AD7569TE2 [ADI]

LC2MOS Complete, 8-Bit Analog I/0 Systems; LC2MOS完成, 8位模拟I / O系统
AD7569TE2
型号: AD7569TE2
厂家: ADI    ADI
描述:

LC2MOS Complete, 8-Bit Analog I/0 Systems
LC2MOS完成, 8位模拟I / O系统

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LC2MOS  
a
Complete, 8-Bit Analog I/0 Systems  
AD7569/AD7669  
AD7569 FUNCTIONAL BLOCK DIAGRAM  
FEATURES  
2 s ADC with Track/Hold  
1 s DAC with Output Amplifier  
AD7569, Single DAC Output  
AD7669, Dual DAC Output  
On-Chip Bandgap Reference  
Fast Bus Interface  
Single or Dual 5 V Supplies  
GENERAL DESCRIPTION  
The AD7569/AD7669 is a complete, 8-bit, analog I/O system  
on a single monolithic chip. The AD7569 contains a high speed  
successive approximation ADC with 2 µs conversion time, a track/  
hold with 200 kHz bandwidth, a DAC and an output buffer ampli-  
fier with 1 µs settling time. A temperature-compensated 1.25 V  
bandgap reference provides a precision reference voltage for the  
ADC and the DAC. The AD7669 is similar, but contains two  
DACs with output buffer amplifiers.  
AD7669 FUNCTIONAL BLOCK DIAGRAM  
A choice of analog input/output ranges is available. Using a sup-  
ply voltage of +5 V, input and output ranges of zero to 1.25 V  
and zero to 2.5 volts may be programmed using the RANGE in-  
put pin. Using a ±5 V supply, bipolar ranges of ±1.25 V or  
±2.5 V may be programmed.  
Digital interfacing is via an 8-bit I/O port and standard micro-  
processor control lines. Bus interface timing is extremely fast, al-  
lowing easy connection to all popular 8-bit microprocessors. A  
separate start convert line controls the track/hold and ADC to  
give precise control of the sampling period.  
PRODUCT HIGHLIGHTS  
The AD7569/AD7669 is fabricated in Linear-Compatible  
CMOS (LC2MOS), an advanced, mixed technology process  
combining precision bipolar circuits with low power CMOS  
logic. The AD7569 is packaged in a 24-pin, 0.3" wide “skinny”  
DIP, a 24-terminal SOIC and 28-terminal PLCC and LCCC  
packages. The AD7669 is available in a 28-pin, 0.6" plastic  
DIP, 28-terminal SOIC and 28-terminal PLCC package.  
1. Complete Analog I/O on a Single Chip.  
The AD7569/AD7669 provides everything necessary to  
interface a microprocessor to the analog world. No external  
components or user trims are required and the overall accu-  
racy of the system is tightly specified, eliminating the need  
to calculate error budgets from individual component  
specifications.  
2. Dynamic Specifications for DSP Users.  
In addition to the traditional ADC and DAC specifications,  
the AD7569/AD7669 is specified for ac parameters, includ-  
ing signal-to-noise ratio, distortion and input bandwidth.  
3. Fast Microprocessor Interface.  
The AD7569/AD7669 has bus interface timing compatible  
with all modern microprocessors, with bus access and relin-  
quish times less than 75 ns and write pulse width less than  
80 ns.  
REV. B  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, nor for any infringements of patents or other rights of third parties  
which may result from its use. No license is granted by implication or  
otherwise under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 617/329-4700  
Fax: 617/326-8703  
World Wide Web Site: http://www.analog.com  
© Analog Devices, Inc., 1996  
AD7569/AD7669–SPECIFICATIONS  
(VDD = +5 V ؎ 5%; VSS2 = RANGE = AGNDDAC = AGNDADC = DGND = 0 V; RL = 2 k, CL = 100 pF to AGNDDAC  
unless otherwise noted. All specifications TMIN to TMAX unless otherwise noted.)  
DAC SPECIFICATIONS1  
AD7569  
J, A Versions3 AD7569  
AD7669  
K, B  
AD7569  
AD7569  
Parameter  
J Version  
Versions  
S Version  
T Version Units  
Conditions/Comments  
STATIC PERFORMANCE  
Resolution4  
8
8
±2  
±1/2  
±3/4  
8
8
±3  
±1/2  
±3/4  
Bits  
Total Unadjusted Error5  
Relative Accuracy5  
Differential Nonlinearity5  
Unipolar Offset Error  
@ +25°C  
±2  
±1  
±1  
±3  
±1  
±1  
LSB typ  
LSB max  
LSB max  
Guaranteed Monotonic  
DAC data is all 0s; VSS = 0 V  
Typical tempco is 10 µV/°C for +1.25 V range  
±2  
±2.5  
±1.5  
±2  
±2  
±2.5  
±1.5  
±2  
LSB max  
LSB max  
T
MIN to TMAX  
Bipolar Zero Offset Error  
DAC data is all 0s; VSS = –5 V  
@ +25°C  
±2  
±2.5  
±1 5  
±2  
±2  
±2.5  
±1.5  
±2  
LSB max  
LSB max  
Typical tempco is 20 µV/°C for ±1.25 V range  
T
MIN to TMAX  
Full-Scale Error6 (AD7569 Only)  
VDD = 5 V  
VDD = 5 V  
@ +25°C  
±2  
±3  
±1  
±2  
±2  
±4  
±1  
±3  
LSB max  
LSB max  
T
MIN to TMAX  
Full-Scale Error6 (AD7669 Only)  
@ +25°C  
±3  
±4.5  
LSB max  
LSB max  
T
MIN to TMAX  
DACA/DACB Full-Scale Error Match6  
(AD7669 Only)  
±2.5  
0.5  
0.5  
LSB max  
LSB max  
LSB max  
LSB max  
VDD = 5 V  
Full Scale/VDD, TA = +25°C  
Full Scale/VSS, TA = +25°C  
Load Regulation at Full Scale  
0.5  
0.5  
0.2  
0.5  
0.5  
0.2  
0.5  
0.5  
0.2  
VOUT = 2.5 V; VDD = ±5%  
VOUT = –2.5 V; VSS = ±5%  
RL = 2 kto °/C  
0.2  
DYNAMIC PERFORMANCE  
Signal-to-Noise Ratio5 (SNR)  
44  
48  
55  
46  
48  
55  
44  
48  
55  
46  
48  
55  
dB min  
dB max  
dB typ  
VOUT = 20 kHz full-scale sine wave with fSAMPLING = 400 kHz  
VOUT = 20 kHz full-scale sine wave with fSAMPLING = 400 kHz  
fa = 18.4 kHz, fb = 14.5 kHz with fSAMPLING = 400 kHz  
Total Harmonic Distortion5 (THD)  
Intermodulation Distortion5 (IMD)  
ANALOG OUTPUT  
Output Voltage Ranges  
Unipolar  
0 to +1.25/2.5  
±1.25/±2.5  
Volts  
Volts  
VDD = +5 V, VSS = 0 V  
VDD = +5 V, VSS = –5 V  
Bipolar  
LOGIC INPUTS  
CS, X/B,WR, RANGE, RESET, DB0–DB7  
Input Low Voltage, VINL  
Input High Voltage, VINH  
Input Leakage Current  
Input Capacitance7  
0.8  
2.4  
10  
0.8  
2.4  
10  
0.8  
2.4  
10  
0.8  
2.4  
10  
V max  
V min  
µA max  
pF max  
VIN = 0 to VDD  
10  
10  
10  
10  
DB0–DB7  
Input Coding (Single Supply)  
Input Coding (Dual Supply)  
Binary  
2s Complement  
AC CHARACTERlSTICS7  
Voltage Output Settling Time  
Positive Full-Scale Change  
Settling time to within ±1/2 LSB of final value  
Typically 1 µs  
2
2
2
2
µs max  
Negative Full-Scale Change (Single Supply)  
Negative Full-Scale Change (Dual Supply)  
Digital-to-Analog Glitch Impulse5  
Digital Feedthrough5  
4
2
15  
1
60  
1
4
2
15  
1
60  
4
2
15  
1
60  
4
2
15  
1
60  
µs max  
µs max  
Typically 2 µs  
Typically 1 µs  
nV secs typ  
nV secs typ  
dB typ  
nV secs typ  
dB max  
VIN to VOUT Isolation  
VIN = ±2.5 V, 50 kHz Sine Wave  
DAC to DAC Crosstalk5 (AD7669 Only)  
DACA to DACB Isolation5 (AD7669 Only)  
–70  
POWER REQUIREMENTS  
V
DD Range  
4.75/5.25  
4.75/5.25  
4.75/5.25  
4.75/5.25  
V min/V max For Specified Performance  
VSS Range (Dual Supplies)  
–4.75/–5.25  
–4.75/–5.25 –4.75/–5.25 –4.75/–5.25 V min/V max Specified Performance also applies to VSS = 0 V  
for unipolar ranges.  
IDD  
VOUT = VIN = 2.5 V; Logic Inputs = 2.4 V; CLK = 0.8 V  
(AD7569)  
(AD7669)  
SS (Dual Supplies)  
(AD7569)  
13  
18  
13  
4
13  
4
13  
4
mA max  
mA max  
Output unloaded  
Outputs unloaded  
VOUT = VIN = –2.5 V; Logic Inputs = 2.4 V; CLK = 0.8 V  
Output unloaded  
Outputs unloaded  
I
4
6
mA max  
mA max  
(AD7669)  
DAC/ADC MATCHING  
Gain Matching6  
@ +25°C  
VIN to VOUT match with VIN = ±2.5 V,  
20 kHz sine wave  
1
1
1
1
1
1
1
1
% typ  
% typ  
TMIN to TMAX  
NOTES  
1Specifications apply to both DACs in the AD7669. VOUT applies to both VOUTA and VOUTB of the AD7669.  
2Except where noted, specifications apply for all output ranges including bipolar ranges with dual supply operation.  
3Temperature ranges as follows:  
J, K versions; 0°C to +70°C  
A, B versions; –40°C to +85°C  
S, T versions; –55°C to +125°C  
41 LSB = 4.88 mV for 0 V to +1.25 V output range, 9.76 mV for 0 V to +2.5 V and±1.25 V ranges and 19.5 mV for ±2.5 V range.  
5See Terminology.  
6Includes internal voltage reference error and is calculated after offset error has been adjusted out. Ideal unipolar full-scale voltage is (FS – 1 LSB); ideal bipolar positive full-scale voltage is (FS/2 – 1 LSB)  
and ideal bipolar negative full-scale voltage is –FS/2.  
7Sample tested at +25°C to ensure compliance.  
Specifications subject to change without notice.  
–2–  
REV. B  
AD7569/AD7669  
(VDD = +5 V ؎ 5%; VSS1 = RANGE = AGNDDAC = AGNDDAC = DGND = 0 V; fCLK = 5 MHz external unless other-  
wise noted. All specifications TMIN to TMAX unless otherwise noted.) Specifications apply to Mode 1 interface.  
ADC SPECIFICATIONS  
AD7569  
J, A Versions3 AD7569  
AD7669  
K, B  
AD7569  
AD7569  
Parameter  
J Version  
Versions  
S Version  
T Version  
Units  
Conditions/Comments  
DC ACCURACY  
Resolution3  
8
8
8
8
Bits  
Total Unadjusted Error4  
Relative Accuracy4  
Differential Nonlinearity4  
Unipolar Offset Error  
@ +25°C  
±3  
±1  
±1  
±3  
±1/2  
±3/4  
±4  
±1  
±1  
±4  
±1/2  
±3/4  
LSB typ  
LSB max  
LSB max  
No Missing Codes  
Typical tempco is 10 µV/°C for +1.25 V range; VSS = 0 V  
±2  
±3  
±1.5  
±2.5  
±2  
±3  
±1.5  
±2.5  
LSB max  
LSB max  
T
MIN to TMAX  
Bipolar Zero Offset Error  
@ +25°C  
TMIN to TMAX  
Full-Scale Error5  
@ +25°C  
Typical tempco is 20 µV/°C for + 1.25 V range; VSS = –5 V  
±3  
±3.5  
±2.5  
±3  
±3  
±4  
±2.5  
±3.5  
LSB max  
LSB max  
VDD = 5 V  
–4, +0  
–5.5, +1.5  
0.5  
–4, +0  
–5.5, +1.5  
0.5  
–4, +0  
–7.5, +2  
0.5  
–4, +0  
–7.5, +2  
0.5  
LSB max  
LSB max  
LSB max  
LSB max  
T
MIN to TMAX  
Full Scale/VDD, TA = +25°C  
Full Scale/VSS, TA = +25°C  
VIN = +2.5 V; VDD = ±5%  
VIN = –2.5 V; VSS = ±5%  
0.5  
0.5  
0.5  
0.5  
DYNAMIC PERFORMANCE  
Signal-to-Noise Ratio4 (SNR)  
Total Harmonic Distortion4 (THD)  
Intermodulation Distortion4 (IMD)  
Frequency Response  
44  
48  
60  
0.1  
200  
46  
48  
60  
0.1  
200  
44  
48  
60  
0.1  
300  
45  
48  
60  
0.1  
300  
dB min  
dB max  
dB typ  
dB typ  
ns typ  
VIN = 100 kHz full-scale sine wave with fSAMPLING = 400 kHz6  
VIN = 100 kHz full-scale sine wave with fSAMPLING = 400 kHz6  
fa = 99 kHz, fb = 96.7 kHz with fSAMPLING = 400 kHz  
V
IN = ±2.5 V, dc to 200 kHz sine wave  
Track/Hold Acquisition Time7  
ANALOG INPUT  
Input Voltage Ranges  
Unipolar  
Bipolar  
Input Current  
Input Capacitance  
0 to +1.25/ +2.5  
±1.25/±2.5  
±300  
Volts  
Volts  
µA max  
pF typ  
V
V
DD = +5 V; VSS = 0 V  
DD = +5 V; VSS = –5 V  
±300  
10  
±300  
10  
±300  
10  
See equivalent circuit Figure 5  
10  
LOGIC INPUTS  
CS, RD, ST, CLK, RESET, RANGE  
Input Low Voltage, VINL  
Input High Voltage, VINH  
Input Capacitance8  
CS, RD, ST, RANGE, RESET  
Input Leakage Current  
CLK  
0.8  
2.4  
10  
0.8  
2.4  
10  
0.8  
2.4  
10  
0.8  
2.4  
10  
V max  
V min  
pF max  
10  
10  
10  
10  
µA max  
V IN = 0 to VDD  
Input Current  
IINL  
IINH  
–1.6  
40  
–1.6  
40  
–1.6  
40  
–1.6  
40  
mA max  
µA max  
VIN = 0 V  
VIN = VDD  
LOGIC OUTPUTS  
DB0–DB7, INT, BUSY  
VOL, Output Low Voltage  
0.4  
4.0  
0.4  
4.0  
0.4  
4.0  
0.4  
4.0  
V max  
V min  
ISINK = 1.6 mA  
ISOURCE = 200 µA  
V
OH, Output High Voltage  
DB0–DB7  
Floating State Leakage Current  
Floating State Output Capacitance8  
Output Coding (Single Supply)  
Output Coding (Dual Supply)  
10  
10  
10  
10  
Binary  
10  
10  
10  
10  
µA max  
pF max  
2s Complement  
CONVERSION TIME  
With External Clock  
With Internal Clock, TA = +25°C  
2
1.6  
2.6  
2
1.6  
2.6  
2
1.6  
2.6  
2
1.6  
2.6  
µs max  
µs min  
µs max  
f
CLK = 5 MHz  
Using recommended clock components shown in Figure 21.  
Clock frequency can be adjusted by varying RCLK  
.
POWER REQUIREMENTS  
As per DAC Specifications  
NOTES  
1
Except where noted, specifications apply for all ranges including bipolar ranges with dual supply operation.  
2Temperature ranges are as follows: J, K versions; 0°C to +70°C  
A, B versions; –40°C to +85°C  
S, T versions; –55°C to +125°C  
31 LSB = 4.88 mV for 0 V to +1.25 V range, 9.76 mV for 0 V to +2.5 V and ±1.25 V ranges and 19.5 mV for +2.5 V range.  
4See Terminology.  
5Includes internal voltage reference error and is calculated after offset error has been adjusted out. Ideal unipolar last code transition occurs at (FS – 3/2 LSB). Ideal bipolar last code transition occurs at  
(FS/2 – 3/2 LSB).  
6Exact frequencies are 101 kHz and 384 kHz to avoid harmonics coinciding with sampling frequency.  
7Rising edge of BUSY to falling edge of ST. The time given refers to the acquisition time, which gives a 3 dB degradation in SNR from the tested figure.  
8Sample tested at +25°C to ensure compliance.  
Specifications subject to change without notice.  
REV. B  
–3–  
AD7569/AD7669–TIMING CHARACTERISTICS1  
(See Figures 8, 10, 12; VDD = 5 V ؎ 5%; VSS = 0 V or –5 V ؎ 5%)  
Limit at  
Limit at  
Limit at  
25؇C (All Grades)  
TMIN, TMAX  
(J, K, A, B Grades)  
TMIN, TMAX  
(S, T Grades)  
Parameter  
Units  
Test Conditions/Comments  
DAC Timing  
t1  
t2  
t3  
t4  
t5  
80  
0
0
60  
10  
80  
0
0
70  
10  
90  
0
0
80  
10  
ns min  
ns min  
ns min  
ns min  
ns min  
WR Pulse Width  
CS, A/B to WR Setup Time  
CS, A/B to WR Hold Time  
Data Valid to WR Setup Time  
Data Valid to WR Hold Time  
ADC Timing  
t6  
t7  
t8  
t9  
50  
110  
20  
0
0
60  
0
60  
95  
10  
60  
65  
120  
60  
90  
50  
130  
30  
0
0
75  
0
75  
120  
10  
75  
75  
140  
75  
115  
50  
150  
30  
0
0
90  
0
90  
135  
10  
85  
85  
160  
90  
135  
ns min  
ns max  
ns max  
ns min  
ns min  
ns min  
ns min  
ns max  
ns max  
ns min  
ns max  
ns max  
ns max  
ns max  
ns max  
ST Pulse Width  
ST to BUSY Delay  
BUSY to INT Delay  
BUSY to CS Delay  
CS to RD Setup Time  
RD Pulse Width Determined by t13.  
CS to RD Hold Time  
Data Access Time after RD; CL = 20 pF  
Data Access Time after RD; CL = 100 pF  
Bus Relinquish Time after RD  
t10  
t11  
t12  
2
t13  
3
t14  
t15  
t16  
t17  
RD to INT Delay  
RD to BUSY Delay  
Data Valid Time after BUSY; CL = 20 pF  
Data Valid Time after BUSY; CL = 100 pF  
2
NOTES  
1Sample tested at +25°C to ensure compliance. All input control signals are specified with tR = tF = 5 ns (10% to 90% of +5 V) and timed from a voltage level of 1.6 V.  
2t13 and t17 are measured with the load circuits of Figure 1 and defined as the time required for an output to cross either 0.8 V or 2.4 V.  
3tl4 is defined as the time required for the data line to change 0.5 V when loaded with the circuit of Figure 2.  
Specifications subject to change without notice.  
a. High-Z to VOH  
b. High-Z to VOL  
a. VOH to High-Z  
b. VOL to High-Z  
Figure 1. Load Circuits for Data Access Time Test  
Figure 2. Load Circuits for Bus Relinquish Time Test  
ABSOLUTE MAXIMUM RATINGS  
VDD to AGNDDAC or AGNDADC . . . . . . . . . . . . . –0.3 V, +7 V  
Power Dissipation (Any Package) to +75°C . . . . . . . . 450 mW  
Derates above 75°C by . . . . . . . . . . . . . . . . . . . . . 6 mW/°C  
Operating Temperature Range  
Commercial (J, K) . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C  
Industrial (A, B) . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C  
Extended (S, T) . . . . . . . . . . . . . . . . . . . . –55°C to +125°C  
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C  
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . +300°C  
*Stresses above those listed under “Absolute Maximum Ratings” may cause  
permanent damage to the device. This is a stress rating only; functional operation  
of the device at these or any other condition above those indicated in the  
operational sections of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect device reliability.  
V
V
DD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7 V  
DD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +14 V  
AGNDDAC or AGNDADC to DGND . . . . –0.3 V, VDD + 0.3 V  
AGNDDAC to AGNDADC . . . . . . . . . . . . . . . . . . . . . . . . . ±5 V  
Logic Voltage to DGND . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V  
CLK Input Voltage to DGND . . . . . . . . . –0.3 V, VDD + 0.3 V  
V
OUT (VOUTA, VOUTB) to  
AGND1  
. . . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V  
DAC  
V
IN to AGNDADC . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V  
NOTE  
1Output may be shorted to any voltage in the range VSS to VDD provided that the  
power dissipation of the package is not exceeded. Typical short circuit current for  
a short to AGND or VSS is 50 mA.  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection.  
Although the AD7569/AD7669 features proprietary ESD protection circuitry, permanent dam-  
age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper  
ESD precautions are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
–4–  
REV. B  
AD7569/AD7669  
NOTE:  
Digital Feedthrough  
The term DAC (Digital-to-Analog Converter) throughout the  
data sheet applies equally to the dual DACs in the AD7669 as  
well as to the single DAC of the AD7569 unless otherwise  
stated. It follows that the term VOUT applies to both VOUTA and  
Digital Feedthrough is also a measure of the impulse injected to  
the analog output from the digital inputs, but is measured when  
the DAC is not selected. It is essentially feedthrough across the  
die and package. It is also a measure of the glitch impulse trans-  
ferred to the analog output when data is read from the internal  
ADC. It is specified in nV secs and is measured with WR high  
and a digital code change from all 0s to all 1s.  
V
OUTB of the AD7669 also.  
TERMINOLOGY  
Total Unadjusted Error  
Total unadjusted error is a comprehensive specification that in-  
cludes internal voltage reference error, relative accuracy, gain  
and offset errors.  
DAC-to-DAC Crosstalk (AD7669 Only)  
The glitch energy transferred to the output of one DAC due to  
an update at the output of the second DAC. The figure given is  
the worst case and is expressed in nV secs. It is measured with  
an update voltage of full scale.  
Relative Accuracy (DAC)  
Relative Accuracy or endpoint nonlinearity is a measure of the  
maximum deviation from a straight line passing through the  
endpoints of the DAC transfer function. It is measured after al-  
lowing for offset and gain errors. For the bipolar output ranges,  
the endpoints of the DAC transfer function are defined as those  
voltages that correspond to negative full-scale and positive full-  
scale codes. For the unipolar output ranges, the endpoints are  
code 1 and code 255. Code 1 is chosen because the amplifier is  
now working in single supply and, in cases where the true offset  
of the amplifier is negative, it cannot be seen at code 0. If the  
relative accuracy were calculated between code 0 and code 255,  
the “negative offset” would appear as a linearity error. If the off-  
set is negative and less than 1 LSB, it will appear at code 1, and  
hence the true linearity of the converter is seen between code 1  
and code 255.  
DAC-to-DAC Isolation (AD7669 Only)  
DAC-to-DAC Isolation is the proportion of a digitized sine  
wave from the output of one DAC, which appears at the output  
of the second DAC (loaded with all 1s). The figure given is the  
worst case for the second DAC output and is expressed as a ra-  
tio in dBs. It is measured with a digitized sine wave (fSAMPLING  
100 kHz) of 20 kHz at 2.5 V pk-pk.  
=
Signal-to-Noise Ratio  
Signal-to-Noise Ratio (SNR) is the measured signal to noise at  
the output of the converter. The signal is the rms magnitude of  
the fundamental. Noise is the rms sum of all the nonfundamen-  
tal signals (excluding dc) up to half the sampling frequency.  
SNR is dependent on the number of quantization levels used in  
the digitization process; the more levels, the smaller the quanti-  
zation noise. The theoretical SNR for a sine wave is given by  
Relative Accuracy (ADC)  
Relative Accuracy is the deviation of the ADC’s actual code  
transition points from a straight line drawn between the end-  
points of the ADC transfer function. For the bipolar input  
ranges, these points are the measured, negative, full-scale transi-  
tion point and the measured, positive, full-scale transition point.  
For the unipolar ranges, the straight line is drawn between the  
measured first LSB transition point and the measured full-scale  
transition point.  
SNR = (6.02N + 1.76) dB  
where N is the number of bits. Thus for an ideal 8-bit converter,  
SNR = 50 dB.  
Harmonic Distortion  
Harmonic Distortion is the ratio of the rms sum of harmonics to  
the fundamental. For the AD7569/AD7669, Total Harmonic  
Distortion (THD) is defined as  
2
V22 +V32 +V42 +V52 +V6  
Differential Nonlinearity  
20 log  
Differential Nonlinearity is the difference between the measured  
change and an ideal 1 LSB change between any two adjacent  
codes. A specified differential nonlinearity of ±1 LSB max en-  
sures monotonicity (DAC) or no missed codes (ADC). A differ-  
ential nonlinearity of ±3/4 LSB max ensures that the minimum  
step size (DAC) or code width (ADC) is 1/4 LSB, and the maxi-  
mum step size or code width is 3/4 LSB.  
V1  
where V1 is the rms amplitude of the fundamental and V2, V3,  
V4, V5 and V6 are the rms amplitudes of the individual  
harmonics.  
Intermodulation Distortion  
With inputs consisting of sine waves at two frequencies, fa and  
fb, any active device with nonlinearities will create distortion  
products, of order (m + n), at sum and difference frequencies of  
mfa ± nfb where m, n = 0, l, 2, 3,… . Intermodulation terms  
are those for which m or n is not equal to zero. For example,  
the second order terms include (fa + fb) and (fa – fb) and the  
third order terms include (2fa + fb), (2fa – fb), (fa + 2fb) and  
(fa – 2fb).  
Digital-to-Analog Glitch Impulse  
Digital-to-Analog Glitch Impulse is the impulse injected into the  
analog output when the digital inputs change state with the  
DAC selected. It is normally specified as the area of the glitch in  
nV secs and is measured when the digital input code is changed  
by 1 LSB at the major carry transition.  
REV. B  
–5–  
AD7569/AD7669  
AD7569 PIN CONFIGURATIONS  
PLCC  
DIP, SOIC  
LCCC  
AD7669 PIN CONFIGURATIONS  
DIP, SOIC  
ORDERING GUIDE  
Relative  
Accuracy  
TMIN –TMAX  
Temperature  
Range  
Package  
Option1  
Model  
AD7569JN  
AD7569JR  
AD7569AQ  
AD7569SQ2  
AD7569BN  
AD7569KN  
AD7569BR  
AD7569BQ  
AD7569TQ2  
AD7569JP  
0°C to +70°C  
0°C to +70°C  
±1 LSB  
±1 LSB  
±1 LSB  
±1 LSB  
±0.5 LSB  
±0.5 LSB  
±0.5 LSB  
±0.5 LSB  
±1/2 LSB  
±1 LSB  
±1 LSB  
±1/2 LSB  
±1/2 LSB  
N-24  
R-24  
–40°C to +85°C  
–55°C to +125°C  
–40°C to +85°C  
0°C to +70°C  
–40°C to +85°C  
–40°C to +85°C  
–55°C to +125°C  
0°C to +70°C  
Q-24  
Q-24  
N-24  
N-24  
R-24  
Q-24  
Q-24  
P-28A  
E-28A  
P-28A  
E-28A  
AD7569SE2  
AD7569KP  
AD7569TE2  
–55°C to +125°C  
0°C to +70°C  
–55°C to +125°C  
AD7669AN  
AD7669JN  
AD7669JP  
AD7669AR  
AD7669JR  
–40°C to +85°C  
0°C to +70°C  
0°C to +70°C  
–40°C to +85°C  
0°C to +70°C  
±1 LSB  
±1 LSB  
±1 LSB  
±1 LSB  
±1 LSB  
N-28  
N-28  
P-28A  
R-28  
R-28  
PLCC  
NOTES  
1E = Leadless Ceramic Chip Carrier; N = Plastic DIP; P = Plastic Leaded Chip  
Carrier; Q = Cerdip; R = Small Outline SOIC.  
2To order MIL-STD-883, Class B processed parts, add /883B to part number.  
Contact your local sales office for military data sheet.  
REV. B  
–6–  
AD7569/AD7669  
PIN FUNCTION DESCRIPTION  
(Applies to the AD7569 and AD7669 unless otherwise stated.)  
Pin  
Pin  
Mnemonic  
Description  
Mnemonic  
Description  
AGNDDAC  
Analog Ground for the DAC(s). Separate  
ground return paths are provided for the  
DAC(s) and ADC to minimize crosstalk.  
CS  
Chip Select Input (Active Low). The device is  
selected when this input is active.  
RD  
READ Input (Active Low). This input must  
be active to access data from the part. In the  
Mode 2 interface, RD going low starts con-  
version. It is used in conjunction with the CS  
input (see Digital Interface Section).  
VOUT  
Output Voltage. VOUT is the buffered output  
(VOUTA, VOUTB) voltage from the AD7569 DAC. VOUTA and  
OUTB are the buffered DAC output voltages  
V
from the AD7669. Four different output volt-  
age ranges can be achieved (see Table I).  
ST  
Start Conversion (Edge triggered). This is  
used when precise sampling is required. The  
falling edge of ST starts conversion and drives  
BUSY low. The ST signal is not gated with  
CS.  
VSS  
Negative Supply Voltage (–5 V for dual sup-  
ply or 0 V for single supply). This pin is also  
used with the RANGE pin to select the differ-  
ent input/output ranges and changes the data  
format from binary (VSS = 0 V) to 2s comple-  
ment (VSS = –5 V) (see Table I).  
BUSY  
INT  
BUSY Status Output (Active Low). When  
this pin is active, the ADC is performing a  
conversion. The input signal is held prior to  
the falling edge of BUSY (see Digital Inter-  
face Section).  
RANGE  
Range Selection Input. This is used with the  
V
SS input to select the different ranges as per  
Table I. The range selected applies to both  
the analog input voltage of the ADC and the  
output voltage from the DAC(s).  
INTERRUPT Output (Active Low). INT go-  
ing low indicates that the conversion is com-  
plete. INT goes high on the rising edge of CS  
or RD and is also set high by a low pulse on  
RESET (see Digital Interface Section).  
RESET  
Reset Input (Active Low). This is an asyn-  
chronous system reset that clears the DAC  
register(s) to all 0s and clears the INT line of  
the ADC (i.e., makes the ADC ready for new  
conversion). In unipolar operation, this input  
sets the output voltage to 0 V; in bipolar  
operation, it sets the output to negative full  
scale.  
A/B (AD7669  
Only)  
DAC Select Input. This input selects which  
DAC register data is written to under control  
of CS and WR. With this input low, data is  
written to the DACA register; with this input  
high, data is written to the DACB register.  
DB7  
Data Bit 7. Most Significant Bit (MSB).  
Data Bit 6 to Data Bit 2.  
Digital Ground.  
CLK  
A TTL compatible clock signal may be used  
to determine the ADC conversion time. Inter-  
nal clock operation is achieved by connecting  
a resistor and capacitor to ground.  
DB6–DB2  
DGND  
DB1  
Data Bit 1.  
AGNDADC  
VIN  
Analog Ground for the ADC.  
DB0  
Data Bit 0. Least Significant Bit (LSB).  
Analog Input. Various input ranges can be se-  
lected (see Table I).  
WR  
Write Input (Edge triggered). This is used in  
conjunction with CS to write data into the  
AD7569 DAC register. It is used in conjunc-  
tion with CS and A/B to write data into the  
selected DAC register of the AD7669. Data is  
transferred on the rising edge of WR.  
VDD  
Positive Supply Voltage (+5 V).  
Table I. Input/Output Ranges  
Input/Output  
Voltage Range  
DB0–DB7  
Data Format  
Range  
VSS  
0
1
0
1
0 V  
0 V  
–5 V  
–5 V  
0 V to +1.25 V  
0 V to +2.5 V  
±1.25 V  
Binary  
Binary  
2s Complement  
2s Complement  
±2.5 V  
REV. B  
–7–  
AD7569/AD7669—Typical Performance Graphs  
Noise Spectral Density vs. Frequency  
Power Supply Rejection Ratio vs. Frequency  
Positive-Going Settling Time (±2.5 V Range)  
Negative-Going Settling Time (±2.5 V Range)  
DAC/ADC Full-Scale Temperature Coefficient  
IMD Plot for ADC  
REV. B  
–8–  
AD7569/AD7669  
CIRCUIT DESCRIPTION  
supply, a transistor on the output acts as a passive pull-down  
with output voltages near 0 V with VSS = 0 V. This means that  
the sink capability of the amplifier is reduced as the output volt-  
age nears 0 V in single supply. In dual supply operation the full  
sink capability of 1.25 mA is maintained over the entire output  
voltage range.  
D/A SECTION  
The AD7569 contains an 8-bit, voltage-mode, D/A converter  
that uses eight equally weighted current sources switched into  
an R-2R ladder network to give a direct but unbuffered 0 V to  
+1.25 V output range. The AD7669 is similar, but contains two  
D/A converters. The current sources are fabricated using PNP  
transistors. These transistors allow current sources that are  
driven from positive voltage logic and give a zero-based output  
range. The output voltage from the voltage switching R-2R lad-  
der network has the same positive polarity as the reference;  
therefore, the D/A converter can be operated from a single  
power supply rail.  
For all other parameters, the single and dual supply perfor-  
mances of the amplifier are essentially identical. The output  
noise from the amplifier, with full scale on the DAC, is 200 µV  
peak-to-peak. The spot noise at 1 kHz is 35 nV/Hz with all 0s  
on the DAC. A noise spectral density versus frequency plot for  
the amplifier is shown in the typical performance graphs.  
VOLTAGE REFERENCE  
The PNP current sources are generated using the on-chip  
bandgap reference and a control amplifier. The current sources  
are switched to either the ladder or AGNDDAC by high speed  
p-channel switches. These high-speed switches ensure a fast set-  
tling time for the output voltage of the DAC. The R-2R ladder  
network of the DAC consists of highly stable, thin-film resistors.  
A simplified circuit diagram for the D/A converter section is  
shown in Figure 3. An identical D/A converter is used as part of  
the A/D converter, which is discussed later.  
The AD7569/AD7669 contains an on-chip bandgap reference  
that provides a low noise, temperature compensated reference  
voltage for both the DAC and the ADC. The reference is  
trimmed for absolute accuracy and temperature coefficient. The  
bandgap reference is generated with respect to VDD. It is buff-  
ered by a separate control amplifier for both the DAC and the  
ADC reference. This can be seen in the DAC ladder network  
configuration in Figure 3.  
DIGITAL SECTION  
The data pins on the AD7569/AD7669 provide a connection  
between the external bus and DAC data inputs and ADC data  
outputs. The threshold levels of all digital inputs and outputs  
are compatible with either TTL or 5 V CMOS levels. Internal  
input protection of all digital pins is achieved by on-chip distrib-  
uted diodes.  
The data format is straight binary when the part is used in single  
supply (VSS = 0 V). However, when a VSS of –5 V is applied, the  
data format becomes twos complement. This data format ap-  
plies to the digital inputs of the DAC and the digital outputs of  
the ADC.  
ADC SECTION  
The analog-to-digital converter on the AD7569/AD7669 uses  
the successive approximation technique to achieve a fast conver-  
sion time of 2 µs and provides an 8-bit parallel digital output.  
The reference for the ADC is provided by the on-chip bandgap  
reference.  
Figure 3. DAC Simplified Circuit Diagram  
OP AMP SECTION  
The output from the D/A converter is buffered by a high speed,  
noninverting op amp. This op amp is capable of developing  
±2.5 V across a 2 kand 100 pF load to AGNDDAC. The am-  
plifier can be operated from a single +5 V supply to give two  
unipolar output ranges, or from dual supplies (±5 V) to allow  
two bipolar output ranges.  
Conversion start is controlled by ST or by CS and RD. Once a  
conversion has been started, another conversion start should not  
be attempted until the conversion in progress is completed.  
Exercising the RESET input does not affect conversion; the  
RESET input resets the INT line high, which is useful in inter-  
rupt driven systems where a READ has not been performed at  
the end of the previous conversion. The INT line does not have  
to be cleared at the end of conversion. The ADC will continue  
to convert correctly, but the function of the INT line will be  
affected.  
The feedback path of the amplifier contains a gain/offset net-  
work that provides four voltage ranges at the output of the op  
amp. The output voltage range is determined by the RANGE  
and VSS inputs. (See Table I in the Pin Function Description  
section.) The four possible output ranges are: 0 V to +1.25 V,  
0 V to +2.5 V, ±1.25 V and ±2.5 V. It should be noted that  
whichever range is selected for the output amplifier also applies  
to the input voltage range of the A/D converter.  
Figure 4 shows the operating waveforms for a conversion cycle.  
The analog input voltage, VIN, is held 50 ns typical after the fall-  
ing edge of ST or (CS & RD). The MSB decision is made ap-  
proximately 50 ns after the second falling edge of the input  
CLK following a conversion start. If t1 in Figure 4 is greater  
than 50 ns, then the falling edge of the input CLK will be seen  
as the first falling clock edge. If t1 is less than 50 ns, the first fall-  
ing clock edge of the conversion will not occur until one clock  
cycle later. The succeeding bit decisions are made approxi-  
mately 50 ns after a CLK edge until conversion is complete.  
The output amplifier settles to within 1/2 LSB of its final value  
in typically less than 500 ns. Operating the part from single or  
dual supplies has no effect on the positive-going settling time.  
However, the negative-going output settling time to voltages  
near 0 V in single supply will be slightly longer than the settling  
time to negative full scale for dual supply operation. Addition-  
ally, to ensure that the output voltage can go to 0 V in single  
REV. B  
–9–  
AD7569/AD7669  
At the end of conversion, the SAR contents are transferred to  
the output latch, and the SAR is reset in readiness for a new  
conversion. A single conversion lasts for 8 input clock cycles.  
INTERNAL CLOCK  
Clock pulses are generated by the action of an internal current  
source charging the external capacitor (CCLK) and this external  
capacitor discharging through the external resistor (RCLK).  
When a conversion is complete, this internal clock stops operat-  
ing and the CLK pin goes to the DGND potential. Connections  
for RCLK and CCLK are shown in the operating diagram of Fig-  
ure 21. The nominal conversion time versus temperature for the  
recommended RCLK and CCLK combination is shown in Figure  
6. The internal clock provides a convenient clock source for the  
AD7569/AD7669. Due to process variations, the actual operat-  
ing frequency for this RCLK/CCLK combination can vary from  
device to device by up to ±25%.  
Figure 4. Operating Waveforms Using External Clock  
ANALOG INPUT  
The analog input of the AD7569/AD7669 feeds into an on-chip  
track-and-hold amplifier. To accommodate different full-scale  
ranges, the analog input signal is conditioned by a gain/offset  
network that conditions all input ranges so the internal ADC al-  
ways works with a 0 V to +1.25 V signal. As a result, the input  
current on the VIN input varies with the input range selected as  
shown in Figure 5.  
Figure 6. Conversion Time vs. Temperature for Internal  
Clock Operation  
DIGITAL INTERFACE  
DAC Timing and Control—AD7569  
Figure 5. Equivalent VIN Circuit  
TRACK-AND-HOLD  
Table II shows the truth table for DAC operation for the  
AD7569. The part contains an 8-bit DAC register, which is  
loaded from the data bus under control of CS and WR. The  
data contained in the DAC register determines the analog out-  
put from the DAC. The WR input is an edge-triggered input,  
and data is transferred into the DAC register on the rising edge  
of WR. Holding CS and WR low does not make the DAC regis-  
ter transparent.  
The track-and-hold (T/H) amplifier on the analog input of the  
AD7569/AD7669 allows the ADC to accurately convert an in-  
put sine wave of 2.5 V peak-to-peak amplitude up to a fre-  
quency of 200 kHz, the Nyquist frequency of the ADC when  
operated at its maximum throughput rate of 400 kHz. This  
maximum rate of conversion includes conversion time and time  
between conversions. Because the input bandwidth of the T/H  
amplifier is much larger than 200 kHz, the input signal should  
be band-limited to avoid converting high-frequency noise  
components.  
Table II. AD7569 DAC Truth Table  
CS WR  
RESET DAC Function  
The operation of this T/H amplifier is essentially transparent to  
the user. The T/H amplifier goes from its tracking mode to its  
hold mode at the start of conversion. This occurs when the  
ADC receives a conversion start command from either ST or  
CS & RD. At the end of conversion (BUSY going high), the  
T/H reverts back to tracking the input signal.  
H
L
L
g
H
L
g
L
X
H
H
H
H
L
DAC Register Unaffected  
DAC Register Unaffected  
DAC Register Updated  
DAC Register Updated  
DAC Register Loaded with All Zeros  
X
EXTERNAL CLOCK  
L = Low State, H = High State, X = Don’t Care  
The AD7569/AD7669 ADC can be used with its on-chip clock  
or with an externally applied clock. When using an external  
clock, the CLK input of the AD7569/AD7669 may be driven  
directly from 74HC, 4000B series buffers (such as 4049) or  
from TTL buffers. When conversion is complete, the internal  
clock is disabled. The external clock can continue to run be-  
tween conversions without being disabled. The mark/space ratio  
of the external clock can vary from 70/30 to 30/70.  
The contents of the DAC register are reset to all 0s by an active  
low pulse on the RESET line, and for the unipolar output ranges,  
the output remains at 0 V after RESET returns high. For the bi-  
polar output ranges, a low pulse on RESET causes the output to  
go to negative full scale. In unipolar applications, the RESET line  
can be used to ensure power-up to 0 V on the AD7569 DAC out-  
put and is also useful when used as a zero override in system cali-  
bration cycles. If the RESET input is connected to the system  
REV. B  
–10–  
AD7569/AD7669  
RESET line, the DAC output resets to 0 V when the entire  
system is reset. Figure 7 shows the input control logic for the  
AD7569 DAC; the write cycle timing diagram is shown in  
Figure 8.  
The contents of the DAC registers are reset to all 0s by an active  
low pulse on the RESET line, and for the unipolar output  
ranges, the outputs remain at 0 V after RESET returns high.  
For the bipolar output ranges, a low pulse on RESET causes the  
outputs to go to negative full scale. In unipolar applications, the  
RESET line can be used to ensure power-up to 0 V on the  
AD7669 DAC outputs and is also useful when used as a zero  
override in system calibration cycles. If the RESET input is con-  
nected to the system RESET line, then the DAC outputs reset  
to 0 V when the entire system is reset. Figure 9 shows the DAC  
input control logic for the AD7669, and the write cycle timing  
diagram is shown in Figure 8.  
Figure 7. AD7569 DAC Input Control Logic  
Figure 9. AD7669 DAC Control Logic  
ADC Timing and Control  
The ADC on the AD7569/AD7669 is capable of two basic oper-  
ating modes. In the first mode, the ST line is used to start con-  
version and drive the track-and-hold into hold mode. At the end  
of conversion, the track-and-hold returns to its tracking mode.  
The second mode is achieved by hard-wiring the ST line high.  
In this case, CS and RD start conversion, and the microproces-  
sor is driven into a WAIT state for the duration of conversion by  
BUSY.  
Figure 8. AD7569/AD7669 Write Cycle Timing Diagram  
DAC Timing and Control—AD7669  
Table III shows the truth table for the dual DAC operation of  
the AD7669. The part contains two 8-bit DAC registers that are  
loaded from the data bus under the control of CS, A/B and WR.  
Address line A/B selects which DAC register the data is  
loaded to. The data contained in the DAC registers determines  
the analog output from the respective DACs. The WR input is  
an edge-triggered input, and data is transferred into the selected  
DAC register on the rising edge of WR. Holding CS and WR  
low does not make the selected DAC register transparent. The  
A/B input should not be changed while CS and WR are low.  
Table III. AD7669 DAC Truth Table  
CS WR A/B RESET  
DAC Function  
H
L
g
L
g
H
g
L
g
L
X
X
L
L
H
H
X
H
H
H
H
H
L
DAC Registers Unaffected  
DACA Register Updated  
DACA Register Updated  
DACB Register Updated  
DACB Register Updated  
DAC Registers Loaded with  
All Zeros  
X
Figure 10. ADC Mode 1 Interface Timing  
L = Low State, H = High State, X = Don’t Care  
REV. B  
–11–  
AD7569/AD7669  
MODE 1 INTERFACE  
MODE 2 INTERFACE  
The timing diagram for the first mode is shown in Figure 10. It  
can be used in digital signal processing and other applications  
where precise sampling in time is required. In these applica-  
tions, it is important that the signal sampling occurs at exactly  
equal intervals to minimize errors due to sampling uncertainty  
or jitter. In these cases, the ST line is driven by a timer or some  
precise clock source.  
The second interface mode is intended for use with micropro-  
cessors, which can be forced into a WAIT state for at least 2 µs.  
The ST line of the AD7569/AD7669 must be hardwired high to  
achieve this mode. The microprocessor starts a conversion and  
is halted until the result of the conversion is read from the con-  
verter. Conversion is initiated by executing a memory READ to  
the AD7569/AD7669 address, bringing CS and RD low. BUSY  
subsequently goes low (forcing the microprocessor READY or  
WAIT input low), placing the microprocessor into a WAIT  
state. The input signal is held on the falling edge of RD (assum-  
ing CS is already low or is coincident with RD). When the con-  
version is complete (BUSY goes high), the processor completes  
the memory READ and acquires the newly converted data.  
While conversion is in progress, the ADC places old data (from  
the previous conversion) on the data bus. The timing diagram  
for this interface is shown in Figure 12.  
The falling edge of the ST pulse starts conversion and drives the  
AD7569/AD7669 track-and-hold amplifier into its hold mode.  
BUSY stays low for the duration of conversion and returns high  
at the end of conversion and the track-and hold amplifier reverts  
to its tracking mode on this rising edge of BUSY. The INT line  
can be used to interrupt the microprocessor. A READ to the  
AD7569/AD7669 address accesses the data, and the INT line is  
reset on the rising edge of CS or RD. Alternatively, the INT can  
be used to trigger a pulse that drives the CS and RD and places  
the data into a FIFO or buffer memory. The microprocessor can  
then read a batch of data from the FIFO or buffer memory at  
some convenient time. The ST input should not be high when  
RD is brought low; otherwise, the part will not operate correctly  
in this mode.  
It is important, especially in systems where the conversion start  
(ST pulse) is asynchronous to the microprocessor, that a READ  
does not occur during a conversion. Trying to read data from  
the device during a conversion can cause errors to the conver-  
sion in progress. Also, pulsing the ST line a second time before  
conversion ends should be avoided since it too can cause errors  
in the conversion result. In applications where precise sampling  
is not critical, the ST pulse can be generated from a micropro-  
cessor WR or RD line gated with a decoded address (different  
from AD7569/AD7669 CS address).  
Figure 12. ADC Mode 2 Interface Timing  
The major advantage of this interface is that it allows the micro-  
processor to start conversion, WAIT, and then READ data with  
a single READ instruction. The user does not have to worry  
about servicing interrupts or ensuring that software delays are  
long enough to avoid reading during conversion. The fast con-  
version time of the ADC ensures that for many microprocessors,  
the processor is not placed in a WAIT state for an excessive  
amount of time.  
DIGITAL SIGNAL PROCESSING APPLICATIONS  
In Digital Signal Processing (DSP) application areas such as  
voice recognition, echo cancellation and adaptive filtering, the  
dynamic characteristics (SNR, Harmonic Distortion, Intermod-  
ulation Distortion) of both the ADC and DAC are critical. The  
AD7569/AD7669 is specified dynamically as well as with stan-  
dard dc specifications. Because the track/hold amplifier has a  
wide bandwidth, an antialiasing filter should be placed on the  
Figure 11. Multichannel Inputs  
This interface mode is also useful in applications where a num-  
ber of input channels are required to be converted by the ADC.  
Figure 11 shows the circuit configuration for such an applica-  
tion. The signal that drives the ST input of the AD7569/  
AD7669 is also used to drive the ENABLE input of the multi-  
plexer. The multiplexer is enabled on the rising edge of the ST  
pulse while the input signal is held on the falling edge; therefore,  
the signal must have settled to within 8 bits over the duration of  
this ST pulse. The settling time, including tON (ENABLE) of  
the multiplexer plus the T/H acquisition time (typically 200 ns),  
thus determines the width of the ST pulse. This is suited to ap-  
plications where a number of input channels needs to be succes-  
sively sampled or scanned.  
V
IN input to avoid aliasing of high-frequency noise back into the  
band of interest.  
The dynamic performance of the ADC is evaluated by applying a  
sine-wave signal of very low distortion to the VIN input, which is  
sampled at a 409.6 kHz sampling rate. A Fast Fourier Transform  
(FFT) plot or Histogram plot is then generated from which SNR,  
harmonic distortion and dynamic differential nonlinearity data  
can be obtained. For the DAC, the codes for an ideal sine wave  
are stored in PROM and loaded down to the DAC. The output  
spectrum is analyzed, using a spectrum analyzer to evaluate SNR  
REV. B  
–12–  
AD7569/AD7669  
and harmonic distortion performance. Similarly, for inter-  
modulation distortion, an input (either to VIN or DAC code)  
consisting of pure sine waves at two frequencies is applied to the  
AD7569/AD7669.  
Figure 15. DAC Output Spectrum  
HISTOGRAM PLOT  
When a sine wave of specified frequency is applied to the VIN in-  
put of the AD7569/AD7669 and several thousand samples are  
taken, it is possible to plot a histogram showing the frequency of  
occurrence of each of the 256 ADC codes. If a particular step is  
wider than the ideal 1 LSB width, the code associated with that  
step will accumulate more counts than for the code for an ideal  
step. Likewise, a step narrower than ideal width will have fewer  
counts. Missing codes are easily seen because a missing code  
means zero counts for a particular code. The absence of large  
spikes in the plot indicates small differential nonlinearity.  
Figure 13. ADC FFT Plot  
Figure 13 shows a 2048 point FFT plot of the ADC with an in-  
put signal of 130 kHz. The SNR is 48.4 dB. It can be seen that  
most of the harmonics are buried in the noise floor. It should be  
noted that the harmonics are taken into account when calculat-  
ing the SNR. The relationship between SNR and resolution (N)  
is expressed by the following equation:  
Figure 16 shows a histogram plot for the ADC indicating very  
small differential nonlinearity and no missing codes for an input  
frequency of 204 kHz. For a sine-wave input, a perfect ADC  
would produce a cusp probability density function described by  
the equation  
SNR = (6.02N + 1.76) dB  
1
p(V ) =  
π(A2 V 2 )1/2  
This is for an ideal part with no differential or integral linearity  
errors. These errors will cause a degradation in SNR. By work-  
ing backward from the above equation, it is possible to get a  
measure of ADC performance expressed in effective number of  
bits (N). This effective number of bits is plotted versus fre-  
quency in Figure 14. The effective number of bits typically falls  
between 7.7 and 7.8, corresponding to SNR figures of 48.1 dB  
and 48.7 dB.  
where A is the peak amplitude of the sine wave and p(V) the  
probability of occurrence at a voltage V.  
The histogram plot of Figure 16 corresponds very well with this  
cusp shape.  
Further typical plots of the performance of the AD7569/AD7669  
are shown in the Typical Performance Graphs section of the data  
sheet.  
Figure 15 shows a spectrum analyzer plot of the output spec-  
trum from the DAC with an ideal sine-wave table loaded to the  
data inputs of the DAC. In this case, the SNR is 46 dB.  
Figure 14. Effective Number of Bits vs. Frequency  
Figure 16. ADC Histogram Plot  
REV. B  
–13–  
AD7569/AD7669  
INTERFACING THE AD7569/AD7669  
AD7569/AD7669—ADSP-2100 INTERFACE  
AD7569/AD7669—Z80 INTERFACE  
Figure 19 shows a typical interface to the DSP processor, the  
ADSP-2100. The ADC is in the Mode 2 interface mode, which  
means that the ADSP-2100 is halted during conversion. This is  
achieved using the decoded address output. This is gated with  
DMWR to ensure that it halts the processor for READ instruc-  
tions only. INT going low at the end of conversion releases the  
processor and allows it to finish off the READ instruction.  
Figure 17 shows a typical interface to the Z80 microprocessor.  
The ADC is configured for operation in the Mode 1 interface  
mode. A precise timer or clock source starts conversion in appli-  
cations requiring equidistant sampling intervals. The scheme  
used, whereby INT of the AD7569/AD7669 generates an inter-  
rupt on the Z80, is limited in that it does not allow the ADC to  
be sampled at the maximum rate. This is because the time be-  
tween samples has to be long enough to allow the Z80 to service  
its interrupt and read data from the ADC. To overcome this,  
some buffer memory or FIFO could be placed between the  
AD7569/AD7669 and the Z80. Writing data to the relevant  
AD7569/AD7669 DAC simply consists of a <LD (nn), A> in-  
struction where nn is the decoded address for that DAC. Read-  
ing data from the ADC, after an INT has been received,  
consists of a < LDA, (nn)> instruction.  
Figure 19. AD7569/AD7669 to ADSP-2100 Interface  
Because the instruction cycle of the ADSP-2100 is so fast  
(125 ns cycle), the DMWR pulse also has to be stretched also  
for write cycles. This is achieved using the 74121, which gener-  
ates a pulse that is fed back to DMACK. The duration of this  
pulse determines how long the ADSP-2100 write cycle is  
stretched. The buffers driving the DMACK line must have  
open-collector outputs. Writing data to the relevant AD7569/  
AD7669 DAC is achieved using a single instruction, <DM  
(addr) = MRO>, where addr is the decoded address of that  
DAC, and MRO contains the data to be loaded to the DAC reg-  
ister. Data is read from the ADC also, using a single instruction  
<MRO = DM (addr)>, where the conversion result is placed in  
the MRO data register.  
Figure 17. AD7569/AD7669 to Z80 Interface  
AD7569/AD7669—68008 INTERFACE  
A typical interface to the 68008 is shown in Figure 18. In this  
case, the ADC is configured in the Mode 2 interface mode. This  
means that the one read instruction starts conversion and reads  
the data. The read cycle is stretched out over the entire conver-  
sion period by taking the INT line back into the DTACK input  
of the 68008. The additional gates are required so the 68008  
receives a DTACK when the processor is writing data to the  
AD7569/AD7669. In this case, there are no wait states intro-  
duced into the write cycle. Writing data to the relevant AD7569/  
AD7669 DAC consists of a <MOVE.B Dn, addr> where Dn is  
the data register, which contains the data to be loaded to that  
DAC, and addr is the decoded address for the DAC. Data is  
read from the ADC using a <MOVE.B addr,Dn> with the con-  
version result placed in register Dn.  
AD7569/AD7669—IBM PC* INTERFACE  
The AD7569/AD7669 is ideal for implementing an analog in-  
put/output port for the IBM PC. Figure 20 shows an interface  
that realizes this function. The ADC is configured in the Mode  
1 interface mode, and conversions are initiated using a precise  
clock source for equidistant sampling intervals. At the end of  
conversion, the INT line goes low, and the 74121 generates  
Figure 20. AD7569/AD7669 to IBM PC Interface  
Figure 18. AD7569/AD7669 to 68008 Interface  
*IBM PC is a trademark of International Business Machines Corp.  
REV. B  
–14–  
AD7569/AD7669  
an RD pulse for the AD7569/AD7669. This RD pulse accesses  
data from the ADC and places the conversion result into a regis-  
ter on the 74646. The rising edge of this pulse generates an in-  
terrupt request to the processor. The conversion result is read  
from the 74646 register by performing an I/O read to the  
decoded address of the 74646. Writing data to the relevant  
AD7569/AD7669 DAC involves an I/O write to the 74646,  
which transfers the data to the data inputs of the AD7569/  
AD7669. Data is latched into the selected DAC register on the  
rising edge of IOW.  
UNIPOLAR (0 V to +2.5 V) CONFIGURATION  
The 0 V to +2.5 V output voltage range is achieved by tying VSS  
to AGNDDAC(= 0 V) and the RANGE input to VDD. The table  
for output voltage versus digital code is as in Table IV with  
2.VREF replacing VREF. Note that for this range  
1
1 LSB = 2.VREF (28 ) = V  
REF 128  
BIPOLAR (–1.25 V to +1.25 V) CONFIGURATION  
The first of the bipolar configurations is achieved by tying the  
RANGE input to AGNDDAC(= 0 V) and VSS to –5 V. The VSS  
voltage level at which the AD7569/AD7669 changes to bipolar  
operation is approximately –1 V. When the part is configured  
for bipolar outputs, the input coding becomes twos comple-  
ment. The table for output voltage versus the digital code in the  
DAC register is shown in Table V. Note as with the unipolar  
configuration, a digital input code of all 0s produces an output  
of 0 V. It should be noted, however, that a low pulse on the  
RESET line for the bipolar ranges sets the output voltage to  
negative full scale.  
APPLYING THE AD7569/AD7669 DAC  
An internal gain/offset network on the AD7569/AD7669 allows  
several output voltage ranges. The part can produce unipolar  
output ranges of 0 V to +1.25 V or 0 V to +2.5 V and bipolar  
output ranges of –1.25 V to +1.25 V or –2.5 V to +2.5 V. Con-  
nections for these various output ranges are outlined below.  
UNIPOLAR (0 V to +1.25 V) CONFIGURATION  
The first of the configurations provides an output voltage range  
of 0 V to +1.25 V. This is achieved by tying the VSS and  
RANGE inputs to AGNDDAC(= 0 V). Figure 21 shows the con-  
figuration of the AD7569 to achieve this output range. A similar  
configuration of the AD7669 gives the same output range. The  
table for output voltage versus the digital code in the DAC regis-  
ter is shown in Table IV.  
Table V. Bipolar (–1.25 V to +1.25 V) Code Table  
DAC Register Contents  
MSB LSB  
0111 1111  
0000 0001  
0000 0000  
1111 1111  
1000 0001  
1000 0000  
Analog Output, VOUT  
127  
+VREF  
128  
1
+VREF  
128  
0 V  
1
–VREF  
128  
127  
–VREF  
128  
Figure 21. AD7569 Unipolar (0 V to +1.25 V) Operation  
128  
–VREF  
= –VREF  
128  
Table IV. Unipolar (0 V to +1.25 V) Code Table  
DAC Register Contents  
NOTE: 1 LSB = (VREF)(2–7) = VREF (1/128)  
MSB LSB  
Analog Output, VOUT  
BIPOLAR (–2.5 V to +2.5 V) CONFIGURATION  
The –2.5 V to +2.5 V bipolar output range is achieved by tying  
the RANGE input to VDD and the VSS input to –5 V. Once  
again, the input coding is 2s complement. The table for output  
voltage versus digital code is as in Table V with 2.VREF replacing  
255  
1111 1111  
1000 0001  
1000 0000  
0111 1111  
0000 0001  
0000 0000  
+VREF  
256  
129  
VREF. Note that for this range  
+VREF  
256  
1
64  
1 LSB = 4.VREF (28 ) = VREF  
128  
+VREF  
+VREF  
+VREF  
0 V  
= +VREF/2  
256  
127  
256  
1
256  
NOTE: 1 LSB = (VREF) (2–8) = VREF (1/256); VREF = +1.25 V Nominal  
REV. B  
–15–  
AD7569/AD7669  
APPLYING THE AD7569/AD7669 ADC  
The analog input on the AD7569/AD7669 accepts the same  
four input ranges as the output ranges on the DAC. Whatever  
output range is selected for the DAC also applies to the input  
range of the ADC.  
Although separate AGNDs exist for both the DAC and ADC to  
minimize crosstalk, writing data to the DAC while the ADC is  
performing a conversion may result in an incorrect conversion  
from the ADC due to an interaction of currents between the  
DAC and ADC. Therefore, to ensure correct operation of the  
ADC, the DAC register should not be updated while the ADC  
is converting.  
UNIPOLAR OPERATION  
The circuit of Figure 21 shows the AD7569 configured for both  
an input and output range of 0 V to +1.25 V (the AD7669 con-  
figuration is similar). The nominal transfer characteristic for this  
range is shown in Figure 22. The output code is Natural Binary  
with 1 LSB = (1.25/256)V = 4.88 mV.  
Figure 23. Nominal Transfer Characteristic for Bipolar  
(–1.25 V to +1.25 V) Operation  
As before, to achieve the unipolar 0 V to +2.5 V input range,  
typical example is a digital filter where an ac analog signal is  
quantized by the ADC, digitally processed and recreated using  
the DAC. In these types of applications, the offset error can be  
eliminated by ac coupling the recreated signal. Full-scale error  
effect is linear and does not cause problems as long as the input  
signal is within the full dynamic range of the ADC. An impor-  
tant parameter in DSP applications is Differential Nonlinearity,  
and this is not affected by either offset or full-scale error.  
V
SS is connected to 0 V, and the RANGE input is tied to a logic  
high. The nominal transfer characteristic is as in Figure 22 but,  
in this case, 1 LSB = (2.5/256)V = 9.76 mV.  
In applications where absolute accuracy is important ADC off-  
set and full-scale error can be adjusted to zero. Figure 24 shows  
the additional components required for offset and full-scale er-  
ror adjustment. Offset error must be adjusted before full-scale  
error. Zero offset is achieved by adjusting the offset of the op  
amp driving VIN (i.e., A1 in Figure 23). In unipolar applica-  
tions, for zero offset error, apply 1/2 LSB at the analog input  
and adjust the op amp offset voltage until the ADC output code  
flickers between 0000 0000 and 0000 0001. For zero full-scale  
error, apply an analog input of FS – 3/2 LSBs and adjust R1 un-  
til the ADC output code flickers between 1111 1110 and 1111  
1111.  
In bipolar applications, to adjust for bipolar zero offset, apply  
–1/2 LSB at the analog input and adjust the op amp offset volt-  
age until the output code flickers between 1111 1111 and 0000  
0000. For zero full-scale error, apply +FS/2 – 3/2 LSB at the  
analog input and adjust R1 until the ADC output code flickers  
between 0111 1110 and 0111 1111.  
Figure 22. Nominal Transfer Characteristic for Unipolar  
(0 V to +1.25 V) Operation  
BIPOLAR OPERATION  
The analog input of the AD7569/AD7669 ADC is configured  
for bipolar inputs when VSS = –5 V. The output code provided  
by the part is twos complement. Figure 23 shows the transfer  
function for bipolar (–1.25 V to +1.25 V) operation. The LSB  
size for this range is (2.5/256)V = 9.76 mV.  
The transfer function for the –2.5 V to +2.5 V range is identical  
to that of Figure 23, but now FS = 5 V and the LSB size is  
(5/256)V = 19.5 mV.  
ADC OFFSET AND FULL-SCALE ERROR ADJUSTMENT  
In most Digital Signal Processing (DSP) applications, offset and  
full-scale error have little or no effect on system performance. A  
Figure 24. ADC Error Adjust Circuit  
REV. B  
–16–  
AD7569/AD7669  
Figure 25. Peak-Reading A/D Converter  
PEAK DETECTION—AD7569  
head (or motor) is monitored. The closed-loop system allows an  
error between the desired position and the actual position to be  
monitored and corrected. The correction is achieved by adjust-  
ing the ratio of the phase currents in the motor windings until  
the required head position is reached.  
The circuit of Figure 25 shows a peak-reading A/D converter,  
which is useful in such applications as monitoring flow rates,  
temperature, pressure, etc. The circuit ensures that a peak will  
not be missed while at the same time does not require the mi-  
croprocessor to frequently monitor the data. The peak value is  
stored in the A/D converter and can be read at any time.  
The AD7669 is ideally suited for the closed-loop microstepping  
technique with its on-chip dual DACs for positioning the disk  
drive head, and onboard ADC for monitoring the position of the  
head. A generalized circuit for a closed-loop microstepping sys-  
tem is shown in Figure 26. The DAC waveforms are shown in  
Figure 27, along with the direction information for clockwise ro-  
tation supplied by the controller.  
The gain on the AD524 is adjusted to yield a 0 V to +2.5 V out-  
put. When the input signal exceeds the current stored value, the  
output of the TL311 goes low, triggering the Q output of the  
74121. This low-going pulse starts a conversion on the AD7569  
ADC, and at the end of conversion latches the result into the  
DAC. This pulse must be at least 120 ns greater than the con-  
version time of the ADC. The Q output is used to drive the  
strobe input of the TL311, resetting the TL311 output high in  
readiness for another conversion.  
The additional gates on the RD and WR inputs are to allow the  
data to be read by the microprocessor while at the same time  
ensuring that the DAC is not updated when the microprocessor  
reads the data. It may be necessary to monitor the AD7569  
BUSY line to ensure that a processor READ is not attempted  
while the AD7569 is in the middle of a conversion. The READ  
pulse width from the processor must be less than 1 µs to ensure  
correct data is read from the ADC. A low-going pulse on the  
RESET line resets the DAC output to 0 V and starts a new “peak-  
detection” period. This RESET pulse must also be less than 1 µs.  
DISK DRIVE APPLICATION—AD7669  
Closed-Loop Microstepping  
Figure 26. Typical Closed-Loop Microstepping Circuit with  
the AD7669  
Microstepping is a popular technique in low density disk drives  
(both floppy and hard disk) that allows higher positional resolu-  
tion of the disk drive head over that obtainable from a full- step  
driven stepper motor. Typically, a two-phase stepper motor has  
its phase currents driven with a sine-cosine relationship. These  
cosinusoidal signals are generated by two DACs driven with the  
appropriate data. The resolution of the DACs determines the  
number of microsteps into which each full step can be divided.  
For example, with a 1.8° full-step motor and a 4-bit DAC, a  
microstep size of 0.11° (1.8°/(2n)) is obtainable.  
The AD7669 is used in the unipolar 0 V to +2.5 V configura-  
tion. This allows the circuit of Figure 26 to be completely uni-  
polar (+5 V, +12 V supplies); no negative power supplies are  
required. The power output stage is a dual H-Bridge device  
such as the UDN-2998W from Sprague Electric. The phase  
currents in both windings are detected by means of the small  
value sense resistors, RSA and RSB, in series with the windings.  
The voltage developed across these resistors is amplified and  
compared with the respective DAC output voltage. The com-  
parators in turn chop the phase winding current. The ADC  
completes the feedback path by converting information from a  
suitable transducer for analysis by the controller.  
The microstepping technique improves the positioning resolu-  
tion possible in any control application; however, the positional  
accuracy can be significantly worse than that offered by the  
original full-step accuracy specification due to load torque effects.  
To ensure that the increased resolution is usable, it is necessary  
to use a closed-loop system where the position of the disk drive  
REV. B  
–17–  
AD7569/AD7669  
On initial start-up, the output voltage, VO, will be invalid until  
the length of the delay is reached (i.e., until the counter is re-  
set). From this point forward, the delayed data is read from the  
6116 and loaded to the DAC before the newly converted data is  
written into the same memory location. The input clock to the  
system can be a square wave of maximum input frequency 200  
kHz  
(assuming 2 µs conversion time for the ADC). The mark/space  
ratio of the input clock can be varied to maximize the sampling  
frequency if required. The clock low time has to be equal to the  
conversion time and access time of the ADC plus the setup time  
required for the 6116. The clock high time has only to be equal  
to the setup time for the DAC plus the delay time through the  
counter and the access time of the 6116.  
The amount of memory used, as well as the sampling frequency,  
determines the maximum possible delay. Using the HCT4040,  
and the 6116 with an input clock frequency of 200 kHz, the  
maximum delay is 5 ms on a maximum input frequency of  
100 kHz. Using 64K memory, with an 8 kHz input clock fre-  
quency, the maximum delay is 8 seconds on a maximum input  
frequency of 4 kHz.  
Figure 27. Typical DAC Output Voltages for Microstepping  
and Direction Signals for Clockwise Rotation with the  
UDN-2998W  
ANALOG DELAY LINE—AD7569  
In many applications, especially in audio systems, it is necessary  
to provide a delay on the input signal. The circuit of Figure 28  
shows how a simple analog delay line can be implemented,  
based on the AD7569. The input signal is sampled using the  
AD7569 ADC, and converted data is loaded into the 6116 (2K  
ϫ 8 static ram). The inverted input clock drives a counter that  
selects the address for the 6116. The delay is selected by choos-  
ing one of the output lines of the HCT4040 counter to reset the  
coun-ter. This can be done using a simple switch in a manual  
system or by a multiplexer in a programmable delay application.  
Data is written to the DAC using the inverted input clock signal.  
TRANSIENT RECORDER—AD7569  
The scheme just outlined can also form the basis for a transient  
recorder. In this case, transients on the input signal are con-  
verted and stored in memory. The transient can then be recalled  
from memory at a later time, and the transient waveform can be  
recreated using the AD7569 DAC.  
INFINITE SAMPLE-AND-HOLD—AD7569  
The AD7569 is ideal for implementing a single-chip infinite  
sample-and-hold function. Basically, the ADC samples and con-  
verts the input signal into an 8-bit digital word. The 8 bits of  
data are then loaded to the DAC and the sampled value is re-  
stored to analog form. The sampled value is held until the DAC  
register is updated. The full-scale matching between the ADC  
and the DAC on the AD7569 ensures a typical error of less than  
1% between the analog input voltage and the “held” output  
voltage. Figure 29 shows the connections required on the  
AD7569 to achieve this infinite sample-and-hold function.  
Figure 29. Infinite Sample-and-Hold  
Figure 28. Analog Delay Line  
REV. B  
–18–  
AD7569/AD7669  
panel meter module that converts the signal for digital readout.  
The input signal to the panel meter is also applied to the analog  
input of the AD7569 for the tare function. When the tare switch  
(S1) is closed, a tare cycle commences and VIN is sampled and  
held infinitely at VOUT until the next tare cycle. VOUT drives the  
inverting input of the differential amplifier and forces its output  
to zero. Thus, the tare function is used to give a readout of zero  
for any undesired weight, such as a box, when only the item  
placed in it is to be weighed. The tare function can also be used  
in calibrating the system, to cancel out offset errors due to the  
load cell, AD624 and differential amplifier.  
TARE FUNCTION FOR WEIGH SCALE—AD7569  
The infinite sample-and-hold just outlined can also form the ba-  
sis of a circuit to provide a tare function for a weigh scale sys-  
tem. Figure 30 shows a circuit for a weigh scale system. It  
incorporates a tare function using a simple circuit based on the  
AD7569.  
The AD587, along with the 2N6285, provides a buffered +10 V  
reference to supply the low impedance load cell transducer. The  
load cell output is amplified by the AD624 precision instrumen-  
tation amplifier with gain adjustment provided by R1. The out-  
put of the AD624 is applied to the noninverting input of a unity  
gain differential summing amplifier that uses the AD707, a high  
precision op amp with low drift. The AD707 feeds a 3 1/2 digit  
The AD7569 offers many advantages in the system outlined,  
such as: simple, low cost circuit—no need for microprocessor,  
software, etc.—and low power consumption.  
Figure 30. Weigh Scale System with Tare Function  
REV. B  
–19–  
AD7569/AD7669  
OUTLINE DIMENSIONS  
Dimensions shown in inches and (mm).  
24-Pin Plastic (N-24)  
24-Pin Cerdip (Q-24)  
28-Terminal Leadless Ceramic Chip Carrier  
(E-28A)  
28-Terminal Plastic Leaded Chip Carrier  
(P-28A)  
28-Pin Plastic DIP (N-28)  
28-Lead Small Outline (SO)  
(R-28)  
REV. B  
–20–  

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SI9122E

500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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VISHAY