ADBF592WYCPZXX [ADI]

50MHz, OTHER DSP, QCC64, 9 X 9 MM, ROHS COMPLIANT, MO-220VMMD-4, LFCSP-64;
ADBF592WYCPZXX
型号: ADBF592WYCPZXX
厂家: ADI    ADI
描述:

50MHz, OTHER DSP, QCC64, 9 X 9 MM, ROHS COMPLIANT, MO-220VMMD-4, LFCSP-64

时钟 外围集成电路
文件: 总44页 (文件大小:1663K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Blackfin  
Embedded Processor  
ADSP-BF592  
FEATURES  
PERIPHERALS  
Up to 400 MHz high performance Blackfin processor  
Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs,  
40-bit shifter  
RISC-like register and instruction model for ease of  
programming and compiler-friendly support  
Advanced debug, trace, and performance monitoring  
Accepts a wide range of supply voltages for internal and I/O  
operations, see Operating Conditions on Page 15  
Off-chip voltage regulator interface  
Four 32-bit timers/counters, three with PWM support  
2 dual-channel, full-duplex synchronous serial ports (SPORT),  
supporting eight stereo I2S channels  
2 serial peripheral interface (SPI) compatible ports  
1 UART with IrDA support  
Parallel peripheral interface (PPI), supporting ITU-R 656  
video data formats  
2-wire interface (TWI) controller  
9 peripheral DMAs  
64-lead (9 mm × 9 mm) LFCSP package  
2 memory-to-memory DMA channels  
Event handler with 28 interrupt inputs  
32 general-purpose I/Os (GPIOs), with programmable  
hysteresis  
Debug/JTAG interface  
On-chip PLL capable of frequency multiplication  
MEMORY  
68K bytes of core-accessible memory  
(See Table 1 on Page 3 for L1 and L3 memory size details)  
64K byte L1 instruction ROM  
Flexible booting options from internal L1 ROM and SPI mem-  
ory or from host devices including SPI, PPI, and UART  
Memory management unit providing memory protection  
WATCHDOG TIMER  
SPORT1  
PORT F  
VOLTAGE REGULATOR INTERFACE  
JTAG TEST AND EMULATION  
PERIPHERAL  
PPI  
TIMER2–0  
UART  
SPI0  
ACCESS BUS  
GPIO  
INTERRUPT  
CONTROLLER  
B
L1 INSTRUCTION  
SRAM  
SPORT0  
SPI1  
L1 INSTRUCTION  
ROM  
L1 DATA  
SRAM  
PORT G  
DMA  
CONTROLLER  
DMA  
ACCESS  
BUS  
DCB  
TWI  
DEB  
BOOT  
ROM  
Figure 1. Processor Block Diagram  
Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.  
Rev. A  
Information furnished by Analog Devices is believed to be accurate and reliable.  
However, no responsibility is assumed by Analog Devices for its use, nor for any  
infringements of patents or other rights of third parties that may result from its use.  
Specifications subject to change without notice. No license is granted by implication  
or otherwise under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
© 2011 Analog Devices, Inc. All rights reserved.  
ADSP-BF592  
TABLE OF CONTENTS  
Features ................................................................. 1  
Memory ................................................................ 1  
Peripherals ............................................................. 1  
General Description ................................................. 3  
Portable Low Power Architecture ............................. 3  
System Integration ................................................ 3  
Blackfin Processor Core .......................................... 3  
Memory Architecture ............................................ 5  
Event Handling .................................................... 5  
DMA Controllers .................................................. 6  
Processor Peripherals ............................................. 6  
Dynamic Power Management .................................. 8  
Voltage Regulation ................................................ 9  
Clock Signals ....................................................... 9  
Booting Modes ................................................... 11  
Instruction Set Description ................................... 12  
Development Tools ............................................. 12  
Related Documents .............................................. 12  
Related Signal Chains ........................................... 12  
Signal Descriptions ................................................. 13  
Specifications ........................................................ 15  
Operating Conditions ........................................... 15  
Electrical Characteristics ....................................... 17  
Absolute Maximum Ratings ................................... 19  
ESD Sensitivity ................................................... 19  
Package Information ............................................ 20  
Timing Specifications ........................................... 21  
Output Drive Currents ......................................... 35  
Test Conditions .................................................. 36  
Environmental Conditions .................................... 39  
64-Lead LFCSP Lead Assignment ............................... 40  
Outline Dimensions ................................................ 42  
Automotive Products .............................................. 42  
Ordering Guide ..................................................... 42  
Designing an Emulator-Compatible  
Processor Board (Target) ................................... 12  
REVISION HISTORY  
Rev. 0 to Rev. A  
Added 200 MHz model to Electrical Characteristics ....... 17  
Added 200 MHz model to Ordering Guide ................... 43  
Rev. A  
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ADSP-BF592  
GENERAL DESCRIPTION  
The ADSP-BF592 processor is a member of the Blackfin® family  
of products, incorporating the Analog Devices/Intel Micro  
Signal Architecture (MSA). Blackfin processors combine a dual-  
MAC state-of-the-art signal processing engine, the advantages  
of a clean, orthogonal RISC-like microprocessor instruction set,  
and single-instruction, multiple-data (SIMD) multimedia capa-  
bilities into a single instruction-set architecture.  
The ADSP-BF592 processor is completely code compatible with  
other Blackfin processors. The ADSP-BF592 processor offers  
performance up to 400 MHz and reduced static power con-  
sumption. The processor features are shown in Table 1.  
SYSTEM INTEGRATION  
The ADSP-BF592 processor is a highly integrated system-on-a-  
chip solution for the next generation of digital communication  
and consumer multimedia applications. By combining industry  
standard interfaces with a high performance signal processing  
core, cost-effective applications can be developed quickly, with-  
out the need for costly external components. The system  
peripherals include a watchdog timer; three 32-bit timers/coun-  
ters with PWM support; two dual-channel, full-duplex  
synchronous serial ports (SPORTs); two serial peripheral inter-  
face (SPI) compatible ports; one UART® with IrDA support; a  
parallel peripheral interface (PPI); and a 2-wire interface (TWI)  
controller.  
Table 1. Processor Features  
Feature  
Timer/Counters with PWM  
SPORTs  
ADSP-BF592  
BLACKFIN PROCESSOR CORE  
3
As shown in Figure 2, the Blackfin processor core contains two  
16-bit multipliers, two 40-bit accumulators, two 40-bit ALUs,  
four video ALUs, and a 40-bit shifter. The computation units  
process 8-, 16-, or 32-bit data from the register file.  
2
SPIs  
2
UART  
1
The compute register file contains eight 32-bit registers. When  
performing compute operations on 16-bit operand data, the  
register file operates as 16 independent 16-bit registers. All  
operands for compute operations come from the multiported  
register file and instruction constant fields.  
Each MAC can perform a 16-bit by 16-bit multiply in each  
cycle, accumulating the results into the 40-bit accumulators.  
Signed and unsigned formats, rounding, and saturation  
are supported.  
The ALUs perform a traditional set of arithmetic and logical  
operations on 16-bit or 32-bit data. In addition, many special  
instructions are included to accelerate various signal processing  
tasks. These include bit operations such as field extract and pop-  
ulation count, modulo 232 multiply, divide primitives, saturation  
and rounding, and sign/exponent detection. The set of video  
instructions includes byte alignment and packing operations,  
16-bit and 8-bit adds with clipping, 8-bit average operations,  
and 8-bit subtract/absolute value/accumulate (SAA) operations.  
The compare/select and vector search instructions are also  
provided.  
Parallel Peripheral Interface  
TWI  
1
1
32  
GPIOs  
L1 Instruction SRAM  
L1 Instruction ROM  
L1 Data SRAM  
32K  
64K  
32K  
L1 Scratchpad SRAM  
L3 Boot ROM  
Maximum Instruction Rate1  
Maximum System Clock Speed  
Package Options  
4K  
4K  
400 MHz  
100 MHz  
64-Lead LFCSP  
1 Maximum instruction rate is not available with every possible SCLK selection.  
By integrating a rich set of industry-leading system peripherals  
and memory, Blackfin processors are the platform of choice for  
next-generation applications that require RISC-like program-  
mability, multimedia support, and leading-edge signal  
processing in one integrated package.  
For certain instructions, two 16-bit ALU operations can be per-  
formed simultaneously on register pairs (a 16-bit high half and  
16-bit low half of a compute register). If the second ALU is used,  
quad 16-bit operations are possible.  
The 40-bit shifter can perform shifts and rotates and is used to  
support normalization, field extract, and field deposit  
instructions.  
The program sequencer controls the flow of instruction execu-  
tion, including instruction alignment and decoding. For  
program flow control, the sequencer supports PC relative and  
indirect conditional jumps (with static branch prediction) and  
subroutine calls. Hardware is provided to support zero over  
PORTABLE LOW POWER ARCHITECTURE  
Blackfin processors provide world-class power management  
and performance. They are produced with a low power and low  
voltage design methodology and feature on-chip dynamic  
power management, which provides the ability to vary both the  
voltage and frequency of operation to significantly lower overall  
power consumption. This capability can result in a substantial  
reduction in power consumption, compared with just varying  
the frequency of operation. This allows longer battery life for  
portable appliances.  
head looping. The architecture is fully interlocked, meaning that  
the programmer need not manage the pipeline when executing  
instructions with data dependencies.  
Rev. A  
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ADSP-BF592  
The address arithmetic unit provides two addresses for simulta-  
neous dual fetches from memory. It contains a multiported  
register file consisting of four sets of 32-bit index, modify,  
length, and base registers (for circular buffering) and eight  
additional 32-bit pointer registers (for C-style indexed stack  
manipulation).  
Blackfin processors support a modified Harvard architecture in  
combination with a hierarchical memory structure. Level 1 (L1)  
memories are those that typically operate at the full processor  
speed with little or no latency. At the L1 level, the instruction  
memory holds instructions only. Data memory holds data, and  
a dedicated scratchpad data memory stores stack and local vari-  
able information.  
The architecture provides three modes of operation: user mode,  
supervisor mode, and emulation mode. User mode has  
restricted access to certain system resources, thus providing a  
protected software environment, while supervisor mode has  
unrestricted access to the system and core resources.  
The Blackfin processor instruction set has been optimized so  
that 16-bit opcodes represent the most frequently used instruc-  
tions, resulting in excellent compiled code density. Complex  
DSP instructions are encoded into 32-bit opcodes, representing  
fully featured multifunction instructions. Blackfin processors  
support a limited multi-issue capability, where a 32-bit instruc-  
tion can be issued in parallel with two 16-bit instructions,  
allowing the programmer to use many of the core resources in a  
single instruction cycle.  
Multiple L1 memory blocks are provided. The memory  
management unit (MMU) provides memory protection for  
individual tasks that may be operating on the core and can  
protect system registers from unintended access.  
The Blackfin processor assembly language uses an algebraic syn-  
tax for ease of coding and readability. The architecture has been  
optimized for use in conjunction with the C/C++ compiler,  
resulting in fast and efficient software implementations.  
ADDRESS ARITHMETIC UNIT  
SP  
FP  
P5  
P4  
I3  
I2  
I1  
I0  
L3  
L2  
L1  
L0  
B3  
B2  
B1  
B0  
M3  
M2  
M1  
M0  
DAG1  
P3  
DAG0  
P2  
P1  
P0  
DA1  
DA0  
32  
32  
32  
PREG  
32  
RAB  
SD  
LD1  
LD0  
32  
32  
32  
ASTAT  
32  
32  
SEQUENCER  
R7.H  
R7.L  
R6.H  
R5.H  
R4.H  
R3.H  
R2.H  
R1.H  
R0.H  
R6.L  
R5.L  
R4.L  
R3.L  
R2.L  
R1.L  
R0.L  
ALIGN  
16  
16  
8
8
8
8
DECODE  
BARREL  
SHIFTER  
LOOP BUFFER  
40  
40  
40 40  
A0  
A1  
CONTROL  
UNIT  
32  
32  
DATA ARITHMETIC UNIT  
Figure 2. Blackfin Processor Core  
Rev. A  
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ADSP-BF592  
Custom ROM (Optional)  
MEMORY ARCHITECTURE  
The on-chip L1 Instruction ROM on the ADSP-BF592 may be  
customized to contain user code with the following features:  
• 64K bytes of L1 Instruction ROM available for custom code  
• Ability to restrict access to all or specific segments of the  
on-chip ROM  
Customers wishing to customize the on-chip ROM for their  
own application needs should contact ADI sales for more infor-  
mation on terms and conditions and details on the technical  
implementation.  
The Blackfin processor views memory as a single unified  
4G byte address space, using 32-bit addresses. All resources,  
including internal memory and I/O control registers, occupy  
separate sections of this common address space. See Figure 3.  
The core-accessible L1 memory system is high performance  
internal memory that operates at the core clock frequency. The  
external bus interface unit (EBIU) provides access to the boot  
ROM.  
The memory DMA controller provides high bandwidth data-  
movement capability. It can perform block transfers of code or  
data between the L1 Instruction SRAM and L1 Data SRAM  
memory spaces.  
I/O Memory Space  
The processor does not define a separate I/O space. All  
resources are mapped through the flat 32-bit address space.  
On-chip I/O devices have their control registers mapped into  
memory-mapped registers (MMRs) at addresses near the top of  
the 4G byte address space. These are separated into two smaller  
blocks, one which contains the control MMRs for all core func-  
tions, and the other which contains the registers needed for  
setup and control of the on-chip peripherals outside of the core.  
The MMRs are accessible only in supervisor mode and appear  
as reserved space to on-chip peripherals.  
0xFFFF FFFF  
CORE MEMORY MAPPED REGISTERS (2M BYTES)  
0xFFE0 0000  
SYSTEM MEMORY MAPPED REGISTERS (2M BYTES)  
0xFFC0 0000  
RESERVED  
0xFFB0 1000  
L1 SCRATCHPAD RAM (4K BYTES)  
0xFFB0 0000  
RESERVED  
0xFFA2 0000  
L1 INSTRUCTION ROM (64K BYTES)  
0xFFA1 0000  
RESERVED  
Booting from ROM  
0xFFA0 8000  
L1 INSTRUCTION BANK B SRAM (16K BYTES)  
0xFFA0 4000  
L1 INSTRUCTION BANK A SRAM (16K BYTES)  
0xFFA0 0000  
The processor contains a small on-chip boot kernel, which con-  
figures the appropriate peripheral for booting. If the processor is  
configured to boot from boot ROM memory space, the proces-  
sor starts executing from the on-chip boot ROM. For more  
information, see Booting Modes on Page 11.  
RESERVED  
0xFF80 8000  
DATA SRAM (32K BYTES)  
0xFF80 0000  
RESERVED  
0xEF00 1000  
BOOT ROM (4K BYTES)  
EVENT HANDLING  
0xEF00 0000  
RESERVED  
0x0000 0000  
The event controller on the processor handles all asynchronous  
and synchronous events to the processor. The processor  
provides event handling that supports both nesting and prioriti-  
zation. Nesting allows multiple event service routines to be  
active simultaneously. Prioritization ensures that servicing of a  
higher-priority event takes precedence over servicing of a lower-  
priority event. The controller provides support for five different  
types of events:  
Figure 3. Internal/External Memory Map  
Internal (Core-Accessible) Memory  
The processor has three blocks of core-accessible memory, pro-  
viding high bandwidth access to the core.  
The first block is the L1 instruction memory, consisting of  
32K bytes SRAM. This memory is accessed at full processor  
speed.  
The second core-accessible memory block is the L1 data mem-  
ory, consisting of 32K bytes. This memory block is accessed at  
full processor speed.  
The third memory block is a 4K byte L1 scratchpad SRAM,  
which runs at the same speed as the other L1 memories.  
• Emulation – An emulation event causes the processor to  
enter emulation mode, allowing command and control of  
the processor via the JTAG interface.  
• RESET – This event resets the processor.  
• Nonmaskable Interrupt (NMI) – The NMI event can be  
generated by the software watchdog timer or by the NMI  
input signal to the processor. The NMI event is frequently  
used as a power-down indicator to initiate an orderly shut-  
down of the system.  
L1 Utility ROM  
The L1 instruction ROM contains utility ROM code. This  
includes the TMK (VDK core), C run-time libraries, and DSP  
libraries. See the VisualDSP++ documentation for more  
information.  
Rev. A  
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ADSP-BF592  
• Exceptions – Events that occur synchronously to program  
flow (in other words, the exception is taken before the  
instruction is allowed to complete). Conditions such as  
data alignment violations and undefined instructions cause  
exceptions.  
• Interrupts – Events that occur asynchronously to program  
flow. They are caused by input signals, timers, and other  
peripherals, as well as by an explicit software instruction.  
Each event type has an associated register to hold the return  
address and an associated return-from-event instruction. When  
an event is triggered, the state of the processor is saved on the  
supervisor stack.  
The processor event controller consists of two stages: the core  
event controller (CEC) and the system interrupt controller  
(SIC). The core event controller works with the system interrupt  
controller to prioritize and control all system events. Conceptu-  
ally, interrupts from the peripherals enter into the SIC and are  
then routed directly into the general-purpose interrupts of the  
CEC.  
The processor DMA controller supports both one-dimensional  
(1-D) and two-dimensional (2-D) DMA transfers. DMA trans-  
fer initialization can be implemented from registers or from sets  
of parameters called descriptor blocks.  
The 2-D DMA capability supports arbitrary row and column  
sizes up to 64K elements by 64K elements, and arbitrary row  
and column step sizes up to 32K elements. Furthermore, the  
column step size can be less than the row step size, allowing  
implementation of interleaved data streams. This feature is  
especially useful in video applications where data can be de-  
interleaved on the fly.  
Examples of DMA types supported by the processor DMA con-  
troller include:  
• A single, linear buffer that stops upon completion  
• A circular, auto-refreshing buffer that interrupts on each  
full or fractionally full buffer  
• 1-D or 2-D DMA using a linked list of descriptors  
• 2-D DMA using an array of descriptors, specifying only the  
base DMA address within a common page  
Core Event Controller (CEC)  
In addition to the dedicated peripheral DMA channels, there are  
two memory DMA channels, which are provided for transfers  
between the various memories of the processor system with  
minimal processor intervention. Memory DMA transfers can be  
controlled by a very flexible descriptor-based methodology or  
by a standard register-based autobuffer mechanism.  
The CEC supports nine general-purpose interrupts (IVG15–7),  
in addition to the dedicated interrupt and exception events. Of  
these general-purpose interrupts, the two lowest priority  
interrupts (IVG15–14) are recommended to be reserved for  
software interrupt handlers, leaving seven prioritized interrupt  
inputs to support the peripherals of the processor. The inputs to  
the CEC, their names in the event vector table (EVT), and their  
priorities are described in the ADSP-BF59x Blackfin Processor  
Hardware Reference, “System Interrupts” chapter.  
PROCESSOR PERIPHERALS  
The ADSP-BF592 processor contains a rich set of peripherals  
connected to the core via several high bandwidth buses, provid-  
ing flexibility in system configuration, as well as excellent  
overall system performance (see Figure 1). The processor also  
contains dedicated communication modules and high speed  
serial and parallel ports, an interrupt controller for flexible man-  
agement of interrupts from the on-chip peripherals or external  
sources, and power management control functions to tailor the  
performance and power characteristics of the processor and sys-  
tem to many application scenarios.  
The SPORTs, SPIs, UART, and PPI peripherals are supported  
by a flexible DMA structure. There are also separate memory  
DMA channels dedicated to data transfers between the proces-  
sor’s various memory spaces, including boot ROM. Multiple  
on-chip buses running at up to 100 MHz provide enough band-  
width to keep the processor core running along with activity on  
all of the on-chip and external peripherals.  
System Interrupt Controller (SIC)  
The system interrupt controller provides the mapping and rout-  
ing of events from the many peripheral interrupt sources to the  
prioritized general-purpose interrupt inputs of the CEC.  
Although the processor provides a default mapping, the user  
can alter the mappings and priorities of interrupt events by writ-  
ing the appropriate values into the interrupt assignment  
registers (SIC_IARx). The inputs into the SIC and the default  
mappings into the CEC are described in the ADSP-BF59x Black-  
fin Processor Hardware Reference, “System Interrupts” chapter.  
The SIC allows further control of event processing by providing  
three pairs of 32-bit interrupt control and status registers. Each  
register contains a bit, corresponding to each peripheral inter-  
rupt event. For more information, see the ADSP-BF59x Blackfin  
Processor Hardware Reference, “System Interrupts” chapter.  
The ADSP-BF592 processor includes an interface to an off-chip  
voltage regulator in support of the processor’s dynamic power  
management capability.  
DMA CONTROLLERS  
The processor has multiple, independent DMA channels that  
support automated data transfers with minimal overhead for  
the processor core. DMA transfers can occur between the pro-  
cessor’s internal memories and any of its DMA-capable  
peripherals. DMA-capable peripherals include the SPORTs, SPI  
ports, UART, and PPI. Each individual DMA-capable periph-  
eral has at least one dedicated DMA channel.  
Watchdog Timer  
The processor includes a 32-bit timer that can be used to imple-  
ment a software watchdog function. A software watchdog can  
improve system availability by forcing the processor to a known  
state through generation of a hardware reset, nonmaskable  
interrupt (NMI), or general-purpose interrupt, if the timer  
expires before being reset by software. The programmer  
Rev. A  
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ADSP-BF592  
initializes the count value of the timer, enables the appropriate  
interrupt, then enables the timer. Thereafter, the software must  
reload the counter before it counts to zero from the pro-  
grammed value. This protects the system from remaining in an  
unknown state where software, which would normally reset the  
timer, has stopped running due to an external noise condition  
or software error.  
If configured to generate a hardware reset, the watchdog timer  
resets both the core and the processor peripherals. After a reset,  
software can determine whether the watchdog was the source of  
the hardware reset by interrogating a status bit in the watchdog  
timer control register.  
Serial Peripheral Interface (SPI) Ports  
The processor has two SPI-compatible ports that enable the  
processor to communicate with multiple SPI-compatible  
devices.  
The SPI interface uses three pins for transferring data: two data  
pins (Master Output-Slave Input, MOSI, and Master Input-  
Slave Output, MISO) and a clock pin (serial clock, SCK). An SPI  
chip select input pin (SPIx_SS) lets other SPI devices select the  
processor, and many SPI chip select output pins (SPIx_SEL7–1)  
let the processor select other SPI devices. The SPI select pins are  
reconfigured general-purpose I/O pins. Using these pins, the  
SPI port provides a full-duplex, synchronous serial interface,  
which supports both master/slave modes and multimaster  
environments.  
The timer is clocked by the system clock (SCLK) at a maximum  
frequency of fSCLK  
.
Timers  
UART Port  
There are four general-purpose programmable timer units in  
the processor. Three timers have an external pin that can be  
configured either as a pulse width modulator (PWM) or timer  
output, as an input to clock the timer, or as a mechanism for  
measuring pulse widths and periods of external events. These  
timers can be synchronized to an external clock input to the sev-  
eral other associated PF pins, to an external clock input to the  
PPI_CLK input pin, or to the internal SCLK.  
The ADSP-BF592 processor provides a full-duplex universal  
asynchronous receiver/transmitter (UART) port, which is fully  
compatible with PC-standard UARTs. The UART port provides  
a simplified UART interface to other peripherals or hosts,  
supporting full-duplex, DMA-supported, asynchronous trans-  
fers of serial data. The UART port includes support for five to  
eight data bits, one or two stop bits, and none, even, or odd par-  
ity. The UART port supports two modes of operation:  
The timer units can be used in conjunction with the UART to  
measure the width of the pulses in the data stream to provide a  
software auto-baud detect function for the respective serial  
channels.  
The timers can generate interrupts to the processor core provid-  
ing periodic events for synchronization, either to the system  
clock or to a count of external signals.  
In addition to the three general-purpose programmable timers,  
a fourth timer is also provided. This extra timer is clocked by the  
internal processor clock and is typically used as a system tick  
clock for generation of operating system periodic interrupts.  
• PIO (programmed I/O) – The processor sends or receives  
data by writing or reading I/O mapped UART registers.  
The data is double-buffered on both transmit and receive.  
• DMA (direct memory access) – The DMA controller trans-  
fers both transmit and receive data. This reduces the  
number and frequency of interrupts required to transfer  
data to and from memory. The UART has two dedicated  
DMA channels, one for transmit and one for receive. These  
DMA channels have lower default priority than most DMA  
channels because of their relatively low service rates.  
Parallel Peripheral Interface (PPI)  
Serial Ports  
The processor provides a parallel peripheral interface (PPI) that  
can connect directly to parallel analog-to-digital and digital-to-  
analog converters, video encoders and decoders, and other gen-  
eral-purpose peripherals. The PPI consists of a dedicated input  
clock pin, up to three frame synchronization pins, and up to 16  
data pins. The input clock supports parallel data rates up to half  
the system clock rate, and the synchronization signals can be  
configured as either inputs or outputs.  
The PPI supports a variety of general-purpose and ITU-R 656  
modes of operation. In general-purpose mode, the PPI provides  
half-duplex, bidirectional data transfer with up to 16 bits of  
data. Up to three frame synchronization signals are also pro-  
vided. In ITU-R 656 mode, the PPI provides half-duplex  
bidirectional transfer of 8- or 10-bit video data. Additionally,  
on-chip decode of embedded start-of-line (SOL) and start-of-  
field (SOF) preamble packets is supported.  
The ADSP-BF592 processor incorporates two dual-channel  
synchronous serial ports (SPORT0 and SPORT1) for serial and  
multiprocessor communications. The SPORTs support the fol-  
lowing features:  
Serial port data can be automatically transferred to and from  
on-chip memory/external memory via dedicated DMA chan-  
nels. Each of the serial ports can work in conjunction with  
another serial port to provide TDM support. In this configura-  
tion, one SPORT provides two transmit signals while the other  
SPORT provides the two receive signals. The frame sync and  
clock are shared.  
Serial ports operate in five modes:  
• Standard DSP serial mode  
• Multichannel (TDM) mode  
• I2S mode  
• Packed I2S mode  
• Left-justified mode  
Rev. A  
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General-Purpose Mode Descriptions  
DYNAMIC POWER MANAGEMENT  
The general-purpose modes of the PPI are intended to suit a  
wide variety of data capture and transmission applications.  
Three distinct submodes are supported:  
• Input mode – Frame syncs and data are inputs into the PPI.  
Input mode is intended for ADC applications, as well as  
video communication with hardware signaling.  
• Frame capture mode – Frame syncs are outputs from the  
PPI, but data are inputs. This mode allows the video  
source(s) to act as a slave (for frame capture for example).  
• Output mode – Frame syncs and data are outputs from the  
PPI. Output mode is used for transmitting video or other  
data with up to three output frame syncs.  
The processor provides five operating modes, each with a differ-  
ent performance/power profile. In addition, dynamic power  
management provides the control functions to dynamically alter  
the processor core supply voltage, further reducing power dissi-  
pation. When configured for a 0 V core supply voltage, the  
processor enters the hibernate state. Control of clocking to each  
of the processor peripherals also reduces power consumption.  
See Table 2 for a summary of the power settings for each mode.  
Table 2. Power Settings  
Core  
Clock  
System  
Clock  
PLL  
Core  
Mode/State PLL  
Bypassed (CCLK) (SCLK) Power  
ITU-R 656 Mode Descriptions  
Full On  
Active  
Enabled No  
Enabled Enabled On  
The ITU-R 656 modes of the PPI are intended to suit a wide  
variety of video capture, processing, and transmission applica-  
tions. Three distinct submodes are supported:  
• Active video only mode – Active video only mode is used  
when only the active video portion of a field is of interest  
and not any of the blanking intervals.  
Enabled/ Yes  
Enabled Enabled On  
Disabled  
Enabled  
Sleep  
Disabled Enabled On  
Disabled Disabled On  
Disabled Disabled Off  
Deep Sleep Disabled —  
Hibernate Disabled —  
• Vertical blanking only mode – In this mode, the PPI only  
transfers vertical blanking interval (VBI) data.  
• Entire field mode – In this mode, the entire incoming bit  
stream is read in through the PPI.  
Full-On Operating Mode—Maximum Performance  
In the full-on mode, the PLL is enabled and is not bypassed,  
providing capability for maximum operational frequency. This  
is the power-up default execution state in which maximum per-  
formance can be achieved. The processor core and all enabled  
peripherals run at full speed.  
TWI Controller Interface  
The processor includes a 2-wire interface (TWI) module for  
providing a simple exchange method of control data between  
multiple devices. The TWI is functionally compatible with the  
widely used I2C® bus standard. The TWI module offers the  
capabilities of simultaneous master and slave operation and  
support for both 7-bit addressing and multimedia data arbitra-  
tion. The TWI interface utilizes two pins for transferring clock  
(SCL) and data (SDA) and supports the protocol at speeds up to  
400K bits/sec.  
Active Operating Mode—Moderate Dynamic Power  
Savings  
In the active mode, the PLL is enabled but bypassed. Because the  
PLL is bypassed, the processor’s core clock (CCLK) and system  
clock (SCLK) run at the input clock (CLKIN) frequency. DMA  
access is available to appropriately configured L1 memories.  
For more information about PLL controls, see the “Dynamic  
Power Management” chapter in the ADSP-BF59x Blackfin Pro-  
cessor Hardware Reference.  
The TWI module is compatible with serial camera control bus  
(SCCB) functionality for easier control of various CMOS cam-  
era sensor devices.  
Sleep Operating Mode—High Dynamic Power Savings  
The sleep mode reduces dynamic power dissipation by disabling  
the clock to the processor core (CCLK). The PLL and system  
clock (SCLK), however, continue to operate in this mode. Typi-  
cally, an external event wakes up the processor.  
System DMA access to L1 memory is not supported in  
sleep mode.  
Ports  
The processor groups the many peripheral signals to two  
ports—Port F and Port G. Most of the associated pins are shared  
by multiple signals. The ports function as multiplexer controls.  
General-Purpose I/O (GPIO)  
The processor has 32 bidirectional, general-purpose I/O (GPIO)  
pins allocated across two separate GPIO modules—PORTFIO  
and PORTGIO, associated with Port F and Port G respectively.  
Each GPIO-capable pin shares functionality with other proces-  
sor peripherals via a multiplexing scheme; however, the GPIO  
functionality is the default state of the device upon power-up.  
Neither GPIO output nor input drivers are active by default.  
Each general-purpose port pin can be individually controlled by  
manipulation of the port control, status, and interrupt registers.  
Deep Sleep Operating Mode—Maximum Dynamic Power  
Savings  
The deep sleep mode maximizes dynamic power savings by dis-  
abling the clocks to the processor core (CCLK) and to all  
synchronous peripherals (SCLK). Asynchronous peripherals  
may still be running but cannot access internal resources or  
external memory. This powered-down mode can only be exited  
by assertion of the reset interrupt (RESET) or by an asynchro-  
nous interrupt generated by a GPIO pin.  
Rev. A  
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ADSP-BF592  
Note that when a GPIO pin is used to trigger wake from deep  
sleep, the programmed wake level must linger for at least 10ns  
to guarantee detection.  
Power Savings Factor  
2
fCCLKRED  
-------------------  
fCCLKNOM  
VDDINTRED  
------------------------  
VDDINTNOM  
TRED  
-----------  
TNOM  
=
×
×
Hibernate State—Maximum Static Power Savings  
The hibernate state maximizes static power savings by disabling  
clocks to the processor core (CCLK) and to all of the peripherals  
(SCLK), as well as signaling an external voltage regulator that  
% Power Savings = (1 Power Savings Factor) × 100%  
VDDINT can be shut off. Any critical information stored inter-  
nally (for example, memory contents, register contents, and  
other information) must be written to a nonvolatile storage  
device prior to removing power if the processor state is to be  
preserved. Writing b#0 to the HIBERNATE bit causes  
EXT_WAKE to transition low, which can be used to signal an  
external voltage regulator to shut down.  
Since VDDEXT can still be supplied in this mode, all of the exter-  
nal pins three-state, unless otherwise specified. This allows  
other devices that may be connected to the processor to still  
have power applied without drawing unwanted current.  
where:  
f
f
CCLKNOM is the nominal core clock frequency  
CCLKRED is the reduced core clock frequency  
V
V
DDINTNOM is the nominal internal supply voltage  
DDINTRED is the reduced internal supply voltage  
T
T
NOM is the duration running at fCCLKNOM  
RED is the duration running at fCCLKRED  
VOLTAGE REGULATION  
As long as VDDEXT is applied, the VR_CTL register maintains its  
state during hibernation. All other internal registers and memo-  
ries, however, lose their content in the hibernate state.  
The ADSP-BF592 processor requires an external voltage regula-  
tor to power the VDDINT domain. To reduce standby power  
consumption, the external voltage regulator can be signaled  
through EXT_WAKE to remove power from the processor core.  
This signal is high-true for power-up and may be connected  
directly to the low-true shut-down input of many common  
regulators.  
While in the hibernate state, the external supply, VDDEXT, can  
still be applied, eliminating the need for external buffers. The  
external voltage regulator can be activated from this power-  
down state by asserting the RESET pin, which then initiates a  
boot sequence. EXT_WAKE indicates a wakeup to the external  
voltage regulator.  
The power good (PG) input signal allows the processor to start  
only after the internal voltage has reached a chosen level. In this  
way, the startup time of the external regulator is detected after  
hibernation. For a complete description of the power-good  
functionality, refer to the ADSP-BF59x Blackfin Processor Hard-  
ware Reference.  
Power Savings  
As shown in Table 3, the processor supports two different  
power domains, which maximizes flexibility while maintaining  
compliance with industry standards and conventions. By isolat-  
ing the internal logic of the processor into its own power  
domain, separate from other I/O, the processor can take advan-  
tage of dynamic power management without affecting the other  
I/O devices. There are no sequencing requirements for the  
various power domains, but all domains must be powered  
according to the appropriate Specifications table for processor  
operating conditions, even if the feature/peripheral is not used.  
Table 3. Power Domains  
Power Domain  
All internal logic and memories  
All other I/O  
VDD Range  
VDDINT  
VDDEXT  
CLOCK SIGNALS  
The dynamic power management feature of the processor  
allows both the processor’s input voltage (VDDINT) and clock fre-  
quency (fCCLK) to be dynamically controlled.  
The processor can be clocked by an external crystal, a sine wave  
input, or a buffered, shaped clock derived from an external  
clock oscillator.  
The power dissipated by a processor is largely a function of its  
clock frequency and the square of the operating voltage. For  
example, reducing the clock frequency by 25% results in a 25%  
reduction in dynamic power dissipation, while reducing the  
voltage by 25% reduces dynamic power dissipation by more  
than 40%. Further, these power savings are additive, in that if  
the clock frequency and supply voltage are both reduced, the  
power savings can be dramatic, as shown in the following  
equations.  
If an external clock is used, it should be a TTL-compatible signal  
and must not be halted, changed, or operated below the speci-  
fied frequency during normal operation. This signal is  
connected to the processor’s CLKIN pin. When an external  
clock is used, the XTAL pin must be left unconnected.  
Alternatively, because the processor includes an on-chip oscilla-  
tor circuit, an external crystal may be used. For fundamental  
frequency operation, use the circuit shown in Figure 4. A  
parallel -resonant, fundamental frequency, microprocessor-  
grade crystal is connected across the CLKIN and XTAL pins.  
The on-chip resistance between CLKIN and the XTAL pin is in  
Rev. A  
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ADSP-BF592  
the 500 kΩ range. Further parallel resistors are typically not rec-  
ommended. The two capacitors and the series resistor shown in  
Figure 4 fine tune phase and amplitude of the sine frequency.  
“FINE” ADJUSTMENT  
REQUIRES PLL SEQUENCING  
“COARSE” ADJUSTMENT  
ON-THE-FLY  
The capacitor and resistor values shown in Figure 4 are typical  
values only. The capacitor values are dependent upon the crystal  
manufacturers’ load capacitance recommendations and the PCB  
physical layout. The resistor value depends on the drive level  
specified by the crystal manufacturer. The user should verify the  
customized values based on careful investigations on multiple  
devices over temperature range.  
CCLK  
÷ 1, 2, 4, 8  
PLL  
5to 64ꢀ  
CLKIN  
VCO  
SCLK  
÷ 1 to 15  
SCLK CCLK  
BLACKFIN  
Figure 5. Frequency Modification Methods  
CLKOUT (SCLK)  
CLKBUF  
All on-chip peripherals are clocked by the system clock (SCLK).  
The system clock frequency is programmable by means of the  
SSEL3–0 bits of the PLL_DIV register. The values programmed  
into the SSEL fields define a divide ratio between the PLL output  
(VCO) and the system clock. SCLK divider values are 1 through  
15. Table 4 illustrates typical system clock ratios.  
TO PLL CIRCUITRY  
EN  
EN  
SELECT  
560  
Note that the divisor ratio must be chosen to limit the system  
clock frequency to its maximum of fSCLK. The SSEL value can be  
changed dynamically without any PLL lock latencies by writing  
the appropriate values to the PLL divisor register (PLL_DIV).  
The core clock (CCLK) frequency can also be dynamically  
changed by means of the CSEL1–0 bits of the PLL_DIV register.  
Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in  
Table 5. This programmable core clock capability is useful for  
fast core frequency modifications.  
XTAL  
EXTCLK  
CLKIN  
18 pF *  
330 *  
FOR OVERTONE  
OPERATION ONLY:  
18 pF *  
NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED, DEPENDING  
ON THE CRYSTAL AND LAYOUT. PLEASE ANALYZE CAREFULLY. FOR  
FREQUENCIES ABOVE 33 MHz, THE SUGGESTED CAPACITOR VALUE  
OF 18 pF SHOULD BE TREATED AS A MAXIMUM, AND THE SUGGESTED  
RESISTOR VALUE SHOULD BE REDUCED TO 0 .  
Table 5. Core Clock Ratios  
Figure 4. External Crystal Connections  
Example Frequency Ratios  
A third-overtone crystal can be used for frequencies above  
25 MHz. The circuit is then modified to ensure crystal operation  
only at the third overtone, by adding a tuned inductor circuit as  
shown in Figure 4. A design procedure for third-overtone oper-  
ation is discussed in detail in (EE-168) Using Third Overtone  
Crystals with the ADSP-218x DSP on the Analog Devices web-  
site (www.analog.com)—use site search on “EE-168.”  
(MHz)  
Signal Name Divider Ratio  
CSEL1–0  
VCO/CCLK  
VCO  
300  
300  
400  
200  
CCLK  
00  
01  
10  
11  
1:1  
2:1  
4:1  
8:1  
300  
150  
100  
25  
The Blackfin core runs at a different clock rate than the on-chip  
peripherals. As shown in Figure 5, the core clock (CCLK) and  
system peripheral clock (SCLK) are derived from the input  
clock (CLKIN) signal. An on-chip PLL is capable of multiplying  
the CLKIN signal by a programmable 5× to 64× multiplication  
factor (bounded by specified minimum and maximum VCO  
frequencies). The default multiplier is 6×, but it can be modified  
by a software instruction sequence.  
Table 4. Example System Clock Ratios  
Example Frequency Ratios  
(MHz)  
Signal Name Divider Ratio  
SSEL3–0  
VCO/SCLK  
VCO  
SCLK  
50  
0010  
2:1  
100  
300  
400  
0110  
6:1  
50  
On-the-fly frequency changes can be effected by simply writing  
to the PLL_DIV register. The maximum allowed CCLK and  
1010  
10:1  
40  
SCLK rates depend on the applied voltages VDDINT and VDDEXT  
;
The maximum CCLK frequency both depends on the part’s  
instruction rate (see Page Page 43) and depends on the applied  
the VCO is always permitted to run up to the frequency speci-  
fied by the part’s instruction rate. The EXTCLK pin can be  
configured to output either the SCLK frequency or the input  
buffered CLKIN frequency, called CLKBUF. When configured  
to output SCLK (CLKOUT), the EXTCLK pin acts as a refer-  
ence signal in many timing specifications. While three-stated by  
default, it can be enabled using the VRCTL register.  
V
DDINT voltage. See Table 8 for details. The maximal system  
clock rate (SCLK) depends on the chip package and the applied  
VDDINT and VDDEXT voltages (see Table 10).  
Rev. A  
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ADSP-BF592  
• SPI0 master boot from flash (BMODE = 0x4) — In this  
mode SPI0 is configured to operate in master mode and to  
connect to 8-, 16-, 24-, or 32-bit addressable devices. The  
processor uses the PF8/SPI0_SSEL2 to select a single SPI  
EEPROM/flash device, submits a read command and suc-  
cessive address bytes (0×00) until a valid 8-, 16-, 24-, or 32-  
bit addressable device is detected, and begins clocking data  
into the processor. Pull-up resistors are required on the  
SSEL and MISO pins. By default, a value of 0×85 is written  
to the SPI_BAUD register.  
BOOTING MODES  
The processor has several mechanisms (listed in Table 6) for  
automatically loading internal and external memory after a  
reset. The boot mode is defined by the BMODE input pins dedi-  
cated to this purpose. There are two categories of boot modes.  
In master boot modes, the processor actively loads data from  
parallel or serial memories. In slave boot modes, the processor  
receives data from external host devices.  
Table 6. Booting Modes  
• Boot from PPI host device (BMODE = 0x5) — The proces-  
sor operates in PPI slave mode and is configured to receive  
the bytes of the LDR file from a PPI host (master) agent.  
BMODE2–0 Description  
000  
001  
010  
011  
100  
101  
110  
111  
Idle/No Boot  
Reserved  
• Boot from UART host device (BMODE = 0x6) — In this  
mode UART0 is used as the booting source. Using an auto-  
baud handshake sequence, a boot-stream formatted  
program is downloaded by the host. The host selects a bit  
rate within the UART clocking capabilities. When per-  
forming the autobaud, the UART expects a “@” (0×40)  
character (eight bits data, one start bit, one stop bit, no par-  
ity bit) on the RXD pin to determine the bit rate. The  
UART then replies with an acknowledgment which is com-  
posed of 4 bytes (0xBF—the value of UART_DLL) and  
(0×00—the value of UART_DLH). The host can then  
download the boot stream. To hold off the host the proces-  
sor signals the host with the boot host wait (HWAIT)  
signal. Therefore, the host must monitor the HWAIT, (on  
PG4), before every transmitted byte.  
• Execute from internal L1 ROM (BMODE = 0x7) — In this  
mode the processor begins execution from the on-chip 64k  
byte L1 instruction ROM starting at address 0xFFA1 0000.  
For each of the boot modes (except Execute from internal L1  
ROM), a 16 byte header is first brought in from an external  
device. The header specifies the number of bytes to be trans-  
ferred and the memory destination address. Multiple memory  
blocks may be loaded by any boot sequence. Once all blocks are  
loaded, program execution commences from the start of L1  
instruction SRAM.  
The boot kernel differentiates between a regular hardware reset  
and a wakeup-from-hibernate event to speed up booting in the  
latter case. Bits 7–4 in the system reset configuration (SYSCR)  
register can be used to bypass the boot kernel or simulate a  
wakeup-from-hibernate boot in case of a software reset.  
The boot process can be further customized by “initialization  
code.” This is a piece of code that is loaded and executed prior to  
the regular application boot. Typically, this is used to speed up  
booting by managing the PLL, clock frequencies, or serial bit  
rates.  
SPI1 master boot from Flash, using SPI1_SSEL5 on PG11  
SPI1 slave boot from external master  
SPI0 master boot from Flash, using SPI0_SSEL2 on PF8  
Boot from PPI port  
Boot from UART host device  
Execute from Internal L1 ROM  
The boot modes listed in Table 6 provide a number of mecha-  
nisms for automatically loading the processor’s internal and  
external memories after a reset. By default, all boot modes use  
the slowest meaningful configuration settings. Default settings  
can be altered via the initialization code feature at boot time.  
The BMODE pins of the reset configuration register, sampled  
during power-on resets and software-initiated resets, imple-  
ment the modes shown in Table 6.  
• IDLE State/No Boot (BMODE - 0x0) — In this mode, the  
boot kernel transitions the processor into Idle state. The  
processor can then be controlled through JTAG for recov-  
ery, debug, or other functions.  
• SPI1 master boot from flash (BMODE = 0x2) — In this  
mode, SPI1 is configured to operate in master mode and to  
connect to 8-, 16-, 24-, or 32-bit addressable devices. The  
processor uses the PG11/SPI1_SSEL5 to select a single SPI  
EEPROM/flash device, submits a read command and suc-  
cessive address bytes (0×00) until a valid 8-, 16-, 24-, or 32-  
bit addressable device is detected, and begins clocking data  
into the processor. Pull-up resistors are required on the  
SSEL and MISO pins. By default, a value of 0×85 is written  
to the SPI_BAUD register.  
• SPI1 slave boot from external master (BMODE = 0x3) — In  
this mode, SPI1 is configured to operate in slave mode and  
to receive the bytes of the .LDR file from a SPI host (mas-  
ter) agent. To hold off the host device from transmitting  
while the boot ROM is busy, the Blackfin processor asserts  
a GPIO pin, called host wait (HWAIT), to signal to the host  
device not to send any more bytes until the pin is deas-  
serted. The host must interrogate the HWAIT signal,  
available on PG4, before transmitting every data unit to the  
processor. A pull-up resistor is required on the SPI1_SS  
input. A pull-down on the serial clock may improve signal  
quality and booting robustness.  
The boot ROM also features C-callable functions that can be  
called by the user application at run time. This enables second  
stage boot or boot management schemes to be implemented  
with ease.  
Rev. A  
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ADSP-BF592  
JTAG Test Access Port (TAP) on each JTAG processor. The  
emulator uses the TAP to access the internal features of the pro-  
cessor, allowing the developer to load code, set breakpoints,  
observe variables, observe memory, and examine registers. The  
processor must be halted to send data and commands, but once  
an operation has been completed by the emulator, the processor  
system is set running at full speed with no impact on  
system timing.  
INSTRUCTION SET DESCRIPTION  
The Blackfin processor family assembly language instruction set  
employs an algebraic syntax designed for ease of coding and  
readability. The instructions have been specifically tuned to pro-  
vide a flexible, densely encoded instruction set that compiles to  
a very small final memory size. The instruction set also provides  
fully featured multifunction instructions that allow the pro-  
grammer to use many of the processor core resources in a single  
instruction. Coupled with many features more often seen on  
microcontrollers, this instruction set is very efficient when com-  
piling C and C++ source code. In addition, the architecture  
supports both user (algorithm/application code) and supervisor  
(O/S kernel, device drivers, debuggers, ISRs) modes of opera-  
tion, allowing multiple levels of access to core  
To use these emulators, the target board must include a header  
that connects the processor’s JTAG port to the emulator.  
For details on target board design issues including mechanical  
layout, single processor connections, multiprocessor scan  
chains, signal buffering, signal termination, and emulator pod  
logic, see (EE-68) Analog Devices JTAG Emulation Technical  
Reference on the Analog Devices website (www.analog.com)—  
use site search on “EE-68.” This document is updated regularly  
to keep pace with improvements to emulator support.  
processor resources.  
The assembly language, which takes advantage of the proces-  
sor’s unique architecture, offers the following advantages:  
• Seamlessly integrated DSP/MCU features are optimized for  
both 8-bit and 16-bit operations.  
• A multi-issue load/store modified-Harvard architecture,  
which supports two 16-bit MAC or four 8-bit ALU + two  
load/store + two pointer updates per cycle.  
• All registers, I/O, and memory are mapped into a unified  
4G byte memory space, providing a simplified program-  
ming model.  
• Microcontroller features, such as arbitrary bit and bit-field  
manipulation, insertion, and extraction; integer operations  
on 8-, 16-, and 32-bit data-types; and separate user and  
supervisor stack pointers.  
RELATED DOCUMENTS  
The following publications that describe the ADSP-BF592 pro-  
cessor (and related processors) can be ordered from any Analog  
Devices sales office or accessed electronically on our website:  
Getting Started With Blackfin Processors  
ADSP-BF59x Blackfin Processor Hardware Reference  
Blackfin Processor Programming Reference  
ADSP-BF592 Blackfin Processor Anomaly List  
RELATED SIGNAL CHAINS  
A signal chain is a series of signal conditioning electronic com-  
ponents that receive input (data acquired from sampling either  
real-time phenomena or from stored data) in tandem, with the  
output of one portion of the chain supplying input to the next.  
Signal chains are often used in signal processing applications to  
gather and process data or to apply system controls based on  
analysis of real-time phenomena. For more information about  
this term and related topics, see the “signal chain” entry in the  
Glossary of EE Terms on the Analog Devices website.  
• Code density enhancements, which include intermixing of  
16-bit and 32-bit instructions (no mode switching, no code  
segregation). Frequently used instructions are encoded  
in 16 bits.  
DEVELOPMENT TOOLS  
The processor is supported with a complete set of  
CROSSCORE® software and hardware development tools,  
including Analog Devices emulators and VisualDSP++® devel-  
opment environment. The same emulator hardware that  
supports other Blackfin processors also fully emulates the  
ADSP-BF592 processor.  
Analog Devices eases signal processing system development by  
providing signal processing components that are designed to  
work together well. A tool for viewing relationships between  
specific applications and related components is available on the  
www.analog.com website.  
EZ-KIT Lite® Evaluation Board  
TM  
The Circuits from the Lab site (www.analog.com\circuits)  
For evaluation of the ADSP-BF592 processor, use the EZ-KIT  
Lite boards soon to be available from Analog Devices. When  
these evaluation kits are available, order using part number  
ADZS-BF592-EZLITE. The boards come with on-chip emula-  
tion capabilities and are equipped to enable software  
provides:  
• Graphical circuit block diagram presentation of signal  
chains for a variety of circuit types and applications  
• Drill down links for components in each chain to selection  
guides and application information  
development. Multiple daughter cards will be available.  
• Reference designs applying best practice design techniques  
DESIGNING AN EMULATOR-COMPATIBLE  
PROCESSOR BOARD (TARGET)  
The Analog Devices family of emulators are tools that every sys-  
tem developer needs in order to test and debug hardware and  
software systems. Analog Devices has supplied an IEEE 1149.1  
Rev. A  
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ADSP-BF592  
SIGNAL DESCRIPTIONS  
Signal definitions for the ADSP-BF592 processor are listed in  
Table 7. In order to maintain maximum function and reduce  
package size and pin count, some pins have dual, multiplexed  
functions. In cases where pin function is reconfigurable, the  
default state is shown in plain text, while the alternate function  
is shown in italics.  
All pins are three-stated during and immediately after reset,  
with the exception of EXTCLK, which toggles at the system  
clock rate.  
All I/O pins have their input buffers disabled with the exception  
of the pins that need pull-ups or pull-downs, as noted in  
Table 7.  
Adding a parallel termination to EXTCLK may prove useful in  
further enhancing signal integrity. Be sure to verify over-  
shoot/undershoot and signal integrity specifications on actual  
hardware.  
Table 7. Signal Descriptions  
Driver  
Type  
Signal Name  
Type Function  
Port F: GPIO and Multiplexed Peripherals  
PF0–GPIO/DR1SEC/PPI_D8/WAKEN1  
PF1–GPIO/DR1PRI/PPI_D9  
I/O GPIO/SPORT1 Receive Data Secondary/PPI Data 8/Wake Enable 1  
I/O GPIO/SPORT1 Receive Data Primary/PPI Data 9  
I/O GPIO/SPORT1 Receive Serial Clock/PPI Data 10  
I/O GPIO/SPORT1 Receive Frame Sync/PPI Data 11  
I/O GPIO/SPORT1 Transmit Data Secondary/PPI Data 12  
I/O GPIO/SPORT1 Transmit Data Primary/PPI Data 13  
I/O GPIO/SPORT1 Transmit Serial Clock/PPI Data 14  
I/O GPIO/SPORT1 Transmit Frame Sync/PPI Data 15  
I/O GPIO/Timer 2/SPI0 Slave Select Enable 2/Wake Enable 0  
I/O GPIO/Timer 0/PPI Frame Sync 1/SPI0 Slave Select Enable 3  
I/O GPIO/Timer 1/PPI Frame Sync 2  
A
A
A
A
A
A
A
A
A
A
A
A
A
PF2–GPIO/RSCLK1/PPI_D10  
PF3–GPIO/RFS1/PPI_D11  
PF4–GPIO/DT1SEC/PPI_D12  
PF5–GPIO/DT1PRI/PPI_D13  
PF6–GPIO/TSCLK1/PPI_D14  
PF7–GPIO/TFS1/PPI_D15  
PF8–GPIO/TMR2/SPI0_SSEL2/WAKEN0  
PF9–GPIO/TMR0/PPI_FS1/SPI0_SSEL3  
PF10–GPIO/TMR1/PPI_FS2  
PF11–GPIO/UA_TX/SPI0_SSEL4  
PF12–GPIO/UA_RX/SPI0_SSEL7/TACI2–0  
I/O GPIO/UART Transmit/SPI0 Slave Select Enable 4  
I/O GPIO/UART Receive/SPI0 Slave Select Enable 7/Timers 2–0 Alternate Input  
Capture  
PF13–GPIO/SPI0_MOSI/SPI1_SSEL3  
PF14–GPIO/SPI0_MISO/SPI1_SSEL4  
I/O GPIO/SPI0 Master Out Slave In/SPI1 Slave Select Enable 3  
A
A
I/O GPIO/SPI0 Master In Slave Out/SPI1 Slave Select Enable 4  
(This pin should always be pulled high through a 4.7 kΩ resistor,  
if booting via the SPI port.)  
PF15–GPIO/SPI0_SCK/SPI1_SSEL5  
I/O GPIO/SPI0 Clock/SPI1 Slave Select Enable 5  
A
A
Port G: GPIO and Multiplexed Peripherals  
PG0–GPIO/DR0SEC/SPI0_SSEL1/SPI0_SS  
I/O GPIO/SPORT0 Receive Data Secondary/SPI0 Slave Select Enable 1/SPI0 Slave  
Select Input  
PG1–GPIO/DR0PRI/SPI1_SSEL1/WAKEN3  
PG2–GPIO/RSCLK0/SPI0_SSEL5  
PG3–GPIO/RFS0/PPI_FS3  
I/O GPIO/SPORT0 Receive Data Primary/SPI1 Slave Select Enable 1/Wake Enable 3  
I/O GPIO/SPORT0 Receive Serial Clock/SPI0 Slave Select Enable 5  
I/O GPIO/SPORT0 Receive Frame Sync/PPI Frame Sync 3  
A
A
A
A
PG4–GPIO(HWAIT)/DT0SEC/SPI0_SSEL6  
I/O GPIO (HWAIT output for Slave Boot Modes)/SPORT0 Transmit Data  
Secondary/SPI0 Slave Select Enable 6  
PG5–GPIO/DT0PRI/SPI1_SSEL6  
PG6–GPIO/TSCLK0  
I/O GPIO/SPORT0 Transmit Data Primary/SPI1 Slave Select Enable 6  
I/O GPIO/SPORT0 Transmit Serial Clock  
A
A
A
A
A
A
PG7–GPIO/TFS0/SPI1_SSEL7  
PG8–GPIO/SPI1_SCK/PPI_D0  
PG9–GPIO/SPI1_MOSI/PPI_D1  
PG10–GPIO/SPI1_MISO/PPI_D2  
I/O GPIO/SPORT0 Transmit Frame Sync/SPI1 Slave Select Enable 7  
I/O GPIO/SPI1 Clock/PPI Data 0  
I/O GPIO/SPI1 Master Out Slave In/PPI Data 1  
I/O GPIO/SPI1 Master In Slave Out/PPI Data 2  
(This pin should always be pulled high through a 4.7 kΩ resistor if booting via  
the SPI port.)  
Rev. A  
|
Page 13 of 44  
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August 2011  
ADSP-BF592  
Table 7. Signal Descriptions (Continued)  
Driver  
Type  
Signal Name  
Type Function  
PG11–GPIO/SPI1_SSEL5/PPI_D3  
PG12–GPIO/SPI1_SSEL2/PPI_D4/WAKEN2  
PG13–GPIO/SPI1_SSEL1/SPI1_SS/PPI_D5  
PG14–GPIO/SPI1_SSEL4/PPI_D6/TACLK1  
PG15–GPIO/SPI1_SSEL6/PPI_D7/TACLK2  
TWI  
I/O GPIO/SPI1 Slave Select Enable 5/PPI Data 3  
A
A
A
A
A
I/O GPIO/SPI1 Slave Select Enable 2 Output/PPI Data 4/Wake Enable 2  
I/O GPIO/SPI1 Slave Select Enable 1 Output/PPI Data 5/SPI1 Slave Select Input  
I/O GPIO/SPI1 Slave Select Enable 4/PPI Data 6/Timer 1 Auxiliary Clock Input  
I/O GPIO/SPI1 Slave Select Enable 6/PPI Data 7/Timer 2 Auxiliary Clock Input  
SCL  
I/O TWI Serial Clock (This signal is an open-drain output and requires a pull-up  
resistor. Consult version 2.1 of the I2C specification for the proper resistor  
value.)  
B
B
SDA  
I/O TWI Serial Data (This signal is an open-drain output and requires a pull-up  
resistor. Consult version 2.1 of the I2C specification for the proper resistor  
value.)  
JTAG Port  
TCK  
I
O
I
JTAG CLK  
TDO  
JTAG Serial Data Out  
JTAG Serial Data In  
JTAG Mode Select  
A
TDI  
TMS  
I
TRST  
I
JTAG Reset  
(This lead should be pulled low if the JTAG port is not used.)  
EMU  
O
Emulation Output  
A
Clock  
CLKIN  
I
CLK/Crystal In  
XTAL  
O
O
Crystal Output  
EXTCLK  
Mode Controls  
RESET  
NMI  
External Clock Output pin/System Clock Output  
C
I
I
Reset  
Nonmaskable Interrupt  
(This lead should be pulled high when not used.)  
BMODE2–0  
PPI_CLK  
I
I
Boot Mode Strap 2–0  
PPI Clock Input  
External Regulator Control  
PG  
I
Power Good indication  
Wake up Indication  
EXT_WAKE  
O
A
Power Supplies  
ALL SUPPLIES MUST BE POWERED  
See Operating Conditions on Page 15.  
VDDEXT  
VDDINT  
GND  
P
P
I/O Power Supply  
Internal Power Supply  
G
Ground for All Supplies (Back Side of LFCSP Package.)  
Rev. A  
|
Page 14 of 44  
|
August 2011  
ADSP-BF592  
SPECIFICATIONS  
Specifications are subject to change without notice.  
OPERATING CONDITIONS  
Parameter  
Conditions  
Min  
1.1  
Nominal  
Max  
1.47  
1.47  
Unit  
V
VDDINT Internal Supply Voltage  
Internal Supply Voltage  
VDDEXT External Supply Voltage  
External Supply Voltage  
Non-Automotive Models  
Automotive Models  
Non-Automotive Models  
Automotive Models  
VDDEXT = 1.9 V  
1.33  
1.7  
V
1.8/2.5/3.3 3.6  
3.6  
V
2.7  
V
VIH  
VIHCLKIN High Level Input Voltage1, 2  
High Level Input Voltage1, 2  
1.1  
V
VDDEXT = 1.9 V  
1.2  
V
VIH  
High Level Input Voltage1, 2  
High Level Input Voltage1, 2  
VDDEXT = 2.75 V  
1.7  
V
VIH  
VDDEXT = 3.6 V  
2.0  
V
VIHCLKIN High Level Input Voltage1, 2  
VDDEXT = 3.6 V  
2.2  
V
VIHTWI  
VIL  
High Level Input Voltage3  
Low Level Input Voltage1, 2  
Low Level Input Voltage1, 2  
Low Level Input Voltage1, 2  
Low Level Input Voltage3  
Junction Temperature  
VDDEXT = 1.90 V/2.75 V/3.6 V  
VDDEXT = 1.7 V  
0.7 × VDDEXT  
3.6  
0.6  
0.7  
0.8  
V
V
VIL  
VDDEXT = 2.25 V  
V
VIL  
VDDEXT = 3.0 V  
V
VILTWI  
TJ  
VDDEXT = Minimum  
64-Lead LFCSP @ TAMBIENT = 0°C to +70°C  
64-Lead LFCSP @ TAMBIENT = –40°C to +85°C  
0.3 × VDDEXT  
V
0
80  
°C  
°C  
°C  
TJ  
Junction Temperature  
–40  
95  
TJ  
Junction Temperature  
64-Lead LFCSP @ TAMBIENT = –40°C to +105°C –40  
115  
1 Bidirectional leads (PF15–0, PG15–0) and input leads (TCK, TDI, TMS, TRST, CLKIN, RESET, NMI, and BMODE2–0) of the ADSP-BF592 processor are 3.3 V tolerant  
(always accept up to 3.6 V maximum VIH). Voltage compliance (on outputs, VOH) is limited by the VDDEXT supply voltage.  
2 Parameter value applies to all input and bidirectional leads, except SDA and SCL.  
3 Parameter applies to SDA and SCL.  
Rev. A  
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Page 15 of 44  
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August 2011  
ADSP-BF592  
ADSP-BF592 Clock Related Operating Conditions  
Table 8 describes the core clock timing requirements for the  
ADSP-BF592 processor. Take care in selecting MSEL, SSEL, and  
CSEL ratios so as not to exceed the maximum core clock and  
system clock (see Table 10). Table 9 describes phase-locked loop  
operating conditions.  
Table 8. Core Clock (CCLK) Requirements  
Parameter  
Max CCLK  
Frequency  
400  
300  
2501  
Min VDDINT  
1.33 V  
Nom VDDINT  
1.400 V  
Unit  
MHz  
MHz  
MHz  
fCCLK  
Core Clock Frequency (All Models)  
Core Clock Frequency (Industrial/Commercial Models)  
1.16 V  
1.225 V  
Core Clock Frequency (Industrial/Commercial Models)  
1.10 V  
1.150 V  
1 See the Ordering Guide on Page 43.  
Table 9. Phase-Locked Loop Operating Conditions  
Parameter  
fVCO  
Min  
72  
Max  
Unit  
MHz  
Voltage Controlled Oscillator (VCO) Frequency  
(Non-Automotive Models)  
Instruction Rate1  
Voltage Controlled Oscillator (VCO) Frequency  
(Automotive Models)  
84  
Instruction Rate1  
MHz  
1 See the Ordering Guide on Page 43.  
Table 10. Maximum SCLK Conditions  
Parameter1  
VDDEXT 1.8 V/2.5 V/3.3 V Nominal  
Unit  
fSCLK  
CLKOUT/SCLK Frequency (VDDINT 1.16 V )  
CLKOUT/SCLK Frequency (VDDINT <1.16 V )  
100  
80  
MHz  
MHz  
1 fSCLK must be less than or equal to fCCLK  
.
Rev. A  
|
Page 16 of 44  
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August 2011  
ADSP-BF592  
ELECTRICAL CHARACTERISTICS  
Parameter  
Test Conditions  
Min  
1.35  
2.0  
Typical  
Max  
Unit  
VOH  
VOH  
VOH  
VOL  
High Level Output Voltage  
High Level Output Voltage  
High Level Output Voltage  
Low Level Output Voltage  
VDDEXT = 1.7 V, IOH = –0.5 mA  
VDDEXT = 2.25 V, IOH = –0.5 mA  
VDDEXT = 3.0 V, IOH = –0.5 mA  
V
V
V
V
2.4  
VDDEXT = 1.7 V/2.25 V/3.0 V,  
IOL = 2.0 mA  
0.4  
0.4  
VOLTWI  
Low Level Output Voltage  
VDDEXT = 1.7 V/2.25 V/3.0 V,  
IOL = 2.0 mA  
V
V
IIH  
High Level Input Current1  
Low Level Input Current1  
High Level Input Current JTAG2  
Three-State Leakage Current3  
Three-State Leakage Current4  
Three-State Leakage Current3  
Input Capacitance5  
VDDEXT =3.6 V, VIN = 3.6 V  
VDDEXT =3.6 V, VIN = 0 V  
10  
10  
50  
10  
10  
10  
86  
μA  
μA  
μA  
μA  
μA  
μA  
pF  
mA  
IIL  
IIHP  
VDDEXT = 3.6 V, VIN = 3.6 V  
VDDEXT = 3.6 V, VIN = 3.6 V  
VDDEXT =3.0 V, VIN = 3.6 V  
VDDEXT = 3.6 V, VIN = 0 V  
10  
IOZH  
IOZHTWI  
IOZL  
CIN  
fIN = 1 MHz, TAMBIENT = 25°C, VIN = 2.5 V  
4
7
IDDDEEPSLEEP  
VDDINT Current in Deep Sleep Mode VDDINT = 1.2 V, fCCLK = 0 MHz,  
fSCLK = 0 MHz, TJ = 25°C, ASF = 0.00  
0.8  
IDDSLEEP  
IDD-IDLE  
IDD-TYP  
VDDINT Current in Sleep Mode  
VDDINT Current in Idle  
VDDINT Current  
VDDINT = 1.2 V, fSCLK = 25 MHz,  
TJ = 25°C  
4
mA  
mA  
mA  
mA  
mA  
ꢀA  
VDDINT = 1.2 V, fCCLK = 50 MHz,  
TJ = 25°C, ASF = 0.35  
6
VDDINT = 1.3 V, fCCLK = 200 MHz,  
TJ = 25°C, ASF = 1.00  
40  
66  
91  
20  
IDD-TYP  
VDDINT Current  
VDDINT = 1.3 V, fCCLK = 300 MHz,  
TJ = 25°C, ASF = 1.00  
IDD-TYP  
VDDINT Current  
VDDINT = 1.4 V, fCCLK = 400 MHz,  
TJ = 25°C, ASF = 1.00  
7
7
IDDHIBERNATE  
Hibernate State Current  
VDDEXT =3.3 V, TJ = 25°C,  
CLKIN = 0 MHz with voltage  
regulator off (VDDINT = 0 V)  
IDDDEEPSLEEP  
VDDINT Current in Deep Sleep Mode fCCLK = 0 MHz, fSCLK = 0 MHz  
VDDINT Current fCCLK > 0 MHz, fSCLK 0 MHz  
Table 12  
mA  
mA  
8
IDDINT  
Table 12 +  
(Table 13 × ASF)  
1 Applies to input pins.  
2 Applies to JTAG input pins (TCK, TDI, TMS, TRST).  
3 Applies to three-statable pins.  
4 Applies to bidirectional pins SCL and SDA.  
5 Applies to all signal pins.  
6 Guaranteed, but not tested.  
7 See the ADSP-BF59x Blackfin Processor Hardware Reference Manual for definitions of sleep, deep sleep, and hibernate operating modes.  
8 See Table 11 for the list of IDDINT power vectors covered.  
Rev. A  
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Page 17 of 44  
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August 2011  
ADSP-BF592  
Total Power Dissipation  
Total power dissipation has two components:  
1. Static, including leakage current  
2. Dynamic, due to transistor switching characteristics  
The ASF is combined with the CCLK frequency and VDDINT  
dependent data in Table 13 to calculate this part. The second  
part is due to transistor switching in the system clock (SCLK)  
domain, which is included in the IDDINT specification equation.  
Many operating conditions can also affect power dissipation,  
including temperature, voltage, operating frequency, and pro-  
cessor activity. Electrical Characteristics on Page 17 shows the  
current dissipation for internal circuitry (VDDINT). IDDDEEPSLEEP  
specifies static power dissipation as a function of voltage  
(VDDINT) and temperature (see Table 12), and IDDINT specifies the  
total power specification for the listed test conditions, including  
the dynamic component as a function of voltage (VDDINT) and  
frequency (Table 13).  
There are two parts to the dynamic component. The first part is  
due to transistor switching in the core clock (CCLK) domain.  
This part is subject to an Activity Scaling Factor (ASF), which  
represents application code running on the processor core and  
L1 memories (Table 11).  
Table 11. Activity Scaling Factors (ASF)1  
IDDINT Power Vector  
IDD-PEAK  
Activity Scaling Factor (ASF)  
1.29  
1.26  
1.00  
0.83  
0.66  
0.33  
IDD-HIGH  
IDD-TYP  
IDD-APP  
IDD-NOP  
IDD-IDLE  
1 See Estimating Power for ASDP-BF534/BF536/BF537 Blackfin Processors  
(EE-297). The power vector information also applies to the ADSP-BF592  
processor.  
Table 12. Static Current - IDD-DEEPSLEEP (mA)  
1
Voltage (VDDINT  
)
TJ (°C)1  
1.15 V  
0.85  
1.20 V  
0.98  
1.25 V  
1.13  
1.30 V  
1.29  
2.16  
3.5  
1.35 V  
1.46  
1.40 V  
1.62  
1.45 V  
1.85  
1.50 V  
2.07  
25  
40  
1.57  
1.8  
2.01  
2.51  
2.74  
3.05  
3.36  
55  
2.57  
2.88  
3.2  
3.84  
4.22  
4.63  
5.05  
70  
4.04  
4.45  
4.86  
5.3  
5.81  
6.31  
6.87  
7.45  
85  
6.52  
7.12  
7.73  
8.36  
12.24  
17.71  
9.09  
9.86  
10.67  
15.37  
21.96  
11.54  
16.55  
23.56  
100  
115  
9.67  
10.51  
15.29  
11.37  
16.45  
13.21  
19.05  
14.26  
20.45  
14.18  
1 Valid temperature and voltage ranges are model-specific. See Operating Conditions on Page 15.  
Table 13. Dynamic Current in CCLK Domain (mA, with ASF = 1.0)1  
2
fCCLK  
Voltage (VDDINT  
1.30 V  
N/A  
)
(MHz)2  
1.15 V  
N/A  
1.20 V  
N/A  
1.25 V  
N/A  
1.35 V  
85.31  
75.41  
66.14  
55.68  
45.81  
25.97  
1.40 V  
88.96  
78.70  
69.02  
58.17  
47.85  
26.64  
1.45 V  
92.81  
82.07  
71.93  
60.69  
49.97  
27.92  
1.50 V  
96.63  
85.46  
75.05  
63.23  
52.09  
29.98  
400  
350  
300  
250  
200  
100  
N/A  
N/A  
N/A  
72.08  
63.22  
53.19  
43.79  
24.98  
N/A  
57.52  
48.43  
39.80  
22.56  
60.38  
50.76  
41.76  
23.78  
46.10  
37.86  
21.45  
1 The values are not guaranteed as stand-alone maximum specifications. They must be combined with static current per the equations of Electrical Characteristics on Page 17.  
2 Valid frequency and voltage ranges are model-specific. See Operating Conditions on Page 15 and Table 8 on Page 16.  
Rev. A  
|
Page 18 of 44  
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August 2011  
ADSP-BF592  
Table 16. Note that the VOH and VOL specifications have separate  
per-pin maximum current requirements, see the Electrical  
Characteristics table.  
ABSOLUTE MAXIMUM RATINGS  
Stresses greater than those listed in Table 14 may cause perma-  
nent damage to the device. These are stress ratings only.  
Functional operation of the device at these or any other condi-  
tions greater than those indicated in the operational sections of  
this specification is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device  
reliability.  
Table 16. Total Current Pin Groups–VDDEXT Groups  
Group Pins in Group  
1
PF0, PF1, PF2, PF3  
2
PF4, PF5, PF6, PF7  
3
PF8, PF9, PF10, PF11  
Table 14. Absolute Maximum Ratings  
4
PF12, PF13, PF14, PF15  
PG3, PG2, PG1, PG0  
Parameter  
Rating  
5
Internal Supply Voltage (VDDINT  
)
1.16 V to +1.47 V  
6
PG7, PG6, PG5, PG4  
External (I/O) Supply Voltage (VDDEXT) 0.3 V to +3.8 V  
7
PG11, PG10, PG9, PG8  
Input Voltage1, 2  
–0.5 V to +3.6 V  
–0.5 V to VDDEXT +0.5 V  
55 mA (Max)  
8
PG15, PG14, PG13, PG12  
TDI, TDO, EMU, TCK, TRST, TMS  
BMODE2, BMODE1, BMODE0  
EXT_WAKE, PG, RESET, NMI, PPI_CLK, EXTCLK  
SDA, SCL, CLKIN, XTAL  
Output Voltage Swing  
9
I
I
OH/IOL Current per Pin Group  
10  
11  
12  
OH/IOL Current per Individual Pin  
25 mA (Max)  
Storage Temperature Range  
–65°C to +150°C  
Junction Temperature While Biased +110°C  
(Non-Automotive Models)  
ESD SENSITIVITY  
Junction Temperature While Biased +115°C  
(Automotive Models)  
1 Applies to 100% transient duty cycle. For other duty cycles see Table 15.  
2 Applies only when VDDEXT is within specifications. When VDDEXT is outside speci-  
fications, the range is VDDEXT 0.2 Volts.  
ESD (electrostatic discharge) sensitive device.  
Charged devices and circuit boards can discharge  
without detection. Although this product features  
patented or proprietary circuitry, damage may occur  
on devices subjected to high energy ESD. Therefore,  
proper ESD precautions should be taken to avoid  
performance degradation or loss of functionality.  
Table 15. Maximum Duty Cycle for Input Transient Voltage1  
VIN Min (V)2  
–0.5  
VIN Max (V)2  
+3.8  
Maximum Duty Cycle3  
100%  
40%  
25%  
15%  
10%  
–0.7  
+4.0  
–0.8  
+4.1  
–0.9  
+4.2  
–1.0  
+4.3  
1 Applies to all signal pins with the exception of CLKIN, XTAL, EXT_WAKE.  
2 The individual values cannot be combined for analysis of a single instance of  
overshoot or undershoot. The worst case observed value must fall within one of  
the voltages specified, and the total duration of the overshoot or undershoot  
(exceeding the 100% case) must be less than or equal to the corresponding duty  
cycle.  
3 Duty cycle refers to the percentage of time the signal exceeds the value for the  
100% case. The is equivalent to the measured duration of a single instance of  
overshoot or undershoot as a percentage of the period of occurrence.  
Table 14 specifies the maximum total source/sink (IOH/IOL) cur-  
rent for a group of pins and for individual pins. Permanent  
damage can occur if this value is exceeded. To understand this  
specification, if pins PF0 and PF1 from Group 1 in Table 16  
were sourcing or sinking 10 mA each, the total current for those  
pins would be 20 mA. This would allow up to 35 mA total that  
could be sourced or sunk by the remaining pins in the group  
without damaging the device. It should also be noted that the  
maximum source or sink current for an individual pin cannot  
exceed 25 mA. The list of all groups and their pins are shown in  
Rev. A  
|
Page 19 of 44  
|
August 2011  
ADSP-BF592  
PACKAGE INFORMATION  
The information presented in Figure 6 and Table 17 provides  
details about the package branding for the ADSP-BF592 proces-  
sor. For a complete listing of product availability, see Ordering  
Guide on Page 43.  
a
ADSP-BF592  
tppZccc  
vvvvvv.x n.n  
#yyww country_of_origin  
B
Figure 6. Product Information on Package  
Table 17. Package Brand Information  
Brand Key  
ADSP-BF592  
Field Description  
Product Name  
t
Temperature Range  
Package Type  
pp  
Z
RoHS Compliant Designation  
See Ordering Guide  
Assembly Lot Code  
Silicon Revision  
ccc  
vvvvvv.x  
n.n  
#
RoHS Compliance Designator  
Date Code  
yyww  
Rev. A  
|
Page 20 of 44  
|
August 2011  
ADSP-BF592  
TIMING SPECIFICATIONS  
Specifications are subject to change without notice.  
Clock and Reset Timing  
Table 18 and Figure 7 describe clock and reset operations. Per  
the CCLK and SCLK timing specifications in Table 8 to  
Table 10, combinations of CLKIN and clock multipliers must  
not select core/peripheral clocks in excess of the processor’s  
instruction rate.  
Table 18. Clock and Reset Timing  
VDDEXT 1.8 V Nominal  
Max  
VDDEXT 2.5 V/3.3 V Nominal  
Parameter  
Min  
Min  
Max  
Unit  
Timing Requirements  
fCKIN  
CLKIN Period1, 2, 3, 4  
12  
10  
10  
50  
12  
50  
MHz  
ns  
tCKINL  
tCKINH  
tWRST  
CLKIN Low Pulse1  
10  
CLKIN High Pulse1  
RESET Asserted Pulse Width Low5  
10  
ns  
11 × tCKIN  
11 × tCKIN  
ns  
Switching Characteristic  
tBUFDLAY CLKIN to CLKBUF6 Delay  
1 Applies to PLL bypass mode and PLL non bypass mode.  
11  
10  
ns  
2 Combinations of the CLKIN frequency and the PLL clock multiplier must not exceed the allowed fVCO, fCCLK, and fSCLK settings discussed in Table 8 on Page 16 through Table 10  
on Page 16.  
3 The tCKIN period (see Figure 7) equals 1/fCKIN  
.
4 If the DF bit in the PLL_CTL register is set, the minimum fCKIN specification is 24 MHz.  
5 Applies after power-up sequence is complete. See Table 19 and Figure 8 for power-up reset timing.  
6 The ADSP-BF592 processor does not have a dedicated CLKBUF pin. Rather, the EXTCLK pin may be programmed to serve as CLKBUF or CLKOUT. This parameter applies  
when EXTCLK is programmed to output CLKBUF.  
tCKIN  
CLKIN  
tBUFDLAY  
tCKINL  
tCKINH  
tBUFDLAY  
CLKBUF  
tWRST  
RESET  
Figure 7. Clock and Reset Timing  
Rev. A  
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ADSP-BF592  
Table 19. Power-Up Reset Timing  
Parameter  
Min  
Max  
Unit  
Timing Requirements  
tRST_IN_PWR RESET Deasserted after the VDDINT, VDDEXT, and CLKIN Pins are Stable and within 3500 × tCKIN  
Specification  
ꢀs  
tRST_IN_PWR  
RESET  
CLKIN  
V
DD_SUPPLIES  
Figure 8. Power-Up Reset Timing  
Rev. A  
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August 2011  
ADSP-BF592  
Parallel Peripheral Interface Timing  
Table 20 and Figure 9 through Figure 13 describe parallel  
peripheral interface operations.  
Table 20. Parallel Peripheral Interface Timing  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5 V/3.3 V  
Parameter  
Min  
Min  
Max  
Unit  
Timing Requirements  
tPCLKW  
tPCLK  
PPI_CLK Width1  
PPI_CLK Period1  
tSCLK 1.5  
tSCLK –1.5  
ns  
ns  
2 × tSCLK 1.5  
2 × tSCLK 1.5  
Timing Requirements—GP Input and Frame Capture Modes  
tPSUD  
tSFSPE  
External Frame Sync Startup Delay2  
4 × tPCLK  
6.7  
4 × tPCLK  
6.7  
ns  
ns  
External Frame Sync Setup Before PPI_CLK  
(Nonsampling Edge for Rx, Sampling Edge for Tx)  
tHFSPE  
tSDRPE  
tHDRPE  
External Frame Sync Hold After PPI_CLK  
Receive Data Setup Before PPI_CLK  
Receive Data Hold After PPI_CLK  
1.8  
4.1  
2
1.6  
3.5  
1.6  
ns  
ns  
ns  
Switching Characteristics—GP Output and Frame Capture Modes  
tDFSPE  
tHOFSPE  
tDDTPE  
tHDTPE  
Internal Frame Sync Delay After PPI_CLK  
Internal Frame Sync Hold After PPI_CLK  
Transmit Data Delay After PPI_CLK  
Transmit Data Hold After PPI_CLK  
9.0  
8.7  
8.0  
8.0  
ns  
ns  
ns  
ns  
1.7  
2.3  
1.7  
1.9  
1 PPI_CLK frequency cannot exceed fSCLK/2  
2 The PPI port is fully enabled 4 PPI clock cycles after the PAB write to the PPI port enable bit. Only after the PPI port is fully enabled are external frame syncs and data words  
guaranteed to be received correctly by the PPI peripheral.  
PPI_CLK  
tPSUD  
PPI_FS1/2  
Figure 9. PPI with External Frame Sync Timing  
DATA SAMPLED /  
DATA SAMPLED /  
FRAME SYNC SAMPLED  
FRAME SYNC SAMPLED  
PPI_CLK  
tPCLKW  
tSFSPE  
tHFSPE  
tPCLK  
PPI_FS1/2  
PPI_DATA  
tSDRPE  
tHDRPE  
Figure 10. PPI GP Rx Mode with External Frame Sync Timing  
Rev. A  
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ADSP-BF592  
DATA DRIVEN /  
FRAME SYNC SAMPLED  
PPI_CLK  
tSFSPE  
tHFSPE  
tPCLKW  
tPCLK  
PPI_FS1/2  
PPI_DATA  
tDDTPE  
tHDTPE  
Figure 11. PPI GP Tx Mode with External Frame Sync Timing  
FRAME SYNC  
DRIVEN  
DATA  
SAMPLED  
PPI_CLK  
PPI_FS1/2  
PPI_DATA  
tDFSPE  
tPCLKW  
tHOFSPE  
tPCLK  
tSDRPE  
tHDRPE  
Figure 12. PPI GP Rx Mode with Internal Frame Sync Timing  
FRAME SYNC  
DRIVEN  
DATA  
DRIVEN  
tPCLK  
DATA  
DRIVEN  
PPI_CLK  
tDFSPE  
tPCLKW  
tHOFSPE  
PPI_FS1/2  
PPI_DATA  
tDDTPE  
tHDTPE  
Figure 13. PPI GP Tx Mode with Internal Frame Sync Timing  
Rev. A  
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ADSP-BF592  
Serial Ports  
Table 21 through Table 25 and Figure 14 through Figure 18  
describe serial port operations.  
Table 21. Serial Ports—External Clock  
VDDEXT  
1.8V Nominal  
VDDEXT  
2.5 V/3.3V Nominal  
Parameter  
Min  
Max  
Min  
Max  
Unit  
Timing Requirements  
tSFSE  
TFSx/RFSx Setup Before TSCLKx/RSCLKx1  
TFSx/RFSx Hold After TSCLKx/RSCLKx1  
Receive Data Setup Before RSCLKx1  
Receive Data Hold After RSCLKx1  
TSCLKx/RSCLKx Width  
3
3
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tHFSE  
3
3
tSDRE  
3
3
tHDRE  
tSCLKEW  
tSCLKE  
tSUDTE  
tSUDRE  
3.5  
4.5  
3
4.5  
TSCLKx/RSCLKx Period  
2 × tSCLK  
2 × tSCLK  
4 × tTSCLKE  
4 × tRSCLKE  
Start-Up Delay From SPORT Enable To First External TFSx2 4 × tTSCLKE  
Start-Up Delay From SPORT Enable To First External RFSx2 4 × tRSCLKE  
Switching Characteristics  
tDFSE  
TFSx/RFSx Delay After TSCLKx/RSCLKx  
10  
11  
10  
10  
ns  
ns  
(Internally Generated TFSx/RFSx)3  
tHOFSE  
TFSx/RFSx Hold After TSCLKx/RSCLKx  
0
0
0
0
(Internally Generated TFSx/RFSx)1  
tDDTE  
tHDTE  
Transmit Data Delay After TSCLKx1  
Transmit Data Hold After TSCLKx1  
ns  
ns  
1 Referenced to sample edge.  
2 Verified in design but untested.  
3 Referenced to drive edge.  
Table 22. Serial Ports—Internal Clock  
VDDEXT  
1.8V Nominal  
VDDEXT  
2.5 V/3.3V Nominal  
Parameter  
Min  
Max  
Min  
Max  
Unit  
Timing Requirements  
tSFSI  
tHFSI  
tSDRI  
tHDRI  
TFSx/RFSx Setup Before TSCLKx/RSCLKx1  
11.5  
–1.5  
11.5  
–1.5  
9.6  
ns  
ns  
ns  
ns  
TFSx/RFSx Hold After TSCLKx/RSCLKx1  
Receive Data Setup Before RSCLKx1  
Receive Data Hold After RSCLKx1  
–1.5  
11.3  
–1.5  
Switching Characteristics  
tSCLKIW TSCLKx/RSCLKx Width  
tDFSI  
7
8
ns  
ns  
TFSx/RFSx Delay After TSCLKx/RSCLKx  
(Internally Generated TFSx/RFSx)2  
4
4
3
3
tHOFSI  
TFSx/RFSx Hold After TSCLKx/RSCLKx  
–2  
–1.8  
–2  
–1.5  
ns  
(Internally Generated TFSx/RFSx)1  
tDDTI  
tHDTI  
Transmit Data Delay After TSCLKx1  
Transmit Data Hold After TSCLKx1  
ns  
ns  
1 Referenced to sample edge.  
2 Referenced to drive edge.  
Rev. A  
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ADSP-BF592  
DATA RECEIVE—INTERNAL CLOCK  
DATA RECEIVE—EXTERNAL CLOCK  
DRIVE EDGE SAMPLE EDGE  
DRIVE EDGE  
SAMPLE EDGE  
tSCLKE  
tSCLKIW  
tSCLKEW  
RSCLKx  
RSCLKx  
tDFSI  
tDFSE  
tHOFSI  
tHOFSE  
RFSx  
RFSx  
(OUTPUT)  
(OUTPUT)  
tSFSI  
tHFSI  
tSFSE  
tHFSE  
RFSx  
RFSx  
(INPUT)  
(INPUT)  
tHDRE  
tSDRI  
tHDRI  
tSDRE  
DRx  
DRx  
DATA TRANSMIT—INTERNAL CLOCK  
DRIVE EDGE  
DATA TRANSMIT—EXTERNAL CLOCK  
DRIVE EDGE SAMPLE EDGE  
SAMPLE EDGE  
tSCLKE  
tSCLKIW  
tSCLKEW  
TSCLKx  
TSCLKx  
tDFSI  
tDFSE  
tHOFSI  
tHOFSE  
TFSx  
TFSx  
(OUTPUT)  
(OUTPUT)  
tSFSI  
tHFSI  
tSFSE  
tHFSE  
TFSx  
TFSx  
(INPUT)  
(INPUT)  
tDDTI  
tDDTE  
tHDTI  
tHDTE  
DTx  
DTx  
Figure 14. Serial Ports  
TSCLKx  
(INPUT)  
tSUDTE  
TFSx  
(INPUT)  
RSCLKx  
(INPUT)  
tSUDRE  
RFSx  
(INPUT)  
FIRST  
TSCLKx/RSCLKx  
EDGE AFTER  
SPORT ENABLED  
Figure 15. Serial Port Start Up with External Clock and Frame Sync  
Rev. A  
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ADSP-BF592  
Table 23. Serial Ports—Enable and Three-State  
VDDEXT  
1.8V Nominal  
VDDEXT  
2.5 V/3.3V Nominal  
Parameter  
Switching Characteristics  
Min  
0
Max  
Min  
Max  
Unit  
tDTENE  
tDDTTE  
tDTENI  
tDDTTI  
Data Enable Delay from External TSCLKx1  
Data Disable Delay from External TSCLKx1  
Data Enable Delay from Internal TSCLKx1  
Data Disable Delay from Internal TSCLKx1  
0
ns  
ns  
ns  
ns  
tSCLK + 1  
tSCLK + 1  
tSCLK + 1  
tSCLK + 1  
–2  
–2  
1 Referenced to drive edge.  
DRIVE EDGE  
DRIVE EDGE  
TSCLKx  
DTx  
tDTENE/I  
tDDTTE/I  
Figure 16. Serial Ports — Enable and Three-State  
Rev. A  
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ADSP-BF592  
Table 24. Serial Ports—External Late Frame Sync  
VDDEXT  
1.8V Nominal  
VDDEXT  
2.5 V/3.3V Nominal  
Parameter  
Min  
Max  
Min  
Max  
Unit  
Switching Characteristics  
tDDTLFSE  
Data Delay from Late External TFSx  
12  
10  
ns  
ns  
or External RFSx in multi-channel mode with MFD = 01, 2  
tDTENLFSE  
Data Enable from External RFSx in multi-channel mode with 0  
0
MFD = 01, 2  
1 When in multi-channel mode, TFSx enable and TFSx valid follow tDTENLFSE and tDDTLFSE  
.
2 If external RFSx/TFSx setup to RSCLKx/TSCLKx > tSCLKE/2 then tDDTTE/I and tDTENE/I apply, otherwise tDDTLFSE and tDTENLFSE apply.  
EXTERNAL RFSx IN MULTI-CHANNEL MODE  
DRIVE  
EDGE  
SAMPLE  
EDGE  
DRIVE  
EDGE  
RSCLKx  
RFSx  
tDDTLFSE  
tDTENLFSE  
DTx  
1ST BIT  
LATE EXTERNAL TFSx  
DRIVE  
EDGE  
SAMPLE  
EDGE  
DRIVE  
EDGE  
TSCLKx  
TFSx  
tDDTLFSE  
DTx  
1ST BIT  
Figure 17. Serial Ports — External Late Frame Sync  
Rev. A  
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August 2011  
ADSP-BF592  
Table 25. Serial Ports—Gated Clock Mode  
VDDEXT  
1.8V Nominal  
VDDEXT  
2.5 V/3.3 V Nominal  
Parameter  
Min  
Max  
Min  
Max  
Unit  
Timing Requirements  
tSDRI  
tHDRI  
Receive Data Setup Before TSCLKx  
Receive Hold After TSCLKx  
11.3  
0
8.7  
0
ns  
ns  
Switching Characteristics  
tDDTI  
Transmit Data Delay After TSCLKx  
3
3
ns  
ns  
ns  
ns  
tHDTI  
Transmit Data Hold After TSCLKx  
–1.8  
–1.8  
tDFTSCLKCNV  
tDCNVLTSCLK  
First TSCLKx edge delay after TFSx/TMR1 Low  
TFSx/TMR1 High Delay After Last TSCLKx Edge  
0.5 × tTSCLK – 3  
tTSCLK – 3  
0.5 × tTSCLK – 3  
tTSCLK – 3  
GATED CLOCK MODE DATA RECEIVE  
TSCLKx  
(OUT)  
tSDRI  
tHDRI  
DRx  
DELAY TIME DATA TRANSMIT  
TFS/TMR  
(OUT)  
tDFTSCLKCNV  
tDCNVLTSCLK  
TSCLKx  
(OUT)  
tDCNVLTSCLK  
tDFTSCLKCNV  
TSCLKx  
(OUT)  
tDDTI  
tHDTI  
DTx  
Figure 18. Serial Ports Gated Clock Mode  
Rev. A  
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August 2011  
ADSP-BF592  
Serial Peripheral Interface (SPI) Port—Master Timing  
Table 26 and Figure 19 describe SPI port master operations.  
Table 26. Serial Peripheral Interface (SPI) Port—Master Timing  
VDDEXT  
1.8V Nominal  
VDDEXT  
2.5 V/3.3V Nominal  
Parameter  
Min  
Max  
Min  
Max  
Unit  
Timing Requirements  
tSSPIDM  
tHSPIDM  
Data Input Valid to SCK Edge (Data Input Setup)  
SCK Sampling Edge to Data Input Invalid  
11.6  
–1.5  
9.6  
ns  
ns  
–1.5  
Switching Characteristics  
tSDSCIM  
tSPICHM  
tSPICLM  
tSPICLK  
SPI_SELx low to First SCK Edge  
2 × tSCLK – 1.5  
2 × tSCLK – 1.5  
2 × tSCLK – 1.5  
4 × tSCLK – 1.5  
2 × tSCLK – 2  
2 × tSCLK – 1.5  
0
2 × tSCLK – 1.5  
2 × tSCLK – 1.5  
2 × tSCLK – 1.5  
4 × tSCLK – 1.5  
2 × tSCLK – 1.5  
2 × tSCLK – 1.5  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Serial Clock High Period  
Serial Clock Low Period  
Serial Clock Period  
tHDSM  
Last SCK Edge to SPI_SELx High  
Sequential Transfer Delay  
tSPITDM  
tDDSPIDM  
tHDSPIDM  
SCK Edge to Data Out Valid (Data Out Delay)  
SCK Edge to Data Out Invalid (Data Out Hold)  
6
6
–1  
–1  
SPIxSELy  
(OUTPUT)  
tSDSCIM  
tSPICLM  
tSPICHM  
tSPICLK  
tHDSM  
tSPITDM  
SPIxSCK  
(OUTPUT)  
tHDSPIDM  
tDDSPIDM  
SPIxMOSI  
(OUTPUT)  
tSSPIDM  
CPHA = 1  
tHSPIDM  
SPIxMISO  
(INPUT)  
tHDSPIDM  
tDDSPIDM  
SPIxMOSI  
(OUTPUT)  
tSSPIDM  
tHSPIDM  
CPHA = 0  
SPIxMISO  
(INPUT)  
Figure 19. Serial Peripheral Interface (SPI) Port—Master Timing  
Rev. A  
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ADSP-BF592  
Serial Peripheral Interface (SPI) Port—Slave Timing  
Table 27 and Figure 20 describe SPI port slave operations.  
Table 27. Serial Peripheral Interface (SPI) Port—Slave Timing  
VDDEXT  
1.8V Nominal  
VDDEXT  
2.5 V/3.3V Nominal  
Parameter  
Min  
Max  
Min  
Max  
Unit  
Timing Requirements  
tSPICHS  
tSPICLS  
tSPICLK  
tHDS  
Serial Clock High Period  
2 × tSCLK – 1.5  
2 × tSCLK – 1.5  
4 × tSCLK  
2 × tSCLK – 1.5  
2 × tSCLK – 1.5  
4 × tSCLK  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Serial Clock Low Period  
Serial Clock Period  
Last SCK Edge to SPI_SS Not Asserted  
Sequential Transfer Delay  
2 × tSCLK – 1.5  
2 × tSCLK – 1.5  
2 × tSCLK – 1.5  
1.6  
2 × tSCLK – 1.5  
2 × tSCLK – 1.5  
2 × tSCLK – 1.5  
1.6  
tSPITDS  
tSDSCI  
tSSPID  
tHSPID  
SPI_SS Assertion to First SCK Edge  
Data Input Valid to SCK Edge (Data Input Setup)  
SCK Sampling Edge to Data Input Invalid  
2
1.6  
Switching Characteristics  
tDSOE  
SPI_SS Assertion to Data Out Active  
0
0
12  
11  
10  
0
0
10.3  
9
ns  
ns  
ns  
ns  
tDSDHI  
tDDSPID  
tHDSPID  
SPI_SS Deassertion to Data High Impedance  
SCK Edge to Data Out Valid (Data Out Delay)  
SCK Edge to Data Out Invalid (Data Out Hold)  
10  
0
0
SPIxSS  
(INPUT)  
tSDSCI  
tSPICLS  
tSPICHS  
tSPICLK  
tHDS  
tSPITDS  
SPIxSCK  
(INPUT)  
tDSOE  
tDDSPID  
tHDSPID  
tDDSPID  
tDSDHI  
SPIxMISO  
(OUTPUT)  
CPHA = 1  
tSSPID  
tHSPID  
SPIxMOSI  
(INPUT)  
tDSOE  
tHDSPID  
tDDSPID  
tDSDHI  
SPIxMISO  
(OUTPUT)  
tHSPID  
CPHA = 0  
tSSPID  
SPIxMOSI  
(INPUT)  
Figure 20. Serial Peripheral Interface (SPI) Port—Slave Timing  
Rev. A  
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ADSP-BF592  
Universal Asynchronous Receiver-Transmitter  
(UART) Ports—Receive and Transmit Timing  
The UART ports receive and transmit operations are described  
in the ADSP-BF59x Hardware Reference Manual.  
General-Purpose Port Timing  
Table 28 and Figure 21 describe general-purpose  
port operations.  
Table 28. General-Purpose Port Timing  
VDDEXT 1.8V/2.5 V/3.3V Nominal  
Parameter  
Timing Requirement  
Min  
tSCLK + 1  
0
Max  
Unit  
ns  
tWFI  
Switching Characteristics  
tGPOD General-Purpose Port Pin Output Delay from CLKOUT Low  
General-Purpose Port Pin Input Pulse Width  
11  
ns  
CLKOUT  
GPIO OUTPUT  
GPIO INPUT  
tGPOD  
tWFI  
Figure 21. General-Purpose Port Timing  
Rev. A  
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ADSP-BF592  
Timer Cycle Timing  
Table 29 and Figure 22 describe timer expired operations. The  
input signal is asynchronous in “width capture mode” and  
“external clock mode” and has an absolute maximum input fre-  
quency of (fSCLK/2) MHz.  
Table 29. Timer Cycle Timing  
VDDEXT  
1.8V Nominal  
VDDEXT  
2.5 V/3.3V Nominal  
Parameter  
Min  
Max  
Min  
Max  
Unit  
Timing Requirements  
tWL  
Timer Pulse Width Input Low  
(Measured In SCLK Cycles)1  
1 × tSCLK  
1 × tSCLK  
1 × tSCLK  
1 × tSCLK  
ns  
ns  
tWH  
Timer Pulse Width Input High  
(Measured In SCLK Cycles)1  
tTIS  
tTIH  
Timer Input Setup Time Before CLKOUT Low2  
Timer Input Hold Time After CLKOUT Low2  
10  
–2  
8
ns  
ns  
–2  
Switching Characteristics  
tHTO Timer Pulse Width Output  
1 × tSCLK – 2 (232 – 1) × tSCLK  
tSCLK – 1.5  
(232 – 1) × tSCLK ns  
(Measured In SCLK Cycles)  
tTOD  
Timer Output Update Delay After CLKOUT High  
6
6 ns  
1 The minimum pulse widths apply for TMRx signals in width capture and external clock modes. They also apply to the PG0 or PPI_CLK signals in PWM output mode.  
2 Either a valid setup and hold time or a valid pulse width is sufficient. There is no need to resynchronize programmable flag inputs.  
CLKOUT  
tTOD  
TMRx OUTPUT  
tTIS  
tTIH  
tHTO  
TMRx INPUT  
tWH,tWL  
Figure 22. Timer Cycle Timing  
Timer Clock Timing  
Table 30 and Figure 23 describe timer clock timing.  
Table 30. Timer Clock Timing  
VDDEXT = 1.8 V  
Max  
VDDEXT = 2.5V/3.3 V  
Max  
Parameter  
Min  
Min  
Unit  
Switching Characteristic  
tTODP  
Timer Output Update Delay After PPI_CLK High  
12.64  
12.64  
ns  
PPI_CLK  
tTODP  
TMRx OUTPUT  
Figure 23. Timer Clock Timing  
Rev. A  
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August 2011  
ADSP-BF592  
JTAG Test And Emulation Port Timing  
Table 31 and Figure 24 describe JTAG port operations.  
Table 31. JTAG Port Timing  
VDDEXT  
1.8V Nominal  
VDDEXT  
2.5 V/3.3V Nominal  
Parameter  
Min  
Max  
Min  
Max  
Unit  
Timing Requirements  
tTCK  
TCK Period  
20  
4
20  
4
ns  
tSTAP  
tHTAP  
tSSYS  
tHSYS  
tTRSTW  
TDI, TMS Setup Before TCK High  
TDI, TMS Hold After TCK High  
System Inputs Setup Before TCK High1  
System Inputs Hold After TCK High1  
TRST Pulse Width2 (measured in TCK cycles)  
ns  
4
4
ns  
4
5
ns  
5
5
ns  
4
4
TCK  
Switching Characteristics  
tDTDO TDO Delay from TCK Low  
tDSYS  
System Outputs Delay After TCK Low3  
10  
13  
10  
13  
ns  
ns  
1 System inputs = SCL, SDA, PF15–0, PG15–0, PH2–0, TCK, NMI, BMODE3–0, PG.  
2 50 MHz maximum  
3 System outputs = CLKOUT, SCL, SDA, PF15–0, PG15–0, PH2–0, TDO, EMU, EXT_WAKE.  
tTCK  
TCK  
tSTAP  
tHTAP  
TMS  
TDI  
tDTDO  
TDO  
tSSYS  
tHSYS  
SYSTEM  
INPUTS  
tDSYS  
SYSTEM  
OUTPUTS  
Figure 24. JTAG Port Timing  
Rev. A  
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August 2011  
ADSP-BF592  
OUTPUT DRIVE CURRENTS  
Figure 25 through Figure 33 show typical current-voltage char-  
acteristics for the output drivers of the ADSP-BF592 processor.  
The curves represent the current drive capability of the output  
drivers. See Table 7 on Page 13 for information about which  
driver type corresponds to a particular pin.  
40  
30  
VDDEXT = 1.9V @ – 40  
VDDEXT = 1.8V @ 25  
°C  
°
C
VDDEXT = 1.7V @ 105°C  
20  
V
OH  
10  
120  
0
VDDEXT = 3.0V @ – 40  
VDDEXT = 3.3V @ 25  
VDDEXT = 3.6V @ 105  
°C  
100  
°
C
–10  
–20  
–30  
–40  
80  
60  
°C  
V
OL  
40  
V
OH  
20  
0
–20  
–40  
–60  
–80  
–100  
0
0.5  
1.0  
1.5  
SOURCE VOLTAGE (V)  
V
OL  
Figure 27. Driver Type A Current (1.8V VDDEXT  
)
120  
100  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
VDDEXT = 3.6V @ – 40  
VDDEXT = 3.3V @ 25  
DDEXT = 3.0V @ 105°C  
°C  
SOURCE VOLTAGE (V)  
°
C
80  
60  
V
Figure 25. Driver Type A Current (3.3V VDDEXT  
)
40  
20  
80  
VDDEXT = 2.75V @ – 40  
VDDEXT = 2.5V @ 25  
°C  
0
°C  
60  
40  
20  
–20  
–40  
–60  
–80  
–100  
–120  
V
DDEXT = 2.25V @ 105°C  
V
OL  
V
OH  
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
–20  
SOURCE VOLTAGE (V)  
–40  
–60  
V
Figure 28. Driver Type B Current (3.3V VDDEXT  
)
OL  
80  
–80  
VDDEXT = 2.75V @ – 40  
VDDEXT = 2.5V @ 25  
°C  
0
0.5  
1.0  
1.5  
2.0  
2.5  
°C  
60  
40  
20  
SOURCE VOLTAGE (V)  
V
DDEXT = 2.25V @ 105°C  
Figure 26. Drive Type A Current (2.5V VDDEXT  
)
0
–20  
–40  
–60  
V
OL  
–80  
0
0.5  
1.0  
1.5  
2.0  
2.5  
SOURCE VOLTAGE (V)  
Figure 29. Driver Type B Current (2.5V VDDEXT  
)
Rev. A  
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|
August 2011  
ADSP-BF592  
60  
50  
40  
VDDEXT = 1.9V @ – 40  
VDDEXT = 1.8V @ 25  
°C  
VDDEXT = 1.9V @ – 40  
°C  
°
C
VDDEXT = 1.8V @ 25  
°C  
40  
20  
VDDEXT = 1.7V @ 105°C  
VDDEXT = 1.7V @ 105°C  
30  
20  
V
OH  
10  
0
–20  
–40  
–60  
0
–10  
–20  
–30  
–40  
V
OL  
V
OL  
–50  
0
0
0.5  
1.0  
1.5  
0.5  
1.0  
1.5  
SOURCE VOLTAGE (V)  
SOURCE VOLTAGE (V)  
Figure 33. Driver Type C Current (1.8V VDDEXT  
)
Figure 30. Driver Type B Current (1.8V VDDEXT  
)
TEST CONDITIONS  
All timing parameters appearing in this data sheet were mea-  
sured under the conditions described in this section. Figure 34  
shows the measurement point for ac measurements (except out-  
put enable/disable). The measurement point VMEAS is VDDEXT/2  
for VDDEXT (nominal) = 1.8 V/2.5 V/3.3 V.  
150  
120  
VDDEXT = 3.6V @ – 40  
VDDEXT = 3.3V @ 25  
DDEXT = 3.0V @ 105°C  
°C  
°
C
V
90  
60  
V
OH  
30  
0
– 30  
INPUT  
OR  
OUTPUT  
V
V
MEAS  
MEAS  
– 60  
– 90  
V
OL  
– 120  
Figure 34. Voltage Reference Levels for AC  
Measurements (Except Output Enable/Disable)  
– 150  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
SOURCE VOLTAGE (V)  
Output Enable Time Measurement  
Output pins are considered to be enabled when they have made  
a transition from a high impedance state to the point when they  
start driving.  
The output enable time tENA is the interval from the point when  
a reference signal reaches a high or low voltage level to the point  
when the output starts driving as shown on the right side of  
Figure 35.  
Figure 31. Driver Type C Current (3.3V VDDEXT  
)
100  
VDDEXT = 2.75V @ – 40  
VDDEXT = 2.5V @ 25  
°C  
75  
50  
°
C
V
DDEXT = 2.25V @ 105°C  
25  
0
V
OH  
REFERENCE  
SIGNAL  
– 25  
– 50  
V
tDIS_MEASURED  
tENA_MEASURED  
OL  
– 75  
tDIS  
tENA  
– 100  
V
OH  
V
(MEASURED)  
OH  
0
0.5  
1.0  
1.5  
2.0  
2.5  
(MEASURED)  
V
(MEASURED) ؊ ⌬V  
(MEASURED) + V  
OH  
V
(HIGH)  
TRIP  
SOURCE VOLTAGE (V)  
V
(LOW)  
V
V
TRIP  
OL  
V
OL  
(MEASURED)  
OL  
Figure 32. Driver Type C Current (2.5V VDDEXT  
)
(MEASURED)  
tDECAY  
tTRIP  
OUTPUT STOPS DRIVING  
OUTPUT STARTS DRIVING  
HIGH IMPEDANCE STATE  
Figure 35. Output Enable/Disable  
Rev. A  
|
Page 36 of 44  
|
August 2011  
ADSP-BF592  
The time tENA_MEASURED is the interval from when the reference  
signal switches to when the output voltage reaches VTRIP(high)  
or VTRIP(low) and is shown below.  
• VDDEXT (nominal) = 1.8 V, VTRIP (high) is 1.05 V, VTRIP  
(low) is 0.75 V  
Capacitive Loading  
Output delays and holds are based on standard capacitive loads  
of an average of 6 pF on all pins (see Figure 36). VLOAD is equal  
to (VDDEXT)/2.  
• VDDEXT (nominal) = 2.5 V, VTRIP (high) is 1.5 V, VTRIP (low)  
is 1.0 V  
• VDDEXT (nominal) = 3.3 V, VTRIP (high) is 1.9 V, VTRIP (low)  
is 1.4 V  
TESTER PIN ELECTRONICS  
50  
V
LOAD  
T1  
DUT  
OUTPUT  
45ꢂ  
70ꢂ  
Time tTRIP is the interval from when the output starts driving to  
when the output reaches the VTRIP(high) or VTRIP(low) trip  
voltage.  
ZO = 50ꢂꢃ(impedance)  
TD = 4.04 1.18 ns  
50ꢂ  
0.5pF  
4pF  
2pF  
Time tENA is calculated as shown in the equation:  
400ꢂ  
tENA = tENA_MEASURED tTRIP  
If multiple pins are enabled, the measurement value is that of  
the first lead to start driving.  
NOTES:  
THE WORST CASE TRANSMISSION LINE DELAY IS SHOWN AND CAN BE USED  
FOR THE OUTPUT TIMING ANALYSIS TO REFELECT THE TRANSMISSION LINE  
EFFECT AND MUST BE CONSIDERED.THE TRANSMISSION LINE (TD) IS FOR  
LOAD ONLY AND DOES NOT AFFECT THE DATA SHEET TIMING SPECIFICATIONS.  
Output Disable Time Measurement  
Output pins are considered to be disabled when they stop driv-  
ing, go into a high impedance state, and start to decay from their  
output high or low voltage. The output disable time tDIS is the  
difference between tDIS_MEASURED and tDECAY as shown on the left  
ANALOG DEVICES RECOMMENDS USING THE IBIS MODEL TIMING FOR A GIVEN  
SYSTEM REQUIREMENT. IF NECESSARY, A SYSTEM MAY INCORPORATE  
EXTERNAL DRIVERS TO COMPENSATE FOR ANY TIMING DIFFERENCES.  
Figure 36. Equivalent Device Loading for AC Measurements  
(Includes All Fixtures)  
side of Figure 35.  
tDIS = tDIS_MEASURED tDECAY  
The graphs of Figure 37 through Figure 42 show how output  
rise time varies with capacitance. The delay and hold specifica-  
tions given should be derated by a factor derived from these  
figures. The graphs in these figures may not be linear outside the  
ranges shown.  
The time for the voltage on the bus to decay by ΔV is dependent  
on the capacitive load CL and the load current IL. This decay  
time can be approximated by the equation:  
tDECAY = (CLΔV) ⁄ IL  
The time tDECAY is calculated with test loads CL and IL, and with  
ΔV equal to 0.25 V for VDDEXT (nominal) = 2.5 V/3.3 V and  
0.15 V for VDDEXT (nominal) = 1.8V.  
The time tDIS_MEASURED is the interval from when the reference  
signal switches to when the output voltage decays ΔV from the  
measured output high or output low voltage.  
20  
18  
tFALL  
16  
14  
tRISE  
12  
10  
Example System Hold Time Calculation  
8
6
4
To determine the data output hold time in a particular system,  
first calculate tDECAY using the equation given above. Choose ΔV  
to be the difference between the processor’s output voltage and  
the input threshold for the device requiring the hold time. CL is  
the total bus capacitance (per data line), and IL is the total leak-  
age or three-state current (per data line). The hold time will be  
tFALL = 1.8V @ 25  
°
C
2
0
tRISE = 1.8V @ 25  
°C  
0
50  
100  
150  
200  
250  
t
DECAY plus the various output disable times as specified in the  
LOAD CAPACITANCE (pF)  
Timing Specifications on Page 21.  
Figure 37. Driver Type A Typical Rise and Fall Times (10%–90%) vs.  
Load Capacitance (1.8V VDDEXT  
)
Rev. A  
|
Page 37 of 44  
|
August 2011  
ADSP-BF592  
18  
16  
14  
12  
9
8
tFALL  
tFALL  
7
6
5
tRISE  
tRISE  
10  
8
4
3
2
1
6
4
tFALL = 2.5V @ 25  
°C  
tFALL = 2.5V @ 25  
°C  
2
tRISE = 2.5V @ 25  
°
C
tRISE = 2.5V @ 25  
°C  
0
0
0
50  
100  
150  
200  
250  
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
LOAD CAPACITANCE (pF)  
Figure 38. Driver Type A Typical Rise and Fall Times (10%–90%) vs.  
Load Capacitance (2.5V VDDEXT  
Figure 41. Driver Type C Typical Rise and Fall Times (10%–90%) vs.  
Load Capacitance (2.5V VDDEXT  
)
)
16  
14  
7
tFALL  
6
5
tFALL  
12  
10  
tRISE  
tRISE  
4
3
8
6
4
2
2
1
tFALL = 3.3V @ 25  
°
C
tFALL = 3.3V @ 25  
°C  
tRISE = 3.3V @ 25  
°
C
tRISE = 3.3V @ 25  
°C  
0
0
0
50  
100  
150  
200  
250  
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
LOAD CAPACITANCE (pF)  
Figure 39. Driver Type A Typical Rise and Fall Times (10%–90%) vs.  
Load Capacitance (3.3V VDDEXT  
Figure 42. Driver Type C Typical Rise and Fall Times (10%–90%) vs.  
Load Capacitance (3.3V VDDEXT  
)
)
12  
tFALL  
10  
8
tRISE  
6
4
2
tFALL = 1.8V @ 25  
°
C
tRISE = 1.8V @ 25  
°C  
0
0
50  
100  
150  
200  
250  
LOAD CAPACITANCE (pF)  
Figure 40. Driver Type C Typical Rise and Fall Times (10%–90%) vs.  
Load Capacitance (1.8V VDDEXT  
)
Rev. A  
|
Page 38 of 44  
|
August 2011  
ADSP-BF592  
ENVIRONMENTAL CONDITIONS  
To determine the junction temperature on the application  
printed circuit board use:  
TJ = TCASE + JT × PD)  
where:  
TJ = junction temperature (°C)  
T
CASE = case temperature (°C) measured by customer at top cen-  
ter of package.  
ΨJT = from Table 32  
PD = power dissipation (see Total Power Dissipation on Page 18  
for the method to calculate PD)  
Table 32. Thermal Characteristics  
Parameter Condition  
Typical Unit  
qJA  
0 linear m/s air flow  
23.5  
20.9  
20.2  
11.2  
9.5  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
θJMA  
θJMA  
θJB  
1 linear m/s air flow  
2 linear m/s air flow  
θJC  
ΨJT  
ΨJT  
ΨJT  
0 linear m/s air flow  
1 linear m/s air flow  
2 linear m/s air flow  
0.21  
0.36  
0.43  
Values of θJA are provided for package comparison and printed  
circuit board design considerations. θJA can be used for a first  
order approximation of TJ by the equation:  
TJ = TA + JA × PD)  
where:  
TA = ambient temperature (°C)  
Values of θJC are provided for package comparison and printed  
circuit board design considerations when an external heat sink  
is required.  
Values of θJB are provided for package comparison and printed  
circuit board design considerations.  
In Table 32, airflow measurements comply with JEDEC stan-  
dards JESD51-2 and JESD51-6, and the junction-to-board  
measurement complies with JESD51-8. The junction-to-case  
measurement complies with MIL-STD-883 (Method 1012.1).  
All measurements use a 2S2P JEDEC test board.  
Rev. A  
|
Page 39 of 44  
|
August 2011  
ADSP-BF592  
64-LEAD LFCSP LEAD ASSIGNMENT  
Table 33 lists the LFCSP leads by signal mnemonic. Table 34  
lists the LFCSP by lead number.  
Table 33. 64-Lead LFCSP Lead Assignment (Alphabetical by Signal)  
Signal  
BMODE0  
BMODE1  
BMODE2  
EXTCLK/SCLK  
CLKIN  
EMU  
Lead No.  
Signal  
PF7  
Lead No.  
7
Signal  
PG6  
Lead No.  
38  
Signal  
TDO  
Lead No.  
23  
21  
20  
3
29  
28  
27  
57  
61  
19  
51  
30  
54  
63  
64  
1
PF8  
10  
PG7  
39  
TMS  
PF9  
11  
PG8  
42  
TRST  
PF10  
PF11  
PF12  
PF13  
PF14  
PF15  
PG  
12  
PG9  
43  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDEXT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
VDDINT  
XTAL  
GND*  
13  
PG10  
PG11  
PG12  
PG13  
PG14  
PG15  
PPI_CLK  
RESET  
SCL  
44  
14  
25  
35  
46  
58  
8
15  
45  
EXT_WAKE  
GND  
16  
47  
17  
48  
NMI  
18  
49  
PF0  
52  
50  
PF1  
PG0  
PG1  
PG2  
PG3  
PG4  
PG5  
31  
56  
9
PF2  
32  
53  
26  
40  
41  
55  
62  
65  
PF3  
2
33  
60  
PF4  
4
34  
SDA  
59  
PF5  
5
36  
TCK  
24  
PF6  
6
37  
TDI  
22  
* Lead no. 65 is the GND supply (see Figure 43 and Figure 44) for the processor (6.2 mm × 6.2 mm); this pad must connect to GND.  
Table 34. 64-Lead LFCSP Lead Assignment (Numerical by Lead Number)  
Lead No.  
1
Signal  
PF2  
Lead No.  
17  
Signal  
PF14  
Lead No.  
33  
Signal  
PG2  
Lead No.  
49  
Signal  
PG14  
2
PF3  
18  
PF15  
34  
PG3  
50  
PG15  
3
VDDEXT  
PF4  
19  
EMU  
35  
VDDEXT  
PG4  
51  
EXT_WAKE  
PG  
4
20  
TRST  
36  
52  
5
PF5  
21  
TMS  
37  
PG5  
53  
RESET  
NMI  
6
PF6  
22  
TDI  
38  
PG6  
54  
7
PF7  
23  
TDO  
39  
PG7  
55  
VDDINT  
PPI_CLK  
EXTCLK/SCLK  
VDDEXT  
SDA  
8
VDDINT  
VDDINT  
PF8  
24  
TCK  
40  
VDDINT  
VDDINT  
PG8  
56  
9
25  
VDDEXT  
VDDINT  
BMODE2  
BMODE1  
BMODE0  
GND  
41  
57  
10  
11  
12  
13  
14  
15  
16  
26  
42  
58  
PF9  
27  
43  
PG9  
59  
PF10  
PF11  
VDDEXT  
PF12  
PF13  
28  
44  
PG10  
PG11  
VDDEXT  
PG12  
PG13  
60  
SCL  
29  
45  
61  
CLKIN  
XTAL  
30  
46  
62  
31  
PG0  
47  
63  
PF0  
32  
PG1  
48  
64  
PF1  
GND*  
65  
* Pin no. 65 is the GND supply (see Figure 43 and Figure 44) for the processor (6.2 mm × 6.2 mm); this pad must connect to GND.  
Rev. A  
|
Page 40 of 44  
|
August 2011  
ADSP-BF592  
Figure 43 shows the top view of the LFCSP lead configuration.  
Figure 44 shows the bottom view of the LFCSP lead  
configuration.  
PIN 64  
PIN 1  
PIN 49  
PIN 48  
PIN 1 INDICATOR  
ADSP-BF592  
64-LEAD LFCSP  
TOP VIEW  
PIN 16  
PIN 33  
PIN 17  
PIN 32  
Figure 43. 64-Lead LFCSP Lead Configuration (Top View)  
PIN 49  
PIN 64  
PIN 48  
PIN 1  
ADSP-BF592  
64-LEAD  
LFCSP  
GND PAD  
(PIN 65)  
PIN 1 INDICATOR  
BOTTOM VIEW  
PIN 33  
PIN 16  
PIN 32  
PIN 17  
Figure 44. 64-Lead LFCSP Lead Configuration (Bottom View)  
Rev. A  
|
Page 41 of 44  
|
August 2011  
ADSP-BF592  
OUTLINE DIMENSIONS  
Dimensions in Figure 45 are shown in millimeters.  
0.60 MAX  
9.00  
BSC SQ  
0.60  
MAX  
PIN 1  
INDICATOR  
64  
49  
1
48  
PIN 1  
INDICATOR  
0.50  
BSC  
6.35  
6.20 SQ  
6.05  
8.75  
TOP VIEW  
EXPOSED PAD  
BSC SQ  
(BOTTOM VIEW)  
0.50  
0.40  
0.30  
33  
32  
16  
17  
0.25 MIN  
7.50  
REF  
0.80 MAX  
0.65 TYP  
12° MAX  
1.00  
0.85  
0.80  
FOR PROPER CONNECTION OF  
THE EXPOSED PAD, REFER TO  
THE LEAD ASSIGNMENT AND  
SIGNAL DESCRIPTIONS  
0.05 MAX  
0.02 NOM  
SECTIONS OF THIS DATA SHEET.  
0.30  
0.23  
0.18  
SEATING  
PLANE  
0.20 REF  
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4  
Figure 45. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ1]  
Very Thin Quad (CP-64-4)  
Dimensions shown in millimeters  
1 For information relating to the CP-64-4 package’s exposed pad, see the table endnotes on Page 40.  
Rev. A  
|
Page 42 of 44  
|
August 2011  
ADSP-BF592  
AUTOMOTIVE PRODUCTS  
The ADSP-BF592 is available with controlled manufacturing to  
support the quality and reliability requirements of automotive  
applications. Note that this automotive model may have specifi-  
cations that differ from the commercial models and designers  
should review the product specifications section of this data  
sheet carefully. Only the automotive grade products shown in  
Table 35 are available for use in automotive applications. Con-  
tact your local ADI account representative for specific product  
ordering information and to obtain the specific Automotive  
Reliability reports for these models.  
Table 35. Automotive Products  
Temperature  
Range2  
Instruction  
Rate (Max)  
Package  
Option  
Model1  
Package Description  
ADBF592WYCPZxx  
1 Z = RoHS compliant part.  
–40ºC to +105ºC  
400 MHz  
64-Lead LFCSP  
CP-64-4  
2 Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 15 for junction temperature (TJ)  
specification, which is the only temperature specification.  
ORDERING GUIDE  
Temperature  
Range3  
0ºC to +70ºC  
0ºC to +70ºC  
–40ºC to +85ºC  
Instruction  
Rate (Max)  
200 MHz  
400 MHz  
400 MHz  
Package  
Option  
CP-64-4  
CP-64-4  
CP-64-4  
Model1, 2  
Package Description  
64-Lead LFCSP  
ADSP-BF592KCPZ-2  
ADSP-BF592KCPZ  
ADSP-BF592BCPZ  
1 Z = RoHS compliant part.  
64-Lead LFCSP  
64-Lead LFCSP  
2 Available with a wide variety of audio algorithm combinations sold as part of a chipset and bundled with necessary software. For a complete list, visit our website at  
www.analog.com /Blackfin.  
3 Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 15 for junction temperature (TJ)  
specification, which is the only temperature specification.  
Rev. A  
|
Page 43 of 44  
|
August 2011  
ADSP-BF592  
©2011 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D09574-0-8/11(A)  
Rev. A  
|
Page 44 of 44  
|
August 2011  

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