AD9002TD [ADI]

IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28, Analog to Digital Converter;


型号：	AD9002TD
厂家：	ADI
描述：	IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28, Analog to Digital Converter CD 转换器
文件：	总11页 (文件大小：47K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

REVISIONS

LTR

DESCRIPTION

DATE (YR-MO-DA)

94-08-11

APPROVED

M. A. FRYE

Changes in accordance with NOR 5962-R229-94.

Changes to table I. Editorial changes throughout. –drw

Make change to input bias current test as specified in table I. –ro

Updated drawing to reflect current requirements. -rrp

98-03-17

99-08-02

04-05-03

R. MONNIN

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Sandra B. Rooney

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

CHECKED BY

STANDARD

MICROCIRCUIT

DRAWING

Charles E. Besore

http://www.dscc.dla.mil

APPROVED BY

Michael A. Frye

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

MICROCIRCUIT, LINEAR, HIGH SPEED, 8-BIT, A/D

CONVERTER, MONOLITHIC SILICON

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

DRAWING APPROVAL DATE

93-04-28

AMSC N/A

REVISION LEVEL

SIZE

CAGE CODE

5962-90508

67268

SHEET

DSCC FORM 2233

APR 97

5962-E256-04

1. SCOPE

1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and

M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the

Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the

PIN.

1.2 PIN. The PIN is as shown in the following example:

5962

90508

Federal

stock class

designator

RHA

designator

(see 1.2.1)

Device

type

(see 1.2.2)

Device

class

designator

(see 1.2.3)

Case

outline

(see 1.2.4)

Lead

finish

(see 1.2.5)

Drawing number

1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and

are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A

specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

1.2.2 Device type(s). The device type(s) identify the circuit function as follows:

Device type

Generic number

Circuit function

AD9002S

AD9002T

High speed 8-bit A/D converter

1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as

follows:

Device class

Device requirements documentation

Vendor self-certification to the requirements for MIL-STD-883 compliant, non-

JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A

Q or V

Certification and qualification to MIL-PRF-38535

1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter

Descriptive designator

Terminals

Package style

GDIP1-T28 or CDIP2-T28

CQCC1-N28

Dual-in-line

Square leadless chip carrier

1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,

appendix A for device class M.

SIZE

STANDARD

5962-90508

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

SHEET

DSCC FORM 2234

APR 97

1.3 Absolute maximum ratings. 1/

Negative supply voltage (V_S-).......................................... -6 V dc

Analog input voltage........................................................ V_S- to +0.5 V dc

Power dissipation (P_D), T_A= +25°C................................. 1.2 W

Storage temperature range ............................................. -65°C to +150°C

Lead temperature (soldering, 10 sec) ............................. +300°C

Junction temperature (T_J)................................................ +175°C

ENCODE to ENCODE differential voltage ..................... 4.0 V dc

Reference input voltage (+V_REF, -V_REF) ......................... -3.5 to +0.1 V dc 2/

Reference midpoint current............................................. ±4.0 mA

Digital output current....................................................... 20 mA

Differential reference voltage .......................................... 2.1 V dc

Digital input voltage......................................................... -V_Sto 0 V dc

Analog to digital supply voltage differential..................... 0.5 V dc

Thermal resistance, junction-to-case (θ_JC)...................... See MIL-STD-1835

Thermal resistance, junction-to-ambient (θ_JA):

Case outline X .............................................................. 56°C/W

Case outline 3............................................................... 69°C/W

1.4 Recommended operating conditions.

Ambient operating temperature range (T_A) ..................... -55°C to +125°C

Differential reference voltage .......................................... 2.0 V dc

Negative supply voltage (V ).......................................... -5.2 V dc

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a

part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in

the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-STD-883

Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from

the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

________

1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability.

2/ +V_REF≥ -V_REFunder all circumstances.

SIZE

STANDARD

5962-90508

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

SHEET

DSCC FORM 2234

APR 97

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full

ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be

marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be

in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535

listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see

6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this

drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535

and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for

device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2

herein) involving devices acquired to this drawing is required for any change that affects this drawing.

3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain

the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made

available onshore at the option of the reviewer.

3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in

microcircuit group number 57 (see MIL-PRF-38535, appendix A).

SIZE

STANDARD

5962-90508

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

SHEET

DSCC FORM 2234

APR 97

TABLE I. Electrical performance characteristics.

Test

Symbol

Conditions 1/

-55°C < T_A< +125°C

unless otherwise specified

Analog input = 0 V

Group A

subgroups

Device

Type

Limits

Unit

µA

Min

Max

200

110

Input bias current

2, 3

All

I_B

Reference ladder

resistance

T_A= +25°C

Ω

µA

Overflow inhibit

0 V input current

1,2,3

300

I_IN

High level 2/

output voltage

-1.1

V_OH

V_OL

-I_CC

Low level 2/

output voltage

-1.5

Negative supply 3/

current

Conversion rate

Encode pulse 4/

width (low)

V_S-= -5.2 V

2, 3

175

200

All

125

1.5

MSPS

T_A= +25°C

F_S

t_PWL

Encode pulse 4/

width (high)

All

1.5

T_A= +25°C

t_PWH

SNR

DNL

Signal-to-noise 5/

ratio

Analog input signal = 1.23 MHz

T_A= +25°C

Differential linearity

All

0.75

0.5

1.0

0.75

1.0

0.5

1.2

LSB

Integral linearity

INL

LSB

Top of reference

ladder

Bottom of reference

ladder

All

See footnotes at end of table.

SIZE

STANDARD

5962-90508

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

SHEET

DSCC FORM 2234

APR 97

TABLE I. Electrical performance characteristics - continued.

Test

Symbol

Conditions 1/

-55°C < T_A< +125°C

unless otherwise specified

Group A

subgroups

Device

Type

Limits

Units

Min

-1.1

Max

High level input

voltage

Low level input

voltage

High level input

current

Low level input

current

Power supply 3/ 6/

rejection ratio

Output delay 7/ 2/

Output rise time 2/

Output fall time 2/

In-band harmonics 5/

V_IH

V_IL

7, 8

All

-1.5

150

120

1.5

I_IH

µA

I_IL

PSRR

mV/V

T_A= +25°C

t_PD

t_r

t_f

All

1.0

3.5

3.0

2.5

T_A= +25°C

Analog Input Signal = 1.23 MHz

T_A= +25°C

Input capacitance 8/

Input resistance

C_IN

R_IN

All

T_A= +25°C

kΩ

1/ V_S- = -5.2 V, differential reference voltage = 2.0 V unless otherwise specified.

2/ Outputs terminated through 100 Ω to -2 V.

3/ Supplies should remain stable within +5% for normal operation.

4/ ENCODE signal rise/fall times should be less than 10 ns for normal operation.

5/ RMS signal to RMS noise, including harmonics with 1.23 MHz analog input signal.

6/ Measured at -5.2 V +5%.

7/ Measured from ENCODE into data out for LSB only.

8/ Subgroup 4 measurements C_INand R_INshall be measured only for the initial test and after process or design

changes which may affect input capacitance and resistance.

SIZE

STANDARD

5962-90508

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

SHEET

DSCC FORM 2234

APR 97

Device types

Case outlines

01 and 02

X and 3

Terminal number

Terminal symbol

DIGITAL GND

OVERFLOW INH

HYSTERESIS

+V_REF

ANALOG INPUT

ANALOG GROUND

ENCODE

ANALOG GROUND

ANALOG INPUT

-V_REF

REF_MID

DIGITAL GND

DIGITAL V_S-

D1 (LSB)

DIGITAL GROUND

ANALOG V_S-

DIGITAL GROUND

D8 (MSB)

OVERFLOW

DIGITAL V_S-

FIGURE 1. Terminal connections.

SIZE

STANDARD

5962-90508

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

SHEET

DSCC FORM 2234

APR 97

4. VERIFICATION

4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with

MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan

shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be

in accordance with MIL-PRF-38535, appendix A.

4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted

on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in

accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.

4.2.1 Additional criteria for device class M.

a. Burn-in test, method 1015 of MIL-STD-883.

(1) Test condition A, B, or C. The test circuit shall be maintained by the manufacturer under document revision level

control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in

method 1015.

(2) T_A= +125°C, minimum.

b. Interim and final electrical test parameters shall be as specified in table II herein.

4.2.2 Additional criteria for device classes Q and V.

a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the

device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under

document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with

MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in

method 1015 of MIL-STD-883.

b. Interim and final electrical test parameters shall be as specified in table II herein.

c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in

MIL-PRF-38535, appendix B.

4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in

accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for

groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).

4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with

MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for

device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed

for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections

(see 4.4.1 through 4.4.4).

4.4.1 Group A inspection.

a. Tests shall be as specified in table II herein.

b. Subgroups 5, 6, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.

SIZE

STANDARD

5962-90508

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

SHEET

DSCC FORM 2234

APR 97

TABLE II. Electrical test requirements.

Subgroups

Test requirements

Subgroups

(in accordance with

MIL-STD-883,

MIL-PRF-38535, table III)

method 5005, table I)

Device

class M

Device

class Q

Device

class V

Interim electrical

parameters (see 4.2)

Final electrical

1, 2, 3, 4 1/

parameters (see 4.2)

Group A test

requirements (see 4.4)

1, 2, 3, 4, 7, 8, 9

1, 2, 3, 4,

7, 8, 9

1, 2, 3, 4,

7, 8, 9

Group C end-point electrical

parameters (see 4.4)

Group D end-point electrical

parameters (see 4.4)

- - -

Group E end-point electrical

parameters (see 4.4)

1/ PDA applies to subgroup 1.

4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein.

4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:

a. Test condition A, B, or C. The test circuit shall be maintained by the manufacturer under document revision level

control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify

the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method

1005 of MIL-STD-883.

b. T_A= +125°C, minimum.

c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.

4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,

or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The

test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with

MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify

the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-

STD-883.

4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.

4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness

assured (see 3.5 herein).

a. End-point electrical parameters shall be as specified in table II herein.

b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as

specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to

radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All

device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at T_A= +25°C

±5°C, after exposure, to the subgroups specified in table II herein.

SIZE

STANDARD

5962-90508

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

SHEET

DSCC FORM 2234

APR 97

5. PACKAGING

5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device

classes Q and V or MIL-PRF-38535, appendix A for device class M.

6. NOTES

6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications

(original equipment), design applications, and logistics purposes.

6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor

prepared specification or drawing.

6.1.2 Substitutability. Device class Q devices will replace device class M devices.

6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for

the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.

6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system

application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users

and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering

microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.

6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone

(614) 692-0547.

6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in

MIL-PRF-38535 and MIL-HDBK-1331.

6.6 Sources of supply.

6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.

The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to

this drawing.

6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.

The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been

submitted to and accepted by DSCC-VA.

SIZE

STANDARD

5962-90508

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

SHEET

DSCC FORM 2234

APR 97

STANDARD MICROCIRCUIT DRAWING BULLETIN

DATE: 04-05-03

Approved sources of supply for SMD 5962-90508 are listed below for immediate acquisition information only and

shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be

revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a

certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded

by the next dated revision of MIL-HDBK-103 and QML-38535.

Standard

microcircuit drawing

PIN 1/

Vendor

CAGE

number

Vendor

similar

PIN 2/

5962-9050801M3A

5962-9050801MXA

5962-9050802M3A

5962-9050802MXA

24355

AD9002SE/883B

AD9002SD/883B

AD9002TE/883B

AD9002TD/883B

1/ The lead finish shown for each PIN representing

a hermetic package is the most readily available

from the manufacturer listed for that part. If the

desired lead finish is not listed contact the vendor

to determine its availability.

2/ Caution. Do not use this number for item

acquisition. Items acquired to this number may not

satisfy the performance requirements of this drawing.

Vendor CAGE

number

Vendor name

and address

24355

Analog Devices

Route 1 Industrial Park

PO Box 9106

Norwood, MA 02062

Point of contact: 7910 Triad Center Drive

Greensboro, NC 27409-9605

The information contained herein is disseminated for convenience only and the

Government assumes no liability whatsoever for any inaccuracies in the

information bulletin.

AD9002TD [ADI]

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