AD7224TD [ADI]
IC PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CDIP18, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18, Digital to Analog Converter;
| 型号： | AD7224TD |
| 厂家： | 
ADI |
| 描述： | IC PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CDIP18, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18, Digital to Analog Converter CD 输入元件 转换器 |
| 文件： | 总13页 (文件大小：67K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
A
DESCRIPTION
Drawing updated to reflect current requirements. - ro
DATE (YR-MO-DA)
03-01-28
APPROVED
R. MONNIN
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
A
A
SHEET
10
11
12
PREPARED BY
SANDRA ROONEY
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
CHECKED BY
SANDRA ROONEY
STANDARD
MICROCIRCUIT
DRAWING
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
MICROCIRCUIT, LINEAR, CMOS 8-BIT DAC WITH
OUTPUT AMPLIFIER, MONOLITHIC SILICON
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
94-04-29
AMSC N/A
REVISION LEVEL
A
SIZE
A
CAGE CODE
5962-90908
67268
SHEET
1
OF
12
DSCC FORM 2233
APR 97
5962-E186-03
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
90908
01
M
V
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
AD7224U
Circuit function
8-bit DAC with output amplifier
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
V
2
GDIP1-T18 or CDIP2-T18
CQCC1-N20
18
20
Dual-in-line
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
SIZE
STANDARD
5962-90908
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
2
DSCC FORM 2234
APR 97
1.3 Absolute maximum ratings. 1/
V
DD
V
DD
V
SS
V
SS
V
DD
to AGND .................................................................................. -0.3 V dc, +17 V dc
to DGND .................................................................................. -0.3 V dc, +17 V dc
to AGND ................................................................................... -7 V dc, V
to DGND ................................................................................... -7 V dc, V
DD
DD
to V
..................................................................................... -0.3 V dc, +24 V dc
SS
AGND to DGND ................................................................................ -0.3 V dc, V
Digital input voltage to DGND .......................................................... -0.3 V dc, V
DD
DD
DD
V
V
to AGND ............................................................................... -0.3 V dc, V
to AGND ............................................................................... V , V
SS DD
REF
OUT
Power dissipation (P ) .................................................................... 450 mW 2/
D
Storage temperature range ............................................................... -65°C to +160°C
Lead temperature (soldering, 10 seconds) ...................................... +300°C
Thermal resistance, junction-to-case (θJC) ...................................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (θJA):
Case outline V .............................................................................. 120°C/W
Case outline 2 .............................................................................. 120°C/W
1.4 Recommended operating conditions.
Operating temperature range ........................................................... -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
______
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Derate linearly above T = +75°C at 6 mW/°C.
A
SIZE
STANDARD
5962-90908
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
3
DSCC FORM 2234
APR 97
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Timing waveforms. The timing waveforms shall be as specified on figure 3.
3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the
full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 80 (see MIL-PRF-38535, appendix A).
SIZE
STANDARD
5962-90908
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C ≤ T ≤ +125°C
Group A
subgroups
Device
type
Limits
Max
Unit
A
Test
Symbol
unless otherwise specified
Min
Resolution
RES
RA
1,2,3
1
01
01
8
Bits
Relative accuracy
LSB
1
V
V
V
V
= +14 V, V = -5 V,
SS
DD
2,3
1
0.5
2
= +10 V
REF
Total unadjusted error
01
LSB
E
T
= +14 V, V = -5 V,
SS
DD
2,3
1,2,3
1
1
= +10 V
REF
Differential nonlinearity
Full scale error
DNL
Guaranteed monotonic
to 8 bits
01
01
LSB
LSB
1
1.5
1.0
30
A
E
V
V
V
= +14 V, V = -5 V,
DD SS
2,3
1
= +10 V
REF
Zero code error
01
mV
A
ZCE
= +16.5 V,
DD
11.4 V and 14 V,
2,3
20
20
V
V
V
V
V
= -5 V,
SS
= V
– 4 V
REF
DD
Full scale temp
coefficient
2/
1,2,3
01
ppm/°C
dA /
= 14 V to 16.5 V,
E
DD
d
= +10 V
T
REF
Reference input resistance
Voltage output slew rate
1,2,3
4
01
01
01
01
8
kΩ
R
= 14 V
DD
IN
2.5
100
V/µs
pF
t
SR
Reference input
capacitance
Occurs when DAC is
loaded with all 1’s
4
C
IN
Digital input leakage
current
1,2,3
1
µA
V
I
V
V
V
V
V
V
= 0 V or V
,
IN
IN
DD
= 16.8 V
= 11.4 V,
DD
DD
REF
Digital input high voltage
7,8
7,8
01
01
2.4
V
V
IH
= V
– 4 V
DD
Digital input low voltage
0.8
V
= 11.4 V,
IL
DD
= V
– 4 V
REF
DD
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-90908
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – Continued.
Conditions 1/
-55°C ≤ T ≤ +125°C
Group A
subgroups
Device
type
Limits
Max
Unit
A
Test
Symbol
unless otherwise specified
Min
Positive power supply
current
Output unloaded:
1
01
01
4
6
3
5
5
mA
I
DD
SS
V
IN
= V or V ,
IL IH
2,3
1
V
V
= 16.5 V, V = -5.5 V,
SS
DD
= 12.5 V
REF
Negative power supply
current
Output unloaded:
mA
I
V
IN
= V or V ,
IL IH
2,3
V
V
= 16.5 V, V = -5.5 V,
SS
DD
= 12.5 V
REF
Voltage output settling
time
2/ 3/
9,10,11
9,10,11
9,10,11
9,10,11
9,10,11
9,10,11
9,10,11
01
01
01
01
01
01
01
µs
ns
ns
ns
ns
ns
ns
t
t
t
t
t
t
t
SL
positive full-scale change
2/
Chip select / load DAC
pulse width
200
200
0
LD
Write / reset pulse width
2/
2/
2/
2/
2/
WR
CS
CH
DS
DH
Chip select / load DAC
to write setup time
Chip select / load DAC
to write hold time
Data valid to write
setup time
0
100
10
Data valid to write
hold time
1/
V
DD
= +11.4 V to 16.5 V; V = -5 V 10%; A
= D
= 0 V; V
= +2 V to (V
– 4 V) unless otherwise
DO
SS
GND
GND
REF
specified.
2/ Guaranteed, if not tested, to the limits specified in table I herein.
3/
V
REF
= +10 V; settling time to 0.5 LSB.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-90908
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
6
DSCC FORM 2234
APR 97
Device type
01
Case outlines
V
2
Terminal
number
1
Terminal symbol
NC
V
SS
2
3
V
V
SS
OUT
V
V
OUT
REF
4
AGND
DGND
DB7 (MSB)
DB6
V
REF
5
AGND
DGND
DB7 (MSB)
DB6
6
7
8
DB5
9
DB4
DB5
10
11
12
13
14
15
16
17
18
19
20
DB3
DB4
DB2
NC
DB1
DB3
DB0 (LSB)
DB2
DB1
CS
WR
DB0 (LSB)
LDAC
RESET
CS
WR
V
DD
LDAC
RESET
---
---
V
DD
NC = No connection
FIGURE 1. Terminal connections.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-90908
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
7
DSCC FORM 2234
APR 97
Function
RESET
LDAC
WR
L
CS
L
H
H
H
H
H
H
H
L
L
X
H
H
H
L
Both registers are transparent
Both registers are latched
Both registers are latched
Input register transparent
Input register latched
H
X
L
X
H
L
↑
L
L
H
H
X
H
L
DAC register transparent
DAC register latched
L
↑
X
H
L
X
H
L
Both registers loaded with all zeros
↑
Both registers latched with all zeros
and output remains at zero
Both registers are transparent and
output follows input data
↑
H = High state, L = Low state, X = Don’t care
FIGURE 2. Truth table.
SIZE
STANDARD
5962-90908
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
8
DSCC FORM 2234
APR 97
NOTES:
1. All input signal rise and fall times measured from 10 % to 90 % of V . t = t = 20 ns over V range.
DD
DD
r
f
2. Timing measurement reference level is : ( V
+ V
) / 2.
INH
INL
FIGURE 3. Timing waveforms.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-90908
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
9
DSCC FORM 2234
APR 97
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be
in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition B . The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015.
(2) T = +125°C, minimum.
A
b. Interim and final electrical test parameters shall be as specified in table II herein.
4.2.2 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II herein.
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for
groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c. Subgroup 4 (C and T measurements) shall be measured only for the initial test and after process or design
IN
SR
changes which may affect them.
SIZE
STANDARD
5962-90908
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
10
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements.
Subgroups
Test requirements
Subgroups
(in accordance with
(in accordance with
MIL-STD-883,
MIL-PRF-38535, table III)
method 5005, table I)
Device
class M
1
Device
class Q
Device
class V
Interim electrical
1
1
parameters (see 4.2)
Final electrical
parameters (see 4.2)
Group A test
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
1,2,3, 1/ 2/
7,8,9,10,11
1,2,3,4, 2/
7,8,9,10,11
1
1,2,3, 1/ 2/
7,8,9,10,11
1,2,3,4, 2/
7,8,9,10,11
1
1,2,3, 1/ 2/
7,8,9,10,11
1,2,3,4, 2/
7,8,9,10,11
1
1
1
1
---
---
---
1/ PDA applies to subgroup 1.
2/ Subgroups 9, 10, and 11 guaranteed to the limits specified in table I if not tested.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a. Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of
MIL-STD-883.
b. T = +125°C, minimum.
A
c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of
MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.
SIZE
STANDARD
5962-90908
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
11
DSCC FORM 2234
APR 97
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness
assured (see 3.5 herein).
a. End-point electrical parameters shall be as specified in table II herein.
b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All
device classes must meet the post irradiation end-point electrical parameter limits as defined in table I at T = +25°C
A
5°C, after exposure, to the subgroups specified in table II herein.
c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device
classes Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users
and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering
microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone
(614) 692-0547.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to
this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DSCC-VA.
SIZE
STANDARD
5962-90908
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
A
12
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 03-01-28
Approved sources of supply for SMD 5962-90908 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
24355
Vendor
similar
PIN 2/
5962-9090801MVA
AD7224UQ/883B
5962-9090801M2A
24355
AD7224UE/883B
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item acquisition.
Items acquired to this number may not satisfy the
performance requirements of this drawing.
Vendor CAGE
number
Vendor name
and address
24355
Analog Devices
Route 1 Industrial Park
P.O. Box 9106
Norwood, MA 02062
Point of contact: Bay F-1
Raheen Ind. Estate
Limerick, Ireland
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
相关型号：
AD7224UD
IC PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CDIP18, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18, Digital to Analog Converter
ADI
AD7224UE/883B
IC PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CQCC20, CERAMIC, LCC-20, Digital to Analog Converter
ADI
AD7224UQ/883B
IC PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CDIP18, CERDIP-18, Digital to Analog Converter
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