AD96687TE [ADI]
IC DUAL COMPARATOR, 3000 uV OFFSET-MAX, CQCC20, CERAMIC, LCC-20, Comparator;型号: | AD96687TE |
厂家: | ADI |
描述: | IC DUAL COMPARATOR, 3000 uV OFFSET-MAX, CQCC20, CERAMIC, LCC-20, Comparator 放大器 |
文件: | 总11页 (文件大小:61K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
REVISIONS
LTR
A
DESCRIPTION
DATE (YR-MO-DA)
87-05-11
APPROVED
M. A.FRYE
Change to military drawing format. Page 2, add device type 02. Page 6, table
I, add device type 02 characteristic. Page 8, 6.4 add vendor. Editorial
changes throughout.
B
Add device types 03 and 04. Add case outline 2. Add vendors CAGE 34031
and 64155. For 1.3 change footnotes 1/ and 2/ and delete footnotes 3/ and 4/.
Change vendor similar part number for CAGE 07263 and change vendor
CAGE 07263 to 27014. Add footnotes 7/, 8/, and 9/ to table I and change
footnote 1/. Delete latch setup test and subgroup 12. Change drawing CAGE
to 67268. Editorial changes throughout. Add latch enable voltage to the
recommended operating conditions. Add latch enable propagation delay to
table I to be tested. Delete vendor CAGE 27014.
89-05-09
M. A. FRYE
C
D
Changes in accordance with NOR 5962-R054-93.
Drawing updated to reflect current requirements. -rrp
93-04-07
07-12-03
M. A. FRYE
R. HEBER
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
CURRENT CAGE CODE 67268
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
SHEET
PREPARED BY
JOSEPH A. KERBY
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
CHECKED BY
STANDARD
MICROCIRCUIT
DRAWING
RAY MONNIN
APPROVED BY
MICHAEL A. FRYE
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
MICROCIRCUIT, LINEAR, HIGH-SPEED VOLTAGE
COMPARATOR, MONOLITHIC SILICON
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
85-11-14
AMSC N/A
REVISION LEVEL
D
SIZE
A
CAGE CODE
86008
14933
SHEET
1
OF
9
DSCC FORM 2233
APR 97
5962-E560-06
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
86008
01
E
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
Circuit function
tPD±(at TA = +25°C)
Min
4.5
0.5
2.0
1.5
Max
01
02
03
04
685
685
6685
96685
Open-emitter output
Open-emitter output
Open-emitter output
Open-emitter output
6.5 ns
6.5 ns
4.0 ns
3.5 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
E
I
2
GDIP1-T16 or CDIP2-T16
MACY1-X10
CQCC1-N20
16
10
20
Dual-in-line
Can
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Positive supply voltage (V+):
Device types 01, 02, 03 ............................................................. +7 V dc
Device type 04 ........................................................................... +6.5 V dc
Negative supply voltage (V-):
Device types 01, 02, 03 ............................................................. -7 V dc
Device type 04 ........................................................................... -6.5 V dc
Input voltage range (VI):
Device types 01, 02, 03 ............................................................. ±4 V dc
Device type 04 ........................................................................... ±5 V dc
Differential input voltage (VID):
Device types 01, 02, 03 ............................................................. ±6 V dc
Device type 04 ........................................................................... ±5.5 V dc
Storage temperature range .......................................................... -65°C to +150°C
Maximum power dissipation (PD):
Device types 01, 02 ................................................................... 500 mW
Device types 03, 04 ................................................................... 300 mW
Lead temperature (soldering, 10 seconds) .................................... +300°C
Thermal resistance, junction-to-case (θJC) .................................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (θJA):
Case E ....................................................................................... 120°C/W
Case I ........................................................................................ 140°C/W
Case 2 ....................................................................................... 92.3°C/W
Output current ............................................................................... 30 mA
SIZE
STANDARD
MICROCIRCUIT DRAWING
86008
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
D
SHEET
2
DSCC FORM 2234
APR 97
1.4 Recommended operating conditions.
Positive supply voltage (V+):
Device types 01, 02, 03 ............................................................. +6.0 V dc
Device type 04 ........................................................................... +5.0 V dc 1/
Negative supply voltage (V-):
Device types 01, 02, 03 ............................................................. -5.2 V dc
Device type 04 ........................................................................... -5.2 V dc 1/
Minimum operating voltage (V+ to V-) ........................................... 9.7 V dc
Latch enable voltage:
VIH .............................................................................................. -0.85 V
VIL .............................................................................................. -1.65 V
Ambient operating temperature range (TA) .................................... -55°C to +125°C 2/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
1/ VIN ≤ positive supply and negative supply voltage.
2/ Devices require a thermal equilibrium to be established with a transverse airflow of ≥500 LFPM.
SIZE
STANDARD
86008
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
D
SHEET
3
DSCC FORM 2234
APR 97
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
SIZE
STANDARD
86008
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
D
SHEET
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions 1/ 2/ 3/ 4/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
Min
Max
±2.0
Input offset voltage
VIO
1
All
mV
RS = 100 Ω, VCM = 0 V dc
RS = 100 Ω, VCM = 0 V
2, 3
±3.0
±10
Input offset voltage
temperature coefficient
5/
1, 2, 3
01,02
ΔVIO/ΔT
μV/°C
03
04
±15.0
±20
Input offset current
Input bias current
Input voltage range
IIO
1
01,02
03
V
CM = 3.3 V, TA = +25°C
CM = +0.5 V, TA = +25°C
±1.0
±1.5
±1.0
±1.6
μA
04
V
-VCM = -3.3 V,
2, 3
01,02
TA = +125°C, -55°C
03
04
±3.0
±1.6
-VCM = -0.5 V,
TA = +125°C, -55°C
IIB
1
01,02
03
10
15
10
16
VCM = 3.3 V, TA = +25°C
μA
04
VCM = +0.5 V, TA = +25°C
-VCM = -3.3 V,
2, 3
01,02
TA = +125°C, -55°C
03
04
30
16
-VCM = -0.5 V,
TA = +125°C, -55°C
VCM
1, 2, 3
4, 5, 6
01,02,
03
-3.3
3.3
V
04
01,02,
03
-2.5
80
+5.0
Input voltage common
mode rejection ratio
CMRR
dB
RS = 100 Ω,
-3.3 V ≤ VCM ≤ +3.3 V
-2.5 V ≤ VCM ≤ +5.0 V
RS = 100 Ω, ΔVS = ±5%
04
All
80
60
Power supply rejection
ratio
PSRR
VOH
4, 5, 6
1
dB
V
High level output voltage
01,02,
03
-0.960
-0.810
TA = +25°C
2
3
-0.850
-1.10
-1.10
-0.620
-0.920
TA = +125°C
TA = -55°C
1, 2, 3
04
See footnotes at end of table.
SIZE
STANDARD
86008
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
D
SHEET
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – Continued.
Conditions 1/ 2/ 3/ 4/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
Min
Max
-1.65
Low level output voltage
VOL
1
01,02,
03
-1.85
V
TA = +25°C
2
-1.81
-1.91
-1.57
-1.69
-1.50
22
TA = +125°C
TA = -55°C
3
1, 2, 3
1, 2, 3
04
01, 02,
03
Positive supply current
I+
mA
04
9
Negative supply current
Propagation delay time
I-
1, 2, 3
9, 11
01, 02,
03,04
01
-26
-18
6.5
mA
ns
3.5
TA = -55°C, +25°C 6/ 7/
tPD
±
10
9, 11
10
5.5
0.5
0.5
2.0
1.5
1.5
1.5
12
TA = +125°C 6/ 7/
TA = +25°C, -55°C 6/ 7/
TA = +125°C 6/ 7/
TA = +25°C, -55°C 7/ 8/
TA = +125°C 7/ 8/
TA = +25°C, -55°C 9/
TA = +125°C 9/
02
03
6.5
12
9, 11
10
4.0
6.0
3.5
6.0
8
9, 11
10
04
Propagation delay time
latch enable to output 5/
9, 11
10
01,03
02
ns
TA = +25°C, -55°C
TA = +125°C
tPD
(E)
±
12.5
8
9, 11
10
TA = +25°C, -55°C
TA = +125°C
12.5
3.5
7
9
04
TA = +25°C
10, 11
TA = +125°C, -55°C
1/ For device types 01, 02, and 03 unless otherwise specified: V+ = +6.0 V dc, V- = -5.2 V dc, VT = -2.0 V dc, and RL = 50 Ω.
2/ Devices require a thermal equilibrium to be established with a transverse airflow of >500 LFPM.
3/ Production pulse test devices at correlated temperatures of -35°C and +145°C to compensate for high power steady-state
operation.
4/ For device type 04 unless otherwise specified: V+ = +5.0 V dc, V- = -5.2 V dc, VT = -2.0 V dc, and RL = 50 Ω.
5/ Guaranteed if not tested to the limits specified.
6/ 100 mV step input with 5 mV overdrive.
7/ a. This parameter tested with VCM = 0 V and supplies V+ = 6.0 V, V- = -5.2 V.
b. tPD+ on either output Q or Q is performed.
c. tPD- on either output Q or Q is performed.
8/ 100 mV step input with 10 mV overdrive V+ = +5.0 V, V- = -5.2 V for 03.
9/ This parameter measured with 100 mV pulse (10 mV overdrive), to 50 percent of the transition output point.
SIZE
STANDARD
86008
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
D
SHEET
6
DSCC FORM 2234
APR 97
Device types
Case outlines
01, 02, 03, and 04
04
2
I
E
Terminal number
Terminal symbol
GROUND 1
V+
NONINVERTING INPUT
INVERTING INPUT
1
2
3
4
5
6
7
8
V+
NC
GROUND 1
V+
NONINVERTING INPUT
INVERTING INPUT
NC
NONINVERTING INPUT
INVERTING INPUT
LATCH ENABLE
V-
NC/HYSTERESIS
Q OUTPUT
NC
LATCH ENABLE
NC
V-
NC
LATCH ENABLE
Q OUTPUT
GROUND 2
GROUND 1
----
9
NC/HYSTERESIS
NC
Q OUTPUT
NC
V-
NC
NC
10
11
12
----
Q OUTPUT
13
14
15
----
----
----
NC
NC
NC
NC
Q OUTPUT
Q OUTPUT
16
17
18
19
20
----
----
----
----
----
GROUND 2
NC
NC
NC
NC
----
----
----
----
GROUND 2
NC = No connection
FIGURE 1. Terminal connections.
SIZE
STANDARD
86008
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
D
SHEET
7
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements.
MIL-STD-883 test requirements
Subgroups
(in accordance with
MIL-STD-883, method 5005,
table I)
Interim electrical parameters
(method 5004)
----
Final electrical test parameters
(method 5004)
1*, 2, 3, 4
Group A test requirements
(method 5005)
1, 2, 3, 4, 5, 6, 9**, 10**, 11**
1
Groups C and D end-point
electrical parameters
(method 5005)
* PDA applies to subgroup 1.
** Subgroups 9, 10 and 11, if not tested, shall be guaranteed to the limits in table I herein.
4.3.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 7 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.
4.3.2 Groups C and D inspections.
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test conditions, method 1005 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1005 of MIL-STD-883.
(2) TA = +125°C, minimum.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
SIZE
STANDARD
86008
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
D
SHEET
8
DSCC FORM 2234
APR 97
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be
used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC
5962) should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone
(614) 692-0547
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-
HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by
DSCC-VA.
SIZE
STANDARD
86008
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
D
SHEET
9
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 07-12-03
Approved sources of supply for SMD 86008 are listed below for immediate acquisition information only and shall be
added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to
include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DSCC-VA. This information information bulletin is superseded by
the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current
sources of supply at http://www.dscc.dla.mil/Programs/Smcr/ .
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
8600801EA
3/
3/
AM685/BEA
LT685J/883
8600801IA
3/
3/
AM685/BIC
LT685H/883
8600802EA
8600802IA
8600803EA
8600803IA
8600804EA
8600804IA
86008042A
3/
3/
3/
3/
3/
3/
3/
LT685J/883
LT685H/883
AM6685/BEA
AM6685/BIC
AD96685TQ/883B
AD96685TH/883B
AD96685TE/883B
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
The last known available sources of supply are listed below.
1 of 2
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued
Vendor CAGE
number
Vendor name
and address
24355
Analog Devices
Route 1 Industrial Park
P.O. Box 9106
Norwood, MA 02062
Point of contact: 7910 Triad Center Drive
Greensboro, NC 27409-9605
34335
64155
Advance Micro Devices, Incorporated
901 Thompson Place
P.O. Box 3453
Sunnyvale, CA 94086
Linear Technology Corp.
1630 McCarthy Blvd.
Milpitas, CA 95035-7417
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
2 of 2
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