AD8002ARZ-R7 [ADI]

Dual 600 MHz, 50 mW Current Feedback Amplifier; 双600兆赫, 50毫瓦电流反馈放大器
AD8002ARZ-R7
型号: AD8002ARZ-R7
厂家: ADI    ADI
描述:

Dual 600 MHz, 50 mW Current Feedback Amplifier
双600兆赫, 50毫瓦电流反馈放大器

运算放大器 放大器电路 光电二极管
文件: 总20页 (文件大小:373K)
中文:  中文翻译
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Dual 600 MHz, 50 mW  
Current Feedback Amplifier  
a
AD8002  
FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
Excellent Video Specifications (RL = 150 , G = +2)  
Gain Flatness 0.1 dB to 60 MHz  
0.01% Differential Gain Error  
0.02؇ Differential Phase Error  
Low Power  
5.5 mA/Amp Max Power Supply Current (55 mW)  
High Speed and Fast Settling  
600 MHz, –3 dB Bandwidth (G = +1)  
500 MHz, –3 dB Bandwidth (G = +2)  
1200 V/s Slew Rate  
8-Lead Plastic DIP, SOIC, and SOIC  
OUT1  
–IN1  
+IN1  
V–  
V+  
1
2
3
4
8
7
6
5
OUT2  
–IN2  
+IN2  
AD8002  
16 ns Settling Time to 0.1%  
Low Distortion  
–65 dBc THD, fC = 5 MHz  
33 dBm Third Order Intercept, F1 = 10 MHz  
–66 dB SFDR, f = 5 MHz  
The outstanding bandwidth of 600 MHz along with 1200 V/µs  
of slew rate make the AD8002 useful in many general purpose  
high speed applications where dual power supplies of up to 6 V  
and single supplies from 6 V to 12 V are needed. The AD8002 is  
available in the industrial temperature range of –40°C to +85°C.  
–60 dB Crosstalk, f = 5 MHz  
High Output Drive  
1
Over 70 mA Output Current  
0
SIDE 1  
Drives Up to Eight Back-Terminated 75 Loads  
(Four Loads/Side) While Maintaining Good  
Differential Gain/Phase Performance (0.01%/0.17؇)  
Available in 8-Lead Plastic DIP, SOIC and SOIC Packages  
G = +2  
= 100  
1  
2  
3  
4  
5  
6  
7  
8  
9  
R
SIDE 2  
SIDE 1  
L
V
= 50mV  
IN  
0.1  
0
APPLICATIONS  
A-to-D Driver  
0.1  
0.2  
0.3  
0.4  
0.5  
Video Line Driver  
Differential Line Driver  
Professional Cameras  
Video Switchers  
Special Effects  
SIDE 2  
RF Receivers  
1M  
10M  
100M  
1G  
FREQUENCY Hz  
PRODUCT DESCRIPTION  
The AD8002 is a dual, low-power, high-speed amplifier designed  
to operate on 5 V supplies. The AD8002 features unique trans-  
impedance linearization circuitry. This allows it to drive video  
loads with excellent differential gain and phase performance on  
only 50 mW of power per amplifier. The AD8002 is a current  
feedback amplifier and features gain flatness of 0.1 dB to 60 MHz  
while offering differential gain and phase error of 0.01% and  
0.02°. This makes the AD8002 ideal for professional video  
electronics such as cameras and video switchers. Additionally,  
the AD8002’s low distortion and fast settling make it ideal for  
buffer high-speed A-to-D converters.  
Figure 1. Frequency Response and Flatness, G = +2  
SIDE 1  
G = +2  
1V STEP  
The AD8002 offers low power of 5.5 mA/amplifier max (VS =  
5 V) and can run on a single 12 V power supply, while capable  
of delivering over 70 mA of load current. It is offered in an  
8-lead plastic DIP, SOIC, and µSOIC package. These features  
make this amplifier ideal for portable and battery-powered  
applications where size and power are critical.  
SIDE 2  
200mV  
5ns  
Figure 2. 1 V Step Response, G = +1  
REV. D  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, nor for any infringements of patents or other rights of third parties  
which may result from its use. No license is granted by implication or  
otherwise under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
World Wide Web Site: www.analog.com  
© Analog Devices, Inc., 2001  
1
(@ T = 25؇C, V = ؎5 V, R = 100  
, RC = 75  
, unless otherwise noted.)  
AD8002–SPECIFICATIONS  
A
S
L
Model  
AD8002A  
Conditions  
Min  
Typ  
Max  
Unit  
DYNAMIC PERFORMANCE  
–3 dB Small Signal Bandwidth, N Package  
G = +2, RF = 750 Ω  
G = +1, RF = 1.21 kΩ  
G = +2, RF = 681 Ω  
G = +1, RF = 953 Ω  
G = +2, RF = 681 Ω  
G = +1, RF = 1 kΩ  
500  
600  
500  
600  
500  
600  
MHz  
MHz  
MHz  
MHz  
MHz  
MHz  
R Package  
RM Package  
Bandwidth for 0.1 dB Flatness  
N Package  
G = +2, RF = 750 Ω  
G = +2, RF = 681 Ω  
G = +2, RF = 681 Ω  
G = +2, VO = 2 V Step  
G = –1, VO = 2 V Step  
G = +2, VO = 2 V Step  
60  
90  
60  
700  
1200  
16  
MHz  
MHz  
MHz  
V/µs  
V/µs  
ns  
R Package  
RM Package  
Slew Rate  
Settling Time to 0.1%  
Rise and Fall Time  
G = +2, VO = 2 V Step, RF = 750 Ω  
2.4  
ns  
NOISE/HARMONIC PERFORMANCE  
Total Harmonic Distortion  
fC = 5 MHz, VO = 2 V p-p  
G = +2, RL = 100 Ω  
f = 5 MHz, G = +2  
f = 10 kHz, RC = 0 Ω  
f = 10 kHz, +In  
–65  
dBc  
Crosstalk, Output to Output  
Input Voltage Noise  
Input Current Noise  
–60  
2.0  
2.0  
18  
0.01  
0.02  
33  
dB  
nV/Hz  
pA/Hz  
pA/Hz  
%
Degree  
dBm  
–In  
Differential Gain Error  
Differential Phase Error  
Third Order Intercept  
1 dB Gain Compression  
SFDR  
NTSC, G = +2, RL = 150 Ω  
NTSC, G = +2, RL = 150 Ω  
f = 10 MHz  
f = 10 MHz  
f = 5 MHz  
14  
–66  
dBm  
dB  
DC PERFORMANCE  
Input Offset Voltage  
2.0  
2.0  
10  
6
9
mV  
mV  
µV/°C  
µA  
TMIN–TMAX  
Offset Drift  
–Input Bias Current  
5.0  
25  
35  
6.0  
10  
TMIN–TMAX  
TMIN–TMAX  
µA  
+Input Bias Current  
3.0  
µA  
µA  
Open Loop Transresistance  
VO  
=
2.5 V  
250  
175  
900  
kΩ  
TMIN–TMAX  
kΩ  
INPUT CHARACTERISTICS  
Input Resistance  
+Input  
–Input  
+Input  
10  
50  
1.5  
3.2  
MΩ  
Input Capacitance  
pF  
V
Input Common-Mode Voltage Range  
Common-Mode Rejection Ratio  
Offset Voltage  
–Input Current  
+Input Current  
VCM  
VCM  
VCM  
=
=
=
2.5 V  
2.5 V, TMIN–TMAX  
2.5 V, TMIN–TMAX  
49  
54  
0.3  
0.2  
dB  
µA/V  
µA/V  
1.0  
0.9  
OUTPUT CHARACTERISTICS  
Output Voltage Swing  
Output Current2  
RL = 150 Ω  
2.7  
85  
3.1  
70  
110  
V
mA  
mA  
Short Circuit Current2  
POWER SUPPLY  
Operating Range  
3.0  
6.0  
V
Quiescent Current/Both Amplifiers  
Power Supply Rejection Ratio  
TMIN–TMAX  
10.0  
75  
56  
0.5  
0.1  
11.5  
mA  
dB  
dB  
µA/V  
µA/V  
+VS = +4 V to +6 V, –VS = –5 V  
–VS = – 4 V to 6 V, +VS = +5 V  
TMIN–TMAX  
60  
49  
–Input Current  
+Input Current  
2.5  
0.5  
TMIN–TMAX  
NOTES  
1RC is recommended to reduce peaking and minimize input reflections at frequencies above 300 MHz. However, RC is not required.  
2Output current is limited by the maximum power dissipation in the package. See the power derating curves.  
Specifications subject to change without notice.  
–2–  
REV. D  
AD8002  
ABSOLUTE MAXIMUM RATINGS1  
MAXIMUM POWER DISSIPATION  
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2 V  
The maximum power that can be safely dissipated by the  
AD8002 is limited by the associated rise in junction tempera-  
ture. The maximum safe junction temperature for plastic  
encapsulated devices is determined by the glass transition tem-  
perature of the plastic, approximately 150°C. Exceeding this  
limit temporarily may cause a shift in parametric performance  
due to a change in the stresses exerted on the die by the package.  
Exceeding a junction temperature of 175°C for an extended  
period can result in device failure.  
Internal Power Dissipation2  
Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . . . . . 1.3 W  
Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . . . 0.9 W  
µSOIC Package (RM) . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 W  
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . VS  
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . 1.2 V  
Output Short Circuit Duration  
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves  
Storage Temperature Range N, R, RM . . . . . –65°C to +125°C  
Operating Temperature Range (A Grade) . . . 40°C to +85°C  
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300°C  
While the AD8002 is internally short circuit protected, this  
may not be sufficient to guarantee that the maximum junction  
temperature (150°C) is not exceeded under all conditions. To  
ensure proper operation, it is necessary to observe the maximum  
power derating curves.  
NOTES  
1Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. This is a stress rating only; functional operation of the  
device at these or any other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability.  
2Specification is for device in free air:  
2.0  
8-LEAD PLASTIC-DIP PACKAGE  
8-LEAD SOIC PACKAGE  
8-Lead Plastic DIP Package: θJA = 90°C/W  
1.5  
8-Lead SOIC Package: θJA = 155°C/W  
8-Lead µSOIC Package: θJA = 200°C/W  
T
= 150؇C  
J
1.0  
8-LEAD  
PACKAGE  
SOIC  
0.5  
0
50 40 30 20 10  
0
10 20 30 40 50 60 70 80 90  
AMBIENT TEMPERATURE –  
؇C  
Figure 3. Plot of Maximum Power Dissipation vs.  
Temperature  
ORDERING GUIDE  
Model  
Temperature Range  
Package Description  
Package Option  
Brand Code  
AD8002AN  
AD8002AR  
AD8002AR-REEL  
AD8002AR-REEL7  
AD8002ARM  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
8-Lead PDIP  
8-Lead SOIC  
N-8  
Standard  
Standard  
Standard  
Standard  
HFA  
SO-8  
SO-8  
SO-8  
RM-8  
RM-8  
RM-8  
8-Lead SOIC 13" REEL  
8-Lead SOIC 7" REEL  
8-Lead µSOIC  
8-Lead µSOIC 13" REEL  
8-Lead µSOIC 7" REEL  
AD8002ARM-REEL  
AD8002ARM-REEL7  
HFA  
HFA  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection.  
Although the AD8002 features proprietary ESD protection circuitry, permanent damage may  
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD  
precautions are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
REV. D  
–3–  
AD8002Typical Performance Characteristics  
750  
953  
10F  
10F  
+5V  
+5V  
0.1F  
0.1F  
750⍀  
AD8002  
AD8002  
75⍀  
50⍀  
75⍀  
0.1F  
0.1F  
R = 100⍀  
L
V
R
= 100⍀  
V
IN  
L
IN  
PULSE  
GENERATOR  
PULSE  
GENERATOR  
50⍀  
10F  
10F  
T /T = 250ps  
T
/T = 250ps  
F
R
F
5V  
R
5V  
TPC 1. Test Circuit , Gain = +1  
TPC 4. Test Circuit, Gain = +2  
SIDE 1  
SIDE 1  
G = +1  
G = +2  
100mV STEP  
100mV STEP  
SIDE 2  
SIDE 2  
5ns  
20mV  
5ns  
20mV  
TPC 2. 100 mV Step Response, G = +1  
TPC 5. 100 mV Step Response, G = +2  
SIDE 1  
G = +1  
G = +2  
1V STEP  
SIDE 1  
1V STEP  
SIDE 2  
SIDE 2  
5ns  
5ns  
200mV  
20mV  
TPC 3. 1 V Step Response, G = +1  
TPC 6. 1 V Step Response, G = +2  
–4–  
REV. D  
AD8002  
1
20  
30  
40  
50  
V
R
V
= 4dBV  
= 100  
= ؎5.0V  
IN  
0
SIDE 1  
L
OUTPUT SIDE 1  
G = +2  
S
1  
2  
3  
4  
5  
6  
7  
8  
9  
R
V
= 100  
= 50mV  
G = +2  
= 750⍀  
SIDE 2  
SIDE 1  
L
R
F
IN  
60  
70  
80  
0.1  
0
OUTPUT SIDE 2  
0.1  
0.2  
0.3  
0.4  
0.5  
75  
50⍀  
50⍀  
SIDE 2  
90  
100  
110  
120  
R
681⍀  
F
681⍀  
100k  
1M  
10M  
FREQUENCY Hz  
100M  
1M  
10M  
100M  
1G  
FREQUENCY Hz  
TPC 7. Frequency Response and Flatness, G = +2  
TPC 10. Crosstalk (Output-to-Output) vs. Frequency  
50  
G = +2  
L
R
= 100⍀  
G = + 2  
60  
70  
R
R
R
= 750  
= 75⍀  
= 100⍀  
SIDE 1  
F
C
L
2ND HARMONIC  
80  
3RD HARMONIC  
SIDE 2  
90  
100  
110  
5ns  
10k  
100k  
1M  
FREQUENCY Hz  
10M  
100M  
NOTES: SIDE 1: V = 0V; 8mV/div RTO  
IN  
SIDE 2: 1V STEP RTO; 400mV/div  
TPC 11. Pulse Crosstalk, Worst Case, 1 V Step  
TPC 8. Distortion vs. Frequency, G = +2, RL = 100 Ω  
60  
0.02  
2 BACK-TERMINATED  
G = +2  
LOADS (75)  
R
V
= 1k⍀  
0.01  
L
= 2V p-p  
70  
80  
OUT  
0.00  
0.01  
1 BACK-TERMINATED  
0.02  
LOAD (150)  
G = +2  
= 750⍀  
NTSC  
2ND HARMONIC  
R
F
90  
2 BACK-TERMINATED  
LOADS (75)  
3RD HARMONIC  
0.08  
0.06  
0.04  
100  
1 BACK-TERMINATED  
LOAD (150)  
110  
120  
0.02  
0.00  
10k  
100k  
1M  
FREQUENCY Hz  
10M  
100M  
1
2
3
4
5
6
IRE  
7
8
9
10  
11  
TPC 9. Distortion vs. Frequency, G = +2, RL = 1 kΩ  
TPC 12. Differential Gain and Differential Phase  
(per Amplifier)  
REV. D  
–5–  
AD8002  
2
6
3
0
3  
V
= 50mV  
IN  
G = +1  
F
L
SIDE 1  
SIDE 2  
1
R
R
= 953  
= 100⍀  
0
6  
0
3  
9  
1  
2  
3  
4  
5  
6  
12  
15  
18  
21  
24  
27  
9  
75  
50⍀  
50⍀  
G = +2  
12  
15  
18  
21  
R
= 681  
= ؎5V  
F
S
V
R
= 100⍀  
L
953⍀  
6  
1M  
10M  
100M  
FREQUENCY Hz  
1G  
1M  
10M  
FREQUENCY Hz  
100M  
500M  
TPC 13. Frequency Response, G = +1  
TPC 16. Large Signal Frequency Response, G = +2  
40  
50  
60  
70  
80  
90  
100  
9
R
= 100⍀  
L
6
3
G = +1  
L
G = +1  
R
R
V
= 100⍀  
= 1.21k⍀  
F
= 2V p-p  
OUT  
0
3  
6  
9  
75⍀  
50⍀  
50⍀  
2ND HARMONIC  
12  
15  
3RD HARMONIC  
1.21k⍀  
18  
27  
1M  
10M  
100M  
500M  
10k  
100k  
1M  
FREQUENCY Hz  
10M  
100M  
FREQUENCY Hz  
TPC 14. Distortion vs. Frequency, G = +1, RL = 100 Ω  
TPC 17. Large Signal Frequency Response, G = +1  
45  
40  
G = +1  
L
40  
V
R
= ؎5V  
= 100⍀  
S
R
= 1k⍀  
50  
60  
L
35  
30  
G = +100  
F
R
= 1000⍀  
25  
20  
70  
2ND HARMONIC  
3RD HARMONIC  
G = +10  
80  
R
= 499⍀  
F
15  
10  
5
90  
100  
110  
0
5  
1M  
10k  
100k  
1M  
10M  
100M  
10M  
FREQUENCY Hz  
100M  
1G  
FREQUENCY Hz  
TPC 18. Frequency Response, G = +10, G = +100  
TPC 15. Distortion vs. Frequency, G = +1, RL = 1 kΩ  
–6–  
REV. D  
AD8002  
G = +2  
2V STEP  
OUTPUT  
G = +2  
2V STEP  
R
R
R
= 750⍀  
= 75⍀  
= 100⍀  
F
C
L
R
R
= 750⍀  
= 75⍀  
F
C
ERROR,  
(0.05%/DIV)  
ERROR,  
(0.05%/DIV)  
OUTPUT  
INPUT  
INPUT  
400mV  
400mV  
10ns  
TPC 19. Short-Term Settling Time  
TPC 22. Long-Term Settling Time  
3.4  
3.3  
3.2  
3.1  
4
3
DEVICE #1  
R
= 150⍀  
L
V
= ؎5V  
S
2
1
+V  
OUT  
|V  
|
3.0  
2.9  
2.8  
OUT  
DEVICE #2  
DEVICE #3  
0
R
= 50⍀  
L
1  
V
= ؎5V  
S
2.7  
2.6  
2.5  
+V  
OUT  
2  
3  
|V  
|
OUT  
55  
35  
15  
5
25  
45  
65  
85  
105  
125  
55  
35  
15  
5
25  
45  
65  
85  
105  
125  
JUNCTION TEMPERATURE ؇C  
JUNCTION TEMPERATURE ؇C  
TPC 20. Output Swing vs. Temperature  
TPC 23. Input Offset Voltage vs. Temperature  
11.5  
11.0  
10.5  
5
4
IN  
3
2
1
V
= ؎5V  
S
10.0  
0
1  
2  
3  
9.5  
9.0  
+IN  
55  
35  
15  
5
25  
45  
65  
85  
105  
125  
55  
35  
15  
5
25  
45  
65  
85  
105  
125  
JUNCTION TEMPERATURE –  
؇C  
JUNCTION TEMPERATURE –  
؇C  
TPC 21. Input Bias Current vs. Temperature  
TPC 24. Total Supply Current vs. Temperature  
REV. D  
–7–  
AD8002  
120  
100  
115  
110  
R
= 50⍀  
bT  
R
R
V
= 750⍀  
= 75⍀  
= ؎5.0V  
F
C
S
105  
100  
95  
10  
1
POWER = 0dBm  
(223.6mVrms)  
G = +2  
|SINK I  
|
SC  
SOURCE I  
SC  
R
= 0⍀  
bT  
90  
0.1  
0.01  
85  
80  
75  
70  
55  
35  
15  
5
25  
45  
65  
85  
105  
125  
10k  
100k  
1M  
10M  
100M  
1G  
JUNCTION TEMPERATURE –  
؇C  
FREQUENCY Hz  
TPC 25. Short Circuit Current vs. Temperature  
TPC 28. Output Resistance vs. Frequency  
100  
100  
10  
1
1
3dB BANDWIDTH  
0
SIDE 1  
SIDE 2  
0.2  
1  
2  
3  
4  
5  
6  
7  
8  
9  
0.1  
0
INVERTING CURRENT V = ؎5V  
S
SIDE 1  
0.1dB FLATNESS  
0.1  
0.2  
0.3  
10  
V
= ؎5V  
S
SIDE 2  
V
= 50mV  
IN  
G = 1  
NONINVERTING CURRENT V = ؎5V  
S
R
R
= 100⍀  
= 549⍀  
L
F
VOLTAGE NOISE V = ؎5V  
S
1
100k  
100  
1k  
10k  
10  
1M  
10M  
100M  
1G  
FREQUENCY Hz  
FREQUENCY Hz  
TPC 26. Noise vs. Frequency  
TPC 29. –3 dB Bandwidth vs. Frequency, G = –1  
48  
49  
50  
50.0  
52.5  
PSRR  
55.0  
57.5  
CMRR  
2V SPAN  
51  
52  
60.0  
CURVES ARE FOR WORST-  
+CMRR  
62.5  
65.0  
CASE CONDITION WHERE  
ONE SUPPLY IS VARIED  
WHILE THE OTHER IS  
HELD CONSTANT.  
53  
54  
55  
56  
67.5  
70.0  
72.5  
75.0  
+PSRR  
55  
35  
15  
5
25  
45  
65  
85  
105  
125  
55  
35  
15  
5
25  
45  
65  
85  
105  
125  
JUNCTION TEMPERATURE –  
؇C  
JUNCTION TEMPERATURE ؇C  
TPC 30. PSRR vs. Temperature  
TPC 27. CMRR vs. Temperature  
–8–  
REV. D  
AD8002  
0
10  
20  
30  
40  
50  
60  
0
10  
20  
30  
40  
50  
V
V
= 200mV  
IN  
IN  
G = +2  
604  
604⍀  
154⍀  
50⍀  
57.6⍀  
154⍀  
0.1F  
PSRR  
5V  
+PSRR  
60  
70  
80  
90  
SIDE 1  
V
R
= ؎5.0V  
= 100⍀  
= 200mV  
S
L
SIDE 2  
V
IN  
30k 100k  
1M  
10M  
FREQUENCY Hz  
100M  
500M  
1M  
10M  
100M  
1G  
FREQUENCY Hz  
TPC 34. PSRR vs. Frequency  
TPC 31. CMRR vs. Frequency  
G = 1  
G = 2  
2V STEP  
SIDE 1  
SIDE 1  
R
R
R
= 576  
= 576⍀  
= 50⍀  
F
G
C
R
= 549⍀  
F
SIDE 2  
SIDE 2  
400mV  
5ns  
400mV  
5ns  
TPC 32. 2 V Step Response, G = –1  
TPC 35. 2 V Step Response, G = –2  
576  
549⍀  
576⍀  
274⍀  
50⍀  
50⍀  
54.9⍀  
50⍀  
61.9⍀  
50⍀  
G = 1  
100mV STEP  
SIDE 1  
SIDE 1  
R
= 549⍀  
F
SIDE 2  
SIDE 2  
G = 1  
R
R
R
R
= 576⍀  
= 576⍀  
= 50⍀  
F
G
C
L
= 100⍀  
20mV  
5ns  
20mV  
5ns  
TPC 36. 100 mV Step Response, G = –2  
TPC 33. 100 mV Step Response, G = –1  
REV. D  
–9–  
AD8002  
THEORY OF OPERATION  
Printed Circuit Board Layout Considerations  
A very simple analysis can put the operation of the AD8002, a  
current feedback amplifier, in familiar terms. Being a current  
feedback amplifier, the AD8002’s open-loop behavior is expressed  
as transimpedance, VO/I–IN, or TZ. The open-loop transim-  
pedance behaves just as the open-loop voltage gain of a voltage  
feedback amplifier, that is, it has a large dc value and decreases  
at roughly 6 dB/octave in frequency.  
As expected for a wideband amplifier, PC board parasitics can  
affect the overall closed-loop performance. Of concern are  
stray capacitances at the output and the inverting input nodes. If  
a ground plane is to be used on the same side of the board as  
the signal traces, a space (5 mm min) should be left around the  
signal lines to minimize coupling. Additionally, signal lines  
connecting the feedback and gain resistors should be short  
enough so that their associated inductance does not cause high  
frequency gain errors. Line lengths on the order of less than  
5 mm are recommended. If long runs of coaxial cable are being  
driven, dispersion and loss must be considered.  
Since the RIN is proportional to 1/gm, the equivalent voltage  
gain is just TZ × gm, where the gm in question is the trans-  
conductance of the input stage. This results in a low open-loop  
input impedance at the inverting input, a now familiar result.  
Using this amplifier as a follower with gain, Figure 4, basic  
analysis yields the following result.  
Power Supply Bypassing  
Adequate power supply bypassing can be critical when optimiz-  
ing the performance of a high-frequency circuit. Inductance in  
the power supply leads can form resonant circuits that produce  
peaking in the amplifiers response. In addition, if large current  
transients must be delivered to the load, bypass capacitors  
(typically greater than 1 µF) will be required to provide the  
best settling time and lowest distortion. A parallel combina-  
tion of 4.7 µF and 0.1 µF is recommended. Some brands of  
electrolytic capacitors will require a small series damping resis-  
tor 4.7 for optimum results.  
TZ (S)  
VO  
VIN  
= G ×  
R1  
TZ (S)+ G × RIN + R1  
G = 1+  
RIN = 1/g m 50 Ω  
R2  
R1  
R2  
DC Errors and Noise  
There are three major noise and offset terms to consider in a  
current feedback amplifier. For offset errors, refer to the equa-  
tion below. For noise error, the terms are root-sum-squared to  
give a net output error. In the circuit shown in Figure 5 they  
are input offset (VIO), which appears at the output multiplied by  
the noise gain of the circuit (1 + RF/RI), noninverting input  
current (IBN × RN), also multiplied by the noise gain, and the  
inverting input current, which, when divided between RF and RI  
and subsequently multiplied by the noise gain, always appears  
at the output as IBN × RF. The input voltage noise of the AD8002  
is a low 2 nV/Hz. At low gains, though, the inverting input  
current noise times RF is the dominant noise source. Careful  
layout and device matching contribute to better offset and  
drift specifications for the AD8002 compared to many other  
current feedback amplifiers. The typical performance curves in  
conjunction with the equations below can be used to predict the  
performance of the AD8002 in any application.  
R
IN  
V
OUT  
V
IN  
Figure 4.  
Recognizing that G × RIN << R1 for low gains, it can be seen to  
the first order that bandwidth for this amplifier is independent  
of gain (G).  
Considering that additional poles contribute excess phase at  
high frequencies, there is a minimum feedback resistance below  
which peaking or oscillation may result. This fact is used to  
determine the optimum feedback resistance, RF. In practice  
parasitic capacitance at the inverting input terminal will also add  
phase in the feedback loop, so picking an optimum value for RF  
can be difficult.  
Achieving and maintaining gain flatness of better than 0.1 dB at  
frequencies above 10 MHz requires careful consideration of  
several issues.  
RF  
RF  
VOUT = VIO × 1 +  
IBN × RN × 1 +  
IBI × RF  
RI   
RI   
Choice of Feedback and Gain Resistors  
R
F
The fine scale gain flatness will, to some extent, vary with  
feedback resistance. It, therefore, is recommended that once  
optimum resistor values have been determined, 1% tolerance  
values should be used if it is desired to maintain flatness over a  
wide range of production lots. In addition, resistors of different  
construction have different associated parasitic capacitance  
and inductance. Surface mount resistors were used for the bulk  
of the characterization for this data sheet. It is not recommended  
that leaded components be used with the AD8002.  
I
BI  
R
R
I
V
OUT  
I
BN  
N
Figure 5. Output Offset Voltage  
–10–  
REV. D  
AD8002  
45  
50  
55  
Driving Capacitive Loads  
G = +2  
The AD8002 was designed primarily to drive nonreactive loads.  
If driving loads with a capacitive component is desired, best  
frequency response is obtained by the addition of a small series  
resistance as shown in Figure 6.  
F
F
= 10MHz  
= 12MHz  
1
2
2F F  
2
1
60  
65  
70  
75  
80  
909⍀  
2F F  
1
2
R
SERIES  
I
N
R
L
C
500⍀  
L
8 7 6 5 4 3 2 1  
0
1
2
3
4
5
6
INPUT POWER dBm  
Figure 6. Driving Capacitive Loads  
Figure 8. Third Order IMD; F1 = 10 MHz, F2 = 12 MHz  
Figure 7 shows the optimum value for RSERIES versus capacitive  
load. It is worth noting that the frequency response of the circuit  
when driving large capacitive loads will be dominated by the  
passive roll-off of RSERIES and CL.  
Operation as a Video Line Driver  
The AD8002 has been designed to offer outstanding perfor-  
mance as a video line driver. The important specifications of  
differential gain (0.01%) and differential phase (0.02°) meet the  
most exacting HDTV demands for driving one video load with  
each amplifier. The AD8002 also drives four back-terminated  
loads (two each), as shown in Figure 9, with equally impressive  
performance (0.01%, 0.07°). Another important consideration  
is isolation between loads in a multiple load application. The  
AD8002 has more than 40 dB of isolation at 5 MHz when driv-  
ing two 75 back-terminated loads.  
40  
30  
20  
10  
75⍀  
CABLE  
75⍀  
750⍀  
750⍀  
V
#1  
OUT  
75⍀  
+V  
4.7F  
+
S
0.1F  
0
0
5
10  
15  
20  
25  
75⍀  
C
pF  
L
CABLE  
75⍀  
1/2  
AD8002  
V
#2  
OUT  
Figure 7. Recommended RSERIES vs. Capacitive Load  
75⍀  
0.1F  
4.7F  
Communications  
75⍀  
CABLE  
Distortion is a key specification in communications applications.  
Intermodulation distortion (IMD) is a measure of the ability of  
an amplifier to pass complex signals without the generation of  
spurious harmonics. The third order products are usually the  
most problematic since several of them fall near the fundamen-  
tals and do not lend themselves to filtering. Theory predicts that  
the third order harmonic distortion components increase in  
power at three times the rate of the fundamental tones. The  
specification of third order intercept as the virtual point where  
fundamental and harmonic power are equal is one standard mea-  
sure of distortion performance. Op amps used in closed-loop  
applications do not always obey this simple theory. At a gain of  
two, the AD8002 has performance summarized in Figure 8. Here  
the worst third order products are plotted versus. input power.  
The third order intercept of the AD8002 is 33 dBm at 10 MHz.  
V
IN  
V  
75⍀  
S
75⍀  
CABLE  
75⍀  
75⍀  
1/2  
AD8002  
V
#3  
OUT  
75⍀  
75⍀  
750⍀  
75⍀  
CABLE  
750⍀  
V
#4  
OUT  
Figure 9. Video Line Driver  
REV. D  
–11–  
AD8002  
Driving A-to-D Converters  
the AD9058s internal 2 V reference connected to both ADCs  
as shown in Figure 10 reduces the number of external compo-  
nents required to create a complete data acquisition system. The  
20 resistors in series with ADC inputs are used to help the  
AD8002s drive the 10 pF ADC input capacitance. The AD8002  
adds only 100 mW to the power consumption, while not limit-  
ing the performance of the circuit.  
The AD8002 is well suited for driving high-speed analog-to-  
digital converters such as the AD9058. The AD9058 is a dual  
8-bit 50 MSPS ADC. In Figure 10, the AD8002 is shown driv-  
ing the inputs of the AD9058 which are configured for 0 V to 2 V  
ranges. Bipolar input signals are buffered, amplified (2×), and  
offset (by 1.0 V) into the proper input range of the ADC. Using  
1k  
74ACT04  
ENCODE  
10pF  
50⍀  
10  
36  
ENCODE A  
ENCODE B  
8
549⍀  
V  
5, 9, 22,  
24, 37, 41  
REF A  
REF B  
+5V  
+V  
S
38  
V  
0.1F  
ANALOG  
IN A  
274⍀  
RZ1  
1/2  
20⍀  
6
؎0.5V  
18  
17  
16  
15  
14  
13  
12  
11  
A
IN A  
AD8002  
D
(LSB)  
0A  
50⍀  
1.1k⍀  
2V  
2
3
+V  
+V  
+V  
8
INT  
AD707  
20k⍀  
0.1F  
0.1F  
REF A  
REF B  
43  
20k⍀  
549⍀  
D
(MSB)  
(LSB)  
7A  
1.1k⍀  
274⍀  
RZ2  
AD9058  
(J-LEAD)  
28  
29  
30  
31  
32  
33  
34  
35  
D
0B  
ANALOG  
IN B  
؎0.5V  
1/2  
AD8002  
20⍀  
40  
1
8
A
IN B  
50⍀  
COMP  
0.1F  
D
(MSB)  
7B  
7, 20,  
26, 39  
CLOCK  
V  
5V  
S
RZ1, RZ2 = 2,000SIP (8-PKG)  
0.1F  
1N4001  
4,19, 21 25, 27, 42  
Figure 10. AD8002 Driving a Dual A-to-D Converter  
–12–  
REV. D  
AD8002  
Single-Ended-to-Differential Driver Using an AD8002  
The two halves of an AD8002 can be configured to create a  
single-ended-to-differential high-speed driver with a 3 dB  
bandwidth in excess of 200 MHz, as shown in Figure 11. Although  
the individual op amps are each current feedback, the overall  
architecture yields a circuit with attributes normally associated  
with voltage feedback amplifiers, while offering the speed advan-  
tages inherent in current feedback amplifiers. In addition, the gain  
of the circuit can be changed by varying a single resistor, RF,  
which is often not possible in a dual op amp differential driver.  
With a feedback resistor RF, an input resistor RG, and grounding  
of the +input of Op Amp #2, a feedback amplifier is formed.  
This configuration is just like a voltage feedback amplifier in an  
inverting configuration if only Output #2 is considered. The  
addition of Output #1 makes the amplifier differential output.  
The differential gain of this circuit is:  
RF  
RG  
RA  
R
G =  
× 1 +  
B  
The RF/RG term is the gain of the overall op amp configuration  
and is the same as for an inverting op amp except for the polarity.  
If Output #1 is used as the output reference, the gain is posi-  
tive. The 1 + RA/RB term is the noise gain of each individual op  
amp in its noninverting configuration.  
C
0.51.5pF  
511  
C
R
F
R
511⍀  
G
OP AMP #1  
50⍀  
V
IN  
1/2  
AD8002  
OUTPUT #1  
The resulting architecture offers several advantages. First, the gain  
can be changed by changing a single resistor. Changing either  
RF or RG will change the gain as in an inverting op amp circuit.  
For most types of differential circuits, more than one resistor  
must be changed to change gain and still maintain good CMR.  
R
A
511⍀  
R
R
511⍀  
B
B
511⍀  
R
A
511⍀  
Reactive elements can be used in the feedback network. This is  
in contrast to current feedback amplifiers that restrict the use of  
reactive elements in the feedback. The circuit described requires  
about 0.9 pF of capacitance in shunt across RF in order to optimize  
peaking and realize a 3 dB bandwidth of more than 200 MHz.  
50⍀  
1/2  
AD8002  
OUTPUT #2  
OP AMP #2  
Figure 11. Differential Line Driver  
The peaking exhibited by the circuit is very sensitive to the value  
of this capacitor. Parasitics in the board layout on the order of  
tenths of picofarads will influence the frequency response and  
the value required for the feedback capacitor, so a good lay-  
out is essential.  
The current feedback nature of the op amps, in addition to  
enabling the wide bandwidth, provides an output drive of more  
than 3 V p-p into a 20 load for each output at 20 MHz. On the  
other hand, the voltage feedback nature provides symmetrical  
high impedance inputs and allows the use of reactive compo-  
nents in the feedback network.  
The shunt capacitor type selection is also critical. A good micro-  
wave type chip capacitor with high Q was found to yield best  
performance. The part selected for this circuit was a muRata  
Erie part number MA280R9B.  
The circuit consists of the two op amps, each configured as a  
unity gain follower by the 511 RA feedback resistors between  
each op amps output and inverting input. The output of each op  
amp has a 511 RB resistor to the inverting input of the other  
op amp. Thus, each output drives the other op amp through a  
unity gain inverter configuration. By connecting the two amplifi-  
ers as cross-coupled inverters, their outputs are freed to be equal  
and opposite, assuring zero-output common-mode voltage.  
The distortion was measured at 20 MHz with a 3 V p-p input  
and a 100 load on each output. For Output #1 the distortion  
is 37 dBc and 41 dBc for the second and third harmonics  
respectively. For Output #2 the second harmonic is 35 dBc  
and the third harmonic is 43 dBc.  
With this circuit configuration, the common-mode signal of the  
outputs is reduced. If one output moves slightly higher, the nega-  
tive input to the other op amp drives its output to go slightly  
lower and thus preserves the symmetry of the complementary  
outputs, which reduces the common-mode signal. The common-  
mode output signal was measured to be 50 dB at 1 MHz.  
6
C
= 0.9pF  
C
4
2
0
2  
4  
6  
Looking at this configuration overall, there are two high imped-  
ance inputs (the + inputs of each op amp), two low impedance  
outputs, and high open-loop gain. If we consider the two nonin-  
verting inputs and just the output of Op Amp #2, the structure  
looks like a voltage feedback op amp having two symmetrical,  
high-impedance inputs, and one output. The +input to Op Amp  
#2 is the noninverting input (it has the same polarity as Output  
#2) and the +input to Amplifier #1 is the inverting input (oppo-  
site polarity of Output #2).  
OUT+  
8  
10  
12  
14  
OUT–  
1M  
10M  
100M  
1G  
FREQUENCY Hz  
Figure 12. Differential Driver Frequency Response  
REV. D  
–13–  
AD8002  
Layout Considerations  
R
F
The specified high-speed performance of the AD8002 requires  
careful attention to board layout and component selection.  
Proper RF design techniques and low parasitic component selec-  
tion are mandatory.  
+V  
S
R
G
IN  
R
BT  
OUT  
R
T
R
S
The PCB should have a ground plane covering all unused por-  
tions of the component side of the board to provide a low  
impedance ground path. The ground plane should be removed  
from the area near the input pins to reduce stray capacitance.  
V  
S
Inverting Configuration  
Chip capacitors should be used for supply bypassing (see Figure  
13). One end should be connected to the ground plane and the  
other within 1/8 in. of each power pin. An additional large tanta-  
lum electrolytic capacitor (4.7 µF10 µF) should be connected in  
parallel, but not necessarily so close, to supply current for fast,  
large-signal changes at the output.  
+V  
S
C1  
C3  
0.1F  
10F  
C2  
0.1F  
C4  
10F  
V  
S
The feedback resistor should be located close to the inverting  
input pin in order to keep the stray capacitance at this node to a  
minimum. Capacitance variations of less than 1 pF at the invert-  
ing input will significantly affect high-speed performance.  
Supply Bypassing  
R
F
+V  
Stripline design techniques should be used for long signal traces  
(greater than about 1 in.). These should be designed with a  
characteristic impedance of 50 or 75 and be properly termi-  
nated at each end.  
S
R
G
R
BT  
OUT  
*R  
C
IN  
R
T
V  
S
*SEE TABLE I  
Noninverting Configuration  
Figure 13. Inverting and Noninverting Configurations  
Table I. Recommended Component Values  
AD8002AN (DIP)  
Gain  
AD8002AR (SOIC)  
Gain  
Component  
–10  
–2  
–1  
+1  
1210 750  
750  
+2  
+10  
+100 –10  
–2  
–1  
+1  
+2  
+10  
+100  
RF ()  
499  
49.9 274  
549  
576  
576  
499  
54.9 10  
1000 499  
499  
549  
549  
953  
681  
681  
499  
54.9 10  
1000  
R
G ()  
49.9 249  
R
BT (Nominal) ()  
49.9 49.9 49.9 49.9 49.9 49.9 49.9 49.9 49.9 49.9 49.9 49.9 49.9 49.9  
RC ()*  
RS ()  
RT (Nominal) ()  
75 75 75 75  
0
0
0
0
49.9 49.9 49.9  
61.9 54.9 49.9 49.9 49.9 49.9  
49.9 49.9 49.9  
250  
50  
61.9 54.9 49.9 49.9 49.9 49.9  
410  
100  
Small Signal BW (MHz) 270  
380  
80  
410  
130  
600  
35  
500  
60  
170  
24  
17  
3
410  
100  
600  
35  
500  
90  
170  
24  
17  
3
0.1 dB Flatness (MHz)  
45  
AD8002ARM (SOIC)  
Gain  
Component  
–10  
–2  
–1  
+1  
1000 681  
681  
+2  
+10  
+100  
RF ()  
499  
49.9 249  
499  
590  
590  
499  
54.9 10  
1000  
RG ()  
RBT (Nominal) ()  
49.9 49.9 49.9 49.9 49.9 49.9 49.9  
RC ()*  
75 75  
0
0
RS ()  
49.9 49.9 49.9  
61.9 49.9 49.9 49.9 49.9 49.9  
RT (Nominal) ()  
Small Signal BW (MHz) 270  
400  
100  
410  
100  
600  
35  
450  
70  
170  
35  
19  
3
0.1 dB Flatness (MHz)  
60  
*RC is recommended to reduce peaking, and minimizes input reflections at frequencies above 300 MHz. However, R C is not required.  
–14–  
REV. D  
AD8002  
Figure 14. Board Layout (Silkscreen)  
REV. D  
–15–  
AD8002  
Figure 15. Board Layout (Component Layer)  
–16–  
REV. D  
AD8002  
Figure 16. Board Layout (Solder Side) (Looking through the Board)  
REV. D  
–17–  
AD8002  
OUTLINE DIMENSIONS  
Dimensions shown in inches and (mm).  
8-Lead Plastic DIP (N-8)  
0.430 (10.92)  
0.348 (8.84)  
8
5
4
0.280 (7.11)  
0.240 (6.10)  
1
0.325 (8.25)  
0.300 (7.62)  
PIN 1  
0.100 (2.54)  
BSC  
0.060 (1.52)  
0.015 (0.38)  
0.210  
(5.33)  
MAX  
0.195 (4.95)  
0.115 (2.93)  
0.130  
(3.30)  
MIN  
0.160 (4.06)  
0.115 (2.93)  
0.015 (0.381)  
0.008 (0.204)  
0.022 (0.558) 0.070 (1.77) SEATING  
0.014 (0.356) 0.045 (1.15)  
PLANE  
8-Lead SOIC (SO-8)  
0.1968 (5.00)  
0.1890 (4.80)  
8
1
5
4
0.2440 (6.20)  
0.2284 (5.80)  
0.1574 (4.00)  
0.1497 (3.80)  
PIN 1  
0.0196 (0.50)  
0.0099 (0.25)  
0.0500 (1.27)  
BSC  
؋
 45؇  
0.0688 (1.75)  
0.0532 (1.35)  
0.0098 (0.25)  
0.0040 (0.10)  
8؇  
0؇  
0.0500 (1.27)  
0.0160 (0.41)  
0.0192 (0.49)  
0.0138 (0.35)  
0.0098 (0.25)  
0.0075 (0.19)  
SEATING  
PLANE  
8-Lead SOIC (RM-8)  
0.122 (3.10)  
0.114 (2.90)  
8
5
4
0.122 (3.10)  
0.114 (2.90)  
0.199 (5.05)  
0.187 (4.75)  
1
PIN 1  
0.0256 (0.65) BSC  
0.120 (3.05)  
0.112 (2.84)  
0.120 (3.05)  
0.112 (2.84)  
0.043 (1.09)  
0.037 (0.94)  
0.006 (0.15)  
0.002 (0.05)  
33؇  
0.018 (0.46)  
0.008 (0.20)  
27؇  
0.028 (0.71)  
0.016 (0.41)  
0.011 (0.28)  
0.003 (0.08)  
SEATING  
PLANE  
–18–  
REV. D  
Revision HistoryAD8002  
Location  
Page  
Data Sheet changed from REV. C to REV. D.  
MAX RATINGS changed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
REV. D  
–19–  
–20–  

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