AD4001BRMZ-RL7 [ADI]
Precision, Differential SAR ADCs;
| 型号： | AD4001BRMZ-RL7 |
| 厂家： | 
ADI |
| 描述： | Precision, Differential SAR ADCs |
| 文件： | 总37页 (文件大小：905K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
16-Bit, 2 MSPS/1 MSPS,
Precision, Differential SAR ADCs
Data Sheet
AD4001/AD4005
FEATURES
GENERAL DESCRIPTION
The AD4001/AD4005 are low noise, low power, high speed, 16-bit,
precision successive approximation register (SAR) analog-to-digital
converters (ADCs). The AD4001 offers a 2 MSPS throughput, and
the AD4005 offers a 1 MSPS throughput. They incorporate ease
of use features that reduce signal chain power consumption,
reduce signal chain complexity, and enable higher channel density.
The high-Z mode, coupled with a long acquisition phase,
eliminates the need for a dedicated high power, high speed
ADC driver, thus broadening the range of low power precision
amplifiers that can drive these ADCs directly, while still achieving
optimum performance. The input span compression feature
enables the ADC driver amplifier and the ADC to operate off
common supply rails without the need for a negative supply while
preserving the full ADC code range. The low serial peripheral
interface (SPI) clock rate requirement reduces the digital
input/output power consumption, broadens processor options,
and simplifies the task of sending data across digital isolation.
Throughput: 2 MSPS/1 MSPS options
INL: 0.4 LSB maximum
Guaranteed 16-bit no missing codes
Low power
9.5 mW at 2 MSPS, 4.9 mW at 1 MSPS (VDD only)
80 μW at 10 kSPS, 16 mW at 2 MSPS (total)
SNR: 96.2 dB typical at 1 kHz, VREF = 5 V; 95.5 dB typical at 100 kHz
THD: −123 dB typical at 1 kHz, VREF = 5 V; −99 dB typical at 100 kHz
Ease of use features reduce system power and complexity
Input overvoltage clamp circuit
Reduced nonlinear input charge kickback
High-Z mode
Long acquisition phase
Input span compression
Fast conversion time allows low SPI clock rates
SPI-programmable modes, read/write capability, status word
Differential analog input range: VREF
0 V to VREF with VREF from 2.4 V to 5.1 V
Operating from a 1.8 V supply, the AD4001/AD4005 have a VREF
fully differential input range with VREF ranging from 2.4 V to 5.1 V.
The AD4001 consumes only 16 mW at 2 MSPS with a minimum
SCK rate of 70 MHz in turbo mode, and the AD4005 consumes
only 8 mW at 1 MSPS. The AD4001/AD4005 both achieve
0.4 LSB integral nonlinearity error (INL) maximum, guaranteed
no missing codes at 16 bits with 96.2 dB typical signal-to-noise
ratio (SNR) for 1 kHz inputs. The reference voltage is applied
externally and can be set independently of the supply voltage.
Single 1.8 V supply operation with 1.71 V to 5.5 V logic interface
SAR architecture: no latency/pipeline delay, valid first conversion
First accurate conversion
Guaranteed operation: −40°C to +125°C
SPI-/QSPI-/MICROWIRE-/DSP-compatible serial interface
Ability to daisy-chain multiple ADCs and busy indicator
10-lead packages: 3 mm × 3 mm LFCSP, 3 mm × 4.90 mm MSOP
APPLICATIONS
Automatic test equipment
Machine automation
Medical equipment
Battery-powered equipment
Precision data acquisition systems
The SPI-compatible, versatile serial interface features seven
different modes including the ability, using the SDI input, to
daisy-chain several ADCs on a single 3-wire bus, and provides an
optional busy indicator. The AD4001/AD4005 are compatible with
1.8 V, 2.5 V, 3 V, and 5 V logic, using the separate VIO supply.
The AD4001/AD4005 are available in a 10-lead MSOP or LFCSP
with operation specified from −40°C to +125°C. The devices are
pin compatible with the 18-bit, 2 MSPS AD4003 (see Table 8).
FUNCTIONAL BLOCK DIAGRAM
2.4V TO 5.1V
10µF
1.8V
REF
VDD
VIO
SDI
AD4001/
AD4005
1.8V TO 5V
V
REF
/2
0
HIGH-Z
MODE
TURBO
MODE
V
V
REF
IN+
IN–
SCK
3-WIRE OR 4-WIRE
SPI INTERFACE
(DAISY CHAIN, CS)
SERIAL
INTERFACE
16-BIT
SAR ADC
SDO
CNV
V
REF
/2
STATUS
BITS
SPAN
COMPRESSION
CLAMP
REF
0
GND
Figure 1.
Rev. B
Document Feedback
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rights of third parties that may result from its use. Specifications subject to change without notice. No
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Tel: 781.329.4700
Technical Support
©2017 Analog Devices, Inc. All rights reserved.
www.analog.com
AD4001/AD4005
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Analog Inputs ............................................................................. 20
Driver Amplifier Choice ........................................................... 22
Ease of Drive Features ............................................................... 23
Voltage Reference Input ............................................................ 24
Power Supply............................................................................... 24
Digital Interface.......................................................................... 25
Register Read/Write Functionality........................................... 26
Status Word ................................................................................. 28
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 4
Timing Specifications .................................................................. 7
Absolute Maximum Ratings............................................................ 9
Thermal Resistance ...................................................................... 9
ESD Caution.................................................................................. 9
Pin Configurations and Function Descriptions ......................... 10
Typical Performance Characteristics ........................................... 11
Terminology .................................................................................... 16
Theory of Operation ...................................................................... 17
Circuit Information.................................................................... 17
Converter Operation.................................................................. 18
Transfer Functions...................................................................... 18
Applications Information .............................................................. 19
Typical Application Diagrams .................................................. 19
CS
CS
CS
CS
CS
CS
Mode, 3-Wire Turbo Mode ................................................. 29
Mode, 3-Wire Without Busy Indicator ............................. 30
Mode, 3-Wire with Busy Indicator .................................... 31
Mode, 4-Wire Turbo Mode ................................................. 32
Mode, 4-Wire Without Busy Indicator ............................. 33
Mode, 4-Wire with Busy Indicator .................................... 34
Daisy-Chain Mode..................................................................... 35
Layout Guidelines....................................................................... 36
Evaluating the AD4001/AD4005 Performance.......................... 36
Outline Dimensions....................................................................... 37
Ordering Guide .......................................................................... 37
REVISION HISTORY
8/2017—Rev. A to Rev. B
CS
Mode, 4-Wire Turbo Mode Section and
Changes to
Figure 58 .......................................................................................... 32
CS
Changes to General Description Section ...................................... 1
Changes to Table 1............................................................................ 6
Changes to Endnote 3, Table 2 ........................................................ 7
Changes to Table 4............................................................................ 8
Change to Pin 3 Description and Pin 4 Description, Table 7... 10
Reorganized Typical Performance Characteristics Section ...... 13
Changes to Figure 17, Figure 19, and Figure 21 ......................... 13
Added Figure 23; Renumbered Sequentially .............................. 14
Changes to Figure 27...................................................................... 15
Changes to Circuit Information Section and Table 8 ................ 17
Changes to Endnote 1 and Endnote 2, Table 9 ........................... 18
Changes to Figure 37 Caption and RC Filter Values Section ... 21
Changes to High Frequency Input Signals Section, Figure 38
Caption, and Figure 39 Caption ................................................... 22
Added Multiplexed Applications Section and Figure 40........... 22
Changes to Figure 41 and Figure 42 Caption ............................. 23
Changes to Figure 43, Figure 44 Caption, Figure 45, and Voltage
Reference Input Section................................................................. 24
Changes to Power Supply Section, Figure 46, Figure 47, Digital
Interface Section, and Table 11..................................................... 25
Changes to
Mode, 4-Wire with Busy Indicator Section and
Figure 62 .......................................................................................... 34
4/2017—Rev. 0 to Rev. A
Added AD4005 ...................................................................Universal
Changes to Title, Features Section, General Description Section,
and Figure 1........................................................................................1
Changes to Table 1.............................................................................3
Changes to Table 2.............................................................................6
Changes to Table 4.............................................................................7
Changes to Figure 19 Caption and Figure 21 ............................. 12
Changes to Figure 24...................................................................... 13
Added Figure 25; Renumbered Sequentially .............................. 13
Changes to Circuit Information Section and Table 8................ 16
Changes to RC Filter Values Section............................................ 20
Changes to High Frequency Input Signals Section.................... 21
Changes to High-Z Mode Section and Figure 41....................... 22
Changes to Long Acquisition Phase Section .............................. 23
Changes to Digital Interface Section and Register Read/Write
Functionality Section..................................................................... 24
CS
Changes to
Mode, 3-Wire Turbo Mode Section................... 29
CS
Changes to
Mode, 3-Wire with Busy Induction Section and
CS
CS
Changes to
Changes to
Mode, 3-Wire Turbo Mode Section .................. 27
Mode, 4-Wire Turbo Mode Section .................. 30
Figure 56 .......................................................................................... 31
Rev. B | Page 2 of 37
Data Sheet
AD4001/AD4005
Changes to Layout Guidelines Section and Evaluating the
AD4001/AD4005 Performance Section.......................................34
Updated Outline Dimensions........................................................35
Changes to Ordering Guide...........................................................35
1/2017—Revision 0: Initial Version
Rev. B | Page 3 of 37
AD4001/AD4005
SPECIFICATIONS
Data Sheet
VDD = 1.71 V to 1.89 V, VIO = 1.71 V to 5.5 V, VREF = 5 V, all specifications TMIN to TMAX, high-Z mode disabled, span compression disabled,
turbo mode enabled, and sampling frequency (fS) = 2 MSPS for the AD4001 and fS = 1 MSPS for the AD4005, unless otherwise noted.
Table 1.
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
RESOLUTION
ANALOG INPUT
Voltage Range
16
Bits
VIN+ − VIN−
−VREF
+VREF
V
Span compression enabled
VIN+, VIN− to GND
Span compression enabled
−VREF × 0.8
−0.1
0.1 × VREF
+VREF × 0.8
VREF + 0.1
0.9 × VREF
VREF/2 + 0.125
V
V
V
V
dB
nA
µA
Operating Input Voltage
Common-Mode Input Range
Common-Mode Rejection Ratio (CMRR)
Analog Input Current
VREF/2 − 0.125 VREF/2
fIN = 500 kHz
Acquisition phase, T = 25°C
High-Z mode enabled, converting
dc input at 2 MSPS
68
0.3
1
THROUGHPUT
Complete Cycle
AD4001
AD4005
Conversion Time
Acquisition Phase1
AD4001
500
1000
ns
ns
ns
290
320
290
790
ns
ns
AD4005
Throughput Rate2
AD4001
AD4005
Transient Response3
0
0
2
1
MSPS
MSPS
ns
250
DC ACCURACY
No Missing Codes
Integral Nonlinearity Error (INL)
Differential Nonlinearity Error (DNL)
Transition Noise
Zero Error
16
−0.4
−0.5
Bits
LSB
LSB
LSB
LSB
ppm/°C
LSB
ppm/°C
LSB
µV p-p
0.2
0.2
0.35
0.1
+0.4
+0.5
−1.5
+1.5
Zero Error Drift4
−0.28
−16.5
−0.23
+0.28
+16.5
+0.23
Gain Error
Gain Error Drift4
Power Supply Sensitivity
1/f Noise5
0.4
VDD = 1.8 V 5%
Bandwidth = 0.1 Hz to 10 Hz
0.25
6
AC ACCURACY
Dynamic Range
96.3
54
dB
µV rms
Total RMS Noise
fIN = 1 kHz, −0.5 dBFS, VREF = 5 V
Signal-to-Noise Ratio (SNR)
Spurious-Free Dynamic Range (SFDR)
Total Harmonic Distortion (THD)
95.6
95.5
96.2
122
−123
96
dB
dB
dB
dB
Signal-to-Noise-and-Distortion Ratio
(SINAD)
Oversampled Dynamic Range
Oversampling ratio (OSR) = 256,
VREF = 5 V
120
dB
Rev. B | Page 4 of 37
Data Sheet
AD4001/AD4005
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
fIN = 1 kHz, −0.5 dBFS, VREF = 2.5 V
SNR
SFDR
THD
SINAD
92.1
93.2
118
−117
93
dB
dB
dB
dB
92
fIN = 100 kHz, −0.5 dBFS, VREF = 5 V
SNR
THD
SINAD
95.5
−99
93.8
dB
dB
dB
fIN = 400 kHz, −0.5 dBFS, VREF = 5 V
SNR
THD
91
−92
89
10
1
dB
dB
dB
MHz
ns
SINAD
−3 dB Input Bandwidth
Aperture Delay
Aperture Jitter
REFERENCE
1
ps rms
Voltage Range, VREF
Current
AD4001
2.4
5.1
V
VREF = 5 V
2 MSPS
1 MSPS
1.1
0.5
mA
mA
AD4005
INPUT OVERVOLTAGE CLAMP
IN+/IN− Current, IIN+/IIN−
VREF = 5 V
VREF = 2.5 V
VREF = 5 V
VREF = 2.5 V
VREF = 5 V
VREF = 2.5 V
50
50
mA
mA
V
V
V
V
ns
µA
VIN+/VIN− at Maximum IIN+/IIN−
5.4
3.1
5.4
2.8
360
100
VIN+/VIN− Clamp On/Off Threshold
5.25
2.68
Deactivation Time
REF Current at Maximum IIN+/IIN−
DIGITAL INPUTS
VIN+/VIN− > VREF
Logic Levels
Input Low Voltage, VIL
VIO > 2.7 V
VIO ≤ 2.7 V
VIO > 2.7 V
VIO ≤ 2.7 V
−0.3
−0.3
0.7 × VIO
0.8 × VIO
−1
+0.3 × VIO
+0.2 × VIO
VIO + 0.3
VIO + 0.3
+1
V
V
V
V
µA
µA
pF
Input High Voltage, VIH
Input Low Current, IIL
Input High Current, IIH
Input Pin Capacitance
DIGITAL OUTPUTS
Data Format
−1
+1
6
Serial 16 bits, twos complement
Pipeline Delay
Conversion results available immediately
after completed conversion
Output Low Voltage, VOL
Output High Voltage, VOH
POWER SUPPLIES
VDD
ISINK = 500 µA
ISOURCE = −500 µA
0.4
V
V
VIO − 0.3
1.71
1.71
1.8
1.6
1.89
5.5
V
V
µA
VIO
Standby Current
VDD = 1.8 V, VIO = 1.8 V, T = 25°C
Rev. B | Page 5 of 37
AD4001/AD4005
Data Sheet
Parameter
Test Conditions/Comments
VDD = 1.8 V, VIO = 1.8 V, VREF = 5 V
10 kSPS, high-Z mode disabled
1 MSPS, high-Z mode disabled
2 MSPS, high-Z mode disabled
1 MSPS, high-Z mode enabled
2 MSPS, high-Z mode enabled
1 MSPS, high-Z mode disabled
2 MSPS, high-Z mode disabled
1 MSPS, high-Z mode disabled
2 MSPS, high-Z mode disabled
1 MSPS, high-Z mode disabled
2 MSPS, high-Z mode disabled
Min
Typ
Max
Unit
Power Dissipation
80
8
µW
mW
mW
mW
mW
mW
mW
mW
mW
mW
mW
nJ/sample
9.3
16
10
20
4.9
9.5
2.8
5.5
0.4
1.0
8
18.5
12.3
24.5
VDD Only
REF Only
VIO Only
Energy per Conversion
TEMPERATURE RANGE
Specified Performance
TMIN to TMAX
−40
+125
°C
1 The acquisition phase is the time available for the input sampling capacitors to acquire a new input with the ADC running at a throughput rate of 2 MSPS for the
AD4001 and 1 MSPS for the AD4005.
2 A throughput rate of 2 MSPS can only be achieved with turbo mode enabled and a minimum SCK rate of 70 MHz. Refer to Table 4 for the maximum achievable
throughput for different modes of operation.
3 Transient response is the time required for the ADC to acquire a full-scale input step to 1 LSB accuracy.
4 The minimum and maximum values are guaranteed by characterization, but not production tested.
5 See the 1/f noise plot in Figure 23.
Rev. B | Page 6 of 37
Data Sheet
AD4001/AD4005
TIMING SPECIFICATIONS
VDD = 1.71 V to 1.89 V, VIO = 1.71 V to 5.5 V, VREF = 5 V, all specifications TMIN to TMAX, high-Z mode disabled, span compression
disabled, turbo mode enabled, and sampling frequency (fS) = 2 MSPS for the AD4001 and fS = 1 MSPS for the AD4005, unless otherwise
noted. See Figure 2 for the timing voltage levels.
Table 2. Digital Interface Timing
Parameter
Symbol
tCONV
Min
Typ
Max
Unit
CONVERSION TIME—CNV RISING EDGE TO DATA AVAILABLE
270
290
320
ns
ACQUISITION PHASE1
tACQ
AD4001
AD4005
290
790
ns
ns
TIME BETWEEN CONVERSIONS
AD4001
AD4005
CNV PULSE WIDTH (CS MODE)2
SCK PERIOD (CS MODE)3
tCYC
500
1000
10
ns
ns
ns
tCNVH
tSCK
VIO > 2.7 V
VIO > 1.7 V
9.8
12.3
ns
ns
SCK PERIOD (DAISY-CHAIN MODE)4
tSCK
VIO > 2.7 V
VIO > 1.7 V
20
25
3
ns
ns
ns
ns
ns
SCK LOW TIME
tSCKL
tSCKH
tHSDO
tDSDO
SCK HIGH TIME
3
SCK FALLING EDGE TO DATA REMAINS VALID DELAY
1.5
SCK FALLING EDGE TO DATA VALID DELAY
VIO > 2.7 V
VIO > 1.7 V
7.5
10.5
ns
ns
CNV OR SDI LOW TO SDO D15 MOST SIGNIFICANT BIT (MSB) VALID DELAY (CS MODE)
VIO > 2.7 V
tEN
10
13
ns
ns
ns
ns
ns
VIO > 1.7 V
CNV RISING EDGE TO FIRST SCK RISING EDGE DELAY
LAST SCK FALLING EDGE TO CNV RISING EDGE DELAY5
CNV OR SDI HIGH OR LAST SCK FALLING EDGE TO SDO HIGH IMPEDANCE (CS MODE)
tQUIET1
tQUIET2
tDIS
190
60
20
SDI VALID SETUP TIME FROM CNV RISING EDGE
tSSDICNV
tHSDICNV
tHSCKCNV
tSSDISCK
tHSDISCK
2
ns
ns
ns
ns
ns
SDI VALID HOLD TIME FROM CNV RISING EDGE (CS MODE)
SCK VALID HOLD TIME FROM CNV RISING EDGE (DAISY-CHAIN MODE)
SDI VALID SETUP TIME FROM SCK RISING EDGE (DAISY-CHAIN MODE)
SDI VALID HOLD TIME FROM SCK RISING EDGE (DAISY-CHAIN MODE)
2
12
2
2
1 The acquisition phase is the time available for the input sampling capacitors to acquire a new input with the ADC running at a throughput rate of 2 MSPS for the
AD4001 and 1 MSPS for the AD4005.
2 For turbo mode, tCNVH must match the tQUIET1 minimum.
3 A throughput rate of 2 MSPS can only be achieved with turbo mode enabled and a minimum SCK rate of 70 MHz. Refer to Table 4 for the maximum achievable
throughput for different modes of operation.
4 A 50% duty cycle is assumed for SCK.
5 See Figure 22 for SINAD vs. tQUIET2
.
1
Y% VIO
1
X% VIO
tDELAY
tDELAY
2
2
V
V
V
IH
IH
2
2
V
IL
IL
1
2
FOR VIO ≤ 2.7V, X = 80, AND Y = 20; FOR VIO > 2.7V, X = 70, AND Y = 30.
MINIMUM V AND MAXIMUM V USED. SEE DIGITAL INPUTS
IH
IL
SPECIFICATIONS IN TABLE 1.
Figure 2. Voltage Levels for Timing
Rev. B | Page 7 of 37
AD4001/AD4005
Data Sheet
Table 3. Register Read/Write Timing
Parameter
Symbol
Min
Typ
Max
Unit
READ/WRITE OPERATION
CNV Pulse Width1
SCK Period
tCNVH
tSCK
10
ns
VIO > 2.7 V
VIO > 1.7 V
SCK Low Time
SCK High Time
9.8
12.3
3
ns
ns
ns
ns
tSCKL
tSCKH
3
READ OPERATION
CNV Low to SDO D15 MSB Valid Delay
VIO > 2.7 V
VIO > 1.7 V
SCK Falling Edge to Data Remains Valid
SCK Falling Edge to Data Valid Delay
VIO > 2.7 V
tEN
10
13
ns
ns
ns
tHSDO
tDSDO
1.5
7.5
10.5
20
ns
ns
ns
VIO > 1.7 V
CNV Rising Edge to SDO High Impedance
WRITE OPERATION
tDIS
SDI Valid Setup Time from SCK Rising Edge
SDI Valid Hold Time from SCK Rising Edge
CNV Rising Edge to SCK Edge Hold Time
CNV Falling Edge to SCK Active Edge Setup Time
tSSDISCK
tHSDISCK
tHCNVSCK
tSCNVSCK
2
2
0
6
ns
ns
ns
ns
1 For turbo mode, tCNVH must match the tQUIET1 minimum.
Table 4. Achievable Throughput for Different Modes of Operation
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
THROUGHPUT, CS MODE
3-Wire and 4-Wire Turbo Mode
fSCK = 100 MHz, VIO ≥ 2.7 V
fSCK = 80 MHz, VIO < 2.7 V
fSCK = 100 MHz, VIO ≥ 2.7 V
fSCK = 80 MHz, VIO < 2.7 V
fSCK = 100 MHz, VIO ≥ 2.7 V
fSCK = 80 MHz, VIO < 2.7 V
fSCK = 100 MHz, VIO ≥ 2.7 V
fSCK = 80 MHz, VIO < 2.7 V
2
2
2
1.86
1.82
1.69
1.64
1.5
MSPS
MSPS
MSPS
MSPS
MSPS
MSPS
MSPS
MSPS
3-Wire and 4-Wire Turbo Mode and Six Status Bits
3-Wire and 4-Wire Mode
3-Wire and 4-Wire Mode and Six Status Bits
Rev. B | Page 8 of 37
Data Sheet
AD4001/AD4005
ABSOLUTE MAXIMUM RATINGS
Note that the input overvoltage clamp cannot sustain the
overvoltage condition for an indefinite amount of time.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 5.
Parameter
Rating
Analog Inputs
IN+, IN− to GND1
Table 6. Thermal Resistance
−0.3 V to VREF + 0.4 V
or 50 mA
Package Type1
RM-10
θJA
θJC
38
33
Unit
°C/W
°C/W
2
3
147
114
Supply Voltage
REF, VIO to GND
VDD to GND
VDD to VIO
Digital Inputs to GND
Digital Outputs to GND
Storage Temperature Range
Junction Temperature
Lead Temperature Soldering
CP-10-9
−0.3 V to +6.0 V
−0.3 V to +2.1 V
−6 V to +2.4 V
−0.3 V to VIO + 0.3 V
−0.3 V to VIO + 0.3 V
−65°C to +150°C
150°C
1 Test Condition 1: thermal impedance simulated values are based upon use
of 2S2P JEDEC PCB. See the Ordering Guide.
2 θJA is the natural convection junction-to-ambient thermal resistance
measured in a one cubic foot sealed enclosure.
3 θJC is the junction-to-case thermal resistance.
ESD CAUTION
260°C reflow as per
JEDEC J-STD-020
ESD Ratings
Human Body Model
Machine Model
Field Induced Charged Device Model
4 kV
200 V
1.25 kV
1 See the Analog Inputs section for an explanation of IN+ and IN−.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. B | Page 9 of 37
AD4001/AD4005
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
REF 1
VDD 2
IN+ 3
10 VIO
AD4001/
AD4005
9
8
7
6
SDI
SCK
SDO
CNV
TOP VIEW
(Not to Scale)
IN– 4
1
2
3
4
5
10
9
REF
VDD
IN+
VIO
GND 5
SDI
AD4001/
AD4005
8
SCK
SDO
CNV
TOP VIEW
NOTES
IN–
7
(Not to Scale)
1. CONNECT THE EXPOSED PAD TO GND.
THIS CONNECTION IS NOT REQUIRED TO
MEET THE SPECIFIED PERFORMANCE.
GND
6
Figure 3. 10-Lead MSOP Pin Configuration
Figure 4. 10-Lead LFCSP Pin Configuration
Table 7. Pin Function Descriptions
Pin No. Mnemonic Type1
Description
1
REF
AI
Reference Input Voltage. The VREF range is 2.4 V to 5.1 V. This pin is referred to the GND pin and must be
decoupled closely to the GND pin with a 10 µF, X7R ceramic capacitor.
2
VDD
P
1.8 V Power Supply. The VDD range is 1.71 V to 1.89 V. Bypass VDD to GND with a 0.1 µF ceramic
capacitor.
3
4
5
6
IN+
IN−
GND
CNV
AI
AI
P
Differential Positive Analog Input. See the Differential Input Considerations section.
Differential Negative Analog Input. See the Differential Input Considerations section.
Power Supply Ground.
Convert Input. This input has multiple functions. On its leading edge, it initiates the conversions and
selects the interface mode of the device: daisy-chain mode or CS mode. In CS mode, the SDO pin is
enabled when CNV is low. In daisy-chain mode, the data is read when CNV is high.
DI
7
8
9
SDO
SCK
SDI
DO
DI
DI
Serial Data Output. The conversion result is output on this pin. It is synchronized to SCK.
Serial Data Clock Input. When the device is selected, the conversion result is shifted out by this clock.
Serial Data Input. This input provides multiple features. It selects the interface mode of the ADC as
follows:
Daisy-chain mode is selected if SDI is low during the CNV rising edge. In this mode, SDI is used as a data
input to daisy-chain the conversion results of two or more ADCs onto a single SDO line. The digital data
level on SDI is output on SDO with a delay of 16 SCK cycles.
CS mode is selected if SDI is high during the CNV rising edge. In this mode, either SDI or CNV can enable
the serial output signals when low. If SDI or CNV is low when the conversion is complete, the busy
indicator feature is enabled. With CNV low, the device can be programmed by clocking in a 16-bit word
on SDI on the rising edge of SCK.
10
VIO
P
P
Input/Output Interface Digital Power. Nominally, this pin is at the same supply as the host interface
(1.8 V, 2.5 V, 3 V, or 5 V). Bypass VIO to GND with a 0.1 μF ceramic capacitor.
Exposed Pad (LFCSP Only). Connect the exposed pad to GND. This connection is not required to meet
the specified performance.
N/A2
EPAD
1 AI is analog input, P is power, DI is digital input, and DO is digital output.
2 N/A means not applicable.
Rev. B | Page 10 of 37
Data Sheet
AD4001/AD4005
TYPICAL PERFORMANCE CHARACTERISTICS
VDD = 1.8 V, VIO = 3.3 V, VREF = 5 V, T = 25°C, high-Z mode disabled, span compression disabled, turbo mode enabled, and sampling
frequency (fS) = 2 MSPS for the AD4001 and fS = 1 MSPS for the AD4005, unless otherwise noted.
0.4
0.4
–40°C
+25°C
+125°C
–40°C
+25°C
+125°C
0.3
0.3
0.2
0.2
0.1
0.1
0
0
–0.1
–0.2
–0.3
–0.4
–0.1
–0.2
–0.3
–0.4
0
8192 16384 24576 32768 40960 49152 57344 65536
CODE
0
8192 16384 24576 32768 40960 49152 57344 65536
CODE
Figure 5. INL vs. Code for Various Temperatures, VREF = 5 V
Figure 8. DNL vs. Code for Various Temperatures, VREF = 5 V
0.4
0.3
0.4
0.3
–40°C
+25°C
+125°C
–40°C
+25°C
+125°C
0.2
0.2
0.1
0.1
0
0
–0.1
–0.2
–0.3
–0.4
–0.1
–0.2
–0.3
–0.4
0
8192 16384 24576 32768 40960 49152 57344 65536
CODE
0
8192 16384 24576 32768 40960 49152 57344 65536
CODE
Figure 6. INL vs. Code for Various Temperatures, VREF = 2.5 V
Figure 9. DNL vs. Code for Various Temperatures, VREF = 2.5 V
0.4
0.3
0.4
HIGH-Z ENABLED
SPAN COMPRESSION ENABLED
HIGH-Z ENABLED
SPAN COMPRESSION ENABLED
0.3
0.2
0.2
0.1
0.1
0
0
–0.1
–0.2
–0.3
–0.4
–0.1
–0.2
–0.3
–0.4
0
8192 16384 24576 32768 40960 49152 57344 65536
CODE
0
8192 16384 24576 32768 40960 49152 57344 65536
CODE
Figure 10. DNL vs. Code, High-Z and Span Compression Modes Enabled,
REF = 5 V
Figure 7. INL vs. Code, High-Z and Span Compression Modes Enabled, VREF = 5 V
V
Rev. B | Page 11 of 37
AD4001/AD4005
Data Sheet
1200000
600000
500000
400000
300000
200000
100000
0
V
V
= 5V
V
V
= 5V
REF
REF
REF
REF
= 2.5V
= 2.5V
1000000
800000
600000
400000
200000
0
32766
32767
32768
CODE
32769
32770
32766
32767
32768
CODE
32769
32770
Figure 11. Histogram of a DC Input at Code Center, VREF = 2.5 V
and VREF = 5 V
Figure 14. Histogram of a DC Input at Code Transition, VREF = 2.5 V
and VREF = 5 V
0
0
V
= 5V
V
= 2.5V
REF
REF
SNR = 96.25dB
THD = –124.30dB
SINAD = 96.23dB
SNR = 93.12dB
THD = –118.26dB
SINAD = 93.11dB
–20
–40
–20
–40
–60
–60
–80
–80
–100
–120
–140
–160
–180
–100
–120
–140
–160
–180
100
1k
10k
100k
1M
100
1k
10k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 12. 1 kHz, −0.5 dBFS Input Tone FFT, Wide View, VREF = 5 V
Figure 15. 1 kHz, −0.5 dBFS Input Tone FFT, Wide View, VREF = 2.5 V
0
0
V
= 5V
V
= 5V
REF
REF
SNR = 91.04dB
THD = –91.47dB
SINAD = 88.85dB
SNR = 95.48dB
THD = –98.63dB
SINAD = 93.84dB
–20
–40
–20
–40
–60
–60
–80
–80
–100
–120
–140
–160
–180
–100
–120
–140
–160
–180
1k
10k
100k
1M
1k
10k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 13. 100 kHz, −0.5 dBFS Input Tone FFT, Wide View
Figure 16. 400 kHz, −0.5 dBFS Input Tone FFT, Wide View
Rev. B | Page 12 of 37
Data Sheet
AD4001/AD4005
15.8
15.7
15.6
15.5
15.4
15.3
15.2
15.1
–116
–118
–120
–122
–124
–126
–128
–130
–132
129
128
127
126
125
124
123
122
121
120
96.5
ENOB
SFDR
THD
SNR
SINAD
96.0
95.5
95.0
94.5
94.0
93.5
93.0
92.5
2.4
2.7
3.0
3.3
3.6
3.9
4.2
4.5
4.8
5.1
2.4
2.7
3.0
3.3
3.6
3.9
4.2
4.5
4.8
5.1
REFERENCE VOLTAGE (V)
REFERENCE VOLTAGE (V)
Figure 17. SNR, SINAD, and ENOB vs. Reference Voltage, fIN = 1 kHz
Figure 20. THD and SFDR vs. Reference Voltage, fIN = 1 kHz
96.5
15.73
15.72
15.71
15.70
15.69
15.68
15.67
15.66
15.65
15.64
15.63
–118
127.1
THD
SFDR
–119
–120
–121
–122
–123
–124
–125
–126
–127
–128
–129
127.0
126.9
126.8
126.7
126.6
126.5
126.4
126.3
96.4
96.3
96.2
96.1
96.0
95.9
SNR
SINAD
ENOB
–40
–20
0
20
40
60
80
100
120
–40
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 18. SNR, SINAD, and ENOB vs. Temperature, fIN = 1 kHz
Figure 21. THD and SFDR vs. Temperature, fIN = 1 kHz
130
97
96
95
94
93
92
91
90
89
DYNAMIC RANGE
FREQUENCY = 1kHz
FREQUENCY = 10kHz
125
120
115
110
105
100
95
VIO = 1.89V
VIO = 3.6V
VIO = 5.5V
1
2
4
8
16
32
64
128 256 512 1024
0
20
40
60
80
100
DECIMATION RATE
tQUIET2 (ns)
Figure 19. SNR vs. Decimation Rate for Various Input Frequencies, 2 MSPS
Figure 22. SINAD vs. tQUIET2
Rev. B | Page 13 of 37
AD4001/AD4005
Data Sheet
1.0
0.8
60
59
58
57
56
55
54
ZERO ERROR
PFS ERROR
NFS ERROR
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1.0
–40
–20
0
20
40
60
80
100
120
0
1
2
3
4
5
6
7
8
9
10
TEMPERATURE (°C)
TIME (Seconds)
Figure 23. 1/f Noise for 0.1 Hz to 10 Hz Bandwidth, 50 kSPS, 2500 Samples
Averaged per Reading
Figure 25. Zero Error and Gain Error vs. Temperature, Positive Full Scale (PFS)
and Negative Full Scale (NFS)
8
7
6
4.5
4.0
3.5
3.0
5
2.5
VDD HIGH-Z DISABLED
VDD HIGH-Z ENABLED
REF HIGH-Z DISABLED
REF HIGH-Z ENABLED
VIO HIGH-Z DISABLED
VIO HIGH-Z ENABLED
4
3
2
1
0
VDD HIGH-Z ENABLED
2.0
1.5
1.0
0.5
0
VDD HIGH-Z DISABLED
REF HIGH-Z ENABLED
REF HIGH-Z DISABLED
VIO HIGH-Z ENABLED
VIO HIGH-Z DISABLED
–40
–20
0
20
40
60
80
100
120
–40
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 24. Operating Current vs. Temperature, AD4001, 2 MSPS
Figure 26. Operating Current vs. Temperature, AD4005, 1 MSPS
Rev. B | Page 14 of 37
Data Sheet
AD4001/AD4005
1.1
25.0
22.5
20.0
17.5
15.0
12.5
10.0
7.5
2MSPS
1MSPS
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
5.0
2.5
0
–40
2.4
2.7
3.0
3.3
3.6
3.9
4.2
4.5
4.8
5.1
–20
0
20
40
60
80
100
120
REFERENCE VOLTAGE (V)
TEMPERATURE (°C)
Figure 29. Standby Current vs. Temperature
Figure 27. Reference Current vs. Reference Voltage
23
21
19
17
15
13
11
9
VIO = 5V
VIO = 3.3V
VIO = 1.8V
7
5
0
20
40
60
80 100 120 140 160 180 200 220
LOAD CAPACITANCE (pF)
Figure 28. tDSDO vs. Load Capacitance
Rev. B | Page 15 of 37
AD4001/AD4005
Data Sheet
TERMINOLOGY
Integral Nonlinearity Error (INL)
Dynamic Range
INL is the deviation of each individual code from a line drawn
from negative full scale through positive full scale. The point
used as negative full scale occurs ½ LSB before the first code
transition. Positive full scale is defined as a level 1½ LSB beyond
the last code transition. The deviation is measured from the
middle of each code to the true straight line (see Figure 31).
Dynamic range is the ratio of the rms value of the full scale to
the total rms noise measured. The value for dynamic range is
expressed in decibels. It is measured with a signal at −60 dBFS
so that it includes all noise sources and DNL artifacts.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the actual input signal to the
rms sum of all other spectral components below the Nyquist
frequency, excluding harmonics and dc. The value for SNR is
expressed in decibels.
Differential Nonlinearity Error (DNL)
In an ideal ADC, code transitions are 1 LSB apart. DNL is the
maximum deviation from this ideal value. It is often specified in
terms of resolution for which no missing codes are guaranteed.
Signal-to-Noise-and-Distortion Ratio (SINAD)
Zero Error
SINAD is the ratio of the rms value of the actual input signal to
the rms sum of all other spectral components that are less than
the Nyquist frequency, including harmonics but excluding dc.
The value of SINAD is expressed in decibels.
Zero error is the difference between the ideal midscale voltage,
that is, 0 V, from the actual voltage producing the midscale
output code, that is, 0 LSB.
Gain Error
Aperture Delay
The first transition (from 100 ... 00 to 100 ... 01) occurs at a level
½ LSB above nominal negative full scale (−4.999981 V for the
5 V range). The last transition (from 011 … 10 to 011 … 11)
occurs for an analog voltage 1½ LSB below the nominal full
scale (+4.999943 V for the 5 V range). The gain error is the
deviation of the difference between the actual level of the last
transition and the actual level of the first transition from the
difference between the ideal levels.
Aperture delay is the measure of the acquisition performance
and is the time between the rising edge of the CNV input and
when the input signal is held for a conversion.
Transient Response
Transient response is the time required for the ADC to acquire a
full-scale input step to 1 LSB accuracy.
Common-Mode Rejection Ratio (CMRR)
CMRR is the ratio of the power in the ADC output at the
frequency, f, to the power of a 200 mV p-p sine wave applied to
the common-mode voltage of IN+ and IN− of frequency, f.
Spurious-Free Dynamic Range (SFDR)
SFDR is the difference, in decibels (dB), between the rms
amplitude of the input signal and the peak spurious signal.
CMRR (dB) = 10log(PADC_IN/PADC_OUT
where:
ADC_IN is the common-mode power at the frequency, f, applied
to the IN+ and IN− inputs.
ADC_OUT is the power at the frequency, f, in the ADC output.
)
Effective Number of Bits (ENOB)
ENOB is a measurement of the resolution with a sine wave
input. It is related to SINAD as follows:
P
ENOB = (SINADdB − 1.76)/6.02
P
ENOB is expressed in bits.
Power Supply Rejection Ratio (PSRR)
Total Harmonic Distortion (THD)
PSRR is the ratio of the power in the ADC output at the
frequency, f, to the power of a 200 mV p-p sine wave applied to
the ADC VDD supply of frequency, f.
THD is the ratio of the rms sum of the first five harmonic
components to the rms value of a full-scale input signal and is
expressed in decibels.
PSRR (dB) = 10 log(PVDD_IN/PADC_OUT
)
where:
P
P
VDD_IN is the power at the frequency, f, at the VDD pin.
ADC_OUT is the power at the frequency, f, in the ADC output.
Rev. B | Page 16 of 37
Data Sheet
AD4001/AD4005
THEORY OF OPERATION
IN+
SWITCHES CONTROL
CONTROL
SW+
SW–
MSB
LSB
LSB
32,768C 16,384C
4C
4C
2C
2C
C
C
C
C
BUSY
REF
COMP
LOGIC
GND
32,768C 16,384C
MSB
OUTPUT CODE
CNV
IN–
Figure 30. ADC Simplified Schematic
For single-supply applications, a span compression feature
creates additional headroom and footroom for the driving
amplifier to access the full range of the ADC.
CIRCUIT INFORMATION
The AD4001/AD4005 are high speed, low power, single-supply,
precise, 16-bit ADCs based on a SAR architecture.
The fast conversion time of the AD4001/AD4005, along with turbo
mode, allows low clock rates to read back conversions even when
running at their maximum throughput rates of 2 MSPS/1 MSPS.
Note that, for the AD4001, a throughput rate of 2 MSPS can be
achieved only with turbo mode enabled.
The AD4001 is capable of converting 2,000,000 samples per
second (2 MSPS), the AD4005 is capable of converting 1,000,000
samples per second (1 MSPS). The power consumption of the
AD4001/AD4005 scales with throughput because they power
down in between conversions. When operating at 10 kSPS, for
example, they typically consume 80 µW, making them ideal for
battery-powered applications. The AD4001/AD4005 also have a
valid first conversion after being powered down for long periods,
which can further reduce power consumed in applications in
which the ADC does not need to be constantly converting.
The AD4001/AD4005 can interface with any 1.8 V to 5 V digital
logic family. They are available in a 10-lead MSOP or a tiny
10-lead LFCSP that allows space savings and flexible
configurations.
The AD4001/AD4005 are pin for pin compatible with some of
the 14-/16-/18-/20-bit precision SAR ADCs listed in Table 8.
The AD4001/AD4005 provide the user with an on-chip track-
and-hold and do not exhibit any pipeline delay or latency,
making them ideal for multiplexed applications.
Table 8. MSOP and LFCSP 14-/16-/18-/20-Bit Precision SAR
ADCs
The AD4001/AD4005 incorporate a multitude of unique ease of
use features that result in a lower system power and footprint.
400 kSPS to
250 kSPS 500 kSPS
Bits 100 kSPS
201
≥1000 kSPS
AD40202
The AD4001/AD4005 each have an internal voltage clamp that
protects the device from overvoltage damage on the analog inputs.
181
AD7989-12
AD76912
AD76902,
AD7989-52,
AD40112
AD40032,
AD40072,
AD79822,
AD79842
The analog input incorporates circuitry that reduces the nonlinear
charge kickback seen from a typical switched capacitor SAR input.
This reduction in kickback, combined with a longer acquisition
phase, means reduced settling requirements on the driving
amplifier. This combination allows the use of lower bandwidth
and lower power amplifiers as drivers. It has the additional benefit
of allowing a larger resistor value in the input RC filter and a
corresponding smaller capacitor, which results in a smaller RC
load for the amplifier, improving stability and power dissipation.
161
163
AD7684
AD76872
AD76882,
AD76932,
AD79162
AD4001,
AD4005,
AD79152
AD40002,
AD40042,
AD7980,2
AD79832
AD7680,
AD7683,
AD7988-12
AD76852,
AD7694
AD76862,
AD7988-52
143
AD7940
AD79422
AD79462
Not applicable
High-Z mode can be enabled via the SPI interface by programming
a register bit (see Table 14). When high-Z mode is enabled, the
ADC input has a low input charging current at low input signal
frequencies, as well as improved distortion over a wide frequency
range up to 100 kHz. For frequencies greater than 100 kHz and
multiplexing, disable high-Z mode.
1 True differential.
2 Pin for pin compatible.
3 Pseudo differential.
Rev. B | Page 17 of 37
AD4001/AD4005
Data Sheet
the completion of this process, the control logic generates the
ADC output code and a busy signal indicator.
CONVERTER OPERATION
The AD4001/AD4005 are SAR-based ADCs using a charge
redistribution sampling digital-to-analog converter (DAC).
Figure 30 shows the simplified schematic of the ADC. The
capacitive DAC consists of two identical arrays of 16 binary
weighted capacitors, which are connected to the comparator inputs.
Because the AD4001 and the AD4005 have on-board conversion
clocks, the serial clock, SCK, is not required for the conversion
process.
TRANSFER FUNCTIONS
During the acquisition phase, terminals of the array tied to the
input of the comparator are connected to GND via the SW+ and
SW− switches. All independent switches connect the other
terminal of each capacitor to the analog inputs. Therefore, the
capacitor arrays are used as sampling capacitors and acquire the
analog signal on the IN+ and IN− inputs.
The ideal transfer characteristics for the AD4001/AD4005 are
shown in Figure 31 and Table 9.
011...111
011...110
011...101
When the acquisition phase is complete and the CNV input
goes high, a conversion phase initiates. When the conversion
phase begins, SW+ and SW− are opened first. The two capacitor
arrays are then disconnected from the inputs and connected to
the GND input. The differential voltage between the IN+ and
IN− inputs captured at the end of the acquisition phase is
applied to the comparator inputs, causing the comparator to
become unbalanced. By switching each element of the capacitor
array between GND and VREF, the comparator input varies by
binary weighted voltage steps (VREF/2, VREF/4, …, VREF/65,536).
The control logic toggles these switches, starting with the MSB,
to bring the comparator back into a balanced condition. After
100...010
100...001
100...000
–FSR
–FSR + 1 LSB
+FSR – 1 LSB
+FSR – 1.5 LSB
ANALOG INPUT
–FSR + 0.5 LSB
Figure 31. ADC Ideal Transfer Function (FSR Is Full-Scale Range)
Table 9. Output Codes and Ideal Input Voltages
Description
+FSR − 1 LSB
Midscale + 1 LSB
Midscale
Midscale − 1 LSB
−FSR + 1 LSB
−FSR
Analog Input, VREF = 5 V
+4.999847 V
+152.6 µV
0 V
−152.6 µV
−4.999847 V
−5 V
VREF = 5 V with Span Compression Enabled
Digital Output Code (Hex)
+3.999878 V
+122.1 µV
0 V
−122.1 µV
−3.999878 V
−4 V
0x7FFF1
0x0001
0x0000
0xFFFF
0x8001
0x80002
1 This output code is also the code for an overranged analog input (VIN+ − VIN− above VREF with span compression disabled and above 0.8 × VREF with span compression
enabled).
2 This output code is also the code for an underranged analog input (VIN+ − VIN− below −VREF with span compression disabled and below −0.8 × VREF with span
compression enabled).
Rev. B | Page 18 of 37
Data Sheet
AD4001/AD4005
APPLICATIONS INFORMATION
Figure 33 shows a recommended connection diagram when
using a single-supply system. This setup is preferable when only
a limited number of rails are available in the system and power
dissipation is of critical importance.
TYPICAL APPLICATION DIAGRAMS
Figure 32 shows an example of the recommended connection
diagram for the AD4001/AD4005 when multiple supplies are
available. This configuration is used for best performance
because the amplifier supplies can be selected to allow the
maximum signal range.
Figure 34 shows a recommended connection diagram when
using a fully differential amplifier.
V+ ≥ +6.5V
REF
LDO
1.8V
AMP
V
= V
/2
CM
REF
5V
0.1µF
10kΩ
10µF
0.1µF 1.8V TO 5V
HOST
SUPPLY
10kΩ
V+
R
AMP
V
REF
V
= V
/2
REF
VDD
VIO
SDI
CM
REF
C
0V
IN+
IN–
V–
V+
SCK
DIGITAL HOST
(MICROPROCESSOR/
FPGA)
AD4001/AD4005
SDO
CNV
R
GND
AMP
V
REF
V
= V
/2
3-WIRE/4-WIRE
INTERFACE
CM
REF
C
0V
V–
V– ≤ –0.5V
Figure 32. Typical Application Diagram with Multiple Supplies
V+ = +5V
1
REF
LDO
AMP
V
= V
/2
CM
REF
4.096V
1
1.8V
0.1µF 1.8V TO 5V
10kΩ
0.1µF
HOST
SUPPLY
10µF
10kΩ
100nF
100nF
R
AMP
0.9 × V
/2
REF
V
= V
REF
CM
REF
VDD VIO
C
0.1 × V
REF
SDI
IN+
IN–
SCK
DIGITAL HOST
(MICROPROCESSOR/
FPGA)
AD4001/AD40052
SDO
CNV
R
GND
AMP
0.9 × V
/2
REF
3-WIRE/4-WIRE
INTERFACE
V
= V
REF
CM
C
0.1 × V
REF
3
1
SEE THE VOLTAGE REFERENCE INPUT SECTION FOR REFERENCE SELECTION. C
SPAN COMPRESSION MODE ENABLED.
SEE TABLE 10 FOR RC FILTER AND AMPLIFIER SELECTION.
IS USUALLY A 10µF CERAMIC CAPACITOR (X7R).
REF
2
3
Figure 33. Typical Application Diagram with a Single Supply
Rev. B | Page 19 of 37
AD4001/AD4005
Data Sheet
V+ = +5V
REF
LDO
AMP
4.096V
V
= V
/2
CM
REF
1.8V
R4
1kΩ
R3
1kΩ
V
1.8V TO 5V
0.1µF
0.1µF
HOST
SUPPLY
REF
10kΩ
10µF
V
= V
/2
CM
REF
10kΩ
0
V+
+IN
–IN
REF
VDD
VIO
R
–OUT
SDI
IN+
C
C
SCK
DIGITAL HOST
(MICROPROCESSOR/
FPGA)
V
= V
/2
CM
REF
AD4001/AD4005
V
OCM
SDO
CNV
+OUT
0.1µF
IN–
R
DIFFERENTIAL
AMPLIFIER
GND
3-WIRE/4-WIRE
INTERFACE
V–
R1
1kΩ
V
REF
V
= V
/2
CM
REF
0
R2
1kΩ
Figure 34. Typical Application Diagram with a Fully Differential Amplifier
V+ = +5V
REF
LDO
AMP
V
= V /2
REF
CM
4.096V
1.8V
R4
1kΩ
R3
1kΩ
1.8V TO 5V
+V
0.1µF 0.1µF
REF
HOST
SUPPLY
10kΩ
10µF
0V
–V
10kΩ
REF
V+
+IN
REF
VDD
VIO
R
R
–OUT
SDI
IN+
C
C
V
/2
SCK
REF
DIGITAL HOST
(MICROPROCESSOR/
FPGA)
V
AD4001/AD4005
OCM
SDO
CNV
+OUT
0.1µF
IN–
DIFFERENTIAL
AMPLIFIER
GND
–IN
3-WIRE/4-WIRE
INTERFACE
V–
R1
1kΩ
R2
1kΩ
Figure 35. Typical Application Diagram for Single-Ended to Differential Conversion with a Fully Differential Amplifier
Input Overvoltage Clamp Circuit
ANALOG INPUTS
Most ADC analog inputs, IN+ and IN−, have no overvoltage
protection circuitry apart from ESD protection diodes. During
an overvoltage event, an ESD protection diode from an analog
input (IN+ or IN−) pin to REF forward biases and shorts the
input pin to REF, potentially overloading the reference or causing
damage to the device. The AD4001/AD4005 internal overvoltage
clamp circuit with a larger external resistor (REXT = 200 Ω)
eliminates the need for external protection diodes and protects
the ADC inputs against dc overvoltages.
Figure 36 shows an equivalent circuit of the analog input
structure, including the overvoltage clamp of the
AD4001/AD4005.
REF
D1
C
IN
R
R
IN
IN+/IN–
EXT
0V TO 15V
C
C
D2
V
CLAMP
EXT
PIN
IN
In applications where the amplifier rails are greater than VREF
and less than ground, it is possible for the output to exceed the
input voltage range of the device. In this case, the AD4001/AD4005
internal voltage clamp circuit ensures that the voltage on the
input pin does not exceed VREF + 0.4 V and prevents damage to
GND
Figure 36. Equivalent Analog Input Circuit
Rev. B | Page 20 of 37
Data Sheet
AD4001/AD4005
72
71
70
69
68
67
66
the device by clamping the input voltage in a safe operating
range and avoiding disturbance of the reference, which is
particularly important for systems that share the reference
among multiple ADCs.
If the analog input exceeds the reference voltage by 0.4 V, t h e
internal clamp circuit turns on and the current flows through
the clamp into ground, preventing the input from rising further
and potentially causing damage to the device. The clamp turns
on before D1 (see Figure 36) and can sink up to 50 mA of current.
OV
When the clamp is active, it sets the
clamp flag bit in the
register that can be read back (see Table 14), which is a sticky bit
that must be read to be cleared. The status of the clamp can also
be checked in the status bits using an overvoltage clamp flag
(see Table 15). The clamp circuit does not dissipate static power
in the off state. Note that the clamp cannot sustain the overvoltage
condition for an indefinite amount of time.
100
1k
10k
100k
1M
FREQUENCY (Hz)
Figure 37. CMRR vs. Frequency, VDD = 1.8 V, VIO = 3.3 V, VREF = 5 V, 25°C
Switched Capacitor Input
During the acquisition phase, the impedance of the analog
inputs (IN+ or IN−) can be modeled as a parallel combination
of Capacitor CPIN and the network formed by the series connection
of RIN and CIN. CPIN is primarily the pin capacitance. RIN is typically
400 Ω and is a lumped component composed of serial resistors
and the on resistance of the switches. CIN is typically 40 pF and
is mainly the ADC sampling capacitor.
The external RC filter is usually present at the ADC input to
band limit the input signal. During an overvoltage event, excessive
voltage is dropped across REXT, and REXT becomes part of a
protection circuit. The REXT value can vary from 200 Ω to 20 kΩ
for 15 V protection. The CEXT value can be as low as 100 pF for
correct operation of the clamp. See Table 1 for input overvoltage
clamp specifications.
During the conversion phase, where the switches are open, the
input impedance is limited to CPIN. RIN and CIN make a single-
pole, low-pass filter that reduces undesirable aliasing effects and
limits noise.
Differential Input Considerations
The analog input structure allows the sampling of the true
differential signal between IN+ and IN−. By using these differential
inputs, signals common to both inputs are rejected. Figure 37
shows the common-mode rejection capability of the AD4001/
AD4005 over frequency. It is important to note that the differential
input signals must be truly antiphase in nature, 180° out of phase,
which is required to keep the common-mode voltage of the input
signal within the specified range around VREF/2 as shown in Table 1.
RC Filter Values
The RC filter value (represented by R and C in Figure 32 to
Figure 35) and driving amplifier can be selected depending on
the input signal bandwidth of interest at the full throughput.
Lower input signal bandwidth means that the RC cutoff can be
lower, thereby reducing noise into the converter. For optimum
performance at various throughputs, use the recommended RC
values (200 Ω, 180 pF) and the ADA4807-1.
The RC values shown in Table 10 are chosen for ease of
drive considerations and greater ADC input protection. The
combination of a large R value (200 Ω) and small C value
results in a reduced dynamic load for the amplifier to drive. The
smaller value of C means fewer stability and phase margin
concerns with the amplifier. The large value of R limits the current
into the ADC input when the amplifier output exceeds the ADC
input range.
Table 10. RC Filter and Amplifier Selection for Various Input Bandwidths
Input Signal Bandwidth (kHz)
R (Ω) C (pF)
Recommended Amplifier
See the High-Z Mode section
ADA4807-1
ADA4897-1
ADA4897-1
Recommended Fully Differential Amplifier
<10
<200
>200
Multiplexed
ADA4940-1
ADA4940-1
ADA4932-1
ADA4932-1
200
200
200
180
120
120
Rev. B | Page 21 of 37
AD4001/AD4005
Data Sheet
97
96
95
94
93
92
91
90
89
88
15.8
15.6
15.4
15.2
15.0
14.8
14.6
14.4
14.2
DRIVER AMPLIFIER CHOICE
Although the AD4001/AD4005 are easy to drive, the driver
amplifier must meet the following requirements:
•
The noise generated by the driver amplifier must be kept
low enough to preserve the SNR and transition noise
performance of the AD4001/AD4005. The noise from the
driver is filtered by the single-pole, low-pass filter of the
AD4001/AD4005 analog input circuit made by RIN and CIN,
or by the external filter, if one is used. Because the typical
noise of the AD4001/AD4005 is 54 µV rms, the SNR
degradation due to the amplifier is
SNR
SINAD
ENOB
14.0
1M
1k
10k
100k
INPUT FREQUENCY (Hz)
54µV
Figure 38. SNR, SINAD, and ENOB vs. Input Frequency, VDD = 1.8 V,
VIO = 3.3 V, VREF = 5 V, 25°C
SNRLOSS = 20 log
π
54µV2 + f−3dB (NeN )2
–90
125
120
115
110
105
100
95
2
–95
where:
f
−3 dB is the input bandwidth, in megahertz, of the AD4001/
AD4005 (10 MHz) or the cutoff frequency of the input
filter, if one is used.
THD
SFDR
–100
–105
–110
–115
–120
–125
N is the noise gain of the amplifier (for example, 1 in buffer
configuration).
eN is the equivalent input noise voltage of the op amp in
nV/√Hz.
•
•
For ac applications, the driver must have a THD
performance commensurate with the AD4001/AD4005.
For multichannel multiplexed applications, the driver
amplifier and the analog input circuit of the AD4001/AD4005
must settle for a full-scale step onto the capacitor array at a
16-bit level (0.0001525%, 15.25 ppm). In the data sheet of
the amplifier, settling at 0.1% to 0.01% is more commonly
specified. This settling may differ significantly from the
settling time at a 16-bit level and must be verified prior to
driver selection.
90
1M
1k
10k
100k
INPUT FREQUENCY (Hz)
Figure 39. THD and SFDR vs. Input Frequency, VDD = 1.8 V, VIO = 3.3 V,
VREF = 5 V, 25°C
Multiplexed Applications
The AD4001/AD4005 significantly reduce system complexity
and cost for multiplexed applications that require superior
performance in terms of noise, power, and throughput. Figure 40
shows a simplified block diagram of a multiplexed data
acquisition system including a multiplexer, an ADC driver, and
the precision SAR ADC.
Single to Differential Driver
For applications using a single-ended analog signal, either bipolar
or unipolar, the ADA4940-1 single-ended to differential driver
allows a differential input to the device. The schematic is shown
in Figure 35.
MULTIPLEXER
R
ADC
DRIVER
SAR ADC
C
High Frequency Input Signals
R
The AD4001/AD4005 ac performance over a wide input frequency
range (using a 5 V reference voltage) is shown in Figure 38 and
Figure 39. Unlike other traditional SAR ADCs, the AD4001/
AD4005 maintain exceptional ac performance for input
frequencies up to the Nyquist frequency with minimal
performance degradation. Note that the input frequency is
limited to the Nyquist frequency of the sample rate in use.
C
C
R
C
Figure 40. Multiplexed Data Acquisition Signal Chain Using the
AD4001/AD4005
Switching multiplexer channels typically results in large voltage
steps at the ADC inputs. To ensure an accurate conversion result,
the step must be given adequate time to settle before the ADC
samples its inputs (on the rising edge of CNV). The settling
time error is dependent on the drive circuitry (multiplexer and
ADC driver), RC filter values, and the time when the multiplexer
Rev. B | Page 22 of 37
Data Sheet
AD4001/AD4005
15
12
9
channels are switched. Switch the multiplexer channels
immediately after tQUIET1 has elapsed from the start of the
conversion to maximize settling time while preventing
corruption of the conversion result. To avoid conversion
corruption, do not switch the channels during the tQUIET1 time. If
the analog inputs are multiplexed during the quiet conversion
time (tQUIET1), the current conversion may be corrupted.
HIGH-Z DISABLED, 2MSPS
HIGH-Z DISABLED, 1MSPS
HIGH-Z ENABLED, 2MSPS
HIGH-Z ENABLED, 1MSPS
6
3
0
–3
–6
–9
–12
–15
EASE OF DRIVE FEATURES
Input Span Compression
In single-supply applications, it is desirable to use the full range
of the ADC; however, the amplifier can have some headroom
and footroom requirements, which can be a problem, even if it
is a rail-to-rail input and output amplifier. The AD4001/
AD4005 include a span compression increases the headroom
and footroom available to the amplifier by reducing the input
range by 10% from the top and bottom of the range while still
accessing all available ADC codes (see Figure 41). The SNR
decreases by approximately 1.9 dB (20 × log(8/10)) for the reduced
input range when span compression is enabled. Span compression
is disabled by default but can be enabled by writing to the relevant
register bit (see the Digital Interface section).
–5
–4
–3
–2
–1
0
1
2
3
4
5
INPUT DIFFERENTIAL VOLTAGE (V)
Figure 42. Input Current vs. Input Differential Voltage, VDD = 1.8 V,
VIO = 3.3 V, VREF = 5 V, 25°C
To achieve the optimum data sheet performance from high
resolution precision SAR ADCs, system designers are often
forced to use a dedicated high power, high speed amplifier to
drive the traditional switched capacitor SAR ADC inputs for
their precision applications, which is commonly encountered in
designing a precision data acquisition signal chain. The benefits
of high-Z mode are low input current for slow (<10 kHz) or dc
type signals and improved distortion (THD) performance over
a frequency range of up to 100 kHz. High-Z mode allows a
choice of lower power and lower bandwidth precision amplifiers
with a lower RC filter cutoff to drive the ADC, removing the need
for dedicated high speed ADC drivers, which saves system power,
size, and cost in precision, low bandwidth applications. High-Z
mode allows the amplifier and RC filter in front of the ADC to
be chosen based on the signal bandwidth of interest and not
based on the settling requirements of the switched capacitor SAR
ADC inputs.
90% OF V
= 3.69V
REF
DIGITAL OUTPUT
+FSR
V
= 4.096V
ADC
5V
REF
10% OF V
= 0.41V
REF
N
ALL 2
CODES
IN+/IN–
ANALOG
INPUT
–FSR
Figure 41. Span Compression
High-Z Mode
The AD4001/AD4005 incorporate high-Z mode, which reduces
the nonlinear charge kickback when the capacitor DAC switches
back to the input at the start of acquisition. Figure 42 shows the
input current of the AD4001/AD4005 with high-Z mode enabled
and disabled. The low input current makes the ADC easier to
drive than the traditional SAR ADCs available in the market,
even with high-Z mode disabled. The input current reduces
further to submicroampere range when high-Z mode is enabled.
The high-Z mode is disabled by default but can be enabled by
writing to the register (see Table 14). Disable high-Z mode for
input frequencies above 100 kHz or when multiplexing.
Additionally, the AD4001/AD4005 can be driven with a much
higher source impedance than traditional SARs, which means the
resistor in the RC filter can have a value 10 times larger than
previous SAR designs and, with high-Z mode enabled, can
tolerate even larger impedance. Figure 43 shows the THD
performance for various source impedances with high-Z mode
disabled and enabled.
Rev. B | Page 23 of 37
AD4001/AD4005
Data Sheet
–80
–80
–85
–85
–90
–90
–95
–95
–100
–105
–100
–105
–110
–115
–120
–125
150Ω HIGH-Z DISABLED
150Ω HIGH-Z ENABLED
510Ω HIGH-Z DISABLED
510Ω HIGH-Z ENABLED
1kΩ HIGH-Z DISABLED
1kΩ HIGH-Z ENABLED
–110
–115
–120
–125
ADA4077-1 HIGH-Z DISABLED
ADA4077-1 HIGH-Z ENABLED
ADA4610-1 HIGH-Z DISABLED
ADA4610-1 HIGH-Z ENABLED
1
10
INPUT FREQUENCY (kHz)
20
260kHz
1.3kΩ
470pF
498kHz
680Ω
470pF
1.3MHz
680Ω
180pF
2.27MHz
390Ω
180pF
4.42MHz
200Ω
180pF
Figure 43. THD vs. Input Frequency for Various Source Impedances,
VDD = 1.8 V, VIO = 3.3 V, VREF = 5 V, 25°C
RC FILTER BANDWIDTHS (Hz), RESISTOR (Ω), CAPACITOR (pF)
Figure 45. THD vs. RC Filter Bandwidths for Various Precision ADC Drivers,
fIN = 1 kHz (Turbo Mode On, High-Z Enabled/Disabled), VDD = 1.8 V,
VIO = 3.3 V, VREF = 5 V, 25°C
Figure 44 and Figure 45 show the AD4001/AD4005 SNR and
THD performance using the ADA4077-1 (supply current per
amplifier (ISY) = 400 µA) and ADA4610-1 (ISY = 1.50 mA)
precision amplifiers when driving the AD4001/AD4005 at full
throughput for high-Z mode enabled and disabled with various
RC filter values. These amplifiers achieve 93 dB to 96 dB typical
SNR and better than −110 dB THD with high-Z mode enabled.
THD is approximately 10 dB better with high-Z mode enabled,
even for large R values. SNR maintains close to 96 dB, even with a
very low RC bandwidth cutoff.
Long Acquisition Phase
The AD4001/AD4005 also feature a very fast conversion time of
290 ns, which results in a long acquisition phase. The acquisition is
further extended by a key feature of the AD4001/AD4005: the
ADC returns to the acquisition phase typically 100 ns before the
end of the conversion. This feature provides an even longer time
for the ADC to acquire the new input voltage. A longer acquisition
phase reduces the settling requirement on the driving amplifier,
and a lower power/bandwidth amplifier can be chosen. The longer
acquisition phase means that a lower RC filter (represented by R
and C in Figure 32 to Figure 35) cutoff can be used, which means
a noisier amplifier can also be tolerated. A larger value of R can
be used in the RC filter with a corresponding smaller value of C,
reducing amplifier stability concerns without affecting distortion
performance significantly. A larger value of R also results in
reduced dynamic power dissipation in the amplifier.
When high-Z mode is enabled, the ADC consumes approximately
2 mW per MSPS extra power; however, this power is still
significantly lower than using dedicated ADC drivers like the
ADA4807-1. For any system, the front end usually limits the
overall ac/dc performance of the signal chain. It is evident from
the data sheets of the selected precision amplifiers, shown in
Figure 44 and Figure 45, that their own noise and distortion
performance dominates the SNR and THD specification at a
certain input frequency.
See Table 10 for details on setting the RC filter bandwidth and
choosing a suitable amplifier.
97
94
91
88
85
82
VOLTAGE REFERENCE INPUT
A 10 µF (X7R, 0805 size) ceramic chip capacitor is appropriate
for the optimum performance of the reference input.
For higher performance and lower drift, use a reference such as
the ADR4550. Use a low power reference such as the ADR3450
at the expense of a slight decrease in the noise performance. It is
recommended to use a reference buffer, such as the ADA4807-1,
between the reference and the ADC reference input. It is important
to consider the optimum capacitance necessary to keep the
reference buffer stable as well as to meet the minimum ADC
requirement previously stated in this section (that is, a 10 µF
ceramic chip capacitor, CREF).
79
ADA4077-1 HIGH-Z DISABLED
ADA4077-1 HIGH-Z ENABLED
ADA4610-1 HIGH-Z DISABLED
ADA4610-1 HIGH-Z ENABLED
76
73
260kHz
1.3kΩ
470pF
498kHz
680Ω
470pF
1.3MHz
680Ω
180pF
2.27MHz
390Ω
180pF
4.42MHz
200Ω
180pF
RC FILTER BANDWIDTHS (Hz), RESISTOR (Ω), CAPACITOR (pF)
POWER SUPPLY
Figure 44. SNR vs. RC Filter Bandwidths for Various Precision ADC Drivers,
fIN = 1 kHz (Turbo Mode On, High-Z Enabled/Disabled), VDD = 1.8 V,
VIO = 3.3 V, VREF = 5 V, 25°C
The AD4001/AD4005 use two power supply pins: a core supply
(VDD) and a digital input/output interface supply (VIO). VIO
allows direct interface with any logic between 1.8 V and 5.5 V.
Rev. B | Page 24 of 37
Data Sheet
AD4001/AD4005
To reduce the number of supplies needed, VIO and VDD can be
tied together for 1.8 V operation. The ADP7118 low noise, CMOS,
low dropout (LDO) linear regulator is recommended to power
the VDD and VIO pins. The AD4001/AD4005 are independent
of power supply sequencing between VIO and VDD. Additionally,
the AD4001/AD4005 are insensitive to power supply variations
over a wide frequency range, as shown in Figure 46.
80
interface. A 3-wire interface using the CNV, SCK, and SDO
signals minimizes wiring connections, which is useful, for
instance, in isolated applications. A 4-wire interface using the
SDI, CNV, SCK, and SDO signals allows CNV, which initiates the
conversions, to be independent of the readback timing (SDI).
This interface is useful in low jitter sampling or simultaneous
sampling applications.
The AD4001/AD4005 provide a daisy-chain feature using the SDI
input for cascading multiple ADCs on a single data line, similar
to a shift register.
75
70
65
60
55
50
The mode in which the device operates depends on the SDI
CS
level when the CNV rising edge occurs.
mode is selected if
SDI is high, and daisy-chain mode is selected if SDI is low. The
SDI hold time is such that when SDI and CNV are connected
together, daisy-chain mode is always selected.
In either 3-wire or 4-wire mode, the AD4001/AD4005 offer the
option of forcing a start bit in front of the data bits. This start
bit can be used as a busy signal indicator to interrupt the digital
host and trigger the data reading. Otherwise, without a busy
indicator, the user must time out the maximum conversion time
prior to readback.
100
1k
10k
100k
1M
FREQUENCY (Hz)
Figure 46. PSRR vs. Frequency, VDD = 1.8 V, VIO = 3.3 V, VREF = 5 V, 25°C
CS
The busy indicator feature is enabled in
is low when the ADC conversion ends.
mode if CNV or SDI
The AD4001/AD4005 power down automatically at the end of
each conversion phase; therefore, the power scales linearly with
the sampling rate. This feature makes the device ideal for low
sampling rates (even a few samples per second) and battery-
powered applications. Figure 47 shows the AD4001/AD4005
total power dissipation and individual power dissipation for
each rail.
The state of SDO on power-up is either low or high-Z depending
on the states of CNV and SDI, as shown in in Table 11.
Table 11. State of SDO on Power-Up
CNV
SDI
SDO
Low
Low
Low
High-Z
0
0
1
1
0
1
0
1
100k
VDD
VIO
REF
TOTAL POWER
10k
1k
The AD4001/AD4005 have turbo mode capability in both 3-wire
and 4-wire mode. Turbo mode is enabled by writing to the
configuration register and replaces the busy indicator feature
when enabled. Turbo mode allows a slower SPI clock rate, making
interfacing simpler. The maximum throughput of 2 MSPS for the
AD4001 can be achieved only with turbo mode enabled and a
minimum SCK rate of 70 MHz.
100
10
1
0.1
0.01
POWER DISSIPATION MEASUREMENTS
APPLY TO EACH PRODUCT OVER ITS
SPECIFIED THROUGHPUT RANGE.
The SCK rate must be sufficiently fast to ensure the conversion
result is clocked out before another conversion initiates. The
minimum required SCK rate for an application can be derived
based on the sample period (tCYC), the number of bits that must
be read (including data and optional status bits), and which
digital interface mode is used. Timing diagrams and explanations
for each digital interface mode are given in the digital modes of
10
100
1k
10k
100k
1M 2M
THROUGHPUT (SPS)
Figure 47. Power Dissipation vs. Throughput, VDD = 1.8 V, VIO = 1.8 V,
VREF = 5 V, 25°C
DIGITAL INTERFACE
Although the AD4001/AD4005 have a reduced number of pins,
they offer flexibility in their serial interface modes. The AD4001/
AD4005 can also be programmed via 16-bit SPI writes to the
configuration registers.
CS
operation sections (see the Mode, 3-Wire Turbo Mode section
through the Daisy-Chain Mode section).
Status bits can also be clocked out at the end of the conversion
data if the status bits are enabled in the configuration register.
There are six status bits in total, as described in Table 12.
CS
When in
mode, the AD4001/AD4005 are compatible with
SPI, QSPI™, MICROWIRE®, digital hosts, and DSPs. In this
mode, the AD4001/AD4005 can use either a 3-wire or 4-wire
Rev. B | Page 25 of 37
AD4001/AD4005
Data Sheet
The AD4001/AD4005 are configured by 16-bit SPI writes to the
desired configuration register. The 16-bit word can be written
via the SDI line while CNV is held low. The 16-bit word consists
of an 8-bit header and 8-bit register data. For isolated systems,
the ADuM141D is recommended, which can support the 70 MHz
SCK rate required to run the AD4001 at its full throughput of
2 MSPS.
Table 13. Command Register
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
WEN
R/W
0
1
0
1
0
0
All register read/writes must occur while CNV is low. Data on
SDI is clocked in on the rising edge of SCK. Data on SDO is
clocked out on the falling edge of SCK. At the end of the data
transfer, SDO is put in a high impedance state on the rising
edge of CNV if daisy-chain mode is not enabled. If daisy-chain
mode is enabled, SDO goes low on the rising edge of CNV.
Register reads are not allowed in daisy-chain mode.
REGISTER READ/WRITE FUNCTIONALITY
The AD4001/AD4005 register bits are programmable, and their
default statuses are shown in Table 12. The register map is shown in
OV
Table 14. The overvoltage clamp flag ( ) is a read only sticky bit,
A register write requires three signal lines: SCK, CNV, and SDI.
During a register write, to read the current conversion results
on SDO, the CNV pin must be brought low after the conversion
is completed; otherwise, the conversion results may be incorrect
on SDO. However, the register write occurs regardless.
and it is cleared only if the register is read and the overvoltage
condition is no longer present. It gives an indication of overvoltage
condition when it is set to 0.
Table 12. Register Bits
The LSB of each configuration register is reserved because a
user reading 16-bit conversion data may be limited to a 16-bit
SPI frame. The state of SDI on the last bit in the SDI frame may
be the state that then persists when CNV rises. Because interface
mode is partly set based on the SDI state when CNV rises, in
this scenario, the user may need to set the final SDI state.
Register Bits
Default Status
Overvoltage (OV) Clamp Flag 1 bit, 1 = inactive (default)
Span Compression
High-Z Mode
Turbo Mode
1 bit, 0 = disabled (default)
1 bit, 0 = disabled (default)
1 bit, 0 = disabled (default)
1 bit, 0 = disabled (default)
Enable Six Status Bits
The timing diagrams in Figure 48 through Figure 50 show how
data is read and written when the AD4001/AD4005 are configured
in register read, write, and daisy-chain mode.
All access to the register map must start with a write to the 8-bit
command register in the SPI interface block. The AD4001/AD4005
ignore all 1s until the first 0 is clocked in; the value loaded into
the command register is always a 0 followed by seven command
bits. This command determines whether that operation is a write
or a read. The AD4001/AD4005 command register is shown in
Table 13.
Table 14. Register Map
ADDR[1:0] Bit 7
Bit 6
Reserved Reserved Reserved Enable six Span
status bits compression
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
0x0
High-Z
mode
Turbo
mode
Overvoltage (OV) clamp
flag (read only sticky bit)
0xE1
tCYC
tCNVH
tSCK
CNV
SCK
tSCNVSCK
tSCKL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
tHSDISCK
tSSDISCK
tSCKH
ADDR[1:0]
SDI
1
0
0
0
0
1
WEN
0
R/W
1
1
0
0
1
1
tHSDO
tDSDO
tEN
tDIS
D16
B3
SDO
D17
D13
D12
D15
D14
D11
D10
B7
B6
B5
B4
B2
B1
B0
X
Figure 48. Register Read Timing Diagram (X Means Don’t Care)
Rev. B | Page 26 of 37
Data Sheet
AD4001/AD4005
tCYC
tSCK
1
tCNVH
tHCNVSCK
CNV
tSCNVSCK
tSCKL
SCK
1
2
3
4
5
9
10
11
12
13
14
15
16
tHSDISCK
tSCKH
tSSDISCK
1
SDI
1
WEN
R/W
0
0
0
1
1
0
0
1
ADDR[1:0]
B7
B6
B5
B4
B3
B2
B1
B0
0
1
0
0
tHSDO
tDSDO
EN
D8
D7
SDO
1
D15
D14
D13
D12
D11
D10
D9
D6
D5
D4
D3
D2
D1
D0
CONVERSION RESULT ON D[15:0]
THE USER MUST WAIT tCONV WHEN READING BACK THE CONVERSION RESULT AND PERFORMING A REGISTER WRITE AT THE SAME TIME.
Figure 49. Register Write Timing Diagram
tCYC
tCNVH
tSCK
CNV
SCK
tSCNVSCK
tSCKL
1
24
tSCKH
SDI
0
A
0
COMMAND (0x14)
DATA (0xAB)
SDO /SDI
A
0
COMMAND (0x14)
DATA (0xAB)
0
B
tDIS
SDO
B
0
COMMAND (0x14)
0
Figure 50. Register Write Timing Diagram, Daisy-Chain Mode
Rev. B | Page 27 of 37
AD4001/AD4005
Data Sheet
The SDO line goes to high-Z after the sixth status bit is clocked
out (except in daisy-chain mode). The user is not required to
clock out all status bits to start the next conversion. The serial
STATUS WORD
The 6-bit status word can be appended to the end of a conversion
result, and the default conditions of these bits are shown in
Table 15. The status bits must be enabled in the register setting.
CS
interface timing for
mode, 3-wire without busy indicator,
including status bits, is shown in Figure 51.
OV
When the overvoltage clamp flag ( ) is a 0, it indicates an
overvoltage condition. The overvoltage clamp flag status bit
updates on a per conversion basis.
Table 15. Status Bits (Default Conditions)
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Overvoltage (OV) clamp flag
Span compression
High-Z mode
Turbo mode
Reserved
Reserved
SDI = 1
tCYC
tCNVH
CN V
ACQ
ACQUISITION
CONVERSION
tCONV
ACQUISITION
tSCK
tQUIET2
tSCKL
SCK
20
21
22
16
1
2
3
14
tSCKH
15
t
HSDO
tEN
tDSDO
D13
tDIS
SDO
D15
D14
D1
D0
B1
B0
STATUS BITS B[5:0]
CS
Figure 51. Mode, 3-Wire Without Busy Indicator Serial Interface Timing Diagram, Including Status Bits (SDI High)
Rev. B | Page 28 of 37
Data Sheet
AD4001/AD4005
When SDI is forced high, a rising edge on CNV initiates a
CS MODE, 3-WIRE TURBO MODE
conversion. The previous conversion data is available to read
after the CNV rising edge. The user must wait tQUIET1 time after
CNV is brought high before bringing CNV low to clock out the
previous conversion result. The user must also wait tQUIET2 time
after the last falling edge of SCK to when CNV is brought high.
This mode is typically used when a single AD4001/AD4005
device is connected to an SPI-compatible digital host. It provides
additional time during the end of the ADC conversion process
to clock out the previous conversion result, providing a lower
SCK rate. The AD4001 can achieve a throughput rate of 2 MSPS
only when turbo mode is enabled and using a minimum SCK
rate of 70 MHz. With turbo mode enabled, the AD4005 can also
achieve its maximum throughput rate of 1 MSPS with a
minimum SCK rate of 22 MHz. The connection diagram is
shown in Figure 52, and the corresponding timing diagram is
shown in Figure 53.
When the conversion is complete, the AD4001/AD4005 enter
the acquisition phase and power down. When CNV goes low,
the MSB is output to SDO. The remaining data bits are clocked
by subsequent SCK falling edges. The data is valid on both SCK
edges. Although the rising edge can capture the data, a digital
host using the SCK falling edge allows a faster reading rate,
provided it has an acceptable hold time. After the 16th SCK
falling edge or when CNV goes high (whichever occurs first),
SDO returns to high impedance.
This mode replaces the 3-wire with busy indicator mode by
programming the turbo mode bit, Bit 1 (see Table 14).
CONVERT
DIGITAL HOST
CNV
VIO
AD4001/
AD4005
SDI
SDO
DATA IN
SCK
CLK
CS
Figure 52. Mode, 3-Wire Turbo Mode Connection Diagram (SDI High)
SDI = 1
tCYC
CNV
t
ACQ
ACQUISITION
CONVERSION
CONV
ACQUISITION
tSCK
tSCKL
QUIET2
tQUIET1
SCK
SDO
1
2
3
14
15
16
tSCKH
tHSDO
tEN
tDSDO
tDIS
D15
D14
D13
D1
D0
CS
Figure 53. Mode, 3-Wire Turbo Mode Serial Interface Timing Diagram (SDI High)
Rev. B | Page 29 of 37
AD4001/AD4005
Data Sheet
When the conversion is complete, the AD4001/AD4005 enter
the acquisition phase and power down. When CNV goes low,
the MSB is output onto SDO. The remaining data bits are clocked
by subsequent SCK falling edges. The data is valid on both SCK
edges. Although the rising edge can capture the data, a digital
host using the SCK falling edge allows a faster reading rate,
provided it has an acceptable hold time. After the 16th SCK
falling edge or when CNV goes high (whichever occurs first),
SDO returns to high impedance.
CS MODE, 3-WIRE WITHOUT BUSY INDICATOR
This mode is typically used when a single AD4001/AD4005 is
connected to an SPI-compatible digital host. The connection
diagram is shown in Figure 54, and the corresponding timing
diagram is shown in Figure 55.
With SDI tied to VIO, a rising edge on CNV initiates a conversion,
CS
selects the
mode, and forces SDO to high impedance. After a
conversion is initiated, it continues until completion irrespective
of the state of CNV. This feature can be useful, for instance, to
bring CNV low to select other SPI devices, such as analog
multiplexers; however, CNV must be returned high before the
minimum conversion time elapses and then held high for the
maximum possible conversion time to avoid the generation of
the busy signal indicator.
There must not be any digital activity on SCK during the
conversion.
CONVERT
DIGITAL HOST
CNV
VIO
AD4001/
AD4005
SDI
SDO
DATA IN
SCK
CLK
CS
Figure 54. Mode, 3-Wire Without Busy Indicator Connection Diagram (SDI High)
SDI = 1
tCYC
tCNVH
CNV
tACQ
ACQUISITION
CONVERSION
tCONV
ACQUISITION
tSCK
tSCKL
tQUIET2
SCK
1
2
3
14
15
16
tSCKH
HSDO
tEN
tDSDO
tDIS
SDO
D15
D14
D13
D1
D0
CS
Figure 55. Mode, 3-Wire Without Busy Indicator Serial Interface Timing Diagram (SDI High)
Rev. B | Page 30 of 37
Data Sheet
AD4001/AD4005
When the conversion is complete, SDO goes from high
CS MODE, 3-WIRE WITH BUSY INDICATOR
impedance to low impedance. With a pull-up resistor of 1 kΩ
on the SDO line, this transition can be used as an interrupt
signal to initiate the data reading controlled by the digital host.
The AD4001/AD4005 then enter the acquisition phase and
power down. The data bits are then clocked out, MSB first, by
subsequent SCK falling edges. The data is valid on both SCK edges.
Although the rising edge can capture the data, a digital host
using the SCK falling edge allows a faster reading rate, provided
it has an acceptable hold time. After the optional 17th SCK
falling edge or when CNV goes high (whichever occurs first),
SDO returns to high impedance.
This mode is typically used when a single AD4001/AD4005 is
connected to an SPI-compatible digital host with an interrupt
IRQ
input (
).
The connection diagram is shown in Figure 56, and the
corresponding timing diagram is shown in Figure 57.
With SDI tied to VIO, a rising edge on CNV initiates a conversion,
CS
selects the
mode, and forces SDO to high impedance. SDO
is maintained in high impedance until the completion of the
conversion irrespective of the state of CNV. Prior to the minimum
conversion time, CNV can select other SPI devices, such as
analog multiplexers; however, CNV must be returned low
before the minimum conversion time elapses and then held
low for the maximum possible conversion time to guarantee
the generation of the busy signal indicator.
If multiple AD4001/AD4005 devices are selected at the same
time, the SDO output pin handles this contention without
damage or induced latch-up. Meanwhile, it is recommended
to keep this contention as short as possible to limit extra power
dissipation.
There must not be any digital activity on the SCK during the
conversion.
CONVERT
VIO
1kΩ
DIGITAL HOST
CNV
VIO
AD4001/
SDI
SDO
DATA IN
AD4005
IRQ
SCK
CLK
CS
Figure 56. Mode, 3-Wire with Busy Indicator Connection Diagram (SDI High)
SDI = 1
tCYC
tCNVH
CNV
tACQ
ACQUISITION
CONVERSION
tCONV
ACQUISITION
tSCK
tSCKL
tQUIET2
SCK
SDO
1
2
3
15
16
17
tHSDO
tSCKH
tDSDO
tDIS
D15
D14
D1
D0
CS
Figure 57. Mode, 3-Wire with Busy Indicator Serial Interface Timing Diagram (SDI High)
Rev. B | Page 31 of 37
AD4001/AD4005
Data Sheet
rising edge. The user must wait tQUIET1 time after CNV is brought
high before bringing SDI low to clock out the previous conversion
result. The user must also wait tQUIET2 time after the last falling
edge of SCK to when CNV is brought high.
CS MODE, 4-WIRE TURBO MODE
This mode is typically used when a single AD4001/AD4005
device is connected to an SPI-compatible digital host. It provides
additional time during the end of the ADC conversion process
to clock out the previous conversion result, giving a lower SCK
rate. The AD4001 can achieve a throughput rate of 2 MSPS only
when turbo mode is enabled and using a minimum SCK rate of
70 MHz. With turbo mode enabled, the AD4005 can also achieve
its maximum throughput rate of 1 MSPS with a minimum SCK
rate of 22 MHz. The connection diagram is shown in Figure 58,
and the corresponding timing diagram is shown in Figure 59.
When the conversion is complete, the AD4001/AD4005 enter
the acquisition phase and power down. The ADC result can be
read by bringing its SDI input low, which consequently outputs
the MSB onto SDO. The remaining data bits are then clocked by
subsequent SCK falling edges. The data is valid on both SCK
edges. Although the rising edge can capture the data, a digital
host using the SCK falling edge allows a faster reading rate,
provided it has an acceptable hold time. After the 16th SCK
falling edge or when SDI goes high (whichever occurs first),
SDO returns to high impedance.
This mode replaces the 4-wire with busy indicator mode by
programming the turbo mode bit, Bit 1 (see Table 14).
With SDI high, a rising edge on CNV initiates a conversion.
The previous conversion data is available to read after the CNV
CS1
CONVERT
VIO
1kΩ
DIGITAL HOST
CNV
AD4001/
SDI
SDO
DATA IN
IRQ
AD4005
SCK
CLK
CS
Figure 58. Mode, 4-Wire Turbo Mode Connection Diagram
CNV
tCYC
tSSDICNV
SDI
tHSDICNV
tACQ
ACQUISITION
CONVERSION
tCONV
ACQUISITION
tSCK
tSCKL
tQUIET2
tQUIET1
SCK
1
2
3
14
15
16
tHSDO
tSCKH
tDIS
tEN
tDSDO
SDO
D15
D14
D13
D1
D0
CS
Figure 59. Mode, 4-Wire Turbo Mode Timing Diagram
Rev. B | Page 32 of 37
Data Sheet
AD4001/AD4005
When the conversion is complete, the AD4001/AD4005 enter
the acquisition phase and power down. Each ADC result can be
read by bringing its SDI input low, which consequently outputs
the MSB onto SDO. The remaining data bits are then clocked by
subsequent SCK falling edges. The data is valid on both SCK
edges. Although the rising edge can capture the data, a digital
host using the SCK falling edge allows a faster reading rate,
provided it has an acceptable hold time. After the 16th SCK falling
edge or when SDI goes high (whichever occurs first), SDO returns
to high impedance and another AD4001/AD4005 can be read.
CS MODE, 4-WIRE WITHOUT BUSY INDICATOR
This mode is typically used when multiple AD4001/AD4005
devices are connected to an SPI-compatible digital host.
A connection diagram example using two AD4001/AD4005
devices is shown in Figure 60, and the corresponding timing
diagram is shown in Figure 61.
With SDI high, a rising edge on CNV initiates a conversion,
CS
selects the
mode, and forces SDO to high impedance. In this
mode, CNV must be held high during the conversion phase and
the subsequent data readback. If SDI and CNV are low, SDO is
driven low. Prior to the minimum conversion time, SDI can select
other SPI devices, such as analog multiplexers; however, SDI
must be returned high before the minimum conversion time
elapses and then held high for the maximum possible conversion
time to avoid the generation of the busy signal indicator.
CS2
CS1
CONVERT
CNV
CNV
DIGITAL HOST
AD4001/
AD4001/
AD4005
SDI
SDO
SDI
SDO
AD4005
DEVICE A
SCK
DEVICE B
SCK
DATA IN
CLK
CS
Figure 60. Mode, 4-Wire Without Busy Indicator Connection Diagram
CYC
CNV
tACQ
ACQUISITION
CONVERSION
tCONV
ACQUISITION
tQUIET2
tSSDICNV
SDI(CS1)
tHSDICNV
SDI(CS2)
SCK
tSCK
tSCKL
1
2
3
14
15
16
17
18
30
31
32
tHSDO
t
SCKH
tDSDO
D13
tDIS
tEN
SDO
D15
D14
D1
D0
D15
D14
D1
D0
CS
Figure 61. Mode, 4-Wire Without Busy Indicator Serial Interface Timing Diagram
Rev. B | Page 33 of 37
AD4001/AD4005
Data Sheet
SDI must be returned low before the minimum conversion time
elapses and then held low for the maximum possible conversion
time to guarantee the generation of the busy signal indicator.
CS MODE, 4-WIRE WITH BUSY INDICATOR
This mode is typically used when a AD4001/AD4005 device is
connected to an SPI-compatible digital host with an interrupt
When the conversion is complete, SDO goes from high
impedance to low impedance. With a pull-up resistor of 1 kΩ
on the SDO line, this transition can be used as an interrupt signal
to initiate the data readback controlled by the digital host. The
AD4001/AD4005 then enter the acquisition phase and power
down. The data bits are then clocked out, MSB first, by subsequent
SCK falling edges. The data is valid on both SCK edges. Although
the rising edge can capture the data, a digital host using the SCK
falling edge allows a faster reading rate, provided it has an
acceptable hold time. After the optional 17th SCK falling edge or
when SDI goes high (whichever occurs first), SDO returns to
high impedance.
IRQ
input (
), and when it is desired to keep CNV, which samples
the analog input, independent of the signal used to select the
data reading. This independence is particularly important in
applications where low jitter on CNV is desired.
The connection diagram is shown in Figure 62, and the
corresponding timing diagram is shown in Figure 63.
With SDI high, a rising edge on CNV initiates a conversion,
CS
selects the
mode, and forces SDO to high impedance. In this
mode, CNV must be held high during the conversion phase and
the subsequent data readback. If SDI and CNV are low, SDO is
driven low. Prior to the minimum conversion time, SDI can
select other SPI devices, such as analog multiplexers; however,
CS1
CONVERT
VIO
1kΩ
DIGITAL HOST
CNV
AD4001/
SDI
SDO
DATA IN
IRQ
AD4005
SCK
CLK
CS
Figure 62. Mode, 4-Wire with Busy Indicator Connection Diagram
tCYC
CNV
tACQ
ACQUISITION
CONVERSION
tCONV
ACQUISITION
tQUIET2
tSSDICNV
SDI
tSCK
tHSDICNV
tSCKL
SCK
SDO
1
2
3
15
16
17
tSCKH
tHSDO
tDSDO
tDIS
tEN
D15
D14
D1
D0
CS
Figure 63. Mode, 4-Wire with Busy Indicator Serial Interface Timing Diagram
Rev. B | Page 34 of 37
Data Sheet
AD4001/AD4005
the daisy-chain outputs its data MSB first, and 16 × N clocks are
required to read back the N ADCs. The data is valid on both
SCK edges. The maximum conversion rate is reduced because of
the total readback time.
DAISY-CHAIN MODE
Use this mode to daisy-chain multiple AD4001/AD4005 devices
on a 3-wire or 4-wire serial interface. This feature is useful for
reducing component count and wiring connections, for example,
in isolated multiconverter applications or for systems with a
limited interfacing capacity. Data readback is analogous to
clocking a shift register.
It is possible to write to each ADC register in daisy-chain mode.
The timing diagram is shown in Figure 50. This mode requires
4-wire operation because data is clocked in on the SDI line with
CNV held low. The same command byte and register data can
be shifted through the entire chain to program all ADCs in the
chain with the same register contents, which requires 8 × (N + 1)
clocks for N ADCs. It is possible to write different register
contents to each ADC in the chain by writing to the furthest ADC
in the chain, first using 8 × (N + 1) clocks, and then the second
furthest ADC with 8 × N clocks, and so forth until reaching the
nearest ADC in the chain, which requires 16 clocks for the
command and register data. It is not possible to read register
contents in daisy-chain mode; however, the six status bits can be
enabled if the user wants to determine the ADC configuration.
Note that enabling the status bits requires six extra clocks to clock
out the ADC result and the status bits per ADC in the chain.
Turbo mode cannot be used in daisy-chain mode.
A connection diagram example using two AD4001/AD4005
devices is shown in Figure 64, and the corresponding timing
diagram is shown in Figure 65.
When SDI and CNV are low, SDO is driven low. With SCK low,
a rising edge on CNV initiates a conversion, selects daisy-chain
mode, and disables the busy indicator. In this mode, CNV is held
high during the conversion phase and the subsequent data
readback. When the conversion is complete, the MSB is output
onto SDO, and the AD4001/AD4005 enter the acquisition phase
and power down. The remaining data bits stored in the internal
shift register are clocked out of SDO by subsequent SCK falling
edges. For each ADC, SDI feeds the input of the internal shift
register and is clocked by the SCK rising edges. Each ADC in
CONVERT
CNV
CNV
DIGITAL HOST
DATA IN
AD4001/
AD4001/
AD4005
SDI
SDO
SDI
SDO
AD4005
DEVICE A
SCK
DEVICE B
SCK
CLK
Figure 64. Daisy-Chain Mode Connection Diagram
SDI = 0
A
tCYC
CNV
tACQ
ACQUISITION
CONVERSION
tCONV
ACQUISITION
tSCK
tQUIET2
tSCKL
t
QUIET2
SCK
1
2
3
14
15
16
17
18
30
31
32
tSSDISCK
tSCKH
tHSCKCNV
tHSDISCK
tEN
D
D
15
D
14
D
13
13
D
A
1
1
D
0
SDO = SDI
A
A
A
A
A
B
tHSDO
tDIS
t
DSDO
D
15
D
14
D
1
D 0
A
15
D
14
D
D
B
D
0
SDO
A
A
A
B
B
B
B
B
Figure 65. Daisy-Chain Mode Serial Interface Timing Diagram
Rev. B | Page 35 of 37
AD4001/AD4005
Data Sheet
LAYOUT GUIDELINES
The PCB that houses the AD4001/AD4005 must be designed so
that the analog and digital sections are separated and confined to
certain areas of the board. The pinout of the AD4001/AD4005,
with its analog signals on the left side and its digital signals on
the right side, eases this task.
Avoid running digital lines under the device because they couple
noise onto the die, unless a ground plane under the AD4001/
AD4005 is used as a shield. Fast switching signals, such as CNV
or clocks, must not run near analog signal paths. Avoid crossover
of digital and analog signals.
At least one ground plane must be used. It can be common or
split between the digital and analog sections. In the latter case,
join the planes underneath the AD4001/AD4005 devices.
Figure 67. Example Layout of the AD4001 (Bottom Layer)
EVALUATING THE AD4001/AD4005 PERFORMANCE
The AD4001/AD4005 voltage reference input (REF) has a
dynamic input impedance. Decouple the REF pin with minimal
parasitic inductances by placing the reference decoupling ceramic
capacitor close to (ideally right up against) the REF and GND
pins and connect them with wide, low impedance traces.
Other recommended layouts for the AD4001/AD4005 are
outlined in the user guide of the evaluation board for the AD4001
(EVAL-AD4001FMCZ). The evaluation board package includes
a fully assembled and tested evaluation board with the AD4001
documentation, and software for controlling the board from a
PC via the EVAL-SDP-CH1Z. The EVAL-AD4001FMCZ can
also be used to evaluate the AD4005 by limiting the throughput
to 1 MSPS in its software (see UG-1042).
Finally, decouple the VDD and VIO power supplies of the
AD4001/AD4005 with ceramic capacitors, typically 0.1 µF,
placed close to the AD4001/AD4005 and connected using short,
wide traces to provide low impedance paths and to reduce the
effect of glitches on the power supply lines.
An example of the AD4001 layout following these rules is shown in
Figure 66 and Figure 67. Note that the AD4005 layout is equivalent
to the AD4001 layout.
Figure 66. Example Layout of the AD4001 (Top Layer)
Rev. B | Page 36 of 37
Data Sheet
AD4001/AD4005
OUTLINE DIMENSIONS
3.10
3.00
2.90
10
1
6
5
5.15
4.90
4.65
3.10
3.00
2.90
PIN 1
IDENTIFIER
0.50 BSC
0.95
0.85
0.75
15° MAX
1.10 MAX
0.70
0.55
0.40
0.15
0.05
0.23
0.13
6°
0°
0.30
0.15
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-BA
Figure 68. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
DETAIL A
(JEDEC 95)
2.48
2.38
2.23
3.10
3.00 SQ
0.50 BSC
2.90
10
6
PIN 1 INDEX
EXPOSED
PAD
1.74
1.64
1.49
AREA
0.50
0.40
0.30
0.20 MIN
1
5
PIN
1
BOTTOM VIEW
TOP VIEW
SIDE VIEW
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.80
0.75
0.70
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.30
0.25
0.20
0.20 REF
Figure 69. 10-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-10-9)
Dimensions shown in millimeters
ORDERING GUIDE
Integral
Nonlinearity (INL)
Temperature
Range
Ordering Package
Quantity Option
Model1, 2
Package Description
10-Lead LFCSP, Reel
10-Lead MSOP, Tube
10-Lead MSOP, Reel
10-Lead LFCSP, Reel
10-Lead MSOP, Tube
10-Lead MSOP, Reel
Branding
C8H
C8H
AD4001BCPZ-RL7
AD4001BRMZ
AD4001BRMZ-RL7
AD4005BCPZ-RL7
AD4005BRMZ
0.4 LSB
0.4 LSB
0.4 LSB
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
1500
50
CP-10-9
RM-10
RM-10
CP-10-9
RM-10
RM-10
1000
1500
50
C8H
0.4 LSB
0.4 LSB
0.4 LSB
C8T
C8T
C8T
AD4005BRMZ-RL7
EVAL-AD4001FMCZ
1000
AD4001 Evaluation Board
Compatible with EVAL-SDP-CH1Z
1 Z = RoHS Compliant Part.
2 The EVAL-AD4001FMCZ can also be used to evaluate the AD4005 by setting the throughput to 1 MSPS in its software (see UG-1042).
©2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D15368-0-8/17(B)
Rev. B | Page 37 of 37
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