AD6421AST [ADI]
GSM/DCS1800/PCS1900 Baseband Processing Chipset; GSM / DCS1800 / PCS1900基带处理芯片组
| 型号： | AD6421AST |
| 厂家： | 
ADI |
| 描述： | GSM/DCS1800/PCS1900 Baseband Processing Chipset |
| 文件： | 总8页 (文件大小：70K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
GSM/DCS1800/PCS1900
Baseband Processing Chipset
a
AD20msp415
SYSTEM ARCH ITECTURE
FEATURES
Com plete Baseband Processing Chipset Perform s:
Speech Coding/ Decoding (GSM 06.XX)
Channel Coding/ Decoding (GSM 05.03)
Equalization w ith 16-State Viterbi, Soft Decision
All ADC and DAC Interface Functions
Includes All Radio, Auxiliary and Voice Interfaces
Support for GSM Data Services
AD20msp415
VOICEBAND/
BASEBAND
CODEC
AD6421
256K 16
ROM
Em bedded 16-Bit Microcontroller
Em bedded 16-Bit DSP
Integrated SIM and Keyboard Interface
Interface to AD6430 GSM RF Chipset
Interface to EFR Coprocessor
RADIO
SIM
128
RAM
8
DISPLAY
2K
GSM
PROCESSOR
8
EEPROM
AD6422
DATA
TERMINAL
ADAPTER
J TAG Boundary Scan
KEYPAD
Layer 1 Softw are Provided w ith Chipset
Softw are Com patible w ith AD20m sp410
Full Phase 2 Protocol Stack Softw are Available
Full Reference Design Available for
Baseband Section and Radio Section
Ultralow Pow er Design
CH IP SET CO MP O NENTS
GSM P r ocessor (GSMP )
2.7 V to 3.3 V Operating Voltage
T he AD6422 combines application specific hardware, an em-
bedded 16-bit DSP and an embedded 16-bit microcontroller
(Hitachi H8/300H). It performs channel coding and decoding
and executes the protocol stack and user software. T he DSP
implements full rate speech transcoding according to GSM
specifications, including Discontinuous T ransmission (DT X)
and Comfort Noise Insertion (CNI). A high performance soft-
decision Viterbi equalizer is also implemented in software em-
bedded in the DSP. T he embedded microcontroller executes
the Layer 1, 2, 3 and user MMI software. T he required Layer 1
software is supplied with the chipset. To ensure minimum power
consumption, the GSMP has been designed to control all the
power-down functions of the other components in the handset.
Intelligent Pow er Managem ent Features
XXX m W Pow er Dissipation in Talk Mode
XX m W Pow er Dissipation in Standby Mode
Tw o TQFP Devices, Occupying Less than 7.5 cm2
APPLICATIONS
GSM/ DCS1800/ PCS1900 Mobile Radios
GENERAL D ESCRIP TIO N
The Analog Devices GSM Baseband Processing Chipset provides
a competitive solution for GSM based Mobile Radio Systems.
It is designed to be fully integrated, easy to use, and compat-
ible with a wide range of product solutions. Examples are
GSM900, DCS1800, PCS1900 handsets and PCMCIA data
cards. T he AD20msp415 is the higher integrated successor of
the AD20msp410 chipset, which passed European GSM T ype
Approval in June, 1996.
Voiceband/Baseband Conver ter (VBC)
T he AD6421 performs the voiceband and baseband analog-to-
digital and digital-to-analog conversions, interfacing the digital
sections of the chipset to the microphone, loudspeaker and radio
section. In addition, the VBC contains all the auxiliary convert-
ers for burst-ramping, AFC, AGC, battery and temperature
monitoring. T he chipset interfaces directly with the radio and
supplies all the synthesizer and timing control signals required
to support two synthesizers and a variety of radio architectures
including the AD6450 GSM RF-Chipset.
T he chipset consists of two highly integrated, sub-micron, low
power CMOS components that perform the entire baseband
signal processing of the GSM handset. T he system architecture
is designed to be easily integrated into current designs and form
the basis for next generation designs.
Softwar e
T he required Layer 1 software is supplied with the chipset. In
addition, an object code license is available for Layers 2 and 3 of
the protocol stack.
T he chipset uses an operating supply voltage of 2.7 V to 3.3 V
which, coupled with the extensive power management features,
significantly reduces the drain on battery power and extends the
handsets talk time and standby time.
REV. 0
Inform ation furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assum ed by Analog Devices for its
use, nor for any infringem ents of patents or other rights of third parties
which m ay result from its use. No license is granted by im plication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norw ood, MA 02062-9106, U.S.A.
Tel: 781/ 329-4700
Fax: 781/ 326-8703
World Wide Web Site: http:/ / w w w .analog.com
© Analog Devices, Inc., 1997
AD20msp415
ARCH ITECTURE O VERVIEW
channel coding function also supports data transmission at full
rate and half rate. After the interleave process (if necessary) the
data is encrypted using the required A5/1 or A5/2 encryption
algorithm. Data is then formatted into bursts, with the required
timing and training sequences, and sent to the VBC through a
dedicated serial port.
Analog Devices and T he T echnology Partnership (T T P) pro-
vide a cost effective and proven method of attaining the baseband
processing subsystem and protocol stack software. T his data
sheet includes functional descriptions of the baseband process-
ing subsystem and the Protocol Stack Layer 1. T he T echnology
Partnership can provide licenses to software and reference de-
signs in all areas of a GSM handportable terminal.
GMSK Modula tion a nd D/A Conver sion (VBC)
T he VBC receives data at 270 kb/s. T he VBC uses an on-chip
lookup table to perform GMSK modulation. A pair of 10-bit
matched differential DACs convert the modulated data and pass
I and Q analog data to the transmit section of the radio subsystem.
For detailed information about the individual chipset compo-
nents, please refer to the AD6421 (VBC) and AD6422 (GSMP)
data sheets for electrical characteristics and timing information.
D ownlink
FUNCTIO NAL D ESCRIP TIO N
T he downlink baseband processing functions include the follow-
ing operations:
Figure 1 is a functional block diagram of the GSM baseband
processing chipset. T he chipset can be viewed as a functional
block that contains a number of discrete functional units. T he
electrical and functional interfaces to the rest of the system are
briefly described at the end of this section and described in
detail in the individual data sheets for each component.
Ana log-to-Digita l Conver sion (VBC)
T he receiver I and Q signals are sampled by a pair of ADCs at
270 kHz. T he I and Q samples are transferred to the GSMP
through a dedicated receive path serial port.
Equa liza tion (GSMP)
T he equalizer recovers and demodulates the received signal and
establishes local timing and frequency references for the mobile
unit as well as RSSI calculation. T he equalization algorithm is a
version of the Maximum Likelihood Sequence Estimation (MLSE)
using the Viterbi algorithm. T wo confidence bits per symbol
provide additional information about the accuracy of each deci-
sion to the channel codec’s convolutional decoder. T he equal-
izer outputs a sequence of bits including the confidence bits.
VBC
GSMP
VOICE
ADC
SPEECH
ENCODE
CHANNEL
ENCODE
INTER-
LEAVE
BASEBAND
DAC
ENCRYPT
DECRYPT
VOICE
DAC
SPEECH
DECODE
CHANNEL
DECODE
DEINTER-
LEAVE
BASEBAND
ADC
EQUALIZER
Channel D ecoding (GSMP )
CONTROL + MMI + I/O
Data is decrypted as required, using the A5/1 or A5/2 decryption
algorithm prior to the deinterleave process. T he deinterleave
process is an exact inversion of the interleave process used by
the transmit section. T he decode function then performs convo-
lutional decoding and parity check. T he convolutional decoder
uses a Viterbi algorithm, with two soft decision confidence bits
supplied by the equalizer. Error control mechanisms are used to
ensure adequate bad frame indication.
Figure 1. Functional Block Diagram
Uplink
T he uplink baseband processing functions include the following
operations:
Ana log-to-Digita l Voice Conver sion (VBC)
Speech Decoding (GSMP)
A conventional microphone, connected directly to the VBC,
provides an analog input signal to the ADC. T he analog voice
signal is sampled at 8 kHz, producing 13-bit linear values corre-
sponding to the magnitude of the input. T he ADC includes all
required filtering to meet the GSM specifications. T he sampled
voice data is passed to the GSMP through a dedicated serial
port.
Encoded speech data is transferred at 20 ms intervals in blocks
of 260 bits plus the Bad Frame Indicator (BFI). T he speech
decoder supports a Comfort Noise Insertion (CNI) function
that inserts a predefined silence descriptor into the decoding
process. T he GSMP also implements control of talker side-tone
and short term echo cancellation. The resulting data, at 104 kb/s,
is transferred to the VBC through a dedicated serial path.
Speech Encoding (GSMP)
Voice Digita l-to-Ana log Conver sion (VBC)
The GSMP receives the voice data stream from the VBC and
encodes the data from 104 kb/s to 13 kb/s. The algorithm used is
Regular Pulse Excitation, with Long T erm Prediction (RPE-
LT P) as specified in the 06-series of GSM Recommendations.
T he Voice DAC function of the VBC operates at 8 kHz and
includes all the needed filtering. T he analog signal can be con-
trolled in volume and directly drive a small earpiece as well as a
separate auxiliary output.
Cha nnel Coding (GSMP)
The information received from the speech coder contains param-
eters that have different levels of priority. T hese are protected to
different levels within the channel coding. T he encode protec-
tion process incorporates block coding and convolutional
encoding. In addition to the normal speech traffic channels, the
–2–
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AD20msp415
Autom atic Gain Contr ol (AGC)
AUXILIARY SYSTEM FUNCTIO NS
T he mobile radio has to cope with a wide range of input signal
levels. T he major part of the overall gain is provided in the IF
amplifier. T he incoming signal level is analyzed in the GSMP
and a digital gain control signal is sent to the VBC. T he AGC
DAC generates the appropriate analog control signal for the IF
amplifier.
T he GSMP and the VBC perform a number of auxiliary func-
tions that are essential to build a complete mobile radio.
A general radio section constitutes the three functions of trans-
mitter, receiver and synthesizer. Figure 2 shows how the baseband
chipset interfaces to a typical radio architecture. T he transmitter
is fed with baseband analog I and Q signals from the VBC and
upconverted to 900 MHz for GSM applications and 1800 MHz
for PCN applications.
Autom atic Fr equency Contr ol (AFC)
T he mobile radio tracks the master clock provided by the base
station to compensate for temperature/frequency drifts in the
crystal oscillator. Drift of the crystal oscillator over time and
temperature has to be compensated as well as frequency shifts
due to the Doppler effect in the case of a moving mobile radio.
T he received signal is analyzed in the GSMP and a digital con-
trol signal is generated. T his signal is sent to the AFC DAC in
the VBC to control the voltage controlled, temperature compen-
sated crystal oscillator (VCT CXO).
A dedicated power amplifier increases the RF signal to the
required level. T he receiver amplifies the antenna signal, down-
converts it to an intermediate frequency (IF ) and amplifies it
there again. After second conversion to baseband the I and Q
components of the signal are fed into the VBC.
T he three auxiliary functions, AGC, AFC and Power Ramping
are included to interface to the radio section.
P ower Ram p Envelope
Synthesizer Contr ol
T o meet the spectral and time-domain specifications of the
transmitted output signal, the burst has to follow a specified
power envelope. T he envelope for the power profile originates in
the GSMP as a set of coefficients, down-loaded and stored in
the VBC. T his envelope profile is fed to the RAMP DAC on the
VBC with each burst. T he analog output is fed into the RF
power amplifier, controlling the power profile and absolute level
of the transmitted data. T he power control loop of the power
amplifier can also feedback an error control signal that indicates
whether the output functions are out of specification and the
radio can be switched off accordingly.
T he GSMP and the respective parts of the Layer 1 software
control the overall timing and frequency generation of the radio
subsystem. T his includes control signals for two synthesizers,
power-down control signals and power amplifier monitor sig-
nals. Detailed information can be found in the AD6422 data
sheet.
BASEBAND/AUXILIARY SECTION OF VBC
Tx DAC
BURST
STORE
GSMSK
MODULATOR
PA
Q
Tx DAC
SERIAL
BASEBAND
PORT
I
DIGITALFIRFILTER
DIGITALFIRFILTER
Rx ADC
Rx ADC
IF
Q
AGC
AGC DAC
RAMP CONTROL
SERIAL
AUXILIARY
PORT
RAMP RAM
SUB DAC
RAMP DAC
AFC DAC
AFC
13MHz
VCTCXO
CLOCK
GSMP
PAERROR
RADIO
SUBSYSTEM
CONTROL
SYNTHESIZERS
Figure 2. Control of Radio Subsystem
REV. 0
–3–
AD20msp415
Gener ation of Auxiliar y Audio Signals
T he Command Interpreter resident on the mobile supports a
serial interface protocol with the DT A by which both traffic data
and control information are communicated.
Under control of Layer 1, the GSMP can generate a variety of
fixed and user-programmable tones. T his includes all standard
DT MF and Call Progress tones as well as user defined tones.
T he tone structure can consist of up to four frequency compo-
nents with individual durations. T he GSMP also generates
T alker Sidetone as specified in the GSM recommendations. In
comparison to traditional hardware implementations, this soft-
ware implementation provides manufacturing flexibility over a
wide range of speaker/microphone sensitivities.
HANDSET
EXTERNAL
DATA TERMINAL
ADAPTER
APPLICATION LAYER
FOREGROUND
COMMAND
INTERPRETER
APPLICATION LAYER
BACKGROUND
V110'
PROTOCOL STACK
LAYERS 2/3
FRAME
ROUTER
FRAMES
DATA TERMINAL
ADAPTER
AD6421
PROTOCOL STACK
LAYER 1
MAN MACHINE INTERFACE
DATA APPLICATION
LAYER 2 RELAY (L2R)
RADIO LINK PROTOCOL (RLP)
RATE ADAPTION
ADC
FILTER
ADC
PGA
PGA
MUX
MUX
AD20msp415
CHIPSET
SERIAL
VOICE
PORT
CAR
KIT
FILTER
Figure 4. Im plem entation of Data Services
SO FTWARE IMP LEMENTATIO NS
TEMP
SERIAL
AUXILIARY
PORT
U
AUXILIARY ADC
A full implementation of the GSM Layer 1 functionality is sup-
plied as an object code module, for execution on the controller,
embedded in the GSMP. Functions performed by this software
include:
MUX
BAT
OTHER
Figure 3. Audio/Auxiliary Section of the AD6421
• Initial scan of GSM/E-GSM/PCN band and selection of
strongest thirty channels as required by 03.22 and 05.08.
Figure 3 shows the audio section and the auxiliary ADC of the
VBC. Input signals can come from either a directly connected
microphone or from a remote microphone in a car kit. Input
gain can be set to 0 dB or +26 dB. T he output signal can be
directly connected to a small earpiece and, for further amplifica-
tion, to an external car kit. The output PGA can be programmed
for –15 dB or +6 dB.
• Mobile oscillator adjustment, timing synchronization and
BCCH decoding from serving cell (camping-on).
• Base station frequency and timing measurements and BSIC
extraction from neighbor cells under control of Layer 3.
• Frequency hopping according to 05.02.
• Full implementation of discontinuous reception (DRX) and
transmission (DT X).
D ATA SERVICES
Data Services is considered to be an essential feature for GSM
terminals and the AD20msp415 chipset is designed to provide
flexible and low cost implementation of Data Services supported
via the GSM air interface.
• Reporting of received level and signal quality.
• Full engineering and test mode support.
• Support for all phase 1 and phase 2 handover modes.
• SIM Interface driver.
T he selected system architecture shown in Figure 4 provides for
minimum terminal Bill of Materials, the lowest possible number
of interconnection points and the lowest power consumption
when running speech traffic only. T he GSMP performs full
channel coding and decoding for T CH/F9.6, T CH/F4.8 and
T CH/F2.4 data rates. T he interface to the chipset is a user-
configurable, 3-wire synchronous or asynchronous serial inter-
face supplying V110´ data packets as defined in GSM 05.03,
combined with protocol information and control to the Applica-
tion Layer.
• Message interfacing to Layer 3 (Radio Resources Manager)
and Layer 2 (data link layer, both signaling and data).
• External functions for AGC, AFC and synthesizer setting are
called by Layer 1. T hese allow the user to configure the sys-
tem for a wide range of radio architectures.
T he higher layers of the protocol stack also reside on this em-
bedded processor.
External to the terminal is the Data T erminal Adapter (DT A)
that runs the Data Services Software. Included in the DT A are
the rate adaptation functions and the Data Services application.
CAUTIO N
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD20msp415 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. T herefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. 0
AD20msp415
P O WER D ISSIP ATIO N CO NSID ERATIO NS
D igital Inter face to Keypad
In mobile applications, minimizing the power consumption of
all devices is critical to achieve longer standby and talk times. In
a GSM handset the baseband subsystem dominates the current
consumption of the phone in standby. T he design of the GSMP
and VBC includes extensive features to reduce power consump-
tion and give standby times of up to 100 hours.
Keypad interface logic for up to 30 keys is provided on the
GSMP. T his interface provides keyboard scan for six rows
and four columns. Additionally, an extra column can be imple-
mented by using the “ghost column” method.
D igital Bus Inter face to Mem or y and D isplay
External RAM and ROM, as well as the display controller,
interface directly to the 21-bit address bus and 16-bit data bus
of the GSMP.
Both devices are specifically designed to operate from 2.7 V to
3.3 V, to enable three or four cell battery designs.
T he GSMP incorporates intelligent power management, permit-
ting automatic control of power consumption in the Channel
Codec part of the GSMP and the peripheral circuitry. Data
processing modules are switched on only when they process
data, otherwise they are powered down. Additional control
signals are provided that enable the Layer 1 software to control
the external subsystems, such as the VBC, the radio and
memory components, so that their power is intelligently switched
by the GSMP.
Inter face to FLASH Mem or y
T he large FLASH memory can contain all programs for the
embedded Control Processor of the GSMP. T his includes the
complete GSM protocol software as well as the User Interface
Software. A total size of 8 Mbits is suggested, assuming a typical
size of User Interface and a GSM Phase 2 Software. Enhanced
features requiring larger memories are easily supported by the
large address space of the embedded Control Processor.
T o support FLASH memory, the GSMP provides embedded
code to download the software into the FLASH memory via its
standard serial port.
In the VBC, the power-down functions are split separately
among receive, transmit and auxiliary circuits. T his provides
optimal analog power performance when operating in different
modes.
Inter face to SRAM
In addition to the FLASH memory, the Control Processor also
supports static RAM to store user-defined variables, typically
those used by the Protocol Stack or Application Layer. Standard
SRAMs interface directly to the address and data bus of the
GSMP.
INTERFACES
T he chipset has eleven external interfaces (see Figure 5) that
have to be considered in the design of the complete mobile
radio.
Inter face to D isplay Contr oller
• Analog Voice Interface to VBC
T his interface is achieved through the address and data buses
and associated read and write strobes, as well as a specific en-
able signal. One backlight pin with PWM control is provided by
the GSMP to control brightness of backlight.
• Radio Interface to VBC and GSMP
• Digital SIM Card Interface to GSMP
• Digital Interface to the Keypad
• Digital Bus Interface from GSMP to Memory and Display
• Digital Audio Interface (DAI)
D igital Audio Inter face (D AI)
As required by the GSM specifications, a digital audio interface
is provided to allow certain tests of the audio section during type
approval. T his interface is activated in one of the test modes. A
fully functional “DAI box” needed for the FT A process may be
obtained from Analog Devices upon request.
• Digital Interface to GSMP for Data Services
• Digital Interface from the GSMP to the EEPROM
• Digital Interface from GSMP to Accessories
• Digital T est Interface
D igital Inter face to GSMP for D ata Ser vices
T he chipset uses a serial interface that is connected to an exter-
nal data terminal adapter as described in the AD6422 data
sheet.
• Digital Interface from GSMP to Optional EFR Coprocessor
Analog Voice Inter face to VBC
The analog voice interface to the VBC is specified in the AD6421
data sheet. Several design examples are given for single-ended
or differential inputs or outputs. A voltage reference for biasing
the microphone signal is provided on the VBC. T he analog
output of the VBC is capable of directly driving an earpiece with
an impedance of 32 Ω. For optional use of a separate external
microphone and power amplifier, a set of auxiliary input/output
signals are provided on the VBC.
D igital Inter face fr om the GSMP to the EEP RO M
T he GSMP provides separate pins to interface directly to an
external serial EEPROM via a serial bus. T his EEPROM is
typically used for storage of calibration or user variable param-
eters like:
• Handset Identifier (IMEI)
• Language
Radio Inter face to VBC and GSMP
• Keypad Lock
T he analog interface between the VBC and the radio subsystem
is specified in detail in the AD6421 data sheet. T he digital inter-
face between the GSMP and the radio subsystem is specified in
detail in the AD6422 data sheet.
• DT MF ON/OFF
• Radio Calibration Parameters
A typical size of the EEPROM is 2K × 8 bits, but this depends
on the individual design of the handset.
D igital SIM Car d Inter face to GSMP
T he GSMP is designed to interface directly to the SIM. How-
ever, interface logic may be necessary to connect the 3 V chipset
to a 5 V SIM.
REV. 0
–5–
AD20msp415
ACCESSORIES
CLKIN
CAR KIT
TEST
INTERFACE
TEST
INTERFACE
13MHz
VCTCXO
DAI
INTERFACE
VOICEBAND
ANALOG I/O
SIM
INTERFACE
SIM CARD
FLASH
AFC DAC
ADDRESS
DATA
DAI CONTROL
POWER
AMPLIFIER
SERIAL
PORTS
RAMP DAC
AGC DAC
VBC INTERFACE
SRAM
GSMP
VBC
CLOCK
RADIO
MCLK
CLKOUT
DISPLAY
CONTROL
DISPLAY
CONTROL
IF
AMPLIFIER
POWER
SUBSYSTEM
POWER
CONTROL
AUX ADC
BASEBAND
ANALOG I/O
BACKLIGHT
CONTROL
MODULATOR
BACKLIGHT
KEYPAD
DEMODULATOR
KEYPAD
INTERFACE
COPROCESSOR
INTERFACE
COPROCESSOR
(OPTIONAL)
EEPROM
INTERFACE
EEPROM
SYNTHESIZER
AND RADIO
CONTROL
SYNTHESIZER
AND RADIO
CONTROL
DATA
INTERFACE
DATA
INTERFACE
Figure 5. Chipset Interfaces
Table I. List of Key Com ponents
D igital Inter face fr om the GSMP to Accessor ies
T o allow proper control of external accessories like a car kit, the
AD6422 provides a 10-pin accessory interface comprised of
eight general purpose I/O channels, one chip select and one
power control signal.
D escription
Specification
GSMP1
AD6422
AD6421
AD6423
256K × 16, 150 ns
128K × 8, 120 ns
2K × 8
VBC1
EFR-Coprocessor2
FLASH3
D igital Test Inter face
T he AD6421 and the AD6422 both support advanced test
methodologies by providing JT AG Boundary Scan. Addition-
ally, the AD6422 provides T est/Mode pins, which select differ-
ent test and operating modes.
SRAM
EEPROM4
Display Driver
Design Specific
D igital Inter face fr om GSMP to O ptional EFR-Copr ocessor
T he AD6422 provides a digital interface to an external EFR
Coprocessor (DSP). T his coprocessor is required to handle the
Enhanced Full Rate speech codec in PCS1900 mobile radios.
NOT ES
1T hese components comprise the AD20msp415
chipset.
2T he EFR-Coprocessor is required only in systems
requiring support of the Enhanced Full Rate speech
codec.
Baseband P r ocessing Key P ar ts List
T able I lists the major hardware components necessary to com-
plete the GSM baseband processing subsystem.
3A size of 4 Mbits is recommended to allow storage of
all GSM Layer (1, 2, 3) programs for GSM Phase 2
as well as a typical User Interface (MMI).
4Can be omitted if parameters are stored in FLASH
memory.
–6–
REV. 0
AD20msp415
MECH ANICAL CO NSID ERATIO NS
All components use low profile Plastic Quad Flatpacks with lead
pitches of 0.5 mm, for PCMCIA applications.
T he chipset has been specifically designed to meet not only cost
and power consumption requirements but also the physical
dimensions. State-of-the-art package technology was used to
achieve the smallest possible geometries. (See T able II for list of
packaging dimensions and consult individual data sheets of the
two components for further details.)
O RD ERING GUID E
P art Num ber
Supply Voltage Range
AD6421AST
AD6422AST
AD6423
+2.7 V to +3.3 V
+2.7 V to +3.3 V
+2.7 V to +3.3 V
Table II. P ackage D im ensions
P aram eter
GSMP
VBC
EFR*
Unit
An Evaluation and Development system may be ordered for this
chipset, under the part number, NRE20msp415EB1.
Package
Leads
T QFP
144
T QFP
64
T QFP
64
#
Pitch
Body
T otal Height
Board Area
0.5
20 × 20
1.6
0.5
10 × 10
1.6
0.5
10 × 10
1.6
mm
mm2
mm
mm2
22 × 22
12 × 12
12 × 12
*T he EFR Coprocessor is needed only in systems requiring support of Enhanced
Full Rate Speech Codec.
REV. 0
–7–
–8–
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