AD5314BRMZ-REEL [ADI]
2.5 V to 5.5 V, 500 μA, Quad Voltage Output 8-/10-/12-Bit DACs in 10-Lead Packages; 2.5 V至5.5 V ， 500 μA ，四路电压输出8位/ 10位/ 12位DAC，采用10引脚封装
| 型号： | AD5314BRMZ-REEL |
| 厂家： | 
ADI |
| 描述： | 2.5 V to 5.5 V, 500 μA, Quad Voltage Output 8-/10-/12-Bit DACs in 10-Lead Packages |
| 文件： | 总24页 (文件大小：357K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2.5 V to 5.5 V, 500 μA, Quad Voltage Output
8-/10-/12-Bit DACs in 10-Lead Packages
AD5304/AD5314/AD5324
Data Sheet
FEATURES
GENERAL DESCRIPTION
The AD5304/AD5314/AD53241 are quad 8-, 10-, and 12-bit
AD5304: 4 buffered 8-Bit DACs in 10-lead MSOP and
buffered voltage output DACs in 10-lead MSOP and 10-lead
LFCSP packages that operate from a single 2.5 V to 5.5 V supply,
consuming 500 μA at 3 V. Their on-chip output amplifiers allow
rail-to-rail output swing to be achieved with a slew rate of 0.7 V/μs.
A 3-wire serial interface is used; it operates at clock rates up to
30 MHz and is compatible with standard SPI, QSPI, MICROWIRE,
and DSP interface standards.
10-lead LFCSP
A, W Version: 1 LSB INL, B Version: 0.625 LSB INL
AD5314: 4 buffered 10-Bit DACs in 10-lead MSOP and
10-lead LFCSP
A, W Version: 4 LSB INL, B Version: 2.5 LSB INL
AD5324: 4 buffered 12-Bit DACs in 10-lead MSOP and
10-lead LFCSP
A, W Version: 16 LSB INL, B Version: 10 LSB INL
Low power operation: 500 μA @ 3 V, 600 μA @ 5 V
2.5 V to 5.5 V power supply
Guaranteed monotonic by design over all codes
Power-down to 80 nA @ 3 V, 200 nA @ 5 V
Double-buffered input logic
The references for the four DACs are derived from one reference
pin. The outputs of all DACs can be updated simultaneously using
LDAC
the software
function. The parts incorporate a power-on
reset circuit, and ensure that the DAC outputs power up to 0 V
and remains there until a valid write takes place to the device.
The parts contain a power-down feature that reduces the current
consumption of the device to 200 nA @ 5 V (80 nA @ 3 V).
Output range: 0 V to VREF
Power-on reset to 0 V
The low power consumption of these parts in normal operation
makes them ideally suited to portable battery-operated equipment.
The power consumption is 3 mW at 5 V, 1.5 mW at 3 V, reducing
to 1 μW in power-down mode.
LDAC
Simultaneous update of outputs (
function)
Low power-, SPI®-, QSPI™-, MICROWIRE™-, and DSP-
compatible 3-wire serial interface
On-chip, rail-to-rail output buffer amplifiers
Temperature range −40°C to +105°C
Qualified for automotive applications
APPLICATIONS
Portable battery-powered instruments
Digital gain and offset adjustment
Programmable voltage and current sources
Programmable attenuators
1 Protected by U.S. Patent No. 5,969,657.
Industrial process controls
FUNCTIONAL BLOCK DIAGRAM
V
REFIN
DD
AD5304/AD5314/AD5324
LDAC
BUFFER
BUFFER
BUFFER
BUFFER
INPUT
DAC
STRING
DAC A
V
V
V
V
A
B
C
D
OUT
OUT
OUT
OUT
REGISTER
REGISTER
SCLK
SYNC
DIN
INPUT
REGISTER
DAC
REGISTER
STRING
DAC B
INPUT
REGISTER
DAC
REGISTER
STRING
DAC C
INPUT
REGISTER
DAC
REGISTER
STRING
DAC D
POWER-ON RESET
POWER-DOWN LOGIC
GND
Figure 1.
Rev. H
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2011 Analog Devices, Inc. All rights reserved.
AD5304/AD5314/AD5324
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Theory of Operation ...................................................................... 14
Functional Description.............................................................. 14
Power-On Reset.......................................................................... 14
Serial Interface............................................................................ 14
Power-Down Mode.................................................................... 16
Microprocessor Interfacing....................................................... 16
Applications Information.............................................................. 18
Typical Application Circuit....................................................... 18
Decoding Multiple AD5304/AD5314/AD5324s.................... 19
Power Supply Bypassing and Grounding................................ 20
Outline Dimensions....................................................................... 22
Ordering Guide .......................................................................... 23
Automotive Products................................................................. 23
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
AC Characteristics........................................................................ 4
Timing Characteristics ................................................................ 5
Absolute Maximum Ratings............................................................ 6
ESD Caution.................................................................................. 6
Pin Configurations and Function Descriptions ........................... 7
Typical Performance Characteristics ............................................. 8
Terminology .................................................................................... 12
REVISION HISTORY
8/03—Rev. C to Rev. D
9/11—Rev. G to Rev. H
Added A Version ................................................................Universal
Changes to Features ..........................................................................1
Changes to Specifications.................................................................2
Changes to Absolute Maximum Ratings........................................4
Changes to Ordering Guide.............................................................4
Changes to Figure 6........................................................................ 11
Added OCTALS Section to Table 2.............................................. 15
Updated Outline Dimensions....................................................... 16
Changes to Table 4............................................................................ 6
5/11—Rev. F to Rev. G
Added W Version ...............................................................Universal
Added EPAD Notation to Figure 4................................................. 7
Updated Outline Dimensions....................................................... 22
Changes to Ordering Guide .......................................................... 23
Added Automotive Products Section .......................................... 23
9/06—Rev. E to Rev. F
Updated Format..................................................................Universal
Changes to Specifications Section.................................................. 3
Changes to Table 5............................................................................ 7
Updated Outline Dimensions ...................................................... 22
Changes to Ordering Guide .......................................................... 23
5/05—Rev. D to Rev. E
Added 10-lead LFCSP package.........................................Universal
Changes to Title ................................................................................ 1
Changes to Ordering Guide ............................................................ 4
Rev. H | Page 2 of 24
Data Sheet
AD5304/AD5314/AD5324
SPECIFICATIONS
VDD = 2.5 V to 5.5 V; VREF = 2 V; RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications TMIN to TMAX, unless otherwise noted.
Table 1.
A, W Version2
Min Typ
B Version2
Min Typ
Parameter1
DC PERFORMANCE3, 4
Max
Max
Unit
Test Conditions/Comments
AD5304
Resolution
8
8
Bits
Relative Accuracy
Differential Nonlinearity
0.15
0.02
1
0.25
0.15
0.02
0.625 LSB
0.25
LSB
Guaranteed monotonic by
design over all codes
AD5314
Resolution
Relative Accuracy
Differential Nonlinearity
10
0.5
0.05
10
0.5
0.05
Bits
LSB
LSB
4
0.5
2.5
0.5
Guaranteed monotonic by
design over all codes
AD5324
Resolution
Relative Accuracy
Differential Nonlinearity
12
2
0.2
12
2
0.2
Bits
LSB
LSB
16
1
10
1
Guaranteed monotonic by
design over all codes
Offset Error
Gain Error
0.4
0.15
3
1
0.4
0.15
3
1
% of FSR See Figure 2 and Figure 3
% of FSR See Figure 2 and Figure 3
Lower Dead Band
20
60
20
60
mV
Lower dead band exists only
if offset error is negative
Offset Error Drift5
Gain Error Drift5
–12
–5
–12
–5
ppm of
FSR/°C
ppm of
FSR/°C
DC Power Supply Rejection
Ratio5
–60
200
–60
200
dB
ΔVDD = 10%
DC Crosstalk5
μV
RL = 2 kΩ to GND or VDD
DAC REFERENCE INPUTS5
VREF Input Range
VREF Input Impedance
0.25
37
VDD
0.25
37
VDD
V
45
>10
–90
45
>10
–90
kΩ
MΩ
dB
Normal operation
Power-down mode
Frequency = 10 kHz
Reference Feedthrough
OUTPUT CHARACTERISTICS5
Minimum Output Voltage6
0.001
0.001
V
Measurement of the
minimum and maximum
V drive capability of the
output amplifier
Maximum Output Voltage6
VDD – 0.001
VDD – 0.001
DC Output Impedance
Short Circuit Current
0.5
25
16
0.5
25
16
Ω
mA
mA
μs
VDD = 5 V
VDD = 3 V
Coming out of power-
down mode VDD = 5 V
Power-Up Time
2.5
2.5
5
5
μs
Coming out of power-
down mode VDD = 3 V
Rev. H | Page 3 of 24
AD5304/AD5314/AD5324
Data Sheet
A, W Version2
Min Typ
B Version2
Min Typ
Parameter1
LOGIC INPUTS5
Max
Max
Unit
Test Conditions/Comments
Input Current
VIL, Input Low Voltage
1
0.8
0.6
0.5
1
0.8
0.6
0.5
μA
V
V
VDD = 5 V 10%
VDD = 3 V 10%
VDD = 2.5 V
V
VIH, Input High Voltage
2.4
2.1
2.0
2.4
2.1
2.0
V
V
V
VDD = 5 V 10%
VDD = 3 V 10%
VDD = 2.5 V
Pin Capacitance
POWER REQUIREMENTS
VDD
3
3
pF
2.5
5.5
2.5
5.5
V
IDD (Normal Mode)7
VDD = 4.5 V to 5.5 V
VDD = 2.5 V to 3.6 V
IDD (Power-Down Mode)
VDD = 4.5 V to 5.5 V
VDD = 2.5 V to 3.6 V
600
500
900
700
600
500
900
700
μA
μA
VIH = VDD and VIL = GND
VIH = VDD and VIL = GND
0.2
0.08
1
1
0.2
0.08
1
1
μA
μA
VIH = VDD and VIL = GND
VIH = VDD and VIL = GND
1 See the Terminology section.
2 Temperature range (A, B, W Version): −40°C to +105°C; typical at +25°C.
3 DC specifications tested with the outputs unloaded.
4 Linearity is tested using a reduced code range: AD5304 (Code 8 to Code 248); AD5314 (Code 28 to Code 995); AD5324 (Code 115 to Code 3981).
5 Guaranteed by design and characterization, not production tested.
6 For the amplifier output to reach its minimum voltage, offset error must be negative. For the amplifier output to reach its maximum voltage, VREF = VDD and offset plus
gain error must be positive.
7 IDD specification is valid for all DAC codes; interface inactive; all DACs active; load currents excluded.
AC CHARACTERISTICS
VDD = 2.5 V to 5.5 V; RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications TMIN to TMAX, unless otherwise noted.
Table 2.
A, B, W Version3
Parameter1, 2
Min
Typ
Max
Unit
Test Conditions/Comments
Output Voltage Settling Time
AD5304
AD5314
VREF = VDD = 5 V
6
7
8
8
9
10
μs
μs
μs
¼ scale to ¾ scale change (0x40 to 0xC0)
¼ scale to ¾ scale change (0x100 to 0x300)
¼ scale to ¾ scale change (0x400 to 0xC00)
AD5324
Slew Rate
0.7
12
1
1
3
V/μs
nV-sec
nV-sec
nV-sec
nV-sec
kHz
Major-Code Transition Glitch Energy
Digital Feedthrough
Digital Crosstalk
DAC-to-DAC Crosstalk
Multiplying Bandwidth
Total Harmonic Distortion
1 LSB change around major carry
200
–70
VREF = 2 V 0.1 V p-p
VREF = 2.5 V 0.1 V p-p; frequency = 10 kHz
dB
1 See the Terminology section.
2 Guaranteed by design and characterization, not production tested.
3 Temperature range (A, B, W Version): −40°C to +105°C; typical at +25°C.
Rev. H | Page 4 of 24
Data Sheet
AD5304/AD5314/AD5324
TIMING CHARACTERISTICS
VDD = 2.5 V to 5.5 V; all specifications TMIN to TMAX, unless otherwise noted.
Table 3.
Limit at TMIN, TMAX
Parameter1, 2, 3
VDD = 2.5 V to 3.6 V
VDD = 3.6 V to 5.5 V
Unit
Test Conditions/Comments
t1
t2
t3
t4
t5
t6
t7
t8
40
16
16
16
5
33
13
13
13
5
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
SCLK cycle time
SCLK high time
SCLK low time
SYNC to SCLK falling edge setup time
Data setup time
Data hold time
SCLK falling edge to SYNC rising edge
Minimum SYNC high time
4.5
0
4.5
0
80
33
1 Guaranteed by design and characterization, not production tested.
2 All input signals are specified with tr = tf = 5 ns (10% to 90 % of VDD) and timed from a voltage level of (VIL + VIH)/2.
3 See Figure 2.
t1
SCLK
t2
t3
t8
t7
t4
SYNC
DIN
t6
DB15
t5
DB0
Figure 2. Serial Interface Timing Diagram
Rev. H | Page 5 of 24
AD5304/AD5314/AD5324
Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 4.
Parameter1
Rating
VDD to GND
–0.3 V to +7 V
Digital Input Voltage to GND
Reference Input Voltage to GND
VOUTA through VOUTD to GND
Operating Temperature Range
Industrial (A, B, W Version)
Storage Temperature Range
Junction Temperature (TJ max)
10-Lead MSOP
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
–40°C to +105°C
–65°C to +150°C
150°C
ESD CAUTION
Power Dissipation
(TJ max – TA)/ θJA
206°C/W
44°C/W
θJA Thermal Impedance
θJC Thermal Impedance
10-Lead LFCSP
Power Dissipation
θJA Thermal Impedance
Reflow Soldering
(TJ max – TA)/ θJA
84°C/W
Peak Temperature (Pb-free)
Peak Temperature (non Pb-free)
Time at Peak Temperature
260°C
220°C
10 sec to 40 sec
1 Transient currents of up to 100 mA do not cause SCR latch-up.
Rev. H | Page 6 of 24
Data Sheet
AD5304/AD5314/AD5324
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
V
10 SYNC
DD
AD5304/
AD5314/
AD5324
2
3
4
5
V
V
V
A
B
C
9
8
7
6
SCLK
DIN
OUT
OUT
OUT
TOP VIEW
GND
(Not to Scale)
REFIN
V
D
OUT
V
1
2
3
4
5
10 SYNC
DD
AD5304/
AD5314/
AD5324
V
V
V
A
B
C
9
8
7
6
SCLK
DIN
OUT
OUT
OUT
NOTES
1. THE EXPOSED PAD IS THE GROUND REFERENCE POINT
FOR ALL CIRCUITRY ON THE PART. IT CAN BE
GND
TOP VIEW
CONNECTED TO 0 V OR LEFT UNCONNECTED PROVIDED
THERE IS A CONNECTION TO 0 V VIA THE GND PIN.
(Not to Scale)
REFIN
V
D
OUT
Figure 4. 10-Lead LFCSP Pin Configuration
Figure 3. 10-Lead MSOP Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
Mnemonic Description
1
2
3
4
5
6
7
8
VDD
Power Supply Input. These parts can be operated from 2.5 V to 5.5 V and the supply can be decoupled to GND.
Buffered Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
Buffered Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
Buffered Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation.
Reference Input Pin for All Four DACs. It has an input range from 0.25 V to VDD.
Buffered Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation.
Ground Reference Point for All Circuitry on the Part.
Serial Data Input. This device has a 16-bit shift register. Data is clocked into the register on the falling edge of the
serial clock input. The DIN input buffer is powered down after each write cycle.
VOUT
VOUT
VOUT
REFIN
VOUT
A
B
C
D
GND
DIN
9
SCLK
SYNC
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. Data can
be transferred at clock speeds up to 30 MHz. The SCLK input buffer is powered down after each write cycle.
Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes low, it
enables the input shift register and data is transferred in on the falling edges of the following 16 clocks. If SYNC is
taken high before the 16th falling edge of SCLK, the rising edge of SYNC acts as an interrupt and the write
sequence is ignored by the device.
10
Exposed
Paddle1
Ground Reference Point for All Circuitry on the Part. Can be connected to 0 V or left unconnected provided there is
a connection to 0 V via the GND pin.
1 For the 10-Lead LFCSP only.
Rev. H | Page 7 of 24
AD5304/AD5314/AD5324
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
1.0
0.3
0.2
T
V
= 25°C
T = 25°C
A
A
= 5V
V
= 5V
DD
DD
0.5
0
0.1
0
–0.1
–0.2
–0.3
–0.5
–1.0
0
50
100
150
200
250
0
50
100
150
200
250
1000
4000
CODE
CODE
Figure 5. AD5304 Typical INL Plot
Figure 8. AD5304 Typical DNL Plot
3
2
0.6
0.4
T
V
= 25°C
T = 25°C
A
A
= 5V
V
= 5V
DD
DD
1
0.2
0
0
–1
–2
–3
–0.2
–0.4
–0.6
0
200
400
600
800
1000
0
200
400
600
800
CODE
CODE
Figure 6. AD5314 Typical INL Plot
Figure 9. AD5314 Typical DNL Plot
12
8
1.0
0.5
T
V
= 25°C
T = 25°C
A
V
A
= 5V
= 5V
DD
DD
4
0
0
–4
–8
–12
–0.5
–1.0
0
500
1000
1500
2000
2500
3000
3500
4000
0
500
1000
1500
2000
2500
3000
3500
CODE
CODE
Figure 7. AD5324 Typical INL Plot
Figure 10. AD5324 Typical DNL Plot
Rev. H | Page 8 of 24
Data Sheet
AD5304/AD5314/AD5324
0.50
0.2
0.1
T
V
= 25°C
A
T
V
= 25°C
A
GAIN ERROR
= 2V
REF
= 5V
DD
MAX INL
0.25
0
0
–0.1
–0.2
–0.3
–0.4
–0.5
–0.6
MAX DNL
MIN DNL
–0.25
–0.50
MIN INL
OFFSET ERROR
0
1
2
3
4
5
0
1
2
3
4
5
6
V
(V)
V
(V)
REF
DD
Figure 11. AD5304 INL and DNL Error vs. VREF
Figure 14. Offset Error and Gain Error vs. VDD
0.5
0.4
5
4
3
2
1
0
V
V
= 5V
= 3V
DD
5V SOURCE
REF
0.3
MAX INL
0.2
3V SOURCE
0.1
MAX DNL
MIN DNL
0
–0.1
–0.2
–0.3
–0.4
–0.5
5V SINK
3V SINK
MIN INL
–40
0
40
TEMPERATURE (°C)
80
120
0
1
2
3
4
5
6
SINK/SOURCE CURRENT (mA)
Figure 12. AD5304 INL Error and DNL Error vs. Temperature
Figure 15. VOUT Source and Sink Current Capability
1.0
600
500
400
300
200
100
0
T
V
V
= 25°C
= 5V
V
V
= 5V
= 2V
A
DD
REF
DD
= 2V
REF
0.5
GAIN ERROR
0
OFFSET ERROR
–0.5
–1.0
–40
0
40
80
120
ZERO SCALE
FULL SCALE
TEMPERATURE (°C)
CODE
Figure 13. AD5304 Offset Error and Gain Error vs. Temperature
Figure 16. Supply Current vs. DAC Code
Rev. H | Page 9 of 24
AD5304/AD5314/AD5324
Data Sheet
600
T
= 25°C
A
V
V
= 5V
–40°C
DD
= 5V
REF
500
CH1
V
A
+25°C
OUT
400
300
200
100
0
+105°C
SCLK
CH2
CH1 1V, CH2 5V, TIME BASE = 1µs/DIV
2.5
3.0
3.5
4.0
(V)
4.5
5.0
5.5
V
DD
Figure 17. Supply Current vs. Supply Voltage
Figure 20. Half-Scale Settling (¼ to ¾ Scale Code Change)
0.5
0.4
0.3
0.2
0.1
0
T
V
V
= 25°C
A
= 5V
DD
= 2V
REF
V
CH1
CH2
DD
–40°C
+25°C
V
A
OUT
+105°C
CH1 2V, CH2 200mV, TIME BASE = 200µs/DIV
2.5
3.0
3.5
4.0
(V)
4.5
5.0
5.5
V
DD
Figure 18. Power-Down Current vs. Supply Voltage
Figure 21. Power-On Reset to 0 V
1000
900
800
700
600
500
400
T
V
V
= 25°C
A
= 5V
T
= 25°C
DD
A
= 2V
REF
V
A
CH1
CH2
OUT
V
= 5V
DD
SCLK
V
= 3V
DD
CH1 500mV, CH2 5V, TIME BASE = 1µs/DIV
0
0.5
1.0
1.5
2.0
2.5
3.0
(V)
3.5
4.0
4.5
5.0
V
LOGIC
Figure 19. Supply Current vs. Logic Input Voltage
Figure 22. Exiting Power-Down to Midscale
Rev. H | Page 10 of 24
Data Sheet
AD5304/AD5314/AD5324
0.02
0.01
0
V
= 5V
= 25°C
DD
T
A
V
= 3V
V
= 5V
DD
DD
–0.01
–0.02
300
350
400
450
500
550
600
0
1
2
3
4
5
6
I
(µA)
DD
V
(V)
REF
Figure 23. IDD Histogram with VDD = 3 V and VDD = 5 V
Figure 26. Full-Scale Error vs. VREF
2.50
2.49
2.48
2.47
150ns/DIV
1µs/DIV
Figure 24. AD5324 Major-Code Transition Glitch Energy
Figure 27. DAC-to-DAC Crosstalk
10
0
–10
–20
–30
–40
–50
–60
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
Figure 25. Multiplying Bandwidth (Small-Signal Frequency Response)
Rev. H | Page 11 of 24
AD5304/AD5314/AD5324
TERMINOLOGY
Data Sheet
Major-Code Transition Glitch Energy
Relative Accuracy or Integral Nonlinearity (INL)
For the DAC, relative accuracy or integral nonlinearity (INL)
is a measure of the maximum deviation, in LSB, from a straight
line passing through the endpoints of the DAC transfer function.
Typical INL vs. code plots can be seen in Figure 5, Figure 6,
and Figure 7.
Major-code transition glitch energy is the energy of the impulse
injected into the analog output when the code in the DAC register
changes state. It is normally specified as the area of the glitch in
nV-s and is measured when the digital code is changed by 1 LSB
at the major carry transition (011 . . . 11 to 100 . . . 00 or 100 . . .
00 to 011 . . . 11).
Differential Nonlinearity
Digital Feedthrough
Differential nonlinearity (DNL) is the difference between the
measured change and the ideal 1 LSB change between any two
adjacent codes. A specified differential nonlinearity of 1 LSB
maximum ensures monotonicity. This DAC is guaranteed mono-
tonic by design. Typical DNL vs. code plots can be seen in Figure 8,
Figure 9, and Figure 10.
Digital feedthrough is a measure of the impulse injected into the
analog output of the DAC from the digital input pins of the
SYNC
device when the DAC output is not being written to (
held high). It is specified in nV-s and is measured with a worst-
case change on the digital input pins (for example, from all 0s
to all 1s or vice versa.)
Offset Error
Digital Crosstalk
This is a measure of the offset error of the DAC and the output
amplifier. It is expressed as a percentage of the full-scale range.
This is the glitch impulse transferred to the output of one DAC
at midscale in response to a full-scale code change (all 0s to all
1s and vice versa) in the input register of another DAC. It is
expressed in nV-s.
Gain Error
This is a measure of the span error of the DAC. It is the deviation
in slope of the actual DAC transfer characteristic from the ideal
expressed as a percentage of the full-scale range.
DAC-to-DAC Crosstalk
This is the glitch impulse transferred to the output of one DAC
due to a digital code change and subsequent output change of
another DAC. This includes both digital and analog crosstalk.
It is measured by loading one of the DACs with a full-scale code
Offset Error Drift
This is a measure of the change in offset error with changes in
temperature. It is expressed in (ppm of full-scale range)/°C.
Gain Error Drift
This is a measure of the change in gain error with changes in
temperature. It is expressed in (ppm of full-scale range)/°C.
LDAC
change (all 0s to all 1s and vice versa) with the
bit set low
and monitoring the output of another DAC. The energy of the
glitch is expressed in nV-s.
Power Supply Rejection Ratio (PSRR)
Multiplying Bandwidth
This indicates how the output of the DAC is affected by changes
in the supply voltage. PSRR is the ratio of the change in VOUT to
a change in VDD for full-scale output of the DAC. It is measured
in decibels. VREF is held at 2 V and VDD is varied 10ꢀ.
The amplifiers within the DAC have a finite bandwidth. The
multiplying bandwidth is a measure of this. A sine wave on the
reference (with full-scale code loaded to the DAC) appears on
the output. The multiplying bandwidth is the frequency at which
the output amplitude falls to 3 dB below the input.
DC Crosstalk
This is the dc change in the output level of one DAC at midscale
in response to a full-scale code change (all 0s to all 1s and vice
versa) and output change of another DAC. It is expressed in
microvolts.
Total Harmonic Distortion (THD)
This is the difference between an ideal sine wave and its attenuated
version using the DAC. The sine wave is used as the reference for
the DAC and the THD is a measure of the harmonics present on
the DAC output. It is measured in decibels.
Reference Feedthrough
This is the ratio of the amplitude of the signal at the DAC output to
the reference input when the DAC output is not being updated.
It is expressed in decibels.
Rev. H | Page 12 of 24
Data Sheet
AD5304/AD5314/AD5324
GAIN ERROR
PLUS
OFFSET ERROR
OUTPUT
VOLTAGE
IDEAL
ACTUAL
NEGATIVE
OFFSET
ERROR
DAC CODE
GAIN ERROR
PLUS
OFFSET ERROR
DEAD BAND
CODES
ACTUAL
OUTPUT
VOLTAGE
AMPLIFIER
FOOTROOM
(1mV)
IDEAL
NEGATIVE
OFFSET
ERROR
POSITIVE
OFFSET
DAC CODE
Figure 28. Transfer Function with Negative Offset
Figure 29. Transfer Function with Positive Offset
Rev. H | Page 13 of 24
AD5304/AD5314/AD5324
Data Sheet
THEORY OF OPERATION
FUNCTIONAL DESCRIPTION
R
R
R
The AD5304/AD5314/AD5324 are quad, resistor-string DACs
fabricated on a CMOS process with resolutions of 8, 10, and 12
bits, respectively. Each contains four output buffer amplifiers and
is written to via a 3-wire serial interface. They operate from single
supplies of 2.5 V to 5.5 V, and the output buffer amplifiers provide
rail-to-rail output swing with a slew rate of 0.7 V/ꢁs. The four
DACs share a single reference input pin. The devices have pro-
grammable power-down modes, in which all DACs can be turned
off completely with a high impedance output.
TO OUTPUT
AMPLIFIER
R
R
Figure 31. Resistor String
Digital-to-Analog
DAC Reference Inputs
The architecture of one DAC channel consists of a resistor-string
DAC followed by an output buffer amplifier. The voltage at the
REFIN pin provides the reference voltage for the DAC. Figure 30
shows a block diagram of the DAC architecture. Since the input
coding to the DAC is straight binary, the ideal output voltage is
given by
There is a single reference input pin for the four DACs. The
reference input is not buffered. The user can have a reference
voltage as low as 0.25 V or as high as VDD because there is no
restriction due to the headroom or footroom requirements of
any reference amplifier. It is recommended to use a buffered
reference in the external circuit (for example, REF192). The
input impedance is typically 45 kΩ.
V
REF D
VOUT
2N
Output Amplifier
where
The output buffer amplifier is capable of generating rail-to-rail
voltages on its output, giving an output range of 0 V to VDD when
the reference is VDD. It is capable of driving a load of 2 kΩ to
GND or VDD, in parallel with 500 pF to GND or VDD. The source
and sink capabilities of the output amplifier can be seen in the
plot in Figure 15.
D = decimal equivalent of the binary code that is loaded to the
DAC register:
0–255 for AD5304 (8 bits)
0–1023 for AD5314 (10 bits)
0–4095 for AD5324 (12 bits)
The slew rate is 0.7 V/ꢁs with a half-scale settling time to
0.5 LSB (at eight bits) of 6 ꢁs.
N = DAC resolution.
REFIN
POWER-ON RESET
The AD5304/AD5314/AD5324 are provided with a power-on reset
function, so that they power up in a defined state. The power-on
state uses normal operation and an output voltage set to 0 V.
INPUT
REGISTER
DAC
REGISTER
RESISTOR
STRING
V
A
OUT
OUTPUT BUFFER
AMPLIFIER
Both input and DAC registers are filled with zeros and remain
so until a valid write sequence is made to the device. This is
particularly useful in applications where it is important to know
the state of the DAC outputs while the device is powering up.
Figure 30. DAC Channel Architecture
Resistor String
The resistor string section is shown in Figure 31. It is simply a
string of resistors, each of value R. The digital code loaded to the
DAC register determines at which node on the string the voltage
is tapped off to be fed into the output amplifier. The voltage is
tapped off by closing one of the switches connecting the string
to the amplifier. Because it is a string of resistors, it is guaranteed
monotonic.
SERIAL INTERFACE
The AD5304/AD5314/AD5324 are controlled over a versatile,
3-wire serial interface that operates at clock rates up to 30 MHz
and are compatible with SPI, QSPI, MICROWIRE, and DSP
interface standards.
Rev. H | Page 14 of 24
Data Sheet
AD5304/AD5314/AD5324
BIT15
(MSB)
BIT0
(LSB)
A1 A0 PD LDAC D7 D6 D5 D4 D3 D2 D1 D0
DATA BITS
0
0
X
X
Figure 32. AD5304 Input Shift Register Contents
BIT15
(MSB)
BIT0
(LSB)
A1 A0 PD LDAC D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
X
X
DATA BITS
Figure 33. AD5314 Input Shift Register Contents
BIT15
(MSB)
BIT0
(LSB)
A1 A0 PD LDAC D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
DATA BITS
Figure 34. AD5324 Input Shift Register Contents
Input Shift Register
SYNC
The
input is a level-triggered input that acts as a frame
synchronization signal and chip enable. Data can be transferred
SYNC
The input shift register is 16 bits wide. Data is loaded into the
device as a 16-bit word under the control of a serial clock input,
SCLK. See Figure 2 for the timing diagram of this operation. The
16-bit word consists of four control bits followed by 8, 10, or 12
bits of DAC data, depending on the device type. Data is loaded
MSB first (Bit 15) and the first two bits determine whether the
data is for DAC A, DAC B, DAC C, or DAC D. Bit 13 and Bit 12
into the device only while
is low. To start the serial data
SYNC
SYNC
transfer, take
low, observing the minimum
to SCLK
SYNC
falling edge setup time, t4. After
goes low, serial data shifts
into the device’s input shift register on the falling edges of SCLK
for 16 clock pulses. Any data and clock pulses after the 16th falling
edge of SCLK are ignored because the SCLK and DIN input buffers
are powered down. No further serial data transfer occurs until
PD
control the operating mode of the DAC. Bit 13 is
mines whether the part is in normal or power-down mode. Bit 12 is
LDAC
, and deter-
SYNC
is taken high and low again.
, and controls when DAC registers and outputs are updated.
Table 6. Address Bits
th
SYNC
can be taken high after the falling edge of the 16 SCLK
SYNC
pulse, observing the minimum SCLK falling edge to
rising edge time, t7.
A1
A0
DAC Addressed
0
0
1
1
0
1
0
1
DAC A
DAC B
DAC C
DAC D
After the end of the serial data transfer, data automatically transfers
from the input shift register to the input register of the selected
th
SYNC
DAC. If
is taken high before the 16 falling edge of SCLK,
the data transfer is aborted and the DAC input registers are not
updated.
Address and Control Bits
When data has been transferred into three of the DAC input
registers, all DAC registers and all DAC outputs are simultaneously
PD
0: All four DACs go into power-down mode, consuming
only 200 nA @ 5 V. The DAC outputs enter a high
impedance state.
LDAC
updated by setting
DAC input register.
low when writing to the remaining
1: Normal operation.
Low Power Serial Interface
LDAC
0: All four DAC registers and, therefore, all DAC outputs
updated simultaneously on completion of the write
sequence.
To reduce the power consumption of the device even further, the
interface fully powers up only when the device is being written
SYNC
to, that is, on the falling edge of
. As soon as the 16-bit
1: Only addressed input register is updated. There is
no change in the content of the DAC registers.
control word has been written to the part, the SCLK and DIN
input buffers are powered down. They power up again only
The AD5324 uses all 12 bits of DAC data; the AD5314 uses 10 bits
and ignores the 2 LSB Bits. The AD5304 uses eight bits and ignores
the last four bits. The data format is straight binary, with all 0s
corresponding to 0 V output and all 1s corresponding to full-scale
output (VREF − 1 LSB).
SYNC
following a falling edge of
.
Rev. H | Page 15 of 24
AD5304/AD5314/AD5324
Data Sheet
The bias generator, the output amplifier, the resistor string, and
all other associated linear circuitry are shut down when the power-
down mode is activated. However, the contents of the registers
are unaffected when in power-down. The time to exit power-down
is typically 2.5 ꢁs for VDD = 5 V and 5 ꢁs when VDD = 3 V. This is
the time from the falling edge of the 16th SCLK pulse to when
the output voltage deviates from its power down voltage. See
Figure 22 for a plot.
Double-Buffered Interface
The AD5304/AD5314/AD5324 DACs have double-buffered inter-
faces consisting of two banks of registers—input registers and
DAC registers. The input register is directly connected to the input
shift register and the digital code is transferred to the relevant input
register on completion of a valid write sequence. The DAC
register contains the digital code used by the resistor string.
LDAC
Access to the DAC register is controlled by the
bit. When
bit is set high, the DAC register is latched and hence
the input register can change state without affecting the contents of
LDAC
AMPLIFIER
LDAC
the
RESISTOR
STRING DAC
V
OUT
the DAC register. However, when the
bit is set low, all DAC
registers are updated after a complete write sequence.
POWER-DOWN
CIRCUITRY
This is useful if the user requires simultaneous updating of all
DAC outputs. The user can write to three of the input registers
Figure 35. Output Stage during Power-Down
LDAC
individually and then, by setting the
bit low when
MICROPROCESSOR INTERFACING
AD5304/AD5314/AD5324 to ADSP-21xx
writing to the remaining DAC input register, all outputs
update simultaneously.
Figure 36 shows a serial interface between the AD5304/AD5314/
AD5324 and the ADSP-21xx family. The ADSP-21xx is set up
to operate in the SPORT transmit alternate framing mode. The
ADSP-21xx sport is programmed through the SPORT control
register and must be configured as follows: internal clock operation,
active-low framing, and 16-bit word length. Transmission is
initiated by writing a word to the Tx register after the SPORT
has been enabled. The data is clocked out on each rising edge of
the DSP’s serial clock and clocked into the AD5304/AD5314/
AD5324 on the falling edge of the DAC’s SCLK.
These parts contain an extra feature whereby the DAC register
is not updated unless its input register has been updated since
LDAC
LDAC
the last time that
was brought low. Normally, when
is brought low, the DAC registers are filled with the contents of
the input registers. In the case of the AD5304/AD5314/AD5324,
the part updates the DAC register only if the input register has
been changed since the last time the DAC register was updated,
thereby removing unnecessary digital crosstalk.
POWER-DOWN MODE
The AD5304/AD5314/AD5324 have low power consumption,
dissipating only 1.5 mW with a 3 V supply and 3 mW with a
5 V supply. Power consumption can be further reduced when
the DACs are not in use by putting them into power-down mode,
ADSP-21xx*
AD5304/
AD5314/
AD5324*
TFS
DT
SYNC
DIN
PD
selected by a 0 on Bit 13 ( ) of the control word.
PD
SCLK
SCLK
When the
bit is set to 1, all DACs work normally with a typical
power consumption of 600 ꢁA at 5 V (500 ꢁA at 3 V). However, in
power-down mode, the supply current falls to 200 nA at 5 V
(80 nA at 3 V) when all DACs are powered down. Not only does
the supply current drop, but also the output stage is internally
switched from the output of the amplifier, making it open-circuit.
This has the advantage that the output is three-stated while the
part is in power-down mode, and provides a defined input
condition for whatever is connected to the output of the DAC
amplifier. The output stage is illustrated in Figure 35.
*ADDITIONAL PINS OMITTED FOR CLARITY.
Figure 36. AD5304/AD5314/AD5324 to ADSP-21xx Interface
Rev. H | Page 16 of 24
Data Sheet
AD5304/AD5314/AD5324
AD5304/AD5314/AD5324 to 68HC11/68L11 Interface
only in 8-bit bytes; thus only eight falling clock edges occur in
the transmit cycle. To load data to the DAC, P3.3 is left low after
the first eight bits are transmitted, and a second write cycle is
initiated to transmit the second byte of data. P3.3 is taken high
following the completion of this cycle. The 80C51/80L51 outputs
the serial data in a format that has the LSB first. The AD5304/
AD5314/AD5324 requires its data with the MSB as the first bit
received. The 80C51/80L51 transmit routine takes this into
account.
Figure 37 shows a serial interface between the AD5304/AD5314/
AD5324 and the 68HC11/68L11 microcontroller. SCK of the
68HC11/68L11 drives the SCLK of the AD5304/AD5314/AD5324,
while the MOSI output drives the serial data line (DIN) of the
SYNC
DAC. The
signal is derived from a port line (PC7). The
setup conditions for the correct operation of this interface are as
follows: the 68HC11/68L11 is configured so that its CPOL bit is
a 0 and its CPHA bit is a 1. When data is being transmitted to the
SYNC
DAC, the
line is taken low (PC7). When the 68HC11/68L11
80C51/80L51*
AD5304/
AD5314/
AD5324*
is configured as above, data appearing on the MOSI output is
valid on the falling edge of SCK. Serial data from the 68HC11/
68L11 is transmitted in 8-bit bytes with only eight falling clock
edges occurring in the transmit cycle. Data is transmitted MSB
first. To load data to the AD5304/ AD5314/AD5324, PC7 is left
low after the first eight bits are transferred, a second serial write
operation is performed to the DAC, and PC7 is taken high at
the end of this procedure.
P3.3
TxD
RxD
SYNC
SCLK
DIN
*ADDITIONAL PINS OMITTED FOR CLARITY.
Figure 38. AD5304/AD5314/AD5324 to 80C51/80L51 Interface
AD5304/AD5314/AD5324 to MICROWIRE Interface
68HC11/68L11*
AD5304/
AD5314/
AD5324*
Figure 39 shows an interface between the AD5304/AD5314/
AD5324 and any MICROWIRE-compatible device. Serial data
is shifted out on the falling edge of the serial clock, SK, and is
clocked into the AD5304/AD5314/AD5324 on the rising edge
of SK, which corresponds to the falling edge of the DAC’s SCLK.
PC7
SCK
SYNC
SCLK
DIN
MOSI
MICROWIRE*
AD5304/
AD5314/
AD5324*
*ADDITIONAL PINS OMITTED FOR CLARITY.
Figure 37. AD5304/AD5314/AD5324 to 68HC11/68L11 Interface
CS
SK
SO
SYNC
AD5304/AD5314/AD5324 to 80C51/80L51 Interface
Figure 38 shows a serial interface between the AD5304/AD5314/
AD5324 and the 80C51/80L51 microcontroller. The setup for
the interface is as follows: TxD of the 80C51/80L51 drives SCLK
of the AD5304/AD5314/AD5324, while RxD drives the serial
SCLK
DIN
*ADDITIONAL PINS OMITTED FOR CLARITY.
SYNC
data line of the part. The
signal is again derived from a
Figure 39. AD5304/AD5314/AD5324 to MICROWIRE Interface
bit-programmable pin on the port. In this case, port line P3.3 is
used. When data is to be transmitted to the AD5304/AD5314/
AD5324, P3.3 is taken low. The 80C51/80L51 transmits data
Rev. H | Page 17 of 24
AD5304/AD5314/AD5324
Data Sheet
APPLICATIONS INFORMATION
Bipolar Operation Using the AD5304/AD5314/AD5324
TYPICAL APPLICATION CIRCUIT
The AD5304/AD5314/AD5324 have been designed for single
supply operation, but a bipolar output range is also possible
using the circuit in Figure 41. This circuit gives an output voltage
range of 5 V. Rail-to-rail operation at the amplifier output is
achievable using an AD820 or an OP295 as the output amplifier.
R2 = 10kΩ
The AD5304/AD5314/AD5324 can be used with a wide range
of reference voltages where the devices offer full, one-quadrant
multiplying capability over a reference range of 0 V to VDD
.
More typically, these devices are used with a fixed, precision
reference voltage. Suitable references for 5 V operation are the
AD780 and REF192 (2.5 V references). For 2.5 V operation, a
suitable external reference would be the AD589, a 1.23 V band
gap reference. Figure 40 shows a typical setup for the AD5304/
AD5314/AD5324 when using an external reference.
+6V TO +16V
+5V
R1 = 10kΩ
10µF
0.1µF
AD820/
OP295
±5V
+5V
1µF
V
V
A
DD
OUT
V
= 2.5V TO 5.5V
REF195
DD
AD5304
V
IN
–5V
REFIN
GND
V
OUT
V
V
V
B
C
D
OUT
OUT
OUT
0.1µF
1µF
10µF
GND
AD5304/AD5314/
AD5324
V
IN
V
V
V
A
B
C
D
V
REFIN
OUT
OUT
OUT
OUT
OUT
DIN SCLK SYNC
EXTERNAL
REFERENCE
SCLK
DIN
AD790/REF192
WITH V = 5V
OR AD589 WITH
V
SERIAL
INTERFACE
DD
SYNC
V
= 2.5V
DD
Figure 41. Bipolar Operation with the AD5304
A0
GND
The output voltage for any input code can be calculated as follows:
SERIAL
INTERFACE
N
(REFIN D /2 ) (R1 R2)
VOUT
REFIN (R2/ R1)
Figure 40. AD5304/AD5314/AD5324 Using External Reference
R1
If an output range of 0 V to VDD is required, the simplest solution is
to connect the reference input to VDD. As this supply is not very
accurate and can be noisy, the AD5304/AD5314/AD5324 can
be powered from the reference voltage; for example, using a 5 V
reference such as the REF195. The REF195 can output a steady
supply voltage for the AD5304/AD5314/AD5324. The current
required from the REF195 is 600 ꢁA supply current and approxi-
mately 112 ꢁA into the reference input. This is with no load on
the DAC outputs. When the DAC outputs are loaded, the REF195
also needs to supply the current to the loads. The total current
required (with a 10 kΩ load on each output) is
where:
D is the decimal equivalent of the code loaded to the DAC.
N is the DAC resolution.
REFIN is the reference voltage input:
REFIN = 5 V, R1 = R2 = 10 kΩ
V
OUT = (10 × D/2N) − 5 V
712 ꢁA + 4 (5 V/10 kΩ) = 2.70 mA
The load regulation of the REF195 is typically 2 ppm/mA, resulting
in an error of 5.4 ppm (27 ꢁV) for the 2.7 mA current drawn from
it. This corresponds to a 0.0014 LSB error at eight bits and
0.022 LSB error at 12 bits.
Rev. H | Page 18 of 24
Data Sheet
AD5304/AD5314/AD5324
Opto-Isolated Interface for Process Control Applications
AD5304
SCLK
DIN
V
V
V
V
A
B
C
D
OUT
OUT
OUT
OUT
SYNC
DIN
The AD5304/AD5314/AD5324 have a versatile 3-wire serial
inter-face, making them ideal for generating accurate voltages
in process control and industrial applications. Due to noise,
safety requirements, or distance, it might be necessary to isolate
the AD5304/AD5314/AD5324 from the controller. This can
easily be achieved by using opto-isolators, which provide isolation
in excess of 3 kV. The actual data rate achieved is limited by the
type of optocouplers chosen. The serial loading structure of the
AD5304/AD5314/AD5324 makes them ideally suited for use in
opto-isolated applications. Figure 42 shows an opto-isolated
interface to the AD5304 where DIN, SCLK, and SYNC are driven
from optocouplers. The power supply to the part also needs to
be isolated. This is done by using a transformer. On the DAC
side of the transformer, a 5 V regulator provides the 5 V supply
required for the AD5304.
V
V
DD
CC
SCLK
1G 74HC139
ENABLE
AD5304
1Y0
1Y1
1Y2
1Y3
V
V
V
V
A
B
C
D
OUT
OUT
OUT
OUT
1A
1B
SYNC
DIN
CODED
ADDRESS
SCLK
DGND
AD5304
V
V
V
V
A
B
C
D
OUT
OUT
OUT
OUT
SYNC
DIN
SCLK
AD5304
V
V
V
V
A
B
C
D
OUT
OUT
OUT
OUT
SYNC
DIN
SCLK
5V
Figure 43. Decoding Multiple AD5304 Devices in a System
REGULATOR
10µF
0.1µF
POWER
AD5304/AD5314/AD5324 as a Digitally Programmable
Window Detector
V
DD
DD
DD
A digitally programmable upper/lower limit detector using two
DACs in the AD5304/AD5314/AD5324 is shown in Figure 44.
The upper and lower limits for the test are loaded to DAC A
and DAC B, which, in turn, set the limits on the CMP04. If the
signal at the VIN input is not within the programmed window,
an LED indicates the fail condition. Similarly, DAC C and DAC D
can be used for window detection on a second VIN signal.
5V
10kΩ
V
DD
SCLK
SCLK
REFIN
AD5304
V
10kΩ
V
A
B
C
D
OUT
OUT
OUT
OUT
SYNC
SYNC
V
V
V
0.1µF
10µF
V
1kΩ
1kΩ
IN
V
FAIL
PASS
V
DD
V
REFIN
10kΩ
REF
V
A
OUT
1/2
DIN
DIN
AD5304/AD5314/
AD5324*
1/2
CMP04
GND
PASS/FAIL
1/6 74HC05
SYNC
SYNC
DIN
DIN
V
B
OUT
Figure 42. AD5304 in an Opto-Isolated Interface
SCLK
SCLK
GND
DECODING MULTIPLE AD5304/AD5314/AD5324S
*ADDITIONAL PINS OMITTED FOR CLARITY.
SYNC
The
pin on the AD5304/AD5314/AD5324 can be used
Figure 44. Window Detection
in applications to decode a number of DACs. In this application, all
the DACs in the system receive the same serial clock and serial
SYNC
data, but
can only be active to one of the devices at any one
time, allowing access to four channels in this 16-channel system.
The 74HC139 is used as a 2-to-4-line decoder to address any of the
DACs in the system. To prevent timing errors, the enable input
must be brought to its inactive state while the coded address
inputs are changing state. Figure 43 shows a diagram of a typical
setup for decoding multiple AD5304 devices in a system.
Rev. H | Page 19 of 24
AD5304/AD5314/AD5324
Data Sheet
the common ceramic types that provide a low impedance path
to ground at high frequencies, to handle transient currents due
to internal logic switching.
POWER SUPPLY BYPASSING AND GROUNDING
In any circuit where accuracy is important, careful consideration of
the power supply and ground return layout helps to ensure the
rated performance. The printed circuit board on which the
AD5304/AD5314/AD5324 is mounted is designed so that the
analog and digital sections are separated and confined to certain
areas of the board. If the AD5304/AD5314/AD5324 are in a
system where multiple devices require an AGND-to-DGND
connection, the connection is made at one point only. The star
ground point is established as close as possible to the device. The
AD5304/AD5314/AD5324 has ample supply bypassing of 10 ꢁF in
parallel with 0.1 ꢁF on the supply located as close to the package as
possible, ideally right up against the device. The 10 ꢁF capacitors
are the tantalum bead type. The 0.1 ꢁF capacitor has low effective
series resistance (ESR) and effective series inductance (ESI), like
The power supply lines of the AD5304/AD5314/AD5324 use as
large a trace as possible to provide low impedance paths and reduce
the effects of glitches on the power supply line. Fast switching
signals such as clocks are shielded with digital ground to avoid
radiating noise to other parts of the board, and are never run
near the reference inputs. Avoid crossover of digital and analog
signals. Traces on opposite sides of the board run at right angles
to each other. This reduces the effects of feedthrough through
the board. A microstrip technique is by far the best, but is not
always possible with a double-sided board. In this technique,
the component side of the board is dedicated to a ground plane
while signal traces are placed on the solder side.
Table 7. Overview of AD53xx Serial Devices
Part No.
SINGLES
AD5300
AD5310
AD5320
AD5301
AD5311
AD5321
DUALS
AD5302
AD5312
AD5322
AD5303
AD5313
AD5323
QUADS
AD5304
AD5314
AD5324
AD5305
AD5315
AD5325
AD5306
AD5316
AD5326
AD5307
AD5317
AD5327
OCTALS
AD5308
AD5318
AD5328
Resolution
No. of DACs
DNL
0.25
0.5
1.0
0.25
0.5
1.0
Interface
Settling Time (ꢀs)
Package
Pins
8
1
1
1
1
1
1
SPI
SPI
SPI
2-Wire
2-Wire
2-Wire
4
6
8
6
7
8
SOT-23, MSOP
SOT-23, MSOP
SOT-23, MSOP
SOT-23, MSOP
SOT-23, MSOP
SOT-23, MSOP
6, 8
6, 8
6, 8
6, 8
6, 8
6, 8
10
12
8
10
12
8
2
2
2
2
2
2
0.25
0.5
1.0
0.25
0.5
1.0
SPI
SPI
SPI
SPI
SPI
SPI
6
7
8
6
7
8
MSOP
MSOP
MSOP
TSSOP
TSSOP
TSSOP
8
8
8
16
16
16
10
12
8
10
12
8
4
4
4
4
4
4
4
4
4
4
4
4
0.25
0.5
1.0
0.25
0.5
1.0
0.25
0.5
1.0
0.25
0.5
1.0
SPI
SPI
SPI
2-Wire
2-Wire
2-Wire
2-Wire
2-Wire
2-Wire
SPI
6
7
8
6
7
8
6
7
8
6
7
8
MSOP, LFCSP
MSOP, LFCSP
MSOP, LFCSP
MSOP
MSOP
MSOP
TSSOP
TSSOP
TSSOP
TSSOP
10
10
10
10
10
10
16
16
16
16
16
16
10
12
8
10
12
8
10
12
8
10
12
SPI
SPI
TSSOP
TSSOP
8
10
12
8
8
8
0.25
0.5
1.0
SPI
SPI
SPI
6
7
8
TSSOP
TSSOP
TSSOP
16
16
16
Rev. H | Page 20 of 24
Data Sheet
AD5304/AD5314/AD5324
Table 8. Overview of AD53xx Parallel Devices
Part No.
SINGLES
AD5330
AD5331
AD5340
AD5341
Resolution
DNL
VREF Pins
Settling Time (ꢀs)
Additional Pin Functions
Package
Pins
BUF
GAIN
✓
HBEN
CLR
✓
8
0.25
1
1
1
1
6
7
8
8
TSSOP
TSSOP
TSSOP
TSSOP
20
20
24
20
✓
10
12
12
0.5
1.0
1.0
✓
✓
✓
✓
✓
✓
✓
✓
✓
DUALS
AD5332
AD5333
AD5342
AD5343
QUADS
AD5334
AD5335
AD5336
AD5344
8
0.25
0.5
2
2
2
1
6
7
8
8
TSSOP
TSSOP
TSSOP
TSSOP
20
24
28
20
✓
✓
✓
✓
10
12
12
✓
✓
✓
✓
1.0
1.0
✓
✓
8
0.25
0.5
2
2
4
4
6
7
7
8
TSSOP
TSSOP
TSSOP
TSSOP
24
24
28
28
✓
✓
✓
✓
✓
10
10
12
0.5
1.0
Rev. H | Page 21 of 24
AD5304/AD5314/AD5324
OUTLINE DIMENSIONS
Data Sheet
3.10
3.00
2.90
10
1
6
5
5.15
4.90
4.65
3.10
3.00
2.90
PIN 1
IDENTIFIER
0.50 BSC
0.95
0.85
0.75
15° MAX
1.10 MAX
0.70
0.55
0.40
0.15
0.05
0.23
0.13
6°
0°
0.30
0.15
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-BA
Figure 45. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
2.48
2.38
2.23
3.10
3.00 SQ
0.50 BSC
2.90
6
10
PIN 1 INDEX
AREA
EXPOSED
PAD
1.74
1.64
1.49
0.50
0.40
0.30
5
1
PIN 1
INDICATOR
TOP VIEW
BOTTOM VIEW
(R 0.15)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.80
0.75
0.70
0.05 MAX
0.02 NOM
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.30
0.25
0.20
0.20 REF
Figure 46. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm x 3 mm Body, Very Very Thin, Dual Lead
(CP-10-9)
Dimensions shown in millimeters
Rev. H | Page 22 of 24
Data Sheet
AD5304/AD5314/AD5324
ORDERING GUIDE
Model1, 2
AD5304ARM
AD5304ARM-REEL7
AD5304ARMZ
AD5304ARMZ-REEL7
AD5304ACPZ-REEL7
AD5304BRM
AD5304BRM-REEL
AD5304BRM-REEL7
AD5304BRMZ
AD5304BRMZ-REEL
AD5304BRMZ-REEL7
AD5304BCPZ-REEL7
AD5314ACPZ-REEL7
AD5314ARM
AD5314ARM-REEL7
AD5314ARMZ
AD5314ARMZ-REEL7
AD5314WARMZ-REEL7
AD5314BCPZ-REEL7
AD5314BRM
AD5314BRM-REEL
AD5314BRM-REEL7
AD5314BRMZ
AD5314BRMZ-REEL
AD5314BRMZ-REEL7
AD5324ACPZ-REEL7
AD5324ARM
AD5324ARM-REEL7
AD5324ARMZ
AD5324ARMZ-REEL7
AD5324BCPZ-REEL7
AD5324BRM
AD5324BRM-REEL
AD5324BRM-REEL7
AD5324BRMZ
AD5324BRMZ-REEL
AD5324BRMZ-REEL7
Temperature Range
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
Package Description
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead LFCSP_WD
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead LFCSP_WD
10-Lead LFCSP_WD
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead LFCSP_WD
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead LFCSP_WD
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead LFCSP_WD
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
Package Option
RM-10
RM-10
RM-10
RM-10
CP-10-9
RM-10
RM-10
RM-10
RM-10
RM-10
RM-10
CP-10-9
CP-10-9
RM-10
RM-10
RM-10
RM-10
RM-10
CP-10-9
RM-10
RM-10
RM-10
RM-10
RM-10
RM-10
CP-10-9
RM-10
RM-10
RM-10
RM-10
CP-10-9
RM-10
RM-10
RM-10
RM-10
RM-10
RM-10
Branding
DBA
DBA
D9W
D9W
DBA#
DBB
DBB
DBB
DBB#
DBB#
DBB#
DBB#
DCA#
DCA
DCA
DCA#
DCA#
DCA#
DCB#
DCB
DCB
DCB
DCB#
DCB#
DCB#
DDA#
DDA
DDA
D8F
D8F
DDB#
DDB
DDB
DDB
DDB#
DDB#
DDB#
1 Z = RoHS Compliant Part; # denotes lead-free product can be top or bottom marked.
2 W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The AD5314WARMZ-REEL7 model is available with controlled manufacturing to support the quality and reliability requirements of
automotive applications. Note that this automotive model may have specifications that differ from the commercial models; therefore
designers should review the Specifications section of this data sheet carefully. Only the automotive grade product shown is available for
use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and
to obtain the specific Automotive Reliability reports for this model.
Rev. H | Page 23 of 24
AD5304/AD5314/AD5324
NOTES
Data Sheet
©2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00929-0-9/11(H)
Rev. H | Page 24 of 24
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