ADF4150HVBCPZ [ADI]

High Voltage, Fractional-N; 高电压,小数N分
ADF4150HVBCPZ
型号: ADF4150HVBCPZ
厂家: ADI    ADI
描述:

High Voltage, Fractional-N
高电压,小数N分

信号电路 锁相环或频率合成电路
文件: 总28页 (文件大小:629K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
High Voltage, Fractional-N/  
Integer-N PLL Synthesizer  
ADF4150HV  
FEATURES  
GENERAL DESCRIPTION  
Fractional-N synthesizer and integer-N synthesizer  
High voltage charge pump: VP = 6 V to 30 V  
Tuning range: 1.0 V to 29 V (or 1 V from VP supply rails)  
RF bandwidth to 3.0 GHz  
Programmable divide-by-1/-2/-4/-8/-16 outputs  
Synthesizer power supply: 3.0 V to 3.6 V  
Programmable dual-modulus prescaler of 4/5 or 8/9  
Programmable output power level  
The ADF4150HV is a 3.0 GHz, fractional-N or integer-N  
frequency synthesizer with an integrated high voltage charge  
pump. The synthesizer can be used to drive external wideband  
VCOs directly, eliminating the need for operational amplifiers  
to achieve higher tuning voltages. This simplifies design and  
reduces cost while improving phase noise, in contrast to active  
filter topologies, which tend to degrade phase noise compared  
to passive filter topologies.  
Programmable charge pump currents  
RF output mute function  
3-wire serial interface  
The VCO frequency can be divided by 1, 2, 4, 8, or 16 to allow  
the user to generate RF output frequencies as low as 31.25 MHz.  
For applications that require isolation, the RF output stage can be  
muted. The mute function is both pin- and software-controllable.  
Analog and digital lock detect  
APPLICATIONS  
A simple 3-wire interface controls all on-chip registers. The  
charge pump operates from a power supply ranging from 6 V to  
30 V, whereas the rest of the device operates from 3.0 V to 3.6 V.  
The ADF4150HV can be powered down when not in use.  
Wireless infrastructure  
Microwave point-to-point/point-to-multipoint radios  
VSAT radios  
Test equipment  
Private land mobile radios  
FUNCTIONAL BLOCK DIAGRAM  
SDV  
AV  
DV  
V
R
SET  
DD  
DD  
DD  
P
MULTIPLEXER  
MUXOUT  
LD  
10-BIT R  
COUNTER  
÷2  
DIVIDER  
×2  
REF  
DOUBLER  
IN  
LOCK  
DETECT  
CLK  
DATA  
LE  
DATA REGISTER  
HIGH VOLTAGE  
CHARGE  
FUNCTION  
LATCH  
CP  
OUT  
PUMP  
PHASE  
COMPARATOR  
BOOST  
MODE  
CURRENT  
SETTING  
RF  
RF  
+
OUT  
OUT  
OUTPUT  
STAGE  
DIVIDE-BY-1/  
-2/-4/-8/-16  
INTEGER  
VALUE  
FRACTION  
VALUE  
MODULUS  
VALUE  
PDB  
RF  
THIRD-ORDER  
FRACTIONAL  
INTERPOLATOR  
RF  
+
RF  
INPUT  
IN  
MULTIPLEXER  
RF  
IN  
N COUNTER  
ADF4150HV  
CE  
GND  
CP  
SD  
GND  
GND  
Figure 1.  
Rev. 0  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rights of third parties that may result from its use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks and registeredtrademarks arethe property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.461.3113  
www.analog.com  
©2011 Analog Devices, Inc. All rights reserved.  
 
ADF4150HV  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Register 1 ..................................................................................... 17  
Register 2 ..................................................................................... 17  
Register 3 ..................................................................................... 19  
Register 4 ..................................................................................... 19  
Register 5 ..................................................................................... 19  
Register Initialization Sequence ............................................... 19  
RF Synthesizer—A Worked Example ...................................... 20  
Reference Doubler and Reference Divider ............................. 20  
12-Bit Programmable Modulus................................................ 20  
Spurious Optimization and Boost Mode ................................ 21  
Spur Mechanisms ....................................................................... 21  
Spur Consistency and Fractional Spur Optimization ........... 21  
Phase Resync............................................................................... 22  
Applications Information.............................................................. 23  
Ultrawideband PLL.................................................................... 23  
Microwave PLL........................................................................... 23  
Generating the High Voltage Supply ....................................... 24  
Interfacing to the ADuC702x and the ADSP-BF527............. 25  
PCB Design Guidelines for a Chip Scale Package ................. 25  
Output Matching........................................................................ 26  
Outline Dimensions....................................................................... 27  
Ordering Guide .......................................................................... 27  
Applications....................................................................................... 1  
General Description......................................................................... 1  
Functional Block Diagram .............................................................. 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Timing Characteristics ................................................................ 5  
Absolute Maximum Ratings............................................................ 6  
Transistor Count........................................................................... 6  
Thermal Resistance ...................................................................... 6  
ESD Caution.................................................................................. 6  
Pin Configuration and Function Descriptions............................. 7  
Typical Performance Characteristics ............................................. 9  
Circuit Description......................................................................... 11  
Reference Input Section............................................................. 11  
RF N Divider............................................................................... 11  
Phase Frequency Detector (PFD) and High Voltage  
Charge Pump .............................................................................. 11  
MUXOUT and Lock Detect...................................................... 12  
Input Shift Registers................................................................... 12  
Program Modes .......................................................................... 12  
Output Stage................................................................................ 12  
Register Maps.................................................................................. 13  
Register 0 ..................................................................................... 17  
REVISION HISTORY  
8/11—Revision 0: Initial Version  
Rev. 0 | Page 2 of 28  
 
ADF4150HV  
SPECIFICATIONS  
AVDD = DVDD = SDVDD = 3.3 V ꢀ10% VP = 6.1 V to 31 V% GND = 1 V% TA = TMIN to TMAX, unless otherwise noted. Operating temperature  
range is −41°C to +85°C.  
Table 1.  
Parameter  
Min  
Typ  
Max  
Unit  
Test Conditions/Comments  
REFIN CHARACTERISTICS  
Input Frequency  
10  
10  
300  
30  
MHz  
MHz  
For f < 10 MHz, ensure slew rate > 21 V/μs  
Reference doubler enabled (DB25 bit in  
Register 2 is set to 1)  
Input Sensitivity  
Input Capacitance  
Input Current  
0.7  
0.5  
AVDD  
5.0  
±±0  
V p-p  
pF  
μA  
Biased at AVDD/2; ac coupling ensures AVDD/2 bias  
RF INPUT CHARACTERISTICS  
For lower RFIN frequencies, ensure slew  
rate > 400 V/μs  
−10 dBm ≤ RF input power ≤ +5 dBm  
RF Input Frequency (RFIN)  
Prescaler Output Frequency  
PHASE DETECTOR  
3.0  
750  
GHz  
MHz  
Phase Detector Frequency  
2±  
20  
2±  
MHz  
MHz  
MHz  
Low noise mode  
Low spur mode  
Integer-N mode  
HIGH VOLTAGE CHARGE PUMP  
ICP Sink/Source  
High Value  
384  
48  
μA  
μA  
kΩ  
μA  
μA  
%
%
%
%
nA  
RSET = 5.1 kΩ  
RSET = 5.1 kΩ  
Low Value  
RSET Range  
High Value vs. RSET  
3.3  
19±  
10  
RSET = 10 kΩ  
RSET = 3.3 kΩ  
1.0 V ≤ VCP ≤ (VP − 1.0 V); VP = ± V to 30 V  
594  
Sink and Source Current Matching  
Absolute ICP Accuracy  
ICP vs. VCP  
ICP vs. Temperature  
ICP Leakage  
±
3
2.5  
2.5  
2.5  
1.0 V ≤ VCP ≤ (VP − 1.0 V)  
VCP = VP/2  
VCP = VP/2  
LOGIC INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current, IINH/IINL  
Input Capacitance, CIN  
LOGIC OUTPUTS  
2.0  
V
V
μA  
pF  
0.±  
±1  
15.0  
Output High Voltage, VOH  
Output High Current, IOH  
Output Low Voltage, VOL  
POWER SUPPLIES  
AVDD  
DVDD − 0.4  
V
μA  
V
CMOS output selected  
IOL = 500 μA  
500  
0.4  
3.0  
±.0  
3.±  
30  
V
V
V
DVDD, SDVDD  
VP  
AVDD  
Set the VP supply at least 1 V above the  
maximum desired tuning voltage  
IP  
1
50  
± to 24  
20  
1
2.5  
±0  
mA  
mA  
mA  
mA  
μA  
VP = 30 V  
1
DIDD + AIDD  
Current per Output Divider  
IRFOUT  
Each output divide-by-2 consumes ± mA typ  
RF output stage is programmable  
2
32  
Low Power Sleep Mode  
Rev. 0 | Page 3 of 28  
 
ADF4150HV  
Parameter  
Min  
Typ  
Max  
Unit  
Test Conditions/Comments  
RF OUTPUT CHARACTERISTICS  
Output Frequency Using RF Output  
Dividers  
31.25  
MHz  
500 MHz VCO input and divide-by-16 selected  
Harmonic Content (Second)  
−19  
−20  
−13  
−10  
−4  
dBc  
dBc  
dBc  
dBc  
dBm  
dBm  
dB  
Fundamental VCO output  
Divided VCO output  
Fundamental VCO output  
Divided VCO output  
Programmable in 3 dB steps  
Programmable in 3 dB steps  
Pull-up supply on Pin 18 and Pin 19 varied  
from 3.0 V to 3.6 V  
Harmonic Content (Third)  
Minimum RF Output Power2  
Maximum RF Output Power2  
Output Power Variation vs. Supply  
5
1
Output Power Variation vs. Temperature  
Level of Signal with RF Mute Enabled  
NOISE CHARACTERISTICS  
1
−37  
dB  
dBm  
From −40°C to +85°C  
PDBRF pin brought low; RF = 2 GHz  
Normalized In-Band Phase Noise  
−213  
dBc/Hz  
Low noise mode  
3
Floor (PNSYNTH  
)
−203  
−113  
−108  
−155  
−70  
dBc/Hz  
dBc/Hz  
dBc/Hz  
dBc/Hz  
dBc  
Low spur mode  
Low noise mode  
Low spur mode  
Measured at 10 MHz offset  
At RFOUT+/RFOUT− pins  
At VCO output  
Normalized 1/f Noise (PN1_f)4  
RF Output Divider Noise Floor  
Spurious Signals Due to PFD Frequency  
−85  
dBc  
1 TA = 25°C; AVDD = DVDD = 3.3 V; prescaler = 8/9; fREFIN = 100 MHz; fPFD = 25 MHz; fRF = 1.75 GHz.  
2 Using 50 Ω resistors to AVDD, into a 50 Ω load.  
3 This figure can be used to calculate phase noise for any application. To calculate in-band phase noise performance as seen at the VCO output, use the following formula:  
PNSYNTH = PNTOT − 10 log(fPFD) − 20 log N.  
4 The PLL phase noise is composed of flicker (1/f) noise plus the normalized PLL noise floor. The flicker noise is specified at a 10 kHz offset and normalized to 1 GHz. The  
formula for calculating the 1/f noise contribution at an RF frequency (fRF) and at a frequency offset (f) is given by PN = PN1_f + 10 log(10 kHz/f) + 20 log(fRF/1 GHz). Both  
the normalized phase noise floor and flicker noise are modeled in ADIsimPLL.  
Rev. 0 | Page 4 of 28  
ADF4150HV  
TIMING CHARACTERISTICS  
AVDD = DVDD = SDVDD = 3.3 V 10ꢀ% VP = 6.0 V to 30 V% GND = 0 V% TA = TMIN to TMAX, unless otherwise noted. Operating temperature  
range is −40°C to +85°C.  
Table 2.  
Parameter  
Limit  
20  
10  
10  
25  
25  
10  
20  
Unit  
Description  
t1  
t2  
t3  
t4  
t5  
t6  
t7  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
LE setup time  
DATA to CLK setup time  
DATA to CLK hold time  
CLK high duration  
CLK low duration  
CLK to LE setup time  
LE pulse width  
Timing Diagram  
t4  
t5  
CLK  
t2  
t3  
DB2  
(CONTROL BIT C3)  
DB1  
DB0 (LSB)  
(CONTROL BIT C1)  
DB31 (MSB)  
DB30  
DATA  
LE  
(CONTROL BIT C2)  
t7  
t1  
t6  
LE  
Figure 2. Timing Diagram  
Rev. 0 | Page 5 of 28  
 
 
 
ADF4150HV  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted.  
TRANSISTOR COUNT  
The transistor count for the ADF4150HV is 23,380 (CMOS)  
and 809 (bipolar).  
Table 3.  
Parameter  
AVDD to GND1  
AVDD to DVDD  
VP to GND1  
Digital I/O Voltage to GND1  
Analog I/O Voltage to GND1  
REFIN to GND1  
Operating Temperature Range  
Storage Temperature Range  
Maximum Junction Temperature  
Reflow Soldering  
Rating  
−0.3 V to +3.9 V  
−0.3 V to +0.3 V  
−0.3 V to +33 V  
−0.3 V to AVDD + 0.3 V  
−0.3 V to DVDD + 0.3 V  
−0.3 V to AVDD + 0.3 V  
−40°C to +85°C  
−65°C to +125°C  
150°C  
THERMAL RESISTANCE  
Thermal impedance (θJA) is specified for a device with the  
exposed pad soldered to GND.  
Table 4. Thermal Resistance  
Package Type  
θJA  
Unit  
32-Lead LFCSP (CP-32-11)  
27.3  
°C/W  
ESD CAUTION  
Peak Temperature  
Time at Peak Temperature  
260°C  
40 sec  
1 GND = CPGND = SDGND = 0 V.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only% functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Rev. 0 | Page 6 of 28  
 
 
ADF4150HV  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
GND 1  
24 GND  
23  
2
CLK  
GND  
22 DV  
DATA 3  
LE 4  
DD  
21 PDB  
ADF4150HV  
RF  
TOP VIEW  
5
6
20  
19  
18 RF  
CE  
AV  
RF  
DD  
(Not to Scale)  
V
+
P
OUT  
OUT  
GND 7  
GND 8  
17 GND  
NOTES  
1. THE LFCSP HAS AN EXPOSED PAD  
THAT MUST BE CONNECTED TO GND.  
Figure 3. Pin Configuration  
Table 5. Pin Function Descriptions  
Pin No. Mnemonic Description  
Ground. All ground pins should be tied together.  
1, 7, 8, 12, 16, 17, GND  
23, 24, 30, 32  
2
3
4
5
6
CLK  
DATA  
LE  
Serial Clock Input. Data is clocked into the 32-bit shift register on the CLK rising edge. This input is a high  
impedance CMOS input.  
Serial Data Input. The serial data is loaded MSB first with the three LSBs as the control bits. This input is a  
high impedance CMOS input.  
Load Enable. When LE goes high, the data stored in the 32-bit shift register is loaded into the register  
that is selected by the three control bits. This input is a high impedance CMOS input.  
Chip Enable. A logic low on this pin powers down the device and puts the charge pump into three-state  
mode. A logic high on this pin powers up the device.  
High Voltage Charge Pump Power Supply. Place decoupling capacitors to the ground plane as close to  
this pin as possible. The decoupling capacitors should have the appropriate voltage rating (a value of  
10 μF is recommended). Care should be taken to ensure that VP does not exceed the absolute maximum  
ratings on power-up (see Table 3). A 10 Ω series resistor can help to significantly reduce voltage overshoot  
with minimal IR drop.  
CE  
VP  
9
CPOUT  
High Voltage Charge Pump Output. When enabled, this output provides ICP to the external passive loop  
filter. The output of the loop filter is connected to the voltage tuning port of the external VCO.  
10  
11, 13, 20  
CPGND  
AVDD  
High Voltage Charge Pump Ground. All ground pins should be tied together.  
Analog Power Supply. This pin ranges from 3.0 V to 3.6 V. Place decoupling capacitors to the ground  
plane as close to this pin as possible. AVDD must have the same value as DVDD.  
14  
15  
RFIN+  
RFIN−  
Positive RF Input. The output of the VCO or external prescaler should be ac-coupled to this pin.  
Complementary RF Input. If a single-ended input is required, this pin can be tied to ground via a 100 pF  
capacitor.  
18  
19  
RFOUT  
RFOUT  
Divided-Down Output of RFIN−. This pin can be left unconnected if the divider functionality is not  
required.  
Divided-Down Output of RFIN+. This pin can be left unconnected if the divider functionality is not  
required.  
+
21  
22  
PDBRF  
DVDD  
RF Power-Down. A logic low on this pin mutes the RF outputs. This function is also software controllable.  
Digital Power Supply. Place decoupling capacitors to the ground plane as close to this pin as possible.  
DVDD must have the same value as AVDD.  
25  
26  
REFIN  
LD  
Reference Input. This CMOS input has a nominal threshold of AVDD/2 and a dc equivalent input resistance  
of 100 kΩ. This input can be driven from a crystal oscillator, TCXO, or other reference.  
Lock Detect Output. A logic high output on this pin indicates PLL lock. A logic low output indicates loss  
of PLL lock.  
Rev. 0 | Page 7 of 28  
 
ADF4150HV  
Pin No.  
Mnemonic  
Description  
27  
MUXOUT  
Multiplexer Output. The multiplexer output allows the lock detect, the N divider value, or the R counter  
value to be accessed externally.  
28  
SDVDD  
Digital Σ-Δ Modulator Power Supply. Place decoupling capacitors to the ground plane as close to this  
pin as possible. SDVDD must have the same value as AVDD.  
29  
31  
SDGND  
RSET  
Digital Σ-Δ Modulator Ground. All ground pins should be tied together.  
Connecting a resistor between this pin and GND sets the charge pump output current. Place the resistor  
as close to this pin as possible. The nominal voltage bias at the RSET pin is 0.55 V. The relationship between  
I
CP and RSET is as follows:  
ICP = 1.96/RSET  
where:  
RSET = 5.1 kΩ.  
ICP = 384 μA.  
EP  
Exposed Pad  
Exposed Pad. The LFCSP has an exposed pad that must be connected to GND.  
Rev. 0 | Page 8 of 28  
ADF4150HV  
TYPICAL PERFORMANCE CHARACTERISTICS  
600  
550  
500  
450  
400  
350  
300  
250  
200  
150  
16  
14  
12  
10  
8
V
V
V
V
V
V
V
V
= 6V MISMATCH (%)  
= 9V MISMATCH (%)  
= 12V MISMATCH (%)  
= 15V MISMATCH (%)  
= 18V MISMATCH (%)  
= 21V MISMATCH (%)  
= 24V MISMATCH (%)  
= 28V MISMATCH (%)  
P
P
P
P
P
P
P
P
I
I
I
I
I
I
I
= 400µA SOURCE  
= 350µA SOURCE  
= 300µA SOURCE  
= 250µA SOURCE  
= 200µA SOURCE  
= 150µA SOURCE  
= 100µA SOURCE  
= 50µA SOURCE  
CP  
CP  
CP  
CP  
CP  
CP  
CP  
6
4
2
100  
50  
I
0
CP  
0
–50  
–2  
–4  
–6  
–8  
–10  
–12  
–14  
–16  
I
I
= 50µA SINK  
CP  
CP  
= 100µA SINK  
= 150µA SINK  
= 200µA SINK  
= 250µA SINK  
= 300µA SINK  
= 350µA SINK  
= 400µA SINK  
–100  
–150  
–200  
–250  
–300  
–350  
–400  
–450  
–500  
I
I
I
I
I
I
CP  
CP  
CP  
CP  
CP  
CP  
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28  
(V)  
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28  
(V)  
V
V
CP  
CP  
Figure 4. Charge Pump Output Characteristics, VP = 28 V,  
ICP Varied from 50 μA to 400 μA, RSET = 5.1 kΩ  
Figure 7. Charge Pump Output Mismatch vs. VP, ICP = 200 μA  
–40  
–80  
–85  
–90  
ADF4150HV  
200kHz  
400kHz  
600kHz  
800kHz  
RMS NOISE = 0.28°  
–50  
–60  
ADF4156  
RMS NOISE = 0.36°  
–95  
BEAT NOTE  
SPUR  
BEAT NOTE  
SPUR  
–100  
–105  
–110  
–115  
–120  
–125  
–130  
–135  
–140  
–145  
–150  
–155  
–160  
–165  
–170  
–70  
–80  
–90  
–100  
–110  
–120  
–130  
1500  
1505  
1510  
1515  
1520  
1525  
100  
1k  
10k  
100k  
1M  
10M  
100M  
FREQUENCY (MHz)  
FREQUENCY (Hz)  
Figure 8. Fractional Spur Levels vs. Frequency, Low Spur Mode;  
Measured at VCO Output, PFD = 25 MHz, MOD = 125  
Figure 5. Active Filter Phase Noise, ADF4150HV vs. ADF4156;  
Active Filter Implemented Using OP27 Op Amp; PFD = 20 MHz, Loop  
Bandwidth = 10 kHz, ICP = 300 μA, Carrier Frequency = 1.7 GHz, VP = 28 V  
–40  
2.0  
200kHz  
400kHz  
600kHz  
800kHz  
–50  
–60  
1.9  
1.8  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
BOOST MODE ON  
–70  
BOOST MODE OFF  
–80  
–90  
–100  
–110  
–120  
–130  
0
50  
100  
150  
200  
250  
300  
1500  
1505  
1510  
1515  
1520  
1525  
TIME (µs)  
FREQUENCY (MHz)  
Figure 6. PLL Lock Time with Boost Mode On and Off;  
Locking over Octave Range Jump (1 GHz to 2 GHz) for PFD = 20 MHz,  
Figure 9. Fractional Spur Levels vs. Frequency, Low Noise Mode;  
Measured at VCO Output, PFD = 25 MHz, MOD = 125  
Loop Bandwidth = 100 kHz, ICP = 300 μA, VP = 28 V, VDD = 3.3 V, REFIN = 100 MHz  
Rev. 0 | Page 9 of 28  
 
 
 
ADF4150HV  
–40  
–80  
–85  
25MHz  
50MHz  
75MHz  
100MHz  
–50  
–60  
LOW SPUR MODE  
–90  
–70  
–80  
–95  
–90  
–100  
–105  
–110  
–100  
–110  
–120  
LOW NOISE MODE  
1000  
1200  
1400  
1600  
1800  
2000  
1000  
1050  
1100  
1150  
1200  
1250  
1300  
FREQUENCY (MHz)  
FREQUENCY (MHz)  
Figure 10. PFD and Reference Spur Levels vs. Frequency at VCO Output,  
REFIN = 100 MHz, PFD = 25 MHz  
Figure 12. In-Band Phase Noise Measured at 3 kHz Offset for Low Noise Mode  
and Low Spur Mode, PFD = 25 MHz, PLL Loop Bandwidth = 40 kHz  
–40  
4
25MHz  
50MHz  
75MHz  
100MHz  
2
0
+5dBm  
+2dBm  
–50  
–60  
–2  
–70  
–4  
–1dBm  
–4dBm  
–80  
–6  
–8  
–90  
–10  
–12  
–14  
–16  
–100  
–110  
–120  
1000  
1200  
1400  
1600  
1800  
2000  
0
500  
1000  
1500  
2000  
2500  
FREQUENCY (MHz)  
FREQUENCY (MHz)  
Figure 11. PFD and Reference Spur Levels vs. Frequency at VCO Output  
with ADL5541 Buffer Placed Between VCO Output and RF Input,  
REFIN = 100 MHz, PFD = 25 MHz  
Figure 13. Single-Ended RF Output Power Level vs. Frequency and  
Power Setting, RF Output Pins Pulled Up to 3.3 V via 27 nH||50 Ω  
Rev. 0 | Page 10 of 28  
 
ADF4150HV  
CIRCUIT DESCRIPTION  
The PFD frequency (fPFD) equation is  
PFD = REFIN × [(1 + D)/(R × (1 + T))]  
REFERENCE INPUT SECTION  
f
(2)  
The reference input stage is shown in Figure 14. The SW1 and  
SW2 switches are normally closed. The SW3 switch is normally  
open. When power-down is initiated, SW3 is closed, and SW1  
and SW2 are opened. In this way, no loading of the REFIN pin  
occurs during power-down.  
where:  
REFIN is the reference input frequency.  
D is the REFIN doubler bit.  
R is the preset divide ratio of the binary 10-bit programmable  
reference counter (1 to 1023).  
POWER-DOWN  
CONTROL  
T is the REFIN divide-by-2 bit (0 or 1).  
100k  
SW2  
NC  
Integer-N Mode  
TO R COUNTER  
REF  
NC  
IN  
If FRAC = 0 and the DB8 (LDF) bit in Register 2 is set to 1,  
the synthesizer operates in integer-N mode. The DB8 bit in  
Register 2 should be set to 1 for integer-N digital lock detect.  
BUFFER  
SW1  
NO  
SW3  
R Counter  
Figure 14. Reference Input Stage  
The 10-bit R counter allows the input reference frequency  
(REFIN) to be divided down to produce the reference clock  
to the PFD. Division ratios from 1 to 1023 are allowed.  
RF N DIVIDER  
The RF N divider allows a division ratio in the PLL feedback  
path. The division ratio is determined by the INT, FRAC, and  
MOD values, which build up this divider (see Figure 15).  
PHASE FREQUENCY DETECTOR (PFD) AND HIGH  
VOLTAGE CHARGE PUMP  
RF N DIVIDER  
N = INT + FRAC/MOD  
The phase frequency detector (PFD) takes inputs from the  
R counter and N counter and produces an output proportional  
to the phase and frequency difference between them. Figure 16  
is a simplified schematic of the phase frequency detector.  
FROM  
VCO OUTPUT/  
OUTPUT DIVIDERS  
TO PFD  
N COUNTER  
THIRD-ORDER  
FRACTIONAL  
INTERPOLATOR  
UP  
HIGH  
D1  
Q1  
U1  
CLR1  
INT  
VALUE  
MOD  
VALUE  
FRAC  
VALUE  
+IN  
CHARGE  
PUMP  
CP  
U3  
DELAY  
DOWN  
OUT  
Figure 15. RF N Divider  
INT, FRAC, MOD, and R Counter Relationship  
The INT, FRAC, and MOD values, in conjunction with the  
R counter, make it possible to generate output frequencies that  
are spaced by fractions of the PFD frequency. For more informa-  
tion, see the RF Synthesizer—A Worked Example section.  
CLR2  
D2 Q2  
HIGH  
U2  
–IN  
Figure 16. PFD Simplified Schematic  
The RF VCO frequency (RFOUT) equation is  
The PFD includes a delay element that sets the width of the  
antibacklash pulse to 4.2 ns. This pulse ensures that there is  
no dead zone in the PFD transfer function and provides a  
consistent reference spur level.  
RFOUT = (fPFD/RF Divider) × [INT + (FRAC/MOD)]  
where:  
RFOUT is the output frequency of the external voltage controlled  
oscillator (VCO).  
RF Divider is the output divider that divides down the VCO  
frequency.  
INT is the preset divide ratio of the binary 16-bit counter (23 to  
32,767 for the 4/5 prescaler, 75 to 65,535 for the 8/9 prescaler).  
FRAC is the numerator of the fractional division (0 to MOD − 1).  
MOD is the preset fractional modulus (2 to 4095).  
(1)  
The high voltage charge pump is designed on an Analog  
Devices, Inc., proprietary high voltage process and allows the  
charge pump to output voltages as high as 29 V when powered  
by a 30 V supply. The high voltage charge pump removes the  
need for active filtering when interfacing to a high voltage VCO.  
Rev. 0 | Page 11 of 28  
 
 
 
 
 
ADF4150HV  
MUXOUT AND LOCK DETECT  
PROGRAM MODES  
The multiplexer output on the ADF4150HV allows the user to  
access various internal points on the chip. The state of MUXOUT is  
controlled by the M3, M2, and M1 bits in Register 2 (see Figure 22).  
Figure 17 shows the MUXOUT section in block diagram form.  
Table 6 and Figure 19 through Figure 25 show how the program  
modes are set up in the ADF4150HV.  
The following settings in the ADF4150HV are double buffered:  
phase value, modulus value, reference doubler, reference divide-  
by-2, R counter value, and charge pump current setting. Before  
the part uses a new value for any double-buffered setting, the  
following two events must occur:  
R COUNTER INPUT  
DV  
DD  
THREE-STATE-OUTPUT  
DV  
DD  
1. The new value is latched into the device by writing to the  
appropriate register.  
2. A new write is performed on Register 0 (R0).  
GND  
R COUNTER OUTPUT  
N COUNTER OUTPUT  
ANALOG LOCK DETECT  
MUXOUT  
MUX  
CONTROL  
For example, any time that the modulus value is updated,  
Register 0 (R0) must be written to, to ensure that the modulus  
value is loaded correctly. The divider select value in Register 4  
(R4) is also double buffered, but only if the DB13 bit of  
Register 2 (R2) is high.  
DIGITAL LOCK DETECT  
RESERVED  
GND  
Figure 17. MUXOUT Schematic  
OUTPUT STAGE  
INPUT SHIFT REGISTERS  
The RFOUT+ and RFOUT− pins of the ADF4150HV are connected  
to the collectors of an NPN differential pair driven by buffered  
outputs of the VCO, as shown in Figure 18. To allow the user to  
optimize the power dissipation vs. output power requirements,  
the tail current of the differential pair is programmable using  
Bits[DB4:DB3] in Register 4 (R4). Four current levels can be set.  
These levels give output power levels of −4 dBm, −1 dBm, +2 dBm,  
and +5 dBm, respectively, using a 50 Ω resistor to AVDD and ac  
coupling into a 50 Ω load. Alternatively, both outputs can be  
combined in a 1 + 1:1 transformer or a 180° microstrip coupler  
(see the Output Matching section). If the outputs are used  
individually, the optimum output stage consists of a shunt  
inductor to AVDD.  
The ADF4150HV digital section includes a 10-bit RF R counter,  
a 16-bit RF N counter, a 12-bit FRAC counter, and a 12-bit  
modulus counter. Data is clocked into the 32-bit shift register  
on each rising edge of CLK. The data is clocked in MSB first.  
Data is transferred from the shift register to one of six latches  
on the rising edge of LE. The destination latch is determined by  
the state of the three control bits (C3, C2, and C1) in the shift  
register. As shown in Figure 2, the control bits are the three LSBs:  
DB2, DB1, and DB0. The truth table for these bits is shown in  
Table 6. Figure 19 summarizes how the latches are programmed.  
Table 6. Truth Table for C3, C2, and C1 Control Bits  
Control Bits  
RF  
+
RF  
C3  
0
0
0
0
C2  
0
0
1
1
C1  
0
1
0
1
Register  
OUT  
OUT  
Register 0 (R0)  
Register 1 (R1)  
Register 2 (R2)  
Register 3 (R3)  
Register 4 (R4)  
Register 5 (R5)  
BUFFER/  
DIVIDE-BY-1/-2/-4/-8/-16  
VCO  
1
1
0
0
0
1
Figure 18. Output Stage  
Another feature of the ADF4150HV is that the supply current to  
the RF output stage can be shut down until the part achieves lock,  
as measured by the digital lock detect circuitry. This feature is  
enabled by the mute-till-lock detect (MTLD) bit in Register 4 (R4).  
Rev. 0 | Page 12 of 28  
 
 
 
 
ADF4150HV  
REGISTER MAPS  
REGISTER 0  
CONTROL  
BITS  
16-BIT INTEGER VALUE (INT)  
12-BIT FRACTIONAL VALUE (FRAC)  
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
0
N16 N15 N14 N13 N12 N11 N10  
N9  
N8  
N7  
N6  
N5  
N4  
N3  
N2  
N1  
F12 F11  
F10  
F9  
F8  
F7  
F6  
F5  
F4  
F3  
F2  
F1 C3(0) C2(0) C1(0)  
REGISTER 1  
CONTROL  
BITS  
1
1
RESERVED  
12-BIT PHASE VALUE (PHASE)  
12-BIT MODULUS VALUE (MOD)  
DBR  
DBR  
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
PR1 P12 P11 P10 P9 P8 P7 P6 P5 P4 P3 P2 P1 M12 M11 M10 M9 M8 M7 M6 M5 M4 M3 M2 M1 C3(0) C2(0) C1(1)  
0
0
0
0
REGISTER 2  
1
DBR  
CHARGE  
PUMP  
CURRENT  
SETTING  
LOW  
NOISE AND  
LOW SPUR  
MODES  
1
CONTROL  
BITS  
MUXOUT  
10-BIT R COUNTER  
DBR  
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
0
L2  
L1  
M3  
M2  
M1 RD2 RD1 R10  
R9  
R8  
R7  
R6  
R5  
R4  
R3  
R2  
R1  
D1  
0
CP3 CP2 CP1 U6  
U5  
1
U3  
U2  
U1 C3(0) C2(1) C1(0)  
REGISTER 3  
CLK  
DIV  
MODE  
RESERVED  
CONTROL  
BITS  
12-BIT CLOCK DIVIDER VALUE  
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
0
0
0
0
0
0
0
0
0
0
0
0
0
B1  
0
C2  
C1  
D12 D11 D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1 C3(0) C2(1) C1(1)  
REGISTER 4  
2
DBB  
DIVIDER  
SELECT  
OUTPUT  
POWER  
RESERVED  
CONTROL  
BITS  
RESERVED  
RESERVED  
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
0
0
0
0
0
0
0
0
D13 D12 D11 D10  
0
0
0
0
0
0
0
0
0
D8  
0
0
0
0
D3  
D2  
D1 C3(1) C2(0) C1(0)  
REGISTER 5  
LD PIN  
MODE  
CONTROL  
BITS  
RESERVED  
RESERVED  
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
ABP2 ABP1 CE1 D15 D14 C3(1) C2(0) C1(1)  
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
2
DBR = DOUBLE BUFFERED REGISTER—BUFFERED BY THE WRITE TO REGISTER 0.  
DBB = DOUBLE BUFFERED BITS—BUFFERED BY THE WRITE TO REGISTER 0, IF AND ONLY IF DB13 OF REGISTER 2 IS HIGH.  
Figure 19. Register Summary  
Rev. 0 | Page 13 of 28  
 
 
ADF4150HV  
CONTROL  
BITS  
16-BIT INTEGER VALUE (INT)  
12-BIT FRACTIONAL VALUE (FRAC)  
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
0
N16  
N15 N14 N13  
N12  
N11  
N10  
N9  
N8  
N7  
N6  
N5  
N4  
N3  
N2  
N1  
F12  
F11  
F10  
F9  
F8  
F7  
F6  
F5  
F4  
F3  
F2  
F1 C3(0) C2(0) C1(0)  
F12  
F11 ...  
F2  
F1  
FRACTIONAL VALUE (FRAC)  
N16  
N15  
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
N5  
N4  
N3  
N2  
N1  
INTEGER VALUE (INT)  
0
0
0
0
.
0
0
0
0
.
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
0
0
1
1
.
0
1
0
1
.
0
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
1
.
0
1
0
.
NOT ALLOWED  
1
NOT ALLOWED  
2
NOT ALLOWED  
3
...  
.
0
0
0
.
0
0
0
.
1
1
1
.
0
0
1
.
1
1
0
.
1
1
0
.
0
1
0
.
NOT ALLOWED  
.
.
.
.
.
23  
24  
.
.
.
.
.
...  
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
4092  
4093  
4094  
4095  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
0
1
65,533  
65,534  
65,535  
INTmin = 75 WITH PRESCALER = 8/9  
Figure 20. Register 0 (R0)  
CONTROL  
BITS  
RESERVED  
12-BIT PHASE VALUE (PHASE)  
DBR  
12-BIT MODULUS VALUE (MOD)  
DBR  
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
0
0
0
0
PR1  
P12  
P11  
P10  
P9  
P8  
P7  
P6  
P5  
P4  
P3  
P2  
P1  
M12 M11  
M10  
M9  
M8  
M7 M6  
M5  
M4  
M3  
M2  
M1 C3(0) C2(0) C1(1)  
P1  
0
PRESCALER  
P12  
P11  
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
P2  
0
0
1
1
.
P1  
0
1
0
1
.
PHASE VALUE (PHASE)  
M12  
M11  
...  
M2  
M1  
INTERPOLATOR MODULUS (MOD)  
4/5  
8/9  
0
0
0
0
.
0
0
0
0
.
0
0
0
.
0
0
.
...  
...  
...  
...  
...  
...  
...  
...  
...  
1
1
.
0
1
.
2
1
3
1 (RECOMMENDED)  
.
2
.
.
.
.
.
3
.
.
.
.
.
.
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
4092  
4093  
4094  
4095  
.
.
.
.
.
.
.
.
.
.
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
4092  
4093  
4094  
4095  
Figure 21. Register 1 (R1)  
Rev. 0 | Page 14 of 28  
 
 
ADF4150HV  
DBR  
CHARGE  
PUMP  
CURRENT  
SETTING  
LOW  
NOISE AND  
LOW SPUR  
MODES  
CONTROL  
BITS  
MUXOUT  
10-BIT R COUNTER  
DBR  
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
0
L2  
L1  
M3  
M2  
M1 RD2 RD1 R10  
R9  
R8  
R7  
R6  
R5  
R4  
R3  
R2  
R1  
D1  
0
CP3 CP2 CP1 U6  
U5  
1
U3  
U2  
U1 C3(0) C2(1) C1(0)  
REFERENCE  
RD2  
COUNTER  
RESET  
DOUBLE BUFFER  
R4[DB22:DB20]  
U1  
L2  
0
L1  
NOISE MODE  
DOUBLER  
D1  
U6  
0
LDF  
0
1
DISABLED  
ENABLED  
0
1
0
1
LOW NOISE MODE  
RESERVED  
FRAC-N  
INT-N  
0
1
DISABLED  
ENABLED  
0
1
DISABLED  
ENABLED  
0
1
1
RESERVED  
RD1 REFERENCE DIVIDE-B Y-2  
CP  
I
(µA)  
1
LOW SPUR MODE  
CP  
U2  
U5  
LDP  
THREE-STATE  
0
1
DISABLED  
ENABLED  
5.1k  
CP3  
CP2  
0
CP1  
0
1
10ns  
6ns  
0
1
DISABLED  
0
0
0
0
1
1
1
1
0
1
0
1
0
1
0
1
48  
0
96  
ENABLED  
1
144  
192  
240  
288  
336  
384  
R10  
R9  
...  
R2  
R1  
R COUNTER (R)  
1
U3  
POWER-DOWN  
RESERVED  
BIT  
0
0
.
0
0
.
...  
...  
...  
...  
...  
...  
...  
...  
...  
0
1
.
1
0
.
1
0
0
1
DISABLED  
ENABLED  
0
2
0
1
RESERVED  
1
.
NORMAL  
OPERATION  
1
.
.
.
.
.
.
.
.
.
.
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
1020  
1021  
1022  
1023  
M3  
M2  
0
M1  
0
OUTPUT  
0
0
0
0
1
1
1
1
THREE-STATE OUTPUT  
0
1
DV  
DD  
1
0
GND  
1
1
R COUNTER OUTPUT  
N DIVIDER OUTPUT  
0
0
0
1
ANALOG LOCK DETECT  
DIGITAL LOCK DETECT  
RESERVED  
1
0
1
1
Figure 22. Register 2 (R2)  
CLK  
DIV  
MODE  
CONTROL  
BITS  
RESERVED  
12-BIT CLOCK DIVIDER VALUE  
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
0
0
0
0
0
0
0
0
0
0
B1  
0
C2  
C1  
D12 D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1 C3(0) C2(1) C1(1)  
0
0
0
D12  
D11 ...  
D2  
D1  
CLOCK DIVIDER VALUE  
BOOST  
ENABLE  
B1  
0
0
0
0
.
0
0
0
0
.
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
0
0
1
1
.
0
1
0
1
.
0
0
1
DISABLED  
ENABLED  
1
2
3
.
.
.
.
.
.
C2  
C1  
0
CLOCK DIVIDER MODE  
CLOCK DIVIDER OFF  
RESERVED  
.
.
.
.
.
0
0
1
1
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
4092  
4093  
4094  
4095  
1
0
RESYNC ENABLE  
RESERVED  
1
Figure 23. Register 3 (R3)  
Rev. 0 | Page 15 of 28  
 
 
ADF4150HV  
DBB  
DIVIDER  
SELECT  
OUTPUT  
POWER  
RESERVED  
CONTROL  
BITS  
RESERVED  
RESERVED  
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
0
0
0
0
0
0
0
0
D13 D12 D11 D10  
0
0
0
0
0
0
0
0
0
D8  
0
0
0
0
D3  
D2  
D1 C3(1) C2(0) C1(0)  
FEEDBACK  
SELECT  
D13  
D2  
D1  
0
OUTPUT POWER (dBm)  
0
0
1
1
–4  
–1  
+2  
+5  
0
1
DIVIDED  
FUNDAMENTAL  
1
0
MUTE TILL  
LOCK DETECT  
D12  
D11  
D10  
RF DIVIDER SELECT  
1
D8  
0
0
0
0
0
1
0
0
1
1
0
0
1
0
1
0
÷1  
÷2  
÷4  
÷8  
÷16  
MUTE DISABLED  
D3  
RF OUT  
1
MUTE ENABLED  
0
1
DISABLED  
ENABLED  
Figure 24. Register 4 (R4)  
LD PIN  
MODE  
CONTROL  
BITS  
ABP  
WIDTH  
RESERVED  
RESERVED  
DB31 DB30 DB29 DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
ABP2 ABP1 CE1  
1
0
0
0
0
D15  
D14  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
C3(1) C2(0) C1(1)  
D15  
0
D14  
0
LOCK DETECT PIN OPERATION  
OUTPUT LOW  
0
1
DIGITAL LOCK DETECT1  
OUTPUT LOW  
1
0
1
1
OUTPUT HIGH  
RESERVED BIT  
RESERVED  
0
1
NORMAL OPERATION  
CE1  
0
CHARGE CANCELL ATION  
DISABLED  
1
ENABLED  
ABP2 ABP1  
ANTIBACKLASH PULSE WIDTH  
0
0
1
1
0
1
0
1
4.2ns (RECOMMENDED)  
RESERVED  
RESERVED  
RESERVED  
1
MUXOUT IN REGISTER 2 MUST ALSO BE SET TO DIGITAL LOCK DETECT FOR THE LOCK DETECT PINTO OPERATE CORRECTLY.  
Figure 25. Register 5 (R5)  
Rev. 0 | Page 16 of 28  
 
 
ADF4150HV  
In most applications, the phase relationship between the RF  
signal and the reference is not important. In such applications,  
the phase value can be used to optimize the fractional and  
subfractional spur levels. For more information, see the Spur  
Consistency and Fractional Spur Optimization section.  
REGISTER 0  
Control Bits  
When Bits[C3:C1] are set to 000, Register 0 is programmed.  
Figure 20 shows the input data format for programming this  
register.  
If neither the phase resync nor the spurious optimization function  
is used, it is recommended that the phase word be set to 1.  
16-Bit Integer Value (INT)  
The 16 INT bits (Bits[DB30:DB15]) set the INT value, which  
determines the integer part of the feedback division factor. The  
INT value is used in Equation 1 (see the INT, FRAC, MOD, and  
R Counter Relationship section). Integer values from 23 to  
32,767 are allowed for the 4/5 prescaler% for the 8/9 prescaler,  
the minimum integer value is 75 and the maximum value is  
65,535.  
12-Bit Modulus Value (MOD)  
The 12 MOD bits (Bits[DB14:DB3]) set the fractional modulus.  
The fractional modulus is the ratio of the PFD frequency to the  
channel step resolution on the RF output. For more information,  
see the 12-Bit Programmable Modulus section.  
REGISTER 2  
12-Bit Fractional Value (FRAC)  
Control Bits  
The 12 FRAC bits (Bits[DB14:DB3]) set the numerator of the  
fraction that is input to the Σ-Δ modulator. This fraction, along  
with the INT value, specifies the new frequency channel that  
the synthesizer locks to, as shown in the RF Synthesizer—A  
Worked Example section. FRAC values from 0 to (MOD − 1)  
cover channels over a frequency range equal to the PFD refer-  
ence frequency.  
When Bits[C3:C1] are set to 010, Register 2 is programmed.  
Figure 22 shows the input data format for programming this  
register.  
Low Noise and Low Spur Modes  
The noise modes on the ADF4150HV are controlled by setting  
Bits[DB30:DB29] in Register 2 (see Figure 22). The noise modes  
allow the user to optimize a design either for improved spurious  
performance or for improved phase noise performance.  
REGISTER 1  
Control Bits  
When the low spur mode is chosen, dither is enabled. Dither  
randomizes the fractional quantization noise so that it resembles  
white noise rather than spurious noise. As a result, the part is  
optimized for improved spurious performance. Low spur mode  
is normally used for fast-locking applications when the PLL  
closed-loop bandwidth is wide. Wide loop bandwidth is a loop  
bandwidth greater than 1/10 of the RFOUT channel step resolu-  
tion (fRES). A wide loop filter does not attenuate the spurs to the  
same level as a narrow loop bandwidth.  
When Bits[C3:C1] are set to 001, Register 1 is programmed.  
Figure 21 shows the input data format for programming this  
register.  
Prescaler Value  
The dual-modulus prescaler, along with the INT, FRAC, and  
MOD values, determines the overall division ratio from the VCO  
output to the PFD input. The PR1 bit (DB27) in Register 1 sets  
the prescaler value.  
For best noise performance, use the low noise mode option.  
When the low noise mode is chosen, dither is disabled. This  
mode ensures that the charge pump operates in an optimum  
region for noise performance. Low noise mode is extremely  
useful when a narrow loop filter bandwidth is available. The  
synthesizer ensures extremely low noise, and the filter attenu-  
ates the spurs.  
Operating at CML levels, the prescaler takes the clock from the  
VCO output and divides it down for the counters. The prescaler  
is based on a synchronous 4/5 core. When the prescaler is set to  
4/5, the maximum RF frequency allowed is 3 GHz. Therefore,  
when operating the ADF4150HV above 3 GHz, the prescaler  
must be set to 8/9. The prescaler limits the INT value as follows:  
Prescaler = 4/5: NMIN = 23  
Prescaler = 8/9: NMIN = 75  
Figure 8 and Figure 9 show fractional spur levels when using  
low spur mode and low noise mode. Figure 12 shows the in-band  
phase noise when using low spur mode and low noise mode.  
12-Bit Phase Value  
MUXOUT  
Bits[DB26:DB15] control the phase word. The word must be  
less than the MOD value programmed in Register 1. The phase  
word is used to program the RF output phase from 0° to 360°  
with a resolution of 360°/MOD. For more information, see the  
Phase Resync section.  
The on-chip multiplexer is controlled by Bits[DB28:DB26] (see  
Figure 22).  
Rev. 0 | Page 17 of 28  
 
ADF4150HV  
Reference Doubler  
Lock Detect Precision (LDP)  
Setting the DB25 bit to 0 disables the doubler and feeds the  
REFIN signal directly into the 10-bit R counter. Setting this bit to  
1 multiplies the REFIN frequency by a factor of 2 before feeding  
it into the 10-bit R counter. When the doubler is disabled, the  
REFIN falling edge is the active edge at the PFD input to the  
fractional synthesizer. When the doubler is enabled, both the  
rising and falling edges of REFIN become active edges at the  
PFD input.  
The lock detect precision bit (Bit DB7) sets the comparison  
window in the lock detect circuit. When DB7 is set to 0, the  
comparison window is 10 ns; when DB7 is set to 1, the window  
is 6 ns. The lock detect circuit goes high when n consecutive  
PFD cycles are less than the comparison window value; n is set  
by the LDF bit (DB8). For example, with DB8 = 0 and DB7 = 0,  
40 consecutive PFD cycles of 10 ns or less must occur before  
digital lock detect goes high. The recommended settings for  
Bits[DB8:DB7] are listed in Table 7.  
When the doubler is enabled and the low spur mode is chosen,  
the in-band phase noise performance is sensitive to the REFIN duty  
cycle. The phase noise degradation can be as much as 5 dB for  
REFIN duty cycles outside a 45% to 55% range. The phase noise  
is insensitive to the REFIN duty cycle in the low noise mode and  
when the doubler is disabled.  
Table 7. Recommended LDF and LDP Bit Settings  
Mode  
DB8 (LDF)  
DB7 (LDP)  
Integer-N  
Fractional-N, Low Noise Mode  
Fractional-N, Low Spur Mode  
1
0
0
1
1
0
The maximum allowable REFIN frequency when the doubler is  
enabled is 30 MHz.  
Power-Down (PD)  
The DB5 bit provides the programmable power-down mode.  
Setting this bit to 1 performs a power-down. Setting this bit to 0  
returns the synthesizer to normal operation. In software power-  
down mode, the part retains all information in its registers. The  
register contents are lost only if the supply voltages are removed.  
RDIV2  
Setting the DB24 bit to 1 inserts a divide-by-2 toggle flip-flop  
between the R counter and the PFD. This function allows a 50%  
duty cycle signal to appear at the PFD input, which is necessary  
when the charge pump boost mode is enabled (see the Boost  
Enable section).  
When power-down is activated, the following events occur:  
Synthesizer counters are forced to their load state  
conditions.  
Charge pump is forced into three-state mode.  
Digital lock detect circuitry is reset.  
RFOUT buffers are disabled.  
10-Bit R Counter  
The 10-bit R counter (Bits[DB23:DB14]) allows the input  
reference frequency (REFIN) to be divided down to produce the  
reference clock to the PFD. Division ratios from 1 to 1023 are  
allowed.  
Input registers remain active and capable of loading  
and latching data.  
Double Buffer  
The DB13 bit enables or disables double buffering of  
Bits[DB22:DB20] in Register 4. For information about how  
double buffering works, see the Program Modes section.  
Charge Pump Three-State  
Setting the DB4 bit to 1 puts the charge pump into three-state  
mode. This bit should be set to 0 for normal operation.  
Charge Pump Current Setting  
Counter Reset  
Bits[DB11:DB9] set the charge pump current. This value  
should be set to the charge pump current that the loop filter  
is designed with (see Figure 22).  
The DB3 bit is the reset bit for the R counter and the N counter  
of the ADF4150HV. When this bit is set to 1, the RF synthesizer  
N counter and R counter are held in reset. For normal opera-  
tion, this bit should be set to 0.  
Lock Detect Function (LDF)  
The DB8 bit configures the lock detect function (LDF). The LDF  
controls the number of PFD cycles monitored by the lock detect  
circuit to ascertain whether lock has been achieved. When DB8  
is set to 0, the number of PFD cycles monitored is 40. When  
DB8 is set to 1, the number of PFD cycles monitored is 5. It is  
recommended that the DB8 bit be set to 0 for fractional-N mode  
and 1 for integer-N mode.  
Rev. 0 | Page 18 of 28  
 
ADF4150HV  
Divider Select  
REGISTER 3  
Bits[DB22:DB20] select the value of the output divider (see  
Figure 24).  
Control Bits  
When Bits[C3:C1] are set to 011, Register 3 is programmed.  
Figure 23 shows the input data format for programming this  
register.  
Mute-Till-Lock Detect (MTLD)  
When the DB10 bit is set to 1, the supply current to the RF output  
stage is shut down until the part achieves lock, as measured by  
the digital lock detect circuitry.  
Boost Enable  
Setting the DB18 bit to 1 enables the charge pump boost mode.  
If boost mode is enabled, the narrow loop bandwidth is main-  
tained for spur attenuation, but faster lock times are still possible.  
Boost mode speeds up locking significantly for higher values of  
PFD frequencies that normally have many cycle slips.  
RF Output Enable  
The DB5 bit enables or disables the primary RF output. If DB5  
is set to 0, the primary RF output is disabled% if DB5 is set to 1,  
the primary RF output is enabled.  
When boost mode is enabled, an extra charge pump current cell  
is turned on. This cell outputs a constant current to the loop filter  
or removes a constant current from the loop filter (depending on  
whether the VCO tuning voltage needs to increase or decrease  
to acquire the new frequency) until VTUNE approaches the lock  
voltage. The boost current is then disabled and the charge pump  
current setting reverts to the user programmed value.  
Output Power  
Bits[DB4:DB3] set the value of the primary RF output power  
level (see Figure 24).  
REGISTER 5  
Control Bits  
When Bits[C3:C1] are set to 101, Register 5 is programmed.  
Figure 25 shows the input data format for programming this  
register.  
Loop stability is maintained because the current is constant and  
is not pulsed, so there is no need to switch a compensating loop  
filter resistor in and out, as in standard fast lock modes. Note that  
the PFD requires a 45ꢀ to 55ꢀ duty cycle for the boost mode to  
operate correctly. This duty cycle can be guaranteed by setting  
the RDIV2 bit (DB24) in Register 2.  
Antibacklash Pulse Width  
Bits[DB31:DB30] set the PFD antibacklash pulse width.  
The recommended value for all operating modes is 4.2 ns  
(set Bits[DB31:DB30] to 00). Other antibacklash pulse width  
settings are reserved and are not recommended.  
Clock Divider Mode  
Bits[DB16:DB15] must be set to 10 to activate phase resync  
(see the Phase Resync section). Setting Bits[DB16:DB15] to  
00 disables the clock divider (see Figure 23).  
Charge Cancellation  
Setting the DB29 bit to 1 enables charge pump charge cancel-  
lation. This has the effect of reducing PFD spurs in integer-N  
mode. In fractional-N mode, this bit should be set to 0.  
12-Bit Clock Divider Value  
Bits[DB14:DB3] set the 12-bit clock divider value. This value  
is the timeout counter for activation of phase resync. For more  
information, see the Phase Resync section.  
Lock Detect Pin Operation  
Bits[DB23:DB22] set the operation of the lock detect (LD) pin  
(see Figure 25).  
REGISTER 4  
Control Bits  
REGISTER INITIALIZATION SEQUENCE  
At initial power-up, after the correct application of voltages to  
the supply pins, the ADF4150HV registers should be started in  
the following sequence:  
When Bits[C3:C1] are set to 100, Register 4 is programmed.  
Figure 24 shows the input data format for programming this  
register.  
1. Register 5  
2. Register 4  
3. Register 3  
4. Register 2  
5. Register 1  
6. Register 0  
Feedback Select  
The DB23 bit selects the feedback from the VCO output to the  
N counter. When this bit is set to 1, the signal is taken directly  
from the VCO. When this bit is set to 0, the signal is taken from  
the output of the output dividers. The dividers enable coverage  
of the wide frequency band (31.25 MHz to 3.0 GHz). When the  
dividers are enabled and the feedback signal is taken from the  
output, the RF output signals of two separately configured PLLs  
are in phase. This is useful in some applications where the posi-  
tive interference of signals is required to increase the power.  
Rev. 0 | Page 19 of 28  
 
 
ADF4150HV  
The ADF4150HV evaluation software can be used to help  
determine integer and fractional values for a given setup,  
along with the actual register settings to be programmed.  
RF SYNTHESIZER—A WORKED EXAMPLE  
The following equations are used to program the ADF4150HV  
synthesizer:  
REFERENCE DOUBLER AND REFERENCE DIVIDER  
RFOUT = [INT + (FRAC/MOD)] × (fPFD/RF Divider)  
where:  
RFOUT is the RF frequency output.  
INT is the integer division factor.  
FRAC is the fractionality.  
MOD is the modulus.  
RF Divider is the output divider that divides down the VCO  
frequency.  
(3)  
The on-chip reference doubler allows the input reference signal  
to be doubled. Doubling the reference signal doubles the PFD  
comparison frequency, which improves the noise performance  
of the system. Doubling the PFD frequency usually improves  
noise performance by 3 dB. Note that the PFD cannot operate  
above 32 MHz due to a limitation in the speed of the Σ-Δ circuit  
of the N divider.  
The reference divide-by-2 divides the reference signal by 2,  
resulting in a 50ꢀ duty cycle PFD frequency. This is necessary  
for the correct operation of the charge pump boost mode. For  
more information, see the Boost Enable section.  
f
PFD = REFIN × [(1 + D)/(R × (1 + T))]  
(4)  
where:  
REFIN is the reference frequency input.  
D is the RF REFIN doubler bit (0 or 1).  
R is the RF reference division factor (1 to 1023).  
T is the reference divide-by-2 bit (0 or 1).  
12-BIT PROGRAMMABLE MODULUS  
The choice of modulus (MOD) depends on the reference signal  
(REFIN) available and the channel resolution (fRES) required at the  
RF output. For example, a GSM system with 13 MHz REFIN sets  
the modulus to 65. This means that the RF output resolution  
(fRES) is the 200 kHz (13 MHz/65) necessary for GSM. With  
dither off, the fractional spur interval depends on the modulus  
values chosen (see Table 8).  
In this example, the user wants to program a 1.5 GHz RF  
frequency output (RFOUT) with a 500 kHz channel resolution  
(fRESOUT) required on the RF output. The reference frequency  
input (REFIN) is 25 MHz. The VCO options available to the  
user include the following:  
1.5 GHz VCO in fundamental mode  
3 GHz VCO with the RF divider set to 2  
Unlike most other fractional-N PLLs, the ADF4150HV allows  
the user to program the modulus over a 12-bit range. When  
combined with the reference doubler and the 10-bit R counter,  
the 12-bit modulus allows the user to set up the part in many  
different configurations for the application.  
When enabling the RF divider, the user must decide whether to  
close the PLL loop before the RF divider or after it. In this  
example, the PLL loop is closed before the RF divider (see  
Figure 26).  
For example, consider an application that requires a 1.75 GHz  
RF frequency output with a 200 kHz channel step resolution.  
The system has a 13 MHz reference signal.  
fPFD  
RF  
OUT  
PFD  
VCO  
÷2  
One possible setup is to feed the 13 MHz reference signal  
directly into the PFD and to program the modulus to divide  
by 65. This setup results in the required 200 kHz resolution.  
N
DIVIDER  
Figure 26. PLL Loop Closed Before Output Divider  
Another possible setup is to use the reference doubler to create  
26 MHz from the 13 MHz input signal. The 26 MHz is then fed  
into the PFD, and the modulus is programmed to divide by 130.  
This setup also results in 200 kHz resolution but offers superior  
phase noise performance over the first setup.  
To minimize VCO feedthrough, the 3 GHz VCO is selected. A  
channel resolution (fRESOUT) of 500 kHz is required at the output  
of the RF divider. Therefore, the channel resolution at the output  
of the VCO (fRES) needs to be 2 × fRESOUT, that is, 1 MHz.  
MOD = REFIN/fRES  
MOD = 25 MHz/1 MHz = 25  
The programmable modulus is also very useful for multistandard  
applications with different channel spacing requirements.  
From Equation 4,  
It is important that the PFD frequency remain constant (in this  
example, 13 MHz). This allows the user to design one loop filter  
for both setups without encountering stability issues. Note that  
the ratio of the RF frequency to the PFD frequency principally  
affects the loop filter design, not the actual channel spacing.  
f
PFD = [25 MHz × (1 + 0)/1] = 25 MHz  
1500.5 MHz = 25 MHz × [(INT + (FRAC/25))/2]  
where:  
(5)  
(6)  
INT = 120.  
FRAC = 1.  
RF Divider = 2.  
Rev. 0 | Page 20 of 28  
 
 
 
 
ADF4150HV  
Integer Boundary Spurs  
SPURIOUS OPTIMIZATION AND BOOST MODE  
Another mechanism for fractional spur creation is the inter-  
actions between the RF VCO frequency and the reference  
frequency. When these frequencies are not integer related (the  
purpose of a fractional-N synthesizer), spur sidebands appear  
on the VCO output spectrum at an offset frequency that corre-  
sponds to the beat note, or difference frequency, between an  
integer multiple of the reference and the VCO frequency. These  
spurs are attenuated by the loop filter and are more noticeable  
on channels close to integer multiples of the reference where the  
difference frequency can be inside the loop bandwidth (thus the  
name integer boundary spurs).  
Narrow loop bandwidths can filter unwanted spurious signals,  
but these bandwidths usually have a long lock time. A wider  
loop bandwidth achieves faster lock times, but may lead to  
increased spurious signals inside the loop bandwidth.  
The boost mode feature can achieve the same fast lock time  
as the wider bandwidth, but with the advantage of a narrow  
final loop bandwidth to keep spurs low (see the Boost Enable  
section).  
SPUR MECHANISMS  
This section describes the three different spur mechanisms that  
arise with a fractional-N synthesizer and how to minimize them  
in the ADF4150HV.  
Reference Spurs  
Reference spurs are generally not a problem in fractional-N  
synthesizers because the reference offset is far outside the loop  
bandwidth. However, any reference feedthrough mechanism that  
bypasses the loop may cause a problem. The PCB layout must  
ensure adequate isolation between VCO traces and the input  
reference to avoid a possible feedthrough path on the board.  
Fractional Spurs  
The fractional interpolator in the ADF4150HV is a third-order  
Σ-Δ modulator with a modulus (MOD) that is programmable to  
any integer value from 2 to 4095. In low spur mode (dither on),  
the minimum allowable value of MOD is 50. The Σ-Δ modulator  
is clocked at the PFD reference rate (fPFD), which allows PLL out-  
put frequencies to be synthesized at a channel step resolution  
of fPFD/MOD.  
SPUR CONSISTENCY AND FRACTIONAL SPUR  
OPTIMIZATION  
With dither off, the fractional spur pattern due to the quantiza-  
tion noise of the Σ-Δ modulator also depends on the particular  
phase word with which the modulator is seeded.  
In low noise mode (dither off), the quantization noise from the  
Σ-Δ modulator appears as fractional spurs. The interval between  
spurs is fPFD/L, where L is the repeat length of the code sequence  
in the digital Σ-Δ modulator. For the third-order Σ-Δ modulator  
used in the ADF4150HV, the repeat length depends on the value  
of MOD, as listed in Table 8.  
The phase word can be varied to optimize the fractional and  
subfractional spur levels on any particular frequency. Thus, a  
lookup table of phase values corresponding to each frequency  
can be constructed for use when programming the ADF4150HV.  
Table 8. Fractional Spurs with Dither Off (Low Noise Mode)  
If a lookup table is not used, keep the phase word at a constant  
value to ensure consistent spur levels on any particular frequency.  
Repeat  
MOD Value (Dither Off)  
Length  
Spur Interval  
MOD is divisible by 2, but not by 3 2 × MOD Channel step/2  
MOD is divisible by 3, but not by 2 3 × MOD Channel step/3  
MOD is divisible by 6  
MOD is not divisible by 2, 3, or 6  
6 × MOD Channel step/6  
MOD Channel step  
In low spur mode (dither on), the repeat length is extended  
to 221 cycles, regardless of the value of MOD, which makes the  
quantization error spectrum look like broadband noise. This  
may degrade the in-band phase noise at the PLL output by as  
much as 10 dB. For lowest noise, dither off is a better choice,  
particularly when the final loop bandwidth is low enough to  
attenuate even the lowest frequency fractional spur.  
Rev. 0 | Page 21 of 28  
 
 
 
ADF4150HV  
In the example shown in Figure 27, the PFD reference is 25 MHz  
and MOD is 125 for a 200 kHz channel spacing. tSYNC is set to  
400 μs by programming CLK_DIV_VALUE = 80.  
PHASE RESYNC  
The output of a fractional-N PLL can settle to any one of the  
MOD phase offsets with respect to the input reference, where  
MOD is the fractional modulus. The phase resync feature of  
the ADF4150HV produces a consistent output phase offset with  
respect to the input reference. This is necessary in applications  
where the output phase and frequency are important, such as  
digital beamforming. For information about how to program  
a specific RF output phase when using phase resync, see the  
Phase Programmability section.  
LE  
tSYNC  
SYNC  
(INTERNAL)  
LAST CYCLE SLIP  
FREQUENCY  
PLL SETTLES TO  
INCORRECT PHASE  
PLL SETTLES TO  
CORRECT PHASE  
AFTER RESYNC  
Phase resync is enabled by setting Bits[DB16:DB15] in  
Register 3 to 10. When phase resync is enabled, an internal  
timer generates sync signals at intervals of tSYNC given by the  
following formula:  
PHASE  
t
SYNC = CLK_DIV_VALUE × MOD × tPFD  
–100  
0
100 200 300 400 500 600 700 800 900 1000  
TIME (µs)  
where:  
Figure 27. Phase Resync Example  
CLK_DIV_VALUE is the decimal value programmed in  
Bits[DB14:DB3] of Register 3 and can be any integer in the  
range of 1 to 4095.  
MOD is the modulus value programmed in Bits[DB14:DB3]  
of Register 1.  
Phase Programmability  
The phase word in Register 1 controls the RF output phase. As  
this word is swept from 0 to MOD, the RF output phase sweeps  
over a 360° range in steps of 360°/MOD.  
t
PFD is the PFD reference period.  
When a new frequency is programmed, the second sync pulse  
after the LE rising edge is used to resynchronize the output  
phase to the reference. The tSYNC time must be programmed to  
a value that is at least as long as the worst-case lock time. This  
guarantees that the phase resync occurs after the last cycle slip  
in the PLL settling transient.  
Rev. 0 | Page 22 of 28  
 
 
 
 
ADF4150HV  
APPLICATIONS INFORMATION  
ULTRAWIDEBAND PLL  
MICROWAVE PLL  
When paired with an octave tuning range VCO, the ADF4150HV  
provides an ultrawideband PLL function using the on-board  
RF dividers. With an octave tuning range at the fundamental  
frequency, the RF dividers provide full frequency coverage with  
no gaps down to much lower frequencies.  
The ADF4150HV can be interfaced directly to a wide tuning  
range microwave VCO without the need for an active filter.  
Typically, most microwave VCOs have a maximum tuning range  
of 15 V. In this case, set VP on the ADF4150HV to a value of  
16 V or higher to ensure sufficient headroom in the charge  
pump. An external prescaler, such as the ADF5001, is required  
to divide down VCO frequencies that are above the maximum  
RF input frequency of 3.0 GHz.  
For example, using a 1 GHz to 2 GHz octave range VCO (such  
as the Synergy DCYS100200-12), the user can obtain contiguous  
output frequencies from 62.5 MHz to 2 GHz at the ADF4150HV  
RF outputs, as shown in Figure 28. A broadband output match  
is achieved using a 27 nH inductor in parallel with a 50 Ω resistor  
(for more information, see the Output Matching section). With  
such a wide output range, the same PLL hardware design can  
generate different frequencies for each of the different hardware  
platforms in the system.  
In the application circuit shown in Figure 29, the ADF5001  
divides down the 16 GHz VCO signal to 4 GHz, which can then  
be input directly into the ADF4150HV RF inputs. The ADF5001  
can be connected either single-ended or differentially to the  
ADF4150HV. For best performance and to achieve maximum  
power transfer, it is recommended that a differential connection  
be used.  
V
DD  
Z
BIAS  
RF  
RF  
+
OUT  
OUT  
Z
=
BIAS  
RF  
=
OUT  
62.5MHz TO 2GHz  
ADF4150HV  
50||27nH  
PLL  
RF  
RF  
+
IN  
CP  
IN  
OUT  
SYNERGY DCYS100200-12  
OCTAVE RANGE VCO  
37Ω  
RFOUT  
VTUNE  
150Ω  
150Ω  
Figure 28. Ultrawideband PLL Using the ADF4150HV and an Octave Tuning Range VCO  
Rev. 0 | Page 23 of 28  
 
 
ADF4150HV  
10pF  
0.1µF  
AC COUPLING INTEGRATED  
ON ADF5001 DEVICE  
VDD1 VDD2  
RFOUT  
RF  
RF  
+
IN  
ADF5001  
ADF4150HV  
PLL  
PRESCALER  
RFIN  
CP  
OUT  
RFOUT  
GND  
IN  
MICROWAVE  
VCO  
6dB PAD  
37  
18Ω  
18Ω  
RFOUT  
VTUNE  
150Ω  
150Ω  
18Ω  
16GHz OUT  
Figure 29. 16 GHz Microwave PLL  
GENERATING THE HIGH VOLTAGE SUPPLY  
It is possible to use a boost converter such as the Analog Devices  
ADP1613 to generate the high voltage charge pump supply  
from a lower voltage rail without degrading PLL performance.  
To minimize any switching noise feedthrough, ensure that  
sufficient decoupling is placed close to the charge pump supply  
pin (Pin 6). Care should be taken to use capacitors with the  
appropriate voltage rating; for example, if using a boost converter  
to generate a 20 V VP supply, use capacitors with a rating of  
20 V or higher.  
The design of the boost converter is simplified using the  
ADP161x Excel-based design tool. This tool is available from the  
ADP1613 product page. Figure 30 shows the user inputs for an  
example 5 V input to 20 V output design. To minimize voltage  
ripple at the output of the converter stage, the Noise Filter  
option is selected, and the Vout Ripple field is set to its  
minimum value. The high voltage charge pump current draw is  
2 mA maximum; therefore, a value of 10 mA is entered in the  
Iout field to provide margin. When tested with the ADF4150HV  
evaluation board, this design showed no evident switching  
spurs at the VCO output.  
Figure 30. ADP161x Designer Tool  
Rev. 0 | Page 24 of 28  
 
 
 
ADF4150HV  
Blackfin ADSP-BF527 Interface  
INTERFACING TO THE ADuC702x AND  
THE ADSP-BF527  
Figure 32 shows the interface between the ADF4150HV and  
the Blackfin® ADSP-BF527 digital signal processor (DSP). The  
ADF4150HV needs a 32-bit serial word for each latch write.  
The easiest way to accomplish this using the Blackfin family  
is to use the autobuffered transmit mode of operation with  
alternate framing. This mode provides a means for transmitting  
an entire block of serial data before an interrupt is generated.  
The ADF4150HV has a simple SPI-compatible serial interface for  
writing to the device. The CLK, DATA, and LE pins control the  
data transfer. When LE goes high, the 32 bits that were clocked  
into the appropriate register on each rising edge of CLK are  
transferred to the appropriate latch. See Figure 2 for the timing  
diagram and Table 6 for the register address table.  
ADuC702x Interface  
ADF4150HV  
SCK  
CLK  
Figure 31 shows the interface between the ADF4150HV and the  
ADuC702x family of analog microcontrollers. The ADuC702x  
family is based on an ARM7 core, but the same interface can be  
used with any 8051-based microcontroller.  
MOSI  
GPIO  
DATA  
LE  
CE  
ADSP-BF527  
I/O PORTS  
MUXOUT  
(LOCK DETECT)  
The microcontroller is set up for SPI master mode with CPHA =  
0. To initiate the operation, the I/O port driving LE is brought  
low. Each latch of the ADF4150HV needs a 32-bit word, which  
is accomplished by writing four 8-bit bytes from the micro-  
controller to the device. After the fourth byte is written, the  
LE input should be brought high to complete the transfer.  
Figure 32. ADSP-BF527 to ADF4150HV Interface  
Set up the word length for eight bits and use four memory loca-  
tions for each 32-bit word. To program each 32-bit latch, store  
the 8-bit bytes, enable the autobuffered mode, and write to the  
transmit register of the DSP. This last operation initiates the  
autobuffer transfer. If using a faster SPI clock, make sure that  
the SPI timing requirements listed in Table 2 are adhered to.  
ADF4150HV  
SCLOCK  
MOSI  
CLK  
DATA  
ADuC702x  
I/O PORTS  
LE  
CE  
PCB DESIGN GUIDELINES FOR A CHIP SCALE  
PACKAGE  
MUXOUT  
(LOCK DETECT)  
The lands on the chip scale package (CP-32-11) are rectangular.  
The PCB pad for these lands must be 0.1 mm longer than the  
package land length and 0.05 mm wider than the package land  
width. Each land must be centered on the pad to ensure that the  
solder joint size is maximized.  
Figure 31. ADuC702x to ADF4150HV Interface  
I/O port lines on the ADuC702x are also used to control the  
power-down input (CE) and the lock detect (MUXOUT con-  
figured for lock detect and polled by the port input). When  
operating in the mode described, the maximum SPI transfer  
rate of the ADuC7023 is 20 Mbps. This means that the maxi-  
mum rate at which the output frequency can be changed is  
833 kHz. If using a faster SPI clock, make sure that the SPI  
timing requirements listed in Table 2 are adhered to.  
The bottom of the chip scale package has a central exposed  
thermal pad. The thermal pad on the PCB must be at least as  
large as the exposed pad. On the PCB, there must be a minimum  
clearance of 0.25 mm between the thermal pad and the inner  
edges of the pad pattern to ensure that shorting is avoided.  
Thermal vias can be used on the PCB thermal pad to improve  
the thermal performance of the package. If vias are used, they  
must be incorporated into the thermal pad at 1.2 mm pitch grid.  
The via diameter must be between 0.3 mm and 0.33 mm, and  
the via barrel must be plated with 1 oz. of copper to plug the via.  
Rev. 0 | Page 25 of 28  
 
 
 
ADF4150HV  
The circuit shown in Figure 34 provides a good broadband  
match to 50 ꢁ for frequencies from 250 MHz to 3.0 GHz. The  
maximum output power in this case is approximately 5 dBm.  
The inductor can be increased for operation below 250 MHz.  
Both single-ended architectures can be examined using the  
EVAL-ADF4150HVEB1Z evaluation board.  
OUTPUT MATCHING  
The output of the ADF4150HV can be matched in a number of  
ways for optimum operation% the most basic is to connect a 50 ꢁ  
resistor to AVDD. A dc bypass capacitor of 100 pF is connected  
in series, as shown in Figure 33. Because the resistor is not fre-  
quency dependent, this method provides a good broadband  
match. When connected to a 50 ꢁ load, this circuit typically  
gives a differential output power equal to the values chosen by  
Bits[DB4:DB3] in Register 4.  
AV  
DD  
22nH  
1nF  
50  
RF  
RF  
+
OUT  
AV  
DD  
50Ω  
50Ω  
50  
100pF  
100Ω  
RF  
OUT  
50Ω  
50Ω  
1nF  
OUT  
Figure 33. Simple ADF4150HV Output Stage  
22nH  
Another solution is to connect a shunt inductor (acting as an RF  
choke) to AVDD. This solution can help provide a better narrow-  
band match and, therefore, more output power. However, because  
the output stage is open-collector, it is recommended that a  
termination resistor be used in addition to the RF choke to give  
a defined output impedance. The termination resistor can be  
either 50 ꢁ in parallel with the RF choke or 100 ꢁ connected  
across the RF output pins.  
AV  
DD  
Figure 34. Optimum ADF4150HV Output Stage  
If differential outputs are not needed, the unused output can be  
terminated, or both outputs can be combined using a balun.  
Rev. 0 | Page 26 of 28  
 
 
 
 
ADF4150HV  
OUTLINE DIMENSIONS  
5.10  
5.00 SQ  
4.90  
0.30  
0.25  
0.18  
PIN 1  
INDICATOR  
PIN 1  
25  
24  
32  
1
INDICATOR  
0.50  
BSC  
3.65  
3.50 SQ  
3.45  
EXPOSED  
PAD  
8
9
17  
16  
0.50  
0.40  
0.30  
0.25 MIN  
TOP VIEW  
BOTTOM VIEW  
FOR PROPER CONNECTION OF  
THE EXPOSED PAD, REFER TO  
THE PIN CONFIGURATION AND  
FUNCTION DESCRIPTIONS  
0.80  
0.75  
0.70  
0.05 MAX  
0.02 NOM  
SECTION OF THIS DATA SHEET.  
COPLANARITY  
0.08  
0.20 REF  
SEATING  
PLANE  
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.  
Figure 35. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]  
5 mm × 5 mm Body, Very Very Thin Quad  
(CP-32-11)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model1  
Temperature Range  
−40°C to +85°C  
−40°C to +85°C  
Package Description  
Package Option  
CP-32-11  
CP-32-11  
ADF4150HVBCPZ  
ADF4150HVBCPZ-RL7  
EVAL-ADF4150HVEB1Z  
32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]  
32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]  
Evaluation Board  
1 Z = RoHS Compliant Part.  
Rev. 0 | Page 27 of 28  
 
ADF4150HV  
NOTES  
©2011 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D09058-0-8/11(0)  
Rev. 0 | Page 28 of 28  

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