AD586JNZ [ADI]

High Precision 5 V Reference;
AD586JNZ
型号: AD586JNZ
厂家: ADI    ADI
描述:

High Precision 5 V Reference

文件: 总33页 (文件大小:489K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Complete Dual, 16-Bit, High Accuracy,  
Serial Input, Bipolar Voltage Output DACs  
Preliminary Technical Data  
AD5762R  
FEATURES  
GENERAꢀ DESCRIPTION  
Complete dual, 16-bit digital-to-analog  
converters (DACs)  
Programmable output range: 10 V, 10.2564 V,  
or 10.5263 V  
1 ꢀSB max INꢀ error, 1 ꢀSB max DNꢀ error  
ꢀow noise: 60 nV/√Hz  
Settling time: 10 µs max  
The AD5762R is a dual, 16-bit, serial input, bipolar voltage  
output digital-to-analog converter that operates from supply  
voltages of 11ꢀ. ꢁ up to 16ꢀ5 ꢀ Nominal full-scale output  
range is 1ꢂ ꢀ The AD5762R provides integrated output  
amplifiers, reference buffers and proprietary power-up/power-  
down control circuitryꢀ The parts also feature a digital I/O port,  
which is programmed via the serial interface and an analog  
temperature sensorꢀ The part incorporates digital offset and  
gain adjust registers per channelꢀ  
Integrated reference buffers  
Internal reference: 10 ppm/°C  
On-chip die temperature sensor  
Output control during power-up/brownout  
Programmable short-circuit protection  
Simultaneous updating via ꢀDAC  
Asynchronous CꢀR to zero code  
Digital offset and gain adjust  
The AD5762R is a high performance converter that offers  
guaranteed monotonicity, integral nonlinearity (INL) of 1 LSB,  
low noise, and 1ꢂ µs settling timeꢀ The AD5762R includes an  
on-chip 5 ꢁ reference with a reference tempco of 1ꢂ ppm/°C  
maximumꢀ During power-up (when the supply voltages are  
changing), ꢁOUT is clamped to ꢂ ꢁ via a low impedance pathꢀ  
ꢀogic output control pins  
DSP-/microcontroller-compatible serial interface  
Temperature range: −40°C to +85°C  
iCMOS™ process technology1  
The AD5762R uses a serial interface that operates at clock rates  
of up to 3ꢂ MHz and is compatible with DSP and  
microcontroller interface standardsꢀ Double buffering allows  
the simultaneous updating of all DACsꢀ The input coding is  
programmable to either twos complement or offset binary  
formatsꢀ The asynchronous clear function clears all DAC  
registers to either bipolar zero or zero scale depending on the  
coding usedꢀ The AD5762R is ideal for both closed-loop servo  
control and open-loop control applicationsꢀ The AD5762R is  
available in a 32-lead TQFP, and offers guaranteed  
APPꢀICATIONS  
Industrial automation  
Open-/closed-loop servo control  
Process control  
Data acquisition systems  
Automatic test equipment  
Automotive test and measurement  
High accuracy instrumentation  
specifications over the −.ꢂ°C to +85°C industrial temperature  
rangeꢀ See Figure 1, the functional block diagramꢀ  
1 For analog systems designers within industrial/instrumentation equipment  
OEMs who need high performance ICs at higher voltage levels, iCMOS is a  
technology platform that enables the development of analog ICs capable of  
30 V and operating at 15 V supplies while allowing dramatic reductions in  
power consumption and package size, and increased AC and DC  
performance.  
Rev. PrA  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2007 Analog Devices, Inc. All rights reserved.  
AD5762R  
Preliminary Technical Data  
TABLE OF CONTENTS  
Features ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 1  
Data Registerꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 25  
Coarse Gain Register ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 25  
Fine Gain Registerꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 25  
Offset Register ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 25  
Offset and Gain Adjustment Worked Exampleꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 27  
AD5762R Featuresꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 28  
Analog Output Control ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 28  
Digital Offset and Gain Controlꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 28  
Programmable Short-Circuit Protection ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 28  
Digital I/O Portꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 28  
die Temperature Sensorꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 28  
Local Ground Offset Adjustꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 28  
Applications Informationꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 29  
Typical Operating Circuit ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 29  
Layout Guidelinesꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 3ꢂ  
Galvanically Isolated Interface ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 3ꢂ  
Microprocessor Interfacingꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 3ꢂ  
Evaluation Boardꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 32  
Outline Dimensionsꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 33  
Ordering Guide ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 33  
Applicationsꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 1  
General Descriptionꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 1  
Revision History ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 2  
Functional Block Diagram ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 3  
Specificationsꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ .  
AC Performance Characteristicꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 6  
Timing Characteristicsꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 7  
Absolute Maximum Ratingsꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 1ꢂ  
ESD Cautionꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 1ꢂ  
Pin Configuration and Function Descriptionsꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 11  
Terminology ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 13  
Typical Performance Characteristics ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 15  
Theory of Operation ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 21  
DAC Architectureꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 21  
Reference Buffersꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 21  
Serial Interface ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 21  
Simultaneous Updating via  
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 22  
LDAC  
Transfer Functionꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 23  
Asynchronous Clear ( )ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 23  
CLR  
Function Register ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 2.  
REVISION HISTORY  
Preliminary Revision PrA December 10, 2007  
Rev. PrA | Page 2 of 33  
Preliminary Technical Data  
FUNCTIONAL BLOCK DIAGRAM  
AD5762R  
REFGND  
PGND AV  
AV  
AV  
AV  
SS  
REFA  
RSTOUT  
RSTIN  
REFOUT  
DD  
SS  
DD  
VOLTAGE  
MONITOR  
AND  
DV  
CC  
+5V  
REFERENCE  
REFERENCE  
BUFFERS  
AD5762R  
DGND  
CONTROL  
ISCC  
16  
G1  
G1  
16  
16  
INPUT  
REG A  
DAC  
REG A  
DAC A  
SDIN  
SCLK  
SYNC  
SDO  
VOUTA  
INPUT SHIFT  
REGISTER  
AND  
CONTROL  
LOGIC  
G2  
GAIN REG A  
AGNDA  
OFFSET REG A  
INPUT  
REG B  
DAC  
REG B  
DAC B  
VOUTB  
AGNDB  
D0  
D1  
G2  
GAIN REG B  
OFFSET REG B  
REFERENCE  
BUFFERS  
TEMP  
SENSOR  
BIN/2SCOMP  
REFB  
CLR  
LDAC  
TEMP  
Figure 1. Functional Block Diagram  
Rev. PrA | Page 3 of 33  
AD5762R  
Preliminary Technical Data  
SPECIFICATIONS  
ADD = 11ꢀ. ꢁ to 16ꢀ5 , ASS = −11ꢀ. ꢁ to −16ꢀ5 , AGND = DGND = REFGND = PGND = ꢂ ꢁ; REFA, REFB = 5 ꢁ external;  
DꢁCC = 2ꢀ7 ꢁ to 5ꢀ25 , RLOAD = 1ꢂ kΩ, CL = 2ꢂꢂ pFAll specifications TMIN to TMAX, unless otherwise notedꢀ  
Table 1.  
Parameter  
C Grade2  
Unit  
Test Conditions/Comments  
ACCURACY  
Outputs unloaded  
Resolution  
16  
1
1
Bits  
Relative Accuracy (INL)  
Differential Nonlinearity  
Bipolar Zero Error  
LSB max  
LSB max  
mV max  
Guaranteed monotonic  
2
At 25°C; error at other temperatures  
obtained using bipolar zero TC  
Bipolar Zero TC3  
Zero-Scale Error  
2
2
ppm FSR/°C max  
mV max  
At 25°C; error at other temperatures  
obtained using zero scale TC  
Zero-Scale TC3  
Gain Error  
2
0.02  
ppm FSR/°C max  
% FSR max  
At 25°C; error at other temperatures  
obtained using gain TC  
Gain TC3  
DC Crosstalk3  
2
0.5  
ppm FSR/°C max  
LSB max  
REFERENCE INPUT/OUTPUT  
Reference Input3  
Reference Input Voltage  
DC Input Impedance  
Input Current  
Reference Range  
Reference Output  
Output Voltage  
Reference TC  
5
1
10  
1/7  
V nominal  
MΩ min  
µA max  
1% for specified performance  
Typically 100 MΩ  
Typically 30 nA  
V min/V max  
4.997/5.003  
10  
1
V min/V max  
ppm/°C max  
Mmin  
At 25°C  
Load3  
Output Noise3  
18  
µV p-p typ  
(0.1 Hz to 10 Hz)  
Noise Spectral Density3  
Output Voltage Drift vs. Time  
Output Voltage Drift vs. Time  
Line Regulation  
Load Regulation  
Thermal Hysteresis  
75  
40  
50  
TBD  
TBD  
TBD  
nV/√Hz typ  
At 10 kHz  
ppm/500hr typ  
ppm/1000hr typ  
ppm/V typ  
ppm/mA typ  
ppm typ  
OUTPUT CHARACTERISTICS3  
Output Voltage Range4  
10.5263  
V min/V max  
V min/V max  
ppm FSR/500 hours typ  
ppm FSR/1000 hours typ  
mA typ  
AVDD/AVSS  
AVDD/AVSS  
=
=
11.4 V, REFA, REFB = 5V  
16.5 V, REFA, REFB = 7V  
14  
13  
15  
10  
1
Output Voltage Drift vs. Time  
Short Circuit Current  
Load Current  
RISCC = 6 kΩ, see Figure 31  
For specified performance  
mA max  
Capacitive Load Stability  
RL = ∞  
RL = 10 kΩ  
200  
1000  
0.3  
pF max  
pF max  
Ω max  
DC Output Impedance  
Rev. PrA | Page 4 of 33  
Preliminary Technical Data  
AD5762R  
Parameter  
DIGITAL INPUTS3  
C Grade2  
Unit  
Test Conditions/Comments  
DVCC = 2.7 V to 5.25 V, JEDEC compliant  
VIH, Input High Voltage  
VIL, Input Low Voltage  
Input Current  
2
0.8  
1
V min  
V max  
µA max  
pF max  
Per pin  
Per pin  
Pin Capacitance  
10  
DIGITAL OUTPUTS (D0, D1, SDO)3  
Output Low Voltage  
Output High Voltage  
Output Low Voltage  
0.4  
DVCC − 1  
0.4  
V max  
V min  
V max  
DVCC = 5 V 5%, sinking 200 µA  
DVCC = 5 V 5%, sourcing 200 µA  
DVCC = 2.7 V to 3.6 V,  
sinking 200 µA  
Output High Voltage  
DVCC − 0.5  
V min  
DVCC = 2.7 V to 3.6 V,  
sourcing 200 µA  
High Impedance Leakage Current  
High Impedance Output Capacitance  
DIE TEMPERATURE SENSOR3  
Output Voltage at 25°C  
Output Voltage Scale Factor  
Output Voltage Range  
Output Load Current  
Power-On Time  
1
5
µA max  
pF typ  
SDO only  
SDO only  
1.4  
5
1.175/1.9  
200  
80  
V typ  
Die temperature  
mV/°C typ  
V min/V max  
µA max  
−40°C to 105°C  
Current source only  
ms typ  
POWER REQUIREMENTS  
AVDD/AVSS  
11.4/16.5  
2.7/5.25  
V min/V max  
V min/V max  
DVCC  
Power Supply Sensitivity3  
∆VOUT/∆ΑVDD  
AIDD  
AISS  
DICC  
−85  
3.5  
2.75  
1.2  
dB typ  
mA/channel max  
mA/channel max  
mA max  
Outputs unloaded  
Outputs unloaded  
VIH = DVCC, VIL = DGND, 750 µA typ  
12 V operation output unloaded  
Power Dissipation  
140  
mW typ  
2 Temperature range : -40°C to +85°C; typical at 25°C. Device functionality is guaranteed to +105°C with degraded performance.  
3 Guaranteed by design and characterization; not production tested.  
4 Output amplifier headroom requirement is 1.4 V minimum.  
Rev. PrA | Page 5 of 33  
AD5762R  
Preliminary Technical Data  
AC PERFORMANCE CHARACTERISTIC  
ADD = 11ꢀ. ꢁ to 16ꢀ5 , ASS = −11ꢀ. ꢁ to −16ꢀ5 , AGND = DGND = REFGND = PGND = ꢂ ꢁ; REFA, REFB= 5 ꢁ external;  
DꢁCC = 2ꢀ7 ꢁ to 5ꢀ25 , RLOAD = 1ꢂ kΩ, CL = 2ꢂꢂ pFAll specifications TMIN to TMAX, unless otherwise notedꢀ Guaranteed by design and  
characterization, not production testedꢀ  
Table 2.  
Parameter  
C Grade  
Unit  
Test Conditions/Comments  
Full-scale step to 1 LSB  
512 LSB step settling  
DYNAMIC PERFORMANCE1  
Output Voltage Settling Time  
8
10  
2
µs typ  
µs max  
µs typ  
Slew Rate  
5
8
25  
80  
8
2
2
0.1  
45  
1
V/µs typ  
nV-s typ  
mV max  
dB typ  
nV-s typ  
nV-s typ  
nV-s typ  
LSB p-p typ  
µV rms max  
kHz typ  
Digital-to-Analog Glitch Energy  
Glitch Impulse Peak Amplitude  
Channel-to-Channel Isolation  
DAC-to-DAC Crosstalk  
Digital Crosstalk  
Digital Feedthrough  
Output Noise (0.1 Hz to 10 Hz)  
Output Noise (0.1 Hz to 100 kHz)  
1/f Corner Frequency  
Effect of input bus activity on DAC outputs  
Output Noise Spectral Density  
Complete System Output Noise Spectral Density2  
60  
80  
nV/√Hz typ  
nV/√Hz typ  
Measured at 10 kHz  
Measured at 10 kHz  
1 Guaranteed by design and characterization; not production tested.  
2 Includes noise contributions from integrated reference buffers,16-bit DAC and output amplifier.  
Rev. PrA | Page 6 of 33  
Preliminary Technical Data  
TIMING CHARACTERISTICS  
AD5762R  
ADD = 11ꢀ. ꢁ to 16ꢀ5 , ASS = −11ꢀ. ꢁ to −16ꢀ5 , AGND = DGND = REFGND = PGND = ꢂ ꢁ; REFA, REFB= 5 ꢁ external;  
DꢁCC = 2ꢀ7 ꢁ to 5ꢀ25 , RLOAD = 1ꢂ kΩ, CL = 2ꢂꢂ pFAll specifications TMIN to TMAX, unless otherwise notedꢀ  
Table 3.  
Parameter1, 2, 3  
ꢀimit at TMIN, TMAX  
Unit  
Description  
t1  
t2  
t3  
t4  
33  
13  
13  
13  
13  
40  
2
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
µs min  
ns min  
ns min  
ns max  
µs max  
ns min  
µs max  
ns max  
ns min  
µs min  
ns min  
SCLK cycle time  
SCLK high time  
SCLK low time  
SYNC falling edge to SCLK falling edge setup time  
24th SCLK falling edge to SYNC rising edge  
Minimum SYNC high time  
4
t5  
t6  
t7  
t8  
t9  
Data setup time  
Data hold time  
SYNC rising edge to LDAC falling edge (all DACs updated)  
SYNC rising edge to LDAC falling edge (single DAC updated)  
LDAC pulse width low  
5
1.4  
400  
10  
500  
10  
10  
2
t10  
t11  
t12  
t13  
t14  
LDAC falling edge to DAC output response time  
DAC output settling time  
CLR pulse width low  
CLR pulse activation time  
5, 6  
t15  
25  
13  
2
SCLK rising edge to SDO valid  
SYNC rising edge to SCLK falling edge  
SYNC rising edge to DAC output response time (LDAC = 0)  
LDAC falling edge to SYNC rising edge  
t16  
t17  
t18  
170  
1 Guaranteed by design and characterization; not production tested.  
2 All input signals are specified with tr = tf = 5 ns (10% to 90% of DVCC) and timed from a voltage level of 1.2 V.  
3 See Figure 2, Figure 3, and Figure 4.  
4 Standalone mode only.  
5 Measured with the load circuit of Figure 5.  
6 Daisy-chain mode only.  
Rev. PrA | Page 7 of 33  
AD5762R  
Preliminary Technical Data  
t1  
SCLK  
SYNC  
1
2
24  
t3  
t2  
t6  
t4  
t5  
t8  
t7  
DB23  
SDIN  
DB0  
t10  
t10  
t9  
LDAC  
t18  
t12  
t11  
VOUT  
LDAC = 0  
t12  
t17  
VOUT  
CLR  
t13  
t14  
VOUT  
Figure 2. Serial Interface Timing Diagram  
t1  
SCLK  
24  
48  
t3  
t2  
t6  
t5  
t16  
t4  
SYNC  
SDIN  
t8  
t7  
DB23  
DB0  
DB23  
DB0  
INPUT WORD FOR DAC N  
INPUT WORD FOR DAC N–1  
t15  
DB23  
DB0  
SDO  
t9  
UNDEFINED  
INPUT WORD FOR DAC N  
t10  
LDAC  
Figure 3. Daisy Chain Timing Diagram  
Rev. PrA | Page 8 of 33  
Preliminary Technical Data  
AD5762R  
SCLK  
24  
48  
SYNC  
DB23  
DB0  
DB23  
DB0  
SDIN  
SDO  
NOP CONDITION  
INPUT WORD SPECIFIES  
REGISTER TO BE READ  
DB23  
DB0  
UNDEFINED  
SELECTED REGISTER DATA  
CLOCKED OUT  
Figure 4. Readback Timing Diagram  
200µA  
I
OL  
V
V
(MIN) OR  
(MAX)  
TO OUTPUT  
PIN  
OH  
OL  
C
L
50pF  
200µA  
I
OH  
Figure 5. Load Circuit for SDO Timing Diagram  
Rev. PrA | Page 9 of 33  
AD5762R  
Preliminary Technical Data  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C unless otherwise notedꢀ Transient currents of up to  
1ꢂꢂ mA do not cause SCR latch-upꢀ  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the deviceꢀ This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those listed in the operational sections  
of this specification is not impliedꢀ Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliabilityꢀ  
Table 4.  
Parameter  
Rating  
AVDD to AGND, DGND  
AVSS to AGND, DGND  
DVCC to DGND  
−0.3 V to +17 V  
+0.3 V to −17 V  
−0.3 V to +7 V  
Digital Inputs to DGND  
−0.3 V to DVCC + 0.3 V or 7 V  
(whichever is less)  
Digital Outputs to DGND  
REFA, REFB to AGND, PGND  
REFOUT to AGND  
−0.3 V to DVCC + 0.3 V  
−0.3 V to AVDD + 0.3V  
AVSS to AVDD  
TEMP  
AVSS to AVDD  
VOUTA, VOUTB to AGND  
AGND to DGND  
AVSS to AVDD  
−0.3 V to +0.3 V  
Operating Temperature Range  
Industrial  
Storage Temperature Range  
Junction Temperature (TJ max)  
32-Lead TQFP  
−40°C to +85°C  
−65°C to +150°C  
150°C  
θJA Thermal Impedance  
θJC Thermal Impedance  
Lead Temperature  
65°C/W  
12°C/W  
JEDEC Industry Standard  
J-STD-020  
Soldering  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the  
human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. PrA | Page 10 of 33  
Preliminary Technical Data  
AD5762R  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
32  
25  
1
24  
NC  
SYNC  
SCLK  
SDIN  
SDO  
CLR  
LDAC  
D0  
PIN 1  
NC  
INDICATOR  
VOUTA  
AGNDA  
AGNDB  
AD5762R  
TOP VIEW  
(Not to Scale)  
VOUTB  
NC  
D1  
NC  
8
17  
9
16  
Figure 6. Pin Configuration  
Table 5. Pin Function Descriptions  
Pin No. Mnemonic Description  
1
SYNC  
Active Low Input. This is the frame synchronization signal for the serial interface.  
While SYNC is low, data is transferred in on the falling edge of SCLK.  
2
SCLK  
Serial Clock Input. Data is clocked into the shift register on the falling edge of SCLK.  
This operates at clock speeds up to 30 MHz.  
3
4
SDIN  
SDO  
Serial Data Input. Data must be valid on the falling edge of SCLK.  
Serial Data Output. Used to clock data from the serial register in daisy-chain or  
readback mode.  
51  
6
CLR1  
Negative Edge Triggered Input. Asserting this pin sets the DAC registers to 0x0000.  
LDAC  
Load DAC. Logic input. This is used to update the DAC registers and consequently  
the analog outputs. When tied permanently low, the addressed DAC register is  
updated on the rising edge of SYNC. If LDAC is held high during the write cycle, the  
DAC input register is updated but the output update is held off until the falling edge  
of LDAC. In this mode, all analog outputs can be updated simultaneously on the  
falling edge of LDAC. The LDAC pin must not be left unconnected.  
7, 8  
D0, D1  
D0 and D1 form a digital I/O port. The user can set up these pins as inputs or outputs  
that are configurable and readable over the serial interface. When configured as  
inputs, these pins have weak internal pull-ups to DVCC. When programmed as  
outputs, D0 and D1 are referenced by DVCC and DGND.  
9
RSTOUT  
RSTIN  
Reset Logic Output. This is the output from the on-chip voltage monitor used in the  
reset circuit. If desired, it can be used to control other system components.  
Reset Logic Input. This input allows external access to the internal reset logic.  
Applying a Logic 0 to this input clamps the DAC outputs to 0 V. In normal operation,  
RSTIN should be tied to Logic 1. Register values remain unchanged.  
10  
11  
12  
13, 31  
14  
15, 30  
16  
DGND  
DVCC  
AVDD  
PGND  
AVSS  
Digital Ground Pin.  
Digital Supply Pin. Voltage ranges from 2.7 V to 5.25 V.  
Positive Analog Supply Pins. Voltage ranges from 11.4 V to 16.5 V.  
Ground Reference Point for Analog Circuitry.  
Negative Analog Supply Pins. Voltage ranges from –11.4 V to –16.5 V.  
ISCC  
This pin is used in association with an optional external resistor to AGND to program  
the short-circuit current of the output amplifiers. Refer to the Features section for  
further details.  
17  
18  
NC  
NC  
No Internal Connection  
No Internal Connection  
Rev. PrA | Page 11 of 33  
AD5762R  
Preliminary Technical Data  
Pin No. Mnemonic  
Description  
19  
VOUTB  
Analog Output Voltage of DAC B. Buffered output with a nominal full-scale output range  
of 10 V. The output amplifier is capable of directly driving a 10 kΩ, 200 pF load.  
20  
21  
22  
AGNDB  
AGNDA  
VOUTA  
Ground Reference Pin for DAC B Output Amplifier.  
Ground Reference Pin for DAC A Output Amplifier.  
Analog Output Voltage of DAC A. Buffered output with a nominal full-scale output range  
of 10 V. The output amplifier is capable of directly driving a 10 kΩ, 200 pF load.  
23  
24  
25  
NC  
NC  
REFA  
Do not connect to this pin  
Do not connect to this pin  
External Reference Voltage. Reference input range is 1 V to 7 V; programs the full-  
scale output voltage. REFA = 5 V for specified performance.  
26  
27  
REFB  
External Reference Voltage. Reference input range is 1 V to 7 V; programs the full-  
scale output voltage. REFB = 5 V for specified performance.  
Reference Output. This is the reference output from the internal voltage reference.  
The internal reference is 5 V 3 mV at 25°C, with a reference tempco of 10 ppm/°C.  
REFOUT  
28  
29  
REFGND  
TEMP  
Reference Ground Return for the Reference Generator and Buffers.  
This pin provides an output voltage proportional to temperature. The output voltage  
is 1.4 V typical at 25°C die temperature; variation with temperature is 5 mV/°C.  
32  
BIN/2sCOMP  
Determines the DAC Coding. This pin should be hardwired to either DVCC or DGND.  
When hardwired to DVCC, input coding is offset binary. When hardwired to DGND,  
input coding is twos complement (see Table 6).  
1 Internal pull-up device on this logic input. Therefore, it can be left floating and defaults to a logic high condition.  
Rev. PrA | Page 12 of 33  
Preliminary Technical Data  
TERMINOLOGY  
AD5762R  
Relative Accuracy or Integral nonlinearity (INL)  
Gain Error  
For the DAC, relative accuracy or integral nonlinearity (INL) is  
a measure of the maximum deviation, in LSBs, from a straight  
line passing through the endpoints of the DAC transfer  
functionꢀ A typical INL vsꢀ code plot can be seen in Figure 7ꢀ  
Gain error is a measure of the span error of the DACꢀ It is the  
deviation in slope of the DAC transfer characteristic from the  
ideal, expressed as a percentage of the full-scale rangeꢀ A plot of  
gain error vsꢀ temperature can be seen in Figure 23ꢀ  
Differential Nonlinearity (DNL)  
Total Unadjusted Error  
Differential nonlinearity is the difference between the measured  
change and the ideal 1 LSB change between any two adjacent  
codesꢀ A specified differential nonlinearity of 1 LSB maximum  
ensures monotonicityꢀ This DAC is guaranteed monotonicꢀ A  
typical DNL vsꢀ code plot can be seen in Figure 9ꢀ  
Total unadjusted error (TUE) is a measure of the output error  
considering all the various errorsꢀ A plot of total unadjusted  
error vsꢀ reference can be seen in Figure 19ꢀ  
Zero-Scale Error TC  
Zero-scale error TC is a measure of the change in zero-scale  
error with a change in temperatureꢀ Zero-scale error TC is  
expressed in ppm FSR/°Cꢀ  
Monotonicity  
A DAC is monotonic if the output either increases or remains  
constant for increasing digital input codeꢀ The AD5762R is  
monotonic over its full operating temperature rangeꢀ  
Gain Error TC  
Gain error TC is a measure of the change in gain error with  
changes in temperatureꢀ Gain Error TC is expressed in  
(ppm of FSR)/°Cꢀ  
Bipolar Zero Error  
Bipolar zero error is the deviation of the analog output from the  
ideal half-scale output of ꢂ ꢁ when the DAC register is loaded with  
ꢂx8ꢂꢂꢂ (offset binary coding) or ꢂxꢂꢂꢂꢂ (twos complement  
coding)ꢀ A plot of bipolar zero error vsꢀ temperature can be seen in  
Figure 22ꢀ  
Digital-to-Analog Glitch Energy  
Digital-to-analog glitch impulse is the impulse injected into the  
analog output when the input code in the DAC register changes  
stateꢀ It is normally specified as the area of the glitch in nꢁ-s and is  
measured when the digital input code is changed by 1 LSB at the  
major carry transition (ꢂx7FFF to ꢂx8ꢂꢂꢂ) (see Figure 28)ꢀ  
Bipolar Zero TC  
Bipolar zero TC is the measure of the change in the bipolar zero  
error with a change in temperatureꢀ It is expressed in ppm FSR/°Cꢀ  
Digital Feedthrough  
Full-Scale Error  
Digital feedthrough is a measure of the impulse injected into  
the analog output of the DAC from the digital inputs of the  
DAC but is measured when the DAC output is not updatedꢀ It is  
specified in nꢁ-s and measured with a full-scale code change on  
the data bus, that is, from all ꢂs to all 1s and vice versaꢀ  
Full-scale error is a measure of the output error when full-scale  
code is loaded to the DAC registerꢀ Ideally the output voltage  
should be 2 × ꢁREF − 1 LSBꢀ Full-scale error is expressed in  
percentage of full-scale rangeꢀ  
Negative Full-Scale Error/Zero Scale Error  
Power Supply Sensitivity  
Negative full-scale error is the error in the DAC output voltage  
when ꢂxꢂꢂꢂꢂ (offset binary coding) or ꢂx8ꢂꢂꢂ (twos  
complement coding) is loaded to the DAC registerꢀ Ideally, the  
output voltage should be −2 × ꢁREFꢀ A plot of zero-scale error vsꢀ  
temperature can be seen in Figure 21ꢀ  
Power supply sensitivity indicates how the output of the DAC is  
affected by changes in the power supply voltageꢀ  
DC Crosstalk  
DC crosstalk is the dc change in the output level of one DAC in  
response to a change in the output of another DACꢀ It is  
measured with a full-scale output change on one DAC while  
monitoring another DAC, and is expressed in LSBsꢀ  
Output Voltage Settling Time  
Output voltage settling time is the amount of time it takes for  
the output to settle to a specified level for a full-scale input  
changeꢀ  
DAC-to-DAC Crosstalk  
DAC-to-DAC crosstalk is the glitch impulse transferred to the  
output of one DAC due to a digital code change and subsequent  
output change of another DACꢀ This includes both digital and  
analog crosstalkꢀ It is measured by loading one of the DACs  
with a full-scale code change (all ꢂs to all 1s and vice versa) with  
Slew Rate  
The slew rate of a device is a limitation in the rate of change of  
the output voltageꢀ The output slewing speed of a voltage-  
output D/A converter is usually limited by the slew rate of the  
amplifier used at its outputꢀ Slew rate is measured from 1ꢂ% to  
9ꢂ% of the output signal and is given in ꢁ/µsꢀ  
low and monitoring the output of another DACꢀ The  
LDAC  
energy of the glitch is expressed in nꢁ-sꢀ  
Rev. PrA | Page 13 of 33  
AD5762R  
Preliminary Technical Data  
Channel-to-Channel Isolation  
Digital Crosstalk  
Channel-to-channel isolation is the ratio of the amplitude of the  
signal at the output of one DAC to a sine wave on the reference  
input of another DACꢀ It is measured in dBꢀ  
Digital crosstalk is a measure of the impulse injected into the  
analog output of one DAC from the digital inputs of another  
DAC but is measured when the DAC output is not updatedꢀ It is  
specified in nꢁ-s and measured with a full-scale code change on  
the data bus, that is, from all ꢂs to all 1s and vice versaꢀ  
Reference TC  
Reference TC is a measure of the change in the reference output  
voltage with a change in temperatureꢀ It is expressed in ppm/°Cꢀ  
Rev. PrA | Page 14 of 33  
Preliminary Technical Data  
AD5762R  
TYPICAL PERFORMANCE CHARACTERISTICS  
1.0  
1.0  
0.8  
T
= 25°C  
T
V
= 25°C  
/V = ±12V  
DD SS  
A
A
V
/V = ±15V  
0.8  
DD SS  
REFIN = 5V  
REFIN = 5V  
0.6  
0.6  
0.4  
0.4  
0.2  
0.2  
0
0
–0.2  
–0.4  
–0.6  
–0.8  
–1.0  
–0.2  
–0.4  
–0.6  
–0.8  
–1.0  
0
0
0
10000  
20000  
30000  
40000  
50000  
60000  
0
10000  
20000  
30000  
40000  
50000  
60000  
DAC CODE  
DAC CODE  
Figure 7. Integral Nonlinearity Error vs. Code,  
VDD/VSS 15 V  
Figure 10. Differential Nonlinearity Error vs. Code,  
=
VDD/VSS  
=
12 V  
1.0  
0.8  
0.5  
0.4  
0.3  
0.2  
0.1  
0
T
V
= 25°C  
A
T = 25°C  
A
/V = ±12V  
DD SS  
V
/V = ±15V  
DD SS  
REFIN = 5V  
REFIN = 5V  
0.6  
0.4  
0.2  
0
–0.2  
–0.4  
–0.6  
–0.8  
–1.0  
–0.1  
–0.2  
10000  
20000  
30000  
40000  
50000  
60000  
–40  
–20  
0
20  
40  
60  
80  
100  
DAC CODE  
TEMPERATURE (°C)  
Figure 8. Integral Nonlinearity Error vs. Code,  
VDD/VSS 12 V  
Figure 11. Integral Nonlinearity Error vs. Temperature,  
VDD/VSS 15 V  
=
=
1.0  
0.8  
0.5  
0.4  
0.3  
0.2  
0.1  
0
T
= 25°C  
A
T
= 25°C  
/V = ±12V  
A
V
/V = ±15V  
DD SS  
V
DD SS  
REFIN = 5V  
REFIN = 5V  
0.6  
0.4  
0.2  
0
–0.2  
–0.4  
–0.6  
–0.8  
–1.0  
–0.1  
–40  
10000  
20000  
30000  
40000  
50000  
60000  
–20  
0
20  
40  
60  
80  
100  
DAC CODE  
TEMPERATURE (°C)  
Figure 9. Differential Nonlinearity Error vs. Code,  
VDD/VSS 15 V  
Figure 12. Integral Nonlinearity Error vs. Temperature,  
VDD/VSS 12 V  
=
=
Rev. PrA | Page 15 of 33  
AD5762R  
Preliminary Technical Data  
0.15  
0.10  
0.05  
0
0.15  
0.10  
T
= 25°C  
A
REFIN = 5V  
0.05  
0
–0.05  
–0.10  
–0.15  
–0.20  
–0.05  
–0.10  
–0.15  
–0.20  
–0.25  
T
V
= 25°C  
A
/V = ±15V  
DD SS  
REFIN = 5V  
–0.25  
–40  
–20  
0
20  
40  
60  
80  
100  
11.4  
12.4  
13.4  
14.4  
15.4  
16.4  
TEMPERATURE (°C)  
SUPPLY VOLTAGE (V)  
Figure 13. Differential Nonlinearity Error vs. Temperature,  
VDD/VSS = 15 V  
Figure 16. Differential Nonlinearity Error vs. Supply Voltage  
0.15  
0.8  
T
= 25°C  
A
0.6  
0.4  
0.10  
0.05  
0.2  
0
0
–0.05  
–0.10  
–0.15  
–0.20  
–0.25  
–0.2  
–0.4  
–0.6  
–0.8  
–1.0  
T
V
= 25°C  
A
/V = ±12V  
DD SS  
REFIN = 5V  
–40  
–20  
0
20  
40  
60  
80  
100  
1
2
3
4
5
6
7
TEMPERATURE (°C)  
REFERENCE VOLTAGE (V)  
Figure 14. Differential Nonlinearity Error vs. Temperature,  
VDD/VSS = 12 V  
Figure 17. Integral Nonlinearity Error vs. Reference Voltage, VDD/VSS  
16.5 V  
=
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.4  
T
= 25°C  
T
= 25°C  
A
A
REFIN = 5V  
0.3  
0.2  
0.1  
0
–0.1  
–0.2  
–0.3  
–0.4  
–0.1  
–0.2  
11.4  
12.4  
13.4  
14.4  
15.4  
16.4  
1
2
3
4
5
6
7
SUPPLY VOLTAGE (V)  
REFERENCE VOLTAGE (V)  
Figure 15. Integral Nonlinearity Error vs. Supply Voltage  
Figure 18. Differential Nonlinearity Error vs. Reference Voltage, VDD/VSS  
16.5 V  
=
Rev. PrA | Page 16 of 33  
Preliminary Technical Data  
AD5762R  
0.8  
0.8  
0.6  
0.4  
0.2  
0
REFIN = 5V  
REFIN = 5V  
V
/V = ±15V  
DD SS  
V
/V = ±15V  
DD SS  
0.6  
0.4  
0.2  
0
V
/V = ±12V  
DD SS  
V
/V = ±12V  
DD SS  
–0.2  
–0.2  
–0.4  
–40  
–0.4  
–40  
–20  
0
20  
40  
60  
80  
100  
–20  
0
20  
40  
60  
80  
100  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 19. Total Unadjusted Error vs. Reference Voltage,  
Figure 22. Bipolar Zero Error vs. Temperature  
VDD/VSS  
= 16.5 V  
14  
13  
12  
11  
10  
9
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
T
= 25°C  
REFIN = 5V  
A
REFIN = 5V  
|I  
DD  
|
V
/V = ±12V  
DD SS  
V
/V = ±15V  
DD SS  
|I  
SS  
|
8
11.4  
–0.2  
–40  
12.4  
13.4  
V
14.4  
/V (V)  
15.4  
16.4  
–20  
0
20  
40  
60  
80  
100  
TEMPERATURE (°C)  
DD SS  
Figure 20. IDD/ISS vs. VDD/VSS  
Figure 23. Gain Error vs. Temperature  
0.25  
0.20  
0.15  
0.10  
0.05  
0
0.0014  
0.0013  
0.0012  
0.0011  
0.0010  
0.0009  
0.0008  
0.0007  
0.0006  
T
= 25°C  
REFIN = 5V  
V
/V = ±15V  
DD SS  
A
5V  
V
/V = ±12V  
DD SS  
–0.05  
–0.10  
–0.15  
–0.20  
–0.25  
3V  
–40  
–20  
0
20  
40  
60  
80  
100  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
TEMPERATURE (°C)  
V
LOGIC  
Figure 21. Zero-Scale Error vs. Temperature  
Figure 24. DICC vs. Logic Input Voltage  
Rev. PrA | Page 17 of 33  
AD5762R  
Preliminary Technical Data  
7000  
–4  
–6  
T
= 25°C  
A
REFIN = 5V  
RI = 6k  
6000  
5000  
4000  
3000  
2000  
1000  
0
SCC  
V
/V = ±15V  
DD SS  
–8  
–10  
–12  
–14  
–16  
–18  
–20  
–22  
–24  
–26  
V
/V = ±12V  
DD SS  
V
/V = ±12V,  
DD SS  
REFIN = 5V,  
= 25°C,  
T
A
0x8000 TO 0x7FFF,  
500ns/DIV  
–1000  
–10  
–5  
0
5
10  
–2.0–1.5–1.0–0.5  
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0  
TIME (µs)  
SOURCE/SINK CURRENT (mA)  
Figure 25. Source and Sink Capability of Output Amplifier with Positive  
Full Scale Loaded  
Figure 28. Major Code Transition Glitch Energy, VDD/VSS  
= 12 V  
10000  
T
= 25°C  
A
REFIN = 5V  
RI = 6k  
9000  
8000  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
V
/V = ±15V  
DD SS  
SCC  
MIDSCALE LOADED  
REFIN = 0V  
15V SUPPLIES  
12V SUPPLIES  
4
–1000  
–12  
–7  
–2  
3
8
50µV/DIV  
CH4  
SOURCE/SINK CURRENT (mA)  
CH4 50.0µV  
M1.00s  
26µV  
Figure 26. Source and Sink Capability of Output Amplifier with Negative  
Full Scale Loaded  
Figure 29. Peak-to-Peak Noise (100 kHz Bandwidth)  
V
/V = ±12V,  
DD SS  
T
V
/V = ±15V  
= 25°C  
DD SS  
REFIN = 5V, T = 25°C,  
RAMP TIME = 100µs,  
LOAD = 200pF||10k  
A
T
A
REFIN = 5V  
1
2
3
1
1µs/DIV  
CH1 –120mV  
B
CH1 3.00V  
M1.00µs  
CH1 10.0V  
CH2 10.0V  
M100µs A CH1  
29.60%  
7.80mV  
W
B
CH3 10.0mV  
T
W
Figure 27. Full-Scale Settling Time  
Figure 30. VOUT vs. VDD/VSS on Power-Up  
Rev. PrA | Page 18 of 33  
Preliminary Technical Data  
AD5762R  
10  
9
8
7
6
5
4
3
2
1
0
V
/V = ±15V  
DD SS  
= 25°C  
T
V
/V = ±12V  
= 25°C  
A
DD SS  
REFIN = 5V  
T
A
1
5µV/DIV  
A CH1  
0
20  
40  
60  
(k)  
80  
100  
120  
M1.00s  
18mV  
RI  
SCC  
Figure 34. REFOUT Output Noise 0.1 Hz to 10 Hz  
Figure 31. Short-Circuit Current vs. RISCC  
T
V
/V = ±12V  
DD SS  
T
= 25°C  
A
1
2
3
B
B
CH1 10.0V  
CH3 5.00V  
CH2 10.0V  
M400µs A CH1  
29.60%  
7.80mV  
W
W
T
Figure 32. REFOUT Turn-On Transient  
Figure 35. REFOUT Load Regulation  
V
/V = ±12V  
DD SS  
T
= 25°C,  
A
10µF CAPACITOR ON REF  
OUT  
1
50µV/DIV  
A CH1  
CH1 50.0µV  
M1.00s  
15µV  
Figure 36. REFOUT Histogram of Thermal Hysteresis  
Figure 33. REFOUT Output Noise 100 kHz Bandwidth  
Rev. PrA | Page 19 of 33  
AD5762R  
Preliminary Technical Data  
Figure 37. TEMP Voltage vs. Temperature  
Rev. PrA | Page 20 of 33  
Preliminary Technical Data  
THEORY OF OPERATION  
AD5762R  
The AD5762R is a dual, 16-bit, serial input, bipolar voltage output  
DAC and operates from supply voltages of 11ꢀ. ꢁ to 16ꢀ5 ꢁ and  
has a buffered output voltage of up to 1ꢂꢀ5263 ꢀ Data is written to  
the AD5762R in a 2.-bit word format, via a 3-wire serial interfaceꢀ  
The AD5762R also offers an SDO pin, which is available for daisy  
chaining or readbackꢀ  
SERIAꢀ INTERFACE  
The AD5762R is controlled over a versatile 3-wire serial  
interface that operates at clock rates of up to 3ꢂ MHz and is  
compatible with SPI®, QSPI™, MICROWIRE™, and DSP  
standardsꢀ  
Input Shift Register  
The AD5762R incorporates a power-on reset circuit, which  
ensures that the DAC registers power up loaded with ꢂxꢂꢂꢂꢂꢀ  
The AD5762R features a digital I/O port that can be  
programmed via the serial interface, an analog die temperature  
sensor, on-chip 1ꢂ ppm/°C voltage reference, on-chip reference  
buffers and per channel digital gain and offset registersꢀ  
The input shift register is 2. bits wideꢀ Data is loaded into the  
device MSB first as a 2.-bit word under the control of a serial  
clock input, SCLKꢀ The input register consists of a read/write  
bit, three register select bits, three DAC address bits and 16 data  
bits as shown in Table 7ꢀ The timing diagram for this operation  
is shown in Figure 2ꢀ  
DAC ARCHITECTURE  
Upon power-up, the DAC registers are loaded with zero code  
(ꢂxꢂꢂꢂꢂ) and the outputs are clamped to ꢂ ꢁ via a low  
impedance pathꢀ The outputs can be updated with the zero code  
The DAC architecture of the AD5762R consists of a 16-bit  
current mode segmented R-2R DACꢀ The simplified circuit  
diagram for the DAC section is shown in Figure 38ꢀ  
value by asserting either  
or  
ꢀ The corresponding  
LDAC CLR  
output voltage depends on the state of the BIN/ pinꢀ If  
2sCOMP  
pin is tied to DGND, then the data coding is  
The four MSBs of the 16-bit data word are decoded to drive 15  
switches, E1 to E15ꢀ Each of these switches connects one of the  
15 matched resistors to either AGND or IOUTThe remaining  
12 bits of the data word drive switches Sꢂ to S11 of the 12-bit R-  
2R ladder networkꢀ  
the BIN/  
2sCOMP  
twos complement and the outputs update to ꢂ ꢀ If the  
BIN/ pin is tied to DꢁCC, then the data coding is offset  
2sCOMP  
binary and the outputs update to negative full scaleꢀ To have the  
outputs power-up with zero code loaded to the outputs, the  
R
R
R
V
REF  
pin should be held low during power-upꢀ  
CLR  
2R  
2R  
2R  
2R  
2R  
2R  
2R  
Standalone Operation  
The serial interface works with both a continuous and noncon-  
tinuous serial clockꢀ A continuous SCLK source can only be  
R/8  
E15  
E14  
E1  
S0  
S11  
S10  
I
OUT  
used if  
is held low for the correct number of clock cyclesꢀ  
SYNC  
In gated clock mode, a burst clock containing the exact number  
of clock cycles must be used and must be taken high after  
V
OUT  
AGND  
SYNC  
the final clock to latch the dataꢀ The first falling edge of  
4 MSBs DECODED INTO  
15 EQUAL SEGMENTS  
12-BIT, R-2R LADDER  
SYNC  
starts the write cycleꢀ Exactly 2. falling clock edges must be  
applied to SCLK before is brought back high againꢀ If  
Figure 38. DAC Ladder Structure  
REFERENCE BUFFERS  
SYNC  
is brought high before the 2.th falling SCLK edge, then  
The AD5762R can operate with either an external or an internal  
referenceꢀ The reference input has an input range up to 7 ꢀ This  
input voltage is then used to provide a buffered positive and  
negative reference for the DAC coresꢀ The positive reference is  
given by  
SYNC  
the data written is invalidꢀ If more than 2. falling SCLK edges  
are applied before is brought high, then the input data is  
SYNC  
also invalidꢀ The input register addressed is updated on the  
rising edge of ꢀ In order for another serial transfer to take  
SYNC  
must be brought low againꢀ After the end of the  
+ ꢁREF = 2 × ꢁREFIN  
place,  
SYNC  
serial data transfer, data is automatically transferred from the  
input shift register to the addressed registerꢀ  
While the negative reference to the DAC cores is given by  
−ꢁREF = −2 × ꢁREFIN  
When the data has been transferred into the chosen register of  
the addressed DAC, all DAC registers and outputs can be  
These positive and negative reference voltages (along with the  
gain register values) define the output ranges of the DACsꢀ  
updated by taking  
lowꢀ  
LDAC  
Rev. PrA | Page 21 of 33  
AD5762R  
Preliminary Technical Data  
AD5762R*  
SDIN  
68HC11*  
MOSI  
A continuous SCLK source can only be used if  
low for the correct number of clock cyclesꢀ In gated clock mode,  
a burst clock containing the exact number of clock cycles must  
is held  
SYNC  
SCK  
PC7  
PC6  
SCLK  
SYNC  
LDAC  
be used and  
must be taken high after the final clock to  
SYNC  
latch the dataꢀ  
Readback Operation  
MISO  
SDO  
Before a readback operation is initiated, the SDO pin must be  
enabled by writing to the function register and clearing the  
SDO DISABLE bit; this bit is cleared by defaultꢀ Readback mode  
SDIN  
is invoked by setting the R/ bit = 1 in the serial input register  
writeꢀ With R/ = 1, Bit A2 to Bit Aꢂ, in association with Bit  
W
W
AD5762R*  
SCLK  
REG2, Bit REG1, and Bit REGꢂ, select the register to be readꢀ  
The remaining data bits in the write sequence are don’t careꢀ  
During the next SPI write, the data appearing on the SDO  
output contain the data from the previously addressed registerꢀ  
For a read of a single register, the NOP command can be used  
in clocking out the data from the selected register on SDOꢀ The  
readback diagram in Figure . shows the readback sequenceꢀ For  
example, to read back the fine gain register of Channel A on the  
AD5762R, the following sequence should be implemented:  
SYNC  
LDAC  
SDO  
SDIN  
AD5762R*  
SCLK  
1ꢀ Write ꢂxAꢂXXXX to the AD5762R input registerꢀ This  
configures the AD5762R for read mode with the fine gain  
register of Channel A selectedꢀ Note that all the data bits,  
DB15 to DBꢂ, are don’t careꢀ  
SYNC  
LDAC  
SDO  
2ꢀ Follow this with a second write, a NOP condition,  
ꢂxꢂꢂXXXXꢀ During this write, the data from the fine gain  
register is clocked out on the SDO line, that is, data clocked  
out contains the data from the fine gain register in Bit DB5 to  
Bit DBꢂꢀ  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 39. Daisy Chaining the AD5762R  
Daisy-Chain Operation  
SIMUꢀTANEOUS UPDATING VIA  
ꢀDAC  
For systems that contain several devices, the SDO pin can be  
used to daisy chain several devices togetherꢀ This daisy-chain  
mode can be useful in system diagnostics and in reducing the  
Depending on the status of both  
and  
, and after  
LDAC  
SYNC  
data has been transferred into the input register of the DACs,  
there are two ways in which the DAC registers and DAC  
outputs can be updatedꢀ  
number of serial interface linesꢀ The first falling edge of  
SYNC  
starts the write cycleꢀ The SCLK is continuously applied to the  
input shift register when is lowꢀ If more than 2. clock  
SYNC  
Individual DAC Updating  
pulses are applied, the data ripples out of the shift register and  
appears on the SDO lineꢀ This data is clocked out on the rising  
edge of SCLK and is valid on the falling edgeꢀ By connecting the  
SDO of the first device to the SDIN input of the next device in  
the chain, a multidevice interface is constructedꢀ Each device in  
the system requires 2. clock pulsesꢀ Therefore, the total number  
of clock cycles must equal 2.N, where N is the total number of  
AD5762R devices in the chainꢀ When the serial transfer to all  
In this mode,  
is held low while data is being clocked into  
LDAC  
the input shift registerꢀ The addressed DAC output is updated  
on the rising edge of  
SYNC  
Simultaneous Updating of All DACs  
In this mode, is held high while data is being clocked  
LDAC  
into the input shift registerꢀ All DAC outputs are updated by  
taking low any time after has been taken highꢀ  
devices is complete,  
is taken highꢀ This latches the input  
SYNC  
LDAC  
SYNC  
data in each device in the daisy chain and prevents any further  
data from being clocked into the input shift registerꢀ The serial  
clock can be a continuous or a gated clockꢀ  
The update now occurs on the falling edge of  
LDAC  
Rev. PrA | Page 22 of 33  
Preliminary Technical Data  
AD5762R  
OUTPUT  
I/V AMPLIFIER  
The output voltage expression for the AD5762R is given by  
16-BIT  
DAC  
V
REFIN  
V
OUT  
D
VOUT = −2×VREFIN + 4×VREFIN  
65536  
DAC  
REGISTER  
LDAC  
where:  
D is the decimal equivalent of the code loaded to the DACꢀ  
REFIN is the reference voltage applied at the REFA, REFB pinsꢀ  
V
INPUT  
REGISTER  
ASYNCHRONOUS CꢀEAR (  
)
CꢀR  
SCLK  
SYNC  
SDIN  
INTERFACE  
LOGIC  
SDO  
is a negative edge triggered clear that allows the outputs to  
CLR  
be cleared to either ꢂ ꢁ (twos complement coding) or negative  
Figure 40. Simplified Serial Interface of Input Loading Circuitry  
for One DAC Channel  
full scale (offset binary coding)ꢀ It is necessary to maintain  
low for a minimum amount of time (see Figure 2) for the  
CLR  
TRANSFER FUNCTION  
operation to completeꢀ When the  
signal is returned high,  
CLR  
the output remains at the cleared value until a new value is  
programmedꢀ If at power-on is at ꢂ , then all DAC  
Table 6 shows the ideal input code to output voltage  
relationship for the AD5762R for both offset binary and twos  
complement data codingꢀ  
CLR  
outputs are updated with the clear valueꢀ A clear can also be  
initiated through software by writing the command ꢂxꢂ.XXXX  
to the AD5762Rꢀ  
Table 6. Ideal Output Voltage to Input Code Relationship for  
the AD5762R  
Digital Input  
Analog Output  
Offset Binary Data Coding  
MSB  
ꢀSB VOUT  
1111 1111  
1000 0000  
1000 0000  
0111 1111  
0000 0000  
1111  
0000  
0000  
1111  
0000  
1111  
0001  
0000  
1111  
0000  
+2 VREFIN × (32767/32768)  
+2 VREFIN × (1/32768)  
0 V  
2 VREFIN × (1/32768)  
2 VREFIN × (32767/32768)  
Twos Complement Data Coding  
MSB  
ꢀSB VOUT  
0111 1111  
0000 0000  
0000 0000  
1111 1111  
1000 0000  
1111  
0000  
0000  
1111  
0000  
1111  
0001  
0000  
1111  
0000  
+2 VREFIN × (32767/32768)  
+2 VREFIN × (1/32768)  
0 V  
2 VREFIN × (1/32768)  
2 VREFIN × (32767/32768)  
Rev. PrA | Page 23 of 33  
AD5762R  
Preliminary Technical Data  
Table 7. AD5762R Input Register Format  
MSB  
LSB  
DB23  
DB22  
0
DB21  
REG2  
DB20  
REG1  
DB19  
REG0  
DB18  
A2  
DB17  
A1  
DB16  
A0  
DB15  
DB14  
DB13  
DB12  
DB11  
DB10  
DB9  
DB8  
DB7  
DB6  
DB5  
DB4  
DB3  
DB2  
DB1  
DB0  
W
R/  
DATA  
Table 8. Input Register Bit Functions  
Register  
Function  
R/W  
Indicates a read from or a write to the addressed register.  
REG2, REG1, REG0  
Used in association with the address bits to determine if a read or write operation is to the data register, offset  
register, gain register, or function register.  
REG2  
REG1  
REG0  
Function  
0
0
0
1
1
0
1
1
0
0
0
0
1
0
1
Function Register  
Data Register  
Coarse Gain Register  
Fine Gain Register  
Offset Register  
A2, A1, A0  
D15:D0  
These bits are used to decode the DAC channels.  
A2  
A1  
0
A0  
0
Channel Address  
DAC A  
0
0
0
1
DAC B  
1
0
0
BOTH DACs  
Data Bits.  
FUNCTION REGISTER  
The function register is addressed by setting the three REG bits to ꢂꢂꢂꢀ The values written to the address bits and the data bits determine  
the function addressedꢀ The functions available via the function register are outlined in Table 9 and Table 1ꢂꢀ  
Table 9. Function Register Options  
REG2 REG1 REG0 A2 A1 A0  
DB15:DB6  
DB5  
DB4  
DB3  
DB2  
DB1  
DB0  
0
0
0
0
0
0
0
0
0
0
0
1
NOP, Data = Don’t Care  
Don’t Care  
Local-  
Ground-  
Offset Adjust  
D1 Direction D1  
Value  
D0  
Direction  
D0  
Value  
SDO  
Disable  
0
0
0
0
0
0
1
1
0
0
0
1
CLR, Data = Don’t Care  
LOAD, Data = Don’t Care  
Table 10. Explanation of Function Register Options  
Option  
Description  
NOP  
No operation instruction used in readback operations.  
Local-Ground-  
Offset Adjust  
Set by the user to enable local-ground-offset adjust function. Cleared by the user to disable local-ground-offset adjust  
function (default). Refer to Features section for further details.  
D0/D1  
Direction  
Set by the user to enable D0/D1 as outputs. Cleared by the user to enable D0/D1 as inputs (default). Refer to the Features  
section for further details.  
D0/D1 Value  
I/O Port Status Bits. Logic values written to these locations determine the logic outputs on the D0 and D1 pins when  
configured as outputs. These bits indicate the status of the D0 and D1 pins when the I/O port is active as an input. When  
enabled as inputs, these bits are don’t cares during a write operation.  
SDO Disable  
CLR  
LOAD  
Set by the user to disable the SDO output. Cleared by the user to enable the SDO output (default).  
Addressing this function resets the DAC outputs to 0 V in twos complement mode and negative full scale in binary mode.  
Addressing this function updates the DAC registers and consequently the analog outputs.  
Rev. PrA | Page 24 of 33  
Preliminary Technical Data  
AD5762R  
DATA REGISTER  
The data register is addressed by setting the three REG bits to ꢂ1ꢂꢀ The DAC address bits select with which DAC channel the data transfer  
is to take place (see Table 8)ꢀ The data bits are in positions DB15 to DBꢂ for the AD5762R as shown in Table 11ꢀ  
Table 11. Programming the AD5762R Data Register  
REG2  
REG1  
REG0  
A2  
A1  
A0  
DB15  
DB14  
DB13  
DB12  
DB11  
DB10  
DB9  
DB8  
DB7  
DB6  
DB5  
DB4  
DB3  
DB2  
DB1  
DB0  
0
1
0
DAC Address  
16-Bit DAC Data  
COARSE GAIN REGISTER  
The coarse gain register is addressed by setting the three REG bits to ꢂ11ꢀ The DAC address bits select with which DAC channel the data  
transfer is to take place (see Table 8)ꢀ The coarse gain register is a 2-bit register and allows the user to select the output range of each DAC  
as shown in Table 13ꢀ  
Table 12. Programming the AD5762R Coarse Gain Register  
REG2  
REG1  
REG0  
A2  
A1  
A0  
DB15 …. DB2  
DB1  
DB0  
0
1
1
DAC Address  
Don’t Care  
CG1  
CG0  
Table 13. Output Range Selection  
Output Range  
10 V (default)  
10.2564 V  
CG1  
CG0  
0
0
1
0
1
0
10.5263 V  
FINE GAIN REGISTER  
The fine gain register is addressed by setting the three REG bits to 1ꢂꢂꢀ The DAC address bits select with which DAC channel the data  
transfer is to take place (see Table 8)ꢀ The AD5762R fine gain register is a 6-bit register and allows the user to adjust the gain of each DAC  
channel by −32 LSBs to +31 LSBs in 1 LSB steps as shown in Table 1. and Table 15ꢀ The adjustment is made to both the positive full-scale  
points and the negative full-scale points simultaneously, each point being adjusted by ½ of one stepꢀ The fine gain register coding is twos  
complementꢀ  
Table 14. Programming AD5762R Fine Gain Register  
REG2  
REG1  
REG0  
A2  
A1  
A0  
DB15:DB6  
DB5  
DB4  
DB3  
DB2  
DB1  
DB0  
1
0
0
DAC Address  
Don’t Care  
FG5  
FG4  
FG3  
FG2  
FG1  
FG0  
Table 15. AD5762R Fine Gain Register Options  
Gain Adjustment  
FG5  
FG4  
FG3  
FG2  
FG1  
FG0  
+31 LSBs  
+30 LSBs  
0
0
-
1
1
-
1
1
-
1
1
-
1
1
-
1
0
-
No Adjustment (default)  
0
-
0
-
0
-
0
-
0
-
0
-
−31 LSBs  
−32 LSBs  
1
1
0
0
0
0
0
0
0
0
1
0
OFFSET REGISTER  
The offset register is addressed by setting the three REG bits to 1ꢂ1ꢀ The DAC address bits select with which DAC channel the data  
transfer is to take place (see Table 8)ꢀ The AD5762R offset register is an 8-bit register and allows the user to adjust the offset of each  
channel by −16 LSBs to +15ꢀ875 LSBs in steps of ⅛ LSB as shown in Table 16 and Table 17ꢀ The offset register coding is twos complementꢀ  
Table 16. Programming the AD5762R Offset Register  
REG2  
REG1  
REG0  
A2  
A1  
A0  
DB15:DB8  
DB7  
DB6  
DB5  
DB4  
DB3  
DB2  
DB1  
DB0  
1
0
1
DAC Address  
Don’t Care  
OF7  
OF6  
OF5  
OF4  
OF3  
OF2  
OF1  
OF0  
Rev. PrA | Page 25 of 33  
AD5762R  
Preliminary Technical Data  
Table 17. AD5762R Offset Register options  
Offset Adjustment  
OF7  
OF6  
OF5  
OF4  
OF3  
OF2  
OF1  
OF0  
+15.875 LSBs  
+15.75 LSBs  
0
0
-
1
1
-
1
1
-
1
1
-
1
1
-
1
1
-
1
1
-
1
0
-
No Adjustment (default)  
0
-
0
-
0
-
0
-
0
-
0
-
0
-
0
-
−15.875 LSBs  
−16 LSBs  
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
0
Rev. PrA | Page 26 of 33  
Preliminary Technical Data  
AD5762R  
Removing Gain Error  
OFFSET AND GAIN ADJUSTMENT WORKED  
EXAMPꢀE  
The AD5762R can eliminate a gain error at negative full-scale  
output in the range of −9ꢀ77 mꢁ to +9ꢀ.6 mꢁ with a step size of  
½ of a 16-bit LSBꢀ  
Using the information provided in the previous section, the  
following worked example demonstrates how the AD5762R  
functions can be used to eliminate both offset and gain errorsꢀ  
As the AD5762R is factory calibrated, offset and gain errors  
should be negligibleꢀ However, errors can be introduced by the  
system that the AD5762R is operating within, for example, a  
voltage reference value that is not equal to +5 ꢁ introduces a  
gain errorꢀ An output range of 1ꢂ ꢁ and twos complement  
data coding is assumedꢀ  
Calculate the step size of the gain adjustment  
20  
216 × 2  
Gain Adjust Step Size =  
=152.59 µV  
Measure the gain error by programming ꢂx8ꢂꢂꢂ to the data  
register and measuring the resulting output voltageꢀ The gain  
error is the difference between this value and −1ꢂ , for this  
example, the gain error is −1ꢀ2 m ꢀ  
Removing Offset Error  
The AD5762R can eliminate an offset error in the range of −.ꢀ88  
mꢁ to +.ꢀ8. mꢁ with a step size of ⅛ of a 16-bit LSBꢀ  
How many gain adjustment steps does this value represent?  
Measured Gain Value  
Gain Step Size  
1.2 mV  
Number of Steps =  
=
= 8 Steps  
152.59 µV  
Calculate the step size of the offset adjustment,  
2ꢂ  
Offset Adjust Step Size =  
= 38ꢀ1. µV  
16 × 8  
The gain error measured is negative (in terms of magnitude);  
therefore, a positive adjustment of eight steps is requiredꢀ The  
gain register is 6 bits wide and the coding is twos complement,  
the required gain register value can be determined as follows:  
2
Measure the offset error by programming ꢂxꢂꢂꢂꢂ to the data  
register and measuring the resulting output voltage, for this  
example the measured value is +61. µ ꢀ  
Convert adjustment value to binary; ꢂꢂ1ꢂꢂꢂꢀ  
How many offset adjustment steps does this value represent?  
The value to be programmed to the gain register is simply this  
binary numberꢀ  
Measured Offset Value  
Offset Step Size  
614 µV  
Numberof Steps =  
=
=16 Steps  
38.14 µV  
The offset error measured is positive, therefore, a negative  
adjustment of 16 steps is requiredꢀ The offset register is 8 bits  
wide and the coding is twos complementꢀ The required offset  
register value can be calculated as follows:  
Convert adjustment value to binary; ꢂꢂꢂ1ꢂꢂꢂꢂꢀ  
Convert this to a negative twos complement number by  
inverting all bits and adding 1; 1111ꢂꢂꢂꢂꢀ  
1111ꢂꢂꢂꢂ is the value that should be programmed to the offset  
registerꢀ  
Note: This twos complement conversion is not necessary in the  
case of a positive offset adjustmentꢀ The value to be  
programmed to the offset register is simply the binary  
representation of the adjustment valueꢀ  
Rev. PrA | Page 27 of 33  
AD5762R  
Preliminary Technical Data  
AD5762R FEATURES  
If the ISCC pin is left unconnected, the short circuit current  
limit defaults to 5 mAꢀ It should be noted that limiting the short  
circuit current to a small value can affect the slew rate of the  
output when driving into a capacitive load, therefore, the value  
of short-circuit current programmed should take into account  
the size of the capacitive load being drivenꢀ  
ANAꢀOG OUTPUT CONTROꢀ  
In many industrial process control applications, it is vital that  
the output voltage be controlled during power-up and during  
brownout conditionsꢀ When the supply voltages are changing,  
the ꢁOUT pins are clamped to ꢂ ꢁ via a low impedance pathꢀ  
To prevent the output amp being shorted to ꢂ ꢁ during this  
time, transmission gate G1 is also opened (see Figure .1)ꢀ These  
conditions are maintained until the power supplies stabilize and  
a valid word is written to the DAC registerꢀ At this time, G2  
opens and G1 closesꢀ Both transmission gates are also externally  
DIGITAꢀ I/O PORT  
The AD5762R contain a 2-bit digital I/O port (D1 and Dꢂ),  
these bits can be configured as inputs or outputs independently,  
and can be driven or have their values read back via the serial  
interfaceꢀ The I/O port signals are referenced to DꢁCC and  
DGNDꢀ When configured as outputs, they can be used as  
control signals to multiplexers or can be used to control  
calibration circuitry elsewhere in the systemꢀ When configured  
as inputs, the logic signals from limit switches, for example can  
be applied to Dꢂ and D1 and can be read back via the digital  
interfaceꢀ  
controllable via the Reset In (  
) control inputꢀ For  
RSTIN  
instance, if  
is driven from a battery supervisor chip, the  
RSTIN  
input is driven low to open G1 and close G2 on power-  
RSTIN  
off or during a brownoutꢀ Conversely, the on-chip voltage  
detector output ( ) is also available to the user to  
RSTOUT  
control other parts of the systemꢀ The basic transmission gate  
functionality is shown in Figure .1ꢀ  
RSTOUT  
RSTIN  
DIE TEMPERATURE SENSOR  
The on-chip die temperature sensor provides a voltage output  
that is linearly proportional to the centigrade temperature scaleꢀ  
Its nominal output voltage is 1ꢀ. ꢁ at +25°C die temperature,  
varying at 5 mꢁ/°C, giving a typical output range of 1ꢀ175 ꢁ to  
1ꢀ9 ꢁ over the full temperature rangeꢀ Its low output impedance,  
and linear output simplify interfacing to temperature control  
circuitry and A/D convertersꢀ The temperature sensor is  
provided as more of a convenience rather than a precise feature;  
it is intended for indicating a die temperature change for  
recalibration purposesꢀ  
VOLTAGE  
MONITOR  
AND  
CONTROL  
G1  
VOUTA  
AGNDA  
G2  
Figure 41. Analog Output Control Circuitry  
DIGITAꢀ OFFSET AND GAIN CONTROꢀ  
ꢀOCAꢀ GROUND OFFSET ADJUST  
The AD5762R incorporates a digital offset adjust function with  
The AD5762R incorporates a local-ground-offset adjust feature  
which when enabled in the function register adjusts the DAC  
outputs for voltage differences between the individual DAC  
ground pins and the REFGND pin ensuring that the DAC  
output voltages are always with respect to the local DAC ground  
pinꢀ For instance, if pin AGNDA is at +5 mꢁ with respect to the  
REFGND pin and ꢁOUTA is measured with respect to  
AGNDA then a −5mꢁ error results, enabling the local-ground-  
offset adjust feature adjusts ꢁOUTA by +5 m, eliminating the  
errorꢀ  
a
16 LSB adjust range and ꢂꢀ125 LSB resolutionꢀ The gain  
register allows the user to adjust the AD5762Rs full-scale  
output rangeꢀ The full-scale output can be programmed to  
achieve full-scale ranges of 1ꢂ , 1ꢂꢀ25 , and 1ꢂꢀ5 ꢀ A fine  
gain trim is also availableꢀ  
PROGRAMMABꢀE SHORT-CIRCUIT PROTECTION  
The short-circuit current of the output amplifiers can be pro-  
grammed by inserting an external resistor between the ISCC  
pin and PGNDꢀ The programmable range for the current is  
5ꢂꢂ µA to 1ꢂ mA, corresponding to a resistor range of 12ꢂ kΩ  
to 6 kΩ ꢀ The resistor value is calculated as follows:  
60  
R =  
Isc  
Rev. PrA | Page 28 of 33  
Preliminary Technical Data  
AD5762R  
APPLICATIONS INFORMATION  
TYPICAꢀ OPERATING CIRCUIT  
Precision Voltage Reference Selection  
To achieve the optimum performance from the AD5762R over  
its full operating temperature range, an external voltage  
reference must be usedꢀ Thought should be given to the  
selection of a precision voltage referenceꢀ The voltage applied to  
the reference input is used to provide a buffered positive and  
negative reference for the DAC coresꢀ Therefore, any error in  
the voltage reference is reflected in the outputs of the deviceꢀ  
Figure .2 shows the typical operating circuit for the AD5762Rꢀ  
The only external components needed for this precision 16-bit  
DAC are decoupling capacitors on the supply pins and reference  
inputs, and an optional short-circuit current setting resistorꢀ  
Because the AD5762R incorporates a voltage reference and  
reference buffers, it eliminates the need for an external bipolar  
reference and associated buffersꢀ This leads to an overall savings  
in both cost and board spaceꢀ  
There are four possible sources of error to consider when  
choosing a voltage reference for high accuracy applications:  
initial accuracy, temperature coefficient of the output voltage,  
long term drift, and output voltage noiseꢀ  
In Figure .2, ꢁDD and ꢁSS are both connected to 15 , but ꢁDD  
and ꢁSS can operate with supplies from 11ꢀ. ꢁ to 16ꢀ5 ꢀ In  
Figure .2, AGNDA and AGNDB are connected to REFGNDꢀ  
+15V –15V  
Initial accuracy error on the output voltage of an external refer-  
ence could lead to a full-scale error in the DACꢀ Therefore, to  
minimize these errors, a reference with low initial accuracy  
error specification is preferredꢀ Choosing a reference with an  
output trim adjustment, such as the ADR.25, allows a system  
designer to trim system errors out by setting the reference  
voltage to a voltage other than the nominalꢀ The trim ad-  
justment can also be used at temperature to trim out any errorꢀ  
10µF  
10µF  
100nF  
100nF  
TEMP  
+5V  
BIN/2sCOMP  
32 31 30 29 28 27 26 25  
Long term drift is a measure of how much the reference output  
voltage drifts over timeꢀ A reference with a tight long-term drift  
specification ensures that the overall solution remains relatively  
stable over its entire lifetimeꢀ  
1
2
3
4
5
6
7
8
24  
23  
22  
21  
20  
19  
18  
17  
SYNC  
SCLK  
SDIN  
SDO  
SYNC  
NC  
NC  
SCLK  
SDIN  
SDO  
CLR  
LDAC  
D0  
VOUTA  
AGNDA  
AGNDB  
VOUTB  
NC  
VOUTA  
VOUTB  
AD5762R  
LDAC  
D0  
The temperature coefficient of a references output voltage  
affects INL, DNL, and TUEꢀ A reference with a tight  
temperature coefficient specification should be chosen to  
reduce the dependence of the DAC output voltage on ambient  
conditionsꢀ  
NC  
D1  
D1  
9
10 11 12 13 14 15 16  
RSTOUT  
RSTIN  
10µF  
In high accuracy applications, which have a relatively low noise  
budget, reference output voltage noise needs to be consideredꢀ  
Choosing a reference with as low an output noise voltage as  
practical for the system resolution required is importantꢀ  
Precision voltage references such as the ADR.35 (XFET design)  
produce low output noise in the ꢂꢀ1 Hz to 1ꢂ Hz regionꢀ  
However, as the circuit bandwidth increases, filtering the output  
of the reference may be required to minimize the output noiseꢀ  
100nF  
10µF  
+5V  
+15V –15V  
Figure 42. Typical Operating Circuit  
Table 18. Some Precision References Recommended for Use with the AD5762R  
Part No. Initial Accuracy(mV Max) ꢀong-Term Drift (ppm Typ) Temp Drift (ppm/°C Max) 0.1 Hz to 10 Hz Noise (µV p-p Typ)  
ADR435  
ADR425  
ADR02  
ADR395  
AD586  
6
6
5
6
30  
50  
50  
50  
15  
3
3
3
25  
10  
3.4  
3.4  
15  
5
2.5  
4
Rev. PrA | Page 29 of 33  
AD5762R  
Preliminary Technical Data  
LAYOUT GUIDELINES  
1
µCONTROLLER  
ADuM1400  
In any circuit where accuracy is important, careful consider-  
ation of the power supply and ground return layout helps to  
ensure the rated performanceꢀ The printed circuit board on  
which the AD5762R is mounted should be designed so that the  
analog and digital sections are separated and confined to  
certain areas of the boardꢀ If the AD5762R is in a system where  
multiple devices require an AGND-to-DGND connection, the  
connection should be made at one point onlyꢀ The star ground  
point should be established as close as possible to the deviceꢀ  
The AD5762R should have ample supply bypassing of 1ꢂ µF in  
parallel with ꢂꢀ1 µF on each supply located as close to the  
package as possible, ideally right up against the deviceꢀ The 1ꢂ  
µF capacitors are the tantalum bead typeꢀ The ꢂꢀ1 µF capacitor  
should have low effective series resistance (ESR) and low  
effective series inductance (ESI) such as the common ceramic  
types, which provide a low impedance path to ground at high  
frequencies to handle transient currents due to internal logic  
switchingꢀ  
V
V
V
V
V
IA  
OA  
OB  
OC  
OD  
ENCODE  
ENCODE  
ENCODE  
ENCODE  
DECODE  
DECODE  
DECODE  
DECODE  
SERIAL CLOCK OUT  
TO SCLK  
TO SDIN  
TO SYNC  
TO LDAC  
V
V
V
IB  
IC  
ID  
SERIAL DATA OUT  
SYNC OUT  
CONTROL OUT  
1
ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 43. Isolated Interface  
MICROPROCESSOR INTERFACING  
Microprocessor interfacing to the AD5762R is via a serial bus  
that uses standard protocol compatible with microcontrollers  
and DSP processorsꢀ The communications channel is a 3-wire  
(minimum) interface consisting of a clock signal, a data signal,  
and a synchronization signalꢀ The AD5762R requires a 2.-bit  
data-word with data valid on the falling edge of SCLKꢀ  
The power supply lines of the AD5762R should use as large a  
trace as possible to provide low impedance paths and reduce  
the effects of glitches on the power supply lineꢀ Fast switching  
signals, such as clocks, should be shielded with digital ground  
to avoid radiating noise to other parts of the board, and should  
never be run near the reference inputsꢀ A ground line routed  
between the SDIN and SCLK lines helps reduce cross-talk  
between them (not required on a multilayer board, which has a  
separate ground plane, however, it is helpful to separate the  
lines)ꢀ It is essential to minimize noise on the reference inputs,  
because it couples through to the DAC outputꢀ Avoid crossover  
of digital and analog signalsꢀ Traces on opposite sides of the  
board should run at right angles to each otherꢀ This reduces the  
effects of feed through on the boardꢀ A microstrip technique is  
recommended, but not always possible with a double-sided  
boardꢀ In this technique, the component side of the board is  
dedicated to ground plane, while signal traces are placed on the  
solder sideꢀ  
For all the interfaces, the DAC output update can be done  
automatically when all the data is clocked in, or it can be done  
under the control of LDACꢀ The contents of the DAC register  
can be read using the readback functionꢀ  
AD5762R to MC68HC11 Interface  
Figure .. shows an example of a serial interface between the  
AD5762R and the MC68HC11 microcontrollerꢀ The serial  
peripheral interface (SPI) on the MC68HC11 is configured for  
master mode (MSTR = 1), clock polarity bit (CPOL = ꢂ), and the  
clock phase bit (CPHA = 1)ꢀ The SPI is configured by writing to the  
SPI control register (SPCR) (see the 68HC11User Manual)ꢀ SCK of  
the MC68HC11 drives the SCLK of the AD5762R, the MOSI  
output drives the serial data line (DIN) of the AD5762R, and the  
MISO input is driven from SDOꢀ The SYNC is driven from one of  
the port lines, in this case PC7ꢀ  
GAꢀVANICAꢀꢀY ISOꢀATED INTERFACE  
In many process control applications, it is necessary to provide  
an isolation barrier between the controller and the unit being  
controlled to protect and isolate the controlling circuitry from  
any hazardous common-mode voltages that might occurꢀ  
Isocouplers provide voltage isolation in excess of 2ꢀ5 kꢁꢀ The  
serial loading structure of the AD5762R makes it ideal for  
isolated interfaces, because the number of interface lines is kept  
to a minimumꢀ Figure .3 shows a .-channel isolated interface  
to the AD5762R using an ADuM1.ꢂꢂꢀ For more information,  
go to wwwꢀanalogꢀcomꢀ  
Rev. PrA | Page 30 of 33  
Preliminary Technical Data  
AD5762R  
When data is being transmitted to the AD5762R, the SYNC line  
(PC7) is taken low and data is transmitted MSB firstꢀ Data  
appearing on the MOSI output is valid on the falling edge of  
SCKꢀ Eight falling clock edges occur in the transmit cycle, so, in  
order to load the required 2.-bit word, PC7 is not brought high  
until the third 8-bit word has been transferred to the DACs  
input shift registerꢀ  
The 8XC51 transmits data in 8-bit bytes with only eight falling  
clock edges occurring in the transmit cycleꢀ Because the DAC  
expects a 2.-bit word, SYNC (P3ꢀ3) must be left low after the  
first eight bits are transferredꢀ After the third byte has been  
transferred, the P3ꢀ3 line is taken highꢀ The DAC can be  
LDAC  
updated using  
via P3ꢀ. of the 8XC51ꢀ  
AD5762R to ADSP2101/ADSP2103 Interface  
1
MC68HC111  
AD5762R  
An interface between the AD5762R and the ADSP21ꢂ1/  
ADSP21ꢂ3 is shown in Figure .6ꢀ The ADSP21ꢂ1/ ADSP21ꢂ3  
should be set up to operate in the SPORT transmit alternate  
framing modeꢀ The ADSP21ꢂ1/ADSP21ꢂ3 are programmed  
through the SPORT control register and should be configured  
as follows: internal clock operation, active low framing, and 2.-  
bit word lengthꢀ  
MISO  
MOSI  
SCK  
PC7  
SDO  
SDIN  
SCLK  
SYNC  
Transmission is initiated by writing a word to the TX register  
after the SPORT has been enabledꢀ As the data is clocked out of  
the DSP on the rising edge of SCLK, no glue logic is required to  
interface the DSP to the DACꢀ In the interface shown, the DAC  
output is updated using the LDAC pin via the DS ꢀ Alterna-  
tively, the LDAC input could be tied permanently low, and then  
the update takes place automatically when TFS is taken highꢀ  
1
ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 44. AD5762R to MC68HC11 Interface  
LDAC is controlled by the PC6 port outputꢀ The DAC can be  
updated after each 3-byte transfer by bringing LDAC lowꢀ This  
example does not show other serial lines for the DACꢀ For  
example, if CLR were used, it could be controlled by port  
output PC5ꢀ  
AD5762R1  
ADSP2101/  
ADSP21031  
AD5762R to 8XC51 Interface  
DR  
DT  
SDO  
The AD5762R requires a clock synchronized to the serial dataꢀ  
For this reason, the 8XC51 must be operated in Mode ꢂꢀ In this  
mode, serial data enters and exits through RXD, and a shift  
clock is output on TXDꢀ  
SDIN  
SCLK  
SCLK  
TFS  
SYNC  
LDAC  
RFS  
FO  
P3ꢀ3 and P3ꢀ. are bit programmable pins on the serial port and  
SYNC  
LDAC  
are used to drive  
and  
, respectivelyꢀ The 8CX51  
1
provides the LSB of its SBUF register as the first bit in the data  
streamꢀ The user must ensure that the data in the SBUF register  
is arranged correctly, because the DAC expects MSB firstꢀ When  
data is to be transmitted to the DAC, P3ꢀ3 is taken lowꢀ Data on  
RXD is clocked out of the microcontroller on the rising edge of  
TXD and is valid on the falling edgeꢀ As a result, no glue logic is  
required between this DAC and the microcontroller interfaceꢀ  
ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 46. AD5762R to ADSP2101/ADSP2103 Interface  
AD5762R to PIC16C6x/7x Interface  
The PIC16C6x/7x synchronous serial port (SSP) is configured  
as an SPI master with the clock polarity bit set to ꢂꢀ This is done  
by writing to the synchronous serial port control register  
(SSPCON)ꢀ See the PIC16/17 Microcontroller User Manualꢀ In  
AD5762R1  
8XC511  
SYNC  
this example, I/O port RA1 is being used to pulse  
and  
enable the serial port of the AD5762Rꢀ This microcontroller  
transfers only eight bits of data during each serial transfer  
operation; therefore, three consecutive write operations are  
neededꢀ Figure .7 shows the connection diagramꢀ  
RxD  
SDIN  
TxD  
P3.3  
P3.4  
SCLK  
SYNC  
LDAC  
1
ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 45. AD5762R to 8XC51 Interface  
Rev. PrA | Page 31 of 33  
AD5762R  
Preliminary Technical Data  
AD5762R1  
PIC16C6x/7x1  
EVAꢀUATION BOARD  
The AD5762R performance can be evaluated via the AD576.R  
evaluation boardꢀ  
SDI/RC4  
SDO/RC5  
SCLK/RC3  
RA1  
SDO  
SDIN  
SCLK  
SYNC  
The AD576.R comes with a full evaluation board to aid  
designers in evaluating the high performance of the part with a  
minimum of effortꢀ All that is required with the evaluation  
board is a power supply and a PCꢀ The AD576.R evaluation kit  
includes a populated, tested AD576.R printed circuit boardꢀ  
The evaluation board interfaces to the USB interface of the PCꢀ  
Software is available with the evaluation board, which allows  
the user to easily program the AD576.Rꢀ The software runs on  
any PC that has Microsoft® Windows® 2ꢂꢂꢂ/XP installedꢀ  
1
ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 47. AD5762R to PIC16C6x/7x Interface  
An application note is available that gives full details on  
operating the evaluation boardꢀ  
Rev. PrA | Page 32 of 33  
Preliminary Technical Data  
OUTLINE DIMENSIONS  
AD5762R  
1.20  
MAX  
0.75  
0.60  
0.45  
9.00 BSC SQ  
25  
32  
1
24  
PIN 1  
7.00  
BSC SQ  
TOP VIEW  
(PINS DOWN)  
0° MIN  
1.05  
1.00  
0.95  
0.20  
0.09  
7°  
8
17  
3.5°  
0.15  
0.05  
9
16  
0°  
SEATING  
PLANE  
0.08 MAX  
COPLANARITY  
VIEW A  
0.80  
0.45  
0.37  
0.30  
BSC  
LEAD PITCH  
VIEW A  
ROTATED 90° CCW  
COMPLIANT TO JEDEC STANDARDS MS-026ABA  
Figure 48. 32-Lead Thin Plastic Dual Flat Package [TQFP]  
(SU-32-2)  
Dimensions shown in millimeters  
ORDERING GUIDE1  
Internal  
Reference  
Package  
Option  
Model  
Function  
INꢀ  
1 LSB max  
1 LSB max  
Temperature  
−40°C to +85°C  
−40°C to +85°C  
Package Description  
32-lead TQFP  
32-lead TQFP  
AD5762RCSUZ  
AD5762RCSUZ-REEL7  
Dual 16-bit DAC  
Dual 16-bit DAC  
+5V  
+5V  
SU-32-2  
SU-32-2  
©2007 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
PR07248-0-12/07(PrA)  
Rev. PrA | Page 33 of 33  

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