5962R8512702VXA_技术文档

REVISIONS

LTR

A

DESCRIPTION

DATE (YR-MO-DA)

90-01-24

APPROVED

M. A. Frye

Add two packages, C-5 and C-4. Make changes to table I, and throughout. For

case X, the dimensions have been changed and figure 2 has been replaced with

D-10 configuration. Inactivate devices 01XX and 02XX for new design. Use

M38510 device. Add a truth table.

B

Add device types 05, 06, 07, and 08. Add vendors CAGES 1ES66, OH9K9, and

33256. Editorial changes throughout.

93-03-15

M. A. Frye

C

D

E

Add class V devices. Add Z package. Editorial changes throughout.

Changes in accordance with NOR 5962-R368-97. – drw

97-04-15

97-06-23

99-12-30

R. Monnin

Raymond Monnin

Change descriptive designator for case outline Z from GDFP2-F28 to

CDFP3-F28. Editorial changes throughout. Redrawn. - drw

F

G

H

J

Sheet 7, table I, V_ILtest, change max limit from –0.8 V to 0.8 V. - drw

Add radiation features and post irradiation limits. - drw

00-03-01

01-05-16

02-07-10

03-04-25

Raymond Monnin

Add device type 01 to the post irradiation limits in table I. - drw

Sheet 6, table I, Integral linearity error test (ILE), post irradiation limits for

device types 01 and 02, subgroup 1, change from -1.0 LSB min to

-1.5 LSB min and from 1.0 LSB max to 1.5 LSB max.

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED

REV

SHEET

REV

H

SHEET

15

16

17

18

19

20

REV STATUS

OF SHEETS

REV

J

H

2

H

3

H

4

H

5

J

H

7

H

8

H

9

H

SHEET

PREPARED BY

Sandra B. Rooney

1

6

10

11

12

13

14

PMIC N/A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

CHECKED BY

Charles E. Besore

STANDARD

MICROCIRCUIT

DRAWING

http://www.dscc.dla.mil

APPROVED BY

Michael A. Frye

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

MICROCIRCUIT, LINEAR, MICROPROCESSOR

COMPATIBLE, 12-BIT ANALOG-TO-DIGITAL

CONVERTERS, MONOLITHIC SILICON

DRAWING APPROVAL DATE

86-07-10

AMSC N/A

REVISION LEVEL

J

SIZE

A

CAGE CODE

5962-85127

67268

SHEET

1

OF

20

DSCC FORM 2233

APR 97

5962-E297-03

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

1. SCOPE

1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)

and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or

Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

1.2 PIN. The PIN is as shown in the following examples.

For device classes M and Q:

5962

-

85127

01

X

Federal

stock class

designator

\

RHA

designator

(see 1.2.1)

Device

type

(see 1.2.2)

Case

outline

(see 1.2.4)

Lead

finish

(see 1.2.5)

/

\/

Drawing number

For device class V:

5962

-

85127

01

V

X

Federal

stock class

designator

\

RHA

designator

(see 1.2.1)

Device

type

(see 1.2.2)

Device

class

designator

(see 1.2.3)

Case

outline

(see 1.2.4)

Lead

finish

(see 1.2.5)

/

\/

Drawing number

1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are

marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A

specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

1.2.2 Device types. The device types identify the circuit function as follows:

Device type

Generic number

574AU

Circuit function

01

02

03

04

05

06

07

08

Monolithic, high performance, 12-bit A/D converter with

microprocessor interface

Monolithic, medium performance, 12-bit A/D converter with

microprocessor interface

Multi-chip, high performance, 12-bit A/D converter with

microprocessor interface

Multi-chip, medium performance, 12-bit A/D converter with

microprocessor interface

Monolithic, high performance, low power, 12-bit A/D converter

with microprocessor interface

Monolithic, medium performance, low power, 12-bit A/D converter

with microprocessor interface

Monolithic, high performance, low power, 12-bit A/D converter

with microprocessor interface

Monolithic, medium performance, low power, 12-bit A/D converter

with microprocessor interface

574AT

574AU

574AT

574ZA

574ZB

574AU

574AT

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

2

DSCC FORM 2234

APR 97

1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed

below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q

designators will not be included in the PIN and will not be marked on the device.

Device class

M

Device requirements documentation

Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN

class level B microcircuits in accordance with MIL-PRF-38535, appendix A

Q or V

Certification and qualification to MIL-PRF-38535

1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:

Outline letter

Descriptive designator

Terminals

Package style

X

Y

Z

3

GDIP1-T28 or CDIP2-T28

CQCC1-N44

28

44

28

dual-in-line

square leadless chip carrier

flat pack

CDFP3-F28

CQCC1-N28

square leadless chip carrier

1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,

appendix A for device class M.

1.3 Absolute maximum ratings. 1/

V_CCto digital common.......................................................................................................... 0 to +16.5 V dc

V_EEto digital common .......................................................................................................... 0 to -16.5 V dc

V_LOGto digital common ........................................................................................................ 0 to +7 V dc

Analog to digital common:

Device types 01, 02, 03, 04.............................................................................................. +1 V dc

Device types 05, 06, 07, 08.............................................................................................. -0.5 V dc to +1 V dc

Control inputs (CE, CS, A_O, 12/8, R/C) to digital common.................................................. -0.5 V dc to V_LOG+0.5 V dc

Analog inputs (REF IN, BIP OFF, 10 V_IN) to analog common ............................................ V_EEto V_CC

20 V_INanalog input voltage to analog common................................................................... +24 V dc

V_{REF OUT}................................................................................................................................. Indefinite short to common,

10 ms short to V_CC

Power dissipation at 75°C:

Device types 01, 02, 05, 06, 07, 08.................................................................................. 1,000 mW 2/

Device types 03, 04 .......................................................................................................... 2,080 mW 2/

Lead temperature (soldering, 10 seconds).......................................................................... +300°C

Storage temperature ............................................................................................................ -65°C to +150°C

Thermal resistance, junction-to-ambient (θ_JA):

Cases X and 3 .................................................................................................................. 70°C/W

Case Y............................................................................................................................... 38°C/W

Case Z............................................................................................................................... 60°C/W

Thermal resistance, junction-to-case (θ_JC)........................................................................... See MIL-STD-1835

Junction temperature (T_J) .................................................................................................... +175°C

1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability.

2/ For cases X and 3, derate linearly above T_A= +75°C at 20.8 mW/°C.

For cases Y, derate linearly above T_A= +75°C at 22.7 mW/°C.

For cases Z, derate linearly above T_A= +115°C at 17 mW/°C.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

3

DSCC FORM 2234

APR 97

1.4 Recommended operating conditions.

Power supply

Operating voltage range:

Positive supply (V_LOG).................................................................................................... +4.5 V dc to +5.5 V dc

Positive supply (V_CC) ..................................................................................................... +11.4 V dc to +16.5 V dc

Negative supply (V_EE).................................................................................................... -11.4 V dc to -16.5 V dc

Ambient operating temperature range................................................................................. -55°C to +125°C

1.5 Radiation features.

Maximum total dose available (dose rate = 50 – 300 rad(Si)/s) .......................................... ≤100 Krads (Si)

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of

this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue

of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation.

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883

-

Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific

exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device

class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

4

DSCC FORM 2234

APR 97

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Truth table. The truth table shall be as specified on figure 2.

3.2.4 Block or logic diagrams. The block or logic diagrams shall be as specified on figure 3.

3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document

revision level control and shall be made available to the preparing and acquiring activity upon request.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical

performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient

operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests

for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked

as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the

manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator

shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M

shall be in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed

manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see

6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing

shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or

for device class M, the requirements of MIL-PRF-38535, appendix A and herein.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for

device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein)

involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.

3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the

option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available

onshore at the option of the reviewer.

3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit

group number 81 (see MIL-PRF-38535, appendix A).

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

5

DSCC FORM 2234

APR 97

TABLE I. Electrical performance characteristics.

Conditions

-55°C ≤ T_A≤ +125°C

V_CC= +15 V, V_LOG= +5 V,

Group A

subgroups

Device

type

Limits

Unit

mA

Test

Symbol

V_EE= -15 V 1/

unless otherwise specified

Min

Max

40

I_LOG

1, 2, 3

01, 02,

03, 04

01, 02

Power supply current

From V_LOG

M, D, P, L, R

1

40

1

05, 06,

07, 08

1, 2, 3

I_CC

1, 2, 3

1

01, 02

03, 04

5

mA

Power supply current

From V_CC

1, 2, 3

15

05, 06,

07, 08

9

I_EE

1, 2, 3

01, 02,

03, 04

01, 02

-30

Power supply current

From V_EE

M, D, P, L, R

1

-30

0

05, 06,

07, 08

1, 2, 3

All

12

Bits

Resolution

ILE

1

2, 3

1

-0.5

-1.0

-1.5

0.5

1.0

1.5

LSB

Integral linearity error

M, D, P, L, R

01, 02

All

Differential linearity error

(minimum resolution for

which no missing codes

DLE

V_IO

1

12

Bits

2, 3

guaranteed)

2/

1

All

01, 02

01

-2.0

-3.0

-1.0

2.0

3.0

1.0

LSB

T_A= +25°C

Unipolar offset voltage error

M, D, P, L, R

1

12

Using internal reference

1, 2, 3 3/

2, 3

01, 02

03, 04

05, 06

07, 08

All

LSB

∆V_IO

∆T

Unipolar offset drift

2/

B_Z

1

-4.0

-5.0

-2.0

-1.0

4.0

5.0

2.0

1.0

LSB

T_A= +25°C

Bipolar offset voltage error

M, D, P, L, R

1

12

01, 02

01

Using internal reference

1, 2, 3 3/

2, 3

01

∆B_Z

Bipolar zero offset drift

2/

T

03,

05, 07

02

1, 2, 3 3/

2, 3

-2.0

2.0

04,

06, 08

See footnotes at end of table.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

J

SHEET

6

DSCC FORM 2234

APR 97

TABLE I. Electrical performance characteristics – continued.

Conditions

-55°C ≤ T_A≤ +125°C

V_CC= +15 V, V_LOG= +5 V,

Group A

subgroups

Device

type

Limits

Unit

Test

Symbol

V_EE= -15 V 1/

unless otherwise specified

T_A= +25°C

Min

Max

0.25

1

01, 02

03, 04,

05, 06,

07, 08

01

% of

F.S.

∆A_E

Gain error

M, D, P, L, R

With 50Ω resistor from

REF OUT to REF IN

0.35

0.30

12

1, 2, 3 3/

2, 3

0.125

12.5

Using internal reference

01

-12.5

-25.0

-1.0

∆A_E

∆T

ppm/°C

Gain error drift

2/

03,

05, 07

02

1, 2, 3 3/

2, 3

25.0

1.0

04,

06, 08

All

+P_SS1

+P_SS2

+P_SS3

-P_SS1

-P_SS2

Z_IN

+13.5 V < V_CC< +16.5 V

T_A= +25°C

1

LSB

Power supply sensitivity

(Maximum change in

full scale calibration)

2/

+11.4 V < V_CC< +12.6 V

T_A= +25°C

+4.5 V < V_LOG< +5.5 V

T_A= +25°C

1

All

-0.5

-1.0

0.5

1.0

-16.5 V < V_EE< -13.5 V

T_A= +25°C

-12.6 V < V_EE< -11.4 V

T_A= +25°C

4

All

3

6

7

10 V span, T_A= +25°C

20 V span, T_A= +25°C

kΩ

Input Impedance

2/

01, 02,

03, 04

05, 06,

07, 08

01, 02

03, 04

07, 08

05, 06

01

14

15

25

V_REF

1

9.98

9.95

9.90

10.02

10.05

10.10

V

T_A= +25°C

4/

Internal reference voltage

M, D, P, L, R

9.97

9.99

10.03

10.01

1.5

12

1

I_O

Available for external loads

01, 02,

03, 04

05, 06,

07, 08

mA

Output current

2/, 5/

T_A= +25°C

2.0

See footnotes at end of table.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

7

DSCC FORM 2234

APR 97

TABLE I. Electrical performance characteristics – continued.

Conditions

-55°C ≤ T_A≤ +125°C

V_CC= +15 V, V_LOG= +5 V,

Group A

subgroups

Device

type

Limits

Unit

V

Test

Symbol

V_EE= -15 V 1/

unless otherwise specified

Logic “1”, T_A= +25°C

Min

2.0

Max

5.5

V_IH

1

01, 02,

05, 06,

07, 08

03, 04

All

Input voltage (CE, CS, 12/8,

R/C, A_O)

2/, 6/

2.4

-0.5

-20

5.5

0.8

V_IL

I_IN

Logic “0”, T_A= +25°C

T_A= +25°C

1

01, 02,

03, 04,

07, 08

05,06

All

+20

µA

Input current

2/

-1

1

V_OL

V_OH

I_Z

Logic “0”, T_A= +25°C,

1

0.4

V

Output voltage

(DB11-DB0, STS)

I

_SINK= +1.6 mA

2/

1

Logic “1”, T_A= +25°C,

I_SOURCE= +500 µA

All

2.4

-20

Output voltage

(DB11-DB0)

2/

High-Z state, T_A= +25°C,

01, 02,

03, 04,

07, 08

05, 06

All

+20

+5

µA

High impedance state

output current

DB11 – DB0 only

-5

7

See 4.4.1b, T_A= +25°C

Functional tests

See figure 4

9, 10, 11

01, 02

03, 04

05, 06,

07, 08

01, 02,

03, 04

05, 06,

07, 08

01, 02,

05, 06,

07, 08

03, 04

01, 02,

05, 06,

07, 08

03, 04

01, 02,

03, 04

05, 06,

07, 08

250

350

50

ns

Low R/C pulse width

2/, 7/

t_HRL

See figure 4

9, 10, 11

600

200

t_DS

STS delay from R/C

2/, 7/

25

t_HDR

Data valid after R/C low

2/, 7/

15

300

1000

1200

t_HS

STS delay after valid data

2/,7/

300

t_HRH

High R/C pulse width

2/, 8/

150

See footnotes at end of table.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

8

DSCC FORM 2234

APR 97

TABLE I. Electrical performance characteristics – continued.

Conditions

Group A

subgroups

Device

type

Limits

Unit

ns

-55°C ≤ T_A≤ +125°C

V_CC= +15 V, V_LOG= +5 V,

V_EE= -15 V 1/

Test

Symbol

unless otherwise specified

See figure 4

Min

Max

250

t_DDR

9, 10, 11

01, 02,

03, 04

05, 06,

07, 08

01, 02,

03, 04

05, 06,

07, 08

01, 02,

03, 04

05, 06,

07, 08

01,02 5/

03, 04,

05, 06,

07, 08

01,02 5/

03, 04,

05, 06,

07, 08

01, 02

03, 04

05, 06,

07, 08

01, 02,

05, 06,

07, 08

03, 04

01, 02

03, 04,

05, 06,

07, 08

Data access time

2/,8/

150

350

200

t_DSC

t_HEC

t_C

See figure 4

See figure 5

ns

µs

STS delay from CE

2/, 8/

300

50

CE pulse width

2/, 8/

8-bit cycle

10

24

17

Conversion time

2/, 9/

See figure 5

12-bit cycle

See figure 5

15

35

25

t_DD

t_HD

t_HL

See figure 6

200

250

150

ns

Access time (from CE)

2/, 7/

25

15

Data valid after CE low

2/, 7/

100

150

Output float delay

2/, 7/

1/ Devices supplied to this drawing have been characterized through all levels M, D, P, L, and R of irradiation. However, this device

is only tested at the “R” level. Pre and post irradiation values are identical unless otherwise specified in table I. When performing

post irradiation electrical measurements for any RHA level, T_A= +25°C.

2/ This parameter is not tested post irradiation.

3/ Guaranteed to the limits specified, if not tested for subgroup 1.

4/ The reference voltage external load current shall be a constant dc and shall not exceed 1.5 mA.

5/ Reference should be buffered for operation on +12 V supplies. External load should not change during conversion.

6/ For devices 01 and 02, 12/8 is not TTL compatible and must be hard wired to V_LOGor digital ground.

7/ Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits.

8/ Parameters t_HRH, t_DDR, t_DSC, and t_HEC, if not tested, shall be guaranteed to the specified limits.

9/ For devices 03 and 04, time measured from 50 percent level of digital transitions, tested with 50 pF and 3.0 kΩ load.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

9

DSCC FORM 2234

APR 97

Device types

Case outlines

Terminal number

1

All

X

01, 02

Z

01, 02, 05, 06, 07, 08

3

03, 04

Y

Terminal symbol

V_LOG

12/8

2

3

4

CS

AO

CS

AO

5

6

R/C

CE

NC

7

V_CC

NC

8

REF OUT

AGND

REF IN

V_EE

NC

9

R/C

CE

V_CC

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

BIP OFF

10 V_IN

20 V_IN

DGND

DB0

DB1

DB2

DB3

DB4

DB5

DB6

DB7

DB8

REF OUT

AGND

REF IN

V_EE

NC

BIP OFF

10 V_IN

20 V_IN

NC

DGND

NC

DB9

DB10

DB11 (MSB)

STS

NC

DB0

DB1

DB2

NC

DB3

DB4

DB5

DB6

DB7

DB8

DB9

NC

DB10

DB11 (MSB)

STS

FIGURE 1. Terminal connections.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

SHEET

H

10

DSCC FORM 2234

APR 97

CE

CS

R/C

12/8

A_O

Operation

0

X

1

X

None

1

0

X

0

1

Initiate 12-bit conversion

Initiate 8-bit conversion

1

0

1

X

Enable 12-bit parallel output

1

0

1

0

1

Enable 8 most significant bits

Enable 4 LSBs + 4 trailing zeros

FIGURE 2. Truth table.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

11

DSCC FORM 2234

APR 97

Device types 01, 02, 03, and 04

NOTE: For device types 03 and 04, the resistor value is 9.95 kΩ.

FIGURE 3. Block diagram.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

12

DSCC FORM 2234

APR 97

Device types 05, 06, 07, and 08

FIGURE 3. Block diagram - continued.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

13

DSCC FORM 2234

APR 97

B

O

FIGURE 4. High/low pulse for R/C outputs.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

14

DSCC FORM 2234

APR 97

FIGURE 5. Convert start diagram.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

15

DSCC FORM 2234

APR 97

FIGURE 6. Read cycle timing.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

16

DSCC FORM 2234

APR 97

4. QUALITY ASSURANCE PROVISIONS

4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-

PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not

affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance

with MIL-PRF-38535, appendix A.

4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on

all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with

method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.

4.2.1 Additional criteria for device class M.

a. Burn-in test, method 1015 of MIL-STD-883.

(1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level

control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify

the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test

method 1015.

(2) T_A= +125°C, minimum.

b. Interim and final electrical test parameters shall be as specified in table IIA herein.

c. Optional subgroup 12, for device 01, is used for grading the part selection at 25°C.

4.2.2 Additional criteria for device classes Q and V.

a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device

manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document

revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with

MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test

method 1015 of MIL-STD-883.

b. Interim and final electrical test parameters shall be as specified in table IIA herein.

c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in

MIL-PRF-38535, appendix B.

4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in

accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups

A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

17

DSCC FORM 2234

APR 97

TABLE IIA. Electrical test requirements.

Subgroups

(in accordance with

MIL-STD-883,

Subgroups

Test requirements

(in accordance with

MIL-PRF-38535, table III)

method 5005, table I)

Device

class Q

Device

class V

class M

Interim electrical

1

parameters (see 4.2)

1/

1/, 2/

1, 2, 3, 4, 12

1, 2, 3, 4, 7, 9,

10, 11, 12

2/

Final electrical

1, 2, 3, 4, 12

1, 2, 3, 4, 7, 9,

10, 11, 12

1, 2, 3, 4, 12

1, 2, 3, 4, 7, 9,

10, 11, 12

parameters (see 4.2)

Group A test

requirements (see 4.4)

Group C end-point electrical

parameters (see 4.4)

1, 4

Group D end-point electrical

parameters (see 4.4)

1, 4

1

Group E end-point electrical

parameters (see 4.4)

- - -

1/ PDA applies to subgroup 1.

2/ Delta limits as specified in table IIB shall be required where specified, and the delta limits shall be computed

with reference to the previous interim electrical parameters.

TABLE IIB. 240 hour burn-in and group C end-point electrical parameters.

Endpoint limits

Test title

Delta limits

Units

Min

-1

Max

2

Uni Vio

Bpze

Ae

+0.5

+1

LSB

-5.5

4.5

-0.35

0.35

+.10

%FSR

4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with

MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified. Quality conformance inspection for device class

M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M

shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through

4.4.4).

4.4.1 Group A inspection.

a. Tests shall be as specified in table IIA herein.

b. For device class M, subgroups 7 tests shall be sufficient to verify the truth table. For device classes Q and V, subgroups 7

shall include verifying the functionality of the device.

c. Subgroups 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.

d. Optional subgroup 12, for device type 01, is used for grading the part selection at 25°C.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

18

DSCC FORM 2234

APR 97

4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.

4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:

a. Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control

and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,

outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-

STD-883.

b. T_A= +125°C, minimum.

c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.

4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or

approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test

circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with

MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the

inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-

STD-883.

4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.

4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured

(see 3.5 herein).

a. End-point electrical parameters shall be as specified in table IIA herein.

b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified

in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation

hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes

must meet the postirradiation end-point electrical parameter limits as defined in table I at

T_A= +25°C ±5°C, after exposure, to the subgroups specified in table IIA herein.

c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied.

5. PACKAGING

5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q

and V or MIL-PRF-38535, appendix A for device class M.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

19

DSCC FORM 2234

APR 97

6. NOTES

6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original

equipment), design applications, and logistics purposes.

6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-

prepared specification or drawing.

6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the

individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.

6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system application

requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will

be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC

5962) should contact DSCC-VA, telephone (614) 692-0544.

6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614)

692-0547.

6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in

MIL-PRF-38535 and MIL-HDBK-1331.

V_LOG

12/8

CS

A0

R/C

Logic supply

Data mode select input

Chip select input

Byte address/short cycle input

Read/convert input

Chip enable input

Positive power supply

Reference output

Analog ground

CE

V_CC

REF OUT

AGND

REF IN

V_EE

BIP OFF

V_IN

Reference input

Negative power supply

Bipolar offset input

Span input

DGND

D0-D11

STS

Digital ground

Tree-state data outputs

Status output

NC

No connection

6.6 Sources of supply.

6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.

The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this

drawing.

6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The

vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to

and accepted by DSCC-VA.

SIZE

STANDARD

MICROCIRCUIT DRAWING

5962-85127

A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

H

SHEET

20

DSCC FORM 2234

APR 97

STANDARD MICROCIRCUIT DRAWING BULLETIN

DATE: 03-04-25

Approved sources of supply for SMD 5962-85127 are listed below for immediate acquisition information only and shall

be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised

to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of

compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of

MIL-HDBK-103 and QML-38535.

Standard

microcircuit drawing

PIN 1/

Vendor

CAGE

number

Vendor

similar

PIN 2/

5962-85127013A

5962-8512701XA

5962-8512701XC

5962-8512701VXA

5962-8512701VZA

5962R8512701VXA

5962R8512701VZA

5962-85127023A

5962-85127023C

24355

1ES66

24355

1ES66

24355

1ES66

24355

34371

3/

AD574AUE/883B

AD574AUD/883B

MX574AUD/883B

AD574AUD/QMLV

AD574AUF/QMLV

AD574AUD/QMLR

AD574AUF/QMLR

AD574ATE/883B

MX574ATE/883B

AD574ATD/883B

MX574ATQ/883B

MX574ATD/883B

AD574ATD/QMLV

AD574ATF/QMLV

AD574ATD/QMLR

AD574ATF/QMLR

HI1-574AUD/883

HI4-574AUE/883

HI1-574ATD/883

HI4-574ATE/883

HADC574ZAMC/883

HADC574ZAMJ/883

HADC574ZBMC/883

HADC574ZBMJ/883

HS574AU/B-LCC

HS574AU/B

5962-8512702XA

5962-8512702XC

5962-8512702VXA

5962-8512702VZA

5962R8512702VXA

5962R8512702VZA

5962-8512703XA

5962-8512703YA

5962-8512704XA

5962-8512704YA

5962-85127053A

5962-8512705XC

5962-85127063A

5962-8512706XC

5962-85127073C

5962-8512707XC

5962-85127083C

5962-8512708XC

34371

3/

HS574AT/B-LCC

HS574AT/B

3/

1/ The lead finish shown for each PIN representing

a hermetic package is the most readily available

from the manufacturer listed for that part. If the

desired lead finish is not listed contact the vendor

to determine its availability.

2/ Caution. Do not use this number for item

acquisition. Items acquired to this number may not

satisfy the performance requirements of this drawing.

3/ Not available from an approved source.

Sheet 1 of 2

STANDARD MICROCIRCUIT DRAWING BULLETIN - continued

Vendor CAGE

number

Vendor name

and address

24355

Analog Devices Incorporated

Route 1 Industrial Park

PO Box 9106

Norwood, MA 02062-9106

Point of contact:

1500 Space Park Drive

PO Box 58020

Santa Clara, CA 95050-8020

1ES66

34371

Maxim Integrated Products

120 San Gabriel Drive

Sunnyvale, CA 94086-5126

Intersil Corporation

2401 Palm Bay Blvd

PO Box 883

Melbourne, FL 32902-0883

The information contained herein is disseminated for convenience only and the

Government assumes no liability whatsoever for any inaccuracies in the

information bulletin.


型号：	5962R8512702VXA
厂家：	ADI
描述：	Aerospace 12-Bit-ADC w/Microprocessor Interface CD 转换器
文件：	总22页 (文件大小：151K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

5962R8512702VXA [ADI]

相关型号：

5962R8512702VZA

5962R8551401V2A

5962R8551401VGA

5962R8551401VHA

5962R8551401VPA

5962R8670412V9A

5962R8670412VYC

5962R8752501B2A

5962R8752501B2A

5962R8752501BCA

5962R8752501BCA

5962R8752501BDA