AD9222 [ADI]
Octal, 12-Bit, 40/50 MSPS Serial LVDS 1.8 V A/D Converter; 八通道,12位, 40/50 MSPS串行LVDS 1.8 VA / D转换器型号: | AD9222 |
厂家: | ADI |
描述: | Octal, 12-Bit, 40/50 MSPS Serial LVDS 1.8 V A/D Converter |
文件: | 总56页 (文件大小:2237K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Octal, 12-Bit, 40/50 MSPS
Serial LVDS 1.8 V A/D Converter
AD9222
FEATURES
8 ADCs integrated into 1 package
93 mW ADC power per channel at 50 MSPS
SNR = 70 dB (to Nyquist)
ENOB = 11.3 bits
SFDR = 84 dBc
Excellent linearity
DNL = 0.3 LSB (typical)
INL = 0.4 LSB (typical)
Serial LVDS (ANSI-644, default)
Low power reduced signal option, IEEE 1596.3 similar
Data and frame clock outputs
325 MHz full power analog bandwidth
2 V p-p input voltage range
1.8 V supply operation
Serial port control
Full-chip and individual-channel power-down modes
Flexible bit orientation
Built-in and custom digital test pattern generation
Programmable clock and data alignment
Programmable output resolution
Standby mode
FUNCTIONAL BLOCK DIAGRAM
AVDD
PDWN
DRVDD
DRGND
AD9222
12
VIN+A
VIN–A
D+A
D–A
SERIAL
LVDS
ADC
ADC
12
12
VIN+B
VIN–B
D+B
D–B
SERIAL
LVDS
VIN+C
VIN–C
D+C
D–C
SERIAL
LVDS
ADC
12
12
VIN+D
VIN–D
D+D
D–D
SERIAL
LVDS
ADC
ADC
ADC
VIN+E
VIN–E
SERIAL
LVDS
D+E
D–E
12
12
VIN+F
VIN–F
D+F
D–F
SERIAL
LVDS
VIN+G
VIN–G
D+G
D–G
SERIAL
LVDS
ADC
ADC
12
VIN+H
VIN–H
D+H
D–H
SERIAL
LVDS
APPLICATIONS
VREF
Medical imaging and nondestructive ultrasound
Portable ultrasound and digital beam forming systems
Quadrature radio receivers
Diversity radio receivers
FCO+
FCO–
SENSE
0.5V
DATA RATE
REFT
REFB
REF
SELECT
MULTIPLIER
SERIAL PORT
INTERFACE
DCO+
DCO–
Tape drives
Optical networking
Test equipment
SCLK/
DTP
RBIAS AGND CSB SDIO/
ODM
CLK+
CLK–
Figure 1.
GENERAL DESCRIPTION
The ADC contains several features designed to maximize
The AD9222 is an octal, 12-bit, 40/50 MSPS analog-to-digital
converter (ADC) with an on-chip sample-and-hold circuit that
is designed for low cost, low power, small size, and ease of use.
The product operates at a conversion rate of up to 50 MSPS and
is optimized for outstanding dynamic performance and low
power in applications where a small package size is critical.
flexibility and minimize system cost, such as programmable
clock and data alignment and programmable digital test pattern
generation. The available digital test patterns include built-in
deterministic and pseudorandom patterns, along with custom user-
defined test patterns entered via the serial port interface (SPI®).
The AD9222 is available in a Pb-free, 64-lead LFCSP package. It is
specified over the industrial temperature range of −40°C to +85°C.
The ADC requires a single 1.8 V power supply and LVPECL-/
CMOS-/LVDS-compatible sample rate clock for full performance
operation. No external reference or driver components are
required for many applications.
PRODUCT HIGHLIGHTS
1. Small Footprint. Eight ADCs are contained in a small, space-
saving package; low power of 93 mW/channel at 50 MSPS.
2. Ease of Use. A data clock output (DCO) operates up to
300 MHz and supports double data rate operation (DDR).
3. User Flexibility. Serial port interface (SPI) control offers a wide
range of flexible features to meet specific system requirements.
The ADC automatically multiplies the sample rate clock for
the appropriate LVDS serial data rate. A data clock (DCO)
for capturing data on the output and a frame clock (FCO) for
signaling a new output byte are provided. Individual channel
power-down is supported and typically consumes less than
2 mW when all channels are disabled.
4. Pin-Compatible Family. This includes the AD9212 (10-bit),
and AD9252 (14-bit).
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2006 Analog Devices, Inc. All rights reserved.
AD9222
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
AC Specifications.......................................................................... 4
Digital Specifications ................................................................... 5
Switching Specifications .............................................................. 6
Timing Diagrams.............................................................................. 7
Absolute Maximum Ratings............................................................ 9
Thermal Impedance..................................................................... 9
ESD Caution.................................................................................. 9
Pin Configuration and Function Descriptions........................... 10
Equivalent Circuits......................................................................... 12
Typical Performance Characteristics ........................................... 14
Theory of Operation ...................................................................... 18
Analog Input Considerations ................................................... 18
Clock Input Considerations...................................................... 21
Serial Port Interface (SPI).............................................................. 29
Hardware Interface..................................................................... 30
Memory Map .................................................................................. 32
Reading the Memory Map Table.............................................. 32
Reserved Locations .................................................................... 32
Default Values............................................................................. 32
Logic Levels................................................................................. 32
Evaluation Board ............................................................................ 36
Power Supplies............................................................................ 36
Input Signals................................................................................ 36
Output Signals ............................................................................ 36
Default Operation and Jumper Selection Settings................. 37
Alternative Analog Input Drive Configuration...................... 38
Outline Dimensions....................................................................... 55
Ordering Guide .......................................................................... 55
REVISION HISTORY
9/06—Revision 0: Initial Version
Rev. 0 | Page 2 of 56
AD9222
SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 1.
AD9222-40
Min Typ
AD9222-50
Min Typ
Parameter1
Temperature
Max
Max
Unit
RESOLUTION
12
12
Bits
ACCURACY
No Missing Codes
Offset Error
Offset Matching
Gain Error
Full
Full
Full
Full
Full
Full
Full
Guaranteed
±1
±3
±0.ꢀ
±0.3
Guaranteed
±1
±3
±1.5
±0.3
±±
±±
±1.2
±0.ꢁ
±0.5
±1
±±
mV
±±
mV
±2.5
±0.ꢁ
% FS
% FS
Gain Matching
Differential Nonlinearity (DNL)
Integral Nonlinearity (INL)
TEMPERATURE DRIFT
Offset Error
Gain Error
Reference Voltage (1 V Mode)
REFERENCE
±0.25
±0.ꢀ
±0.3
±0.ꢀ
±0.65 LSB
±1
LSB
Full
Full
Full
±2
±1ꢁ
±21
±2
±1ꢁ
±21
ppm/°C
ppm/°C
ppm/°C
Output Voltage Error (VREF = 1 V)
Load Regulation @ 1.0 mA (VREF = 1 V)
Input Resistance
Full
Full
Full
±2
3
6
±30
±2
3
6
±30
mV
mV
kΩ
ANALOG INPUTS
Differential Input Voltage Range (VREF = 1 V)
Common-Mode Voltage
Differential Input Capacitance
Analog Bandwidth, Full Power
POWER SUPPLY
Full
Full
Full
Full
2
2
V p-p
V
pF
AVDD/2
ꢁ
325
AVDD/2
ꢁ
325
MHz
AVDD
DRVDD
IAVDD
IDRVDD
Full
Full
Full
Full
Full
Full
Full
Full
Full
1.ꢁ
1.ꢁ
1.±
1.±
33±
51
ꢁ00
2
1.9
1.9
3ꢀ±.5
53.6
ꢁ22
11
1.ꢁ
1.ꢁ
1.±
1.±
35ꢁ.5
53.5
ꢁꢀ0
2
1.9
1.9
V
V
36ꢁ.5 mA
56.2
ꢁ60
11
mA
mW
mW
mW
dB
Total Power Dissipation (Including Output Drivers)
Power-Down Dissipation
Standby Dissipation2
CROSSTALK
±3
±9
−90
−90
−90
−90
CROSSTALK (Overrange Condition)3
dB
1 See the AN-±35 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
2 Can be controlled via SPI.
3 Overrange condition is specific with 6 dB of the full-scale input range.
Rev. 0 | Page 3 of 56
AD9222
AC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 2.
AD9222-40
Typ
AD9222-50
Typ
Parameter1
Temperature Min
Max Min
Max Unit
dB
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 2.ꢀ MHz
Full
ꢁ0.3
ꢁ0.ꢀ
fIN = 19.ꢁ MHz Full
69.5
ꢁ0.3
69.5
ꢁ0.3
dB
fIN = 35 MHz
fIN = ꢁ0 MHz
Full
Full
Full
69.9
6±.±
ꢁ0.0
69.0
dB
dB
SIGNAL-TO-NOISE AND DISTORTION RATIO (SINAD) fIN = 2.ꢀ MHz
ꢁ0.0
ꢁ0.0
dB
fIN = 19.ꢁ MHz Full
6±.ꢁ
ꢁ0.0
6±.5
ꢁ0.0
dB
fIN = 35 MHz
fIN = ꢁ0 MHz
fIN = 2.ꢀ MHz
Full
Full
Full
69.5
6±.0
69.±
6±.5
dB
dB
EFFECTIVE NUMBER OF BITS (ENOB)
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
WORST HARMONIC (Second or Third)
WORST OTHER (Excluding Second or Third)
11.3±
11.25 11.3±
11.32
11.ꢀ
11.25 11.3±
11.33
Bits
Bits
Bits
Bits
fIN = 19.ꢁ MHz Full
fIN = 35 MHz
fIN = ꢁ0 MHz
fIN = 2.ꢀ MHz
Full
Full
Full
11.1ꢀ
11.1ꢁ
±5
±5
±0
ꢁ6
±5
±ꢀ
±3
ꢁꢁ
dBc
dBc
dBc
dBc
fIN = 19.ꢁ MHz Full
ꢁ3
ꢁ3
fIN = 35 MHz
fIN = ꢁ0 MHz
fIN = 2.ꢀ MHz
Full
Full
Full
−±5
−±5
−±0
−ꢁ6
−92
−92
−92
−90
±0.0
−±5
−±ꢀ
−±3
−ꢁꢁ
−92
−92
−92
−90
±0.0
dBc
−ꢁ3 dBc
dBc
fIN = 19.ꢁ MHz Full
−ꢁꢀ
−±0
fIN = 35 MHz
fIN = ꢁ0 MHz
fIN = 2.ꢀ MHz
fIN = 19.ꢁ MHz Full
fIN = 35 MHz
fIN = ꢁ0 MHz
Full
Full
Full
dBc
dBc
−±0 dBc
dBc
Full
Full
dBc
TWO-TONE INTERMODULATION DISTORTION (IMD)— fIN1 = 15 MHz, 25°C
dBc
AIN1 AND AIN2 = −ꢁ.0 dBFS
fIN2 = 16 MHz
fIN1 = ꢁ0 MHz, 25°C
fIN2 = ꢁ1 MHz
ꢁꢁ.0
ꢁꢁ.0
dBc
1 See the AN-±35 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
Rev. 0 | Page ꢀ of 56
AD9222
DIGITAL SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 3.
AD9222-40
Typ Max
AD9222-50
Typ Max
Parameter1
Temperature
Min
Min
Unit
CLOCK INPUTS (CLK+, CLK−)
Logic Compliance
CMOS/LVDS/LVPECL
CMOS/LVDS/LVPECL
Differential Input Voltage2
Input Common-Mode Voltage
Input Resistance (Differential)
Input Capacitance
Full
Full
25°C
25°C
250
250
mV p-p
V
kΩ
pF
1.2
20
1.5
1.2
20
1.5
LOGIC INPUTS (PDWN, SCLK/DTP)
Logic 1 Voltage
Logic 0 Voltage
Input Resistance
Input Capacitance
Full
Full
25°C
25°C
1.2
0
3.6
0.3
1.2
1.2
3.6
0.3
V
V
kΩ
pF
30
0.5
30
0.5
LOGIC INPUT (CSB)
Logic 1 Voltage
Logic 0 Voltage
Full
Full
1.2
0
3.6
0.3
3.6
0.3
V
V
Input Resistance
Input Capacitance
25°C
25°C
ꢁ0
0.5
ꢁ0
0.5
kΩ
pF
LOGIC INPUT (SDIO/ODM)
Logic 1 Voltage
Logic 0 Voltage
Full
Full
1.2
0
DRVDD + 0.3 1.2
DRVDD + 0.3
0.3
V
V
0.3
0
Input Resistance
Input Capacitance
25°C
25°C
30
2
30
2
kΩ
pF
LOGIC OUTPUT (SDIO/ODM)3
Logic 1 Voltage (IOH = ±00 μA)
Logic 0 Voltage (IOL = 50 μA)
DIGITAL OUTPUTS (D+, D−), (ANSI-6ꢀꢀ)1
Logic Compliance
Full
Full
1.ꢁ9
0.05
1.ꢁ9
0.05
V
V
LVDS
LVDS
Differential Output Voltage (VOD
)
Full
Full
2ꢀꢁ
1.125
ꢀ5ꢀ
1.3ꢁ5
2ꢀꢁ
1.125
ꢀ5ꢀ
1.3ꢁ5
mV
V
Output Offset Voltage (VOS
)
Output Coding (Default)
Offset binary
Offset binary
DIGITAL OUTPUTS (D+, D−),
(Low Power, Reduced Signal Option)1
Logic Compliance
LVDS
LVDS
Differential Output Voltage (VOD
)
Full
Full
150
1.10
250
1.30
150
1.10
250
1.30
mV
V
Output Offset Voltage (VOS
)
Output Coding (Default)
Offset binary
Offset binary
1 See the AN-±35 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
2 This is specified for LVDS and LVPECL only.
3 This is specified for 13 SDIO pins sharing the same connection.
Rev. 0 | Page 5 of 56
AD9222
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 4.
AD9222-40
Typ
AD9222-50
Typ
Parameter1
CLOCK2
Temp
Min
Max
Min
Max
Unit
Maximum Clock Rate
Minimum Clock Rate
Clock Pulse Width High (tEH)
Clock Pulse Width Low (tEL)
Full
Full
Full
Full
ꢀ0
50
MSPS
MSPS
ns
10
10
12.5
12.5
10.0
10.0
ns
OUTPUT PARAMETERS2, 3
Propagation Delay (tPD)
Full
Full
Full
Full
Full
1.5
1.5
2.3
3.1
3.1
1.5
1.5
2.3
3.1
3.1
ns
ps
ps
ns
ns
Rise Time (tR) (20% to ±0%)
Fall Time (tF) (20% to ±0%)
FCO Propagation Delay (tFCO
300
300
2.3
300
300
2.3
)
ꢀ
DCO Propagation Delay (tCPD
)
tFCO
+
tFCO
+
(tSAMPLE/2ꢀ)
(tSAMPLE/2ꢀ)
ꢀ
Full
Full
Full
(tSAMPLE/2ꢀ) − 300 (tSAMPLE/2ꢀ) (tSAMPLE/2ꢀ) + 300 (tSAMPLE/2ꢀ) − 300 (tSAMPLE/2ꢀ) (tSAMPLE/2ꢀ) + 300 ps
(tSAMPLE/2ꢀ) − 300 (tSAMPLE/2ꢀ) (tSAMPLE/2ꢀ) + 300 (tSAMPLE/2ꢀ) − 300 (tSAMPLE/2ꢀ) (tSAMPLE/2ꢀ) + 300 ps
DCO to Data Delay (tDATA
)
ꢀ
DCO to FCO Delay (tFRAME
Data to Data Skew
)
±50
±200
±50
±200
ps
(tDATA-MAX − tDATA-MIN
)
Wake-Up Time (Standby)
25°C
25°C
Full
600
3ꢁ5
±
600
3ꢁ5
±
ns
μs
Wake-Up Time (Power Down)
Pipeline Latency
CLK
cycles
APERTURE
Aperture Delay (tA)
25°C
25°C
25°C
ꢁ50
<1
1
ꢁ50
<1
1
ps
Aperture Uncertainty (Jitter)
Out-of-Range Recovery Time
ps rms
CLK
cycles
1 See the AN-±35 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
2 Can be adjusted via the SPI interface.
3 Measurements were made using a part soldered to FRꢀ material.
ꢀ tSAMPLE/2ꢀ is based on the number of bits divided by 2 because the delays are based on half duty cycles.
Rev. 0 | Page 6 of 56
AD9222
TIMING DIAGRAMS
N – 1
AIN
tA
N
tEH
tEL
CLK–
CLK+
tCPD
DCO–
DCO+
tFRAME
tFCO
FCO–
FCO+
tPD
tDATA
D–
D+
MSB
N – 8
D10
N – 8
D9
N – 8
D8
N – 8
D7
N – 8
D6
N – 8
D5
N – 8
D4
N – 8
D3
N – 8
D2
N – 8
D1
N – 8
D0
N – 8
MSB
N – 7
D10
N – 7
Figure 2. 12-Bit Data Serial Stream (Default)
N – 1
AIN
tA
N
tEH
tEL
CLK–
CLK+
tCPD
DCO–
DCO+
tFRAME
tFCO
FCO–
FCO+
D–
tPD
tDATA
MSB
N – 8
D8
N – 8
D7
D6
D5
D4
D3
D2
D1
D0
MSB
D8
D7
D6
D5
N – 8 N – 8
N – 8 N – 8 N – 8 N – 8
N – 8 N – 8 N – 7 N – 7
N – 7 N – 7 N – 7
D+
Figure 3. 10-Bit Data Serial Stream
Rev. 0 | Page ꢁ of 56
AD9222
N – 1
AIN
tA
N
tEH
tEL
CLK–
CLK+
tCPD
DCO–
DCO+
tFRAME
tFCO
FCO–
FCO+
tPD
tDATA
D–
D+
LSB
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
LSB
D0
(N – 8) (N – 8) (N – 8) (N – 8) (N – 8) (N – 8) (N – 8) (N – 8) (N – 8) (N – 8) (N – 8) (N – 8) (N – 7) (N – 7)
Figure 4. 12-Bit Data Serial Stream, LSB First
Rev. 0 | Page ± of 56
AD9222
ABSOLUTE MAXIMUM RATINGS
Table 5.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
With
Respect To
Parameter
ELECTRICAL
AVDD
DRVDD
AGND
Rating
AGND
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−0.3 V to +2.0 V
DRGND
DRGND
DRVDD
DRGND
AVDD
Digital Outputs
THERMAL IMPEDANCE
(D+, D−, DCO+,
DCO−, FCO+, FCO−)
CLK+, CLK−
VIN+, VIN−
SDIO/ODM
PDWN, SCLK/DTP, CSB
REFT, REFB, RBIAS
VREF, SENSE
Table 6.
Air Flow
Velocity (m/s)
AGND
AGND
AGND
AGND
AGND
AGND
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
1
θJA
θJB
θJC
0.0
1.0
2.5
1ꢁ.ꢁ°C/W
15.5°C/W
13.9°C/W
±.ꢁ°C/W
0.6°C/W
1 θJA for a ꢀ-layer PCB with solid ground plane (simulated). Exposed pad
soldered to PCB.
ENVIRONMENTAL
Operating Temperature
Range (Ambient)
Maximum Junction
Temperature
−ꢀ0°C to +±5°C
150°C
ESD CAUTION
Lead Temperature
(Soldering, 10 sec)
300°C
Storage Temperature
Range (Ambient)
−65°C to +150°C
Rev. 0 | Page 9 of 56
AD9222
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
PIN 1
INDICATOR
AVDD
VIN+G
VIN–G
AVDD
VIN–H
VIN+H
AVDD
AVDD
CLK–
CLK+ 10
AVDD 11
AVDD 12
DRGND 13
DRVDD 14
D–H 15
1
2
3
4
5
6
7
8
9
48 AVDD
47 VIN+B
46 VIN–B
45 AVDD
44 VIN–A
43 VIN+A
42 AVDD
41 PDWN
40 CSB
39 SDIO/ODM
38 SCLK/DTP
37 AVDD
36 DRGND
35 DRVDD
34 D+A
EXPOSED PADDLE, PIN 0
(BOTTOM OF PACKAGE)
AD9222
TOP VIEW
(Not to Scale)
D+H 16
33 D–A
NC = NO CONNECT
Figure 5. 64-Lead LFCSP Top View
Table 7. Pin Function Descriptions
Pin No.
Mnemonic
Description
0
AGND
AVDD
Analog Ground (Exposed Paddle)
1.± V Analog Supply
1, ꢀ, ꢁ, ±, 11,
12, 3ꢁ, ꢀ2, ꢀ5,
ꢀ±, 51, 59, 62
13, 36
1ꢀ, 35
2
3
5
DRGND
DRVDD
VIN+G
VIN−G
VIN−H
VIN+H
CLK−
CLK+
D−H
D+H
D−G
D+G
D−F
D+F
D−E
D+E
DCO−
DCO+
FCO−
FCO+
D−D
Digital Output Driver Ground
1.± V Digital Output Driver Supply
ADC G Analog Input—True
ADC G Analog Input—Complement
ADC H Analog Input—Complement
ADC H Analog Input—True
6
9
Input Clock—Complement
Input Clock—True
10
15
16
1ꢁ
1±
19
20
21
22
23
2ꢀ
25
26
2ꢁ
2±
29
30
31
32
33
ADC H Digital Output—Complement
ADC H True Digital Output—True
ADC G Digital Output—Complement
ADC G True Digital Output—True
ADC F Digital Output—Complement
ADC F True Digital Output—True
ADC E Digital Output—Complement
ADC E True Digital Output—True
Data Clock Digital Output—Complement
Data Clock Digital Output—True
Frame Clock Digital Output—Complement
Frame Clock Digital Output—True
ADC D Digital Output—Complement
ADC D True Digital Output—True
ADC C Digital Output—Complement
ADC C True Digital Output
D+D
D−C
D+C
D−B
D+B
D−A
ADC B Digital Output—Complement
ADC B True Digital Output—True
ADC A Digital Output—Complement
Rev. 0 | Page 10 of 56
AD9222
Pin No.
3ꢀ
3±
39
ꢀ0
ꢀ1
ꢀ3
ꢀꢀ
ꢀ6
ꢀꢁ
ꢀ9
50
52
53
5ꢀ
55
56
5ꢁ
5±
60
61
63
6ꢀ
Mnemonic
D+A
SCLK/DTP
SDIO/ODM
CSB
PDWN
VIN+A
VIN−A
VIN−B
VIN+B
VIN+C
VIN−C
VIN−D
VIN+D
RBIAS
Description
ADC A True Digital Output—True
Serial Clock/Digital Test Pattern
Serial Data Input-Output/Output Driver Mode
Chip Select Bar
Power Down
ADC A Analog Input—True
ADC A Analog Input—Complement
ADC B Analog Input—Complement
ADC B Analog Input—True
ADC C Analog Input—True
ADC C Analog Input—Complement
ADC D Analog Input—Complement
ADC D Analog Input—True
External Resistor to Set the Internal ADC Core Bias Current
Reference Mode Selection
Voltage Reference Input/Output
Differential Reference (Negative)
Differential Reference (Positive)
ADC E Analog Input—True
ADC E Analog Input—Complement
ADC F Analog Input—Complement
ADC F Analog Input—True
SENSE
VREF
REFB
REFT
VIN+E
VIN−E
VIN−F
VIN+F
Rev. 0 | Page 11 of 56
AD9222
EQUIVALENT CIRCUITS
DRVDD
V
V
D–
D+
VIN
V
V
DRGND
Figure 9. Equivalent Digital Output Circuit
Figure 6. Equivalent Analog Input Circuit
10Ω
CLK
10kΩ
10kΩ
1.25V
1kΩ
SCLK/DTP OR PDWN
10Ω
CLK
30kΩ
Figure 7. Equivalent Clock Input Circuit
Figure 10. Equivalent SCLK/DTP or PDWN Input Circuit
100Ω
RBIAS
350Ω
SDIO/ODM
30kΩ
Figure 11. Equivalent RBIAS Circuit
Figure 8. Equivalent SDIO/ODM Input Circuit
Rev. 0 | Page 12 of 56
AD9222
AVDD
70kΩ
1kΩ
CSB
VREF
6kΩ
Figure 12. Equivalent CSB Input Circuit
Figure 14. Equivalent VREF Circuit
1kΩ
SENSE
Figure 13. Equivalent SENSE Circuit
Rev. 0 | Page 13 of 56
AD9222
TYPICAL PERFORMANCE CHARACTERISTICS
0
–20
0
AIN = –0.5dBFS
SNR = 70.35dB
ENOB = 11.40 BITS
SFDR = 83.86dBc
AIN = –0.5dBFS
SNR = 70.79dB
ENOB = 11.47 BITS
–20
SFDR = 84.71dBc
–40
–40
–60
–60
–80
–80
–100
–120
–100
–120
0
5
10
15
20
25
0
2
4
6
8
10
12
14
16
18
20
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 18. Single-Tone 32k FFT with fIN = 35 MHz, AD9222-50
Figure 15. Single-Tone 32k FFT with fIN = 2.3 MHz, AD9222-40
0
0
AIN = –0.5dBFS
SNR = 70.02dB
ENOB = 11.45 BITS
AIN = –0.5dBFS
SNR = 70.32dB
ENOB = 11.39 BITS
–20
–20
–40
SFDR = 86.3dBc
SFDR = 84.28dBc
–40
–60
–80
–60
–80
–100
–100
–120
–120
0
2
4
6
8
10
12
14
16
18
20
0
5
10
15
20
25
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 16. Single-Tone 32k FFT with fIN = 19.7 MHz, AD9222-40
Figure 19. Single-Tone 32k FFT with fIN = 70 MHz, AD9222-50
0
0
AIN = –0.5dBFS
SNR = 70.72dB
ENOB = 11.45 BITS
AIN = –0.5dBFS
SNR = 69.25dB
ENOB = 11.21 BITS
–20
–20
–40
SFDR = 85.79dBc
SFDR = 72.85dBc
–40
–60
–60
–80
–80
–100
–120
–100
–120
0
5
10
15
20
25
0
5
10
15
20
25
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 17. Single-Tone 32k FFT with fIN = 2.3 MHz, AD9222-50
Figure 20. Single-Tone 32k FFT with fIN = 120 MHz, AD9222-50
Rev. 0 | Page 1ꢀ of 56
AD9222
100
95
90
85
80
75
70
65
60
100
90
80
70
60
50
40
30
20
10
0
F
F
= 35MHz
IN
SAMPLE
= 50MSPS
2V p-p, SFDR
2V p-p, SFDR
80dB
REFERENCE
2V p-p, SNR
2V p-p, SNR
10
15
20
25
30
35
40
45
50
–60
–50
–40
–30
–20
–10
0
ENCODE (MSPS)
INPUT AMPLITUDE (dBFS)
Figure 21. SNR/SFDR vs. fSAMPLE, fIN = 2.61 MHz, AD9222-50
Figure 24. SNR/SFDR vs. Analog Input Level, fIN = 35 MHz, AD9222-50
90
0
AIN1 AND AIN2 = –7dBFS
SFDR = 89.87dB
IMD2 = 96.07dBc
85
80
75
70
65
60
–20
–40
IMD3 = 90.16dBc
2V p-p, SFDR
–60
–80
2V p-p, SNR
–100
–120
10
15
20
25
30
35
40
45
50
0
2
4
6
8
10
12
14
16
18
20
ENCODE (MSPS)
FREQUENCY (MHz)
Figure 22. SNR/SFDR vs. fSAMPLE, fIN = 20.1 MHz, AD9222-50
Figure 25. Two-Tone 32k FFT with fIN1 = 15 MHz and fIN2 = 16 MHz,
AD9222-40
100
90
80
70
60
50
40
30
20
10
0
0
F
F
= 10.3MHz
AIN1 AND AIN2 = –7dBFS
SFDR = 77.24dB
IMD2 = 91.66dBc
IN
SAMPLE
= 50MSPS
–20
–40
IMD3 = 77.72dBc
2V p-p, SFDR
80dB
REFERENCE
–60
–80
2V p-p, SNR
–100
–120
–60
–50
–40
–30
–20
–10
0
0
2
4
6
8
10
12
14
16
18
20
INPUT AMPLITUDE (dBFS)
FREQUENCY (MHz)
Figure 23. SNR/SFDR vs. Analog Input Level, fIN = 10.3 MHz, AD9222-50
Figure 26. Two-Tone 32k FFT with fIN1 = 70 MHz and fIN2 = 71 MHz,
AD9222-40
Rev. 0 | Page 15 of 56
AD9222
0
100
95
90
85
80
75
70
65
60
AIN1 AND AIN2 = –7dBFS
SFDR = 84.49dB
IMD2 = 85.83dBc
IMD3 = 84.54dBc
–20
–40
2V p-p, SFDR
2V p-p, SINAD
–60
–80
–100
–120
0
5
10
15
20
25
–40
–20
0
20
40
60
80
FREQUENCY (MHz)
TEMPERATURE (°C)
Figure 27. Two-Tone 32k FFT with fIN1 = 15 MHz and
fIN2 = 16 MHz, AD9222-50
Figure 30. SINAD/SFDR vs. Temperature, fIN = 2.61 MHz, AD9222-50
90
85
0
–20
AIN1 AND AIN2 = –7dBFS
SFDR = 80.42dB
IMD2 = 83.92dBc
IMD3 = 80.60dBc
2V p-p, SFDR
80
–40
75
–60
2V p-p, SINAD
70
–80
65
–100
–120
60
–40
–20
0
20
40
60
80
0
5
10
15
20
25
TEMPERATURE (°C)
FREQUENCY (MHz)
Figure 31. SINAD/SFDR vs. Temperature, fIN = 20.1 MHz, AD9222-50
Figure 28. Two-Tone 32k FFT with fIN1 = 70 MHz and
fIN2 = 71 MHz, AD9222-50
1.0
0.8
90
85
80
75
70
65
60
0.6
SFDR
SNR
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1.0
0
500
1000 1500 2000 2500 3000 3500 4000
CODE
1
10
100
1000
ANALOG INPUT FREQUENCY (MHz)
Figure 29. SNR/SFDR vs. fIN, AD9222-50
Figure 32. INL, fIN = 2.3 MHz, AD9222-50
Rev. 0 | Page 16 of 56
AD9222
0
–20
0.5
0.4
NPR = 60.3dB
NOTCH = 18.0MHz
NOTCH WIDTH = 3.0MHz
0.3
0.2
–40
0.1
–60
0
–0.1
–0.2
–0.3
–0.4
–0.5
–80
–100
–120
0
5
10
15
20
25
0
500
1000 1500 2000 2500 3000 3500 4000
CODE
FREQUENCY (MHz)
Figure 36. Noise Power Ratio (NPR), AD9222-50
Figure 33. DNL, fIN = 2.3 MHz, AD9222-50
–30
–35
–40
–45
–50
–55
–60
–65
–70
0
–1
–3dB BANDWIDTH = 325MHz
–2
–3
–4
–5
–6
–7
–8
–9
–10
–11
0
5
10
15
20
25
30
35
40
0
50
100 150 200 250 300 350 400 450 500
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 37. Full Power Bandwidth vs. Frequency, AD9222-50
Figure 34. CMRR vs. Frequency, AD9222-50
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0.27 LSB rms
N – 3
N – 2
N – 1
N
N + 1
N + 2
N + 3
CODE
Figure 35. Input Referred Noise Histogram, AD9222-50
Rev. 0 | Page 1ꢁ of 56
AD9222
THEORY OF OPERATION
The AD9222 architecture consists of a pipelined ADC that is
divided into three sections: a 4-bit first stage followed by eight
1.5-bit stages and a final 3-bit flash. Each stage provides
sufficient overlap to correct for flash errors in the preceding
stages. The quantized outputs from each stage are combined
into a final 12-bit result in the digital correction logic. The
pipelined architecture permits the first stage to operate on a
new input sample while the remaining stages operate on preceding
samples. Sampling occurs on the rising edge of the clock.
The clock signal alternately switches the input circuit between
sample mode and hold mode (see Figure 38). When the input
circuit is switched into sample mode, the signal source must be
capable of charging the sample capacitors and settling within
one-half of a clock cycle. A small resistor in series with each
input can help reduce the peak transient current injected from
the output stage of the driving source. In addition, low-Q inductors
or ferrite beads can be placed on each leg of the input to reduce
the high differential capacitance seen at the analog inputs, thus
realizing the maximum bandwidth of the ADC. Such use of
low-Q inductors or ferrite beads is required when driving the
converter front end at high IF frequencies. Either a shunt capacitor
or two single-ended capacitors can be placed on the inputs to
provide a matching passive network. This ultimately creates a
low-pass filter at the input to limit any unwanted broadband
noise. See the AN-742 Application Note, the AN-827 Application
Note, and the Analog Dialogue article “Transformer-Coupled
Front-End for Wideband A/D Converters” for more information
on this subject. In general, the precise values depend on the
application.
Each stage of the pipeline, excluding the last, consists of a low
resolution flash ADC connected to a switched-capacitor DAC
and interstage residue amplifier (MDAC). The residue amplifier
magnifies the difference between the reconstructed DAC output
and the flash input for the next stage in the pipeline. One bit of
redundancy is used in each stage to facilitate digital correction
of flash errors. The last stage simply consists of a flash ADC.
The output staging block aligns the data, carries out the error
correction, and passes the data to the output buffers. The data is
then serialized and aligned to the frame and output clock.
ANALOG INPUT CONSIDERATIONS
The analog inputs of the AD9222 are not internally dc-biased.
In ac-coupled applications, the user must provide this bias
externally. Setting the device so that VCM = AVDD/2 is recom-
mended for optimum performance, but the device can function
over a wider range with reasonable performance, as shown in
Figure 39 and Figure 40.
The analog input to the AD9222 is a differential switched-capacitor
circuit designed for processing differential input signals. The input
can support a wide common-mode range and maintain excellent
performance. An input common-mode voltage of midsupply
minimizes signal-dependent errors and provides optimum
performance.
H
CPAR
H
VIN+
CSAMPLE
S
S
S
S
CSAMPLE
VIN–
H
CPAR
H
Figure 38. Switched-Capacitor Input Circuit
Rev. 0 | Page 1± of 56
AD9222
90
85
80
75
70
65
60
90
85
80
75
70
65
60
SFDR (dBc)
SFDR (dBc)
SNR (dB)
SNR (dB)
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
ANALOG INPUT COMMON-MODE VOLTAGE (V)
ANALOG INPUT COMMON-MODE VOLTAGE (V)
Figure 39. SNR/SFDR vs. Common-Mode Voltage,
fIN = 2.3 MHz, AD9222-50
Figure 40. SNR/SFDR vs. Common-Mode Voltage,
fIN = 35 MHz, AD9222-50
Rev. 0 | Page 19 of 56
AD9222
ADT1–1WT
1:1 Z RATIO
For best dynamic performance, the source impedances driving
VIN+ and VIN− should be matched such that common-mode
settling errors are symmetrical. These errors are reduced by the
common-mode rejection of the ADC. An internal reference
buffer creates the positive and negative reference voltages, REFT
and REFB, respectively, that define the span of the ADC core.
The output common-mode of the reference buffer is set to
midsupply, and the REFT and REFB voltages and span are
defined as
C
R
VIN+
VIN–
ADC
1
2Vp-p
49.9ꢀ
C
DIFF
C
AD9222
R
AVDD
1kꢀ
AGND
1kꢀ
0.1μF
1
C
IS OPTIONAL.
DIFF
Figure 41. Differential Transformer-Coupled Configuration
for Baseband Applications
REFT = 1/2 (AVDD + VREF)
REFB = 1/2 (AVDD − VREF)
Span = 2 × (REFT − REFB) = 2 × VREF
ADT1–1WT
1:1 Z RATIO
2Vp-p
16nH
16nH 0.1μF
33ꢀ
VIN+
It can be seen from these equations that the REFT and REFB
voltages are symmetrical about the midsupply voltage and, by
definition, the input span is twice the value of the VREF voltage.
65ꢀ
ADC
499ꢀ
16nH
2.2pF
1kꢀ
AD9222
33ꢀ
VIN–
AVDD
Maximum SNR performance is always achieved by setting the
ADC to the largest span in a differential configuration. In the
case of the AD9222, the largest input span available is 2 V p-p.
1kꢀ
1kꢀ
0.1μF
Figure 42. Differential Transformer-Coupled Configuration for IF Applications
Differential Input Configurations
Single-Ended Input Configuration
There are several ways in which to drive the AD9222 either
actively or passively. In either case, the optimum performance is
achieved by driving the analog input differentially. One example
is by using the AD8334 differential driver. It provides excellent
performance and a flexible interface to the ADC (see Figure 44)
for baseband applications. This configuration is common for
medical ultrasound systems.
A single-ended input may provide adequate performance in
cost-sensitive applications. In this configuration, SFDR and
distortion performance degrade due to the large input common-
mode swing. If the application requires a single-ended input
configuration, ensure that the source impedances on each input
are well matched in order to achieve the best possible performance.
A full-scale input of 2 V p-p can still be applied to the ADC’s VIN+
pin while the VIN− pin is terminated. Figure 43 details a typical
single-ended input configuration.
However, the noise performance of most amplifiers is not
adequate to achieve the true performance of the AD9222. For
applications where SNR is a key parameter, differential transfor-
mer coupling is the recommended input configuration. Two
examples are shown in Figure 41 and Figure 42.
AVDD
C
R
VIN+
In any configuration, the value of the shunt capacitor, C, is
dependent on the input frequency and may need to be reduced
or removed.
0.1µF
AVDD
1kꢀ
2V p-p
49.9ꢀ
ADC
1
C
DIFF
AD9222
1kꢀ
25ꢀ
R
C
VIN–
0.1µF
1kꢀ
1
C
IS OPTIONAL.
DIFF
Figure 43. Single-Ended Input Configuration
0.1μF
LOP
VIP
0.1μF
187ꢀ
374ꢀ
R
R
VOH
VOL
0.1μF 120nH
INH
VIN+
1V p-p
AD8334
1.0kꢀ
1.0kꢀ
22pF
ADC
AD9222
LNA
VGA
C
LMD
VIN–
VREF
0.1μF
187ꢀ
0.1μF
0.1μF
10μF
LON
VIN
274ꢀ
18nF
0.1μF
Figure 44. Differential Input Configuration Using the AD8334
Rev. 0 | Page 20 of 56
AD9222
In some applications, it is acceptable to drive the sample clock
inputs with a single-ended CMOS signal. In such applications,
CLK+ should be directly driven from a CMOS gate, and the
CLK− pin should be bypassed to ground with a 0.1 μF capacitor
in parallel with a 39 kΩ resistor (see Figure 48). Although the
CLK+ input circuit supply is AVDD (1.8 V), this input is
designed to withstand input voltages up to 3.3 V, making the
selection of the drive logic voltage very flexible.
CLOCK INPUT CONSIDERATIONS
For optimum performance, the AD9222 sample clock inputs
(CLK+ and CLK−) should be clocked with a differential signal.
This signal is typically ac-coupled into the CLK+ and CLK− pins
via a transformer or capacitors. These pins are biased internally
and require no additional bias.
Figure 45 shows one preferred method for clocking the AD9222.
The low jitter clock source is converted from single-ended to
differential using an RF transformer. The back-to-back Schottky
diodes across the secondary transformer limit clock excursions
into the AD9222 to approximately 0.8 V p-p differential. This
helps prevent the large voltage swings of the clock from feeding
through to other portions of the AD9222 and preserves the fast
rise and fall times of the signal, which are critical to low jitter
performance.
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
0.1µF
CLOCK
CLK
INPUT
OPTIONAL
100ꢀ
0.1µF
1
50ꢀ
CLK+
CMOS DRIVER
CLK
ADC
AD9222
0.1µF
CLK–
0.1µF
39kꢀ
1
50ꢀ RESISTOR IS OPTIONAL.
MIN-CIRCUITS
ADT1–1WT, 1:1Z
Figure 48. Single-Ended 1.8 V CMOS Sample Clock
0.1µF
0.1µF
XFMR
AD9510/AD9511/
AD9512/AD9513/
CLOCK
INPUT
CLK+
100ꢀ
ADC
AD9222
CLK–
50ꢀ
AD9514/AD9515
0.1µF
0.1µF
CLOCK
INPUT
CLK
OPTIONAL
100ꢀ
0.1µF
1
50ꢀ
SCHOTTKY
DIODES:
HSM2812
0.1µF
CLK+
CMOS DRIVER
CLK
ADC
AD9222
Figure 45. Transformer-Coupled Differential Clock
0.1µF
0.1µF
CLK–
If a low jitter clock is available, another option is to ac-couple a
differential PECL signal to the sample clock input pins as shown
in Figure 46. The AD9510/AD9511/AD9512/AD9513/AD9514/
AD9515 family of clock drivers offers excellent jitter performance.
1
50ꢀ RESISTOR IS OPTIONAL.
Figure 49. Single-Ended 3.3 V CMOS Sample Clock
Clock Duty Cycle Considerations
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
Typical high speed ADCs use both clock edges to generate a
variety of internal timing signals. As a result, these ADCs may
be sensitive to clock duty cycle. Commonly, a 5% tolerance is
required on the clock duty cycle to maintain dynamic performance
characteristics. The AD9222 contains a duty cycle stabilizer (DCS)
that retimes the nonsampling edge, providing an internal clock
signal with a nominal 50% duty cycle. This allows a wide range
of clock input duty cycles without affecting the performance of
the AD9222. When the DCS is on, noise and distortion perfor-
mance are nearly flat for a wide range of duty cycles. However,
some applications may require the DCS function to be off. If so,
keep in mind that the dynamic range performance can be affected
when operated in this mode. See the Memory Map section for
more details on using this feature.
0.1µF
0.1µF
CLOCK
INPUT
CLK
PECL DRIVER
CLK
CLK+
ADC
AD9222
100ꢀ
0.1µF
0.1µF
CLOCK
INPUT
CLK–
1
1
240ꢀ
240ꢀ
50ꢀ
50ꢀ
1
50ꢀ RESISTORS ARE OPTIONAL.
Figure 46. Differential PECL Sample Clock
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
0.1µF
0.1µF
CLOCK
INPUT
CLK+
CLK
ADC
AD9222
100ꢀ
LVDS DRIVER
CLK
0.1µF
0.1µF
CLOCK
INPUT
CLK–
The duty cycle stabilizer uses a delay-locked loop (DLL) to
create the nonsampling edge. As a result, any changes to the
sampling frequency require approximately eight clock cycles
to allow the DLL to acquire and lock to the new rate.
1
1
50ꢀ
50ꢀ
1
50ꢀ RESISTORS ARE OPTIONAL.
Figure 47. Differential LVDS Sample Clock
Rev. 0 | Page 21 of 56
AD9222
Clock Jitter Considerations
Power Dissipation and Power-Down Mode
High speed, high resolution ADCs are sensitive to the quality of the
clock input. The degradation in SNR at a given input frequency
(fA) due only to aperture jitter (tJ) can be calculated by
As shown in Figure 51, the power dissipated by the AD9222 is
proportional to its sample rate. The digital power dissipation
does not vary much because it is determined primarily by the
DRVDD supply and bias current of the LVDS output drivers.
SNR degradation = 20 × log 10 [1/2 × π × fA × tJ]
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0.800
0.750
0.700
0.650
0.600
0.550
0.500
In this equation, the rms aperture jitter represents the root mean
square of all jitter sources, including the clock input, analog input
signal, and ADC aperture jitter specifications. IF undersampling
applications are particularly sensitive to jitter (see Figure 50).
AVDD CURRENT
The clock input should be treated as an analog signal in cases
where aperture jitter may affect the dynamic range of the AD9222.
Power supplies for clock drivers should be separated from the
ADC output driver supplies to avoid modulating the clock signal
with digital noise. Low jitter, crystal-controlled oscillators make
the best clock sources. If the clock is generated from another
type of source (by gating, dividing, or other methods), it should
be retimed by the original clock at the last step.
TOTAL POWER
DRVDD CURRENT
10
15
20
25
30
35
40
45
50
ENCODE (MSPS)
Refer to the AN-501 Application Note and the AN-756
Application Note for more in-depth information about jitter
performance as it relates to ADCs (visit www.analog.com).
Figure 51. Supply Current vs. fSAMPLE for fIN = 10.3 MHz, AD9222- 50
130
RMS CLOCK JITTER REQUIREMENT
120
110
16 BITS
100
90
80
70
60
50
40
30
14 BITS
12 BITS
10 BITS
8 BITS
0.125ps
0.25ps
0.5ps
1.0ps
2.0ps
1
10
100
1000
ANALOG INPUT FREQUENCY (MHz)
Figure 50. Ideal SNR vs. Input Frequency and Jitter
Rev. 0 | Page 22 of 56
AD9222
By asserting the PDWN pin high, the AD9222 is placed in
power-down mode. In this state, the ADC typically dissipates
11 mW. During power-down, the LVDS output drivers are placed
in a high impedance state. The AD9222 returns to normal
operating mode when the PDWN pin is pulled low. This pin is
both 1.8 V and 3.3 V tolerant.
100 Ω termination resistor placed as close to the receiver as
possible. No far-end receiver termination and poor differential
trace routing may result in timing errors. It is recommended
that the trace length is no longer than 24 inches and that the
differential output traces are kept close together and at equal
lengths. An example of the FCO and data stream with proper
trace length and position can be found in Figure 52.
In power-down mode, low power dissipation is achieved by
shutting down the reference, reference buffer, PLL, and biasing
networks. The decoupling capacitors on REFT and REFB are
discharged when entering power-down mode and must be
recharged when returning to normal operation. As a result, the
wake-up time is related to the time spent in the power-down
mode; shorter cycles result in proportionally shorter wake-up
times. With the recommended 0.1 ꢀF and 4.7 ꢀF decoupling
capacitors on REFT and REFB, it takes approximately 1 sec to
fully discharge the reference buffer decoupling capacitors and
375 ꢀs to restore full operation.
There are a number of other power-down options available
when using the SPI port interface. The user can individually
power down each channel or put the entire device into standby
mode. This allows the user to keep the internal PLL powered
when fast wake-up times (~600 ns) are required. See the
Memory Map section for more details on using these features.
5.0ns/DIV
CH1 500mV/DIV = FCO
CH2 500mV/DIV = DCO
CH3 500mV/DIV = DATA
Figure 52. LVDS Output Timing Example in ANSI Mode (Default), AD9222-50
An example of the LVDS output using the ANSI standard (default)
data eye and a time interval error (TIE) jitter histogram with
trace lengths less than 24 inches on regular FR-4 material is
shown in Figure 53. Figure 54 shows an example of when the
trace lengths exceed 24 inches on regular FR-4 material. Notice
that the TIE jitter histogram reflects the decrease of the data eye
opening as the edge deviates from the ideal position. It is up to
the user to determine if the waveforms meet the timing budget
of the design when the trace lengths exceed 24 inches. Additional
SPI options allow the user to further increase the internal ter-
mination (increasing the current) of all eight outputs in order to
drive longer trace lengths (see Figure 55). Even though this
produces sharper rise and fall times on the data edges and is less
prone to bit errors, the power dissipation of the DRVDD supply
increases when this option is used. Also notice in Figure 55 that
the histogram has improved.
Digital Outputs and Timing
The AD9222 differential outputs conform to the ANSI-644 LVDS
standard on default power-up. This can be changed to a low power,
reduced signal option similar to the IEEE 1596.3 standard using the
SDIO/ODM pin or via the SPI. This LVDS standard can further
reduce the overall power dissipation of the device by approximately
36 mW. See the SDIO/ODM Pin section or Table 15 in the
Memory Map section for more information. The LVDS driver
current is derived on-chip and sets the output current at each
output equal to a nominal 3.5 mA. A 100 Ω differential termination
resistor placed at the LVDS receiver inputs results in a nominal
350 mV swing at the receiver.
The AD9222 LVDS outputs facilitate interfacing with LVDS
receivers in custom ASICs and FPGAs that have LVDS capability
for superior switching performance in noisy environments.
Single point-to-point net topologies are recommended with a
In cases that require increased driver strength to the DCO and
FCO outputs because of load mismatch, Register 15 allows the
user to increase the drive strength by 2×. To do this, set the
appropriate bit in Register 5. Note that this feature cannot be
used with Bit 4 and Bit 5 in Register 15. Bit 4 and Bit 5 will take
precedence over this feature. See the Memory Map section for
more details.
Rev. 0 | Page 23 of 56
AD9222
500
400
300
EYE: ALL BITS
ULS: 12071/12071
EYE: ALL BITS
ULS: 12072/12072
400
300
200
200
100
100
0
0
–100
–200
–300
–400
–500
–100
–200
–300
–400
–1.5ns
–1.0ns
–0.5ns
0ns
0.5ns
1.0ns
1.5ns
–1.5ns
–1.0ns
–0.5ns
0ns
0.5ns
1.0ns
1.5ns
90
80
70
60
50
40
30
20
10
80
70
60
50
40
30
20
10
0
0
–150ps
–100ps
–50ps
0ps
50ps
100ps
150ps
–150ps
–100ps
–50ps
0ps
50ps
100ps
150ps
Figure 55. Data Eye for LVDS Outputs in ANSI Mode with 100 Ω Termination
on and Trace Lengths Greater than 24 Inches on Standard FR-4, AD9222-50
Figure 53. Data Eye for LVDS Outputs in ANSI Mode with Trace Lengths Less
than 24 Inches on Standard FR-4, AD9222-50
The format of the output data is offset binary by default. An
example of the output coding format can be found in Table 8.
If it is desired to change the output data format to twos
complement, see the Memory Map section.
500
EYE: ALL BITS
ULS: 12067/12067
400
300
200
100
Table 8. Digital Output Coding
0
(VIN+) − (VIN−), Input
Digital Output Offset Binary
(D11 ... D0)
–100
–200
–300
–400
–500
Code Span = 2 V p-p (V)
ꢀ095
20ꢀ±
20ꢀꢁ
0
+1.00
1111 1111 1111
1000 0000 0000
0111 1111 1111
0000 0000 0000
0.00
−0.000ꢀ±±
−1.00
–1.5ns
–1.0ns
–0.5ns
0ns
0.5ns
1.0ns
1.5ns
Data from each ADC is serialized and provided on a separate
channel. The data rate for each serial stream is equal to 12 bits
times the sample clock rate, with a maximum of 600 Mbps
(12 bits × 50 MSPS = 600 Mbps). The lowest typical conversion
rate is 10 MSPS. However, if lower sample rates are required for
a specific application, the PLL can be set up for encode rates
lower than 10 MSPS via the SPI. This allows encode rates as low
as 5 MSPS. See the Memory Map section to enable this feature.
100
90
80
70
60
50
40
30
20
10
0
–200ps
–100ps
0ps
100ps
200ps
Figure 54. Data Eye for LVDS Outputs in ANSI Mode with Trace Lengths
Greater than 24 Inches on Standard FR-4, AD9222-50
Rev. 0 | Page 2ꢀ of 56
AD9222
Two output clocks are provided to assist in capturing data from
the AD9222. The DCO is used to clock the output data and is
equal to six times the sampling clock (CLK) rate. Data is
clocked out of the AD9222 and must be captured on the rising
and falling edges of the DCO that supports double data rate
(DDR) capturing. The frame clock out (FCO) is used to signal
the start of a new output byte and is equal to the sampling clock
rate. See the timing diagram shown in Figure 2 for more
information.
Table 9. Flex Output Test Modes
Subject
to Data
Format
Output Test
Mode Bit
Sequence
Pattern Name
Off (default)
Digital Output Word 1
Digital Output Word 2
Select
0000
N/A
N/A
N/A
0001
Midscale short
1000 0000 (±-bit)
Same
Yes
10 0000 0000 (10-bit)
1000 0000 0000 (12-bit)
10 0000 0000 0000 (1ꢀ-bit)
0010
0011
0100
+Full-scale short
−Full-scale short
Checker board
1111 1111 (±-bit)
Same
Same
Yes
Yes
No
11 1111 1111 (10-bit)
1111 1111 1111 (12-bit)
11 1111 1111 1111 (1ꢀ-bit)
0000 0000 (±-bit)
00 0000 0000 (10-bit)
0000 0000 0000 (12-bit)
00 0000 0000 0000 (1ꢀ-bit)
1010 1010 (±-bit)
0101 0101 (±-bit)
10 1010 1010 (10-bit)
1010 1010 1010 (12-bit)
10 1010 1010 1010 (1ꢀ-bit)
N/A
N/A
01 0101 0101 (10-bit)
0101 0101 0101 (12-bit)
01 0101 0101 0101 (1ꢀ-bit)
N/A
N/A
0101
0110
0111
PN sequence long1
PN sequence short1
One/zero word toggle
Yes
Yes
No
1111 1111 (±-bit)
0000 0000 (±-bit)
11 1111 1111 (10-bit)
1111 1111 1111 (12-bit)
11 1111 1111 1111 (1ꢀ-bit)
00 0000 0000 (10-bit)
0000 0000 0000 (12-bit)
00 0000 0000 0000 (1ꢀ-bit)
1000
1001
User input
One/zero bit toggle
Register 0x19 to Register 0x1A
1010 1010 (±-bit)
Register 0x1B to Register 0x1C
N/A
No
No
10 1010 1010 (10-bit)
1010 1010 1010 (12-bit)
10 1010 1010 1010 (1ꢀ-bit)
1010
1011
1100
1× sync
0000 1111 (±-bit)
N/A
N/A
N/A
No
No
No
00 0001 1111 (10-bit)
0000 0011 1111 (12-bit)
00 0000 0111 1111 (1ꢀ-bit)
One bit high
Mixed frequency
1000 0000 (±-bit)
10 0000 0000 (10-bit)
1000 0000 0000 (12-bit)
10 0000 0000 0000 (1ꢀ-bit)
1010 0011 (±-bit)
10 0110 0011 (10-bit)
1010 0011 0011 (12-bit)
10 1000 0110 0111 (1ꢀ-bit)
1 PN, or pseudorandom number, sequence is determined by the number of bits in the shift register. The long sequence is 23 bits and the short sequence is
9 bits. How the sequence is generated and utilized is described in the ITU O.150 standard. In general, the polynomial, X23 + X1± + 1 (long) and X9 + X5 + 1
(short), defines the pseudorandom sequence.
Rev. 0 | Page 25 of 56
AD9222
When using the serial port interface (SPI), the DCO phase can
be adjusted in 60° increments relative to the data edge. This
enables the user to refine system timing margins if required.
The default DCO timing, as shown in Figure 2, is 90° relative to
the output data edge.
Table 10. Output Driver Mode Pin Settings
Resulting
Resulting
Selected ODM ODM Voltage
Normal
operation
Output Standard FCO and DCO
10 kΩ to AGND ANSI-6ꢀꢀ
ANSI-6ꢀꢀ
(default)
(default)
ODM
AVDD
Low power,
reduced signal
option
Low power,
reduced
signal
An 8-, 10-, and 14-bit serial stream can also be initiated from
the SPI. This allows the user to implement and test compatibility
to lower and higher resolution systems. When changing the
resolution to an 8- or 10-bit serial stream, the data stream is
shortened. See Figure 3 for the 10-bit example. However, when
using the 14-bit option, the data stream stuffs two 0s at the end
of the normal 14-bit serial data.
option
SCLK/DTP Pin
This pin is for applications that do not require SPI mode operation.
The serial clock/digital test pattern (SCLK/DTP) pin can enable
a single digital test pattern if this pin and the CSB pin are held
high during device power-up. When the DTP is tied to AVDD,
all the ADC channel outputs shift out the following pattern:
1000 0000 0000. The FCO and DCO outputs still work as usual
while all channels shift out the repeatable test pattern. This pattern
allows the user to perform timing alignment adjustments among
the FCO, DCO, and output data. For normal operation, this pin
should be tied to AGND through a 10 kΩ resistor. This pin is
both 1.8 V and 3.3 V tolerant.
When using the SPI, all of the data outputs can also be inverted
from their nominal state. This is not to be confused with
inverting the serial stream to an LSB-first mode. In default
mode, as shown in Figure 2, the MSB is represented first in the
data output serial stream. However, this can be inverted so that
the LSB is represented first in the data output serial stream (see
Figure 4).
There are 12 digital output test pattern options available that
can be initiated through the SPI. This is a useful feature when
validating receiver capture and timing. Refer to Table 9 for the
output bit sequencing options available. Some test patterns have
two serial sequential words and can be alternated in various
ways, depending on the test pattern chosen. It should be noted
that some patterns may not adhere to the data format select
option. In addition, customer user patterns can be assigned in
the 0x19, 0x1A, 0x1B, and 0x1C register addresses. All test mode
options can support 8- to 14-bit word lengths in order to verify
data capture to the receiver.
Table 11. Digital Test Pattern Pin Settings
Resulting
Resulting
FCO and DCO
Selected DTP DTP Voltage
Normal
operation
DTP
D+ and D−
10 kΩ to AGND Normal
Normal operation
operation
AVDD
1000 0000 0000 Normal operation
Additional and custom test patterns can also be observed when
commanded from the SPI port. Consult the Memory Map
section to choose from the different options available.
Please consult the Memory Map section for information on how
to change these additional digital output timing features through
the serial port interface or SPI.
CSB Pin
The chip select bar (CSB) pin should be tied to AVDD for
applications that do not require SPI mode operation. By tying
CSB high, all SCLK and SDIO information is ignored. This pin
is both 1.8 V and 3.3 V tolerant.
SDIO/ODM Pin
This pin is for applications that do not require SPI mode operation.
The SDIO/ODM pin can enable a low power, reduced signal option
similar to the IEEE 1596.3 reduced range link output standard if
this pin and the CSB pin are tied to AVDD during device power-
up. This option should only be used when the digital output trace
lengths are less than 2 inches from the LVDS receiver. The FCO,
DCO, and outputs function normally, but the LVDS signal swing
of all channels is reduced from 350 mV p-p to 200 mV p-p. This
output mode allows the user to further lower the power on the
DRVDD supply. For applications where this pin is not used, it
should be tied low. In this case, the device pin can be left open,
and the 30 kΩ internal pull-down resistor pulls this pin low. This
pin is only 1.8 V tolerant. If applications require this pin to be
driven from a 3.3 V logic level, insert a 1 kΩ resistor in series
with this pin to limit the current.
RBIAS Pin
To set the internal core bias current of the ADC, place a resistor
(nominally equal to 10.0 kΩ) to ground at the RBIAS pin. The
resistor current is derived on-chip and sets the ADC’s AVDD
current to a nominal 358 mA at 50 MSPS. Therefore, it is
imperative that at least a 1% tolerance on this resistor be used to
achieve consistent performance. If SFDR performance is not as
critical as power, simply adjust the ADC core current to achieve
a lower power. Figure 56 and Figure 57 show the relationship
between the dynamic range and power as the RBIAS resistance
is changed. Nominally, a 10.0 kΩ value is used, as indicated by
the dashed line.
Rev. 0 | Page 26 of 56
AD9222
90
85
80
75
70
65
60
Internal Reference Operation
A comparator within the AD9222 detects the potential at the
SENSE pin and configures the reference. If SENSE is grounded,
the reference amplifier switch is connected to the internal
resistor divider (see Figure 58), setting VREF to 1 V.
SFDR
The REFT and REFB pins establish their input span of the ADC
core from the reference configuration. The analog input full-
scale range of the ADC equals twice the voltage at the reference
pin for either an internal or an external reference configuration.
SNR
If the reference of the AD9222 is used to drive multiple
converters to improve gain matching, the loading of the refer-
ence by the other converters must be considered. Figure 60
depicts how the internal reference voltage is affected by loading.
0
5
10
15
(kꢀ)
20
25
R
BIAS
Figure 56. SNR/SFDR vs. RBIAS, FIN = 10.3 MHz, AD9222-50
VIN+
1.0
VIN–
REFT
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0.1µF
+
ADC
CORE
0.1µF
2.2µF
REFB
0.1µF
V
REF
1µF
0.1µF
0.5V
SELECT
LOGIC
SENSE
0
5
10
15
(kꢀ)
20
25
R
BIAS
Figure 58. Internal Reference Configuration
Figure 57. IAVDD vs. RBIAS, AD9222-50
VIN+
VIN–
Voltage Reference
A stable and accurate 0.5 V voltage reference is built into the
AD9222. This is gained up by a factor of 2 internally, setting
REFT
0.1µF
0.1µF
REFB
+
ADC
CORE
2.2µF
VREF to 1.0 V, which results in a full-scale differential input span
of 2 V p-p. The VREF is set internally by default; however, the
VREF pin can be driven externally with a 1.0 V reference to
achieve more accuracy.
EXTERNAL
REFERENCE
0.1µF
V
REF
1
1
1µF
0.1µF
0.5V
When applying the decoupling capacitors to the VREF, REFT,
and REFB pins, use ceramic low ESR capacitors. These capacitors
should be close to the ADC pins and on the same layer of the
PCB as the AD9222. The recommended capacitor values and
configurations for the AD9222 reference pin can be found in
Figure 58.
SELECT
LOGIC
AVDD
SENSE
1
OPTIONAL.
Figure 59. External Reference Operation
Table 12. Reference Settings
Resulting
Selected
Mode
SENSE
Voltage
Resulting
VREF (V)
Differential
Span (V p-p)
External
AVDD
N/A
2 × external
reference
Reference
Internal,
2 V p-p FSR
AGND to 0.2 V
1.0
2.0
Rev. 0 | Page 2ꢁ of 56
AD9222
0.02
0
External Reference Operation
The use of an external reference may be necessary to enhance
the gain accuracy of the ADC or improve thermal drift charac-
teristics. Figure 61 shows the typical drift characteristics of the
internal reference in 1 V mode.
–0.02
–0.04
–0.06
–0.08
–0.10
–0.12
–0.14
–0.16
–0.18
When the SENSE pin is tied to AVDD, the internal reference is
disabled, allowing the use of an external reference. The external
reference is loaded with an equivalent 6 kΩ load. An internal
reference buffer generates the positive and negative full-scale
references, REFT and REFB, for the ADC core. Therefore, the
external reference must be limited to a nominal of 1.0 V.
5
–40
–20
0
20
40
60
80
TEMPERATURE (°C)
0
–5
Figure 61. Typical VREF Drift, AD9222-50
–10
–15
–20
–25
–30
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
CURRENT LOAD (mA)
Figure 60. VREF Accuracy vs. Load, AD9222-50
Rev. 0 | Page 2± of 56
AD9222
SERIAL PORT INTERFACE (SPI)
CSB remains low until the communication cycle is complete.
The AD9222 serial port interface allows the user to configure
the converter for specific functions or operations through a
structured register space provided inside the ADC. This gives
the user added flexibility and customization depending on the
application. Addresses are accessed via the serial port and can
be written to or read from via the port. Memory is organized
into bytes that can be further divided down into fields, as doc-
umented in the Memory Map section. Detailed operational
information can be found in the Analog Devices, Inc., user
manual Interfacing to High Speed ADCs via SPI.
However, if connected to a slow device, CSB can be brought
high between bytes, allowing older microcontrollers enough
time to transfer data into shift registers. CSB can be stalled
when transferring one, two, or three bytes of data. When W0
and W1 are set to 11, the device enters streaming mode and
continues to process data, either reading or writing, until the
CSB is taken high to end the communication cycle. This allows
complete memory transfers without having to provide additional
instructions. Regardless of the mode, if CSB is taken high in the
middle of any byte transfer, the SPI state machine is reset and
the device waits for a new instruction.
There are three pins that define the serial port interface, or SPI,
to this particular ADC. They are the SCLK, SDIO, and CSB
pins. The SCLK (serial clock) is used to synchronize the read
and write data presented to the ADC. The SDIO (serial data
input/output) is a dual-purpose pin that allows data to be sent
to and read from the internal ADC memory map registers. The
CSB (chip select bar) is an active low control that enables or
disables the read and write cycles (see Table 13).
In addition to the operation modes, the SPI port can be
configured to operate in different manners. For applications
that do not require a control port, the CSB line can be tied and
held high. This places the remainder of the SPI pins in their
secondary mode as defined in the Serial Port Interface (SPI)
section. CSB can also be tied low to enable 2-wire mode. When
CSB is tied low, SCLK and SDIO are the only pins required for
communication. Although the device is synchronized during
power-up, caution must be exercised when using this mode to
ensure that the serial port remains synchronized with the CSB
line. When operating in 2-wire mode, it is recommended to use
a 1-, 2-, or 3-byte transfer exclusively. Without an active CSB
line, streaming mode can be entered but not exited.
Table 13. Serial Port Pins
Pin
Function
SCLK
Serial Clock. The serial shift clock in. SCLK is used to
synchronize serial interface reads and writes.
SDIO
CSB
Serial Data Input/Output. A dual-purpose pin. The
typical role for this pin is an input or output, depending
on the instruction sent and the relative position in the
timing frame.
Chip Select Bar (Active Low). This control gates the read
and write cycles.
In addition to word length, the instruction phase determines if
the serial frame is a read or write operation, allowing the serial
port to be used to both program the chip and read the contents
of the on-chip memory. If the instruction is a readback operation,
performing a readback causes the serial data input/output (SDIO)
pin to change direction from an input to an output at the
appropriate point in the serial frame.
The falling edge of the CSB in conjunction with the rising edge
of the SCLK determines the start of the framing sequence. During
an instruction phase, a 16-bit instruction is transmitted, followed
by one or more data bytes, which is determined by Bit Fields
W0 and W1. An example of the serial timing and its definitions
can be found in Figure 63 and Table 14. In normal operation,
CSB is used to signal to the device that SPI commands are to be
received and processed. When CSB is brought low, the device
processes SCLK and SDIO to process instructions. Normally,
Data can be sent in MSB- or LSB-first mode. MSB-first mode
is the default at power-up and can be changed by adjusting the
configuration register. For more information about this and
other features, see the user manual Interfacing to High Speed
ADCs via SPI.
Rev. 0 | Page 29 of 56
AD9222
This interface is flexible enough to be controlled by either serial
PROMS or PIC mirocontrollers. This provides the user an
alternative method, other than a full SPI controller, to program
the ADC (see the AN-812 Application Note).
HARDWARE INTERFACE
The pins described in Table 13 compose the physical interface
between the user’s programming device and the serial port of
the AD9222. The SCLK and CSB pins function as inputs when
using the SPI interface. The SDIO pin is bidirectional, functioning
as an input during write phases and as an output during readback.
If the user chooses not to use the SPI interface, these pins serve
a dual function and are associated with secondary functions
when the CSB is strapped to AVDD during device power-up.
See the Theory of Operation section for details on which pin-
strappable functions are supported on the SPI pins.
If multiple SDIO pins share a common connection, care should
be taken to ensure that proper VOH levels are met. Assuming the
same load as the AD9222, Figure 62 shows the number of SDIO
pins that can be connected together and the resulting VOH level.
1.800
1.795
1.790
1.785
1.780
1.775
1.770
1.765
1.760
1.755
1.750
1.745
1.740
1.735
1.730
1.725
1.720
1.715
0
10
20
30
40
50
60
70
80
90
100
NUMBER OF SDIO PINS CONNECTED TOGETHER
Figure 62. SDIO Pin Loading
Rev. 0 | Page 30 of 56
AD9222
tDS
tHI
tCLK
tH
tS
tDH
tLO
CSB
SCLK DON’T CARE
SDIO DON’T CARE
DON’T CARE
DON’T CARE
R/W
W1
W0
A12
A11
A10
A9
A8
A7
D5
D4
D3
D2
D1
D0
Figure 63. Serial Timing Details
Table 14. Serial Timing Definitions
Parameter
Timing (minimum, ns)
Description
tDS
5
2
ꢀ0
5
Set-up time between the data and the rising edge of SCLK
Hold time between the data and the rising edge of SCLK
Period of the clock
tDH
tCLK
tS
Set-up time between CSB and SCLK
tH
2
Hold time between CSB and SCLK
tHI
tLO
tEN_SDIO
16
16
1
Minimum period that SCLK should be in a logic high state
Minimum period that SCLK should be in a logic low state
Minimum time for the SDIO pin to switch from an input to an output relative to the SCLK
falling edge (not shown in Figure 63)
tDIS_SDIO
5
Minimum time for the SDIO pin to switch from an output to an input relative to the SCLK
rising edge (not shown in Figure 63)
Rev. 0 | Page 31 of 56
AD9222
MEMORY MAP
READING THE MEMORY MAP TABLE
RESERVED LOCATIONS
Undefined memory locations should not be written to except
when writing the default values suggested in this data sheet.
Addresses that have values marked as 0 should be considered
reserved and have a 0 written into their registers during power-up.
Each row in the memory map table has eight address locations.
The memory map is roughly divided into three sections: chip
configuration register map (Address 0x00 to Address 0x02), device
index and transfer register map (Address 0x05 and Address 0xFF),
and program register map (Address 0x08 to Address 0x25).
DEFAULT VALUES
The left-hand column of the memory map indicates the register
address number in hexadecimal. The default value of this address is
shown in hexadecimal in the right-hand column. The Bit 7 (MSB)
column is the start of the default hexadecimal value given. For
example, Hexadecimal Address 0x09, Clock, has a hexadecimal
default value of 0x01. This means Bit 7 = 0, Bit 6 = 0, Bit 5 = 0,
Bit 4 = 0, Bit 3 = 0, Bit 2 = 0, Bit 1 = 0, and Bit 0 = 1, or 0000 0001
in binary. This setting is the default for the duty cycle stabilizer in
the on condition. By writing a 0 to Bit 6 at this address, the duty
cycle stabilizer turns off. For more information on this and other
functions, consult the user manual Interfacing to High Speed
ADCs via SPI.
Coming out of reset, critical registers are preloaded with default
values. These values are indicated in Table 15, where an X refers
to an undefined feature.
LOGIC LEVELS
An explanation of various registers follows: “Bit is set” is
synonymous with “bit is set to Logic 1” or “writing Logic 1 for
the bit.” Similarly, “clear a bit” is synonymous with “bit is set to
Logic 0” or “writing Logic 0 for the bit.”
Rev. 0 | Page 32 of 56
AD9222
Table 15. Memory Map Register
Default
Value
(Hex)
Addr.
(Hex)
Bit 7
Bit 0
(LSB)
Default Notes/
Comments
Parameter Name (MSB)
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Chip Configuration Registers
00
chip_port_config
0
LSB first
1 = on
Soft
reset
1
1
Soft
reset
LSB first
1 = on
0
0x1±
The nibbles
should be
0 = off
(default)
1 = on
0 = off
(default)
1 = on
0 = off
(default)
0 = off
(default)
mirrored so that
LSB- or MSB-first
mode registers
correctly
regardless of
shift mode.
01
02
chip_id
±-bit Chip ID Bits ꢁ:0
(AD9222 = 0x0ꢁ), (default)
Read
only
Default is unique
chip ID, different
for each device.
This is a read-
only register.
chip_grade
X
Child ID 6:ꢀ
X
X
X
X
Read
only
Child ID used to
differentiate
graded devices.
(identify device variants of Chip ID)
011 = 50 MSPS
001 = ꢀ0 MSPS
Device Index and Transfer Registers
0ꢀ
05
FF
device_index_2
device_index_1
device_update
X
X
X
X
X
X
X
X
Data
Channel
H
1 = on
(default)
0 = off
Data
Channel
G
Data
Channel
F
Data
Channel
E
0x0F
0x0F
0x00
Bits are set to
determine which
on-chip device
receives the next
write command.
1 = on
1 = on
1 = on
(default) (default) (default)
0 = off
0 = off
0 = off
Clock
Channel
DCO
1 = on
0 = off
Clock
Channel
FCO
1 = on
0 = off
Data
Channel
D
Data
Channel
C
Data
Channel
B
Data
Channel
A
Bits are set to
determine which
on-chip device
receives the next
write command.
1 = on
1 = on
1 = on
1 = on
(default) (default) (default) (default)
(default) (default) 0 = off
0 = off
0 = off
0 = off
X
X
X
X
X
SW
Synchronously
transfers data
from the master
shift register to
the slave.
transfer
1 = on
0 = off
(default)
ADC Functions
0±
modes
X
X
X
X
X
X
X
X
X
X
Internal power-down mode
000 = chip run (default)
001 = full power-down
010 = standby
0x00
0x01
Determines
various generic
modes of chip
operation.
011 = reset
09
clock
X
X
Duty
Turns the
cycle
internal duty
cycle stabilizer
on and off.
stabilizer
1 = on
(default)
0 = off
0D
test_io
User test mode
00 = off (default)
Reset PN Reset
long gen PN short Digital Outputs and Timing section
Output test mode—see Table 9 in the
0x00
When set, the
test data is
01 = on, single alternate 1 = on
gen
1 = on
0000 = off (default)
0001 = midscale short
0010 = +FS short
placed on the
output pins in
place of normal
data.
10 = on, single once
11 = on, alternate once
0 = off
(default) 0 = off
(default) 0011 = −FS short
0100 = checker board output
0101 = PN 23 sequence
0110 = PN 9
0111 = one/zero word toggle
1000 = user input
1001 = one/zero bit toggle
1010 = 1× sync
1011 = one bit high
1100 = mixed bit frequency
(format determined by output_mode)
Rev. 0 | Page 33 of 56
AD9222
Default
Value
(Hex)
Addr.
(Hex)
Bit 7
Parameter Name (MSB)
output_mode X
Bit 0
(LSB)
Default Notes/
Comments
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
1ꢀ
0 = LVDS
ANSI
(default)
1 = LVDS
low
X
X
X
Output
invert
1 = on
0 = off
(default)
00 = offset binary
(default)
0x00
Configures the
outputs and the
format of the
data.
01 = twos
complement
power,
(IEEE
1596.3
similar)
15
output_adjust
X
X
Output driver
termination
00 = none (default)
01 = 200 Ω
10 = 100 Ω
11 = 100 Ω
X
X
X
DCO and 0x00
FCO
2× Drive
Strength
1 = on
Determines
LVDS or other
output properties.
Primarily func-
tions to set the
LVDS span and
common-mode
levels in place of
an external
0 = off
(default)
resistor.
16
output_phase
X
X
X
X
0011 = output clock phase adjust
(0000 through 1010)
0x03
On devices that
utilize global
clock divide,
determines
which phase of
the divider
output is used to
supply the
output clock.
Internal latching
is unaffected.
(Default: 1±0° relative to DATA edge)
0000 = 0° relative to DATA edge
0001 = 60° relative to DATA edge
0010 = 120° relative to DATA edge
0011 = 1±0° relative to DATA edge
0100 = 2ꢀ0° relative to DATA edge
0101 = 300° relative to DATA edge
0110 = 360° relative to DATA edge
0111 = ꢀ20° relative to DATA edge
1000 = ꢀ±0° relative to DATA edge
1001 = 5ꢀ0° relative to DATA edge
1010 = 600° relative to DATA edge
1011 to 1111 = 660° relative to DATA edge
19
1A
1B
1C
21
user_patt1_lsb
user_patt1_msb
user_patt2_lsb
user_patt2_msb
serial_control
Bꢁ
B6
B1ꢀ
B6
B5
B13
B5
Bꢀ
B12
Bꢀ
B3
B2
B1
B9
B1
B9
B0
B±
B0
B±
0x00
0x00
0x00
0x00
0x00
User-defined
pattern, 1 LSB.
B15
Bꢁ
B11
B3
B10
B2
User-defined
pattern, 1 MSB.
User-defined
pattern, 2 LSB.
B15
B1ꢀ
X
B13
X
B12
X
B11
B10
User-defined
pattern, 2 MSB.
LSB first
1 = on
0 = off
<10
MSPS,
low
encode
rate
000 = 12 bits (default, normal bit
stream)
001 = ± bits
010 = 10 bits
011 = 12 bits
Serial stream
control. Default
causes MSB first
and the native
bit stream
(default)
mode
1 = on
0 = off
(default)
100 = 1ꢀ bits
(global).
22
serial_ch_stat
X
X
X
X
X
X
Channel
output
reset
Channel
power-
down
0x00
Used to power
down individual
sections of a
1 = on
0 = off
1 = on
0 = off
converter (local).
(default) (default)
Rev. 0 | Page 3ꢀ of 56
AD9222
Power and Ground Recommendations
Exposed Paddle Thermal Heat Slug Recommendations
When connecting power to the AD9222, it is recommended
that two separate 1.8 V supplies be used: one for analog (AVDD)
and one for digital (DRVDD). If only one supply is available, it
should be routed to the AVDD first and then tapped off and
isolated with a ferrite bead or a filter choke preceded by
decoupling capacitors for the DRVDD. The user can employ
several different decoupling capacitors to cover both high and
low frequencies. These should be located close to the point of
entry at the PC board level and close to the parts with minimal
trace length.
It is required that the exposed paddle on the underside of the
ADC is connected to analog ground (AGND) to achieve the
best electrical and thermal performance of the AD9222. An
exposed continuous copper plane on the PCB should mate to
the AD9222 exposed paddle, Pin 0. The copper plane should
have several vias to achieve the lowest possible resistive thermal
path for heat dissipation to flow through the bottom of the PCB.
These vias should be solder filled or plugged.
To maximize the coverage and adhesion between the ADC and
PCB, partition the continuous copper plane by overlaying a
silkscreen on the PCB into several uniform sections. This provides
several tie points between the two during the reflow process.
Using one continuous plane with no partitions only guarantees
one tie point between the ADC and PCB. See Figure 64 for a
PCB layout example. For detailed information on packaging
and the PCB layout of chip scale packages, see the AN-772
Application Note, A Design and Manufacturing Guide for the
Lead Frame Chip Scale Package (LFCSP), at www.analog.com.
A single PC board ground plane should be sufficient when
using the AD9222. With proper decoupling and smart parti-
tioning of the PC board’s analog, digital, and clock sections,
optimum performance is easily achieved.
SILKSCREEN PARTITION
PIN 1 INDICATOR
Figure 64. Typical PCB Layout
Rev. 0 | Page 35 of 56
AD9222
EVALUATION BOARD
The AD9222 evaluation board provides all of the support cir-
cuitry required to operate the ADC in its various modes and
configurations. The converter can be driven differentially through a
transformer (default) or through the AD8334 driver. The ADC
can also be driven in a single-ended fashion. Separate power pins
are provided to isolate the DUT from the AD8334 drive circuitry.
Each input configuration can be selected by proper connection
of various jumpers (see Figure 67 to Figure 71). Figure 65 shows
the typical bench characterization setup used to evaluate the ac
performance of the AD9222. It is critical that the signal sources
used for the analog input and clock have very low phase noise
(<1 ps rms jitter) to realize the optimum performance of the
converter. Proper filtering of the analog input signal to remove
harmonics and lower the integrated or broadband noise at the
input is also necessary to achieve the specified noise performance.
capability for AVDD_DUT and DRVDD_DUT; however, it is
recommended that separate supplies be used for both analog
and digital. To operate the evaluation board using the VGA
option, a separate 5.0 V analog supply is needed. The 5.0 V
supply, or AVDD_5 V, should have a 1 A current capability. To
operate the evaluation board using the SPI and alternate clock
options, a separate 3.3 V analog supply is needed in addition to
the other supplies. The 3.3 V supply, or AVDD_3.3 V, should
have a 1 A current capability as well.
INPUT SIGNALS
When connecting the clock and analog source, use clean signal
generators with low phase noise, such as Rohde & Schwarz SMHU
or HP8644 signal generators or the equivalent. Use a 1 m, shielded,
RG-58, 50 Ω coaxial cable for making connections to the evalu-
ation board. Enter the desired frequency and amplitude from the
ADC specifications tables. Typically, most Analog Devices
evaluation boards can accept ~2.8 V p-p or 13 dBm sine wave
input for the clock. When connecting the analog input source, it
is recommended to use a multipole, narrow-band, band-pass
filter with 50 Ω terminations. Analog Devices uses TTE, Allen
Avionics, and K&L types of band-pass filters. The filter should
be connected directly to the evaluation board if possible.
See Figure 67 to Figure 77 for the complete schematics and
layout diagrams that demonstrate the routing and grounding
techniques that should be applied at the system level.
POWER SUPPLIES
This evaluation board comes with a wall-mountable switching
power supply that provides a 6 V, 2 A maximum output. Simply
connect the supply to the rated 100 V ac to 240 V ac wall outlet
at 47 Hz to 63 Hz. The other end is a 2.1 mm inner diameter
jack that connects to the PCB at P701. Once on the PC board,
the 6 V supply is fused and conditioned before connecting to
three low dropout linear regulators that supply the proper bias
to each of the various sections on the board.
OUTPUT SIGNALS
The default setup uses the HSC-ADC-FPGA high speed
deserialization board to deserialize the digital output data and
convert it to parallel CMOS. These two channels interface
directly with the Analog Devices standard dual-channel FIFO
data capture board (HSC-ADC-EVALA-DC). Two of the eight
channels can then be evaluated at the same time. For more
information on channel settings on these boards and their
optional settings, visit www.analog.com/FIFO.
When operating the evaluation board in a nondefault condition,
L701 to L704 can be removed to disconnect the switching
power supply. This enables the user to bias each section of the
board individually. Use P702 to connect a different supply for
each section. At least one 1.8 V supply is needed with a 1 A current
WALL OUTLET
100V TO 240V AC
47Hz TO 63Hz
6V DC
2A MAX
5.0V
1.8V
1.8V
3.3V
3.3V
1.5V
3.3V
–
+
–
+
–
+
–
+
–
+
–
+
–
+
SWITCHING
POWER
SUPPLY
PC
RUNNING
ADC
ANALYZER
AND SPI
USER
ROHDE & SCHWARZ,
HSC-ADC-FPGA
HIGH SPEED
DESERIALIZATION
HSC-ADC-EVALA-DC
FIFO DATA
SMHU,
2V p-p SIGNAL
SYNTHESIZER
BAND-PASS
FILTER
XFMR
INPUT
CAPTURE
BOARD
AD9222
EVALUATION BOARD
BOARD
CHA TO CHH
12-BIT
SOFTWARE
2-CH
USB
CONNECTION
ROHDE & SCHWARZ,
SMHU,
12-BIT
PARALLEL
CMOS
CLK
SERIAL
LVDS
2V p-p SIGNAL
SYNTHESIZER
SPI
SPI
SPI
SPI
Figure 65. Evaluation Board Connection
Rev. 0 | Page 36 of 56
AD9222
50 Ω terminated and ac-coupled to handle single-ended
DEFAULT OPERATION AND JUMPER SELECTION
SETTINGS
sine wave types of inputs. The transformer converts the
single-ended input to a differential signal that is clipped
before entering the ADC clock inputs.
The following is a list of the default and optional settings or
modes allowed on the AD9222 Rev. A evaluation board.
A differential LVPECL clock can also be used to clock the
ADC input using the AD9515 (U401). Simply populate
R406 and R407 with 0 Ω resistors and remove R215 and
R216 to disconnect the default clock path inputs. In addition,
populate C205 and C206 with a 0.1 μF capacitor and remove
C409 and C410 to disconnect the default cloth path outputs.
The AD9515 has many pin-strappable options that are set
to a default working condition. Consult the AD9515 data
sheet for more information about these and other options.
•
POWER: Connect the switching power supply that is
supplied in the evaluation kit between a rated 100 V ac
to 240 V ac wall outlet at 47 Hz to 63 Hz and P701.
•
AIN: The evaluation board is set up for a transformer-
coupled analog input with optimum 50 Ω impedance
matching out to 150 MHz (see Figure 66). For more
bandwidth response, the differential capacitor across the
analog inputs can be changed or removed. The common
mode of the analog inputs is developed from the center
tap of the transformer or AVDD_DUT/2.
If using an oscillator, two oscillator footprint options are
also available (OSC401) to check the ADC performance.
J401 gives the user flexibility in using the enable pin, which
is common on most oscillators.
0
–2
–3dB CUTOFF = 150MHz
–4
–6
•
•
PDWN: To enable the power-down feature, simply short
J301 to the on position (AVDD) on the PDWN pin.
SCLK/DTP: To enable a digital test pattern on the digital
outputs of the ADC, use J304. If J304 is tied to AVDD during
device power-up, Test Pattern 1000 0000 0000 will be enabled.
See the SCLK/DTP Pin section for details.
–8
–10
–12
–14
–16
–18
•
SDIO/ODM: To enable the low power, reduced signal option
similar to the IEEE 1595.3 reduced range link LVDS output
standard, use J303. If J303 is tied to AVDD during device
power-up, it enables the LVDS outputs in a low power,
reduced signal option from the default ANSI standard.
This option changes the signal swing from 350 mV p-p to
200 mV p-p, which reduces the power of the DRVDD supply.
See the SDIO/ODM Pin section for more details.
0
50
100 150 200 250 300 350 400 450 500
FREQUENCY (MHz)
Figure 66. Evaluation Board Full Power Bandwidth, AD9222-50
•
VREF: VREF is set to 1.0 V by tying the SENSE pin to
ground, R317. This causes the ADC to operate in 2.0 V p-p
full-scale range. A separate external reference option using
the ADR510 or ADR520 is also included on the evaluation
board. Simply populate R312 and R313 and remove C307.
Proper use of the VREF options is noted in the Voltage
Reference section.
•
•
CSB: To enable the SPI information on the SDIO and
SCLK pins that is to be processed, simply tie J302 low in
the always enable mode. To ignore the SDIO and SCLK
information, tie J302 to AVDD.
Non-SPI Mode: For users who wish to operate the DUT
without using SPI, simply remove Jumpers J302, J303, and
J304. This disconnects the CSB, SCLK/DTP, and SDIO/OMD
pins from the control bus, allowing the DUT to operate in
its simplest mode. Each of these pins has internal termination
and will float to its respective level.
•
•
RBIAS: RBIAS has a default setting of 10 kΩ (R301) to
ground and is used to set the ADC core bias current. To
further lower the core power (excluding the LVDS driver
supply) simply change the resistor setting. However,
performance of the ADC will degrade depending on the
resistor chosen. See RBIAS section for more information.
•
D+, D−: If an alternative data capture method to the setup
described in Figure 67 is used, optional receiver terminations,
R318, R320 to R328, can be installed next to the high speed
backplane connector.
CLOCK: The default clock input circuitry is derived from a
simple transformer-coupled circuit using a high bandwidth
1:1 impedance ratio transformer (T401) that adds a very
low amount of jitter to the clock path. The clock input is
Rev. 0 | Page 3ꢁ of 56
AD9222
•
•
Populate R101, R114, R127, R140, R201, R217, R233 and
R251 with 0 Ω resistors in the analog input path.
ALTERNATIVE ANALOG INPUT DRIVE
CONFIGURATION
The following is a brief description of the alternative analog
input drive configuration using the AD8334 dual VGA. If this
particular drive option is in use, some components may need to
be populated, in which case all the necessary components are
listed in Table 16. For more details on the AD8334 dual VGA,
including how it works and its optional pin settings, consult the
AD8334 data sheet.
Populate R106, R107, R119, R120, R132, R133, R144, R145,
R206, R207, R223, R224, R239, R240, R257 and R258 with
10 kΩ resistors to provide an input common-mode level to
the analog input.
•
Populate R105, R113, R118, R124, R131, R137, R151, and
R160, R205, R213, R221, R222, R255, R256 with 0 Ω resistors
in the analog input path.
To configure the analog input to drive the VGA instead of the
default transformer option, the following components need to
be removed and/or changed.
Currently, L505 to L520 and L605 to L620 are populated with 0 Ω
resistors to allow signal connection. This area allows the user to
design a filter if additional requirements are necessary.
•
Remove R102, R115, R128, R141, R202, R218, R234, R252,
T101, T102, T103, T104, T201, T202, T203, and T204 in
the default analog input path.
Rev. 0 | Page 3± of 56
AD9222
7 2 0 7 - 0 5 9 6
Figure 67. Evaluation Board Schematic, DUT Analog Inputs
Rev. 0 | Page 39 of 56
AD9222
7 3 0 7 - 0 5 9 6
Figure 68. Evaluation Board Schematic, DUT Analog Inputs (Continued)
Rev. 0 | Page ꢀ0 of 56
AD9222
7 4 0 7 - 9 6 0 5
2
2
2
2
R307
10kΩ
R306
100kΩ
AVDD_DUT
R302
DNP
R305
100kΩ
CW
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
0
VIN+C
VIN−C
AVDD
VIN−D
VIN+D
RBIAS
SENSE
VREF
REFB
REFT
AVDD
VIN+E
VIN−E
AVDD
VIN−F
VIN+F
SLUG
VIN_C
VIN_C
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
CHB
D+B
D−B
CHB
CHC
AVDD_DUT
VIN_D
D+C
D−C
CHC
CHD
GND
R301
10kΩ
VIN_D
D+D
D−D
CHD
FCO
VSENSE_DUT
VREF_DUT
FCO+
FCO−
DCO+
DCO−
D+E
FCO
DCO
DCO
AVDD_DUT
VIN_E
CHE
CHE
D−E
VIN_E
D+F
CHF
AVDD_DUT
D−F
CHF
CHG
VIN_F
VIN_F
D+G
D−G
CHG
Figure 69. Evaluation Board Schematic, DUT, VREF, and Digital Output Interface
Rev. 0 | Page ꢀ1 of 56
AD9222
5
0 - 7 6 7 0 5 9
25
16
15
14
13
12
11
10
9
S0
S1
S2
S3
1
2
33
31
1
S4
3
S5
GND
VS
S6
S7
S8
8
S9
32
7
RSET
S10
VREF
6
Figure 70. Evaluation Board Schematic, Clock Circuitry
Rev. 0 | Page ꢀ2 of 56
AD9222
7 6 0 - 6 7 5 9
R524
10kΩ
R523
10kΩ
R513
187Ω
C512
10µF
C511
0.1µF
C533
10µF
C534
0.1µF
C535
10µF
C536
0.1µF
C510
10µF
C509
0.1µF
R512
10kΩ
R511
10kΩ
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCM2
VCM1
EN34
NC
VCM3
VCM4
HILO
R504
10kΩ
R505
10kΩ
AVDD_5V
EN12
CLMP12
GAIN12
VPS1
VIN1
CLMP34
GAIN34
VPS4
VG34
VG12
AVDD_5V
AVDD_5V
VIN4
VIP1
VIP4
LOP1
LON1
COM1X
LMD1
INH1
LOP4
LON4
COM4X
LMD4
INH4
R509
274Ω
C505
0.1µF
COM1
COM2
COM4
COM3
C527
0.018µF
C526
22pF
L504
120nH
0.1µF
C525
R503
274Ω
R508
274Ω
R507
274Ω
C502
0.018µF
C521
0.018µF
C515
0.018µF
C503
22pF
L501
120nH
C520
22pF
C514
22pF
0.1µF
C501
L503
120nH
L502
120nH
0.1µF
C519
0.1µF
C513
AVDD_5V
AVDD_5V
CW
CW
GND
GND
VG34
VG12
Variable Gain Circuit
(0−1.0V DC)
Variable Gain Circuit
(0−1.0V DC)
VG34
VG12
External
Variable Gain Drive
External
Variable Gain Drive
Figure 71. Evaluation Board Schematic, Optional DUT Analog Input Drive
Rev. 0 | Page ꢀ3 of 56
AD9222
7 7 0 7 - 9 6 0 5
R613
187Ω
C612
10µF
C611
0.1µF
C633
10µF
C634
0.1µF
C635
10µF
C636
0.1µF
C610
10µF
C609
0.1µF
VCM2
NC
VCM3
VCM4
HILO
49
50
51
52
53
54
55
56
57
58
59
60
61
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCM1
EN34
EN12
10kΩ
R604
R612
10kΩ
R611
10kΩ
R605
10kΩ
AVDD_5V
CLMP12
GAIN12
VPS1
CLMP34
GAIN34
VPS4
VG56
VG78
AVDD_5V
AVDD_5V
VIN1
VIN4
VIP1
VIP4
LOP1
LOP4
LON1
COM1X
LMD1
INH1
LON4
COM4X
LMD4
INH4
R609
274Ω
C605
0.1µF
62
63
COM1
COM2
COM4
COM3
64
C627
0.018µF
C626
22pF
L604
120nH
0.1µF
C625
R603
274Ω
R608
274Ω
R607
274Ω
C602
0.018µF
C621
0.018µF
C615
0.018µF
C603
22pF
L601
120nH
C620
22pF
C614
22pF
0.1µF
C601
L603
120nH
L602
120nH
0.1µF
C619
0.1µF
C613
AVDD_5V
AVDD_5V
CW
CW
GND
GND
VG78
VG56
Variable Gain Circuit
(0−1.0V DC)
Variable Gain Circuit
(0−1.0V DC)
VG78
VG56
External
Variable Gain Drive
External
Variable Gain Drive
Figure 72. Evaluation Board Schematic, Optional DUT Analog Input Drive (Continued)
Rev. 0 | Page ꢀꢀ of 56
AD9222
7 8 0 - 6 7 5 9
CR702
GREEN
C702
0.1µF
C703
0.1µF
GND
GND
1
1
R709
0Ω
0Ω
SDO_CHA
SDI_CHA
R708
R707
R706
0Ω
0Ω
SCLK_CHA
CSB1_CHA
PICVCC
1
3
5
7
9
2
4
PICVCC
GP1
GP1
GP0
6
GP0
MCLR/GP3
8
MCLR/GP3
10
GND
GND
CR701
2
OPTIONAL GREEN
Figure 73. Evaluation Board Schematic, Power Supply Inputs and SPI Interface Circuitry
Rev. 0 | Page ꢀ5 of 56
AD9222
Figure 74. Evaluation Board Layout, Primary Side
Rev. 0 | Page ꢀ6 of 56
AD9222
Figure 75. Evaluation Board Layout, Ground Plane
Rev. 0 | Page ꢀꢁ of 56
AD9222
Figure 76. Evaluation Board Layout, Power Plane
Rev. 0 | Page ꢀ± of 56
AD9222
Figure 77. Evaluation Board Layout, Secondary Side (Mirrored Image)
Rev. 0 | Page ꢀ9 of 56
AD9222
Table 16. Evaluation Board Bill of Materials (BOM)1
Qnty.
per
Item Board REFDES
Device
Pkg.
PCB
ꢀ02
Value
Mfg.
Mfg. Part Number
1
2
1
11±
AD9222-50EBZ
PCB
PCB
C101, C102, C10ꢁ, Capacitor
C10±, C109, C11ꢀ,
C115, C116, C121,
C122, C123, C12±,
C201, C202, C20ꢁ,
C20±, C209, C21ꢀ,
C215, C216, C221,
C222, C223, C22±,
C301, C302, C30ꢀ,
C305, C306, Cꢀ01,
Cꢀ02, Cꢀ03, Cꢀ09,
Cꢀ10, Cꢀ11, Cꢀ12,
Cꢀ13, Cꢀ1ꢀ, Cꢀ15,
Cꢀ16, Cꢀ1ꢁ, Cꢀ1±,
C501, C50ꢀ, C505,
C506, C50±, C509,
C511, C513, C51±,
C519, C522, C523,
C52ꢀ, C525, C52±,
C529, C530, C532,
C53ꢀ, C536, C53ꢁ,
C53±, C601, C60ꢀ,
C605, C606, C60±,
C609, C611, C613,
C616, C61ꢁ, C61±,
C619, C622, C623,
C62ꢀ, C625, C62±,
C629, C630, C632,
C63ꢀ, C636, Cꢁ01,
Cꢁ02, Cꢁ03, Cꢁ06,
Cꢁ0±, Cꢁ10, Cꢁ12,
Cꢁ23, Cꢁ2ꢀ, Cꢁ25,
Cꢁ26, Cꢁ2ꢁ, Cꢁ30,
Cꢁ31, Cꢁ32, Cꢁ33,
Cꢁ3ꢀ, Cꢁ35, Cꢁꢀ0,
Cꢁꢀ1, Cꢁꢀ2, Cꢁꢀ3,
Cꢁꢀꢀ, Cꢁꢀ5, Cꢁꢀ6,
Cꢁꢀꢁ, Cꢁꢀ±, Cꢁꢀ9,
Cꢁ50, Cꢁ51, Cꢁ52,
Cꢁ53
0.1 μF, ceramic, X5R,
10 V, 10% tol
Murata
GRM155Rꢁ1C10ꢀKA±±D
3
ꢀ
±
±
C10ꢀ, C111, C11±, Capacitor
C125, C20ꢀ, C211,
C21±, C225
C510, C512, C533, Capacitor
C535, C610, C612,
ꢀ02
±05
2.2 pF, ceramic, COG,
0.25 pF tol, 50 V
Murata
Murata
GRM1555C1H2R20CZ01D
GRM219R60J106KE19D
10 μF, 6.3 V ±10%
ceramic, X5R
C633, C635
5
6
ꢁ
1
ꢀ
±
C303
Capacitor
603
ꢀ02
ꢀ02
ꢀ.ꢁ μF, ceramic, X5R,
6.3 V, 10% tol
1000 pF, ceramic, XꢁR,
25 V, 10% tol
0.01± μF, ceramic, XꢁR,
16 V, 10% tol
Murata
Murata
AVX
GRM1±±R60Jꢀꢁ5KE19D
GRM155Rꢁ1H102KA01D
0ꢀ02YC1±3KAT2A
C50ꢁ, C531, C60ꢁ, Capacitor
C631
C502, C515, C521, Capacitor
C52ꢁ, C602, C615,
C621, C62ꢁ
Rev. 0 | Page 50 of 56
AD9222
Qnty.
per
Item Board REFDES
Device
Pkg.
Value
Mfg.
Mfg. Part Number
±
±
C503, C51ꢀ, C520, Capacitor
C526, C603, C61ꢀ,
ꢀ02
22 pF, ceramic, NPO,
5% tol, 50 V
Murata
GRM1555C1H220JZ01D
C620, C626
9
1
9
Cꢁ0ꢀ
Capacitor
1206
603
10 μF, tantalum,
16 V, 20% tol
1 μF, ceramic, X5R,
6.3 V, 10% tol
Rohm
TCA1C106M±R
10
C30ꢁ, Cꢁ1ꢀ, Cꢁ15, Capacitor
Cꢁ16, Cꢁ1ꢁ, Cꢁ19,
Murata
GRM1±±R61C105KA93D
Cꢁ20, Cꢁ21, Cꢁ22
11
16
C5ꢀ0, C5ꢀ1, C5ꢀꢀ, Capacitor
C5ꢀ5, C5ꢀ±, C5ꢀ9,
C552, C553, C6ꢀ0,
C6ꢀ1, C6ꢀꢀ, C6ꢀ5,
C6ꢀ±, C6ꢀ9, C652,
C653
±05
0.1 μF, ceramic, XꢁR,
50 V, 10% tol
Murata
Murata
GRM21BRꢁ1H10ꢀKA01L
12
13
ꢀ
1
Cꢁ05, Cꢁ0ꢁ, Cꢁ09, Capacitor
Cꢁ11
603
10 μF, ceramic, X5R,
6.3 V, 20% tol
30 V, 20 mA, dual
Schottky
GRM1±±R60J106MEꢀꢁD
HSMS-2±12-TR1G
CRꢀ01
Diode
SOT-23
603
Agilent
Technologies
Panasonic
Micro
1ꢀ
15
2
1
CRꢁ01, CRꢁ02
Dꢁ02
LED
Diode
Green, ꢀV, 5 m candela
LNJ31ꢀG±TRA
SK33-TP
DO-21ꢀAB 3 A, 30 V, SMC
Commercial Co.
16
1ꢁ
1±
19
1
Dꢁ01
Diode
DO-21ꢀAA 5 A, 50 V, SMC
Micro
Commercial Co.
Tyco/Raychem
Murata
S2A-TP
1
Fꢁ01
Fuse
1210
2020
603
6.0 V, 2.2 A trip-current
resettable fuse
NANOSMDC110F-2
DLW5BSN191SQ2L
BLM1±BA100SN1D
1
FERꢁ01
Choke coil
Ferrite bead
10 μH, 5 A, 50 V, 190 Ω
@ 100 MHz
10 Ω, test frequency
100 MHz, 25% tol,
500 mA
2ꢀ
FB101, FB102,
FB103, FB10ꢀ,
FB105, FB106,
FB10ꢁ, FB10±,
FB109, FB110,
FB111, FB112,
FB201, FB202,
FB203, FB20ꢀ,
FB205, FB206,
FB20ꢁ, FB20±,
FB209, FB210,
FB211, FB212
Murata
20
21
23
ꢀ
6
1
JP501, JP502,
JP601, JP602
J301, J302, J303,
J30ꢀ, Jꢀ01, Jꢁ01
Connector
Connector
Connector
2-pin
3-pin
10-pin
100 mil header jumper,
2-pin
100 mil header jumper,
3-pin
100 mil header, male,
2 × 5 double row
straight
Samtec
Samtec
Samtec
TSW-102-0ꢁ-G-S
TSW-103-0ꢁ-G-S
TSW-105-0±-G-D
Jꢁ02
2ꢀ
25
±
±
Lꢁ01, Lꢁ02, Lꢁ03,
Lꢁ0ꢀ, Lꢁ05, Lꢁ06,
Lꢁ0ꢁ, Lꢁ0±
L501, L502, L503,
L50ꢀ, L601, L602,
L603, L60ꢀ
Ferrite bead
Inductor
1210
ꢀ02
10 μH, bead core 3.2 ×
2.5 × 1.6 SMD, 2 A
Murata
Murata
BLM31PG500SN1L
LQG15HNR12J02D
120 nH, test freq
100 MHz, 5% tol,
150 mA
Rev. 0 | Page 51 of 56
AD9222
Qnty.
per
Item Board REFDES
Device
Pkg.
Value
Mfg.
Mfg. Part Number
26
20
L505, L506, L50ꢁ,
L50±, L509, L510,
L511, L512, L513,
L51ꢀ, L515, L516,
L51ꢁ, L51±, L519,
L520, L605, L606,
L60ꢁ, L60±, L609,
L610, L611, L612,
L613, L61ꢀ, L615,
L616, L61ꢁ, L61±,
L619, L620
Resistor
±05
0 Ω, 1/± W, 5% tol
NIC
Components
Corp.
NRC0ꢀZ0TRF
2ꢁ
2±
29
1
9
1
OSCꢀ01
Oscillator
Connector
Connector
SMT
Clock oscillator,
50.00 MHz, 3.3 V,
±5% duty cycle
Side-mount SMA for
0.063" board thickness
Valphey Fisher
VFAC3H-L-50MHz
1ꢀ2-0ꢁ01-±51
6ꢀ69169-1
P101, P103, P105,
P10ꢁ, P201, P203,
P205, P20ꢁ, Pꢀ01
SMA
Johnson
Components
P301
HEADER
1ꢀ69169-1, right angle
2-pair, 25 mm, header
assembly
Tyco
30
31
1
Pꢁ01
Connector
Resistor
0.1", PCMT RAPCꢁ22, power
supply connector
Switchcraft
RAPCꢁ22X
21
R301, R30ꢁ, Rꢀ01,
Rꢀ02, Rꢀ10, Rꢀ13,
R50ꢀ, R505, R511,
R512, R523, R52ꢀ,
R60ꢀ, R605, R611,
R612, R623, R62ꢀ,
Rꢁ11, Rꢁ1ꢀ, Rꢁ15
ꢀ02
10 kΩ, 1/16 W,
5% tol
NIC
Components
Corp.
NRC0ꢀJ103TRF
32
1±
R103, R11ꢁ, R129,
R1ꢀ2, R203, R219,
R235, R253, R31ꢁ,
Rꢀ05, Rꢀ15, Rꢀ16,
Rꢀ1ꢁ, Rꢀ1±, Rꢁ06,
Rꢁ0ꢁ, Rꢁ0±, Rꢁ09
Resistor
ꢀ02
0 Ω, 1/16 W,
5% tol
NIC
Components
Corp.
NRC0ꢀZ0TRF
33
3ꢀ
35
±
R102, R115, R12±,
R1ꢀ1, R202, R21±,
R23ꢀ, R252
R10ꢀ, R116, R130,
R1ꢀ3, R20ꢀ, R220,
R236, R25ꢀ
R109, R111, R112,
R123, R125, R126,
R135, R13±, R139,
R1ꢀ±, R1ꢀ9, R150,
R211, R212, R21ꢀ,
R22±, R231, R232,
R2ꢀ6, R2ꢀ9, R250,
R262, R265, R266,
R319, Rꢁ10, Rꢁ12,
Rꢁ13
Resistor
Resistor
Resistor
ꢀ02
603
ꢀ02
6ꢀ.9 Ω, 1/16 W,
1% tol
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NRC0ꢀF6ꢀR9TRF
NRC06Z0TRF
±
0 Ω, 1/10 W,
5% tol
2±
1 kΩ, 1/16 W,
1% tol
NRC0ꢀF1001TRF
36
16
R10±, R110, R121,
R122, R13ꢀ, R136,
R1ꢀ6, R1ꢀꢁ, R209,
R210, R226, R22ꢁ,
R2ꢀ2, R2ꢀ5, R260,
R261
Resistor
ꢀ02
33 Ω, 1/16 W,
5% tol
NIC
Components
Corp.
NRC0ꢀJ330TRF
Rev. 0 | Page 52 of 56
AD9222
Qnty.
per
Item Board REFDES
Device
Pkg.
Value
Mfg.
Mfg. Part Number
3ꢁ
3±
39
±
3
1
R161, R162, R163,
R16ꢀ, R20±, R225,
R2ꢀ1, R259
Resistor
ꢀ02
ꢀ99 Ω, 1/16 W,
1% tol
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NRC0ꢀFꢀ990TRF
NRC0ꢀF1003TRF
NRC0ꢀFꢀ121TRF
R303, R305, R306
Resistor
Resistor
ꢀ02
ꢀ02
100 kΩ, 1/16 W,
1% tol
Rꢀ1ꢀ
ꢀ.12 kΩ, 1/16W,
1% tol
ꢀ0
ꢀ1
1
1
Rꢀ0ꢀ
R309
Resistor
Resistor
ꢀ02
ꢀ02
ꢀ9.9 Ω, 1/16 W,
0.5% tol
ꢀ.99 kΩ, 1/16 W,
5% tol
Susumu
RR0510R-ꢀ9R9-D
NRC0ꢀFꢀ991TRF
NIC
Components
Corp.
ꢀ2
ꢀ3
ꢀꢀ
ꢀ5
2
R310, R501, R535,
R601, R63ꢀ
Potentiometer
Resistor
3-lead
ꢀ02
10 kΩ, Cermet trimmer
potentiometer, 1± turn
top adjust, 10%, 1/2 W
ꢀꢁ0 kΩ, 1/16 W,
5% tol
COPAL
ELECTRONICS
CT9ꢀEW103
1
R30±
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NRC0ꢀJꢀꢁꢀTRF
NRC0ꢀJ393TRF
NRC0ꢀF1±ꢁ0TRF
ꢀ
R502, R536, R602,
R635
Resistor
ꢀ02
39 kΩ, 1/16 W,
5% tol
16
R513, R51ꢀ, R51±,
R519, R525, R526,
R530, R531, R613,
R61ꢀ, R61±, R619,
R625, R626, R630,
R631
Resistor
ꢀ02
1±ꢁ Ω, 1/16 W,
1% tol
ꢀ6
ꢀꢁ
ꢀ±
±
R515, R520, R52ꢁ,
R532, R615, R620,
R62ꢁ, R632
R503, R50ꢁ, R50±,
R509, R603, R60ꢁ,
R60±, R609
Rꢀ25,Rꢀ2ꢁ, Rꢀ29,
Rꢀ31, Rꢀ33, Rꢀ35,
Rꢀ36, Rꢀ39, Rꢀꢀ1,
Rꢀꢀ3, Rꢀꢀ5
Resistor
Resistor
Resistor
ꢀ02
ꢀ02
201
3ꢁꢀ Ω, 1/16 W,
1% tol
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NRC0ꢀF3ꢁꢀ0TRF
NRC0ꢀF2ꢁꢀ0TRF
NRC02Z0TRF
±
2ꢁꢀ Ω, 1/16 W,
1% tol
11
0 Ω, 1/20 W,
5% tol
ꢀ9
50
51
52
53
5ꢀ
ꢀ
1
1
2
2
1
Rꢁ01
Resistor
Resistor
Resistor
Resistor
Resistor
Switch
ꢀ02
ꢀ02
603
ꢀ02
ꢀ02
SMD
ꢀ.ꢁ kΩ, 1/16 W,
1% tol
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NRC0ꢀJꢀꢁ2TRF
NRC0ꢀF2610TRF
NRC06F261OTRF
NRC0ꢀJ2ꢀ1TRF
NRC0ꢀF1000TRF
EVQ-PLDA15
Rꢁ02
261 Ω, 1/16 W,
1% tol
Rꢁ16
261 Ω, 1/16 W,
1% tol
Rꢀ20, Rꢀ21
Rꢀ22, Rꢀ23
Sꢁ01
2ꢀ0 Ω, 1/16 W,
5% tol
100 Ω, 1/16 W,
1% tol
LIGHT TOUCH,
100GE, 5 mm
Panasonic
Rev. 0 | Page 53 of 56
AD9222
Qnty.
per
Item Board REFDES
Device
Pkg.
Value
Mfg.
Mfg. Part Number
55
56
5ꢁ
9
2
2
T101, T102, T103,
T10ꢀ, T201, T202,
T203, T20ꢀ, Tꢀ01
Transformer
CD5ꢀ2
ADT1-1WT+,
1:1 impedance ratio
transformer
ADP33339AKC-1.±-RL,
1.5 A, 1.± V LDO
regulator
AD±33ꢀACPZ-REEL,
ultralow noise
Mini-Circuits
ADT1-1WT+
Uꢁ0ꢀ, Uꢁ0ꢁ
IC
IC
SOT-223
CP-6ꢀ-3
Analog Devices
Analog Devices
ADP3339AKCZ-1.±-RL
AD±33ꢀACPZ-REEL
U501, U601
precision dual VGA
5±
59
60
1
1
1
Uꢁ06
Uꢁ05
U301
IC
IC
IC
SOT-223
SOT-223
CP-6ꢀ-3
ADP33339AKC-5-RLꢁ
ADP33339AKC-3.3-RL
AD9222BCPZ-50, octal,
12-bit, 50 MSPS serial
LVDS 1.± V ADC
Analog Devices
Analog Devices
Analog Devices
ADP3339AKCZ-5-RLꢁ
ADP3339AKCZ-3.3-RL
AD9222BCPZ-50
61
1
U302
IC
SOT-23
ADR510ARTZ, 1.0 V,
precision low noise
shunt voltage
Analog Devices
ADR510ARTZ
reference
62
63
6ꢀ
65
1
1
1
1
Uꢀ01
Uꢁ02
Uꢁ03
Uꢁ01
IC
IC
IC
IC
LFCSP
CP-32-2
SCꢁ0,
MAA06A
SCꢁ0,
MAA06A
±-SOIC
AD9515BCPZ, 1.6 GHz
clock distribution IC
NCꢁWZ0ꢁP6X_NL,
UHS dual buffer
NCꢁWZ16P6X_NL,
UHS dual buffer
Flash prog
Analog Devices
Fairchild
AD9515BCPZ
NCꢁWZ0ꢁP6X_NL
NCꢁWZ16P6X_NL
PIC12F629-I/SNG
Fairchild
Microchip
mem 1kx1ꢀ,
RAM size 6ꢀ × ±,
20 MHz speed, PIC12F
controller series
1 This BOM is RoHS compliant.
Rev. 0 | Page 5ꢀ of 56
AD9222
OUTLINE DIMENSIONS
0.30
0.25
0.18
9.00
BSC SQ
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
64
49
1
48
PIN 1
INDICATOR
7.25
7.10 SQ
6.95
8.75
BSC SQ
TOP
VIEW
EXPOSED PAD
(BOTTOM VIEW)
0.45
0.40
0.35
33
16
17
32
0.25 MIN
7.50
REF
0.80 MAX
0.65 TYP
1.00
0.85
0.80
12° MAX
0.05 MAX
0.02 NOM
SEATING
PLANE
0.50 BSC
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
Figure 78. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Octal
(CP-64-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
6ꢀ-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6ꢀ-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Tape and Reel
6ꢀ-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6ꢀ-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Tape and Reel
Evaluation Board
Package Option
CP-6ꢀ-3
CP-6ꢀ-3
CP-6ꢀ-3
CP-6ꢀ-3
AD9222BCPZ-ꢀ01
AD9222BCPZRLꢁ-ꢀ01
AD9222BCPZ-501
AD9222BCPZRLꢁ-501
AD9222-50EBZ
−ꢀ0°C to +±5°C
−ꢀ0°C to +±5°C
−ꢀ0°C to +±5°C
−ꢀ0°C to +±5°C
1 Z = Pb-free part.
Rev. 0 | Page 55 of 56
AD9222
NOTES
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05967-0-9/06(0)
Rev. 0 | Page 56 of 56
相关型号:
AD9222BCPZ-65
IC 8-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, QCC64, 9 X 9 MM, ROHS COMPLIANT, MO-220VMMD-4, LFCSP-64, Analog to Digital Converter
ADI
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