AD7495BR [ADI]

1 MSPS, 12-Bit ADCs; 1 MSPS , 12位ADC
AD7495BR
型号: AD7495BR
厂家: ADI    ADI
描述:

1 MSPS, 12-Bit ADCs
1 MSPS , 12位ADC

文件: 总16页 (文件大小:219K)
中文:  中文翻译
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1 MSPS,  
12-Bit ADCs  
a
AD7475/AD7495  
FUNCTIONAL BLOCK DIAGRAMS  
FEATURES  
Fast Throughput Rate: 1 MSPS  
Specified for VDD of 2.7 V to 5.25 V  
Low Power:  
4.5 mW Max at 1 MSPS with 3 V Supplies  
10.5 mW Max at 1 MSPS with 5 V Supplies  
Wide Input Bandwidth:  
V
DD  
12-BIT  
SUCCESSIVE  
APPROXIMATION  
ADC  
T/H  
V
IN  
REF IN  
68 dB SNR at 300 kHz Input Frequency  
Flexible Power/Serial Clock Speed Management  
No Pipeline Delays  
High-Speed Serial Interface SPI™/QSPI™/  
MICROWIRE™/DSP-Compatible  
On-Board Reference 2.5 V (AD7495 Only)  
Standby Mode: 1 A Max  
SCLK  
SDATA  
CS  
CONTROL  
LOGIC  
V
DRIVE  
AD7475  
8-Lead SOIC and SOIC Packages  
GND  
V
APPLICATIONS  
DD  
Battery-Powered Systems  
Personal Digital Assistants  
Medical Instruments  
Mobile Communications  
Instrumentation and Control Systems  
Data Acquisition Systems  
High-Speed Modems  
12-BIT  
SUCCESSIVE  
APPROXIMATION  
ADC  
T/H  
V
IN  
REF OUT  
BUF  
SCLK  
SDATA  
CS  
Optical Sensors  
CONTROL  
LOGIC  
2.5V  
REFERENCE  
GENERAL DESCRIPTION  
V
DRIVE  
The AD7475/AD7495 are 12-bit high-speed, low-power,  
successive-approximation ADCs. The parts operate from a single  
2.7 V to 5.25 V power supply and feature throughput rates up to  
1 MSPS. The parts contain a low-noise, wide bandwidth track/hold  
amplifier that can handle input frequencies in excess of 1 MHz.  
AD7495  
GND  
PRODUCT HIGHLIGHTS  
1. High throughput with low power consumption. The  
The conversion process and data acquisition are controlled using  
CS and the serial clock allowing the devices to interface with  
microprocessors or DSPs. The input signal is sampled on the  
falling edge of CS and conversion is also initiated at this point.  
There are no pipelined delays associated with the part.  
AD7475 offers 1 MSPS throughput rates with 4.5 mW  
power consumption.  
2. Single-supply operation with VDRIVE function. The AD7475/  
AD7495 operate from a single 2.7 V to 5.25 V supply. The  
V
DRIVE function allows the serial interface to connect directly  
The AD7475/AD7495 use advanced design techniques to achieve  
very low power dissipation at high throughput rates. With 3 V  
supplies and 1 MSPS throughput rate, the AD7475 consumes just  
1.5 mA, while the AD7495 consumes 2 mA. With 5 V supplies  
and 1 MSPS, the current consumption is 2.1 mA for the AD7475  
and 2.6 mA for the AD7495.  
to either 3 V or 5 V processor systems independent of VDD  
.
3. Flexible power/serial clock speed management. The con-  
version rate is determined by the serial clock, allowing the  
conversion time to be reduced through the serial clock speed  
increase. The part also features shutdown modes to maximize  
power efficiency at lower throughput rates. This allows the  
average power consumption to be reduced while not convert-  
ing. Power consumption is 1 µA when in full shutdown.  
The analog input range for the part is 0 V to REF IN. The 2.5 V  
reference for the AD7475 is applied externally to the REF IN pin  
while the AD7495 has an on-board 2.5 V reference. The conver-  
sion time is determined by the SCLK frequency.  
4. No pipeline delay. The part features a standard successive-  
approximation ADC with accurate control of the sampling  
instant via a CS input and once off conversion control.  
MICROWIRE is a trademark of National Semiconductor Corporation.  
SPI and QSPI are trademarks of Motorola, Inc.  
REV. A  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, norforanyinfringementsofpatentsorotherrightsofthirdpartiesthat  
may result from its use. No license is granted by implication or otherwise  
under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
www.analog.com  
© Analog Devices, Inc., 2001  
AD7475/AD7495–SPECIFICATIONS1  
(VDD = 2.7 V to 5.25 V, VDRIVE = 2.7 V to 5.25 V, REF IN = 2.5 V, fSCLK = 20 MHz unless otherwise  
noted; TA = TMIN to TMAX, unless otherwise noted.)  
AD7475–SPECIFICATIONS1  
Parameter  
A Version1  
B Version1  
Unit  
Test Conditions/Comments  
DYNAMIC PERFORMANCE  
Signal to Noise + Distortion Ratio  
(SINAD)  
Total Harmonic Distortion (THD) –75  
Peak Harmonic or Spurious Noise  
(SFDR)  
68  
68  
dB min  
fIN = 300 kHz Sine Wave, fSAMPLE = 1 MSPS  
–75  
–76  
dB max  
dB max  
fIN = 300 kHz Sine Wave, fSAMPLE = 1 MSPS  
IN = 300 kHz Sine Wave, fSAMPLE = 1 MSPS  
–76  
f
Intermodulation Distortion (IMD)  
Second Order Terms  
Third Order Terms  
Aperture Delay  
–78  
–78  
10  
–78  
–78  
10  
dB typ  
dB typ  
ns typ  
Aperture Jitter  
50  
50  
ps typ  
Full Power Bandwidth  
Full Power Bandwidth  
8.3  
1.3  
8.3  
1.3  
MHz typ  
MHz typ  
@ 3 dB  
@ 0.1 dB  
DC ACCURACY  
Resolution  
Integral Nonlinearity  
12  
1.5  
0.5  
+1.5/–0.9  
12  
1
0.5  
+1.5/–0.9  
Bits  
LSB max  
LSB typ  
LSB max  
@ 5 V (typ @ 3 V)  
@ 25°C  
Differential Nonlinearity  
@ 5 V Guaranteed No Missed Codes to 12 Bits  
(typ @ 3 V)  
@ 25°C  
Typically 2.5 LSB  
0.5  
8
3
0.5  
8
3
LSB typ  
LSB max  
LSB max  
Offset Error  
Gain Error  
ANALOG INPUT  
Input Voltage Ranges  
DC Leakage Current  
Input Capacitance  
0 to REF IN  
Volts  
µA max  
pF typ  
1
20  
1
20  
REFERENCE INPUT  
REF IN Input Voltage Range  
DC Leakage Current  
Input Capacitance  
2.5  
1
20  
2.5  
1
20  
Volts  
µA max  
pF typ  
1% for Specified Performance  
LOGIC INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current, IIN  
VDRIVE – 1  
0.4  
1
VDRIVE – 1  
0.4  
1
V min  
V max  
µA max  
pF max  
Typically 10 nA, VIN = 0 V or VDRIVE  
2
Input Capacitance, CIN  
10  
10  
LOGIC OUTPUTS  
Output High Voltage, VOH  
Output Low Voltage, VOL  
Floating-State Leakage Current  
VDRIVE – 0.2  
V min  
ISOURCE = 200 µA; VDRIVE = 2.7 V to 5.25 V  
ISINK = 200 µA  
0.4  
10  
0.4  
10  
10  
V max  
µA max  
pF max  
Floating-State Output Capacitance2 10  
Output Coding  
Straight (Natural) Binary  
CONVERSION RATE  
Conversion Time  
Track/Hold Acquisition Time  
800  
800  
300  
325  
1
ns max  
ns max  
ns max  
16 SCLK Cycles with SCLK at 20 MHz  
Sine Wave Input  
Full-Scale Step Input  
300  
325  
1
Throughput Rate  
MSPS max See Serial Interface Section  
POWER REQUIREMENTS  
VDD  
2.7/5.25  
2.7/5.25  
2.7/5.25  
2.7/5.25  
V min/max  
V min/max  
VDRIVE  
3
IDD  
Digital I/Ps = 0 V or VDRIVE  
VDD = 2.7 V to 5.25 V. SCLK On or Off  
Normal Mode (Static)  
Normal Mode (Operational)  
750  
2.1  
1.5  
450  
100  
1
750  
2.1  
1.5  
450  
100  
1
A typ  
mA max  
mA max  
µA typ  
µA max  
µA max  
V
V
DD = 4.75 V to 5.25 V. fSAMPLE = 1 MSPS  
DD = 2.7 V to 3.6 V. fSAMPLE = 1 MSPS  
Partial Power-Down Mode  
Partial Power-Down Mode  
Full Power-Down Mode  
fSAMPLE = 100 kSPS  
(Static)  
SCLK On or Off  
–2–  
REV. A  
AD7475/AD7495  
AD7475–SPECIFICATIONS (continued)  
Parameter  
A Version1  
B Version1  
Unit  
Test Conditions/Comments  
POWER REQUIREMENTS  
(continued)  
Power Dissipation3  
Normal Mode (Operational)  
10.5  
4.5  
500  
300  
5
10.5  
4.5  
500  
300  
5
mW max  
mW max  
W max  
W max  
W max  
W max  
VDD = 5 V. fSAMPLE = 1 MSPS  
VDD = 3 V. fSAMPLE = 1 MSPS  
VDD = 5 V  
VDD = 3 V  
VDD = 5 V  
VDD = 3 V  
Partial Power-Down (Static)  
Full Power-Down  
3
3
NOTES  
1Temperature ranges as follows: A, B Versions: –40C to +85C.  
2Sample tested @ 25C to ensure compliance.  
3See Power Versus Throughput Rate section.  
Specifications subject to change without notice.  
(VDD = 2.7 V to 5.25 V, VDRIVE = 2.7 V to 5.25 V, fSCLK = 20 MHz unless otherwise noted; TA = TMIN to  
TMAX, unless otherwise noted.)  
AD7495–SPECIFICATIONS1  
Parameter  
A Version1  
B Version1  
Unit  
Test Conditions/Comments  
DYNAMIC PERFORMANCE  
Signal to Noise + Distortion  
(SINAD)  
Total Harmonic Distortion (THD) –75  
Peak Harmonic or Spurious Noise –76  
(SFDR)  
68  
68  
dB min  
fIN = 300 kHz Sine Wave, fSAMPLE = 1 MSPS  
–75  
–76  
dB max  
dB max  
fIN = 300 kHz Sine Wave, fSAMPLE = 1 MSPS  
fIN = 300 kHz Sine Wave, fSAMPLE = 1 MSPS  
Intermodulation Distortion (IMD)  
Second Order Terms  
Third Order Terms  
Aperture Delay  
–78  
–78  
10  
–78  
–78  
10  
dB typ  
dB typ  
ns typ  
Aperture Jitter  
Full Power Bandwidth  
Full Power Bandwidth  
50  
8.3  
1.3  
50  
8.3  
1.3  
ps typ  
MHz typ  
MHz typ  
@ 3 dB  
@ 0.1 dB  
DC ACCURACY  
Resolution  
Integral Nonlinearity  
12  
1.5  
0.5  
+1.5/–0.9  
12  
1
0.5  
+1.5/–0.9  
Bits  
LSB max  
LSB typ  
LSB max  
@ 5 V (typ @ 3 V)  
@ 25°C  
@ 5 V Guaranteed No Missed Codes to 12 Bits  
(typ @ 3 V)  
Differential Nonlinearity  
0.6  
8
7
0.6  
8
7
LSB typ  
LSB max  
LSB max  
@ 25°C  
Typically 2.5 LSB  
Typically 2.5 LSB  
Offset Error  
Gain Error  
ANALOG INPUT  
Input Voltage Ranges  
DC Leakage Current  
Input Capacitance  
0 to 2.5  
1
20  
0 to 2.5  
1
20  
Volts  
µA max  
pF typ  
REFERENCE OUTPUT  
REF OUT Output Voltage  
REF OUT Impedance  
2.4625/2.5375 2.4625/2.5375 V min/max  
10  
10  
50  
typ  
ppm/C typ  
REF OUT Temperature Coefficient 50  
LOGIC INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current, IIN  
VDRIVE – 1  
0.4  
1
VDRIVE – 1  
0.4  
1
V min  
V max  
µA max  
pF max  
Typically 10 nA, VIN = 0 V or VDRIVE  
2
Input Capacitance, CIN  
10  
10  
LOGIC OUTPUTS  
Output High Voltage, VOH  
Output Low Voltage, VOL  
Floating-State Leakage Current  
VDRIVE – 0.2  
0.4  
10  
10  
Straight (Natural) Binary  
V min  
ISOURCE = 200 µA; VDD = 2.7 V to 5.25 V  
ISINK = 200 µA  
0.4  
10  
V max  
µA max  
pF max  
Floating-State Output Capacitance2 10  
Output Coding  
REV. A  
–3–  
AD7475/AD7495–SPECIFICATIONS1  
AD7495–SPECIFICATIONS (continued)  
Parameter  
A Version1  
B Version1  
Unit  
Test Conditions/Comments  
CONVERSION RATE  
Conversion Time  
Track/Hold Acquisition Time  
800  
300  
325  
1
800  
300  
325  
1
ns max  
ns max  
ns max  
16 SCLK Cycles with SCLK at 20 MHz  
Sine Wave Input  
Full-Scale Step Input  
Throughput Rate  
MSPS max See Serial Interface Section  
POWER REQUIREMENTS  
VDD  
VDRIVE  
2.7/5.25  
2.7/5.25  
2.7/5.25  
2.7/5.25  
V min/max  
V min/max  
IDD  
Digital I/Ps = 0 V or VDRIVE  
Normal Mode (Static)  
Normal Mode (Operational)  
1
2.6  
2
650  
230  
1
1
2.6  
2
650  
230  
1
mA typ  
mA max  
mA max  
µA typ  
µA max  
µA max  
VDD = 2.7 V to 5.25 V. SCLK On or Off  
VDD = 4.75 V to 5.25 V. fSAMPLE = 1 MSPS  
VDD = 2.7 V to 3.6 V. fSAMPLE = 1 MSPS  
fSAMPLE = 100 kSPS  
(Static)  
(Static) SCLK On or Off  
Partial Power-Down Mode  
Partial Power-Down Mode  
Full Power-Down Mode  
Power Dissipation3  
Normal Mode (Operational)  
13  
6
1.15  
690  
5
13  
6
1.15  
690  
5
mW max  
mW max  
mW max  
µW max  
µW max  
µW max  
VDD = 5 V. fSAMPLE = 1 MSPS  
VDD = 3 V. fSAMPLE = 1 MSPS  
Partial Power-Down (Static)  
Full Power-Down  
V
V
DD = 5 V  
DD = 3 V  
VDD = 5 V  
VDD = 3 V  
3
3
NOTES  
1Temperature ranges as follows: A, B Versions: –40C to +85C.  
2Sample tested @ 25C to ensure compliance.  
3See Power Versus Throughput Rate section.  
Specifications subject to change without notice.  
(VDD = 2.7 V to 5.25 V, VDRIVE = 2.7 V to 5.25 V, REF IN = 2.5 V (AD7475); TA = TMIN to TMAX, unless  
otherwise noted.)  
TIMING SPECIFICATIONS1  
Limit at TMIN, TMAX  
AD7475/AD7495  
Parameter  
Unit  
Description  
2
fSCLK  
10  
kHz min  
20  
MHz max  
tCONVERT  
16 × tSCLK  
800  
100  
10  
22  
40  
0.4 tSCLK  
0.4 tSCLK  
10  
10  
45  
tSCLK = 1/fSCLK  
fSCLK = 20 MHz  
Minimum Quiet Time Required between Conversions  
CS to SCLK Setup Time  
Delay from CS Until SDATA 3-State Disabled  
Data Access Time after SCLK Falling Edge  
SCLK Low Pulsewidth  
SCLK High Pulsewidth  
SCLK to Data Valid Hold Time  
SCLK Falling Edge to SDATA High Impedance  
SCLK Falling Edge to SDATA High Impedance  
CS Rising Edge to SDATA High Impedance  
Power-Up Time from Full Power-Down AD7475  
Power-Up Time from Full Power-Down AD7495  
ns max  
ns min  
ns min  
ns max  
ns max  
ns min  
ns min  
ns min  
ns min  
ns max  
ns max  
µs max  
µs max  
tQUIET  
t23  
t33  
t4  
t5  
t6  
t74  
t8  
4
t9  
20  
20  
650  
tPOWER-UP  
NOTES  
1Sample tested at 25C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of VDRIVE) and timed from a voltage level of 1.6 V.  
2Mark/Space ratio for the SCLK input is 40/60 to 60/40.  
3Measured with the load circuit of Figure 3 and defined as the time required for the output to cross 0.8 V or 2.0 V.  
4t8 and t9 are derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 3. The measured number is then  
extrapolated back to remove the effects of charging or discharging the 50 pF capacitor. This means that the times, t8 and t9, quoted in the timing characteristics are  
the true bus relinquish time of the part and are independent of the bus loading.  
Specifications subject to change without notice.  
–4–  
REV. A  
AD7475/AD7495  
CS  
tCONVERT  
t6  
t2  
B
3
4
5
1
2
13  
15  
t8  
DB0  
16  
14  
t5  
SCLK  
t7  
DB10  
tQUIET  
t4  
DB11  
t3  
0
0
0
0
SDATA  
DB2  
DB1  
THREE-STATE  
THREE-STATE  
FOUR LEADING ZEROS  
Figure 1. Serial Interface Timing Diagram  
Timing Example 1  
With t2 = 10 ns min, this leaves tacq to be 664 ns. This 664 ns  
satisfies the requirement of 300 ns for tACQ. From Figure 2, tACQ  
is comprised of 2.5(1/fSCLK) + t8 + tQUIET, t8 = 45 ns. This allows  
a value of 119 ns for tQUIET satisfying the minimum requirement  
of 100 ns. As in this example and with other slower clock values,  
the signal may already be acquired before the conversion is  
complete, but it is still necessary to leave 100 ns minimum  
tQUIET between conversions. In Example 2 the signal should be  
fully acquired at approximately Point C in Figure 2.  
Having fSCLK = 20 MHz and a throughput of 1 MSPS gives a cycle  
time of t2 + 12.5(1/fSCLK) + tACQ = 1 µs. With t2 = 10 ns min, this  
leaves tACQ to be 365 ns. This 365 ns satisfies the requirement of  
300 ns for tACQ. From Figure 2, tACQ comprises of 2.5(1/fSCLK) + t8  
+ tQUIET, where t8 = 45 ns. This allows a value of 195 ns for tQUIET  
satisfying the minimum requirement of 100 ns.  
,
Timing Example 2  
Having fSCLK = 5 MHz and a throughput of 315 KSPS, gives a  
cycle time of t2 + 12.5(1/fSCLK) + tACQ = 3.174 s.  
CS  
tCONVERT  
t6  
t2  
B
C
3
4
5
1
2
13  
14  
t5  
15  
16  
SCLK  
t8  
tQUIET  
45ns  
12.5 (1/f  
)
SCLK  
tACQUISITION  
10ns  
1/THROUGHPUT  
Figure 2. Serial Interface Timing Example  
200A  
I
OL  
TO OUTPUT  
PIN  
1.6V  
C
L
50pF  
200A  
I
OH  
Figure 3. Load Circuit for Digital Output Timing Specifications  
REV. A  
–5–  
AD7475/AD7495  
ABSOLUTE MAXIMUM RATINGS1  
PIN CONFIGURATIONS  
(TA = 25C unless otherwise noted)  
AD7475 SOIC/SOIC  
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V  
V
DRIVE to GND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V  
Analog Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V  
Digital Input Voltage to GND . . . . . . . . . . . . . –0.3 V to +7 V  
1
2
3
4
8
7
6
5
REF IN  
V
DD  
AD7475  
TOP VIEW  
(Not to Scale)  
V
CS  
IN  
V
DRIVE to DVDD . . . . . . . . . . . . . . . . . –0.3 V to DVDD + 0.3 V  
GND  
V
DRIVE  
Digital Output Voltage to GND . . . . . . –0.3 V to VDD + 0.3 V  
REF IN to GND . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V  
Input Current to Any Pin Except Supplies2 . . . . . . . 10 mA  
Operating Temperature Range  
SCLK  
SDATA  
Commercial (A, B Version) . . . . . . . . . . . . –40C to +85C  
Storage Temperature Range . . . . . . . . . . . –65C to +150C  
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150C  
SOIC, µSOIC Package, Power Dissipation . . . . . . . . 450 mW  
JA Thermal Impedance . . . . . . . . . . . . . . 157C/W (SOIC)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205.9C/W (µSOIC)  
JC Thermal Impedance . . . . . . . . . . . . . . . 56C/W (SOIC)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43.74C/W (µSOIC)  
Lead Temperature, Soldering  
AD7495 SOIC/SOIC  
1
2
3
4
8
7
6
5
REF OUT  
V
DD  
AD7495  
TOP VIEW  
(Not to Scale)  
V
CS  
IN  
GND  
V
DRIVE  
SCLK  
SDATA  
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . . . 215C  
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220C  
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 kV  
NOTES  
1Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. This is a stress rating only; functional operation of the  
device at these or any other conditions above those listed in the operational sections  
of this specification is not implied. Exposure to absolute maximum rating condi-  
tions for extended periods may affect device reliability.  
2Transient currents of up to 100 mA will not cause SCR latch-up.  
ORDERING GUIDE  
Linearity  
Package  
Option2  
Branding  
Information  
Model  
Range  
Error (LSB)1  
AD7495AR  
AD7495BR  
AD7495ARM  
AD7495BRM  
AD7475AR  
AD7475BR  
AD7475ARM  
–40C to +85C  
–40C to +85C  
–40C to +85C  
–40C to +85C  
–40C to +85C  
–40C to +85C  
–40C to +85C  
–40C to +85C  
Evaluation Board  
Evaluation Board  
Controller Board  
1.5  
1
1.5  
1
1.5  
1
1.5  
SO-8  
SO-8  
RM-8  
RM-8  
SO-8  
SO-8  
RM-8  
RM-8  
AD7495AR  
AD7495BR  
CCA  
CCB  
AD7475AR  
AD7475BR  
C9A  
AD7475BRM  
1
C9B  
EVAL-AD7495CB3  
EVAL-AD7475CB3  
EVAL-CONTROL BRD24  
NOTES  
1Linearity Error here refers to Integral Linearity Error.  
2SO = SOIC; RM = µSOIC.  
3This can be used as a standalone evaluation board or in conjunction with the EVAL-BOARD CONTROLLER for evaluation/demonstration purposes.  
4This EVALUATION BOARD CONTROLLER is a complete unit allowing a PC to control and communicate with all Analog Devices evaluation boards ending in  
the CB designators.  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection. Although  
the AD7475/AD7495 features proprietary ESD protection circuitry, permanent damage may occur  
on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions  
are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
REV. A  
–6–  
AD7475/AD7495  
PIN FUNCTION DESCRIPTIONS  
Pin  
No.  
Mnemonic  
Function  
1
REF IN  
Reference Input for the AD7475. An external reference must be applied to this input. The voltage range  
for the external reference is 2.5 V 1% for specified performance. A cap of a least 0.1 F should be placed  
on the REF IN pin.  
REF OUT  
Reference Output for the AD7495. A minimum 100 nF capacitance is required from this pin to GND. The  
internal reference can be taken from this pin but buffering is required before it is applied elsewhere in a system.  
Analog Input. Single-ended analog input channel. The input range is 0 to REF IN.  
Analog Ground. Ground reference point for all circuitry on the AD7475/AD7495. All analog input signals  
and any external reference signal should be referred to this GND voltage.  
2
3
VIN  
GND  
4
5
SCLK  
Serial Clock. Logic input. SCLK provides the serial clock for accessing data from the part. This clock input is  
also used as the clock source for the AD7475/AD7495’s conversion process.  
Data Out. Logic Output. The conversion result from the AD7475/AD7495 is provided on this output as a  
serial data stream. The bits are clocked out on the falling edge of the SCLK input. The data stream consists  
of four leading zeros followed by the 12 bits of conversion data which is provided MSB first.  
Logic Power Supply Input. The voltage supplied at this pin determines at what voltage the serial interface  
of the AD7475/AD7495 will operate.  
Chip Select. Active low logic input. This input provides the dual function of initiating conversions on the  
AD7475/AD7495 and also frames the serial data transfer.  
Power Supply Input. The VDD range for the AD7475/AD7495 is from 2.7 V to 5.25 V.  
SDATA  
6
7
8
VDRIVE  
CS  
VDD  
TERMINOLOGY  
Total Harmonic Distortion  
Integral Nonlinearity  
Total harmonic distortion (THD) is the ratio of the rms sum of  
This is the maximum deviation from a straight line passing through  
the endpoints of the ADC transfer function. The endpoints of the  
transfer function are zero scale, a point 1/2 LSB below the first  
code transition, and full scale, a point 1/2 LSB above the last  
code transition.  
harmonics to the fundamental. For the AD7475/AD7495, it is  
defined as:  
V22 +V32 +V42 +V52 +V62  
THD(dB) = 20log  
V1  
Differential Nonlinearity  
This is the difference between the measured and the ideal 1 LSB  
change between any two adjacent codes in the ADC.  
where V1 is the rms amplitude of the fundamental and V2, V3, V4,  
V5 and V6 are the rms amplitudes of the second through the sixth  
harmonics.  
Offset Error  
Peak Harmonic or Spurious Noise  
This is the deviation of the first code transition (00 . . . 000) to  
(00 . . . 001) from the ideal, i.e., AGND + 0.5 LSB.  
Peak harmonic or spurious noise is defined as the ratio of the rms  
value of the next largest component in the ADC output spectrum  
(up to fS/2 and excluding dc) to the rms value of the fundamental.  
Normally, the value of this specification is determined by the  
largest harmonic in the spectrum, but for ADCs where the har-  
monics are buried in the noise floor, it will be a noise peak.  
Gain Error  
This is the deviation of the last code transition (111 . . . 110) to  
(111 . . . 111) from the ideal (i.e., VREF – 1.5 LSB) after the offset  
error has been adjusted out.  
Track/Hold Acquisition Time  
Intermodulation Distortion  
The track/hold amplifier returns into track mode on the 13th  
SCLK rising edge (see Serial Interface section). The Track/Hold  
Acquisition Time is the minimum time required for the track-  
and-hold amplifier to remain in track mode for its output to  
reach and settle to within 0.5 LSB of the applied input signal,  
given a step change to the input signal.  
With inputs consisting of sine waves at two frequencies, fa and  
fb, any active device with nonlinearities will create distortion  
products at sum and difference frequencies of mfa nfb where  
m, n = 0, 1, 2, 3, etc. Intermodulation distortion terms are those  
for which neither m nor n is equal to zero. For example, the  
second order terms include (fa + fb) and (fa fb), while the third  
order terms include (2fa + fb), (2fa fb), (fa + 2fb) and (fa 2fb).  
Signal to (Noise + Distortion) Ratio  
This is the measured ratio of signal to (noise + distortion) at the  
output of the A/D converter. The signal is the rms amplitude of  
the fundamental. Noise is the sum of all nonfundamental signals  
up to half the sampling frequency (fS/2), excluding dc. The ratio  
is dependent on the number of quantization levels in the digiti-  
zation process; the more levels, the smaller the quantization noise.  
The theoretical signal to (noise + distortion) ratio for an ideal  
N-bit converter with a sine wave input is given by:  
The AD7475/AD7495 are tested using the CCIF standard where  
two input frequencies near the top end of the input bandwidth are  
used. In this case, the second order terms are usually distanced  
in frequency from the original sine waves while the third order  
terms are usually at a frequency close to the input frequencies.  
As a result, the second and third order terms are specified sepa-  
rately. The calculation of the intermodulation distortion is as per  
the THD specification where it is the ratio of the rms sum of the  
individual distortion products to the rms amplitude of the sum  
of the fundamentals expressed in dBs.  
Signal to (Noise + Distortion) = (6.02 N + 1.76) dB  
Thus for a 12-bit converter, this is 74 dB.  
REV. A  
–7–  
AD7475/AD7495  
AD7475/AD7495 TYPICAL PERFORMANCE CURVES  
TPC 1 shows a typical FFT plot for the AD7475 at 1 MHz  
sample rate and 100 kHz input frequency.  
CIRCUIT INFORMATION  
The AD7475/AD7495 are fast, micropower, 12-bit, single-supply,  
A/D converters. The parts can be operated from a 2.7 V to 5.25 V  
supply. When operated from either a 5 V supply or a 3 V sup-  
ply, the AD7475/AD7495 are capable of throughput rates of  
1 MSPS when provided with a 20 MHz clock.  
8192 POINT FFT  
f
f
= 1MSPS  
SAMPLE  
= 100kHz  
–15  
–35  
The AD7475/AD7495 provide the user with an on-chip track/  
hold, A/D converter, and a serial interface housed in either an  
8-lead SOIC or µSOIC package, which offers the user considerable  
space-saving advantages over alternative solutions. The AD7495  
also has an on-chip 2.5 V reference. The serial clock input accesses  
data from the part but also provides the clock source for the  
successive-approximation A/D converter. The analog input range  
is 0 V to REF IN for the AD7475 and 0 V to REF OUT for  
the AD7495.  
IN  
SINAD = 70.46dB  
THD = –87.7dB  
SFDR = –89.5dB  
–55  
–75  
–95  
The AD7475/AD7495 also feature power-down options to allow  
power saving between conversions. The power-down feature is  
implemented across the standard serial interface as described in  
the Modes of Operation section.  
–115  
0
50  
100 150  
200 250 300  
350 400 450 500  
FREQUENCY – kHz  
TPC 1. AD7475 Dynamic Performance  
CONVERTER OPERATION  
TPC 2 shows a typical FFT plot for the AD7495 at 1 MHz sample  
rate and 100 kHz input frequency.  
The AD7475/AD7495 are 12-bit successive approximation  
analog-to-digital converters based around a capacitive DAC.  
The AD7475/AD7495 can convert analog input signals in the  
range 0 V to 2.5 V. Figures 4 and 5 show simplified schematics  
of the ADC. The ADC comprises of Control Logic, SAR and a  
Capacitive DAC, which are used to add and subtract fixed  
amounts of charge from the sampling capacitor to bring the  
comparator back into a balanced condition. Figure 4 shows the  
ADC during its acquisition phase. SW2 is closed and SW1 is in  
Position A. The comparator is held in a balanced condition and  
the sampling capacitor acquires the signal on VIN.  
8192 POINT FFT  
f
f
= 1MSPS  
= 100kHz  
SAMPLE  
15  
35  
IN  
SINAD = 69.95dB  
THD = 89.2dB  
SFDR = 91.2dB  
55  
75  
CAPACITIVE  
DAC  
95  
115  
4k  
A
0
50  
100 150  
200 250 300  
350 400 450 500  
V
IN  
FREQUENCY kHz  
B
CONTROL LOGIC  
SW1  
SW2  
TPC 2. AD7495 Dynamic Performance  
COMPARATOR  
AGND  
TPC 3 shows the signal-to-(noise + distortion) ratio performance  
versus input frequency for various supply voltages while sampling  
at 1 MSPS with an SCLK of 20 MHz.  
Figure 4. ADC Acquisition Phase  
When the ADC starts a conversion (see Figure 5), SW2 will  
open and SW1 will move to position B causing the compara-  
tor to become unbalanced. The Control Logic and the Capacitive  
DAC are used to add and subtract fixed amounts of charge  
from the sampling capacitor to bring the comparator back into a  
balanced condition. When the comparator is rebalanced, the  
conversion is complete. The Control Logic generates the ADC  
output code. Figure 6 shows the ADC transfer function.  
71.0  
V
= V  
= 4.75V  
70.5  
70.0  
69.5  
69.0  
68.5  
DD  
DRIVE  
V
= V = 3.60V  
DRIVE  
DD  
V
= V  
= 2.70V  
DD  
DRIVE  
CAPACITIVE  
DAC  
V
= V  
= 5.25V  
DD  
DRIVE  
4k⍀  
A
V
IN  
SW1  
B
CONTROL LOGIC  
SW2  
COMPARATOR  
10  
100  
INPUT FREQUENCY kHz  
1000  
AGND  
Figure 5. ADC Conversion Phase  
TPC 3. AD7495 SINAD vs. Input Frequency at 1 MSPS  
REV. A  
–8–  
AD7475/AD7495  
5V  
ADC TRANSFER FUNCTION  
SERIAL  
INTERFACE  
SUPPLY  
The output coding of the AD7475/AD7495 is straight binary.  
The designed code transitions occur midway between successive  
integer LSB values (i.e., 1/2 LSB, 3/2 LSBs, etc.). The LSB size  
is = VREF/4096. The ideal transfer characteristic for the AD7475/  
AD7495 is shown in Figure 6 below.  
0.1F  
10F  
V
DD  
SCLK  
0V TO  
2.5V  
INPUT  
V
SDATA  
IN  
AD7475  
C/P  
CS  
GND  
V
DRIVE  
111...111  
111...110  
REF IN  
0.1F  
10F  
2.5V  
AD780  
111...000  
0.1F  
(MIN)  
1LSB = V  
/4096  
REF  
3V  
SUPPLY  
011...111  
Figure 7. AD7475 Typical Connection Diagram  
000...010  
000...001  
000...000  
Analog Input  
Figure 9 shows an equivalent circuit of the analog input structure  
of the AD7475/AD7495. The two diodes D1 and D2 provide ESD  
protection for the analog inputs. Care must be taken to ensure that  
the analog input signal never exceeds the supply rails by more than  
200 mV. This will cause these diodes to become forward-biased  
and start conducting current into the substrate. 20 mA is the  
maximum current these diodes can conduct without causing  
irreversible damage to the part. The capacitor C1 in Figure 9 is  
typically about 4 pF and can primarily be attributed to pin capaci-  
tance. The resistor R1 is a lumped component made up of the  
on resistance of a switch. This resistor is typically about 100 .  
The capacitor C2 is the ADC sampling capacitor and has a capaci-  
tance of 16 pF typically. For ac applications, removing high  
frequency components from the analog input signal is recom-  
mended by use of an RC low-pass filter on the relevant analog  
input pin. In applications where harmonic distortion and signal  
to noise ratio are critical, the analog input should be driven from  
a low impedance source. Large source impedances will signifi-  
cantly affect the ac performance of the ADC. This may necessitate  
the use of an input buffer amplifier. The choice of the op amp will  
be a function of the particular application.  
0.5LSB  
0V  
V
1.5LSB  
REF  
ANALOG INPUT  
Figure 6. AD7475/AD7495 Transfer Characteristic  
TYPICAL CONNECTION DIAGRAM  
Figure 7 and Figure 8 show a typical connection diagram for the  
AD7475 and AD7495 respectively. In both setups the GND pin is  
connected to the analog ground plane of the system. In Figure 7  
REF IN is connected to a decoupled 2.5 V supply from a reference  
source, the AD780, to provide an analog input range of 0 V to  
2.5 V. Although the AD7475 is connected to a VDD of 5 V, the  
serial interface is connected to a 3 V microprocessor. The VDRIVE  
pin of the AD7475 is connected to the same 3 V supply of the  
microprocessor to allow a 3 V logic interface, see Digital Inputs  
Section. In Figure 8, the REF OUT pin of the AD7495 is con-  
nected to a buffer and then applied to a level-shifting circuit used  
on the analog input to allow a bipolar signal to be applied to the  
AD7495. A minimum 100 nF capacitance is required on the  
REF OUT pin to GND. The conversion result from both ADCs is  
output in a 16-bit word with four leading zeros followed by the  
MSB of the 12-bit result. For applications where power con-  
sumption is of concern, the power-down modes should be  
used between conversions or bursts of several conversions to  
improve power performance. See Modes of Operation section  
of the data sheet.  
V
DD  
C2  
16pF  
D1  
D2  
R1  
V
IN  
C1  
4pF  
CONVERSION PHASESWITCH OPEN  
TRACK PHASESWITCH CLOSED  
Figure 9. Equivalent Analog Input Circuit  
5V  
SUPPLY  
SERIAL  
INTERFACE  
0.1F  
10F  
V
V
0V TO  
2.5V  
INPUT  
DD  
R
SCLK  
R
0V  
V
V
IN  
SDATA  
3R  
AD7495  
C/P  
R
CS  
GND  
V
DRIVE  
REF OUT  
0.1F  
10F  
0.1F  
(MIN)  
3V  
SUPPLY  
Figure 8. AD7495 Typical Connection Diagram  
–9–  
REV. A  
AD7475/AD7495  
When no amplifier is used to drive the analog input, the source  
impedance should be limited to low values. The maximum source  
impedance will depend on the amount of total harmonic distortion  
(THD) that can be tolerated. The THD will increase as the source  
impedance increases and performance will degrade. Figure 10  
shows a graph of the total harmonic distortion versus source  
impedance for various analog input frequencies.  
allows the ADC to easily interface to both 3 V and 5 V processors.  
For example, if the AD7475/AD7495 were operated with a VDD  
of 5 V, and the VDRIVE pin could be powered from a 3 V supply.  
The AD7475/AD7495 has better dynamic performance with a  
VDD of 5 V while still being able to interface to 3 V digital parts.  
Care should be taken to ensure VDRIVE does not exceed VDD by  
more than 0.3 V. (See Absolute Maximum Ratings.)  
Reference Section  
10  
20  
An external reference source should be used to supply the 2.5 V  
reference to the AD7475. Errors in the reference source will result  
in gain errors in the AD7475 transfer function and will add the  
specified full-scale errors on the part. A capacitor of at least 0.1 µF  
should be placed on the REF IN pin. Suitable reference sources  
for the AD7475 include the AD780, the AD680, and the AD1852.  
30  
f
= 10kHz  
IN  
40  
50  
60  
f
= 500kHz  
IN  
f
= 200kHz  
IN  
The AD7495 contains an on-chip 2.5 V reference. As shown in  
Figure 12, the voltage that appears at the REF OUT pin is inter-  
nally buffered before being applied to the ADC, the output  
impedance of this buffer is typically 10 . The reference is capable  
of sourcing up to 2 mA. The REF OUT pin should be decoupled  
to AGND using a 100 nF or greater capacitor.  
70  
80  
90  
f
= 100kHz  
IN  
1
10  
100  
1000  
10000  
If the 2.5 V internal reference is to be used to drive another device  
that is capable of glitching the reference at critical times, then the  
reference will have to be buffered before driving the device. To  
ensure optimum performance of the AD7495 it is recommended  
that the Internal Reference not be over driven. If the use of an  
external reference is required the AD7475 should be used.  
SOURCE IMPEDANCE Ohms  
Figure 10. THD vs. Source Impedance for Various Ana-  
log Input Frequencies  
Figure 11 shows a graph of total harmonic distortion versus analog  
Input frequency for various supply voltages while sampling at  
1 MSPS with an SCLK of 20 MHz.  
V
REF OUT  
25  
75  
V
= V  
= 5.25V  
40k⍀  
77  
79  
81  
83  
85  
87  
89  
91  
93  
95  
DD  
DRIVE  
160k⍀  
V
= V  
= 2.70V  
DD  
DRIVE  
Figure 12. AD7495 Reference Circuit  
MODES OF OPERATION  
V
= V  
= 3.60V  
DD  
DRIVE  
The mode of operation of the AD7475/AD7495 is selected by  
controlling the (logic) state of the CS signal during a conversion.  
There are three possible modes of operation, Normal Mode,  
Partial Power-Down Mode, and Full Power-Down Mode. The  
point at which CS is pulled high after the conversion has been  
initiated will determine which power-down mode, if any, the device  
will enter. Similarly, if already in a power-down mode, CS can  
control whether the device will return to Normal operation or  
remain in power-down. These modes of operation are designed to  
provide flexible power management options. These options can be  
chosen to optimize the power dissipation/throughput rate ratio for  
differing application requirements.  
V
= V  
= 4.75V  
DD  
DRIVE  
10  
100  
INPUT FREQUENCY kHz  
1000  
Figure 11. THD vs. Analog Input Frequency for Various  
Supply Voltages  
Digital Inputs  
The digital inputs applied to the AD7475/AD7495 are not limited  
by the maximum ratings which limit the analog inputs. Instead,  
the digital inputs applied can go to 7 V and are not restricted by  
the VDD + 0.3 V limit as on the analog inputs.  
Normal Mode  
This mode is intended for fastest throughput rate performance as  
the user does not have to worry about any power-up times with  
the AD7475/AD7495 remaining fully powered all the time.  
Figure 13 shows the general diagram of the operation of the  
AD7475/AD7495 in this mode.  
Another advantage of SCLK and CS not being restricted by the  
DD + 0.3 V limit is the fact that power supply sequencing issues  
are avoided. If CS or SCLK are applied before VDD, there is no  
risk of latch-up as there would be on the analog inputs if a  
V
The conversion is initiated on the falling edge of CS as described in  
the Serial Interface section. To ensure the part remains fully pow-  
ered up at all times, CS must remain low until at least 10 SCLK  
falling edges have elapsed after the falling edge of CS. If CS is  
brought high any time after the 10th SCLK falling edge, but  
signal greater than 0.3 V were applied prior to VDD  
.
VDRIVE  
The AD7475/AD7495 also has the VDRIVE feature. VDRIVE  
controls the voltage at which the serial interface operates. VDRIVE  
REV. A  
–10–  
AD7475/AD7495  
CS  
1
10  
16  
SCLK  
SDATA  
FOUR LEADING ZEROS + CONVERSION RESULT  
Figure 13. Normal Mode Operation  
CS  
1
2
10  
16  
SCLK  
Figure 14. Entering Partial Power-Down Mode  
THE PART BEGINS  
TO POWER UP  
THE PART IS FULLY  
POWERED UP  
CS  
16  
16  
A1  
1
10  
SCLK  
SDATA  
INVALID DATA  
VALID DATA  
Figure 15. Exiting Partial Power-Down Mode  
falling edge of CS the device will begin to power up, and will  
continue to power up as long as CS is held low until after the  
falling edge of the tenth SCLK. The device will be fully powered  
up once 16 SCLKs have elapsed, and valid data will result from  
the next conversion as shown in Figure 15. If CS is brought high  
before the second falling edge of SCLK, the AD7475/AD7495  
will go back into partial power-down again. This avoids accidental  
power-up due to glitches on the CS line; although the device  
may begin to power up on the falling edge of CS, it will power  
down again on the rising edge of CS. If in partial power-down  
and CS is brought high between the second and tenth falling  
edges of SCLK, the device will enter full power-down mode.  
before the 16th SCLK falling edge, the part will remain powered  
up but the conversion will be terminated and SDATA will go  
back into three-state. Sixteen serial clock cycles are required  
to complete the conversion and access the conversion result. CS  
may idle high until the next conversion or may idle low until some-  
time prior to the next conversion (effectively idling CS low).  
Once a data transfer is complete (SDATA has returned to  
three-state), another conversion can be initiated after the quiet  
time, tQUIET, has elapsed by bringing CS low again.  
Partial Power-Down Mode  
This mode is intended for use in applications where slower  
throughput rates are required; either the ADC is powered down  
between each conversion, or a series of conversions may be  
performed at a high throughput rate and then the ADC is powered  
down for a relatively long duration between these bursts of several  
conversions. When the AD7475 is in partial power-down, all ana-  
log circuitry is powered down except for the bias current generator;  
and, in the case of the AD7495, all analog circuitry is powered  
down except for the on-chip reference and reference buffer.  
Power-Up Time  
The power-up time of the AD7475/AD7495 from partial power-  
down is typically 1 µs, which means that with any frequency of  
SCLK up to 20 MHz, one dummy cycle will always be suffi-  
cient to allow the device to power up from partial power-down.  
Once the dummy cycle is complete, the ADC will be fully pow-  
ered up and the input signal will be acquired properly. The quiet  
time tQUIET must still be allowed from the point where the bus  
goes back into three-state after the dummy conversion, to the  
next falling edge of CS. When running at 1 MSPS throughput  
rate, the AD7475/AD7495 will power up and acquire a signal  
within 0.5 LSB in one dummy cycle, i.e., 1 µs.  
To enter partial power-down, the conversion process must be  
interrupted by bringing CS high anywhere after the second falling  
edge of SCLK and before the tenth falling edge of SCLK as shown  
in Figure 14. Once CS has been brought high in this window of  
SCLKs, the part will enter partial power-down, and the con-  
version that was initiated by the falling edge of CS will be  
terminated, and SDATA will go back into three-state. If CS  
is brought high before the second SCLK falling edge, the part  
will remain in Normal Mode and will not power down. This will  
avoid accidental power-down due to glitches on the CS line.  
When powering up from the power-down mode with a dummy  
cycle, as in Figure 15, the track-and-hold that was in hold mode  
while the part was powered down, returns to track mode after the  
first SCLK edge the part receives after the falling edge of CS.  
This is shown as Point A in Figure 15. Although at any SCLK  
frequency one dummy cycle is sufficient to power the device up  
and acquire VIN, it does not necessarily mean that a full dummy  
In order to exit this mode of operation and power the AD7475/  
AD7495 up again, a dummy conversion is performed. On the  
REV. A  
–11–  
AD7475/AD7495  
THE PART ENTERS  
PARTIAL POWER-DOWN  
THE PART BEGINS  
TO POWER UP  
THE PART ENTERS  
FULL POWER-DOWN  
CS  
16  
16  
1
2
1
2
10  
10  
SCLK  
THREE-STATE  
THREE-STATE  
SDATA  
INVALID DATA  
INVALID DATA  
Figure 16. Entering Full Power-Down Mode  
THE PART IS FULLY  
POWERED UP  
THE PART BEGINS  
TO POWER UP  
tPOWER-UP  
CS  
16  
16  
1
1
10  
SCLK  
SDATA  
INVALID DATA  
VALID DATA  
Figure 17. Exiting Full Power-Down Mode  
cycle of 16 SCLKs must always elapse to power up the device  
and fully acquire VIN; 1 µs will be sufficient to power the device  
up and acquire the input signal. If, for example, a 5 MHz SCLK  
frequency was applied to the ADC, the cycle time would be 3.2 s.  
In one dummy cycle, 3.2 µs, the part would be powered up and  
VIN fully acquired. However, after 1 µs with a 5 MHz SCLK,  
only 5 SCLK cycles would have elapsed. At this stage, the ADC  
would be fully powered up and the signal acquired. So, in this  
case the CS can be brought high after the tenth SCLK falling edge  
and brought low again after a time tQUIET to initiate the conversion.  
long as CS is held low until after the falling edge of the tenth  
SCLK. The power-up time is longer than one dummy conversion  
cycle however, and this time, tPOWER-UP, must elapse before  
a conversion can be initiated as shown in Figure 17. (See  
Timing Specifications.)  
When power supplies are first applied to the AD7475/AD7495,  
the ADC may power up in either of the power-down modes or  
normal mode. Because of this, it is best to allow a dummy cycle  
to elapse to ensure the part is fully powered up before attempt-  
ing a valid conversion. Likewise, if it is intended to keep the part  
in the partial power-down mode immediately after the supplies  
are applied, then two dummy cycles must be initiated. The first  
dummy cycle must hold CS low until after the tenth SCLK  
falling edge, Figure 13; in the second cycle CS must be brought  
high before the tenth SCLK edge but after the second SCLK  
falling edge, Figure 14. Alternatively, if it is intended to place  
the part in full power-down mode when the supplies have been  
applied, then three dummy cycles must be initiated. The first  
dummy cycle must hold CS low until after the tenth SCLK  
edge, Figure 13; the second and third dummy cycle place the  
part in full power-down, Figure 16. See Modes of Operation  
section. Once supplies are applied to the AD7475/AD7495,  
enough time must be allowed, for the AD7475, for the external  
reference to power up and charge the reference capacitor to its  
final value. For the AD7495, enough time should be allowed for  
the internal reference buffer to charge the reference capacitor.  
Then, to place the AD7475/AD7495 in normal mode, a dummy  
cycle, 1 µs, should be initiated. If the first valid conversion is then  
performed directly after the dummy conversion, care must be  
taken to ensure that adequate acquisition time has been allowed.  
As mentioned earlier, when powering up from the power-down  
mode, the part will return to track upon the first SCLK edge  
applied after the falling edge of CS. However, when the ADC  
powers up initially after supplies are applied, the track-and-hold  
will already be in track. This means (assuming one has the facil-  
ity to monitor the ADC supply current) if the ADC powers up  
Full Power-Down Mode  
This mode is intended for use in applications where slower  
throughput rates are required than that in the partial power-down  
mode, as power up from a full power-down would not be com-  
plete in just one dummy conversion. This mode is more suited to  
applications where a series of conversions performed at a relatively  
high throughput rate would be followed by a long period of  
inactivity and hence power-down. When the AD7475/AD7495  
is in full power-down, all analog circuitry is powered down.  
Full power-down is entered in a way similar to partial power-down,  
except the timing sequence shown in Figure 14 must be executed  
twice. The conversion process must be interrupted in a similar  
fashion by bringing CS high anywhere after the second falling  
edge of SCLK and before the tenth falling edge of SCLK. The  
device will enter partial power-down at this point. To reach full  
power-down, the next conversion cycle must be interrupted  
in the same way as shown in Figure 16. Once CS has been  
brought high in this window of SCLKs, then the part will  
power down completely.  
NOTE: It is not necessary to complete the 16 SCLKs once CS  
has been brought high to enter a power-down mode.  
To exit full power-down, and power the AD7475/AD7495 up  
again, a dummy conversion is performed as when powering  
up from partial power-down. On the falling edge of CS the  
device will begin to power up, and will continue to power up as  
REV. A  
–12–  
AD7475/AD7495  
in the desired mode of operation, and thus a dummy cycle is not  
required to change mode, then neither is a dummy cycle required  
to place the track-and-hold into track. If no current monitoring  
facility is available, the relevant dummy cycle(s) should be per-  
formed to ensure the part is in the required mode.  
remaining 8 µs where the part is in partial power-down. With a  
throughput rate of 100 kSPS, the average power dissipated during  
each conversion cycle is (2/10) (6 mW) + (8/10) (0.69 mW)  
= 1.752 mW. Figure 18 shows the power versus throughput rate  
when using the partial power-down mode between conversions  
with both 5 V and 3 V supplies for both the AD7475 and AD7495.  
For the AD7475, partial power-down current is lower than that  
of the AD7495.  
POWER VERSUS THROUGHPUT RATE  
By using the partial power-down mode on the AD7475/AD7495  
when not converting, the average power consumption of the  
ADC decreases at lower throughput rates. Figure 18 shows  
how, as the throughput rate is reduced, the part remains in its  
partial power-down state longer and the average power consump-  
tion over time drops accordingly.  
Full power-down mode is intended for use in applications with  
slower throughput rates than required for the partial power-  
down mode. It is necessary to leave 650 µs for the AD7495 to  
be fully powered up from full power-down before initiating a  
conversion. Current consumptions between conversions is typi-  
cally less than 1 µA.  
100  
Figure 19 shows a typical graph of current versus throughput for  
the AD7495 while operating in different modes. At slower  
throughput rates, e.g., 10 SPS to 1 kSPS, the AD7495 was  
operated in Full Power-Down mode. As the throughput rate  
increased, up to 100 kSPS, the AD7495 was operated in Partial  
Power-Down mode, with the part being powered down between  
conversions. With throughput rates from 100 kSPS to 1 MSPS,  
the part operated in Normal mode, remaining fully powered up  
at all times.  
AD7495 5V  
SCLK = 20MHz  
AD7475 5V  
SCLK = 20MHz  
10  
1
AD7495 3V  
SCLK = 20MHz  
AD7475 3V  
SCLK = 20MHz  
0.1  
0.01  
2.0  
V
= 5V  
DD  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
0.001  
0
50  
100  
150  
200  
250  
300  
350  
THROUGHPUT kSPS  
Figure 18. AD7495 Power vs. Throughput for Partial  
Power-Down  
For example if the AD7495 is operated in a continuous sampling  
mode with a throughput rate of 100 kSPS and an SCLK of  
20 MHz (VDD = 5 V), and the device is placed in partial power-  
down mode between conversions, then the power consumption  
is calculated as follows. The maximum power dissipation during  
normal operation is 13 mW (VDD = 5 V). If the power-up time  
from partial power-down is one dummy cycle, i.e., 1 µs, and the  
remaining conversion time is another cycle, i.e., 1 µs, then the  
AD7495 can be said to dissipate 13 mW for 2 µs during each  
conversion cycle. For the remainder of the conversion cycle,  
8 µs, the part remains in partial power-down mode. The AD7495  
can be said to dissipate 1.15 mW for the remaining 8 µs of the  
conversion cycle. If the throughput rate is 100 kSPS, the cycle  
time is 10 µs and the average power dissipated during each cycle  
is (2/10) (13 mW) + (8/10) (1.15 mW) = 3.52 mW. If VDD  
= 3 V, SCLK = 20 MHz and the device is again in partial power-  
down mode between conversions, the power dissipated during  
normal operation is 6 mW. The AD7495 can be said to dissipate  
6 mW for 2 µs during each conversion cycle and 0.69 mW for the  
PARTIAL  
POWER-DOWN  
FULL  
POWER-DOWN  
NORMAL  
10  
100  
1k  
10k  
100k  
1M  
THROUGHPUT SPS  
Figure 19. Typical AD7495 Current vs. Throughput  
SERIAL INTERFACE  
Figure 20 shows the detailed timing diagram for serial interfacing  
to the AD7475/AD7495. The serial clock provides the conversion  
clock and also controls the transfer of information from the  
AD7475/AD7495 during conversion.  
CS initiates the data transfer and conversion process. The falling  
edge of CS puts the track and hold into hold mode, takes the bus  
out of three-state, and the analog input is sampled at this point.  
CS  
tCONVERT  
t6  
t2  
B
3
4
5
1
2
13  
15  
t8  
DB0  
16  
14  
t5  
SCLK  
t7  
DB10  
tQUIET  
t4  
DB11  
t3  
0
0
0
0
SDATA  
DB2  
DB1  
THREE-STATE  
THREE-STATE  
FOUR LEADING ZEROS  
Figure 20. Serial Interface Timing Diagram  
–13–  
REV. A  
AD7475/AD7495  
CS  
tCONVERT  
t6  
t2  
B
t9  
3
4
5
1
2
13  
15  
16  
14  
SCLK  
t7  
tQUIET  
t4  
t3  
0
0
0
0
DB11  
DB10  
SDATA  
THREE-STATE  
DB2  
THREE-STATE  
FOUR LEADING ZEROS  
Figure 21. Serial Interface Timing Diagram—Conversion Termination  
The connection diagram is shown in Figure 22. It should be noted  
that for signal processing applications, it is imperative that  
the frame synchronization signal from the TMS320C5x/C54x  
provide equidistant sampling. The VDRIVE pin of the AD7475/  
AD7495 takes the same supply voltage as that of the TMS320C5x/  
C54x. This allows the ADC to operate at a higher voltage than  
the serial interface, i.e., TMS320C5x/C54x, if necessary.  
The conversion is also initiated at this point and will require  
16 SCLK cycles to complete. Once 13 SCLK falling edges have  
elapsed, the track and hold will go back into track on the next  
SCLK rising edge as shown in Figure 20 at Point B. On the  
16th SCLK falling edge the SDATA line will go back into three-  
state. If the rising edge of CS occurs before 16 SCLKs have  
elapsed, the conversion will be terminated and the SDATA line  
will go back into three-state, as shown in Figure 21, otherwise  
SDATA returns to three-state on the 16th SCLK falling edge as  
shown in Figure 20.  
TMS320C5x/C54x*  
AD7475/AD7495*  
SCLK  
CLKX  
Sixteen serial clock cycles are required to perform the conversion  
process and to access data from the AD7475/AD7495. CS going  
low provides the first leading zero to be read in by the micro-  
controller or DSP. The remaining data is then clocked out by  
subsequent SCLK falling edges beginning with the 2nd leading  
zero, thus the first falling clock edge on the serial clock has the  
second leading zero provided. The final bit in the data transfer  
is valid on the sixteenth falling edge, having being clocked out on  
the previous (15th) falling edge.  
CLKR  
DR  
SDATA  
CS  
FBX  
V
DRIVE  
FSR  
V
DD  
*
ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 22. Interfacing to the TMS320C5x/C54x  
AD7475/AD7495 to ADSP-21xx  
In applications with a slower SCLK, it may be possible to read in  
data on each SCLK rising edge, although the first leading zero will  
still have to be read on the first SCLK falling edge after the CS  
falling edge. Therefore, the first rising edge of SCLK after the CS  
falling edge would provide the second leading zero and the 15th  
rising SCLK edge would have DB0 provided. This method may  
not work with most Micros/DSPs, but could possibly be used  
with FPGAs and ASICs.  
The ADSP-21xx family of DSPs are interfaced directly to the  
AD7475/AD7495 without any glue logic required. The VDRIVE pin  
of the AD7475/AD7495 takes the same supply voltage as that of  
the ADSP-21xx. This allows the ADC to operate at a higher  
voltage than the serial interface, i.e., ADSP-21xx, if necessary.  
The SPORT control register should be set up as follows:  
TFSW = RFSW = 1, Alternate Framing  
INVRFS = INVTFS = 1, Active Low Frame Signal  
DTYPE = 00, Right Justify Data  
SLEN = 1111, 16-Bit Data Words  
ISCLK = 1, Internal Serial Clock  
TFSR = RFSR = 1, Frame Every Word  
IRFS = 0,  
MICROPROCESSOR INTERFACING  
The serial interface on the AD7475/AD7495 allows the parts to  
be directly connected to a range of many different microprocessors.  
This section explains how to interface the AD7475/AD7495 with  
some of the more common microcontroller and DSP serial  
interface protocols.  
ITFS = 1.  
AD7475/AD7495 to TMS320C5x/C54x  
To implement the power-down modes SLEN should be set to  
1001 to issue an 8-bit SCLK burst.  
The serial interface on the TMS320C5x/C54x uses a continuous  
serial clock and frame synchronization signals to synchronize the  
data transfer operations with peripheral devices like the AD7475/  
AD7495. The CS input allows easy interfacing between the  
TMS320C5x/C54x and the AD7475/AD7495 without any glue  
logic required. The serial port of the TMS320C5x/C54x is set  
up to operate in burst mode with internal CLKX (Tx serial clock)  
and FSX (Tx frame sync). The serial port control register (SPC)  
must have the following setup: FO = 0, FSM = 1, MCM = 1 and  
TXM = 1. The format bit, FO, may be set to 1 to set the word  
length to 8 bits, in order to implement the power-down modes  
on the AD7475/AD7495.  
The connection diagram is shown in Figure 23. The ADSP-  
21xx has the TFS and RFS of the SPORT tied together, with  
TFS set as an output and RFS set as an input. The DSP oper-  
ates in Alternate Framing Mode and the SPORT control register is  
set up as described. The Frame synchronizations signal generated  
on the TFS is tied to CS and as with all signal processing appli-  
cations equidistant sampling is necessary. However, in this  
example, the timer interrupt is used to control the sampling rate  
of the ADC and under certain conditions, equidistant sampling  
may not be achieved.  
REV. A  
–14–  
AD7475/AD7495  
implement the power-down modes on the AD7475/AD7495  
then the word length can be changed to eight bits by setting bits  
WL1 = 0 and WL0 = 0 in CRA. It should be noted that for  
signal processing applications, it is imperative that the frame  
synchronization signal from the DSP56xxx provide equidistant  
sampling. The VDRIVE pin of the AD7475/AD7495 takes the  
same supply voltage as that of the DSP56xxx. This allows the  
ADC to operate at a voltage higher than the serial interface, i.e.,  
DSP56xxx, if necessary.  
ADSP-21xx*  
SCLK  
AD7475/AD7495*  
SCLK  
DR  
SDATA  
CS  
RFS  
TFS  
V
DRIVE  
V
DD  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 23. Interfacing to the ADSP-21xx  
DSP56xxx*  
AD7475/AD7495*  
SCLK  
SCLK  
SRD  
SC2  
The Timer registers etc., are loaded with a value that will provide  
an interrupt at the required sample interval. When an interrupt  
is received, a value is transmitted with TFS/DT (ADC control  
word). The TFS is used to control the RFS and hence the  
reading of data. The frequency of the serial clock is set in the  
SCLKDIV register. When the instruction to transmit with TFS  
is given, (i.e., AX0 = TX0), the state of the SCLK is checked. The  
DSP will wait until the SCLK has gone high, low, and high  
before transmission will start. If the timer and SCLK values are  
chosen such that the instruction to transmit occurs on or near  
the rising edge of SCLK, the data may be transmitted or it may  
wait until the next clock edge.  
SDATA  
CS  
V
DRIVE  
V
DD  
*
ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 24. Interfacing to the DSP56xxx  
AD7475/AD7495 to MC68HC16  
The Serial Peripheral Interface (SPI) on the MC68HC16 is  
configured for Master Mode (MSTR = 1), Clock Polarity Bit  
(CPOL) = 1 and the Clock Phase Bit (CPHA) = 0. The SPI  
is configured by writing to the SPI Control Register (SPCR), see  
68HC16 user manual. The serial transfer will take place as a  
16-bit operation when the SIZE bit in the SPCR register is  
set to SIZE = 1. To implement the power-down modes with an  
8-bit transfer set SIZE = 0. A connection diagram is shown in  
Figure 25. The VDRIVE pin of the AD7475/AD7495 takes the same  
supply voltage as that of the MC68HC16. This allows the ADC  
to operate at a higher voltage than the serial interface, i.e.,  
MC68HC16, if necessary.  
For example, the ADSP-2111 has a master clock frequency of  
16 MHz. If the SCLKDIV register is loaded with the value 3, an  
SCLK of 2 MHz is obtained, and eight master clock periods will  
elapse for every 1 SCLK period. If the timer registers are loaded  
with the value 803, 100.5 SCLKs will occur between interrupts  
and subsequently between transmit instructions. This situation  
will result in nonequidistant sampling as the transmit instruc-  
tion is occurring on a SCLK edge. If the number of SCLKs  
between interrupts is a whole integer figure of N, equidistant  
sampling will be implemented by the DSP.  
AD7475/AD7495 to DSP56xxx  
The connection diagram in Figure 24 shows how the AD7475/  
AD7495 can be connected to the SSI (Synchronous Serial Inter-  
face) of the DSP56xxx family of DSPs from Motorola. The SSI  
is operated in Synchronous Mode (SYN bit in CRB = 1) with  
internally generated 1-bit clock period frame sync for both Tx  
and Rx (bits FSL1 = 1 and FSL0 = 0 in CRB). Set the word  
length to 16 by setting bits WL1 = 1 and WL0 = 0 in CRA. To  
MC68HC16*  
AD7475/AD7495*  
SCLK  
SCLK/PCM2  
MISO/PMC0  
SDATA  
CS  
SS/PMC3  
V
DRIVE  
V
DD  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 25. Interfacing to the MC68HC16  
REV. A  
–15–  
AD7475/AD7495  
OUTLINE DIMENSIONS  
Dimensions shown in inches and (mm).  
8-Lead SOIC  
(SO-8)  
0.1968 (5.00)  
0.1890 (4.80)  
8
1
5
4
0.2440 (6.20)  
0.2284 (5.80)  
0.1574 (4.00)  
0.1497 (3.80)  
PIN 1  
0.0196 (0.50)  
0.0099 (0.25)  
0.0500 (1.27)  
BSC  
؋
 45؇  
0.0688 (1.75)  
0.0532 (1.35)  
0.0098 (0.25)  
0.0040 (0.10)  
SEATING  
PLANE  
8؇  
0؇  
0.050 (1.27)  
0.016 (0.40)  
0.020 (0.51)  
0.013 (0.33)  
0.0098 (0.25)  
0.0075 (0.19)  
CONTROLLING DIMENSIONS ARE IN MILLIMETERS  
8-Lead microSOIC  
(RM-8)  
0.122 (3.10)  
0.114 (2.90)  
8
5
4
0.122 (3.10)  
0.114 (2.90)  
0.199 (5.05)  
0.187 (4.75)  
1
PIN 1  
0.0256 (0.65) BSC  
0.120 (3.05)  
0.112 (2.84)  
0.120 (3.05)  
0.112 (2.84)  
0.043 (1.09)  
0.037 (0.94)  
0.006 (0.15)  
0.002 (0.05)  
33؇  
0.018 (0.46)  
0.008 (0.20)  
27؇  
0.028 (0.71)  
0.016 (0.41)  
0.011 (0.28)  
0.003 (0.08)  
SEATING  
PLANE  
–16–  
REV. A  

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