ADE5569 [ADI]
Single-Phase Energy Measurement IC with 8052 MCU, RTC, and LCD Driver; 单相电能计量IC，具有8052 MCU ，RTC和LCD驱动器
| 型号： | ADE5569 |
| 厂家： | 
ADI |
| 描述： | Single-Phase Energy Measurement IC with 8052 MCU, RTC, and LCD Driver |
| 文件： | 总148页 (文件大小：1249K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Single-Phase Energy Measurement IC with
8052 MCU, RTC, and LCD Driver
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
GENERAL FEATURES
MICROPROCESSOR FEATURES
Wide supply voltage operation: 2.4 V to 3.7 V
8052-based core
Internal bipolar switch between regulated and battery inputs
Ultralow power operation with power saving modes (PSM)
Full operation: 4 mA to 1.6 mA (PLL clock dependent)
Battery mode: 3.2 mA to 400 μA (PLL clock dependent)
Sleep mode
Single-cycle 4 MIPS 8052 core
8052-compatible instruction set
32.768 kHz external crystal with on-chip PLL
Two external interrupt sources
External reset pin
Real-time clock (RTC) mode: 1.5 μA
Low power battery mode
RTC and LCD mode: 27 μA (LCD charge pump enabled)
Reference: 1.2 V 0.1% (10 ppm/°C drift)
64-lead RoHS package options
Wake-up from I/O, temperature change, alarm, and
universal asynchronous receiver/transmitter (UART)
LCD driver operation with automatic scrolling
Temperature measurement
Low profile quad flat package (LQFP)
Operating temperature range: −40°C to +85°C
Real-time clock
Counter for seconds, minutes, hours, days, months,
and years
Date counter including leap year compensation
Automatic battery switchover for RTC backup
Operation down to 2.4 V
Ultralow battery supply current: 1.5 μA
Selectable output frequency: 1 Hz to 16.384 kHz
Embedded digital crystal frequency compensation for
calibration and temperature variation 2 ppm resolution
Integrated LCD driver
108-segment driver for the ADE5566/ADE5569 and
104-segment driver for the ADE5166/ADE5169
2×, 3×, or 4× multiplexing
ENERGY MEASUREMENT FEATURES
Proprietary analog-to-digital converters (ADCs) and digital
signal processing (DSP) provide high accuracy active
(WATT), reactive (VAR), and apparent energy (VA)
measurement
Less than 0.1% error on active energy over a dynamic
range of 1000 to 1 @ 25°C
Less than 0.5% error on reactive energy over a dynamic
range of 1000 to 1 @ 25°C (ADE5569 and ADE5169 only)
Less than 0.5% error on root mean square (rms)
measurements over a dynamic range of 500 to 1 for
current (Irms) and 100 to 1 for voltage (Vrms) @ 25°C
Supports IEC 62053-21, IEC 62053-22, IEC 62053-23,
EN 50470-3 Class A, Class B, and Class C, and ANSI C12-16
Differential input with programmable gain amplifiers (PGAs)
supports shunts, current transformers, and di/dt current
sensors (ADE5569 and ADE5169 only)
Four LCD memory banks for screen scrolling
LCD voltages generated internally or with external resistors
Internal adjustable drive voltages up to 5 V independent
of power supply level
On-chip peripherals
Two current inputs for antitamper detection in the
ADE5166/ADE5169
Two independent UART interfaces
SPI or I2C
High frequency outputs proportional to Irms, active, reactive,
or apparent power (AP)
Watchdog timer
Power supply management with user-selectable levels
Memory: 62 kB flash memory, 2.256 kB RAM
Development tools
Single-pin emulation
IDE-based assembly and C-source debugging
Table 1. Features Available on Each Part
Feature
Part No.
Antitamper
WATT, VA, Irms, Vrms
VAR
ADE5166, ADE5169
ADE5166, ADE5169, ADE5566, ADE5569
ADE5169, ADE5569
ADE5169, ADE5569
di/dt Sensor
Rev. PrB
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2008 Analog Devices, Inc. All rights reserved.
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
TABLE OF CONTENTS
General Features ............................................................................... 1
Power Quality Measurements................................................... 49
Phase Compensation ................................................................. 51
RMS Calculation ........................................................................ 51
Active Power Calculation.......................................................... 54
Active Energy Calculation ........................................................ 56
Reactive Power Calculation for the ADE5569/ADE5169..... 59
Reactive Energy Calculation for the ADE5569/ADE5169 ... 60
Apparent Power Calculation..................................................... 64
Apparent Energy Calculation ................................................... 64
Ampere-Hour Accumulation ................................................... 66
Energy-to-Frequency Conversion............................................ 66
Energy Register Scaling............................................................. 67
Energy Measurement Interrupts .............................................. 67
Temperature, Battery, and Supply Voltage Measurements........ 68
Temperature Measurement....................................................... 70
Battery Measurement................................................................. 70
External Voltage Measurement ................................................ 71
8052 MCU Core Architecture....................................................... 73
MCU registers............................................................................. 73
Basic 8052 Registers................................................................... 75
Standard 8052 SFRs.................................................................... 77
Memory Overview ..................................................................... 77
Addressing Modes...................................................................... 78
Instruction Set ............................................................................ 80
Read-Modify-Write Instructions ............................................. 82
Instructions That Affect Flags .................................................. 82
Dual Data Pointers ......................................................................... 84
Interrupt System ............................................................................. 85
Standard 8052 Interrupt Architecture..................................... 85
Interrupt Architecture ............................................................... 85
Interrupt Registers...................................................................... 85
Interrupt Priority........................................................................ 86
Interrupt Flags ............................................................................ 87
Interrupt Vectors ........................................................................ 89
Interrupt Latency........................................................................ 89
Context Saving............................................................................ 89
Watchdog Timer............................................................................. 90
LCD Driver...................................................................................... 92
LCD Registers ............................................................................. 92
LCD Setup ................................................................................... 95
Energy Measurement Features........................................................ 1
Microprocessor Features.................................................................. 1
General Description......................................................................... 4
Functional Block Diagrams............................................................. 4
Specifications..................................................................................... 6
Energy Metering........................................................................... 6
Analog Peripherals ....................................................................... 7
Digital Interface............................................................................ 8
Timing Specifications ................................................................ 10
Absolute Maximum Ratings.......................................................... 15
Thermal Resistance .................................................................... 15
ESD Caution................................................................................ 15
Pin Configuration and Function Descriptions........................... 16
Terminology .................................................................................... 18
SFR Mapping................................................................................... 19
Power Management........................................................................ 21
Power Management Register Details....................................... 21
Power Supply Architecture........................................................ 24
Battery Switchover...................................................................... 24
Power Supply Management Interrupt (PSM) ......................... 25
Using the Power Supply Features ............................................. 27
Operating Modes............................................................................ 29
PSM0 (Normal Mode) ............................................................... 29
PSM1 (Battery Mode) ................................................................ 29
PSM2 (Sleep Mode).................................................................... 29
3.3 V Peripherals and Wake-Up Events................................... 30
Transitioning Between Operating Modes ............................... 31
Using the Power Management Features .................................. 31
Energy Measurement ..................................................................... 33
Access to Energy Measurement SFRs...................................... 33
Access to Internal Energy Measurement Registers................ 33
Energy Measurement Registers ................................................ 36
Energy Measurement Internal Registers Details.................... 37
Interrupt Status/Enable SFRs.................................................... 40
Analog Inputs.............................................................................. 42
Analog-to-Digital Conversion.................................................. 43
Fault Detection1 .......................................................................... 46
di/dt Current Sensor and Digital Integrator for the
ADE5569/ADE5169................................................................... 47
Rev. PrB | Page 2 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
LCD Timing and Waveforms ....................................................95
Blink Mode...................................................................................96
Scrolling Mode ............................................................................96
Display Element Control............................................................96
Voltage Generation .....................................................................97
LCD External Circuitry..............................................................97
LCD Function in PSM2..............................................................98
Flash Memory..................................................................................99
Flash Memory Overview............................................................99
Flash Memory Organization......................................................99
Using the Flash Memory......................................................... 100
Protecting the Flash Memory................................................. 103
In Circuit Programming ......................................................... 105
Timers............................................................................................ 106
Timer Registers......................................................................... 106
Timer 0 and Timer 1................................................................ 108
Timer 2 ...................................................................................... 109
PLL ................................................................................................. 111
PLL Registers ............................................................................ 111
RTC—Real-Time Clock .............................................................. 112
Access to RTC SFR................................................................... 112
Access to Internal RTC Registers........................................... 112
RTC SFR Register List ............................................................. 113
RTC Registers ........................................................................... 116
RTC Calendar........................................................................... 117
RTC Interrupts ......................................................................... 118
RTC Crystal Compensation.................................................... 119
RTC Temperature Compensation.......................................... 119
UART Serial Interface.................................................................. 121
UART Registers ........................................................................ 121
UART Operation Modes..........................................................124
UART Baud Rate Generation..................................................125
UART Additional Features ......................................................127
UART2 Serial Interface.................................................................128
UART SFR Register List ...........................................................128
UART2 Operation Mode .........................................................130
UART Baud Rate Generation..................................................130
UART Additional Features ......................................................131
Serial Peripheral Interface (SPI)..................................................132
SPI Registers ..............................................................................132
SPI Pins.......................................................................................135
SPI Master Operating Modes ..................................................136
SPI Interrupt and Status Flags.................................................137
I2C-Compatible Interface.............................................................138
Serial Clock Generation...........................................................138
Slave Addresses..........................................................................138
I2C Registers...............................................................................138
Read and Write Operations .....................................................139
I2C Receive and Transmit FIFOs.............................................140
I/O Ports.........................................................................................141
Parallel I/O.................................................................................141
I/O Registers ..............................................................................142
Port 0...........................................................................................145
Port 1...........................................................................................145
Port 2...........................................................................................145
Determining the Version of the
ADE5166/ADE5169/ADE5566/ADE5569 ................................146
Outline Dimensions......................................................................147
Ordering Guide .........................................................................147
Rev. PrB | Page 3 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
GENERAL DESCRIPTION
The ADE5166/ADE5169/ADE5566/ADE55691 integrate Analog
Devices, Inc., energy (ADE) metering IC analog front end and
fixed function DSP solution with an enhanced 8052 MCU core,
a full RTC, an LCD driver, and all the peripherals to make an
electronic energy meter with an LCD display in a single part.
The microprocessor functionality includes a single-cycle 8052 core,
a full real-time clock with a power supply backup pin, two
independent UART interfaces, and an SPI or I2C® interface. The
ready-to-use information from the ADE core reduces the program
memory size requirement, making it easy to integrate complicated
design into 62 kB of flash memory.
The ADE measurement core includes active, reactive, and apparent
energy calculations, as well as voltage and current rms measure-
ments. This information is ready to use for energy billing by using
built-in energy scalars. Many power line supervisory features
such as SAG, peak, and zero crossing are included in the energy
measurement DSP to simplify energy meter design.
The ADE5166/ADE5169/ADE5566/ADE5569 also include a
108-/104-segment LCD driver with the capability to store up to 4
LCD screens in memory. This driver generates voltages capable of
driving LCDs up to 5 V.
FUNCTIONAL BLOCK DIAGRAMS
43 42
38 39 40 41
39 38
7
6
45 11 43 42 41 40 39 38
37 36
5
6
7
8
9 10
57
12
13
14
44
19
P2.0 (FP18)
P2.1 (FP17)
P2.2 (FP16)
P2.3 (SDEN)
LCDVP1
2
SPI/I C
3 × 16-BIT
COUNTER
TIMERS
ADE5566/ADE5569
SERIAL
INTERFACE
1.20V
REF
16 LCDVP2
18 LCDVA
17 LCDVB
15 LCDVC
+
52
53
I
P
PGA1
ADC
ADC
–
3V/5V LCD
I
N
CHARGE PUMP
ENERGY
MEASUREMENT
DSP
4
COM0
...
+
49
50
1
COM3
V
104 SEGMENTS
LCD DRIVER
P
PGA2
–
FP0
...
35
V
N
SINGLE
CYCLE
8052
PROGRAM MEMORY
62kB FLASH
WATCHDOG
TIMER
20 FP15
14 FP16
13 FP17
12 FP18
11 FP19
10 FP20
63
54
DGND
AGND
MCU
USER RAM
256 BYTES
TEMP
SENSOR
TEMP
ADC
USER XRAM
2kB
UART2
TIMER
BATTERY
ADC
V
58
BAT
9
8
FP21
FP22
FP23
FP24
FP25
FP26
VSW
ADC
PLL
DOWNLOADER
DEBUGGER
POWER SUPPLY
CONTROL AND
MONITORING
UART2
SERIAL
PORT
POR
LDO
7
UART
SERIAL
PORT
UART
TIMER
6
RTC
OSC
LDO
5
55
61
62
59
51
47
46
48
45
64
60
56
37
44
36
38
Figure 1. ADE5566/ADE5569 Functional Block Diagram
1 Patents pending.
Rev. PrB | Page 4 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
43 42
38 39 40 41
39 38
7
6
45 11 43 42 41 40 39 38
37 36
5
6
7
8
9 10
57
12 P2.0 (FP18)
13 P2.1 (FP17)
14 P2.2 (FP16)
44 P2.3 (SDEN)
19 LCDVP1
16 LCDVP2
18 LCDVA
2
SPI/I C
3 × 16-BIT
COUNTER
TIMERS
ADE5166/ADE5169
SERIAL
INTERFACE
1.20V
REF
+
52
53
I
I
PA
PGA1
ADC
ADC
ADC
–
3V/5V LCD
CHARGE PUMP
17 LCDVB
I
N
15 LCDVC
+
ENERGY
PGA1
MEASUREMENT
DSP
4
COM0
...
–
55
PB
1
COM3
+
104-SEGMENT
LCD DRIVER
49
50
V
P
PGA2
FP0
...
35
–
V
N
SINGLE
CYCLE
8052
PROGRAM MEMORY
62kB FLASH
WATCHDOG
TIMER
20 FP15
14 FP16
13 FP17
12 FP18
63
54
DGND
AGND
MCU
USER RAM
256 BYTES
TEMP
SENSOR
TEMP
ADC
USER XRAM
2kB
FP19
11
UART2
TIMER
10 FP20
BATTERY
ADC
V
58
BAT
9
8
7
6
5
FP21
FP22
FP23
FP24
FP25
VSW
ADC
PLL
DOWNLOADER
DEBUGGER
POWER SUPPLY
CONTROL AND
MONITORING
UART2
SERIAL
PORT
POR
LDO
UART
SERIAL
PORT
UART
TIMER
RTC
OSC
LDO
61
62
59
51
47
46
48
45
64
60
56
37
44
36
38
Figure 2. ADE5166/ADE5169 Functional Block Diagram
Rev. PrB | Page 5 of 148
ADE5166/ADE5169/ADE5566/ADE5569
SPECIFICATIONS
Preliminary Technical Data
VDD = 3.3 V 5%, AGND = DGND = 0 V, on-chip reference XTAL = 32.768 kHz, TMIN to TMAX = −40°C to +85°C, unless otherwise noted.
ENERGY METERING
Table 2.
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
MEASUREMENT ACCURACY1
Phase Error Between Channels
PF = 0.8 Capacitive
0.05
0.05
0.1
Degrees
Degrees
% of reading
Phase lead: 37°
Phase lag: 60°
Over a dynamic range of 1000 to 1 @ 25°C
VDD = 3.3 V + 100 mV rms/120 Hz
IPx = VP = 100 mV rms
PF = 0.5 Inductive
Active Energy Measurement Error2
AC Power Supply Rejection2
Output Frequency Variation
DC Power Supply Rejection2
Output Frequency Variation
Active Energy Measurement Bandwidth1
Reactive Energy Measurement Error2, 3
Vrms Measurement Error2
Vrms Measurement Bandwidth1
Irms Measurement Error2
0.01
%
VDD = 3.3 V 117 mV dc
0.01
8
%
kHz
0.5
0.5
3.9
0.5
3.9
% of reading
% of reading
kHz
% of reading
kHz
Over a dynamic range of 1000 to 1 @ 25°C
Over a dynamic range of 100 to 1 @ 25°C
Over a dynamic range of 500 to 1 @ 25°C
Irms Measurement Bandwidth1
ANALOG INPUTS
Maximum Signal Levels
400
400
250
mV peak
mV peak
mV peak
kΩ
mV
mV
VP − VN differential input
IP − IN differential input
IPA − IN and IPB − IN differential inputs
ADE5566/ADE5569
ADE5166/ADE5169
Input Impedance (DC)
ADC Offset Error2
770
10
1
PGA1 = PGA2 = 1
PGA1 = 16
Gain Error2
Current Channel
Voltage Channel
Gain Error Match
3
3
0.2
%
%
%
IPA = IPB = 0.4 V dc or IP = 0.4 dc
Voltage channel = 0.4 V dc
CF1 AND CF2 PULSE OUTPUT
Maximum Output Frequency
21.1
kHz
VP − VN = 400 mV peak, IPA − IN = 250 mV,
PGA1 = 2 sine wave
Duty Cycle
Active High Pulse Width
FAULT DETECTION4
50
90
%
ms
If CF1 or CF2 frequency, >5.55 Hz
If CF1 or CF2 frequency, <5.55 Hz
Fault Detection Threshold
Inactive Input ≠ Active Input
Input Swap Threshold
Inactive Input > Active Input
Accuracy Fault Mode Operation
IPA Active, IPB = AGND
IPB Active, IPA = AGND
Fault Detection Delay
Swap Delay
6.25
6.25
%, of active
% of active
IPA or IPB active
IPA or IPB active
0.1
0.1
3
% of reading
% of reading
Seconds
Over a dynamic range of 500 to 1
Over a dynamic range of 500 to 1
3
Seconds
1 These specifications are not production tested but are guaranteed by design and/or characterization data on production release.
2 See the Terminology section for definition.
3 This function is not available in the ADE5566 and the ADE5166.
4 This function is not available in the ADE5566 and the ADE5569.
Rev. PrB | Page 6 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
ANALOG PERIPHERALS
Table 3.
Parameter
Min
Typ Max
Unit
Test Conditions/Comments
INTERNAL ADCs (BATTERY, TEMPERATURE, VDCIN
Power Supply Operating Range
No Missing Codes1
)
2.4
8
3.7
V
Bits
μs
Measured on VSWOUT
Conversion Delay2
38
ADC Gain
VDCIN Measurement
VBAT Measurement
Temperature Measurement
ADC Offset
15.3
14.6
0.78
mV/LSB
mV/LSB
°C/LSB
VDCIN Measurement at 3 V
VBAT Measurement at 3.7 V
Temperature Measurement at 25°C
VDCIN Analog Input
206
205
129
LSB
LSB
LSB
Maximum Signal Levels
Input Impedance (DC)
Low VDCIN Detection Threshold
POWER-ON RESET (POR)
VDD POR
3.3
1.2
V
MΩ
V
1
Detection Threshold
POR Active Timeout Period
VSWOUT POR
2.7
33
V
ms
Detection Threshold
POR Active Timeout Period
VINTD POR
2
20
V
ms
Detection Threshold
POR Active Timeout Period
VINTA POR
2.1
16
V
ms
Detection Threshold
POR Active Timeout Period
BATTERY SWITCH OVER
2.05
120
V
ms
Voltage Operating Range (VSWOUT
VDD to VBAT Switching
)
3.3
V
Switching Threshold (VDD)
Switching Delay
2.7
10
30
V
ns
ms
When VDD to VBAT switch activated by VDD
When VDD to VBAT switch activated by VDCIN
VBAT to VDD Switching
Switching Threshold (VDD)
Switching Delay
VSWOUT To VBAT Leakage Current
LCD, CHARGE PUMP ACTIVE
2.7
30
10
V
ms
nA
Based on VDD > 2.75 V
VBAT = 0 V, VSWOUT = 3.43 V, TA = 25°C
Charge Pump Capacitance Between
LCDVP1 and LCDVP2
100
nF
LCDVA, LCDVB, LCDVC Decoupling Capacitance
LCDVA
LCDVB
470
1.75
3.5
nF
V
V
1/3 bias mode
LCDVC
5.3
V
1/3 bias mode
V1 Segment Line Voltage
V2 Segment Line Voltage
V3 Segment Line Voltage
DC Voltage Across Segment and COMx Pin
LCDVA − 0.1
LCDVB − 0.1
LCDVC − 0.1
LCDVA
LCDVB
LCDVC
V
V
V
mV
Current on segment line = −2 μA
Current on segment line = −2 μA
Current on segment line = −2 μA
LCDVC − LCDVB, LCDVC − LCDVA, or
LCDVB − LCDVA
50
Rev. PrB | Page 7 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Parameter
Min
Typ Max
Unit
Test Conditions/Comments
LCD, RESISTOR LADDER ACTIVE
Leakage Current
20
nA
V
V
1/2 and 1/3 bias modes, no load
Current on segment line = −2 μA
Current on segment line = −2 μA
Current on segment line = −2 μA
V1 Segment Line Voltage
V2 Segment Line Voltage
V3 Segment Line Voltage
ON-CHIP REFERENCE
Reference Error
LCDVA − 0.1
LCDVB − 0.1
LCDVC − 0.1
LCDVA
LCDVB
LCDVC
V
0.9
80
10
mV
dB
ppm/°C
TA = 25°C
Power Supply Rejection
Temperature Coefficient1
1 These specifications are not production tested but are guaranteed by design and/or characterization data on production release.
2 Delay between ADC conversion request and interrupt set.
DIGITAL INTERFACE
Table 4.
Parameter
Min
Typ
Max Unit
Test Conditions/Comments
LOGIC INPUTS
All Inputs Except XTAL1, XTAL2, BCTRL,
INT0, INT1, RESET
Input High Voltage, VINH
Input Low Voltage, VINL
BCTRL, INT0, INT1, RESET
Input High Voltage, VINH
Input Low Voltage, VINL
Input Currents
2.0
0.4
V
V
1.3
V
V
0.4
RESET
100
nA
RESET = VSWOUT = 3.3 V
Port 0, Port 1, Port 2
100 nA
μA
Internal pull-up disabled, input = 0 V or VSWOUT
Internal pull-up enabled, input = 0 V, VSWOUT = 3.3 V
All digital inputs
−3.75
10
Input Capacitance
FLASH MEMORY
Endurance1
Data Retention2
pF
10,000
20
Cycles
Years
TJ = 85°C
CRYSTAL OSCILLATOR
Crystal Equivalent Series Resistance
Crystal Frequency
XTAL1 Input Capacitance
XTAL2 Output Capacitance
40
32.768
12
kΩ
kHz
pF
12
pF
MCU CLOCK RATE (fCORE
)
4.096
32
MHz
kHz
Crystal = 32.768 kHz and CD[2:0] = 0
Crystal = 32.768 kHz and CD[2:0] = 0b111
LOGIC OUTPUTS
Output High Voltage, VOH
ISOURCE
Output Low Voltage, VOL
2.4
V
μA
V
VDD = 3.3 V 5%
VDD = 3.3 V 5%
80
0.4
2
3
ISINK
mA
START-UP TIME4
PSM0 Power-On Time
From Power Saving Mode 1 (PSM1)
448
130
ms
ms
VDD at 2.75 V to PSM0 code execution
VDD at 2.75 V to PSM0 code execution
PSM1 → PSM0
From Power Saving Mode 2 (PSM2)
PSM2 → PSM1
48
ms
ms
Wake-up event to PSM1 code execution
VDD at 2.75 V to PSM0 code execution
186
PSM2 → PSM0
Rev. PrB | Page 8 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Parameter
Min
Typ
Max Unit
Test Conditions/Comments
POWER SUPPLY INPUTS
VDD
VBAT
3.3
3.3
V
V
INTERNAL POWER SUPPLY SWITCH (VSWOUT
VBAT to VSWOUT On Resistance
VDD to VSWOUT On Resistance
)
22
10.2
40
18
1
Ω
Ω
ns
μs
mA
VBAT = 2.4 V
VDD = 3.13 V
V
BAT ←→ VDD Switching Open Time
BCTRL State Change and Switch Delay
VSWOUT Output Current Drive
POWER SUPPLY OUTPUTS
VINTA
2.5
2.5
60
V
V
dB
dB
VINTD
VINTA Power Supply Rejection
VINTD Power Supply Rejection
POWER SUPPLY CURRENTS
Current in Normal Mode (PSM0)
50
4
mA
mA
mA
mA
fCORE = 4.096 MHz, LCD and meter active
fCORE = 1.024 MHz, LCD and meter active
fCORE = 32.768 kHz, LCD and meter active
fCORE = 4.096 MHz, meter DSP active, metering ADC
powered down
2.1
1.6
3.2
3
mA
fCORE = 4.096 MHz, metering ADC and DSP powered
down
Current in PSM1
Current in PSM2
3.2
880
38
mA
μA
μA
μA
fCORE = 4.096 MHz, LCD active, VBAT = 3.7 V
fCORE = 1.024 MHz, LCD active
LCD active with charge pump at 3.3 V + RTC
RTC only, TA = 25°C, VBAT = 3.3 V
1.5
POWER SUPPLY CURRENTS
Current in Normal Mode (PSM0)
4
mA
fCORE = 4.096 MHz, LCD and meter active
1 Endurance is qualified as per JEDEC Standard 22 Method A117 and measured at −40°C, +25°C, +85°C, and +125°C.
2 Retention lifetime equivalent at junction temperature (TJ) = 85°C as per JEDEC Standard 22 Method A117. Retention lifetime derates with junction temperature.
3 Test carried out with all the I/Os set to a low output level.
4 Delay between power supply valid and execution of first instruction by 8052 core.
Rev. PrB | Page 9 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
For timing purposes, a port pin is no longer floating when a
100 mV change from load voltage occurs. A port pin begins to
float when a 100 mV change from the loaded VOH/VOL level
occurs as shown in Figure 3.
TIMING SPECIFICATIONS
AC inputs during testing were driven at VSWOUT − 0.5 V for Logic 1
and 0.45 V for Logic 0. Timing measurements were made at VIH
minimum for Logic 1 and VIL maximum for Logic 0, as shown in
Figure 3.
CLOAD for all outputs = 80 pF, unless otherwise noted. VDD = 2.7 V
to 3.6 V; all specifications TMIN to TMAX, unless otherwise noted.
V
– 0.5V
0.45V
SWOUT
V
– 0.1V
+ 0.1V
V
– 0.1V
– 0.1V
LOAD
LOAD
0.2V
+ 0.9V
SWOUT
TEST POINTS
0.2V – 0.1V
TIMING
REFERENCE
POINTS
V
V
LOAD
LOAD
SWOUT
V
V
LOAD
LOAD
Figure 3. Timing Waveform Characteristics
Table 5. Clock Input (External Clock Driven XTAL1) Parameter
32.768 kHz External Crystal
Parameter
tCK
tCKL
tCKH
tCKR
Description
Min
Typ
30.52
6.26
6.26
9
Max
Unit
μs
μs
μs
ns
XTAL1 period
XTAL1 width low
XTAL1 width high
XTAL1 rise time
XTAL1 fall time
Core clock frequency1
tCKF
1/tCORE
9
ns
MHz
1.024
1 The ADE5166/ADE5169/ADE5566/ADE5569 internal PLL locks onto a multiple (512 times) of the 32.768 kHz external crystal frequency to provide a stable 4.096 MHz
internal clock for the system. The core can operate at this frequency or at a binary submultiple defined by the CD[2:0] bits, selected via the POWCON SFR (see Table 25).
Table 6. I2C-Compatible Interface Timing Parameters (400 kHz)
Parameter
Description
Typ
1.3
Unit
μs
μs
μs
μs
ns
ns
ns
ns
ns
ns
ns
tBUF
tL
tH
tSHD
tDSU
tDHD
tRSU
tPSU
tR
Bus-free time between stop condition and start condition
SCLK low pulse width
SCLK high pulse width
Start condition hold time
Data setup time
Data hold time
Setup time for repeated start
Stop condition setup time
Rise time of both SCLK and SDATA
Fall time of both SCLK and SDATA
Pulse width of spike suppressed
1.36
1.14
251.35
740
400
12.5
400
200
300
50
tF
tSUP
1
1 Input filtering on both the SCLK and SDATA inputs suppresses noise spikes less than 50 ns.
tBUF
tSUP
tR
SDATA (I/O)
MSB
LSB
ACK
MSB
tDSU
tDSU
tF
tDHD
tDHD
tR
tRSU
tH
tPSU
SCLK (I)
tSHD
1
8
9
1
2 TO 7
tSUP
tL
S(R)
PS
tF
STOP
START
REPEATED
START
CONDITION CONDITION
Figure 4. I2C-Compatible Interface Timing
Rev. PrB | Page 10 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 7. SPI Master Mode Timing (SPICPHA = 1) Parameters
Parameter
Description
Min
Typ
Max
Unit
ns
ns
ns
ns
ns
2SPIR × tCORE
1
1
tSL
tSH
SCLK low pulse width
SCLK high pulse width
Data output valid after SCLK edge
Data input setup time before SCLK edge
Data input hold time after SCLK edge
Data output fall time
Data output rise time
SCLK rise time
SCLK fall time
2SPIR × tCORE
1
tDAV
tDSU
tDHD
tDF
tDR
tSR
3 × tCORE
0
tCORE
1
19
19
19
19
ns
ns
ns
ns
tSF
1 tCORE depends on the clock divider or CD[2:0] bits of the POWCON SFR (see Table 25); tCORE = 2CD/4.096 MHz.
SCLK
(SPICPOL = 0)
tSH
tSL
tSR
tSF
SCLK
(SPICPOL = 1)
tDAV
tDF
tDR
MOSI
MISO
MSB
BITS [6:1]
LSB
LSB IN
MSB IN
BITS [6:1]
tDSU
tDHD
Figure 5. SPI Master Mode Timing (SPICPHA = 1)
Rev. PrB | Page 11 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Table 8. SPI Master Mode Timing (SPICPHA = 0) Parameters
Parameter
Description
Min
Typ
Max
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
2SPIR × tCORE
(SPIR + 1) × tCORE
(SPIR + 1) × tCORE
1
1
1
tSL
tSH
SCLK low pulse width
SCLK high pulse width
2SPIR × tCORE
1
1
tDAV
tDOSU
tDSU
tDHD
tDF
tDR
tSR
tSF
Data output valid after SCLK edge
Data output setup before SCLK edge
Data input setup time before SCLK edge
Data input hold time after SCLK edge
Data output fall time
Data output rise time
SCLK rise time
SCLK fall time
3 × tCORE
75
0
tCORE
1
19
19
19
19
1 tCORE depends on the clock divider or CD[2:0] bits of the POWCON SFR (see Table 25); tCORE = 2CD/4.096 MHz.
SCLK
(SPICPOL = 0)
tSH
tSL
tSR
tSF
SCLK
(SPICPOL = 1)
tDAV
tDOSU
tDF
tDR
MOSI
MISO
MSB
BITS [6:1]
LSB
LSB IN
MSB IN
BITS [6:1]
tDSU tDHD
Figure 6. SPI Master Mode Timing (SPICPHA = 0)
Rev. PrB | Page 12 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 9. SPI Slave Mode Timing (SPICPHA = 1) Parameters
Parameter
Description
Min
Typ
Max
Unit
ns
ns
ns
ns
ns
μs
ns
ns
ns
ns
ns
tSS
SS to SCLK edge
145
1
1
tSL
tSH
SCLK low pulse width
SCLK high pulse width
Data output valid after SCLK edge
Data input setup time before SCLK edge
Data input hold time after SCLK edge
Data output fall time
Data output rise time
SCLK rise time
SCLK fall time
6 × tCORE
6 × tCORE
tDAV
tDSU
tDHD
tDF
tDR
tSR
25
0
2 × tCORE1 + 0.5 μs
19
19
19
19
tSF
tSFS
SS high after SCLK edge
0
1 tCORE depends on the clock divider or CD[2:0] bits of the POWCON SFR (see Table 25); tCORE = 2CD/4.096 MHz.
SS
tSFS
tSS
SCLK
(SPICPOL = 0)
tSH
tSL
tSR
tSF
SCLK
(SPICPOL = 1)
tDAV
tDF
tDR
MSB
LSB
BITS [6:1]
MISO
MOSI
MSB IN
BITS [6:1]
LSB IN
tDSU
tDHD
Figure 7. SPI Slave Mode Timing (SPICPHA = 1)
Rev. PrB | Page 13 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Table 10. SPI Slave Mode Timing (SPICPHA = 0) Parameters
Parameter
Description
Min
Typ
Max
Unit
ns
ns
ns
ns
ns
μs
ns
ns
ns
ns
ns
ns
tSS
SS to SCLK edge
145
1
1
tSL
tSH
tDAV
tDSU
tDHD
tDF
tDR
tSR
tSF
tDOSS
tSFS
SCLK low pulse width
6 × tCORE
6 × tCORE
SCLK high pulse width
Data output valid after SCLK edge
Data input setup time before SCLK edge
Data input hold time after SCLK edge
Data output fall time
Data output rise time
SCLK rise time
SCLK fall time
Data output valid after SS edge
SS high after SCLK edge
25
0
2 × tCORE1+ 0.5 μs
19
19
19
19
0
0
1 tCORE depends on the clock divider or CD[2:0] bits of the POWCON SFR (see Table 25); tCORE = 2CD/4.096 MHz.
SS
tSFS
tSS
SCLK
(SPICPOL = 0)
tSH
tSL
tSR
tSF
SCLK
(SPICPOL = 1)
tDAV
tDOSS
tDF
tDR
MSB
BITS [6:1]
LSB
MISO
MOSI
BITS [6:1]
LSB IN
MSB IN
tDSU
tDHD
Figure 8. SPI Slave Mode Timing (SPICPHA = 0)
Rev. PrB | Page 14 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 11.
Parameter
Rating
VDD to DGND
VBAT to DGND
VDCIN to DGND
Input LCD Voltage to AGND, LCDVA,
LCDVB, LCDVC1
−0.3 V to +3.7 V
−0.3 V to +3.7 V
−0.3 V to VSWOUT + 0.3 V
−0.3 V to VSWOUT + 0.3 V
THERMAL RESISTANCE
Analog Input Voltage to AGND, VP, VN, IPA, −2 V to +2 V
and IN
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Digital Input Voltage to DGND
Digital Output Voltage to DGND
Operating Temperature Range (Industrial)
Storage Temperature Range
64-Lead LQFP, Power Dissipation
Lead Temperature
−0.3 V to VSWOUT + 0.3 V
−0.3V to VSWOUT + 0.3 V
−40°C to +85°C
Table 12. Thermal Resistance
Package Type
θJA
θJC
Unit
−65°C to +150°C
64-Lead LQFP
60
20.5
°C/W
ESD CAUTION
Soldering
Time
300°C
30 sec
1 When used with external resistor divider.
Rev. PrB | Page 15 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
COM3/FP27
INT0
PIN 1
2
3
COM2/FP28
COM1
XTAL1
XTAL2
4
COM0
BCTRL/INT1/P0.0
SDEN/P2.3/TxD2
P0.2/CF1/RTCCAL
P0.3/CF2
5
P1.2/FP25/ZX
P1.3/T2EX/FP24
P1.4/T2/FP23
P1.5/FP22
P1.6/FP21
P1.7/FP20
P0.1/FP19
P2.0/FP18
P2.1/FP17
P2.2/FP16
LCDVC
6
7
ADE5166/ADE5169/ADE5566/ADE5569
8
P0.4/MOSI/SDATA
P0.5/MISO/ZX
P0.6/SCLK/T0
P0.7/SS/T1/RxD2
P1.0/RxD
TOP VIEW
(Not to Scale)
9
10
11
12
13
14
15
16
P1.1/TxD
FP0
FP1
LCDVP2
FP2
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Figure 9. Pin Configuration
Table 13. Pin Function Descriptions
Pin No. Mnemonic Description
1
2
3
COM3/FP27
COM2/FP28
COM1
Common Output 3 or LCD Segment Output 27. COM3 is used for LCD backplane.
Common Output 2 or LCD Segment Output 28. COM2 is used for LCD backplane.
Common Output 1. COM1 is used for LCD backplane.
4
COM0
Common Output 0. COM0 is used for LCD backplane.
5
6
7
8
P1.2/FP25/ZX
P1.3/T2EX/FP24
P1.4/T2/FP23
P1.5/FP22
P1.6/FP21
P1.7/FP20
P0.1/FP19
P2.0/FP18
P2.1/FP17
P2.2/FP16
LCDVC
General-Purpose Digital I/O Port 1.2 or LCD Segment Output 25/ZX Output
General-Purpose Digital I/O Port 1.3, Timer 2 Control Input, or LCD Segment Output 24.
General-Purpose Digital I/O Port 1.4, Timer 2 Input, or LCD Segment Output 23.
General-Purpose Digital I/O Port 1.5 or LCD Segment Output 22.
General-Purpose Digital I/O Port 1.6 or LCD Segment Output 21.
General-Purpose Digital I/O Port 1.7 or LCD Segment Output 20.
General-Purpose Digital I/O Port 0.1 or LCD Segment Output 19.
General-Purpose Digital I/O Port 2.0 or LCD Segment Output 18.
General-Purpose Digital I/O Port 2.1 or LCD Segment Output 17.
General-Purpose Digital I/O Port 2.2 or LCD Segment Output 16.
Output Port for LCD Levels. This pin should be decoupled with a 470 nF capacitor.
9
10
11
12
13
14
15
16
LCDVP2
Analog Output. A 100 nF capacitor should be connected between this pin and LCDVP1 for the internal LCD
charge pump device.
17, 18
19
LCDVB, LCDVA
LCDVP1
Output Port for LCD Levels. These pins should be decoupled with a 470 nF capacitor.
Analog Output. A 100 nF capacitor should be connected between this pin and LCDVP2 for the internal LCD
charge pump device.
35 to 20 FP0 to F15
LCD Segment Output 0 to LCD Segment Output 15.
36
37
38
P1.1/TxD
P1.0/RxD
P0.7/SS/T1/RxD2
General-Purpose Digital I/O Port 1.1 or Transmitter Data Output (Asynchronous).
General-Purpose Digital I/O Port 1.0 or Receiver Data Input (Asynchronous).
General-Purpose Digital I/O Port 0.7, Slave Select when SPI is in Slave Mode, or Timer 1 Input/Receive Data
Input 2 (Asynchronous)
39
40
P0.6/SCLK/T0
P0.5/MISO/ZX
General-Purpose Digital I/O Port 0.6, Clock Output for I2C or SPI Port, or Timer 0 Input.
General-Purpose Digital I/O Port 0.5 or Data Input for SPI Port/ZX Output
Rev. PrB | Page 16 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Pin No. Mnemonic
Description
41
42
P0.4/MOSI/SDATA General-Purpose Digital I/O Port 0.4, Data Output for SPI Port, or I2C-Compatible Data Line.
P0.3/CF2
General-Purpose Digital I/O Port 0.3 or Calibration Frequency Logic Output 2. The CF2 logic output gives
instantaneous active, reactive, Irms, or apparent power information.
43
44
P0.2/CF1/RTCCAL General-Purpose Digital I/O Port 0.2, Calibration Frequency Logic Output 1, or RTC Calibration Frequency
Logic Output. The CF1 logic output gives instantaneous active, reactive, Irms, or apparent power information.
The RTCCAL logic output gives access to the calibrated RTC output.
SDEN/P2.3/TxD2
Serial Download Mode Enable or Digital Output Pin P2.3. This pin is used to enable serial download mode
through a resistor when pulled low on power-up or reset. On reset, this pin momentarily becomes an input
and the status of the pin is sampled. If there is no pull-down resistor in place, the pin momentarily goes high
and then user code is executed. If the pin is pulled down on reset, the embedded serial download/debug
kernel executes, and this pin remains low during the internal program execution. After reset, this pin can be
used as a digital output port pin (P2.3)/ Transmitter Data Output 2 (asynchronous).
45
46
47
BCTRL/INT1/P0.0
XTAL2
Digital Input for Battery Control, External Interrupt Input 1, or General-Purpose Digital I/O Port 0.0. This logic
input connects VDD or VBAT to VSWOUT internally when set to logic high or logic low, respectively. When left
open, the connection between VDD or VBAT and VSWOUT is selected internally.
A crystal can be connected across this pin and XTAL1 (see XTAL1 pin description) to provide a clock source
for the ADE5166/ADE5169/ADE5566/ADE5569. The XTAL2 pin can drive one CMOS load when an external
clock is supplied at XTAL1 or by the gate oscillator circuit. An internal 6 pF capacitor is connected to this pin.
An external clock can be provided at this logic input. Alternatively, a tuning fork crystal can be connected
across XTAL1 and XTAL2 to provide a clock source for the ADE5166/ADE5169/ADE5566/ADE5569. The clock
frequency for specified operation is 32.768 kHz. An internal 6 pF capacitor is connected to this pin.
XTAL1
48
INT0
External Interrupt Input 0.
49, 50
VP, VN
Analog Inputs for Voltage Channel. These inputs are fully differential voltage inputs with a maximum
differential level of 400 mV for specified operation. This channel also has an internal PGA.
51
EA
This pin is used as an input for emulation. When held high, this input enables the device to fetch code from
internal program memory locations. The ADE5166/ADE5169/ADE5566/ADE5569 do not support external
code memory. This pin should not be left floating.
52, 53
IP/IPA, IN
Analog Inputs for Current Channel. These inputs are fully differential voltage inputs with a maximum
differential level of 400 mV for specified operation. This channel also has an internal PGA.
54
55
AGND
FP26 or IPB
This pin provides the ground reference for the analog circuitry.
LCD Segment Output 26 (FP26) for ADE5566 and ADE5569 or Analog Input for Second Current Channel (IPB)
for ADE5166 and ADE5169. This input is fully differential with a maximum differential level of 400 mV
referred to IN for specified operation. This channel also has an internal PGA.
56
57
RESET
Reset Input, Active Low.
REFIN/OUT
This pin provides access to the on-chip voltage reference. The on-chip reference has a nominal value of
1.2 V 0.1% and a typical temperature coefficient of 50 ppm/°C maximum. This pin should be decoupled
with a 1 μF capacitor in parallel with a ceramic 100 nF capacitor.
58
59
60
VBAT
VINTA
VDD
Power Supply Input from the Battery with a 2.4 V to 2.7 V Range. This pin is connected internally to VDD when
the battery is selected as the power supply for the ADE5166/ADE5169/ADE5566/ADE5569.
This pin provides access to the on-chip 2.5 V analog LDO. No external active circuitry should be connected to
this pin. This pin should be decoupled with a 10 μF capacitor in parallel with a ceramic 100 nF capacitor.
3.3 V Power Supply Input from the Regulator. This pin is connected internally to VDD when the regulator is
selected as the power supply for the ADE5166/ADE5169/ADE5566/ADE5569. This pin should be decoupled
with a 10 μF capacitor in parallel with a ceramic 100 nF capacitor.
61
62
VSWOUT
3.3 V Power Supply Output. This pin provides the supply voltage for the LDOs and internal circuitry of the
ADE5166/ADE5169/ADE5566/ADE5569. This pin should be decoupled with a 10 μF capacitor in parallel with
a ceramic 100 nF capacitor.
This pin provides access to the on-chip 2.5 V digital LDO. No external active circuitry should be connected to
this pin. This pin should be decoupled with a 10 μF capacitor in parallel with a ceramic 100 nF capacitor.
VINTD
63
64
DGND
VDCIN
This pin provides the ground reference for the digital circuitry.
Analog Input for DC Voltage Monitoring. The maximum input voltage on this pin is VSWOUT with respect to
AGND. This pin is used to monitor the preregulated dc voltage.
Rev. PrB | Page 17 of 148
ADE5166/ADE5169/ADE5566/ADE5569
TERMINOLOGY
Preliminary Technical Data
For the dc PSR measurement, a reading at nominal supplies
(3.3 V) is taken. A second reading is obtained with the same
input signal levels when the supplies are varied 5%. Any error
introduced is again expressed as a percentage of the reading.
Measurement Error
The error associated with the energy measurement made by the
ADE5166/ADE5169/ADE5566/ADE5569 is defined by the
following formula:
ADC Offset Error
Percentage Errror =
ADC offset error is the dc offset associated with the analog
inputs to the ADCs. It means that, with the analog inputs
connected to AGND, the ADCs still see a dc analog input
signal. The magnitude of the offset depends on the gain and
input range selection. However, when HPF1 is switched on,
the offset is removed from the current channel, and the power
calculation is not affected by this offset. The offsets can be
removed by performing an offset calibration (see the Analog
Inputs section).
⎛
⎜
⎜
⎝
⎞
⎟
⎟
⎠
Energy Register −True Energy
×100%
True Energy
Phase Error Between Channels
The digital integrator and the high-pass filter (HPF) in the
current channel have a nonideal phase response. To offset this
phase response and equalize the phase response between
channels, two phase correction networks are placed in the
current channel: one for the digital integrator and the other for
the HPF. The phase correction networks correct the phase
response of the corresponding component and ensure a phase
match between current channel and voltage channel to within
0.1° over a range of 45 Hz to 65 Hz with the digital integrator
off. With the digital integrator on, the phase is corrected to
within 0.4° over a range of 45 Hz to 65 Hz.
Gain Error
Gain error is the difference between the measured ADC output
code (minus the offset) and the ideal output code (see the
Current Channel ADC section and the Voltage Channel ADC
section). It is measured for each of the gain settings on the
current channel (1, 2, 4, 8, and 16). The difference is expressed
as a percentage of the ideal code.
Power Supply Rejection (PSR)
PSR quantifies the ADE5166/ADE5169/ADE5566/ADE5569
measurement error as a percentage of reading when the power
supplies are varied. For the ac PSR measurement, a reading at
nominal supplies (3.3 V) is taken. A second reading is obtained
with the same input signal levels when an ac (100 mV rms/120 Hz)
signal is introduced onto the supplies. Any error introduced by
this ac signal is expressed as a percentage of reading (see the
Measurement Error definition).
Rev. PrB | Page 18 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
SFR MAPPING
Table 14. SFR Mapping
Mnemonic
Address
0xFF
0xFE
0xFD
0xFC
0xFB
0xFA
0xF9
0xF8
0xF7
0xF6
0xF5
0xF4
0xF3
0xF0
0xEF
0xEE
0xED
0xEC
0xEB
0xEA
0xEA
0xE9
0xE9
0xE8
0xE8
0xE7
0xE6
0xE5
0xE4
0xE3
0xE2
0xE1
0xE0
0xDF
0xDE
0xDD
0xDC
0xDB
0xDA
0xD9
0xD8
0xD7
0xD6
0xD5
0xD4
0xD3
0xD2
0xD1
0xD0
0xCD
Details
Mnemonic
TL2
Address
0xCC
0xCB
0xCA
0xC8
0xC7
0xC6
0xC5
0xC1
0xC0
0xBF
0xBC
0xBB
0xBA
0xB9
0xB8
0xB7
0xB4
0xB3
0xB2
0xB1
0xAF
0xAE
0xAC
0xA9
0xA8
0xA7
0xA4
0xA3
0xA2
0xA1
0xA0
0x9F
0x9E
0x9D
0x9C
0x9B
0x9A
0x99
0x98
0x97
0x96
0x95
0x94
0x93
0x92
0x91
0x90
0x8D
0x8C
0x8B
Details
INTPR
Table 16
Table 24
Table 23
Table 22
Table 21
Table 52
Table 49
Table 17
Table 124
Table 123
Table 18
Table 19
Table 50
Table 56
Table 53
Table 142
Table 91
Table 20
Table 141
Table 149
Table 153
Table 148
Table 152
Table 147
Table 151
Table 30
Table 30
Table 30
Table 30
Table 30
Table 30
Table 140
Table 56
Table 54
Table 42
Table 41
Table 40
Table 45
Table 44
Table 43
Table 51
Table 55
Table 30
Table 30
Table 30
Table 30
Table 30
Table 30
Table 57
Table 110
Table 111
Table 112
Table 113
Table 105
Table 100
Table 99
Table 25
Table 116
Table 78
Table 64
Table 98
Table 97
Table 96
Table 95
Table 72
Table 63
Table 158
Table 157
Table 156
Table 84
Table 65
Table 90
Table 89
Table 73
Table 71
Table 69
Table 122
Table 121
Table 120
Table 119
Table 161
Table 155
Table 136
Table 137
Table 82
Table 146
Table 145
Table 135
Table 134
Table 88
Table 85
Table 81
Table 30
Table 30
Table 30
Table 30
Table 160
Table 108
Table 106
Table 109
SCRATCH4
SCRATCH3
SCRATCH2
SCRATCH1
BATVTH
STRBPER
IPSMF
TEMPCAL
RTCCOMP
BATPR
PERIPH
DIFFPROG
B
VDCINADC
SBAUD2
LCDSEGE2
IPSME
RCAP2H
RCAP2L
T2CON
EADRH
EADRL
POWCON
KYREG
WDCON
STCON
EDATA
PROTKY
FLSHKY
ECON
IP
SPH
PINMAP2
PINMAP1
PINMAP0
LCDCONY
CFG
LCDDAT
LCDPTR
IEIP2
SBUF2
SPISTAT
SPI2CSTAT
SPIMOD2
I2CADR
SPIMOD1
I2CMOD
WAV2H
WAV2M
WAV2L
WAV1H
WAV1M
WAV1L
SCON2
ACC
BATADC
MIRQSTH
MIRQSTM
MIRQSTL
MIRQENH
MIRQENM
MIRQENL
ADCGO
TEMPADC
IRMSH
IRMSM
IRMSL
VRMSH
VRMSM
VRMSL
IE
DPCON
RTCDAT
RTCPTR
TIMECON2
TIMECON
P2
EPCFG
SBAUDT
SBAUDF
LCDCONX
SPI2CRx
SPI2CTx
SBUF
SCON
LCDSEGE
LCDCLK
LCDCON
MDATH
MDATM
MDATL
MADDPT
P1
TH1
TH0
TL1
PSW
TH2
Rev. PrB | Page 19 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Mnemonic
TL0
TMOD
TCON
Address
0x8A
0x89
0x88
0x87
Details
Mnemonic
Address
0x83
0x82
0x81
0x80
Details
Table 107
Table 103
Table 104
Table 58
DPH
DPL
SP
Table 60
Table 59
Table 62
Table 159
PCON
P0
Rev. PrB | Page 20 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
POWER MANAGEMENT
The ADE5166/ADE5169/ADE5566/ADE5569 have elaborate
power management circuitry that manages the regular power
supply to battery switchover and power supply failures.
The power management functionalities can be accessed directly
through the 8052 SFRs (see Table 15).
Table 15. Power Management SFRs
SFR Address
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Mnemonic
Description
0xEC
0xF5
0xF8
0xFF
0xF4
0xC5
0xFB
0xFC
IPSME
BATPR
IPSMF
INTPR
Power management interrupt enable. See Table 20.
Battery switchover configuration. See Table 18.
Power management interrupt flag. See Table 17.
Interrupt pins configuration. See Table 16.
Peripheral configuration. See Table 19.
Power control. See Table 25.
Scratch Pad 1. See Table 21.
Scratch Pad 2. See Table 22.
Scratch Pad 3. See Table 23.
Scratch Pad 4. See Table 24.
PERIPH
POWCON
SCRATCH1
SCRATCH2
SCRATCH3
SCRATCH4
0xFD
0xFE
POWER MANAGEMENT REGISTER DETAILS
Table 16. Interrupt Pins Configuration SFR (INTPR, 0xFF)
Bit
Mnemonic
Default Description
7
RTCCAL
0
Controls RTC calibration output. When set, the RTC calibration frequency selected by FSEL[1:0] is
output on the P0.2/CF1/RTCCAL pin.
6 to 5
FSEL[1:0]
00
Sets RTC calibration output frequency and calibration window.
FSEL[1:0]
Result (Calibration window, frequency)
30.5 sec, 1 Hz
30.5 sec, 512 Hz
0.244 sec, 500 Hz
0.244 sec, 16.384 kHz
00
01
10
11
4
Reserved
N/A
3 to 1
INT1PRG[2:0] 000
Controls the function of INT1.
INT1PRG[2:0] Result
X00
X01
01X
11X
GPIO enabled
BCTRL enabled
INT1 input disabled
INT1 input enabled
0
INT0PRG
0
Controls the function of INT0.
INT0PRG
Result
0
1
INT0 input disabled
INT0 input enabled
Writing to the Interrupt Pins Configuration SFR (INTPR, 0xFF)
To protect the RTC from runaway code, a key must be written to the key SFR (KYREG, 0xC1) to obtain write access to INTPR. KYREG
(see Table 116) should be set to 0xEA to unlock this SFR and reset to zero after a timekeeping register is written to. The RTC registers can
be written using the following 8052 assembly code:
MOV
MOV
KYREG, #0EAh
INTPR, #080h
Rev. PrB | Page 21 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Table 17. Power Management Interrupt Flag SFR (IPSMF, 0xF8)
Bit
Address Mnemonic
Default
Description
7
0xFF
FPSR
0
Power supply restored interrupt flag. Set when the VDD power supply has been restored.
This occurs when the source of VSWOUT changes from VBAT to VDD.
6
5
4
3
0xFE
0xFD
0xFC
0xFB
FPSM
FSAG
Reserved
FVADC
0
0
0
0
PSM interrupt flag. Set when an enabled PSM interrupt condition occurs.
Voltage SAG interrupt flag. Set when an ADE energy measurement SAG condition occurs.
This bit must be kept cleared for proper operation.
VDCIN monitor interrupt flag. Set when VDCIN changes by VDCIN_DIFF or when VDCIN
measurement is ready.
2
0xFA
FBAT
0
VBAT monitor interrupt flag. Set when VBAT falls below BATVTH or when VBAT measurement is
ready.
1
0
0xF9
0xF8
FBSO
FVDCIN
0
0
Battery switchover interrupt flag. Set when VSWOUT switches from VDD to VBAT
VDCIN monitor interrupt flag. Set when VDCIN falls below 1.2 V.
.
Table 18. Battery Switchover Configuration SFR (BATPR, 0xF5)
Bit
Mnemonic
Default
Description
7 to 2 Reserved
0
0
These bits must be kept to 0 for proper operation.
Control bits for battery switchover.
1 to 0 BATPRG[1:0]
BATPRG[1:0]
Result
00
01
1X
Battery switchover enabled on low VDD
Battery switchover enabled on low VDD and low VDCIN
Battery switchover disabled
Table 19. Peripheral Configuration SFR (PERIPH, 0xF4)
Bit
Mnemonic
Default
Description
7
RXFLAG
0
1
1
0
If set, indicates that an Rx edge event triggered wake-up from PSM2.
6
VSWSOURCE
VDD_OK
Indicates the power supply that is internally connected to VSWOUT (0 VSWOUT = VBAT, 1 VSWOUT = VDD).
If set, indicates that VDD power supply is ready for operation.
5
4
PLL_FLT
If set, indicates that a PLL fault occurred where the PLL lost lock. Set the PLLACK bit (see Table 51) in
the start ADC measurement SFR (ADCGO, 0xD8) to acknowledge the fault and clear the PLL_FLT bit.
3
2
REF_BAT_EN
0
Set this bit to enable internal voltage reference in PSM2 mode. This bit should be set if LCD is on in
PSM2 mode.
Reserved
0
0
This bit should be kept to 0.
1 to
0
RXPROG[1:0]
Controls the function of the P1.0/RxD pin.
RXPROG[1:0]
Result
00
01
11
GPIO
RxD with wake-up disabled
RxD with wake-up enabled
Table 20. Power Management Interrupt Enable SFR (IPSME, 0xEC)
Bit
Mnemonic
Default
Description
7
6
5
4
3
2
1
0
EPSR
Reserved
ESAG
Reserved
EVADC
EBAT
0
0
0
0
0
0
0
0
Enables a PSM interrupt when the power supply restored flag (FPSR) is set.
Reserved.
Enables a PSM interrupt when the voltage SAG flag (FSAG) is set.
This bit must be kept cleared for proper operation.
Enables a PSM interrupt when the VADC monitor flag (FVADC) is set.
Enables a PSM interrupt when the VBAT monitor flag (FBAT) is set.
Enables a PSM interrupt when the battery switchover flag (FBSO) is set.
Enables a PSM interrupt when the VDCIN monitor flag (FVDCIN) is set.
EBSO
EVDCIN
Table 21. Scratch Pad 1 SFR (SCRATCH1, 0xFB)
Bit
Mnemonic
Default
Description
7 to 0 SCRATCH1
0
Value can be written/read in this register. This value is maintained in all the power saving modes.
Rev. PrB | Page 22 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 22. Scratch Pad 2 SFR (SCRATCH2, 0xFC)
Bit
Mnemonic Default Description
7 to 0
SCRATCH2 Value can be written/read in this register. This value is maintained in all the power saving modes.
0
Table 23. Scratch Pad 3 SFR (SCRATCH3, 0xFD)
Bit
Mnemonic Default Description
7 to 0
SCRATCH3 Value can be written/read in this register. This value is maintained in all the power saving modes.
0
Table 24. Scratch Pad 4 SFR (SCRATCH4, 0xFE)
Bit
Mnemonic Default Description
7 to 0
SCRATCH4 Value can be written/read in this register. This value is maintained in all the power saving modes.
0
Clearing the Scratch Pad Registers (SCRATCH1, 0xFB to SCRATCH4, 0xFE)
Note that these scratch pad registers are only cleared when the part loses VDD and VBAT. They are not cleared by software, watchdog, or
PLL reset and, therefore, need to be set correctly in these situations.
Table 25. Power Control SFR (POWCON, 0xC5)
Bit
Mnemonic
Default
Description
7
Reserved
1
0
Reserved.
6
METER_OFF
Set this bit to turn off the modulators and energy metering DSP circuitry to reduce power if
metering functions are not needed in PSM0.
5
Reserved
COREOFF
Reserved
CD[2:0]
0
This bit should be kept at 0 for proper operation.
Set this bit to shut down the core and enter PSM2 if in the PSM1 operating mode.
Reserved.
4
0
3
0
2 to 0
010
Controls the core clock frequency, fCORE. fCORE = 4.096 MHz/2CD.
CD[2:0]
000
Result (fCORE in MHz)
4.096
2.048
1.024
0.512
0.256
0.128
0.064
0.032
001
010
011
100
101
110
111
Writing to the Power Control SFR (POWCON, 0xC5)
Writing data to the POWCON SFR involves writing 0xA7 into the key SFR (KYREG, 0xC1), which is described in Table 116, followed by a
write to the POWCON SFR. For example:
MOV KYREG,#0A7h
MOV POWCON,#10h
;Write KYREG to 0xA7 to get write access to the POWCON SFR
;Shutdown the core
Rev. PrB | Page 23 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
The battery switchover functionality provided by the ADE5166/
ADE5169/ADE5566/ADE5569 allows a seamless transition
from VDD to VBAT. An automatic battery switchover option
ensures a stable power supply to the ADE5166/ADE5169/
ADE5566/ADE5569, as long as the external battery voltage is
above 2.75 V. It allows continuous code execution even while
the internal power supply is switching from VDD to VBAT and
back. Note that the energy metering ADCs are not available
POWER SUPPLY ARCHITECTURE
Each ADE5166/ADE5169/ADE5566/ADE5569 has two power
supply inputs, VDD and VBAT, and require only a single 3.3 V power
supply at VDD for full operation. A battery backup, or secondary
power supply, with a maximum of 3.7 V can be connected to
the VBAT input. Internally, the ADE5166/ADE5169/ADE5566/
ADE5569 connect VDD or VBAT to VSWOUT, which is used to derive
power for the ADE5166/ADE5169/ADE5566/ADE5569 circuitry.
The VSWOUT output pin reflects the voltage at the internal
power supply (VSWOUT) and has a maximum output current of 6
mA. This pin can also be used to power a limited number of
peripheral components. The 2.5 V analog supply (VINTA) and the
2.5 V supply for the core logic (VINTD) are derived by on-chip
linear regulators from VSWOUT. Figure 10 shows the power supply
architecture of ADE5166/ADE5169/ADE5566/ADE5569.
when VBAT is being used for VSWOUT
.
Power supply management (PSM) interrupts can be enabled to
indicate when battery switchover occurs and when the VDD
power supply is restored (see the Power Supply Management
Interrupt (PSM) section.)
VDD to VBAT
The following three events switch the internal power supply
The ADE5166/ADE5169/ADE5566/ADE5569 provide
automatic battery switchover between VDD and VBAT based on
the voltage level detected at VDD or VDCIN. Additionally, the
BCTRL input can be used to trigger a battery switchover. The
conditions for switching VSWOUT from VDD to VBAT and back to
(VSWOUT) from VDD to VBAT
:
•
VDCIN < 1.2 V. When VDCIN falls below 1.2 V, VSWOUT switches
from VDD to VBAT. This event is enabled when the
BATPRG[1:0] bits in the battery switchover configuration
SFR (BATPR, 0xF5) = 0b01. Setting these bits disables
switchover based on VDCIN. Battery switchover on low VDCIN is
disabled by default.
VDD are described in the Battery Switchover section. VDCIN is an
input pin that can be connected to a 0 V to 3.3 V dc signal. This
input is intended for power supply supervisory purposes and
does not provide power to the ADE5166/ADE5169/ADE5566/
ADE5569 circuitry (see the Battery Switchover section).
•
•
VDD < 2.75 V. When VDD falls below 2.75 V, VSWOUT switches
from VDD to VBAT. This event is enabled when BATPRG[1:0] in
the BATPR SRF are cleared.
Falling edge on BCTRL. When the battery control pin,
BCTRL, goes low, VSWOUT switches from VDD to VBAT. This
external switchover signal can trigger a switchover to VBAT
at any time. Setting Bits INT1PRG[4:2] to 0bx01 in the
interrupt pins configuration SFR (INTPR, 0xFF) enables
the battery control pin (see Table 16).
V
V
V
V
DCIN
DD
BAT
SWOUT
MCU
ADE
ADC
V
INTD
LDO
LDO
POWER SUPPLY
MANAGEMENT
V
BCTRL
SW
V
INTA
ADC
LCD
2
SPI/I C
Switching from VBAT to VDD
SCRATCHPAD
RTC
To switch VSWOUT from VBAT to VDD, all of the following events
that are enabled to force battery switchover must be false:
UART
2.5V
TEMPERATURE ADC
3.3V
•
VDCIN < 1.2 V and VDD < 2.75 V enabled. If the low VDCIN
Figure 10. Power Supply Architecture
condition is enabled, VSWOUT switches to VDD after VDCIN
remains above 1.2 V and VDD remains above 2.75 V.
BATTERY SWITCHOVER
The ADE5166/ADE5169/ADE5566/ADE5569 monitor VDD
,
•
•
V
V
DD < 2.75 V enabled. VSWOUT switches back to VDD after
DD remains above 2.75 V.
VBAT, and VDCIN. Automatic battery switchover from VDD to VBAT
can be configured based on the status of VDD, VDCIN, or the
BCTRL pin. Battery switchover is enabled by default. Setting Bit 1
in the battery switchover configuration SFR (BATPR, 0xF5)
disables battery switchover so that VDD is always connected to
BCTRL enabled. VSWOUT switches back to VDD after BCTRL
is high, and the first or second bullet point is satisfied.
VSWOUT (see Table 18). The source of VSWOUT is indicated by Bit 6 in
the peripheral configuration SFR (PERIPH, 0xF4), which is
described in Table 19. Bit 6 is set when VSWOUT is connected to
VDD and cleared when VSWOUT is connected to VBAT.
Rev. PrB | Page 24 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
The power management interrupt enable SFR (IPSME, 0xEC)
controls the events that result in a PSM interrupt (see Table 20).
POWER SUPPLY MANAGEMENT INTERRUPT (PSM)
The power supply management interrupt (PSM) alerts the 8052
core of power supply events. The PSM interrupt is disabled by
default. Setting the EPSM bit in the interrupt enable and
Priority 2 SFR (IEIP2, 0xA9) enables the PSM interrupt (see
Table 73).
Figure 11 is a diagram illustrating how the PSM interrupt vector
is shared among the PSM interrupt sources. The PSM interrupt
flags are latched and must be cleared by writing to the IPSMF flag
register (see Table 17).
EPSR
FPSR
ESAG
FSAG
EVADC
FVADC
FPSM
EPSM
PENDING PSM
INTERRUPT
TRUE?
EBAT
FBAT
EBSO
FBSO
EVDCIN
FVDCIN
IPSME ADDR. 0xEC
IPSMF ADDR. 0xF8
IEIP2 ADDR. 0xA9
EPSR
FPSR
PS2
RESERVED
FPSM
ESAG
RESERVED
RESERVED
PSI
EVADC
FVADC
EADE
EBAT
FBAT
ETI
EBSO
FBSO
EPSM
EVDCIN
FVDCIN
ESI
FSAG
ES2
PTI
NOT INVOLVED IN PSM INTERRUPT SIGNAL CHAIN
Figure 11. PSM Interrupt Sources
Rev. PrB | Page 25 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Battery Switchover and Power Supply Restored
PSM Interrupt
VBAT Monitor PSM Interrupt
The VBAT voltage is measured using a dedicated ADC. These
measurements take place in the background at intervals to
check the change in VBAT. The FBAT bit is set when the battery
level is lower than the threshold set in the battery detection
threshold SFR (BATVTH, 0xFA), described in Table 52, or
when a new measurement is ready in the battery ADC value
SFR (BATADC, 0xDF), described in Table 54. See the Battery
Measurement section for more information. Setting the EBAT
bit in the power management interrupt enable SFR (IPSME,
0xEC) enables this event to generate a PSM interrupt.
The ADE5166/ADE5169/ADE5566/ADE5569 can be configured
to generate a PSM interrupt when the source of VSWOUT changes
from VDD to VBAT, indicating battery switchover. Setting the
EBSO bit in the power management interrupt enable SFR
(IPSME, 0xEC) enables this event to generate a PSM interrupt
(see Table 20).
The ADE5166/ADE5169/ADE5566/ADE5569 can also be
configured to generate an interrupt when the source of VSWOUT
changes from VBAT to VDD, indicating that the VDD power supply
has been restored. Setting the EPSR bit in the power management
interrupt enable SFR (IPSME, 0xEC) enables this event to generate
a PSM interrupt.
VDCIN Monitor PSM Interrupt
The VDCIN voltage is monitored by a comparator. The FVDCIN
bit in the power management interrupt flag SFR (IPSMF, 0xF8)
is set when the VDCIN input level is lower than 1.2 V. Setting the
EVDCIN bit in the IPSME SFR enables this event to generate a
PSM interrupt. This event, which is associated with the SAG
monitoring, can be used to detect a power supply (VDD) being
compromised and to trigger further actions prior to deciding a
The flags in the IPSMF SFR for these interrupts, FBSO and
FPSR, are set regardless of whether the respective enable bits
have been set. The battery switchover and power supply restore
event flags, FBSO and FPSR, are latched. These events must be
cleared by writing a 0 to these bits. Bit 6 in the peripheral
configuration SFR (PERIPH, 0xF4), VSWSOURCE, tracks the
source of VSWOUT. The bit is set when VSWOUT is connected to VDD
switch of VDD to VBAT
.
SAG Monitor PSM Interrupt
and cleared when VSWOUT is connected to VBAT
.
The ADE5166/ADE5169/ADE5566/ADE5569 energy measure-
ment DSP monitors the ac voltage input at the VP and VN input
pins. The SAGLVL register is used to set the threshold for a line
voltage SAG event. The FSAG bit in the power management
interrupt flag SFR (IPSMF, 0xF8) is set if the line voltage stays
below the level set in the SAGLVL register for the number of
line cycles set in the SAGCYC register. See the Line Voltage
SAG Detection section for more information. Setting the ESAG
bit in the power management interrupt enable SFR (IPSME,
0xEC) enables this event to generate a PSM interrupt.
VDCIN ADC PSM Interrupt
The ADE5166/ADE5169/ADE5566/ADE5569 can be configured
to generate a PSM interrupt when VDCIN changes magnitude by
more than a configurable threshold. This threshold is set in the
temperature and supply delta SFR (DIFFPROG, 0xF3), which is
described in Table 50. See the External Voltage Measurement
section for more information. Setting the EVDCIN bit in the
power management interrupt enable SFR (IPSME, 0xEC)
enables this event to generate a PSM interrupt.
The VDCIN voltage is measured using a dedicated ADC. These
measurements take place in the background at intervals to check
the change in VDCIN. Conversions can also be initiated by writing to
the start ADC measurement SFR (ADCGO, 0xD8) described in
Table 51. The FVDCIN flag indicates when a VDCIN measurement
is ready. See the External Voltage Measurement section for
details on how VDCIN is measured.
Rev. PrB | Page 26 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
When a SAG event occurs, user code can be configured to back
up data and prepare for battery switchover if desired. The rela-
tive spacing of these interrupts depends on the design of the
power supply.
USING THE POWER SUPPLY FEATURES
In an energy meter application, the 3.3 V power supply (VDD
)
is typically generated from the ac line voltage and regulated to
3.3 V by a voltage regulator IC. The preregulated dc voltage,
typically 5 V to 12 V, can be connected to VDCIN through a
resistor divider. A 3.6 V battery can be connected to VBAT
Figure 12 shows how the ADE5166/ADE5169/ADE5566/
Figure 14 shows the sequence of events that occurs if the main
power supply starts to fail in the power meter application shown
in Figure 12, with battery switchover on low VDCIN or low VDD
enabled.
.
ADE5569 power supply inputs are set up in this application.
Finally, the transition between VDD and VBAT and the different
power supply modes (see the Operating Modes section) are
represented in Figure 15 and Figure 16.
Figure 13 shows the sequence of events that occurs if the main
power supply generated by the PSU starts to fail in the power
meter application shown in Figure 12. The SAG detection can
provide the earliest warning of a potential problem on VDD
.
45
49
BCTRL
V
(240V, 220V, 110V TYPICAL)
AC INPUT
P
SAG
DETECTION
V
N
50
5V TO 12V DC
V
DCIN
VOLTAGE
SUPERVISORY
64
VOLTAGE
SUPERVISORY
POWER SUPPLY
MANAGEMENT
IPSMF SFR
(ADDR. 0xF8)
V
DD
3.3V
PSU
60
REGULATOR
V
SW
61
58
V
SWOUT
V
BAT
Figure 12. Power Supply Management for Energy Meter Application
V
– V
N
P
SAG LEVEL TRIP POINT
SAGCYC = 1
V
DCIN
1.2V
t1
V
DD
2.75V
t2
SAG EVENT
(FSAG = 1)
V
EVENT
IF SWITCHOVER ON LOW V IS ENABLED,
DD
AUTOMATIC BATTERY SWITCHOVER
DCIN
(FVDCIN = 1)
V
CONNECTED TO V
SWOUT
BAT
BSO EVENT
(FBSO = 1)
Figure 13. Power Supply Management Interrupts and Battery Switchover with Only VDD Enabled for Battery Switchover
Rev. PrB | Page 27 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Table 26. Power Supply Event Timing Operating Modes
Parameter Time
Description
t1
t2
t3
10 ns min
10 ns min
30 ms typ
Time between when VDCIN goes below 1.2 V and when FVDCIN is raised.
Time between when VDD falls below 2.75 V and when battery switchover occurs.
Time between when VDCIN falls below 1.2 V and when battery switchover occurs if VDCIN is enabled to cause
battery switchover.
t4
130 ms typ
Time between when power supply restore conditions are met (VDCIN above 1.2 V and VDD above 2.75 V if
BATPR[1:0] = 0b01 or VDD above 2.75 V if BATPR[1:0] = 0b00) and when VSWOUT switches to VDD.
V
– V
N
P
SAG LEVEL TRIP POINT
SAGCYC = 1
V
DCIN
1.2V
t3
t1
V
DD
2.75V
SAG EVENT
(FSAG = 1)
V
EVENT
IF SWITCHOVER ON LOW V
DCIN
ENABLED, AUTOMATIC BATTERY
IS
DCIN
(FVDCIN = 1)
SWITCHOVER V CONNECTED TO V
SWOUT BAT
BSO EVENT
(FBSO = 1)
Figure 14. Power Supply Management Interrupts and Battery Switchover with VDD or VDCIN Enabled for Battery Switchover
V
− V
N
P
SAG LEVEL
TRIP POINT
V
EVENT
SAG EVENT
DCIN
V
EVENT
DCIN
V
DCIN
1.2V
130ms MIN.
30ms MIN.
V
BAT
V
DD
2.75V
V
SW
PSM0
PSM0
PSM0
BATTERY SWITCH
ENABLED ON
PSM1 OR PSM2
LOW V
DCIN
V
SW
PSM0
BATTERY SWITCH
ENABLED ON
LOW V
DD
PSM1 OR PSM2
Figure 15. Power Supply Management Transitions Between Modes
Rev. PrB | Page 28 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
OPERATING MODES
PSM0 (NORMAL MODE)
PSM2 (SLEEP MODE)
PSM2 is a low power consumption sleep mode for use in battery
operation. In this mode, VSWOUT is connected to VBAT. All of the
2.5 V digital and analog circuitry powered through VINTA and VINTD
are disabled, including the MCU core, resulting in the following:
In PSM0, normal operating mode, VSWOUT is connected to VDD
All of the analog circuitry and digital circuitry powered by
.
VINTD and VINTA are enabled by default. In normal mode, the
default clock frequency, fCORE, established during a power-on
reset or software reset, is 1.024 MHz.
•
•
The RAM in the MCU is no longer valid.
The program counter for the 8052, also held in volatile
memory, becomes invalid when the 2.5 V supply is shut
down. Therefore, the program does not resume from
where it left off but always starts from the power-on reset
vector when the ADE5166/ADE5169/ADE5566/ADE5569
exit PSM2.
PSM1 (BATTERY MODE)
In PSM1, battery mode, VSWOUT is connected to VBAT.
In this operating mode, the 8052 core and all of the digital
circuitry are enabled by default. The analog circuitry for the
ADE energy metering DSP powered by VINTA is disabled. This
analog circuitry automatically restarts, and the switch to the
VDD power supply occurs when the VDD supply is above 2.75 V
and when the PWRDN bit in the MODE1 register (0x0B) is
cleared (see Table 32). The default fCORE for PSM1, established
during a power-on reset or software reset, is 1.024 MHz.
The 3.3 V peripherals (temperature ADC, VDCIN ADC, RTC,
and LCD) are active in PSM2. They can be enabled or disabled
to reduce power consumption and are configured for PSM2
operation when the MCU core is active (see Table 28 for more
information about the individual peripherals and their PSM2
configuration). The ADE5166/ADE5169/ADE5566/ADE5569
remain in PSM2 until an event occurs to wake them up.
In PSM2, the ADE5166/ADE5169/ADE5566/ADE5569 provide
four scratch pad RAM SFRs that are maintained during this
mode. These SFRs can be used to save data from PSM0 or
PSM1 when entering PSM2 (see Table 21 to Table 24).
In PSM2, the ADE5166/ADE5169/ADE5566/ADE5569 main-
tain some SFRs (see Table 27). The SFRs that are not listed in
this table should be restored when the part enters PSM0 or
PSM1 from PSM2.
Table 27. SFR Maintained in PSM2
I/O Configuration
Power Supply Management
RTC Peripherals
LCD Peripherals
Interrupt Pins Configuration SFR
(INTPR, 0xFF), see Table 16
Battery Detection Threshold SFR
(BATVTH, 0xFA), see Table 52
RTC Nominal Compensation SFR
(RTCCOMP, 0xF6), see Table 123
LCD Segment Enable 2 SFR
(LCDSEGE2, 0xED), see Table 91
Peripheral Configuration SFR (PERIPH, Battery Switchover Configuration
RTC Temperature Compensation
SFR (TEMPCAL, 0xF7),
see Table 124
LCD Configuration Y SFR
(LCDCONY, 0xB1), see Table 84
0xF4), see Table 19
SFR (BATPR, 0xF5), see Table 18
Port 0 Weak Pull-Up Enable SFR
(PINMAP0, 0xB2), see Table 156
Battery ADC Value SFR
(BATADC, 0xDF), see Table 54
RTC Configuration SFR (TIMECON,
0xA1), seeTable 119
LCD Configuration X SFR
(LCDCONX, 0x9C), see Table 82
Port 1 Weak Pull-Up Enable SFR
(PINMAP1, 0xB3), see Table 157
Peripheral ADC Strobe Period SFR
(STRBPER, 0xF9), see Table 49
RTC Configuration 2 SFR
(TIMECON2, 0xA2), see Table 120
LCD Configuration SFR
(LCDCON, 0x95), see Table 81
Port 2 Weak Pull-Up Enable SFR
(PINMAP2, 0xB4), see Table 158
Temperature and Supply Delta SFR All indirectly accessible register
LCD Clock SFR (LCDCLK, 0x96),
see Table 85
(DIFFPROG, 0xF3), see Table 50
defined in the RTC register list. See
Table 126
Scratch Pad 1 SFR (SCRATCH1, 0xFB),
see Table 21
VDCIN ADC Value SFR
(VDCINADC, 0xEF), see Table 53
LCD Segment Enable SFR
(LCDSEGE, 0x97) see Table 88
Scratch Pad 2 SFR (SCRATCH2, 0xFC),
see Table 22
Temperature ADC Value SFR
(TEMPADC, 0xD7), see Table 55
LCD Pointer SFR (LCDPTR, 0xAC),
see Table 89
Scratch Pad 3 SFR (SCRATCH3, 0xFD),
see Table 23
LCD Data SFR (LCDDAT, 0xAE),
see Table 90
Scratch Pad 4 SFR (SCRATCH4, 0xFE),
see Table 24
Rev. PrB | Page 29 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
3.3 V PERIPHERALS AND WAKE-UP EVENTS
Some of the 3.3 V peripherals are capable of waking the
ADE5166/ADE5169/ADE5566/ADE5569 from PSM2. The
events that can cause the ADE5166/ADE5169/ADE5566/
ADE5569 to wake up from PSM2 are listed in the Wake-Up
Event column in Table 28. The interrupt flag associated with
these events must be cleared prior to executing instructions that
put the ADE5166/ADE5169/ADE5566/ADE5569 in PSM2 mode
after wake-up.
Table 28. 3.3 V Peripherals and Wake-Up Events
Wake-
Up
Event
3.3 V
Peripheral
Wake-Up
Enable Bits
Interrupt
Vector
Flag
Comments
Temperature
ADC
∆T
Maskable
ITADC
The temperature ADC can wake up the ADE5166/ADE5169/
ADE5566/ADE5569 if the ITADC flag is set. A pending interrupt is
generated according to the description in the Temperature
Measurement section. This wake-up event can be disabled by
disabling temperature measurements in the temperature and
supply delta SFR (DIFFPROG, 0xF3) in PSM2. The temperature
interrupt needs to be serviced and acknowledged prior to entering
PSM2 mode.
VDCIN ADC
ΔV
Maskable
FVADC
IPSM
IPSM
The VDCIN measurement can wake up the ADE5166/ADE5169/
ADE5566/ADE5569. FVADC is set according to the description in
the External Voltage Measurement section. This wake-up event can
be disabled by clearing EVADC in the power management
interrupt enable SFR (IPSME, 0xEC); see Table 20. The FVADC flag
needs to be cleared prior to entering PSM2 mode.
Power Supply
Management
PSR
Nonmaskable PSR
The ADE5166/ADE5169/ADE5566/ADE5569 wake up if the power
supply is restored (if VSWOUT switches to be connected to VDD). The
VSWSOURCE flag, Bit 6 of the peripheral configuration SFR (PERIPH,
0xF4), is set to indicate that VSWOUT is connected to VDD.
RTC
Interval Maskable
ITFLAG
Alarm
IRTC
IRTC
The ADE5166/ADE5169/ADE5566/ADE5569 wake up after the
programmable time interval has elapsed. The RTC interrupt needs
to be serviced and acknowledged prior to entering PSM2 mode.
Alarm
Maskable
An alarm can be set to wake the ADE5166/ADE5169/ADE5566/
ADE5569 after the desired amount of time. The RTC alarm is
enabled by setting the corresponding ALxx_EN bits in the RTC
Configuration 2 SFR (TIMECON2, 0xA2). The RTC interrupt needs to
be serviced and acknowledged prior to entering PSM2 mode.
I/O Ports1
INT0
INT1
INT0PRG = 1
IE0
IE1
The edge of the interrupt is selected by Bit IT0 in the TCON register. The
IE0 flag bit in the TCON register is not affected. The Interrupt 0
interrupt needs to be serviced and acknowledged prior to entering
PSM2 mode.
INT1PRG[2:0]
= 11x
The edge of the interrupt is selected by Bit IT1 in the TCON register. The
IE1 flag bit in the TCON register is not affected. The Interrupt 1
interrupt needs to be serviced and acknowledged prior to entering
PSM2 mode.
Rx Edge RXPROG[1:0]
= 11
PERIPH[7]
(RXFG)
An Rx edge event occurs if a rising or falling edge is detected on
the Rx line. The UART RxD flag needs to be cleared prior to entering
PSM2 mode.
External Reset RESET
LCD
Nonmaskable
If the RESET pin is brought low while the ADE5166/ADE5169/
ADE5566/ADE5569 is in PSM2, it wakes up to PSM1.
The LCD can be enabled/disabled in PSM2. The LCD data memory
remains intact.
Scratch Pad
The four SCRATCHx registers remain intact in PSM2.
1 All I/O pins are treated as inputs. The weak pull-up on each I/O pin can be disabled individually in the Port 0 Weak Pull-Up Enable SFR (PINMAP0, 0xB2), Port 1 Weak
Pull-Up Enable SFR (PINMAP1, 0xB3), and Port 2 Weak Pull-Up Enable SFR (PINMAP2, 0xB4) to decrease current consumption. The interrupts can be enabled/disabled.
Rev. PrB | Page 30 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Automatic Switch to VDD (PSM1 to PSM0)
TRANSITIONING BETWEEN OPERATING MODES
If the conditions to switch VSWOUT from VBAT to VDD occur (see
the Battery Switchover section), the operating mode switches
to PSM0. When this switch occurs, the analog circuitry used in
the ADE energy measurement DSP automatically restarts. Note
that code execution continues normally. A software reset can
be performed to start PSM0 code execution at the power-on
reset vector.
The operating mode of the ADE5166/ADE5169/ADE5566/
ADE5569 is determined by the power supply connected to
V
V
SWOUT. Therefore, changes in the power supply, such as when
SWOUT switches from VDD to VBAT or when VSWOUT switches to
VDD, alter the operating mode. This section describes events
that change the operating mode.
Automatic Battery Switchover (PSM0 to PSM1)
USING THE POWER MANAGEMENT FEATURES
If any of the enabled battery switchover events occur (see the
Battery Switchover section), VSWOUT switches to VBAT. This switch-
over results in a transition from PSM0 to PSM1 operating
mode. When battery switchover occurs, the analog circuitry
used in the ADE energy measurement DSP is disabled. To
reduce power consumption, the user code can initiate a
transition to PSM2.
Because program flow is different for each operating mode, the
status of VSWOUT must be known at all times. The VSWSOURCE
bit in the peripheral configuration SFR (PERIPH, 0xF4) indicates
what VSWOUT is connected to (see Table 19). This bit can be used
to control program flow on wake-up. Because code execution
always starts at the power-on reset vector, Bit 6 of the PERIPH
SRF can be tested to determine which power supply is being
used and to branch to normal code execution or to wake up
event code execution. Power supply events can also occur when
the MCU core is active. To be aware of the events that change
what VSWOUT is connected to, use the following guidelines:
Entering Sleep Mode (PSM1 to PSM2)
To reduce power consumption when VSWOUT is connected to
VBAT, user code can initiate sleep mode, PSM2, by setting Bit 4
in the power control SFR (POWCON, 0xC5) to shut down the
MCU core. Events capable of waking the MCU can be enabled
(see the 3.3 V Peripherals and Wake-Up Events section).
•
Enable the battery switchover interrupt (EBSO)
if VSWOUT = VDD at power-up.
Servicing Wake-Up Events (PSM2 to PSM1)
•
Enable the power supply restored interrupt (EPSR)
if VSWOUT = VBAT at power-up.
The ADE5166/ADE5169/ADE5566/ADE5569 may need to
wake up from PSM2 to service wake-up events (see the 3.3 V
Peripherals and Wake-Up Events section). PSM1 code execu-
tion begins at the power-on reset vector. After servicing the
wake-up event, the ADE5166/ADE5169/ADE5566/ ADE5569
can return to PSM2 by setting Bit 4 in the power control SFR
(POWCON, 0xC5) to shut down the MCU core.
An early warning that battery switchover is about to occur is
provided by SAG detection and possibly low VDCIN detection
(see the Battery Switchover section).
For a user-controlled battery switchover, enable automatic
battery switchover on low VDD only. Then, enable the low VDCIN
event to generate the PSM interrupt. When a low VDCIN event
occurs, start data backup. Upon completion of the data backup,
enable battery switchover on low VDCIN. Battery switchover
occurs 30 ms later.
Automatic Switch to VDD (PSM2 to PSM0)
If the conditions to switch VSWOUT from VBAT to VDD occur (see
the Battery Switchover section), the operating mode switches to
PSM0. When this switch occurs, the MCU core and the analog
circuitry used in the ADE energy measurement DSP automatically
restart. PSM0 code execution begins at the power-on reset vector.
Rev. PrB | Page 31 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
POWER SUPPLY
RESTORED
AUTOMATIC BATTERY
SWITCHOVER
PSM0
PSM1
NORMAL MODE
CONNECTED TO V
BATTERY MODE
CONNECTED TO V
V
V
SWOUT
SWOUT
DD
BAT
POWER SUPPLY
RESTORED
WAKE-UP
EVENT
USER CODE DIRECTS MCU
TO SHUT DOWN CORE AFTER
SERVICING WAKE-UP EVENT
PSM2
SLEEP MODE
CONNECTED TO V
V
SWOUT
BAT
Figure 16. Transitioning Between Operating Modes
Rev. PrB | Page 32 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
ENERGY MEASUREMENT
The ADE5166/ADE5169/ADE5566/ADE5569 offer a fixed
function, energy measurement, digital processing core that
provides all the information needed to measure energy in
single-phase energy meters. The part provides two ways to
access the energy measurements: direct access through SFRs for
time sensitive information and indirect access through address
and data SFR registers for the majority of energy measurements.
The Irms, Vrms, interrupts, and waveform registers are readily
available through SFRs, as shown in Table 30. Other energy
measurement information is mapped to a page of memory that
is accessed indirectly through the MADDPT, MDATL, MDATM,
and MDATH SFRs. The address and data registers act as
pointers to the energy measurement internal registers.
energy measurement register designated by the address in the
MADDPT SFR. If the internal register is 1 byte long, only the
MDATL SFR content is copied to the internal register, while the
MDATM SFR and MDATH SFR contents are ignored.
The energy measurement core functions with an internal clock
of 4.096 MHz ∕ 5 or 819.2 kHz. Because the 8052 core functions
with another clock, 4.096MHz ∕ 2CD, synchronization between
the two clock environments when CD = 0 or 1 is an issue. When
data is written to the internal energy measurement registers, a
small wait period needs to be implemented before another read
or write to these registers can take place.
Sample code to write 0x0155 to the 2-byte SAGLVL register
located at 0x14 in the energy measurement memory space is as
follows:
ACCESS TO ENERGY MEASUREMENT SFRs
Access to the energy measurement SFRs is achieved by reading
or writing to the SFR addresses detailed in Table 30. The internal
data for the MIRQx SFRs are latched byte by byte into the SFR
when the SFR is read.
MOV
MOV
MOV
MOV
DJNZ
MDATM,#01h
MDATL,#55h
MADDPT,#SAGLVL_W (Address 0x94)
A,#05h
ACC,$
The WAV1x, WAV2x, VRMSx, and IRMSx registers are all 3-byte
SFRs. The 24-bit data is latched into these SFRs when the high
byte is read. Reading the low or medium byte before the high
byte results in reading the data from the previous latched sample.
;Next write or read to energy
measurement SFR can be done after
this.
Sample code to read the VRMSx register is as follows:
Reading the Internal Energy Measurement Registers
MOV
R1, VRMSH
//latches data in VRMSH,
VRMSM, and VRMSL SFRs
When Bit 7 of energy measurement pointer address SFR
(MADDPT, 0x91) is cleared, the content of the internal energy
measurement register designated by the address in MADDPT
is transferred to the MDATx SFRs. If the internal register is
1 byte long, only the MDATL SFR content is updated with a
new value, while the MDATM SFR and MDATH SFR contents
are reset to 0x00.
MOV
MOV
R2, VRMSM
R3, VRMSL
ACCESS TO INTERNAL ENERGY MEASUREMENT
REGISTERS
Access to the internal energy measurement registers is achieved
by writing to the energy measurement pointer address SFR
(MADDPT, 0x91). This SFR selects the energy measurement
register to be accessed and determines if a read or a write is
performed (see Table 29).
The energy measurement core functions with an internal clock
of 4.096 MHz ∕ 5 or 819.2 kHz. Because the 8052 core functions
with another clock, 4.096MHz ∕ 2CD, synchronization between
the two clock environments when CD = 0 or 1 is an issue. When
data is read from the internal energy measurement registers, a
small wait period needs to be implemented before the MDATx
SFRs are transferred to another SFR.
Table 29. Energy Measurement Pointer Address SFR
(MADDPT, 0x91)
Bit
Description
Sample code to read the peak voltage in the 2-byte VPKLVL
register located at 0x16 into the data pointer is as follows:
7
1 = write, 0 = read
6 to 0
Energy measurement internal register address
MOV
MOV
DJNZ
MOV
MOV
MADDPT,#VPKLVL_R (Address 0x16)
Writing to the Internal Energy Measurement Registers
A,#05h
When Bit 7 of the energy measurement pointer address SFR
(MADDPT, 0x91) is set, the content of the MDATx SFRs
(MDATL, MDATM, and MDATH) is transferred to the internal
ACC,$
DPH,MDATM
DPL,MDATL
Rev. PrB | Page 33 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Table 30. Energy Measurement SFRs
Address
0x91
0x92
0x93
0x94
0xD1
0xD2
0xD3
0xD4
0xD5
0xD6
0xD9
0xDA
0xDB
0xDC
0xDD
0xDE
0xE2
0xE3
0xE4
0xE5
0xE6
0xE7
R/W
R/W
R/W
R/W
R/W
R
R
R
R
R
Mnemonic
MADDPT
MDATL
MDATM
MDATH
VRMSL
VRMSM
VRMSH
IRMSL
Description
Energy measurement pointer address.
Energy measurement pointer data lowest significant byte.
Energy measurement pointer data middle byte.
Energy measurement pointer data most significant byte.
Vrms measurement lowest significant byte.
Vrms measurement middle byte.
Vrms measurement most significant byte.
Irms measurement lowest significant byte.
Irms measurement middle byte.
Irms measurement most significant byte.
Energy measurement interrupt enable lowest significant byte.
Energy measurement interrupt enable middle byte.
Energy measurement interrupt enable most significant byte.
Energy measurement interrupt status lowest significant byte.
Energy measurement interrupt status middle byte.
Energy measurement interrupt status most significant byte.
Selection 1 sample lowest significant byte.
Selection 1 sample middle byte.
IRMSM
IRMSH
R
R/W
R/W
R/W
R/W
R/W
R/W
R
R
R
R
R
MIRQENL
MIRQENM
MIRQENH
MIRQSTL
MIRQSTM
MIRQSTH
WAV1L
WAV1M
WAV1H
WAV2L
Selection 1 sample most significant byte.
Selection 2 sample lowest significant byte.
Selection 2 sample middle byte.
WAV2M
WAV2H
R
Selection 2 sample most significant byte.
×1, ×2, ×4,
×8, ×16
INTEGRATOR
WGAIN[11:0]
{GAIN[2:0]}
I
P
MULTIPLIER
dt
PGA1
I
ADC
LPF2
HPF
CF1NUM[15:0]
I
BP
WATTOS[15:0]
LPF2
π
2
VARGAIN[11:0]
PHCAL[7:0]
CF1
DFC
Ф
CF1DEN[15:0]
CF2NUM[15:0]
VAROS[15:0]
VAGAIN[11:0]
IRMSOS[11:0]
2
2
x
x
CF2
DFC
LPF
VRMSOS[11:0]
VARDIV[7:0]
V
V
CF2DEN[15:0]
P
PGA2
ADC
VADIV[7:0]
%
%
%
WDIV[7:0]
LPF
HPF
N
METERING SFRs
Figure 17. ADE5566 and ADE5569 Energy Metering Block Diagram
Rev. PrB | Page 34 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
×1, ×2, ×4,
×8, ×16
{GAIN[2:0]}
I
PA
INTEGRATOR
WGAIN[11:0]
PGA1
PGA1
I
ADC
ADC
MULTIPLIER
HPF
HPF
I
N
dt
LPF2
CF1NUM[15:0]
WATTOS[15:0]
LPF2
I
π
2
VARGAIN[11:0]
BP
IBGAIN[11:0]
CF1
DFC
Ф
CF1DEN[15:0]
CF2NUM[15:0]
VAROS[15:0]
VAGAIN[11:0]
IRMSOS[11:0]
2
2
x
x
CF2
DFC
LPF
VRMSOS[11:0]
VARDIV[7:0]
V
P
CF2DEN[15:0]
PGA2
ADC
VADIV[7:0]
%
%
%
WDIV[7:0]
LPF
V
N
HPF
METERING SFRs
Figure 18. ADE5166 and ADE5169 Energy Metering Block Diagram
Rev. PrB | Page 35 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
ENERGY MEASUREMENT REGISTERS
Table 31. Energy Measurement Register List
Address Length Signed/
MADDPT[6:0] Mnemonic R/W (Bits) Unsigned Default Description
0x01
0x02
0x03
0x04
0x05
0x06
0x07
WATTHR
RWATTHR
LWATTHR
VARHR1
RVARHR1
LVARHR1
VAHR
R
R
R
R
R
R
R
24
24
24
24
24
24
24
S
S
S
S
S
S
S
0
0
0
0
0
0
0
Reads Wh accumulator without reset.
Reads Wh accumulator with reset.
Reads Wh accumulator synchronous to line cycle.
Reads VARh accumulator without reset.
Reads VARh accumulator with reset.
Reads VARh accumulator synchronous to line cycle.
Reads VAh accumulator without reset. If the VARMSCFCON bit in the
MODE2 register (0x0C) is set, this register accumulates Irms
Reads VAh accumulator with reset. If the VARMSCFCON bit in the
MODE2 register (0x0C) is set, this register accumulates Irms
Reads VAh accumulator synchronous to line cycle. If the VARMSCFCON
bit in the MODE2 register (0x0C) is set, this register accumulates Irms
.
0x08
0x09
RVAHR
LVAHR
R
R
24
24
S
S
0
0
.
.
0x0A
0x0B
0x0C
0x0D
PER_FREQ
MODE1
MODE2
R
R/W
R/W
16
8
8
U
U
U
U
0
Reads line period or frequency register depending on Mode2 register.
Sets basic configuration of energy measurement (see Table 32).
Sets basic configuration of energy measurement (see Table 33).
Sets configuration of Waveform Sample 1 and Waveform Sample 2
(see Table 34).
0x06
0x40
0
WAVMODE R/W
8
0x0E
0x0F
NLMODE
ACCMODE R/W
R/W
8
8
U
U
0
0
Sets level of energy no load thresholds (see Table 35).
Sets configuration of WATT, VAR accumulation, and various tamper
alarms (see Table 36).
0x10
0x11
PHCAL
ZXTOUT
R/W
R/W 12
8
S
0x40
Sets phase calibration register (see the Phase Compensation section).
0x0FFF Sets timeout for zero-crossing timeout detection (see the Zero-
Crossing Timeout section).
0x12
0x13
0x14
0x15
0x16
LINCYC
SAGCYC
SAGLVL
IPKLVL
R/W 16
U
U
U
U
U
0xFFFF Sets number of half-line cycles for LWATTHR, LVARHR, and LVAHR
accumulators.
R/W
8
0xFF
Sets number of half-line cycles for SAG detection (see the Line
Voltage SAG Detection section).
R/W 16
R/W 16
R/W 16
0
Sets detection level for SAG detection (see the Line Voltage SAG
Detection section).
0xFFFF Sets peak detection level for current peak detection (see the Peak
Detection section).
0xFFFF Sets peak detection level for voltage peak detection (see the Peak
Detection section).
VPKLVL
0x17
0x18
0x19
IPEAK
RSTIPEAK
VPEAK
R
R
R
24
24
24
U
U
U
0
0
0
Reads current peak level without reset (see the Peak Detection section).
Reads current peak level with reset (see the Peak Detection section).
Reads voltage peak level without reset (see the Peak Detection
section).
0x1A
0x1B
0x1C
0x1D
0x1E
0x1F
0x20
0x21
0x22
0x23
0x24
0x25
0x26
0x27
0x28
RSTVPEAK
GAIN
R
R/W
24
8
U
U
S
S
S
S
S
S
S
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Reads voltage peak level with reset (see the Peak Detection section).
Sets PGA gain of analog inputs (see Table 37).
Sets matching gain for IPB current input.
Sets WATT gain register.
Sets VAR gain register.
Sets VA gain register.
IBGAIN2
WGAIN
VARGAIN1
VAGAIN
WATTOS
VAROS1
IRMSOS
VRMSOS
WDIV
VARDIV
VADIV
CF1NUM
CF1DEN
R/W 12
R/W 12
R/W 12
R/W 12
R/W 16
R/W 16
R/W 12
R/W 12
R/W
R/W
R/W
R/W 16
R/W 16
Sets WATT offset register.
Sets VAR offset register.
Sets current rms offset register.
Sets voltage rms offset register.
Sets WATT energy scaling register.
Sets VAR energy scaling register.
Sets VA energy scaling register.
Sets CF1 numerator register.
S
8
8
8
U
U
U
U
U
0x003F Sets CF1 denominator register.
Rev. PrB | Page 36 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Address
Length Signed/
MADDPT[6:0] Mnemonic R/W (Bits)
Unsigned Default Description
0x29
0x2A
0x2B
0x3B
0x3C
0x3D
0x3E
0x3F
CF2NUM
CF2DEN
MODE3
Reserved
Reserved
CALMODE2 R/W
Reserved
R/W 16
R/W 16
U
U
U
0
Sets CF2 numerator register.
0x003F Sets CF2 denominator register.
0
0
R/W
8
Enables Zero Crossing Outputs. See Table 38.
This register must be kept at its default value for proper operation.
0x0300 This register must be kept at its default value for proper operation.
8
U
0
0
0
For ADE5166/ADE5169 only. Set calibration mode.
This register must be kept at its default value for proper operation.
This register must be kept at its default value for proper operation.
Reserved
1 This function is not available in the ADE5566 and ADE5166.
2 This function is not available in the ADE5566 and ADE5569.
ENERGY MEASUREMENT INTERNAL REGISTERS DETAILS
Table 32. Mode 1 Register (MODE1, 0x0B)
Bit
Mnemonic Default
Description
7
6
5
4
3
2
1
0
SWRST
DISZXLPF
INTE
SWAPBITS
PWRDN
DISCF2
DISCF1
DISHPF
0
0
0
0
0
1
1
0
Setting this bit resets all of the energy measurement registers to their default values.
Setting this bit disables the zero-crossing low-pass filter.
Setting this bit enables the digital integrator for use with a di/dt sensor.
Setting this bit swaps CH1 ADC and CH2 ADC.
Setting this bit powers down voltage and current ADCs.
Setting this bit disables Frequency Output CF2.
Setting this bit disables Frequency Output CF1.
Setting this bit disables the HPFs in voltage and current channels.
Table 33. Mode 2 Register (MODE2, 0x0C)
Bit
Mnemonic
Default
Description
7 to 6
CF2SEL[1:0]
01
Configuration bits for CF2 output.
CF2SEL[1:0]
Result
00
01
1x
CF2 frequency is proportional to active power.
CF2 frequency is proportional to reactive power.1
CF2 frequency is proportional to apparent power or Irms
.
5 to 4
CF1SEL[1:0]
00
0
Configuration bits for CF1 output.
CF1SEL[1:0]
Result
00
01
1x
CF1 frequency is proportional to active power.
CF1 frequency is proportional to reactive power.1
CF1 frequency is proportional to apparent power or Irms
.
3
VARMSCFCON
Configuration bits for apparent power or Irms for CF1, CF2 outputs, and VA accumulation registers
(VAHR, RVAHR, and LVAHR). Note that CF1 cannot be proportional to VA if CF2 is proportional to
Irms and vice versa.
VARMSCFCON Result
0
1
If CF1SEL[1:0] = 1x, CF1 is proportional to VA.
If CF2SEL[1:0] = 1x, CF2 is proportional to VA.
If CF1SEL[1:0] = 1x, CF1 is proportional to Irms
.
If CF2SEL[1:0] = 1x, CF2 is proportional to Irms
.
2
ZXRMS
0
Logic 1 enables update of rms values synchronously to Voltage ZX.
Rev. PrB | Page 37 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Bit
Mnemonic
Default
Description
Configuration Bits to Select Period or Frequency Measurement for PER_FREQ Register (0x0A).
1
FREQSEL
0
FREQSEL
Result
0
1
PER_FREQ register holds a period measurement.
PER_FREQ register holds a frequency measurement.
0
WAVEN
0
When this bit is set, waveform sampling mode is enabled.
1 This function is not available in the ADE5566 and ADE5166.
Table 34. Waveform Mode Register (WAVMODE, 0x0D)
Bit
Mnemonic
Default
Description
7 to 5
WAV2SEL[2:0]
000
Waveform 2 Selection for Samples Mode.
WAV2SEL[2:0]
Source
000
Current
001
Voltage
010
011
100
101
Active power multiplier output
Reactive power multiplier output1
VA multiplier output
Irms LPF output
Others
Reserved
4 to 2
WAV1SEL[2:0]
000
Waveform 1 Selection for Samples Mode.
WAV1SEL[2:0]
Source
000
Current
001
Voltage
010
011
100
101
Active power multiplier output
Reactive power multiplier output1
VA multiplier output
Irms LPF output (low 24-bit)
Reserved
Others
1 to 0
DTRT[1:0]
00
Waveform Samples Output Data Rate.
DTRT[1:0]
Update Rate (Clock = fCORE/5 = 819.2 kHz)
00
01
10
11
25.6 kSPS (clock/32)
12.8 kSPS (clock/64)
6.4 kSPS (clock/128)
3.2 kSPS (clock/256)
1 This function is not available in the ADE5566 and ADE5166.
Table 35. No Load Configuration Register (NLMODE, 0x0E)
Bit
Mnemonic
Default
Description
7
DISVARCMP1
0
0
Setting this bit disables fundamental VAR gain compensation over line frequency.
6
IRMSNOLOAD
Logic 1 enables Irms no load threshold detection. The level is defined by the setting of the
VANOLOAD bits.
5 to 4
VANOLOAD[1:0]
00
Apparent Power No Load Threshold.
VANOLOAD[1:0]
Result
00
01
10
11
No load detection disabled
No load detection enabled with threshold = 0.030% of full scale
No load detection enabled with threshold = 0.015% of full scale
No load detection enabled with threshold = 0.0075% of full scale
Rev. PrB | Page 38 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Bit
Mnemonic
Default
Description
3 to 2
VARNOLOAD[1:0]1 00
Reactive Power No Load Threshold.
VARNOLOAD[1:0]
Result
00
01
10
11
No load detection disabled
No load detection enabled with threshold = 0.015% of full scale
No load detection enabled with threshold = 0.0075% of full scale
No load detection enabled with threshold = 0.0037% of full scale
1 to 0
APNOLOAD[1:0]
00
Active Power No Load Threshold.
APNOLOAD[1:0]
Result
00
01
10
11
No load detection disabled
No load detection enabled with threshold = 0.015% of full scale
No load detection enabled with threshold = 0.0075% of full scale
No load detection enabled with threshold = 0.0037% of full scale
1 This function is not available in the ADE5566 and ADE5166.
Table 36. Accumulation Mode Register (ACCMODE, 0x0F)
Bit
Mnemonic
ICHANNEL1
Default
Description
7
0
This bit indicates the current channel used to measure energy in antitampering mode.
0 = Channel A
1 = Channel B
6
FAULTSIGN1
0
Configuration bit to select the event that triggers a fault interrupt.
0 = FAULTSIGN interrupt occurs when the part enters fault mode
1 = FAULTSIGN interrupt occurs when the part enters normal mode
5
4
VARSIGN2
APSIGN
0
0
Configuration bit to select the event that triggers a reactive power sign interrupt. If set to 0,
VARSIGN interrupt occurs when reactive power changes from positive to negative. If set to 1,
VARSIGN interrupt occurs when reactive power changes from negative to positive.
Configuration bit to select event that triggers an active power sign interrupt. If set to 0, APSIGN
interrupt occurs when active power changes from positive to negative. If set to 1, APSIGN
interrupt occurs when active power changes from negative to positive.
3
2
ABSVARM2
SAVARM2
0
0
Logic 1 enables absolute value accumulation of reactive power in energy register and pulse
output.
Logic 1 enables reactive power accumulation depending on the sign of the active power. If
active power is positive, VAR is accumulated as it is. If active power is negative, the sign of the
VAR is reversed for the accumulation. This accumulation mode affects both the VAR registers
(VARHR, RVARHR, LVARHR) and the pulse output when connected to VAR.2
1
0
POAM
ABSAM
0
0
Logic 1 enables positive-only accumulation of active power in energy register and pulse output.
Logic 1 enables absolute value accumulation of active power in energy register and pulse
output.
1 This function is not available in the ADE5566 and ADE5569.
2 This function is not available in the ADE5566 and ADE5166.
Table 37. Gain Register (GAIN, 0x1B)
Bit
Mnemonic
Default
Description
7 to 5
PGA2[2:0]
000
These bits define the voltage channel input gain.
PGA2[2:0]
000
001
010
011
Result
Gain = 1
Gain = 2
Gain = 4
Gain = 8
Gain = 16
100
4
3
Reserved
0
0
Reserved.
CFSIGN_OPT
This bit defines where the CF change of sign detection (APSIGN or VARSIGN) is implemented.
CFSIGN_OPT
Result
0
1
Filtered power signal
On a per CF pulse basis
Rev. PrB | Page 39 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Bit
Mnemonic
Default
Description
2 to 0
PGA1[2:0]
000
These bits define the current channel input gain.
PGA1[2:0]
000
001
010
011
Result
Gain = 11
Gain = 2
Gain = 4
Gain = 8
Gain = 16
100
1 This gain is not recommended in the ADE5166 and ADE5169 because it can create an overranging of the ADC when both current inputs are in opposite phase.
Table 38. Mode 3 Register (MODE30x2B)
Bit No.
Mnemonic
Reserved
ZX1
Default
Description
7 to 2
1
0
0
0
0
Reserved
Setting this bit enables the zero crossing output signal on P1.2
Setting this bit enables the zero crossing output signal on P0.5
ZX2
Table 39. Calibration Mode Register (CALMODE, 0x3D)1
Bit
Mnemonic
Default
Description
7 to 6
5 to 4
Reserved
0
0
These bits should be kept cleared for proper operation.
These bits define the current channel used for energy measurements.
SEL_I_CH[1:0]
SEL_I_CH[1:0]
Result
00
01
10
11
Current channel automatically selected by the tampering condition
Current channel connected to IPA
Current channel connected to IPB
Current channel automatically selected by the tampering condition
3
V_CH_SHORT
I_CH_SHORT
Reserved
0
0
0
Logic one short voltage channel to ground.
Logic one short Current channels to ground.
These bits should be kept clear for proper operation.
2
1 to 0
1 This register is not available in the ADE5566 and ADE5569.
INTERRUPT STATUS/ENABLE SFRS
Table 40. Interrupt Status 1 SFR (MIRQSTL, 0xDC)
Bit
Interrupt Flag
Description
7
ADEIRQFLAG
This bit is set if any of the ADE status flags that are enabled to generate an ADE interrupt are set. This bit is
automatically cleared when all of the enabled ADE status flags are cleared.
6
5
4
3
2
Reserved
FAULTSIGN1
VARSIGN2
APSIGN
Reserved.
Logic 1 indicates that the fault mode has changed according to the configuration of the ACCMODE register.
Logic 1 indicates that the reactive power sign has changed according to the configuration of the ACCMODE register.
Logic 1 indicates that the active power sign has changed according to the configuration of the ACCMODE register.
Logic 1 indicates that an interrupt has been caused by apparent power no load detection. This interrupt is also
used to reflect the part entering the Irms no load mode.
VANOLOAD
1
0
RNOLOAD2
APNOLOAD
Logic 1 indicates that an interrupt has been caused by reactive power no load detection.
Logic 1 indicates that an interrupt has been caused by active power no load detection.
1 This function is not available in the ADE5566 and ADE5569.
2 This function is not available in the ADE5566 and ADE5166.
Rev. PrB | Page 40 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 41. Interrupt Status 2 SFR (MIRQSTM, 0xDD)
Bit
Interrupt Flag
Description
7
CF2
Logic 1 indicates that a pulse on CF2 has been issued. The flag is set even if CF2 pulse output is not
enabled by clearing Bit 2 of the MODE1 register.
6
CF1
Logic 1 indicates that a pulse on CF1 has been issued. The flag is set even if CF1 pulse output is not
enabled by clearing Bit 1 of the MODE1 register.
5
4
3
2
1
0
VAEOF
REOF1
AEOF
VAEHF
REHF1
AEHF
Logic 1 indicates that the VAHR register has overflowed.
Logic 1 indicates that the VARHR register has overflowed.
Logic 1 indicates that the WATTHR register has overflowed.
Logic 1 indicates that the VAHR register is half full.
Logic 1 indicates that the VARHR register is half full.
Logic 1 indicates that the WATTHR register is half full.
1 This function is not available in the ADE5566 and ADE5166.
Table 42. Interrupt Status 3 SFR (MIRQSTH, 0xDE)
Bit
Interrupt Flag
RESET
Reserved
WFSM
PKI
PKV
CYCEND
ZXTO
Description
7
6
5
4
3
2
1
0
Indicates the end of a reset (for both software and hardware reset).
Reserved.
Logic 1 indicates that new data is present in the waveform registers (Address 0xE2 to Address 0xE7).
Logic 1 indicates that current channel has exceeded the IPKLVL value
Logic 1 indicates that voltage channel has exceeded the VPKLVL value.
Logic 1 indicates the end of the energy accumulation over an integer number of half-line cycles.
Logic 1 indicates that no zero crossing on the line voltage happened for the last ZXTOUT half-line cycles.
Logic 1 indicates detection of a zero crossing in the voltage channel.
ZX
Table 43. Interrupt Enable 1 SFR (MIRQENL, 0xD9)
Bit
Interrupt Enable Bit
Description
7 to 6
Reserved
FAULTSIGN1
VARSIGN2
Reserved.
5
4
3
2
1
0
When this bit is set, the FAULTSIGN bit set creates a pending ADE interrupt to the 8052 core.
When this bit is set, the VARSIGN flag set creates a pending ADE interrupt to the 8052 core.
When this bit is set, the APSIGN flag set creates a pending ADE interrupt to the 8052 core.
When this bit is set, the VANOLOAD flag set creates a pending ADE interrupt to the 8052 core.
When this bit is set, the RNOLOAD flag set creates a pending ADE interrupt to the 8052 core.
When this bit is set, the APNOLOAD flag set creates a pending ADE interrupt to the 8052 core.
APSIGN
VANOLOAD
RNOLOAD2
APNOLOAD
1 This function is not available in the ADE5566 and ADE5569.
2 This function is not available in the ADE5566 and ADE5166.
Table 44. Interrupt Enable 2 SFR (MIRQENM, 0xDA)
Bit
Interrupt Enable Bit
Description
7
6
5
4
3
2
1
0
CF2
CF1
When this bit is set, a CF2 pulse creates a pending ADE interrupt to the 8052 core.
When this bit is set, a CF1 pulse creates a pending ADE interrupt to the 8052 core.
When this bit is set, the VAEOF flag set creates a pending ADE interrupt to the 8052 core.
When this bit is set, the REOF flag set creates a pending ADE interrupt to the 8052 core.
When this bit is set, the AEOF flag set creates a pending ADE interrupt to the 8052 core.
When this bit is set, the VAEHF flag set creates a pending ADE interrupt to the 8052 core.
When this bit is set, the REHF flag set creates a pending ADE interrupt to the 8052 core.
When this bit is set, the AEHF flag set creates a pending ADE interrupt to the 8052 core.
VAEOF
REOF1
AEOF
VAEHF
REHF1
AEHF
1 This function is not available in the ADE5566 and ADE5166.
Rev. PrB | Page 41 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Table 45. Interrupt Enable 3 SFR (MIRQENH, 0xDB)
Bit
Interrupt Enable Bit
Description
7 to 6
Reserved
WFSM
PKI
Reserved.
5
4
3
2
1
0
When this bit is set, the WFSM flag set creates a pending ADE interrupt to the 8052 core.
When this bit is set, the PKI flag set creates a pending ADE interrupt to the 8052 core.
When this bit is set, the PKV flag set creates a pending ADE interrupt to the 8052 core.
When this bit is set, the CYCEND flag set creates a pending ADE interrupt to the 8052 core.
When this bit is set, the ZXTO flag set creates a pending ADE interrupt to the 8052 core.
When this bit is set, the ZX flag set creates a pending ADE interrupt to the 8052 core.
PKV
CYCEND
ZXTO
ZX
GAIN[7:0]
ANALOG INPUTS
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
Each ADE5166/ADE5169/ADE5566/ADE5569 has two fully
differential voltage input channels. The maximum differential
input voltage for input pairs VP/VN and IP/IN is 0.4 V for the
ADE5566 and ADE5569.
GAIN (K)
SELECTION
I
P
For the ADE5166 and ADE5169, PGA1 = 1 is not recommended
because at full scale, when both IPA and IPB are 180° out of phase,
the ADC can be overranged. It is recommended, for these
products, that PGA1 = 2, 4, 8, or 16 be used.
K × V
IN
V
IN
I
N
Each analog input channel has a programmable gain amplifier
(PGA) with possible gain selections of 1, 2, 4, 8, and 16. The
gain selections are made by writing to the GAIN register (see
Table 37 and Figure 20). Bit 0 to Bit 2 select the gain for the PGA
in the current channel, and Bit 5 to Bit 7 select the gain for the
PGA in the voltage channel. For the ADE5166 and ADE5169, it
is recommended that PGA1 = 2, 4, 8, or 16 be used. Figure 19
shows how a gain selection for the current channel is made
using the gain register.
Figure 19. PGA in Current Channel
GAIN REGISTER*
CURRENT AND VOLTAGE CHANNELS PGA CONTROL
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
ADDR:
0x1B
PGA2 GAIN SELECT
000 = ×1
PGA1 GAIN SELECT
000 = ×1
001 = ×2
001 = ×2
010 = ×4
010 = ×4
011 = ×8
100 = ×16
011 = ×8
100 = ×16
CFSIGN_OPT
RESERVED
*REGISTER CONTENTS SHOW POWER-ON DEFAULTS.
Figure 20. Analog Gain Register
Rev. PrB | Page 42 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
effect of spreading the quantization noise (noise due to
sampling) over a wider bandwidth. With the noise spread more
thinly over a wider bandwidth, the quantization noise in the
band of interest is lowered (see Figure 21).
ANALOG-TO-DIGITAL CONVERSION
Each ADE5166/ADE5169/ADE5566/ADE5569 has two Σ-Δ
analog-to-digital converters (ADCs). The outputs of these ADCs
are mapped directly to waveform sampling SFRs (Address 0xE2
to Address 0xE7) and are used for energy measurement internal
digital signal processing. In PSM1 (battery mode) and PSM2
(sleep mode), the ADCs are powered down to minimize power
consumption.
However, oversampling alone is not efficient enough to improve
the signal-to-noise ratio (SNR) in the band of interest. For example,
an oversampling ratio of four is required to increase the SNR by
only 6 dB (1 bit). To keep the oversampling ratio at a reasonable
level, it is possible to shape the quantization noise so that the
majority of the noise lies at the higher frequencies. In the Σ-ꢀ
modulator, the noise is shaped by the integrator, which has a
high-pass-type response for the quantization noise. The result is
that most of the noise is at the higher frequencies where it can
be removed by the digital low-pass filter. This noise shaping is
shown in Figure 21.
For simplicity, the block diagram in Figure 22 shows a first-
order Σ-ꢀ ADC. The converter is made up of the Σ-ꢀ modulator
and the digital low-pass filter.
A Σ-ꢀ modulator converts the input signal into a continuous
serial stream of 1s and 0s at a rate determined by the sampling
clock. In the ADE5166/ADE5169/ADE5566/ADE5569, the
sampling clock is equal to 4.096 MHz/5. The 1-bit DAC in the
feedback loop is driven by the serial data stream. The DAC
output is subtracted from the input signal. If the loop gain is
high enough, the average value of the DAC output (and, therefore,
the bit stream) can approach that of the input signal level.
ANTIALIAS
FILTER (RC)
DIGITAL
FILTER
SAMPLING
FREQUENCY
SIGNAL
SHAPED
NOISE
NOISE
For any given input value in a single sampling interval, the data
from the 1-bit ADC is virtually meaningless. Only when a large
number of samples are averaged is a meaningful result obtained.
This averaging is carried into the second part of the ADC, the
digital low-pass filter. By averaging a large number of bits from
the modulator, the low-pass filter can produce 24-bit data-
words that are proportional to the input signal level.
0
2
409.6
FREQUENCY (kHz)
819.2
HIGH RESOLUTION
SIGNAL
OUTPUT FROM DIGITAL
LPF
NOISE
The Σ-ꢀ converter uses two techniques to achieve high resolution
from what is essentially a 1-bit conversion technique. The first
is oversampling. Oversampling means that the signal is sampled
at a rate (frequency) that is many times higher than the bandwidth
of interest. For example, the sampling rate in the ADE5166/
ADE5169/ADE5566/ADE5569 is 4.096 MHz/5 (819.2 kHz), and
the band of interest is 40 Hz to 2 kHz. Oversampling has the
0
2
409.6
FREQUENCY (kHz)
819.2
Figure 21. Noise Reduction Due to Oversampling and
Noise Shaping in the Analog Modulator
MCLK/5
ANALOG
LOW-PASS FILTER
DIGITAL
INTEGRATOR
LOW-PASS
LATCHED
COMPARATOR
FILTER
+
R
–
C
24
V
REF
... 10100101 ...
1-BIT DAC
Figure 22. First-Order Σ-∆ ADC
Rev. PrB | Page 43 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
ALIASING EFFECTS
Antialiasing Filter
Figure 22 also shows an analog low-pass filter (RC) on the input
to the modulator. This filter is present to prevent aliasing, an
artifact of all sampled systems. Aliasing means that frequency
components in the input signal to the ADC, which are higher
than half the sampling rate of the ADC, appear in the sampled
signal at a frequency below half the sampling rate. Figure 23
illustrates the effect. Frequency components (the black arrows)
above half the sampling frequency (also known as the Nyquist
frequency, that is, 409.6 kHz) are imaged or folded back down
below 409.6 kHz. This happens with all ADCs regardless of the
architecture. In Figure 23, only frequencies near the sampling
frequency (819.2 kHz) move into the band of interest for
metering (40 Hz to 2 kHz). This allows the use of a very simple
LPF (low-pass filter) to attenuate high frequency (near
SAMPLING
FREQUENCY
IMAGE
FREQUENCIES
0
2
409.6
819.2
FREQUENCY (kHz)
Figure 23. ADC and Signal Processing in Current Channel Outline Dimensions
ADC Transfer Function
Both ADCs in the ADE5166/ADE5169/ADE5566/ADE5569 are
designed to produce the same output code for the same input
signal level. With a full-scale signal on the input of 0.4 V and
an internal reference of 1.2 V, the ADC output code is nominally
2,147,483 or 0x20C49B. The maximum code from the ADC is
4,194,304; this is equivalent to an input signal level of 0.794 V.
However, for specified performance, it is recommended that the
full-scale input signal level of 0.4 V not be exceeded.
819.2 kHz) noise and prevents distortion in the band of interest.
For conventional current sensors, a simple RC filter (single-pole
LPF) with a corner frequency of 10 kHz produces an attenuation
of approximately 40 dB at 819.2 kHz (see Figure 23). The 20 dB
per decade attenuation is usually sufficient to eliminate the
effects of aliasing for conventional current sensors. However, for
a di/dt sensor such as a Rogowski coil, the sensor has a 20 dB
per decade gain. This neutralizes the −20 dB per decade attenua-
tion produced by one simple LPF. Therefore, when using a di/dt
sensor, care should be taken to offset the 20 dB per decade gain.
One simple approach is to cascade two RC filters to produce the
−40 dB per decade attenuation needed.
Current Channel ADC
Figure 24 shows the ADC and signal processing chain for the
current channel. In waveform sampling mode, the ADC outputs
a signed, twos complement, 24-bit data-word at a maximum of
25.6 kSPS (4.096 MHz/160).
With the specified full-scale analog input signal of 0.4 V and
PGA1 = 1, the ADC produces an output code that is approximately
between 0x20C49B (+2,147,483d) and 0xDF3B65 (−2,147,483d).
For inputs of 0.25 V, 0.125 V, 82.6 mV, and 31.3 mV with PGA1 = 2,
4, 8, and 16, respectively, the ADC produces an output code that
is approximately between 0x28F5C2 (+2,684,354d) and 0xD70A3E
(–2,684,354d).
MODE1[5]
×1, ×2, ×4
×8, ×16
{GAIN[2:0]}
CURRENT RMS (I
CALCULATION
)
rms
REFERENCE
ADC
WAVEFORM SAMPLE
REGISTER
DIGITAL
INTEGRATOR*
I
I
P
N
ACTIVE AND REACTIVE
POWER CALCULATION
PGA1
I
dt
HPF
CURRENT CHANNEL
WAVEFORM
DATA RANGE AFTER
INTEGRATOR (50Hz)
50Hz
0x342CD0
V1
0.25V, 0.125V,
62.5mV, 31.3mV
CURRENT CHANNEL
WAVEFORM
DATA RANGE
0x000000
0V
0x28F5C2
60Hz
0xCBD330
0x000000
ANALOG
INPUT
CURRENT CHANNEL
WAVEFORM
RANGE
DATA RANGE AFTER
INTEGRATOR (60Hz)
0xD70A3E
0x2B7850
0x000000
0xD487B0
*WHEN DIGITAL INTEGRATOR IS ENABLED, FULL-SCALE OUTPUT DATA IS ATTENUATED
DEPENDING ON THE SIGNAL FREQUENCY BECAUSE THE INTEGRATOR HAS A –20dB/DECADE
FREQUENCY RESPONSE. WHEN DISABLED, THE OUTPUT IS NOT FURTHER ATTENUATED.
PGA1 = 1 IS NOT RECOMMENDED IN THE ADE5166 AND ADE5169.
Figure 24. ADC and Signal Processing in Current Channel with PGA1 = 1, 2, 4, 8, or 16 for ADE5566 and ADE5569
Rev. PrB | Page 44 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
×1, ×2, ×4,
×8, ×16
{GAIN[2:0]}
I
PA
INTEGRATOR
WGAIN[11:0]
PGA1
PGA1
I
ADC
ADC
MULTIPLIER
HPF
HPF
I
N
dt
LPF2
CF1NUM[15:0]
WATTOS[15:0]
LPF2
I
π
2
VARGAIN[11:0]
BP
IBGAIN[11:0]
CF1
DFC
Ф
CF1DEN[15:0]
CF2NUM[15:0]
VAROS[15:0]
VAGAIN[11:0]
IRMSOS[11:0]
2
2
x
x
CF2
DFC
LPF
VRMSOS[11:0]
VARDIV[7:0]
V
P
CF2DEN[15:0]
PGA2
ADC
VADIV[7:0]
%
%
%
WDIV[7:0]
LPF
V
N
HPF
METERING SFRs
Figure 25. ADC and Signal Processing in Current Channel with PGA1 = 2, 4, 8, or 16 for ADE5166 and ADE5169
ACTIVE AND REACTIVE
×1, ×2, ×4,
REFERENCE
ADC
POWER CALCULATION
×8, ×16
{GAIN[7:5]}
VOLTAGE RMS (V
)
rms
V
V
P
N
CALCULATION
HPF
WAVEFORM SAMPLE
REGISTER
PGA2
V2
VOLTAGE PEAK DETECT
V2
0.5V, 0.25V,
0.125V, 62.5mV,
31.3mV
ZX DETECTION
LPF1
f–3dB = 63.7Hz
0V
VOLTAGE CHANNEL
WAVEFORM
DATA RANGE
ZX SIGNAL
DATA RANGE FOR 60Hz SIGNAL
0x1DD0
ANALOG
MODE1[6]
0x28F5
INPUT
RANGE
0x0000
0xE230
0x0000
0xD70B
ZX SIGNAL
DATA RANGE FOR 50Hz SIGNAL
0x2037
0x0000
0xDFC9
Figure 26. ADC and Signal Processing in Voltage Channel
Rev. PrB | Page 45 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Voltage Channel ADC
Channel Selection Indication
Figure 26 shows the ADC and signal processing chain for the
voltage channel. In waveform sampling mode, the ADC outputs
a signed, twos complement, 24-bit data-word at a maximum
of 25.6 kSPS (MCLK/160). The ADC produces an output code
that is approximately between 0x28F5 (+10,485d) and 0xD70B
(−10,485d).
The current channel selected for measurement is indicated by
Bit 7 (ICHANNEL) in the ACCMODE register (0x0F). When
this bit is cleared, IPA is selected and, when it is set, IPB is
selected. The ADE5166/ADE5169 automatically switch from
one channel to the other and report the channel configuration
in the ACCMODE register (0x0F)..
Channel Sampling
The current channel selected for measurement can also be
forced. Setting the SEL_I_CH[1:0] bits in the CALMODE
register (0x3D) selects IPA and IPB, respectively. When both bits
are cleared or set, the current channel used for measurement is
selected automatically based on the fault detection.
The waveform samples of the current ADC and voltage ADC
can also be routed to the waveform registers to be read by the
MCU core. The active, reactive, apparent power, and energy
calculation remain uninterrupted during waveform sampling.
Fault Indication
When in waveform sampling mode, one of four output sample
rates can be chosen by using the DTRT[1:0] bits of the WAVMODE
register (see Table 34). The output sample rate can be 25.6 kSPS,
12.8 kSPS, 6.4 kSPS, or 3.2 kSPS. If the WFSM enable bit is set
in the Interrupt Enable 3 SFR (MIRQENH, 0xDB), the 8052
core has a pending ADE interrupt. The sampled signals selected
in the WAVMODE register are latched into the waveform SFRs
when the waveform high byte (WAV1H or WAV2H) is read.
The ADE5166/ADE5169 provide an indication of the part going
in or out of a fault condition. The new fault condition is indicated
by the FAULTSIGN flag (Bit 5) in the Interrupt Status 1 SFR
(MIRQSTL, 0xDC).
When FAULTSIGN bit (Bit 6) of the ACCMODE register
(0x0F) is cleared, the FAULTSIGN flag in the Interrupt Status 1
SFR (MIRQSTL, 0xDC) is set when the part is a entering fault
condition or a normal condition.
The ADE interrupt stays active until the WFSM status bit is
cleared (see the Energy Measurement Interrupts section).
FAULT DETECTION1
When the FAULTSIGN bit is set in the Interrupt Enable 1 SFR
(MIRQENL, 0xD9), and the FAULTSIGN flag in the Interrupt
Status 1 SFR (MIRQSTL, 0xDC) is set, the 8052 core has a
pending ADE interrupt.
The ADE5166/ADE5169 incorporate a fault detection scheme
that warns of fault conditions and allows the ADE5166/ADE5169
to continue accurate measurement during a fault event. The
ADE5166/ADE5169 do this by continuously monitoring both
current inputs (IPA and IPB). For ease of understanding, these
currents are referred to as phase and neutral (return) currents.
In the ADE5166/ADE5169, a fault condition is defined when
the difference between IPA and IPB is greater than 6.25% of the
active channel. If a fault condition is detected and the inactive
channel is larger than the active channel, the ADE5166/ADE5169
automatically switch current measurement to the inactive
channel. During a fault, the active, reactive, current rms and
apparent powers are generated using the larger of the two
currents. On power-up, IPA is the current input selected for
active, reactive, and apparent power and Irms calculations.
Fault with Active Input Greater Than Inactive Input
If IPA is the active current input (that is, being used for billing),
and the voltage signal on IPB (inactive input) falls below 93.75%
of IPA, and the FAULTSIGN bit (Bit 6) of the ACCMODE
register (0x0F) is cleared, the FAULTSIGN flag in the Interrupt
Status 1 SFR (MIRQSTL, 0xDC) is set. Both analog inputs are
filtered and averaged to prevent false triggering of this logic
output. As a consequence of the filtering, there is a time delay of
approximately three seconds on the logic output after the fault
event. The FAULTSIGN flag is independent of any activity.
Because IPA is the active input and it is still greater than IPB,
billing is maintained on IPA; that is, no swap to the IPB input
occurs. IPA remains the active input.
To prevent a false alarm, averaging is done for the fault
detection, and a fault condition is detected approximately one
second after the event. The fault detection is automatically
disabled when the voltage signal is less than 0.3% of the full-
scale input range. This eliminates false detection of a fault due
to noise at light loads.
Fault with Inactive Input GreaterThan Active Input
If the difference between IPB, the inactive input, and IPA, the
active input (that is, being used for billing), becomes greater
than 6.25% of IPB, and the FAULTSIGN bit (Bit 6) of the
ACCMODE register (0x0F) is cleared, the FAULTSIGN flag in
the Interrupt Status 1 SFR (MIRQSTL, 0xDC) is set. The analog
input IPB becomes the active input. Again, a time constant of
about 3 sec is associated with this swap. IPA does not swap back
to the active channel until IPA is greater than IPB and the differ-
ence between IPA and IPB, in this order, becomes greater than 6.25%
of IPB. However, if the FAULTSIGN bit (Bit 6) of the ACCMODE
register (0x0F) is set, the FAULTSIGN flag in the Interrupt Status 1
SFR (MIRQSTL, 0xDC) is set as soon as IPA is within 6.25% of
IPB. This threshold eliminates potential chatter between IPA and IPB.
Because the ADE5166/ADE5169 look for a difference between
the voltage signals on IPA and IPB, it is important that both
current transducers be closely matched.
1 This function is not available in the ADE5566 and ADE5569.
Rev. PrB | Page 46 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Calibration Concerns
di/dt CURRENT SENSOR AND DIGITAL
INTEGRATOR FOR THE ADE5569/ADE5169
Typically, when a meter is being calibrated, the voltage and
current circuits are separated, as shown in Figure 27. This
means that current passes through only the phase or neutral
circuit. Figure 27 shows current being passed through the phase
circuit. This is the preferred option because the ADE5166/
ADE5169 start billing on the input IPA on power-up. The phase
circuit CT is connected to IPA in the diagram. Because the
current sensors are not perfectly matched, it is important to
match current inputs. The ADE5166/ADE5169 provide a gain
calibration register for IPB, IBGAIN (Address 0x1C). IBGAIN is
a 12-bit, signed, twos complement register that provides a gain
resolution of 0.0244%/LSB.
A di/dt sensor, a feature available for the AD5569/ADE5169 but
not for the AD5566/ADE5166, detects changes in the magnetic
field caused by ac currents. Figure 28 shows the principle of a
di/dt current sensor.
MAGNETIC FIELD CREATED BY CURRENT
(DIRECTLY PROPORTIONAL TO CURRENT)
+
–
EMF (ELECTROMOTIVE FORCE)
INDUCED BY CHANGES IN
For calibration, a first measurement should be done on IPA by
setting the SEL_I_CH bits to 0b01 in the CALMODE register
(0x3D). This measurement should be compared to the measure-
ment on IPB. Measuring IPB can be forced by setting the SEL_I_CH
bits to 0b10 in the CALMODE register (0x3D). The gain error
between these two measurements can be evaluated using
MAGNETIC FLUX DENSITY (di/dt)
Figure 28. Principle of a di/dt Current Sensor
The flux density of a magnetic field induced by a current is directly
proportional to the magnitude of the current. The changes in
the magnetic flux density passing through a conductor loop
generate an electromotive force (EMF) between the two ends of
the loop. The EMF is a voltage signal that is proportional to the
di/dt of the current. The voltage output from the di/dt current
sensor is determined by the mutual inductance between the
current-carrying conductor and the di/dt sensor. The current
signal needs to be recovered from the di/dt signal before it can
be used. An integrator is therefore necessary to restore the
signal to its original form.
Measurement
(
I B
)
− Measurement
I A
(
I A
)
Error
(
% =
)
Measurement
(
)
The two channels IPA and IPB can then be matched by writing
–Error(%)/(1 + Error(%)) × 212 to the IBGAIN register. This
matching adjustment is valid for all energy measurements made
by the ADE5166/ADE5169., including active power, reactive
power, Irms, and apparent power,
I
R
F
The ADE5569/ADE5169 have a built-in digital integrator to
recover the current signal from the di/dt sensor. The digital
integrator on the current channel is switched off by default when
the ADE5569/ADE5169 are powered up. Setting the INTE bit in
the MODE1 register (0x0B) turns on the integrator. Figure 29 to
Figure 32 show the gain and phase response of the digital
integrator.
PA
I
CT
PB
0
R
B
C
V
F
F
A
AGND
I
I
N
0V
R
C
B
TEST
CURRENT
CT
10
R
F
B
R
A
V
P
C
R
F
F
V
N
0
R
C
F
T
–10
V
240V rms
–20
–30
Figure 27. Fault Conditions for Inactive Input Greater Than Active Input
–40
–50
100
1000
FREQUENCY (Hz)
Figure 29. Combined Gain Response of the Digital Integrator and
Phase Compensator
Rev. PrB | Page 47 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
–88.0
–89.70
–89.75
–89.80
–89.85
–89.90
–89.95
–90.00
–88.5
–89.0
–89.5
–90.0
–90.5
–90.05
2
3
10
10
40
45
50
55
60
65
70
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 30. Combined Phase Response of the Digital Integrator and
Phase Compensator
Figure 32. Combined Phase Response of the Digital Integrator and
Phase Compensator (40 Hz to 70 Hz)
–1.0
Note that the integrator has a −20 dB/dec attenuation and an
approximately −90° phase shift. When combined with a di/dt
sensor, the resulting magnitude and phase response should be a
flat gain over the frequency band of interest. The di/dt sensor
has a 20 dB/dec gain associated with it. It also generates significant
high frequency noise. Therefore, a more effective antialiasing
filter is needed to avoid noise due to aliasing (see the Antialiasing
Filter section).
–1.5
–2.0
–2.5
–3.0
–3.5
–4.0
–4.5
When the digital integrator is switched off, the ADE5569/ADE5169
can be used directly with a conventional current sensor, such as a
current transformer (CT), or with a low resistance current shunt.
–5.0
–5.5
–6.0
40
45
50
55
60
65
70
FREQUENCY (Hz)
Figure 31. Combined Gain Response of the Digital Integrator and
Phase Compensator (40 Hz to 70 Hz)
Rev. PrB | Page 48 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
before a zero crossing is detected in the Interrupt Status 3 SFR
(MIRQSTH, 0xDE), and the ZXTO bit in the Interrupt Enable 3
SFR (MIRQENH, 0xDB) is set, the 8052 core has a pending
ADE interrupt.
POWER QUALITY MEASUREMENTS
Zero-Crossing Detection
Each ADE5166/ADE5169/ADE5566/ADE5569 has a zero-
crossing detection circuit on the voltage channel. This external
zero-crossing signal can be output on P0.5 and P1.2 (see Table 38.
It is also used in calibration mode.
The ADE interrupt stays active until the ZXTO status bit is
cleared (see the Energy Measurement Interrupts section). The
ZXTOUT register (Address 0x11) can be written to or read by
the user (see the Energy Measurement Register List section).
The resolution of the register is 160/MCLK seconds per LSB.
Thus, the maximum delay for an interrupt is 0.16 seconds
(1/MCLK × 212) when MCLK = 4.096 MHz.
The zero crossing is generated by default from the output of
LPF1. This filter has a low cutoff frequency and is intended for
50 Hz and 60 Hz systems. If needed, this filter can be disabled
to allow a higher frequency signal to be detected or to limit the
group delay of the detection. If the voltage input fundamental
frequency is below 60 Hz, and a time delay in ZX detection is
acceptable, it is recommended to enable LPF1. Enabling LPF1
limits the variability in the ZX detection by eliminating the high
frequency components. Figure 33 shows how the zero-crossing
signal is generated.
Figure 34 shows the mechanism of the zero-crossing timeout
detection when the line voltage stays at a fixed dc level for more
than MCLK/160 × ZXTOUT seconds.
12-BIT INTERNAL
REGISTER VALUE
ZXTOUT
×1, ×2, ×4,
×8, ×16
REFERENCE
V
{GAIN[7:5]}
PGA2
P
N
HPF
ADC 2
V2
VOLTAGE
CHANNEL
V
ZERO
CROSS
ZX
LPF1
f–3dB = 63.7Hz
ZXTO
FLAG
BIT
MODE1[6]
Figure 34. Zero-Crossing Timeout Detection
43.24° @ 60Hz
1.0
0.73
Period or Frequency Measurements
ZX
The ADE5166/ADE5169/ADE5566/ADE5569 provide the
period or frequency measurement of the line. The period or
frequency measurement is selected by clearing or setting the
FREQSEL bit in the MODE2 register (0x0C). The period/
frequency register, PER_FREQ Register (0x0A), is an unsigned
16-bit register that is updated every period. If LPF1 is enabled, a
settling time of 1.8 seconds is associated with this filter before
the measurement is stable.
LPF1
V2
Figure 33. Zero-Crossing Detection on the Voltage Channel
The zero-crossing signal ZX is generated from the output of
LPF1 (bypassed or not). LPF1 has a single pole at 63.7 Hz (at
MCLK = 4.096 MHz). As a result, there is a phase lag between
the analog input signal V2 and the output of LPF1. The phase
lag response of LPF1 results in a time delay of approximately
2 ms (@ 60 Hz) between the zero crossing on the analog inputs
of the voltage channel and ZX detection.
When the period measurement is selected, the measurement has a
2.44 μs/LSB (4.096 MHz/10), which represents 0.014% when the
line frequency is 60 Hz. When the line frequency is 60 Hz, the value
of the period register is approximately 0d6827. The length of
the register enables the measurement of line frequencies as low
as 12.5 Hz. The period register is stable at 1 LSB when the line
is established and the measurement does not change.
The zero-crossing detection also drives the ZX flag in the
Interrupt Status 3 SFR (MIRQSTH, 0xDE). If the ZX bit in the
Interrupt Enable 3 SFR (MIRQENH, 0xDB) is set, the 8052 core
has a pending ADE interrupt. The ADE interrupt stays active
until the ZX status bit is cleared (see the Energy Measurement
Interrupts section).
When the frequency measurement is selected, the measurement
has a 0.0625 Hz/LSB resolution when MCLK = 4.096 MHz,
which represents 0.104% when the line frequency is 60 Hz.
When the line frequency is 60 Hz, the value of the frequency
register is 0d960. The frequency register is stable at 4 LSB when
the line is established and the measurement does not change.
Zero-Crossing Timeout
The zero-crossing detection also has an associated timeout
register, ZXTOUT. This unsigned, 12-bit register is decremented
(1 LSB) every 160/MCLK seconds. The register is reset to its
user programmed, full-scale value every time a zero crossing is
detected on the voltage channel. The default power-on value in
this register is 0xFFF. If the internal register decrements to 0
Line Voltage SAG Detection
In addition to detection of the loss of the line voltage signal
(zero crossing), the ADE5166/ADE5169/ADE5566/ADE5569
Rev. PrB | Page 49 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
V
2
can also be programmed to detect when the absolute value of
the line voltage drops below a certain peak value for a number
of line cycles. This condition is illustrated in Figure 35.
VPKLVL[15:0]
VOLTAGE CHANNEL
FULL SCALE
SAGLVL[15:0]
PKV RESET
LOW WHEN
MIRQSTH SFR
IS READ
PKV INTERRUPT
FLAG
SAG RESET LOW
WHEN VOLTAGE
CHANNEL EXCEEDS
SAGLVL[15:0] AND
SAGCYC[7:0] = 0x04
RESET BIT PKV
IN MIRQSTH SFR
SAG FLAG RESET
3 LINE CYCLES
SAG FLAG
Figure 36. Peak Level Detection
Figure 36 shows a line voltage exceeding a threshold that is set
in the voltage peak register (VPKLVL[15:0]). The voltage peak
event is recorded by setting the PKV flag in the Interrupt Status
3 SFR (MIRQSTH, 0xDE). If the PKV enable bit is set in the
Interrupt Enable 3 SFR (MIRQENH, 0xDB), the 8052 core has
a pending ADE interrupt. Similarly, the current peak event is
recorded by setting the PKI flag in Interrupt Status 3 SFR
(MIRQSTH, 0xDE). The ADE interrupt stays active until the
PKV or PKI status bit is cleared (see the Energy Measurement
Interrupts section).
Figure 35. SAG Detection
Figure 35 shows the line voltage falling below a threshold that
is set in the SAG level register (SAGLVL[15:0]) for three line
cycles. The quantities 0 and 1 are not valid for the SAGCYC
register, and the contents represent one more than the desired
number of full line cycles. For example, when the SAG cycle
(SAGCYC[7:0]) contains 0x04, FSAG in the power management
interrupt flag SFR (IPSMF, 0xF8) is set at the end of the third
line cycle after the line voltage falls below the threshold. If the SAG
enable bit (ESAG) in the power management interrupt enable SFR
(IPSME, 0xEC) is set, the 8052 core has a pending power supply
management interrupt. The PSM interrupt stays active until the
ESAG bit is cleared (see the Power Supply Management Interrupt
(PSM) section).
Peak Level Set
The contents of the VPKLVL and IPKLVL registers are compared
to the absolute value of the voltage and 2 MSBs of the current
channel, respectively. Thus, for example, the nominal maximum
code from the current channel ADC with a full-scale signal is
0x28F5C2 (see the Current Channel ADC section). Therefore,
writing 0x28F5 to the IPKLVL register puts the current channel,
peak detection level at full scale and sets the current peak detec-
tion to its least sensitive value. Writing 0x00 puts the current
channel detection level at 0. The detection is done by comparing
the contents of the IPKLVL register to the incoming current
channel sample. The PKI flag indicates that the peak level is
exceeded. If the PKI or PKV bit is set in the Interrupt Enable 3
SFR (MIRQENH, 0xDB), the 8052 core has a pending ADE
interrupt.
In Figure 35, the SAG flag (FSAG) is set on the fifth line cycle
after the signal on the voltage channel first dropped below the
threshold level.
SAG Level Set
The 2-byte contents of the SAG level register (SAGLVL, 0x14)
are compared to the absolute value of the output from LPF1.
Therefore, when LPF1 is enabled, writing 0x2038 to the SAG
level register puts the SAG detection level at full scale (see
Figure 35). Writing 0x00 or 0x01 puts the SAG detection level
at 0. The SAG level register is compared to the input of the ZX
detection, and detection is made when the contents of the SAG
level register are greater.
Peak Level Record
Each ADE5166/ADE5169/ADE5566/ADE5569 records the
maximum absolute value reached by the voltage and current
channels in two different registers, IPEAK and VPEAK,
respectively. Each register is a 24-bit unsigned register that is
updated each time the absolute value of the waveform sample
from the corresponding channel is above the value stored in the
VPEAK or IPEAK register. The contents of the VPEAK register
correspond to the maximum absolute value observed on the
voltage channel input. The contents of IPEAK and VPEAK
represent the maximum absolute value observed on the current
and voltage input, respectively. Reading the RSTVPEAK and
RSTIPEAK registers clears their respective contents after the read
operation.
Peak Detection
The ADE5166/ADE5169/ADE5566/ADE5569 can also be
programmed to detect when the absolute value of the voltage
or current channel exceeds a specified peak value. Figure 36
illustrates the behavior of the peak detection for the voltage
channel. Both voltage and current channels are monitored at
the same time.
Rev. PrB | Page 50 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
PHASE COMPENSATION
RMS CALCULATION
The ADE5166/ADE5169/ADE5566/ADE5569 must work with
transducers that can have inherent phase errors. For example,
a phase error of 0.1° to 0.3° is not uncommon for a current
transformer (CT). These phase errors can vary from part to part,
and they must be corrected to perform accurate power calcula-
tions. The errors associated with phase mismatch are particularly
noticeable at low power factors. The ADE5166/ADE5169/
ADE5566/ADE5569 provide a means of digitally calibrating
these small phase errors. The part allows a small time delay or
time advance to be introduced into the signal processing chain
to compensate for small phase errors. Because the compensation
is in time, this technique should only be used for small phase
errors in the range of 0.1° to 0.5°. Correcting large phase errors
using a time shift technique can introduce significant phase
errors at higher harmonics.
The root mean square (rms) value of a continuous signal V(t) is
defined as
T
1
Vrms
=
× V 2 (t)dt
(1)
∫
T
0
For time sampling signals, rms calculation involves squaring the
signal, taking the average, and obtaining the square root. The
ADE5166/ADE5169/ADE5566/ADE5569 implement this method
by serially squaring the input, averaging them, and then taking
the square root of the average. The averaging part of this signal
processing is done by implementing a low-pass filter (LPF3 in
Figure 38, Figure 40, and Figure 41). This LPF has a −3 dB cutoff
frequency of 2 Hz when MCLK = 4.096 MHz.
V
(
t
)
=
2 ×V sin(ωt)
where V is the rms voltage.
V 2 (t) =V 2 −V 2 cos
2ωt
(2)
The phase calibration register (PHCAL[7:0]) is a twos complement,
signed, single-byte register that has values ranging from 0x82
(−126d) to 0x68 (+104d).
(
)
(3)
The PHCAL register is centered at 0x40, meaning that writing
0x40 to the register gives 0 delay. By changing this register, the
time delay in the voltage channel signal path can change from
−231.93 μs to +48.83 μs (MCLK = 4.096 MHz). One LSB is
equivalent to a 1.22 μs (4.096 MHz/5) time delay or advance. A
line frequency of 60 Hz gives a phase resolution of 0.026° at the
fundamental (that is, 360° × 1.22 μs × 60 Hz).
When this signal goes through LPF3, the cos(2ωt) term is attenu-
ated and only the dc term Vrms2 (shown as V2 in Figure 38) goes
through.
2
2
2
V
(t) = V – V cos(2ωt)
V(t) = √2 × V sin(ωt)
LPF3
INPUT
V
Figure 37 illustrates how the phase compensation is used to
remove a 0.1° phase lead in the current channel due to the
external transducer. To cancel the lead (0.1°) in the current
channel, a phase lead must also be introduced into the voltage
channel. The resolution of the phase adjustment allows the
introduction of a phase lead in increments of 0.026°. The phase
lead is achieved by introducing a time advance into the voltage
channel. A time advance of 4.88 μs is made by writing −4 (0x3C)
to the time delay block, thus reducing the amount of time delay
by 4.88 μs, or equivalently, a phase lead of approximately 0.1° at a
line frequency of 60 Hz (0x3C represents −4 because the register is
centered with 0 at 0x40).
2
2
(t) = V
V
Figure 38. RMS Signal Processing
The Irms signal can be read from the waveform register by setting
the WAVMODE register (0x0D) and setting the WFSM bit in
the Interrupt Enable 3 SFR (MIRQENH, 0xDB). Like the current
and voltage channels waveform sampling modes, the waveform
data is available at sample rates of 25.6 kSPS, 12.8 kSPS, 6.4 kSPS,
or 3.2 kSPS.
It is important to note that when the current input is larger than
40% of full scale, the Irms waveform sample register does not
represent the true processed rms value. The rms value processed
with this level of input is larger than the 24-bit read by the wave-
form register, making the value read truncated on the high end.
I
/I
HPF
P
PA
24
PGA1
ADC 1
I
I
N
LPF2
24
V
P
CHANNEL 2 DELAY
REDUCED BY 4.48µs
(0.1°LEAD AT 60Hz)
0x0B IN PHCAL[7:0]
1
DELAY BLOCK
1.22µs/LSB
PGA2
V
V
ADC 2
0.1°
V
N
7
1
0
V
I
0
0 1 0 1 1 1
PHCAL[7:0]
–231.93µs TO +48.83µs
I
60Hz
60Hz
Figure 37. Phase Calibration
Rev. PrB | Page 51 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Current Channel RMS Calculation
4, 8, or 16. The current rms measurement provided in the
ADE5166/ADE5169/ADE5566/ADE5569 is accurate to within
0.5% for signal inputs between full scale and full scale/500. The
conversion from the register value to amps must be done exter-
nally in the microprocessor using an amps/LSB constant.
Each ADE5166/ADE5169/ADE5566/ADE5569 simultaneously
calculates the rms values for the current and voltage channels in
different registers. Figure 39 and Figure 40 show the detail of the
signal processing chain for the rms calculation on the current
channel. The current channel rms value is processed from the
samples used in the current channel waveform sampling mode
and is stored in an unsigned 24-bit register (Irms). One LSB of
the current channel rms register is equivalent to one LSB of a
current channel waveform sample.
Current Channel RMS Offset Compensation
The ADE5166/ADE5169/ADE5566/ADE5569 incorporate a
current channel rms offset compensation register (IRMSOS).
This is a 12-bit signed register that can be used to remove offset
in the current channel rms calculation. An offset can exist in
the rms calculation due to input noises that are integrated into
the dc component of V2(t).
The update rate of the current channel rms measurement is
4.096 MHz/5. To minimize noise in the reading of the register,
the Irms register can also be configured to update only with the
zero crossing of the voltage input. This configuration is done by
setting the ZXRMS bit in the MODE2 register (0x0C).
One LSB of the current channel rms offset is equivalent to
16,384 LSBs of the square of the current channel rms register.
Assuming that the maximum value from the current channel
rms calculation is 0d1,898,124 with full-scale ac inputs, then
1 LSB of the current channel rms offset represents 0.23% of
measurement error at −60 dB down from full scale.
With the different specified full-scale analog input signal PGA1
values, the ADC produces an output code that is approximately
0d2,147,483 (PGA1 = 1) or 0d2,684,354 (PGA1 = 2, 4, 8, or 16);
see the Current Channel ADC section. Similarly, the equivalent
rms value of a full-scale ac signal is 0d1,518,499 (0x172BA3)
when PGA = 1 and 0d1,898,124 (0x1CF68C) when PGA1 = 2,
2
(4)
Irms
=
Irms + IRMSOS ×32768
0
where Irms0 is the rms measurement without offset correction.
CURRENT CHANNEL
WAVEFORM
60Hz
DATA RANGE WITH
INTEGRATOR ON (60Hz)
0x2B7850
0x000000
0xD487B0
IRMSOS[11:0]
I
(t)
rms
MODE1[5]
25 26 27
18 17 16
2 2
sgn 2
2
2
2
HPF
HPF
I
0x00
DIGITAL
P
INTEGRATOR*
HPF1
24
LPF3
+
24
I
[23:0]
rms
dt
I
PB
CURRENT CHANNEL
WAVEFORM
DATA RANGE WITH
INTEGRATOR OFF
0x28F5C2
0x000000
0xD70A3E
NOTES:
1. WHEN DIGITAL INTEGRATOR IS ENABLED, FULL-SCALE OUTPUT DATA IS ATTENUATED DEPENDING ON THE SIGNAL
FREQUENCY BECAUSE THE INTEGRATOR HAS A –20dB/DECADE FREQUENCY RESPONSE. WHEN DISABLED, THE
OUTPUT IS NOT FURTHER ATTENUATED.
Figure 39. ADE5566/ADE5569 Current Channel RMS Signal Processing with PGA1 = 1, 2, 4, 8, or 16
Rev. PrB | Page 52 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
CURRENT CHANNEL
WAVEFORM
60Hz
DATA RANGE WITH
INTEGRATOR ON (60Hz)
0x2B7850
0x000000
0xD487B0
IRMSOS[11:0]
I
(t)
rms
MODE1[5]
25 26 27
18 17 16
2 2
sgn 2
LPF3
2
2
2
HPF
HPF
I
I
0x00
DIGITAL
PA
PB
INTEGRATOR*
HPF1
24
+
24
I
[23:0]
rms
dt
CURRENT CHANNEL
IBGAIN
WAVEFORM
DATA RANGE WITH
INTEGRATOR OFF
0x28F5C2
0x000000
0xD70A3E
NOTES:
1. WHEN DIGITAL INTEGRATOR IS ENABLED, FULL-SCALE OUTPUT DATA IS ATTENUATED DEPENDING ON THE SIGNAL
FREQUENCY BECAUSE THE INTEGRATOR HAS A –20dB/DECADE FREQUENCY RESPONSE. WHEN DISABLED, THE
OUTPUT IS NOT FURTHER ATTENUATED.
Figure 40. ADE5166/ADE5169 Current Channel RMS Signal Processing with PGA1 = 2, 4, 8, or 16
VOLTAGE SIGNAL (V(t))
VRMOS[11:0]
0x28F5
0x0
16 15
sgn 2
8
7
6
2
2
2
2
VRMSx[23:0]
0xD70B
0x28F5C2
0x00
LPF3
LPF1
+
+
VOLTAGE CHANNEL
Figure 41. Voltage Channel RMS Signal Processing
Rev. PrB | Page 53 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Voltage Channel RMS Calculation
The average power over an integral number of line cycles (n) is
given by the expression in Equation 9.
Figure 41 shows details of the signal processing chain for the
rms calculation on the voltage channel. The voltage channel
rms value is processed from the samples used in the voltage
channel waveform sampling mode and is stored in the unsigned
24-bit Vrms register.
1
nT
P =
nT p(t)dt = VI
(9)
∫
0
where:
T is the line cycle period.
The update rate of the voltage channel rms measurement is
MCLK/5. To minimize noise in the reading of the register, the
Vrms register can also be configured to update only with the zero
crossing of the voltage input. This configuration is done by
setting the ZXRMS bit in the MODE2 register (0x0C).
P is referred to as the active or real power.
Note that the active power is equal to the dc component of the
instantaneous power signal p(t) in Equation 9, that is, VI. This
is the relationship used to calculate active power in the ADE5166/
ADE5169/ADE5566/ADE5569. The instantaneous power signal
p(t) is generated by multiplying the current and voltage signals. The
dc component of the instantaneous power signal is then extracted
by LPF2 (low-pass filter) to obtain the active power information.
This process is illustrated in Figure 42.
With the specified full-scale ac analog input signal of 0.4 V, the
output from the LPF1 in Figure 41 swings between 0x28F5 and
0xD70B at 60 Hz (see the Voltage Channel ADC section). The
equivalent rms value of this full-scale ac signal is approximately
0d1,898,124 (0x1CF68C) in the Vrms register. The voltage rms
measurement provided in the ADE5166/ADE5169/ADE5566/
ADE5569 is accurate to within 0.5% for signal input between
full scale and full scale/20. The conversion from the register
value to volts must be done externally in the microprocessor
using a V/LSB constant.
INSTANTANEOUS
POWER SIGNAL
p(t) = v × i – v × i × cos(2ωt)
0x19999A
ACTIVE REAL POWER
SIGNAL = v × i
VI
0xCCCCD
Voltage Channel RMS Offset Compensation
The ADE5166/ADE5169/ADE5566/ADE5569 incorporate a
voltage channel rms offset compensation register (VRMSOS).
This is a 12-bit signed register that can be used to remove offset
in the voltage channel rms calculation. An offset can exist in the
rms calculation due to input noises and dc offset in the input
samples. One LSB of the voltage channel rms offset is equivalent
to 64 LSBs of the rms register. Assuming that the maximum
value from the voltage channel rms calculation is 0d1,898,124
with full-scale ac inputs, then 1 LSB of the voltage channel rms
offset represents 3.37% of measurement error at −60 dB down
of full scale.
0x00000
CURRENT
i(t) = √2 × i × sin(ωt)
VOLTAGE
v(t) = √2 × v × sin(ωt)
Figure 42. Active Power Calculation
Because LPF2 does not have an ideal brick wall frequency
response (see Figure 43), the active power signal has some
ripple due to the instantaneous power signal. This ripple is
sinusoidal and has a frequency equal to twice the line frequency.
Because of its sinusoidal nature, the ripple is removed when the
active power signal is integrated to calculate energy (see the
Active Energy Calculation section).
Vrms = Vrms0 + 64 × VRMSOS
(5)
where Vrms0 is the rms measurement without offset correction.
ACTIVE POWER CALCULATION
0
Active power is defined as the rate of energy flow from source
to load. It is the product of the voltage and current waveforms.
The resulting waveform is called the instantaneous power signal
and is equal to the rate of energy flow at every instant of time.
The unit of power is the watt or joules/second. Equation 8 gives an
expression for the instantaneous power signal in an ac system.
–4
–8
–12
–16
–20
v
(
t
)
=
2 ×V sin(ωt)
(6)
(7)
( )
i t = 2 × I sin(ωt)
where:
v is the rms voltage.
i is the rms current.
–24
1
3
10
30
100
FREQUENCY (Hz)
p(t) = v(t)× i(t)
Figure 43. Frequency Response of LPF2
p(t) = VI −VI cos(2ωt)
(8)
Rev. PrB | Page 54 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Active Power Gain Calibration
Active Power Sign Detection
Figure 44 shows the signal processing chain for the active power
calculation in the ADE5166/ADE5169/ADE5566/ADE5569. As
explained previously, the active power is calculated by filtering
the output of the multiplier with a low-pass filter. Note that
when reading the waveform samples from the output of LPF2,
the gain of the active energy can be adjusted by using the
multiplier and watt gain register (WGAIN[11:0]). The gain is
adjusted by writing a twos complement 12-bit word to the watt
gain register. Equation 10 shows how the gain adjustment is
related to the contents of the watt gain register.
The ADE5166/ADE5169/ADE5566/ADE5569 detect a change
of sign in the active power. The APSIGN flag in the Interrupt
Status 1 SFR (MIRQSTL, 0xDC) records when a change of sign
has occurred according to Bit APSIGN in the ACCMODE register
(0x0F). If the APSIGN flag is set in the Interrupt Enable 1 SFR
(MIRQENL, 0xD9), the 8052 core has a pending ADE interrupt.
The ADE interrupt stays active until the APSIGN status bit is
cleared (see the Energy Measurement Interrupts section).
When APSIGN in the ACCMODE register (0x0F) is cleared
(default), the APSIGN flag in the Interrupt Status 1 SFR
(MIRQSTL, 0xDC) is set when a transition from positive–to-
negative active power has occurred.
⎛
⎞
WGAIN
212
⎧
⎫
⎬
⎭
⎜
⎟
⎟
Output WGAIN = Active Power × 1+
(10)
⎨
⎜
⎩
⎝
⎠
When APSIGN in the ACCMODE register (0x0F) is set, the
APSIGN flag in the MIRQSTL SFR is set when a transition
from negative to positive active power occurs.
For example, when 0x7FF is written to the watt gain register, the
power output is scaled up by 50% (0x7FF = 2047d, 2047/212 = 0.5).
Similarly, 0x800 = −2048d (signed, twos complement) and power
output is scaled by –50%. Each LSB scales the power output by
0.0244%. The minimum output range is given when the watt
gain register contents are equal to 0x800 and the maximum
range is given by writing 0x7FF to the watt gain register. This
can be used to calibrate the active power (or energy) calculation
in the ADE5166/ADE5169/ADE5566/ADE5569.
Active Power No Load Detection
The ADE5166/ADE5169/ADE5566/ADE5569 include a no load
threshold feature on the active energy that eliminates any creep
effects in the meter. The part accomplishes this by not accumulat-
ing energy if the multiplier output is below the no load threshold.
When the active power is below the no load threshold, the
APNOLOAD flag in the Interrupt Status 1 SFR (MIRQSTL, 0xDC)
is set. If the APNOLOAD bit is set in the Interrupt Enable 1 SFR
(MIRQENL, 0xD9), the 8052 core has a pending ADE interrupt.
The ADE interrupt stays active until the APNOLOAD status bit is
cleared (see the Energy Measurement Interrupts section).
Active Power Offset Calibration
The ADE5166/ADE5169/ADE5566/ADE5569 also incorporate
an active power offset register (WATTOS[15:0]). It is a signed,
twos complement, 16-bit register that can be used to remove
offsets in the active power calculation (see Figure 42). An offset
can exist in the power calculation due to crosstalk between
channels on the PCB or in the IC itself. The offset calibration
allows the contents of the active power register to be maintained
at 0 when no power is being consumed.
The no load threshold level is selectable by setting the
APNOLOAD bits in the NLMODE register (0x0E). Setting
these bits to 0b00 disables the no load detection, and setting
them to 0b01, 0b10, or 0b11 sets the no load detection threshold
to 0.015%, 0.0075%, or 0.0037% of the multiplier full-scale
output frequency, respectively. The IEC 62053-21 specification
states that the meter must start up with a load equal to or less
than 0.4% IPB, which translates to 0.0167% of the full-scale
output frequency of the multiplier.
The 256 LSBs (WATTOS = 0x0100) written to the active power
offset register are equivalent to 1 LSB in the waveform sample
register. Assuming the average value, output from LPF2 is
0xCCCCD (838,861d) when inputs on the voltage and current
channels are both at full scale. At −60 dB down on the current
channel (1/1000 of the current channel full-scale input), the
average word value output from LPF2 is 838.861 (838,861/1,000).
One LSB in the LPF2 output has a measurement error of
1/838.861 × 100% = 0.119% of the average value. The active
power offset register has a resolution equal to 1/256 LSB of
the waveform register. Therefore, the power offset correction
resolution is 0.000464%/LSB (0.119%/256) at −60 dB.
Rev. PrB | Page 55 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
accumulation. The active power signal in the waveform register
is continuously added to the internal active energy register.
ACTIVE ENERGY CALCULATION
As stated in the Active Power Calculation section, power is
defined as the rate of energy flow. This relationship can be
expressed mathematically in Equation 11.
The active energy accumulation depends on the setting of the
POAM and ABSAM bits in the ACCMODE register (0x0F).
When both bits are cleared, the addition is signed and, therefore,
negative energy is subtracted from the active energy contents.
When both bits are set, the ADE5166/ADE5169/ADE5566/
ADE5569 are set to be in the more restrictive mode, the positive-
only accumulation mode.
dE
P =
(11)
dt
where:
P is power.
E is energy.
When POAM in the ACCMODE register (0x0F) is set, only
positive power contributes to the active energy accumulation.
When ABSAM in the ACCMODE register (0x0F) is set, the
absolute active power is used for the active energy accumulation
(see the Watt-Absolute Accumulation Mode section).
Conversely, energy is given as the integral of power.
E = P(t)dt
(12)
∫
The ADE5166/ADE5169/ADE5566/ADE5569 achieve the
integration of the active power signal by continuously accumu-
The output of the multiplier is divided by the value in the WDIV
register. If the value in the WDIV register is equal to 0, the
internal active energy register is divided by 1. WDIV is an 8-bit
unsigned register. After dividing by WDIV, the active energy is
accumulated in a 49-bit internal energy accumulation register.
The upper 24 bits of this register are accessible through a read
to the active energy register (WATTHR[23:0]). A read to the
RWATTHR register returns the content of the WATTHR
register, and the upper 24 bits of the internal register are cleared.
As shown in Figure 44, the active power signal is accumulated
in an internal 49-bit signed register. The active power signal can
be read from the waveform register by setting the WAVMODE
register (0x0D) and setting the WFSM bit in the Interrupt Enable 3
SFR (MIRQENH, 0xDB). Like the current and voltage channels
waveform sampling modes, the waveform data is available at
sample rates of 25.6 kSPS, 12.8 kSPS, 6.4 kSPS, or 3.2 kSPS.
lating the active power signal in an internal, nonreadable, 49-bit
energy register. The register (WATTHR[23:0]) represents the
upper 24 bits of this internal register. This discrete time
accumulation or summation is equivalent to integration in
continuous time. Equation 13 expresses the relationship.
∞
⎧
⎨
⎩
⎫
⎬
⎭
(13)
E = p(t)dt = lim
p(nT)×T
∑
∫
t→0
n=1
where:
n is the discrete time sample number.
T is the sample period.
The discrete time sample period (T) for the accumulation
register in the ADE5166/ADE5169/ADE5566/ADE5569 is 1.22 μs
(5/MCLK). In addition to calculating the energy, this integration
removes any sinusoidal components that may be in the active
power signal. Figure 44 shows this discrete time integration or
UPPER 24 BITS ARE
ACCESSIBLE THROUGH
WATTHR[23:0] REGISTER
FOR WAVEFORM
SAMPLING
WATTHR[23:0]
23
0
WATTOS[15:0]
6
5
–6 –7 –8
2 2 2
sgn
2
2
WDIV[7:0]
CURRENT
CHANNEL
LPF2
48
0
+
+
+
%
+
VOLTAGE
CHANNEL
WGAIN[11:0]
OUTPUTS FROM THE LPF2 ARE
ACCUMULATED (INTEGRATED) IN
ACTIVE POWER
SIGNAL
THE INTERNAL ACTIVE ENERGY REGISTER
TO
DIGITAL-TO-FREQUENCY
CONVERTER
5
T
MCLK
WAVEFORM
REGISTER
VALUES
TIME (nT)
Figure 44. Active Energy Calculation
Rev. PrB | Page 56 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Figure 45 shows this energy accumulation for full-scale signals
(sinusoidal) on the analog inputs. The three displayed curves
illustrate the minimum period of time it takes the energy register
to roll over when the active power gain register contents are
0x7FF, 0x000, and 0x800. The watt gain register is used to carry
out power calibration in the ADE5166/ADE5169/ADE5566/
ADE5569. As shown, the fastest integration time occurs when
the watt gain register is set to maximum full scale, that is, 0x7FF.
WATTHR[23:0]
When WDIV is set to a value other than 0, the integration time
varies, as shown in Equation 15.
Time = TimeWDIV = 0 × WDIV
(15)
Active Energy Accumulation Modes
Watt-Signed Accumulation Mode
The ADE5166/ADE5169/ADE5566/ADE5569 active energy
default accumulation mode is a watt-signed accumulation based
on the active power information.
0x7F,FFFF
Watt Positive-Only Accumulation Mode
WGAIN = 0x7FF
WGAIN = 0x000
WGAIN = 0x800
The ADE5166/ADE5169/ADE5566/ADE5569 are placed in watt
positive-only accumulation mode by setting the POAM bit in the
ACCMODE register (0x0F). In this mode, the energy accumula-
tion is only done for positive power, ignoring any occurrence
of negative power above or below the no load threshold (see
Figure 46). The CF pulse also reflects this accumulation method
when in this mode. The default setting for this mode is off.
Detection of the transitions in the direction of power flow and
detection of no load threshold are active in this mode.
0x3F,FFFF
0x00,0000
0x40,0000
TIME (Minutes)
13.7
3.41
6.82
10.2
0x80,0000
Figure 45. Energy Register Rollover Time for Full-Scale Power
(Minimum and Maximum Power Gain)
Note that the energy register contents roll over to full-scale
negative (0x800000) and continue to increase in value when the
power or energy flow is positive (see Figure 45). Conversely, if
the power is negative, the energy register underflows to full-
scale positive (0x7FFFFF) and continues to decrease in value.
ACTIVE ENERGY
NO LOAD
THRESHOLD
By using the interrupt enable register, the ADE5166/ADE5169/
ADE5566/ADE5569 can be configured to issue an ADE interrupt
to the 8052 core when the active energy register is half full
(positive or negative) or when an overflow or underflow occurs.
ACTIVE POWER
NO LOAD
THRESHOLD
Integration Time Under Steady Load: Active Energy
APSIGN FLAG
As mentioned in the Active Energy Calculation section, the
discrete time sample period (T) for the accumulation register
is 1.22 μs (5/MLCK). With full-scale sinusoidal signals on the
analog inputs and the WGAIN register set to 0x000, the average
word value from each LPF2 is 0xCCCCD (see Figure 42). The
maximum positive value that can be stored in the internal 49-bit
register is 248 (or 0xFFFF,FFFF,FFFF) before it overflows. The
integration time under these conditions when WDIV = 0 is
calculated in the following equation:
POS NEG POS
INTERRUPT STATUS REGISTERS
Figure 46. Energy Accumulation in Positive-Only Accumulation Mode
Watt-Absolute Accumulation Mode
The ADE5166/ADE5169/ADE5566/ADE5569 are placed in
watt-absolute accumulation mode by setting the ABSAM bit
in the ACCMODE register (0x0F). In this mode, the energy
accumulation is done using the absolute active power, ignoring
any occurrence of power below the no load threshold (see
Figure 47). The CF pulse also reflects this accumulation method
when in this mode. The default setting for this mode is off.
Detection of the transitions in the direction of power flow, and
detection of no load threshold are active in this mode.
Time =
0xFFFF,FFFF,FFFF
×1.22ꢁs = 409.6sec = 6.82min (14)
0xCCCCD
Rev. PrB | Page 57 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Line Cycle Active Energy Accumulation Mode
In line cycle active energy accumulation mode, the energy accumu-
lation of the ADE5166/ADE5169/ADE5566/ADE5569 can be
synchronized to the voltage channel zero crossing so that active
energy can be accumulated over an integral number of half-line
cycles. The advantage of summing the active energy over an
integer number of line cycles is that the sinusoidal component in
the active energy is reduced to 0. This eliminates any ripple in the
energy calculation. Energy is calculated more accurately and
more quickly because the integration period can be shortened.
By using this mode, the energy calibration can be greatly
simplified, and the time required to calibrate the meter can be
significantly reduced.
ACTIVE ENERGY
NO LOAD
THRESHOLD
ACTIVE POWER
NO LOAD
THRESHOLD
In the line cycle active energy accumulation mode, the
ADE5166/ADE5169/ADE5566/ADE5569 accumulate the active
power signal in the LWATTHR register for an integral number of
line cycles, as shown in Figure 48. The number of half-line cycles is
specified in the LINCYC register.
APSIGN FLAG
APNOLOAD
POS
NEG POS
APNOLOAD
INTERRUPT STATUS REGISTERS
Figure 47. Energy Accumulation in Absolute Accumulation Mode
The ADE5166/ADE5169/ADE5566/ADE5569 can accumulate
active power for up to 65,535 half-line cycles. Because the active
power is integrated on an integral number of line cycles, the
CYCEND flag in the Interrupt Status 3 SFR (MIRQSTH, 0xDE) is
set at the end of an active energy accumulation line cycle. If the
CYCEND enable bit in the Interrupt Enable 3 SFR (MIRQENH,
0xDB) is set, the 8052 core has a pending ADE interrupt. The
ADE interrupt stays active until the CYCEND status bit is cleared
(see the Energy Measurement Interrupts section). Another
calibration cycle starts as soon as the CYCEND flag is set. If the
LWATTHR register is not read before a new CYCEND flag is set,
the LWATTHR register is overwritten by a new value.
Active Energy Pulse Output
All of the ADE5166/ADE5169/ADE5566/ADE5569 circuitry
has a pulse output whose frequency is proportional to active
power (see the Active Power Calculation section). This pulse
frequency output uses the calibrated signal from the WGAIN
register output, and its behavior is consistent with the setting
of the active energy accumulation mode in the ACCMODE
register (0x0F). The pulse output is active low and should be
preferably connected to an LED as shown in Figure 58.
TO
DIGITAL-TO-FREQUENCY
CONVERTER
WGAIN[11:0]
48
0
+
+
OUTPUT
FROM
LPF2
%
WATTOS[15:0]
WDIV[7:0]
ACCUMULATE
ACTIVE ENERGY IN
INTERNAL REGISTER
AND UPDATE THE
LWATTHR REGISTER
AT THE END OF LINCYC
HALF-LINE CYCLES
23
0
LPF1
LWATTHR[23:0]
FROM VOLTAGE
CHANNEL
ADC
ZERO-CROSSING
DETECTION
CALIBRATION
CONTROL
LINCYC[15:0]
Figure 48. Line Cycle Active Energy Accumulation
Rev. PrB | Page 58 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
When a new half-line cycle is written in the LINCYC register,
the LWATTHR register is reset, and a new accumulation starts
at the next zero crossing. The number of half-line cycles is then
counted until LINCYC is reached. This implementation provides a
valid measurement at the first CYCEND interrupt after writing
to the LINCYC register (see Figure 49). The line active energy
accumulation uses the same signal path as the active energy
accumulation. The LSB size of these two registers is equivalent.
v(t) = 2 V sin(ωt +θ)
i(t) = 2 I sin(ωt)
(19)
π
2
⎛
⎝
⎞
⎟
⎠
′
i (t) = 2 I sin ωt +
(20)
⎜
where:
θ is the phase difference between the voltage and current channel.
v is the rms voltage.
i is the rms current.
LWATTHR REGISTER
CYCEND IRQ
q(t) = v(t) × i’(t)
(21)
q(t) = VI sin (θ) + VI sin(2ωt + θ)
The average reactive power over an integral number of lines (n)
is given in Equation 22.
nT
LINCYC
VALUE
1
nT
Q =
q(t)dt = VI sin(θ)
(22)
∫
0
Figure 49. Energy Accumulation When LINCYC Changes
where:
T is the line cycle period.
From the information in Equation 8 and Equation 9,
⎧
⎪
⎪
⎨
⎪
⎪
⎩
⎫
⎪
⎪
⎬
⎪
⎪
⎭
q is referred to as the reactive power.
nT
nT
VI
Note that the reactive power is equal to the dc component of
the instantaneous reactive power signal q(t) in Equation 21.
E
(
t
)
= VIdt −
cos
(
2πft
)
dt
(16)
∫
∫
2
0
0
f
⎛
⎜
⎞
⎟
1+
The instantaneous reactive power signal q(t) is generated by
8.9
⎝
⎠
multiplying the voltage and current channels. In this case, the
phase of the current channel is shifted by 90°. The dc component of
the instantaneous reactive power signal is then extracted by a
low-pass filter to obtain the reactive power information (see
Figure 50).
where:
n is an integer.
T is the line cycle period.
Because the sinusoidal component is integrated over an integer
number of line cycles, its value is always 0. Therefore,
In addition, the phase-shifting filter has a nonunity magnitude
response. Because the phase-shifted filter has a large attenuation
at high frequency, the reactive power is primarily for calculation
at line frequency. The effect of harmonics is largely ignored in
the reactive power calculation. Note that, because of the magnitude
characteristic of the phase shifting filter, the weight of the reactive
power is slightly different from the active power calculation
(see the Energy Register Scaling section).
nT
E = VIdt + 0
(17)
∫
0
E(t) = VInT
(18)
Note that in this mode, the 16-bit LINCYC register can hold a
maximum value of 65,535. In other words, the line energy
accumulation mode can be used to accumulate active energy for
a maximum duration of over 65,535 half-line cycles. At a 60 Hz
line frequency, it translates to a total duration of 65,535/120 Hz
= 546 sec.
The frequency response of the LPF in the reactive signal path is
identical to the one used for LPF2 in the average active power
calculation. Because LPF2 does not have an ideal brick wall
frequency response (see Figure 43), the reactive power signal
has some ripple due to the instantaneous reactive power signal.
This ripple is sinusoidal and has a frequency equal to twice the
line frequency. Because the ripple is sinusoidal in nature, it is
removed when the reactive power signal is integrated to
calculate energy.
REACTIVE POWER CALCULATION FOR THE
ADE5569/ADE5169
Reactive power, a function available for the ADE5569/ADE5169
but not for the ADE5566/ADE5166, is defined as the product of
the voltage and current waveforms when one of these signals is
phase-shifted by 90°. The resulting waveform is called the
instantaneous reactive power signal. Equation 21 gives an
expression for the instantaneous reactive power signal in an ac
system when the phase of the current channel is shifted by 90°.
The reactive power signal can be read from the waveform
register by setting the WAVMODE register (0x0D) and the
WFSM bit in the Interrupt Enable 3 SFR (MIRQENH, 0xDB).
Like the current and voltage channels waveform sampling
modes, the waveform data is available at sample rates of
25.6 kSPS, 12.8 kSPS, 6.4 kSPS, or 3.2 kSPS.
Rev. PrB | Page 59 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Reactive Power Gain Calibration
(MIRQENL, 0xD9), the 8052 core has a pending ADE interrupt.
The ADE interrupt stays active until the VARSIGN status bit is
cleared (see the Energy Measurement Interrupts section).
Figure 50 shows the signal processing chain for the ADE5569/
ADE5169 reactive power calculation. As explained in the
Reactive Power Calculation for the ADE5569/ADE5169 section,
the reactive power is calculated by applying a low-pass filter to
the instantaneous reactive power signal. Note that, when
reading the waveform samples from the output of LPF2, the
gain of the reactive energy can be adjusted by using the
multiplier and by writing a twos complement, 12-bit word to
the VAR gain register (VARGAIN[11:0]). Equation 23 shows
how the gain adjustment is related to the contents of the watt
gain register.
When VARSIGN in the ACCMODE register (0x0F) is cleared
(default), the VARSIGN flag in the Interrupt Status 1 SFR
(MIRQSTL, 0xDC) is set when a transition from positive to
negative reactive power occurs.
When VARSIGN in the ACCMODE register (0x0F) is set, the
VARSIGN flag in the Interrupt Status 1 SFR (MIRQSTL, 0xDC)
is set when a transition from negative to positive reactive power
occurs.
Reactive Power No Load Detection
Output VARGAIN =
The ADE5569/ADE5169 include a no load threshold feature on
the reactive energy that eliminates any creep effects in the meter.
The ADE5569/ADE5169 accomplish this by not accumulating
reactive energy when the multiplier output is below the no load
threshold. When the reactive power is below the no load threshold,
the RNOLOAD flag in the Interrupt Status 1 SFR (MIRQSTL,
0xDC) is set. If the RNOLOAD bit is set in the Interrupt Enable 1
SFR (MIRQENL, 0xD9), the 8052 core has a pending ADE
interrupt. The ADE interrupt stays active until the RNOLOAD
status bit is cleared (see the Energy Measurement Interrupts
section).
VARGAIN
⎛
⎜
⎞
⎟
⎧
⎩
⎫
⎬
⎭
Reactive Power× 1+
(23)
⎨
212
⎝
⎠
The resolution of the VARGAIN register is the same as the
WGAIN register (see the Active Power Gain Calibration
section). VARGAIN can be used to calibrate the reactive
power (or energy) calculation in the ADE5569/ADE5169.
Reactive Power Offset Calibration
The ADE5569/ADE5169 also incorporate a reactive power
offset register (VAROS[15:0]). This is a signed, twos complement,
16-bit register that can be used to remove offsets in the reactive
power calculation (see Figure 50). An offset can exist in the
reactive power calculation due to crosstalk between channels on
the PCB or in the IC itself. The offset calibration allows the
contents of the reactive power register to be maintained at 0
when no power is being consumed.
The no load threshold level is selectable by setting the
VARNOLOAD bits in the NLMODE register (0x0E).
Setting these bits to 0b00 disables the no load detection,
and setting them to 0b01, 0b10, or 0b11 sets the no load
detection threshold to 0.015%, 0.0075%, and 0.0037% of
the full-scale output frequency of the multiplier, respectively.
The 256 LSBs (VAROS = 0x100) written to the reactive power
offset register are equivalent to 1 LSB in the WAVMODE register.
REACTIVE ENERGY CALCULATION FOR THE
ADE5569/ADE5169
Sign of Reactive Power Calculation
As for active energy, the ADE5569/ADE5169 achieve the integra-
tion of the reactive power signal by continuously accumulating
the reactive power signal in an internal, nonreadable, 49-bit energy
register. The reactive energy register (VARHR[23:0]) represents
the upper 24 bits of this internal register. The VARHR register
and its function are available for the ADE5569/ADE5169 but
not for the ADE5566/ADE5166.
Note that the average reactive power is a signed calculation.
The phase shift filter has −90° phase shift when the integrator
is enabled, and +90° phase shift when the integrator is disabled.
Table 46 summarizes the relationship of the phase difference
between the voltage and the current and the sign of the resulting
VAR calculation.
Table 46. Sign of Reactive Power Calculation
The discrete time sample period (T) for the accumulation register
in the ADE5569/ADE5169 is 1.22 μs (5/MCLK). As well as
calculating the energy, this integration removes any sinusoidal
components that may be in the active power signal. Figure 50
shows this discrete time integration or accumulation. The
reactive power signal in the waveform register is continuously
added to the internal reactive energy register.
Angle
Integrator
Sign
Off
Off
On
On
Positive
Negative
Positive
Negative
Between 0° to +90°
Between –90° to 0°
Between 0° to +90°
Between –90° to 0°
Reactive Power Sign Detection
The reactive energy accumulation depends on the setting of the
SAVARM and ABSVARM bits in the ACCMODE register (0x0F).
When both bits are cleared, the addition is signed and, therefore,
negative energy is subtracted from the reactive energy contents.
When both bits are set, the ADE5569/ADE5169 are set to be in
the more restrictive mode, the absolute accumulation mode.
The ADE5569/ADE5169 detect a change of sign in the reactive
power. The VARSIGN flag in the Interrupt Status 1 SFR
(MIRQSTL, 0xDC) records when a change of sign has occurred
according to the VARSIGN bit in the ACCMODE register
(0x0F). If the VARSIGN bit is set in the Interrupt Enable 1 SFR
Rev. PrB | Page 60 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
When SAVARM in the ACCMODE register (0x0F) is set, the
reactive power is accumulated depending on the sign of the
active power. When active power is positive, the reactive power
is added as it is to the reactive energy register. When active
power is negative, the reactive power is subtracted from the
reactive energy accumulator (see the VAR Antitamper
Accumulation Mode section).
As shown in Figure 50, the reactive power signal is accumulated
in an internal 49-bit signed register. The reactive power signal
can be read from the waveform register by setting the WAVMODE
register (0x0D) and setting the WFSM bit in the Interrupt Enable 3
SFR (MIRQENH, 0xDB). Like the current and voltage channel
waveform sampling modes, the waveform data is available at
sample rates of 25.6 kSPS, 12.8 kSPS, 6.4 kSPS, or 3.2 kSPS.
When ABSVARM in the ACCMODE register (0x0F) is set, the
absolute reactive power is used for the reactive energy accumu-
lation (see the VAR Absolute Accumulation Mode section).
Figure 45 shows this energy accumulation for full-scale signals
(sinusoidal) on the analog inputs. These curves also apply for
the reactive energy accumulation.
The output of the multiplier is divided by VARDIV. If the value
in the VARDIV register is equal to 0, the internal reactive
energy register is divided by 1. VARDIV is an 8-bit, unsigned
register. After dividing by VARDIV, the reactive energy is
accumulated in a 49-bit internal energy accumulation register.
The upper 24 bits of this register are accessible through a read
to the reactive energy register (VARHR[23:0]). A read to the
RVARHR register returns the content of the VARHR register,
and the upper 24 bits of the internal register are cleared.
Note that the energy register contents roll over to full-scale
negative (0x800000) and continue to increase in value when
the power or energy flow is positive. Conversely, if the power is
negative, the energy register underflows to full-scale positive
(0x7FFFFF) and continues to decrease in value.
By using the interrupt enable register, the ADE5569/ADE5169
can be configured to issue an ADE interrupt to the 8052 core
when the reactive energy register is half-full (positive or
negative) or when an overflow or underflow occurs.
UPPER 24 BITS ARE
ACCESSIBLE THROUGH
VARHR[23:0] REGISTER
FOR WAVEFORM
SAMPLING
V
ARHR[23:0]
23
0
VAROS[15:0]
90° PHASE
SHIFTING FILTER
HPF
CURRENT
CHANNEL
6
5
–6 –7 –8
2 2 2
sgn
2
2
VARDIV[7:0]
2
LPF2
48
0
+
+
+
%
+
VOLTAGE
CHANNEL
PHCAL[7:0]
VARGAIN[11:0]
OUTPUTS FROM THE LPF2 ARE
ACCUMULATED (INTEGRATED) IN
THE INTERNAL REACTIVE ENERGY
REGISTER
REACTIVE POWER
SIGNAL
TO
DIGITAL-TO-FREQUENCY
CONVERTER
5
T
MCLK
WAVEFORM
REGISTER
VALUES
TIME (nT)
Figure 50. Reactive Energy Calculation
Rev. PrB | Page 61 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Integration Time Under Steady Load: Reactive Energy
As mentioned in the Active Energy Calculation section, the
discrete time sample period (T) for the accumulation register is
1.22 μs (5/MCLK). With full-scale sinusoidal signals on the
analog inputs and the VARGAIN and VARDIV registers set to
0x000, the integration time before the reactive energy register
overflows is calculated in Equation 24.
REACTIVE ENERGY
Time =
NO LOAD
THRESHOLD
0xFFFF, FFFF, FFFF
×1.22μs = 409.6 sec = 6.82 min (24)
0xCCCCD
REACTIVE POWER
When VARDIV is set to a value different from 0, the integration
time varies, as shown in Equation 25.
NO LOAD
THRESHOLD
Time =TimeWDIV =0 ×VARDIV
(25)
Reactive Energy Accumulation Modes
VAR Signe d Accumu lation Mo de
NO LOAD
THRESHOLD
The ADE5569/ADE5169 reactive energy default accumulation
mode is a signed accumulation based on the reactive power
information.
ACTIVE POWER
NO LOAD
THRESHOLD
VAR Antitamper Accumulation Mode
The ADE5569/ADE5169 are placed in VAR antitamper accumula-
tion mode by setting the SAVARM bit in the ACCMODE register
(0x0F). In this mode, the reactive power is accumulated depending
on the sign of the active power. When active power is positive,
the reactive power is added as it is to the reactive energy register.
When active power is negative, the reactive power is subtracted
from the reactive energy accumulator (see Figure 51). The CF
pulse also reflects this accumulation method when in this mode.
The default setting for this mode is off. Transitions in the direction
of power flow and no load threshold are active in this mode.
APSIGN FLAG
POS
NEG
POS
INTERRUPT STATUS REGISTERS
Figure 51. Reactive Energy Accumulation in
Antitamper Accumulation Mode
Rev. PrB | Page 62 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Line Cycle Reactive Energy Accumulation Mode
VAR Absolute Accumulation Mode
In line cycle reactive energy accumulation mode, the energy
accumulation of the ADE5569/ADE5169 can be synchronized
to the voltage channel zero crossing so that reactive energy can
be accumulated over an integral number of half-line cycles. The
advantage of this mode is similar to the ones described in the
Line Cycle Active Energy Accumulation Mode section.
The ADE5569/ADE5169 are placed in absolute accumulation
mode by setting the ABSVARM bit in the ACCMODE register
(0x0F). In absolute accumulation mode, the reactive energy
accumulation is done by using the absolute reactive power and
ignoring any occurrence of power below the no load threshold for
the active energy (see Figure 47). The CF pulse also reflects this
accumulation method when in the absolute accumulation mode.
The default setting for this mode is off. Transitions in the direction
of power flow and no load threshold are active in this mode.
In line cycle active energy accumulation mode, the ADE5569/
ADE5169 accumulate the reactive power signal in the LVARHR
register for an integral number of line cycles, as shown in Figure 53.
The number of half-line cycles is specified in the LINCYC
register. The ADE5569/ADE5169 can accumulate active power
for up to 65,535 half-line cycles.
Because the reactive power is integrated on an integral number
of line cycles, the CYCEND flag in the Interrupt Status 3 SFR
(MIRQSTH, 0xDE) is set at the end of an active energy accumula-
tion line cycle. If the CYCEND enable bit in the Interrupt Enable 3
SFR (MIRQENH, 0xDB) is set, the 8052 core has a pending
ADE interrupt. The ADE interrupt stays active until the CYCEND
status bit is cleared (see the Energy Measurement Interrupts
section). Another calibration cycle starts as soon as the CYCEND
flag is set. If the LVARHR register is not read before a new
CYCEND flag is set, the LVARHR register is overwritten by a
new value.
REACTIVE ENERGY
NO LOAD
THRESHOLD
REACTIVE POWER
NO LOAD
THRESHOLD
Figure 52. Reactive Energy Accumulation in Absolute Accumulation Mode
Reactive Energy Pulse Output
When a new half-line cycle is written in the LINECYC register,
the LVARHR register is reset, and a new accumulation starts at
the next zero crossing. The number of half-line cycles is then
counted until LINCYC is reached. This implementation
provides a valid measurement at the first CYCEND interrupt
after writing to the LINCYC register. The line reactive energy
accumulation uses the same signal path as the reactive energy
accumulation. The LSB size of these two registers is equivalent.
The ADE5569/ADE5169 provide all the circuitry with a pulse
output whose frequency is proportional to reactive power (see
the Energy-to-Frequency Conversion section). This pulse
frequency output uses the calibrated signal after VARGAIN,
and its behavior is consistent with the setting of the reactive
energy accumulation mode in the ACCMODE register (0x0F).
The pulse output is active low and should preferably be connected
to an LED, as shown in Figure 58.
TO
DIGITAL-TO-FREQUENCY
CONVERTER
VARGAIN[11:0]
48
0
+
+
OUTPUT
FROM
LPF2
%
VAROS[15:0]
VARDIV[7:0]
ACCUMULATE REACTIVE
ENERGY IN INTERNAL
REGISTER AND UPDATE
THE LVARHR REGISTER
AT THE END OF LINCYC
HALF-LINE CYCLES
23
0
LPF1
LVARHR[23:0]
ZERO-CROSSING
DETECTION
CALIBRATION
CONTROL
FROM VOLTAGE
CHANNEL ADC
LINCYC[15:0]
Figure 53. Line Cycle Reactive Energy Accumulation Mode
Rev. PrB | Page 63 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Apparent Power Offset Calibration
APPARENT POWER CALCULATION
Each rms measurement includes an offset compensation register
to calibrate and eliminate the dc component in the rms value (see
the Current Channel RMS Calculation section and the Voltage
Channel RMS Calculation section). The voltage and current
channels rms values are then multiplied together in the apparent
power signal processing. Because no additional offsets are
created in the multiplication of the rms values, there is no
specific offset compensation in the apparent power signal
processing. The offset compensation of the apparent power
measurement is done by calibrating each individual rms
measurement.
Apparent power is defined as the maximum power that can be
delivered to a load. Vrms and Irms are the effective voltage and
current delivered to the load, respectively. Therefore, the apparent
power (AP) = Vrms × Irms. This equation is independent from the
phase angle between the current and the voltage.
Equation 29 gives an expression of the instantaneous power
signal in an ac system with a phase shift.
(26)
v(t) = 2 Vrms sin(ωt)
2 Irms sin(ωt + θ)
p(t) = v(t)×i(t)
=Vrms Irms cos(θ)−Vrms Irms cos(2ωt + θ)
i
(
t
)
=
(27)
(29)
(30)
APPARENT ENERGY CALCULATION
p t
( )
The apparent energy is given as the integral of the apparent power.
(31)
Apparent Energy = Apparent Power(t)dt
Figure 54 illustrates the signal processing for the calculation of the
apparent power in the ADE5166/ADE5169/ADE5566/ADE5569.
∫
The ADE5166/ADE5169/ADE5566/ADE5569 achieve the
integration of the apparent power signal by continuously
accumulating the apparent power signal in an internal 48-bit
register. The apparent energy register (VAHR[23:0]) represents
the upper 24 bits of this internal register. This discrete time
accumulation or summation is equivalent to integration in
continuous time. Equation 32 expresses the relationship.
The apparent power signal can be read from the waveform register
by setting the WAVMODE register (0x0D) and setting the WFSM
bit in the Interrupt Enable 3 SFR (MIRQENH, 0xDB). Like the
current and voltage channel waveform sampling modes, the wave-
form data is available at sample rates of 25.6 kSPS, 12.8 kSPS,
6.4 kSPS, or 3.2 kSPS.
∞
The gain of the apparent energy can be adjusted by using the
multiplier and by writing a twos complement, 12-bit word to the
VAGAIN register (VAGAIN[11:0]). Equation 30 shows how the
gain adjustment is related to the contents of the VAGAIN register.
⎧
⎨
⎩
⎫
⎬
⎭
(32)
Apparent Energy = lim
Apparent Power(nT)×T
∑
T →0
n=0
where:
n is the discrete time sample number.
T is the sample period.
Output VAGAIN =
VAGAIN
⎛
⎞
⎟
⎧
⎩
⎫
⎬
⎭
Apparent Power × 1+
(30)
⎜
⎨
212
⎝
⎠
For example, when 0x7FF is written to the VAGAIN register, the
power output is scaled up by 50% (0x7FF = 2047d, 2047/212 = 0.5).
Similarly, 0x800 = –2047d (signed twos complement) and power
output is scaled by –50%. Each LSB represents 0.0244% of the
power output. The apparent power is calculated with the current
and voltage rms values obtained in the rms blocks of the
ADE5166/ADE5169/ADE5566/ADE5569.
VARMSCFCON
APPARENT POWER
SIGNAL (P)
I
rms
0x1A36E2
CURRENT RMS SIGNAL – i(t)
0x1CF68C
0x00
VAGAIN
V
rms
VOLTAGE RMS SIGNAL – v(t)
0x1CF68C
TO
DIGITAL-TO-FREQUENCY
CONVERTER
0x00
Figure 54. Apparent Power Signal Processing
Rev. PrB | Page 64 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
The discrete time sample period (T) for the accumulation regis-
ter in the ADE5166/ADE5169/ADE5566/ADE5569 is 1.22 μs
(5/MCLK).
analog inputs and the VAGAIN register set to 0x000, the
average word value from the apparent power stage is 0x1A36E2
(see the Apparent Power Calculation section). The maximum
value that can be stored in the apparent energy register before it
overflows is 224 or 0xFF,FFFF. The average word value is added
to the internal register, which can store 248 or 0xFFFF,FFFF,FFFF
before it overflows. Therefore, the integration time under these
conditions with VADIV = 0 is calculated as follows:
Figure 55 shows this discrete time integration or accumulation.
The apparent power signal is continuously added to the internal
register. This addition is a signed addition even if the apparent
energy theoretically remains positive.
The 49 bits of the internal register are divided by VADIV. If the
value in the VADIV register is 0, the internal apparent energy
register is divided by 1. VADIV is an 8-bit unsigned register.
The upper 24 bits are then written in the 24-bit apparent energy
register (VAHR[23:0]). The RVAHR register (24 bits long) is
provided to read the apparent energy. This register is reset to 0
after a read operation
Time =
0xFFFF, FFFF, FFFF
×1.22μs =199 sec = 3.33 min
(33)
0xD055
When VADIV is set to a value different from 0, the integration
time varies, as shown in Equation 34.
Time = TimeWDIV = 0 × VADIV
(34)
Note that the apparent energy register is unsigned. By setting
the VAEHF and VAEOF bits in the Interrupt Enable 2 SFR
(MIRQENM, 0xDA), the ADE5166/ADE5169/ADE5566/
ADE5569 can be configured to issue an ADE interrupt to the
8052 core when the apparent energy register is half-full or when
an overflow occurs. The half-full interrupt for the unsigned
apparent energy register is based on 24 bits as opposed to 23 bits
for the signed active energy register.
Apparent Energy Pulse Output
All the ADE5166/ADE5169/ADE5566/ADE5569 circuitry has a
pulse output whose frequency is proportional to apparent power
(see the Energy-to-Frequency Conversion section). This pulse
frequency output uses the calibrated signal after VAGAIN. This
output can also be used to output a pulse whose frequency is
proportional to Irms.
The pulse output is active low and should preferably be connected
to an LED, as shown in Figure 58.
Integration Times Under Steady Load: Apparent Energy
As mentioned in the Apparent Energy Calculation section, the
discrete time sample period (T) for the accumulation register is
1.22 μs (5/MCLK). With full-scale sinusoidal signals on the
VAHR[23:0]
23
0
48
0
%
VADIV
48
0
APPARENT POWER
+
or
+
I
rms
APPARENT
POWER SIGNAL = P
APPARENT POWER OR I
IS
rms
ACCUMULATED (INTEGRATED)
IN THE APPARENT ENERGY
REGISTER
T
TIME (nT)
Figure 55. Apparent Energy Calculation
Rev. PrB | Page 65 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Line Apparent Energy Accumulation
If the VANOLOAD bit is set in the Interrupt Enable 1 SFR
(MIRQENL, 0xD9), the 8052 core has a pending ADE interrupt.
The ADE interrupt stays active until the APNOLOAD status bit
is cleared (see the Energy Measurement Interrupts section).
The ADE5166/ADE5169/ADE5566/ADE5569 are designed
with a special apparent energy accumulation mode that
simplifies the calibration process. By using the on-chip, zero-
crossing detection, the ADE5166/ADE5169/ADE5566/ADE5569
accumulate the apparent power signal in the LVAHR register for
an integral number of half cycles, as shown in Figure 56. The line
apparent energy accumulation mode is always active.
The no load threshold level is selectable by setting the
VANOLOAD bits in the NLMODE register (0x0E). Setting
these bits to 0b00 disables the no load detection and setting
them to 0b01, 0b10, or 0b11 sets the no load detection
threshold to 0.030%, 0.015%, and 0.0075% of the full-scale
output frequency of the multiplier, respectively.
The number of half-line cycles is specified in the LINCYC
register, which is an unsigned 16-bit register. The ADE5166/
ADE5169/ADE5566/ADE5569 can accumulate apparent power
for up to 65,535 combined half cycles. Because the apparent
power is integrated on the same integral number of line cycles
as the line active register and reactive energy register, these
values can easily be compared. The energies are calculated more
accurately because of this precise timing control and provide all
the information needed for reactive power and power factor
calculation.
This no load threshold can also be applied to the Irms pulse
output when selected. In this case, the level of no load threshold
is the same as for the apparent energy.
AMPERE-HOUR ACCUMULATION
In a tampering situation where no voltage is available to the
energy meter, the ADE5166/ADE5169/ADE5566/ADE5569 is
capable of accumulating the ampere-hour instead of apparent
power into the VAHR, RVAHR, and LVAHR. When Bit 3
(VARMSCFCON) of the MODE2 register (0x0C) is set, the
VAHR, RVAHR, and LVAHR, and the input for the digital-to-
frequency converter accumulate Irms instead of apparent power.
All the signal processing and calibration registers available for
apparent power and energy accumulation remain the same when
ampere-hour accumulation is selected. However, the scaling
difference between Irms and apparent power requires independent
values for gain calibration in the VAGAIN, VADIV, CFxNUM,
and CFxDEN registers.
At the end of an energy calibration cycle, the CYCEND flag in
the Interrupt Status 3 SFR (MIRQSTH, 0xDE) is set. If the
CYCEND enable bit in the Interrupt Enable 3 SFR (MIRQENH,
0xDB) is enabled, the 8052 core has a pending ADE interrupt.
As for LWATTHR, when a new half-line cycles is written
in LINCYC register, the LVAHR register is reset and a new
accumulation starts at the next zero crossing. The number of
half-line cycles is then counted until LINCYC is reached.
This implementation provides a valid measurement at the first
CYCEND interrupt after writing to the LINCYC register. The
line apparent energy accumulation uses the same signal path as
the apparent energy accumulation. The LSB size of these two
registers is equivalent.
ENERGY-TO-FREQUENCY CONVERSION
The ADE5166/ADE5169/ADE5566/ADE5569 also provide two
energy-to-frequency conversions for calibration purposes. After
initial calibration at manufacturing, the manufacturer or end
customer often verifies the energy meter calibration. One conve-
nient way to do this is for the manufacturer to provide an output
frequency that is proportional to the active power, reactive
power, apparent power, or Irms under steady load conditions.
This output frequency can provide a simple, single-wire, optically
isolated interface to external calibration equipment. Figure 57
illustrates the energy-to-frequency conversion in the ADE5166/
ADE5169/ADE5566/ADE5569.
Apparent Power No Load Detection
The ADE5166/ADE5169/ADE5566/ADE5569 include a no load
threshold feature on the apparent power that eliminates any
creep effects in the meter. The ADE5166/ADE5169/ADE5566/
ADE5569 accomplish this by not accumulating energy if the
multiplier output is below the no load threshold. When the
apparent power is below the no load threshold, the VANOLOAD
flag in the Interrupt Status 1 SFR (MIRQSTL, 0xDC) is set.
48
0
+
+
APPARENT POWER
%
OR I
rms
LVAHR REGISTER IS
UPDATED EVERY LINCYC
ZERO CROSSING WITH THE
TOTAL APPARENT ENERGY
DURING THAT DURATION
VADIV[7:0]
23
0
LPF1
LVAHR[23:0]
FROM
VOLTAGE CHANNEL
ADC
ZERO-CROSSING
DETECTION
CALIBRATION
CONTROL
LINCYC[15:0]
Figure 56. Line Cycle Apparent Energy Accumulation
Rev. PrB | Page 66 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
V
DD
MODE2 REGISTER 0x0C
CF
VARMSCFCON CFxSEL[1:0]
Irms
CFxNUM
VA
Figure 58. CF Pulse Output
CFx PULSE
OUTPUT
DFC
VAR*
÷
The maximum output frequency with ac input signals at
full scale and CFxNUM = 0x00 and CFxDEN = 0x00 is
approximately 21.1 kHz.
WATT
CFxDEN
The ADE5166/ADE5169/ADE5566/ADE5569 incorporate two
registers per DFC, CFxNUM[15:0] and CFxDEN[15:0], to set
the CFx frequency. These are unsigned 16-bit registers that can
be used to adjust the CFx frequency to a wide range of values.
These frequency scaling registers are 16-bit registers that can
scale the output frequency by 1/216 to 1 with a step of 1/216.
*AVAILABLE ONLY IN THE ADE5569 AND ADE5169.
Figure 57. Energy-to-Frequency Conversion
Two digital-to-frequency converters (DFC) are used to generate
the pulsed outputs. When WDIV = 0 or 1, the DFC generates a
pulse each time 1 LSB in the energy register is accumulated. An
output pulse is generated when a CFxNUM/CFxDEN number
of pulses are generated at the DFC output. Under steady load
conditions, the output frequency is proportional to the active
power, reactive power, apparent power, or Irms, depending on
the CFxSEL bits in the MODE2 register (0x0C).
If 0 is written to any of these registers, 1 is applied to the
register. The ratio CFxNUM/CFxDEN should be less than 1 to
ensure proper operation. If the ratio of the CFxNUM/CFxDEN
registers is greater than 1, the register values are adjusted to a
ratio of 1. For example, if the output frequency is 1.562 kHz
while the content of CFxDEN is 0 (0x000), the output frequency
can be set to 6.1 Hz by writing 0xFF to the CFxDEN register.
Both pulse outputs can be enabled or disabled by clearing or
setting Bit DISCF1 and Bit DISCF2 in the MODE1 register
(0x0B), respectively.
ENERGY REGISTER SCALING
Both pulse outputs set separate flags in the Interrupt Status 2 SFR
(MIRQSTM, 0xDD), CF1 and CF2. If the CF1 and CF2 enable
bits in the Interrupt Enable 2 SFR (MIRQENM, 0xDA) are set,
the 8052 core has a pending ADE interrupt. The ADE interrupt
stays active until the CF1 or CF2 status bits are cleared (see the
Energy Measurement Interrupts section).
The ADE5166/ADE5169/ADE5566/ADE5569 provide measure-
ments of active, reactive, and apparent energies that use separate
paths and filtering for calculation. The difference in data paths
can result in small differences in LSB weight between active,
reactive, and apparent energy registers. These measurements are
internally compensated so the scaling is nearly one to one. The
relationship between these registers is shown in Table 47.
Pulse Output Configuration
The two pulse output circuits have separate configuration bits
in the MODE2 Register (0x0C). Setting the CFxSEL bits to
0b00, 0b01, or 0b1x configures the DFC to create a pulse output
proportional to active power, to reactive power (not available in
Table 47. Energy Registers Scaling
Line Frequency = 50 Hz Line Frequency = 60 Hz Integrator
VAR = 0.9952 × WATT
VA = 0.9978 × WATT
VAR = 0.9997 × WATT
VA = 0.9977 × WATT
VAR = 0.9949 × WATT
VA = 1.0015 × WATT
VAR = 0.9999 × WATT
VA = 1.0015 × WATT
Off
Off
On
On
the ADE5566 and ADE5166), or to apparent power or Irms
respectively.
,
The selection between Irms and apparent power is done by the
VARMSCFCON bit in the MODE2 register (0x0C). With this
selection, CF2 cannot be proportional to apparent power if CF1
is proportional to Irms, and CF1 cannot be proportional to
ENERGY MEASUREMENT INTERRUPTS
The energy measurement part of the ADE5166/ADE5169/
ADE5566/ADE5569 has its own interrupt vector for the 8052
core, Vector Address 0x004B (see the Interrupt Vectors section).
The bits set in the Interrupt Enable 1 SFR (MIRQENL, 0xD9),
Interrupt Enable 2 SFR (MIRQENM, 0xDA), and Interrupt
Enable 3 SFR (MIRQENH, 0xDB) enable the energy measure-
ment interrupts that are allowed to interrupt the 8052 core.
If an event is not enabled, it cannot create a system interrupt.
apparent power if CF2 is proportional to Irms
.
Pulse Output Characteristic
The pulse output for both DFCs stays low for 90 ms if the pulse
period is longer than 180 ms (5.56 Hz). If the pulse period is
shorter than 180 ms, the duty cycle of the pulse output is 50%.
The pulse output is active low and should preferably be
connected to an LED, as shown in Figure 58.
The ADE interrupt stays active until the status bit that has created
the interrupt is cleared. The status bit is cleared when a zero is
written to this register bit.
Rev. PrB | Page 67 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
TEMPERATURE, BATTERY, AND SUPPLY VOLTAGE MEASUREMENTS
The ADE5166/ADE5169/ADE5566/ADE5569 include tempera-
ture measurements as well as battery and supply voltage
measurements. These measurements enable many forms of
compensation. The temperature and supply voltage measurements
can be used to compensate external circuitry. The RTC can be
calibrated over temperature to ensure that it does not drift. Supply
voltage measurements allow the LCD contrast to be maintained
despite variations in voltage. Battery measurements allow low
battery detection to be performed.
All ADC measurements are configured through the SFRs
detailed in Table 48.
The temperature, battery, and supply voltage measurements can
be configured to continue functioning in PSM1 and PSM2.
Keeping the temperature measurement active ensures that it is
not necessary to wait for the temperature measurement to settle
before using it for compensation.
Table 48. Temperature, Battery, and Supply Voltage Measurement SFRs
SFR Address
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Mnemonic
STRBPER
DIFFPROG
ADCGO
BATVTH
VDCINADC
BATADC
Description
0xF9
0xF3
0xD8
0xFA
0xEF
0xDF
0xD7
Peripheral ADC Strobe Period (see Table 49).
Temperature and Supply Delta Configuration (see Table 50).
Start ADC Measurement (see Table 51).
Battery Detection Threshold (see Table 52).
VDCIN ADC Value (see Table 53).
Battery ADC Value (see Table 54).
Temperature ADC Value (see Table 55).
TEMPADC
Table 49. Peripheral ADC Strobe Period SFR (STRBPER, 0xF9)
Bit
Mnemonic
Default
Description
7 to 6
5 to 4
Reserved
00
0
These bits should be left clear for proper operation.
Period for background external voltage measurements.
VDCIN_PERIOD[1:0]
VDCIN_PERIOD[1:0]
Result
00
01
10
11
No VDCIN measurement
8 min
2 min
1 min
3 to 2
BATT_PERIOD[1:0]
TEMP_PERIOD[1:0]
0
0
Period for background battery level measurements.
BATT_PERIOD[1:0]
Result
00
01
10
11
No battery measurement
16 min
4 min
1 min
1 to 0
Period for background temperature measurements.
TEMP_PERIOD[1:0]
Result
00
01
10
11
No temperature measurements
8 min
2 min
1 min
Rev. PrB | Page 68 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 50. Temperature and Supply Delta SFR (DIFFPROG, 0xF3)
Bit
Mnemonic
Default Description
7 to 6
5 to 3
Reserved
0
0
Reserved.
TEMP_DIFF[2:0]
Difference threshold between last temperature measurement interrupting 8052 and new
temperature measurement that should interrupt 8052.
TEMP_DIFF[2:0]
Result
000
001
010
011
100
101
110
111
No interrupt
1 LSB (≈ 0.8°C)
2 LSB (≈ 1.6°C)
3 LSB (≈ 2.4°C)
4 LSB (≈ 3.2°C)
5 LSB (≈ 4°C)
6 LSB (≈ 4.8°C)
Every temperature measurement
2 to 0
VDCIN_DIFF[2:0]
0
Difference threshold between last external voltage measurement interrupting 8052 and new
external measurement that should interrupt 8052.
VDCIN_DIFF[2:0] Result
000
001
010
011
100
101
110
111
No interrupt
1 LSB (≈ 120 mV)
2 LSB (≈ 240 mV)
3 LSB (≈ 360 mV)
4 LSB (≈ 480 mV)
5 LSB (≈ 600 mV)
6 LSB (≈ 720 mV)
Every VDCIN measurement
Table 51. Start ADC Measurement SFR (ADCGO, 0xD8)
Bit
Address
Mnemonic
Default
Description
7
0xDF
PLLACK
0
Set this bit to clear the PLL fault bit, PLL_FLT, in the PERIPH register. A PLL fault is
generated if a reset is caused because the PLL lost lock.
6 to 3 0xDE to 0xDB
Reserved
VDCIN_ADC_GO
0
0
Reserved.
2
1
0
0xDA
0xD9
0xD8
Set this bit to initiate an external voltage measurement. This bit is cleared when
the measurement request is received by the ADC.
Set this bit to initiate a temperature measurement. This bit is cleared when the
measurement request is received by the ADC.
Set this bit to initiate a battery measurement. This bit is cleared when the
measurement request is received by the ADC.
TEMP_ADC_GO
BATT_ADC_GO
0
0
Table 52. Battery Detection Threshold SFR (BATVTH, 0xFA)
Bit
Mnemonic
Default
Description
7 to 0
BATVTH
0
The battery ADC value is compared to this register, the battery threshold register. If BATADC
is lower than the threshold, an interrupt is generated.
Table 53. VDCIN ADC Value SFR (VDCINADC, 0xEF)
Bit
Mnemonic
Default
Description
7 to 0
VDCINADC
0
The VDCIN ADC value in this register is updated when an ADC interrupt occurs.
Table 54. Battery ADC Value SFR (BATADC, 0xDF)
Bit
Mnemonic
Default
Description
7 to 0
BATADC
0
The battery ADC value in this register is updated when an ADC interrupt occurs.
Table 55. Temperature ADC Value SFR (TEMPADC, 0xD7)
Bit
Mnemonic
Default
Description
7 to 0
TEMPADC
0
The temperature ADC value in this register is updated when an ADC interrupt occurs.
Rev. PrB | Page 69 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
start ADC measurement SFR (ADCGO, 0xD8).
TEMPERATURE MEASUREMENT
Background temperature measurements are not available.
In PSM2 operating mode, the 8052 is not active.
Temperature conversions are available through the
background measurement mode only.
To provide a digital temperature measurement, each ADE5166/
ADE5169/ADE5566/ADE5569 includes a dedicated ADC. An
8-bit temperature ADC value SFR (TEMPADC, 0xD7) holds
the results of the temperature conversion. The resolution of the
temperature measurement is 0.78°C/LSB. There are two ways to
initiate a temperature conversion: a single temperature measure-
ment or background temperature measurements.
•
The temperature ADC value SFR (TEMPADC, 0xD7) is updated
with a new value only when a temperature ADC interrupt occurs.
Temperature ADC Interrupt
Single Temperature Measurement
The temperature ADC can generate an ADC interrupt when at
least one of the following conditions occurs:
Set the TEMP_ADC_GO bit in the start ADC measurement
SFR (ADCGO, 0xD8) to obtain a temperature measurement
(see Table 51). An interrupt is generated when the conversion is
complete and when the temperature measurement is available
in the temperature ADC value SFR (TEMPADC, 0xD7).
•
The difference between the new temperature ADC value and
the last temperature ADC value generating an ADC interrupt
is larger than the value set in the TEMP_DIFF[2:0] bits.
The temperature ADC conversion, initiated by setting start
ADC measurement SFR (ADCGO, 0xD8) finishes.
•
Background Temperature Measurements
Background temperature measurements are disabled by default.
To configure the background temperature measurement mode,
set a temperature measurement interval in the peripheral ADC
strobe period SFR (STRBPER, 0xF9). Temperature measurements
are then performed periodically in the background (see Table 49).
When the ADC interrupt occurs, a new value is available in the
temperature ADC value SFR (TEMPADC, 0xD7). Note that
there is no flag associated with this interrupt.
BATTERY MEASUREMENT
To provide a digital battery measurement, each ADE5166/
ADE5169/ADE5566/ADE5569 includes a dedicated ADC. The
battery measurement is available in an 8-bit SFR, the battery
ADC value SFR (BATADC, 0xDF). The battery measurement
has a resolution of 14.6 mV/LSB. A battery conversion can be
initiated by two methods: a single battery measurement or
background battery measurements.
When a temperature conversion completes, the new temperature
ADC value is compared to the last temperature ADC value that
created an interrupt. If the absolute difference between the two
values is greater than the setting in the TEMP_DIFF[2:0] bits in
the temperature and supply delta SFR (DIFFPROG, 0xF3), a
TEMPADC interrupt is generated (see Table 50). This allows
temperature measurements to take place completely in the
background, only requiring MCU activity if the temperature
changes more than a configurable delta.
Single Battery Measurement
Set the BATT_ADC_GO bit in the start ADC measurement
SFR (ADCGO, 0xD8) to obtain a battery measurement. An
interrupt is generated when the conversion is done and when
the battery measurement is available in the battery ADC value
SFR (BATADC, 0xDF).
To set up background temperature measurements, follow
these steps:
1. Initiate a single temperature measurement by setting the
TEMP_ADC_GO bit in the start ADC measurement SFR
(ADCGO, 0xD8).
Background Battery Measurements
2. Upon completion of this measurement, configure the
TEMP_DIFF[2:0] bits to establish the change in temperature
that triggers an interrupt.
3. Set up the interval for background temperature measurements
by configuring the TEMP_PERIOD[1:0] bits in the
peripheral ADC strobe period SFR (STRBPER, 0xF9).
To configure background measurements for the battery, establish a
measurement interval in the peripheral ADC strobe period SFR
(STRBPER, 0xF9). Battery measurements are then performed
periodically in the background (see Table 49).
When a battery conversion completes, the battery ADC value is
compared to the low battery threshold, established in the battery
detection threshold SFR (BATVTH, 0xFA). If the battery ADC
value is below this threshold, a low battery flag is set. This low
battery flag is the FBAT bit in the power management interrupt
flag SFR (IPSMF, 0xF8), which is used for power supply manage-
ment. This low battery flag can be enabled to generate the PSM
interrupt by setting the EBAT bit in the power management
interrupt enable SFR (IPSME, 0xEC). This method allows battery
measurements to take place completely in the background, only
requiring MCU activity if the battery drops below a user-specified
threshold.
Temperature ADC in PSM0, PSM1, and PSM2
Depending on the operating mode of the ADE5166/ADE5169/
ADE5566/ADE5569, a temperature conversion is initiated only
by certain actions.
•
In PSM0 operating mode, the 8052 is active. Temperature
measurements are available in the background measurement
mode and by initiating a single measurement.
•
In PSM1 operating mode, the 8052 is active and the part
is battery powered. Single temperature measurements
can be initiated by setting the TEMP_ADC_GO bit in the
Rev. PrB | Page 70 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
To set up background battery measurements, follow these steps:
Single External Voltage Measurement
To obtain an external voltage measurement, set the
1. Configure the battery detection threshold SFR (BATVTH,
0xFA) to establish a low battery threshold. If the BATADC
measurement is below this threshold, the FBAT in the power
management interrupt flag SFR (IPSMF, 0xF8) is set.
2. Set up the interval for background battery measurements
by configuring the BATT_PERIOD[1:0] bits in the
VDCIN_ADC_GO bit in the start ADC measurement SFR
(ADCGO, 0xD8). An interrupt is generated when the conversion
is done and when the external voltage measurement is available
in the VDCIN ADC value SFR (VDCINADC, 0xEF).
Background External Voltage Measurements
peripheral ADC strobe period SFR (STRBPER, 0xF9).
Background external voltage measurements are disabled
by default. To configure the background external voltage
measurement mode, set an external voltage measurement
interval in the peripheral ADC strobe period SFR (STRBPER,
0xF9). External voltage measurements are performed periodi-
cally in the background (see Table 49).
Battery ADC in PSM0, PSM1, and PSM2
Depending on the operating mode, a battery conversion is
initiated only by certain actions.
•
In PSM0 operating mode, the 8052 is active. Battery
measurements are available in the background measure-
ment mode and by initiating a single measurement.
In PSM1 operating mode, the 8052 is active and the part
is battery powered. Single battery measurements can be
initiated by setting the BATT_ADC_GO bit in the start
ADC measurement SFR (ADCGO, 0xD8). Background
battery measurements are not available.
When an external voltage conversion is complete, the new
external voltage ADC value is compared to the last external
voltage ADC value that created an interrupt. If the absolute
difference between the two values is greater than the setting in
the VDCIN_DIFF[2:0] bits in the temperature and supply delta
SFR (DIFFPROG, 0xF3), a VDCIN ADC flag is set. This VDCIN
ADC flag is FVADC in the power management interrupt flag
SFR (IPSMF, 0xF8), which is used for power supply management.
This VDCIN ADC flag can be enabled to generate a PSM interrupt
by setting the EVADC bit in the power management interrupt
enable SFR (IPSME, 0xEC).
•
•
In PSM2 operating mode, the 8052 is not active. Unlike
temperature and VDCIN measurements, the battery
conversions are not available in this mode.
Battery ADC Interrupt
The battery ADC can generate an ADC interrupt when at least
one of the following conditions occurs:
This method allows external voltage measurements to take
place completely in the background, only requiring MCU
activity if the external voltage has changed more than a
configurable delta.
•
The new battery ADC value is smaller than the value set in
the battery detection threshold SFR (BATVTH, 0xFA),
indicating a battery voltage loss.
To set up background external voltage measurements, follow
these steps:
•
A single battery measurement initiated by setting the
BATT_ADC_GO bit finishes.
1. Initiate a single external voltage measurement by setting
the VDCIN_ADC_GO bit in the start ADC measurement
SFR (ADCGO, 0xD8).
2. Upon completion of this measurement, configure the
VDCIN_DIFF[2:0] bits to establish the change in voltage
that sets the FVDCIN in the power management interrupt
flag SFR (IPSMF, 0xF8).
3. Set up the interval for background external voltage measure-
ments by configuring the VDCIN_PERIOD[1:0] bits in the
peripheral ADC strobe period SFR (STRBPER, 0xF9).
When the battery flag (FBAT) is set in the power management
interrupt flag SFR (IPSMF, 0xF8), a new ADC value is available
in the battery ADC value SFR (BATADC, 0xDF). This battery
flag can be enabled as a source of the PSM interrupt to generate
a PSM interrupt every time the battery drops below a set voltage
threshold or after a single conversion initiated by setting the
BATT_ADC_GO bit is ready.
The battery ADC value SFR (BATADC, 0xDF) is updated with a
new value only when the battery flag is set in the power manage-
ment interrupt flag SFR (IPSMF, 0xF8).
EXTERNAL VOLTAGE MEASUREMENT
The ADE5166/ADE5169/ADE5566/ADE5569 include a dedicated
ADC to provide a digital measurement of an external voltage on
the VDCIN pin. An 8-bit SFR, the VDCIN ADC value SFR
(VDCINADC, 0xEF), holds the results of the conversion. The
resolution of the external voltage measurement is 15.3 mV/LSB.
There are two ways to initiate an external voltage conversion: a
single external voltage measurement or background external
voltage measurements.
Rev. PrB | Page 71 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
External Voltage ADC in PSM1 and PSM2
External Voltage ADC Interrupt
An external voltage conversion is initiated only by certain actions
that depend on the operating mode of the ADE5166/ADE5169/
ADE5566/ADE5569.
The external voltage ADC can generate an ADC interrupt when
at least one of the following conditions occurs:
•
The difference between the new external voltage ADC
value and the last external voltage ADC value generating
an ADC interrupt is larger than the value set in the
VDCIN_DIFF[2:0] bits in the temperature and supply
delta SFR (DIFFPROG, 0xF3).
•
In PSM0 operating mode, the 8052 is active. External
voltage measurements are available in the background
measurement mode and by initiating a single measurement.
In PSM1 operating mode, the 8052 is active and the part is
powered from battery. Single external voltage measurements
can be initiated by setting the VDCIN_ADC_GO bit in the
start ADC measurement SFR (ADCGO, 0xD8). Background
external voltage measurements are not available.
•
•
The external voltage ADC conversion initiated by setting
VDCIN_ADC_GO finishes.
When the ADC interrupt occurs, a new value is available in the
DCIN ADC value SFR (VDCINADC, 0xEF). Note that there is
no flag associated with this interrupt.
V
•
In PSM2 operating mode, the 8052 is not active. External
voltage conversions are available through the background
measurement mode only.
The external voltage ADC in the VDCIN ADC value SFR
(VDCINADC, 0xEF) is updated with a new value only when
an external voltage ADC interrupt occurs.
Rev. PrB | Page 72 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
8052 MCU CORE ARCHITECTURE
The ADE5166/ADE5169/ADE5566/ADE5569 has an 8052 MCU
core and uses the 8051 instruction set. Some of the standard
8052 peripherals, such as the UART, have been enhanced. This
section describes the standard 8052 core and enhancements
that have been made to it in the ADE5166/ADE5169/ADE5566/
ADE5569.
62kB ELECTRICALLY
REPROGRAMMABLE
ENERGY
NONVOLATILE
MEASUREMENT
FLASH/EE
PROGRAM/DATA
POWER
MANAGEMENT
MEMORY
256 BYTES
RTC
GENERAL-
PURPOSE
RAM
128-BYTE
SPECIAL
FUNCTION
REGISTER
AREA
LCD DRIVER
8051-COMPATIBLE
CORE
The special function register (SFR) space is mapped into the
upper 128 bytes of internal data memory space and is accessed
by direct addressing only. It provides an interface between the
CPU and all on-chip peripherals. A block diagram showing the
programming model of the ADE5166/ADE5169/ADE5566/
ADE5569 via the SFR area is shown in Figure 59.
TEMPERATURE
ADC
REGISTER
BANKS
PC
IR
BATTERY
ADC
2kB XRAM
OTHER ON-CHIP
PERIPHERALS:
SERIAL I/O
WDT
TIMERS
Figure 59: ADE5166/ADE5169/ADE5566/ADE5569 Block Diagram
All registers except the program counter (PC), instruction
register (IR) and the four general-purpose register banks reside
in the SFR area. The SFR registers include control, configura-
tion, and data registers that provide an interface between the
CPU and all on-chip peripherals.
MCU REGISTERS
The registers used by the MCU are summarized hereafter.
Table 56. 8051 SFRs
SFR
Address
Bit Addressable
Description
A
B
0xE0
0xF0
0xD0
0x87
0x82
0x83
0x82 and 0x83
0x81
0xB7
Yes
Yes
Yes
No
No
No
No
No
No
No
No
Accumulator
Auxiliary Math
PSW
PCON
DPL
DPH
DPTR
SP
SPH
STCON
CFG
Program Status Word (see Table 57)
Power Control (see Table 58)
Data Pointer Low (see Table 59)
Data Pointer High (see Table 60)
Data Pointer (see Table 61)
Stack Pointer (see Table 62)
Stack Pointer High (see Table 63)
Stack Boundary (see Table 64)
Configuration (see Table 65)
0xBF
0xAF
Table 57. Program Status Word SFR (PSW, 0xD0)
Bit
Address
Mnemonic
Description
7
0xD7
CY
Carry Flag. Modified by ADD, ADDC, SUBB, MUL, and DIV instructions.
Auxiliary Carry Flag. Modified by ADD, and ADDC instructions.
General-Purpose Flag Available to the User.
6
0xD6
AC
5
0xD5
F0
4, 3
0xD4,
0xD3
RS1, RS0
Register Bank Select Bits.
RS1
0
RS0
0
Selected Bank
0
1
2
3
0
1
1
0
1
1
2
1
0
0xD2
0xD1
0xD0
OV
F1
P
Overflow Flag. Modified by ADD, ADDC, SUBB, MUL and DIV instructions.
General-Purpose Flag Available to the User.
Parity Bit. The number of bits set in the accumulator added to the value of the parity bit is always an
even number.
Rev. PrB | Page 73 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Table 58. Program Control SFR (PCON, 0x87)
Bit
Mnemonic
Default
Description
7
SMOD
Reserved
0
0
Double baud rate control.
Reserved, should be left cleared.
6 to 0
Table 59. Data Pointer Low SFR (DPL, 0x82)
Bit
Mnemonic
Default
Description
7 to 0
DPH[7:0]
0
Contain the low byte of the data pointer.
Table 60. Data Pointer High SFR (DPH, 0x83)
Bit
Mnemonic
Default
Description
7 to 0
DPH[7:0]
0
Contain the high byte of the data pointer.
Table 61. Data Pointer SFR (DPTR, 0x82 and 0x83)
Bit
Mnemonic
Default
Description
15 to 0
DP[15:0]
0
Contain the 2-byte address of the data pointer. DPTR is a combination of DPH and DPL SFRs.
Table 62. Stack Pointer SFR (SP, 0x81)
Bit
Mnemonic
Default
Description
7 to 0
SP[7:0]
0
Contain the eight LSBs of the pointer for the stack.
Table 63. Stack Pointer High SFR (SPH, 0xB7)
Bits
Mnemonic Default
Description
7
6
5
4
3
2
1
0
Reserved
SBFLG
SSA[10]
SSA[9]
SSA[8]
SP[10]
SP[9]
1
0
0
0
1
0
0
1
Reserved.
Stack bottom flag.
Stack Starting Address Bit 10.
Stack Starting Address Bit 9.
Stack Starting Address Bit 8.
Stack Address Bit 10.
Stack Address Bit 9.
Stack Address Bit 8.
SP[8]
Table 64. Stack Boundary SFR (STCON, 0xBF)
Bits
7 to 3
2
Mnemonic Default
Description
WTRLINE
INT_RST
0
0
Contains the stack water line setting bits.
Interrupt/reset selection bit.
0
1
An interrupt is issued when a stack violation occurs.
A reset is issued when a stack violation occurs.
1
0
SBE
0
0
Stack boundary enable bit.
Waterline flag.
WTRLFG
Table 65. Configuration SFR (CFG, 0xAF)
Bit
Mnemonic Default
Description
7
Reserved
EXTEN
1
0
This bit should be left set for proper operation.
Enhanced UART enable bit.
6
EXTEN
Result
0
1
Standard 8052 UART without enhanced error checking features
Enhanced UART with enhanced error checking—see the UART Additional
Features section.
5
SCPS
0
Synchronous communication selection bit.
SCPS
Result
0
I2C port is selected for control of the shared I2C/SPI (MOSI, MISO, SCLK, and
SS) pins and SFRs.
1
SPI port is selected for control of the shared I2C/SPI (MOSI, MISO, SCLK, and
SS) pins and SFRs
Rev. PrB | Page 74 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Bit
Mnemonic Default
Description
4
MOD38EN
0
38 kHz Modulation Enable Bit
MOD38EN
Result
0
1
38kHz modulation is disabled.
38kHz modulation is enabled on the pins selected by the MOD38[7:0] bits in the
EPCFG SFR.
3 to 2
1 to 0
Reserved
00
01
Reserved. Should be left cleared.
XREN1,
XREN0
XREN[1:0]
Result
XREN1 OR
XREN0 = 1
Enable MOVX instruction to use 256 bytes of Extended RAM.
XREN1 AND Disable MOVX instruction.
XREN0 = 0
B Register
BASIC 8052 REGISTERS
The B register is used by the multiply and divide instructions,
Program Counter (PC)
MUL AB and DIV AB, to hold one of the operands. Because it
is not used for many instructions, it can be used as a scratchpad
register like those in the register banks. The B register is stored
in the SFR space (see Table 56).
The program counter holds the 2-byte address of the next instruc-
tion to be fetched. The PC is initialized with 0x00 at reset and is
incremented after each instruction is performed. Note that the
amount that is added to the PC depends on the number of bytes
in the instruction, so the increment can range from one to three
bytes. The program counter is not directly accessible to the user
but can be directly modified by CALL and JMP instructions
that change which part of the program is active.
Program Status Word (PSW)
The PSW register reflects the status of arithmetic and logical
operations through carry, auxiliary carry and overflow flags.
The parity flag reflects the parity of the contents of the accumula-
tor, which can be helpful for communication protocols. The
PSW bits are described in Table 57. The program status word
SFR (PSW, 0xD0) is bit addressable.
Instruction Register (IR)
The instruction register holds the opcode of the instruction
being executed. The opcode is the binary code that results from
assembling an instruction. This register is not directly accessible
to the user.
Data Pointer (DPTR)
The data pointer is made up of two 8-bit registers: DPH (high
byte), and DPL (low byte). These provide memory addresses for
internal code and data access. The DPTR can be manipulated as
a 16-bit register (DPTR = DPH, DPL), or as two independent
8-bit registers (DPH, DPL)—see Table 59 and Table 60.
Register Banks
There are four banks containing 8-byte-wide registers each, for
a total of 32 bytes of registers. These registers are convenient for
temporary storage of mathematical operands. An instruction
involving the accumulator and a register can be executed in one
clock cycle as opposed to 2 clock cycles to perform an instruc-
tion involving the accumulator and a literal or a byte of general
purpose RAM. The register banks are located in the first 32 bytes
of RAM.
The 8052 MCU core architecture supports dual data pointers
(see the 8052 MCU Core Architecture section).
Stack Pointer (SP)
The stack pointer keeps track of the current address of the top
of the stack. To push a byte of data onto the stack, the stack
pointer is incremented and the data is moved to the new top of
the stack. To pop a byte of data off the stack, the top byte of data
is moved into the awaiting address and the stack pointer is
decremented. The stack is a last in first out (LIFO) method of
data storage because the most recent addition to the stack is the
first to come off it.
The active register bank is selected by the RS0 and RS1 bits in
the program status word SFR (PSW, 0xD0).
Accumulator
The accumulator is a working register, storing the results of
many arithmetic or logical operations. The accumulator is used
in more than half of the 8052 instructions where it is usually
referred to as A. The status register (PSW) constantly monitors
the number of bits that are set in the accumulator to determine
if it has even or odd parity. The accumulator is stored in the
SFR space (see Table 56).
The stack is utilized during CALL and RET instructions to keep
track of the address to move into the PC when returning from
the function call. The stack is also manipulated when vectoring
for interrupts, to keep track of the prior state of the PC.
The stack resides in the upper part of the extended internal
RAM. The SP[7:0] and SPH[2:0] registers hold the address of
the stack in the extended RAM. The advantage of this solution
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ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
is that the use of the general-purpose RAM can be limited to
data storage. The use of the extended internal RAM can be
limited to the stack, or alternatively split between the stack and
data storage if more space is required. This separation limits the
chance of data corruption because the stack can be contained in
the upper section of the XRAM and does not overflow into the
lower section containing data. Data can still be stored in
extended RAM by using the MOVX command.
when STCON[2] is high, a reset also occurs. If an interrupt
response is selected, the watchdog interrupt service routine is
entered assuming that there is no higher level interrupt currently
being serviced. It should be noted that once STCON[1] is
enabled, an interrupt(or reset) triggers if the stack boundary is
violated, regardless of the status of the EA bit in the IE register.
This is because the watchdog interrupt is automatically configured
as a high priority interrupt and, therefore, is not disabled by
clearing EA. When STCON[1] is low, the feature is completely
disabled and no pending interrupts are generated.
The default starting address for the stack is 0x100, electing the
upper 1792 bytes of XRAM for the stack operation. The starting
address can be reconfigured to reduce the stack by writing to
Bits SPH[5:3]. These three bits set the value of the three most
significant bits of the stack pointer. For example, setting the
SPH[5:3] to a value of 110b moves the default starting address
of the stack to 0x600, allowing the highest 512 bytes of the
XRAM to be used for stack operation. If the situation occurs
that the stack reaches the top of the XRAM and overflows, the
stack pointer rolls over to the default starting address that is
written in SPH[5:3]. Care should be taken if altering the default
starting address of the stack because unwanted overwrite
operations may occur should the stack overflow or underflow.
There are two separate flags associated with the stack boundary
protection, allowing the cause of the violation to be determined.
When the waterline is exceeded, a flag is set in Bit 0 of the stack
boundary SFR (STCON, 0xBF) indicating that the reset/interrupt
was initiated by the stack waterline monitor. This flag remains
high until the stack pointer falls below the waterline and the
user clears the flag in software. A waterline or watchdog reset
alone does not clear the flag. To successfully clear the flag, the
software clear must occur while the stack pointer is below the
waterline.
Note that the stack pointer should never be altered while in the
interrupt service routine because this leads to the program
returning to a different section of the program and therefore
malfunctioning. An external reset also causes the waterline flag
to reset.
Stack Boundary Protection
As a warning signal that the stack pointer is extending outside
the specified range, a stack boundary protection feature is
included. This feature is controlled through the stack boundary
SFR (STCON, 0xBF) and is disabled by default. To enable this
feature, the boundary protection enable bit should be set in the
STCON SFR.
When an attempt has been made to move the stack pointer
below the stack starting address, a flag is set in the stack pointer
high SFR (SPH, 0xB7), indicating that the reset/interrupt was
initiated by the stack bottom monitor. Once again, a boundary
or watchdog reset alone does not clear this flag, and the user
must clear the flag in software to successfully acknowledge the
event. Note that if SPH[5:3] and SPH[2:0] are altered simulta-
neously to reduce the default stack starting address, when the
stack boundary condition is enabled, a stack violation condition
occurs and the stack bottom flag, SPH[6], is initiated. To avoid
this condition, it is recommended that the default stack starting
address remain at 0x100 or be increased further up the XRAM.
The stack boundary protection works in two ways to protect the
remainder of the XRAM from being corrupted. The waterline
detection feature monitors the top of the stack and warns the
user when the stack pointer is reaching the overflow point. By
setting STCON[7:3], the level of the water line below the top of
the XRAM can be set. For example, by setting STCON[7:3] to
the maximum value of 0x1F, the waterline is set to its minimum
value of 0x7FF − 0x1F = 0x7F0. Similarly, by setting STCON[7:3]
to 0x1, the waterline is set at the top of the RAM space, 0x7FE.
Note that if STCON[7:3] is set to 000b, then the feature is
effectively disabled and no interrupt or reset is generated.
A useful implementation of the waterline feature is to determine
the amount of space required for the stack and allow a suitable
default starting address to be selected. This optimizes the use
of the additional XRAM space, allowing it to be used for data
storage. To obtain this information, the waterline should be set
to the estimated stack maximum and the interrupt enabled. If
the stack exceeds the estimated maximum, the interrupt triggers,
and the waterline level should be increased in the interrupt
service routine. Before returning to the main program, the
waterline interrupt status flag should be cleared. This program
continues to jump to the waterline service routine until the
stack no longer exceeds the waterline level and the maximum
stack level has been determined.
The bottom of the stack is also preserved by the stack boundary
feature. Should the stack pointer be written to a value lower
than the default stack starting address defined in the SPH[5:3],
a warning is issued and the perpetrating command is ignored.
The protection for both the waterline and the stack starting
address are enabled simultaneously by setting Bit 1 in the
STCON SFR.
When enabled, the stack boundary protection can be configured
to either reset the part or trigger an interrupt when a stack viola-
tion occurs. The value of STCON[2] determines the response
of the part. When STCON[2] is set to 0x1 and the stack pointer
exceeds the waterline, the part resets immediately no matter
what other routines are in progress. If an attempt is made to
move the stack pointer below the default stack starting address
The stack boundary feature can be protected by clearing the
second most significant bit in Flash Location 0xF7FF (see the
Protecting the Flash section). If this protection bit is enabled,
Rev. PrB | Page 76 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
the stack boundary protection is enabled and fixed to issue an
interrupt should an event occur. STCON[1] and STCON[2] can
therefore not be altered when the protection bit is set. Once the
protection bit is set, the default stack starting address, SPH[5:3],
can only be written once before becoming fixed. It is therefore
recommended that this feature be configured for the application
before the stack boundary protection bit is written in the flash.
unlike standard 8052 products, provide internal nonvolatile
Flash memory so that an external code space is unnecessary.
The on-chip LCD driver requires many pins, some of which are
dedicated for LCD functionality and others that can be configured
at LCD or general-purpose I/O. Due to the limited number of
I/O pins, the ADE5166/ADE5169/ADE5566/ADE5569 do not
allow access to external code and data spaces.
The ADE5166/ADE5169/ADE5566/ADE5569 provide 20 pins
that can be used for general purpose I/O. These pins are mapped
to Port 0, Port 1, and Port 2, and are accessed through three
bit-addressable 8052 SFRs: P0, P1, and P2. Another enhanced
feature of the ADE5166/ADE5169/ADE5566/ADE5569 is that
the weak pull-ups standard on 8052 Port 1, Port 2, and Port 3
can be disabled to make open-drain outputs, as is standard on
Port 0. The weak pull-ups can be enabled on a pin-by-pin basis
(see the I/O Ports section).
0x7FF
WATERLINE
0x7FF-STCON[7:3]
STACK STARTING
ADDRESS
{SPH[5:3], 0x00}
2kB OF
ON-CHIP x-RAM
0xFF
256 BYTES
OF RAM
Power Control Register (PCON, 0x87)
(DATA)
The 8052 core defines two power-down modes; power-down
and idle. The ADE5166/ADE5169/ADE5566/ADE5569
enhance the power control capability of the traditional 8052
MCU with additional power management functions. The
POWCON register is used to define power control specific
functionality for the ADE5166/ADE5169/ADE5566/ADE5569.
The program control SFR (PCON, 0x87) is not bit addressable
(see Power Management section).
0x00
0x00
Figure 60. Extended Stack Pointer Operation
STANDARD 8052 SFRS
The standard 8052 special function registers include the accumula-
tor, B, PSW, DPTR, and SP SFRs described in the Basic 8052
Registers section. The 8052 also defines standard timers, serial
port interfaces, interrupts, I/O ports and power down modes.
The ADE5166/ADE5169/ADE5566/ADE5569 provide many
other peripherals not standard to the 8052 core.
Timer SFRs
The 8052 contains three 16-bit timers, the identical Timer0 and
Timer1, as well as a Timer2. These timers can also function as
event counters. Timer2 has a capture feature where the value
of the timer can be captured in two 8-bit registers upon the
assertion of an external input signal (see the Timers section).
•
•
•
•
•
•
•
•
•
•
ADE energy measurement DSP
Full RTC
LCD driver
Battery switchover/power management
Temperature ADC
Serial Port SFRs
Battery ADC
The two full-duplex serial port peripherals each require two
registers, one for setting up the baud rate and other communica-
tion parameters, and another byte for the transmit/receive
buffer. TheADE5166/ADE5169/ADE5566/ADE5569 also
provide enhanced serial port functionality with a dedicated
timer for baud rate generation with a fractional divisor and
additional error detection. See the UART Serial Interface
section and the UART2 Serial Interface section for details.
SPI/I2C communication
Flash memory controller
Watchdog timer
Secondary UART port
MEMORY OVERVIEW
The ADE5166/ADE5169/ADE5566/ADE5569 contain three
memory blocks.
Interrupt SFR
•
•
•
62 kB of on-chip Flash/EE program and data memory
256 bytes of general-purpose RAM
2 kB of internal extended RAM (XRAM)
There is a two-tiered interrupt system standard in the 8052
core. The priority level for each interrupt source is individually
selectable as high or low. The TheADE5166/ADE5169/ADE5566/
ADE5569 enhance this interrupt system by creating in essence a
third interrupt tier for a highest priority power supply manage-
ment interrupt, PSM (see the Interrupt System section).
The 256 bytes of general-purpose RAM shares the upper 128 bytes
of its address space with special function registers. All of the
memory spaces are shown in Figure 59. The addressing mode
specifies which memory space to access.
I/O Port SFRs
The 8052 core supports four I/O ports, P0 through P3, where
Port 0 and Port 2 are typically used for access to external code
and data spaces. The ADE5166/ADE5169/ADE5566/ADE5569,
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ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
BYTE
ADDRESS
General-Purpose RAM
BIT ADDRESSES (HEXA)
0x2F
0x2E
0x2D
0x2C
0x2B
0x2A
0x29
0x28
0x27
0x26
0x25
0x24
0x23
0x22
0x21
0x20
7F 7E 7D 7C 7B 7A 79 78
77 76 75 74 73 72 71 70
6F 6E 6D 6C 6B 6A 69 68
67 66 65 64 63 62 61 60
5F 5E 5D 5C 5B 5A 59 58
57 56 55 54 53 52 51 50
4F 4E 4D 4C 4B 4A 49 48
47 46 45 44 43 42 41 40
3F 3E 3D 3C 3B 3A 39 38
37 36 35 34 33 32 31 30
2F 2E 2D 2C 2B 2A 29 28
27 26 25 24 23 22 21 20
1F 1E 1D 1C 1B 1A 19 18
17 16 15 14 13 12 11 10
0F 0E 0D 0C 0B 0A 09 08
07 06 05 04 03 02 01 00
General-purpose RAM resides in Memory Location 0x00
through Memory Location 0xFF. It contains the register banks.
0x7F
GENERAL-PURPOSE
AREA
0x30
0x2F
BIT-ADDRESSABLE
BANKS
(BIT ADDRESSES)
SELECTED
VIA
BITS IN PSW
0x20
0x18
0x10
0x08
0x00
0x1F
11
10
01
00
0x17
0x0F
0x07
FOUR BANKS OF EIGHT
REGISTERS R0 TO R7
Figure 63. Bit Addressable Area of General-Purpose RAM
Bit addressing can be used for instructions that involve Boolean
variable manipulation and program branching (see the Instruction
Set section).
RESET VALUE OF
STACK POINTER
Figure 61. Lower 128 Bytes of Internal Data Memory
Special Function Registers
Address 0x80 through Address 0xFF of general-purpose RAM
are shared with the special function registers. The mode of
addressing determines which memory space is accessed, as
shown in Figure 62.
Special function registers are registers that affect the function of
the 8051 core or its peripherals. These registers are located in
RAM with Address 0x80 through Address 0xFF. They are only
accessible through direct addressing, as shown in Figure 62.
0xFF
The individual bits of some of the SFRs can be accessed for use
in Boolean and program branching instructions. These SFRs are
labeled as bit addressable and the bit addresses are given in
Table 14.
ACCESSIBLE BY
ACCESSIBLE BY
INDIRECT ADDRESSING DIRECT ADDRESSING
ONLY
ONLY
0x80
0x7F
ACCESSIBLE BY
DIRECT AND INDIRECT
ADDRESSING
0x00
Extended Internal RAM (XRAM)
GENERAL-PURPOSE RAM
The ADE5166/ADE5169/ADE5566/ADE5569 provide 2 kB of
extended on-chip RAM. No external RAM is supported. This
RAM is located in Address 0x00 through Address 0x7FF in the
extended RAM space. To select the extended RAM memory
space, the extended indirect addressing modes are used.
0x7FF
SPECIAL FUNCTION REGISTERS (SFRs)
Figure 62. General-Purpose RAM and SFR Memory Address Overlap
Both direct and indirect addressing can be used to access general-
purpose RAM from 0x00 through 0x7F, but indirect addressing
must be used to access general-purpose RAM with addresses in
the range from 0x80 through 0xFF because they share the same
address space with the special function registers (SFRs).
2kB OF
EXTENDED INTERNAL
RAM (XRAM)
0x00
The 8052 core also has the means to access individual bits of
certain addresses in the general-purpose RAM and special
function memory spaces. The individual bits of general-purpose
RAM, Address 0x20 to Address 0x2F, can be accessed through
Bit Address 0x00 to Bit Address 0x7F. The benefit of bit addressing
is that the individual bits can be accessed quickly, without the
need for bit masking, which takes more code memory and
execution time. The bit addresses for general-purpose RAM
Address 0x20 through Address 0x2F can be seen in Figure 63.
Figure 64: Extended Internal RAM (XRAM) Space
Code Memory
Code and data memory are stored in the 62 kB flash memory
space. No external code memory is supported. To access code
memory, code indirect addressing is used.
ADDRESSING MODES
The 8052 core provides several addressing modes. The address-
ing mode determines how the core interprets the memory
location or data value specified in assembly language code.
There are six addressing modes, as shown in Table 66.
Rev. PrB | Page 78 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
ADE5566/ADE5569 provide 2 kB of internal extended RAM
(XRAM), accessed through MOVX instructions. External
memory spaces are not supported on the ADE5166/ADE5169/
ADE5566/ADE5569.
Table 66. 8052 Addressing Modes
Core Clock
Bytes Cycles
Addressing Mode Example
Immediate
MOV A, #A8h
MOV DPTR, #A8h
MOV A, A8h
2
3
2
2
1
1
1
1
1
1
1
2
3
2
2
1
2
4
4
4
4
3
In extended direct addressing mode, the DPTR register points
to the address of the byte of extended RAM. The following code
moves the contents of extended RAM Address 0x100 to the
accumulator:
Direct
MOV A, IE
MOV A, R0
Indirect
MOV A, @R0
MOV
DPTR,#100h
A,@DPTR
Extended Direct
Extended Indirect
Code Indirect
MOVX A, @DPTR
MOVX A, @R0
MOVC A, @A+DPTR
MOVC A, @A+PC
JMP @A+DPTR
MOVX
These two instructions require a total of seven clock cycles and
four bytes of storage in the program memory.
Extended Indirect Addressing
The internal extended RAM is accessed through a pointer to the
address in indirect addressing mode. The ADE5166/ADE5169/
ADE5566/ADE5569 provide 2 kB of internal extended RAM,
accessed through MOVX instructions. External memory is not
supported on the ADE5166/ADE5169/ADE5566/ADE5569.
Immediate Addressing
In immediate addressing, the expression entered after the
number sign (#) is evaluated by the assembler and stored in the
memory address specified. This number is referred to as a
literal because it refers only to a value and not to a memory
location. Instructions using this addressing mode is slower than
those between two registers because the literal must be stored
and fetched from memory. The expression can be entered as a
symbolic variable or an arithmetic expression; the value is
computed by the assembler.
In extended indirect addressing mode, a register holds the
address of the byte of extended RAM. The following code
moves the contents of extended RAM Address 0x80 to the
accumulator:
MOV R0,#80h
MOVX A,@R0
Direct Addressing
With direct addressing, the value at the source address is moved
to the destination address. Direct addressing provides the fastest
execution time of all the addressing modes when an instruction
is performed between registers using direct addressing. Note
that indirect or direct addressing modes can be used to access
general-purpose RAM Address 0x00 through Address 0x7F. An
instruction with direct addressing that uses an address between
0x80 and 0xFF is referring to a special function memory location.
These two instructions require six clock cycles and three bytes
of storage.
Note that there are 2 kB of extended RAM, so both extended
direct and extended indirect addressing can cover the whole
address range. There is a storage and speed advantage to using
extended indirect addressing because the additional byte of
addressing available through the DPTR register that is not
needed is not stored.
Indirect Addressing
From the three examples demonstrating the access of internal
RAM from 0x80 through 0xFF and extended internal RAM
from 0x00 through 0xFF, it can be seen that it is most efficient
to use the entire internal RAM accessible through indirect
access before moving to extended RAM.
With indirect addressing, the value pointed to by the register is
moved to the destination address. For example, to move the
contents of internal RAM Address 0x82 to the accumulator, use
the following two instructions, which require a total of four
clock cycles and three bytes of storage in the program memory:
Code Indirect Addressing
MOV
MOV
R0,#82h
A,@R0
The internal code memory can be accessed indirectly. This can
be useful for implementing lookup tables and other arrays of
constants that are stored in Flash. For example, to move the data
stored in Flash memory at Address 0x8002 into the accumulator:
Indirect addressing allows addresses to be computed, and is
useful for indexing into data arrays stored in RAM.
Note that an instruction that refers to Addresses 0x00 through
Address 0x7F is referring to internal RAM, and indirect or direct
addressing modes can be used. An instruction with indirect
addressing that uses an address between 0x80 and 0xFF is
referring to internal RAM, not to an SFR.
MOV
DPTR,#8002h
A
CLR
MOVX
A,@A+DPTR
The accumulator can be used as a variable index into the array
of flash memory located at DPTR.
Extended Direct Addressing
The DPTR register is used to access internal extended RAM in
extended indirect addressing mode. The ADE5166/ADE5169/
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ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
INSTRUCTION SET
Table 67 documents the number of clock cycles required for each instruction. Most instructions are executed in one or two clock cycles,
resulting in a 4-MIPS peak performance.
Table 67. Instruction Set
Mnemonic
Arithmetic
ADD A, Rn
ADD A, @Ri
ADD A, dir
ADD A, #data
ADDC A, Rn 1 1
ADDC A, @Ri
ADDC A, dir
ADDC A, #data
SUBB A, Rn
SUBB A, @Ri
SUBB A, dir
SUBB A, #data
INC A
INC Rn
INC @
INC dir
INC DPTR
DEC A
DEC Rn
DEC @Ri
DEC dir
MUL AB
Description
Bytes
Cycles
Add register to A
Add indirect memory to A
Add direct byte to A
1
1
2
2
1
1
2
2
1
1
2
2
1
1
1
2
1
1
1
1
2
1
1
1
1
2
2
2
1
2
2
2
1
2
2
2
1
1
2
2
3
1
1
2
2
9
9
2
Add Immediate to A
Add register to A with carry
Add indirect memory to A with carry
Add direct byte to A with carry
Add immediate to A with carry
Subtract register from A with borrow
Subtract indirect memory from A with borrow
Subtract direct from A with borrow
Subtract immediate from A with borrow
Increment A
Increment register
Ri increment indirect memory
Increment direct byte
Increment data pointer
Decrement A
Decrement register
Decrement indirect memory
Decrement direct byte
Multiply A by B
Divide A by B
Decimal Adjust A
DIV AB
DA A
Logic
ANL A, Rn
ANL A, @Ri
ANL A, dir
ANL A, #data
ANL dir, A
ANL dir, #data
ORL A, Rn
ORL A, @Ri
ORL A, dir
ORL A, #data
ORL dir, A
ORL dir, #data
XRL A, Rn
XRL A, @Ri
XRL A, #data
XRL dir, A
XRL A, dir
XRL dir, #data
CLR A
AND register to A
AND indirect memory to A
AND direct byte to A
AND immediate to A
AND A to direct byte
AND immediate data to direct byte
OR register to A
OR indirect memory to A
OR direct byte to A
OR immediate to A
OR A to direct byte
OR immediate data to direct byte
Exclusive-OR register to A
Exclusive-OR indirect memory to A
Exclusive-OR immediate to A
Exclusive-OR A to direct byte
Exclusive-OR indirect memory to A
Exclusive-OR immediate data to direct
Clear A
1
1
2
2
2
3
1
1
2
2
2
3
1
2
2
2
2
3
1
1
1
1
1
2
2
2
2
3
1
2
2
2
2
3
1
2
2
2
2
3
1
1
1
1
CPL A
SWAP A
RL A
Complement A
Swap nibbles of A
Rotate A left
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Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Mnemonic
RLC A
RR A
Description
Bytes
Cycles
Rotate A left Through carry
Rotate A right
Rotate A right through carry
1
1
1
1
1
1
RRC A
Data Transfer
MOV A, Rn
MOV A, @Ri
MOV Rn, A
MOV @Ri, A
MOV A, dir
MOV A, #data
MOV Rn, #data
MOV dir, A
MOV Rn, dir
MOV dir, Rn
MOV @Ri, #data
MOV dir, @Ri
MOV @Ri, dir
MOV dir, dir
MOV dir, #data
MOV DPTR, #data
MOVC A, @A+DPTR
MOVC A, @A+PC
MOVX A, @Ri
MOVX A, @DPTR
MOVX @Ri, A
MOVX @DPTR, A
PUSH dir
Move register to A
Move indirect memory to A
Move A to register
Move A to indirect memory
Move direct byte to A
Move immediate to A
Move register to immediate
Move A to direct byte
Move register to direct byte
Move direct to register
Move immediate to indirect memory
Move indirect to direct memory
Move direct to indirect memory
Move direct byte to direct byte
Move immediate to direct byte
Move immediate to data pointer
Move code byte relative DPTR to A
Move code byte relative PC to A
Move external (A8) data to A
Move external (A16) data to A
Move A to external data (A8)
Move A to external data (A16)
Push direct byte onto stack
Pop direct byte from stack
Exchange A and register
1
1
1
1
2
2
2
2
2
2
2
2
2
3
3
3
1
1
1
1
1
1
2
2
1
1
1
2
1
2
1
2
2
2
2
2
2
2
2
2
2
3
3
3
4
4
4
4
4
4
2
2
1
2
2
2
POP dir
XCH A, Rn
XCH A, @Ri
XCHD A, @Ri
XCH A, dir
Boolean
Exchange A and indirect memory
Exchange A and indirect memory nibble
Exchange A and direct byte
CLR C
CLR bit
SETB C
SETB bit
CPL C
CPL bit
ANL C,bit
ANL C, /bit
ORL C, bit
ORL C, /bit OR
MOV C, bit
MOV bit, C
Branching
JMP @A+DPTR
RET
Clear carry
Clear direct bit
Set carry
Set direct bit
Complement carry
Complement direct bit
AND direct bit and carry
AND direct bit inverse to carry
OR direct bit and carry
Direct bit inverse to carry
Move direct bit to carry
Move carry to direct bit
1
2
1
2
1
2
2
2
2
2
2
2
1
2
1
2
1
2
2
2
2
2
2
2
Jump indirect relative to DPTR
Return from subroutine
Return from interrupt
Absolute jump to subroutine
Absolute jump unconditional
Short jump (relative address)
Jump on carry equal to 1
1
1
1
2
2
2
2
3
4
4
3
3
3
3
RETI
ACALL addr11
AJMP addr11
SJMP rel
JC rel
Rev. PrB | Page 81 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Mnemonic
JNC rel
JZ rel
JNZ rel
DJNZ Rn, rel
LJMP
Description
Bytes
Cycles
Jump on carry = 0
Jump on accumulator = 0
Jump on accumulator ≠ 0
Decrement register, JNZ relative
Long jump unconditional
Long jump to subroutine
Jump on direct bit = 1
Jump on direct bit = 0
Jump on direct bit = 1 and clear
Compare A, direct JNE relative
Compare A, immediate JNE relative
Compare register, immediate JNE relative
Compare indirect, immediate JNE relative
Decrement direct byte, JNZ relative
2
2
2
2
3
3
3
3
3
3
3
3
3
3
3
3
3
3
4
4
4
4
4
4
4
4
4
4
LCALL addr16
JB bit, rel
JNB bit, rel
JBC bit, rel
CJNE A, dir, rel
CJNE A, #data, rel
CJNE Rn, #data, rel
CJNE @Ri, #data, rel
DJNZ dir, rel
Miscellaneous
NOP
No operation
1
1
READ-MODIFY-WRITE INSTRUCTIONS
INSTRUCTIONS THAT AFFECT FLAGS
Some 8052 instructions read the latch and others read the pin.
The state of the pin is read for instructions that input a port bit.
Instructions that read the latch rather than the pins are the ones
that read a value, possibly change it, and rewrite it to the latch.
Because these instructions involve modifying the port, it is
assumed that the pins being modified are outputs, so the output
state of the pin is read from the latch. This prevents a possible
misinterpretation of the voltage level of a pin. For example, if a
port pin is used to drive the base of a transistor, a 1 is written to
the bit to turn on the transistor. If the CPU reads the same port
bit at the pin rather than the latch, it reads the base voltage of
the transistor and interprets it as Logic 0. Reading the latch
rather than the pin returns the correct value of 1.
Many instructions explicitly modify the carry bit, such as the
MOV C bit and CLR C instructions. Other instructions that
affect status flags are listed in this section.
ADD A, Source
This instruction adds the source to the accumulator. No status
flags are referenced by the instruction.
Affected Status Flags
C
Set if there is a carry out of Bit 7. Cleared otherwise.
Used to indicate an overflow if the operands are
unsigned.
OV
Set if there is a carry out of Bit 6 or a carry out of
Bit 7, but not if both are set. Used to indicate an
overflow for signed addition. This flag is set if two
positive operands yield a negative result or if two
negative operands yield a positive result.
The instructions that read the latch rather than the pins are
called read-modify-write instructions and are listed in Table 68.
When the destination operand is a port or a port bit, these
instructions read the latch rather than the pin.
AC
Set if there is a carry out of Bit 3. Cleared otherwise.
Table 68. Read-Modify-Write Instructions
Instruction
Example
ANL P0, A
ORL P1, A
XRL P2, A
JBC P1.1,LABEL
CPL P2.0
INC P2
Description
ADDC A, Source
ANL
ORL
XRL
JBC
CPL
INC
DEC
DJNZ
Logic AND
Logic OR
Logic XOR
Jump if Bit = 1 and clear bit
Complement bit
Increment
This instruction adds the source and the carry bit to the accu-
mulator. The carry status flag is referenced by the instruction.
Affected Status Flags
C
Set if there is a carry out of Bit 7. Cleared otherwise.
Used to indicate an overflow if the operands are
unsigned.
DEC P2
Decrement
DJNZ P0, LABEL Decrement and jump if not zero
MOV PX.Y,C1 MOV P0.0, C
CLR PX.Y1
SETB PX.Y1
1 These instructions read the port byte (all eight bits), modify the addressed
bit, and write the new byte back to the latch.
Move carry to Bit Y of Port X
Clear Bit Y of Port X
Set Bit Y of Port X
OV
Set if there is a carry out of Bit 6 or a carry out of Bit 7,
but not if both are set. Used to indicate an overflow
for signed addition. This flag is set if two positive
operands yield a negative result or if two negative
operands yield a positive result.
CLR P0.0
SETB P0.0
AC
Set if there is a carry out of Bit 3. Cleared otherwise.
Rev. PrB | Page 82 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
SUBB A, Source
of Bit 0 to Bit 3 exceeds nine, 0x06 is added to the accumulator
to correct the lower four bits. If the carry bit is set when the
instruction begins, or if 0x06 is added to the accumulator in the
first step, 0x60 is added to the accumulator to correct the higher
four bits.
This instruction subtracts the source byte and the carry
(borrow) flag from the accumulator. It references the carry
(borrow) status flag.
Affected Status Flags
The carry and AC status flags are referenced by this instruction.
C
Set if there is a borrow needed for Bit 7. Cleared
otherwise. Used to indicate an overflow if the
operands are unsigned.
Affected Status Flag
C
Set if the result is greater than 0x99. Cleared otherwise.
OV
Set if there is a borrow needed for Bit 6 or Bit 7, but
not for both. Used to indicate an overflow for signed
subtraction. This flag is set if a negative number
subtracted from a positive yields a negative result or
if a positive number subtracted from a negative
number yields a positive result.
RRC A
This instruction rotates the accumulator to the right through
the carry flag. The old LSB of the accumulator becomes the new
carry flag, and the old carry flag is loaded into the new MSB of
the accumulator.
The carry status flag is referenced by this instruction.
AC
Set if a borrow is needed for Bit 3. Cleared otherwise.
Affected Status Flag
MUL AB
C
Equal to the state of ACC[0] before execution of the
instruction.
This instruction multiplies the accumulator by the B register.
This operation is unsigned. The lower byte of the 16-bit product
is stored in the accumulator and the higher byte is left in the B
register. No status flags are referenced by the instruction.
RLC A
This instruction rotates the accumulator to the left through the
carry flag. The old MSB of the accumulator becomes the new
carry flag, and the old carry flag is loaded into the new LSB of
the accumulator.
Affected Status Flags
C
Cleared
The carry status flag is referenced by this instruction.
OV
Set if the result is greater than 255. Cleared otherwise.
Affected Status Flag
DIV AB
C
Equal to the state of ACC[7] before execution of the
instruction.
This instruction divides the accumulator by the B register. This
operation is unsigned. The integer part of the quotient is stored
in the accumulator and the remainder goes into the B register.
No status flags are referenced by the instruction.
CJNE Destination, Source, Relative Jump
This instruction compares the source value to the destination
value and branches to the location set by the relative jump if
they are not equal. If the values are equal, program execution
continues with the instruction after the CJNE instruction.
Affected Status Flags
C
Cleared
OV
Cleared unless the B register is equal to 0, in which
case the results of the division are undefined and the
OV flag is set.
No status flags are referenced by this instruction.
Affected Status Flag
C
Set if the source value is greater than the destination
value. Cleared otherwise.
DA A
This instruction adjusts the accumulator to hold two 4-bit digits
after the addition of two binary coded decimals (BCDs) with
the ADD or ADDC instructions. If the AC bit is set or if the value
Rev. PrB | Page 83 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
DUAL DATA POINTERS
MOV DPTR,#0
MOV DPCON,#55H
;Main DPTR = 0
Each ADE5166/ADE5169/ADE5566/ADE5569 incorporates
two data pointers. The second data pointer is a shadow data
pointer and is selected via the data pointer control SFR (DPCON,
0xA7). DPCON features automatic hardware postincrement and
postdecrement, as well as an automatic data pointer toggle.
;Select shadow DPTR
;DPTR1 increment mode
;DPTR0 increment mode
;DPTR auto toggling ON
MOV DPTR,#0D000H ;DPTR = D000H
MOVELOOP: CLR A
Note that this is the only section of the data sheet where the
main and shadow data pointers are distinguished. Whenever the
data pointer (DPTR) is mentioned elsewhere in the data sheet,
active DPTR is implied.
MOVC A,@A+DPTR
;Post Inc DPTR
;Get data
In addition, only the MOVC/MOVX @DPTR instructions
automatically postincrement and postdecrement the DPTR.
Other MOVC/MOVX instructions, such as MOVC PC
or MOVC @Ri, do not cause the DPTR to automatically
postincrement and postdecrement.
;Swap to Main DPTR(Data)
MOVX @DPTR,A
;Put ACC in XRAM
;Increment main DPTR
;Swap Shadow DPTR(Code)
MOV A, DPL
To illustrate the operation of DPCON, the following code copies
256 bytes of code memory at Address 0xD000 into XRAM,
starting from Address 0x0000:
JNZ MOVELOOP
Table 69. Data Pointer Control SFR (DPCON, 0xA7)
Bit
Mnemonic
Default Description
7
0
0
Not implemented. Write don’t care.
6
DPT
Data pointer automatic toggle enable. Cleared by the user to disable autoswapping of the DPTR.
Set in user software to enable automatic toggling of the DPTR after each MOVX or MOVC instruction.
5, 4
DP1m1,
DP1m0
0
Shadow data pointer mode. These bits enable extra modes of the shadow data pointer operation,
allowing more compact and more efficient code size and execution.
DP1m1
DP1m0
Result (Behavior of the Shadow Data Pointer)
8052 behavior.
DPTR is postincremented after a MOVX or a MOVC instruction.
DPTR is postdecremented after a MOVX or MOVC instruction.
DPTR LSB is toggled after a MOVX or MOVC instruction. This instruction can be
useful for moving 8-bit blocks to/from 16-bit devices.
0
0
1
1
0
1
0
1
3, 2
DP0m1,
DP0m0
0
Main data pointer mode. These bits enable extra modes of the main data pointer operation, allowing
more compact and more efficient code size and execution.
DP0m1
DP0m0
Result (Behavior of the Main Data Pointer)
8052 behavior.
DPTR is postincremented after a MOVX or a MOVC instruction.
DPTR is postdecremented after a MOVX or MOVC instruction.
DPTR LSB is toggled after a MOVX or MOVC instruction. This instruction is useful
for moving 8-bit blocks to/from 16-bit devices.
0
0
1
1
0
1
0
1
1
0
0
0
Not implemented. Write don’t care.
DPSEL
Data pointer select. Cleared by the user to select the main data pointer, meaning that the contents of
this 16-bit register are placed into the DPL SFR and DPH SFR. Set by the user to select the shadow data
pointer, meaning that the contents of a separate 16-bit register appear in the DPL SRF and DPH SFR.
Rev. PrB | Page 84 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
INTERRUPT SYSTEM
The unique power management architecture of the ADE5166/
ADE5169/ADE5566/ADE5569 includes an operating mode
(PSM2) where the 8052 MCU core is shut down. Events can
be configured to wake the 8052 MCU core from the PSM2
operating mode. A distinction is drawn here between events
that can trigger the wake-up of the 8052 MCU core and events
that can trigger an interrupt when the MCU core is active.
Events that can wake the core are referred to as wake-up events,
whereas events that can interrupt the program flow when the
MCU is active are called interrupts. See the 3.3 V Peripherals
and Wake-Up Events section to learn more about events that
can wake the 8052 core from PSM2.
occur at the same time, the Priority 1 interrupt is serviced first.
An interrupt cannot be interrupted by another interrupt of the
same priority level. If two interrupts of the same priority level
occur simultaneously, a polling sequence is observed (see the
Interrupt Priority section).
INTERRUPT ARCHITECTURE
The ADE5166/ADE5169/ADE5566/ADE5569 possess advanced
power supply management features. To ensure a fast response to
time-critical power supply issues, such as a loss of line power,
the power supply management interrupt should be able to inter-
rupt any interrupt service routine. To enable the user to have
full use of the standard 8052 interrupt priority levels, an additional
priority level is added for the power supply management (PSM)
interrupt. The PSM interrupt is the only interrupt at this highest
interrupt priority level.
The ADE5166/ADE5169/ADE5566/ADE5569 provide 12 inter-
rupt sources with three priority levels. The power management
interrupt is at the highest priority level. The other two priority
levels are configurable through the interrupt priority SFR (IP,
0xB8) and interrupt enable and Priority 2 SFR (IEIP2, 0xA9).
HIGH
PSM
PRIORITY 1
STANDARD 8052 INTERRUPT ARCHITECTURE
PRIORITY 0
LOW
The 8052 standard interrupt architecture includes two tiers of
interrupts, where some interrupts are assigned a high priority
and others are assigned a low priority.
Figure 66. Interrupt Architecture
See the Power Supply Management Interrupt (PSM) section for
more information on the PSM interrupt.
HIGH
PRIORITY 1
PRIORITY 0
LOW
INTERRUPT REGISTERS
The control and configuration of the interrupt system is carried
out through four interrupt-related SFRs, discussed in this section.
Figure 65. Standard 8052 Interrupt Priority Levels
A Priority 1 interrupt can interrupt the service routine of a
Priority 0 interrupt, and if two interrupts of different priorities
Table 70. Interrupt SFRs
SFR
Address Default
Bit Addressable
Description
IE
IP
0xA8
0xB8
0xA9
0x00
0x00
0xA0
0x10
Yes
Yes
No
Yes
Interrupt enable (see Table 71).
Interrupt priority (see Table 72).
Interrupt enable and Priority 2 (see Table 73).
Watchdog timer (see Table 78 and the Writing to the Watchdog Timer SFR
(WDCON, 0xC0) section).
IEIP2
WDCON 0xC0
Table 71. Interrupt Enable SFR (IE, 0xA8)
Bit
Address Mnemonic Description
7
6
5
4
3
2
0xAF
0xAE
0xAD
0xAC
0xAB
0xAA
0xA9
0xA8
EA
Enables all interrupt sources. Set by the user. Cleared by the user to disable all interrupt sources.
Enables the temperature ADC interrupt. Set by the user.
Enables the Timer 2 interrupt. Set by the user.
Enables the UART serial port interrupt. Set by the user.
Enables the Timer 1 interrupt. Set by the user.
Enables the External Interrupt 1 (INT1). Set by the user.
Enables the Timer 0 interrupt. Set by the user.
Enables External Interrupt 0 (INT0). Set by the user.
ETEMP
ET2
ES
ET1
EX1
ET0
EX0
1
0
Rev. PrB | Page 85 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Table 72. Interrupt Priority SFR (IP, 0xB8)
Bit
Address
Mnemonic
PADE
PTEMP
PT2
PS
PT1
Description
7
6
5
4
3
2
0xBF
0xBE
ADE energy measurement interrupt priority (1 = high, 0 = low).
Temperature ADC interrupt priority (1 = high, 0 = low).
Timer 2 interrupt priority (1 = high, 0 = low).
UART serial port interrupt priority (1 = high, 0 = low).
Timer 1 interrupt priority (1 = high, 0 = low).
0xBD
0xBC
0xBB
0xBA
0xB9
PX1
INT1 (External Interrupt 1) priority (1 = high, 0 = low).
Timer 0 interrupt priority (1 = high, 0 = low).
1
PT0
0
0xB8
PX0
INT0 (External Interrupt 0) priority (1 = high, 0 = low).
Table 73. Interrupt Enable and Priority 2 SFR (IEIP2, 0xA9)
Bit
Mnemonic
Description
7
6
PS2
PTI
UART2 serial port interrupt priority (1 = high, 0 = low).
RTC interrupt priority (1 = high, 0 = low).
5
4
ES2
PSI
Enables the UART2 serial port interrupt. Set by the user.
SPI/I2C interrupt priority (1 = high, 0 = low).
3
2
1
0
EADE
ETI
EPSM
ESI
Enables the energy metering interrupt (ADE). Set by the user.
Enables the RTC interval timer interrupt. Set by the user.
Enables the PSM power supply management interrupt. Set by the user.
Enables the SPI/I2C interrupt. Set by the user.
INTERRUPT PRIORITY
If two interrupts of the same priority level occur simultaneously, the polling sequence is observed (as shown in Table 74).
Table 74. Priority Within Interrupt Level
Source
IPSM
IRTC
IADE
WDT
Priority
Description
0 (Highest)
1
2
3
4
5
Power supply management interrupt.
RTC interval timer interrupt.
ADE energy measurement interrupt.
Watchdog timer overflow interrupt.
Temperature ADC interrupt.
External Interrupt 0.
ITEMP
IE0
TF0
IE1
6
7
Timer/Counter 0 interrupt.
External Interrupt 1.
TF1
ISPI/I2CI
RI/TI
TF2/EXF2
RI2/TI2
8
9
10
11
Timer/Counter 1 interrupt.
SPI/I2C interrupt.
UART Serial Port interrupt.
Timer/Counter 2 interrupt.
UART2 serial port interrupt
12 (Lowest)
Rev. PrB | Page 86 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
INTERRUPT FLAGS
The interrupt flags and status flags associated with the interrupt vectors are shown in Table 75 and Table 76, respectively. Most of the
interrupts have flags associated with them.
Table 75. Interrupt Flags
Interrupt Source
Flag
Bit Name
IE0
TF0
IE1
TF1
TI
RI
TI2
RI2
TF2
EXF2
N/A
FPSM
Description
IE0
TF0
IE1
TF1
RI + TI
TCON.1
TCON.5
TCON.3
TCON.7
SCON.1
SCON.0
SCON2.1
SCON2.0
T2CON.7
T2CON.6
N/A
External Interrupt 0.
Timer 0.
External Interrupt 1.
Timer 1.
Transmit interrupt.
Receive interrupt.
Transmit 2 interrupt
Receive 2 interrupt
Timer 2 overflow flag.
Timer 2 external flag.
Temperature ADC interrupt. Does not have an interrupt flag associated with it.
PSM interrupt flag.
RI2 + TI2
TF2 + EXF2
ITEMP (Temperature ADC)
IPSM (Power Supply)
IPSMF.6
IADE (Energy Measurement DSP) MIRQSTL.7 ADEIRQFLAG Read MIRQSTH, MIRQSTM, MIRQSTL.
Table 76. Status Flags
Interrupt Source
ITEMP (Temperature ADC)
ISPI/I2CI
Flag
Bit Address Description
N/A
N/A
Temperature ADC interrupt. Does not have a status flag associated with it.
SPI2CSTAT1
SPI2CSTAT
TIMECON.6
TIMECON.2
WDCON.2
N/A
SPI interrupt status register.
I2C interrupt status register.
RTC alarm flag.
N/A
IRTC (RTC Interval Timer)
ALFLAG
ITFLAG
WDS
RTC interrupt flag.
WDT (Watchdog Timer)
Watchdog timeout flag.
1 There is no specific flag for ISPI/I2CI; however, all flags for SPI2CSTAT need to be read to assess the reason for the interrupt.
A functional block diagram of the interrupt system is shown in
Figure 67. Note that the PSM interrupt is the only interrupt in
the highest priority level.
respective interrupt service routines are entered shortly
thereafter.
The RTC interrupts are driven by the alarm and interval flags.
Pending RTC interrupts can be cleared without entering the
interrupt service routine, by clearing the corresponding RTC
flag in software. Entering the interrupt service routine alone
does not clear the RTC interrupt.
If an external wake-up event occurs to wake the ADE5166/
ADE5169/ADE5566/ADE5569 from PSM2, a pending external
interrupt is generated. When the EX0 or EX1 bit in the interrupt
enable SFR (IE, 0xA8) is set to enable external interrupts, the
program counter is loaded with the IE0 or IE1 interrupt vector.
The IE0 and IE1 interrupt flags in the TCON register are not
affected by events that occur when the 8052 MCU core is shut
down during PSM2 (see the Power Supply Management
Interrupt (PSM) section).
The temperature ADC and I2C/SPI interrupts are latched such
that pending interrupts cannot be cleared without entering their
respective interrupt service routines. Clearing the I2C/SPI status
bits in the SPI interrupt status SFR (SPISTAT, 0xEA) does not
cancel a pending I2C/SPI interrupt. These interrupts remain
pending until the I2C/SPI interrupt vectors are enabled. Their
Figure 67 shows how the interrupts are cleared when the inter-
rupt service routines are entered. Some interrupts with multiple
interrupt sources are not automatically cleared; specifically, the
PSM, ADE, UART, UART2 and Timer 2 interrupt vectors. Note
INT0
INT1
that the
and
interrupts are only cleared if the external
interrupt is configured to be triggered by a falling edge by setting
IT0 in the Timer/Counter 0 and Timer/Counter 1 control SFR
INT0 INT1
(TCON, 0x88). If
or
is configured to interrupt on a
low level, the interrupt service routine is reentered until the
respective pin goes high.
Rev. PrB | Page 87 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
PRIORITY LEVEL
IE/IEIP2 REGISTERS
IP/IEIP2 REGISTERS
LOW
HIGH HIGHEST
IPSMF
IPSME
FPSM
(IPSMF.6)
PSM
MIDNIGHT
ALARM
RTC
MIRQSTH MIRQSTM MIRQSTL
MIRQENH MIRQENM MIRQENL
ADE
MIRQSTL.7
WATCHDOG TIMEOUT
WDIR
WATCHDOG
TEMP ADC
IN/OUT
LATCH
RESET
TEMPADC INTERRUPT
PSM2
IE0
IT0
0
INT0
EXTERNAL
INTERRUPT 0
1
IT0
TF0
INTERRUPT
TIMER 0
POLLING
SEQUENCE
PSM2
IE1
IT1
0
EXTERNAL
INTERRUPT 1
INT1
1
IT1
TF1
TIMER 1
CFG.5
SPI INTERRUPT
IN/OUT
LATCH
RESET
1
2
I C/SPI
2
I C INTERRUPT
0
RI
TI
UART
RI2
TI2
UART2
TF2
TIMER 2
EXF2
INDIVIDUAL
INTERRUPT
ENABLE
LEGEND
AUTOMATIC
CLEAR SIGNAL
GLOBAL
INTERRUPT
ENABLE (EA)
Figure 67. Interrupt System Functional Block Diagram
Rev. PrB | Page 88 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
INTERRUPT VECTORS
CONTEXT SAVING
When an interrupt occurs, the program counter is pushed onto the
stack, and the corresponding interrupt vector address is loaded
into the program counter. When the interrupt service routine is
complete, the program counter is popped off the stack by a RETI
instruction. This allows program execution to resume from where
it was interrupted. The interrupt vector addresses are shown in
Table 77.
When the 8052 vectors to an interrupt, only the program counter
is saved on the stack. Therefore, the interrupt service routine
must be written to ensure that registers used in the main program
are restored to their pre-interrupt state. Common registers that
can be modified in the ISR are the accumulator register and the
PSW register. Any general-purpose registers that are used as
scratch pads in the ISR should also be restored before exiting
the interrupt. The following example 8052 code shows how to
restore some commonly used registers:
Table 77. Interrupt Vector Addresses
Source
Vector Address
0x0003
0x000B
0x0013
0x001B
0x0023
0x002B
0x0033
0x003B
0x0043
0x004B
0x0053
0x005B
0x0063
GeneralISR:
IE0
TF0
IE1
TF1
; save the current Accumulator value
PUSH
ACC
; save the current status and register bank
selection
RI + TI
TF2 + EXF2
ITEMP (Temperature ADC)
ISPI/I2CI
IPSM (Power Supply)
IADE (Energy Measurement DSP)
IRTC (RTC Interval Timer)
WDT (Watchdog Timer)
RI2 + TI2
PUSH
PSW
; service interrupt
…
; restore the status and register bank
selection
POP
PSW
; restore the accumulator
INTERRUPT LATENCY
POP
ACC
The 8052 architecture requires that at least one instruction
execute between interrupts. To ensure this, the 8052 MCU
core hardware prevents the program counter from jumping to
an ISR immediately after completing a RETI instruction or an
access of the IP and IE registers.
RETI
The shortest interrupt latency is 3.25 instruction cycles, 800 ns
with a clock of 4.096 MHz. The longest interrupt latency for a
high priority interrupt results when a pending interrupt is
generated during a low priority interrupt RETI, followed by a
multiply instruction. This results in a maximum interrupt
latency of 16.25 instruction cycles, 4 μs with a clock of 4.096 MHz.
Rev. PrB | Page 89 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
WATCHDOG TIMER
The watchdog timer generates a device reset or interrupt within
a reasonable amount of time if the ADE5166/ADE5169/
ADE5566/ADE5569 enter an erroneous state, possibly due to a
programming error or electrical noise. The watchdog is enabled
by default with a timeout of two seconds and creates a system reset
if not cleared within two seconds. The watchdog function can be
disabled by clearing the watchdog enable bit (WDE) in the
watchdog timer SFR (WDCON, 0xC0).
The WDCON SFR can be written only by user software if the
double write sequence described in Table 78 is initiated on
every write access to the WDCON SFR.
To prevent any code from inadvertently disabling the watchdog, a
watchdog protection can be activated. This watchdog protection
locks in the watchdog enable and event settings so they cannot
be changed by user code. The protection is activated by clearing
a watchdog protection bit in the flash memory. The watchdog
protection bit is the most significant bit at Address 0x3FFA of
the flash memory. When this bit is cleared, the WDIR bit is forced
to 0, and the WDE bit is forced to 1. Note that the sequence for
configuring the flash protection bits must be followed to modify
the watchdog protection bit at Address 0x3FFA (see the Protecting
the Flash section).
The watchdog circuit generates a system reset or interrupt
(WDS) if the user program fails to set the WDE bit within a
predetermined amount of time (set by the PRE[3:0] bits).
The watchdog timer is clocked from the 32.768 kHz external
crystal connected between the XTAL1 and XTAL2 pins.
Table 78. Watchdog Timer SFR (WDCON, 0xC0)
Bit
Address
Mnemonic Default Description
7 to 4
0xC7 to
0xC4
PRE[3:0]
7
Watchdog prescaler. In normal mode, the 16-bit watchdog timer is clocked by the input
clock (32.768 kHz). The PREx bits set which of the upper bits of the counter are used as the
watchdog output as follows:
29
tWATCHDOG = 2PRE
×
XTAL1
PRE[3:0]
Result (Watchdog Timeout)
0000
15.6 ms
0001
31.2 ms
0010
62.5 ms
0011
125 ms
0100
250 ms
0101
500 ms
0110
1 sec
0111
2 sec
1000
1001
1010 to 1111
0 sec, automatic reset
0 sec, serial download reset
Not a valid selection
3
2
0xC3
0xC2
WDIR
WDS
0
0
Watchdog interrupt response bit. When cleared, the watchdog generates a system reset
when the watchdog timeout period has expired. When set, the watchdog generates an
interrupt when the watchdog timeout period has expired.
Watchdog status bit. This bit is set to indicate that a watchdog timeout has occurred. It is
cleared by writing a 0 or by an external hardware reset. A watchdog reset does not clear
WDS; therefore, it can be used to distinguish between a watchdog reset and a hardware
reset from the RESET pin.
1
0
0xC1
0xC0
WDE
1
0
Watchdog enable bit. When set, this bit enables the watchdog and clears its counter. The
watchdog counter is subsequently cleared again whenever WDE is set. If the watchdog is
not cleared within its selected timeout period, it generates a system reset or watchdog
interrupt, depending on the WDIR bit.
WDWR
Watchdog write enable bit (see the Writing to the Watchdog Timer SFR (WDCON, 0xC0)
section).
Rev. PrB | Page 90 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 79. Watchdog and Flash Protection Byte in Flash (Flash Address = 0x3FFA)
Bit
Mnemonic
Default Description
7
WDPROT_PROTKY7
1
This bit holds the protection for the watchdog timer and the 7th bit of the flash protection key.
When this bit is cleared, the watchdog enable and event bits WDE and WDIR cannot be changed
by user code. The watchdog configuration is then fixed to WDIR = 0 and WDE = 1. The watchdog
timeout in PRE[3:0] can still be modified by user code.
The value of this bit is also used to set the flash protection key. If this bit is cleared to protect the
watchdog, then the default value for the flash protection key is 0x7F instead of 0xFF (see the
Protecting the Flash section for more information on how to clear this bit).
6 to 0
PROTKY[6:0]
0xFF
These bits hold the flash protection key. The content of this flash address is compared to the
flash protection key SFR (PROTKY, 0xBB) when the protection is being set or changed. If the two
values match, the new protection is written to the flash Address 0x3FFF to Address 0x3FFB. See
the Protecting the Flash section for more information on how to configure these bits.
Watchdog Timer Interrupt
Writing to the Watchdog Timer SFR (WDCON, 0xC0)
If the watchdog timer is not cleared within the watchdog timeout
period, a system reset occurs unless the watchdog timer interrupt
is enabled. The watchdog timer interrupt response bit (WDIR)
is located in the watchdog timer SFR (WDCON, 0xC0). Enabling
the WDIR bit allows the program to examine the stack or other
variables that may have led the program to execute inappropriate
code. The watchdog timer interrupt also allows the watchdog to
be used as a long interval timer.
Writing data to the WDCON SFR involves a double instruction
sequence. The WDWR bit must be set and the following instruc-
tion must be a write instruction to the WDCON SFR.
Disable Watch dog
CLR EA
SETB WDWR
CLR WDE
SETB EA
Note that WDIR is automatically configured as a high priority
interrupt. This interrupt cannot be disabled by the EA bit in the
IE register (see Table 71). Even if all of the other interrupts are
disabled, the watchdog is kept active to watch over the program.
This sequence is necessary to protect the WDCON SFR from
code execution upsets that may unintentionally modify this
SFR. Interrupts should be disabled during this operation due
to the consecutive instruction cycles.
Rev. PrB | Page 91 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
LCD DRIVER
Using shared pins, the LCD module is capable of directly driving
an LCD panel of 17 × 4 segments without compromising any
ADE5166/ADE5169/ADE5566/ADE5569 functions. It is capable
of driving LCDs with 2×, 3×, and 4× multiplexing. The LCD
waveform voltages generated through internal charge pump
circuitry support up to 5 V LCDs. An external resistor ladder
for LCD waveform voltage generation is also supported.
LCD REGISTERS
There are six LCD control registers that configure the driver for
the specific type of LCD in the end system and set up the user
display preferences. The LCD configuration SFR (LCDCON,
0x95), LCD Configuration X SFR (LCDCONX, 0x9C), and
LCD Configuration Y SFR (LCDCONY, 0xB1) contain general
LCD driver configuration information including the LCD enable
and reset, as well as the method of LCD voltage generation and
multiplex level. The LCD clock SFR (LCDCLK, 0x96) configures
timing settings for LCD frame rate and blink rate. LCD pins are
configured for LCD functionality in the LCD segment enable
SFR (LCDSEGE, 0x97) and the LCD Segment Enable 2 SFR
(LCDSEGE2, 0xED).
Each ADE5166/ADE5169/ADE5566/ADE5569 has an embedded
LCD control circuit, driver, and power supply circuit. The LCD
module is functional in all operating modes (see the Operating
Modes section) and can store up to four different screens in
memory for scrolling purposes.
Table 80. LCD Driver SFRs
SFR Address
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Mnemonic Description
0x95
0x96
0x97
0x9C
0xAC
0xAE
0xB1
0xED
LCDCON
LCDCLK
LCD configuration (see Table 81).
LCD clock (see Table 85).
LCDSEGE
LCDCONX
LCDPTR
LCD segment enable (see Table 88).
LCD Configuration X (see Table 82).
LCD pointer (see Table 89).
LCDDAT
LCD data (see Table 90).
LCDCONY
LCDSEGE2
LCD Configuration Y (see Table 84).
LCD Segment Enable 2 (see Table 91).
Table 81. LCD Configuration SFR (LCDCON, 0x95)
Bit
Mnemonic
Value
Description
7
LCDEN
0
0
0
LCD enable. If this bit is set, the LCD driver is enabled.
LCD data registers reset. If this bit is set, the LCD data registers are reset to zero.
6
LCDRST
5
BLINKEN
Blink mode enable bit. If this bit is set, blink mode is enabled. The blink mode is configured by the
BLKMOD[1:0] and BLKFREQ[1:0] bits in the LCD clock SFR (LCDCLK, 0x96).
4
LCDPSM2
0
Forces LCD off when in PSM2 (sleep mode). Note that the internal voltage reference must be enabled by
setting the REF_BAT_EN bit in the peripheral configuration SFR (PERIPH, 0xF4) to allow LCD operation
in PSM2.
LCDPSM2
Result
0
1
The LCD is disabled or enabled in PSM2 by the LCDEN bit.
The LCD is disabled in PSM2 regardless of LCDEN setting.
3
CLKSEL
BIAS
0
0
0
LCD clock selection.
CLKSEL
Result
0
fLCDCLK = 2048 Hz
fLCDCLK = 128 Hz
1
2
Bias mode.
BIAS
Result
1/2
0
1
1/3
1 to 0
LMUX[1:0]
LCD multiplex level.
LMUX[1:0] Result
00
01
10
11
Reserved.
2× Multiplexing. FP27/COM3 is used as FP27. FP28/COM2 is used as FP28.
3× Multiplexing. FP27/COM3 is used as FP27. FP28/COM2 is used as COM2.
4× Multiplexing. FP27/COM3 is used as COM3. FP28/COM2 is used as COM2.
Rev. PrB | Page 92 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 82. LCD Configuration X SFR (LCDCONX, 0x9C)
Bit
Mnemonic
Reserved
EXTRES
Default
Description
7
0
0
Reserved.
6
External resistor ladder selection bit.
EXTRES
Result
0
1
External resistor ladder is disabled. Charge pump is enabled.
External resistor ladder is enabled. Charge pump is disabled.
5 to 0
BIASLVL[5:0]
0
Bias level selection bits (see Table 83).
Table 83. LCD Bias Voltage When Contrast Control Is Enabled
1/2 Bias
VC
1/3 Bias
VC
BIASLVL[5]
VA (V)
VB
VB
0
VB = VA
VC = 2 × VA
VB = 2 × VA
VC = 3 × VA
BIASLVL 4:0
[ ]
VREF
×
31
1
VB = VA
VC = 2 × VA
VB = 2 × VA
VC = 3 × VA
BIASLVL 4:0
[ ]
⎛
⎝
⎞
⎟
⎠
VREF × 1+
⎜
31
Table 84. LCD Configuration Y SFR (LCDCONY, 0xB1)
Bit
Mnemonic
Default
Description
7
AUTOSCREENSCROLL
0
When set, the four screens scroll automatically. The scrolling item is selected by
the BLKFREQ bits in the LCD clock SFR (LCDCLK, 0x96). If both BLINKEN and this
bit are set, this bit preempt the blinking mode.
6
INV_LVL
0
Frame inversion mode enable bit. If this bit is set, frames are inverted every other
frame. If this bit is cleared, frames are not inverted.
5 to 4 Reserved
00
These bits should be kept cleared for proper operation.
3 to 2 SCREEN_SEL
These bits select the screen that is being output on the LCD pins. Values of 0, 1, 2,
and 3 select screen 0, 1, 2, and 3, respectively
1
0
UPDATEOVER
REFRESH
0
0
Update finished flag bit. This bit is updated by the LCD driver. When set, this bit
indicates that the LCD memory has been updated and a new frame has begun.
Refresh LCD data memory bit. This bit should be set by the user. When set, the
LCD driver does not use the data in the LCD data registers to update the display.
The LCD data registers can be updated by the 8052. When cleared, the LCD driver
uses the data in the LCD data registers to update display at the next frame.
Table 85. LCD Clock SFR (LCDCLK, 0x96)
Bit
Mnemonic
Default
Description
7 to 6 BLKMOD[1:0]
5 to 4 BLKFREQ[1:0]
3 to 0 FD[3:0]
0
Blink mode clock source configuration bits.
BLKMOD[1:0]
Result
00
01
10
11
The blink rate is controlled by software. The display is off.
The blink rate is controlled by software. The display is on.
The blink rate is 2 Hz.
The blink rate is set by BLKFREQ[1:0].
0
0
Blink rate configuration bits. These bits control the LCD blink rate if BLKMOD[1:0] = 11.
BLKFREQ[1:0]
Result (Blink Rate)
1 Hz
1/2 Hz
1/3 Hz
1/4 Hz
00
01
10
11
LCD frame rate selection bits (see Table 86 and Table 87).
Rev. PrB | Page 93 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Table 86. LCD Frame Rate Selection for fLCDCLK = 2048 Hz (LCDCON[3] = 0)
2× Multiplexing
3× Multiplexing
4× Multiplexing
FD3
0
0
FD2
0
0
FD1
0
1
FD0
1
0
fLCD (Hz)
256
170.7
128
Frame Rate (Hz)
fLCD (Hz)
341.3
341.3
256
Frame Rate (Hz)
170.71
113.81
85.3
fLCD (Hz)
512
341.3
256
Frame Rate (Hz)
1281
85.3
64
1281
85.3
64
0
0
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
1
0
1
102.4
85.3
73.1
64
51.2
42.7
36.6
32
204.8
170.7
146.3
128
68.3
56.9
48.8
42.7
204.8
170.7
146.3
128
51.2
42.7
36.6
32
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
56.9
51.2
46.5
42.7
39.4
36.6
34.1
32
28.5
25.6
23.25
21.35
19.7
18.3
17.05
16
113.8
102.4
93.1
85.3
78.8
73.1
68.3
64
37.9
34.1
31
28.4
26.3
24.4
22.8
21.3
113.8
102.4
93.1
85.3
78.8
73.1
68.3
64
28.5
25.6
23.25
21.35
19.7
18.3
17.05
16
0
0
0
0
16
8
32
10.7
32
8
1 Not within the range of typical LCD frame rates.
Table 87. LCD Frame Rate Selection for fLCDCLK = 128 Hz (LCDCON[3] = 1)
2× Multiplexing
3× Multiplexing
4× Multiplexing
FD3
0
0
FD2
0
0
FD1
0
1
FD0
1
0
fLCD (Hz)
32
21.3
16
Frame Rate (Hz)
fLCD (Hz)
32
32
Frame Rate (Hz)
10.7
10.7
fLCD (Hz)
32
32
Frame Rate (Hz)
161
10.6
8
8
8
8
0
0
1
1
32
10.7
32
0
1
0
0
16
8
32
10.7
32
8
0
1
0
1
16
8
32
10.7
32
8
0
1
1
0
16
8
32
10.7
32
8
0
1
1
1
16
8
32
10.7
32
8
1
0
0
0
16
8
32
10.7
32
8
1
0
0
1
16
8
32
10.7
32
8
1
0
1
0
16
8
32
10.7
32
8
1
0
1
1
16
8
32
10.7
32
8
1
1
0
0
16
8
32
10.7
32
8
1
1
0
1
16
8
32
10.7
32
8
1
1
1
0
16
8
32
10.7
32
8
1
0
1
0
1
0
1
0
128
64
64
32
128
64
42.7
21.3
128
64
32
16
1 Not within the range of typical LCD frame rates.
Table 88. LCD Segment Enable SFR (LCDSEGE, 0x97)
Bit
Mnemonic
FP25EN
FP24EN
FP23EN
FP22EN
FP21EN
FP20EN
Reserved
Default
Description
7
6
5
4
3
2
0
0
0
0
0
0
0
FP25 function select bit. 0 = general-purpose I/O, 1 = LCD function.
FP24 function select bit. 0 = general-purpose I/O, 1 = LCD function.
FP23 function select bit. 0 = general-purpose I/O, 1 = LCD function.
FP22 function select bit. 0 = general-purpose I/O, 1 = LCD function.
FP21 function select bit. 0 = general-purpose I/O, 1 = LCD function.
FP20 function select bit. 0 = general-purpose I/O, 1 = LCD function.
These bits should be left at 0 for proper operation.
1 to 0
Rev. PrB | Page 94 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 89. LCD Pointer SFR (LCDPTR, 0xAC)
Bit
Mnemonic
Default
Description
7
R/W
0
Read or write LCD bit. If this bit is set (1), the data in LCDDAT is written to the address indicated
by the LCDPTR[3:0] bits.
6
Reserved
RAM2SCREEN
ADDRESS
0
0
0
Reserved.
5 to 4
3 to 0
These bits select the screen recipient of the data memory action.
LCD memory address (see Table 92).
Table 90. LCD Data SFR (LCDDAT, 0xAE)
Bit
Mnemonic
Default
Description
7 to 0
LCDDATA
0
Data to be written into or read out of the LCD memory SFRs.
Table 91. LCD Segment Enable 2 SFR (LCDSEGE2, 0xED)
Bit
Mnemonic
Reserved
FP19EN
FP18EN
FP17EN
Default
Description
7 to 4
0
0
0
0
0
Reserved.
3
2
1
0
FP19 function select bit. 0 = general-purpose I/O, 1 = LCD function.
FP18 function select bit. 0 = general-purpose I/O, 1 = LCD function.
FP17 function select bit. 0 = general-purpose I/O, 1 = LCD function.
FP16 function select bit. 0 = general-purpose I/O, 1 = LCD function.
FP16EN
LCD SETUP
LCD TIMING AND WAVEFORMS
The LCD configuration SFR (LCDCON, 0x95) configures the
LCD module to drive the type of LCD in the user end system.
The BIAS and LMUX[1:0] bits in this SFR should be set according
to the LCD specifications.
An LCD segment acts like a capacitor that is charged and
discharged at a certain rate. This rate, the refresh rate, determines
the visual characteristics of the LCD. A slow refresh rate results
in the LCD blinking on and off between refreshes. A fast refresh
rate presents a screen that appears to be continuously lit. In
addition, a faster refresh rate consumes more power.
The COM2/FP28 and COM3/FP27 pins default to LCD segment
lines. Selecting the 3× multiplex level in the LCD configuration
SFR (LCDCON, 0x95) by setting LMUX[1:0] to 10 changes the
FP28 pin functionality to COM2. The 4× multiplex level selection,
LMUX[1:0] = 11, changes the FP28 pin functionality to COM2
and the FP27 pin functionality to COM3.
The frame rate, or refresh rate, for the LCD module is derived
from the LCD clock, fLCDCLK. The LCD clock is selected as 2048 Hz
or 128 Hz by the CLKSEL bit in the LCD configuration SFR
(LCDCON, 0x95). The minimum refresh rate needed for the
LCD to appear solid (without blinking) is independent of the
multiplex level.
The LCD segments, FP0 to FP15 and FP26, are enabled by
default. Additional pins are selected for LCD functionality in
the LCD segment enable SFR (LCDSEGE, 0x97) and LCD
Segment Enable 2 SFR (LCDSEGE2, 0xED) where there are
individual enable bits for the FP16 to FP25 segment pins. The
LCD pins do not have to be enabled sequentially. For example,
if the alternate function of FP23, the Timer 2 input, is required,
any of the other shared pins, FP16 to FP25, can be enabled
instead.
The LCD waveform frequency, fLCD, is the frequency at which
the LCD switches the active common line. Thus, the LCD
waveform frequency depends heavily on the multiplex level.
The frame rate and LCD waveform frequency are set by fLCDCLK
,
the multiplex level, and the FD[3:0] frame rate selection bits in
the LCD clock SFR (LCDCLK, 0x96).
The LCD module provides 16 different frame rates for fLCDCLK
2048 Hz, ranging from 8 Hz to 128 Hz for an LCD with 4×
multiplexing. Fewer options are available with fLCDCLK = 128 Hz,
ranging from 8 Hz to 32 Hz for a 4× multiplexed LCD. The
128 Hz clock is beneficial for battery operation because it
consumes less power than the 2048 Hz clock. The frame rate is
set by the FD[3:0] bits in the LCD clock SFR (LCDCLK, 0x96);
see Table 86 and Table 87.
=
The Display Element Control section contains details about
setting up the LCD data memory to turn individual LCD
segments on and off. Setting the LCDRST bit in the LCD
configuration SFR (LCDCON, 0x95) resets the LCD data
memory to its default (0). A power-on reset also clears the
LCD data memory.
The LCD waveform is inverted at twice the LCD waveform
frequency, fLCD. This way, each frame has an average dc offset
of zero. ADC offset degrades the lifetime and performance of
the LCD.
Rev. PrB | Page 95 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
and the MSBs store the state of the odd numbered segment
lines. For example, LCD Data Address 0 refers to segment Line
1 and Line 0 (see Table 92). Note that the LCD data memory is
maintained in the PSM2 operating mode.
BLINK MODE
Blink mode is enabled by setting the BLINKEN bit in the LCD
configuration SFR (LCDCON, 0x95). This mode is used to
alternate between the LCD on state and LCD off state so that
the LCD screen appears to blink. There are two blinking modes:
a software controlled blink mode and an automatic blink mode.
The LCD data memory is accessed indirectly through the LCD
pointer SFR (LCDPTR, 0xAC) and LCD data SFR (LCDDAT,
0xAE). Moving a value to the LCDPTR SFR selects the LCD
screen and data byte to be accessed and initiates a read or write
operation (see Table 89).
Software Controlled Blink Mode
The LCD blink rate can be controlled by user code with the
BLKMOD[1:0] bits in the LCD clock SFR (LCDCLK, 0x96) by
toggling the bits to turn the display on and off at a rate deter-
mined by the MCU code.
Writing to LCD Data Registers
To update the LCD data memory, first set the LSB of the LCD
Configuration Y SFR (LCDCONY, 0xB1) to freeze the data
being displayed on the LCD while updating it. This operation
ensures that the data displayed on the screen does not change
while the data is being changed. Then, move the data to the
LCD data SFR (LCDDAT, 0xAE) prior to accessing the LCD
pointer SFR (LCDPTR, 0xAC). The address of the LCD screen
should be consistent with the data changed. When the MSB of
the LCD pointer SFR (LCDPTR, 0xAC) is set, the content of the
LCD data SFR (LCDDAT, 0xAE) is transferred to the internal
LCD data memory designated by the address in the LCD pointer
SFR (LCDPTR, 0xAC) and the screen designator. Clear the LSB
of the LCD Configuration Y SFR (LCDCONY, 0xB1) when all
of the data memory has been updated to allow the use of the
new LCD setup for display.
Automatic Blink Mode
There are five blink rates. These blink rates are selected by the
BLKMOD[1:0] and BLKFREQ[1:0] bits in the LCD clock SFR
(LCDCLK, 0x96); see Table 85.
SCROLLING MODE
The ADE5166/ADE5169/ADE5566/ADE5569 provide the
possibility to have four screens in memory. The LCD driver can
use any of these screens by setting the SCREEN_SEL bits in the
LCD Configuration Y SFR (LCDCONY, 0xB1) and clearing the
refresh bit in the same register. The software scrolling of the
screens can then be achieved by a one-command instruction.
Automatic Scrolling Mode
The ADE5166/ADE5169/ADE5566/ADE5569 also provide
an automatic scrolling between the screens using the five
blink rates available. This mode is enabled by setting bit
AUTOSCREENSCROLL in the LCD Configuration Y SFR
(LCDCONY, 0xB1) and also the BLINKEN bit in the LCD
configuration SFR (LCDCON 0x95). To allow the scrolling
frequency to be selected, the BLKMOD[1:0] bits in the LCD
Clock register (LCDCLK, 0x96) should both be set to 1. The
scrolling rates are then selected by the BLKFREQ[1:0] bits
in the LCD Clock register (LCDCLK, 0x96); see Table 85.
Automatic scrolling mode is available in all operating modes.
Sample 8052 code to update the segments attached to Pin FP10
and Pin FP11 on Screen 1 is as follows:
ORL
MOV
MOV
ANL
LCDCONY,#01h ;start updating the data
LCDDAT,#FFh
LCDPTR,#80h OR 05h
LCDCONY,#0FEh;update finished
Reading LCD Data Registers
When the MSB of the LCD pointer SFR (LCDPTR, 0xAC) is
cleared, the content of the LCD data memory of the corresponding
screen designated by LCDPTR is transferred to the LCD data
SFR (LCDDAT, 0xAE).
DISPLAY ELEMENT CONTROL
Four banks of 15 bytes of data memory located in the LCD
module controls the on or off state of each segment of the LCD.
The LCD data memory is stored in Address 0 through Address
14 in the LCD module with two extra bits defining which one of
the four screen is being addressed.
Sample 8052 code to read the contents of LCD Data Memory
Address 0x07 on Screen 1, which holds the on and off state of
the segments attached to FP14 and FP15, is as follows.
MOV
MOV
LCDPTR,#07h
R1, LCDDAT
Each byte configures the on and off states of two segment lines.
The LSBs store the state of the even numbered segment lines
Rev. PrB | Page 96 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 92. LCD Data Memory Accessed Indirectly Through LCD Pointer SFR (LCDPTR, 0xAC) and LCD Data SFR (LCDDAT, 0xAE)1, 2
LCD Pointer SFR (LCDPTR, 0xAC) LCD Pointer SFR (LCDDAT, 0xAE)
LCD Memory Address
COM3
COM2
COM1
COM0
COM3
FP28
FP26
FP24
FP22
FP20
FP18
FP16
FP14
FP12
FP10
FP8
COM2
FP28
FP26
FP24
FP22
FP20
FP18
FP16
FP14
FP12
FP10
FP8
COM1
FP28
FP26
FP24
FP22
FP20
FP18
FP16
FP14
FP12
FP10
FP8
COM0
FP28
FP26
FP24
FP22
FP20
FP18
FP16
FP14
FP12
FP10
FP8
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x07
0x06
0x05
0x04
0x03
0x02
0x01
0x00
FP27
FP25
FP23
FP21
FP19
FP17
FP15
FP13
FP11
FP9
FP27
FP25
FP23
FP21
FP19
FP17
FP15
FP13
FP11
FP9
FP27
FP25
FP23
FP21
FP19
FP17
FP15
FP13
FP11
FP9
FP27
FP25
FP23
FP21
FP19
FP17
FP15
FP13
FP11
FP9
FP7
FP5
FP3
FP1
FP7
FP5
FP3
FP1
FP7
FP5
FP3
FP1
FP7
FP5
FP3
FP1
FP6
FP4
FP2
FP0
FP6
FP4
FP2
FP0
FP6
FP4
FP2
FP0
FP6
FP4
FP2
FP0
1 COMx designates the common lines.
2 FPx designates the segment lines.
ADE5569 temperature and supply voltage measurements (see
the Temperature, Battery, and Supply Voltage Measurements
section). This dynamic contrast control is not easily imple-
mented with external resistor ladder voltage generation.
VOLTAGE GENERATION
The ADE5166/ADE5169/ADE5566/ADE5569 provide two ways
to generate the LCD waveform voltage levels. The on-chip
charge pump option can generate 5 V. This makes it possible to
use 5 V LCDs with the 3.3 V ADE5166/ADE5169/ADE5566/
ADE5569. There is also an option to use an external resistor ladder
with a 3.3 V LCD. The EXTRES bit in the LCD Configuration X
SFR (LCDCONX, 0x9C) selects the resistor ladder or charge
pump option.
The LCD bias voltage sets the contrast of the display when the
charge pump provides the LCD waveform voltages. The ADE5166/
ADE5169/ADE5566/ADE5569 provide 64 bias levels selected by
the BIASLVL bits in the LCD Configuration X SFR (LCDCONX,
0x9C). The voltage level on LCDVA, LCDVB and LCDVC depend
on the internal voltage reference value (VREF), BIASLVL[5:0]
selection, and the biasing selected as described in Table 83.
When selecting how to generate the LCD waveform voltages,
the following should be considered:
Lifetime Performance
•
•
Lifetime performance power consumption
Contrast control
DC offset on a segment degrades its performance over time.
The voltages generated through the internal charge pump
switch faster than those generated by the external resistor
ladder, reducing the likelihood of a dc voltage being applied
to a segment and increasing the lifetime of the LCD.
Lifetime Performance Power Consumption
In most LCDs, a high amount of current is required when the LCD
waveforms change state. The external resistor ladder option draws a
constant amount of current, whereas the charge pump circuitry
allows dynamic current consumption. If the LCD module is used
with the internal charge pump option when the display is disabled,
the voltage generation is disabled, so that no power is consumed by
the LCD function. This feature results in significant power
savings if the display is turned off during battery operation.
LCD EXTERNAL CIRCUITRY
The voltage generation selection is made by Bit EXTRES in
the LCD Configuration X SFR (LCDCONX, 0x9C). This bit is
cleared by default for charge pump voltage generation, but can
be set to enable an external resistor ladder.
Charge Pump
Contrast Control
Voltage generation through the charge pump requires external
capacitors to store charge. The external connections to LCDVA,
LCDVB, and LCDVC, as well as LCDVP1 and LCDVP2, are
shown in Figure 68.
The electrical characteristics of the liquid in the LCD change
over temperature. This requires adjustments in the LCD waveform
voltages to ensure a readable display. An added benefit of the
internal charge pump voltage generation is a configurable bias
voltage that can be compensated over temperature and supply
to maintain contrast on the LCD. These compensations can be
performed based on the ADE5166/ADE5169/ADE5566/
Rev. PrB | Page 97 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
A 96-segment LCD with 4× multiplexing requires 96/4 = 24
segment lines. Sixteen pins, FP0 to FP15, are automatically
dedicated for use as LCD segments. Eight more pins must be
chosen for the LCD function. Because the LCD has 4× multi-
plexing, all four common lines are used. As a result, COM2/FP28
and COM3/FP27 cannot be used as segment lines. Based on the
alternate functions of the pins used for FP16 through FP25,
FP16 to FP23 are chosen for the eight remaining segment lines.
These pins are enabled for LCD functionality in the LCD
segment enable SFR (LCDSEGE, 0x97) and LCD Segment
Enable 2 SFR (LCDSEGE2, 0xED).
LCDVC
470nF
LCDVB
CHARGE PUMP
470nF
AND
LCDVA
LCD WAVEFORM
470nF
CIRCUITRY
LCDVP1
100nF
LCDVP2
Figure 68. External Circuitry for Charge Pump Option
External Resistor Ladder
To enable the external resistor ladder option, set the EXTRES
bit in the LCD Configuration X SFR (LCDCONX, 0x9C). When
EXTRES = 1, the LCD waveform voltages are supplied by the
external resistor ladder. Because the LCD voltages are not
generated on-chip, the LCD bias compensation implemented to
maintain contrast over temperature and supply is not possible.
To determine contrast setting for this 5 V LCD, Table 83 shows
the BIASLVL[5:0] setting that corresponds to a VC of 5 V in
1/3 bias mode. The maximum bias level setting for this LCD is
BIASLVL[5:0] = 101110.
The external circuitry needed for the resistor ladder option is
shown in Figure 69. The resistors required should be in the
range of 10 kΩ to 100 kΩ and based on the current required by
the LCD being used.
The LCD is set up with the following 8052 code:
; set up LCD pins to have LCD functionality
MOV
MOV
LCDSEG,#FP20EN+FP21EN+FP22EN+FP23EN
LCDSEGX,#FP16EN+FP17EN+FP18EN+FP19EN
LCDVC
LCDVB
LCD WAVEFORM
CIRCUITRY
LCDVA
LCDVP1
LCDVP2
; set up LCDCON for fLCDCLK=2048Hz, 1/3 bias
and 4x multiplexing
MOV
LCDCON,#BIAS+LMUX1+LMUX0
; set up LCDCONX for charge pump and
BIASLVL[110111]
Figure 69. External Circuitry for External Resistor Ladder Option
LCD FUNCTION IN PSM2
MOV
LCDCONX,#BIASLVL5+BIASLVL4+BIASLVL3+BI
ASLVL2+BIASLVL1+BIASLVL0
The LCDPSM2 and LCDEN bits in the LCD configuration SFR
(LCDCON, 0x95) control LCD functionality in the PSM2
operating mode (see Table 93).
; set up refresh rate for 64Hz with fLCDCLK
2048 Hz
=
Note that the internal voltage reference must be enabled by
setting the REF_BAT_EN bit in the peripheral configuration
SFR (PERIPH, 0xF4) to allow LCD operation in PSM2 (see
Table 19).
MOV
LCDCLK,#FD3+FD2+FD1+FD0
; set up LCD data registers with data to be
displayed using
; LCDPTR and LCDDATA registers
Table 93. Bits Controlling LCD Functionality in PSM2 Mode
; turn all segments on FP27 ON and FP26 OFF
LCDPSM2
LCDEN
Result
ORL
LCDCONY,#01h ; start data memory
0
0
1
0
1
X
The display is off in PSM2.
The display is on in PSM2.
The display is off in PSM2.
refresh
MOV
MOV
LCDDAT,#F0H
LCDPTR, #80h OR 0DH
In addition, note that the LCD configuration and data memory
is retained when the display is turned off.
ANL
refresh
LCDCONY,#0FEh; end of data memory
Example LCD Setup
ORL
LCDCON,#LCDEN ; enable LCD
An example of how to set up the LCD peripheral for a specific
LCD is described in this section with the following parameters:
To set up the same 3.3 V LCD for use with an external resistor
ladder,
; setup LCDCONX for external resistor ladder
•
•
•
Type of LCD: 5 V, 4× multiplexed with 1/3 bias, 96 segment
Voltage generation: internal charge pump
Refresh rate: 64 Hz
MOV
LCDCONX,#EXTRES
Rev. PrB | Page 98 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
FLASH MEMORY
Retention is the ability of the Flash memory to retain its
programmed data over time. Again, the parts have been qualified
in accordance with the formal JEDEC Retention Lifetime
Specification (A117) at a specific junction temperature (TJ =
55°C). As part of this qualification procedure, the flash memory
is cycled to its specified endurance limit described previously,
before data retention is characterized. This means that the flash
memory is guaranteed to retain its data for its full specified
retention lifetime every time the flash memory is reprogrammed.
It should also be noted that retention lifetime, based on an activa-
tion energy of 0.6 eV, derates with TJ, as shown in Figure 70.
300
FLASH MEMORY OVERVIEW
Flash memory is a type of nonvolatile memory that is in-circuit
programmable. The default, erased state of a byte of flash
memory is 0xFF. When a byte of flash memory is programmed,
the required bits change from one to zero. The flash memory
must be erased to turn the zeros back to ones. A byte of flash
memory cannot however be erased individually. The entire
segment, or page, of flash memory that contains the byte must
be erased.
The ADE5166/ADE5169/ADE5566/ADE5569 provide 62 bytes
of flash program/information memory. This memory is segmented
into 124 pages each containing 512 bytes. To reprogram one
byte of flash memory, the 511 bytes in that page must be erased.
The flash memory can be erased by page or all at once in a mass
erase. There is a command to verify that a flash write operation
has completed successfully. The ADE5166/ADE5169/ADE5566/
ADE5569 flash memory controller also offers configurable flash
memory protection.
250
ANALOG DEVICES
200
SPECIFICATION
100 YEARS MIN.
AT T = 55°C
J
150
100
50
The 62 bytes of flash memory are provided on-chip to facilitate
code execution without any external discrete ROM device
requirements. The program memory can be programmed in-
circuit, using the serial download mode provided or using
conventional third party memory programmers.
0
40
50
60
70
80
90
100
110
T
JUNCTION TEMPERATURE (°C)
J
Flash/EE Memory Reliability
Figure 70. Flash/EE Memory Data Retention
The flash memory arrays on the ADE5166/ADE5169/ADE5566/
ADE5569 are fully qualified for two key Flash/EE memory
characteristics: Flash/EE memory cycling endurance and
Flash/EE memory data retention.
FLASH MEMORY ORGANIZATION
The ADE5166/ADE5169/ADE5566/ADE5569 contain a 64 kB
array of Flash/EE program memory. The upper 2 kB contain
permanently embedded firmware, allowing in-circuit serial
download, serial debug and nonintrusive single-pin emulation.
The 2 kB of embedded firmware also contains essential
coefficients that provide calibration to peripherals such as the
ADCs and reference. The embedded firmware contained in the
upper 2 kB of Flash/EE memory is not accessible by the user.
Endurance quantifies the ability of the Flash/EE memory to be
cycled through many program, read, and erase cycles. In real
terms, a single endurance cycle is composed of four independent,
sequential events:
1. Initial page erase sequence
2. Read/verify sequence
3. Byte program sequence
EMBEDDED DOWNLOAD/DEBUG KERNEL
PERMANENTLY EMBEDDED FIRMWARE ALLOWS
0×FFFF
2kB
0×F800
CODE TO BE DOWNLOADED TO ANY OF THE
62 kB OF ON-CHIP PROGRAM MEMORY.
THE KERNEL PROGRAM APPEARS AS NOP
INSTRUCTIONS TO USER CODE.
4. Second read/verify sequence
In reliability qualification, every byte in both the program and
data Flash/EE memory is cycled from 0x00 to 0xFF until a first
fail is recorded, signifying the endurance limit of the on-chip
Flash/EE memory.
USER PROGRAM MEMORY
62 kB OF FLASH/EE PROGRAM MEMORY
ARE AVAILABLE TO THE USER. ALL OF THIS
SPACE CAN BE PROGRAMMED FROM THE
PERMANENTLY EMBEDDED DOWNLOAD/DEBUG
KERNEL OR IN PARALLEL PROGRAMMING MODE.
0×F7FF
62kB
0×0000
As indicated in Table 4, the ADE5166/ADE5169/ADE5566/
ADE5569 flash memory endurance qualification has been
carried out in accordance with JEDEC Standard Method A117
over the industrial temperature range of –40°C, +25°C, and
+85°C. The results allow the specification of a minimum endur-
ance figure over supply and temperature of 100,000 cycles, with a
minimum endurance figure of 20,000 cycles of operation at 25°C.
Figure 71. Flash Memory Organization
Rev. PrB | Page 99 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
The lower 62 bytes are available to the user for program storage
or as nonvolatile data memory. They are segmented into 124 pages
of 512 bytes each. It is up to the user to decide which flash
memory is to be used for data memory. It is recommended that
each page be dedicated solely to program or data memory so
that an instance does not arise where the program counter is
loaded with data memory instead of an opcode from the
program memory or where program memory is erased to
update a byte of data memory.
USING THE FLASH MEMORY
The 62 bytes of Flash memory are configured as 124 pages, each
of 512 bytes. As with the other ADE5166/ADE5169/ADE5566/
ADE5569 peripherals, the interface to this memory space is via
a group of registers mapped in the SFR space. A data register,
EDATA, holds the byte of data to be accessed. The byte of flash
memory is addressed via the EADRH and EADRL registers.
Table 94. Flash SFRs
Bit
The flash memory can be protected from read or write/erase
access. The protection is implemented in the upper page of user
program memory. The last sixteen bytes from this page are used
to configure the write/erase protection for each of the pages.
The remaining four bytes are used for configuring read
protection of the flash memory. The read protection is selected
in groups of four pages. Finally, there is a byte used to store the
key required for modifying the protection scheme. If any code
protection is required, the page of information memory must be
write/erase protected at a minimum.
SFR
Address Default Addressable Description
ECON
FLSHKY 0xBA
PROTKY 0xBB
0xB9
0x00
0xFF
0xFF
No
No
No
Flash control
Flash key
Flash
protection key
Flash data
Flash low
address
Flash high
address
EDATA
EADRL
0xBC
0xC6
0x00
0x00
No
No
EADRH
0xC7
0x00
No
Thus it is recommended that if code protection is enabled, the
last page of user accessible flash memory should only be used to
store data that does not need modification in the field. If the
firmware requires protection and may need updating in the
future, the last page should be reserved for constants used by
the user code that does not require modification during
emulation or debug.
ECON is an 8-bit control register that can be written to with one
of five Flash memory access commands to trigger various read,
write, erase, and verify functions. Figure 72 demonstrates the
steps required for access to the flash memory.
ECON
COMMAND
ADDRESS ADDRESS PROTECTION
DECODER DECODER
ACCESS
ALLOWED?
TRUE: ACCESS
ALLOWED
EADRH EADRL
ECON = 0
Page 0 through Page 122 are therefore available for general
program and data memory use. It is recommended that Page 123
be used for constants or code that do not require future modifica-
tions. Note that the last 20 bytes of page 123 are reserved for the
flash memory protection and are therefore unavailable to the user.
FLASH
PROTECTION KEY
FLSHKY
FALSE: ACCESS
DENIED
ECON = 1
FLSHKY = 0x3B?
Figure 72. Flash Memory Read/Write/Erase Protection Block Diagram
Rev. PrB | Page 100 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
0xDFFF
0xBFFF
0x9FFF
PAGE 111
PAGE 110
PAGE 109
PAGE 108
PAGE 107
PAGE 106
PAGE 105
PAGE 104
PAGE 103
PAGE 102
PAGE 101
PAGE 100
PAGE 99
PAGE 98
PAGE 97
PAGE 96
PAGE 79
PAGE 78
PAGE 77
PAGE 76
PAGE 75
PAGE 74
PAGE 73
PAGE 72
PAGE 71
PAGE 70
PAGE 69
PAGE 68
PAGE 67
PAGE 66
PAGE 65
PAGE 64
PAGE 95
PAGE 94
PAGE 93
PAGE 92
PAGE 91
PAGE 90
PAGE 89
PAGE 88
PAGE 87
PAGE 86
PAGE 85
PAGE 84
PAGE 83
PAGE 82
PAGE 81
PAGE 80
0xDE00
0xDDFF
0xBE00
0xBDFF
0x9E00
0x9DFF
READ
READ
READ
PROTECT
BIT 19
0xDC00
0xDBFF
0xBC00
0xBBFF
0x9C00
0x9BFF
PROTECT
BIT 27
PROTECT
BIT 23
0xDA00
0xD9FF
0xBA00
0xB9FF
0x9A00
0x99FF
0xD800
0xB800
0xB7FF
0x9800
0x97FF
0xF7FF
0xD7FF
PAGE 123
0xF600
0xF5FF
0xD600
0xD5FF
0xB600
0xB5FF
0x9600
0x95FF
PAGE 122
PAGE 121
PAGE 120
PAGE 119
PAGE 118
PAGE 117
PAGE 116
PAGE 115
PAGE 114
PAGE 113
PAGE 112
READ
READ
PROTECT
BIT 26
READ
PROTECT
BIT 22
READ
PROTECT
BIT 18
0xF400
0xF3FF
0xD400
0xD3FF
0xB400
0xB3FF
0x9400
0x93FF
PROTECT
BIT 30
0xF200
0xF1FF
0xD200
0xD1FF
0xB200
0xB1FF
0x9200
0x91FF
0xF000
0xEFFF
0xD000
0xCFFF
0xB000
0xAFFF
0x9000
0x8FFF
0xEE00
0xEDFF
0xCE00
0xCDFF
0xAE00
0xADFF
0x8E00
0x8DFF
READ
PROTECT
BIT 29
READ
PROTECT
BIT 25
READ
PROTECT
BIT 21
READ
PROTECT
BIT 17
0xEC00
0xEBFF
0xCC00
0xCBFF
0xAC00
0xABFF
0x8C00
0x8BFF
0xEA00
0xE9FF
0xCA00
0xC9FF
0xAA00
0xA9FF
0x8A00
0x89FF
0xE800
0xE7FF
0xC800
0xC7FF
0xA800
0xA7FF
0x8800
0x87FF
0xE600
0xE5FF
0xC600
0xC5FF
0xA600
0xA5FF
0x8600
0x85FF
READ
PROTECT
BIT 28
READ
PROTECT
BIT 24
READ
PROTECT
BIT 20
READ
PROTECT
BIT 16
0xE400
0xE3FF
0xC400
0xC3FF
0xA400
0xA3FF
0x8400
0x83FF
0xE200
0xE1FF
0xC200
0xC1FF
0xA200
0xA1FF
0x8200
0x81FF
0xE000
0xC000
0xA000
0x8000
0x7FFF
0x5FFF
0x3FFF
0x1FFF
PAGE 47
PAGE 46
PAGE 45
PAGE 44
PAGE 43
PAGE 42
PAGE 41
PAGE 40
PAGE 39
PAGE 38
PAGE 37
PAGE 36
PAGE 35
PAGE 34
PAGE 33
PAGE 32
PAGE 15
PAGE 14
PAGE 13
PAGE 12
PAGE 11
PAGE 10
PAGE 9
PAGE 8
PAGE 7
PAGE 6
PAGE 5
PAGE 4
PAGE 3
PAGE 2
PAGE 1
PAGE 0
PAGE 63
PAGE 62
PAGE 61
PAGE 60
PAGE 59
PAGE 58
PAGE 57
PAGE 56
PAGE 55
PAGE 54
PAGE 53
PAGE 52
PAGE 51
PAGE 50
PAGE 49
PAGE 48
PAGE 31
PAGE 30
PAGE 29
PAGE 28
PAGE 27
PAGE 26
PAGE 25
PAGE 24
PAGE 23
PAGE 22
PAGE 21
PAGE 20
PAGE 19
PAGE 18
PAGE 17
PAGE 16
0x7E00
0x7DFF
0x5E00
0x5DFF
0x3E00
0x3DFF
0x1E00
0x1DFF
READ
READ
READ
READ
PROTECT
BIT 3
0x7C00
0x7BFF
0x5C00
0x5BFF
0x3C00
0x3BFF
0x1C00
0x1BFF
PROTECT
BIT 15
PROTECT
BIT 11
PROTECT
BIT 7
0x7A00
0x79FF
0x5A00
0x59FF
0x3A00
0x39FF
0x1A00
0x19FF
0x7800
0x77FF
0x5800
0x57FF
0x3800
0x37FF
0x1800
0x17FF
0x7600
0x75FF
0x5600
0x55FF
0x3600
0x35FF
0x1600
0x15FF
READ
PROTECT
BIT 14
READ
PROTECT
BIT 10
READ
PROTECT
BIT 6
READ
PROTECT
BIT 2
0x7400
0x73FF
0x5400
0x53FF
0x3400
0x33FF
0x1400
0x13FF
0x7200
0x71FF
0x5200
0x51FF
0x3200
0x31FF
0x1200
0x11FF
0x7000
0x6FFF
0x5000
0x4FFF
0x3000
0x2FFF
0x1000
0x0FFF
0x6E00
0x6DFF
0x4E00
0x4DFF
0x2E00
0x2DFF
0x0E00
0x0DFF
READ
PROTECT
BIT 13
READ
PROTECT
BIT 9
READ
PROTECT
BIT 5
READ
PROTECT
BIT 1
0x6C00
0x6BFF
0x4C00
0x4BFF
0x2C00
0x2BFF
0x0C00
0x0BFF
0x6A00
0x69FF
0x4A00
0x49FF
0x2A00
0x29FF
0x0A00
0x09FF
0x6800
0x67FF
0x4800
0x47FF
0x2800
0x27FF
0x0800
0x07FF
0x6600
0x65FF
0x4600
0x45FF
0x2600
0x25FF
0x0600
0x05FF
READ
PROTECT
BIT 12
READ
PROTECT
BIT 8
READ
PROTECT
BIT 4
READ
PROTECT
BIT 0
0x6400
0x63FF
0x4400
0x43FF
0x2400
0x23FF
0x0400
0x03FF
0x6200
0x61FF
0x4200
0x41FF
0x2200
0x21FF
0x0200
0x01FF
0x6000
0x4000
0x2000
0x0000
CONTAINS PROTECTION SETTINGS
Figure 73. Flash Memory Organization
Rev. PrB | Page 101 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
ECON—Flash/EE Memory Control SFR
The program counter, PC, is held on the instruction where the
ECON register is written to until the flash memory controller is
done performing the requested operation. Then the PC incre-
ments to continue with the next instruction. Any interrupts
requests that occur while the flash controller is performing an
operation are not handled until the flash operation is complete.
All peripherals, such as timers and counters, will continue to
operate as configured throughout the flash memory access.
Programming flash memory is done through the flash memory
control flash control SFR (ECON, 0xB9). This SFR allows the
user to read, write, erase, or verify the 62 kB of flash memory.
As a method of security, a key must be written to the FLSHKY
register to initiate any user access to the flash memory. Upon
completion of the flash memory operation, the FLSHKY
register is reset such that it must be written prior to another
flash memory operation. Requiring the key to be set before an
access to the flash memory decreases the likelihood of user code
or data being overwritten by a program that has run amuck.
Table 95. Flash Control SFR (ECON, 0xB9)
Bit
Mnemonic Default Value Description
7 to 0
ECON
0
1
Write byte. The value in EDATA is written to the Flash memory, at the page address given by
EADRH and EARDL. Note that the byte being addressed must be pre-erased.
2
Erase page. A 512-byte page of Flash memory address is erased. The page is selected by the
address in EADRH/L. Any address in the page can be written to EADRH/EADRL to select it for
erasure.
3
Erase all. All 62 kB of the available Flash memory are erased. Note that this command is used
during serial mode and parallel download mode but should not be executed by user code.
4
5
6
7
8
Read byte. The byte in the Flash memory, addressed by EADRH/L, is read into EDATA.
Reserved.
Reserved.
Reserved.
Protect code (see the Protecting the Flash Memory section).
Table 96. Flash Key SFR (FLSHKY, 0xBA)
Bit
Mnemonic
Default
Description
7 to 0
FLSHKY
0xFF
The content of this SFR is compared to the Flash key, 0x3B. If the two values match the next ECON
operation is allowed (see the Protecting the Flash Memory section).
Table 97. Flash Protection Key SFR (PROTKY, 0xBB)
Bit
Mnemonic
Default
Description
7 to 0
PROTKY
0xFF
The content of this SFR is compared to the flash memory location at Address 0xF7EA. If the two
values match, the update of the write/erase and read protection set up is allowed (see the Protecting
the Flash Memory section).
If the protection key in the flash is 0xFF, the PROTKY SFR value is not used for comparison.
The PROTKY SFR is also used to write the protection key in the flash. This is done by writing the
desired value in PROTKY and writing 0x08 in the ECON SFR. This operation can only be done once.
Table 98. Flash Data SFR (EDATA, 0xBC)
Bit
Mnemonic
Default
Description
7 to 0
EDATA
0
Flash pointer data.
Table 99. Flash Low Byte Address SFR (EADRL, 0xC6)
Bit
Mnemonic
Default
Description
7 to 0
EADRL
0
Flash pointer low byte address.
Table 100. Flash High Byte Address SFR (EADRH, 0xC7)
Bit
Mnemonic
Default
Description
7 to 0
EADRH
0
Flash pointer high byte address.
Rev. PrB | Page 102 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Address 0xF7FF (see Figure 74). 16 bytes are reserved for
write/erase protection, 4 bytes for read protection and another
byte to set the protection security key. The user must enable
write/erase protection for the last page at a minimum for the
entire protection scheme to work.
Flash Functions
The following sample 8051 code is provided below to
demonstrate how to use the Flash functions. For these
examples, the byte of flash memory, 0x3C00 is accessed.
Write Byte
Note that the read protection does not prevent MOVC
commands from being executed within the code.
Write 0xF3 into Flash Memory Byte 0x3C00.
MOV EDATA, #F3h
MOV EADRH, #3Ch
MOV EADRL, #00h
; Data to be written
; Set up byte address
There is an additional layer of protection offered by a protection
security key. The user can setup a protection security key so
that the protection scheme cannot be changed without this key.
Once the protection key has been configured, it may not be
modified.
MOV FLSHKY, #3Bh
key.
; Write Flash security
; Write Byte
MOV ECON, #01H
Enabling Flash Protection by Code
The protection bytes in the Flash can be programmed using
Flash controller command and programming ECON to 0x08.
Issuing the ECON protection command initiates the program-
ming of 1 byte of protection data. The EADRL and EDATA data
pointers are used to store the least significant address and data
bytes, respectively. Note that the EADRH data pointer is not
used in this command.
Erase Page
Erase the page containing flash memory byte 0x3C00.
MOV EADRH, #3Ch
byte address
; Select page through
MOV EADRL, #00h
MOV FLSHKY, #3Bh
key.
; Write Flash security
; Erase Page
The following sequence should be followed to enable the flash
protection:
MOV ECON, #02H
Erase All
1. Set the EDATA data pointer with the write/erase or read
protection data. When erased, the protection bits default to
1, like any other bit of flash memory. The default
protection setting is for no protection. To enable
protection, write a 0 to the bits corresponding to the pages
that should be protected. Note that when setting the read
protection that each protection bit protects four pages.
2. Set the EADRL data pointer with the least significant byte
of the protection address. For example, to access the
protection on the Page 112 through Page 119 (Address
0xF7FE), EADRL should be written to 0xFE.
Erase all of the 62 kB flash memory.
MOV FLSHKY, #3Bh
key.
; Write Flash security
MOV ECON, #03H
; Erase All
Read Byte
Read Flash Memory Byte 0x3C00.
MOV EADRH, #3Ch
MOV EADRL, #00h
; Setup byte address
MOV FLSHKY, #3Bh
key.
; Write Flash security
; Read Byte
3. Enable access to the flash by writing 3Bh to the FLSHKY
register.
MOV ECON, #04H
4. Issue the protection command by writing 08H to the
ECON register.
; Data is ready in EDATA register
Note that the read byte command can be used to view the status
of the protection bytes located in the upper 21 bytes, Page 123.
The write byte command is not valid for this area.
Step 1 to Step 3 should be repeated for each byte that requires
protection. While configuring the final byte of write/read
protection, the PROTKY can be enabled for a further level of
code security. If enabled, the protection key is required to
modify the protection scheme. To enable the protection key, the
flash location 0xF7EB where the PROTKY is located should be
written to using the ECON protection command (0x8). The
PROTKY can be written to any 8-bit value, but once configured,
it cannot be modified. To enable the PROTKY and activate the
flash protection, the part has to be reset.
PROTECTING THE FLASH MEMORY
Two forms of protection are offered for this flash memory: read
protection and write/erase protection. The read protection
ensures that any pages that are read protected cannot be read by
the end user. The write protection ensures that the flash
memory cannot be erased or written over. This protects the end
system from tampering and can prevent the code from being
overwritten in the event of a runaway program.
Note that once the PROTKY has been activated by a reset any
further changes to the protection require the new 8-bit protection
key to be written to the PROTKY SFR prior to issuing the ECON
command. The PROTKY SFR is cleared automatically when the
ECON 0x8 command is issued and, therefore, the user must
Write/erase protection is individually selectable for all 124
pages. Read protection is selected in groups of four pages (see
Figure 73 for the groupings). The protection bits are stored in
the last flash memory locations, Address 0xF7EB through
Rev. PrB | Page 103 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
;enable write/erase protection on last page
(this is required for any protection to be
activated)
ensure that the correct value is written to the PROTKY SFR
each time the protection scheme is changed.
The two most significant bits of 0xF7FF are used to enable the
lock mechanisms for the watchdog and stack boundary settings
(see the Watchdog Timer section and the Stack Boundary
Protection section for more information).
MOV EDATA, #0F7H
MOV EADRL, #0FFH
MOV FLSHKY, #3BH
; clear bit WP123
; write address to F7FFh
; enable flash access
;issue protection
MOV ECON, #08H
command
The following code provides an example of how the write/erase
protection can be enabled on the first page and the PROTKY set
to 0xA3. Note that to active the following protection, the part
requires a reset.
;set up PROTKY to A3h
MOV EDATA, #0A3H
MOV EADRL, #0EBH
MOV FLSHKY, #3BH
; set PROTKY to A3h
; write address to F7EBh
; enable flash access
; issue protection
; enable write/erase protection on the first
page only
MOV EDATA, #0FEH
MOV EADRL, #0F0H
MOV FLSHKY, #3BH
; clear bit WP 0
MOV ECON, #08H
command
; write address to F7F0h
; enable flash access
;issue protection
Note that once PROTKY is changed to 0xA3, as shown in the
preceding example code, all future modifications of the
protection scheme require the PROTKY SFR to be set to 0xA3
prior to issuing the ECON protection command.
MOV ECON, #08H
command
0xF7FF
WDOG STCON
WP
123
WP
122
WP
121
WP
120
LOCK
LOCK
WP
119
WP
118
WP
117
WP
116
WP
115
WP
114
WP
113
WP
112
WP
111
WP
110
WP
109
WP
108
WP
107
WP
106
WP
105
WP
104
WP
15
WP
14
WP
13
WP
12
WP
11
WP
10
WP
9
WP
8
WP
7
WP
6
WP
5
WP
4
WP
3
WP
2
WP
1
WP
0
RP
RP
RP
RP
RP
RP
RP
0xF7EF
120 TO 123 116 TO 119 112 TO 115108 TO 111 104 TO 107 100 TO 103 96 TO 99
RP
RP RP RP
RP RP RP RP
92 TO 95 88 TO 91 84 TO 87 80 TO 83 76 TO 79 72 TO 75 68 TO 71 64 TO 67
RP
RP
RP
RP
RP
RP
RP
RP
60 TO 63 56 TO 59 52 TO 55 48 TO 51 44 TO 47 40 TO 43 36 TO 39 32 TO 35
RP
RP
RP
RP
RP
RP
RP
RP
28 TO 31 24 TO 27 20 TO 23 16 TO 19 12 TO 15 8 TO 11 4 TO 7
0 TO 3
PROTECTION KEY
0xF7EB
PROTKY
0xF600
Figure 74. Flash Protection in Page124
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Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Flash Memory Timing
Enabling Flash Protection by Emulator Commands
Typical program and erase times for the flash memory are
shown in Table 101.
Another way to set the Flash protection bytes is to use the reserved
emulator commands available only in download mode. These
commands write directly to the SFRs and can be used to duplicate
the operation mentioned in the Enabling Flash Protection by
Code section. Once these Flash bytes are written, the part can
exit emulation mode by reset and the protections will be effective.
This method can be used in production and implemented after
downloading the program. The commands used for this opera-
tion are an extension of the commands listed in Application
Note uC004, Understanding the Serial Download Protocol,
available at www.analog.com.
Table 101. Flash Memory Program and Erase Times
Command
Write Byte
Erase Page
Erase All
Bytes Affected
Flash Memory Timing
1 byte
512 bytes
62 kB
30 us
20 ms
2.5 sec
100 ns
Read Byte
1 bytes
Note that the core microcontroller operation is idled until the
requested flash memory operation is complete. In practice, this
means that even though the Flash operation is typically initiated
with a two-machine-cycle MOV instruction (to write to the
flash control SFR (ECON, 0xB9), the next instruction is not
executed until the Flash/EE operation is complete. This means
that the core cannot respond to interrupt requests until the
Flash/EE operation is complete, although the core peripheral
functions such as counter/timers continue to count as
configured throughout this period.
•
•
Command with ASCII code I or 0x49 write the data into R0.
Command with ASCII code F or 0x46 write R0 into the
SFR address defined in the data of this command.
Omitting the protocol defined in uC004, the sequence to load
protections is similar to the sequence mentioned in the Enabling
Flash Protection by Code section, except that two emulator
commands are necessary to replace one assembly command.
For example, to write the protection value in EADRH, the two
following commands need to be executed:
IN CIRCUIT PROGRAMMING
Serial Downloading
•
•
Command I with Data = value of Protection Byte 0x3FFF
Command F with Data = 0xC7
The ADE5166/ADE5169/ADE5566/ADE5569 facilitate code
download via the standard UART serial port. The parts enter
SDEN
serial download mode after a reset or a power cycle if the
Following this protocol, the protection can be written to the
Flash using the same sequence as mentioned in the Enabling
Flash Protection by Code paragraph. When the part is reset the
protection will be effective.
pin is pulled low through an external 1 kΩ resistor. Once in
serial download mode, the hidden embedded download kernel
executes. This allows the user to download code to the full 62 kB
of flash memory while the device is in circuit in its target
application hardware.
Notes on Flash Protection
The flash protection scheme is disabled by default so that none
of the pages of the flash are protected from reading or writing/
erasing.
Protection configured in the last page of the ADE5166/ADE5169/
ADE5566/ADE5569 affects whether flash memory can be
accessed in serial download mode. Read protected pages cannot
be read. Write/erase protected pages cannot be written or
erased. The configuration bits cannot be programmed in serial
download mode.
The last page must be write-/erase-protected for the protection
scheme to work.
To activate the protection settings, the ADE5166/ADE5169/
ADE5566/ADE5569 must be reset after configuring the
protection.
After configuring protection on the last page and resetting the
part, protections that have been enabled can only be removed
by mass erasing the flash memory. The protection bits are never
truly write protected. Protection bits can be programmed
modified from a 1 to a 0, even after the last page has been
protected. In this way, more protection can be added but none
can be removed.
When the last page is read protected, the protection bits can still
be read by the user code. All other bits on this page are not
available for reading.
The protection scheme is intended to protect the end system.
Protection should be disabled while developing and emulating
code.
Rev. PrB | Page 105 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
TIMERS
Each ADE5166/ADE5169/ADE5566/ADE5569 has three 16-bit
timer/counters: Timer/Counter 0, Timer/Counter 1, and Timer/
Counter 2. The timer/counter hardware is included on-chip to
relieve the processor core of overhead inherent in implementing
timer/counter functionality in software. Each timer/counter
consists of two 8-bit registers: THx and TLx (x = 0, 1, or 2). All
three timers can be configured to operate as timers or as event
counters.
When functioning as a counter, the TLx register is incremented
by a 1-to-0 transition at its corresponding external input pin:
T0, T1, or T2. When the samples show a high in one cycle and a
low in the next cycle, the count is incremented. Because it takes
two machine cycles (two core clock periods) to recognize a 1-to-0
transition, the maximum count rate is half the core clock frequency.
There are no restrictions on the duty cycle of the external input
signal, but to ensure that a given level is sampled at least once
before it changes, it must be held for a minimum of one full
machine cycle. User configuration and control of all timer
operating modes is achieved via the SFRs in Table 102.
When functioning as a timer, the TLx register is incremented
every machine cycle. Thus, users can think of it as counting
machine cycles. Because a machine cycle on a single cycle core
consists of one core clock period, the maximum count rate is
the core clock frequency.
Table 102. Timer SFRs
SFR
Address
Bit Addressable
Description
TCON
TMOD
TL0
TL1
TH0
0x88
0x89
Yes
No
No
No
No
No
Yes
No
No
No
No
Timer/Counter 0 and Timer/Counter 1 control (see Table 104).
Timer/Counter 0 and Timer/Counter 1 mode (see Table 103).
Timer 0 low byte (see Table 107).
Timer 1 low byte (see Table 109).
Timer 0 high byte (see Table 106).
0x8A
0x8B
0x8C
0x8D
0xC8
0xCA
0xCB
0xCC
0xCD
TH1
Timer 1 high byte (see Table 108).
T2CON
RCAP2L
RCAP2H
TL2
Timer/Counter 2 control (see Table 105).
Timer 2 reload/capture low byte (see Table 113).
Timer 2 reload/capture high byte (see Table 112).
Timer 2 low byte (Table 111).
TH2
Timer 2 high byte (see Table 110).
TIMER REGISTERS
Table 103. Timer/Counter 0 and Timer/Counter 1 Mode SFR (TMOD, 0x89)
Bit
Mnemonic Default Description
7
Gate1
C/T1
0
Timer 1 gating control. Set by software to enable Timer/Counter 1 only when the INT1 pin is high and the
TR1 control bit is set. Cleared by software to enable Timer 1 whenever the TR1 control bit is set.
6
0
Timer 1 timer or counter select bit. Set by software to select counter operation (input from T1 pin). Cleared
by software to select the timer operation (input from internal system clock).
5 to 4 T1/M1,
T1/M0
00
Timer 1 mode select bits.
T1/M[1:0] Result
00
01
10
11
TH1 operates as an 8-bit timer/counter. TL1 serves as a 5-bit prescaler.
16-Bit Timer/Counter. TH1 and TL1 are cascaded; there is no prescaler.
8-Bit Autoreload Timer/Counter. TH1 holds a value to reload into TL1 each time it overflows.
Timer/Counter 1 Stopped.
3
2
Gate0
C/T0
0
Timer 0 gating control. Set by software to enable Timer/Counter 0 only when the INT0 pin is high and the TR0
control bit is set. Cleared by software to enable Timer 0 whenever the TR0 control bit is set.
0
Timer 0 timer or counter select bit. Set by software to the select counter operation (input from T0 pin).
Cleared by software to the select timer operation (input from internal system clock).
1 to 0 T0/M1,
T0/M0
00
Timer 0 mode select bits.
T0/M[1:0] Result
00
01
10
11
TH0 operates as an 8-bit timer/counter. TL0 serves as a 5-bit prescaler.
16-Bit Timer/Counter. TH0 and TL0 are cascaded; there is no prescaler.
8-Bit Autoreload Timer/Counter. TH0 holds a value to reload into TL0 each time it overflows.
TL0 is an 8-bit timer/counter controlled by the standard Timer 0 control bits. TH0 is an
8-bit timer only, controlled by Timer 1 control bits.
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Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 104. Timer/Counter 0 and Timer/Counter 1 Control SFR (TCON, 0x88)
Bit Address Mnemonic Default Description
7
6
5
4
3
0x8F
0x8E
0x8D
0x8C
0x8B
TF1
TR1
TF0
TR0
IE11
0
0
0
0
0
Timer 1 overflow flag. Set by hardware on a Timer/Counter 1 overflow. Cleared by hardware
when the program counter (PC) vectors to the interrupt service routine.
Timer 1 run control bit. Set by the user to turn on Timer/Counter 1. Cleared by the user to turn off
Timer/Counter 1.
Timer 0 overflow flag. Set by hardware on a Timer/Counter 0 overflow. Cleared by hardware
when the PC vectors to the interrupt service routine.
Timer 0 run control bit. Set by the user to turn on Timer/Counter 0. Cleared by the user to turn off
Timer/Counter 0.
External Interrupt 1 (INT1) flag. Set by hardware by a falling edge or by a zero level applied to the
external interrupt pin, INT1, depending on the state of Bit IT1. Cleared by hardware when the PC
vectors to the interrupt service routine only if the interrupt was transition activated. If level activated,
the external requesting source controls the request flag rather than the on-chip hardware.
2
1
0x8A
0x89
IT11
IE01
0
0
External Interrupt 1 (IE1) trigger type. Set by software to specify edge sensitive detection, that is, 1-
to-0 transition. Cleared by software to specify level sensitive detection, that is, zero level.
External Interrupt 0 (INT0) flag. Set by hardware by a falling edge or by a zero level being applied
to the external interrupt pin, INT0, depending on the state of Bit IT0. Cleared by hardware when
the PC vectors to the interrupt service routine only if the interrupt was transition activated. If
level activated, the external requesting source controls the request flag rather than the on-chip
hardware.
0
0x88
IT01
0
External Interrupt 0 (IE0) trigger type. Set by software to specify edge sensitive detection, that is,
1-to-0 transition. Cleared by software to specify level sensitive detection, that is, zero level.
1
INT0
INT1
interrupt pins.
These bits are not used to control Timer/Counter 0 and Timer/Counter 1 but are instead used to control and monitor the external
and
Table 105. Timer/Counter 2 Control SFR (T2CON, 0xC8)
Bit Address Mnemonic Default Description
7
6
5
0xCF
0xCE
0xCD
TF2
0
0
0
Timer 2 overflow flag. Set by hardware on a Timer 2 overflow. TF2 cannot be set when either
RCLK = 1 or TCLK = 1. Cleared by user software.
Timer 2 external flag. Set by hardware when either a capture or reload is caused by a negative
transition on the T2EX pin and EXEN2 = 1. Cleared by user software.
Receive clock enable bit. Set by the user to enable the serial port to use Timer 2 overflow pulses
for its receive clock in Serial Port Mode 1 and Serial Port Mode 3. Cleared by the user to enable
Timer 1 overflow to be used for the receive clock.
EXF2
RCLK
4
3
0xCC
0xCB
TCLK
0
0
Transmit clock enable bit. Set by the user to enable the serial port to use Timer 2 overflow pulses
for its transmit clock in Serial Port Mode 1 and Serial Port Mode 3. Cleared by the user to enable
Timer 1 overflow to be used for the transmit clock.
Timer 2 external enable flag. Set by the user to enable a capture or reload to occur as a result of a
negative transition on T2EX if Timer 2 is not being used to clock the serial port. Cleared by the
user for Timer 2 to ignore events at T2EX.
EXEN2
2
1
0xCA
0xC9
TR2
C/T2
0
0
Timer 2 start/stop control bit. Set by the user to start Timer 2. Cleared by the user to stop Timer 2.
Timer 2 timer or counter function select bit. Set by the user to select the counter function (input
from the external T2 pin). Cleared by the user to select the timer function (input from on-chip
core clock).
0
0xC8
CAP2
0
Timer 2 capture/reload select bit. Set by the user to enable captures on negative transitions at
T2EX if EXEN2 = 1. Cleared by the user to enable autoreloads with Timer 2 overflows or negative
transitions at T2EX when EXEN2 = 1. When either RCLK = 1 or TCLK = 1, this bit is ignored and the
timer is forced to autoreload on Timer 2 overflow.
Rev. PrB | Page 107 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Mode 0 (13-Bit Timer/Counter)
Table 106. Timer 0 High Byte SFR (TH0, 0x8C)
Mode 0 configures an 8-bit timer/counter. Figure 75 shows
Mode 0 operation. Note that the divide-by-12 prescaler is not
present on the single cycle core.
Bit
Mnemonic
Default
Description
7 to 0
TH0
0
Timer 0 Data High Byte.
Table 107. Timer 0 Low Byte SFR (TL0, 0x8A)
Bit
fCORE
Mnemonic
Default
Description
C/T0 = 0
7 to 0
TL0
0
Timer 0 Data Low Byte.
INTERRUPT
TL0
TH0
TF0
(5 BITS) (8 BITS)
Table 108. Timer 1 High Byte SFR (TH1, 0x8D)
C/T0 = 1
P0.6/T0
Bit
Mnemonic
Default
Description
CONTROL
7 to 0
TH1
0
Timer 1 Data High Byte.
TR0
Table 109. Timer 1 Low Byte SFR (TL1, 0x8B)
GATE
INT0
Bit
Mnemonic
Default
Description
7 to 0
TL1
0
Timer 1 Data Low Byte.
Figure 75. Timer/Counter 0, Mode 0
Table 110. Timer 2 High Byte SFR (TH2, 0xCD)
In this mode, the timer register is configured as a 13-bit register.
As the count rolls over from all 1s to all 0s, it sets the timer
overflow flag, TF0. TF0 can then be used to request an interrupt.
The counted input is enabled to the timer when TR0 = 1 and either
Bit
Mnemonic
Default
Description
7 to 0
TH2
0
Timer 2 Data High Byte.
Table 111. Timer 2 Low Byte SFR (TL2, 0xCC)
INT0
Gate0 = 0 or
= 1. Setting Gate0 = 1 allows the timer to be
INT0
Bit
Mnemonic
Default
Description
controlled by the external input
to facilitate pulse width
7 to 0
TL2
0
Timer 2 Data Low Byte.
measurements. TR0 is a control bit in the Timer/Counter 0 and
Timer/Counter 1 control SFR (TCON, 0x88); the Gate0/Gate1
bits are in Timer/Counter 0 and Timer/Counter 1 mode SFR
(TMOD, 0x89). The 13-bit register consists of all eight bits of
Timer 0 high byte SFR (TH0, 0x8C) and the lower five bits of
Timer 0 low byte SFR (TL0, 0x8A). The upper three bits of TL0
SFR are indeterminate and should be ignored. Setting the run
flag (TR0) does not clear the registers.
Table 112. Timer 2 Reload/Capture High Byte SFR
(RCAP2H, 0xCB)
Bit
Mnemonic Default
Description
7 to 0
TH2
0
Timer 2 Reload/
Capture High Byte.
Table 113. Timer 2 Reload/Capture Low Byte SFR
(RCAP2L, 0xCA)
Mode 1 (16-Bit Timer/Counter)
Bit
Mnemonic Default
Description
Mode 1 is the same as Mode 0 except that the Mode 1 timer
register runs with all 16 bits. Mode 1 is shown in Figure 76.
7 to 0
TL2
0
Timer 2 Reload/
Capture Low Byte.
fCORE
TIMER 0 AND TIMER 1
C/T0 = 0
Timer/Counter 0 and Timer/Counter 1 Data Registers
INTERRUPT
TL0
TH0
TF0
(8 BITS) (8 BITS)
Each timer consists of two 8-bit registers. They are Timer 0 high
byte SFR (TH0, 0x8C), Timer 0 low byte SFR (TL0, 0x8A), Timer 1
high byte SFR (TH1, 0x8D), and Timer 1 low byte SFR (TL1,
0x8B) These can be used as independent registers or combined
into a single 16-bit register, depending on the timer mode
configuration (see Table 106 to Table 109).
C/T0 = 1
P0.6/T0
CONTROL
TR0
GATE
INT0
Timer/Counter 0 and Timer/Counter 1 Operating Modes
Figure 76. Timer/Counter 0, Mode 1
This section describes the operating modes for Timer/Counter 0
and Timer/Counter 1. Unless otherwise noted, these modes of
operation are the same for both Timer 0 and Timer 1.
Rev. PrB | Page 108 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Mode 2 (8-Bit Timer/Counter with Autoreload)
TIMER 2
Timer/Counter 2 Data Registers
Mode 2 configures the timer register as an 8-bit counter (TL0)
with automatic reload as shown in Figure 77. Overflow from TL0
not only sets TF0 but also reloads TL0 with the contents of TH0,
which is preset by software. The reload leaves TH0 unchanged.
Timer/Counter 2 also has two pairs of 8-bit data registers
associated with it: Timer 2 high byte SFR (TH2, 0xCD), Timer 2
low byte SFR (TL2, 0xCC), Timer 2 reload/capture high byte
SFR (RCAP2H, 0xCB), and Timer 2 reload/capture low byte
SFR (RCAP2L, 0xCA). These are used as both timer data
registers and as timer capture/reload registers (see Table 110
to Table 113).
fCORE
C/T0 = 0
INTERRUPT
TL0
TF0
(8 BITS)
C/T0 = 1
Timer/Counter 2 Operating Modes
P0.6/T0
CONTROL
The following sections describe the operating modes for
Timer/Counter 2. The operating modes are selected by bits in
the Timer/Counter 2 control SFR (T2CON, 0xC8), as shown in
Table 105 and Table 114.
TRO
RELOAD
TH0
GATE
INT0
(8 BITS)
Figure 77. Timer/Counter 0, Mode 2
Table 114. T2CON Operating Modes
RCLK or TCLK
CAP2
TR2
Mode
Mode 3 (Two 8-Bit Timer/Counters)
0
0
1
X
0
1
X
X
1
1
1
0
16-bit autoreload
16-bit capture
Baud rate
Off
Mode 3 has different effects on Timer 0 and Timer 1. Timer 1 in
Mode 3 simply holds its count. The effect is the same as setting
TR1 = 0. Timer 0 in Mode 3 establishes TL0 and TH0 as two
separate counters. This configuration is shown in Figure 78.
16-Bit Autoreload Mode
T0
TL0 uses the Timer 0 control bits, C/ , Gate0 (see Table 103),
INT0
TR0, TF0 (see Table 104), and
. TH0 is locked into a timer
Autoreload mode has two options that are selected by Bit EXEN2
in Timer/Counter 2 control SFR (T2CON, 0xC8). If EXEN2 = 0
when Timer 2 rolls over, it not only sets TF2 but also causes the
Timer 2 registers to be reloaded with the 16-bit value in both the
Timer 2 reload/capture high byte SFR (RCAP2H, 0xCB) and
Timer 2 reload/capture low byte SFR (RCAP2L, 0xCA)
registers, which are preset by software. If EXEN2 = 1, Timer 2
performs the same events as when EXEN2 = 0 but adds a 1-to-0
transition at the external input T2EX, which triggers the 16-bit
reload and sets EXF2. Autoreload mode is shown in Figure 79.
function (counting machine cycles) and takes over the use of
TR1 and TF1 from Timer 1. Therefore, TH0 controls the Timer 1
interrupt. Mode 3 is provided for applications requiring an
extra 8-bit timer or counter.
When Timer 0 is in Mode 3, Timer 1 can be turned on and off
by switching it out of and into its own Mode 3, or it can be used
by the serial interface as a baud rate generator. In fact, Timer1
can be used in any application not requiring an interrupt from
Timer 1 itself.
CORE
CLK/12
16-Bit Capture Mode
fCORE
Capture mode has two options that are selected by Bit EXEN2
in Timer/Counter 2 control SFR (T2CON, 0xC8). If EXEN2 = 0,
Timer 2 is a 16-bit timer or counter that, upon overflowing, sets
Bit TF2, the Timer 2 overflow bit, which can be used to generate
an interrupt. If EXEN2 = 1, Timer 2 performs the same events
as when EXEN2 = 0 but adds a l-to-0 transition on the external
input T2E, which causes the current value in the Timer 2 registers,
TL2 and TH2, to be captured into the RCAP2L and RCAP2H
registers, respectively. In addition, the transition at T2EX causes
Bit EXF2 in T2CON to be set, and EXF2, like TF2, can generate
an interrupt. Capture mode is shown in Figure 80. The baud
rate generator mode is selected by RCLK = 1 and/or TCLK = 1.
C/T0 = 0
INTERRUPT
TL0
TF0
(8 BITS)
C/T0 = 1
P0.6/T0
CONTROL
TR0
GATE
INT0
INTERRUPT
TH0
fCORE/12
TF1
(8 BITS)
In either case, if Timer 2 is used to generate the baud rate, the TF2
interrupt flag does not occur. Therefore, Timer 2 interrupts do not
occur and do not have to be disabled. In this mode, the EXF2 flag
can, however, still cause interrupts that can be used as a third
external interrupt. Baud rate generation is described as part of the
UART serial port operation in the UART Serial Interface section.
TR1
Figure 78. Timer/Counter 0, Mode 3
Rev. PrB | Page 109 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
fCORE
C/T2 = 0
TL2
(8 BITS)
TH2
(8 BITS)
C/T2 = 1
P1.4/T2
CONTROL
TR2
RELOAD
TRANSITION
DETECTOR
RCAP2L
RCAP2H
TF2
TIMER
INTERRUPT
P1.3/
T2EX
EXF2
CONTROL
EXEN2
Figure 79. Timer/Counter 2, 16-Bit Autoreload Mode
fCORE
C/T2 = 0
C/T2 = 1
TL2
(8 BITS)
TH2
(8 BITS)
TF2
P1.4/T2
CONTROL
TR2
TIMER
INTERRUPT
CAPTURE
TRANSITION
DETECTOR
RCAP2L
RCAP2H
P1.3/
T2EX
EXF2
CONTROL
EXEN2
Figure 80. Timer/Counter 2, 16-Bit Capture Mode
Rev. PrB | Page 110 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
PLL
The ADE5166/ADE5169/ADE5566/ADE5569 are intended
for use with a 32.768 kHz watch crystal. A PLL locks onto a
multiple of this frequency to provide a stable 4.096 MHz clock
for the system. The core can operate at this frequency or at
binary submultiples of it to allow power savings when maximum
core performance is not required. The default core clock is the
PLL clock divided by 4, or 1.024 MHz. The ADE energy measure-
ment clock is derived from the PLL clock and is maintained at
4.096 MHz/5 MHz (or 819.2 kHz) across all CD settings.
The PLL is controlled by the CD[2:0] bits in the power control
SFR (POWCON, 0xC5). To protect erroneous changes to the
POWCON SFR, a key is required to modify the register. First,
the key SFR (KYREG, 0xC1) is written with the key, 0xA7, and
then a new value is written to the POWCON SFR.
If the PLL loses lock, the MCU is reset and the PLL_FLT bit is
set in the peripheral configuration SFR (PERIPH, 0xF4). Set the
PLL_FTL_ACK bit in the start ADC measurement SFR
(ADCGO, 0xD8) to acknowledge the PLL fault, clearing the
PLL_FLT bit.
PLL REGISTERS
Table 115. Power Control SFR (POWCON, 0xC5)
Bit
Mnemonic Default Description
7
Reserved
1
0
Reserved.
6
METER_OFF
Set this bit to turn off the modulators and energy metering DSP circuitry to reduce power if metering
functions are not needed in PSM0.
5
Reserved
COREOFF
Reserved
CD[2:0]
0
0
This bit should be kept at 0 for proper operation.
Set this bit to shut down the core if in the PSM1 operating mode.
Reserved.
4
3
2 to 0
010
Controls the core clock frequency (fCORE). fCORE = 4.096 MHz/2CD.
CD[2:0]
000
Result (fCORE in MHz)
4.096
2.048
1.024
0.512
0.256
0.128
0.064
0.032
001
010
011
100
101
110
111
Writing to the Power Control SFR (POWCON, 0xC5)
Note that writing data to the POWCON SFR involves writing 0xA7 into the key SFR (KYREG, 0xC1), followed by a write to the
POWCON SFR.
Table 116. Key SFR (KYREG, 0xC1)
Bit
Mnemonic Default Description
7 to 0
KYREG
0
Write 0xA7 to the KYREG SFR before writing to the POWCON SFR to unlock it.
Write 0xEA to the KYREG SFR before writing to the INTPR, HTHSEC, SEC, MIN, or HOUR timekeeping
registers to unlock it.
Table 117. Start ADC Measurement SFR (ADCGO, 0xD8)
Bit
Address
Mnemonic
Default
Description
7
0xDF
PLL_FTL_ACK
0
Set this bit to clear the PLL fault bit, PLL_FLT in the PERIPH register. A PLL
fault is generated if a reset was caused because the PLL lost lock.
6 to 3
2
0xDE to 0xDB
0xDA
Reserved
VDCIN_ADC_GO
0
0
Reserved.
Set this bit to initiate an external voltage measurement. This bit is cleared
when the measurement request is received by the ADC.
1
0
0xD9
0xD8
TEMP_ADC_GO
BATT_ADC_GO
0
0
Set this bit to initiate a temperature measurement. This bit is cleared
when the measurement request is received by the ADC.
Set this bit to initiate a battery measurement. This bit is cleared when the
measurement request is received by the ADC.
Rev. PrB | Page 111 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
RTC—REAL-TIME CLOCK
MOV
CALL
…
RTCKey, #0EAh
UpdateRTC
The ADE5166/ADE5169/ADE5566/ADE5569 have an embed-
ded real-time clock (RTC); see Figure 81. The external 32.768
kHz crystal is used as the clock source for the RTC. Calibration
is provided to compensate the nominal crystal frequency and
for variations in the external crystal frequency over temperature.
By default, the RTC is active in all the power saving modes.
The RTC counters retain their values through watchdog resets
and external resets and are only reset during a power on reset.
UpdateRTC:
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
RET
KYREG, RTCKey
RTCDAT, #30
RTCPTR, #82h
KYREG, RTCKey
RTCDAT, #05
RTCPTR, #83h
KYREG, RTCKey
RTCDAT, #04
RTCPTR, #84h
RTCKey, #00h
The ADE5166/ADE5169/ADE5566/ADE5569 provide two
ways to access the RTC data: direct access through SFRs for
configuration and indirect access through address and data SFR
registers for the timekeeping registers and some other configura-
tion. The address and data registers act as pointers to the RTC
internal registers.
ACCESS TO RTC SFR
Access to the RTC SFRs is achieved by reading or writing to the
SFR addresses detailed in the Access to Internal RTC Registers
section. Writing to the indirect registers is protected by a key,
as explained in the following section, while reading is not
protected.
Reading Internal Energy Measurement Registers
When Bit 7 of the RTCPTR SFR is cleared, the content of the
internal RTC data register designated by the address in
RTCPTR is transferred to the RTCDAT SFR. The RTC cannot
be stopped to read the current time because stopping the RTC
would introduce an error in its timekeeping. Therefore, the
RTC is read on-the-fly and the counter registers must be
checked for overflow. This can be accomplished through the
following 8052 assembly code:
ACCESS TO INTERNAL RTC REGISTERS
Access to the internal RTC measurement registers is achieved
by writing to the RTC pointer address SFR (RTCPTR, 0xA3).
The RTCPTR register selects the RTC register to be accessed
and determines if a read or a write is performed (see Table 121).
Writing to Internal RTC registers
ReadAgain:
The RTC circuitry runs off a 32.768 kHz clock. The timekeeping
registers, HTHSEC, SEC, MIN, HOUR, DAY, DATE, MONTH,
and YEAR are updated with a 32.768 kHz clock. However, the
TIMECON, TIMECON2 and INTVAL registers are updated
with a 128Hz clock. It takes up to two 128 Hz clock cycles from
when the MCU writes the TIMECON, TIMECON2, or
MOV
0
RTCPTR #01
; Read HTHSEC using Bank
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
R0, RTCDAT
RTCPTR, #02 ; Read SEC
R1, RTCDAT
RTCPTR, #03 ; Read MIN
R2, RTCDAT
INTVAL register until it is successfully updated in the RTC.
When Bit 7 of RTCPTR SFR is set, the content of the RTCDAT
SFR is transferred to the internal RTC register designated by the
address in the RTCPTR SFR. To protect the RTC timekeeping
registers from runaway code, a key must be written to the
KYREG register to obtain write access to any of the RTC
indirect registers. The KYREG should be set to 0xEA to unlock
the timekeeping registers and is reset to zero after a timekeeping
register is written. The RTC registers can be written using the
following 8052 assembly code:
RTCPTR, #04 ; Read HOUR
R3, RTCDAT
RTCPTR, #01 ; Read HTHSEC
A, RTCDAT
CJNE
Bank 0
A, 00h, ReadAgain
; 00h is R0 in
Rev. PrB | Page 112 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
XTALG2 XTALG1
AUTOCOMPEN
XTALOS
_
+
32.768kHz
CRYSTAL
TEMPERATURE
ADC
RTCCOMP
CALIBRATION
ITS1 ITS0
(x)2
TEMPCAL
COMPENSATION
CALIBRATED
32.768kHz
8-BIT
PRESCALER
HUNDREDTHS COUNTER
HTHSEC
INTERVAL
TIMEBASE
ALSEC_EN
ALARM SECOND
ALSEC
SELECTION
EQUAL?
EQUAL?
SECOND COUNTER
MUX
SEC
ALMIN_EN
ALARM MINUTE
ALMIN
MINUTE COUNTER
MIN
ALHR_EN
ALARM HOUR
ALHOUR
ITEN
HOUR COUNTER
HOUR
EQUAL?
EQUAL?
ALDAY_EN
ALARM DAY
ALDAY
DAY COUNTER
DAY
ALDAT_EN
8-BIT
INTERVAL COUNTER
ALARM DATE
ALDATE
DAY COUNTER
DATE
EQUAL?
INTVAL
MONTH COUNTER
MONTH
EQUAL?
ALINT_EN
YEAR COUNTER
YEAR
RTC INTERRUPT
ALFLAG
Figure 81. RTC Implementation
RTC SFR REGISTER LIST
Table 118.
SFR
Address
0xA1
0xA2
0xA3
0xA4
0xC1
0xF6
Bit Addressable
Description
TIMECON
TIMECON2
RTCPTR
RTCDAT
KYREG
No
No
No
No
No
No
No
RTC configuration (see Table 119)
RTC Configuration 2 (see Table 120)
RTC pointer address (see Table 121)
RTC pointer data (see Table 122)
Key (see Table 125)
RTCCOMP
TEMPCAL
RTC nominal compensation (see Table 123)
RTC temperature compensation (see Table 124)
0xF7
Rev. PrB | Page 113 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Table 119. RTC Configuration SFR (TIMECON, 0xA1)
Bit
Mnemonic
Reserved
ALFLAG
Default
Description
7
N/A
Reserved.
6
0
Alarm flag. This bit is set when the RTC registers match the enabled alarm registers. It can be cleared
by the user to indicate that the alarm has been serviced.
5 to 4 ITS[1:0]
0
0
INTVAL timebase select bits.
ITS[1:0]
00
01
10
11
Timebase
1/128 sec
Second
Minute
Hour
3
SIT
Interval timer one-time alarm.
SIT
0
Result
The ALARM flag is set after INTVAL counts and then another interval count starts.
The ALARM flag is set after one time interval.
1
2
1
ITFLAG
ITEN
0
0
Interval timer flag. This bit is set when the configured time interval has elapsed. It can be cleared by
the user to indicate that the alarm event has been serviced.
Interval timer enable.
ITEN
Result
0
1
The interval timer is disabled. The 8-bit interval timer counter is reset.
Set this bit to enable the interval timer.
0
Unused
N/A
Table 120. RTC Configuration 2 SFR (TIMECON2, 0xA2)
Bit
Mnemonic
Default
Description
7 to 5 Reserved
N/A
Reserved.
4
3
2
1
0
ALDAT_EN
ALDAY_EN
ALHR_EN
ALMIN_EN
ALSEC_EN
0
Alarm date enable. When this bit is set, the data in the AL_DATE register is compared to the data in
the RTC DATE register. If the two values match and any other enabled RTC alarms also match, the
ALFLAG is set. If enabled, an RTC interrupt occurs.
Alarm day enable. When this bit is set, the data in the AL_DAY register is compared to the data in the
RTC DAY register. If the two values match and any other enabled RTC alarms also match, the ALFLAG
is set. If enabled, an RTC interrupt occurs.
Alarm hour enable. When this bit is set, the data in the AL_HOUR register is compared to the data in
the RTC HOUR register. If the two values match and any other enabled RTC alarms also match, the
ALFLAG is set. If enabled, an RTC interrupt occurs.
Alarm minute enable. When set, the data in the AL_MIN register is compared to the data in the RTC
MIN register. If the two values match and any other enabled RTC alarms also match, the ALFLAG is
set. If enabled, an RTC interrupt occurs.
0
0
0
0
Alarm second enable. When this bit is set, the data in the AL_SEC register is compared to the data in
the RTC SEC register. If the two values match and any other enabled RTC alarms also match, the
ALFLAG is set. If enabled, an RTC interrupt occurs.
Rev. PrB | Page 114 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 121. RTC Pointer Address SFR (RTCPTR, 0xA3)
Bit
Mnemonic
Default
Description
7
RTCW_RB
0
Read/write selection.
RTCW_RB
Results
The RTC register at the address is read into the RTCDAT SFR.
The data in the RTCDAT SFR is written in the RTC register at the address. This
operation is completed only if the KEYREG SFR is set to 0xEA, the instruction
before writing to the RTCDAT SFR.
0
1
6 to 5
4 to 0
Reserved
N/A
0
Reserved.
RTC_ADDRESS
Target address for read/write operation.
Table 122. RTC Pointer Data SFR (RTCDAT, 0xA4)
Bit
Mnemonic
Default
Description
7 to 0
RTC_DATA
0
Location of data for read/write RTC operation.
Table 123. RTC Nominal Compensation SFR (RTCCOMP, 0xF6)
Bit
Mnemonic
Default
Description
7 to 0
RTCCOMP
0
The RTCCOMP SFR holds the nominal RTC compensation value at 25°C. Note that this register
is reset after a watchdog reset, an external reset or a power on reset (POR).
Table 124. RTC Temperature Compensation SFR (TEMPCAL, 0xF7)
Bit
Mnemonic
Default
Description
7 to 0
TEMPCAL
0
The TEMPCAL SFR is adjusted based on the temperature read in the TEMPADC to calibrate the
RTC over temperature. This allows the external crystal shift to be compensated over
temperature. Note that this register is reset after a watchdog reset, an external reset or a
power-on reset (POR).
Table 125. Key SFR (KYREG, 0xC1)
Bit
Mnemonic
Default Description
7 to 0
KYREG
0
To unlock the POWCON SFR and enable a write operation, 0xA7 should be written to KYREG.
To unlock the HTHSEC, SEC, MIN or HOUR timekeeping registers or the RTCCAL, XTALOS,
XTALG1 or XTALG2 registers and enable a write operation, 0xEA should be written to KYREG.
Rev. PrB | Page 115 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
RTC REGISTERS
Table 126. RTC Register List
Address
RTCPTR[4:0] Mnemonic
Signed/
Length Unsigned Value
Default
R/W
N/A
R/W
Description
0x00
0x01
Reserved
HTHSEC
N/A
8
N/A
U
N/A
0
Reserved.
This counter updates every 1/128 second, referenced from
the calibrated 32.768 kHz clock. It overflows from 127 to 00,
incrementing the seconds counter, SEC.
0x02
0x03
0x04
SEC
R/W
R/W
R/W
8
8
8
U
U
U
0
0
0
This counter updates every second, referenced from the
calibrated 32.768 kHz clock. It overflows from 59 to 00,
incrementing the minutes counter, MIN
This counter updates every minute, referenced from the
calibrated 32.768 kHz clock. It overflows from 59 to 00,
incrementing the hours counter, HOUR
This counter updates every Hour, referenced from the
calibrated 32.768 kHz clock. It overflows from 23 to 00,
incrementing the DAY and DATE counters.
MIN
HOUR
0x05
0x06
DAY
R/W
R/W
8
8
U
U
0
1
This counter updates every day, referenced from the
calibrated 32.768 kHz clock. It overflows from 6 to 0
This counter updates every day, referenced from the
calibrated 32.768 kHz clock. It overflows from 28/29/30 or 31
to 01, depending on the month, incrementing the month
counter, MONTH.
DATE
0x07
MONTH
R/W
8
U
1
This counter starts at 1 and updates every month, referenced
from the calibrated 32.768 kHz clock. It overflows from 12 to
01, incrementing the year counter, YEAR.
0x08
0x09
YEAR
R/W
R/W
8
8
U
U
0
0
This counter updates every year, referenced from the
calibrated 32.768 kHz clock.
INTVAL
The interval timer counts according to the timebase
established in the ITS[1:0] bits of the RTC Configuration SFR
(TIMECON, 0xA1). Once the number of counts is equal to
INTVAL, the ITFLAG flag is set and a pending RTC interrupt is
created if enabled. Note that the interval counter is 8-bits so
it could count up to 255 sec, for example.
0x0A
0x0B
0x0C
0x0D
0x0E
AL_SEC
R/W
R/W
R/W
R/W
R/W
8
8
8
8
8
U
U
U
U
U
0
0
0
0
0
Alarm second register. When this register matches the SEC
register and the ALSEC_EN bit is set, the ALFLAG is issued if
all other enabled alarms match their corresponding timekeep-
ing register. If enabled, a pending RTC interrupt is generated.
Alarm minute register. When this register matches the MIN
register and the ALMIN_EN bit is set the ALFLAG is issued if
all other enabled alarms match their corresponding timekeep-
ing register. If enabled, a pending RTC interrupt is generated.
Alarm hour register. When this register matches the HOUR
register and the ALHR_EN bit is set, the ALFLAG is issued if all
other enabled alarms match their corresponding timekeep-
ing register. If enabled, a pending RTC interrupt is generated.
Alarm day register. When this register matches the DAY
register and the ALDAY_EN bit is set the ALFLAG is issued if
all other enabled alarms match their corresponding timekeep-
ing register. If enabled, a pending RTC interrupt is generated..
AL_MIN
AL_HOUR
AL_DAY
AL_DATE
Alarm date register. When this register matches the DATE
register and the AL_DAT_EN bit is set the ALFLAG is issued if
all other enabled alarms match their corresponding timekeep-
ing register. If enabled, a pending RTC interrupt is generated.
0x0F
0x10
RTC_CAL
XTALOS
R/W
R/W
8
8
U
U
0
0
Configuration of the RTC calibration output (see Table 127).
Temperature offset for crystal temperature compensation
Rev. PrB | Page 116 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Address
RTCPTR[4:0] Mnemonic
Signed/ Default
Length Unsigned Value
R/W
Description
0x11
XTALG1
R/W
8
U
0
Least significant byte of frequency coefficient for crystal
temperature compensation (see Table 128).
0x12
XTALG2
R/W
8
U
0
Most significant byte of frequency coefficient for crystal
temperature compensation (see Table 129)
Table 127. RTC Calibration Configuration Register (RTC_CAL, 0x0F)
Bit
Mnemonic
Reserved
CAL_EN
Default Description
7
0
0
This bit should be kept cleared for proper operation.
RTC calibration enable output.
6
CAL_EN
Result
0
1
The RTC calibration output signal is disabled.
The RTC calibration output signal is enabled and present on the pins selected by
the RTC_CAL[3:0] bits.
5 to 4
FSEL[1:0]
0
RTC calibration output frequency selection.
FSEL[1:0] Frequency Calibration window
00
01
10
11
1 Hz
30.5 seconds
30.5 seconds
0.244 second
0.244 second
512 Hz
500 Hz
16.384kHz
3
2
1
0
RTC_P2P3
RTC_P1P2
RTC_P0P7
RTC_P0P5
0
0
0
0
When this bit is set and the CAL_EN bit is set, the RTC output is present on P2.3/SDEN/TxD2.
When this bit is set and the CAL_EN bit is set, the RTC output is present on P1.2/FP25.
When this bit is set and the CAL_EN bit is set, the RTC output is present on P0.7/SS/T1/RxD2.
When this bit is set and the CAL_EN bit is set, the RTC output is present on P0.5/MISO/ZX.
Table 128. Crystal Gain Register MSB ( (XTALG2, 0x12)
Bit
Mnemonic
Default Description
7
AUTOCOMPEN
0
Automatic crystal temperature compensation enable. Setting this bit to one enables the
automatic compensation.
6 to 0
XTALGain[6:0]
0
Upper seven bits of crystal temperature coefficient.
Table 129. Crystal Gain Register LSB (XTALG1, 0x11)
Bit
Mnemonic
Default Description
7 to 0
XTALGain[14:7]
0
Least significant byte of crystal temperature coefficient.
RTC CALENDAR
The RTC has a full calendar taking into account leap years. The rollover of the date to increment the month is implemented following Table 130.
Table 130. Month Rollover
MONTH Register
Rollover Value
Estimated Month
January
February
March
April
May
June
July
August
September
October
November
December
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
31
28 or 29 days (see Table 131)
31
30
31
30
31
31
30
31
30
31
0x09
0x0A
0x0B
0x0C
Rev. PrB | Page 117 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Interval Timer Alarm
Table 131. Leap Years—Rollover After 29 Days
The RTC can be used as an interval timer. When the interval
timer is enabled by setting the ITEN bit in the RTC configuration
SFR (TIMECON, 0xA1), the interval timer clock source selected
by the ITS1 and ITS0 bits is passed through to an 8-bit counter.
This counter increments on every interval timer clock pulse
until the 8-bit counter is equal to the value in the alarm interval
register. Then an alarm event is generated, setting the SIT flag
and creating a pending RTC interrupt. If the SIT bit in the RTC
configuration SFR (TIMECON, 0xA1) is clear, the 8-bit counter
is cleared and starts counting again. If the SIT bit is set then the
8-bit counter is held in reset after the alarm occurs.
Year Register
0d04
0d08
0d12
0d16
0d20
0d24
0d28
0d32
0d36
0d40
0d44
0d48
0d52
0d56
0d60
0d64
0d68
0d72
0d76
0d80
0d84
0d88
0d96
0d96
Estimated Year
2004
2008
2012
2016
2020
2024
2028
2032
2036
2040
2044
2048
2052
2056
2060
2064
2068
2072
2076
2080
2084
2088
2092
2096
Take care when changing the interval timer timebase. The
recommended procedure is as follows:
1. If the INTVAL register is going to be modified, write this
register first. Then wait for one 128 Hz clock cycle to
synchronize with the RTC, 64,000 cycles at a 4.096 MHz
instruction cycle clock.
2. Disable the interval timer by clearing the ITEN bit in the
TIMECON SFR. Then wait for one 128 Hz clock cycle to
synchronize with the RTC, 64,000 cycles at a 4.096 MHz
instruction cycle clock.
3. Read the TIMECON SFR to ensure that the ITEN bit is
clear. If it is not, wait for another 128 Hz clock cycle.
4. Set the timebase bits, ITS[1:0] in the TIMECON SFR to
configure the interval. Wait for a 128 Hz clock cycle for this
change to take effect.
RTC INTERRUPTS
The RTC alarm and interval timer interrupts are enabled by
setting the ETI bit in the interrupt enable and Priority 2 SFR
(IEIP2, 0xA9). When an alarm or Interval Timer event occurs,
the corresponding flag is set and a pending RTC interrupt is
generated. If the RTC interrupt is enabled, the program vectors
to the RTC interrupt address and the corresponding RTC flag
can be cleared in software. Moving to the RTC interrupt address
alone does not automatically clear the flag. To successfully
acknowledge the interrupt event, the flag has to be cleared by
software. If the RTC interrupt is disabled when the event
occurs, the pending interrupt remains until the corresponding
RTC flag is cleared. The ALFLAG and ITFLAG flags therefore
drive the RTC interrupt, and should be managed by the user to
keep track of the RTC events.
Alarm
The RTC can be used with an alarm to wake up periodically.
The alarm registers (AL_SEC, AL_MIN, AL_HOUR, AL_DAY,
and AL_DATE) should be set to the specific time that the alarm
event is required, and the corresponding Alxx_EN bits set in the
TIMECON2 SFR (0xA2). The enabled alarm registers are then
compared to their respective RTC registers (SEC, MIN, HOUR,
DAY, and DATE) and when all enabled alarms match their
corresponding RTC registers, the alarm flag is set and a pending
interrupt is generated. The alarm flag is located in Bit 6 of the
TIMECON2 SFR (0xA2). If enabled, an RTC interrupt occurs
and the program vectors to the RTC interrupt address.
Note that if the ADE5166/ADE5169/ADE5566/ADE5569 are
awakened by an RTC event, either the ALFLAG or ITFLAG,
then the pending RTC interrupt must be serviced before the
ADE5166/ADE5169/ADE5566/ADE5569 can go back to sleep
again. The ADE5166/ADE5169/ADE5566/ADE5569 keep
waking up until this interrupt has been serviced.
Rev. PrB | Page 118 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
RTC CRYSTAL COMPENSATION
When no RTC compensation is applied, with RTCCOMP and
TEMPCAL equal to zero, the nominal compensation required
to account for the error in the external crystal can be deter-
mined. In this case, it is not necessary to wait for an entire
calibration window to determine the error in the pulse output.
Calculating at the error in frequency between two consecutive
pulses on the RTC calibration pin is sufficient.
The RTC provides registers to compensate for the tolerance of
the crystal frequency and its variation over temperature. Up to
248 ppm frequency error can be calibrated out by the RTC
circuitry. The compensation is fully digital and implemented
by adding or subtracting pulses from the crystal clock signal.
The resolution of the RTC compensation register is 2 ppm/LSB,
or 0.17 s/day/LSB. The RTC compensation circuitry adds the
RTC temperature compensation SFR (TEMPCAL, 0xF7) and
the RTC nominal compensation SFR (RTCCOMP, 0xF6) to
determine how much compensation is required and the sum of
these two registers is limited to 248ppm, or 42.85 s/day.
The value to write to the RTCCOMP register is calculated from
the % error or seconds per day error on the frequency output.
Each LSB of the RTCCOMP SFR represents 2 ppm of correction
where1 s/day error is equal to 11.57 ppm.
RTCCOMP = 5000 ×(% Error)
RTC Calibration
1
RTCCOMP =
×(s/day Error)
The nominal crystal frequency can be calibrated by adjusting
the RTCCOMP register so that the clock going into the RTC is
precisely 32.768 kHz at 25°C.
2 ×11.57
During calibration, user software writes the RTC with the
current time. Refer to the Access to Internal RTC Registers
section for more information on how to read and write the RTC
timekeeping registers.
Calibration Flow
An RTC calibration pulse output is on up to four pins configured
by the four LSBs in the RTC calibration configuration register
(RTC_CAL, 0x0F). Enable the RTC output by setting the
CAL_EN bit in the RTC calibration configuration register
(RTC_CAL, 0x0F).
RTC TEMPERATURE COMPENSATION
The RTC temperature compensation SFR (TEMPCAL, 0xF7) is
used to compensate for the external crystal drift over temperature
by adding or subtracting additional pulses based on tempera-
ture. By design, crystal frequency’s changes with temperature
according to Equation 35.
The RTC calibration is accurate to within 2 ppm over a 30.5 sec
window in all operational modes: PSM0, PSM1, and PSM2. Two
output frequencies are offered for the normal RTC mode: 1 Hz
with FSEL[1:0] = 00 and 512Hz with FSEL[1:0] = 01 in the RTC
calibration configuration register (RTC_CAL, 0x0F).
XTALfrequency
(
T
)
− XTALfrequency
T0 =
2
k ×
T −T0
)
(35)
A shorter window of 0.244 sec is offered for fast calibration
during PSM0 or PSM1. Two output frequencies are offered for
this RTC calibration output mode: 500 Hz with FSEL[1:0] = 10
and 16.384 kHz with FSEL[1:0] = 11 in the RTC calibration
configuration register (RTC_CAL, 0x0F). Note that for the
0.244 sec calibration window, the RTC is clocked 125 times
faster than in the normal mode, resulting in timekeeping
registers that represent seconds/125, minutes/125, and
hours/125 instead of seconds, minutes, and hours. Therefore,
this mode should be used for calibration only.
where k and T0 are given by the crystal manufacturer.
The ADE5166/ADE5169/ADE5566/ADE5569 provide the
unique feature of using its internal temperature measurement to
process the TEMPCAL register value based on the theoretical
inverted parabolic curve described in Equation 35. The coefficient
k and T0 are user programmable.
The crystal manufacturer coefficients need to be translated
to fit the format of crystal offset (XTALOS) and crystal gain
(XTALGain), which is a combination of the XTALG1 and
XTALG2 registers of the ADE5166/ADE5169/ADE5566/
ADE5569. The actual implementation of Equation 35 in the
ADE5166/ADE5169/ADE5566/ADE5569 is as follows:
Table 132. RTC Calibration Options
Calibration
FSEL[1:0] Window (sec)
fRTCCAL
(Hz)
Option
XTALGain
Normal Mode 0
Normal Mode 1
Calibration
Mode 0
00
01
10
30.5
30.5
0.244
1
512
500
TEMPCAL[7 : 0
]
=
×
215
2
(
TEMPADC
[7 : 0
]− XTALOS[7 : 0])
where XTALGain = XTALG2[6:0] × 28 + XTALG1[7:0]
Calibration
Mode 1
11
0.244
16384
Rev. PrB | Page 119 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Because the temperature measurement has a resolution of
0.78°C/LSB and the RTC compensation has a resolution of
2ppm/LSB, XTALOS and XTALGain can be processed using
(STRBPER, 0xF9). Background measurements occur every 1, 2,
or 8 minutes, depending on the configuration. When the MSB
of XTALG2 is set and background temperature readings are
initiated, the RTC calibration is performed every time a new
temperature measurement is obtained. Note that the
temperature and supply delta SFR (DIFFPROG, 0xF3) does not
have to be set for the RTC temperature compensation to be
operational.
XTALOS[7:0] = TEMPADC[7:0]T0
considering the equation of the temperature ADC at 25°C,
XTALOS = 0d123, if T0 is given to be 25°C.
14
(
)
XTALGain
[14 : 0] = − k ×2ppm / °C ×0.78°C/LSB ×2
Note that because the RTC temperature compensation is
designed to operate in the background, it does not affect the
temperature, voltage or battery ADC SFRs. These registers are
only updated when configured to do so in the temperature and
supply delta SFR (DIFFPROG, 0xF3) in background mode, or
upon the completion of a single ADC reading initiated by a write
to the start ADC measurement SFR (ADCGO, 0xD8). All of the
ADC measurements can therefore be used in parallel with the
RTC temperature calibration. It should be noted, however, that
the frequency of background temperature measurements is
restricted by the strobe interval set in the peripheral ADC
strobe period (STRBPER, 0xF9) when the RTC temperature
compensation was configured.
where:
k is a negative number usually presented with the unit of
ppm/°C.
XTALGain is an unsigned 15-bit number made up of
Register XTALG1 and Register XTALG2.
The automatic correction is disabled by default and can be
enabled by writing 1 to the MS of the XTALG2 register. When
enabled, TEMPCAL can be read but cannot be written by user
code. To successfully perform the autocalibration, a temperature
reading must first be obtained (see the Temperature Measurement
section). This calibration feature is designed to operate in the
background to continually maintain an accurate RTC value
with changing temperature. It is therefore recommended that
temperature measurements be set up to occur automatically in
the background through the peripheral ADC strobe period SFR
Rev. PrB | Page 120 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
UART SERIAL INTERFACE
The ADE5166/ADE5169/ADE5566/ADE5569 UART can be
configured in one of four modes.
and TxD (P1.1) pins, and the firmware interface is through the
SFRs presented in Table 133.
Both the serial port receive and transmit registers are accessed
through the serial port buffer SFR (SBUF, 0x99). Writing to
SBUF loads the transmit register, and reading SBUF accesses a
physically separate receive register.
•
•
•
•
Shift register with baud rate fixed at fCORE/12
8-bit UART with variable baud rate
9-bit UART with baud rate fixed at fCORE/64 or fCORE/32
9-bit UART with variable baud rate
An enhanced UART mode is offered by using the UART timer
and by providing enhanced frame error, break error, and overwrite
error detection. This mode is enabled by setting the EXTEN bit
in the configuration SFR (CFG, 0xAF) (see the UART Additional
Features section). The enhanced serial baud rate control SFR
(SBAUDT, 0x9E) and UART timer fractional divider SFR
(SBAUDF, 0x9D) are used to configure the UART timer and to
indicate the enhanced UART errors.
Variable baud rates are defined by using an internal timer to
generate any rate between 300 bauds/s and 115,200 bauds/s.
The UART serial interface provided in the ADE5166/ADE5169/
ADE5566/ADE5569 is a full-duplex serial interface. It is also
receive buffered by storing the first received byte in a receive
buffer until the reception of the second byte is complete. The
physical interface to the UART is provided via the RxD (P1.0)
UART REGISTERS
Table 133. Serial Port SFRs
SFR
Address
Bit Addressable
Description
SCON
SBUF
SBAUDT
SBAUDF
0x98
0x99
0x9E
0x9D
Yes
No
No
No
Serial communications control (see Table 134).
Serial port buffer (see Table 135).
Enhanced serial baud rate control (see Table 136).
UART timer fractional divider (see Table 137).
Table 134. Serial Communications Control SFR (SCON, 0x98)
Bit
Address
Mnemonic Default Description
7 to 6
0x9F, 0x9E SM0, SM1
00 UART serial mode select bits. These bits select the serial port operating mode.
SM[0:1]
00
01
Result (Selected Operating Mode)
Mode 0, shift register, fixed baud rate (fCORE/12).
Mode 1, 8-bit UART, variable baud rate.
10
11
Mode 2, 9-bit UART, fixed baud rate (fCORE/32) or (fCORE/16).
Mode 3, 9-bit UART, variable baud rate.
5
0x9D
SM2
0
Multiprocessor communication enable bit. Enables multiprocessor communication in
Mode 2 and Mode 3, and framing error detection in Mode 1.
In Mode 0, SM2 should be cleared.
In Mode 1, if SM2 is set, RI is not activated if a valid stop bit was not received.
If SM2 is cleared, RI is set as soon as the byte of data is received.
In Mode 2 or Mode 3, if SM2 is set, RI is not activated if the received ninth data bit in RB8 is 0. If
SM2 is cleared, RI is set as soon as the byte of data is received.
4
3
2
1
0x9C
0x9B
0x9A
0x99
REN
TB8
RB8
TI
0
0
0
0
Serial port receive enable bit. Set by user software to enable serial port reception.
Cleared by user software to disable serial port reception.
Serial port transmit (Bit 9). The data loaded into TB8 is the ninth data bit transmitted in
Mode 2 and Mode 3.
Serial port receiver (Bit 9). The ninth data bit received in Mode 2 and Mode 3 is latched
into RB8. For Mode 1, the stop bit is latched into RB8.
Serial port transmit interrupt flag. Set by hardware at the end of the eighth bit in Mode 0 or
at the beginning of the stop bit in Mode 1, Mode 2, and Mode 3.
TI must be cleared by user software.
0
0x98
RI
0
Serial port receive interrupt flag. Set by hardware at the end of the eighth bit in Mode 0 or
halfway through the stop bit in Mode 1, Mode 2, and Mode 3.
RI must be cleared by user software.
Rev. PrB | Page 121 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Table 135. Serial Port Buffer SFR (SBUF, 0x99)
Bit
Mnemonic
Default
Description
Serial Port Data Buffer.
7 to 0
SBUF
0
Table 136. Enhanced Serial Baud Rate Control SFR (SBAUDT, 0x9E)
Bit
Mnemonic
Default Description
7
OWE
0
Overwrite error. This bit is set when new data is received and RI = 1. It indicates that SBUF was not
read before the next character was transferred in, causing the prior SBUF data to be lost. Write a 0 to
this bit to clear it.
6
5
FE
BE
0
0
Frame error. This bit is set when the received frame does not have a valid stop bit. This bit is read
only and updated every time a frame is received.
Break error. This bit is set whenever the receive data line (Rx) is low for longer than a full transmission
frame, which is the time required for a start bit, eight data bits, a parity bit, and half a stop bit. This
bit is updated every time a frame is received.
4, 3
SBTH1, SBTH0
0
0
Extended divider ratio for baud rate setting as shown in Table 138.
Binary divider. See Table 138.
2, 1, 0
DIV2, DIV1, DIV0
DIV[2:0]
000
001
010
011
100
101
110
111
Result
Divide by 1.
Divide by 2.
Divide by 4.
Divide by 8.
Divide by 16.
Divide by 32.
Divide by 64.
Divide by 128.
Table 137. UART Timer Fractional Divider SFR (SBAUDF, 0x9D)
Bit
Mnemonic
Default Description
7
UARTBAUDEN
0
UART baud rate enable. Set to enable UART timer to generate the baud rate.
When set, PCON.7 (SMOD), T2CON.4 (TCLK), and T2CON.5 (RCLK) are ignored.
Cleared to let the baud rate be generated as per a standard 8052.
6
5
4
3
2
1
0
Not Implemented, write don’t care.
UART Timer Fractional Divider Bit 5.
UART Timer Fractional Divider Bit 4.
UART Timer Fractional Divider Bit 3.
UART Timer Fractional Divider Bit 2.
UART Timer Fractional Divider Bit 1.
UART Timer Fractional Divider Bit 0.
SBAUDF.5
SBAUDF.4
SBAUDF.3
SBAUDF.2
SBAUDF.1
SBAUDF.0
0
0
0
0
0
0
Rev. PrB | Page 122 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 138. Common Baud Rates Using UART Timer with a 4.096 MHz PLL Clock
Ideal Baud
115,200
115,200
57,600
57,600
38,400
38,400
38,400
19,200
19,200
19,200
19,200
9600
9600
9600
9600
9600
4800
4800
4800
4800
4800
4800
2400
2400
2400
2400
2400
2400
2400
300
CD
0
1
0
1
0
1
2
0
1
2
3
0
1
2
3
4
0
1
2
3
4
5
0
1
2
3
4
5
6
0
1
2
3
4
5
6
7
SBTH
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2
1
0
0
0
0
0
0
DIV
1
0
2
1
2
1
0
3
2
1
0
4
3
2
1
0
5
4
3
2
1
0
6
5
4
3
2
1
0
7
7
7
6
5
4
3
2
SBAUDT
0x01
0x00
0x02
0x01
0x02
0x01
0x00
0x03
0x02
0x01
0x00
0x04
0x03
0x02
0x01
0x00
0x05
0x04
0x03
0x02
0x01
0x00
0x06
0x05
0x04
0x03
0x02
0x01
0x00
0x17
0x0F
0x07
0x06
0x05
0x04
0x03
0x02
SBAUDF
0x87
0x87
0x87
0x87
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
0xAB
% Error
+0.16
+0.16
+0.16
+0.16
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
300
300
300
300
300
300
300
Rev. PrB | Page 123 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
All of the following conditions must be met at the time the final
shift pulse is generated to receive a character:
UART OPERATION MODES
Mode 0 (Shift Register with Baud Rate Fixed at fCORE/12)
•
If the extended UART is disabled (EXTEN = 0 in the CFG
SFR), RI must be 0 to receive a character. This ensures that
the data in the SBUF SFR is not overwritten if the last
received character has not been read.
If frame error checking is enabled by setting SM2, the
received stop bit must be set to receive a character. This
ensures that every character received comes from a valid
frame, with both a start bit and a stop bit.
Mode 0 is selected when the SM0 and SM1 bits in the serial
communications control register SFR (SCON, 0x98) are cleared.
In this shift register mode, serial data enters and exits through
RxD. TxD outputs the shift clock. The baud rate is fixed at
•
fCORE/12. Eight data bits are transmitted or received.
Transmission is initiated by any instruction that writes to the
serial port buffer SFR (SBUF, 0x99). The data is shifted out of the
RxD line. The eight bits are transmitted with the least significant
bit (LSB) first.
If any of these conditions are not met, the received frame is
irretrievably lost, and the receive interrupt flag (RI) is not set.
Reception is initiated when the receive enable bit (REN) is 1
and the receive interrupt bit (RI) is 0. When RI is cleared, the
data is clocked into the RxD line, and the clock pulses are
output from the TxD line as shown in Figure 82.
If the received frame has met the previous criteria, the following
events occur:
•
The eight bits in the receive shift register are latched into
the SBUF SFR.
RxD
(DATA OUT)
DATA BIT 0
DATA BIT 1
DATA BIT 6
DATA BIT 7
•
•
The ninth bit (stop bit) is clocked into RB8 in the SCON SFR.
The receiver interrupt flag (RI) is set.
TxD
(SHIFT CLOCK)
Figure 82. 8-Bit Shift Register Mode
Mode 2 (9-Bit UART with Baud Fixed at fCORE/64 or fCORE/32)
Mode 1 (8-Bit UART, Variable Baud Rate)
Mode 2 is selected by setting SM0 and clearing SM1. In this
mode, the UART operates in 9-bit mode with a fixed baud rate.
The baud rate is fixed at fCORE/64 by default, although setting the
SMOD bit in the program control SFR (PCON, 0x87) doubles
the frequency to fCORE/32. Eleven bits are transmitted or received:
a start bit (0), eight data bits, a programmable ninth bit, and a
stop bit (1). The ninth bit is most often used as a parity bit or as
part of a multiprocessor communication protocol, although it
can be used for anything, including a ninth data bit, if required.
Mode 1 is selected by clearing SM0 and setting SM1. Each data
byte (LSB first) is preceded by a start bit (0) and followed by a
stop bit (1). Therefore, each frame consists of 10 bits transmitted
on TxD or received on RxD.
The baud rate is set by a timer overflow rate. Timer 1 or Timer 2
can be used to generate baud rates, or both timers can be used
simultaneously where one generates the transmit rate and the
other generates the receive rate. There is also a dedicated timer
for baud rate generation, the UART timer, which has a fractional
divisor to precisely generate any baud rate (see the UART Timer
Generated Baud Rates section).
To use the ninth data bit as part of a communication protocol for
a multiprocessor network such as RS-485, the ninth bit is set to
indicate that the frame contains the address of the device with
which the master wants to communicate. The devices on the
network are always listening for a packet with the ninth bit set
and are configured such that if the ninth bit is cleared, the frame
is not valid, and a receive interrupt is not generated. If the ninth
bit is set, all devices on the network receive the address and obtain a
receive character interrupt. The devices examine the address and, if
it matches one of the device’s preprogrammed addresses, that
device configures itself to listen to all incoming frames, even those
with the ninth bit cleared. Because the master has initiated
communication with that device, all the following packets with
the ninth bit cleared are intended specifically for that addressed
device until another packet with the ninth bit set is received. If
the address does not match, the device continues to listen for
address packets.
Transmission is initiated by a write to the serial port buffer SFR
(SBUF, 0x99). Next, a stop bit (1) is loaded into the ninth bit
position of the transmit shift register. The data is output bit-by-
bit until the stop bit appears on TxD and the transmit interrupt
flag (TI) is automatically set, as shown in Figure 83.
STOP BIT
START
BIT
D0 D1 D2
D3
D4
D5 D6
D7
TxD
TI
(SCON.1)
SET INTERRUPT
(FOR EXAMPLE,
READY FOR MORE DATA)
Figure 83. 8-Bit Variable Baud Rate
Reception is initiated when a 1-to-0 transition is detected on
RxD. Assuming that a valid start bit is detected, character
reception continues. The eight data bits are clocked into the
serial port shift register.
Rev. PrB | Page 124 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
To transmit, the eight data bits must be written into the serial
port buffer SFR (SBUF, 0x99). The ninth bit must be written to
TB8 in the serial communications control SFR (SCON, 0x98).
When transmission is initiated, the eight data bits from SBUF
are loaded into the transmit shift register (LSB first). The ninth
data bit, held in TB8, is loaded into the ninth bit position of the
transmit shift register. The transmission starts at the next valid
baud rate clock. The transmit interrupt flag (TI) is set as soon as
the transmission completes, when the stop bit appears on TxD.
UART BAUD RATE GENERATION
Mode 0 Baud Rate Generation
The baud rate in Mode 0 is fixed.
f
⎛
⎜
⎞
⎟
CORE
Mode 0 Baud Rate =
12
⎝
⎠
Mode 2 Baud Rate Generation
The baud rate in Mode 2 depends on the value of the PCON[7]
(SMOD) bit in the program control SFR (PCON, 0x87). If
SMOD = 0, the baud rate is 1/32 of the core clock. If SMOD = 1,
the baud rate is 1/16 of the core clock.
All of the following conditions must be met at the time the final
shift pulse is generated to receive a character:
•
•
If the extended UART is disabled (EXTEN = 0 in the CFG
SFR), RI must be 0 to receive a character. This ensures that
the data in SBUF is not overwritten if the last received
character has not been read.
If multiprocessor communication is enabled by setting
SM2, the received ninth bit must be set to receive a character.
This ensures that only frames with the ninth bit set, frames
that contain addresses, generate a receive interrupt.
2SMOD
Mode 2 Baud Rate =
× fCORE
32
Mode 1 and Mode 3 Baud Rate Generation
The baud rates in Mode 1 and Mode 3 are determined by the
overflow rate of the timer generating the baud rate, that is,
either Timer 1, Timer 2, or the dedicated baud rate generator,
UART timer, which has an integer and fractional divisor.
Timer 1 Generated Baud Rates
If any of these conditions are not met, the received frame is
irretrievably lost, and the receive interrupt flag (RI) is not set.
When Timer 1 is used as the baud rate generator, the baud rates
in Mode 1 and Mode 3 are determined by the Timer 1 overflow
rate. The value of SMOD is as follows:
Reception for Mode 2 is similar to that of Mode 1. The eight
data bytes are input at RxD (LSB first) and loaded onto the
receive shift register. If the received frame has met the previous
criteria, the following events occur:
Mode 1 or Mode 3 Baud Rate =
2SMOD
32
× Timer 1 Overflow Rate
•
The eight bits in the receive shift register are latched into
the SBUF SFR.
The Timer 1 interrupt should be disabled in this application.
The timer itself can be configured for either timer or counter
operation, and in any of its three running modes. In the most
typical application, it is configured for timer operation in
autoreload mode (high nibble of TMOD = 0010 binary). In that
case, the baud rate is given by the following formula:
•
•
The ninth data bit is latched into RB8 in the SCON SFR.
The receiver interrupt flag (RI) is set.
Mode 3 (9-Bit UART with Variable Baud Rate)
Mode 3 is selected by setting both SM0 and SM1. In this mode,
the 8052 UART serial port operates in 9-bit mode with a variable
baud rate. The baud rate is set by a timer overflow rate. Timer 1
or Timer 2 can be used to generate baud rates, or both timers can
be used simultaneously where one generates the transmit rate
and the other generates the receive rate. There is also a dedi-
cated timer for baud rate generation, the UART timer, which
has a fractional divisor to precisely generate any baud rate (see
the UART Timer Generated Baud Rates section). The operation
of the 9-bit UART is the same as for Mode 2, but the baud rate
can be varied.
2SMOD
fCORE
Mode 1 or Mode 3 Baud Rate =
×
32
(256 −TH1)
Timer 2 Generated Baud Rates
Baud rates can also be generated by using Timer 2. Using Timer 2
is similar to using Timer 1 in that the timer must overflow 16 times
before a bit is transmitted or received. Because Timer 2 has a
16-bit autoreload mode, a wider range of baud rates is possible.
1
16
Mode 1 or Mode 3 Baud Rate =
× Timer 2 Overflow Rate
In all four modes, transmission is initiated by any instruction
that uses SBUF as a destination register. Reception is initiated in
Mode 0 when RI = 0 and REN = 1. Reception is initiated in the
other modes by the incoming start bit if REN = 1.
Therefore, when Timer 2 is used to generate baud rates, the
timer increments every two clock cycles rather than every core
machine cycle as before. It increments six times faster than
Timer 1, and, therefore, baud rates six times faster are possible.
Because Timer 2 has 16-bit autoreload capability, very low baud
rates are still possible. Timer 2 is selected as the baud rate
generator by setting TCLK and/or RCLK in Timer/Counter 2
control SFR (T2CON, 0xC8). The baud rates for transmit and
receive can be simultaneously different. Setting RCLK and/or
Rev. PrB | Page 125 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
TCLK puts Timer 2 into its baud rate generator mode, as shown
in Figure 85.
fCORE
TIMER 1/TIMER 2
Tx CLOCK
FRACTIONAL
DIVIDER
In this case, the baud rate is given by the following formula:
÷(1 + SBAUDF/64)
TIMER 1/TIMER 2
Rx CLOCK
Mode 1 or Mode 3 Baud Rate =
1
0
0
DIV + SBTH
÷2
fCORE
Rx CLOCK
(
16×
65536 − RCAP2H : RCAP2L
[ ( )])
1
÷32
UART Timer Generated Baud Rates
UARTBAUDEN
Tx CLOCK
UART TIMER
Rx/Tx CLOCK
The high integer dividers in a UART block mean that high speed
baud rates are not always possible. In addition, generating baud
rates requires the exclusive use of a timer, rendering it unusable
for other applications when the UART is required. To address
this problem, each ADE5166/ADE5169/ADE5566/ADE5569
has a dedicated baud rate timer (UART timer) specifically for
generating highly accurate baud rates. The UART timer can be
used instead of Timer 1 or Timer 2 for generating very accurate
high speed UART baud rates, including 115,200 bps. This timer
also allows a much wider range of baud rates to be obtained. In
fact, every desired bit rate from 12 bps to 393,216 bps can be
generated to within an error of 0.8%. The UART timer also
frees up the other three timers, allowing them to be used for
different applications. A block diagram of the UART timer is
shown in Figure 84.
Figure 84. UART Timer, UART Baud Rate
Two SFRs, enhanced serial baud rate control SFR (SBAUDT,
0x9E) and UART timer fractional divider SFR (SBAUDF, 0x9D),
are used to control the UART timer. SBAUDT is the baud rate
control SFR; it sets up the integer divider (DIV) and the extended
divider (SBTH) for the UART timer.
The appropriate value to write to the DIV[2:0] and SBTH[1:0]
bits can be calculated using the following formula where fCORE is
defined in the POWCON SFR (see Table 25). Note that the DIV
value must be rounded down to the nearest integer.
⎛
⎜
⎜
⎝
⎞
⎟
⎟
⎠
fCORE
16×Baud Rate
log
DIV + SBTH =
log 2
( )
TIMER 1
OVERFLOW
2
0
1
SMOD
CONTROL
fCORE
C/T2 = 0
TIMER 2
OVERFLOW
1
1
0
0
TL2
(8 BITS)
TH2
(8 BITS)
RCLK
16
C/T2 = 1
T2
PIN
Rx
CLOCK
TR2
TCLK
16
RELOAD
Tx
CLOCK
NOTE: AVAILABILITY OF ADDITIONAL
EXTERNAL INTERRUPT
RCAP2H
RCAP2L
TIMER 2
INTERRUPT
T2EX
PIN
EXF 2
CONTROL
EXEN2
TRANSITION
DETECTOR
Figure 85. Timer 2, UART Baud Rates
Rev. PrB | Page 126 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
START
STOP
SBAUDF is the fractional divider ratio required to achieve the
required baud rate. The appropriate value for SBAUDF can be
calculated with the following formula:
D0
D1
D2
D3
D4
D5
D6
D7
Rx
RI
⎛
⎜
⎜
⎝
⎞
⎟
⎟
⎠
fCORE
FE
EXTEN = 1
SBAUDF = 64×
−1
DIV +SBTH
16×2
× Baud Rate
Figure 86. UART Timing in Mode 1
Note that SBAUDF should be rounded to the nearest integer.
After the values for DIV and SBAUDF are calculated, the actual
baud rate can be calculated with the following formula:
START
STOP
D0
D1
D2
D3
D4
D5
D6
D7
D8
Rx
RI
fCORE
Actual Baud Rate =
SBAUDF
⎛
⎞
⎟
⎠
16×2DIV +SBTH × 1+
⎜
FE
EXTEN = 1
64
⎝
Figure 87. UART Timing in Mode 2 and Mode 3
For example, to obtain a baud rate of 9600 bps while operating
at a core clock frequency of 4.096 MHz and with the PLL CD
bits equal to 0,
The 8052 standard UART does not provide break error detection.
However, for an 8-bit UART, a break error can be detected when
the received character is 0, a null character, and when there is a
no stop bit because the RB8 bit is low. Break error detection is
not possible for a 9-bit 8052 UART because the stop bit is not
recorded. The ADE5166/ADE5169/ADE5566/ADE5569
enhanced break error detection is available through the BE bit
in the SBAUDT SFR.
4,096,000
16×9600
⎛
⎜
⎝
⎞
⎟
⎠
log
DIV + SBTH =
= 4.74 = 4
log
2
( )
Note that the DIV result is rounded down.
4,096,000
⎛
⎜
⎝
⎞
⎠
SBAUDF = 64×
−1 = 42.67 = 0x2B
⎟
16×23 ×9600
The 8052 standard UART prevents overwrite errors by not
allowing a character to be received when the RI, receive interrupt
flag, is set. However, it does not indicate if a character has been
lost because the RI bit is set when the frame is received. The
enhanced UART overwrite error detection provides this infor-
mation. When the enhanced 8052 UART is enabled, a frame is
received regardless of the state of the RI flag. If RI = 1 when a
new byte is received, the byte in SCON is overwritten, and the
overwrite error flag is set. The overwrite error flag is cleared
when SBUF is read.
Thus, the actual baud rate is 9570 bps, resulting in a 0.31% error.
UART ADDITIONAL FEATURES
Enhanced Error Checking
The extended UART provides frame error, break error, and
overwrite error detection. Framing errors occur when a stop bit
is not present at the end of the frame. A missing stop bit implies
that the data in the frame may not have been received properly.
Break error detection indicates whether the Rx line has been
low for longer than a 9-bit frame. It indicates that the data just
received, a 0 or null character, is not valid because the master has
disconnected. Overwrite error detection indicates when the
received data has not been read fast enough and, as a result, a
byte of data has been lost.
The extended UART is enabled by setting the EXTEN bit in the
configuration SFR (CFG, 0xAF).
UART TxD Signal Modulation
There is an internal 38 kHz signal that can be OR’ed with the
UART transmit signal for use in remote control applications
(see the 38 kHz Modulation section).
The 8052 standard UART offers frame-error checking for an 8-bit
UART through the SM2 and RB8 bits. Setting the SM2 bit prevents
frames without a stop bit from being received. The stop bit is
latched into the RB8 bit in the serial communications control
SFR (SCON, 0x98). This bit can be examined to determine if a
valid frame was received. The 8052 does not, however, provide
frame error checking for a 9-bit UART. This enhanced error
checking functionality is available through the frame error bit,
FE, in the enhanced serial baud rate control SFR (SBAUDT,
0x9E). The FE bit is set on framing errors for both 8-bit and
9-bit UARTs.
One of the events that can wake the MCU from sleep mode is
activity on the RxD pin (see the 3.3 V Peripherals and Wake-Up
Events section).
Rev. PrB | Page 127 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
UART2 SERIAL INTERFACE
The ADE5166/ADE5169/ADE5566/ADE5569 UART2 is an 8-
bit or 9-bit UART with variable baud rate
SS
SDEN
) pins, whereas the firmware
(P0.7/ /T1) and TxD2 (P2.3/
interface is through the SFRs presented in Table 139.
Variable baud rates are defined by using an internal timer to
generate any rate between 300 bauds/s and 115,200 bauds/s.
Both the serial port receive and transmit registers are accessed
through the SBUF2 SFR (0xEB). Writing to SBUF2 loads the
transmit register, and reading SBUF2 accesses a physically
separate receive register.
The UART2 serial interface provided in the ADE5166/ADE5169/
ADE5566/ADE5569 is a full-duplex serial interface. It is also
receive buffered, by storing the first received byte in a receive
buffer until the reception of the second byte is complete. The
physical interface to the UART is provided via the RxD2
An enhanced UART mode is offered by using the UART timer
and providing enhanced frame error, break error, and overwrite
error detection. The SBAUD2 SFR is used to configure the
UART2 timer and to indicate the enhanced UART2 errors.
UART SFR REGISTER LIST
Table 139. Serial Port 2 SFRs
SFR
Address
Bit Addressable
Description
SCON2
SBUF2
SBAUD2
0xE1
0xEB
0xEE
No
No
No
Serial communications control (see Table 140)
Serial Port 2 buffer (see Table 141)
Enhance serial baud rate control (see Table 142)
Table 140. Serial Communications Control SFR (SCON2, 0xE1)
Bit
Mnemonic
Default
Description
7
6
N/A
EN-T8
N/A
0
Reserved
9-bit UART, variable baud rate enable bit. When set, the UART2 is in 9-bit mode.
5
OWE2
0
Overwrite error. This bit is set when new data is received and RI = 1. It indicates that SBUF2 was not
read before the next character was transferred in, causing the prior SBUF2 data to be lost. Write a
zero to this bit to clear it.
4
3
FE2
BE2
0
0
Frame error. This bit is set when the received frame does not have a valid stop bit. This bit is read
only and updated every time a frame is received.
Break error. This bit is set whenever the receive data line (Rx2) is low for longer than a full transmission
frame, the time required for a start bit, eight data bits, a parity bit, and half a stop bit. This bit is
updated every time a frame is received.
2
1
0
REN2
TI2
0
0
0
Serial Port 2 receive enable bit. Set by user software to enable serial port reception. Cleared by
user software to disable serial port reception.
Serial Port 2 transmit interrupt flag. Set by hardware at the end of the eighth bit, TI2 must be
cleared by user software.
Serial Port 2 receive interrupt flag. Set by hardware at the end of the eighth bit, RI2 must be
cleared by user software.
RI2
Table 141. Serial port 2 Buffer SFR (SBUF2, 0xEB)
Bit
Mnemonic Default
Description
7 to 0
SBUF2
0
Serial Port 2 data buffer.
Table 142. Enhanced Serial baud rate control 2 SFR (SBAUD2, 0xEE)
Bit
Mnemonic
Default
Description
7
TB8
0
Serial port transmit (Bit 9). The data loaded into TB8 is the ninth data bit transmitted in
9-bit mode.
6
RB8
0
0
Serial port receiver (Bit 9). The ninth data bit received in 9-bit mode is latched into RB8. For 8-bit
Mode, the stop bit is latched into RB8.
5
SBF2
Fractional divider boolean: When set, SBAUDF2 = 0x2B when clear, SBAUDF2 = 0x07.
Extended divider ratio for baud rate setting as shown in Table 138.
4 to 3
SBTH2.1,
SBTH2.0
Rev. PrB | Page 128 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Bit
Mnemonic
Default
Description
2 to 0
DIV2.2,
DIV2.1,
DIV2.0
0
Binary divider.
DIV2.2
DIV2.1
DIV2.0
Result
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Divide by 1. See Table 138
Divide by 2. See Table 138.
Divide by 4. See Table 138.
Divide by 8. See Table 138.
Divide by 16. See Table 138.
Divide by 32. See Table 138.
Divide by 64. See Table 138.
Divide by 128. See Table 138.
Table 143. Common Baud Rates Using UART2 Timer with a 4.096 MHz PLL Clock
Ideal Baud
115200
115200
57600
57600
38400
38400
38400
19200
19200
19200
19200
9600
9600
9600
9600
9600
4800
4800
4800
4800
4800
4800
2400
2400
2400
2400
2400
2400
2400
300
CD
0
1
0
1
0
1
2
0
1
2
3
0
1
2
3
4
0
1
2
3
4
5
0
1
2
3
4
5
6
0
1
2
3
4
5
6
7
SBTH2
DIV2
1
0
2
1
2
1
0
3
2
1
0
4
3
2
1
0
5
4
3
2
1
0
6
5
4
3
2
1
0
7
7
7
6
5
4
3
2
SBAUDT
0x01
0x00
0x02
0x01
0x02
0x01
0x00
0x03
0x02
0x01
0x00
0x04
0x03
0x02
0x01
0x00
0x05
0x04
0x03
0x02
0x01
0x00
0x06
0x05
0x04
0x03
0x02
0x01
0x00
0x17
0x0F
0x07
0x06
0x05
0x04
0x03
0x02
SBF2
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
SBAUDF2
0x07
0x07
0x07
0x07
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
0x2B
% Error
+ 0.16
+ 0.16
+ 0.16
+ 0.16
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
−0.31
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2
1
0
0
0
0
0
0
300
300
300
300
300
300
300
Rev. PrB | Page 129 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
9-Bit UART with Variable Baud Rate
UART2 OPERATION MODE
9-bit mode is selected by setting EN-T8 in the serial communica-
tions control SFR (SCON, 0x98). In this mode, the UART2 serial
port operates in 9-bit mode with a variable baud rate. The baud
rate is set by a dedicated timer for baud rate generation, UART2
Timer, which has a fractional divisor to precisely generate any
baud rate (see the UART Timer Generated Baud Rates section).
The operation of the 9-bit UART2 is the same as for 9-bit mode
for the UART1.
The UART2 has two operation modes where each data byte
(LSB first) is preceded by a start bit (0), followed by a stop bit
(1). Therefore, each frame consists of 10 bits transmitted on
TxD2 or received on RxD2.
The baud rate is set by a dedicated timer for baud rate
generation, UART2 Timer, which has a fractional divisor to
precisely generate any baud rate.
Transmission is initiated by a write to SBUF2. Next, a stop bit
(1) is loaded into the 9th bit position of the transmit shift
register. The data is output bit-by-bit until the stop bit appears
on TxD2 and the transmit interrupt flag (TI2) is automatically
set as shown in Figure 88.
In both modes, transmission is initiated by any instruction that
uses SBUF2 as a destination register. Reception is initiated in
8-bit mode when RI = 0 and REN = 1. Reception is initiated in
the 9-bit mode by the incoming start bit if REN = 1.
UART BAUD RATE GENERATION
STOP BIT
START
BIT
D0 D1 D2
D3
D4
D5 D6
D7
TxD2
The baud rate is determined by the overflow rate of the dedicated
baud rate generator, UART2 Timer, which has an integer and
fractional divisor.
TI2
(SCON2.1)
SET INTERRUPT
(FOR EXAMPLE,
READY FOR MORE DATA)
UART Timer Generated Baud Rates
The enhanced Serial Baud Rate Control 2 SFR (SBAUD2, 0xEE)
is used to control UART2 Timer. SBAUD2 is the baud rate
control SFR; it sets up the integer divider (DIV) and the
extended divider (SBTH) for UART Timer.
Figure 88. 8-Bit Variable Baud Rate
Reception is initiated when a 1-to-0 transition is detected on
RxD2. Assuming that a valid start bit is detected, character
reception continues. The eight data bits are clocked into the
serial port shift register.
The desired value to write to the DIV[2:0] and SBTH[1:0] bits
can be calculated using the following formula where fcore is
defined in POWCON SFR. Note that the DIV value must be
rounded down to the nearest integer.
All of the following conditions must be met at the time the final
shift pulse is generated to receive a character:
•
•
If the extended UART is disabled (EXTEN = 0 in the CFG
SFR), RI must be 0 to receive a character. This ensures that
the data in the SBUF SFR is not overwritten if the last
received character has not been read.
If frame error checking is enabled by setting SM2, the
received stop bit must be set to receive a character. This
ensures that every character received comes from a valid
frame, with both a start bit and a stop bit.
⎛
⎜
⎜
⎝
⎞
⎟
⎟
⎠
fcore
log
16× Baud Rate
DIV2 + SBTH2 =
log 2
( )
SBAUDF2is the fractional divider ratio required to achieve the
required baud rate. The appropriate value for SBAUDF2 can be
calculated with the following formula:
⎛
⎜
⎜
⎝
⎞
⎟
⎟
⎠
fcore
SBAUDF2 =
64 ×
−1
16 ×2DIV 2+SBTH 2 × Baud Rate
If any of these conditions are not met, the received frame is
irretrievably lost, and the receive interrupt flag, RI2 is not set.
Note that the SBAUDF2 can only take two values, 0x87 or
0xAB, by clearing or setting the SBF2 bit, respectively, in the
SBAUD2 SFR. These values were chosen to provide an accurate
baud rate for 300, 2400, 4800, 9600, 19200, 38400, 57600, and
115,200 bps. Once DIV2 and SBAUDF2 are calculated, the
actual baud rate can be calculated with the following formula:
If the received frame has met the preceding conditions, the
following events occur:
•
The eight bits in the receive shift register are latched into
SBUF2.
•
The receiver interrupt flag (RI2) is set.
fcore
Actual Baud Rate =
Transmission is initiated by any instruction that uses SBUF2 as
a destination register. Reception is initiated by the incoming
start bit if REN2 = 1.
SBAUDF2
⎛
⎞
⎟
⎠
16×2DIV 2+SBTH2 ⋅ 1+
⎜
64
⎝
Rev. PrB | Page 130 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
For example, to get a baud rate of 9600 while operating at a core
clock frequency of 4.096 MHz, with the PLL CD bits equal to 0,
UART ADDITIONAL FEATURES
Enhanced Error Checking
DIV2 + SBTH2 = log(4,096,000/(16 × 9600))/log2 =
4.74 = 4
The extended UART2 provides frame error, break error and
overwrite error detection. Framing errors occur when a stop bit
is not present at the end of the frame. A missing stop bit implies
that the data in the frame may not have been received properly.
Break error detection indicates if the Rx line has been low for
longer than a 9-bit frame. It indicates that the data just received,
a zero, or NULL character, is not valid because the master has
disconnected. Overwrite error detection indicates if the
received data isn’t read fast enough and as result, a byte of data
has been lost.
Note that the DIV result is rounded down.
SBAUDF2 = 64 × (4,096,000/(16 × 23 × 9600) − 1) =
42.67 = 0x2B
Therefore, the actual baud rate is 9570 bps, which gives an error
of 0.31%.
UART2 TxD2 signal modulation
There is an internal 38 kHz signal that can be read with the
UART2 transmit signal for use in remote control applications.
Rev. PrB | Page 131 of 148
ADE5166/ADE5169/ADE5566/ADE5569
SERIAL PERIPHERAL INTERFACE (SPI)
Preliminary Technical Data
SS
MOSI (P0.4), SCLK (P0.6), and (P0.7) pins, while the
The ADE5166/ADE5169/ADE5566/ADE5569 integrate a
complete hardware serial peripheral interface on-chip. The SPI
is full duplex so that eight bits of data are synchronously transmit-
ted and simultaneously received. This SPI implementation is
double buffered, allowing users to read the last byte of received
data while a new byte is shifted in. The next byte to be transmitted
can be loaded while the current byte is shifted out.
firmware interface is via the SPI Configuration SFR 1
(SPIMOD1, 0xE8), the SPI Configuration SFR 2 (SPIMOD2,
0xE9), the SPI interrupt status SFR (SPISTAT, 0xEA), the
SPI/I2C transmit buffer SFR (SPI2CTx, 0x9A), and the SPI/I2C
receive buffer SFR (SPI2CRx, 0x9B).
Note that the SPI pins are shared with the I2C pins. Therefore, the
user can enable only one interface at a time. The SCPS bit in the
configuration SFR (CFG, 0xAF) selects which peripheral is active.
The SPI port can be configured for master or slave operation.
The physical interface to the SPI is via the MISO (P0.5),
SPI REGISTERS
Table 144. SPI SFR List
SFR Address
Mnemonic R/W
Length (Bits)
Default
Description
0x9A
0x9B
0xE8
0xE9
SPI2CTx
SPI2CRx
SPIMOD1
SPIMOD2
SPISTAT
W
R
R/W
R/W
R/W
8
8
8
8
8
0
0
0x10
0
0
SPI/I2C transmit buffer (see Table 145).
SPI/I2C receive buffer (see Table 146).
SPI Configuration SFR 1 (see Table 147).
SPI Configuration SFR 2 (see Table 148).
SPI interrupt status (see Table 149).
0xEA
Table 145. SPI/I2C Transmit Buffer SFR (SPI2CTx, 0x9A)
Bit
Mnemonic
Default
Description
7 to 0 SPI2CTx
0
SPI or I2C transmit buffer. When the SPI2CTx SFR is written, its content is transferred to the transmit
FIFO input. When a write is requested, the FIFO output is sent on the SPI or I2C bus.
Table 146. SPI/I2C Receive Buffer SFR (SPI2CRx, 0x9B)
Bit
Mnemonic
Default
Description
7 to 0 SPI2CRx
0
SPI or I2C receive buffer. When SPI2CRx SFR is read, one byte from the receive FIFO output is
transferred to the SPI2CRx SFR. A new data byte from the SPI or I2C bus is written to the FIFO input.
Rev. PrB | Page 132 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 147. SPI Configuration SFR 1 (SPIMOD1, 0xE8)
Bit
Address
Mnemonic Default
Description
7 to 6 0xEF to 0xEE
Reserved
INTMOD
0
0
Reserved.
5
4
0xED
0xEC
SPI interrupt mode.
INTMOD
Result
0
1
SPI interrupt is set when SPI Rx buffer is full.
SPI interrupt is set when SPI Tx buffer is empty.
AUTO_SS
1
Master mode, SS output control (see Figure 89).
AUTO_SS Result
0
The SS pin is held low while this bit is cleared. This allows manual chip
select control using the SS pin.
1
Single Byte Read or Write. The SS pin goes low during a single byte
transmission and then returns high.
Continuous Transfer. The SS pin goes low during the duration of the
multibyte continuous transfer and then returns high.
3
2
0xEB
0xEA
SS_EN
0
0
Slave mode, SS input enable.
When this bit is set to Logic 1, the SS pin is defined as the slave select input pin for the
SPI slave interface.
RxOFW
Receive buffer overflow write enable.
RxOFW
Result
0
If the SPI2CRx SFR has not been read when a new data byte is received,
the new byte is discarded.
1
If the SPI2CRx SFR has not been read when a new data byte is received,
the new byte overwrites the old data.
1 to 0 0xE9 to 0xE8
SPIR[1:0]
0
Master mode, SPI SCLK frequency.
SPIR[1:0]
Result
00
01
10
11
fCORE/8 = 512 kHz (if fCORE = 4.096 MHz).
fCORE/16 = 256 kHz (if fCORE = 4.096 MHz).
fCORE/32 = 128 kHz (if fCORE = 4.096 MHz).
fCORE/64 = 64 kHz (if fCORE = 4.096 MHz).
Rev. PrB | Page 133 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Table 148. SPI Configuration SFR 2 (SPIMOD2, 0xE9)
Bit Mnemonic Default Description
7
SPICONT
0
Master mode, SPI continuous transfer mode enable bit.
SPICONT Result
0
The SPI interface stops after one byte is transferred and SS is deasserted. A new data transfer can
be initiated after a stalled period.
1
The SPI interface continues to transfer data until no valid data is available in the SPI2CTx SFR. SS
remains asserted until the SPI2CTx SFR and the transmit shift registers are empty.
6
5
SPIEN
0
0
SPI interface enable bit.
SPIEN
Result
0
1
The SPI interface is disabled.
The SPI interface is enabled.
SPIODO
SPI open-drain output configuration bit.
SPIODO
Result
0
1
Internal pull-up resistors are connected to the SPI outputs.
The SPI outputs are open drain and need external pull-up resistors. The pull-up voltage should
not exceed the specified operating voltage.
4
3
SPIMS_b
SPICPOL
0
0
SPI master mode enable bit.
SPIMS_b Result
0
1
The SPI interface is defined as a slave.
The SPI interface is defined as a master.
SPI clock polarity configuration bit (see Figure 91).
SPICPOL Result
0
The default state of SCLK is low, and the first SCLK edge is rising. Depending on the SPICPHA bit,
the SPI data output changes state on the falling or rising edge of SCLK while the SPI data input is
sampled on the rising or falling edge of SCLK.
1
The default state of SCLK is high, and the first SCLK edge is falling. Depending on the SPICPHA
bit, the SPI data output changes state on the rising or falling edge of SCLK while the SPI data
input is sampled on the falling or rising edge of SCLK.
2
SPICPHA
0
SPI clock phase configuration bit (see Figure 91).
SPICPHA Result
0
The SPI data output changes state when SS goes low at the second edge of SCLK and then every
two subsequent edges, whereas the SPI data input is sampled at the first SCLK edge and then
every two subsequent edges.
1
The SPI data output changes state at the first edge of SCLK and then every two subsequent
edges, whereas the SPI data input is sampled at the second SCLK edge and then every two
subsequent edges.
1
0
SPILSBF
TIMODE
0
1
Master mode, LSB first configuration bit.
SPILSBF
Result
0
1
The MSB of the SPI outputs is transmitted first.
The LSB of the SPI outputs is transmitted first.
Transfer and interrupt mode of the SPI interface.
TIMODE Result
1
This bit must be left set for proper operation.
Rev. PrB | Page 134 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 149. SPI Interrupt Status SFR (SPISTAT, 0xEA)
Bit
Mnemonic Default Description
7
BUSY
0
SPI peripheral busy flag.
BUSY
Result
0
1
The SPI peripheral is idle.
The SPI peripheral is busy transferring data in slave or master mode.
6
MMERR
0
SPI multimaster error flag.
MMERR
Result
0
1
A multiple master error has not occurred.
If the SS_EN bit is set, enabling the slave select input and asserting the SS pin while the SPI
peripheral is transferring data as a master, this flag is raised to indicate the error.
Write a 0 to this bit to clear it.
5
4
SPIRxOF
SPIRxIRQ
0
0
SPI receive overflow error flag. Reading the SPI2CRx SFR clears this bit.
SPIRxOF
TIMODE Result
0
1
X
1
The SPI2CRx register contains valid data.
This bit is set if the SPI2CRx register is not read before the end of the next byte
transfer. If the RxOFW bit is set and this condition occurs, SPI2CRx is overwritten.
SPI receive mode interrupt flag. Reading the SPI2CRx SFR clears this bit.
SPIRxIRQ TIMODE Result
0
1
X
0
The SPI2CRx register does not contain new data.
This bit is set when the SPI2CRx register contains new data. If the SPI/I2C
interrupt is enabled, an interrupt is generated when this bit is set. If the SPI2CRx
register is not read before the end of the current byte transfer, the transfer stops
and the SS pin is deasserted.
1
1
The SPI2CRx register contains new data.
3
2
SPIRxBF
SPITxUF
0
0
Status bit for SPI Rx buffer. When set, the Rx FIFO is full. A read of the SPI2CRx clears this flag.
Status bit for SPI Tx buffer. When set, the Tx FIFO is underflowing and data can be written into SPI2CTx.
Write a 0 to this bit to clear it.
1
SPITxIRQ
0
SPI transmit mode interrupt flag. Writing new data to the SPI2CTx SFR clears this bit.
SPITxIRQ TIMODE Result
0
1
1
X
0
1
The SPI2CTx register is full.
The SPI2CTx register is empty.
This bit is set when the SPI2CTx register is empty. If the SPI/I2C interrupt is
enabled, an interrupt is generated when this bit is set. If new data is not written
into the SPI2CTx SFR before the end of the current byte transfer, the transfer
stops, and the SS pin is deasserted. Write a 0 to this bit to clear it.
0
SPITxBF
0
Status bit for SPI Tx buffer. When set, the SPI Tx buffer is full. Write a 0 to this bit to clear it.
SPI PINS
SCLK (Serial Clock I/O Pin)
The master serial clock (SCLK) is used to synchronize the data
being transmitted and received through the MOSI and MISO
data lines. The SCLK pin is configured as an output in master
mode and as an input in slave mode.
MISO (Master In, Slave Out Data I/O Pin)
The MISO pin is configured as an input line in master mode
and as an output line in slave mode. The MISO line on the
master (data in) should be connected to the MISO line in the
slave device (data out). The data is transferred as byte-wide
(8-bit) serial data, MSB first.
In master mode, the bit rate, polarity, and phase of the clock are
controlled by the SPI Configuration SFR 1 (SPIMOD1, 0xE8) and
SPI Configuration SFR 2 (SPIMOD2, 0xE9).
MOSI (Master Out, Slave In Pin)
The MOSI pin is configured as an output line in master mode
and as an input line in slave mode. The MOSI line on the master
(data out) should be connected to the MOSI line in the slave
device (data in). The data is transferred as byte-wide (8-bit)
serial data, MSB first.
In slave mode, the SPI Configuration SFR 2 (SPIMOD2, 0xE9)
must be configured with the phase and polarity of the expected
input clock.
In both master and slave modes, the data is transmitted on one
edge of the SCLK signal and sampled on the other. It is important,
therefore, that the SPICPHA and SPICPOL bits be configured
the same for the master and slave devices.
Rev. PrB | Page 135 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Figure 89 shows the SPI output for certain automatic chip select
and continuous mode selections. Note that if the continuous mode
is not used, a short delay is inserted between transfers.
(Slave Select Pin)
SS
In SPI slave mode, a transfer is initiated by the assertion of
low. The SPI port then transmits and receives 8-bit data until
SS
SS
SS
the data is concluded by the deassertion of according to the
SS
SPICON bit setting. In slave mode, is always an input.
SCLK
SS
In SPI master mode, the can be used to control data transfer
to a slave device. In the automatic slave select control mode, the
AUTO_SS = 1
SPICONT = 1
DIN
DIN1
DIN2
SS
is asserted low to select the slave device and then raised to
deselect the slave device after the transfer is complete. Automatic
slave select control is enabled by setting the AUTO_SS bit in the
SPI Configuration SFR 1 (SPIMOD1, 0xE8).
DOUT
DOUT1
DOUT2
SS
In a multimaster system, the can be configured as an input so
SS
that the SPI peripheral can operate as a slave in some situations
and as a master in others. In this case, the slave selects for the
slaves controlled by this SPI peripheral should be generated
with general I/O pins.
SCLK
AUTO_SS = 1
SPICONT = 0
DIN
DIN1
DIN2
SPI MASTER OPERATING MODES
The double buffered receive and transmit registers can be used to
maximize the throughput of the SPI peripheral by continuously
streaming out data in master mode. The continuous transmit mode
is designed to use the full capacity of the SPI. In this mode, the
master transmits and receives data until the SPI/I2C transmit
buffer SFR (SPI2CTx, 0x9A) is empty at the start of a byte transfer.
Continuous mode is enabled by setting the SPICONT bit in the SPI
Configuration SFR 2 (SPIMOD2, 0xE9). The SPI peripheral also
offers a single byte read/write function.
DOUT
DOUT1
DOUT2
SS
SCLK
AUTO_SS = 0
SPICONT = 0
(MANUAL SS CONTROL)
DIN
DIN1
DIN2
In master mode, the type of transfer is handled automatically,
depending on the configuration of the SPICONT bit in the SPI
Configuration SFR 2 (SPIMOD2, 0xE9). The following proce-
dures show the sequence of events that should be performed for
DOUT
DOUT1
DOUT2
Figure 89. Automatic Chip Select and Continuous Mode Output
SS
each master operating mode. Based on the configuration,
Note that reading the content of the SPI/I2C receive buffer SFR
(SPI2CRx, 0x9B) should be done using a 2-cycle instruction set,
such as MOV A or SPI2CRX. Using a 3-cycle instruction, such
as MOV 0x3D or SPI2CRX, does not transfer the right
information into the target register.
some of these events take place automatically.
Procedures for Using SPI as a Master
Single Byte Write Mode, SPICONT (SPIMOD2[7]) = 0
1. Write to SPI2CTx SFR.
2.
is asserted low and a write routine is initiated.
SS
3. SPITxIRQ interrupt flag is set when the SPI2CTx register
is empty.
4.
is deasserted high.
SS
5. Write to SPI2CTx SFR to clear the SPITxIRQ interrupt flag.
Continuous Mode, SPICONT (SPIMOD2[7]) = 1
1. Write to SPI2CTx SFR.
2.
is asserted low and write routine is initiated.
SS
3. Wait for the SPITxIRQ interrupt flag to write to SPI2CTx SFR.
4. Transfer continues until the SPI2CTx register and transmit
shift registers are empty.
5. SPITxIRQ interrupt flag is set when the SPI2CTx register
is empty.
6.
is deasserted high.
SS
7. Write to SPI2CTx SFR to clear the SPITxIRQ interrupt flag.
Rev. PrB | Page 136 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
(SPI2CRx, 0x9B) is not read before new data is ready to be
loaded into the SPI/I2C receive buffer SFR (SPI2CRx, 0x9B), an
overflow condition has occurred. This overflow condition,
indicated by the SPIRxOF flag, forces the new data to be discarded
or overwritten if the RxOFW bit is set.
SPI INTERRUPT AND STATUS FLAGS
The SPI interface has several status flags that indicate the status
of the double-buffered receive and transmit registers. Figure 90
shows when the status and interrupt flags are raised. The transmit
interrupt occurs when the transmit shift register is loaded with
the data in the SPI/I2C transmit buffer SFR (SPI2CTx, 0x9A)
register. If the SPI master is in transmit operating mode, and the
SPI/I2C transmit buffer SFR (SPI2CTx, 0x9A) register has not
been written with new data by the beginning of the next byte
transfer, the transmit operation stops.
SPITx
SPIRx
SPITxIRQ = 1
SPIRxIRQ = 1
TRANSMIT SHIFT REGISTER
RECEIVE SHIFT REGISTER
SPITx (EMPTY)
SPIRx (FULL)
STOPS TRANSFER IF TIMODE = 1
SPIRxOF = 1
TRANSMIT SHIFT REGISTER RECEIVE SHIFT REGISTER
When a new byte of data is received in the SPI/I2C receive
buffer SFR (SPI2CRx, 0x9B) register, the SPI receive interrupt
flag is raised. If the data in the SPI/I2C receive buffer SFR
Figure 90. SPI Receive and Transmit Interrupt and Status Flags
SCLK
(SPICPOL = 1)
SCLK
(SPICPOL = 0)
SS
MISO
MOSI
?
?
MSB BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 LSB
MSB BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 LSB
SPICPHA = 1
SPIRx AND
SPITx FLAGS
WITH INTMOD = 1
SPIRx AND
SPITx FLAGS
WITH INTMOD = 0
MSB BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 LSB
MSB BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 LSB
?
?
MISO
MOSI
SPICPHA = 0
SPIRx AND
SPITx FLAGS
WITH INTMOD = 1
SPIRx AND
SPITx FLAGS
WITH INTMOD = 0
Figure 91. SPI Timing Configurations
Rev. PrB | Page 137 of 148
ADE5166/ADE5169/ADE5566/ADE5569
I2C-COMPATIBLE INTERFACE
Preliminary Technical Data
The bit rate is defined in the I2CMOD SFR as follows:
The ADE5166/ADE5169/ADE5566/ADE5569 support a fully
licensed I2C interface. The I2C interface is implemented as a full
hardware master.
fCORE
fSCLK
=
16×2I2CR[1:0]
SDATA is the data I/O pin, and SCLK is the serial clock. These
two pins are shared with the MOSI and SCLK pins of the on-chip
SPI interface. Therefore, the user can enable only one interface
or the other on these pins at any given time. The SCPS bit in the
configuration SFR (CFG, 0xAF) selects which peripheral is active.
SLAVE ADDRESSES
The I2C slave address SFR (I2CADR, 0xE9) contains the slave
device ID. The LSB of this register contains a read/write request.
A write to this SFR starts the I2C communication.
I2C REGISTERS
The I2C peripheral interface consists of five SFRs.
The two pins used for data transfer, SDATA and SCLK, are
configured in a wire-AND format that allows arbitration in a
multimaster system.
The transfer sequence of an I2C system consists of a master device
initiating a transfer by generating a start condition while the bus
is idle. The master transmits the address of the slave device and
the direction of the data transfer in the initial address transfer. If
the slave acknowledges, the data transfer is initiated. This continues
until the master issues a stop condition and the bus becomes idle.
•
•
•
•
•
I2CMOD
SPI2CSTAT
I2CADR
SPI2CTx
SPI2CRx
Because the SPI and I2C serial interfaces share the same pins,
they also share the same SFRs, such as the SPI2CTx and SPI2CRx
SFRs. In addition, the I2CMOD, I2CADR, and SPI2CSTAT SFRs
are shared with the SPIMOD1, SPIMOD2, and SPISTAT SFRs,
respectively.
SERIAL CLOCK GENERATION
The I2C master in the system generates the serial clock for a
transfer. The master channel can be configured to operate in
fast mode (256 kHz) or standard mode (32 kHz).
Table 150. I2C SFR List
SFR Address
Mnemonic
SPI2CTx
SPI2CRx
I2CMOD
I2CADR
SPI2CSTAT
R/W
W
R
R/W
R/W
R/W
Length
Default
Description
0x9A
0x9B
0xE8
0xE9
8
8
8
8
8
SPI/I2C transmit buffer (see Table 145).
SPI/I2C receive buffer (see Table 146).
I2C mode (see Table 151).
0
0
0
0
I2C slave address (see Table 152).
I2C interrupt status register (see Table 153).
0xEA
Table 151. I2C Mode SFR (I2CMOD, 0xE8)
Bit
Address
Mnemonic Default
Description
7
0xEF
I2CEN
0
I2C enable bit. When this bit is set to Logic 1, the I2C interface is enabled. A write to the
I2CADR SFR starts a communication.
6 to 5 0xEE to 0xED I2CR[1:0]
0
I2C SCLK frequency.
I2CR[1:0] Result
00
01
10
11
fCORE/16 = 256 kHz if fCORE = 4.096 MHz.
fCORE/32 = 128 kHz if fCORE = 4.096 MHz.
fCORE/64 = 64 Hz if fCORE = 4.096 MHz.
fCORE/128= 32 kHz if fCORE = 4.096 MHz.
4 to 0 0xEC to 0xE8 I2CRCT[4:0]
0
Configures the length of the I2C received FIFO buffer. The I2C peripheral stops when
I2CRCT[4:0] + 1 byte have been read, or if an error occurs.
Table 152. I2C Slave Address SFR (I2CADR, 0xE9)
Bit
7 to 1
0
Mnemonic
I2CSLVADR
I2CR_W
Default
Description
0
0
Address of the I2C slave being addressed. Writing to this register starts the I2C transmission (read or write).
Command bit for read or write. When this bit is set to Logic 1, a read command is transmitted on the
I2C bus. Data from the slave in the SPI2CRx SFR is expected after a command byte. When this bit is
set to Logic 0, a write command is transmitted on the I2C bus. Data to slave is expected in the
SPI2CTx SFR.
Rev. PrB | Page 138 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 153. I2C Interrupt Status Register SFR (SPI2CSTAT, 0xEA)
Bit
Mnemonic
Default Description
7
I2CBUSY
0
0
This bit is set to Logic 1 when the I2C interface is used. When set, the Tx FIFO is emptied.
6
I2CNOACK
I2C no acknowledgement transmit interrupt. This bit is set to Logic 1 when the slave device
does not send an acknowledgement. The I2C communication is stopped after this event.
Write a 0 to this bit to clear it.
5
I2CRxIRQ
0
0
0
I2C receive interrupt. This bit is set to Logic 1 when the receive FIFO is not empty.
Write a 0 to this bit to clear it.
I2C transmit interrupt. This bit is set to Logic 1 when the transmit FIFO is empty.
Write a 0 to this bit to clear it.
4
I2CTxIRQ
3 to 2
I2CFIFOSTAT[1:0]
Status Bits for 3- or 4-byte deep I2C FIFO. The FIFO monitored in these two bits is the one currently
used in I2C communication (receive or transmit) because only one FIFO is active at a time.
I2CFIFOSTAT[1:0]
Result
00
01
10
11
FIFO empty
Reserved
FIFO half full
FIFO full
1
0
I2CACC_ERR
0
0
Set when trying to write and read at the same time. Write a 0 to this bit to clear it.
Set when write was attempted when I2C transmit FIFO was full. Write a 0 to this bit to clear it.
I2CTxWR_ERR
READ AND WRITE OPERATIONS
1
9
1
9
1
9
SCLK
A6 A5 A4 A3 A2 A1 A0 R/W
D7 D6 D5 D4 D3 D2 D1 D0
SDATA
START BY
D7 D6 D5 D4 D3 D2 D1 D0
ACK BY
SLAVE
ACK BY
MASTER
NACK BY
MASTER
STOP BY
MASTER
MASTER
FRAME 1
FRAME 2
DATA BYTE 1 FROM MASTER
FRAME N + 1
SERIAL BUS ADDRESS BYTE
DATA BYTE N FROM SLAVE
Figure 92. I2C Read Operation
1
9
1
9
SCLK
A6 A5 A4 A3 A2 A1 A0 R/W
D7 D6 D5 D4 D3 D2 D1 D0
SDATA
START BY
ACK BY
SLAVE
ACK BY
SLAVE
STOP BY
MASTER
MASTER
FRAME 1
FRAME 2
DATA BYTE 1 FROM MASTER
SERIAL BUS ADDRESS BYTE
Figure 93. I2C Write Operation
Figure 92 and Figure 93 depict I2C read and write operations,
respectively. Note that the LSB of the I2CADR register is used
to select whether a read or write operation is performed on the
slave device. During the read operation, the master acknowledges
are generated automatically by the I2C peripheral. The master
generated NACK (no acknowledge) before the end of a read
operation is also automatically generated after I2CRCT[4:0] have
been read from the slave. If the I2CADR register is updated during
a transmission, instead of generating a stop at the end of the
read or write operation, the master generates a start condition
and continues with the next communication.
Reading the SPI/I2C Receive Buffer SFR (SPI2CRx, 0x9B)
Reading the SPI2CRx SFR should be done with a 2-cycle
instruction, such as
Mov a, spi2crx or Mov R0, spi2crx.
A 3-cycle instruction such as
Mov 3dh, spi2crx
does not transfer the right data into RAM Address 0x3D.
Rev. PrB | Page 139 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
is full. If the peripheral is reading from a slave address, the
communication stops once the number of received bytes equals
the number set in I2CRCT[4:0]. An error, such as not receiving
an acknowledge, also causes the communication to terminate.
I2C RECEIVE AND TRANSMIT FIFOS
The I2C peripheral has a 4-byte receive FIFO and a 4-byte
transmit FIFO. The buffers reduce the overhead associated with
using the I2C peripheral. Figure 94 shows the operation of the
I2C receive and transmit FIFOs.
CODE TO FILL Tx FIFO:
CODE TO READ Rx FIFO:
2
2
2
2
2
2
2
2
MOV I CTx, TxDATA1
MOV A, I CRx; RESULT: A = RxDATA1
MOV I CTx, TxDATA2
MOV A, I CRx; RESULT: A = RxDATA2
MOV I CTx, TxDATA3
MOV A, I CRx; RESULT: A = RxDATA3
The Tx FIFO can be loaded with four bytes to be transmitted to
the slave at the beginning of a write operation. When the transmit
FIFO is empty, the I2C transmit interrupt flag is set, and the PC
vectors to the I2C interrupt vector if this interrupt is enabled. If
a new byte is not loaded into the Tx FIFO before it is needed in
the transmit shift register, the communication stops. An error,
such as not receiving an acknowledge, also causes the communica-
tion to terminate. In case of an error during a write operation,
the Tx FIFO is flushed.
MOV I CTx, TxDATA4
MOV A, I CRx; RESULT: A = RxDATA4
2
2
I CRx
I CTx
TxDATA4
TxDATA3
RxDATA1
RxDATA2
4-BYTE FIFO
4-BYTE FIFO
TxDATA2
TxDATA1
RxDATA3
RxDATA4
TRANSMIT SHIFT REGISTER
RECEIVE SHIFT REGISTER
Figure 94. I2C FIFO Operation
The Rx FIFO allows four bytes to be read in from the slave
before the MCU has to read the data. A receive interrupt can
be generated after each byte is received or when the Rx FIFO
Rev. PrB | Page 140 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
I/O PORTS
PARALLEL I/O
Weak Internal Pull-Ups Enabled
A pin with weak internal pull-up enabled is used as an input by
writing a 1 to the pin. The pin is pulled high by the internal pull-
ups, and the pin is read using the circuitry shown in Figure 95.
If the pin is driven low externally, it sources current because of
the internal pull-ups.
The ADE5166/ADE5169/ADE5566/ADE5569 use three input/
output ports to exchange data with external devices. In addition
to performing general-purpose I/O, some are capable of driving
an LCD or performing alternate functions for the peripherals
available on-chip. In general, when a peripheral is enabled, the pins
associated with it cannot be used as a general-purpose I/O. The
I/O port can be configured through the SFRs in Table 154.
A pin with internal pull-up enabled is used as an output by
writing a 1 or a 0 to the pin to control the level of the output. If
a 0 is written to the pin, it drives a logic low output voltage
(VOL) and is capable of sinking 1.6 mA.
Table 154. I/O Port SFRs
SFR
Address Bit Addressable Description
Open Drain (Weak Internal Pull-Ups Disabled)
P0
P1
P2
EPCFG
0x80
0x90
0xA0
0x9F
Yes
Yes
Yes
No
Port 0 register
Port 1 register
Port 2 Register
Extended port
configuration
When the weak internal pull-up on a pin is disabled, the pin
becomes open drain. Use this open-drain pin as a high impedance
input by writing a 1 to the pin. The pin is read using the circuitry
shown in Figure 95. The open-drain option is preferable for
inputs because it draws less current than the internal pull-ups
that were enabled.
PINMAP0 0xB2
PINMAP1 0xB3
PINMAP2 0xB4
No
No
No
Port 0 weak
pull-up enable
Port 1 weak
pull-up enable
38 kHz Modulation
Every ADE5166/ADE5169/ADE5566/ADE5569 provides a
38 kHz modulation signal. The 38 kHz modulation is accom-
plished by internally XOR’ing the level written to the I/O pin
with a 38 kHz square wave. Then, when a 0 is written to the I/O
pin, it is modulated as shown in Figure 96.
Port 2 weak
pull-up enable
The three bidirectional I/O ports have internal pull-ups that can
be enabled or disabled individually for each pin. The internal
pull-ups are enabled by default. Disabling an internal pull-up
causes a pin to become open drain. Weak internal pull-ups are
configured through the PINMAPx SFRs.
LEVEL WRITTEN
TO MOD38
38kHz MODULATION
SIGNAL
Figure 95 shows a typical bit latch and I/O buffer for an I/O pin.
The bit latch (one bit in the SFR of each port) is represented as a
Type D flip-flop, which clocks in a value from the internal bus
in response to a write-to-latch signal from the CPU. The Q output
of the flip-flop is placed on the internal bus in response to a read
latch signal from the CPU. The level of the port pin itself is
placed on the internal bus in response to a read pin signal from
the CPU. Some instructions that read a port activate the read
latch signal, and others activate the read pin signal. See the
Read-Modify-Write Instructions section for details.
38kHz MODULATED
OUTPUT PIN
Figure 96. 38 kHz Modulation
Uses for this 38 kHz modulation include IR modulation of
a UART transmit signal or a low power signal to drive an
LED. The modulation can be enabled or disabled with the
MOD38EN bit in the CFG SFR. The 38 kHz modulation is
available on eight pins, selected by the MOD38[7:0] bits in the
extended port configuration SFR (EPCFG, 0x9F).
DV
DD
INTERNAL
PULL-UP
ALTERNATE
OUTPUT
FUNCTION
READ
LATCH
CLOSED: PINMAPx.x = 0
OPEN: PINMAPx.x = 1
Px.x
PIN
INTERNAL
BUS
D
Q
Q
WRITE
TO LATCH
CL
LATCH
READ
PIN
ALTERNATE
INPUT
FUNCTION
Figure 95. Port 0 Bit Latch and I/O Buffer
Rev. PrB | Page 141 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
I/O REGISTERS
Table 155. Extended Port Configuration SFR (EPCFG, 0x9F)
Bit
Mnemonic
Default
Description
7
6
5
4
3
2
MOD38_FP21
MOD38_FP22
MOD38_FP23
MOD38_TxD
MOD38_CF1
MOD38_SSb
MOD38_MISO
MOD38_CF2
0
0
0
0
0
0
0
0
Enable 38 kHz modulation on P1.6/FP21 pin.
Enable 38 kHz modulation on P1.5/FP22 pin.
Enable 38 kHz modulation on P1.4/T2/FP23 pin.
Enable 38 kHz modulation on P1.1/TxD pin.
Enable 38 kHz modulation on P0.2/CF1/RTCCAL pin.
Enable 38 kHz modulation on P0.7/SS/T1pin.
Enable 38 kHz modulation on P0.5/MISO/ZX pin.
Enable 38 kHz modulation on P0.3/CF2 pin.
1
0
Table 156. Port 0 Weak Pull-Up Enable SFR (PINMAP0, 0xB2)
Bit
Mnemonic
PINMAP0.7
PINMAP0.6
PINMAP0.5
PINMAP0.4
PINMAP0.3
PINMAP0.2
PINMAP0.1
PINMAP0.0
Default
Description
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
The weak pull-up on P0.7 is disabled when this bit is set.
The weak pull-up on P0.6 is disabled when this bit is set.
The weak pull-up on P0.5 is disabled when this bit is set.
The weak pull-up on P0.4 is disabled when this bit is set.
The weak pull-up on P0.3 is disabled when this bit is set.
The weak pull-up on P0.2 is disabled when this bit is set.
The weak pull-up on P0.1 is disabled when this bit is set.
The weak pull-up on P0.0 is disabled when this bit is set.
Table 157. Port 1 Weak Pull-Up Enable SFR (PINMAP1, 0xB3)
Bit
Mnemonic
PINMAP1.7
PINMAP1.6
PINMAP1.5
PINMAP1.4
PINMAP1.3
PINMAP1.2
PINMAP1.1
PINMAP1.0
Default
Description
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
The weak pull-up on P1.7 is disabled when this bit is set.
The weak pull-up on P1.6 is disabled when this bit is set.
The weak pull-up on P1.5 is disabled when this bit is set.
The weak pull-up on P1.4 is disabled when this bit is set.
The weak pull-up on P1.3 is disabled when this bit is set.
The weak pull-up on P1.2 is disabled when this bit is set.
The weak pull-up on P1.1 is disabled when this bit is set.
The weak pull-up on P1.0 is disabled when this bit is set.
Table 158. Port 2 Weak Pull-Up Enable SFR (PINMAP2, 0xB4)
Bit
Mnemonic
Default
Description
7 to 6
Reserved
PINMAP2.5
Reserved
PINMAP2.3
PINMAP2.2
PINMAP2.1
PINMAP2.0
0
0
0
0
0
0
0
Reserved. Should be left cleared.
The weak pull-up on RESET is disabled when this bit is set.
Reserved. Should be left cleared.
5
4
3
2
1
0
Reserved. Should be left cleared.
The weak pull-up on P2.2 is disabled when this bit is set.
The weak pull-up on P2.1 is disabled when this bit is set.
The weak pull-up on P2.0 is disabled when this bit is set.
Rev. PrB | Page 142 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Table 159. Port 0 SFR (P0, 0x80)
Bit
Address
0x87
0x86
0x85
0x84
0x83
0x82
0x81
0x80
Mnemonic
Default
Description1
7
T1
T0
ZX
1
1
1
1
1
1
1
1
This bit reflects the state of P0.7/SS/T1/RxD2 pin. It can be written or read.
This bit reflects the state of P0.6/SCLK/T0 pin. It can be written or read.
This bit reflects the state of P0.5/MISO/ZX pin. It can be written or read.
This bit reflects the state of P0.4/MOSI/SDATA pin. It can be written or read.
This bit reflects the state of P0.3/CF2 pin. It can be written or read.
This bit reflects the state of P0.2/CF1 pin. It can be written or read.
This bit reflects the state of P0.1/FP19/RTCCAL pin. It can be written or read.
This bit reflects the state of BCTRL/INT1/P0.0 pin. It can be written or read.
6
5
4
3
2
CF2
CF1
1
0
INT1
1 When an alternate function is chosen for a pin of this port, the bit controlling this pin should always be set.
Table 160. Port 1 SFR (P1, 0x90)
Bit
Address
0x97
0x96
0x95
0x94
0x93
0x92
0x91
0x90
Mnemonic
Default
Description1
7
6
5
1
1
1
1
1
1
1
1
This bit reflects the state of P1.7/FP20 pin. It can be written or read.
This bit reflects the state of P1.6/FP21 pin. It can be written or read.
This bit reflects the state of P1.5/FP22 pin. It can be written or read.
This bit reflects the state of P1.4/T2/FP23 pin. It can be written or read.
This bit reflects the state of P1.3/T2EX/FP24 pin. It can be written or read.
This bit reflects the state of P1.2/FP25/ZX pin. It can be written or read.
This bit reflects the state of P1.1/TxD pin. It can be written or read.
This bit reflects the state of P1.0/RxD pin. It can be written or read.
4
T2
3
2
1
0
T2EX
ZX1
TxD
RxD
1 When an alternate function is chosen for a pin of this port, the bit controlling this pin should always be set.
Table 161. Port 2 SFR (P2, 0xA0)
Bit
Address
0x97 to 0x94
0x93
Mnemonic
Default
Description1
7 to 4
0x1F
These bits are unused and should remain set.
3
2
1
0
P2.3
P2.2
P2.1
P2.0
1
1
1
1
This bit reflects the state of SDEN/P2.3/TxD2 pin. It can be written only.
This bit reflects the state of P2.2/FP16 pin. It can be written or read.
This bit reflects the state of P2.1/FP17 pin. It can be written or read.
This bit reflects the state of P2.0/FP18 pin. It can be written or read.
0x92
0x91
0x90
1 When an alternate function is chosen for a pin of this port, the bit controlling this pin should always be set.
Rev. PrB | Page 143 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
Table 162. Port 0 Alternate Functions
Pin No. Alternate Function
Alternate Function Enable
P0.0
BCTRL external battery control input
INT1 external interrupt
Set INT1PROG[2:0] = x01 in the interrupt pins configuration SFR (INTPR, 0xFF).
Set EX1 in the Interrupt Enable SFR (IE, 0xA8).
INT1 wake-up from PSM2 operating mode
FP19 LCD segment pin
Set INT1PROG[2:0] = 11x in the interrupt pins configuration SFR (INTPR, 0xFF).
Set FP19EN in the LCD Segment Enable 2 SFR (LCDSEGE2, 0xED).
P0.1
P0.2
CF1 ADE calibration frequency output
Clear the DISCF1 bit in the ADE energy measurement internal MODE1 register
(0x0B).
P0.3
P0.4
CF2 ADE calibration frequency output
MOSI SPI data line
Clear the DISCF2 bit in the ADE energy measurement internal MODE1 register
(0x0B).
Set the SCPS bit in the configuration SFR (CFG, 0xAF) and set the SPIEN bit in
SPI Configuration SFR 2 (SPIMOD2, 0xE9).
SDATA I2C data line
Clear the SCPS bit in the configuration SFR (CFG, 0xAF) and set the I2CEN bit
in the I2C mode SFR (I2CMOD, 0xE8).
P0.5
P0.6
MISO SPI data line
Set the SCPS bit in the configuration SFR (CFG, 0xAF) and set the SPIEN bit in
SPI Configuration SFR 2 (SPIMOD2, 0xE9).
Set the ZX2 bit in the MODE3 energy measurement SFR (MODE3, 0x2B)
Zero Crossing Detection 2
SCLK serial clock for I2C or SPI
Set the I2CEN bit in the I2C mode SFR (I2CMOD, 0xE8) or the SPIEN bit in SPI
Configuration SFR 2 (SPIMOD2, 0xE9) to enable the I2C or SPI interface.
T0 Timer0 input
Set the C/T0 bit in the Timer/Counter 0 and Timer/Counter 1 mode SFR (TMOD,
0x89) to enable T0 as an external event counter.
P0.7
SS SPI slave select input for SPI in slave mode
SS SPI slave select output for SPI in master mode
T1 Timer 1 input
Set the SS_EN bit in SPI Configuration SFR 1 (SPIMOD1, 0xE8).
Set the SPIMS_b bit in SPI Configuration SFR 2 (SPIMOD2, 0xE9).
Set the C/T1 bit in the Timer/Counter 0 and Timer/Counter 1 mode SFR (TMOD,
0x89) to enable T1 as an external event counter.
RxD2 receiver data input for UART2
Set the REN2 bit in the Serial Communications Control SFR (SCON2, 0xE1).
Table 163. Port 1 Alternate Functions
Pin No. Alternate Function
Alternate Function Enable
P1.0
RxD receiver data input for UART
Set the REN bit in the serial communications control register SFR (SCON,
0x98).
Rx Edge wake-up from PSM2 operating mode
TxD transmitter data output for UART
FP25 LCD segment pin
Zero-Crossing Detection 1
FP24 LCD segment pin
T2EX Timer 2 control input
FP23 LCD segment pin
T2 Timer 2 input
Set RXPROG[1:0] = 11 in the peripheral configuration SFR (PERIPH, 0xF4).
This pin becomes TxD as soon as data is written into SBUF.
P1.1
P1.2
Set FP25EN in the LCD segment enable SFR (LCDSEGE, 0x97).
Set the ZX1 bit in the MODE3 Energy Measurement SFR (MODE3, 0x2B)
Set FP24EN in the LCD segment enable SFR (LCDSEGE, 0x97).
Set EXEN2 in the Timer/Counter 2 control SFR (T2CON, 0xC8).
P1.3
P1.4
Set FP23EN in the LCD segment enable SFR (LCDSEGE, 0x97).
Set the C/T2 bit in the Timer/Counter 2 control SFR (T2CON, 0xC8) to enable
T2 as an external event counter.
P1.5
P1.6
P1.7
FP22 LCD segment pin
FP21 LCD segment pin
FP20 LCD segment pin
Set FP22EN in the LCD segment enable SFR (LCDSEGE, 0x97).
Set FP21EN in the LCD segment enable SFR (LCDSEGE, 0x97).
Set FP20EN in the LCD segment enable SFR (LCDSEGE, 0x97).
Table 164. Port 2 Alternate Functions
Pin No. Alternate Function
Alternate Function Enable
P2.0
P2.1
P2.2
P2.3
FP18 LCD segment pin
FP17 LCD segment pin
FP16 LCD segment pin
SDEN serial download pin sampled on reset. P2.3 is
an output only. TxD2 transmitter data output for
UART2.
Set FP18EN in the LCD Segment Enable 2 SFR (LCDSEGE2, 0xED).
Set FP17EN in the LCD Segment Enable 2 SFR (LCDSEGE2, 0xED).
Set FP16EN in the LCD Segment Enable 2 SFR (LCDSEGE2, 0xED).
Enabled by default. This pin becomes TxD2 as soon as data is written into
SBUF2.
Rev. PrB | Page 144 of 148
Preliminary Technical Data
ADE5166/ADE5169/ADE5566/ADE5569
Port 1 pins also have various secondary functions as described
in Table 163. The alternate functions of Port 1 pins can be
activated only if the corresponding bit latch in the Port 1 SFR
contains a 1. Otherwise, the port pin remains at 0.
PORT 0
Port 0 is controlled directly through the bit-addressable Port 0
SFR (P0, 0x80). The weak internal pull-ups for Port 0 are
configured through the Port 0 weak pull-up enable SFR
(PINMAP0, 0xB2); they are enabled by default. The weak
internal pull-up is disabled by writing a 1 to PINMAP0.x.
PORT 2
Port 2 is a 4-bit bidirectional port controlled directly through
the bit-addressable Port 2 SFR (P2, 0xA0). Note that P2.3 can be
used as an output only. Consequently, any read operation, such
as a CPL P2.3, cannot be executed on this I/O. The weak
internal pull-ups for Port 2 are configured through the Port 2
weak pull-up enable SFR (PINMAP2, 0xB4); they are enabled
by default. The weak internal pull-up is disabled by writing a 1
to PINMAP2.x.
Port 0 pins also have various secondary functions as described
in
Table 162. The alternate functions of Port 0 pins can be
activated only if the corresponding bit latch in the Port 0 SFR
contains a 1. Otherwise, the port pin remains at 0.
PORT 1
Port 1 is an 8-bit bidirectional port controlled directly through
the bit-addressable Port 1 SFR (P1, 0x90). The weak internal
pull-ups for Port 1 are configured through the Port 1 weak pull-
up enable SFR (PINMAP1, 0xB3); they are enabled by default.
The weak internal pull-up is disabled by writing a 1 to
PINMAP1.x.
Port 2 pins also have various secondary functions as described
in Table 164. The alternate functions of Port 2 pins can be
activated only if the corresponding bit latch in the Port 2 SFR
contains a 1. Otherwise, the port pin remains at 0.
Rev. PrB | Page 145 of 148
ADE5166/ADE5169/ADE5566/ADE5569
Preliminary Technical Data
DETERMINING THE VERSION OF THE ADE5166/ADE5169/ADE5566/ADE5569
Each ADE5166/ADE5169/ADE5566/ADE5569 holds in its
internal flash registers a value that defines its version. This value
helps to determine if users have the latest version of the part.
To access this value, the following procedure can be followed:
1. Launch HyperTerminal with a 9600 baud rate.
2. Put the part in serial download mode by first holding
SDEN
to logic low then resetting the part.
SDEN
3. Hold the
pin.
RESET
4. Press and release the
pin.
5. A string should appear on the HyperTerminal containing
the part name an d version number.
Rev. PrB | Page 146 of 148
Preliminary Technical Data
OUTLINE DIMENSIONS
ADE5166/ADE5169/ADE5566/ADE5569
12.20
12.00 SQ
11.80
0.75
0.60
0.45
1.60
MAX
64
49
48
1
PIN 1
10.20
10.00 SQ
9.80
TOP VIEW
(PINS DOWN)
1.45
1.40
1.35
0.20
0.09
7°
3.5°
0°
0.08
COPLANARITY
16
33
0.15
0.05
SEATING
17
32
PLANE
VIEW A
0.27
0.22
0.17
0.50
BSC
LEAD PITCH
VIEW A
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026-BCD
Figure 97. 64-Lead Low Profile Quad Flat Package [LQFP]
(ST-64-2)
Dimensions shown in millimeters
ORDERING GUIDE
di/dt Sensor
Antitamper Interface
Temperature
VAR Flash (kB) Range
Package
Option
Model1
ADE5169ASTZF622
ADE5169ASTZF62-RL2
Package Description
64-Lead LQFP
64-Lead LQFP, Reel
Yes
Yes
Yes
Yes
Yes
Yes
62
62
−40°C to +85°C
−40°C to +85°C
ST-64-2
ST-64-2
1 All models have W + VA + rms, 5 V LCD, and RTC.
2 Z = RoHS Compliant Part.
Rev. PrB | Page 147 of 148
ADE5166/ADE5169/ADE5566/ADE5569
NOTES
Preliminary Technical Data
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent
Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
©2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07411-0-4/08(PrB)
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