5962-8777101VKA [ADI]
Aerospace Quad Low-Offset, Low-Power Op Amp;
| 型号： | 5962-8777101VKA |
| 厂家： | 
ADI |
| 描述： | Aerospace Quad Low-Offset, Low-Power Op Amp 放大器 CD |
| 文件： | 总12页 (文件大小：59K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
A
DESCRIPTION
DATE (YR-MO-DA)
91-12-11
APPROVED
M. A. FRYE
Change to one part-one number format. Add table III. Editorial changes
throughout.
B
C
D
Changes in accordance with NOR 5962-R049-95.
Changes in accordance with NOR 5962-R035-97.
94-12-21
96-11-26
02-12-17
M. A. FRYE
R. MONNIN
R. MONNIN
Removed table III, burn-in, dynamic burn-in, static and dynamic test circuits.
Drawing updated to reflect current requirements. -rrp
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
D
SHEET
10
11
PREPARED BY
Rick C. Officer
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
CHECKED BY
STANDARD
MICROCIRCUIT
DRAWING
Charles E. Besore
http://www.dscc.dla.mil
APPROVED BY
Michael A. Frye
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
MICROCIRCUIT, LINEAR, QUAD LOW OFFSET,
LOW POWER, OPERATIONAL AMPLIFIER,
MONOLITHIC SILICON
DRAWING APPROVAL DATE
87-12-11
AMSC N/A
REVISION LEVEL
D
SIZE
A
CAGE CODE
5962-87771
67268
SHEET
1
OF
11
DSCC FORM 2233
APR 97
5962-E037-03
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
87771
01
M
C
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
OP400A
Circuit function
Quad low offset low power operational amplifier
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
C
3
K
GDIP1-T14 or CDIP2-T14
CQCC1-N28
GDFP2-F24 or CDFP3-F24
14
28
24
Dual-in-line
Square leadless chip carrier
Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
SIZE
STANDARD
5962-87771
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
2
DSCC FORM 2234
APR 97
1.3 Absolute maximum ratings. 1/
Supply voltage (VCC) .................................................................................... ±20 V
Differential input voltage .............................................................................. ±30 V
Input voltage ................................................................................................ Supply voltage
Output short-circuit duration ........................................................................ Continuous
Power dissipation (PD) ................................................................................. 800 mW
Storage temperature range ......................................................................... -65°C to +150°C
Lead temperature range (soldering, 60 seconds) ....................................... +300°C
Junction temperature (TJ) ............................................................................ -65°C to +150°C
Thermal resistance, junction-to-case (θJC) .................................................. See MIL-STD-1835
Thermal resistance, junction-to-ambient (θJA):
Cases C and K ......................................................................................... 91°C/W
Case 3 ..................................................................................................... 110°C/W
1.4 Recommended operating conditions.
Ambient operating temperature range (TA) ................................................. -55°C to +125°C
Supply voltage (VCC) .................................................................................... ±15 V
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
SIZE
STANDARD
5962-87771
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
3
DSCC FORM 2234
APR 97
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Schematic diagram. The schematic diagram shall be as specified on figure 2.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in tables I and III.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 49 (see MIL-PRF-38535, appendix A).
3.11 Supersession and substitution. PIN substitution information shall be as specified in the appendix.
SIZE
STANDARD
5962-87771
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
VCC = ±15 V
unless otherwise specified
Min
Max
Input offset voltage
Input offset current
Input bias current
Input voltage range
VIO
1
01
01
01
01
01
-150
+150
µV
2, 3
-270
+270
IIO
VCM = 0 V
VCM = 0 V
1/
1
-1.0
-2.5
+1.0
+2.5
nA
nA
V
2, 3
1
-3.0
-5.0
+3.0
+5.0
±IIB
2, 3
+IVR
-IVR
1, 2, 3
+12
-12
Common mode rejection
ratio
CMRR
1
120
115
dB
VCM = ±12 V
2, 3
Power supply rejection ratio
Supply current
PSRR
ISY
1
01
01
01
1.8
3.2
V
CC = ±3 V and ±18 V
µV/V
mA
2, 3
No load 2/
1
2.9
3.1
2, 3
Large signal voltage gain
AVS
4
5, 6
4
2000
1000
5000
3000
+11
V/mV
VOUT = ±10 V, RL = 2 kΩ
VOUT = ±10 V, RL = 10 kΩ
5, 6
4, 5, 6
Output voltage swing
+VOP
-VOP
eN
01
V
RL = 2 kΩ
+12
RL = 10 kΩ
-11
-12
22
RL = 2 kΩ
RL = 10 kΩ
Input noise voltage density
7
7
01
01
fO = 10 Hz, TA = +25°C 3/
fO = 1000 Hz,
TA = +25°C 3/
1 Hz to 100 Hz,
TA = +25°C
nV/ Hz
nVRMS
22
Input noise voltage
Slew rate
eNT
438
1.2
SR
7
8
01
01
0.05
AV = +1, TA = +25°C
See table III.
V/µs
Average input offset voltage
drift
TCVIO
µV/°C
1/ IVR guaranteed by CMRR test.
2/ ISY limit = total all four amplifiers.
3/ eN at fO = 10 Hz and fO = 1000 Hz is guaranteed by eNT test.
SIZE
STANDARD
5962-87771
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
5
DSCC FORM 2234
APR 97
Device type
01
Case outlines
C
3
K
Terminal numbers
Terminal symbols
1
OUT A
NC
OUT A
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
-IN A
+IN A
VCC+
+IN B
-IN B
OUT B
OUT C
-IN C
+IN C
VCC-
+IN D
-IN D
OUT D
----
----
----
----
----
----
----
----
----
OUT A
-IN A
NC
NC
+IN A
NC
VCC+
NC
+IN B
NC
-IN A
NC
NC
+IN A
VCC+
+IN B
NC
NC
NC
-IN B
OUT B
OUT C
-IN C
NC
NC
NC
+IN C
VCC-
+IN D
NC
NC
-IN B
OUT B
NC
OUT C
-IN C
NC
NC
+IN C
NC
VCC-
NC
+IN D
NC
NC
-IN D
OUT D
NC
-IN D
OUT D
----
----
----
----
----
----
----
----
----
NC = No connection
FIGURE 1. Terminal connections.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-87771
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
6
DSCC FORM 2234
APR 97
FIGURE 2. Schematic diagram.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-87771
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
7
DSCC FORM 2234
APR 97
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be
in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015.
(2) TA = +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table IIA herein.
4.2.2 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table IIA herein.
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for
groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a. Tests shall be as specified in table IIA herein.
b. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V,
subgroups 7 and 8 shall include verifying the functionality of the device.
c. Subgroups 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.
SIZE
STANDARD
5962-87771
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
8
DSCC FORM 2234
APR 97
TABLE IIA. Electrical test requirements.
Subgroups
Test requirements
Subgroups
(in accordance with
(in accordance with
MIL-STD-883,
MIL-PRF-38535, table III)
method 5005, table I)
Device
class M
1
Device
class Q
Device
class V
Interim electrical
1
1
parameters (see 4.2)
Final electrical
1,2,3,4,7
1/
1,2,3,4,7
1/
1,2,3, 1/ 2/
parameters (see 4.2)
Group A test
4,7
1,2,3,4,5,6,
1,2,3,4,5,6,
1,2,3,4,5,6,
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
7,8
1
7,8
1
7,8
1,2,3,4,5, 2/
6,7,8
1
1
1
1,2,3,4,7
1,2,3,4,7
1,2,3,4,7
1/ PDA applies to subgroup 1.
2/ Delta limits in accordance with table IIB shall be computed with reference to the previous interim electrical
parameters.
TABLE IIB. 240 hour burn-in and group C end-point electrical parameters.
Test
Limit
Delta
Max
+75
2
Min
-150
-3
Max
150
3
Min
-75
-2
Unit
µV
nA
VIO
+IIB
-IIB
-3
3
-2
2
nA
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a. Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method
1005 of MIL-STD-883.
b. TA = +125°C, minimum.
c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of
MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
SIZE
STANDARD
5962-87771
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
9
DSCC FORM 2234
APR 97
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness
assured (see 3.5 herein).
a. End-point electrical parameters shall be as specified in table IIA herein.
b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All
device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at
TA = +25°C ±5°C, after exposure, to the subgroups specified in table IIA herein.
c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device
classes Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users
and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering
microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone
(614) 692-0674.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to
this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DSCC-VA.
SIZE
STANDARD
5962-87771
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
10
DSCC FORM 2234
APR 97
APPENDIX
SUBSTITUTION DATA
10. SCOPE
10.1 Scope. This appendix contains the PIN substitution information to support the one part-one part number system. For
new system designs, after the date of this document the new PIN shall be used in lieu of the old PIN. For existing
system designs prior to the date of this document the new PIN can be used in lieu of the old PIN. This is a
mandatory part of the document. The information herein is intended for compliance. The PIN substitution data shall
be as follows:
20. APPLICABLE DOCUMENTS. This section is not applicable to this appendix.
30. SUBSTITUTION DATA
New PIN
Old PIN
5962-8777101MCX
5962-8777101M3X
5962-8777101CX
5962-87771013X
SIZE
STANDARD
5962-87771
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
D
SHEET
11
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 02-12-17
Approved sources of supply for SMD 5962-87771 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
3/
Vendor
similar
PIN 2/
5962-8777101CA
5962-87771013A
5962-8777101MCA
5962-8777101M3A
5962-8777101VCA
5962-8777101V3A
5962-8777101VKA
OP400AY/883
OP400ATC/883
OP400AY/883
OP400ATC/883
OP400AY/QMLV
OP400ATC/QMLV
OP400AN/QMLV
3/
24355
24355
24355
24355
24355
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Vendor CAGE
number
Vendor name
and address
24355
Analog Devices
Route 1 Industrial Park
P.O. Box 9106
Norwood, MA 02062
Point of contact: 1500 Space Park Drive
P.O. Box 58020
Santa Clara, CA 95050-8020
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