AD815ARB-24-REEL [ADI]

High Output Current Differential Driver; 高输出电流差分驱动器
AD815ARB-24-REEL
型号: AD815ARB-24-REEL
厂家: ADI    ADI
描述:

High Output Current Differential Driver
高输出电流差分驱动器

线路驱动器或接收器 驱动程序和接口 接口集成电路 光电二极管
文件: 总16页 (文件大小:336K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
High Output Current  
Differential Driver  
a
AD815  
FUNCTIONAL BLOCK DIAGRAM  
FEATURES  
15-Lead Through-Hole SIP (Y) and Surface-Mount  
DDPAK(VR)  
Flexible Configuration  
Differential Input and Output Driver  
or Two Single-Ended Drivers  
High Output Power  
15  
14  
13  
12  
11  
10  
9
NC  
NC  
Power Package  
NC  
26 dBm Differential Line Drive for ADSL Application  
40 V p-p Differential Output Voltage, RL = 50   
500 mA Minimum Output Drive/Amp, RL = 5 ⍀  
Thermally Enhanced SOIC  
400 mA Minimum Output Drive/Amp, RL = 10 ⍀  
Low Distortion  
–66 dB @ 1 MHz THD, RL = 200 , VOUT = 40 V p-p  
0.05% and 0.45؇ Differential Gain and Phase, RL = 25 ⍀  
(6 Back-Terminated Video Loads)  
High Speed  
TAB IS  
NC  
+V  
S
+IN2  
–IN2  
OUT2  
+V  
S
8
AD815  
7
–V  
S
6
OUT1  
–IN1  
+IN1  
NC  
5
4
3
2
1
NC  
NC  
120 MHz Bandwidth (–3 dB)  
900 V/s Differential Slew Rate  
70 ns Settling Time to 0.1%  
NC = NO CONNECT  
REFER TO PAGE 3 FOR 24-LEAD SOIC PACKAGE  
Thermal Shutdown  
coupling transformer with a greater than 1:1 turns ratio. The  
low harmonic distortion of –66 dB @ 1 MHz into 200  
combined with the wide bandwidth and high current drive make  
the differential driver ideal for communication applications such  
as subscriber line interfaces for ADSL, HDSL and VDSL.  
APPLICATIONS  
ADSL, HDSL and VDSL Line Interface Driver  
Coil or Transformer Driver  
CRT Convergence and Astigmatism Adjustment  
Video Distribution Amp  
Twisted Pair Cable Driver  
The AD815 differential slew rate of 900 V/µs and high load drive  
are suitable for fast dynamic control of coils or transformers,  
and the video performance of 0.05% and 0.45° differential gain  
and phase into a load of 25 enable up to 12 back-terminated  
loads to be driven.  
PRODUCT DESCRIPTION  
The AD815 consists of two high speed amplifiers capable of  
supplying a minimum of 500 mA. They are typically configured  
as a differential driver enabling an output signal of 40 V p-p on  
±15 V supplies. This can be increased further with the use of a  
Three package styles are available, and all work over the  
industrial temperature range (–40°C to +85°C). Maximum  
output power is achieved with the power package available for  
through-hole mounting (Y) and surface-mounting (VR). The  
24-lead SOIC (RB) is capable of driving 26 dBm for full rate  
ADSL with proper heat sinking.  
–40  
V
= ؎15V  
S
G = +10  
–50  
–60  
V
= 40V p-p  
OUT  
+15V  
1/2  
AD815  
100⍀  
R
= 15⍀  
1
–70  
AMP1  
R
= 50⍀  
L
–80  
499⍀  
(DIFFERENTIAL)  
R
120⍀  
R
= 200⍀  
V
=
V =  
D
40Vp-p  
L
L
IN  
V
=
OUT  
G = +10  
–90  
110⍀  
(DIFFERENTIAL)  
4Vp-p  
40Vp-p  
499⍀  
–100  
R
= 15⍀  
2
AMP2  
–15V  
–110  
100⍀  
1:2  
TRANSFORMER  
1/2  
AD815  
100  
1k  
10k  
100k  
1M  
10M  
FREQUENCY – Hz  
Total Harmonic Distortion vs. Frequency  
Subscriber Line Differential Driver  
REV. B  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, nor for any infringements of patents or other rights of third parties  
which may result from its use. No license is granted by implication or  
otherwise under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
World Wide Web Site: http://www.analog.com  
© Analog Devices, Inc., 1999  
AD815–SPECIFICATIONS  
(@ TA = +25؇C, VS = ؎15 V dc, RFB = 1 kand RLOAD = 100 unless otherwise noted)  
AD815A  
Model  
Conditions  
VS  
Min  
Typ Max Units  
DYNAMIC PERFORMANCE  
Small Signal Bandwidth (–3 dB)  
G = +1  
G = +1  
G = +2  
G = +2  
±15  
±5  
±15  
±5  
±15  
±15  
100  
90  
120  
110  
40  
10  
900  
70  
MHz  
MHz  
MHz  
MHz  
V/µs  
ns  
Bandwidth (0.1 dB)  
Differential Slew Rate  
Settling Time to 0.1%  
V
OUT = 20 V p-p, G = +2  
800  
10 V Step, G = +2  
NOISE/HARMONIC PERFORMANCE  
Total Harmonic Distortion  
Input Voltage Noise  
f = 1 MHz, RLOAD = 200 , VOUT = 40 V p-p ±15  
–66  
1.85  
1.8  
19  
0.05  
0.45  
dBc  
f = 10 kHz, G = +2 (Single Ended)  
f = 10 kHz, G = +2  
f = 10 kHz, G = +2  
NTSC, G = +2, RLOAD = 25 Ω  
NTSC, G = +2, RLOAD = 25 Ω  
±5, ±15  
nV/Hz  
pA/Hz  
pA/Hz  
%
Input Current Noise (+IIN  
)
±5, ±15  
±5, ±15  
±15  
Input Current Noise (–IIN  
Differential Gain Error  
Differential Phase Error  
)
±15  
Degrees  
DC PERFORMANCE  
Input Offset Voltage  
±5  
±15  
5
10  
8
15  
30  
mV  
mV  
mV  
µV/°C  
mV  
mV  
mV  
µV/°C  
µA  
µA  
µA  
µA  
µA  
TMIN – TMAX  
Input Offset Voltage Drift  
Differential Offset Voltage  
20  
0.5  
0.5  
±5  
±15  
2
4
5
TMIN – TMAX  
Differential Offset Voltage Drift  
–Input Bias Current  
10  
10  
±5, ±15  
±5, ±15  
±5, ±15  
±5, ±15  
90  
150  
5
5
75  
100  
TMIN – TMAX  
TMIN – TMAX  
TMIN – TMAX  
TMIN – TMAX  
+Input Bias Current  
2
Differential Input Bias Current  
Open-Loop Transresistance  
10  
5.0  
µA  
MΩ  
MΩ  
1.0  
0.5  
INPUT CHARACTERISTICS  
Differential Input Resistance  
+Input  
–Input  
±15  
7
15  
MΩ  
Differential Input Capacitance  
Input Common-Mode Voltage Range  
±15  
±15  
±5  
±5, ±15  
±5, ±15  
1.4  
13.5  
3.5  
65  
pF  
±V  
±V  
dB  
dB  
Common-Mode Rejection Ratio  
Differential Common-Mode Rejection Ratio TMIN – TMAX  
TMIN – TMAX  
57  
80  
100  
OUTPUT CHARACTERISTICS  
Voltage Swing  
Single Ended, RLOAD = 25 Ω  
±15  
±5  
±15  
11.0  
1.1  
21  
11.7  
1.8  
23  
±V  
±V  
±V  
±V  
Differential, RLOAD = 50 Ω  
MIN – TMAX  
T
±15  
22.5  
24.5  
Output Current1, 2  
VR, Y  
RLOAD = 5 Ω  
±15  
±5  
±15  
±15  
±15  
500  
350  
400  
750  
400  
500  
1.0  
13  
mA  
mA  
mA  
A
RB-24  
Short Circuit Current  
Output Resistance  
RLOAD = 10 Ω  
MATCHING CHARACTERISTICS  
Crosstalk  
f = 1 MHz  
±15  
–65  
dB  
POWER SUPPLY  
Operating Range3  
Quiescent Current  
TMIN – TMAX  
±18  
30  
40  
40  
55  
V
±5  
±15  
±5  
±15  
±5, ±15  
23  
30  
mA  
mA  
mA  
mA  
dB  
TMIN – TMAX  
TMIN – TMAX  
Power Supply Rejection Ratio  
NOTES  
–55  
–66  
1Output current is limited in the 24-lead SOIC package to the maximum power dissipation. See absolute maximum ratings and derating curves.  
2See Figure 12 for bandwidth, gain, output drive recommended operation range.  
3Observe derating curves for maximum junction temperature.  
Specifications subject to change without notice.  
–2–  
REV. B  
AD815  
ABSOLUTE MAXIMUM RATINGS1  
MAXIMUM POWER DISSIPATION  
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Total  
The maximum power that can be safely dissipated by the AD815  
is limited by the associated rise in junction temperature. The  
maximum safe junction temperature for the plastic encapsulated  
parts is determined by the glass transition temperature of the  
plastic, about 150°C. Exceeding this limit temporarily may  
cause a shift in parametric performance due to a change in the  
stresses exerted on the die by the package. Exceeding a junction  
temperature of 175°C for an extended period can result in  
device failure.  
Internal Power Dissipation2  
Plastic (Y and VR) . . 3.05 Watts (Observe Derating Curves)  
Small Outline (RB) . . 2.4 Watts (Observe Derating Curves)  
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ±VS  
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . ±6 V  
Output Short Circuit Duration  
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves  
Can Only Short to Ground  
Storage Temperature Range  
Y, VR and RB Package . . . . . . . . . . . . . . . –65°C to +125°C  
Operating Temperature Range  
AD815A . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C  
Lead Temperature Range (Soldering, 10 sec) . . . . . . . +300°C  
The AD815 has thermal shutdown protection, which guarantees  
that the maximum junction temperature of the die remains below a  
safe level, even when the output is shorted to ground. Shorting  
the output to either power supply will result in device failure.  
To ensure proper operation, it is important to observe the  
derating curves and refer to the section on power considerations.  
NOTES  
1Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. This is a stress rating only; functional operation of the  
device at these or any other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability.  
It must also be noted that in high (noninverting) gain configurations  
(with low values of gain resistor), a high level of input overdrive  
can result in a large input error current, which may result in a  
significant power dissipation in the input stage. This power  
must be included when computing the junction temperature rise  
due to total internal power.  
2Specification is for device in free air with 0 ft/min air flow: 15-Lead Through-Hole  
and Surface Mount: θJA = 41°C/W; 24-Lead Surface Mount: θJA = 52°C/W.  
PIN CONFIGURATION  
24-Lead Thermally-Enhanced SOIC (RB-24)  
14  
T
= 150؇C  
J
13  
12  
11  
θJA = 16؇C/W  
1
2
24  
23  
22  
21  
20  
19  
18  
17  
16  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
SOLDERED DOWN TO  
COPPER HEAT SINK  
(STILL AIR = 0FT/MIN)  
10  
9
3
AD815 AVR, AY  
8
4
7
6
θJA = 41؇C/W  
(STILL AIR = 0FT/MIN)  
5
AD815  
TOP VIEW  
THERMAL  
HEAT TABS  
THERMAL  
HEAT TABS  
6
NO HEAT SINK  
5
4
(Not to Scale)  
7
AD815 AVR, AY  
+V  
*
+V  
*
S
S
8
3
θJA = 52؇C/W  
(STILL AIR = 0 FT/MIN)  
NO HEAT SINK  
+IN1  
–IN1  
9
+IN2  
2
1
AD815ARB-24  
10  
15 –IN2  
0
OUT1 11  
–V  
14 OUT2  
–50 –40 –30 –20 –10  
0
10 20 30 40 50 60 70 80 90  
12  
13 +V  
S
S
AMBIENT TEMPERATURE – ؇C  
NC = NO CONNECT  
*HEAT TABS ARE CONNECTED TO THE POSITIVE SUPPLY.  
Plot of Maximum Power Dissipation vs. Temperature  
ORDERING GUIDE  
Package Description  
Model  
Temperature Range  
Package Option  
AD815ARB-24  
AD815ARB-24-REEL  
AD815AVR  
AD815AY  
AD815AYS  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
24-Lead Thermally Enhanced SOIC  
24-Lead Thermally Enhanced SOIC  
15-Lead Surface Mount DDPAK  
15-Lead Through-Hole SIP with Staggered Leads and 90° Lead Form  
15-Lead Through-Hole SIP with Staggered Leads and Straight Lead Form  
Evaluation Board  
RB-24  
RB-24  
VR-15  
Y-15  
YS-15  
AD815-EB  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection.  
Although the AD815 features proprietary ESD protection circuitry, permanent damage may  
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD  
precautions are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
REV. B  
–3–  
AD815–Typical Performance Characteristics  
20  
36  
34  
32  
30  
V
= ؎15V  
= ؎5V  
80  
S
15  
28  
26  
10  
5
V
S
24  
22  
20  
18  
0
0
5
10  
15  
20  
–40  
–20  
0
20  
40  
60  
100  
SUPPLY VOLTAGE – ؎Volts  
JUNCTION TEMPERATURE – ؇C  
Figure 1. Input Common-Mode Voltage Range vs. Supply  
Voltage  
Figure 4. Total Supply Current vs. Temperature  
80  
60  
33  
40  
30  
T
= +25؇C  
A
30  
27  
24  
21  
18  
NO LOAD  
40  
20  
20  
10  
R = 50⍀  
L
(DIFFERENTIAL)  
= 25⍀  
R
L
(SINGLE-ENDED)  
0
0
20  
0
2
4
6
8
10  
12  
14  
16  
0
5
10  
15  
SUPPLY VOLTAGE – ؎Volts  
SUPPLY VOLTAGE – ؎Volts  
Figure 2. Output Voltage Swing vs. Supply Voltage  
Figure 5. Total Supply Current vs. Supply Voltage  
60  
50  
30  
25  
20  
10  
SIDE A, B  
V
= ؎15V  
S
+I  
B
0
–10  
–20  
V
= ؎15V, ؎5V  
S
40  
30  
20  
10  
0
V
= ؎5V  
S
–30  
–40  
–50  
–60  
–70  
SIDE B  
–I  
15  
10  
B
SIDE A  
V
= ؎5V  
S
SIDE B  
SIDE A  
V
5
0
–I  
B
= ؎15V  
S
–80  
–40  
–20  
0
20  
40  
60  
80  
100  
10  
100  
1k  
10k  
LOAD RESISTANCE – (Differential – ) (Single-Ended – /2)  
JUNCTION TEMPERATURE – ؇C  
Figure 3. Output Voltage Swing vs. Load Resistance  
Figure 6. Input Bias Current vs. Temperature  
–4–  
REV. B  
AD815  
80  
0
T
= 25؇C  
A
60  
40  
20  
0
–2  
–4  
V
=
S
؎15V  
V
=
V
= ؎5V  
S
S
؎10V  
–6  
V
=
S
؎5V  
–8  
V
IN  
1/2  
f = 0.1Hz  
AD815  
100⍀  
V
–20  
OUT  
–10  
–12  
–14  
49.9⍀  
V
= ؎15V  
S
R =  
L
5⍀  
–40  
–60  
1k⍀  
1k⍀  
0
LOAD CURRENT – Amps  
–2.0 –1.6 –1.2 –0.8 –0.4  
0.4  
0.8 1.2 1.6  
2.0  
–40  
–20  
0
20  
40  
60  
80  
100  
JUNCTION TEMPERATURE – ؇C  
Figure 7. Input Offset Voltage vs. Temperature  
Figure 10. Thermal Nonlinearity vs. Output Current Drive  
750  
V
= ؎15V  
S
100  
10  
700  
650  
600  
550  
SOURCE  
V
= ؎5V  
S
V
= ؎15V  
1
S
SINK  
0.1  
500  
450  
0.01  
–60 –40 –20  
0
20  
40  
60  
80  
100 120 140  
30k  
100k 300k  
1M  
3M  
10M  
30M 100M 300M  
JUNCTION TEMPERATURE – ؇C  
FREQUENCY – Hz  
Figure 8. Short Circuit Current vs. Temperature  
Figure 11. Closed-Loop Output Resistance vs. Frequency  
15  
T
= 25؇C  
A
V
= ؎10V  
40  
S
T
R
= 25؇C  
= 25⍀  
A
V
= ±15V  
S
10  
5
L
V
= ؎5V  
V
= ؎15V  
S
R
= 100⍀  
S
L
30  
20  
R
R
= 50⍀  
= 25⍀  
L
0
V
IN  
1/2  
f = 0.1Hz  
AD815  
100⍀  
–5  
–10  
–15  
V
L
OUT  
49.9⍀  
10  
0
R =  
L
25⍀  
1k⍀  
1k⍀  
R
= 1⍀  
L
0
2
4
6
8
10  
12  
14  
–20 –16 –12  
–8  
–4  
V
0
4
8
12  
16  
20  
FREQUENCY – MHz  
– Volts  
OUT  
Figure 9. Gain Nonlinearity vs. Output Voltage  
Figure 12. Large Signal Frequency Response  
REV. B  
–5–  
AD815  
100  
100  
120  
110  
100  
90  
TRANSIMPEDANCE  
INVERTING INPUT  
CURRENT NOISE  
100  
500  
0
80  
PHASE  
10  
10  
70  
–50  
–100  
–150  
–200  
–250  
60  
NONINVERTING INPUT  
CURRENT NOISE  
50  
40  
30  
INPUT VOLTAGE  
NOISE  
1
100k  
1
10  
100  
1k  
10k  
100  
1k  
10k  
100k  
FREQUENCY – Hz  
1M  
10M  
100M  
FREQUENCY – Hz  
Figure 13. Input Current and Voltage Noise vs. Frequency  
Figure 16. Open-Loop Transimpedance vs. Frequency  
90  
80  
–40  
V
= ؎15V  
S
G = +10  
–50  
–60  
V
= ؎15V  
V
= 40V p-p  
S
OUT  
70  
60  
SIDE B  
SIDE A  
–70  
50  
40  
30  
20  
10  
562⍀  
R
= 50⍀  
L
–80  
(DIFFERENTIAL)  
562⍀  
562⍀  
V
V
OUT  
IN  
R
= 200⍀  
L
–90  
(DIFFERENTIAL)  
1/2  
AD815  
562⍀  
–100  
–110  
10k  
100k  
1M  
FREQUENCY – Hz  
10M  
100M  
100  
1k  
10k  
100k  
1M  
10M  
FREQUENCY – Hz  
Figure 14. Common-Mode Rejection vs. Frequency  
Figure 17. Total Harmonic Distortion vs. Frequency  
0
10  
8
–10  
–20  
V
= ؎15V  
S
0.1%  
1%  
G = +2  
= 100⍀  
6
R
L
GAIN = +2  
–30  
–40  
4
2
0
V
= ؎15V  
S
–PSRR  
–50  
–60  
–70  
+PSRR  
–2  
–4  
–80  
–90  
–6  
1%  
0.1%  
–8  
–100  
–10  
0.01  
0.1  
1
10  
100  
300  
0
20  
40  
60  
70  
80  
100  
FREQUENCY – MHz  
SETTLING TIME – ns  
Figure 15. Power Supply Rejection vs. Frequency  
Figure 18. Output Swing and Error vs. Settling Time  
–6–  
REV. B  
AD815  
700  
1400  
5
4
3
2
1
0
G = +10  
G = +2  
600  
500  
400  
300  
200  
100  
0
1200  
1000  
800  
600  
400  
200  
0
SIDE B  
SIDE A  
SIDE A  
+T  
Z
–T  
Z
SIDE B  
0
5
10  
15  
20  
25  
–40  
–20  
0
20  
40  
60  
80  
100  
OUTPUT STEP SIZE – V p-p  
JUNCTION TEMPERATURE – ؇C  
Figure 19. Slew Rate vs. Output Step Size  
Figure 22. Open-Loop Transresistance vs. Temperature  
–85  
–80  
–75  
–70  
–65  
–60  
15  
V
= ؎15V  
S
V
= ؎15V  
S
SIDE B  
SIDE A  
R
= 150⍀  
L
14  
13  
12  
11  
10  
+PSRR  
+V  
OUT  
| –V  
|
OUT  
+V  
OUT  
R
= 25⍀  
L
SIDE A  
SIDE B  
| –V  
|
OUT  
–PSRR  
–40  
–20  
0
20  
40  
60  
80  
100  
–40  
–20  
0
20  
40  
60  
80  
100  
JUNCTION TEMPERATURE – ؇C  
JUNCTION TEMPERATURE – ؇C  
Figure 20. PSRR vs. Temperature  
Figure 23. Single-Ended Output Swing vs. Temperature  
27  
26  
–74  
–73  
–72  
–71  
V
R
= ؎15V  
= 50⍀  
S
L
25  
24  
–V  
+V  
OUT  
–70  
–69  
–68  
–67  
–66  
OUT  
–CMRR  
+CMRR  
23  
22  
–40  
–20  
0
20  
40  
60  
80  
100  
–40  
–20  
0
20  
40  
60  
80  
100  
JUNCTION TEMPERATURE – ؇C  
JUNCTION TEMPERATURE – ؇C  
Figure 24. Differential Output Swing vs. Temperature  
Figure 21. CMRR vs. Temperature  
REV. B  
–7–  
AD815  
1
6 BACK TERMINATED LOADS (25)  
؎15V  
؎15V  
0.04  
0.03  
0.02  
0.01  
0.00  
0.5  
0.4  
0.3  
0
؎5V  
PHASE  
G = +2  
F
NTSC  
0.1  
0
–1  
R
= 1k0.2  
0.1  
0.0  
–0.1  
–0.2  
–0.3  
–2  
–3  
–0.01  
–0.02  
–0.03  
–0.04  
A
B
GAIN  
–0.1  
A
–0.2  
–0.3  
–0.4  
–4  
–5  
–6  
1
2
3
4
5
6
7
8
9
10 11  
B
2 BACK TERMINATED LOADS (75)  
V
IN  
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0.00  
0.010  
0.005  
0.000  
–0.005  
–0.010  
–0.015  
100⍀  
V
OUT  
PHASE  
GAIN  
؎5V  
GAIN  
49.9⍀  
499⍀  
G = +2  
100⍀  
–7  
–8  
–0.5  
–0.6  
R
= 1k⍀  
499⍀  
F
NTSC  
–0.020  
PHASE  
–0.025  
–0.030  
–0.02  
–0.04  
–9  
300  
–0.7  
0.1  
1
10  
FREQUENCY – MHz  
100  
1
2
3
4
5
6
7
8
9
10 11  
Figure 25. Differential Gain and Differential Phase  
(per Amplifier)  
Figure 28. Bandwidth vs. Frequency, G = +2  
–10  
1
V
= ؎15V  
S
G = +2  
–20  
–30  
0
–1  
–2  
R
= 499⍀  
F
SIDE A  
V
= ؎15V, ؎5V  
= 400mVrms  
= 100⍀  
SIDE B  
S
V
IN  
–40  
–50  
R
L
SIDE B  
SIDE A  
–60  
–70  
–80  
–3  
–4  
–5  
–6  
V
IN  
100⍀  
V
OUT  
49.9⍀  
124499⍀  
100⍀  
–90  
–100  
–110  
–7  
0.1  
0.03  
0.1  
1
10  
100  
300  
1
10  
100  
300  
FREQUENCY – MHz  
FREQUENCY – MHz  
Figure 26. Output-to-Output Crosstalk vs. Frequency  
Figure 29. –3 dB Bandwidth vs. Frequency, G = +5  
2
V
V
= ؎15V  
S
1
0
= 0 dBm  
SIDE B  
IN  
100  
90  
SIDE A  
–1  
–2  
–3  
V
IN  
100⍀  
V
OUT  
–4  
–5  
49.9⍀  
10  
100⍀  
562⍀  
0%  
–6  
–7  
–9  
5V  
1s  
0.1  
1
10  
100  
300  
FREQUENCY – MHz  
Figure 27. –3 dB Bandwidth vs. Frequency, G = +1  
Figure 30. 40 V p-p Differential Sine Wave, RL = 50 ,  
f = 100 kHz  
–8–  
REV. B  
AD815  
R
562⍀  
F
10F  
0.1F  
10F  
0.1F  
+15V  
+15V  
0.1F  
R
S
8
1/2 AD815  
7
8
1/2 AD815  
100⍀  
50⍀  
100⍀  
0.1F  
10F  
R
= 100⍀  
V
IN  
R
= 100⍀  
V
L
L
IN  
7
PULSE  
GENERATOR  
PULSE  
GENERATOR  
50⍀  
10F  
–15V  
–15V  
T
/T = 250ps  
F
T
/T = 250ps  
F
R
R
Figure 35. Test Circuit, Gain = 1 + RF /RS  
Figure 31. Test Circuit, Gain = +1  
SIDE A  
G = +1  
G = +5  
R
R
R
= 562⍀  
= 100⍀  
= 140⍀  
R
R
= 698⍀  
= 100⍀  
F
L
S
F
L
SIDE A  
SIDE B  
SIDE B  
5V  
100mV  
100ns  
20ns  
Figure 36. 20 V Step Response, G = +5  
Figure 32. 500 mV Step Response, G = +1  
G = +1  
562⍀  
R
R
= 562⍀  
= 100⍀  
F
L
SIDE A  
SIDE B  
10F  
+15V  
0.1F  
562⍀  
8
V
IN  
PULSE  
GENERATOR  
1/2 AD815  
55⍀  
100⍀  
0.1F  
R
= 100⍀  
L
7
T
/T = 250ps  
F
R
10F  
–15V  
1V  
20ns  
Figure 33. 4 V Step Response, G = +1  
Figure 37. Test Circuit, Gain = –1  
SIDE A  
G = –1  
SIDE A  
G = +1  
R
R
= 562⍀  
= 100⍀  
R
R
= 562⍀  
= 100⍀  
F
L
F
L
SIDE B  
SIDE B  
100mV  
2V  
20ns  
50ns  
Figure 34. 10 V Step Response, G = +1  
Figure 38. 500 mV Step Response, G = –1  
REV. B  
–9–  
AD815  
Choice of Feedback and Gain Resistors  
G = –1  
The fine scale gain flatness will, to some extent, vary with  
feedback resistance. It therefore is recommended that once  
optimum resistor values have been determined, 1% tolerance  
values should be used if it is desired to maintain flatness over  
a wide range of production lots. Table I shows optimum values  
for several useful configurations. These should be used as  
starting point in any application.  
R
R
= 562⍀  
= 100⍀  
F
L
SIDE A  
SIDE B  
Table I. Resistor Values  
RF () RG ()  
1V  
20ns  
G = +1  
562  
499  
499  
499  
ϱ
–1  
+2  
+5  
499  
499  
125  
110  
Figure 39. 4 V Step Response, G = –1  
THEORY OF OPERATION  
+10 1 k  
The AD815 is a dual current feedback amplifier with high  
(500 mA) output current capability. Being a current feedback  
amplifier, the AD815’s open-loop behavior is expressed  
as transimpedance, VO/I–IN, or TZ. The open-loop  
transimpedance behaves just as the open-loop voltage gain  
of a voltage feedback amplifier, that is, it has a large dc value  
and decreases at roughly 6 dB/octave in frequency.  
PRINTED CIRCUIT BOARD LAYOUT  
CONSIDERATIONS  
As to be expected for a wideband amplifier, PC board parasitics  
can affect the overall closed-loop performance. Of concern are  
stray capacitances at the output and the inverting input nodes. If  
a ground plane is to be used on the same side of the board as  
the signal traces, a space (5 mm min) should be left around the  
signal lines to minimize coupling.  
Since RIN is proportional to 1/gM, the equivalent voltage gain is  
just TZ × gM, where the gM in question is the transconductance  
of the input stage. Using this amplifier as a follower with gain,  
Figure 40, basic analysis yields the following result:  
POWER SUPPLY BYPASSING  
TZ  
S
( )  
VO  
VIN  
Adequate power supply bypassing can be critical when optimizing  
the performance of a high frequency circuit. Inductance in the  
power supply leads can form resonant circuits that produce  
peaking in the amplifier’s response. In addition, if large current  
transients must be delivered to the load, then bypass capacitors  
(typically greater than 1 µF) will be required to provide the best  
settling time and lowest distortion. A parallel combination of  
10.0 µF and 0.1 µF is recommended. Under some low frequency  
applications, a bypass capacitance of greater than 10 µF may be  
necessary. Due to the large load currents delivered by the  
AD815, special consideration must be given to careful bypassing.  
The ground returns on both supply bypass capacitors as well as  
signal common must be “star” connected as shown in Figure 41.  
= G ×  
TZ S + G × R + RF  
( )  
IN  
where:  
RF  
G = 1 +  
RG  
IN = 1/gM 25 Ω  
R
R
F
R
G
R
IN  
V
OUT  
R
N
+V  
S
V
IN  
+IN  
+OUT  
R
F
Figure 40. Current Feedback Amplifier Operation  
R
G
Recognizing that G × RIN << RF for low gains, it can be seen to  
the first order that bandwidth for this amplifier is independent  
of gain (G).  
R
F
(OPTIONAL)  
–OUT  
Considering that additional poles contribute excess phase at  
high frequencies, there is a minimum feedback resistance below  
which peaking or oscillation may result. This fact is used to  
determine the optimum feedback resistance, RF. In practice  
parasitic capacitance at the inverting input terminal will also add  
phase in the feedback loop, so picking an optimum value for RF  
can be difficult.  
–IN  
–V  
S
Figure 41. Signal Ground Connected in “Star”  
Configuration  
Achieving and maintaining gain flatness of better than 0.1 dB at  
frequencies above 10 MHz requires careful consideration of  
several issues.  
–10–  
REV. B  
AD815  
DC ERRORS AND NOISE  
Figure 44 gives the relationship between output voltage swing  
into various loads and the power dissipated by the AD815 (PIN).  
This data is given for both sine wave and square wave (worst  
case) conditions. It should be noted that these graphs are for  
mostly resistive (phase < ±10°) loads. When the power dissipation  
requirements are known, Equation 1 and the graph on Figure 45  
can be used to choose an appropriate heat sinking configuration.  
There are three major noise and offset terms to consider in  
a current feedback amplifier. For offset errors refer to the  
equation below. For noise error the terms are root-sum-squared  
to give a net output error. In the circuit below (Figure 42), they  
are input offset (VIO) which appears at the output multiplied by  
the noise gain of the circuit (1 + RF/RG), noninverting input  
current (IBN × RN) also multiplied by the noise gain, and the  
inverting input current, which when divided between RF and RG  
and subsequently multiplied by the noise gain always appear at  
the output as IBI × RF. The input voltage noise of the AD815 is  
less than 2 nV/Hz. At low gains though, the inverting input  
current noise times RF is the dominant noise source. Careful  
layout and device matching contribute to better offset and  
drift specifications for the AD815 compared to many other  
current feedback amplifiers. The typical performance curves  
in conjunction with the equations below can be used to predict  
the performance of the AD815 in any application.  
R
= 50⍀  
f = 1kHz  
L
4
3
2
1
SQUARE WAVE  
SINE WAVE  
= 100⍀  
R
L
R
= 200⍀  
L
RF  
RG  
RF  
RG  
V
= VIO × 1+  
± IBN × RN × 1+  
± IBI × RF  
OUT  
10  
20  
30  
40  
V
– Volts p-p  
R
F
OUT  
Figure 44. Total Power Dissipation vs. Differential Output  
Voltage  
I
BI  
R
G
I
BN  
V
OUT  
Normally, the AD815 will be soldered directly to a copper pad.  
Figure 45 plots θJA against size of copper pad. This data pertains  
to copper pads on both sides of G10 epoxy glass board connected  
together with a grid of feedthroughs on 5 mm centers.  
R
N
Figure 42. Output Offset Voltage  
POWER CONSIDERATIONS  
This data shows that loads of 100 ohms or less will usually not  
require any more than this. This is a feature of the AD815’s  
15-lead power SIP package.  
The 500 mA drive capability of the AD815 enables it to drive  
a 50 load at 40 V p-p when it is configured as a differential  
driver. This implies a power dissipation, PIN, of nearly 5 watts.  
To ensure reliability, the junction temperature of the AD815  
should be maintained at less than 175°C. For this reason,  
the AD815 will require some form of heat sinking in most  
applications. The thermal diagram of Figure 43 gives the  
basic relationship between junction temperature (TJ) and  
various components of θJA.  
An important component of θJA is the thermal resistance of the  
package to heatsink. The data given is for a direct soldered  
connection of package to copper pad. The use of heatsink  
grease either with or without an insulating washer will increase  
this number. Several options now exist for dry thermal connec-  
tions. These are available from Bergquist as part # SP600-90.  
Consult with the manufacturer of these products for details of  
their application.  
35  
Equation 1  
T
J
= TA + P θJA  
IN  
T
J
θ
A
(JUNCTION TO  
DIE MOUNT)  
30  
AD815AVR, AY = 2؇C/W)  
JC  
25  
20  
θ B (DIE MOUNT  
TO CASE)  
T
A
θA + θ B = θ JC  
CASE  
θ JC  
θ CA  
T
J
15  
10  
T
A
P
IN  
θ JA  
WHERE:  
0
0.5k  
1k  
1.5k  
2k  
2.5k  
P
T
= DEVICE DISSIPATION  
2
IN  
COPPER HEAT SINK AREA (TOP AND BOTTOM) – mm  
= AMBIENT TEMPERATURE  
A
J
Figure 45. Power Package Thermal Resistance vs. Heat  
Sink Area  
T
θ
θ
= JUNCTION TEMPERATURE  
= THERMAL RESISTANCE – JUNCTION TO CASE  
JC  
= THERMAL RESISTANCE – CASE TO AMBIENT  
CA  
Figure 43. A Breakdown of Various Package Thermal  
Resistances  
REV. B  
–11–  
AD815  
Other Power Considerations  
resistor should be placed in series with each output. See Figure  
There are additional power considerations applicable to the  
AD815. First, as with many current feedback amplifiers, there is an  
increase in supply current when delivering a large peak-to-peak  
voltage to a resistive load at high frequencies. This behavior is  
affected by the load present at the amplifier’s output. Figure 12  
summarizes the full power response capabilities of the AD815.  
These curves apply to the differential driver applications (e.g.,  
Figure 49 or Figure 53). In Figure 12, maximum continuous  
peak-to-peak output voltage is plotted vs. frequency for various  
resistive loads. Exceeding this value on a continuous basis can  
damage the AD815.  
48. This circuit can deliver 800 mA into loads of up to 12.5 .  
499⍀  
499⍀  
+15V  
0.1F  
10F  
8
5
4
1⍀  
1/2  
AD815  
6
100⍀  
499⍀  
50⍀  
499⍀  
R
L
The AD815 is equipped with a thermal shutdown circuit. This  
circuit ensures that the temperature of the AD815 die remains  
below a safe level. In normal operation, the circuit shuts down  
the AD815 at approximately 180°C and allows the circuit to  
turn back on at approximately 140°C. This built-in hysteresis  
means that a sustained thermal overload will cycle between  
power-on and power-off conditions. The thermal cycling  
typically occurs at a rate of 1 ms to several seconds, depending  
on the power dissipation and the thermal time constants of the  
package and heat sinking. Figures 46 and 47 illustrate the  
thermal shutdown operation after driving OUT1 to the + rail,  
and OUT2 to the – rail, and then short-circuiting to ground  
each output of the AD815. The AD815 will not be damaged by  
momentary operation in this state, but the overload condition  
should be removed.  
10 1/2  
AD815  
1⍀  
9
100⍀  
11  
7
0.1F  
10F  
–15V  
Figure 48. Parallel Operation for High Current Output  
Differential Operation  
Various circuit configurations can be used for differential  
operation of the AD815. If a differential drive signal is avail-  
able, the two halves can be used in a classic instrumentation  
configuration to provide a circuit with differential input and  
output. The circuit in Figure 49 is an illustration of this. With  
the resistors shown, the gain of the circuit is 11. The gain can  
be changed by changing the value of RG. This circuit, however,  
provides no common-mode rejection.  
OUT 1  
+15V  
100  
90  
0.1F  
10F  
100⍀  
+IN  
4
8
OUT 1  
1/2  
6
AD815  
OUT 2  
5
R
F
499⍀  
10  
0%  
V
R
G
100⍀  
IN  
V
R
OUT  
L
5V  
200s  
R
F
499⍀  
10 1/2  
AD815  
OUT 2  
Figure 46. OUT2 Shorted to Ground, Square Wave Is  
OUT1, RF = 1 k, RG = 222 Ω  
9
100⍀  
–IN  
11  
7
10F  
0.1F  
100  
90  
–15V  
Figure 49. Fully-Differential Operation  
Creating Differential Signals  
OUT 1  
If only a single ended signal is available to drive the AD815 and  
a differential output signal is desired, several circuits can be  
used to perform the single-ended-to-differential conversion.  
OUT 2  
10  
0%  
5V  
5ms  
One circuit to perform this is to use a dual op amp as a  
predriver that is configured as a noninverter and inverter. The  
circuit shown in Figure 50 performs this function. It uses an  
AD826 dual op amp with the gain of one amplifier set at +1 and  
the gain of the other at –1. The 1 kresistor across the input  
terminals of the follower makes the noise gain (NG = 1) equal  
to the inverter’s. The two outputs then differentially drive the  
inputs to the AD815 with no common-mode signal to first order.  
Figure 47. OUT1 Shorted to Ground, Square Wave Is  
OUT2, RF = 1 k, RG = 222 Ω  
Parallel Operation  
To increase the drive current to a load, both of the amplifiers  
within the AD815 can be connected in parallel. Each amplifier  
should be set for the same gain and driven with the same signal.  
In order to ensure that the two amplifiers share current, a small  
–12–  
REV. B  
AD815  
+15V  
8
+15V  
8
+15V  
0.1F  
0.1F  
10F  
100⍀  
4
V
IN  
4
5
3
2
8
1/2  
AD815  
1/2  
AD815  
6
1/2  
AD826  
6
AMP 1  
1
1k⍀  
5
R
F
R
F1  
499⍀  
1k⍀  
402⍀  
R
100⍀  
G
R
100⍀  
G
R
V
L
R
OUT  
L
1k⍀  
1k⍀  
R
F
499⍀  
R
499⍀  
F2  
6
10  
11  
1/2  
10 1/2  
1/2  
7
AD826  
9
9
AD815  
100⍀  
AMP 2  
AD815  
4
5
0.1F  
7
11  
7
10F  
0.1F  
–15V  
–15V  
–15V  
Figure 50. Differential Driver with Single-Ended  
Differential Converter  
Figure 52. Direct Single-Ended-to-Differential Conversion  
Amp 1 has its + input driven with the input signal, while the  
+ input of Amp 2 is grounded. Thus the – input of Amp 2 is  
driven to virtual ground potential by its output. Therefore  
Amp 1 is configured for a noninverting gain of five, (1 + RF1/RG),  
because RG is connected to the virtual ground of Amp 2’s – input.  
Another means for creating a differential signal from a single-  
ended signal is to use a transformer with a center-tapped  
secondary. The center tap of the transformer is grounded and  
the two secondary windings are connected to obtain opposite  
polarity signals to the two inputs of the AD815 amplifiers. The  
bias currents for the AD815 inputs are provided by the center  
tap ground connection through the transformer windings.  
When the + input of Amp 1 is driven with a signal, the same  
signal appears at the – input of Amp 1. This signal serves as an  
input to Amp 2 configured for a gain of –5, (–RF2/RG). Thus the  
two outputs move in opposite directions with the same gain and  
create a balanced differential signal.  
One advantage of using a transformer is its ability to provide  
isolation between circuit sections and to provide good common-  
mode rejection. The disadvantages are that transformers have  
no dc response and can sometimes be large, heavy, and expensive.  
This circuit is shown in Figure 51.  
This circuit can work at various gains with proper resistor  
selection. But in general, in order to change the gain of the  
circuit, at least two resistor values will have to be changed. In  
addition, the noise gain of the two op amps in this configuration  
will always be different by one, so the bandwidths will not match.  
+15V  
0.1F  
10F  
A second circuit that has none of the disadvantages mentioned  
in the above circuit creates a differential output voltage feedback  
op amp out of the pair of current feedback op amps in the AD815.  
This circuit, drawn in Figure 53, can be used as a high power  
differential line driver, such as required for ADSL (asymmetrical  
digital subscriber loop) line driving.  
100⍀  
4
5
8
1/2  
6
AD815  
50⍀  
1k⍀  
50⍀  
200⍀  
R
L
1k⍀  
Each of the AD815’s op amps is configured as a unity gain  
follower by the feedback resistors (RA). Each op amp output  
also drives the other as a unity gain inverter via the two RBs,  
creating a totally symmetrical circuit.  
10  
11  
1/2  
9
AD815  
100⍀  
7
If the + input to Amp 2 is grounded and a small positive signal  
is applied to the + input of Amp 1, the output of Amp 1 will be  
driven to saturation in the positive direction and the output of  
Amp 2 driven to saturation in the negative direction. This is  
similar to the way a conventional op amp behaves without any  
feedback.  
10F  
0.1F  
–15V  
Figure 51. Differential Driver with Transformer Input  
Direct Single-Ended-to-Differential Conversion  
Two types of circuits can create a differential output signal from  
a single-ended input without the use of any other components  
than resistors. The first of these is illustrated in Figure 52.  
REV. B  
–13–  
AD815  
~20pF  
Twelve Channel Video Distribution Amplifier  
The high current of the AD815 enables it to drive up to twelve  
standard 75 reverse terminated video loads. Figure 54 is a  
schematic of such an application.  
R
F
499⍀  
+15V  
V
R
499⍀  
I
(OPTIONAL)  
50⍀  
0.1F  
The input video signal is terminated in 75 and applied to the  
noninverting inputs of both amplifiers of the AD815. Each  
amplifier is configured for a gain of two to compensate for the  
divide-by-two feature of each cable termination. Six separate  
75 resistors for each amplifier output are used for the cable  
back termination. In this manner, all cables are relatively  
independent of each other and small disturbances on any cable  
will not have an effect on the other cables.  
10F  
CC  
V
4
5
8
IN  
1/2  
AD815  
6
AMP1  
R
A
R
B
250  
(50)  
(OPTIONAL)  
499⍀  
499⍀  
100⍀  
R
B
R
A
499⍀  
499⍀  
When driving six video cables in this fashion, the load seen by  
each amplifier output is resistive and is equal to 150 /6 or  
25 . The differential gain is 0.05% and the differential phase  
10 1/2  
50⍀  
9
CC  
AMP2  
AD815  
is 0.45°.  
11  
7
V
+15V  
10F  
0.1F  
0.1F  
10F  
–15V  
499⍀  
12 
؋
 75⍀  
Figure 53. Single-Ended-to-Differential Driver  
499⍀  
If a resistor (RF) is connected from the output of Amp 2 to the  
+ input of Amp 1, negative feedback is provided which closes  
the loop. An input resistor (RI) will make the circuit look like a  
conventional inverting op amp configuration with differential  
outputs. The inverting input to this dual output op amp becomes  
Pin 4, the positive input of Amp 1.  
5
4
8
6
100⍀  
12 
؋
 
VIDEO OUT  
TO 75⍀  
CABLES  
VIDEO IN  
AD815  
75⍀  
100⍀  
11  
10  
The gain of this circuit from input to either output will be ± RF/  
RI. Or the single-ended-to-differential gain will be 2 × RF/RI.  
9
7
The differential outputs can be applied to the primary of a  
transformer. If each output can swing ±10 V, the effective swing  
on the transformer primary is 40 V p-p. The optional capacitor  
can be added to prevent any dc current in the transformer due  
to dc offsets at the output of the AD815.  
499⍀  
499⍀  
10F  
0.1F  
–15V  
Figure 54. AD815 Video Distribution Amp Driving  
12 Video Cables  
C1  
B2  
B1  
B3  
+15V  
–15V  
TP4 TP3  
J5  
TP2  
C2  
0.1F  
R3  
+15V  
4
J1  
R1  
R5  
T1  
C3  
2
8
10F  
4
C6  
R7  
R19  
1/2  
AD815  
6
1
R8  
5
U1  
1
2
7
5
1
2
R2  
R6  
R17  
R20  
J4  
R4  
J7  
R22  
3
1
2
C13  
R16  
3
R15  
10  
9
6
C9  
J2  
TP1  
–15V  
C10  
0.1F  
8
11  
R14  
12  
3
JP1  
J3  
R10  
R12  
C11  
11  
7
10F  
R13  
J6  
R9  
R21  
1/2  
9
AD815  
10  
U1  
R11  
R18  
Figure 55. AD815 Evaluation Board Schematic  
–14–  
REV. B  
AD815  
Figure 56. AD815 AVR Evaluation Board Assembly Drawing  
Figure 58. AD815 AVR Evaluation Board Layout  
(Solder Side)  
Figure 57. AD815 AVR Evaluation Board Layout  
(Component Side)  
REV. B  
–15–  
AD815  
OUTLINE DIMENSIONS  
Dimensions shown in inches and (mm).  
15-Lead Through-Hole SIP with Staggered Leads and  
15-Lead Surface Mount DDPAK  
(VR-15)  
90؇ Lead Form (Y-15)  
0.110  
(2.79)  
BSC  
0.110  
(2.79)  
BSC  
0.063 (1.60)  
0.057 (1.45)  
0.063 (1.60)  
0.057 (1.45)  
0.152 (3.86)  
0.152 (3.86)  
0.148 (3.76)  
0.394  
(10.007)  
0.394  
0.148 (3.76)  
(10.007)  
0.137  
(3.479)  
TYP  
0.137  
(3.479)  
TYP  
0.516  
(13.106)  
0.671  
±0.006  
(17.043  
±0.152)  
SHORT  
LEAD  
0.666  
0.042  
(1.066)  
TYP  
±0.006  
(16.916  
±0.152)  
LONG  
LEAD  
0.042  
(1.066)  
TYP  
0.080 (2.03)  
0.080 (2.03)  
1
15  
1
15  
0.065 (1.65)  
2 PLACES  
0.065 (1.65)  
2 PLACES  
8°  
0°  
PIN 1  
0.079 (2.006)  
DIA  
2 PLACES  
PIN 1  
0.079 (2.006)  
DIA  
2 PLACES  
0.600 (15.24)  
BSC  
0.146 (3.70)  
0.138 (3.50)  
0.024 (0.61)  
0.014 (0.36)  
0.798 (20.27)  
0.024 (0.61)  
0.014 (0.36)  
0.778 (19.76)  
0.798 (20.27)  
0.778 (19.76)  
0.182 (4.62)  
0.172 (4.37)  
0.182 (4.62)  
0.172 (4.37)  
0.209 ±0.010  
(5.308 ±0.254)  
SEATING  
PLANE  
0.100 (2.54) 0.031 (0.79)  
SEATING  
PLANE  
BSC  
0.024 (0.60)  
0.050 0.031 (0.79)  
(1.27)  
BSC  
0.024 (0.60)  
0.700 (17.78) BSC  
24-Lead Thermally Enhanced SOIC  
(RB-24)  
15-Lead Through-Hole SIP with Staggered Leads and  
Straight Lead Form (YS-15)  
0.6141 (15.60)  
0.5985 (15.20)  
0.110  
(2.79)  
BSC  
0.152 (3.86)  
0.148 (3.76)  
0.063 (1.60)  
0.057 (1.45)  
0.394  
(10.007)  
24  
13  
0.137  
(3.48)  
TYP  
0.601  
±0.010  
(15.265  
±0.254)  
LONG  
LEAD  
0.627  
0.042  
(1.07)  
TYP  
±0.010  
(15.926  
±0.254)  
SHORT  
LEAD  
1
12  
0.710 (18.03)  
0.690 (17.53)  
PIN 1  
0.1043 (2.65)  
0.0291 (0.74)  
0.0098 (0.25)  
1
15  
0.080 (2.03)  
x 45°  
0.0926 (2.35)  
0.065 (1.65)  
2 PLACES  
0.176 (4.47)  
0.150 (3.81)  
0.024 (0.61)  
0.014 (0.36)  
PIN 1  
0.079  
(2.007) DIA  
2 PLACES  
0.0500 (1.27)  
0.0157 (0.40)  
8°  
0°  
0.700 (17.78) BSC  
0.0500  
(1.27)  
BSC  
0.0201 (0.51)  
0.0130 (0.33)  
0.0118 (0.30)  
0.0040 (0.10)  
SEATING  
PLANE  
0.0125 (0.32)  
0.0091 (0.23)  
0.200  
(5.08)  
BSC  
0.169  
(4.29)  
BSC  
0.798 (20.27)  
0.778 (19.76)  
0.182 (4.62)  
0.172 (4.37)  
SEATING  
PLANE  
0.050 (1.27)  
BSC  
0.031 (0.79)  
0.024 (0.60)  
–16–  
REV. B  

相关型号:

AD815ARBZ-24

High Output Current Differential Driver
ADI

AD815AVR

High Output Current Differential Driver
ADI

AD815AY

High Output Current Differential Driver
ADI

AD815AYS

High Output Current Differential Driver
ADI

AD815_05

High Output Current Differential Driver
ADI

AD816

500 mA Differential Driver and Dual Low Noise VF Amplifiers
ADI

AD816*

500 mA Differential Driver and Dual Low Noise (VF) Amplifiers
ETC

AD816AVR

500 mA Differential Driver and Dual Low Noise VF Amplifiers
ADI

AD816AY

500 mA Differential Driver and Dual Low Noise VF Amplifiers
ADI

AD816AYR

Analog IC
ETC

AD816AYS

500 mA Differential Driver and Dual Low Noise VF Amplifiers
ADI

AD817

High Speed, Low Power Wide Supply Range Amplifier
ADI