AD7657-1 [ADI]
250 kSPS, 6-Channel, Simultaneous Sampling, Bipolar, 16-/14-/12-Bit ADC; 250 kSPS时， 6通道，同步采样，双极性， 16位/ 14位/ 12位ADC
| 型号： | AD7657-1 |
| 厂家： | 
ADI |
| 描述： | 250 kSPS, 6-Channel, Simultaneous Sampling, Bipolar, 16-/14-/12-Bit ADC |
| 文件： | 总32页 (文件大小：865K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
250 kSPS, 6-Channel, Simultaneous
Sampling, Bipolar, 16-/14-/12-Bit ADC
AD7656-1/AD7657-1/AD7658-1
FEATURES
FUNCTIONAL BLOCK DIAGRAM
V
CONVST A CONVST B CONVST C AV
DV
CC CC
DD
Pin and software compatible with AD7656/AD7657/AD7658
featuring reduced decoupling requirements
6 independent ADCs
CS
CLK
OSC
REF
SER/PAR SEL
CONTROL
LOGIC
True bipolar analog inputs
V
DRIVE
Pin-/software-selectable ranges: 10 V, 5 V
Fast throughput rate: 250 kSPS
iCMOS process technology
STBY
BUF
OUTPUT
DRIVERS
DB8/DOUT A
16-/14-/
T/H
V1
V2
V3
V4
V5
V6
12-BIT SAR
Low power
DB6/SCLK
16-/14-/
12-BIT SAR
140 mW at 250 kSPS with 5 V supplies
High noise performance with wide bandwidth
88 dB SNR at 10 kHz input frequency
On-chip reference and reference buffers
High speed parallel, serial, and daisy-chain interface modes
High speed serial interface
SPI/QSPI™/MICROWIRE™/DSP compatible
Standby mode: 25 μW max
64-lead LQFP
T/H
T/H
T/H
T/H
T/H
OUTPUT
DRIVERS
DB9/DOUT B
BUF
BUF
16-/14-/
12-BIT SAR
OUTPUT
DRIVERS
DB10/DOUT C
16-/14-/
12-BIT SAR
DATA/
CONTROL
LINES
OUTPUT
DRIVERS
16-/14-/
12-BIT SAR
RD
WR/REF
EN/DIS
16-/14-/
12-BIT SAR
APPLICATIONS
Power line monitoring and measuring systems
Instrumentation and control systems
Multiaxis positioning systems
AD7656-1/AD7657-1/AD7658-1
V
AGND
DGND
SS
Figure 1.
GENERAL DESCRIPTION
The AD7656-1/AD7657-1/AD7658-11 are reduced decoupling pin-
and software-compatible versions of AD7656/AD7657/AD7658.
The AD7656-1/AD7657-1/AD7658-1 devices contain six 16-/
14-/12-bit, fast, low power successive approximation ADCs in
a package designed on the iCMOS® process (industrial CMOS).
iCMOS is a process combining high voltage silicon with submicron
CMOS and complementary bipolar technologies. It enables the
development of a wide range of high performance analog ICs
capable of 33 V operation in a footprint that no previous generation
of high voltage parts could achieve. Unlike analog ICs using conven-
tional CMOS processes, iCMOS components can accept bipolar
input signals while providing increased performance, which
dramatically reduces power consumption and package size.
The conversion process and data acquisition are controlled
using the CONVST signals and an internal oscillator. Three
CONVST pins (CONVST A, CONVST B, and CONVST C)
allow independent, simultaneous sampling of the three ADC
pairs. The AD7656-1/AD7657-1/AD7658-1 have a high speed
parallel and serial interface, allowing the devices to interface with
microprocessors or DSPs. When the serial interface is selected,
each part has a daisy-chain feature that allows multiple ADCs to
connect to a single serial interface. The AD7656-1/AD7657-1/
AD7658-1 can accommodate true bipolar input signals in the
4 ꢀ VREF and 2 ꢀ VREF ranges. Each AD7656-1/AD7657-1/
AD7658-1 also contains an on-chip 2.5 V reference.
PRODUCT HIGHLIGHTS
The AD7656-1/AD7657-1/AD7658-1 feature throughput rates
of up to 250 kSPS. The parts contain low noise, wide bandwidth
track-and-hold amplifiers that can handle input frequencies
up to 4.5 MHz.
1. Six 16-/14-/12-bit, 250 kSPS ADCs on board.
2. Six true bipolar, high impedance analog inputs.
3. High speed parallel and serial interfaces.
4. Reduced decoupling requirements and reduced bill of
materials cost compared with the AD7656/AD7657/
AD7658 devices.
1 Protected by U.S. Patent No. 6,731,232.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2008 Analog Devices, Inc. All rights reserved.
AD7656-1/AD7657-1/AD7658-1
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configuration and Function Descriptions........................... 11
Typical Performance Characteristics ........................................... 14
Terminology.................................................................................... 18
Theory of Operation ...................................................................... 20
Converter Details ....................................................................... 20
ADC Transfer Function............................................................. 21
Internal/External Reference...................................................... 21
Typical Connection Diagram ................................................... 21
Driving the Analog Inputs ........................................................ 22
Interface Options........................................................................ 22
Application Hints ........................................................................... 29
Layout .......................................................................................... 29
Outline Dimensions....................................................................... 30
Ordering Guide .......................................................................... 30
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
AD7656-1 ...................................................................................... 3
AD7657-1 ...................................................................................... 5
AD7658-1 ...................................................................................... 7
Timing Specifications .................................................................. 9
Absolute Maximum Ratings.......................................................... 10
Thermal Resistance .................................................................... 10
ESD Caution................................................................................ 10
REVISION HISTORY
7/08—Revision 0: Initial Version
Rev. 0 | Page 2 of 32
AD7656-1/AD7657-1/AD7658-1
SPECIFICATIONS
AD7656-1
VREF = 2.5 V internal/external, AVCC = 4.75 V to 5.25 V, DVCC = 4.75 V to 5.25 V, VDRIVE = 2.7 V to 5.25 V; for the 4 ꢀ VREF range, VDD
10 V to 16.5 V, VSS = −10 V to −16.5 V; for the 2 ꢀ VREF range, VDD = 5 V to 16.5 V, VSS = −5 V to −16.5 V; fSAMPLE = 250 kSPS, TA = TMIN to
MAX, unless otherwise noted.
=
T
Table 1.
Parameter
B Version1 Y Version1 Unit
Test Conditions/Comments
DYNAMIC PERFORMANCE
Signal-to-(Noise + Distortion) (SINAD)2
Signal-to-Noise Ratio (SNR)2
Total Harmonic Distortion (THD)2
fIN = 10 kHz sine wave
88
88
−90
−105
−100
88
88
−90
−105
−100
dB typ
dB typ
dB max
dB typ
dB typ
VDD/VSS = 5 V to 16.5 V
fa = 10.5 kHz, fb = 9.5 kHz
Peak Harmonic or Spurious Noise (SFDR)2
Intermodulation Distortion (IMD)2
Second-Order Terms
Third-Order Terms
Aperture Delay
Aperture Delay Matching
Aperture Jitter
Channel-to-Channel Isolation2
−112
−107
10
4
35
−100
4.5
2.2
−112
−107
10
4
35
−100
4.5
2.2
dB typ
dB typ
ns max
ns max
ps typ
dB typ
MHz typ
MHz typ
fIN on unselected channels up to 100 kHz
@ −3 dB
@ −0.1 dB
Full-Power Bandwidth
DC ACCURACY
Resolution
16
16
Bits
No Missing Codes
Integral Nonlinearity2
15
3
1
14
3
1
Bits min
LSB max
LSB typ
Positive Full-Scale Error2
Positive Full-Scale Error Matching2
Bipolar Zero-Scale Error2
Bipolar Zero-Scale Error Matching2
Negative Full-Scale Error2
Negative Full-Scale Error Matching2
0.8
0.35
0.048
0.038
0.8
0.35
0.8
0.35
0.023
0.038
0.8
0.35
% FS max
% FS max
% FS max
% FS max
% FS max
% FS max
0.381% FSR typical
0.0137% FSR typical
0.381% FSR typical
ANALOG INPUT
See Table 8 for minimum VDD/VSS for
each range
Input Voltage Ranges
4 ꢀ VREF
2 ꢀ VREF
4 ꢀ VREF
2 ꢀ VREF
V
V
RNGx bits or RANGE pin = 0
RNGx bits or RANGE pin = 1
DC Leakage Current
Input Capacitance3
1
10
14
1
10
14
μA max
pF typ
pF typ
4 ꢀ VREF range when in track
2 ꢀ VREF range when in track
REFERENCE INPUT/OUTPUT
Reference Input Voltage Range
DC Leakage Current
2.5
1
18.5
2.5
1
18.5
V min/max
μA max
pF typ
Input Capacitance3
REFEN/DIS = 1
1000 hours
Reference Output Voltage
Long-Term Stability
Reference Temperature Coefficient
2.49/2.51
2.49/2.51
V min/max
ppm typ
ppm/°C max
ppm/°C typ
150
25
6
150
25
6
Rev. 0 | Page 3 of 32
AD7656-1/AD7657-1/AD7658-1
Parameter
B Version1 Y Version1 Unit
Test Conditions/Comments
LOGIC INPUTS
Input High Voltage (VINH
)
0.7 ꢀ VDRIVE
0.3 ꢀ VDRIVE
10
0.7 ꢀ VDRIVE V min
0.3 ꢀ VDRIVE V max
Input Low Voltage (VINL
)
Input Current (IIN)
10
10
μA max
pF max
Typically 10 nA, VIN = 0 V or VDRIVE
Input Capacitance (CIN)3
LOGIC OUTPUTS
10
Output High Voltage (VOH)
Output Low Voltage (VOL)
Floating-State Leakage Current
Floating-State Output Capacitance3
Output Coding
VDRIVE − 0.2 VDRIVE − 0.2 V min
ISOURCE = 200 μA
ISINK = 200 μA
0.2
10
10
0.2
10
10
V max
μA max
pF max
Twos complement
CONVERSION RATE
Conversion Time
Track-and-Hold Acquisition Time2, 3
Throughput Rate
POWER REQUIREMENTS
VDD
3.1
550
250
3.1
550
250
μs max
ns max
kSPS
Parallel interface mode only
5/15
5/15
V nom min/max For the 4 ꢀ VREF range, VDD = 10 V to 16.5 V
VSS
−5/−15
−5/−15
V nom min/max For the 4 ꢀ VREF range, VDD = −10 V to −16.5 V
AVCC
5
5
V nom
DVCC
5
5
V nom
VDRIVE
ITOTAL
3/5
3/5
V nom min/max
Digital inputs = 0 V or VDRIVE
4
Normal Mode—Static
18
26
18
26
mA max
AVCC = DVCC = VDRIVE = 5.25 V, VDD = 16.5 V,
VSS = −16.5 V
fSAMPLE = 250 kSPS, AVCC = DVCC = VDRIVE = 5.25 V,
VDD = 16.5 V, VSS = −16.5 V
Normal Mode—Operational
mA max
ISS (Operational)
IDD (Operational)
Partial Power-Down Mode
0.25
0.25
7
0.25
0.25
7
mA max
mA max
mA max
VSS = −16.5 V, fSAMPLE = 250 kSPS
VDD = 16.5 V, fSAMPLE = 250 kSPS
AVCC = DVCC = VDRIVE = 5.25 V, VDD = 16.5 V,
VSS = −16.5 V
Full Power-Down Mode (STBY Pin)
Power Dissipation
400
400
μA max
SCLK on or off, AVCC = DVCC = VDRIVE = 5.25 V,
V
DD = 16.5 V, VSS = −16.5 V
AVCC = DVCC = VDRIVE = 5.25 V, VDD = 16.5 V,
VSS = −16.5 V
Normal Mode—Static
94
140
40
94
140
40
mW max
mW max
mW max
μW max
Normal Mode—Operational
Partial Power-Down Mode
Full Power-Down Mode (STBY Pin)
fSAMPLE = 250 kSPS
25
25
1 The temperature range for the B version is −40°C to +85°C and for the Y version is −40°C to +125°C.
2 See the Terminology section.
3 Sample tested during initial release to ensure compliance.
4 Includes IAVCC, IVDD, IVSS, IVDRIVE, and IDVCC
.
Rev. 0 | Page 4 of 32
AD7656-1/AD7657-1/AD7658-1
AD7657-1
VREF = 2.5 V internal/external, AVCC = 4.75 V to 5.25 V, DVCC = 4.75 V to 5.25 V, VDRIVE = 2.7 V to 5.25 V; for the 4 ꢀ VREF range, VDD
10 V to 16.5 V, VSS = −10 V to −16.5 V; for the 2 ꢀ VREF range, VDD = 5 V to 16.5 V, VSS = −5 V to −16.5 V; fSAMPLE = 250 kSPS, TA = TMIN to
MAX, unless otherwise noted.
=
T
Table 2.
Parameter
B Version1 Y Version1 Unit
Test Conditions/Comments
DYNAMIC PERFORMANCE
Signal-to-(Noise + Distortion) (SINAD)2
Signal-to-Noise Ratio (SNR)2
Total Harmonic Distortion (THD)2
fIN = 10 kHz sine wave
82.5
83.5
−90
−105
−100
82.5
83.5
−90
−105
−100
dB typ
dB typ
dB max
dB typ
dB typ
Peak Harmonic or Spurious Noise (SFDR)2
Intermodulation Distortion (IMD)2
Second-Order Terms
Third-Order Terms
Aperture Delay
Aperture Delay Matching
Aperture Jitter
Channel-to-Channel Isolation2
fa = 10.5 kHz, fb = 9.5 kHz
−109
−104
10
4
35
−100
4.5
2.2
−109
−104
10
4
35
−100
4.5
2.2
dB typ
dB typ
ns max
ns max
ps typ
dB typ
MHz typ
MHz typ
fIN on unselected channels up to 100 kHz
@ −3 dB
@ −0.1 dB
Full-Power Bandwidth
DC ACCURACY
Resolution
14
14
Bits
No Missing Codes
Integral Nonlinearity2
14
1
1
14
1
1
Bits min
LSB max
LSB typ
Positive Full-Scale Error2
Positive Full-Scale Error Matching2
Bipolar Zero-Scale Error2
Bipolar Zero-Scale Error Matching2
Negative Full-Scale Error2
Negative Full-Scale Error Matching2
0.95
0.366
0.04
0.0427
0.95
0.366
0.95
0.366
0.04
0.0427
0.95
0.366
% FS max
% FS max
% FS max
% FS max
% FS max
% FS max
0.27% FSR typical
0.016% FSR typical
0.27% FSR typical
ANALOG INPUT
See Table 8 for minimum VDD/VSS for
each range
Input Voltage Ranges
4 ꢀ VREF
2 ꢀ VREF
4 ꢀ VREF
2 ꢀ VREF
V
V
RNGx bits or RANGE pin = 0
RNGx bits or RANGE pin = 1
DC Leakage Current
Input Capacitance3
1
10
14
1
10
14
μA max
pF typ
pF typ
4 ꢀ VREF range when in track
2 ꢀ VREF range when in track
REFERENCE INPUT/OUTPUT
Reference Input Voltage Range
DC Leakage Current
2.5
1
18.5
2.5
1
18.5
V min/max
μA max
pF typ
Input Capacitance3
REFEN/DIS = 1
1000 hours
Reference Output Voltage
Long-Term Stability
Reference Temperature Coefficient
2.49/2.51
2.49/2.51
V min/max
ppm typ
ppm/°C max
ppm/°C typ
150
25
6
150
25
6
LOGIC INPUTS
Input High Voltage (VINH
)
0.7 ꢀ VDRIVE 0.7 ꢀ VDRIVE V min
0.3 ꢀ VDRIVE 0.3 ꢀ VDRIVE V max
Input Low Voltage (VINL
)
Input Current (IIN)
Input Capacitance (CIN)3
10
10
10
10
μA max
pF max
Typically 10 nA, VIN = 0 V or VDRIVE
Rev. 0 | Page 5 of 32
AD7656-1/AD7657-1/AD7658-1
Parameter
B Version1 Y Version1 Unit
Test Conditions/Comments
LOGIC OUTPUTS
Output High Voltage (VOH)
Output Low Voltage (VOL)
Floating-State Leakage Current
Floating-State Output Capacitance3
VDRIVE − 0.2 VDRIVE − 0.2 V min
ISOURCE = 200 μA
ISINK = 200 μA
0.2
10
0.2
10
10
V max
μA max
pF max
10
Output Coding
Twos complement
CONVERSION RATE
Conversion Time
3.1
550
250
3.1
550
250
μs max
ns max
kSPS
Track-and-Hold Acquisition Time2, 3
Throughput Rate
Parallel interface mode only
POWER REQUIREMENTS
VDD
5/15
5/15
V nom min/max For the 4 ꢀ VREF range, VDD = 10 V to 16.5 V
VSS
−5/−15
−5/−15
V nom min/max For the 4 ꢀ VREF range, VDD = −10 V to −16.5 V
AVCC
DVCC
VDRIVE
5
5
3/5
5
5
3/5
V nom
V nom
V nom min/max
Digital inputs = 0 V or VDRIVE
4
ITOTAL
Normal Mode—Static
18
26
18
26
mA max
AVCC = DVCC = VDRIVE = 5.25 V, VDD = 16.5 V,
VSS = −16.5 V
fSAMPLE = 250 kSPS, AVCC = DVCC = VDRIVE = 5.25 V,
VDD = 16.5 V, VSS = −16.5 V
Normal Mode—Operational
mA max
ISS (Operational)
IDD (Operational)
Partial Power-Down Mode
0.25
0.25
7
0.25
0.25
7
mA max
mA max
mA max
VSS = −16.5 V, fSAMPLE = 250 kSPS
VDD = 16.5 V, fSAMPLE = 250 kSPS
AVCC = DVCC = VDRIVE = 5.25 V, VDD = 16.5 V,
VSS = −16.5 V
Full Power-Down Mode (STBY Pin)
Power Dissipation
400
400
μA max
SCLK on or off, AVCC = DVCC = VDRIVE = 5.25 V,
VDD = 16.5 V, VSS = −16.5 V
AVCC = DVCC = VDRIVE = 5.25 V, VDD = 16.5 V,
VSS = −16.5 V
Normal Mode—Static
94
140
40
94
140
40
mW max
mW max
mW max
μW max
Normal Mode—Operational
Partial Power-Down Mode
Full Power-Down Mode (STBY Pin)
fSAMPLE = 250 kSPS
25
25
1 The temperature range for the B version is −40°C to +85°C and for the Y version is −40°C to +125°C.
2 See the Terminology section.
3 Sample tested during initial release to ensure compliance.
4 Includes IAVCC, IVDD, IVSS, IVDRIVE, and IDVCC
.
Rev. 0 | Page 6 of 32
AD7656-1/AD7657-1/AD7658-1
AD7658-1
VREF = 2.5 V internal/external, AVCC = 4.75 V to 5.25 V, DVCC = 4.75 V to 5.25 V, VDRIVE = 2.7 V to 5.25 V; for 4 ꢀ VREF range, VDD = 10 V
to 16.5 V, VSS = −10 V to −16.5 V; for 2 ꢀ VREF range, VDD = 5 V to 16.5 V, VSS = −5 V to −16.5 V; fSAMPLE = 250 kSPS, TA = TMIN to TMAX
,
unless otherwise noted.
Table 3.
Parameter
B Version1 Y Version1 Unit
Test Conditions/Comments
DYNAMIC PERFORMANCE
Signal-to-(Noise + Distortion) (SINAD)2
fIN = 10 kHz sine wave
73.5
73.5
−88
−100
−97
73.5
73.5
−88
−100
−97
dB typ
dB typ
dB max
dB typ
dB typ
Total Harmonic Distortion (THD)2
Peak Harmonic or Spurious Noise (SFDR)2
Intermodulation Distortion (IMD)2
Second-Order Terms
Third-Order Terms
Aperture Delay
Aperture Delay Matching
Aperture Jitter
Channel-to-Channel Isolation2
fa = 10.5 kHz, fb = 9.5 kHz
−106
−101
10
4
35
−100
4.5
2.2
−106
−101
10
4
35
−100
4.5
2.2
dB typ
dB typ
ns max
ns max
ps typ
dB typ
MHz typ
MHz typ
fIN on unselected channels up to 100 kHz
@ −3 dB
@ −0.1 dB
Full-Power Bandwidth
DC ACCURACY
Resolution
12
12
Bits
No Missing Codes
12
0.7
0.5
0.95
0.366
2
12
0.7
0.5
0.95
0.366
2
Bits min
LSB max
LSB max
% FS max
% FS max
LSB max
LSB max
% FS max
% FS max
Differential Nonlinearity
Integral Nonlinearity2
Positive Full-Scale Error2
Positive Full-Scale Error Matching2
Bipolar Zero-Scale Error2
Bipolar Zero-Scale Error Matching2
Negative Full-Scale Error2
Negative Full-Scale Error Matching2
ANALOG INPUT
0.317% FSR typical
0.0125% FSR typical
0.317% FSR typical
2
2
0.95
0.366
0.95
0.366
See Table 8 for minimum VDD/VSS for
each range
Input Voltage Ranges
4 ꢀ VREF
2 ꢀ VREF
4 ꢀ VREF
2 ꢀ VREF
V
V
RNGx bits or RANGE pin = 0
RNGx bits or RANGE pin = 1
DC Leakage Current
Input Capacitance3
1
10
14
1
10
14
μA max
pF typ
pF typ
4 ꢀ VREF range when in track
2 ꢀ VREF range when in track
REFERENCE INPUT/OUTPUT
Reference Input Voltage Range
DC Leakage Current
2.5
1
18.5
2.5
1
18.5
V min/max
μA max
pF typ
Input Capacitance3
REFEN/DIS = 1
1000 hours
Reference Output Voltage
Long-Term Stability
Reference Temperature Coefficient
2.49/2.51
2.49/2.51
V min/max
ppm typ
ppm/°C max
ppm/°C typ
150
25
6
150
25
6
LOGIC INPUTS
Input High Voltage (VINH
)
0.7 ꢀ VDRIVE 0.7 ꢀ VDRIVE V min
0.3 ꢀ VDRIVE 0.3 ꢀ VDRIVE V max
Input Low Voltage (VINL
)
Input Current (IIN)
Input Capacitance (CIN)3
10
10
10
10
μA max
pF max
Typically 10 nA, VIN = 0 V or VDRIVE
Rev. 0 | Page 7 of 32
AD7656-1/AD7657-1/AD7658-1
Parameter
B Version1 Y Version1 Unit
Test Conditions/Comments
LOGIC OUTPUTS
Output High Voltage (VOH)
Output Low Voltage (VOL)
Floating-State Leakage Current
Floating-State Output Capacitance3
VDRIVE − 0.2 VDRIVE − 0.2 V min
ISOURCE = 200 μA
ISINK = 200 μA
0.2
10
0.2
10
10
V max
μA max
pF max
10
Output Coding
Twos complement
CONVERSION RATE
Conversion Time
3.1
550
250
3.1
550
250
μs max
ns max
kSPS
Track-and-Hold Acquisition Time2, 3
Throughput Rate
Parallel interface mode only
POWER REQUIREMENTS
VDD
5/15
5/15
V nom min/max For the 4 ꢀ VREF range, VDD = 10 V to 16.5 V
VSS
−5/−15
−5/−15
V nom min/max For the 4 ꢀ VREF range, VDD = −10 V to −16.5 V
AVCC
DVCC
VDRIVE
5
5
3/5
5
5
3/5
V nom
V nom
V nom min/max
Digital inputs = 0 V or VDRIVE
4
ITOTAL
Normal Mode—Static
18
26
18
26
mA max
AVCC = DVCC = VDRIVE = 5.25 V, VDD = 16.5 V,
VSS = −16.5 V
fSAMPLE = 250 kSPS, AVCC = DVCC = VDRIVE = 5.25 V,
VDD = 16.5 V, VSS = −16.5 V
Normal Mode—Operational
mA max
ISS (Operational)
IDD (Operational)
Partial Power-Down Mode
0.25
0.25
7
0.25
0.25
7
mA max
mA max
mA max
VSS = −16.5 V, fSAMPLE = 250 kSPS
VDD = 16.5 V, fSAMPLE = 250 kSPS
AVCC = DVCC = VDRIVE = 5.25 V, VDD = 16.5 V,
VSS = −16.5 V
Full Power-Down Mode (STBY Pin)
Power Dissipation
400
400
μA max
SCLK on or off, AVCC = DVCC = VDRIVE = 5.25 V,
VDD = 16.5 V, VSS = −16.5 V
AVCC = DVCC = VDRIVE = 5.25 V, VDD = 16.5 V,
VSS = −16.5 V
Normal Mode—Static
94
140
40
94
140
40
mW max
mW max
mW max
μW max
Normal Mode—Operational
Partial Power-Down Mode
Full Power-Down Mode (STBY Pin)
fSAMPLE = 250 kSPS
25
25
1 The temperature range for the B version is −40°C to +85°C and for the Y version is −40°C to +125°C
2 See the Terminology section.
3 Sample tested during initial release to ensure compliance.
4 Includes IAVCC, IVDD, IVSS, IVDRIVE, and IDVCC
.
Rev. 0 | Page 8 of 32
AD7656-1/AD7657-1/AD7658-1
TIMING SPECIFICATIONS
AVCC/DVCC = 4.75 V to 5.25 V, VDD = 5 V to 16.5 V, VSS = −5 V to −16.5 V, VDRIVE = 2.7 V to 5.25 V, VREF = 2.5 V internal/external,
TA = TMIN to TMAX, unless otherwise noted.
Table 4.
Limit at tMIN, tMAX
Parameter1
PARALLEL INTERFACE
tCONVERT
VDRIVE < 4.75 V
VDRIVE = 4.75 V to 5.25 V
Unit
Description
3
3
μs typ
ns min
Conversion time, internal clock
Minimum quiet time required between bus
relinquish and start of next conversion
tQUIET
150
150
tACQ
t10
t1
550
25
60
2
550
25
60
2
ns min
ns min
ns min
ms max
μs max
Acquisition time
Minimum CONVST low pulse
CONVST high to BUSY high
STBY rising edge to CONVST rising edge
Partial power-down mode
tWAKE-UP
25
25
PARALLEL WRITE OPERATION
t11
t12
t13
t14
t15
15
0
15
0
ns min
ns min
ns min
ns min
ns min
WR pulse width
CS to WR setup time
5
5
CS to WR hold time
5
5
Data setup time before WR rising edge
Data hold after WR rising edge
5
5
PARALLEL READ OPERATION
t2
0
0
ns min
ns min
ns min
ns min
ns max
ns min
ns max
ns min
BUSY to RD delay
t3
0
0
CS to RD setup time
t4
0
0
CS to RD hold time
t5
45
45
10
12
6
36
36
10
12
6
RD pulse width
t6
Data access time after RD falling edge
Data hold time after RD rising edge
Bus relinquish time after RD rising edge
Minimum time between reads
t7
t8
t9
SERIAL INTERFACE
fSCLK
t16
18
12
18
12
MHz max
ns max
Frequency of serial read clock
Delay from CS until DOUTx three-state
disabled
Data access time after SCLK rising edge/CS
falling edge
2
t17
22
22
ns max
t18
t19
t20
0.4 ꢀ tSCLK
0.4 ꢀ tSCLK
10
0.4 ꢀ tSCLK
0.4 ꢀ tSCLK
10
ns min
ns min
ns min
SCLK low pulse width
SCLK high pulse width
SCLK to data valid hold time after SCLK
falling edge
t21
18
18
ns max
CS rising edge to DOUTx high impedance
1 Sample tested during initial release to ensure compliance. All input signals are specified with tR = tF = 5 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V.
2 A buffer is used on the DOUTx pins (Pin 5 to Pin 7) for this measurement.
200µA
I
OL
TO OUTPUT
PIN
1.6V
C
L
25pF
200µA
I
OH
Figure 2. Load Circuit for Digital Output Timing Specifications
Rev. 0 | Page 9 of 32
AD7656-1/AD7657-1/AD7658-1
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameter
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rating
VDD to AGND, DGND
VSS to AGND, DGND
VDD to AVCC
AVCC to AGND, DGND
DVCC to AVCC
−0.3 V to +16.5 V
+0.3 V to −16.5 V
VCC − 0.3 V to 16.5 V
−0.3 V to +7 V
−0.3 V to AVCC + 0.3 V
−0.3 V to +7 V
DVCC to DGND, AGND
AGND to DGND
THERMAL RESISTANCE
−0.3 V to +0.3 V
VDRIVE to DGND
−0.3 V to DVCC + 0.3 V
VSS − 0.3 V to VDD + 0.3 V
−0.3 V to VDRIVE + 0.3 V
−0.3 V to VDRIVE + 0.3 V
−0.3 V to AVCC + 0.3 V
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. These
specifications apply to a 4-layer board.
Analog Input Voltage to AGND1
Digital Input Voltage to DGND
Digital Output Voltage to DGND
REFIN/REFOUT to AGND
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
Input Current to Any Pin Except
Supplies2
64-Lead LQFP
45
11
°C/W
10 mA
Operating Temperature Range
B Version
Y Version
Storage Temperature Range
Junction Temperature
Pb/Sn Temperature, Soldering
Reflow (10 sec to 30 sec)
−40°C to +85°C
−40°C to +125°C
−65°C to +150°C
150°C
ESD CAUTION
240(+0)°C
Pb-Free Temperature, Soldering Reflow 260(+0)°C
ESD 700 V
1 If the analog inputs are driven from alternative VDD and VSS supply circuitry,
a 240 Ω series resistor should be placed on the analog inputs and Schottky
diodes should be placed in series with the AD7656-1/AD7657-1/AD7658-1’s
V
DD and VSS supplies.
2 Transient currents of up to 100 mA do not cause SCR latch-up.
Rev. 0 | Page 10 of 32
AD7656-1/AD7657-1/AD7658-1
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
DB14/REFBUF
V6
AV
AV
V5
EN/DIS
DB13
PIN 1
2
3
CC
CC
DB12
DB11
4
5
DB10/DOUT C
DB9/DOUT B
DB8/DOUT A
DGND
AGND
AGND
V4
6
AD7656-1/AD7657-1/AD7658-1
7
TOP VIEW
(Not to Scale)
8
AV
AV
V3
CC
CC
9
V
DRIVE
10
11
12
13
14
15
16
DB7/HBEN/DCEN
DB6/SCLK
AGND
AGND
V2
DB5/DCIN A
DB4/DCIN B
DB3/DCIN C
DB2/SEL C
AV
AV
V1
CC
CC
DB1/SEL B
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Figure 3. Pin Configuration
Table 7. Pin Function Descriptions
Pin No.
Mnemonic
Description
54, 56, 58
REFCAPA, REFCAPB,
REFCAPC
Reference Capacitor A, Reference Capacitor B, and Reference Capacitor C. Decoupling capacitors are
connected to these pins to decouple the reference buffer for each ADC pair. Each REFCAP pin should be
decoupled to AGND using a 1 μF capacitor.
33, 36, 39,
42, 45, 48
V1 to V6
Analog Input 1 to Analog Input 6. These pins are single-ended analog inputs. In hardware mode,
the analog input range of these channels is determined by the RANGE pin. In software mode, it is
determined by the RNGC to RNGA bits of the control register (see Table 11).
32, 37, 38, 43, AGND
44, 49, 52, 53,
55, 57, 59
Analog Ground. This pin is the ground reference point for all analog circuitry on the AD7656-1/
AD7657-1/AD7658-1. All analog input signals and external reference signals should be referred to
this pin. All AGND pins should be connected to the AGND plane of the system. The AGND and
DGND voltages should ideally be at the same potential and must not be more than 0.3 V apart, even
on a transient basis.
26
DVCC
Digital Power, 4.75 V to 5.25 V. The DVCC and AVCC voltages should ideally be at the same potential
and must not be more than 0.3 V apart, even on a transient basis. This supply should be decoupled
to DGND by placing a 1 μF decoupling capacitor on the DVCC pin.
9
VDRIVE
Logic Power Supply Input. The voltage supplied at this pin determines the operating voltage of the
interface. This pin is nominally at the same supply as the supply of the host interface.
8, 25
DGND
Digital Ground. This is the ground reference point for all digital circuitry on the AD7656-1/AD7657-1/
AD7658-1. Both DGND pins should connect to the DGND plane of a system. The DGND and AGND
voltages should ideally be at the same potential and must not be more than 0.3 V apart, even on a
transient basis.
34, 35, 40,
41, 46, 47,
50, 60
AVCC
Analog Supply Voltage, 4.75 V to 5.25 V. This is the supply voltage for the ADC cores. The AVCC and
DVCC voltages should ideally be at the same potential and must not be more than 0.3 V apart, even
on a transient basis.
23, 22, 21
CONVST A,
Conversion Start Input A, Conversion Start Input B, and Conversion Start Input C. These logic inputs
CONVST B, CONVST C are used to initiate conversions on the ADC pairs. CONVST A is used to initiate simultaneous conversions
on V1 and V2. CONVST B is used to initiate simultaneous conversions on V3 and V4. CONVST C is
used to initiate simultaneous conversions on V5 and V6. When one of these pins switches from low
to high, the track-and-hold switch on the selected ADC pair switches from track to hold, and the
conversion is initiated. These inputs can also be used to place the ADC pairs into partial power-
down mode.
Rev. 0 | Page 11 of 32
AD7656-1/AD7657-1/AD7658-1
Pin No.
Mnemonic
Description
19
CS
Chip Select. This active low logic input frames the data transfer. If both CS and RD are logic low and
the parallel interface is selected, the output bus is enabled and the conversion result is output on
the parallel data bus lines. If both CS and WR are logic low and the parallel interface is selected, DB[15:8]
are used to write data to the on-chip control register. When the serial interface is selected, the CS is
used to frame the serial read transfer and clock out the MSB of the serial output data.
20
63
RD
Read Data. If both CS and RD are logic low and the parallel interface is selected, the output bus is
enabled. When the serial interface is selected, the RD line should be held low.
Write Data/Reference Enable and Disable. When the H/S SEL pin is high and both CS and WR are
logic low, DB[15:8] are used to write data to the internal control register. When the H/S SEL pin is
WR/REFEN/DIS
DIS
low, this pin is used to enable or disable the internal reference. When H/S SEL = 0 and REFEN/ = 0, the
internal reference is disabled and an external reference should be applied to the REFIN/REFOUT pin.
When H/S SEL = 0 and REFEN/DIS = 1, the internal reference is enabled and the REFIN/REFOUT pin
should be decoupled. See the Internal/External Reference section.
18
51
BUSY
Busy Output. This pin transitions to high when a conversion is started and remains high until the
conversion is complete and the conversion data is latched into the output data registers. A new
conversion should not be initiated on the AD7656-1/AD7657-1/AD7658-1 when the BUSY signal is high.
Reference Input/Reference Output. The on-chip reference is available via this pin. Alternatively, the
internal reference can be disabled and an external reference can be applied to this input. See the
Internal/External Reference section. When the internal reference is enabled, this pin should be
decoupled using at least a 1 μF decoupling capacitor.
REFIN/REFOUT
61
17
16
SER/PAR SEL
DB0/SEL A
DB1/SEL B
Serial/Parallel Selection Input. When this pin is low, the parallel interface is selected. When this pin is high,
the serial interface is selected. When the serial interface is selected, DB[10:8] function as DOUT[C:A],
DB[0:2] function as DOUT, and DB7 functions as DCEN. When the serial interface is selected, DB15 and
DB[13:11] should be tied to DGND.
Data Bit 0/Select DOUT A. When SER/PAR SEL = 0, this pin acts as a three-state parallel digital output
pin. When SER/PAR SEL = 1, this pin functions as SEL A and is used to configure the serial interface. If
this pin is 1, the serial interface operates with one, two, or three DOUT output pins and enables
DOUT A as a serial output. When the serial interface is selected, this pin should always be set to 1.
Data Bit 1/Select DOUT B. When SER/PAR SEL = 0, this pin acts as a three-state parallel digital output
pin. When SER/PAR SEL = 1, this pin functions as SEL B and is used to configure the serial interface. If
this pin is 1, the serial interface operates with two or three DOUT output pins and enables DOUT B
as a serial output. If this pin is 0, the DOUT B is not enabled to operate as a serial data output pin
and only one DOUT output pin, DOUT A, is used. Unused serial DOUT pins should be left unconnected.
15
DB2/SEL C
Data Bit 2/Select DOUT C. When SER/PAR SEL = 0, this pin acts as a three-state parallel digital output
pin. When SER/PAR SEL = 1, this pin functions as SEL C and is used to configure the serial interface. If
this pin is 1, the serial interface operates with three DOUT output pins and enables DOUT C as a
serial output. If this pin is 0, the DOUT C is not enabled to operate as a serial data output pin.
Unused serial DOUT pins should be left unconnected.
14
13
12
DB3/DCIN C
DB4/DCIN B
DB5/DCIN A
Data Bit 3/Daisy-Chain Input C. When SER/PAR SEL = 0, this pin acts as a three-state parallel digital
output pin. When SER/PAR SEL = 1 and DCEN = 1, this pin acts as Daisy-Chain Input C. When the serial
interface is selected but the device is not used in daisy-chain mode, this pin should be tied to DGND.
Data Bit 4/Daisy-Chain Input B. When SER/PAR SEL = 0, this pin acts as a three-state parallel digital
output pin. When SER/PAR SEL = 1 and DCEN = 1, this pin acts as Daisy-Chain Input B. When the serial
interface is selected but the device is not used in daisy-chain mode, this pin should be tied to DGND.
Data Bit 5/Daisy-Chain Input A. When SER/PAR SEL is low, this pin acts as a three-state parallel digital
output pin. When SER/PAR SEL = 1 and DCEN = 1, this pin acts as Daisy-Chain Input A. When the serial
interface is selected but the device is not used in daisy-chain mode, this pin should be tied to DGND.
Data Bit 6/Serial Clock. When SER/PAR SEL = 0, this pin acts as a three-state parallel digital output pin.
When SER/PAR SEL = 1, this pin functions as SCLK input and is the read serial clock for the serial transfer.
11
10
DB6/SCLK
DB7/HBEN/DCEN
Data Bit 7/High Byte Enable/Daisy-Chain Enable. When the parallel interface is selected and the device is
used in word mode (SER/PAR SEL = 0 and W/B = 0), this pin functions as Data Bit 7. When the parallel
interface is selected and the device is used in byte mode (SER/PAR SEL = 0 and W/B = 1), this pin
functions as HBEN. If the HBEN pin is logic high, the data is output MSB byte first on DB[15:8]. If the
HBEN pin is logic low, the data is output LSB byte first on DB[15:8]. When the serial interface is
selected (SER/PAR SEL = 1), this pin functions as DCEN. If the DCEN pin is logic high, the parts
operate in daisy-chain mode with DB[5:3] functioning as DCIN[A:C]. When the serial interface is
selected but the device is not used in daisy-chain mode, this pin should be tied to DGND.
Rev. 0 | Page 12 of 32
AD7656-1/AD7657-1/AD7658-1
Pin No.
Mnemonic
Description
7
DB8/DOUT A
Data Bit 8/Serial Data Output A. When SER/PAR SEL = 0, this pin acts as a three-state parallel digital
output pin. When SER/PAR SEL = 1 and SEL A = 1, this pin functions as DOUT A and outputs serial
conversion data.
6
5
DB9/DOUT B
Data Bit 9/Serial Data Output B. When SER/PAR SEL = 0, this pin acts as a three-state parallel digital
output pin. When SER/PAR SEL = 1 and SEL B = 1, this pin functions as DOUT B and outputs serial
conversion data. This configures the serial interface to have two DOUT output lines.
Data Bit 10/Serial Data Output C. When SER/PAR SEL = 0, this pin acts as a three-state parallel digital
output pin. When SER/PAR SEL = 1 and SEL C = 1, this pin functions as DOUT C and outputs serial
conversion data. This configures the serial interface to have three DOUT output lines.
Data Bit 11/Digital Ground. When SER/PAR SEL = 0, this pin acts as a three-state parallel digital
output pin. When SER/PAR SEL = 1, this pin should be tied to DGND.
DB10/DOUT C
4
DB11
3, 2, 64
DB12, DB13, DB15
Data Bit 12, Data Bit 13, Data Bit 15. When SER/PAR SEL = 0, these pins act as three-state parallel
digital input/output pins. When CS and RD are low, these pins are used to output the conversion
result. When CS and WR are low, these pins are used to write to the control register. When SER/PAR
SEL = 1, these pins should be tied to DGND. For the AD7657-1, DB15 contains a leading 0. For the
AD7658-1, DB15, DB13, and DB12 contain leading 0s.
1
Data Bit 14/Reference Buffer Enable and Disable. When SER/PAR SEL = 0, this pin acts as a three-
state digital input/output pin. For the AD7657-1 and AD7658-1, DB14 contains a leading 0. When
SER/PAR SEL = 1, this pin can be used to enable or disable the internal reference buffers.
DB14/REFBUFEN
/DIS
28
RESET
Reset Input. When set to logic high, this pin resets the AD7656-1/AD7657-1/AD7658-1. In software
mode, the current conversion is aborted and the internal register is set to all 0s. In hardware mode, the
AD7656-1/AD7657-1/AD7658-1 are configured depending on the logic levels on the hardware select
pins. In all modes, the parts should receive a RESET pulse after power-up. The RESET high pulse should
be typically 100 ns wide. After the RESET pulse, the AD7656-1/AD7657-1/AD7658-1 need to see a valid
CONVST pulse to initiate a conversion; this should consist of a high-to-low CONVST edge followed by a
low-to-high CONVST edge. The CONVST signal should be high during the RESET pulse. In hardware
mode, the user can initiate a RESET pulse between conversion cycles, that is, a 100 ns RESET pulse can
be applied to the device after BUSY has transitioned from high to low and the data has been read. The
RESET can then be used prior to the next CONVST pulse. Ensure that in such a case RESET is logic low
prior to the next CONVST pulse.
27
RANGE
Analog Input Range Selection. Logic input. The logic level on this pin determines the input range of
the analog input channels. When this pin is Logic 1 at the falling edge of BUSY, the range for the
next conversion is 2 ꢀ VREF. When this pin is Logic 0 at the falling edge of BUSY, the range for the
next conversion is 4 ꢀ VREF. In hardware select mode, the RANGE pin is checked on the falling edge
of BUSY. In software mode (H/S SEL = 1), the RANGE pin can be tied to DGND, and the input range is
determined by the RNGA, RNGB, and RNGC bits in the control register.
31
30
24
VDD
VSS
STBY
Positive Power Supply Voltage. This is the positive supply voltage for the analog input section.
Negative Power Supply Voltage. This is the negative supply voltage for the analog input section.
Standby Mode Input. This pin is used to put all six on-chip ADCs into standby mode. The STBY pin is
high for normal operation and low for standby operation.
62
H/S SEL
W/B
Hardware/Software Select Input. Logic input. When H/S SEL = 0, the AD7656-1/AD7657-1/AD7658-1
operate in hardware select mode, and the ADC pairs to be simultaneously sampled are selected
by the CONVST pins. When H/S SEL = 1, the ADC pairs to be sampled simultaneously are selected by
writing to the control register. When the serial interface is selected, CONVST A is used to initiate
conversions on the selected ADC pairs.
Word/Byte Input. When this pin is logic low, data can be transferred to and from the AD7656-1/
AD7657-1/AD7658-1 using the parallel data lines DB[15:0]. When this pin is logic high and the parallel
interface is selected, byte mode is enabled. In this mode, data is transferred using Data Lines DB[15:8],
and DB[7] function as HBEN. To obtain the 16-bit conversion result, 2-byte reads are required. When
the serial interface is selected, this pin should be tied to DGND.
29
Rev. 0 | Page 13 of 32
AD7656-1/AD7657-1/AD7658-1
TYPICAL PERFORMANCE CHARACTERISTICS
2.0
1.5
0
V
/V = ±12V
T = –40°C
A
= 5V DNL WCP = 0.61LSB
V
/V = ±15V
DD SS
DD SS
AV /DV /V
fSAMPLE = 250kSPS
2 × V
REF
AV /DV /V
= 5V
CC
CC DRIVE
CC
CC DRIVE
–20
–40
DNL WCN = –0.82LSB
±10V RANGE
INTERNAL REFERENCE
RANGE
T
= 25°C
1.0
fSAAMPLE = 250kSPS
fIN = 10kHz
–60
0.5
SNR = 88.44dB
SINAD = 88.43dB
THD = –111.66dB
–80
0
–100
–120
–140
–160
–180
–0.5
–1.0
–1.5
–2.0
0
10k
20k
30k
CODE
40k
50k
60k 65535
0
20
40
60
80
100
120
FREQUENCY (kHz)
Figure 4. AD7656-1 FFT for 5 ꢀ ꢁange ꢂꢀDD/ꢀSS
= 15 ꢀ)
Figure 7. AD7656-1 Typical DNL
0
2.0
1.6
V
/V = ±12V
V
/V = ±12V
DD SS
DD SS
AV /DV /V
fSAMPLE = 250kSPS
±5V RANGE
= 5V
AV /DV /V
±5V RANGE
INTERNAL REFERENCE
= 5V
CC
CC DRIVE
CC
CC DRIVE
–20
–40
1.2
T
= 25°C
fSAAMPLE = 250kSPS
fIN = 10kHz
0.8
–60
SNR = 88.25dB
SINAD = 88.24dB
THD = –112.46dB
0.4
–80
0
–100
–120
–140
–160
–180
–0.4
–0.8
–1.2
–1.6
–2.0
0
2000 4000 6000 8000 10000 12000 14000 16000
CODE
0
20
40
60
80
100
120
FREQUENCY (kHz)
Figure 5. AD7656-1 FFT for 5 ꢀ ꢁange ꢂꢀDD/ꢀSS
= 12 ꢀ)
Figure 8. AD7657-1 Typical INL
2.0
1.5
2.0
1.5
V
/V = ±12V
T = –40°C
A
= 5V INL WCP = 0.97LSB
V
/V = ±12V
DD SS
DD SS
AV /DV /V
fSAMPLE = 250kSPS
2 × V
REF
AV /DV /V
fSAMPLE = 250kSPS
±5V RANGE
= 5V
CC
CC DRIVE
CC
CC DRIVE
INL WCN = –0.72LSB
RANGE
1.0
1.0
0.5
0.5
0
0
–0.5
–1.0
–1.5
–2.0
–0.5
–1.0
–1.5
–2.0
0
2000 4000 6000 8000 10000 12000 14000 16000
ADC CODE
0
10k
20k
30k
CODE
40k
50k
60k 65535
Figure 6. AD7656-1 Typical INL
Figure 9. AD7657-1 Typical DNL
Rev. 0 | Page 14 of 32
AD7656-1/AD7657-1/AD7658-1
1.0
0.8
–80
–85
V
/V = ±12V
DD SS
fSAMPLE = 250kSPS
A
INTERNAL REFERENCE
AV /DV /V
fSAMPLE = 250kSPS
±5V RANGE
= 5V
CC
CC DRIVE
T
= 25°C
0.6
–90
0.4
0.2
–95
0
±10V RANGE
/V = ±12V
V
DD SS
–100
–105
–110
–115
–0.2
–0.4
–0.6
–0.8
–1.0
AV /DV /V
= 5V
CC CC DRIVE
±5V RANGE
/V = ±12V
V
DD SS
AV /DV /V
= 5V
CC CC DRIVE
0
500
1000 1500 2000 2500 3000 3500 4000
CODE
10
100
ANALOG INPUT FREQUENCY (kHz)
Figure 10. AD7658-1 Typical INL
Figure 13. AD7656-1 THD vs. Analog Input Frequency
1.0
0.8
–80
–90
V
/V = ±12V
DD SS
V
/V = ±16.5V
DD SS
AV /DV /V
fSAMPLE = 250kSPS
±5V RANGE
= 5V
AV /DV /V
= 5.25V
CC
CC DRIVE
CC
CC DRIVE
T
= 25°C
R
= 1000Ω
A
SOURCE
INTERNAL REFERENCE
±4 × V RANGE
0.6
REF
0.4
0.2
R
= 220Ω
SOURCE
0
–100
–110
–120
R
= 50Ω
SOURCE
–0.2
–0.4
–0.6
–0.8
–1.0
R
= 100Ω
SOURCE
R
= 10Ω
SOURCE
0
500
1000 1500 2000 2500 3000 3500 4000
CODE
10
100
ANALOG INPUT FREQUENCY (kHz)
Figure 11. AD7658-1 Typical DNL
Figure 14. AD7656-1 THD vs. Analog Input Frequency for ꢀarious Source
Impedances, 4 × ꢀꢁEF ꢁange
90
89
88
87
86
85
84
83
–80
V
/V = ±12V
fSAMPLE = 250kSPS
= 25°C
INTERNAL REFERENCE
DD SS
AV /DV /V
= 5V
T
CC
CC DRIVE
A
T
= 25°C
±10V RANGE
/V = ±12V
–85
–90
A
INTERNAL REFERENCE
±2 × V
V
DD SS
RANGE
AV /DV /V
= 5V
REF
CC CC DRIVE
R
= 1000Ω
–95
±5V RANGE
SOURCE
V
/V = ±12V
DD SS
AV /DV /V
= 5V
CC CC DRIVE
–100
–105
–110
–115
R
= 220Ω
R
= 100Ω
SOURCE
SOURCE
R
= 50Ω
SOURCE
R
= 10Ω
SOURCE
10
100
10
100
ANALOG INPUT FREQUENCY (kHz)
ANALOG INPUT FREQUENCY (kHz)
Figure 12. AD7656-1 SINAD vs. Analog Input Frequency
Figure 15. AD7656-1 THD vs. Analog Input Frequency for ꢀarious Source
Impedances, 2 × ꢀꢁEF ꢁange
Rev. 0 | Page 15 of 32
AD7656-1/AD7657-1/AD7658-1
2.510
100
90
80
70
60
50
40
f
= 250kSPS
RANGE
AV /DV /V
CC CC DRIVE
= 5V
SAMPLE
±2 × V
V
/V = ±12V
REF
DD SS
2.508
2.506
2.504
2.502
2.500
2.498
2.496
2.494
2.492
INTERNAL REFERENCE
T
= 25°C
= 10kHz
A
f
IN
100nF ON V AND V
DD
SS
V
SS
V
DD
–55
–35
–15
5
25
45
65
85
105
125
30
80
130 180 230 280 330 380 430 480 530
SUPPLY RIPPLE FREQUENCY (kHz)
TEMPERATURE (°C)
Figure 16. ꢁeference ꢀoltage vs. Temperature
Figure 19. PSꢁꢁ vs. Supply ꢁipple Frequency
3.20
3.15
3.10
3.05
3.00
2.95
2.90
2.85
2.80
2.75
2.70
90
89
88
87
86
85
AV /DV /V
CC CC DRIVE
= 5V
V
/V = ±12V
DD SS
±10V RANGE
AV /DV /V
= 5.25V
CC CC DRIVE
/V = ±16.5V
DD SS
V
±5V RANGE
AV /DV /V
= 5V
CC CC DRIVE
V
/V = ±12V
DD SS
fSAMPLE = 250kSPS
fIN = 10kHz
INTERNAL REFERENCE
–55
–35
–15
5
25
45
65
85
105
125
–40
–20
0
20
40
60
80
100
120
140
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 17. Conversion Time vs. Temperature
Figure 20. AD7656-1 SNꢁ vs. Temperature
3500
3000
2500
2000
1500
1000
500
–90
–95
fSAMPLE = 250kSPS
fIN = 10kHz
3212
V
/V = ±15V
DD SS
INTERNAL REFERENCE
AV /DV /V
INTERNAL REFERENCE
8192 SAMPLES
= 5V
CC CC DRIVE
2806
–100
–105
–110
–115
–120
±5V RANGE
AV /DV /V
= 5V
CC CC DRIVE
V
/V = ±12V
1532
DD SS
±10V RANGE
AV /DV /V
= 5.25V
CC CC DRIVE
392
–3
V
/V = ±16.5V
DD SS
168
25
57
–4
0
0
3
0
–5
–2
–1
0
1
2
–60 –40 –20
0
20
40
60
80
100 120
140
CODE
TEMPERATURE (°C)
Figure 18. AD7656-1 Histogram of Codes
Figure 21. AD7656-1 THD vs. Temperature
Rev. 0 | Page 16 of 32
AD7656-1/AD7657-1/AD7658-1
95
90
85
80
75
70
65
60
120
110
100
90
fSAMPLE = 250kSPS
REF
INTERNAL REFERENCE
80
±2 × V
RANGE
AV /DV /V
CC CC DRIVE
= 5V
V
/V = ±12V
DD SS
T
= 25°C
T
= 25°C
fIAN = 10kHz
A
70
INTERNAL REFERENCE
1µF ON AV SUPPLY PIN
±2 × V RANGE
CC
REF
30kHz ON SELECTED CHANNEL
±100mV SUPPLY RIPPLE AMPLITUDE
60
30
70
110
150
190
230
0
20 40 60 80
100
120
140
SUPPLY RIPPLE FREQUENCY (kHz)
FREQUENCY OF INPUT NOISE (kHz)
Figure 22. Channel-to-Channel Isolation vs. Frequency of Input Noise
Figure 24. PSꢁꢁ vs. Supply ꢁipple Frequency for AꢀCC Supply
22
±5V RANGE
±10V RANGE
20
18
16
14
12
10
AV /DV /V
= 5V
CC
CC DRIVE
= 250kSPS
f
SAMPLE
FOR ±5V RANGE V /V = ±12V
DD SS
FOR ±10V RANGE V /V = ±16.5V
DD SS
–40
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
Figure 23. Dynamic Current vs. Temperature
Rev. 0 | Page 17 of 32
AD7656-1/AD7657-1/AD7658-1
TERMINOLOGY
Total Harmonic Distortion (THD)
The ratio of the rms sum of the harmonics to the fundamental.
For the AD7656-1/AD7657-1/AD7658-1, it is defined as
Integral Nonlinearity (INL)
The maximum deviation from a straight line passing through
the endpoints of the ADC transfer function. The endpoints of
the transfer function are zero scale at a ½ LSB below the first code
transition and full scale at ½ LSB above the last code transition.
2
2
2
2
2
V2 +V3 +V4 +V5 +V6
THD(dB) = 20 log
V1
Differential Nonlinearity (DNL)
The difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
where:
V1 is the rms amplitude of the fundamental.
V2, V3, V4, V5, and V6 are the rms amplitudes of the second
Bipolar Zero Scale Error
The deviation of the midscale transition (all 1s to all 0s) from
the ideal VIN voltage, that is, AGND − 1 LSB.
through sixth harmonics.
Peak Harmonic or Spurious Noise
The ratio of the rms value of the next largest component in the
ADC output spectrum (up to fSAMPLE/2, excluding dc) to the rms
value of the fundamental. Normally, the value of this specification
is determined by the largest harmonic in the spectrum, but for
ADCs where the harmonics are buried in the noise floor, it is
determined by a noise peak.
Bipolar Zero Scale Error Matching
The difference in bipolar zero code error between any two input
channels.
Positive Full-Scale Error
The deviation of the last code transition (011 … 110 to 011 … 111)
from the ideal (+4 ꢀ VREF − 1 LSB, +2 ꢀ VREF − 1 LSB) after
adjusting for the bipolar zero scale error.
Intermodulation Distortion (IMD)
With inputs consisting of sine waves at two frequencies, fa and
fb, any active device with nonlinearities create distortion
products at the sum and difference frequencies of mfa nfb,
where m, n = 0, 1, 2, 3. Intermodulation distortion terms are
those for which neither m nor n are equal to 0. For example, the
second-order terms include (fa + fb) and (fa − fb), and the
third-order terms include (2fa + fb), (2fa − fb), (fa + 2fb), and
(fa − 2fb).
Positive Full-Scale Error Matching
The difference in positive full-scale error between any two input
channels.
Negative Full-Scale Error
The deviation of the first code transition (10 … 000 to 10 … 001)
from the ideal (−4 ꢀ VREF + 1 LSB, −2 ꢀ VREF + 1 LSB) after
adjusting for the bipolar zero scale error.
The AD7656-1/AD7657-1/AD7658-1 are tested using the CCIF
standard in which two input frequencies near the maximum
input bandwidth are used. In this case, the second-order terms
are usually distanced in frequency from the original sine waves,
and the third-order terms are usually at a frequency close to the
input frequencies. As a result, the second- and third-order terms
are specified separately. The calculation of the intermodulation
distortion is per the THD specification, where it is the ratio of
the rms sum of the individual distortion products to the rms
amplitude of the sum of the fundamentals and is expressed in
decibels.
Negative Full-Scale Error Matching
The difference in negative full-scale error between any two
input channels.
Track-and-Hold Acquisition Time
The track-and-hold amplifier returns to track mode at the end
of the conversion. The track-and-hold acquisition time is the
time required for the output of the track-and-hold amplifier to
reach its final value, within 1 LSB, after the end of the conversion.
See the Track-and-Hold section for more details.
Signal-to-(Noise + Distortion) Ratio
The measured ratio of signal-to-(noise + distortion) (SINAD) at
the output of the ADC. The signal is the rms amplitude of the
fundamental. Noise is the sum of all nonfundamental signals up
to half the sampling frequency (fSAMPLE/2, excluding dc).
Channel-to-Channel Isolation
Channel-to-channel isolation is a measure of the level of crosstalk
between any two channels. It is measured by applying a full-scale,
100 kHz sine wave signal to all unselected input channels and
determining the degree to which the signal attenuates in the
selected channel with a 30 kHz signal.
The ratio depends on the number of quantization levels in the
digitization process: the more levels, the smaller the quantization
noise. The theoretical SINAD ratio for an ideal N-bit converter
with a sine wave input is given by
Power Supply Rejection (PSR)
Variations in power supply affect the full-scale transition but
not the linearity of the converter. Power supply rejection is the
maximum change in full-scale transition point due to a change
in power supply voltage from the nominal value. See the Typical
Performance Characteristics section.
SINAD = (6.02 N + 1.76) dB
Therefore, SINAD is 98 dB for a 16-bit converter, 86.04 dB for a
14-bit converter, and 74 dB for a 12-bit converter.
Rev. 0 | Page 18 of 32
AD7656-1/AD7657-1/AD7658-1
Figure 19 shows the power supply rejection ratio vs. supply
ripple frequency for the AD7656-1/AD7657-1/AD7658-1. The
power supply rejection ratio is defined as the ratio of the power
in the ADC output at full-scale frequency, f, to the power of a
200 mV p-p sine wave applied to the ADC’s VDD and VSS
supplies at a frequency sampled, fSAMPLE
PSRR (dB) = 10 log(Pf/PfS)
where:
:
Pf is equal to the power at frequency f in the ADC output.
PfS is equal to the power at frequency fSAMPLE coupled onto the
VDD and VSS supplies.
Rev. 0 | Page 19 of 32
AD7656-1/AD7657-1/AD7658-1
THEORY OF OPERATION
CONVERTER DETAILS
Analog Input
The AD7656-1/AD7657-1/AD7658-1 can handle true bipolar
input voltages. The logic level on the RANGE pin or the value
written to the RNGx bits in the control register determines the
analog input range on the AD7656-1/AD7657-1/AD7658-1 for
the next conversion. When the RANGE pin or RNGx bits are 1,
The AD7656-1/AD7657-1/AD7658-1 are pin- and software-
compatible, reduced decoupling versions of the AD7656/AD7657/
AD7658 devices. In addition, the AD7656-1/AD7657-1/AD7658-1
are high speed, low power converters that allow the simultaneous
sampling of six on-chip ADCs. The analog inputs on the AD7656-1/
AD7657-1/AD7658-1 can accept true bipolar input signals. The
RANGE pin or RNGx bits are used to select either 4 ꢀ VREF or
2 ꢀ VREF as the input range for the next conversion.
the analog input range for the next conversion is 2 ꢀ VREF
When the RANGE pin or RNGx bits are 0, the analog input
range for the next conversion is 4 ꢀ VREF
.
.
V
DD
Each AD7656-1/AD7657-1/AD7658-1 contains six SAR ADCs, six
track-and-hold amplifiers, an on-chip 2.5 V reference, reference
buffers, and high speed parallel and serial interfaces. The parts
allow the simultaneous sampling of all six ADCs when the three
CONVST pins (CONVST A, CONVST B, and CONVST C) are
tied together. Alternatively, the six ADCs can be grouped into
three pairs. Each pair has an associated CONVST signal used to
initiate simultaneous sampling on each ADC pair, on four ADCs,
or on all six ADCs. CONVST A is used to initiate simultaneous
sampling on V1 and V2, CONVST B is used to initiate simul-
taneous sampling on V3 and V4, and CONVST C is used to
initiate simultaneous sampling on V5 and V6.
D1
C2
R1
V1
C1
D2
V
SS
Figure 25. Equivalent Analog Input Structure
Figure 25 shows an equivalent circuit of the analog input
structure of the AD7656-1/AD7657-1/AD7658-1. The two
diodes, D1 and D2, provide ESD protection for the analog
inputs. Care must be taken to ensure that the analog input
signal never exceeds the VDD and VSS supply rails by more than
300 mV. Signals exceeding this value cause these diodes to
become forward-biased and to start conducting current into the
substrate. The maximum current these diodes can conduct
without causing irreversible damage to the parts is 10 mA.
Capacitor C1 in Figure 25 is typically about 4 pF and can be
attributed primarily to pin capacitance. Resistor R1 is a lumped
component made up of the on resistance of a switch (that is, a
track-and-hold switch). This resistor is typically about 3.5 kΩ.
Capacitor C2 is the ADC sampling capacitor and has a
capacitance of 10 pF typically.
A conversion is initiated on the AD7656-1/AD7657-1/AD7658-1
by pulsing the CONVST input. On the rising edge of CONVST,
the track-and-hold amplifier of the selected ADC pair is placed
into hold mode and the conversions are started. After the rising
edge of CONVST, the BUSY signal goes high to indicate that the
conversion is taking place. The conversion clock for the AD7656-1/
AD7657-1/AD7658-1 is internally generated, and the conversion
time for the parts is 3 μs. The BUSY signal returns low to indicate
the end of a conversion. On the falling edge of BUSY, the track-
and-hold amplifier returns to track mode. Data can be read from
the output register via the parallel or serial interface.
The AD7656-1/AD7657-1/AD7658-1 require VDD and VSS dual
supplies for the high voltage analog input structures. These supplies
must be equal to or greater than the analog input range (see Table 8
for the requirements on these supplies for each analog input range).
The AD7656-1/AD7657-1/AD7658-1 require a low voltage AVCC
supply of 4.75 V to 5.25 V to power the ADC core, a DVCC supply
of 4.75 V to 5.25 V for the digital power, and a VDRIVE supply of
2.7 V to 5.25 V for the interface power.
Track-and-Hold Amplifiers
The track-and-hold amplifiers on the AD7656-1/AD7657-1/
AD7658-1 allow the ADCs to accurately convert an input
sine wave of full-scale amplitude to 16-/14-/12-bit resolution,
respectively. The input bandwidth of the track-and-hold amplifiers
is greater than the Nyquist rate of the ADC, even when the
AD7656-1/AD7657-1/AD7658-1 are operating at the maximum
throughput rate. The parts can handle input frequencies of up
to 4.5 MHz.
To meet the specified performance when using the minimum
supply voltage for the selected analog input range, it may be
necessary to reduce the throughput rate from the maximum
throughput rate.
The track-and-hold amplifiers sample their respective inputs
simultaneously on the rising edge of CONVST. The aperture time
(that is, the delay time between the external CONVST signal
actually going into hold) for the track-and-hold amplifier is 10 ns.
This is well matched across all six track-and-hold amplifiers on one
device and from device to device. This allows more than six ADCs
to be sampled simultaneously. The end of the conversion is signaled
by the falling edge of BUSY, and it is at this point that the track-
and-hold amplifiers return to track mode and the acquisition
time begins.
Table 8. Minimum VDD/VSS Supply Voltage Requirements
Analog Input
Range (V)
Reference
Voltage (V)
Full-Scale
Input (V)
Minimum
VDD/VSS (V)
4 ꢀ VREF
2 ꢀ VREF
2.5
2.5
10
5
10
5
Rev. 0 | Page 20 of 32
AD7656-1/AD7657-1/AD7658-1
the control register to set DB9 of the register to 1. For the internal
reference mode, the REFIN/REFOUT pin should be decoupled
using a 1 μF capacitor.
ADC TRANSFER FUNCTION
The output coding of the AD7656-1/AD7657-1/AD7658-1 is
twos complement. The designed code transitions occur midway
between successive integer LSB values, that is, 1/2 LSB, 3/2 LSB.
The LSB size is FSR/65,536 for the AD7656-1, FSR/16,384 for
the AD7657-1, and FSR/4096 for the AD7658-1. The ideal
transfer characteristic is shown in Figure 26.
The AD7656-1/AD7657-1/AD7658-1 each contain three on-
chip reference buffers. Each of the three ADC pairs has an
associated reference buffer. These reference buffers require
external decoupling capacitors, using 1 μF capacitors, on the
REFCAPA, REFCAPB, and REFCAPC pins. The internal
reference buffers can be disabled in software mode by writing
to Bit DB8 in the internal control register. If serial interface is
selected, the internal reference buffers can be disabled in hardware
011 ... 111
011 ... 110
000 ... 001
000 ... 000
111 ... 111
EN
mode by setting the DB14/REFBUF /DIS pin high. If the internal
reference and its buffers are disabled, an external buffered
reference should be applied to the REFCAPx pins.
100 ... 010
100 ... 001
100 ... 000
AGND – 1LSB
TYPICAL CONNECTION DIAGRAM
Figure 27 shows the typical connection diagram for the AD7656-1/
AD7657-1/AD7658-1, illustrating the reduction in the number
and value of decoupling capacitors required. There are eight
AVCC supply pins on each part. The AVCC supplies are the supplies
used for the AD7656-1/AD7657-1/AD7658-1 conversion process;
therefore, they should be well decoupled. The AVCC supply which
is applied to eight AVCC pins can be decoupled using just one 1 μF
capacitor The AD7656-1/AD7657-1/AD7658-1 can operate with
the internal reference or an externally applied reference. In this
configuration, the parts are configured to operate with the
external reference. The REFIN/REFOUT pin is decoupled with
a 1 μF capacitor. The three internal reference buffers are enabled.
Each of the REFCAPx pins is decoupled with a 1 μF capacitor.
–FSR/2 + 1/2LSB
+FSR/2 – 3/2LSB
ANALOG INPUT
Figure 26. AD7656-1/AD7657-1/AD7658-1 Transfer Characteristic
The LSB size is dependent on the analog input range selected
(see Table 9).
INTERNAL/EXTERNAL REFERENCE
The REFIN/REFOUT pin allows access to the 2.5 V reference of
the AD7656-1/AD7657-1/AD7658-1, or it allows an external
reference to be connected to provide the reference source for
conversions.
The AD7656-1/AD7657-1/AD7658-1 can each accommodate a
2.5 V external reference range. When using an external reference,
the internal reference must be disabled. After a reset, the AD7656-1/
AD7657-1/AD7658-1 default to operating in external reference
mode with the internal reference buffers enabled.
If the same supply is being used for the AVCC and DVCC supplies, a
ferrite or small RC filter should be placed between the supply pins.
AGND pins are connected to the AGND plane of the system.
The DGND pins are connected to the digital ground plane in
the system. The AGND and DGND planes should be connected
together at one place in the system. This connection should be
as close as possible to the AD7656-1/AD7657-1/AD7658-1 in
the system.
The internal reference can be enabled in either hardware or
software mode. To enable the internal reference in hardware mode,
set the /S SEL pin to 0 and the REFEN/DIS pin to 1. To enable the
H
H
internal reference in software mode, set /S SEL to 1 and write to
Table 9. LSB Size for Each Analog Input Range
Input Range for AD7656-1
Input Range for AD7657-1
Input Range for AD7658-1
Parameter
LSB Size
FS Range
10 V
5 V
10 V
5 V
10 V
5 V
0.305 mV
20 V/65,536
0.152 mV
10 V/65,536
1.22 mV
20 V/16,384
0.610 mV
10 V/16,384
4.88 mV
20 V/4096
2.44 mV
10 V/4096
Rev. 0 | Page 21 of 32
AD7656-1/AD7657-1/AD7658-1
DV
CC
+
DIGITAL SUPPLY
VOLTAGE +3V OR +5V
ANALOG SUPPLY
VOLTAGE 5V
+
+
1µF
1µF
1µF
AGND AV
DD
DV
DGND
V DGND
DRIVE
CC
CC
+9.5V TO +16.5V
SUPPLY
V
+
+
+
1µF
1µF
1µF
PARALLEL
INTERFACE
D0 TO D15
AGND
µP/µC/DSP
RESET
CS
RD
REFCAPA, B, C
AGND
AD7656-1/
AD7657-1/
AD7658-1
BUSY
2.5V
REF
REFIN/OUT
AGND
SCHMITT 1
TRIGGER
CONVST A, B, C
SER/PAR
H/S
SIX ANALOG
INPUTS
W/B
RANGE
–9.5V TO –16.5V
SUPPLY
V
SS
1µF
+
AGND
V
STBY
DRIVE
1 See Applications Hints Section
Figure 27. Typical Connection Diagram
The VDRIVE supply is connected to the same supply as the
processor. The voltage on VDRIVE controls the voltage value of
the output logic signals.
Parallel Interface (SER/
SEL = 0)
PAR
The AD7656-1/AD7657-1/AD7658-1 consist of six 16-/14-/
12-bit ADCs, respectively. A simultaneous sample of all six
ADCs can be performed by connecting all three CONVST pins
(CONVST A, CONVST B, and CONVST C) together. The
AD7656-1/AD7657-1/AD7658-1 need to see a CONVST pulse
to initiate a conversion; this should consist of a falling CONVST
edge followed by a rising CONVST edge. The rising edge of
CONVST initiates simultaneous conversions on the selected
ADCs. The AD7656-1/AD7657-1/AD7658-1 each contain an
on-chip oscillator that is used to perform the conversions. The
conversion time, tCONV, is 3 μs. The BUSY signal goes low to
indicate the end of a conversion. The falling edge of the BUSY
signal is used to place the track-and-hold amplifier into track mode.
The VDD and VSS signals should be decoupled with a minimum 1 μF
decoupling capacitor. These supplies are used for the high voltage
analog input structures on the AD7656-1/AD7657-1/AD7658-1
analog inputs.
DRIVING THE ANALOG INPUTS
Together, the driver amplifier and the analog input circuit used
for the AD7656-1 must settle for a full-scale step input to a 16-bit
level (0.0015%), which is within the specified 550 ns acquisition
time of the AD7656-1. The noise generated by the driver
amplifier needs to be kept as low as possible to preserve the
SNR and transition noise performance of the AD7656-1. In
addition, the driver also needs to have a THD performance
suitable for the AD7656-1.
The AD7656-1/AD7657-1/AD7658-1 also allow the six ADCs
to be converted simultaneously in pairs by pulsing the three
CONVST pins independently. CONVST A is used to initiate
simultaneous conversions on V1 and V2, CONVST B is used to
initiate simultaneous conversions on V3 and V4, and CONVST C
is used to initiate simultaneous conversions on V5 and V6. The
conversion results from the simultaneously sampled ADCs are
stored in the output data registers.
The AD8021 meets these requirements. The AD8021 needs an
external compensation capacitor of 10 pF. If a dual version of
the AD8021 is required, the AD8022 can be used. The AD8610
and the AD797 can also be used to drive the AD7656-1/AD7657-1/
AD7658-1.
INTERFACE OPTIONS
Data can be read from the AD7656-1/AD7657-1/AD7658-1 via
CS
RD W
The AD7656-1/AD7657-1/AD7658-1 provide two interface
options: a high speed parallel interface and a high speed serial
interface. The required interface mode is selected via the
the parallel data bus with standard
and
signals ( /B = 0).
PAR
To read the data over the parallel bus, SER/
SEL should be
CS
RD
input signals are internally gated to
tied low. The
and
PAR
SER/
SEL pin. The parallel interface can operate in word
enable the conversion result onto the data bus. The data lines
CS
W
W
/B = 0) or byte ( /B = 1) mode. When in serial mode, the
(
DB0 to DB15 leave their high impedance state when both
RD
AD7656-1/AD7657-1/AD7658-1 can be configured into daisy-
chain mode.
and
are logic low.
Rev. 0 | Page 22 of 32
AD7656-1/AD7657-1/AD7658-1
CS
RD
signal
may affect the performance of the conversion. For the specified
performance, it is recommended to perform the read after the
conversion. For unused input channel pairs, the associated
The
signal can be permanently tied low, and the
can be used to access the conversion results. A read operation
can take place after the BUSY signal goes low. The number of
required read operations depends on the number of ADCs that
are simultaneously sampled (see Figure 28). If CONVST A
and CONVST B are simultaneously brought low, four read
operations are required to obtain the conversion results from
V1, V2, V3, and V4. If CONVST A and CONVST C are
simultaneously brought low, four read operations are required
to obtain the conversion results from V1, V2, V5, and V6.
The conversion results are output in ascending order. For
the AD7657-1, DB15 and DB14 contain two leading 0s, and
DB[13:0] output the 14-bit conversion result. For the AD7658-1,
DB[15:12] contain four leading 0s, and DB[11:0] output the
12-bit conversion result.
CONVST pin should be tied to VDRIVE
.
If there is only an 8-bit bus available, the AD7656-1/AD7657-1/
AD7658-1 parallel interface can be configured to operate in byte
W
mode ( /B = 1). In this configuration, the DB7/HBEN/DCEN
pin takes on its HBEN function. Each channel conversion result
from the AD7656-1/AD7657-1/AD7658-1 can be accessed in
two read operations, with eight bits of data provided on DB15
to DB8 for each of the read operations (see Figure 29). The
HBEN pin determines whether the read operation first accesses
the high byte or the low byte of the 16-bit conversion result. To
always access the low byte first on DB15 to DB8, the HBEN pin
should be tied low. To always access the high byte first on DB15
to DB8, the HBEN pin should be tied high. In byte mode when
all three CONVST pins are pulsed together to initiate simultaneous
conversions on all six ADCs, 12 read operations are necessary
to read back the six 16-/14-/12-bit conversion results. DB[6:0]
should be left unconnected in byte mode.
When using the three CONVST signals to independently
initiate conversions on the three ADC pairs, care should be
taken to ensure that a conversion is not initiated on a channel
pair when the BUSY signal is high. It is also recommended not
to initiate a conversion during a read sequence because doing so
t10
CONVST A,
CONVST B,
CONVST C
tCONV
tACQ
BUSY
t4
CS
t3
t2
t5
t9
RD
t7
t6
t8
tQUIET
DATA
V1
V2
V3
V4
V5
V6
W
Figure 28. Parallel Interface Timing Diagram ꢂ /B = 0)
CS
t4
t3
t9
t5
RD
t8
t7
t6
LOW BYTE
HIGH BYTE
DB15 TO DB8
W
Figure 29. Parallel Interface—ꢁead Cycle for Byte Mode of Operation. ꢂ /B = 1, HBEN = 0)
Rev. 0 | Page 23 of 32
AD7656-1/AD7657-1/AD7658-1
Software Selection of ADCs
Table 11. Control Register Bit Function Descriptions
H
Bit
Mnemonic
Description
The /S SEL pin determines the source of the combination of ADCs
DB15 VC
DB14 VB
DB13 VA
DB12 RNGC
This bit is used to select the V5 and V6
analog inputs for the next conversion.
When this bit is set to 1, V5 and V6 are
simultaneously converted on the next
CONVST A rising edge.
H
that are to be simultaneously sampled. When the /S SEL pin
is logic low, the combination of channels to be simultaneously
sampled is determined by the CONVST A, CONVST B, and
CONVST C pins. When the /S SEL pin is logic high, the
combination of channels selected for simultaneous sampling
is determined by the contents of the DB15 to DB13 control
registers. In this mode, a write to the control register is necessary.
H
This bit is used to select the V3 and V4
analog inputs for the next conversion.
When this bit is set to 1, V3 and V4 are
simultaneously converted on the next
CONVST A rising edge.
The control register is an 8-bit write-only register. Data is written
CS
WR
to this register using the
and
pins and the DB[15:8] data
This bit is used to select the V1 and V2
analog inputs for the next conversion.
When this bit is set to 1, V1 and V2 are
simultaneously converted on the next
CONVST A rising edge.
pins (see Figure 30). The control register is detailed in Table 10
and Table 11. To select an ADC pair to be simultaneously sampled,
set the corresponding data line high during the write operation.
CS
This bit is used to select the analog input
range for the V5 and V6 analog inputs.
When this bit is set to 1, the 2 ꢀ VREF range
is selected for the next conversion. When
this bit is set to 0, the 4 ꢀ VREF range is
selected for the next conversion.
WR
t13
t12
t11
t15
t14
DATA
DB11 RNGB
DB10 RNGA
This bit is used to select the analog input
range for the V3 and V4 analog inputs.
When this bit is set to 1, the 2 ꢀ VREF range
is selected for the next conversion. When
this bit is set to 0, the 4 ꢀ VREF range is
selected for the next conversion.
DB15 TO DB8
W
Figure 30. Parallel Interface—Write Cycle for Word Mode ꢂ /B = 0)
The AD7656-1/AD7657-1/AD7658-1 control register allows
individual ranges to be programmed on each ADC pair. DB12
to DB10 in the control register are used to program the range
on each ADC pair.
This bit is used to select the analog input
range for the V1 and V2 analog inputs.
When this bit is set to 1, the 2 ꢀ VREF range
is selected for the next conversion. When
this bit is set to 0, the 4 ꢀ VREF range is
selected for the next conversion.
After a reset occurs on the AD7656-1/AD7657-1/AD7658-1,
the control register contains all 0s.
The CONVST A signal is used to initiate a simultaneous
conversion on the combination of channels selected via the
control register. The CONVST B and CONVST C signals can be
DB9
DB8
REFEN
This bit is used to select the internal
reference or an external reference. When
this bit is set to 0, the external reference
mode is selected. When this bit is set to 1,
the internal reference is selected.
H
tied low when operating in software mode ( /S SEL = 1). The
number of read pulses required depends on the number of
ADCs selected in the control register and on whether the
devices are operating in word or byte mode. The conversion
results are output in ascending order.
REFBUF
This bit is used to select between using the
internal reference buffers and choosing
to bypass these reference buffers. When
this bit is set to 0, the internal reference
buffers are enabled and decoupling is
required on the REFCAPx pins. When this
bit is set to 1, the internal reference buffers
are disabled and a buffered reference
should be applied to the REFCAPx pins.
During the write operation, Data Bus Bit DB15 to Data Bus Bit DB8
are bidirectional and become inputs to the control register when
RD
CS
WR
is logic high and
on DB15 through DB8 is latched into the control register when
WR
and
are logic low. The logic state
goes logic high.
Table 10. Control Register Bit Map1
DB15 DB14 DB13 DB12 DB11 DB10 DB9
DB8
VC
VB
VA
RNGC RNGB RNGA REFEN REFBUF
1 Default All 0s.
Rev. 0 | Page 24 of 32
AD7656-1/AD7657-1/AD7658-1
If it is required to clock conversion data out on two data output
lines, DOUT A and DOUT B should be used. To enable DOUT A
and DOUT B, DB0/SEL A and DB1/SEL B should be tied to VDRIVE
H
Changing the Analog Input Range ( /S SEL = 0)
The AD7656-1/AD7657-1/AD7658-1 RANGE pin allows the
user to select either 2 ꢀ VREF or 4 ꢀ VREF as the analog input
,
and DB2/SEL C should be tied low. When six simultaneous
conversions are performed and only two DOUT lines are used,
a 48 SCLK transfer can be used to access the data from the
AD7656-1/AD7657-1/AD7658-1. The read sequence is shown
in Figure 32 for a simultaneous conversion on all six ADCs
using two DOUT lines. If a simultaneous conversion occurred
on all six ADCs, and only two DOUT lines are used to read the
results from the AD7656-1/AD7657-1/AD7658-1. DOUT A
clocks out the result from V1, V2, and V5, whereas DOUT B
clocks out the results from V3, V4, and V6.
H
range for the six analog inputs. When the /S SEL pin is low,
the logic state of the RANGE pin is sampled on the falling edge of
the BUSY signal to determine the range for the next simultaneous
conversion. When the RANGE pin is logic high at the falling
edge of the BUSY signal, the range for the next conversion is
2 ꢀ VREF. When the RANGE pin is logic low at the falling
edge of the BUSY signal, the range for the next conversion is
4 ꢀ VREF. After a RESET pulse, the range is updated on the first
falling BUSY edge.
H
Changing the Analog Input Range ( /S SEL = 1)
Data can also be clocked out using just one DOUT line, in which
case DOUT A should be used to access the conversion data. To
configure the AD7656-1/AD7657-1/AD7658-1 to operate in
this mode, DB0/SEL A should be tied to VDRIVE, and DB1/SEL B
and DB2/SEL C should be tied low. The disadvantage of using
only one DOUT line is that the throughput rate is reduced. Data
can be accessed from the AD7656-1/AD7657-1/AD7658-1 using
one 96 SCLK transfer, three 32-SCLK individually framed transfers,
or six 16-SCLK individually framed transfers. When using the
H
When the /S SEL pin is high, the range can be changed by
writing to the control register. DB[12:10] in the control register
are used to select the analog input ranges for the next conversion.
Each analog input pair has an associated range bit, allowing
independent ranges to be programmed on each ADC pair.
When the RNGx bit is set to 1, the range for the next conversion
is 2 ꢀ VREF. When the RNGx bit is set to 0, the range for the next
conversion is 4 ꢀ VREF
.
RD
serial interface, the
signal should be tied low and the unused
Serial Interface (SER/
SEL = 1)
PAR
DOUT line(s) should be left unconnected.
By pulsing one, two, or all three CONVST signals, the AD7656-1/
AD7657-1/AD7658-1 use their on-chip trimmed oscillator to
simultaneously convert the selected channel pairs on the rising
edge of CONVST. After the rising edge of CONVST, the BUSY
signal goes high to indicate that the conversion has started. It
returns low when the conversion is complete, 3 μs later. The
output register is loaded with the new conversion results, and
data can be read from the AD7656-1/AD7657-1/AD7658-1.
To read the data back from the parts over the serial interface,
Serial Read Operation
Figure 33 shows the timing diagram for reading data from the
AD7656-1/AD7657-1/AD7658-1 when the serial interface is
selected. The SCLK input signal provides the clock source for
CS
the serial interface. The
signal goes low to access data from
CS
the AD7656-1/AD7657-1/AD7658-1. The falling edge of
takes the bus out of three-state and clocks out the MSB of the
16-bit conversion result. The ADCs output 16 bits for each
conversion result; the data stream of the AD7656-1 consists of
16 bits of conversion data, provided MSB first. The data stream
for the AD7657-1 consists of two leading 0s followed by 14 bits
of conversion data, provided MSB first. The data stream for the
AD7658-1 consists of four leading 0s and 12 bits of conversion
data, provided MSB first.
PAR
SER/
SEL should be tied high. The and SCLK signals are
CS
used to transfer data from the AD7656-1/AD7657-1/AD7658-1.
The parts have three DOUT pins: DOUT A, DOUT B, and
DOUT C. Data can be read back from each part using one, two,
or all three DOUT lines.
Figure 31 shows six simultaneous conversions and the read
sequence using three DOUT lines. Also in Figure 31, 32 SCLK
transfers are used to access data from the AD7656-1/AD7657-1/
AD7658-1; however, two 16-SCLK individually framed transfers
The first bit of the conversion result is valid on the first SCLK
CS
falling edge after the
falling edge. The subsequent 15 data
bits are clocked out on the rising edge of the SCLK signal. Data
is valid on the SCLK falling edge. To access each conversion result,
16 clock pulses must be provided to the AD7656-1/AD7657-1/
AD7658-1. Figure 33 shows how a 16-SCLK read is used to
access the conversion results.
CS
with the
signal can also be used to access the data on the
three DOUT lines. When the serial interface is selected and
conversion data is clocking out on all three DOUT lines,
DB0/SEL A, DB1/SEL B, and DB2/SEL C should be tied to
VDRIVE. These pins are used to enable the DOUT A to DOUT C
lines, respectively.
Rev. 0 | Page 25 of 32
AD7656-1/AD7657-1/AD7658-1
CONVST A,
CONVST B,
CONVST C
tCONV
tACQ
BUSY
CS
16
32
SCLK
tQUIET
DOUT A
V1
V3
V5
V2
V4
V6
DOUT B
DOUT C
Figure 31. Serial Interface with Three DOUT Lines
CS
48
SCLK
DOUT A
DOUT B
V5
V6
V1
V3
V2
V4
Figure 32. Serial Interface with Two DOUT Lines
t1
CONVST A,
t10
CONVST B,
tACQ
tCONV
CONVST C
t2
BUSY
ACQUISITION
CONVERSION
ACQUISITION
CS
tQUIET
t19
t18
SCLK
t16
t17
t20
DOUT A,
DOUT B,
DOUT C
t21
DB15
DB14
DB13
DB1
DB0
Figure 33. Serial ꢁead Operation
Rev. 0 | Page 26 of 32
AD7656-1/AD7657-1/AD7658-1
Figure 36 shows the timing if two AD7656-1/AD7657-1/AD7658-1
devices are configured in daisy-chain mode and are operating
with three DOUT lines. Assuming that a simultaneous sampling
PAR
Daisy-Chain Mode (DCEN = 1, SER/
SEL = 1)
When reading conversion data back from the AD7656-1/AD7657-1/
AD7658-1 using three/two/one DOUT pins, it is possible to
configure the parts to operate in daisy-chain mode by using the
DCEN pin. This daisy-chain feature allows multiple AD7656-1/
AD7657-1/AD7658-1 devices to be cascaded together and is
useful for reducing the component count and wiring connections.
An example connection of two devices is shown in Figure 34.
This configuration shows two DOUT lines being used for each
device. Simultaneous sampling of the 12 analog inputs is possible
by using a common CONVST signal. The DB5, DB4, and DB3
data pins are used as the DCIN[A:C] data input pins for the
daisy-chain mode.
CS
of all 12 inputs occurs, the
frames a 64 SCLK transfer during
the read operation. During the first 32 SCLKs of this transfer,
the conversion results from Device 1 are clocked into the digital
host and the conversion results from Device 2 are clocked into
Device 1. During the last 32 SCLKs of the transfer, the
conversion results from Device 2 are clocked out of Device 1
and into the digital host, and Device 2 clocks out 0s.
Standby/Partial Power-Down Modes of Operation
PAR
(SER/
SEL = 0 or 1)
Each ADC pair can be individually placed into partial power-
down mode by bringing the CONVST signal low before the
falling edge of BUSY. To power the ADC pair back up, the
CONVST signal should be brought high to tell the ADC pair to
power up and place the track-and-hold amplifier into track
mode. After the power-up time from partial power-down has
elapsed, the CONVST signal should receive a rising edge to
initiate a valid conversion. In partial power-down mode, the
reference buffers remain powered up. When an ADC pair is in
partial power-down mode, conversions can still occur on the
other ADCs.
The rising edge of CONVST is used to initiate a conversion on
the AD7656-1/AD7657-1/AD7658-1. After the BUSY signal has
gone low to indicate that the conversion is complete, the user can
begin to read the data from the two devices. Figure 35 shows the
serial timing diagram when operating two AD7656-1/AD7657-1/
AD7658-1 devices in daisy-chain mode.
CS
The
falling edge is used to frame the serial transfer from the
AD7656-1/AD7657-1/AD7658-1 devices, to take the bus out of
three-state, and to clock out the MSB of the first conversion
result. In the example shown in Figure 35, all 12 ADC channels
are simultaneously sampled. Two DOUT lines are used to read
The AD7656-1/AD7657-1/AD7658-1 have a standby mode
whereby the devices can be placed into a low power consumption
mode (25 μW maximum). The AD7656-1/AD7657-1/AD7658-1
CS
the conversion results in this example. frames a 96 SCLK
transfer. During the first 48 SCLKs, the conversion data is
transferred from Device 2 to Device 1. DOUT A on Device 2
transfers conversion data from V1, V2, and V5 into DCIN A in
Device 1; DOUT B on Device 2 transfers conversion results from
V3, V4, and V6 to DCIN B in Device 1. During the first 48 SCLKs,
Device 1 transfers data into the digital host. DOUT A on Device 1
transfers conversion data from V1, V2, and V5; DOUT B on
Device 1 transfers conversion data from V3, V4, and V6. During
the last 48 SCLKs, Device 2 clocks out 0s, and Device 1 shifts the
data clocked in from Device 2 during the first 48 SCLKs into
the digital host. This example can also be implemented using
six 16-SCLK individually framed transfers if DCEN remains
high during the transfers.
STBY
are placed into standby mode by bringing the logic input
low and can be powered up again for normal operation by bringing
STBY
logic high. The output data buffers are still operational
when the AD7656-1/AD7657-1/AD7658-1 are in standby
mode, meaning the user can continue to access the conversion
results of the parts. This standby feature can be used to reduce
the average power consumed by the AD7656-1/AD7657-1/
AD7658-1 when operating at lower throughput rates. The parts
can be placed into standby at the end of each conversion when
BUSY goes low and are taken out of standby mode prior to the
next conversion. The time for the AD7656-1/AD7657-1/
AD7658-1 to come out of standby is called the wake-up time.
The wake-up time limits the maximum throughput rate at which
the AD7656-1/AD7657-1/AD7658-1 can operate when powering
down between conversions. See the Specifications section.
Rev. 0 | Page 27 of 32
AD7656-1/AD7657-1/AD7658-1
CONVERT
DIGITAL HOST
CONVST
CONVST
DCIN A
DCIN B
DOUT A
DATA IN1
DATA IN2
DOUT A
AD7656-1/
AD7656-1/
AD7657-1/
AD7657-1/ DOUT B
AD7658-1
DOUT B
AD7658-1
SCLK
CS
SCLK
CS
CS
SCLK
DCEN = 0
DEVICE 2
DCEN = 1
DEVICE 1
Figure 34. Daisy-Chain Configuration
CONVST A,
CONVST B,
CONVST C
BUSY
CS
1
2
3
15
16
17
31
32
33
47
48
49
63
64
65
94
95
96
SCLK
DEVICE 1, DOUT A
DEVICE 1, DOUT B
DEVICE 2, DOUT A
DEVICE 2, DOUT B
MSB V1
MSB V3
MSB V1
MSB V3
LSB V1 MSB V2
LSB V3 MSB V4
LSB V1 MSB V2
LSB V3 MSB V4
LSB V2 MSB V5
LSB V4 MSB V6
LSB V2 MSB V5
LSB V4 MSB V6
LSB V5 MSB V1
LSB V6 MSB V3
LSB V5
LSB V1 MSB V2
LSB V3 MSB V4
LSB V5
LSB V6
LSB V6
Figure 35. Daisy-Chain Serial Interface Timing with Two DOUT Lines
CONVST A,
CONVST B,
CONVST C
BUSY
CS
1
2
3
15
16
17
31
32
33
47
48
49
63
64
SCLK
DEVICE 1, DOUT A
DEVICE 1, DOUT B
DEVICE 1, DOUT C
DEVICE 2, DOUT A
DEVICE 2, DOUT B
DEVICE 2, DOUT C
MSB V1
MSB V3
MSB V5
MSB V1
MSB V3
MSB V5
LSB V1 MSB V2
LSB V3 MSB V4
LSB V5 MSB V6
LSB V1 MSB V2
LSB V3 MSB V4
LSB V5 MSB V6
LSB V2 MSB V1
LSB V4 MSB V3
LSB V6 MSB V5
LSB V2
LSB V1 MSB V2
LSB V3 MSB V4
LSB V5 MSB V6
LSB V2
LSB V4
LSB V6
LSB V4
LSB V6
Figure 36. Daisy-Chain Serial Interface Timing with Three DOUT Lines
Rev. 0 | Page 28 of 32
AD7656-1/AD7657-1/AD7658-1
APPLICATION HINTS
effect of glitches on the power supply lines. Good connections
should be made between the AD7656-1/AD7657-1/AD7658-1
supply pins and the power tracks on the board; this should involve
the use of a single via or multiple vias for each supply pin.
LAYOUT
The printed circuit board that houses the AD7656-1/AD7657-1/
AD7658-1 should be designed so that the analog and digital
sections are separated and confined to different areas of the board.
Good decoupling is also important to lower the supply impedance
presented to the AD7656-1/AD7657-1/AD7658-1 and to reduce
the magnitude of the supply spikes. The decoupling capacitors
should be placed close to, ideally right up against, these pins
and their corresponding ground pins. Additionally, low-ESR
1 ꢁF capacitors should be placed on each of the supply pins, the
REFIN/REFOUT pin, and each REFCAPx pin. Avoid sharing
these capacitors between pins, and use vias to connect the
capacitors to the power and ground planes. In addition, use
wide, short traces between each via and the capacitor pad, or
place the vias adjacent to the capacitor pad to minimize parasitic
inductances. The AD7656-1/AD7657-1/AD7658-1 offer the user
a reduced decoupling solution that is pin and software compatible
with AD7656/AD7657/AD7658. The recommended reduced
decoupling required for AD7656-1/AD7657-1/AD7658-1 is
outlined in Figure 27.
At least one ground plane should be used. It can be common or
split between the digital and analog sections. In the case of the
split plane, the digital and analog ground planes should be
joined in only one place, preferably underneath the AD7656-1/
AD7657-1/AD7658-1, or at least as close as possible to the part.
If the AD7656-1/AD7657-1/AD7658-1 are in a system where
multiple devices require analog-to-digital ground connections,
the connection should still be made at only one point, a star
ground point, which should be established as close as possible to
the AD7656-1/AD7657-1/AD7658-1. Good connections should
be made to the ground plane. Avoid sharing one connection for
multiple ground pins. Individual vias or multiple vias to the
ground plane should be used for each ground pin.
Avoid running digital lines under the devices because doing so
couples noise onto the die. The analog ground plane should be
allowed to run under the AD7656-1/AD7657-1/AD7658-1 to
avoid noise coupling. Fast-switching signals like CONVST or
clocks should be shielded with digital ground to avoid radiating
noise to other sections of the board, and they should never run
near analog signal paths. Crossover of digital and analog signals
should be avoided. Traces on layers in close proximity on the
board should run at right angles to each other to reduce the
effect of feedthrough through the board.
Figure 27 shows an external Schmitt trigger device on the
CONVST A, CONVST B, CONVST C inputs. The Schmitt trigger
can be placed close to the CONVST pins (decoupled to the digital
ground) and is used to eliminate any system noise that couples onto
long CONVST A, CONVST B, CONVST C traces from being
applied to the CONVST pins. The Schmitt trigger offers noise
immunity to any high frequency noise, providing a clean
conversion edge to the AD7656-1/AD7657-1/AD7658-1 device in
cases where there is large system noise capable of coupling onto the
CONVST trace.
The power supply lines to the AVCC, DVCC, VDRIVE, VDD, and VSS pins
on the AD7656-1/AD7657-1/AD7658-1 should use as large a
trace as possible to provide low impedance paths and reduce the
Rev. 0 | Page 29 of 32
AD7656-1/AD7657-1/AD7658-1
OUTLINE DIMENSIONS
12.20
12.00 SQ
11.80
0.75
0.60
0.45
1.60
MAX
64
49
1
48
PIN 1
10.20
10.00 SQ
9.80
TOP VIEW
(PINS DOWN)
1.45
0.20
1.40
0.09
1.35
7°
3.5°
0°
0.08
COPLANARITY
16
33
0.15
0.05
SEATING
PLANE
17
32
VIEW A
0.27
0.22
0.17
0.50
BSC
LEAD PITCH
VIEW A
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026-BCD
Figure 37. 64-Lead Low Profile Quad Flat Package [LQFP]
ꢂST-64-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
Package Description
Package Option
ST-64-2
ST-64-2
ST-64-2
ST-64-2
ST-64-2
ST-64-2
ST-64-2
ST-64-2
ST-64-2
ST-64-2
ST-64-2
ST-64-2
AD7656BSTZ-11
64-Lead Low Profile Quad Flat Package [LQFP]
64-Lead Low Profile Quad Flat Package [LQFP]
64-Lead Low Profile Quad Flat Package [LQFP]
64-Lead Low Profile Quad Flat Package [LQFP]
64-Lead Low Profile Quad Flat Package [LQFP]
64-Lead Low Profile Quad Flat Package [LQFP]
64-Lead Low Profile Quad Flat Package [LQFP]
64-Lead Low Profile Quad Flat Package [LQFP]
64-Lead Low Profile Quad Flat Package [LQFP]
64-Lead Low Profile Quad Flat Package [LQFP]
64-Lead Low Profile Quad Flat Package [LQFP]
64-Lead Low Profile Quad Flat Package [LQFP]
Evaluation Board
AD7656BSTZ-1-RL1
AD7656YSTZ-11
AD7656YSTZ-1-RL1
AD7657BSTZ-11
AD7657BSTZ-1-RL1
AD7657YSTZ-11
AD7657YSTZ-1-RL1
AD7658BSTZ-11
AD7658BSTZ-1-RL1
AD7658YSTZ-11
AD7658YSTZ-1-RL1
EVAL-AD7656-1EDZ1
EVAL-AD7657-1EDZ1
EVAL-AD7658-1EDZ1
Evaluation Board
Evaluation Board
1 Z = RoHS Compliant Part.
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NOTES
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