AD660SQ/883B [ADI]
Monolithic 16-Bit Serial/Byte DACPORT; 单片16位串行/字节DACPORT
| 型号： | AD660SQ/883B |
| 厂家： | 
ADI |
| 描述： | Monolithic 16-Bit Serial/Byte DACPORT |
| 文件： | 总12页 (文件大小：428K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Monolithic 16-Bit
Serial/Byte DACPORT
a
AD660
FUNCTIONAL BLOCK DIAGRAM
FEATURES
Complete 16-Bit D/A Function
On-Chip Output Amplifier
On-Chip Buried Zener Voltage Reference
؎1 LSB Integral Linearity
15-Bit Monotonic over Temperature
Microprocessor Compatible
Serial or Byte Input
Double Buffered Latches
Fast (40 ns) Write Pulse
Asynchronous Clear (to 0 V) Function
Serial Output Pin Facilitates Daisy Chaining
Unipolar or Bipolar Output
Low Glitch: 15 nV-s
UNI/BIP CLR/
SIN/ MSB/LSB/
LBE
15
CS
14
DB7
DB0 DB1
12 11
5
AD660
HBE 16
SER 17
CLR 18
13
22
16-BIT LATCH
S
OUT
CONTROL
LOGIC
10k
SPAN/
BIP
OFFSET
16-BIT LATCH
16-BIT DAC
10.05k
LDAC
19
23
10k
REF IN
21
20
V
OUT
+10V REF
AGND
24
REF OUT
1
2
3
4
Low THD+N: 0.009%
–V
+V
+V
LL
DGND
EE
CC
PRODUCT DESCRIPTION
PRODUCT HIGHLIGHTS
The AD660 DACPORT is a complete 16-bit monolithic D/A
converter with an on-board voltage reference, double buffered
latches and output amplifier. It is manufactured on Analog De-
vices’ BiMOS II process. This process allows the fabrication of
low power CMOS logic functions on the same chip as high pre-
cision bipolar linear circuitry.
1. The AD660 is a complete 16-bit DAC, with a voltage refer-
ence, double buffered latches and output amplifier on a sin-
gle chip.
2. The internal buried Zener reference is laser trimmed to
10.000 volts with a ±0.1% maximum error and a tempera-
ture drift performance of ±15 ppm/°C. The reference is
available for external applications.
The AD660’s architecture ensures 15-bit monotonicity over
time and temperature. Integral and differential nonlinearity is
maintained at ±0.003% max. The on-chip output amplifier pro-
vides a voltage output settling time of 10 µs to within 1/2 LSB
for a full-scale step.
3. The output range of the AD660 is pin programmable and can
be set to provide a unipolar output range of 0 V to +10 V or
a bipolar output range of –10 V to +10 V. No external com-
ponents are required.
The AD660 has an extremely flexible digital interface. Data can
be loaded into the AD660 in serial mode or as two 8-bit bytes.
This is made possible by two digital input pins which have dual
functions. The serial mode input format is pin selectable to be
MSB or LSB first. The serial output pin allows the user to daisy
chain several AD660s by shifting the data through the input
latch into the next DAC thus minimizing the number of control
lines required to SIN, CS and LDAC. The byte mode input for-
mat is also flexible in that the high byte or low byte data can be
loaded first. The double buffered latch structure eliminates data
skew errors and provides for simultaneous updating of DACs in
a multi-DAC system.
4. The AD660 is both dc and ac specified. DC specifications
include ±1 LSB INL and ±1 LSB DNL errors. AC specifi-
cations include 0.009% THD+N and 83 dB SNR.
5. The double buffered latches on the AD660 eliminate data
skew errors and allow simultaneous updating of DACs in
multi-DAC applications.
6. The CLEAR function can asynchronously set the output to
0 V regardless of whether the DAC is in unipolar or bipolar
mode.
7. The output amplifier settles within 10 µs to ±1/2 LSB for a
full-scale step and within 2.5 µs for a 1 LSB step over tem-
perature. The output glitch is typically 15 nV-s when a full-
scale step is loaded.
The AD660 is available in five grades. AN and BN versions are
specified from –40°C to +85°C and are packaged in a 24-pin
300 mil plastic DIP. AR and BR versions are also specified from
–40°C to +85°C and are packaged in a 24-pin SOIC. The SQ
version is packaged in a 24-pin 300 mil cerdip package and is
also available compliant to MIL-STD-883. Refer to the AD660/
883B data sheet for specifications and test conditions.
DACPORT is a registered trademark of Analog Devices, Inc.
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700
Fax: 617/326-8703
AD660–SPECIFICATIONS (TA = +25؇C, VCC = +15 V, VEE = –15 V, VLL = +5 V unless otherwise noted)
AD660AN/AR/SQ
AD660BN/BR
Typ
Parameter
Min
Typ
Max
Min
Max
Units
RESOLUTION
16
16
Bits
DIGITAL INPUTS (TMIN to TMAX
)
V
V
IH (Logic “1”)
IL (Logic “0”)
2.0
0
5.5
*
*
*
*
*
*
Volts
Volts
µA
0.8
I
IH (VIH = 5 5 V)
±10
±10
IIL (VIL = 0 V)
µA
TRANSFER FUNCTION CHARACTERISTICS1
Integral Nonlinearity
±2
±4
±2
±4
±1
±2
±1
±2
LSB
TMIN to TMAX
LSB
Differential Nonlinearity
LSB
T
MIN to TMAX
LSB
Monotonicity Over Temperature
14
15
Bits
Gain Error2, 3
±0.10
25
±0.05
10
±2.5
3
±7.5
5
*
% of FSR
ppm/°C
% of FSR
ppm/°C
mV
Gain Drift (TMIN to TMAX
DAC Gain Error4
DAC Gain Drift4
)
15
*
*
Unipolar Offset
*
Unipolar Offset Drift (TMIN to TMAX
Bipolar Zero Error
)
*
ppm/°C
mV
ppm/°C
*
Bipolar Zero Error Drift (TMIN to TMAX
)
*
REFERENCE INPUT
Input Resistance
Bipolar Offset Input Resistance
7
7
10
10
13
13
*
*
*
*
*
*
kΩ
kΩ
REFERENCE OUTPUT
Voltage
9.99
2
10.00
4
10.01
25
*
*
*
*
*
*
Volts
ppm/°C
mA
Drift
15
External Current5
Capacitive Load
Short Circuit Current
1000
*
pF
25
mA
OUTPUT CHARACTERISTICS
Output Voltage Range
Unipolar Configuration
Bipolar Configuration
Output Current
0
–10
5
+10
+10
*
*
*
*
*
Volts
Volts
mA
Capacitive Load
1000
*
pF
Short Circuit Current
25
*
mA
POWER SUPPLIES
Voltage
6
VCC
+13.5
–13.5
+4.5
+16.5
–16.5
+5.5
*
*
*
*
*
*
Volts
Volts
Volts
6
VEE
VLL
Current (No Load)
ICC
+12
–12
+18
–18
*
*
*
*
mA
mA
IEE
ILL
@ VIH, VIL = 5, 0 V
@ VIH, VIL = 2.4, 0.4 V
Power Supply Sensitivity
Power Dissipation (Static, No Load)
0.3
3
1
365
2
*
*
*
*
*
*
*
*
mA
mA
ppm/%
mW
7.5
2
625
TEMPERATURE RANGE
Specified Performance (A, B)
Specified Performance (S)
–40
–55
+85
+125
*
*
°C
°C
NOTES
1For 16-bit resolution, 1 LSB = 0.0015% of FSR. For 15-bit resolution, 1 LSB = 0.003% of FSR. For 14-bit resolution, 1 LSB = 0.006% of FSR. FSR stands for
Full-Scale Range and is 10 V in a Unipolar Mode and 20 V in Bipolar Mode.
2Gain error and gain drift are measured using the internal reference. The internal reference is the main contributor to gain drift. If lower gain drift is required, the
AD660 can be used with a precision external reference such as the AD587, AD586 or AD688.
3Gain Error is measured with fixed 50 Ω resistors as shown in the Application section. Eliminating these resistors increases the gain error by 0.25% of FSR (Unipolar
mode) or 0.50% of FSR (Bipolar mode).
4DAC Gain Error and Drift are measured with an external voltage reference. They represent the error contributed by the DAC alone, for use with an external reference.
5External current is defined as the current available in addition to that supplied to REF IN and SPAN/BIPOLAR OFFSET on the AD660.
6Operation on ±12 V supplies is possible using an external reference such as the AD586 and reducing the output range. Refer to the Internal/External Reference section.
*Indicates that the specification is the same as AD660AN/AR/SQ.
Specifications subject to change without notice.
–2–
REV. A
AD660
AC PERFORMANCE CHARACTERISTICS (With the exception of Total Harmonic Distortion + Noise and Signal-to-Noise
Ratio, these characteristics are included for design guidance only and are not subject to test. THD+N and SNR are 100% tested.
T
MIN ≤ TA ≤ TMAX, VCC = +15 V, VEE = –15 V, VLL = +5 V except where noted.)
Parameter
Limit
Units
Test Conditions/Comments
Output Settling Time
(Time to ±0.0008% FS
with 2 kΩ, 1000 pF Load)
13
8
10
6
8
2.5
µs max
µs typ
µs typ
µs typ
µs typ
µs typ
20 V Step, TA = +25°C
20 V Step, TA = +25°C
20 V Step, TMIN ≤ TA ≤ TMAX
10 V Step, TA = +25°C
10 V Step, TMIN ≤ TA ≤ TMAX
1 LSB Step, TMIN ≤ TA ≤ TMAX
Total Harmonic Distortion + Noise
A, B, S Grade
A, B, S Grade
0.009
0.056
5.6
% max
% max
% max
0 dB, 990.5 Hz; Sample Rate = 96 kHz; TA = +25°C
–20 dB, 990.5 Hz; Sample Rate = 96 kHz; TA = +25°C
–60 dB, 990.5 Hz; Sample Rate = 96 kHz; TA = +25°C
A, B, S Grade
Signal-to-Noise Ratio
83
15
2
dB min
TA = +25°C
Digital-to-Analog Glitch Impulse
Digital Feedthrough
nV-s typ
nV-s typ
nV/√Hz typ
DAC Alternately Loaded with 8000H and 7FFFH
DAC Alternately Loaded with 0000H and FFFFH; CS High
Measured at VOUT; 20 V Span; Excludes Reference
Output Noise Voltage
120
Density (1 kHz – 1 MHz)
Reference Noise
125
nV/√Hz typ
Measured at REF OUT
Specifications subject to change without notice.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD660 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
PIN CONFIGURATION
ABSOLUTE MAXIMUM RATINGS*
VCC to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +17.0 V
–V
+V
1
2
24
23
22
21
REF OUT
REF IN
V
V
EE to AGND . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –17.0 V
LL to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
EE
CC
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1 V
Digital Inputs (Pins 5 through 23) to DGND . . . . . . –1.0 V to
+7.0 V
SPAN,
BIPOLAR OFFSET
+V
3
LL
V
DGND
4
OUT
REF IN to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10.5 V
Span/Bipolar Offset to AGND . . . . . . . . . . . . . . . . . . . ±10.5 V
Ref Out, VOUT . . . . . . . Indefinite Short to AGND, DGND,
DB7, 15
DB6, 14
DB5, 13
DB4, 12
DB3, 11
DB2, 10
5
20 AGND
AD660
TOP VIEW
(Not to Scale)
19
18
6
LDAC
CLR
7
V
CC, VEE, and VLL
Power Dissipation (Any Package)
8
17 SER
To +60°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1000 mW
Derates above +60°C . . . . . . . . . . . . . . . . . . . . 8.7 mW/°C
Storage Temperature . . . . . . . . . . . . . . . . . . .–65°C to +150°C
Lead Temperature Range
9
16 HBE
10
15 LBE, UNI/BIP CLEAR
14
DB1, 9, MSB/LSB 11
DB0, 8, SIN 12
CS
(Soldering 10 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +300°C
13
S
OUT
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in
the operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
REV. A
–3–
AD660
ORDERING GUIDE
Temperature
Range
Linearity Error Max Linearity Error Max Gain TC max Package
Package
Model
+25°C
TMIN – TMAX
ppm/°C
Description Option*
AD660AN
AD660AR
AD660BN
AD660BR
AD660SQ
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
±2 LSB
±2 LSB
±1 LSB
±1 LSB
±4 LSB
±4 LSB
±2 LSB
±2 LSB
±4 LSB
**
25
25
15
15
25
**
Plastic DIP N-24
SOIC
R-24
Plastic DIP N-24
SOIC
Cerdip
**
R-24
Q-24
**
–55°C to +125°C ±2 LSB
AD660SQ/883B** –55°C to +125°C ±2 LSB
*N = Plastic DIP; Q = Cerdip; R = SOIC.
**Refer to AD660/883B military data sheet.
V = +15 V, V = –15 V, V = +5 V, V = 2.4 V, V = 0.4 V
TIMING CHARACTERISTICS
CC
EE
LL
HI
LO
Parameter
Limit +25°C
Limit –55°C to +125°C
Units
(Figure la)
tCS
tDS
tDH
tBES
tBEH
tLH
tLW
40
40
0
40
0
50
50
10
50
10
100
50
ns min
ns min
ns min
ns min
ns min
ns min
ns min
80
40
(Figure lb)
tCLK
tLO
tHI
tSS
tDS
tDH
tSH
tLH
80
30
30
0
40
0
0
80
40
100
50
50
10
50
10
10
100
50
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
tLW
(Figure lc)
tCLR
tSET
80
80
0
110
110
10
ns min
ns min
ns min
tHOLD
(Figure ld)
tPROP
tDS
50
50
100
80
ns min
ns min
Specifications subject to change without notice.
BIT 0–7
tDH
tDS
HBE OR
LBE
tBES
tBEH
tCS
CS
tLH
tLW
LDAC
Figure 1a. AD660 Byte Load Timing
–4–
REV. A
AD660
BIT0
VALID 1
tDS
VALID 16
tDH
tSH
tSS
SER
BIT1
"1" = MSB FIRST, "0" = LSB FIRST
tHI
tLO
CS
tLH
tLW
tCLK
LDAC
Figure 1b. AD660 Serial Load Timing
tCLR
CLR
LBE
tSET
tHOLD
"1" = BIP 0, "0" = UNI 0
Figure 1c. Asynchronous Clear to Bipolar or Unipolar Zero
VALID 16
VALID 17
tDS
BIT0
SER
BIT 1
(MSB/LSB)
CS
tPROP
SERIAL
OUT
VALID S
1
OUT
Figure 1d. Serial Out Timing
DEFINITIONS OF SPECIFICATIONS
BIPOLAR ZERO ERROR: When the AD660 is connected for
bipolar output and 10 . . . 000 is loaded in the DAC, the devia-
tion of the analog output from the ideal midscale value of 0 V is
called the bipolar zero error.
INTEGRAL NONLINEARITY: Analog Devices defines
integral nonlinearity as the maximum deviation of the actual,
adjusted DAC output from the ideal analog output (a straight
line drawn from 0 to FS–1 LSB) for any bit combination. This
is also referred to as relative accuracy.
DRIFT: Drift is the change in a parameter (such as gain, offset
and bipolar zero) over a specified temperature range. The drift
temperature coefficient, specified in ppm/°C, is calculated by
measuring the parameter at TMIN, 25°C and TMAX and dividing
the change in the parameter by the corresponding temperature
change.
DIFFERENTIAL NONLINEARITY: Differential nonlinearity
is the measure of the change in the analog output, normalized to
full scale, associated with a 1 LSB change in the digital input
code. Monotonic behavior requires that the differential linearity
error be greater than or equal to –1 LSB over the temperature
range of interest.
TOTAL HARMONIC DISTORTION + NOISE: Total har-
monic distortion + noise (THD+N) is defined as the ratio of the
square root of the sum of the squares of the values of the har-
monics and noise to the value of the fundamental input fre-
quency. It is usually expressed in percent (%).
MONOTONICITY: A DAC is monotonic if the output either
increases or remains constant for increasing digital inputs with
the result that the output will always be a single-valued function
of the input.
THD+N is a measure of the magnitude and distribution of lin-
earity error, differential linearity error, quantization error and
noise. The distribution of these errors may be different, depend-
ing upon the amplitude of the output signal. Therefore, to be
the most useful, THD+N should be specified for both large and
small signal amplitudes.
GAIN ERROR: Gain error is a measure of the output error be-
tween an ideal DAC and the actual device output with all 1s
loaded after offset error has been adjusted out.
OFFSET ERROR: Offset error is a combination of the offset
errors of the voltage-mode DAC and the output amplifier and is
measured with all 0s loaded in the DAC.
REV. A
–5–
AD660
(Pin 21), and between REF OUT (Pin 24) and REF IN (Pin
23). It is possible to use the AD660 without any external compo-
nents by tying Pin 24 directly to Pin 23 and Pin 22 directly to
Pin 21. Eliminating these resistors will increase the gain error by
0.25% of FSR.
SIGNAL-TO-NOISE RATIO: The signal-to-noise ratio is de-
fined as the ratio of the amplitude of the output when a full-
scale signal is present to the output with no signal present. This
is measured in dB.
DIGITAL-TO-ANALOG GLITCH IMPULSE: This is the
amount of charge injected from the digital inputs to the analog
output when the inputs change state. This is measured at half
scale when the DAC switches around the MSB and as many
as possible switches change state, i.e., from 011 . . . 111 to
100 . . . 000.
UNI/BIP CLR/
SIN/ MSB/LSB/
LBE
CS
DB0 DB1
DB7
15
14
12 11
5
AD660
10k
HBE 16
SER 17
CLR 18
SOUT
13
22
16-BIT LATCH
CONTROL
LOGIC
SPAN/
BIP OFF
DIGITAL FEEDTHROUGH: When the DAC is not selected
(i.e., CS is held high), high frequency logic activity on the digi-
tal inputs is capacitively coupled through the device to show up
as noise on the VOUT pin. This noise is digital feedthrough.
16-BIT LATCH
16-BIT DAC
R2
50Ω
LDAC
19
23
10.05k
10k
VOUT
21
20
REF IN
OUTPUT
AGND
+10V REF
THEORY OF OPERATION
The AD660 uses an array of bipolar current sources with MOS
current steering switches to develop a current proportional to
the applied digital word, ranging from 0 to 2 mA. A segmented
architecture is used, where the most significant four data bits are
thermometer decoded to drive 15 equal current sources. The
lesser bits are scaled using a R-2R ladder, then applied together
with the segmented sources to the summing node of the output
amplifier. The internal span/bipolar offset resistor can be con-
nected to the DAC output to provide a 0 V to +10 V span, or it
can be connected to the reference input to provide a –10 V to
+10 V span.
24
REF OUT
1
2
3
4
Ω
R1 50
–VEE +VCC +VLL
DGND
Figure 3a. 0 V to +10 V Unipolar Voltage Output
If it is desired to adjust the gain and offset errors to zero, this can
be accomplished using the circuit shown in Figure 3b. The ad-
justment procedure is as follows:
STEP 1 . . . ZERO ADJUST
Turn all bits OFF and adjust zero trimmer, R4, until the output
reads 0.000000 volts (1 LSB = 153 µV).
UNI/BIP CLR/
SIN/ MSB/LSB/
STEP 2 . . . GAIN ADJUST
LBE
15
CS
14
DB7
DB0 DB1
Turn all bits ON and adjust gain trimmer, R1, until the output is
9.999847 volts. (Full scale is adjusted to 1 LSB less than the
nominal full scale of 10.000000 volts).
12 11
5
AD660
HBE 16
SER 17
CLR 18
13
22
16-BIT LATCH
S
OUT
CONTROL
LOGIC
10k
UNI/BIP CLR/
SIN/ MSB/LSB/
SPAN/
BIP
OFFSET
DB0 DB1
LBE
CS
DB7
16-BIT LATCH
16-BIT DAC
15
14
12 11
5
+V
CC
AD660
10.05k
LDAC
19
23
HBE 16
SER 17
CLR 18
13 S
16-BIT LATCH
10k
OUT
R3 16k
CONTROL
LOGIC
REF IN
SPAN/
BIP OFF
R4
10k
21
20
V
OUT
10k
16-BIT LATCH
16-BIT DAC
22
+10V REF
AGND
R2
50
LDAC
19
23
Ω
–V
EE
24
REF OUT
1
2
3
4
10.05k
10k
REF IN
–V
+V
+V
LL
DGND
EE
CC
21
20
Figure 2. AD660 Functional Block Diagram
OUTPUT
+10V REF
ANALOG CIRCUIT CONNECTIONS
24
REF OUT
1
2
3
4
Internal scaling resistors provided in the AD660 may be con-
nected to produce a unipolar output range of 0 V to +10 V or a
bipolar output range of –10 V to +10 V. Gain and offset drift
are minimized in the AD660 because of the thermal tracking of
the scaling resistors with other device components.
–V
+V
+V
LL
EE
CC
DGND
R1 100
Ω
AGND
Figure 3b. 0 V to +10 V Unipolar Voltage Output with Gain
and Offset Adjustment
UNIPOLAR CONFIGURATION
The configuration shown in Figure 3a will provide a unipolar
0 V to +10 V output range. In this mode, 50 Ω resistors are tied
between the span/bipolar offset terminal (Pin 22) and VOUT
–6–
REV. A
AD660
BIPOLAR CONFIGURATION
It should be noted that using external resistors will introduce a
small temperature drift component beyond that inherent in the
AD660. The internal resistors are trimmed to ratio-match and
temperature-track other resistors on chip, even though their ab-
solute tolerances are ±20% and absolute temperature coeffi-
cients are approximately –50 ppm/°C . In the case that external
resistors are used, the temperature coefficient mismatch be-
tween internal and external resistors, multiplied by the sensitiv-
ity of the circuit to variations in the external resistor value, will
be the resultant additional temperature drift.
The circuit shown in Figure 4a will provide a bipolar output
voltage from –10.000000 V to +9.999694 V with positive full
scale occurring with all bits ON. As in the unipolar mode, resis-
tors R1 and R2 may be eliminated altogether to provide AD660
bipolar operation without any external components. Eliminat-
ing these resistors will increase the gain error by 0.50% of FSR
in the bipolar mode.
Ω
R2 50
UNI/BIP CLR/
SIN/ MSB/LSB/
LBE
15
CS
14
DB0 DB1
12 11
DB7
INTERNAL/EXTERNAL REFERENCE USE
5
The AD660 has an internal low noise buried Zener diode refer-
ence which is trimmed for absolute accuracy and temperature
coefficient. This reference is buffered and optimized for use in a
high speed DAC and will give long-term stability equal or supe-
rior to the best discrete Zener diode references. The perfor-
mance of the AD660 is specified with the internal reference
driving the DAC and with the DAC alone (for use with a preci-
sion external reference ).
AD660
HBE 16
SER 17
CLR 18
S
13
22
16-BIT LATCH
OUT
CONTROL
LOGIC
10k
16-BIT LATCH
16-BIT DAC
SPAN/
BIP OFF
LDAC
19
23
10.05k
10k
V
OUT
21
20
REF IN
Ω
R1 50
OUTPUT
+10V REF
The internal reference has sufficient buffering to drive external
circuitry in addition to the reference currents required for the
DAC (typically 1 mA to REF IN and 1 mA to BIPOLAR
OFFSET). A minimum of 2 mA is available for driving external
loads. The AD660 reference output should be buffered with an
external op amp if it is required to supply more than 4 mA total
current. The reference is tested and guaranteed to ±0.2% max
error.
24
REF OUT
1
2
3
4
–V
+V
+V
LL
EE
CC
DGND
AGND
Figure 4a. ±10 V Bipolar Voltage Output
Gain offset and bipolar zero errors can be adjusted to zero us-
ing the circuit shown in Figure 4b as follows:
STEP I . . . OFFSET ADJUST
Turn OFF all bits. Adjust trimmer R2 to give 10.000000 volts
output.
It is also possible to use external references other than 10 volts
with slightly degraded linearity specifications. The recom-
mended range of reference voltages is +5 V to +10.24 V, which
allows 5 V, 8.192 V and 10.24 V ranges to be used. For ex-
ample, by using the AD586 5 V reference, outputs of 0 V to
+5 V unipolar or ±5 V bipolar can be realized. Using the
AD586 voltage reference makes it possible to operate the
AD660 with ±12 V supplies with 10% tolerances.
STEP II . . . GAIN ADJUST
Turn all bits ON and adjust R1 to give a reading of +9.999694
volts.
STEP III . . . BIPOLAR ZERO ADJUST (Optional)
In applications where an accurate zero output is required, set
the MSB ON, all other bits OFF, and readjust R2 for zero volts
output.
R2
100Ω
UNI/BIP CLR/
SIN/ MSB/LSB/
LBE
15
CS
14
DB0 DB1
DB7
12 11
5
AD660
HBE 16
SER 17
CLR 18
SOUT
13
22
16-BIT LATCH
CONTROL
LOGIC
10k
16-BIT LATCH
16-BIT DAC
SPAN/
BIP OFF
LDAC
19
23
10.05k
10k
VOUT
21
20
REF IN
R1
100Ω
OUTPUT
+10V REF
24
REF OUT
1
2
3
4
–VEE +VCC +VLL
AGND
DGND
Figure 4b. ±10 V Bipolar Voltage Output with Gain and
Offset Adjustment
REV. A
–7–
AD660
Figure 5 shows the AD660 using the AD586 precision 5 V refer-
ence in the bipolar configuration. The highest grade AD586MN
is specified with a drift of 2 ppm/°C which is a 7.5× improve-
ment over the AD660’s internal reference. This circuit includes
two optional potentiometers and one optional resistor that can
be used to adjust the gain, offset and bipolar zero errors in a
manner similar to that described in the BIPOLAR CONFIGU-
RATION section. Use –5.000000 V and +4.999847 as the out-
put values.
The AD660 can also be used with the AD587 10 V reference,
using the same configuration shown in Figure 5 to produce a
±10 V output. The highest grade AD587LR, N is specified at
5 ppm/°C, which is a 3× improvement over the AD660’s inter-
nal reference.
Figure 6 shows the AD660 using the AD680 precision ±10 V
reference, in the unipolar configuration. The highest grade
AD688BQ is specified with a temperature coefficient of
1.5 ppm/°C. The ±10 V output is also ideal for providing pre-
cise biasing for the offset trim resistor R4.
R2
50Ω
UNI/BIP CLR/
SIN/ MSB/LSB/
DB0 DB1
LBE
CS
DB7
15
14
12 11
5
AD660
HBE 16
SER 17
CLR 18
S
13
22
16-BIT LATCH
OUT
CONTROL
LOGIC
10k
16-BIT LATCH
16-BIT DAC
2
SPAN/
BIP OFF
+V
CC
LDAC
19
23
10.05k
10k
V
6
5
V
OUT
OUT
21
20
REF IN
R1
100Ω
OUTPUT
AGND
AD586
+10V REF
R2
10kΩ
24
REF OUT
1
2
3
4
TRIM
–V
+V
+V
LL
EE
CC
GND
4
DGND
Figure 5. Using the AD660 with the AD586 5 V Reference
UNI/BIP CLR/
SIN/ MSB/LSB/
DB0 DB1
LBE
CS
DB7
15
14
12 11
5
AD660
HBE
16
S
13
16-BIT LATCH
OUT
SPAN/
BIP OFF
CONTROL
LOGIC
SER 17
CLR 18
R3
10k
10k
Ω
R4
22
10kΩ
16-BIT LATCH
16-BIT DAC
R2
100Ω
LDAC
19
23
10.05k
10k
V
OUT
OUTPUT
0 TO +10V
21
20
REF IN
R1
100Ω
4
7
6
3
+10V REF
AGND
A3
1
24
REF OUT
1
2
3
4
–V
+V
+V
LL
A1
EE
CC
R
S
AD688
R4
DGND
14
15
R1
R2
R5
A4
R6
+V
CC
2
A2
R3
–V
EE
16
12
5
9
10
8
11 13
Figure 6. Using the AD660 with the AD688 High Precision ±10 V Reference
–8–
REV. A
AD660
DIGITAL CIRCUIT DETAILS
OUTPUT SETTLING AND GLITCH
The AD660 has several “dual-use” pins which allow flexible op-
eration while maintaining the lowest possible pin count and con-
sequently the smallest package size. The user should, therefore,
pay careful attention to the following information when applying
the AD660.
The AD660’s output buffer amplifier typically settles to within
0.0008% FS (1/2 LSB) of its final value in 8 µs for a full-scale
step. Figures 7a and 7b show settling for a full-scale and an LSB
step, respectively, with a 2 kΩ, 1000 pF load applied. The guar-
anteed maximum settling time at +25°C for a full-scale step is
13 µs with this load. The typical settling time for a 1 LSB step is
2.5 µs.
Data can be loaded into the AD660 in serial or byte mode as
described below.
The digital-to-analog glitch impulse is specified as 15 nV-s typi-
cal. Figure 7c shows the typical glitch impulse characteristic at
the code 011 . . . 111 to 100 . . . 000 transition when loading
the second rank register from the first rank register.
Serial Mode Operation is enabled by bringing SER (Pin 17)
low. This changes the function of DB0 (Pin 12) to that of the
serial input pin, SIN. It also changes the function of DB1 (Pin
11) to a control input that tells the AD660 whether the serial
data is going to be loaded MSB or LSB first.
600
In serial mode HBE and LBE are effectively disabled except for
LBE’s dual function which is to control whether the user wishes
to have the asynchronous clear function go to unipolar or bipo-
lar zero. (A low on LBE, when CLR is strobed, sends the DAC
output to unipolar zero, a high to bipolar zero.) The AD660
does not care about the status of HBE when in serial mode.
+10
0
400
200
0
–200
–400
–600
–10
Data is clocked into the input register on the rising edge of CS
as shown in Figure 1b. The data is then resident in the first rank
latch and can be loaded into the DAC latch by taking LDAC
high. This will cause the DAC to change to the appropriate out-
put value.
10
µs
20
0
a. –10 V to +10 V Full-Scale Step Settling
It should be noted that the clear function clears the DAC latch
but does not clear the first rank latch. Therefore, the data that
was previously resident in the first rank latch can be reloaded
simply by bringing LDAC high after the event that necessitated
CLR to be strobed has ended. Alternatively, new data can be
loaded into the first rank latch if desired.
600
400
200
0
The serial out pin (SOUT) can be used to daisy chain several
DACs together in multi-DAC applications to minimize the
number of isolators being used to cross an intrinsic safety bar-
rier. The first rank latch simply acts like a 16-bit shift register,
and repeated strobing of CS will shift the data out through
SOUT and into the next DAC. Each DAC in the chain will
require its own LDAC signal unless all of the DACs are to be
updated simultaneously.
–200
–400
–600
2
3
4
0
5
1
µs
b. LSB Step Settling
Byte Mode Operation is enabled simply by keeping SER high,
which configures DB0–DB7 as data inputs. In this mode HBE
and LBE are used to identify the data as either the high byte or
low byte of the 16-bit input word. (The user can load the data,
in any order, into the first rank latch.) As in the serial mode
case, the status of LBE, when CLR is strobed determines
whether the AD660 clears to unipolar or bipolar zero. There-
fore, when in byte mode, the user must take care to set LBE to
the desired status before strobing CLR. (In serial mode the user
can simply hardware LBE to the desired state.)
+10
0
–10
NOTE: CS is edge triggered. HBE, LBE and LDAC are level
triggered.
2
3
4
0
5
1
µs
c. D-to-A Glitch Impulse
Figure 7. Output Characteristics
REV. A
–9–
AD660–Microprocessor Interface Section
AD660 TO MC68HC11 (SPI BUS) INTERFACE
MICROWIRE
SO
The AD660 interface to the Motorola SPI (serial peripheral in-
terface) is shown in Figure 8. The MOSI, SCK, and SS pins of
the HC11 are respectively connected to the BIT0, CS and
LDAC pins of the AD660. The SER pin of the AD660 is tied
low causing the first rank latch to be transparent. The majority
of the interfacing issues are taken care of in the software initial-
ization. A typical routine such as the one shown below begins by
initializing the state of the various SPI data and control registers.
BIT0
CS
SK
G1
AD660
LDAC
SER
Figure 9. AD660 to MICROWIRE Interface
AD660 TO ADSP-210x FAMILY INTERFACE
The most significant data byte (MSBY) is then retrieved from
memory and processed by the SENDAT subroutine. The SS
pin is driven low by indexing into the PORTD data register and
clear Bit 5. This causes the 2nd rank latch of the AD660 to be-
come transparent. The MSBY is then set to the SPI data regis-
ter where it is automatically transferred to the AD660.
The serial mode of the AD660 minimizes the number of control
and data lines required to interface to digital signal processors
(DSPs) such as the ADSP-210x family. The application in Fig-
ure 10 shows the interface between an ADSP-2101 and the
AD660. Both the TFS pin and the DT pins of the ADSP-2101
should be connected to the SER and BIT0 pins of the AD660,
respectively. An inverter is required between the SCLK output
and the CS input of the AD660 in order to assure that data
transmitted to the BIT0 pin is valid on the rising edge of CS.
The HC11 generates the requisite 8 clock pulses with data valid
on the rising edges. After the most significant byte is transmit-
ted, the least significant byte (LSBY) is loaded from memory
and transmitted in a similar fashion. To complete the transfer,
the LDAC pin is driven high latching the complete 16-bit word
into the AD660.
The serial port (SPORT) of the DSP should be configured for
alternate framing mode so that TFS complies with the word-
length framing requirement of SER. Note that the INVTFS bit
in the SPORT control register should be set to invert the TFS
signal so that SER is the correct polarity. The LDAC signal,
which must meet the minimum hold specification of tIH, is easily
generated by delaying the rising edge of SER with a 74HC74
flip-flop. The CS signal clocks the flip-flop resulting in a delay
of approximately one CS clock cycle.
INIT
LDAA
STAA
LDAA
STAA
LDAA
STAA
#$2F
PORTD
#$38
DDRD
#$50
;SS = I; SCK = 0; MOSI = I
;SEND TO SPI OUTPUTS
;SS, SCK,MOSI = OUTPUTS
;SEND DATA DIRECTION INFO
;DABL INTRPTS,SPI IS MASTER & ON
;CPOL=0, CPHA = 0,1MHZ BAUD RATE
SPCR
NEXTPT LDAA
MSBY
SENDAT
NEXTPT
;LOAD ACCUM W/UPPER 8 BITS
;JUMP TO DAC OUTPUT ROUTINE
;INFINITE LOOP
BSR
JMP
In applications such as waveform generation, accurate timing of
the output samples is important to avoid noise that would be in-
duced by jitter on the LDAC signal. In this example, the
ADSP-2101 is set up to use the internal timer to interrupt the
processor at the precise and desired sample rate. When the
timer interrupt occurs, the processors’s 16-bit data word is writ-
ten to the transmit register (TXn). This causes the DSP to auto-
matically generate the TFS signal and begin transmission of the
data.
SENDAT LDY
BCLR
#$1000
;POINT AT ON-CHIP REGISTERS
$08,Y,$20 ;DRIVE SS (LDAC) LOW
STAA
SPDR
;SEND MS-BYTE TO SPI DATA REG
WAIT1
LDAA
BPL
LDAA
STAA
LDAA
BPL
SPSR
;CHECK STATUS OF SPIE
WAIT1
LSBY
SPDR
SPSR
;POLL FOR END OF X-MISSION
;GET LOW 8 BITS FROM MEMORY
;SEND LS-BYTE TO SPI DATA REG
;CHECK STATUS OF SPIE
WAIT2
WAIT2
;POLL FOR END OF X-MISSION
BSET
RTS
$08,Y,$20 ;DRIV SS HIGH TO LATCH DATA
74HC04
ADSP-210x
SCLK
CS
68HC11
MDSI
SCK
SS
BIT0
CS
DT
BIT0
SER
AD660
AD660
TFS
LDAC
SER
D
Q
74HC74
LDAC
Figure 8. AD660 to 68HC11 (SPI) Interface
Figure 10. AD660 to ADSP-210x Interface
AD660 TO Z80 INTERFACE
Figure 11 shows a Zilog Z-80 8-bit microprocessor connected to
the AD660 using the byte mode interface. The double-buffered
capability of the AD660 allows the microprocessor to indepen-
dently write to the low and high byte registers, and update the
DAC output. Processor speeds up to 6 MHz on Z-80B require
no extra wait states to interface with the AD660 using a
74ALS138 as the address decoder.
AD660 TO MICROWIRE INTERFACE
The flexible serial interface of the AD660 is also compatible
with the National Semiconductor MICROWIRE interface.
The MICROWIRE interface is used on microcontrollers such as
the COP400 and COP800 series of processors. A generic inter-
face to the MICROWIRE interface is shown in Figure 9. The
G1, SK, And SO pins of the MICROWIRE interface are respec-
tively connected to the LDAC, CS and BIT0 pins of the
AD660.
MICROWIRE is a registered trademark of National Semiconductor.
REV. A
–10–
Applications Information–AD660
1000
The address decoder analyzes the input-output address pro-
duced by the processor to select the function to be performed by
the AD660, qualified by the coincidence of the Input-Output
Request (IORQ*) and Write (WR*) pins. The least significant
address bit (A0) determines if the low or high byte register of
the AD660 is active. More significant address bits select be-
tween input register loading, DAC output update, and unipolar
or bipolar clear.
100
10
1
A typical Z-80 software routine begins by writing the low byte of
the desired 16-bit DAC data to address 0, followed by the high
byte to address 1. The DAC output is then updated by activat-
ing LDAC with a write to address 2 (or 3). A clear to unipolar
zero occurs on a write to address 4, and a clear to bipolar zero is
performed by a write to address 5. The actual data written to
addresses 2 through 5 is irrelevant. The decoder can easily be
expanded to control as many AD660s as required.
10
100k
1M
10M
1
100
1k
10k
FREQUENCY – Hz
Figure 13. Reference Noise Voltage Spectral Density
BOARD LAYOUT
Designing with high resolution data converters requires careful
attention to board layout. Trace impedance is the first issue. A
306 µA current through a 0.5 Ω trace will develop a voltage
drop of 153 µV, which is 1 LSB at the 16-bit level for a 10 V
full-scale span. In addition to ground drops, inductive and
capacitive coupling need to be considered, especially when high
accuracy analog signals share the same board with digital sig-
nals. Finally, power supplies need to be decoupled in order to
filter out ac noise.
+5V
D0-D7
ADDRESS
DB0-DB7
SER
V
DECODE
LL
Y2
CLR
IORQ
WR
E2
E1
AD660
Y1
LDAC
Y0
CS
HBE LBE DGND
A1–A15
Z80
Analog and digital signals should not share a common path.
Each signal should have an appropriate analog or digital return
routed close to it. Using this approach, signal loops enclose a
small area, minimizing the inductive coupling of noise. Wide PC
tracks, large gauge wire, and ground planes are highly recom-
mended to provide low impedance signal paths. Separate analog
and digital ground planes should also be used, with a single in-
terconnection point to minimize ground loops. Analog signals
should be routed as far as possible from digital signals and
should cross them at right angles.
A0
A0-A15
Figure 11. Connections for 8-Bit Bus Interface
NOISE
In high resolution systems, noise is often the limiting factor. A
16-bit DAC with a 10 volt span has an LSB size of 153 µV
(–96 dB). Therefore, the noise floor must remain below this
level in the frequency range of interest. The AD660’s noise
spectral density is shown in Figures 12 and 13. Figure 12 shows
the DAC output noise voltage spectral density for a 20 V span
excluding the reference. This figure shows the 1/f corner
frequency at 100 Hz and the wideband noise to be below
120 nV/√Hz. Figure 13 shows the reference noise voltage spec-
tral density. This figure shows the reference wideband noise to
be below 125 nV/√Hz.
One feature that the AD660 incorporates to help the user layout
is that the analog pins (VCC, VEE, REF OUT, REF IN, SPAN/
BIP OFFSET, VOUT and AGND) are adjacent to help isolate
analog signals from digital signals.
SUPPLY DECOUPLING
The AD660 power supplies should be well filtered, well regu-
lated, and free from high frequency noise. Switching power sup-
plies are not recommended due to their tendency to generate
spikes which can induce noise in the analog system.
1000
100
10
Decoupling capacitors should be used in very close layout prox-
imity between all power supply pins and ground. A 10 µF tanta-
lum capacitor in parallel with a 0.1 µF ceramic capacitor
provides adequate decoupling. VCC and VEE should be bypassed
to analog ground, while VLL should be decoupled to digital
ground.
An effort should be made to minimize the trace length between
the capacitor leads and the respective converter power supply
and common pins. The circuit layout should attempt to locate
the AD660, associated analog circuitry and interconnections as
far as possible from logic circuitry. A solid analog ground plane
around the AD660 will isolate large switching ground currents.
For these reasons, the use of wire wrap circuit construction
is not recommended; careful printed circuit construction is
preferred.
1
10
100k
1M
10M
1
100
1k
10k
FREQUENCY – Hz
Figure 12. DAC Output Noise Voltage Spectral Density
REV. A
–11–
AD660
GROUNDING
the digital ground plane to DGND keeping lead lengths as short
as possible. Then connect AGND and DGND together at the
AD660. If multiple AD660s are used or the AD660 shares ana-
log supplies with other components, connect the analog and
digital returns together once at the power supplies rather than at
each chip. This single interconnection of grounds prevents large
ground loops and consequently prevents digital currents from
flowing through the analog ground.
The AD660 has two pins, designated analog ground (AGND)
and digital ground (DGND.) The analog ground pin is the
“high quality” ground reference point for the device. Any exter-
nal loads on the output of the AD660 should be returned to
analog ground. If an external reference is used, this should also
be returned to the analog ground.
If a single AD660 is used with separate analog and digital
ground planes, connect the analog ground plane to AGND and
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
N-24
24-Lead Plastic DIP
2
4
13
0.280 (7.11)
PIN 1
0.240 (6.10)
12
1
1.275 (32.30)
1.125 (28.60)
0.325 (8.25)
0.300 (7.62)
0.060 (1.52)
0.015 (0.38)
0.195 (4.95)
0.115 (2.93)
0.210
(5.33)
MAX
0.150
(3.81)
MIN
0.200 (5.05)
0.125 (3.18)
0.015 (0.381)
0.008 (0.204)
SEATING
PLANE
0.100
(2.54)
BSC
0.022 (0.558)
0.014 (0.356)
0.070 (1.77)
0.045 (1.15)
Q-24
24-Lead Cerdip
0.005 (0.13) MIN
2
0.098 (2.49) MAX
1
3
4
0.310 (7.87)
PIN 1
0.220 (5.59)
1
12
0.320 (8.13)
1.060 (26.92) MAX
0.290 (7.37)
0.060 (1.52)
0.015 (0.38)
0.200
(5.08)
MAX
0.150
(3.81)
MIN
0.015 (0.38)
0.008 (0.20)
15°
0.200 (5.08)
0.125 (3.18)
0°
0.100
(2.54)
BSC
0.070 (1.78)
0.030 (0.76)
0.023 (0.58)
0.014 (0.36)
SEATING
PLANE
R-24
24-Lead Small Outline (SOIC)
24
13
0.2992 (7.60)
0.2914 (7.40)
0.4193 (10.65)
PIN 1
0.3937 (10.00)
12
1
0.1043 (2.65)
0.6141 (15.60)
0.0926 (2.35)
0.0291 (0.74)
0.5985 (15.20)
x 45°
0.0098 (0.25)
0.0500 (1.27)
0.0157 (0.40)
8
0
°
°
0.0118 (0.30)
0.0040 (0.10)
0.0500
(1.27)
BSC
0.0192 (0.49)
0.0138 (0.35)
0.0125 (0.32)
0.0091 (0.23)
–12–
REV. A
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