AD7995_15 [ADI]
4-Channel, 12-/10-/8-Bit ADC with IC-Compatible Interface in 8-Lead SOT-23;
| 型号： | AD7995_15 |
| 厂家： | 
ADI |
| 描述： | 4-Channel, 12-/10-/8-Bit ADC with IC-Compatible Interface in 8-Lead SOT-23 |
| 文件： | 总28页 (文件大小：607K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
4-Channel, 12-/10-/8-Bit ADC with
I2C-Compatible Interface in 8-Lead SOT-23
AD7991/AD7995/AD7999
FEATURES
FUNCTIONAL BLOCK DIAGRAM
V
DD
12-/10-/8-bit ADCs with fast conversion time: 1 μs typical
4 analog input channels/3 analog input channels with
reference input
Specified for VDD of 2.7 V to 5.5 V
Sequencer operation
Temperature range: −40°C to +125°C
I2C-compatible serial interface supports standard, fast,
and high speed modes
2 versions allow 2 I2C addresses
Low power consumption
V
V
V
IN0
IN1
IN2
12-/10-/8-BIT
SAR
I/P
MUX
T/H
ADC
V
/V
IN3 REF
CONTROL
SCL
SDA
LOGIC AND
2
I C
INTERFACE
Shutdown mode: 1 μA maximum
8-lead SOT-23 package
AD7991/AD7995/AD7999
GND
APPLICATIONS
Figure 1.
System monitoring
Battery-powered systems
Data acquisition
Medical instruments
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The AD7991/AD7995/AD7999 are 12-/10-/8-bit, low power,
successive approximation ADCs with an I2C®-compatible interface.
Each part operates from a single 2.7 V to 5.5 V power supply and
features a 1 μs conversion time. The track-and-hold amplifier
allows each part to handle input frequencies of up to 14 MHz,
and a multiplexer allows taking samples from four channels.
1. Four single-ended analog input channels, or three single-
ended analog input channels and one reference input channel.
2. I2C-compatible serial interface. Standard, fast, and high
speed modes.
3. Automatic shutdown.
4. Reference derived from the power supply or external
reference.
Each AD7991/AD7995/AD7999 provides a 2-wire serial
interface compatible with I2C interfaces. The AD7991 and
AD7995 come in two versions and each version has an
individual I2C address. This allows two of the same devices to be
connected to the same I2C bus. Both versions support standard,
fast, and high speed I2C interface modes. The AD7999 comes in
one version.
5. 8-lead SOT-23 package.
Table 1. Related Devices
Device
AD7998
AD7997
AD7994
AD7993
AD7992
Resolution
Input Channels
12
10
12
10
12
8
8
4
4
2
The AD7991/AD7995/AD7999 normally remain in a shutdown
state, powering up only for conversions. The conversion process
is controlled by a command mode, during which each I2C read
operation initiates a conversion and returns the result over the
I2C bus.
When four channels are used as analog inputs, the reference for
the part is taken from VDD; this allows the widest dynamic input
range to the ADC. Therefore, the analog input range to the
ADC is 0 V to VDD. An external reference, applied through the
VIN3/VREF input, can also be used with this part.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 ©2007–2010 Analog Devices, Inc. All rights reserved.
AD7991/AD7995/AD7999
TABLE OF CONTENTS
Features .............................................................................................. 1
Converter Operation.................................................................. 17
Typical Connection Diagram ................................................... 18
Analog Input ............................................................................... 18
Internal Register Structure............................................................ 20
Configuration Register .............................................................. 20
Sample Delay and Bit Trial Delay............................................. 21
Conversion Result Register....................................................... 21
Serial Interface ................................................................................ 22
Serial Bus Address...................................................................... 22
Writing to the AD7991/AD7995/AD7999.................................. 23
Reading from the AD7991/AD7995/AD7999............................ 24
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
AD7991.......................................................................................... 3
AD7995.......................................................................................... 5
AD7999.......................................................................................... 7
I2C Timing Specifications............................................................ 9
Absolute Maximum Ratings.......................................................... 11
ESD Caution................................................................................ 11
Pin Configuration and Function Descriptions........................... 12
Typical Performance Characteristics ........................................... 13
Terminology .................................................................................... 16
Theory of Operation ...................................................................... 17
Placing the AD7991/AD7995/AD7999 into High
Speed Mode................................................................................. 25
Mode of Operation......................................................................... 26
Outline Dimensions....................................................................... 27
Ordering Guide .......................................................................... 27
REVISION HISTORY
10/10—Rev. A to Rev. B
Changes to Max Offset Error Parameter in Table 2..................... 3
Changes to Max Offset Error Parameter (Y Version) in Table 3 ......5
Changes to Max Offset Error Parameter (Y Version) in Table 4 ......7
Changes to Ordering Guide...................................................................27
10/09—Rev. 0 to Rev. A
Changes to Table 3............................................................................ 5
Changes to Table 4............................................................................ 7
Updated Ordering Guide............................................................... 27
12/07—Revision 0: Initial Version
Rev. B | Page 2 of 28
AD7991/AD7995/AD7999
SPECIFICATIONS
AD79911
The temperature range of the Y version is −40°C to +125°C. Unless otherwise noted, VDD = 2.7 V to 5.5 V, VREF = 2.5 V, fSCL = 3.4 MHz,
and TA = TMIN to TMAX
.
Table 2.
Y Version
Typ
Parameter
DYNAMIC PERFORMANCE2, 3
Min
Max
Unit
Test Conditions/Comments
See the Sample Delay and Bit Trial Delay
section, fIN = 10 kHz sine wave for fSCL
from 1.7 MHz to 3.4 MHz
fIN = 1 kHz sine wave for fSCL up to 400 kHz
Signal-to-Noise and Distortion (SINAD)4
Signal-to-Noise Ratio (SNR)4
Total Harmonic Distortion (THD)4
Peak Harmonic or Spurious Noise (SFDR)4
Intermodulation Distortion (IMD)4
69.5
70
70
71
dB
dB
dB
dB
−75.5
−77.5
fa = 11 kHz, fb = 9 kHz for fSCL from
1.7 MHz to 3.4 MHz
fa = 5.4 kHz, fb = 4.6 kHz for fSCL up
to 400 kHz
Second-Order Terms
Third-Order Terms
Channel-to-Channel Isolation4
Full-Power Bandwidth4
−92
−88
−90
14
dB
dB
dB
MHz
MHz
fIN = 10 kHz
@ 3 dB
1.5
@ 0.1 dB
DC ACCURACY2, 5
Resolution
Integral Nonlinearity4
12
Bits
LSB
1
0.5
LSB
LSB
Differential Nonlinearity4
0.9
Guaranteed no missed codes to 12 bits
0.5
1
LSB
LSB
Offset Error4
7
Offset Error Matching
Offset Temperature Drift
Gain Error4
Gain Error Matching
Gain Temperature Drift
ANALOG INPUT
0.5
LSB
ppm/°C
LSB
LSB
ppm/°C
4.43
0.69
2
0.7
Input Voltage Range
DC Leakage Current
Input Capacitance
0
VREF
1
V
μA
pF
VREF = VIN3/VREF or VDD
34
4
Channel 0 to Channel 2—during
acquisition phase
Channel 0 to Channel 2—outside
acquisition phase
pF
35
5
pF
pF
Channel 3—during acquisition phase
Channel 3—outside acquisition phase
REFERENCE INPUT
VREF Input Voltage Range
DC Leakage Current
VREF Input Capacitance
1.2
VDD
1
V
μA
pF
pF
kΩ
5
35
69
Outside conversion phase
During conversion phase
Input Impedance
Rev. B | Page 3 of 28
AD7991/AD7995/AD7999
Y Version
Typ
Parameter
Min
Max
Unit
Test Conditions/Comments
LOGIC INPUTS (SDA, SCL)
Input High Voltage, VINH
0.7 (VDD
0.9 (VDD
)
)
V
V
V
V
μA
pF
V
VDD = 2.7 V to 5.5 V
VDD = 2.35 V to 2.7 V
VDD = 2.7 V to 5.5 V
VDD = 2.35 V to 2.7 V
VIN = 0 V or VDD
Input Low Voltage, VINL
0.3 (VDD
0.1 (VDD
1
)
)
Input Leakage Current, IIN
6
Input Capacitance, CIN
10
Input Hysteresis, VHYST
LOGIC OUTPUTS (OPEN DRAIN)
Output Low Voltage, VOL
0.1 (VDD
)
0.4
0.6
1
V
V
μA
pF
ISINK = 3 mA
ISINK = 6 mA
Floating-State Leakage Current
Floating-State Output Capacitance6
Output Coding
10
Straight (natural) binary
18 × (1/fSCL
THROUGHPUT RATE
)
fSCL ≤ 1.7 MHz; see the Serial Interface
section
17.5 × (1/fSCL
)
fSCL > 1.7 MHz; see the Serial Interface
+ 2 μs
section
POWER REQUIREMENTS2
VREF = VDD; for fSCL = 3.4 MHz,
clock stretching is implemented
VDD
IDD
2.7
5.5
V
Digital inputs = 0 V or VDD
ADC Operating, Interface Active
(Fully Operational)
0.09/0.25
mA
VDD = 3.3 V/5.5 V, 400 kHz fSCL
0.25/0.8
0.07/0.16
0.26/0.85
1/1.6
mA
mA
mA
μA
VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
VDD = 3.3 V/5.5 V, 400 kHz fSCL
VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
VDD = 3.3 V/5.5 V
Power-Down, Interface Active7
Power-Down, Interface Inactive7
Power Dissipation
ADC Operating, Interface Active
(Fully Operational)
0.3/1.38
mW
VDD = 3.3 V/5.5 V, 400 kHz fSCL
0.83/4.4
0.24/0.88
0.86/4.68
3.3/8.8
mW
mW
mW
μW
VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
VDD = 3.3 V/5.5 V, 400 kHz fSCL
VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
VDD = 3.3 V/5.5 V
Power-Down, Interface Active7
Power-Down, Interface Inactive7
1 Functional from VDD = 2.35 V.
2 Sample delay and bit trial delay enabled, t1 = t2 = 0.5/fSCL
.
3 For fSCL up to 400 kHz, clock stretching is not implemented. Above fSCL = 400 kHz, clock stretching is implemented.
4 See the Terminology section.
5 For fSCL ≤ 1.7 MHz, clock stretching is not implemented; for fSCL > 1.7 MHz, clock stretching is implemented.
6 Guaranteed by initial characterization.
7 See the Reading from the AD7991/AD7995/AD7999 section.
Rev. B | Page 4 of 28
AD7991/AD7995/AD7999
AD79951
The temperature range for the Y version is −40°C to +125°C. Unless otherwise noted, VDD = 2.7 V to 5.5 V, VREF = 2.5 V, fSCL = 3.4 MHz,
and TA = TMIN to TMAX
.
Table 3.
A Version2
Y Version
Parameter
Min
Typ
Max
Min
Typ Max
Unit
Test Conditions/Comments
DYNAMIC PERFORMANCE3, 4
See the Sample Delay and Bit Trial Delay
section, fIN = 10 kHz sine wave for fSCL from
1.7 MHz to 3.4 MHz
fIN = 1 kHz sine wave for fSCL up to 400 kHz
Signal-to-Noise and
Distortion (SINAD)5
61.5
−85
−85
61
dB
dB
dB
Total Harmonic Distortion
(THD)5
−75
−76
Peak Harmonic or Spurious
Noise (SFDR)5
Intermodulation
Distortion (IMD)5
fa = 11 kHz, fb = 9 kHz for fSCL from 1.7 MHz to
3.4 MHz
fa = 5.4 kHz, fb = 4.6 kHz for fSCL up to 400 kHz
Second-Order Terms
Third-Order Terms
−90
−86
−90
−90
−86
−90
dB
dB
dB
Channel-to-Channel
fIN = 10 kHz
Isolation5
Full-Power Bandwidth5
14
14
MHz
MHz
@ 3 dB
1.5
1.5
@ 0.1 dB
DC ACCURACY3, 6
Resolution
10
10
Bits
Integral Nonlinearity5
Differential Nonlinearity5
Offset Error5
0.4
0.4
0.4
0.4
LSB
LSB
Guaranteed no missed codes to 10 bits
1
2.25
LSB
Offset Error Matching
Offset Temperature Drift
Gain Error5
0.04
4.13
0.15
0.06
0.50
0.2
LSB
4.13
0.50
ppm/°C
LSB
0.5
Gain Error Matching
Gain Temperature Drift
ANALOG INPUT
0.25
LSB
ppm/°C
Input Voltage Range
DC Leakage Current
Input Capacitance
0
VREF
0
VREF
V
VREF = VIN3/VREF or VDD
1
1
μA
pF
34
4
34
4
Channel 0 to Channel 2—during acquisition
phase
pF
Channel 0 to Channel 2—outside acquisition
phase
35
5
35
5
pF
pF
Channel 3—during acquisition phase
Channel 3—outside acquisition phase
REFERENCE INPUT
VREF Input Voltage Range
DC Leakage Current
VREF Input Capacitance
1.2
VDD
1
1.2
VDD
1
V
μA
pF
pF
kΩ
5
5
Outside conversion phase
During conversion phase
35
69
35
69
Input Impedance
Rev. B | Page 5 of 28
AD7991/AD7995/AD7999
A Version2
Typ Max
Y Version
Parameter
Min
Min
Typ Max
Unit
Test Conditions/Comments
LOGIC INPUTS (SDA, SCL)
Input High Voltage, VINH
0.7 (VDD
)
0.7 (VDD
)
)
V
VDD = 2.7 V to 5.5 V
VDD = 2.35 V to 2.7 V
VDD = 2.7 V to 5.5 V
VDD = 2.35 V to 2.7 V
VIN = 0 V or VDD
0.9 (VDD
V
Input Low Voltage, VINL
0.3 (VDD
)
0.3 (VDD
)
V
0.1 (VDD
)
V
Input Leakage Current, IIN
1
1
μA
pF
V
7
Input Capacitance, CIN
10
10
Input Hysteresis, VHYST
0.1 (VDD
)
0.1 (VDD
)
LOGIC OUTPUTS (OPEN
DRAIN)
Output Low Voltage, VOL
0.4
0.6
1
0.4
0.6
1
V
ISINK = 3 mA
ISINK = 6 mA
V
Floating-State Leakage
Current
μA
Floating-State Output
Capacitance7
10
10
pF
Output Coding
Straight (natural) binary
18 × (1/fSCL
Straight (natural) binary
18 × (1/fSCL)
THROUGHPUT RATE
)
f
SCL ≤ 1.7 MHz; see the Serial Interface
section
17.5 × (1/fSCL) +
2 μs
17.5 × (1/fSCL) +
2 μs
f
SCL > 1.7 MHz; see the Serial Interface
section
POWER REQUIREMENTS3
VREF = VDD; for fSCL = 3.4 MHz,
clock stretching is implemented
VDD
IDD
2.7
5.5
2.7
5.5
V
Digital inputs = 0 V or VDD
ADC Operating,
Interface Active
(Fully Operational)
0.09/0.25
mA
VDD = 3.3 V/5.5 V, 400 kHz fSCL
0.25
0.25/0.8
0.07/0.16
0.26/0.85
1/1.6
mA
mA
mA
μA
VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
Power-Down, Interface
Active8
VDD = 3.3 V/5.5 V, 400 kHz fSCL
0.26
1
V
DD = 3.3 V/5.5 V, 3.4 MHz fSCL
DD = 3.3 V/5.5 V
Power-Down, Interface
Inactive8
V
Power Dissipation
ADC Operating,
Interface Active
(Fully Operational)
0.3/1.38
0.83/4.4
mW
mW
VDD = 3.3 V/5.5 V, 400 kHz fSCL
DD = 3.3 V/5.5 V, 3.4 MHz fSCL
0.83
V
Power-Down, Interface
Active8
0.24/0.88
0.86/4.68
3.3/8.8
mW
mW
μW
VDD = 3.3 V/5.5 V, 400 kHz fSCL
VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
VDD = 3.3 V/5.5 V
0.86
3.3
Power-Down, Interface
Inactive8
1 Functional from VDD = 2.35 V.
2 A Version tested at VDD = 3.3 V and fSCL = 3.4 MHz. Functionality tested at fSCL = 400 kHz.
3 Sample delay and bit trial delay enabled, t1 = t2 = 0.5/fSCL
.
4 For fSCL up to 400 kHz, clock stretching is not implemented. Above fSCL = 400 kHz, clock stretching is implemented.
5 See the Terminology section.
6 For fSCL ≤ 1.7 MHz, clock stretching is not implemented; for fSCL > 1.7 MHz, clock stretching is implemented.
7 Guaranteed by initial characterization.
8 See the Reading from the AD7991/AD7995/AD7999 section.
Rev. B | Page 6 of 28
AD7991/AD7995/AD7999
AD79991
The temperature range for the Y version is −40°C to +125°C. Unless otherwise noted, VDD = 2.7 V to 5.5 V, VREF = 2.5 V, fSCL = 3.4 MHz,
and TA = TMIN to TMAX
.
Table 4.
A Version2
Y Version
Parameter
Min
Typ
Max
Min
Typ Max
Unit
Test Conditions/Comments
DYNAMIC PERFORMANCE3, 4
See the Sample Delay and Bit Trial Delay section,
fIN = 10 kHz sine wave for fSCL from 1.7 MHz to 3.4 MHz
fIN = 1 kHz sine wave for fSCL up to 400 kHz
Signal-to-Noise and
Distortion (SINAD)5
49.5
49.5
dB
dB
dB
Total Harmonic
−65
−65
−65
−65
Distortion (THD)5
Peak Harmonic or
Spurious Noise (SFDR)5
Intermodulation
Distortion (IMD)5
fa = 11 kHz, fb = 9 kHz for fSCL from 1.7 MHz to
3.4 MHz
fa = 5.4 kHz, fb = 4.6 kHz for fSCL up to 400 kHz
Second-Order Terms
Third-Order Terms
−83
−75
−90
−83
−75
−90
dB
dB
dB
Channel-to-Channel
fIN = 10 kHz
Isolation5
Full-Power Bandwidth5
14
14
MHz
MHz
@ 3 dB
1.5
1.5
@ 0.1 dB
DC ACCURACY3, 6
Resolution
8
8
Bits
Integral Nonlinearity5
Differential Nonlinearity5
Offset Error5
0.04
0.1
0.1
0.5
LSB
0.05
0.3
LSB
Guaranteed no missed codes to eight bits
LSB
Offset Error Matching
Offset Temperature Drift
Gain Error5
0.02
0.05
LSB
4.26
4.26
0.59
ppm/°C
LSB
0.06
0.03
0.175
0.06
Gain Error Matching
Gain Temperature Drift
ANALOG INPUT
LSB
0.59
ppm/°C
Input Voltage Range
DC Leakage Current
Input Capacitance
0
VREF
1
0
VREF
V
VREF = VIN3/VREF or VDD
1
μA
pF
pF
pF
pF
34
4
34
4
Channel 0 to Channel 2—during acquisition phase
Channel 0 to Channel 2—outside acquisition phase
Channel 3—during acquisition phase
35
5
35
5
Channel 3—outside acquisition phase
REFERENCE INPUT
VREF Input Voltage Range
DC Leakage Current
VREF Input Capacitance
1.2
VDD
1
1.2
VDD
1
V
μA
pF
pF
kΩ
5
5
Outside conversion phase
During conversion phase
35
69
35
69
Input Impedance
Rev. B | Page 7 of 28
AD7991/AD7995/AD7999
A Version2
Typ Max
Y Version
Parameter
Min
Min
Typ Max
Unit
Test Conditions/Comments
LOGIC INPUTS (SDA, SCL)
Input High Voltage, VINH
0.7 (VDD
)
0.7 (VDD
)
)
V
VDD = 2.7 V to 5.5 V
VDD = 2.35 V to 2.7 V
VDD = 2.7 V to 5.5 V
VDD = 2.35 V to 2.7 V
VIN = 0 V or VDD
0.9 (VDD
V
Input Low Voltage, VINL
0.3 (VDD
)
0.3 (VDD
)
V
0.1 (VDD
)
V
Input Leakage Current, IIN
1
1
μA
pF
V
7
Input Capacitance, CIN
10
10
Input Hysteresis, VHYST
0.1 (VDD
)
0.1 (VDD
)
LOGIC OUTPUTS (OPEN
DRAIN)
Output Low Voltage, VOL
0.4
0.6
1
0.4
0.6
1
V
ISINK = 3 mA
ISINK = 6 mA
V
Floating-State Leakage
Current
μA
Floating-State Output
Capacitance7
10
10
pF
Output Coding
Straight (natural) binary
18×(1/fSCL
Straight (natural) binary
18×(1/fSCL)
THROUGHPUT RATE
)
fSCL ≤ 1.7 MHz; see the Serial Interface section
fSCL > 1.7 MHz; see the Serial Interface section
17.5×(1/fSCL
+ 2 μs
)
17.5×(1/fSCL)
+ 2 μs
POWER REQUIREMENTS3
VREF = VDD; for fSCL = 3.4 MHz,
clock stretching is implemented
VDD
IDD
2.7
5.5
2.7
5.5
V
Digital inputs = 0 V or VDD
ADC Operating,
Interface Active
(Fully Operational)
0.09/0.25
0.25/0.8
mA
mA
VDD = 3.3 V/5.5 V, 400 kHz fSCL
0.25
V
DD = 3.3 V/5.5 V, 3.4 MHz fSCL
Power-Down,
0.07/0.16
0.26/0.85
1/1.6
mA
mA
μA
VDD = 3.3 V/5.5 V, 400 kHz fSCL
Interface Active8
0.26
1
V
V
DD = 3.3 V/5.5 V, 3.4 MHz fSCL
DD = 3.3 V/5.5 V
Power-Down ,
Interface Inactive8
Power Dissipation
ADC Operating,
Interface Active
(Fully Operational)
0.3/1.38
0.83/4.4
mW
mW
V
DD = 3.3 V/5.5 V, 400 kHz fSCL
0.83
VDD = 3.3 V/5.5 V, 3.4 MHz fSCL
Power-Down,
0.24/0.88
0.86/4.68
3.3/8.8
mW
mW
μW
VDD = 3.3 V/5.5 V, 400 kHz fSCL
Interface Active8
0.86
3.3
V
V
DD = 3.3 V/5.5 V, 3.4 MHz fSCL
DD = 3.3 V/5.5 V
Power-Down ,
Interface Inactive8
1 Functional from VDD = 2.35 V.
2 A Version tested at VDD=3.3 V and fSCL= 3.4 MHz. Functionality tested at fSCL = 400 kHz.
3 Sample delay and bit trial delay enabled, t1 = t2 = 0.5/fSCL
.
4 For fSCL up to 400 kHz, clock stretching is not implemented. Above fSCL = 400 kHz, clock stretching is implemented.
5 See the Terminology section.
6 For fSCL ≤ 1.7 MHz, clock stretching is not implemented; for fSCL > 1.7 MHz, clock stretching is implemented.
7 Guaranteed by initial characterization.
8 See the Reading from the AD7991/AD7995/AD7999 section.
Rev. B | Page 8 of 28
AD7991/AD7995/AD7999
I2C TIMING SPECIFICATIONS
Guaranteed by initial characterization. All values were measured with the input filtering enabled. CB refers to the capacitive load on the bus line,
with tr and tf measured between 0.3 VDD and 0.7 VDD (see Figure 2). Unless otherwise noted, VDD = 2.7 V to 5.5 V and TA = TMIN to TMAX
.
Table 5.
Limit at tMIN, tMAX
Parameter
Conditions
Min
Typ
Max
100
400
Unit
kHz
kHz
Description
1
fSCL
Standard mode
Fast mode
Serial clock frequency
High speed mode
CB = 100 pF maximum
CB = 400 pF maximum
Standard mode
Fast mode
High speed mode
CB = 100 pF maximum
CB = 400 pF maximum
Standard mode
Fast mode
3.4
1.7
MHz
MHz
μs
1
t1
4
0.6
tHIGH, SCL high time
tLOW, SCL low time
μs
60
ns
ns
μs
μs
120
4.7
1.3
1
t2
High speed mode
CB = 100 pF maximum
CB = 400 pF maximum
Standard mode
Fast mode
High speed mode
Standard mode
Fast mode
160
320
250
100
10
ns
ns
ns
ns
ns
μs
μs
1
t3
tSU;DAT, data setup time
tHD;DAT, data hold time
1, 2
t4
0
0
3.45
0.9
High Speed mode
CB = 100 pF maximum
CB = 400 pF maximum
Standard mode
Fast mode
High Speed mode
Standard mode
Fast mode
0
0
703
150
ns
ns
μs
μs
ns
μs
μs
ns
μs
μs
μs
μs
ns
ns
ns
1
t5
4.7
0.6
160
4
0.6
160
4.7
1.3
4
tSU;STA, setup time for a repeated start condition
tHD;STA, hold time for a repeated start condition
1
t6
High speed mode
Standard mode
Fast mode
1
t7
tBUF, bus-free time between a stop and a start condition
tSU;STO, setup time for a stop condition
1
t8
Standard mode
Fast mode
High speed mode
Standard mode
Fast mode
0.6
160
t9
1000
300
tRDA, rise time of the SDA signal
20 + 0.1 CB
High speed mode
CB = 100 pF maximum
CB = 400 pF maximum
10
20
80
160
ns
ns
Rev. B | Page 9 of 28
AD7991/AD7995/AD7999
Limit at tMIN, tMAX
Parameter
Conditions
Min
Typ
Max
Unit
ns
ns
Description
t10
Standard mode
Fast mode
300
300
tFDA, fall time of the SDA signal
20 + 0.1 CB
High speed mode
CB = 100 pF maximum
CB = 400 pF maximum
Standard mode
Fast mode
10
20
80
ns
ns
ns
ns
160
1000
300
t11
tRCL, rise time of the SCL signal
20 + 0.1 CB
High speed mode
CB = 100 pF maximum
CB = 400 pF maximum
Standard mode
10
20
40
80
ns
ns
ns
t11A
1000
tRCL1, rise time of the SCL signal after a repeated
start condition and after an acknowledge bit
Fast mode
20 + 0.1 CB
300
ns
High speed mode
CB = 100 pF maximum
CB = 400 pF maximum
Standard mode
10
20
80
ns
ns
ns
ns
160
300
300
t12
tFCL, fall time of the SCL signal
Fast mode
20 + 0.1 CB
High speed mode
CB = 100 pF maximum
CB = 400 pF maximum
Fast mode
10
20
0
40
80
50
10
ns
ns
ns
ns
μs
1
tSP
Pulse width of the suppressed spike
Power-up and acquisition time
High speed mode
0
tPOWER-UP
0.6
1 Functionality is tested during production.
2 A device must provide a data hold time for SDA in order to bridge the undefined region of the SCL falling edge.
3 For 3 V supplies, the maximum hold time with CB = 100 pF maximum is 100 ns maximum.
t11
t12
t6
t2
SCL
SDA
t6
t4
t3
t5
t10
t8
t1
t9
t7
S
S
P
P
S = START CONDITION
P = STOP CONDITION
Figure 2. 2-Wire Serial Interface Timing Diagram
Rev. B | Page 10 of 28
AD7991/AD7995/AD7999
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 6.
Parameter
VDD to GND
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rating
−0.3 V to 7 V
Analog Input Voltage to GND
Reference Input Voltage to GND
Digital Input Voltage to GND
Digital Output Voltage to GND
Input Current to Any Pin Except Supplies1
Operating Temperature Ranges
Industrial (YVersion) Temperature Range
Storage Temperature Range
Junction Temperature
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
10 mA
ESD CAUTION
−40°C to +125°C
−65°C to +150°C
150°C
8-Lead SOT-23 Package
θJA Thermal Impedance
θJC Thermal Impedance
170°C/W
90°C/W
RoHS Compliant Temperature,
Soldering Reflow
260 + 0°C
ESD
1 kV
1 Transient currents of up to 100 mA do not cause SCR latch-up.
Rev. B | Page 11 of 28
AD7991/AD7995/AD7999
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
SCL
1
2
3
4
8
7
6
5
V
DD
AD7991/
AD7995/
AD7999
SDA
GND
V
V
V
V
/V
IN0
IN3 REF
TOP VIEW
(Not to Scale)
IN1
IN2
Figure 3. SOT-23 Pin Configuration
Table 7. Pin Function Descriptions
Pin
No.
Mnemonic Description
1
SCL
Digital Input. Serial bus clock. External pull-up resistor required.
2
3
4
5
SDA
VIN0
VIN1
Digital I/O. Serial bus bidirectional data. Open-drain output. External pull-up resistor required.
Analog Input 1. Single-ended analog input channel. The input range is 0 V to VREF
Analog Input 2. Single-ended analog input channel. The input range is 0 V to VREF
Analog Input 3. Single-ended analog input channel. The input range is 0 V to VREF
.
.
.
VIN2
6
VIN3/VREF
Analog Input 4. Single-ended analog input channel. The input range is 0 V to VREF. Can also be used to input an
external VREF signal.
7
8
GND
VDD
Analog Ground. Ground reference point for all circuitry on the AD7991/AD7995/AD7999. All analog input signals
should be referred to this AGND voltage.
Power Supply Input. The VDD range for the AD7991/AD7995/AD7999 is from 2.7 V to 5.5 V.
Table 8. I2C Address Selection
Part Number
AD7991-0
AD7991-1
AD7995-0
I2C Address
010 1000
010 1001
010 1000
010 1001
010 1001
AD7995-1
AD7999-1
Rev. B | Page 12 of 28
AD7991/AD7995/AD7999
TYPICAL PERFORMANCE CHARACTERISTICS
1.0
0.8
1.0
V
V
f
= 2.7V
DD
0.8
= 2.35V
= 1.7MHz
REF
SCL
0.6
0.6
POSITIVE INL
0.4
0.4
0.2
0.2
0
0
–0.2
–0.4
–0.6
–0.8
–1.0
–0.2
–0.4
–0.6
–0.8
–1.0
NEGATIVE INL
0
500
1000 1500 2000 2500 3000 3500 4000
CODE
1.2
1.7
2.2
2.7
3.2
3.7
4.2
4.7
REFERENCE VOLTAGE (V)
Figure 4. DNL Error, VDD = 2.7 V, VREF = 2.35 V, fSCL = 1.7 MHz
Without Clock Stretching
Figure 7. INL Error vs. Reference Voltage , fSCL = 1.7 MHz
Without Clock Stretching
1.0
1.0
V
V
f
= 2.7V
DD
0.8
0.6
0.8
0.6
= 2.35V
REF
= 1.7MHz
SCL
POSITIVE DNL
NEGATIVE DNL
0.4
0.4
0.2
0.2
0
0
–0.2
–0.4
–0.6
–0.8
–1.0
–0.2
–0.4
–0.6
–0.8
–1.0
0
500
1000 1500 2000 2500 3000 3500 4000
CODE
1.2
1.7
2.2
2.7
3.2
3.7
4.2
4.7
REFERENCE VOLTAGE (V)
Figure 5. INL Error, VDD = 2.7 V, VREF = 2.35 V, fSCL = 1.7 MHz
Without Clock Stretching
Figure 8. DNL Error vs. Reference Voltage, fSCL = 1.7 MHz
Without Clock Stretching
12.0
11.5
11.0
10.5
10.0
9.5
74
72
70
68
66
64
62
60
1.0
ENOB V = 5V
DD
0.8
0.6
ENOB V
= 3V
DD
SINAD V
= 5V
DD
0.4
0.2
SINAD V
= 3V
DD
0
–0.2
–0.4
–0.6
–0.8
–1.0
9.0
V
V
f
= 5V
DD
8.5
= 2.5V
REF
= 1.7MHz
SCL
8.0
0
500
1000 1500 2000 2500 3000 3500 4000
CODE
0
1
2
3
4
5
6
REFERENCE VOLTAGE (V)
Figure 6. ENOB/SINAD vs. Reference Voltage, fSCL = 1.7 MHz
Without Clock Stretching
Figure 9. INL Error, VDD = 5 V, VREF = 2.5 V, fSCL = 1.7 MHz
Without Clock Stretching
Rev. B | Page 13 of 28
AD7991/AD7995/AD7999
1.0
–70
–80
fSCL = 1.7MHz
0.8
0.6
0.4
V
V
= 5V
= 3V
0.2
DD
DD
0
–0.2
–0.4
–0.6
–90
V
V
f
= 5V
DD
= 2.5V
–0.8
–1.0
REF
= 1.7MHz
SCL
–100
0
500
1000 1500 2000 2500 3000 3500 4000
CODE
1
10
100
INPUT FREQUENCY (kHz)
Figure 13. THD vs. Input Frequency, VREF = 2.5 V, fSCL = 1.7 MHz
Without Clock Stretching
Figure 10. DNL Error, VDD = 5 V, VREF = 2.5 V, fSCL = 1.7 MHz
Without Clock Stretching
800
96
95
fSCL = 1.7MHz
+125°C
+85°C
+25°C
–40°C
V
= 3V
DD
600
400
200
0
94
93
92
91
90
89
V
= 5V
DD
V
f
= V
DD
= 1.7MHz
REF
SCL
TEMPERATURE = T
A
0
10
20
30
40
50
60
70
80
90 100
2
3
4
5
6
fNOISE (kHz)
V
(V)
DD
Figure 11. IDD Supply Current vs. Supply Voltage, fSCL = 1.7 MHz
Without Clock Stretching, −40°C to +125°C
Figure 14. AD7991 Channel-to-Channel Isolation , fSCL = 1.7 MHz
Without Clock Stretching
1000
0
16384 POINT FFT
fS = 22.5kSPS
fSCL = 3.4MHz
+125°C
+85°C
+25°C
–40°C
fSCL = 405kHz
–20
fIN = 5.13kHz
SNR = 71.83dB
800
600
400
200
0
SINAD = 71.39dB
THD = –81.26dB
SFDR = –93.71dB
–40
–60
–80
–100
–120
0
2
4
6
8
10
2
3
4
5
6
FREQUENCY (kHz)
V
(V)
DD
Figure 12. IDD Supply Current vs. Supply Voltage, f SCL = 3.4 MHz
with Clock Stretching, −40°C to +125°C
Figure 15. Dynamic Performance, fSCL = 405 kHz
Without Clock Stretching, VDD = 5 V, Full-Scale Input,
Seven-Term Blackman-Harris Window
Rev. B | Page 14 of 28
AD7991/AD7995/AD7999
3
2
1
0
0
–20
16384 POINT FFT
fS = 95kSPS
fSCL = 1.71MHz
fIN = 10.13kHz
SNR = 71.77dB
SINAD = 71.45dB
THD = –82.43dB
SFDR = –95.02dB
–40
V
V
= 5V
DD
–60
–80
= 3V
DD
–100
–120
0
5
10
15
20
25
30
35
40
45
0
500
1000
1500
FREQUENCY (kHz)
SCL FREQUENCY (kHz)
Figure 16. Dynamic Performance, fSCL = 1.71 MHz
Figure 17. Power vs. SCL Frequency, VREF = 2.5 V
Without Clock Stretching, VDD = 5 V, Full-Scale Input,
Seven-Term Blackman-Harris Window
Rev. B | Page 15 of 28
AD7991/AD7995/AD7999
TERMINOLOGY
in frequency from the original sine waves, and the third-order
terms are usually at a frequency close to the input frequencies. As a
result, the second- and third-order terms are specified separately.
The calculation of intermodulation distortion is, like the THD
specification, the ratio of the rms sum of the individual distortion
products to the rms amplitude of the sum of the fundamentals,
expressed in decibels.
Signal-to-Noise and Distortion (SINAD) Ratio
The measured ratio of signal-to-noise and distortion at the output
of the ADC. The signal is the rms amplitude of the fundamental.
Noise is the sum of the nonfundamental signals excluding dc,
up to half the sampling frequency (fS/2). The ratio is dependent
on the number of quantization levels in the digitization process:
the more levels, the smaller the quantization noise. The theoretical
SINAD ratio for an ideal N-bit converter with a sine wave input
is given by
Channel-to-Channel Isolation
Channel-to-channel isolation is a measure of the level of
crosstalk between any two channels. It is measured by applying
a full-scale sine wave signal to all unselected input channels and
then determining the degree to which the signal attenuates in
the selected channel with a 10 kHz signal. The frequency of the
signal in each of the unselected channels is increased from 2 kHz
up to 92 kHz. Figure 14 shows the worst-case across all four
channels for the AD7991.
Signal-to-(Noise + Distortion) = (6.02 N + 1.76) dB
Therefore, SINAD is 49.92 dB for an 8-bit converter, 61.96 dB
for a 10-bit converter, and 74 dB for a 12-bit converter.
Total Harmonic Distortion (THD)
The ratio of the rms sum of harmonics to the fundamental. For
the AD7991/AD7995/AD7999, it is defined as
2
2
2
2
2
Full-Power Bandwidth
The input frequency at which the amplitude of the reconstructed
fundamental is reduced by 0.1 dB or 3 dB for a full-scale input.
V2 +V3 +V4 +V5 +V6
THD (dB) = 20 log
V1
where:
V1 is the rms amplitude of the fundamental.
V2, V3, V4, V5, and V6 are the rms amplitudes of the second
Integral Nonlinearity
The maximum deviation from a straight line passing through
the endpoints of the ADC transfer function. The endpoints are
at zero scale (a point 1 LSB below the first code transition) and
full scale (a point 1 LSB above the last code transition).
through sixth harmonics.
Peak Harmonic or Spurious Noise
The ratio of the rms value of the next largest component in the
ADC output spectrum (up to fS/2 and excluding dc) to the rms
value of the fundamental. Typically, the value of this specification
is determined by the largest harmonic in the spectrum, but for
ADCs where the harmonics are buried in the noise floor, the
largest harmonic may be a noise peak.
Differential Nonlinearity
The difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
Offset Error
The deviation of the first code transition (00 … 000 to
00 … 001) from the ideal—that is, AGND + 1 LSB.
Intermodulation Distortion
Offset Error Match
The difference in offset error between any two channels.
With inputs consisting of sine waves at two frequencies, fa
and fb, any active device with nonlinearities creates distortion
products at sum and difference frequencies of mfa nfb, where
m, n = 0, 1, 2, 3, and so on. Intermodulation distortion terms
are those for which neither m nor n equals 0. For example,
second-order terms include (fa + fb) and (fa − fb), and
third-order terms include (2fa + fb), (2fa − fb), (fa + 2fb), and
(fa − 2fb).
Gain Error
The deviation of the last code transition (111 … 110 to
111 … 111) from the ideal (that is, VREF − 1 LSB) after
the offset error has been adjusted out.
Gain Error Match
The difference in gain error between any two channels.
The AD7991/AD7995/AD7999 are tested using the CCIF standard,
where two input frequencies near the maximum input bandwidth
are used. In this case, the second-order terms are usually distanced
Rev. B | Page 16 of 28
AD7991/AD7995/AD7999
THEORY OF OPERATION
The AD7991/AD7995/AD7999 are low power, 12-/10-/8-bit,
single-supply, 4-channel ADCs. Each part can be operated from
a single 2.35 V to 5.5 V supply.
When the ADC starts a conversion, as shown in Figure 19, SW2
opens and SW1 moves to Position B, causing the comparator to
become unbalanced. The input is disconnected when the con-
version begins. The control logic and the capacitive DAC are used
to add and subtract fixed amounts of charge from the sampling
capacitor to bring the comparator back into a balanced condition.
When the comparator is rebalanced, the conversion is complete.
The control logic generates the ADC output code. Figure 20 shows
the ADC transfer function.
The AD7991/AD7995/AD7999 provide the user with a 4-channel
multiplexer, an on-chip track-and-hold, an ADC, and an I2C-
compatible serial interface, all housed in an 8-lead SOT-23 package
that offers the user considerable space-saving advantages over
alternative solutions.
The AD7991/AD7995/AD7999 normally remains in a power-
down state while not converting. Therefore, when supplies are
first applied, the part is in a power-down state. Power-up is initiated
prior to a conversion, and the device returns to the power-down
state upon completion of the conversion. This automatic power-
down feature allows the device to save power between conversions.
This means any read or write operations across the I2C interface
can occur while the device is in power-down.
CAPACITIVE
DAC
A
V
IN
CONTROL
LOGIC
SW1
B
SW2
COMPARATOR
AGND
Figure 19. ADC Conversion Phase
CONVERTER OPERATION
ADC Transfer Function
The AD7991/AD7995/AD7999 are successive approximation
ADCs built around a capacitive DAC. Figure 18 and Figure 19
show simplified schematics of the ADC during its acquisition
and conversion phases, respectively. Figure 18 shows the ADC
during its acquisition phase: SW2 is closed, SW1 is in Position A,
the comparator is held in a balanced condition, and the sampling
capacitor acquires the signal on VIN. The source driving the
analog input needs to settle the analog input signal to within
one LSB in 0.6 ꢀs, which is equivalent to the duration of the
power-up and acquisition time.
The output coding of the AD7991/AD7995/AD7999 is straight
binary. The designed code transitions occur at successive integer
LSB values (that is, 1 LSB, 2 LSB, and so on). The LSB size for
the AD7991/AD7995/AD7999 is VREF/4096, VREF/1024, and
VREF/256, respectively. Figure 20 shows the ideal transfer
characteristics for the AD7991/AD7995/AD7999.
111 ... 111
111 ... 110
111 ... 000
011 ... 111
CAPACITIVE
DAC
AD7991 1 LSB = REF /4096
IN
A
AD7995 1 LSB = REF /1024
IN
000 ... 010
000 ... 001
000 ... 000
V
IN
AD7999 1 LSB = REF /256
IN
CONTROL
LOGIC
SW1
B
SW2
AGND + 1 LSB
+REF – 1 LSB
IN
COMPARATOR
ANALOG INPUT
AGND
0V TO REF
IN
Figure 20. AD7991/AD7995/AD7999 Transfer Characteristics
Figure 18. ADC Acquisition Phase
Rev. B | Page 17 of 28
AD7991/AD7995/AD7999
TYPICAL CONNECTION DIAGRAM
ANALOG INPUT
Figure 22 shows the typical connection diagram for the
AD7991/AD7995/AD7999.
Figure 21 shows an equivalent circuit of the AD7991/AD7995/
AD7999 analog input structure. The two diodes, D1 and D2,
provide ESD protection for the analog inputs. Care must be taken
to ensure that the analog input signal does not exceed the supply
rails by more than 300 mV. If the signal does exceed this level,
the diodes become forward-biased and start conducting current
into the substrate. Each diode can conduct a maximum current
of 10 mA without causing irreversible damage to the part.
The reference voltage can be taken from the supply voltage,
VDD. However, the AD7991/AD7995/AD7999 can be configured
to be a 3-channel device with the reference voltage applied to
the VIN3/VREF pin. In this case, a 1 ꢀF decoupling capacitor on
the VIN3/VREF pin is recommended.
SDA and SCL form the 2-wire I2C compatible interface. External
pull-up resistors are required for both the SDA and SCL lines.
V
DD
The AD7991-0/AD7995-0 and the AD7991-1/AD7995-1/
AD7999-1 support standard, fast, and high speed I2C interface
modes. Both the -0 and -1 devices have independent I2C addresses,
which allows the devices to connect to the same I2C bus without
contention issues.
D1
D2
C2
30pF
R1
V
IN
C1
4pF
The part requires approximately 0.6 μs to wake up from power-
down and to acquire the analog input. Once the acquisition
phase ends, the conversion phase starts and takes approximately
1 μs to complete. The AD7991/AD7995/AD7999 enters
shutdown mode after each conversion, which is useful in
applications where power consumption is a concern.
CONVERSION PHASE—SWITCH OPEN
TRACK PHASE—SWITCH CLOSED
Figure 21. Equivalent Analog Input Circuit
Capacitor C1 in Figure 21 is typically about 4 pF and can
primarily be attributed to pin capacitance. Resistor R1 is a
lumped component composed of the on resistance (RON) of
both a track-and-hold switch and the input multiplexer. The
total resistor is typically about 400 Ω. Capacitor C2, the ADC
sampling capacitor, has a typical capacitance of 30 pF.
5V SUPPLY
+
+
10µF
0.1µF
2-WIRE SERIAL
INTERFACE
R
R
P
P
V
V
V
V
IN0
IN1
IN2
V
DD
SDA
SCL
MICROCONTROLLER/
MICROPROCESSOR
/V
IN3 REF
AD7991/
AD7995/
AD7999
GND
Figure 22. AD7991/AD7995/AD7999 Typical Connection Diagram
Rev. B | Page 18 of 28
AD7991/AD7995/AD7999
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
For ac applications, removing high frequency components from
the analog input signal is recommended by use of an RC band-
pass filter on the relevant analog input pin. In applications
where harmonic distortion and signal-to-noise ratio are critical,
the analog input should be driven from a low impedance
source. Large source impedances significantly affect the ac
performance of the ADC. This may necessitate the use of an
input buffer amplifier. The choice of the op amp is a function
of the particular application.
V
V
= 5V
= V
DD
REF
DD
TEMPERATURE = T
fSCL = 1.7MHz
A
5.1kΩ
2kΩ
1.3kΩ
When no amplifier is used to drive the analog input, the source
impedance should be limited to low values. The maximum
source impedance depends on the amount of THD that can be
tolerated. THD increases as the source impedance increases and
performance degrades. Figure 23 shows the THD vs. the analog
input signal frequency for different source impedances at a
supply voltage of 5 V.
240Ω
56Ω
1
10
ANALOG INPUT FREQUENCY (kHz)
100
Figure 23. THD vs. Analog Input Frequency for Various Source Impedances
for VDD = 5 V, fSCL = 1.7 MHz Without Clock Stretching
Rev. B | Page 19 of 28
AD7991/AD7995/AD7999
INTERNAL REGISTER STRUCTURE
CONFIGURATION REGISTER
The configuration register is an 8-bit write-only register that is used to set the operating modes of the AD7991/AD7995/AD7999. The bit
functions are outlined in Table 10. A single-byte write is necessary when writing to the configuration register. D7 is the MSB. When the
master writes to the AD7991/AD7995/AD7999, the first byte is written to the configuration register.
Table 9. Configuration Register Bit Map and Default Settings at Power-Up
D7
CH3
1
D6
CH2
1
D5
CH1
1
D4
CH0
1
D3
D2
FLTR
0
D1
D0
REF_SEL
0
Bit trial delay
0
Sample delay
0
Table 10. Bit Function Descriptions
Bit
Mnemonic
Comment
D7 to D4
CH3 to CH0
These four channel address bits select the analog input channel(s) to be converted. If a channel address bit
(Bit D7 to Bit D4) is set to 1, a channel is selected for conversion. If more than one channel bit is set to 1, the
AD7991/AD7995/AD7999 sequence through the selected channels, starting with the lowest channel. All
unused channels should be set to 0. Table 11 shows how these four channel address bits are decoded. Prior
to the device initiating a conversion, the channel(s) must be selected in the configuration register.
D3
D2
REF_SEL
FLTR
This bit allows the user to select the supply voltage as the reference or choose to use an external reference. If
this bit is 0, the supply is used as the reference, and the device acts as a 4-channel input part. If this bit is set
to 1, an external reference must be used and applied to the VIN3/VREF pin, and the device acts as a 3-channel
input part.
The value written to this bit of the control register determines whether the filtering on SDA and SCL is
enabled or bypassed. If this bit is set to 0, the filtering is enabled; if it set to 1, the filtering is bypassed.
D1
D0
Bit trial delay
Sample delay
See the Sample Delay and Bit Trial Delay section.
See the Sample Delay and Bit Trial Delay section.
Table 11. Channel Selection
D7
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
D6
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
D5
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
D4
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Analog Input Channel1
No channel selected
Convert on VIN0
Convert on VIN1
Sequence between VIN0 and VIN1
Convert on VIN2
Sequence between VIN0 and VIN2
Sequence between VIN1 and VIN2
Sequence among VIN0, VIN1, and VIN2
Convert on VIN3
Sequence between VIN0 and VIN3
Sequence between VIN1 and VIN3
Sequence among VIN0, VIN1, and VIN3
Sequence between VIN2 and VIN3
Sequence among VIN0, VIN2, and VIN3
Sequence among VIN1, VIN2, and VIN3
Sequence among VIN0, VIN1, VIN2, and VIN3
1 The AD7991/AD7995/AD7999 converts on the selected channel in the sequence in ascending order, starting with the lowest channel in the sequence.
Rev. B | Page 20 of 28
AD7991/AD7995/AD7999
SAMPLE DELAY AND BIT TRIAL DELAY
CONVERSION RESULT REGISTER
It is recommended that no I2C bus activity occur while a
conversion is taking place (see Figure 27 and the Placing the
AD7991/AD7995/AD7999 into High Speed Mode section).
However, if this is not always possible, then in order to maintain
the performance of the ADC, Bits D0 and D1 in the configuration
register are used to delay critical sample intervals and bit trials
from occurring while there is activity on the I2C bus. This results in
a quiet period for each bit decision. However, the sample delay
protection may introduce excessive jitter, degrading the SNR for
large signals above 300 Hz. For guaranteed ac performance, use
of clock stretching is recommended.
The conversion result register is a 16-bit read-only register that
stores the conversion result from the ADC in straight binary
format. A 2-byte read is necessary to read data from this
register. Table 12 shows the contents of the first byte to be read
from AD7991/AD7995/AD7999, and Table 13 shows the
contents of the second byte to be read.
Each AD7991/AD7995/AD7999 conversion result consists of
two leading 0s, two channel identifier bits, and the 12-/10-/8-bit
data result. For the AD7995, the two LSBs (D1 and D0) of the
second read contain two trailing 0s. For the AD7999, the four
LSBs (D3, D2, D1, and D0) of the second read contain four
trailing 0s.
When Bit D0 and Bit D1 are both 0, the bit trial and sample interval
delay mechanism is implemented. The default setting of D0 and D1
is 0. To turn off both delay mechanisms, set D0 and D1 to 1.
Table 12. Conversion Value Register (First Read)
D15
D14
D13
D12
D11
D10
D9
D8
Leading 0
Leading 0
CHID1
CHID0
MSB
B10
B9
B8
Table 13. Conversion Value Register (Second Read)
D7
D6
D5
D4
D3
D2
D1
D0
B7
B6
B5
B4
B3/0
B2/0
B1/0
B0/0
Rev. B | Page 21 of 28
AD7991/AD7995/AD7999
SERIAL INTERFACE
Control of the AD7991/AD7995/AD7999 is accomplished via
the I2C-compatible serial bus. The AD7991/AD7995/AD7999 is
connected to this bus as a slave device under the control of a
master device, such as the processor.
4. Data is sent over the serial bus in sequences of nine clock
pulses—eight bits of data followed by an acknowledge bit
from the receiver of data. Transitions on the data line must
occur during the low period of the clock signal and remain
stable during the high period because a low-to-high transition
when the clock is high may be interpreted as a stop signal.
SERIAL BUS ADDRESS
Like all I2C-compatible devices, the AD7991/AD7995/AD7999 has
a 7-bit serial address. The devices are available in two versions, the
AD7991-0/AD7995-0 and the AD7991-1/AD7995-1/AD7999-1.
Each version has a different address (see Table 8), which allows up
to two AD7991/AD7995 devices to be connected to a single
serial bus. AD7999 has only one version.
5. When all data bytes have been read or written, stop conditions
are established. In write mode, the master pulls the data line
high during the 10th clock pulse to assert a stop condition.
In read mode, the master device pulls the data line high
during the low period before the ninth clock pulse. This is
known as a no acknowledge. The master takes the data line
low during the low period before the 10th clock pulse, and
then high during the 10th clock pulse to assert a stop condition.
The serial bus protocol operates as follows:
1. The master initiates a data transfer by establishing a start
condition, defined as a high-to-low transition on the serial
data line SDA while the serial clock line, SCL, remains high.
This indicates that an address/data stream follows.
6. Any number of bytes of data can be transferred over the serial
bus in one operation, but it is not possible to mix reads and
writes in one operation because the type of operation is
determined at the beginning and cannot subsequently be
changed without starting a new operation.
2. All slave peripherals connected to the serial bus respond to
the start condition and shift in the next eight bits, consisting of
a 7-bit address (MSB first) plus an R/ bit that determines
W
the direction of the data transfer—that is, whether data is
written to or read from the slave device.
3. The peripheral whose address corresponds to the transmitted
address responds by pulling the data line low during the
low period before the ninth clock pulse, known as the
acknowledge bit. All other devices on the bus remain idle
while the selected device waits for data to be read from or
written to it. If the R/ bit is set to 0, the master writes to
W
the slave device. If the R/ bit is set to 1, the master reads
W
from the slave device.
Rev. B | Page 22 of 28
AD7991/AD7995/AD7999
WRITING TO THE AD7991/AD7995/AD7999
By default, each part operates in read-only mode and all four chan-
nels are selected as enabled in the configuration register. To write
to the AD7991/AD7995/AD7999 configuration register, the user
must first address the device.
The configuration register is an 8-bit register; therefore, only
one byte of data can be written to this register. However, writing
a single byte of data to this register consists of writing the serial
bus write address, followed by the data byte written (see Figure 24).
1
9
1
9
SCL
0
1
0
1
0
0
A0
R/W
D7
D6
D5
D4
D3
D2
D1
D0
SDA
START BY
MASTER
ACK BY
ADC
ACK BY
ADC
STOP
FRAME 1
SERIAL BUS ADDRESS BYTE
CONFIGURATION REGISTER BYTE
Figure 24. Writing to the AD7991/AD7995/AD7999 Configuration Register
Rev. B | Page 23 of 28
AD7991/AD7995/AD7999
READING FROM THE AD7991/AD7995/AD7999
Reading data from the conversion result register is a 2-byte
operation, as shown in Figure 25. Therefore, a read operation
always involves two bytes.
read operation and should not affect the read operation. The
master reads back two bytes of data. On the ninth SCLK rising
edge of the second byte, if the master sends an ACK, it keeps
reading conversion results and the AD7991/AD7995/AD7999
powers up and performs a second conversion. If the master sends
a NO ACK, the AD7991/AD7995/AD7999 does not power up
on the ninth SCLK rising edge of the second byte. If a further
conversion is required, the part converts on the next channel, as
selected in the configuration register. See Table 11 for information
about the channel selection.
After the AD7991/AD7995/AD7999 have received a read
address, any number of reads can be performed from the
conversion result register.
Following a start condition, the master writes the 7-bit address
of the AD7991/AD7995/AD7999 and then sets R/ to 1. The
W
AD7991/AD7995/AD7999 acknowledge this by pulling the
SDA line low. They then output the conversion result over the
I2C bus, preceded by four status bits. The status bits are two
leading 0s followed by the channel identifier bits. For the
AD7995 there are two trailing 0s, and for the AD7999 there are
four trailing 0s.
If the master sends a NO ACK on the ninth SCLK rising edge of
the second byte, the conversion is finished and no further
conversion is preformed.
To put the part into full shutdown mode, the user should issue a
stop condition to the AD7991/AD7995/AD7999. If the AD7991/
AD7995/AD7999 is not put into full shutdown mode, it will draw
a few tens of microamperes from the supply.
After the master has addressed the AD7991/AD7995/AD7999,
the part begins to power up on the ninth SCLK rising edge. At
the same time, the acquisition phase begins. When approximately
0.6 μs have elapsed, the acquisition phase ends. The input is
sampled and a conversion begins. This is done in parallel to the
1
9
1
0
9
SCL
0
1
0
1
0
0
A0
R/W
0
D11 D10
D9
D8
SDA
ACK BY
ADC
ACK BY
MASTER
START BY
MASTER
CH
CH
ID0
ID1
FRAME 2
MOST SIGNIFICANT DATA BYTE FROM ADC
FRAME 1
SERIAL BUS ADDRESS BYTE
1
9
SCL (CONTINUED)
SDA (CONTINUED)
D7
D6
D5
D4
D3
D2
D1
D0
NO ACK BY
MASTER
STOP BY
MASTER
FRAME 3
LEAST SIGNIFICANT DATA BYTE FROM ADC
Figure 25. Reading Two Bytes of Data from the AD7991Conversion Result Register
Rev. B | Page 24 of 28
AD7991/AD7995/AD7999
PLACING THE AD7991/AD7995/AD7999 INTO HIGH SPEED MODE
High speed mode communication commences after the master
addresses all devices connected to the bus with the master code,
00001XXX, to indicate that a high speed mode transfer is to
begin. No device connected to the bus is allowed to acknowledge
the high speed master code; therefore, the code is followed by a
NO ACK (see Figure 26). The master must then issue a repeated
All devices continue to operate in high speed mode until the
master issues a stop condition. When the stop condition is
issued, the devices return to fast mode.
To guarantee performance above fSCL = 1.7 MHz, the user must
perform clock stretching—that is, the clock must be held high—for
2 μs after the ninth clock rising edge (see Figure 27). Therefore,
the clock must be held high for 2 μs after the device starts to power
up (see the Reading from the AD7991/AD7995/AD7999 section).
start, followed by the device address and an R/ bit. The selected
W
device then acknowledges its address.
HIGH SPEED MODE
9
FAST MODE
1
9
1
SCL
1
0
0
0
0
1
X
X
X
0
1
0
0
A0
0
SDA
NO ACK Sr
START BY
MASTER
ACK BY
ADC
HS MODE MASTER CODE
SERIAL BUS ADDRESS BYTE
Figure 26. Placing the Part into High Speed Mode
CLOCK HIGH TIME = 2µs
1
0
9
1
9
SCL
1
0
1
0
0
A0
R/W
0
0
D11 D10
D9
D8
SDA
ACK BY
ADC
ACK BY
MASTER
START BY
MASTER
CH
CH
ID0
ID1
FRAME 2
MOST SIGNIFICANT DATA BYTE FROM ADC
FRAME 1
SERIAL BUS ADDRESS BYTE
1
9
SCL (CONTINUED)
SDA (CONTINUED)
D7
D6
D5
D4
D3
D2
D1
D0
NO ACK BY
MASTER
STOP BY
MASTER
FRAME 3
LEAST SIGNIFICANT DATA BYTE FROM ADC
Figure 27. Reading Two Bytes of Data from the Conversion Result Register in High Speed Mode for AD7991
Rev. B | Page 25 of 28
AD7991/AD7995/AD7999
MODE OF OPERATION
The AD7991/AD7995/AD7999 powers up in shutdown mode.
After the master addresses the AD7991/AD7995/AD7999 with
the correct I2C address, the ADC acknowledges the address. In
response, the AD7991/AD7995/AD7999 power up.
second byte of the conversion result. For the AD7991, this
second byte contains the lower eight bits of conversion data. For
the AD7995, this second byte contains six bits of conversion
data plus two trailing 0s. For the AD7999, this second byte
contains four bits of conversion data and four trailing 0s.
During this wake up time, the AD7991/AD7995/AD7999 exit
shutdown mode and begin to acquire the analog input (acquisition
phase). By default, all channels are selected. Which channels
are converted depends on the status of the channel bits in the
configuration register.
The master then sends a NO ACK to the AD7991/AD7995/
AD7999, as long as no further reads are required. If the master
instead sends an ACK to the AD7991/AD7995/AD7999, the
ADC powers up and completes another conversion. When
more than one channel bit has been set in the configuration
register, this conversion is performed on the second channel in
the selected sequence. If only one channel is selected, the ADC
converts again on the selected channel.
When the read address is acknowledged, the ADC outputs two
bytes of conversion data. The first byte contains four status bits
and the four MSBs of the conversion result. The status bits
contain two leading 0s and two channel-identifier bits. After
this first byte, the AD7991/AD7995/AD7999 outputs the
1
9
1
9
9
SCL
SDA
FIRST DATA BYTE
(MSB)
SECOND DATA BYTE
(LSB)
Sr
7-BIT ADDRESS
R
A
A
A
Sr/P
ACK. BY
ADC
ACK. BY
MASTER
NO ACK. BY
MASTER
Figure 28. Mode of Operation, Single-Channel Conversion
Rev. B | Page 26 of 28
AD7991/AD7995/AD7999
OUTLINE DIMENSIONS
3.00
2.90
2.80
8
1
7
6
3
5
4
3.00
2.80
2.60
1.70
1.60
1.50
2
PIN 1
INDICATOR
0.65 BSC
1.95
BSC
1.30
1.15
0.90
0.22 MAX
0.08 MIN
1.45 MAX
0.95 MIN
0.60
0.45
0.30
0.15 MAX
0.05 MIN
8°
4°
0°
SEATING
PLANE
0.60
BSC
0.38 MAX
0.22 MIN
COMPLIANT TO JEDEC STANDARDS MO-178-BA
Figure 29. 8-Lead Small Outline Transistor Package [SOT-23]
(RJ-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
8-Lead SOT-23
8-Lead SOT-23
8-Lead SOT-23
8-Lead SOT-23
8-Lead SOT-23
8-Lead SOT-23
8-Lead SOT-23
8-Lead SOT-23
8-Lead SOT-23
8-Lead SOT-23
8-Lead SOT-23
8-Lead SOT-23
Evaluation Board
Evaluation Board
Package Option
Branding
C56
C56
C55
C55
C58
C58
C57
C57
C6Y
C5B
C5B
C70
AD7991YRJZ-1RL
AD7991YRJZ-1500RL7
AD7991YRJZ-0RL
AD7991YRJZ-0500RL7
AD7995YRJZ-1RL
AD7995YRJZ-1500RL7
AD7995YRJZ-0RL
AD7995YRJZ-0500RL7
AD7995ARJZ-0RL
AD7999YRJZ-1RL
AD7999YRJZ-1500RL7
AD7999ARJZ-1RL
EVAL-AD7991EBZ
EVAL-AD7995EBZ
RJ-8
RJ-8
RJ-8
RJ-8
RJ-8
RJ-8
RJ-8
RJ-8
RJ-8
RJ-8
RJ-8
RJ-8
1 Z = RoHS Compliant Part.
Rev. B | Page 27 of 28
AD7991/AD7995/AD7999
NOTES
©2007–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06461-0-10/10(B)
Rev. B | Page 28 of 28
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