 160°C, and prevents the  
regulators from being enabled until the IC  
temperature drops by 20°C (typ).  
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ACT8935  
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STEP-DOWN DC/DC REGULATORS  
Despite the advantages of ceramic capacitors, care  
must be taken during the design process to ensure  
stable operation over the full operating voltage and  
temperature range. Ceramic capacitors are  
available in a variety of dielectrics, each of which  
exhibits different characteristics that can greatly  
affect performance over their temperature and  
voltage ranges.  
General Description  
The ACT8935 features three synchronous, fixed-  
frequency, current-mode PWM step down  
converters that achieve peak efficiencies of up to  
97%. REG1 and REG3 are capable of supplying up  
to 900mA of output current, while REG2 supports  
up to 700mA. These regulators operate with a fixed  
frequency of 2MHz, minimizing noise in sensitive  
applications and allowing the use of small external  
components.  
Two of the most common dielectrics are Y5V and  
X5R. Whereas Y5V dielectrics are inexpensive and  
can provide high capacitance in small packages,  
their capacitance varies greatly over their voltage  
and temperature ranges and are not recommended  
for DC/DC applications. X5R and X7R dielectrics  
are more suitable for output capacitor applications,  
as their characteristics are more stable over their  
operating ranges, and are highly recommended.  
100% Duty Cycle Operation  
Each regulator is capable of operating at up to  
100% duty cycle. During 100% duty-cycle  
operation, the high-side power MOSFET is held on  
continuously, providing a direct connection from the  
input to the output (through the inductor), ensuring  
the lowest possible dropout voltage in battery  
powered applications.  
Inductor Selection  
REG1, REG2, and REG3 utilize current-mode  
control and a proprietary internal compensation  
scheme to simultaneously simplify external  
component selection and optimize transient  
performance over their full operating range. These  
devices were optimized for operation with 2.2μH  
inductors, although inductors in the 1.5μH to 3.3μH  
range can be used. Choose an inductor with a low  
DC-resistance, and avoid inductor saturation by  
choosing inductors with DC ratings that exceed the  
maximum output current by at least 30%.  
Synchronous Rectification  
REG1, REG2, and REG3 each feature integrated n-  
channel synchronous rectifiers, maximizing  
efficiency and minimizing the total solution size and  
cost by eliminating the need for external rectifiers.  
Soft-Start  
When enabled, each output voltages tracks an  
internal 400μs soft-start ramp, minimizing input  
current during startup and allowing each regulator  
to power up in a smooth, monotonic manner that is  
independent of output load conditions.  
Configuration Options  
Output Voltage Programming  
Compensation  
By default, each regulator powers up and regulates  
to its default output voltage. Once the system is  
enabled, each regulator's output voltage may be  
independently programmed to a different value,  
typically in order to minimize the power  
consumption of the microprocessor during some  
operating modes. Program the output voltages via  
the I2C serial interface by writing to the regulator's  
VSET[-] register as shown in Table 8.  
Each buck regulator utilizes current-mode control  
and a proprietary internal compensation scheme to  
simultaneously simplify external component  
selection and optimize transient performance over  
its full operating range. No compensation design is  
required; simply follow a few simple guidelines  
described below when choosing external  
components.  
Input Capacitor Selection  
Enable / Disable Control  
The input capacitor reduces peak currents and  
noise induced upon the voltage source. A 4.7μF  
ceramic capacitor is recommended for each  
regulator in most applications.  
During normal operation, each buck may be  
enabled or disabled via the I2C interface by writing  
to that regulator's ON[ ] bit. The regulator accept  
rising or falling edge of ON[ ] bit as on/off signal. To  
enable the regulator, clear ON[ ] to 0 first then set to  
1. To disable the regulator, set ON[ ] to 1 first then  
clear it to 0.  
Output Capacitor Selection  
For most applications, 22μF ceramic output  
capacitors are recommended for REG1 and REG3,  
while 15μF ceramic output capacitor is  
recommended for REG2.  
PWRSTAT Control Bit (REG3)  
PWRSTAT[-] is a control bit which configures  
REG3's behavior with respect to the PBIN input.  
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The Prima and Atlas IV processors require that  
REG3 enable with PBIN, but then operate  
independently of PBIN when implementing sleep  
modes. PWRSTAT[ ] provides a convenient means  
of doing so; PWRSTAT defaults to 0, in which case  
REG3 is enabled when PBIN is asserted. Set  
PWRSTAT[-] to 1, making REG3's enable state  
independent of PBIN, prior to entering SLEEP  
mode.  
OK[ ] and Output Fault Interrupt  
Each DC/DC features a power-OK status bit that  
can be read by the system microprocessor via the  
I2C interface. If an output voltage is lower than the  
power-OK threshold, typically 7% below the  
programmed regulation voltage, that regulator's  
OK[ ] bit will be 0.  
If a DC/DC's nFLTMSK[-] bit is set to 1, the  
ACT8935 will interrupt the processor if that DC/DC's  
output voltage falls below the power-OK threshold.  
In this case, nIRQ will assert low and remain  
asserted until either the regulator is turned off or  
back in regulation, and the OK[ ] bit has been read  
via I2C.  
REG1, REG2, REG3 Turn-on Delay  
Each of REG1, REG2 and REG3 features a  
programmable Turn-on Delay which help ensure a  
reliable qualification. This delay is programmed by  
DELAY[2:0], as shown in Table 7.  
Table 7:  
PCB Layout Considerations  
REGx/DELAY[ ] Turn-On Delay  
High switching frequencies and large peak currents  
make PC board layout an important part of step-  
down DC/DC converter design. A good design  
minimizes excessive EMI on the feedback paths  
and voltage gradients in the ground plane, both of  
which can result in instability or regulation errors.  
DELAY[2] DELAY[1] DELAY[0] TURN-ON DELAY  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0 ms  
2 ms  
4 ms  
Step-down DC/DCs exhibit discontinuous input  
current, so the input capacitors should be placed as  
close as possible to the IC, and avoiding the use of  
via if possible. The inductor, input filter capacitor,  
and output filter capacitor should be connected as  
close together as possible, with short, direct, and  
wide traces. The ground nodes for each regulator's  
power loop should be connected at a single point in  
a star-ground configuration, and this point should  
be connected to the backside ground plane with  
multiple via. The output node for each regulator  
should be connected to its corresponding OUTx pin  
through the shortest possible route, while keeping  
sufficient distance from switching nodes to prevent  
noise injection. Finally, the exposed pad should be  
directly connected to the backside ground plane  
using multiple via to achieve low electrical and  
thermal resistance.  
8 ms  
16 ms  
32 ms  
64 ms  
128 ms  
Operating Mode  
By default, REG1, REG2, and REG3 each operate  
in fixed-frequency PWM mode at medium to heavy  
loads, while automatically transitioning to  
proprietary power-saving mode at light loads in  
order to maximize standby battery life. In  
applications where low noise is critical, force fixed-  
frequency PWM operation across the entire load  
current range, at the expense of light-load  
efficiency, by setting the MODE[ ] bit to 1.  
a
Table 8:  
REGx/VSET[ ] Output Voltage Setting  
REGx/VSET[5:3]  
REGx/VSET[2:0]  
000  
001  
010  
011  
100  
101  
110  
111  
000  
001  
010  
011  
100  
101  
110  
111  
0.600  
0.625  
0.650  
0.675  
0.700  
0.725  
0.750  
0.775  
0.800  
0.825  
0.850  
0.875  
0.900  
0.925  
0.950  
0.975  
1.000  
1.025  
1.050  
1.075  
1.100  
1.125  
1.150  
1.175  
1.200  
1.250  
1.300  
1.350  
1.400  
1.450  
1.500  
1.550  
1.600  
1.650  
1.700  
1.750  
1.800  
1.850  
1.900  
1.950  
2.000  
2.050  
2.100  
2.150  
2.200  
2.250  
2.300  
2.350  
2.400  
2.500  
2.600  
2.700  
2.800  
2.900  
3.000  
3.100  
3.200  
3.300  
3.400  
3.500  
3.600  
3.700  
3.800  
3.900  
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ACT8935  
Rev 4, 17-Sep-13  
LOW-NOISE, LOW-DROPOUT LINEAR REGULATORS  
or falling edge of ON[ ] bit as on/off signal. To  
enable the regulator, clear ON[ ] to 0 first then set to  
1. To disable the regulator, set ON[ ] to 1 first then  
clear it to 0.  
General Description  
REG4, REG5, REG6, and REG7 are low-noise,  
low-dropout linear regulators (LDOs) that are each  
capable of supplying up to 150mA. Each LDO has  
been optimized to achieve low noise and high-  
PSRR, achieving more than 65dB PSRR at  
frequencies up to 10kHz.  
REG4, REG5, REG6, REG7 Turn-on Delay  
Each of REG4, REG5, REG6 and REG7 features a  
programmable Turn-on Delay which help ensure a  
reliable qualification. This delay is programmed by  
DELAY[2:0], as shown in Table 7.  
Output Current Limit  
Each LDO contains current-limit circuitry featuring a  
current-limit fold-back function. During normal and  
moderate overload conditions, the regulators can  
support more than their rated output currents.  
During extreme overload conditions, however, the  
current limit is reduced by approximately 30%,  
reducing power dissipation within the IC.  
Output Discharge  
Each of the ACT8935’s LDOs features an optional  
output discharge function, which discharges the  
output to ground through a 1.5kresistance when  
the LDO is disabled. This feature may be enabled  
or disabled by setting DIS[-]; set DIS[-] to 1 to  
enable this function, clear DIS[-] to 0 to disable it.  
Compensation  
Low-Power Mode  
The LDOs are internally compensated and require  
very little design effort, simply select input and  
output capacitors according to the guidelines below.  
Each of ACT8935's LDOs features a LOWIQ[-] bit  
which, when set to 1, reduces the LDO's quiescent  
current by about 16%, saving power and extending  
battery lifetime.  
Input Capacitor Selection  
Each LDO requires a small ceramic input capacitor  
to supply current to support fast transients at the  
input of the LDO. Bypassing each INL pin to GA  
with 1μF. High quality ceramic capacitors such as  
X7R and X5R dielectric types are strongly  
recommended.  
OK[ ] and Output Fault Interrupt  
Each LDO features a power-OK status bit that can  
be read by the system microprocessor via the  
interface. If an output voltage is lower than the  
power-OK threshold, typically 11% below the  
programmed regulation voltage, the value of that  
regulator's OK[-] bit will be 0.  
Output Capacitor Selection  
Each LDO requires a small 1.5μF ceramic output  
capacitor for stability. For best performance, each  
output capacitor should be connected directly  
between the output and GA pins, as close to the  
output as possible, and with a short, direct  
connection. High quality ceramic capacitors such as  
X7R and X5R dielectric types are strongly  
recommended.  
If a LDO's nFLTMSK[-] bit is set to 1, the ACT8935  
will interrupt the processor if that LDO's output  
voltage falls below the power-OK threshold. In this  
case, nIRQ will assert low and remain asserted until  
either the regulator is turned off or back in  
regulation, and the OK[-] bit has been read via I2C.  
PCB Layout Considerations  
The ACT8935’s LDOs provide good DC, AC, and  
noise performance over a wide range of operating  
conditions, and are relatively insensitive to layout  
considerations. When designing a PCB, however,  
careful layout is necessary to prevent other circuitry  
from degrading LDO performance.  
Configuration Options  
Output Voltage Programming  
By default, each LDO powers up and regulates to  
its default output voltage. Once the system is  
enabled, each output voltage may be independently  
programmed to a different value by writing to the  
regulator's VSET[-] register via the I2C serial  
interface as shown in Table 8.  
A good design places input and output capacitors  
as close to the LDO inputs and output as possible,  
and utilizes a star-ground configuration for all  
regulators to prevent noise-coupling through  
ground. Output traces should be routed to avoid  
close proximity to noisy nodes, particularly the SW  
nodes of the DC/DCs.  
Enable / Disable Control  
During normal operation, each LDO may be  
enabled or disabled via the I2C interface by writing  
to that LDO's ON[ ] bit. The regulator accept rising  
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ACT8935  
Rev 4, 17-Sep-13  
REFBP is a noise-filtered reference, and internally  
has a direct connection to the linear regulator  
controller. Any noise injected into REFBP will  
directly affect the outputs of the linear regulators,  
and therefore special care should be taken to  
ensure that no noise is injected to the outputs via  
REFBP. As with the LDO output capacitors, the  
REFBP bypass capacitor should be placed as close  
to the IC as possible, with short, direct connections  
to the star-ground. Avoid the use of via whenever  
possible. Noisy nodes, such as from the DC/DCs,  
should be routed as far away from REFBP as  
possible.  
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ACT8935  
Rev 4, 17-Sep-13  
ActivePathTM CHARGER  
In an input over-voltage condition this circuit limits  
VVSYS to 4.6V, protecting any circuitry connected to  
VSYS from the over-voltage condition, which may  
exceed this circuitry's voltage capability. This circuit  
is capable of withstanding input voltages of up to  
12V.  
General Description  
The ACT8935 features an advanced battery  
charger that incorporates the patent-pending  
ActivePath architecture for system power selection.  
This combination of circuits provides a complete,  
advanced battery-management system that  
automatically selects the best available input  
supply, manages charge current to ensure system  
power availability, and provides a complete, high-  
accuracy (±0.5%), thermally regulated, full-featured  
single-cell linear Li+ charger that can withstand  
input voltages of up to 12V.  
Table 9:  
Input Over-Voltage Protection Setting  
OVPSET[1]  
OVPSET[0]  
OVP THRESHOLD  
0
0
1
1
0
1
0
1
6.6V  
7.0V  
7.5V  
8.0V  
ActivePath Architecture  
The ActivePath architecture performs three  
important functions:  
Input Supply Overload Protection  
1) System Configuration Optimization  
2) Input Protection  
The ActivePath circuitry monitors and limits the total  
current drawn from the input supply to a value set  
by the ACIN and CHGLEV inputs, as well as the  
resistor connected to ISET. Drive ACIN to a logic-  
low for “USB Mode”, which limits the input current to  
either 100mA, when CHGLEV is driven to a logic-  
low, or 450mA, when CHGLEV is driven to a logic-  
high. Drive ACIN to a logic-high for “AC-Mode”,  
which limits the input current to 2A, typically.  
3) Battery-Management  
System Configuration Optimization  
The ActivePath circuitry monitors the state of the  
input supply, the battery, and the system, and  
automatically reconfigures itself to optimize the  
power system. If a valid input supply is present,  
ActivePath powers the system from the input while  
charging the battery in parallel. This allows the  
battery to charge as quickly as possible, while  
supplying the system. If a valid input supply is not  
present, ActivePath powers the system from the  
battery. Finally, if the input is present and the  
system current requirement exceeds the capability  
of the input supply, ActivePath allows system power  
to be drawn from both the battery and the input  
supply.  
Input Under Voltage Lockout  
If the input voltage applied to CHGIN falls below  
3.5V (typ), an input under-voltage condition is  
detected and the charger is disabled. Once an input  
under-voltage condition is detected, a new charge  
cycle will initiate when the input exceeds the under-  
voltage threshold by at least 500mV.  
Battery Management  
The ACT8935 features a full-featured, intelligent  
charger for Lithium-based cells, and was designed  
specifically to provide a complete charging solution  
with minimum system design effort.  
Input Protection  
Input Over-Voltage Protection  
The ActivePath circuitry features input over-voltage  
protection circuitry. This circuitry disables charging  
when the input voltage exceeds the voltage set by  
OVPSET[-] as shown in table 13, but stands off the  
input voltage in order to protect the system. Note  
that the adjustable OVP threshold is intended to  
provide the charge cycle with adjustable immunity  
against upward voltage transients on the input, and  
is not intended to allow continuous charging with  
input voltages above the charger's normal operating  
voltage range. Independent of the OVPSET[-]  
setting, the charge cycle is not allowed to resume  
until the input voltage falls back into the charger's  
normal operating voltage range (i.e. below 6.0V).  
The core of the charger is a CC/CV (Constant-  
Current/Constant-Voltage), linear-mode charge  
controller. This controller incorporates current and  
voltage sense circuitry, an internal 70mpower  
MOSFET, thermal-regulation circuitry,  
a
full-  
featured state machine that implements charge  
control and safety features, and circuitry that  
eliminates the reverse blocking diode required by  
conventional charger designs.  
The charge termination voltage is highly accurate  
(±0.5%), and features a selection of charge safety  
time-out periods that protect the system from  
operation with damaged cells. Other features  
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ACT8935  
Rev 4, 17-Sep-13  
include pin-programmable fast-charge current and  
one current-limited nSTAT output that can directly  
drive LED indicator or provide a logic-level status  
a logic-high, or 100mA, if CHGLEV is driven to a  
logic-low.  
The ACT8935's charge current settings are  
summarized in Table 10.  
signal to the host microprocessor.  
Note that the actual charge current may be limited  
to a current lower than the programmed fast charge  
current due to the ACT8935’s internal thermal  
regulation loop. See the Thermal Regulation section  
for more information.  
Dynamic Charge Current Control (DCCC)  
The ACT8935's ActivePath charger features  
dynamic charge current control (DCCC) circuitry,  
which acts to ensure that the system remains  
powered while operating within the maximum output  
capability of the power adapter. The DCCC circuitry  
continuously monitors VVSYS, and if the voltage at  
VSYS drops by more than 200mV, the DCCC  
circuitry automatically reduces charge current in  
order to prevent VVSYS from continuing to drop.  
Charger Input Interrupts  
In order to ease input supply detection and  
eliminate the size and cost of external detection  
circuitry, the charger has the ability to generate  
interrupts based upon the status of the input supply.  
This function is capable of generating an interrupt  
when the input is connected, disconnected, or both.  
An interrupt is generated any time the input supply  
is connected when INSTAT[ ] bit is set to 1 and the  
INCON[-] bit is set to 1, and an interrupt is  
generated any time the input supply is disconnected  
when INSTAT[ ] bit is set to 1 and the INDIS[ ] bit is  
set to 1.  
Charge Current Programming  
The ACT8935's ActivePath charger features a  
flexible charge current-programming scheme that  
combines the convenience of internal charge  
current programming with the flexibility of resistor  
based charge current programming. Current limits  
and charge current programming are managed as a  
function of the ACIN and CHGLEV pins, in  
combination with RISET, the resistance connected to  
the ISET pin.  
INDAT[-] indicates the status of the CHGIN input  
supply. A value of 1 indicates that a valid CHGIN  
input (CHGIN UVLO Threshold<VCHGIN<CHGIN  
OVP Threshold) is present, a value of 0 indicates a  
valid input is not present.  
ACIN is a logic input that configures the current-limit  
of ActivePath's linear regulator as well as that of the  
battery charger. ACIN features a precise 1.2V logic  
threshold, so that the input voltage detection  
threshold may be adjusted with a simple resistive  
voltage divider. This input also allows a simple, low-  
cost dual-input charger switch to be implemented  
with just a few, low-cost components.  
When an interrupt is generated by the input supply,  
reading the INSTAT[ ] returns a value of 1.  
INSTAT [ ] is automatically cleared to 0 upon  
reading. When no interrupt is generated by the  
input supply, reading the INSTAT[ ] returns a value  
of 0.  
When the voltage at ACIN is above the 1.2V  
threshold, the charger operates in “AC-Mode” with a  
charge current programmed by RISET, and the RISET  
is given by:  
When responding to an Input Status Interrupt, it is  
often useful to know the state of the ACIN input. For  
example, in  
a
dual-input charger application  
knowing the state of the ACIN input can identify  
which type of input supply has been connected. The  
state of the ACIN input can be read at any time by  
reading the ACINSTAT[-] bit, where a value of 1  
indicates that the voltage at ACIN is above the 1.2V  
threshold (indicating that a wall-cube has been  
attached), and a value of 0 indicates that the  
voltage is below this threshold (indicating that ACIN  
input is not valid and USB supply input is selected).  
RISET (k) = 2336 × (1V/ICHG (mA)) - 0.205  
With a given RISET then charge current will reduce 5  
times when CHGLEV is driven low.  
When ACIN is below the 1.2V threshold, the  
charger operates in “USB-Mode”, with a maximum  
CHGIN input current and charge current defined by  
the CHGLEV input; 450mA, if CHGLEV is driven to  
Table 10:  
ACIN and CHGLEV Inputs  
CHARGE CURRENT  
PRECONDITION CHARGE CURRENT  
(mA)  
ACIN  
CHGLEV  
(mA)  
0
0
1
1
0
1
0
1
90  
45  
450  
45  
I
CHG/5  
ICHG  
10% × ICHG  
10% × ICHG  
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ACT8935  
Rev 4, 17-Sep-13  
Figure 7:  
Typical Li+ charge profile and ACT8935 charge states  
A: PRECONDITION State  
B: FAST-CHARGE State  
C: TOP-OFF State  
D: END-OF-CHARGE State  
Figure 8:  
Charger State Diagram  
TEMP NOT OK  
ANY STATE  
(VCHGIN < VBAT) OR (VCHGIN < VCHGIN UVLO)  
OR (VCHGIN > VOVP) OR (SUSCHG[ ] = 1)  
SUSPEND  
TEMP-FAULT  
(VCHGIN > VBAT) AND (VCHGIN > VCHGIN UVLO)  
AND (VCHGIN < VOVP) AND (SUSCHG[ ] = 0)  
TEMP OK  
PRECONDITION  
TIME-OUT-FAULT  
PRECONDITION  
Time-out  
(VBAT > 2.85V) AND  
(TQUAL = 32ms)  
Total Time-out  
FAST-CHARGE  
(VBAT = VTERM ) AND  
(TQUAL = 32ms)  
(VBAT < VTERM - 205mV )  
AND (TQUAL = 32ms)  
TOP-OFF  
(IBAT < 10% x ICHG) OR (Total  
Time-out) AND (TQUAL = 32ms)  
END-OF-CHARGE  
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ACT8935  
Rev 4, 17-Sep-13  
minimizing battery current drain and allowing the  
cell to “relax”. The charger continues to monitor the  
cell voltage, and re-initiates a charging sequence if  
the cell voltage drops to 205mV (typ) below the  
charge termination voltage.  
Charge-Control State Machine  
PRECONDITION State  
new charging cycle begins with the  
A
PRECONDITION state, and operation continues in  
this state until VBAT exceeds the Precondition  
Threshold Voltage. When operating in  
PRECONDITION state, the cell is charged at 10%  
of the programmed maximum fast-charge constant  
SUSPEND State  
The state-machine jumps to the SUSPEND state  
any time the battery is removed, and any time the  
input voltage either falls below the CHGIN UVLO  
threshold or exceeds the OVP threshold. Once  
none of these conditions are present, a new charge  
cycle initiates.  
current, ICHG  
.
Once VBAT reaches the Precondition Threshold  
Voltage, the state machine jumps to the FAST-  
CHARGE state. If VBAT does not reach the  
Precondition Threshold Voltage before the  
Precondition Time-out period expires, then the state  
machine jumps to the TIME-OUT-FAULT state in  
order to prevent charging a damaged cell. See the  
Charge Safety Timers section for more information.  
A charging cycle may also be suspended manually  
by setting the SUSPEND[ ] bit. In this case, initiate  
a new charging sequence by clearing SUSPEND[ ]  
to 0.  
State Machine Interrupts  
FAST-CHARGE State  
The charger features the ability to generate  
interrupts when the charger state machine  
transitions, based upon the status of the CHG_ bits.  
Set CHGEOCIN[ ] bit to 1 and CHGSTAT[ ] bit to 1  
to generate an interrupt when the charger state  
machine goes into the END-OF-CHARGE (EOC)  
state. Set CHGEOCOUT[ ] bit to 1 and CHGSTAT[ ]  
bit to 1 to generate an interrupt when the charger  
state machine exits the EOC state.  
In the FAST-CHARGE state, the charger operates  
in constant-current (CC) mode and regulates the  
charge current to the current set by RISET . Charging  
continues in CC mode until VBAT reaches the charge  
termination voltage (VTERM), at which point the state-  
machine jumps to the TOP-OFF state. If VBAT does  
not reach VTERM before the total time out period  
expires then the state-machine will jump to the  
“EOC” state and will re-initiate a new charge cycle  
after 32ms “relax”. See the Current Limits and  
Charge Current Programming sections for more  
information about setting the maximum charge  
current.  
CHGDAT[ ] indicates the status of the charger state  
machine. A value of 1 indicates that the charger  
state machine is in END-OF-CHARGE state, a  
value of 0 indicates the charger state machine is in  
other states.  
When an interrupt is generated by the charger state  
machine, reading the CHGSTAT[ ] returns a value  
of 1. CHGSTAT[ ] is automatically cleared to 0 upon  
reading. When no interrupt is generated by the  
charger state machine, reading the CHGSTAT[ ]  
returns a value of 0.  
TOP-OFF State  
In the TOP-OFF state, the cell charges in constant-  
voltage (CV) mode. In CV mode operation, the  
charger regulates its output voltage to the 4.20V  
charge termination voltage, and the charge current  
is naturally reduced as the cell approaches full  
charge. Charging continues until the charge current  
drops to END-OF-CHARGE current threshold, at  
which point the state machine jumps to the END-  
OF-CHARGE (EOC) state.  
For additional information about the charge cycle,  
CSTATE[0:1] may be read at any time via I2C to  
determine the current charging state.  
Table 11:  
If the state-machine does not jump out of the TOP-  
OFF state before the Total-Charge Time-out period  
expires, the state machine jumps to the EOC state  
and will re-initiate a new charge cycle if VBAT falls  
below termination voltage 205mV (typ). For more  
information about the charge safety timers, see the  
Charging Safety Times section.  
Charging Status Indication  
CSTATE[0] CSTATE[1] STATE MACHINE STATUS  
1
1
1
0
PRECONDITION State  
FAST-CHARGE/  
TOP-OFF State  
END-OF-CHARGE (EOC) State  
0
0
1
0
END-OF-CHARGE State  
In the END-OF-CHARGE (EOC) state, the charger  
SUSPEND/DISABLED/  
FAULT State  
presents  
a
high-impedance to the battery,  
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ACT8935  
Rev 4, 17-Sep-13  
Table 13:  
Thermal Regulation  
Total Safety Timer Setting  
The charger features an internal thermal regulation  
loop that monitors die temperature and reduces  
charging current as needed to ensure that the die  
temperature does not exceed the thermal regulation  
threshold of 110°C. This feature protects against  
excessive junction temperature and makes the  
device more accommodating to aggressive thermal  
designs. Note, however, that attention to good  
thermal designs is required to achieve the fastest  
possible charge time by maximizing charge current.  
TOTAL TIME-OUT  
PERIOD  
TOTTIMO[1] TOTTIMO[0]  
0
0
1
1
0
1
0
1
3 hrs  
4 hrs  
5 hrs  
Disabled  
Charge Status Indicator  
Charge Safety Timers  
The charger provides a charge-status indicator  
output, nSTAT. nSTAT is an open-drain output  
which sinks current when the charger is in an  
active-charging state, and is high-Z otherwise.  
nSTAT features an internal 8mA current limit, and is  
capable of directly driving a LED without the need  
of a current-limiting resistor or other external  
circuitry. To drive an LED, simply connect the LED  
between nSTAT pin and an appropriate supply,  
such as VSYS. For a logic-level charge status  
indication, simply connect a resistor from nSTAT to  
an appropriate voltage supply.  
The charger features programmable charge safety  
timers which help ensure a safe charge by  
detecting potentially damaged cells. These timers  
are programmable via the PRETIMO[1:0] and  
TOTTIMO[1:0] bits, as shown in Table 11 and Table  
13. Note that in order to account for reduced charge  
current resulting from DCCC operation in thermal  
regulation mode, the charge time-out periods are  
extended proportionally to the reduction in charge  
current. As a result, the actual safety period may  
exceed the nominal timer period.  
Charger Timer Interrupts  
Table 14:  
The charger features the ability to generate  
interrupts based upon the status of the charge  
Charging Status Indication  
STATE  
PRECONDITION  
FAST-CHARGE  
TOP-OFF  
nSTAT  
Active  
Active  
Active  
High-Z  
High-Z  
High-Z  
High-Z  
timers. Set the TIMRPRE[  
]
bit to  
1
and  
TIMRSTAT[ ] bit to 1 to generate an interrupt when  
the Precondition Timer expires. Set the TIMRTOT[ ]  
bit to 1 and TIMRSTAT[ ] bit to 1 to generate an  
interrupt when the Total-Charge Timer expires.  
TIMRDAT[ ] indicates the status of the charge  
timers. A value of 1 indicates a precondition time-  
out or a total charge time-out occurs, a value of 0  
indicates other cases.  
END-OF-CHARGE  
SUSPEND  
TEMPERATURE FAULT  
TIME-OUT-FAULT  
When an interrupt is generated by the charge  
timers, reading the TIMRSTAT[ ] returns a value of  
1. TIMRSTAT[ ] is automatically cleared to 0 upon  
reading. When no interrupt is generated by the  
charge timers, reading the TIMRSTAT[ ] returns a  
value of 0.  
Reverse-Current Protection  
The charger includes internal reverse-current  
protection circuitry that eliminates the need for  
blocking diodes, reducing solution size and cost as  
well as dropout voltage relative to conventional  
battery chargers. When the voltage at CHGIN falls  
below VBAT, the charger automatically reconfigures  
its power switch to minimize current drawn from the  
battery.  
Table 12:  
PRECONDITION Safety Timer Setting  
PRECONDITION  
PRETIMO[1] PRETIMO[0]  
TIME-OUT PERIOD  
Battery Temperature Monitoring  
0
0
1
1
0
1
0
1
40 mins  
60 mins  
80 mins  
Disabled  
In a typical application, the TH pin is connected to  
the battery pack's thermistor input, as shown in  
Figure 9. The charger continuously monitors the  
temperature of the battery pack by injecting a  
102μA (typ) current into the thermistor (via the TH  
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ACT8935  
Rev 4, 17-Sep-13  
pin) and sensing the voltage at TH. The voltage at  
TH is continuously monitored, and charging is  
suspended if the voltage at TH exceeds either of  
the internal VTHH and VTHL thresholds of 0.5V and  
2.51V, respectively.  
Figure 9:  
Simple Configuration  
The net resistance (from TH to GA) required to  
cross the thresholds are given by:  
102μA × RNOM × kHOT = 0.5V RNOM × kHOT 5kꢀ  
102μA × RNOM × kCOLD = 2.51V RNOM × kCOLD ≈  
25kꢀ  
where RNOM is the nominal thermistor resistance at  
room temperature, and kHOT and kCOLD represent the  
ratios of the thermistor's resistance at the desired  
hot and cold thresholds, respectively, to the  
resistance at 25°C.  
Battery Temperature Interrupts  
In order to ease detecting the status of the battery  
temperature, the charger features the ability to  
generate interrupts based upon the status of the  
battery temperature. Set the TEMPOUT[ ] bit to 1  
and TEMPSTAT[ ] bit to 1 to generate an interrupt  
when battery temperature goes out of the valid  
temperature range. Set the TEMPIN[ ] bit to 1 and  
TEMPSTAT[ ] bit to 1 to generate an interrupt when  
battery temperature returns to the valid range.  
TEMPDAT[ ] indicates the status of the battery  
temperature. A value of 1 indicates the battery  
temperature is inside of the valid range, a value of 0  
indicates the battery is outside of the valid range.  
When an interrupt is generated by the battery  
temperature event, reading the TEMPSTAT[ ]  
returns a value of 1. TEMPSTAT[ ] is automatically  
cleared to 0 upon reading. When no interrupt is  
generated by the battery temperature event,  
reading the TEMPSTAT[ ] returns a value of 0.  
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- 44 -  
www.active-semi.com  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
Copyright © 2013 Active-Semi, Inc.  
ACT8935  
Rev 4, 17-Sep-13  
TQFN55-40 PACKAGE OUTLINE AND DIMENSIONS  
DIMENSION IN  
MILLIMETERS  
DIMENSION IN  
INCHES  
SYMBOL  
MIN  
MAX  
MIN  
MAX  
A
A1  
A2  
b
0.700  
0.800  
0.028  
0.031  
0.200 REF  
0.008 REF  
0.000  
0.150  
4.900  
4.900  
3.450  
3.450  
0.050  
0.250  
5.100  
5.100  
3.750  
3.750  
0.000  
0.006  
0.193  
0.193  
0.136  
0.136  
0.002  
0.010  
0.201  
0.201  
0.148  
0.148  
D
E
D2  
E2  
e
0.400 BSC  
0.016 BSC  
L
0.300  
0.500  
0.012  
0.020  
R
0.300  
0.012  
Active-Semi, Inc. reserves the right to modify the circuitry or specifications without notice. Users should evaluate each  
product to make sure that it is suitable for their applications. Active-Semi products are not intended or authorized for use  
as critical components in life-support devices or systems. Active-Semi, Inc. does not assume any liability arising out of  
the use of any product or circuit described in this datasheet, nor does it convey any patent license.  
Active-Semi and its logo are trademarks of Active-Semi, Inc. For more information on this and other products, contact  
sales@active-semi.com or visit http://www.active-semi.com.  
is a registered trademark of Active-Semi.  
Innovative PowerTM  
- 45 -  
www.active-semi.com  
Active-Semi ProprietaryFor Authorized Recipients and Customers  
ActivePMUTM and ActivePathTM are trademarks of Active-Semi.  
Copyright © 2013 Active-Semi, Inc.  
Mouser Electronics  
Authorized Distributor  
Click to View Pricing, Inventory, Delivery & Lifecycle Information:  
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