AD7873ARQZ-REEL7 [ADI]

Touch Screen Digitizer; 摸屏
AD7873ARQZ-REEL7
型号: AD7873ARQZ-REEL7
厂家: ADI    ADI
描述:

Touch Screen Digitizer
摸屏

商用集成电路 光电二极管
文件: 总29页 (文件大小:600K)
中文:  中文翻译
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Touch Screen Digitizer  
Data Sheet  
AD7873  
FEATURES  
4-wire touch screen interface  
FUNCTIONAL BLOCK DIAGRAM  
+V  
PENIRQ  
CC  
On-chip temperature sensor: −40°C to +85°C  
On-chip 2.5 V reference  
Direct battery measurement (0 V to 6 V)  
Touch pressure measurement  
PEN  
INTERRUPT  
TEMP  
SENSOR  
X+  
X–  
Specified throughput rate of 125 kSPS  
Single supply, VCC of 2.2 V to 5.25 V  
Ratiometric conversion  
High speed serial interface  
Programmable 8-bit or 12-bit resolution  
One auxiliary analog input  
AD7873  
Y+  
Y–  
T/H  
6-TO-1  
I/P  
MUX  
AUX  
COMP  
BATTERY  
MONITOR  
Shutdown mode: 1 µA maximum  
16-lead QSOP, TSSOP, and LFCSP packages  
V
BAT  
APPLICATIONS  
V
REF  
GND  
Personal digital assistants  
Smart hand-held devices  
Touch screen monitors  
Point-of-sale terminals  
Pagers  
CHARGE  
REDISTRIBUTION  
DAC  
+V  
CC  
2.5V  
REF  
BUF  
SAR + ADC  
CONTROL LOGIC  
GENERAL DESCRIPTION  
The AD7873 is a 12-bit successive approximation ADC with a  
synchronous serial interface and low on resistance switches for  
driving touch screens. The AD7873 operates from a single 2.2 V  
to 5.25 V supply, with a throughput rate of 125 kSPS.  
SPORT  
The AD7873 features direct battery measurement, temperature  
measurement, and touch pressure measurement. The AD7873  
also has an on-board reference of 2.5 V that can be used for the  
auxiliary input, battery monitor, and temperature measurement  
modes. When not in use, the internal reference can be shut  
down to conserve power. An external reference can also be  
applied and varied from 1 V to VCC with an analog input range  
from 0 V to VREF. The device includes a shutdown mode that  
reduces the current consumption to less than 1 µA.  
DIN  
DOUT  
DCLK  
BUSY  
CS  
Figure 1.  
PRODUCT HIGHLIGHTS  
1. Ratiometric conversion mode available, eliminating errors  
due to on-board switch resistances.  
2. On-board temperature sensor: −40°C to +85°C.  
3. Battery monitor input.  
4. Touch pressure measurement capability.  
The AD7873 features on-board switches. This, coupled with low  
power and high speed operation, makes the device ideal for  
battery-powered systems with resistive touch screens. The part  
is available in a 16-lead, 0.15 inch quarter size outline package  
(QSOP), a 16-lead, thin shrink small outline package (TSSOP),  
and a 16-lead, lead frame chip scale package (LFCSP).  
5. Low power consumption of 1.37 mW maximum with the  
reference off, or 2.41 mW typical with the reference on, at  
125 kSPS and VCC at 3.6 V.  
6. Package options include 4 mm × 4 mm LFCSP.  
7. Analog input range from 0 V to VREF  
8. Versatile serial I/O ports.  
.
Rev. F  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registered trademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2013 Analog Devices, Inc. All rights reserved.  
 
 
 
 
 
IMPORTANT LINKS for the AD7873*  
Last content update 08/31/2013 11:50 pm  
PARAMETRIC SELECTION TABLES  
DESIGN TOOLS, MODELS, DRIVERS & SOFTWARE  
AD7873 Input Touch Screen Digitizer Linux Driver  
Find Similar Products By Operating Parameters  
DOCUMENTATION  
DESIGN SUPPORT  
Submit your support request here:  
Linear and Data Converters  
Embedded Processing and DSP  
AN-577: Layout and Grounding Recommendations for Touch Screen  
Digitizers  
UG-062: Evaluation Board for AD7843/AD7873 Resistive Touch Screen  
Controllers  
The PDA Challenge—Met by the AD7873 Resistive-Touch-Screen  
Controller ADC  
Telephone our Customer Interaction Centers toll free:  
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Quality and Reliability  
Lead(Pb)-Free Data  
EVALUATION KITS & SYMBOLS & FOOTPRINTS  
Symbols and Footprints  
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AD7873  
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* This page was dynamically generated by Analog Devices, Inc. and inserted into this data sheet.  
Note: Dynamic changes to the content on this page (labeled 'Important Links') does not  
constitute a change to the revision number of the product data sheet.  
This content may be frequently modified.  
AD7873  
Data Sheet  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Circuit Information........................................................................ 13  
ADC Transfer Function............................................................. 13  
Typical Connection Diagram ................................................... 13  
Analog Input ............................................................................... 14  
Measurements............................................................................. 16  
Pen Interrupt Request................................................................ 18  
Control Register ......................................................................... 19  
Power vs. Throughput Rate....................................................... 20  
Serial Interface............................................................................ 21  
Grounding and Layout .................................................................. 23  
PCB Design Guidelines for Chip Scale Package .................... 23  
Outline Dimensions....................................................................... 24  
Ordering Guide .......................................................................... 25  
Applications....................................................................................... 1  
General Description......................................................................... 1  
Functional Block Diagram .............................................................. 1  
Product Highlights ........................................................................... 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Timing Specifications .................................................................. 5  
Absolute Maximum Ratings............................................................ 6  
Thermal Resistance ...................................................................... 6  
ESD Caution.................................................................................. 6  
Pin Configurations and Function Descriptions ........................... 7  
Terminology ...................................................................................... 8  
Typical Performance Characteristics ............................................. 9  
REVISION HISTORY  
2/13—Rev. E to Rev. F  
4/03—Rev. B to Rev. C  
Changes to General Description Section ...................................... 1  
Added EPAD Note to Figure 3 and Table 5................................... 7  
Updated Outline Dimensions....................................................... 24  
Changes to Ordering Guide .......................................................... 26  
Changes to Formatting ......................................................Universal  
Updated Outline Dimensions....................................................... 19  
1/02—Rev. A to Rev. B  
Addition of 16-Lead Lead Frame Chip Scale Package ..Universal  
Edits to Features.................................................................................1  
Edits to General Description ...........................................................1  
Addition of LFCSP Pin Configuration ...........................................4  
Edit to Absolute Maximum Ratings................................................4  
Addition to Ordering Guide ............................................................4  
Addition of CP-16 Outline Dimensions .................................... 19  
9/06—Rev. D to Rev. E  
Changes to Figure 13 Caption ...................................................... 10  
Updated Outline Dimensions....................................................... 24  
Changes to Ordering Guide .......................................................... 25  
6/04—Rev. C to Rev. D  
Updated Format..................................................................Universal  
Changes to Absolute Maximum Ratings....................................... 6  
Additions to PD0 and PD1 Description...................................... 21  
PBC Guidelines for Chip Scale Package Added ......................... 23  
Additions to Ordering Guide........................................................ 25  
2/01—Rev. 0 to Rev A  
Edits to Notes in the Ordering Guide  
Rev. F | Page 2 of 28  
 
Data Sheet  
AD7873  
SPECIFICATIONS  
VCC = 2.7 V to 3.6 V, VREF = 2.5 V internal or external, fDCLK = 2 MHz; TA = −40°C to +85°C, unless otherwise noted.  
Table 1.  
Parameter  
AD7873A1  
AD7873B1  
Unit  
Test Conditions/Comments  
DC ACCURACY  
Resolution  
12  
11  
±2  
12  
12  
± 1  
–0.9/+1.5  
±±  
±ꢀ  
70  
70  
Bits  
No Missing Codes  
Integral Nonlinearity2  
Differential Nonlinearity2  
Offset Error2  
Gain Error2  
Noise  
Power Supply Rejection  
SWITCH DRIVERS  
On Resistance2  
Bits min  
LSB max  
LSB max  
LSB max  
LSB max  
µV rms typ  
dB typ  
±±  
±ꢀ  
70  
70  
+VCC = 2.7 V  
External reference  
Y+, X+  
Y–, X–  
5
±
5
±
Ω typ  
Ω typ  
ANALOG INPUT  
Input Voltage Ranges  
DC Leakage Current  
Input Capacitance  
REFERENCE INPUT/OUTPUT  
Internal Reference Voltage  
Internal Reference Tempco  
VREF Input Voltage Range  
DC Leakage Current  
VREF Input Impedance  
0 to VREF  
±0.1  
37  
0 to VREF  
±0.1  
37  
V
µA typ  
pF typ  
2.ꢀ5/2.55  
±15  
1/VCC  
±1  
2.ꢀ5/2.55  
±15  
1/VCC  
± 1  
V min/max  
ppm/°C typ  
V min/max  
µA max  
1
1
GΩ typ  
CS = GND or +VCC; typically 2±0 Ω when the  
on-board reference is enabled  
TEMPERATURE MEASUREMENT  
Temperature Range  
Resolution  
–ꢀ0/+85  
–ꢀ0/+85  
°C min/max  
Differential Method3  
Single Conversion Methodꢀ  
Accuracy  
1.±  
0.3  
1.±  
0.3  
°C typ  
°C typ  
Differential Method3  
Single Conversion Methodꢀ  
BATTERY MONITOR  
Input Voltage Range  
Input Impedance  
±2  
±2  
±2  
±2  
°C typ  
°C typ  
0/±  
10  
±2.5  
±3  
0/±  
10  
±2  
±3  
V min/max  
kΩ typ  
% max  
Sampling; 1 GΩ when battery monitor is off  
External reference  
Internal reference  
Accuracy  
% max  
LOGIC INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current, IIN  
2.ꢀ  
0.ꢀ  
±1  
10  
2.ꢀ  
0.ꢀ  
±1  
10  
V min  
V max  
µA max  
pF max  
Typically 10 nA, VIN = 0 V or +VCC  
5
Input Capacitance, CIN  
Rev. F | Page 3 of 28  
 
 
AD7873  
Data Sheet  
Parameter  
AD7873A1  
AD7873B1  
Unit  
Test Conditions/Comments  
LOGIC OUTPUTS  
Output High Voltage, VOH  
Output Low Voltage, VOL  
PENIRQ Output Low Voltage, VOL  
Floating-State Leakage Current  
Floating-State Output Capacitance5  
Output Coding  
VCC – 0.2  
0.ꢀ  
0.ꢀ  
VCC – 0.2  
0.ꢀ  
0.ꢀ  
V min  
ISOURCE = 250 µA; VCC = 2.2 V to 5.25 V  
ISINK = 250 µA  
100 kΩ pull-up; ISINK = 250 µA  
V max  
V max  
µA max  
pF max  
±10  
10  
±10  
10  
Straight (Natural) Binary  
CONVERSION RATE  
Conversion Time  
Track-and-Hold Acquisition Time  
Throughput Rate  
12  
3
125  
12  
3
125  
DCLK cycles max  
DCLK cycles min  
kSPS max  
POWER REQUIREMENTS  
+VCC (Specified Performance)  
ICC  
2.7/3.±  
2.7/3.±  
V min/max  
Functional from 2.2 V to 5.25 V  
Digital I/Ps = 0 V or VCC  
±
Normal Mode (fSAMPLE = 125 kSPS)  
380  
±70  
380  
±70  
170  
150  
580  
1
µA max  
µA typ  
µA typ  
µA typ  
µA typ  
µA max  
Internal reference off, VCC = 3.± V, 2ꢀ0 µA typ  
Internal reference on, VCC = 3.± V  
Internal reference off, VCC = 2.7 V, fDCLK = 200 kHz  
Internal reference off, VCC = 3.± V  
Internal reference on, VCC = 3.± V  
200 nA typ  
Normal Mode (fSAMPLE = 12.5 kSPS) 170  
Normal Mode (Static)  
150  
580  
1
Shutdown Mode (Static)  
Power Dissipation±  
Normal Mode (fSAMPLE = 125 kSPS)  
1.3±8  
2.ꢀ12  
3.±  
1.3±8  
2.ꢀ12  
3.±  
mW max  
mW typ  
µW max  
Internal reference off, VCC = 3.± V  
Internal reference on, VCC = 3.± V  
VCC = 3.± V  
Shutdown  
1 Temperature range as follows: A, B Versions: –ꢀ0°C to +85°C.  
2 See the Terminology section.  
3 Difference between TEMP0 and TEMP1 measurement. No calibration necessary.  
Temperature drift is –2.1 mV/°C.  
5 Sample tested @ 25°C to ensure compliance.  
± See the Power vs. Throughput Rate section.  
Rev. F | Page ꢀ of 28  
Data Sheet  
AD7873  
TIMING SPECIFICATIONS  
TA = TMIN to TMAX, unless otherwise noted; VCC = 2.7 V to 5.25 V, VREF = 2.5 V.  
Table 2. Timing Specifications1  
Parameter  
Limit at TMIN, TMAX  
Unit  
Description  
2
fDCLK  
10  
2
1.5  
10  
kHz min  
MHz max  
µs min  
ns min  
ns max  
ns max  
ns min  
ns min  
ns max  
ns min  
ns min  
ns max  
ns min  
ns max  
ns max  
tACQ  
t1  
Acquisition time  
CS falling edge to first DCLK rising edge  
CS falling edge to busy three-state disabled  
CS falling edge to DOUT three-state disabled  
DCLK high pulse width  
t2  
±0  
3
t3  
±0  
tꢀ  
t5  
t±  
t7  
t8  
200  
200  
±0  
10  
10  
DCLK low pulse width  
DCLK falling edge to BUSY rising edge  
Data setup time prior to DCLK rising edge  
Data valid to DCLK hold time  
Data access time after DCLK falling edge  
CS rising edge to DCLK ignored  
3
t9  
200  
0
t10  
t11  
CS rising edge to BUSY high impedance  
CS rising edge to DOUT high impedance  
100  
100  
t12  
1 Sample tested at 25°C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of VCC) and timed from a voltage level of 1.± V.  
2 Mark/space ratio for the DCLK input is ꢀ0/±0 to ±0/ꢀ0.  
3 Measured with the load circuit of Figure 2 and defined as the time required for the output to cross 0.ꢀ V or 2.0 V.  
t12 is derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 2. The measured number is then extrapolated  
back to remove the effects of charging or discharging the 50 pF capacitor. This means that the time, t12, quoted in the timing characteristics is the true bus relinquish  
time of the part and is independent of the bus loading.  
200µA  
I
OL  
TO OUTPUT  
PIN  
1.6V  
C
L
50pF  
200µA  
I
OH  
Figure 2. Load Circuit for Digital Output Timing Specifications  
Rev. F | Page 5 of 28  
 
 
 
 
 
 
 
 
AD7873  
Data Sheet  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Table 3.  
Parameter  
Rating  
+VCC to GND  
–0.3 V to +7 V  
Analog Input Voltage to GND  
Digital Input Voltage to GND  
Digital Output Voltage to GND  
VREF to GND  
Input Current to Any Pin Except Supplies1  
Operating Temperature Range  
Commercial (A, B Versions)  
Storage Temperature Range  
Junction Temperature  
Power Dissipation  
–0.3 V to VCC + 0.3 V  
–0.3 V to VCC + 0.3 V  
–0.3 V to VCC + 0.3 V  
–0.3 V to VCC + 0.3 V  
±10 mA  
THERMAL RESISTANCE  
θJA is specified for the worst-case conditions, that is, a device  
soldered in a circuit board for surface-mount packages.  
–ꢀ0°C to +85°C  
–±5°C to +150°C  
150°C  
Table 4. Thermal Resistance  
Package Type  
1±-Lead QSOP  
1±-Lead TSSOP  
1±-Lead LFCSP  
θJA  
θJC  
Unit  
°C/W  
°C/W  
°C/W  
1ꢀ9.97  
150.ꢀ  
135.7  
38.8  
27.±  
ꢀ50 mW  
IR Reflow Soldering  
Peak Temperature  
Time-to-Peak Temperature  
Ramp-Down Rate  
220°C (±5°C)  
10 sec to 30 sec  
±°C/sec max  
ESD CAUTION  
Pb-free Parts Only  
Peak Temperature  
250°C  
Time-to-Peak Temperature  
Ramp-Up Rate  
Ramp-Down Rate  
20 sec to ꢀ0 sec  
3°C/sec max  
±°C/sec max  
1 Transient currents of up to 100 mA do not cause SCR latch-up.  
Rev. F | Page ± of 28  
 
 
 
 
Data Sheet  
AD7873  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
AUX  
1
2
3
4
12  
Y+  
V
11 X+  
REF  
AD7873  
TOP VIEW  
+V  
+V  
10  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
+V  
DCLK  
CS  
CC  
CC  
CC  
9
PENIRQ  
DCLK  
X+  
Y+  
X–  
Y–  
DIN  
BUSY  
DOUT  
PENIRQ  
AD7873  
TOP VIEW  
(Not to Scale)  
GND  
NOTES  
1. THE EXPOSED PAD IS NOT CONNECTED INTERNALLY.  
FOR INCREASED RELIABILITY OF THE SOLDER JOINTS  
AND MAXIMUM THERMAL CAPABILITY, IT IS  
RECOMMENDED THAT THE PAD BE SOLDERED  
TO GROUND PLANE.  
V
+V  
CC  
BAT  
AUX  
V
REF  
Figure 3. LFCSP Pin Configuration  
Figure 4. QSOP/TSSOP Pin Configuration  
Table 5. Pin Function Descriptions  
Pin No.  
QSOP/  
TSSOP  
Mnemonic  
Description  
LFCSP  
3, 10  
1, 10  
+VCC  
Power Supply Input. The +VCC range for the AD7873 is from 2.2 V to 5.25 V. Both +VCC pins should be  
connected directly together.  
11  
12  
13  
1ꢀ  
15  
2
3
5
±
X+  
Y+  
X–  
Y–  
GND  
X+ Position Input. ADC Input Channel 1.  
Y+ Position Input. ADC Input Channel 2.  
X– Position Input.  
Y– Position Input. ADC Input Channel 3.  
Analog Ground. Ground reference point for all circuitry on the AD7873. All analog input signals  
and any external reference signals should be referred to this GND voltage.  
1±  
1
2
7
8
9
VBAT  
AUX  
VREF  
Battery Monitor Input. ADC Input Channel ꢀ.  
Auxiliary Input. ADC Input Channel 5.  
Reference Output for the AD7873. Alternatively, an external reference can be applied to this input.  
The voltage range for the external reference is 1.0 V to +VCC. For specified performance, it is 2.5 V on  
the AD7873. The internal 2.5 V reference is available on this pin for use external to the device. The  
reference output must be buffered before it is applied elsewhere in a system. A 0.1 µF capacitor is  
recommended between this pin and GND to reduce system noise effects.  
5
11  
12  
PENIRQ  
DOUT  
Pen Interrupt. CMOS logic open-drain output (requires 10 kΩ to 100 kΩ pull-up resistor externally).  
Data Out. Logic output. The conversion result from the AD7873 is provided on this output as a  
serial data stream. The bits are clocked out on the falling edge of the DCLK input. This output is  
high impedance when CS is high.  
±
7
13  
1ꢀ  
BUSY  
DIN  
BUSY Output. Logic output. This output is high impedance when CS is high.  
Data In. Logic Input. Data to be written to the AD7873 control register is provided on this input and  
is clocked into the register on the rising edge of DCLK (see the Control Register section).  
8
9
15  
CS  
Chip Select Input. Active low logic input. This input provides the dual function of initiating  
conversions on the AD7873 and enabling the serial input/output register.  
External Clock Input. Logic input. DCLK provides the serial clock for accessing data from the part.  
This clock input is also used as the clock source for the AD7873 conversion process.  
Exposed Pad. The exposed pad is not connected internally. For increased reliability of the solder  
joints and maximum thermal capability, it is recommended that the pad be soldered to the ground  
plane.  
1±  
DCLK  
EPAD  
N/A1  
1 N/A = not applicable.  
Rev. F | Page 7 of 28  
 
AD7873  
Data Sheet  
TERMINOLOGY  
Integral Nonlinearity  
Gain Error  
Integral nonlinearity is the maximum deviation from a straight  
line passing through the endpoints of the ADC transfer function.  
The endpoints of the transfer function are zero scale, a point 1 LSB  
below the first code transition, and full scale, a point 1 LSB  
above the last code transition.  
Gain error is the deviation of the last code transition (111…110)  
to (111…111) from the ideal (that is, VREF – 1 LSB) after the  
offset error is adjusted out.  
Track-and-Hold Acquisition Time  
The track-and-hold amplifier enters the acquisition phase on  
the fifth falling edge of DCLK after the start bit has been  
detected. Three DCLK cycles are allowed for the track-and-hold  
acquisition time. The input signal is fully acquired to the 12-bit  
level within this time even with the maximum specified DCLK  
frequency. See the Analog Input section for more details.  
Differential Nonlinearity  
Differential nonlinearity is the difference between the measured  
and the ideal 1 LSB change between any two adjacent codes in  
the ADC.  
Offset Error  
Offset error is the deviation of the first code transition (00…000)  
On Resistance  
to (00…001) from the ideal, that is, AGND + 1 LSB.  
On resistance is a measure of the ohmic resistance between the  
drain and source of the switch drivers.  
Rev. F | Page 8 of 28  
 
 
 
 
 
Data Sheet  
AD7873  
TYPICAL PERFORMANCE CHARACTERISTICS  
141  
140  
139  
138  
137  
136  
135  
134  
207  
206  
205  
204  
203  
202  
201  
200  
199  
198  
–40  
–20  
0
20  
40  
60  
80  
100  
–40  
–20  
0
20  
40  
60  
80  
4.6  
80  
100  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 5. Supply Current vs. Temperature  
Figure 8. Power-Down Supply Current vs. Temperature  
230  
1000  
fSAMPLE = 12.5kHz  
220  
210  
200  
190  
180  
170  
160  
150  
V
= +V  
REF  
CC  
V
= +V  
CC  
REF  
100  
2.2  
2.6  
3.0  
3.4  
3.8  
4.2  
5.0  
2.2  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
+V (V)  
CC  
+V (V)  
CC  
Figure 6. Supply Current vs. +VCC  
Figure 9. Maximum Sample Rate vs. +VCC  
0.20  
0.15  
0.10  
0.05  
0
0.6  
0.4  
0.2  
0
–0.05  
–0.10  
–0.15  
–0.20  
–0.2  
–0.4  
–0.6  
–40  
–20  
0
20  
40  
60  
100  
–40  
–20  
0
20  
40  
60  
80  
100  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 7. Change in Gain vs. Temperature  
Figure 10. Change in Offset vs. Temperature  
Rev. F | Page 9 of 28  
 
AD7873  
Data Sheet  
7.5  
6.5  
5.5  
4.5  
3.5  
2.5  
1.5  
14  
13  
12  
11  
10  
9
8
7
6
5
4
3
0.5  
10  
2
–40  
25  
40  
55  
70  
85  
100  
115  
130  
–20  
0
20  
40  
60  
80  
SAMPLE RATE (kHz)  
TEMPERATURE (°C)  
Figure 11. Reference Current vs. Sample Rate  
Figure 14. Reference Current vs. Temperature  
10  
9
9
8
7
6
5
4
3
Y+  
X+  
Y+  
X+  
8
X–  
7
Y–  
X–  
6
Y–  
5
4
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
–40  
–20  
0
20  
40  
60  
80  
100  
+V (V)  
CC  
TEMPERATURE (°C)  
Figure 12. Switch On Resistance vs. +VCC  
(X+, Y+: +VCC to Pin; X−, Y−: Pin to GND)  
Figure 15. Switch On Resistance vs. Temperature  
(X+, Y+: +VCC to Pin; X−, Y−: Pin to GND)  
2.5006  
2.5004  
2.5002  
2.5000  
2.4998  
2.4996  
2.4994  
2.4992  
2.4990  
2.4988  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
INL: R = 2k  
INL: R = 500Ω  
DNL: R = 2kΩ  
DNL: R = 500Ω  
0
–40 –30 –20 –10  
0
10 20 30 40 50 60 70 80  
TEMPERATURE (°C)  
15  
35  
55  
75  
95  
115  
135  
155  
175  
195  
SAMPLING RATE (kSPS)  
Figure 13. Linearity Error vs. Sampling Rate for Various RIN  
Figure 16. Internal VREF vs. Temperature  
Rev. F | Page 10 of 28  
Data Sheet  
AD7873  
2.504  
2.502  
2.500  
2.498  
2.496  
2.494  
2.492  
2.490  
2.488  
2.486  
2.484  
5
4
3
2
1
0
NO CAP (7µs)  
SETTLING TIME  
1µF CAP (1800µs)  
SETTLING TIME  
2.5  
2.7  
2.9  
3.1  
+V (V)  
3.3  
3.5  
3.7  
0
200  
400  
600  
800 1000 1200 1400 1600 1800  
TURN-ON TIME (µs)  
CC  
Figure 17. Internal VREF vs. +VCC  
Figure 20. Internal VREF vs. Turn-on Time  
610  
609  
608  
607  
606  
605  
604  
603  
602  
601  
600  
850  
800  
750  
700  
650  
600  
550  
500  
450  
TEMP1  
95.95mV  
TEMP0  
142.15mV  
–40 –30 –20 –10  
0
10 20 30 40 50 60 70 80  
TEMPERATURE (°C)  
2.7  
2.8  
2.9  
3.0  
3.1  
3.2  
(V)  
3.3  
3.4  
3.5  
3.6  
V
SUPPLY  
Figure 18. Temp Diode Voltage vs. Temperature (2.7 V Supply)  
Figure 21. TEMP0 Diode Voltage vs. VSUPPLY (25°C)  
730  
729  
728  
727  
726  
725  
724  
723  
722  
721  
720  
0
fSAMPLE = 125kHz  
fIN = 15kHz  
SNR = 68.34dB  
20  
40  
60  
80  
100  
120  
0
7.5  
15.0  
22.5  
30.0  
37.5  
45.0  
52.5  
60.0  
2.7  
3.0  
3.3  
3.6  
FREQUENCY (kHz)  
V
(V)  
SUPPLY  
Figure 19. TEMP1 Diode Voltage vs. VSUPPLY (25°C)  
Figure 22. Auxiliary Channel Dynamic Performance  
(fSAMPLE =125 kHz, fINPUT = 15 kHz)  
Rev. F | Page 11 of 28  
 
 
AD7873  
Data Sheet  
0
Figure 23 shows the power supply rejection ratio vs. VDD supply  
frequency for the AD7873. The power supply rejection ratio is  
defined as the ratio of the power in the ADC output at full-scale  
frequency, f, to the power of a 100 mV sine wave applied to the  
ADC VCC supply of frequency fS  
V
= 3V  
CC  
100mV p-p SINE WAVE ON +V  
CC  
–20  
–40  
V
= 2.5V EXT REFERENCE  
REF  
fSAMPLE = 125kHz, fIN = 20kHz  
PSSR (dB) = 10log(Pf/Pfs)  
–60  
where:  
–80  
Pf is power at frequency, f, in ADC output.  
Pfs is power at frequency, fs, coupled onto the ADC VCC supply.  
–100  
–120  
Here a 100 mV p-p sine wave is coupled onto the VCC supply.  
Decoupling capacitors of 10 µF and 0.1 µF were used on the supply.  
0
10  
20  
30  
CC  
40  
50  
60  
70  
80  
90  
100  
V
RIPPLE FREQUENCY (kHz)  
Figure 23. AC PSRR vs. Supply Ripple Frequency  
Rev. F | Page 12 of 28  
 
Data Sheet  
AD7873  
CIRCUIT INFORMATION  
The AD7873 is a fast, low power, 12-bit, single-supply analog-  
to-digital converter (ADC). The AD7873 can be operated from  
a 2.2 V to 5.25 V supply. When operated from either a 5 V  
supply or a 3 V supply, the AD7873 is capable of throughput  
rates of 125 kSPS when provided with a 2 MHz clock.  
111...111  
111...110  
111...000  
011...111  
1LSB = V  
/4096  
REF  
The AD7873 provides the user with on-chip track-and-hold,  
multiplexer, ADC, reference, temperature sensor, and serial  
interface, housed in a tiny 16-lead QSOP, TSSOP, or LFCSP  
package, offering the user considerable space-saving advantages  
over alternative solutions. The serial clock input (DCLK)  
accesses data from the part and also provides the clock source  
for the successive approximation ADC. The analog input range  
is 0 V to VREF (where the externally applied VREF can be between  
1 V and +VCC). The AD7873 has a 2.5 V reference on-board  
with this reference voltage available for use externally if buffered.  
000...010  
000...001  
000...000  
+V  
– 1LSB  
1LSB  
REF  
0V  
ANALOG INPUT  
Figure 24. Transfer Characteristic  
TYPICAL CONNECTION DIAGRAM  
Figure 25 shows a typical connection diagram for the AD7873  
in a touch screen control application. The AD7873 features an  
internal reference, but this can be overdriven with an external  
low impedance source between 1 V and +VCC. The value of the  
reference voltage sets the input range of the converter. The  
conversion result is output MSB first, followed by the remaining  
11 bits and three trailing zeros, depending on the number of  
clocks used per conversion (see the Serial Interface section). For  
applications where power consumption is a concern, the power  
management option should be used to improve power perform-  
ance. See Table 8 for available power management options.  
The analog input to the ADC is provided via an on-chip  
multiplexer. This analog input can be any one of the X, Y, and Z  
panel coordinates, the battery voltage, or the chip temperature.  
The multiplexer is configured with low resistance switches that  
allow an unselected ADC input channel to provide power and  
an accompanying pin to provide ground for an external device.  
For some measurements, the on resistance of the switches could  
present a source of error. However, with a differential input to  
the converter and a differential reference architecture, this error  
can be negated.  
ADC TRANSFER FUNCTION  
The output coding of the AD7873 is straight binary. The  
designed code transitions occur at successive integer LSB values  
(that is, 1 LSB, 2 LSBs, and so on). The LSB size is VREF/4096.  
The ideal transfer characteristic for the AD7873 is shown in  
Figure 24.  
2.2V TO 5V  
+
+
1µF TO 10µF  
(OPTIONAL)  
0.1µF  
+V  
DCLK  
1
2
3
4
5
6
7
8
16  
15  
14  
SERIAL/CONVERSION CLOCK  
CHIP SELECT  
CC  
X+  
Y+  
X–  
CS  
AD7873  
SERIAL DATA IN  
DIN  
CONVERTER STATUS  
SERIAL DATA OUT  
BUSY 13  
TOUCH  
SCREEN  
12  
Y–  
DOUT  
TO BATTERY  
11  
GND  
PEN INTERRUPT  
PENIRQ  
+V  
V
V
10  
9
CC  
BAT  
AUXILIARY  
INPUT  
50k  
AUX  
REF  
+
0.1µF  
VOLTAGE  
REGULATOR  
Figure 25. Typical Application Circuit  
Rev. F | Page 13 of 28  
 
 
 
 
 
AD7873  
Data Sheet  
ANALOG INPUT  
Figure 26 shows an equivalent circuit of the analog input  
structure of the AD7873 that contains a block diagram of the  
input multiplexer, the differential input of the ADC, and the  
differential reference.  
V
CC  
X+  
X–  
Table 6 shows the multiplexer address corresponding to each  
Y+  
Y–  
REF  
INT/  
analog input, both for the SER/  
bit in the control register  
DFR  
X+ Y+ EXT  
set high and low. The control bits are provided serially to the  
device via the DIN pin. For more information on the control  
register, see the Control Register section.  
3-TO-1  
MUX  
ON-CHIP SWITCHES  
When the converter enters hold mode, the voltage difference  
between the +IN and –IN inputs (see Figure 26) is captured on  
the internal capacitor array. The input current on the analog  
inputs depends on the conversion rate of the device. During the  
sample period, the source must charge the internal sampling  
capacitor (typically 37 pF). Once the capacitor is fully charged,  
there is no further input current. The rate of charge transfer  
from the analog source to the converter is a function of  
conversion rate.  
X+  
Y+  
Y–  
REF+  
ADC CORE  
IN+  
DATA OUT  
IN+  
6-TO-1  
MUX  
IN– REF–  
V
BAT  
AUX  
3-TO-1  
MUX  
TEMP  
X– Y– GND  
Figure 26. Equivalent Analog Input Circuit  
Table 6. Analog Input, Reference, and Touch Screen Control  
A2  
0
0
0
0
A1  
0
0
1
1
A0  
0
1
0
1
Analog Input  
TEMP0  
X+  
VBAT  
X+ (Z1)  
X Switches  
Off  
Off  
Y Switches  
+REF1  
VREF  
VREF  
VREF  
–REF1  
GND  
GND  
GND  
GND  
SER/ DFR  
1
1
1
1
Off  
On  
Off  
Y+ On  
Y– Off  
Y+ On  
Y– Off  
Off  
Off  
X+ Off  
X– On  
X+ Off  
X– On  
On  
VREF  
1
0
0
1
Y– (Z2)  
VREF  
GND  
1
1
1
0
0
1
1
0
1
0
1
0
1
1
1
0
Y+  
VREF  
VREF  
VREF  
GND  
GND  
GND  
AUX  
TEMP1  
Off  
Off  
Off  
Off  
Invalid Address. Test Mode: Switches out the TEMP0 diode to the PENIRQ pin.  
0
0
0
0
1
1
1
0
1
0
0
0
X+  
Off  
On  
Y+  
Y+  
Y+  
X+  
Y–  
X–  
X–  
X–  
Invalid Address  
X+ (Z1)  
X+ Off  
X– On  
X+ Off  
X– On  
ON  
Y+ On  
Y– Off  
Y+ On  
Y– Off  
Off  
1
0
0
0
Y– (Z2)  
Y+  
1
1
1
0
1
1
1
0
1
0
0
0
Outputs Identity Code, 1000 0000 0000.  
Invalid address. Test mode: Switches out the TEMP1 diode to the PENIRQ pin.  
1 Internal node, not directly accessible by the user.  
Rev. F | Page 1ꢀ of 28  
 
 
 
 
Data Sheet  
AD7873  
Acquisition Time  
time of the 2.5 V reference is typically 10 µs without a load;  
however, a 0.1 µF capacitor on the VREF pin is recommended for  
optimum performance because it affects the power-up time (see  
Figure 20).  
The track-and-hold amplifier enters tracking mode on the  
falling edge of the fifth DCLK after the start bit is detected (see  
Figure 35). The time required for the track-and-hold amplifier  
to acquire an input signal depends on how quickly the 37 pF  
input capacitance is charged. With zero source impedance on  
the analog input, three DCLK cycles are always sufficient to  
acquire the signal to the 12-bit level. With a source impedance  
(RIN) on the analog input, the actual acquisition time required is  
calculated using the formula:  
X+  
Y+  
3-TO-1  
MUX  
ADC  
260  
V
REF  
SW1  
tACQ = 8.4 ×  
(
RIN + 100 Ω × 37 pF  
)
2.5V  
REF  
BUF  
where RIN is the source impedance of the input signal, and 100 Ω,  
37 pF is the input RC. Depending on the frequency of DCLK  
used, three DCLK cycles may or may not be sufficient to acquire  
the analog input signal with various source impedance values.  
Figure 27. On-Chip Reference Circuitry  
Reference Input  
The voltage difference between +REF and −REF (see Figure 26)  
sets the analog input range. The AD7873 operates with a refer-  
ence input in the range of 1 V to +VCC. Figure 27 shows the  
on-chip reference circuitry on the AD7873. The internal  
reference on the AD7873 can be overdriven with an external  
reference; for best performance, however, the internal reference  
should be disabled when an external reference is applied,  
because SW1 in Figure 27 opens on the AD7873 when the  
internal reference is disabled. The on-chip reference always is  
available at the VREF pin as long as the reference is enabled. The  
input impedance seen at the VREF pin is approximately 260 Ω  
when the internal reference is enabled. When it is disabled, the  
input impedance seen at the VREF pin is in the GΩ region.  
Touch Screen Settling  
In some applications, external capacitors could be required  
across the touch screen to filter noise associated with it, for  
example, noise generated by the LCD panel or backlight  
circuitry. The value of these capacitors causes a settling time  
requirement when the panel is touched. The settling time  
typically appears as a gain error. There are several methods for  
minimizing or eliminating this issue. The problem can be that  
the input signal, reference, or both, have not settled to their  
final value before the sampling instant of the ADC. Additionally,  
the reference voltage could still be changing during the conversion  
cycle. One option is to stop or slow down the DCLK for the  
required touch screen settling time. This allows the input and  
reference to stabilize for the acquisition time, resolving the issue  
for both single-ended and differential modes.  
When making touch screen measurements, conversions can be  
made in differential (ratiometric) mode or single-ended mode.  
DFR  
If the SER/  
bit is set to 1 in the control register, then a  
The other option is to operate the AD7873 in differential mode  
only for the touch screen, and program the AD7873 to keep  
the touch screen drivers on and not go into power-down  
(PD0 = PD1 = 1). Several conversions could be required,  
depending on the settling time required and the AD7873 data  
rate. Once the required number of conversions have been made,  
the AD7873 can then be placed in a power-down state on the  
last measurement. The last method is to use the 15-DCLK cycle  
mode, maintaining the touch screen drivers on until it is  
commanded by the processor to stop.  
single-ended conversion is performed. Figure 28 shows the  
configuration for a single-ended Y coordinate measurement.  
The X+ input is connected to the analog-to-digital converter,  
the Y+ and Y− drivers are turned on, and the voltage on X+ is  
digitized. The conversion is performed with the ADC referenced  
from GND to VREF. This VREF is either the on-chip reference or  
the voltage applied at the VREF pin externally, and is determined  
by the setting of the power management Bit PD0 and Bit PD1  
(see Table 7). The advantage of this mode is that the switches  
that supply the external touch screen can be turned off once the  
acquisition is complete, resulting in a power savings. However,  
the on resistance of the Y drivers affects the input voltage that  
can be acquired. The full touch screen resistance could be in the  
order of 200 Ω to 900 Ω, depending on the manufacturer. Thus,  
if the on resistance of the switches is approximately 6 Ω, true  
full-scale and zero-scale voltages cannot be acquired, regardless  
of where the pen/stylus is on the touch screen. Note that the  
minimum touch screen resistance recommended for use with  
Internal Reference  
The AD7873 has an internal reference voltage of 2.5 V. The  
internal reference is available on the VREF pin for external use in  
the system; however, it must be buffered before it is applied  
elsewhere. The on-chip reference can be turned on or off with  
the power-down address, PD1 = 1 (see Table 8 and Figure 27).  
Typically, the reference voltage is only used in single-ended  
mode for battery monitoring, temperature measurement, and  
for using the auxiliary input. Optimal touch screen performance  
is achieved when using the differential mode. The power-up  
Rev. F | Page 15 of 28  
 
AD7873  
Data Sheet  
the AD7873 is approximately 70 Ω. In this mode of operation,  
therefore, some voltage is likely to be lost across the internal  
switches, and it is unlikely that the internal switch resistance  
will track the resistance of the touch screen over temperature  
and supply, providing an additional source of error.  
In the single conversion method, a diode voltage is digitized  
and recorded at a fixed calibration temperature. Any subsequent  
polling of the diode provides an estimate of the ambient tempera-  
ture through extrapolation from the calibration temperature  
diode result. This assumes a diode temperature drift of  
approximately –2.1 mV/°C. This method provides a resolution  
+V  
CC  
of approximately 0.3°C and a predicted accuracy of 3°C.  
The differential conversion method is a two-point measurement.  
The first measurement is performed with a fixed bias current  
into a diode, and the second measurement is performed with a  
fixed multiple of the bias current into the same diode. The  
voltage difference in the diode readings is proportional to  
absolute temperature and is given by the following formula:  
Y+  
X+  
V
REF  
REF+  
IN+  
IN+  
ADC CORE  
REF–  
IN–  
Y–  
VBE  
where:  
BE represents the diode voltage.  
=
(
kT / q  
)
×
(
ln N  
)
GND  
DFR  
Figure 28. Single-Ended Reference Mode (SER/  
= 1)  
V
The alternative to this situation is to set the SER/  
DFR  
bit low.  
N is the bias current multiple.  
k is Boltzmann’s constant.  
q is the electron charge.  
Again, making a Y coordinate measurement is considered, but  
now the +REF and –REF nodes of the ADC are connected  
directly to the Y+ and Y– pins. This means the analog-to-digital  
conversion is ratiometric. The result of the conversion is always  
a percentage of the external resistance, independent of how it  
could change with respect to the on resistance of the internal  
switches. Figure 29 shows the configuration for a ratiometric  
Y coordinate measurement.  
This method provides more accurate absolute temperature  
measurement of 2°C. However, the resolution is reduced to  
approximately 1.6°C. Assuming a current multiple of 105  
(typical for the AD7873) taking Boltzmanns constant,  
k = 1.38054 ×10–23 electrons volts/degrees Kelvin, the electron  
charge q = 1.602189 × 10–19, then T, the ambient temperature in  
degrees centigrade, can be calculated as follows:  
+V  
CC  
Y+  
VBE  
T =  
=
(
kT / q  
)
×
(
ln N  
)
(
VBE × q  
T(°C) = 2.49 × 103 × ∆VBE / 273 Κ  
)
/
(
k × ln N  
)
REF+  
X+  
Y–  
IN+  
IN+  
ADC CORE  
REF–  
IN–  
where ∆VBE is calculated from the difference in readings from  
the first conversion and second conversion.  
Figure 30 shows a block diagram of the temperature  
measurement mode.  
GND  
DFR  
Figure 29. Differential Reference Mode (SER/  
= 0)  
TEMP0 TEMP1  
The disadvantage of this mode of operation is that during both  
the acquisition phase and conversion process, the external  
touch screen must remain powered. This results in additional  
supply current for the duration of the conversion.  
105 × I  
I
MUX  
ADC  
MEASUREMENTS  
Temperature Measurement  
Figure 30. Block Diagram of Temperature Measurement Circuit  
Two temperature measurement options are available on the  
AD7873, the single conversion method and the differential  
conversion method. Both methods are based on an on-chip  
diode measurement.  
Rev. F | Page 1± of 28  
 
 
 
 
Data Sheet  
AD7873  
Battery Measurement  
Pressure Measurement  
The AD7873 can monitor a battery voltage from 0 V to 6 V.  
Figure 31 shows a block diagram of a battery voltage monitored  
through the VBAT pin. The voltage to the +VCC of the AD7873 is  
maintained at the desired supply voltage via the dc-to-dc  
regulator while the input to the regulator is monitored. This  
voltage on VBAT is divided by 4 so that a 6 V battery voltage is  
presented to the ADC as 1.5 V. To conserve power, the divider is  
on only during the sampling of a voltage on VBAT. Table 6 shows  
the control bit settings required to perform a battery  
measurement.  
The pressure applied to the touch screen via a pen or finger  
can also be measured with the AD7873 with some simple  
calculations. The 8-bit resolution mode would be sufficient for  
this measurement, but the following calculations are shown  
with the 12-bit resolution mode. The contact resistance between  
the X and Y plates is measured, providing a good indication of  
the size of the depressed area and the applied pressure. The area  
of the spot touched is proportional to the size of the object  
touching it. The size of this resistance (RTOUCH) can be calculated  
using two different methods.  
DC/DC  
The first method requires the user to know the total resistance  
of the X-plate tablet. Three touch screen conversions are  
required, a measurement of the X-position, Z1-position, and  
Z2-position (see Figure 32). The following equation calculates  
the touch resistance:  
CONVERTER  
+
BATTERY  
0V TO 6V  
+V  
CC  
V
BAT  
0V TO 1.5V  
ADC CORE  
7.5k  
2.5kΩ  
RTOUCH  
=
(
RXPLATE  
)
×
(
XPOSITION / 4095  
)
×
[(  
Z2 / Z1  
)
/ 1  
]
The second method requires that the resistance of both the  
X-plate and Y-plate tablets are known. Again three touch screen  
conversions are required, a measurement of the X-position,  
Y-position, and Z1-position (see Figure 32).  
Figure 31. Block Diagram of Battery Measurement Circuit  
The following equation also calculates the touch resistance:  
RTOUCH  
=
{(  
RXPLATE / Z1  
)
×
/
(
XPOSITION / 4095  
)
×
[
(
4096 / Z1  
)
/ 1  
]}  
[
RYPLATE YPOSITION / 4095  
×
(
)
]
MEASURE X-POSITION  
Y+  
X+  
TOUCH  
+
X-POSITION  
X–  
Y–  
MEASURE Z -POSITION  
1
Y+  
Y–  
Y+  
X+  
X+  
TOUCH  
TOUCH  
+
+
Z -POSITION  
2
Z -POSITION  
1
X–  
Y–  
X–  
MEASURE Z -POSITION  
2
Figure 32. Pressure Measurement Block Diagram  
Rev. F | Page 17 of 28  
 
 
AD7873  
Data Sheet  
PEN INTERRUPT REQUEST  
The pen interrupt equivalent circuitry is outlined in Figure 33.  
By connecting a pull-up resistor (10 kΩ to 100 kΩ) between +VCC  
output again responds to a screen touch. The fact that  
PENIRQ  
returns high almost immediately after the fourth falling edge of  
DCLK means the user avoids any spurious interrupts on the  
microprocessor or DSP, which can occur if the interrupt request  
line on the micro/DSP were unmasked during or toward the  
and this CMOS logic open-drain output, the  
output  
PENIRQ  
remains high normally. If  
is enabled (see Table 8), when  
PENIRQ  
the touch screen connected to the AD7873 is touched by a pen  
or finger, the output goes low, initiating an interrupt to  
end of conversion and the  
pin was still low. Once the  
PENIRQ  
PENIRQ  
next start bit is detected by the AD7843, the  
is again disabled.  
function  
PENIRQ  
a microprocessor. This can then instruct a control word to be  
written to the AD7873 to initiate a conversion. This output can  
also be enabled between conversions during power-down (see  
Table 8), allowing power-up to be initiated only when the  
screen is touched. The result of the first touch screen coordinate  
conversion after power-up is valid, assuming any external  
reference is settled to the 12-bit or 8-bit level as required.  
If the control register write operation overlaps with the data  
read, a start bit is always detected prior to the end of  
conversion, meaning that even if the  
function is  
PENIRQ  
enabled in the control register, it is disabled by the start bit  
again before the end of the conversion is reached, so  
Figure 34 assumes that the  
function was enabled in  
PENIRQ  
the  
function effectively cannot be used in this mode.  
PENIRQ  
However, as conversions are occurring continuously,  
the function is not necessary and is therefore  
the last write or that the part was just powered up so  
enabled by default. Once the screen is touched, the  
is  
PENIRQ  
PENIRQ  
PENIRQ  
redundant.  
output goes low a time tPEN later. This delay is approximately  
5 µs, assuming a 10 nF touch screen capacitance, and varies  
+V  
CC  
with the touch screen resistance actually used. Once the START  
bit is detected, the pen interrupt function is disabled and  
EXTERNAL  
PULL-UP  
100k  
the  
cannot respond to screen touches. The  
PENIRQ  
PENIRQ  
PENIRQ  
Y+  
+V  
CC  
output remains low until the fourth falling edge of DCLK after  
the START bit is clocked in, at which point it returns high as  
soon as possible, irrespective of the touch screen capacitance.  
This does not mean that the pen interrupt function is now  
enabled again because the power-down bits have not yet been  
X+  
TOUCH  
SCREEN  
PENIRQ  
ENABLE  
loaded to the control register. Regardless of whether  
is  
PENIRQ  
Y–  
ON  
to be enabled again, the  
output normally always idles  
PENIRQ  
is enabled again as shown in  
high. Assuming the  
PENIRQ  
PENIRQ  
Figure 33.  
Functional Block Diagram  
Figure 34, then once the conversion is complete, the  
PENIRQ  
SCREEN  
TOUCHED  
HERE  
PD1 = 1, PD0 = 0, PENIRQ  
ENABLED AGAIN  
tPEN  
NO RESPONSE TO TOUCH  
PENIRQ  
INTERRUPT  
ROCESSOR  
P
CS  
1
8
1
13  
16  
DCLK  
DIN  
SER/  
DFR  
MODE  
S
A2 A1 A0  
1
0
(START)  
PENIRQ  
Figure 34.  
Timing Diagram  
Rev. F | Page 18 of 28  
 
 
 
Data Sheet  
AD7873  
CONTROL REGISTER  
The control word provided to the ADC via the DIN pin is  
shown in Table 7. This provides the conversion start, channel  
addressing, ADC conversion resolution, configuration, and  
power-down of the AD7873. Table 7 provides detailed  
information on the order and description of these control bits  
within the control word.  
converter is always the difference between the VREF and GND  
pins. See Table 6 and Figure 26 through Figure 29 for further  
information.  
If X-position, Y-position, and pressure touch are measured in  
single-ended mode, an external reference voltage or +VCC is  
required for maximum dynamic range. The internal reference  
can be used for these single-ended measurements; however, a  
loss in dynamic range is incurred. If an external reference is  
used, the AD7873 should also be powered from the external  
reference. Because the supply current required by the device is  
so low, a precision reference can be used as the supply source to  
the AD7873. It might also be necessary to power the touch  
screen from the reference, which can require 5 mA to 10 mA. A  
REF19x voltage reference can source up to 30 mA, and, as such,  
could supply both the ADC and the touch screen. Care must be  
taken, however, to ensure that the input voltage applied to the  
ADC does not exceed the reference voltage and therefore the  
supply voltage. See the Absolute Maximum Ratings section.  
Initiate START  
The first bit, the S bit, must always be set to 1 to initiate the start  
of the control word. The AD7873 ignores any inputs on the  
DIN line until the start bit is detected.  
Channel Addressing  
The next three bits in the control register, A2, A1, and A0, select  
the active input channel(s) of the input multiplexer (see Table 6  
and Figure 26), touch screen drivers, and the reference inputs.  
Mode  
The MODE bit sets the resolution of the analog-to-digital  
converter. With a 0 in this bit, the following conversion has  
12 bits of resolution. With a 1 in this bit, the following  
conversion has eight bits of resolution.  
Note that the differential mode can only be used for X-position,  
Y-position, and pressure touch measurements. All other  
measurements require single-ended mode.  
SER/  
DFR  
PD0 and PD1  
The SER/  
bit controls the reference mode, set to either  
DFR  
The power management options are selected by programming  
the power management bits, PD0 and PD1, in the control  
register. Table 8 summarizes the options available and the  
internal reference voltage configurations. The internal reference  
can be turned on or off independent of the analog-to-digital  
converter, allowing power saving between conversions using the  
power management options. On power-up, PD0 defaults to 0,  
while PD1 defaults to 1.  
single-ended or differential when a 1 or a 0 is written to this bit,  
respectively. The differential mode is also referred to as the  
ratiometric conversion mode. This mode is optimum for  
X-position, Y-position, and pressure-touch measurements. The  
reference is derived from the voltage at the switch drivers,  
which is almost the same as the voltage to the touch screen. In  
this case, a separate reference voltage is not needed because the  
reference voltage to the ADC is the voltage across the touch  
screen. In single-ended mode, the reference voltage to the  
MSB  
LSB  
S
A2  
A1  
A0  
MODE  
SER/DFR  
PD1  
PD0  
Table 7. Control Register Bit Function Description  
Bit No.  
Mnemonic Comment  
7
S
Start Bit. The control word starts with the first high bit on DIN. A new control word can start every 15th DCLK cycle  
when in the 12-bit conversion mode or every 11th DCLK cycle when in 8-bit conversion mode.  
± to ꢀ  
3
A2 to A0  
MODE  
SER/DFR  
PD1, PD0  
Channel Select Bits. These three address bits along with the SER/DFR bit control the setting of the multiplexer  
input, switches, and reference inputs, as detailed in Table ±.  
12-Bit/8-Bit Conversion Select Bit. This bit controls the resolution of the following conversion. With a 0 in this bit,  
the conversion has 12-bit resolution or, with a 1 in this bit, 8-bit resolution.  
Single-Ended/Differential Reference Select Bit. Together with Bit A2 to Bit A0, this bit controls the setting of the  
multiplexer input, switches, and reference inputs as described in Table ±.  
Power Management Bits. These two bits decode the power-down mode of the AD7873 as shown in Table 8.  
2
1, 0  
Rev. F | Page 19 of 28  
 
 
 
AD7873  
Data Sheet  
Table 8. Power Management Options  
PENIRQ  
PD1 PD0  
Description  
0
0
Enabled This configuration results in immediate power-down of the on-chip reference as soon as PD1 is set to 0. The ADC  
powers down only between conversions. When PD0 is set to 0, the conversion is performed first and the ADC  
powers down upon completion of that conversion (or upon the rising edge of CS, if it occurs first). At the start of  
the next conversion, the ADC instantly powers up to full power. This means if the device is being used in the  
differential mode, or an external reference is used, there is no need for additional delays to ensure full operation  
and the very first conversion is valid. The Y– switch is on while in power-down. When the device is performing  
differential table conversions, the reference and reference buffer do not attempt to power up with Bit PD1 and  
Bit PD0 programmed in this way.  
0
1
1
0
Enabled This configuration results in switching the reference off immediately and the ADC on permanently. When the  
device is performing differential tablet conversions, the reference and reference buffer do not attempt to power  
up with Bit PD1 and Bit PD0 programmed in this way.  
Enabled This configuration results in switching the reference on and powering the ADC down between conversions. The  
ADC powers down only between conversions. When PD0 is set to 0, the conversion is performed first, and the  
ADC powers down upon completion of the conversion (or upon the rising edge of CS if it occurs first). At the start  
of the next conversion, the ADC instantly powers up to full power. There is no need for additional delays to ensure  
full operation as the reference remains permanently powered up.  
1
1
Disabled This configuration results in always keeping the device powered up. The reference and the ADC are on.  
For example, if the AD7873 is operated in a 24-DCLK continuous  
POWER VS. THROUGHPUT RATE  
sampling mode, with a throughput rate of 10 kSPS and a DCLK  
of 2 MHz, and the device is placed in the power-down mode  
between conversions, (PD0, PD1 = 0, 0), that is, the ADC shuts  
down between conversions but the reference remains powered  
down permanently, then the current consumption is calculated  
as follows. The current consumption during normal operation  
with a 2 MHz DCLK is 210 µA (VCC = 2.7 V). Assuming an  
external reference is used, the power-up time of the ADC is  
instantaneous, so when the part is converting, it consumes  
210 µA. In this mode of operation, the part powers up on the  
fourth falling edge of DCLK after the start bit is recognized. It  
goes back into power-down at the end of conversion on the  
20th falling edge of DCLK, meaning that the part consumes  
210 µA for 16 DCLK cycles only, 8 µs during each conversion  
cycle. If the throughput rate is 10 kSPS, the cycle time is 100 µs  
and the average power dissipated during each cycle is  
By using the power-down options on the AD7873 when not  
converting, the average power consumption of the device  
decreases at lower throughput rates. Figure 35 shows how, as  
the throughput rate is reduced while maintaining the DCLK  
frequency at 2 MHz, the device remains in its power-down state  
longer and the average current consumption over time drops  
accordingly.  
1000  
fDCLK = 16 × f  
SAMPLE  
100  
fDCLK = 2MHz  
10  
(8/100) × (210 µA) = 16.8 µA.  
V
= 2.7V  
CC  
= –40°C TO +85°C  
T
A
1
0
20  
40  
60  
80  
100  
120  
THROUGHPUT (kSPS)  
Figure 35. Supply Current vs. Throughput (µA)  
Rev. F | Page 20 of 28  
 
 
 
Data Sheet  
AD7873  
SERIAL INTERFACE  
updated) and the converter enters conversion mode. At this  
Figure 36 shows the typical operation of the serial interface of  
the AD7873. The serial clock provides the conversion clock and  
also controls the transfer of information to and from the AD7873.  
One complete conversion can be achieved with 24 DCLK cycles.  
point, track-and-hold goes into hold mode, the input signal is  
sampled, and the BUSY output goes high (BUSY returns low on  
the next falling edge of DCLK). The internal switches can also  
turn off at this point if in single-ended mode, battery-monitor  
mode, or temperature measurement mode.  
The  
signal initiates the data transfer and conversion process.  
CS  
The falling edge of  
takes the BUSY output and the serial bus  
CS  
The next 12 DCLK cycles are used to perform the conversion  
and to clock out the conversion result. If the conversion is  
out of three-state. The first eight DCLK cycles are used to write  
to the control register via the DIN pin. The control register is  
updated in stages as each bit is clocked in. Once the converter  
has enough information about the following conversion to set  
the input multiplexer and switches appropriately, the converter  
enters the acquisition mode and, if required, the internal switches  
are turned on. During acquisition mode, the reference input  
data is updated. After the three DCLK cycles of acquisition, the  
control word is complete (the power management bits are now  
ratiometric (SER/  
low), the internal switches are on during  
DFR  
the conversion. A 13th DCLK cycle is needed to allow the  
DSP/micro to clock in the LSB. Three more DCLK cycles clock  
out the three trailing zeros and complete the 24 DCLK transfer.  
The 24 DCLK cycles can be provided from a DSP or via three  
bursts of eight clock cycles from a microcontroller.  
CS  
tACQ  
1
8
1
8
1
8
DCLK  
DIN  
SER/  
DFR  
S
A2 A1 A0 MODE  
IDLE  
PD1 PD0  
(START)  
ACQUIRE  
CONVERSION  
IDLE  
THREE-STATE  
THREE-STATE  
THREE-STATE  
BUSY  
DOUT  
THREE-STATE  
11  
(MSB)  
10  
9
8
7
6
5
4
3
2
1
0
ZERO FILLED  
(LSB)  
1
X/Y SWITCHES  
(SER/DFR HIGH)  
OFF  
OFF  
OFF  
ON  
1, 2  
X/Y SWITCHES  
OFF  
ON  
(SER/DFR LOW)  
NOTES  
1
Y DRIVERS ARE ON WHEN X+ IS SELECTED INPUT CHANNEL (A2 TO A0 = 001); X DRIVERS ARE ON WHEN Y+ IS SELECTED INPUT CHANNEL (A2 TO A0 = 101).  
WHEN PD1, PD0 = 00, 01 OR 10, Y– WILL TURN ON AT THE END OF THE CONVERSION.  
2
DRIVERS WILL REMAIN ON IF POWER-DOWN MODE IS 11 (NO POWER-DOWN) UNTIL SELECTED INPUT CHANNEL, REFERENCE MODE,  
OR POWER-DOWN MODE IS CHANGED, OR CS IS HIGH.  
Figure 36. Conversion Timing, 24 DCLKS per Conversion Cycle, 8-Bit Bus Interface. No DCLK delay required with dedicated serial port.  
CS  
t9  
t4  
t6  
t6  
t1  
t10  
t5  
DCLK  
t8  
t7  
PD0  
DIN  
t2  
t11  
t12  
BUSY  
t3  
DOUT  
DB11  
DB10  
Figure 37. Detail Timing Diagram  
Rev. F | Page 21 of 28  
 
 
AD7873  
Data Sheet  
16 Clocks per Cycle  
using 12 DCLKs to perform the conversion and 3 DCLKs to  
acquire the analog input. This effectively increases the  
throughput rate of the AD7873 beyond that used for the  
specifications that are tested using 16 DCLKs per cycle, and  
DCLK = 2 MHz.  
The control bits for the next conversion can be overlapped with  
the current conversion to allow for a conversion every 16 DCLK  
cycles, as shown in Figure 38. This timing diagram also allows  
the possibility of communication with other serial peripherals  
between each byte (eight DCLKs) transfer between the  
8-Bit Conversion  
processor and the converter. However, the conversion must  
complete within a short enough time frame to avoid capacitive  
droop effects that could distort the conversion result. It should  
also be noted that the AD7873 is fully powered while other  
serial communications are taking place between byte transfers.  
The AD7873 can be set up to operate in an 8-bit mode rather  
than a 12-bit mode by setting the MODE bit in the control  
register to 1. This mode allows a faster throughput rate to be  
achieved, assuming 8-bit resolution is sufficient. When using 8-bit  
mode, a conversion is complete four clock cycles earlier than in  
12-bit mode. This can be used with serial interfaces that provide  
12 clock transfers, or two conversions can be completed with  
three 8-clock transfers. The throughput rate increases by 25% as  
a result of the shorter conversion cycle, but the conversion itself  
can occur at a faster clock rate because the internal settling time  
of the AD7873 is not as critical, because settling to eight bits is  
all that is required. The clock rate can be as much as 50% faster.  
The faster clock rate and fewer clock cycles combine to provide  
double the conversion rate.  
15 Clocks per Cycle  
Figure 39 shows the fastest way to clock the AD7873. This  
scheme does not work with most microcontrollers or DSPs  
because they are not capable of generating a 15 clock cycle per  
serial transfer. However, some DSPs allow the number of clocks  
per cycle to be programmed. This method can also be used with  
FPGAs (field programmable gate arrays) or ASICs (application  
specific integrated circuits). As in the 16 clocks per cycle case,  
the control bits for the next conversion are overlapped with the  
current conversion to allow a conversion every 15 DCLK cycles  
CS  
1
8
1
8
1
8
1
DCLK  
DIN  
S
S
CONTROL BITS  
CONTROL BITS  
BUSY  
DOUT  
11  
10  
9
8
7
6
5
4
3
2
1
0
11  
10  
9
Figure 38. Conversion Timing, 16 DCLKs per Cycle, 8-Bit Bus Interface. No DCLK delay required with dedicated serial port.  
CS  
1
15  
1
15  
1
DCLK  
SER/  
DFR  
SER/  
MODE  
A2 A1 A0  
DFR  
S
A2 A1 A0 MODE  
PD1 PD0  
DIN  
S
5
PD1 PD0  
S
A2  
BUSY  
DOUT  
11  
10  
9
8
7
6
4
3
2
1
0
11 10  
9
8
7
6
5
4
Figure 39. Conversion Timing, 15 DCLKs per Cycle, Maximum Throughput Rate  
Rev. F | Page 22 of 28  
 
 
Data Sheet  
AD7873  
GROUNDING AND LAYOUT  
For information on grounding and layout considerations for the  
AD7873, refer to Application Note AN-577, Layout and  
Grounding Recommendations for Touch Screen Digitizers.  
should be a clearance of at least 0.25 mm between the thermal  
pad and the inner edges of the pad pattern. This ensures that  
shorting is avoided.  
Thermal vias can be used on the printed circuit board thermal  
pad to improve thermal performance of the package. If vias are  
used, they should be incorporated in the thermal pad at 1.2 mm  
pitch grid. The via diameter should be between 0.3 mm and  
0.33 mm and the via barrel should be plated with 1 oz. copper  
to plug the via.  
PCB DESIGN GUIDELINES FOR  
CHIP SCALE PACKAGE  
The lands on the chip scale package (CP-32) are rectangular.  
The printed circuit board pad for these should be 0.1 mm  
longer than the package land length and 0.05 mm wider than  
the package land width. The land should be centered on the  
pad. This ensures that the solder joint size is maximized.  
The user should connect the printed circuit board thermal  
pad to GND.  
The bottom of the chip scale package has a central thermal pad.  
The thermal pad on the printed circuit board should be at least  
as large as this exposed pad. On the printed circuit board, there  
Rev. F | Page 23 of 28  
 
 
AD7873  
Data Sheet  
OUTLINE DIMENSIONS  
0.197 (5.00)  
0.193 (4.90)  
0.189 (4.80)  
16  
1
9
8
0.158 (4.01)  
0.154 (3.91)  
0.150 (3.81)  
0.244 (6.20)  
0.236 (5.99)  
0.228 (5.79)  
0.010 (0.25)  
0.006 (0.15)  
0.020 (0.51)  
0.010 (0.25)  
0.069 (1.75)  
0.053 (1.35)  
0.065 (1.65)  
0.049 (1.25)  
0.010 (0.25)  
0.004 (0.10)  
0.041 (1.04)  
REF  
SEATING  
PLANE  
8°  
0°  
0.025 (0.64)  
BSC  
0.050 (1.27)  
0.016 (0.41)  
COPLANARITY  
0.004 (0.10)  
0.012 (0.30)  
0.008 (0.20)  
COMPLIANT TO JEDEC STANDARDS MO-137-AB  
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.  
Figure 40. 16-Lead Shrink Small Outline Package [QSOP]  
(RQ-16)  
Dimensions shown in inches and (millimeters)  
5.10  
5.00  
4.90  
16  
9
8
4.50  
4.40  
4.30  
6.40  
BSC  
1
PIN 1  
1.20  
MAX  
0.15  
0.05  
0.20  
0.09  
0.75  
0.60  
0.45  
8°  
0°  
0.30  
0.19  
0.65  
BSC  
SEATING  
PLANE  
COPLANARITY  
0.10  
COMPLIANT TO JEDEC STANDARDS MO-153-AB  
Figure 41. 16-Lead Thin Shrink Small Outline Package [TSSOP]  
(RU-16)  
Dimensions shown in millimeters  
Rev. F | Page 2ꢀ of 28  
 
Data Sheet  
AD7873  
4.10  
4.00 SQ  
3.90  
0.35  
0.30  
0.25  
PIN 1  
INDICATOR  
PIN 1  
INDICATOR  
13  
16  
0.65  
BSC  
1
4
12  
EXPOSED  
PAD  
2.25  
2.10 SQ  
1.95  
9
8
5
0.70  
0.60  
0.50  
0.25 MIN  
TOP VIEW  
BOTTOM VIEW  
FOR PROPER CONNECTION OF  
THE EXPOSED PAD, REFER TO  
THE PIN CONFIGURATION AND  
FUNCTION DESCRIPTIONS  
0.80  
0.75  
0.70  
0.05 MAX  
0.02 NOM  
COPLANARITY  
0.08  
SECTION OF THIS DATA SHEET.  
SEATING  
PLANE  
0.20 REF  
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.  
Figure 42. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]  
4 mm × 4 mm Body, Very Very Thin Quad  
(CP-16-23)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model1  
AD7873ARQZ  
AD7873ARQZ-REEL  
AD7873ARQZ-REEL7  
AD7873BRQZ  
AD7873BRQZ-REEL  
AD7873BRQZ-REEL7  
AD7873ARUZ  
AD7873ARUZ-REEL  
AD7873ARUZ-REEL7  
AD7873ACPZ  
AD7873ACPZ-REEL  
AD7873ACPZ-REEL7  
EVAL-AD7873EBZ  
Temperature Range  
–ꢀ0°C to +85°C  
–ꢀ0°C to +85°C  
–ꢀ0°C to +85°C  
–ꢀ0°C to +85°C  
–ꢀ0°C to +85°C  
–ꢀ0°C to +85°C  
–ꢀ0°C to +85°C  
–ꢀ0°C to +85°C  
–ꢀ0°C to +85°C  
–ꢀ0°C to +85°C  
–ꢀ0°C to +85°C  
–ꢀ0°C to +85°C  
Package Description  
1±-Lead QSOP  
1±-Lead QSOP  
Linearity Error (LSB)2  
Package Option3  
±2  
±2  
±2  
±1  
±1  
±1  
±2  
±2  
±2  
±2  
±2  
±2  
RQ-1±  
RQ-1±  
RQ-1±  
1±-Lead QSOP  
1±-Lead QSOP  
1±-Lead QSOP  
1±-Lead QSOP  
RQ-1±  
RQ-1±  
RQ-1±  
1±-Lead TSSOP  
1±-Lead TSSOP  
1±-Lead TSSOP  
1±-Lead LFCSP_WQ  
1±-Lead LFCSP_WQ  
1±-Lead LFCSP_WQ  
Evaluation Board  
RU-1±  
RU-1±  
RU-1±  
CP-1±-23  
CP-1±-23  
CP-1±-23  
1 Z = RoHS Compliant Part.  
2 Linearity error here refers to integral linearity error.  
3 RQ = QSOP = 0.15 inch quarter size outline package; RU = TSSOP, CP = LFCSP.  
Rev. F | Page 25 of 28  
 
AD7873  
NOTES  
Data Sheet  
Rev. F | Page 2± of 28  
Data Sheet  
NOTES  
AD7873  
Rev. F | Page 27 of 28  
AD7873  
NOTES  
Data Sheet  
©2013 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D02164-0-2/13(F)  
Rev. F | Page 28 of 28  
 
 
 

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SI9137DB

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137LG

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9122E

500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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