AD8075 [ADI]

500 MHz, G = +-1 and +2 Triple Video Buffers with Disable; 500兆赫, G = + -1和2三路视频缓冲器,具有禁用
AD8075
型号: AD8075
厂家: ADI    ADI
描述:

500 MHz, G = +-1 and +2 Triple Video Buffers with Disable
500兆赫, G = + -1和2三路视频缓冲器,具有禁用

文件: 总16页 (文件大小:305K)
中文:  中文翻译
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500 MHz, G = +1 and +2 Triple  
Video Buffers with Disable  
a
AD8074/AD8075  
FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
Dual Supply ؎5 V  
High-Speed Fully Buffered Inputs and Outputs  
600 MHz Bandwidth (–3 dB) 200 mV p-p  
500 MHz Bandwidth (–3 dB) 2 V p-p  
1600 V/s Slew Rate, G = +1  
1350 V/s Slew Rate, G = +2  
Fast Settling Time: 4 ns  
Low Supply Current: <30 mA  
Excellent Video Specifications (RL = 150 ):  
Gain Flatness of 0.1 dB to 50 MHz  
0.01% Differential Gain Error  
0.01؇ Differential Phase Error  
“All Hostile“ Crosstalk  
AD8074/AD8075  
1
2
3
4
5
6
7
8
16  
15  
V
CC  
OE  
DGND  
IN2  
V
CC  
G =  
+1/+2  
14 OUT2  
13  
V
AGND  
IN1  
EE  
12 OUT1  
11  
G =  
+1/+2  
V
AGND  
IN0  
CC  
G =  
+1/+2  
10 OUT0  
V
V
9
EE  
EE  
–80 dB @ 10 MHz  
–50 dB @ 100 MHz  
High “OFF” Isolation of 90 dB @ 10 MHz  
Low Cost  
Fast Output Disable Feature  
APPLICATIONS  
RGB Buffer in LCD and Plasma Displays  
RGB Driver  
Video Routers  
Table I. Truth Table  
OUT0, 1, 2  
PRODUCT DESCRIPTION  
The AD8074/AD8075 are high-speed triple video buffers with  
G = +1 and +2 respectively. They have a –3 dB full signal band-  
width in excess of 450 MHz, along with slew rates in excess of  
1400 V/µs. With better than –80 dB of all hostile crosstalk and  
90 dB isolation, they are useful in many high-speed applica-  
tions. The differential gain and differential phase error are 0.01%  
and 0.01°. Gain flatness of 0.1 dB up to 50 MHz makes the  
AD8074/AD8075 ideal for RGB buffering or driving. They  
consume less than 30 mA on a 5 V supply.  
OE  
0
1
IN0, IN1, IN2  
High Z  
Both devices offer a high-speed disable feature that allows the  
outputs to be put into a high impedance state. This allows the  
building of larger input arrays while minimizing “OFF” chan-  
nel output loading. The AD8074/AD8075 are offered in a  
16-lead TSSOP package.  
REV. A  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use,norforanyinfringementsofpatentsorotherrightsofthirdparties that  
may result from its use. No license is granted by implication or otherwise  
under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
www.analog.com  
© Analog Devices, Inc., 2001  
(TA = 25؇C, VS = ؎5 V, unless otherwise noted.)  
AD8074/AD8075–SPECIFICATIONS  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
DYNAMIC PERFORMANCE  
–3 dB Bandwidth (Small Signal)  
V
V
V
V
V
V
IN = 200 mV p-p, CL = 5 pF  
IN = 200 mV p-p, RL = 150 Ω  
IN = 2 V p-p, CL = 5 pF  
IN = 2 V p-p, RL = 150 Ω  
IN = 200 mV p-p, CL = 5 pF  
IN = 200 mV p-p, RL = 150 Ω  
330/310  
250/230  
330/300  
250/230  
600/550  
400/400  
500/500  
350/350  
70/65  
70/65  
1600/1350  
4/7.5  
MHz  
MHz  
MHz  
MHz  
MHz  
MHz  
V/µs  
ns  
–3 dB Bandwidth (Large Signal)  
0.1 dB Bandwidth  
Slew Rate  
Settling Time to 0.1%  
2 V Step, RL = 1 k/150 Ω  
2 V Step, RL = 1 k/150 Ω  
NOISE/DISTORTION PERFORMANCE  
Differential Gain  
Differential Phase  
V= 3.58 MHz, 150 Ω  
V= 3.58 MHz, 150 Ω  
V= 10 MHz, RL = 1 kΩ  
V= 100 MHz, RL = 1 kΩ  
V= 10 MHz, RL = 150 Ω  
V= 10 kHz to 100 MHz  
0.01  
0.01  
–80/–74  
–50/–44  
90  
%
Degrees  
dB  
dB  
dB  
All Hostile Crosstalk  
OFF Isolation  
Voltage Noise  
19.5/22  
nV/Hz  
DC PERFORMANCE  
Voltage Gain Error  
Input Offset Voltage  
No Load  
0.1/ 0.2  
2.5  
3
10  
5
0.15/ 0.65  
27/40  
%
mV  
mV  
µV/°C  
µA  
TMIN to TMAX  
Input Offset Drift  
Input Bias Current  
9.5/10  
INPUT CHARACTERISTICS  
Input Resistance  
Input Capacitance  
10  
1.5  
1.5  
2.8/ 1.4  
MΩ  
pF  
pF  
V
Channel Enabled  
Channel Disabled  
Input Voltage Range  
OUTPUT CHARACTERISTICS  
Output Voltage Swing  
RL = 1 kΩ  
+VS – 1.95 +VS – 1.8  
–VS + 2.1 –VS + 1.8  
V
V
RL = 150 Ω  
+VS – 2.35 +VS – 2.2  
–VS + 2.30 –VS + 2.2  
V
V
Short Circuit Current (Protected)  
Output Resistance  
70  
0.5  
7.5  
2.2  
mA  
MΩ  
pF  
Enabled  
Disabled  
Disabled  
3.5  
Output Capacitance  
POWER SUPPLY  
Operating Range  
4.5  
5.5  
V
Power Supply Rejection Ratio  
+PSRR: +VS = +4.5 V to +5.5 V, –VS = –5 V  
–PSRR: –VS = –4.5 V to –5.5 V, +VS = +5 V  
All Channels “ON”  
All Channels “OFF”  
TMIN to TMAX  
60  
56  
74  
64  
21.5/24  
3/4  
23/26  
dB  
dB  
mA  
mA  
mA  
Quiescent Current  
30  
5.5  
DIGITAL INPUT  
Logic “1” Voltage  
Logic “0” Voltage  
Logic “1” Input Current  
Logic “0” Input Current  
OE Input  
OE Input  
OE = 4 V  
OE = 0.4 V  
2.0  
V
V
nA  
µA  
0.8  
100  
1
OPERATING TEMPERATURE RANGE  
Temperature Range  
θJA  
θJC  
Operating (Still Air)  
Operating (Still Air)  
Operating  
–40  
+85  
°C  
°C/W  
°C/W  
150.4  
27.6  
Specifications subject to change without notice.  
–2–  
REV. A  
AD8074/AD8075  
ORDERING GUIDE  
ABSOLUTE MAXIMUM RATINGS1  
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.0 V  
Temperature  
Range  
Package  
Description  
Package  
Option  
Internal Power Dissipation2, 3  
Model  
AD8074/AD8075 16-Lead TSSOP (RU) . . . . . . . . . . . . . 1 W  
Input Voltage  
AD8074ARU  
AD8075ARU  
AD8074-EVAL  
AD8075-EVAL  
–40°C to +85°C 16-Lead Plastic TSSOP RU-16  
–40°C to +85°C 16-Lead Plastic TSSOP RU-16  
Evaluation Board  
IN0, IN1, IN2 . . . . . . . . . . . . . . . . . . . . . . . . . VEE VIN VCC  
OE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DGND VIN VCC  
Output Short Circuit Duration . . . . . . . . . . . . . . . . . . Indefinite3  
Storage Temperature Range . . . . . . . . . . . . . . –65°C to +150°C  
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . . . 300°C  
Evaluation Board  
PIN CONFIGURATION  
NOTES  
1Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. This is a stress rating only; functional operation of the  
device at these or any other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability.  
2Specification is for device in free air (TA = 25°C).  
AD8074/AD8075  
1
2
3
4
5
6
7
8
16  
15  
V
CC  
OE  
DGND  
IN2  
V
CC  
G =  
14 OUT2  
13  
+1/+2  
316-lead plastic TSSOP; θJA = 150.4°C/W. Maximum internal power dissipa-  
V
AGND  
IN1  
EE  
12 OUT1  
11  
tion (PD  
) should be derated for ambient temperature (TA) such that  
PD < (150°C – TA)/θJA  
.
G =  
+1/+2  
V
AGND  
IN0  
CC  
G =  
+1/+2  
10 OUT0  
V
V
9
EE  
EE  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection. Although  
the AD8074/AD8075 features proprietary ESD protection circuitry, permanent damage may occur  
on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions  
are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
1.5  
MAXIMUM POWER DISSIPATION  
T
= 150؇C  
J
The maximum power that can be safely dissipated by the AD8074/  
AD8075 is limited by the associated rise in junction temperature.  
The maximum safe junction temperature for plastic encapsulated  
devices is determined by the glass transition temperature of the  
1.0  
plastic, approximately 150°C. Temporarily exceeding this limit  
may cause a shift in parametric performance due to a change in  
the stresses exerted on the die by the package. Exceeding a junc-  
tion temperature of 175°C for an extended period can result in  
device failure.  
0.5  
While the AD8074/AD8075 is internally short circuit protected,  
this may not be sufficient to guarantee that the maximum junction  
temperature (150°C) is not exceeded under all conditions. To  
ensure proper operation, it is necessary to observe the maximum  
power derating curves shown in Figure 1.  
0
–50  
–30  
–10  
0
10  
30  
50  
90  
70  
AMBIENTTEMPERATURE – ؇C  
Figure 1. Maximum Power Dissipation vs. Temperature  
REV. A  
–3–  
AD8074/AD8075Typical Performance Characteristics  
1
0.4  
1
0.4  
GAIN  
GAIN  
0
0.3  
0
0.3  
1  
2  
3  
4  
5  
6  
7  
8  
9  
0.2  
1  
2  
3  
4  
5  
6  
7  
8  
9  
0.2  
2V p-p  
0.1  
0.1  
200mV p-p  
FLATNESS  
FLATNESS  
0
200mV p-p  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
2V p-p  
2V p-p  
0.1  
1
10  
FREQUENCY MHz  
100  
1000  
0.1  
1
10  
FREQUENCY MHz  
100  
1000  
TPC 1. AD8074 Frequency Response; RL = 150 Ω  
TPC 4. AD8075 Frequency Response; RL = 150 Ω  
2
1
0.6  
2
1
0.6  
0.5  
0.5  
GAIN  
GAIN  
0
0.4  
0
0.4  
1  
2  
3  
4  
5  
6  
7  
8  
9  
10  
0.3  
1  
2  
3  
4  
5  
6  
7  
8  
9  
10  
0.3  
2V p-p  
0.2  
0.2  
2V p-p  
2V p-p  
0.1  
0.1  
FLATNESS  
FLATNESS  
0
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
200mV p-p  
2V p-p  
200mV p-p  
200mV p-p  
0.1  
1
10  
FREQUENCY MHz  
100  
1000  
0.1  
1
10  
FREQUENCY MHz  
100  
1000  
TPC 2. AD8074 Frequency Response; RL = 1 k, CL = 5 pF  
TPC 5. AD8075 Frequency Response; RL = 1 k, CL = 5 pF  
3
3
C
= 10pF  
C
= 10pF  
2
1
L
2
1
L
0
0
1  
2  
3  
4  
5  
6  
7  
8  
9  
10  
1  
2  
3  
4  
5  
6  
7  
8  
9  
10  
C
C
= 0pF  
C
C
= 0pF  
= 5pF  
L
L
= 5pF  
V
L
L
V
IN  
OUT  
V
V
IN  
OUT  
150k  
C
1k⍀  
L
75⍀  
C
L
75⍀  
V
= 2V p-p  
OUT  
V
= 2V p-p  
1
OUT  
0.1  
1
10  
FREQUENCY MHz  
100  
1000  
0.1  
10  
FREQUENCY MHz  
100  
1000  
TPC 3. AD8074 Frequency Response vs. Capacitive Load  
TPC 6. AD8075 Frequency Response vs. Capacitive Load  
–4–  
REV. A  
AD8074/AD8075  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
110  
V
R
R
= 2V p-p (ACTIVE CHANNEL(s))  
= 1k⍀  
= 37.5⍀  
V
R
R
= 2V p-p (ACTIVE CHANNEL(s))  
OUT  
OUT  
= 150⍀  
L
T
L
T
= 37.5⍀  
ALL-HOSTILE  
ALL-HOSTILE  
ADJACENT  
ADJACENT  
100  
110  
0.1  
1
10  
FREQUENCY MHz  
100  
1000  
0.1  
1
10  
100  
1000  
FREQUENCY MHz  
TPC 7. AD8074 Crosstalk vs. Frequency (All Hostile and  
Adjacent RL = 1 k)  
TPC 9. AD8075 Crosstalk vs. Frequency (All Hostile and  
Adjacent RL = 150 )  
0
0
V
R
R
= 2V p-p  
= 150  
= 37.5⍀  
V
R
R
= 2V p-p  
= 150  
= 37.5⍀  
OUT  
OUT  
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
10  
20  
30  
40  
50  
60  
70  
L
T
L
T
SECOND  
HARMONIC  
SECOND  
HARMONIC  
THIRD  
HARMONIC  
80  
90  
THIRD  
HARMONIC  
100  
1
10  
100  
1000  
1
10  
100  
1000  
FUNDAMENTAL FREQUENCY MHz  
FUNDAMENTAL FREQUENCY MHz  
TPC 8. AD8074 Distortion vs. Frequency  
TPC 10. AD8075 Distortion vs. Frequency  
REV. A  
–5–  
AD8074/AD8075  
20  
20  
30  
40  
50  
60  
70  
80  
90  
100  
110  
30  
40  
50  
60  
70  
80  
90  
R
= 1k  
L
R
= 1k  
L
R
= 150⍀  
L
R
= 150⍀  
L
100  
110  
0.1  
1
10  
100  
1000  
0.1  
1
10  
FREQUENCY MHz  
100  
1000  
FREQUENCY MHz  
TPC 14. AD8075 Off Isolation vs. Frequency  
TPC 11. AD8074 Off Isolation vs. Frequency  
20  
10  
0
10  
0
10  
PSRR  
10  
20  
30  
40  
50  
60  
70  
80  
+PSRR  
20  
30  
40  
+PSRR  
PSRR  
50  
60  
70  
0.1  
1
10  
100  
1000  
0.1  
1
10  
FREQUENCY MHz  
100  
1000  
FREQUENCY MHz  
TPC 15. AD8075 PSRR vs. Frequency  
TPC 12. AD8074 PSRR vs. Frequency  
350  
400  
350  
300  
250  
200  
150  
100  
50  
300  
250  
200  
150  
100  
50  
0
0
10  
100  
1k  
10k  
100k  
1M  
10  
100  
1k  
10k  
100k  
1M  
FREQUENCY Hz  
FREQUENCY Hz  
TPC 16. AD8075 Voltage Noise vs. Frequency  
TPC 13. AD8074 Voltage Noise vs. Frequency  
–6–  
REV. A  
AD8074/AD8075  
10000  
10000  
1000  
100  
10  
1000  
100  
10  
1
1
0.1  
0.01  
0.1  
0.01  
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
1000  
FREQUENCY MHz  
FREQUENCY MHz  
TPC 17. AD8074 Input Impedance vs. Frequency  
TPC 20. AD8075 Input Impedance vs. Frequency  
1000  
1000  
100  
100  
10  
1
10  
1
0.1  
0.1  
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
1000  
FREQUENCY MHz  
FREQUENCY MHz  
TPC 21. AD8075 Output Impedance vs. Frequency;  
Enabled  
TPC 18. AD8074 Output Impedance vs. Frequency;  
Enabled  
1000  
100  
10  
1000  
100  
10  
1
1
0.1  
0.01  
0.1  
0.01  
0.001  
0.001  
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
1000  
FREQUENCY MHz  
FREQUENCY MHz  
TPC 19. AD8074 Output Impedance vs. Frequency;  
Disabled  
TPC 22. AD8075 Output Impedance vs. Frequency;  
Disabled  
REV. A  
–7–  
AD8074/AD8075  
0.15  
0.10  
0.05  
0
0.15  
V
= 200mV STEP  
O
V
= 200mV STEP  
O
0.10  
0.05  
0
0.05  
0.05  
0.10  
0.10  
0.15  
2ns  
2ns  
0.15  
TPC 23. AD8074 Small Signal Pulse Response (RL = 1 k,  
CL = 5 pF)  
TPC 26. AD8075 Small Signal Pulse Response (RL = 150 k)  
0.8  
0.7  
0.8  
0.7  
V
= 700mV STEP  
0.6  
0.5  
0.4  
O
V
= 700mV STEP  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
O
0.3  
0.2  
0.1  
0
2ns  
0.1  
0.2  
2ns  
0.1  
TPC 24. AD8074 Video Amplitude Pulse Response  
TPC 27. AD8075 Video Amplitude Pulse Response  
(RL = 1 k, CL = 5 pF)  
(RL = 150 )  
1.5  
1.5  
V
= 2V STEP  
O
V = 2V STEP  
O
1.0  
0.5  
1.0  
0.5  
0
0.5  
1.0  
1.5  
0
0.5  
1.0  
2ns  
2ns  
1.5  
TPC 25. AD8074 Large Signal Pulse Response  
(RL = 1 k, CL = 5 pF)  
TPC 28. AD8075 Large Signal Pulse Response (RL = 150 )  
–8–  
REV. A  
AD8074/AD8075  
THEORY OF OPERATION  
APPLICATIONS  
Response Tuning  
The AD8074 (G = +1) and AD8075 (G = +2) are triple-channel,  
high-speed buffers with TTL-compatible output enable control.  
Optimized for buffering RGB (red, green, blue) video sources,  
the devices have high peak slew rates, maintaining their band-  
width for large signals. Additionally, the buffers are compensated  
for high phase margin, minimizing overshoot for good pixel  
resolution. The buffers also have video specifications that are  
suitable for buffering NTSC or PAL composite signals.  
It has been mentioned in passing that the primary cause of over-  
shoot for the AD8074 and AD8075 is the presence of large  
reactive loads at the output. If the system exhibits excessive  
ringing while settling, a 10 50 series resistor may be used  
at the output to isolate the emitter-follower output buffer from  
the reactive load. If the output exhibits an overdamped response,  
the system designer may add a few pF shunt capacitance at the  
output to tune for a faster edge transition. A system with a small  
degree of overshoot will settle faster than an overdamped system.  
The buffers are organized as three independent channels, each  
with an input transconductance stage and an output trans-  
impedance stage. Each channel is characterized by low input  
capacitance and high input impedance. The transconductance  
stages, NPN differential pairs, source signal current into the folded  
cascode output stages. Each output stage contains a compensat-  
ing network and emitter follower output buffer. Internal voltage  
feedback sets the gain, the AD8074 being configured as a unity  
gain follower, and the AD8075 as a gain-of-two amplifier with a  
feedback network. The architecture provides drive for a reverse-  
terminated video load (150 ) with low differential gain and  
phase error for relatively low power consumption. Careful chip  
design and layout allow excellent crosstalk isolation between  
channels.  
2.0  
R
C
= 10  
= 10pF  
S
L
1.5  
1.0  
R
C
= 0⍀  
= 5pF  
S
L
0.5  
R
C
= 20⍀  
= 15pF  
S
L
0
0.5  
1.0  
1.5  
2.0  
R
S
V
V
OUT  
IN  
C
1k⍀  
L
75⍀  
2ns  
One logic pin, OE, controls whether the three outputs are  
enabled, or disabled to a high-impedance state. The high imped-  
ance disable allows larger matrices to be built when busing the  
outputs together. When disabled, the AD8074 and AD8075 con-  
sume a fifth the power as when enabled. In the case of the  
AD8075 (G = +2), a feedback isolation scheme is used so that  
the impedance of the gain-of-two feedback network does not  
load the output.  
Figure 2. Driving Capacitive Loads  
Single Supply Operation  
The AD8074 and AD8075 may be operated from a single 10 V  
supply. In this configuration, the AD8075s AGND pins must  
be tied near midsupply, as AGND provides the reference for the  
ground buffer, to which the internal gain network is terminated.  
Full power bandwidth for an undistorted sinusoid is often calcu-  
lated using peak slew rate from the equation:  
Logic is referenced to DGND. The buffers are disabled in single  
supply operation for VOE > VDGND + ~2.0 V and enabled for  
V
OE < VDGND + 0.8 V. TTL logic levels are expected. The fol-  
Peak Slew Rate  
Full Power Bandwidth =  
lowing restrictions are placed upon the digital ground potential:  
2 × π × Sinusoidal Amplitude  
3.5V VAVCC VDGND 12V  
VDGND VAVEE  
Peak slew rate is not the same as average slew rate (25% to  
75%) which is typically specified. For a natural response, peak  
slew rate may be 2.7 times larger than average slew rate. There-  
fore, calculating a full power bandwidth with a specified average  
slew rate will give a pessimistic result.  
The architecture of the output buffer is such that the output  
voltage can swing to within ~2.3 V of either rail. For example, if  
the output need swing only 2 V, then the buffers could be oper-  
ated on dual 3.5 V or single 7 V supplies. It is cautioned that  
saturation effects may become noticeable when the output swings  
within 2.6 V of either rail. The system designer may opt to  
use this characteristic to his or her advantage by using the  
soft-saturation regime, (2.2 V2.6 V from the supply rails), to  
tame excessive overshoot. The designer is cautioned that a  
charge storage associated time delay of several nanoseconds is  
incurred when recovering from soft-saturation. This effect  
results in longer settling tails.  
The primary cause of overshoot in these amplifiers is the pres-  
ence of large reactive loads at the output and insufficient series  
isolation of the load. However, it is possible to overdrive these  
amplifiers with 1 V, subnanosecond input-pulse edges. The  
ensuing dynamics may give rise to subnanosecond overshoot. To  
reduce these effects, an edge-rate limiting network at the input  
should be considered for input transition times less than 0.5 ns.  
REV. A  
–9–  
AD8074/AD8075  
RGB Buffer for Second Monitor  
can be connected to the same signal, as is done in some studio-  
type TV monitors.  
The RGB signals for PC monitors are driven through coax  
cables whose characteristic impedance is 75 . The graphics  
chip will generally have current-source output drivers that should  
be double terminated with a 75 shunt termination at each end.  
On the transmit end, the shunt terminations are provided to  
ground close to the graphics IC, while the monitor terminates  
its end via internal termination resistors. While this scheme works  
well and is virtually foolproof for a single monitor, it leaves no  
means for passively connecting a second monitor to the same source.  
A way around this problem is to connect the first monitor to the  
RGB channels in the standard fashion, and then to provide a  
triple gain-of-two buffer to drive the second monitor. The AD8075  
is designed to provide this function and also provide excellent  
high-frequency performance for high-resolution graphics signals.  
Figure 3 shows a schematic of this circuit.  
The outputs of the AD8075 are low impedance voltage sources  
and are therefore series-terminated with 75 resistors. The  
internal resistors in Monitor #2 provide the terminations at its  
end. The overall effect of this type of termination scheme is to  
divide the signal amplitude by two. This is compensated by the  
gain of two provided by the AD8075.  
A second monitor that is connected simply in parallel will pro-  
vide an extra set of terminations that will upset the signal levels.  
To keep costs low, most computer monitors do not have the ability  
to open-circuit the terminations in order that an additional monitor  
MONITOR #1  
PC GRAPHICS IC  
R
75  
75⍀  
CURRENT SOURCE  
OUTPUT DRIVERS  
G
INTERNAL  
75⍀  
75⍀  
TERMINATIONS  
B
75⍀  
75⍀  
+5V  
+5V  
+5V  
+
25F  
0.1F  
0.1F  
0.1F  
MONITOR #2  
75⍀  
75⍀  
75⍀  
75⍀  
AD8075  
INTERNAL  
TERMINATIONS  
75⍀  
75⍀  
25F  
0.1F  
0.1F  
0.1F  
+
5V  
5V  
5V  
Figure 3. Buffer  
–10–  
REV. A  
AD8074/AD8075  
Triple Video Multiplexer  
and the amplifier output are disabled to a high impedance to  
provide a high-impedance disabled state.  
The AD8074 and AD8075 each have an output-enable function  
that can be used to disable the outputs and put them in a high-  
impedance state. Usually, for a unity-gain device, it is relatively  
easy to provide high disabled impedance, because the feedback  
path is from the output to a high-impedance input. However, for a  
non-unity-gain part, the feedback provides a resistive path to  
ground. This will usually dominate the disabled output imped-  
ance, and make it a much lower value than the unity-gain device.  
To construct a multiplexer, the outputs from one or more devices  
are connected in parallel and only one device is enabled at a  
time while all of the others are disabled. The two sets of inputs  
are applied individually to each of the separate device inputs.  
Figure 4 shows the circuit details for this function. The first RGB  
Source 1 is input to the first AD8075. Each of the individual  
signals is terminated to ground with 75 to provide proper  
termination for the input cables. In a similar fashion, the Source  
2 signals are input to the second AD8075.  
The AD8075 has an internal buffer that provides a low-impedance,  
ground level output that terminates the feedback path during  
enabled operation. In the disabled state, both this buffer output  
+5V  
+5V  
+5V  
+
25F  
0.1F  
0.1F  
0.1F  
75⍀  
R
R
G
B
75⍀  
75⍀  
75⍀  
AD8075  
75⍀  
75⍀  
SOURCE 1  
G
B
OUTPUT  
OE  
25F  
0.1F  
0.1F  
0.1F  
+
5V  
5V  
5V  
SEL1/SEL2  
+5V  
+5V  
+5V  
+
25F  
0.1F  
0.1F  
0.1F  
OE  
75⍀  
75⍀  
75⍀  
R
G
B
75⍀  
75⍀  
75⍀  
AD8075  
SOURCE 2  
25F  
0.1F  
0.1F  
0.1F  
+
5V  
5V  
5V  
Figure 4. Mux  
–11–  
REV. A  
AD8074/AD8075  
Each of the six outputs has a 75 series resistor that is used to  
reverse-terminate the output transmission line. The correspond-  
ing outputs are then wired in parallel and delivered to the output  
cable. The termination resistors in this position help to isolate  
the off capacitance of the disabled devices outputs from loading  
the enabled devices outputs. The gain-of-two of the AD8075  
compensates for the signal halving that occurs as a result of the  
output terminations.  
A major area of focus should be the power distribution system.  
There should be a full ground plane that provides the reference  
and return paths for both the inputs and outputs. The ground  
also provides isolation between the input signals to minimize the  
crosstalk. This ground plane should cover as wide an area as  
possible and be minimally interrupted in order to keep its  
impedance to a minimum.  
The power planes should also be as broad as possible to provide  
minimal inductance, which is required for high-slew-rate sig-  
nals. These power planes layers should be spaced closely to the  
ground plane to increase the interplane capacitance between the  
supplies and ground.  
A select signal is provided directly to the OE of the second  
AD8075 and an inverted version is used to drive the other devices  
OE. This will ensure that only one device is active at a time. Since  
there is a total of 150 in series between any two outputs, it is  
not essential to be overly concerned about the exact timing of  
the making and breaking of the enable signals.  
Each supply pin should be bypassed with a low inductance  
0.1 µF ceramic capacitance with minimal excess circuit length  
to minimize the series impedance. A 25 µF tantalum electro-  
lytic capacitor will supply a charge reservoir for lower frequency,  
high-amplitude transitions.  
Additional inputs can easily be added to the circuit shown to  
make wider multiplexers. The outputs of all of the devices will  
be wired in parallel, and the logic must allow that only one output  
be enabled at a time.  
The input and output signals should be run as directly as pos-  
sible in order to minimize the effects of parasitics. If they must  
run over a longer distance of more than a few centimeters, con-  
trolled impedance PCB traces should be used to minimize the  
effect of reflections due to mismatches in impedance and the  
proper termination should be provided.  
If it is desired to make a triple 3:1 multiplexer, a triple 2:1 mul-  
tiplexer, like the AD8185 can be used along with the AD8075.  
The same general guidelines for input and output treatment  
should be followed and the logic must perform the proper function.  
If it is desired to design such a multiplexer at unity gain, the  
AD8074 should be used. For a triple 3:1 multiplexer, an  
AD8183 (triple 2:1 mux) can be combined with an AD8074 to  
provide this function.  
To avoid excess crosstalk, the above recommendations should  
be followed carefully. The power system and signal routing are  
the most important aspects of preventing excess crosstalk.  
Beyond these techniques, shielding can be provided by ground  
traces between adjacent signals, especially those that travel  
parallel over long distances.  
Layout and Grounding  
The AD8074 and AD8075 are extreme bandwidth, high-slew-rate  
devices that are designed to drive up to the highest resolution  
monitors and provide excellent resolution. To realize their full  
performance potential, it is essential to adhere to the best prac-  
tices of high-speed PCB layout.  
–12–  
REV. A  
AD8074/AD8075  
TP2  
+
DO NOT INSTALL  
V
EE  
V
V
P1  
1
EE  
EE  
50IMPEDANCE LINE  
C2  
10F  
TP3  
TP4  
AGND  
AGND  
V
CC  
AGND  
P1  
P1  
2
3
AGND  
R16  
20k⍀  
AGND  
AGND  
TP1  
DO NOT INSTALL  
V
CC  
W2  
V
V
CC  
CC  
+
50IMPEDANCE LINE  
C1  
10F  
TP5  
AGND  
50IMPEDANCE LINE  
DISOUT  
AGND  
DISOUT  
R11  
50⍀  
V
CC  
DO NOT INSTALL  
C15  
0.01F  
C14  
0.01F  
AGND  
IN2  
75IMPEDANCE LINE  
IN2  
AGND  
AGND  
C3  
0.1F  
DO NOT INSTALL  
75IMPEDANCE LINE  
R7  
75⍀  
OUT2  
OUT2  
R1  
C7  
AGND  
75⍀  
R6  
150⍀  
0.1F  
DUT  
V
EE  
C13  
AGND  
IN1  
AGND  
DO NOT INSTALL  
AGND  
V
0.01F  
1
2
3
4
5
6
7
8
16  
CC  
OE  
DGND  
75IMPEDANCE LINE  
75IMPEDANCE LINE  
AGND  
AGND  
AGND  
IN1  
IN0  
V
15  
CC  
AGND  
IN2  
OUT2 14  
R2  
75⍀  
75IMPEDANCE LINE  
R8  
75⍀  
AGND  
IN1  
V
13  
12  
11  
10  
9
EE  
OUT1  
OUT1  
OUT1  
AGND  
IN0  
R10  
150⍀  
AGND  
AGND  
IN0  
V
V
CC  
CC  
C12  
0.01F  
OUT0  
DO NOT INSTALL  
V
V
V
V
EE  
EE  
EE  
EE  
AGND  
C6  
0.1F  
C8  
C11  
0.01F  
R3  
75⍀  
AD8074  
AGND  
0.01F  
AGND  
R9  
75⍀  
75IMPEDANCE LINE  
AGND  
AGND  
AGND  
OUT0  
OUT0  
R12  
150⍀  
AGND  
DO NOT INSTALL  
AGND  
Figure 5. Evaluation Board Schematic  
REV. A  
–13–  
AD8074/AD8075  
Figure 6. Component Side  
Figure 8. Silkscreen Top  
Figure 9. Silkscreen Bottom  
Figure 7. Circuit Side  
Figure 10. Internal 2  
–14–  
REV. A  
AD8074/AD8075  
OUTLINE DIMENSIONS  
Dimensions shown in inches and (mm).  
Controlling Dimension: Metric, shown in parentheses.  
16-Lead TSSOP  
(RU-16)  
0.201 (5.10)  
0.193 (4.90)  
16  
9
0.177 (4.50)  
0.169 (4.30)  
0.256 (6.50)  
0.246 (6.25)  
1
8
PIN 1  
0.006 (0.15)  
0.002 (0.05)  
0.0433 (1.10)  
MAX  
8؇  
0؇  
0.0118 (0.30)  
0.0075 (0.19)  
0.0256 (0.65)  
0.028 (0.70)  
0.020 (0.50)  
0.0079 (0.20)  
0.0035 (0.090)  
SEATING  
PLANE  
BSC  
REV. A  
–15–  
AD8074/AD8075  
Revision History  
Location  
Page  
Data Sheet changed from REV. 0 to REV. A.  
Addition to equation in SINGLE SUPPLY OPERATION section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
–16–  
REV. A  

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