ADF4211BRCHIPS [ADI]

IC PHASE DETECTOR, 1200 MHz, UUC, DIE, PLL or Frequency Synthesis Circuit;
ADF4211BRCHIPS
型号: ADF4211BRCHIPS
厂家: ADI    ADI
描述:

IC PHASE DETECTOR, 1200 MHz, UUC, DIE, PLL or Frequency Synthesis Circuit

文件: 总12页 (文件大小:87K)
中文:  中文翻译
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a
PreliminaryTechnicalData  
DualFrequencySynthesizer  
ADF4210/ADF4211/ADF4212/ADF4213  
G E NE R AL D E S C R IP T IO N  
FEATURES  
T he AD F4210/AD F4211/AD F4212/AD F4213 is a  
dual frequency synthesizer which can be used to  
implement local oscillators in the up-conversion and  
down-conversion sections of wireless receivers and  
transmitters. T hey can provide the LO for both the  
RF and IF sections. T hey consist of a low-noise digi-  
tal PFD (Phase Frequency Detector), a precision  
charge pump, a programmable reference divider,  
programmable A and B counters and a dual-modulus  
prescaler (P/P+1). T he A (6-bit) and B (12-bit)  
counters, in conjunction with the dual modulus  
prescaler (P/P+1), implement an N divider (N=  
BP+A). In addition, the 15-bit reference counter (R  
Counter), allows selectable REFIN frequencies at the  
PFD input. A complete PLL (Phase-Locked Loop)  
can be implemented if the synthesizers are used with  
an external loop filter and VCO's (Voltage Controlled  
Oscillators)Control of all the on-chip registers is via  
a simple 3-wire interface. T he devices operate with a  
3V ( ± 10%) or 5V( ± 10%) power supply and can be  
powered down when not in use.  
ADF4210:  
ADF4211:  
ADF4212:  
ADF4213:  
550MHz/ 1.2GHz  
550MHz/ 2.0GHz  
550MHz/ 3.0GHz  
1.0GHz/ 2.5GHz  
+2.7 V to +5.5 V Pow er Supply  
Program m able Dual Modulus Prescaler  
Program m able Charge Pum p Currents  
3-Wire Serial Interface  
Digital Lock Detect  
Pow er Dow n Mode  
APPLICATIONS  
Portable Wireless Com m unications (PCS/ PCN,  
Cordless)  
phone System s  
w orks (WLANs)  
Cordless and Cellular Tele-  
Wireless Local Area Net-  
FUNCTIO NAL BLO CK D IAGRAM  
V
1
V
2
V
1
V 2  
RS ET  
CC  
CC  
P
P
AD F 4210/AD F 4211/  
AD F 4212/AD F 4213  
SWALLOW  
CO NTROL  
15 -BIT IF  
IFIN  
+
-
IF  
N-COUNTER  
PRESCALER  
CHARGE  
PUMP  
CP  
IF  
15-BI IF  
R-COUNTER  
PH ASE  
C OM PAR ATOR  
IF  
LOCK  
DETECT  
OS CILLATOR  
REFIN  
OUTPUT  
M UX  
MUXOUT  
FAST  
CH ARGE  
CLOCK  
DATA  
LE  
24-BIT  
DAT A  
PUMP  
REGISTER  
FLO  
RF  
LOCK  
DE TECT  
18 -BIT RF  
N-COUNTE R  
+
RF  
RFIN  
PRESCALER  
-
CHARGE  
PUMP  
CP  
RF  
15-BIT RF  
R-COUNTER  
PH ASE  
C OM PAR ATOR  
SWALLOW  
CONTRO L  
REV.PrD 07/99  
DGND  
AGND  
DGND  
AGND  
IF  
RF  
RF  
IF  
© Analog Devices, Inc., 1999  
Inform ation furnished by Analog Devices is believed to be accurate and reliable. However,  
no responsibility is assum ed by Analog Devices for its use, nor for any infringem ents of  
patents or other rights of third parties which m ay result from its use. No license is granted  
by im plication or otherwise under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norw ood, MA 02062-9106, U.S.A.  
Tel: 781-329-4700 Fax: 781-326-8703  
(V = +3 V ± 10%, +5 V ± 10%; V = V +5 V ± 10%;  
DD  
P
DD,  
1
GND = 0 V; R = 4.7k; T = TMIN to TMAX unless otherwise  
SET  
A
ADF4210/11/12/13 – SPECIFICATIONS  
noted)  
P ar am eter  
B Version  
BChips  
Units  
Test Conditions/Com m ents  
RF C H ARAC T ERIST IC S  
RF Input Frequency (RFINA, RFINB)  
AD F 4210  
25/550  
0.1/1.2  
0.1/3.0  
0.1/2.5  
25/550  
0.1/1.2  
0.1/3.0  
0.1/2.5  
M H z min/max  
G H z min/max  
G H z min/max  
G H z min/max  
AD F 4211  
AD F 4212  
AD F 4213  
IF Input Frequency (IFINA, IFINB)  
AD F 4210  
AD F 4211  
AD F 4212  
AD F 4213  
25/550  
25/550  
25/550  
0.1/1.0  
25/550  
25/550  
25/550  
0.1/1.0  
M H z min/max  
G H z min/max  
G H z min/max  
G H z min/max  
Reference Input Frequency  
Phase Detector Frequency  
RF Input Sensitivity  
5/40  
10  
-15/0  
-10/0  
-5  
5/40  
10  
-15/0  
-10/0  
-5  
M H z min/max  
M H z max  
dBm min/max 3V Power Supply  
dBm min/max 5V Power Supply  
dBm min  
Reference Input Sensitivity  
C H ARG E PU M P  
IC P sink/source  
H igh Value  
Low Value  
IC P T hree State Current  
Sink and Source Current Matching  
IC P vs. VC P  
5
625  
1
2
2
5
625  
1
2
2
mA typ  
µA typ  
nA max  
% typ  
% typ  
% typ  
See T able 11  
0.5V < VC P < VP - 0.5  
0.5V < VC P < VP - 0.5  
VC P = VP/2  
IC P vs. T emperature  
2
2
LO G IC IN PU T S  
VINH, Input High Voltage  
0.8*VD D  
0.2*VD D  
± 1  
10  
± 100  
0.8*VD D  
0.2*VD D  
± 1  
10  
± 100  
V min  
V max  
µA max  
pF max  
µA max  
V
I
C
INL, Input Low Voltage  
INH/IINL, Input Current  
IN, Input Capacitance  
Oscillator Input Current  
LO G IC O U T P U T S  
VOH, Output High Voltage  
VOL, Output Low Voltage  
VCC - 0.4  
0.4  
VCC - 0.4  
0.4  
V min  
V max  
IOH = 1mA  
IOL = 1mA  
PO WER SU PPLIES  
AVDD  
DVDD  
2.7/5.5  
AVDD  
AVD D/5.5  
2.7/5.5  
AVDD  
AVD D/5.5  
V min/V max  
V min/V max  
VP1,VP2  
IDD  
(RF + IF)  
AD F 4210  
AD F 4211  
AD F 4212  
AD F 4213  
RF Only  
3.0  
4.0  
4.0  
5.0  
3.0  
4.0  
4.0  
5.0  
mA max  
mA max  
mA max  
mA max  
AD F 4210  
AD F 4211  
AD F 4212  
AD F 4213  
IF Only  
2.0  
3.0  
4.0  
4.0  
2.0  
3.0  
4.0  
4.0  
mA max  
mA max  
mA max  
mA max  
AD F 4213  
Low Power Sleep Mode  
1.0  
1
1.0  
1
mA max  
µA typ  
REV.PrD 07/99  
–2–  
Preliminary TechnicalData  
ADF4210/ADF4211/ADF4212/ADF4213  
P ar am eter  
B Version  
BChips  
Units  
Test Conditions/Com m ents  
N O ISE C H ARAC T ERIST IC S  
Phase N oise Floor  
-173  
-165  
-173  
-165  
dBc/H z typ  
dBc/H z typ  
@ 25kH z PFD Frequency  
@ 200kH z PFD Frequency  
@ VCO Output  
Phase Noise Performance2  
AD F 42103  
-96  
-92  
-82  
-85  
-66  
-66  
-85  
-96  
-92  
-82  
-85  
-66  
-66  
-85  
dBc/H z typ  
dBc/H z typ  
dBc/H z typ  
dBc/H z typ  
dBc/H z typ  
dBc/H z typ  
dBc/H z typ  
AD F 42114  
AD F 42115  
AD F 42126  
AD F 42127  
AD F 42137  
AD F 42138  
Spurious Signals  
Measured at offset of fPFD/2fPFD  
AD F 42103  
tbd/tbd  
tbd/tbd  
tbd/tbd  
tbd/tbd  
tbd/tbd  
tbd/tbd  
tbd/tbd  
tbd/tbd  
tbd/tbd  
tbd/tbd  
tbd/tbd  
tbd/tbd  
tbd/tbd  
tbd/tbd  
tbd/tbd  
tbd/tbd  
dB typ  
dB typ  
dB typ  
dB typ  
dB typ  
dB typ  
dB typ  
dB typ  
AD F 42114  
AD F 42115  
AD F 42126  
AD F 42127  
AD F 42128  
AD F 42138  
AD F 42138  
NOTES  
1
2
Operatingtemperaturerangeisasfollows:BVersion: –40°C to +85°C.  
ThephasenoiseismeasuredwiththeEVAL-ADF421XEBEvaluationBoardandtheHP8562ESpectrumAnalyzer. ThespectrumanalyzerprovidestheREFIN forthesynthesizer.(fREFOUT =10MHz@  
0dBm)  
3.  
4.  
5.  
6.  
7.  
8.  
f REFIN = 10MHz; fPFD = 200kHz; Offsetfrequency= 1kHz; fRF = 540MHz; N = 2700; Loop B/W= 20kHz  
f
f
f
REFIN = 10MHz; fPFD = 200kHz; Offsetfrequency= 1kHz; fRF = 900MHz; N = 4500; Loop B/W= 12kHz  
REFIN = 10MHz; fPFD = 30kHz; Offsetfrequency= 1kHz; fRF = 836MHz; N = 27867; Loop B/W= 3kHz  
REFIN = 10MHz; fPFD = 200kHz; Offsetfrequency= 1kHz; fRF = 1880MHz; N = 9400; LoopB/W= 20kHz  
f REFIN = 10MHz; fPFD = 10kHz; Offsetfrequency= 250Hz; fRF = 1880MHz; N = 188000; LoopB/W= 1kHz  
REFIN = 10MHz; fPFD = 200kHz; Offsetfrequency= 1kHz; fRF = 1960MHz; N = 9800; LoopB/W= 20kHz  
f
Specificationssubjecttochangewithoutnotice.  
C H IP LAYO U T  
REV.PrD 07/99  
–3 –  
Preliminary TechnicalData  
TIMINGCHARACTERISTICS  
ADF4210/ADF4211/ADF4212/ADF4213  
(V = +5 V 10%, +3 V ± 10%; GND = 0 V, unless otherwise noted)  
Lim it at  
DD  
TMIN to TMAX  
P aram eter  
(B Version)  
Units  
Test Conditions/Com m ents  
t1  
t2  
t3  
t4  
t5  
t6  
50  
10  
50  
50  
50  
50  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
DAT A to CLOCK Set Up T ime  
DAT A to CLOCK Hold T ime  
CLOCK High Duration  
CLOCK Low Duration  
CLOCK to LE Set Up T ime  
LE Pulse Width  
NOT E  
Guaranteed by Design but not Production T ested.  
t3  
t4  
CLOCK  
t1  
t2  
DB23  
DATA  
DB22  
DB2  
DB1  
DB0 (LSB)  
(CONTROL BIT C1)  
(MSB)  
(CONTROL BIT C2)  
t6  
LE  
LE  
t5  
Figure 1. Tim ing Diagram  
Lead T emperature, Soldering  
2
ABSO LUT E MAXIMUM RAT INGS1,  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C  
(
TA = +25°C unless otherwise noted)  
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +7 V  
VP to GND . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +7 V  
VP to VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +3.5 V  
Digital I/O Voltage to GND . . . . . . . . 0.3 V to VDD + 0.3 V  
Analog I/O Voltage to GND . . . . . . . . 0.3 V to VP + 0.3 V  
Operating T emperature Range  
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +85°C  
Storage T emperature Range . . . . . . . . . . . –65°C to +150°C  
Maximum Junction T emperature . . . . . . . . . . . . . . . +150°C  
T SSOP θJA T hermal Impedance . . . . . . . . . . . . . T BD °C/W  
1. Stresses above those listed under “Absolute Maximum Ratings” may cause  
permanent damage to the device. T his is a stress rating only and functional  
operation of the device at these or any other conditions above those listed in the  
operational sections of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect device reliability.  
2. T his device is a high-performance RF integrated circuit with an ESD rating of  
< 2kV and it is ESD sensitive. Proper precautions should be taken for handling  
and assembly.  
C A U T I O N  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection.  
Although this device features proprietary ESD protection circuitry, permanent damage may  
occur on devices subjected to high energy electrostatic discharges. T herefore, proper ESD  
precautions are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
O R D E R ING G U ID E  
Model  
Tem perature Range P ackage O ption*  
AD F 4210BRU  
–40°C to +85°C  
RU -16  
RU -16  
RU -16  
RU -16  
AD F 4210BC H IP S 40°C to +85°C  
AD F 4211BRU 40°C to +85°C  
AD F 4211BRC H IP S 40°C to +85°C  
AD F 4212BRU 40°C to +85°C  
AD F 4212BC H IP S 40°C to +85°C  
AD F 4213BRU 40°C to +85°C  
AD F 4213BRC H IP S 40°C to +85°C  
REV.PrD 07/99  
*RU = T hin Shrink Small Outline Package (T SSOP).  
–4 –  
Preliminary TechnicalData  
ADF4210/ADF4211/ADF4212/ADF4213  
T YP IC AL P E RF O RM ANC E C H ARAC T E RIST IC S  
Figure 2. ADF4210 Phase Noise  
Figure 3. ADF4210 Reference Spurs  
Figure 4. ADF4211 Phase Noise (GSM902)  
Figure 5. ADF4211 Reference Spurs (GSM902)  
Figure 6. ADF4211 Phase Noise (CDMA836)  
Figure 7. ADF4211 Reference Spurs (CDMA836)  
REV.PrD 07/99  
–5 –  
Preliminary TechnicalData  
ADF4210/ADF4211/ADF4212/ADF4213  
T YP IC AL P E RF O RM ANC E C H ARAC T E RIST IC S (con tin -  
u ed )  
Figure 8. ADF4212 Phase Noise (GSM1880)  
Figure 9. ADF4212 Reference Spurs (GSM1880)  
Figure 10. ADF4212 Phase Noise (CDMA1880)  
Figure 11. ADF4212 Reference Spurs (CDMA1880)  
Figure 12. ADF4212 Phase Noise (WCDMA1960)  
Figure 13. ADF4212 Reference Spurs (WCDMA1960)  
REV.PrD 07/99  
–6 –  
Preliminary TechnicalData  
ADF4210/ADF4211/ADF4212/ADF4213  
T YP IC AL P E RF O RM ANC E C H ARAC T E RIST IC S (con tin -  
u ed )  
Figure 14. ADF4210 Phase Noise Floor vs PFD Fre-  
quency  
Figure 15. ADF4211 Phase Noise Floor vs PFD Fre-  
quency  
Figure 16. ADF4212 Phase Noise Floor vs PFD Fre-  
quency  
Figure 17.ADF4213 Phase Noise Floor vs PFD Fre-  
quency  
Figure 18.  
Figure 19.  
REV.PrD 07/99  
–7 –  
Preliminary TechnicalData  
ADF4210/ADF4211/ADF4212/ADF4213  
P IN D E S C R IP T IO N  
Mnem onic  
Function  
Vcc1  
Positive power supply for the RF section. A 0.1uF capacitor should be connected between this pin and  
GND. Vcc1 has a value +5V 10% or 3V 10%. Vcc1 must have the same potential as Vcc2.  
Vp1  
RF Charge Pump Power Supply. T his should be greater than or equal to Vcc1.  
CPRF  
RF Charge Pump Output. T his is normally connected to a loop filter which drives the input to an ex-  
ternal VC O.  
D G N D RF  
RFIN  
Digital Ground for the RF digital circuitry.  
Input to the RF Prescaler. T his small signal input is normally taken from the VCO.  
Analog Ground for the RF analog circuitry.  
AG N D RF  
F Lo  
Multiplexed output of RF/IF programmable or reference dividers, RF/IF fastlock mode. CMOS output.  
REF IN  
Reference Input. T his is a CMOS input with a nominal threshold of VDD /2 and an equivalent input  
resistance of 100kΩ. T his input can be driven from a T T L or CMOS crystal oscillator.  
D G N D IF  
Digital Ground for the IF digital,interface and control circuitry  
M U X O U T  
T his multiplexer output allows either the IF/RF Lock Detect, the scaled RF, scaled IF or the scaled  
Reference Frequency to be accessed externally.  
C L K  
Serial Clock Input. T his serial clock is used to clock in the serial data to the registers. T he data is  
latched into the 22-bit shift register on the CLK rising edge. T his input is a high impedance CMOS  
input.  
D AT A  
L E  
Serial Data Input. T he serial data is loaded MSB first with the two LSBs being the control bits. T his  
input is a high impedance CMOS input.  
Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into  
one of the four latches, the latch being selected using the control bits.  
RSET  
Connecting a resistor to this pin sets the maximum charge pump output current. With RSET = 4.7k,  
ICPmax = 5mA.  
AG N D IF  
IFIN  
Analog Ground for the IF analog circuitry.  
Input to the RF Prescaler. T his small signal input is normally taken from the VCO.  
Digital Ground for the IF digital,interface and control circuitry  
D G N D IF  
C PIF  
IF Charge Pump Output. T his is normally connected to a loop filter which drives the input to an exter-  
nal VC O.  
Vp2  
IF Charge Pump Power Supply. T his should be greater than or equal to Vcc2.  
Vcc2  
Positive power supply for the IF section. A 0.1uF capacitor should be connected between this pin and  
GND. Vcc1 has a value +5V ±10% or 3V ±10%. Vcc1 must have the same potential as Vcc1.  
P IN C O NF IG U R AT IO N  
VCC  
1
VCC  
VP2  
2
VP1  
CPRF  
CPIF  
DGNDRF  
RFIN  
DGNDIF  
IFIN  
ADF4210  
ADF4211  
ADF4212  
ADF4213  
AGNDIF  
AGNDRF  
R
FL  
O
SET  
REFIN  
LE  
DGNDIF  
DATA  
CLK  
MUXOUT  
REV.PrD 07/99  
–8 –  
Preliminary TechnicalData  
ADF4210/ADF4211/ADF4212/ADF4213  
C IR C U IT D E S C R IP T IO N  
INP UT SH IFT RE GISTE R  
P RO G RAM M AB LE RE F E RE NC E (R) C O UNT E R  
If control bits C2, C1 are 0,0 then the data is transferred  
from the input shift register to the 14 Bit IFR counter. If  
the control bits 1,0 then the data is transferred to the 14 Bit  
RFR counter T ables 2a and 2b shows the input shift regis-  
ter data format for the IF and RF R conters and T able 3  
shows the divide ratios possible.  
T he functional block diagram for the ADF4210 family is  
shown on page 1. T he main blocks include a 22-bit input  
shift register, two 15-bit R counters and two N counters  
(15 bit resloution for the IF and 18 bit resolution for the  
RF). Data is clocked into the 24-bit shift register on each  
rising edge of CLK. T he data is clocked in MSB first.  
Data is transferred from the shift register to one of four  
latches on the rising edge of LE. T he destination latch is  
determined by the state of the two control bits (C2, C1) in  
the shift register. T hese are the two lsb's DB1, DB0 as  
shown in the timing diagram of Figure 1. T he truth table  
for these bits is shown in T able 1.  
Table 1. C2, C1 Tr uth Table  
C on tr ol Bits  
C 2  
C 1  
D a ta La tch  
0
0
1
1
0
1
0
1
IF R Counter  
IF N Counter (A and B)  
RF R Counter  
RF N Counter  
Table 2a. IF R Counter  
IF CP Current  
Setting  
14-Bit Reference Counter  
Control  
Bits  
IF F  
O
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9  
DB8  
R7  
DB7  
R6  
DB6  
R5  
DB5  
R4  
DB4  
R3  
DB3  
R2  
DB2  
R1  
DB1  
DB0  
IF CPI 2 IF CPI 1 IF CPI 0  
P4  
P3  
P2  
P1  
R14  
R13 R12  
R11  
R10  
R9  
R8  
C2(0) C1(0)  
Table 2b. RF R Counter  
RF CP  
Cu rrent  
Setting  
14-Bit Reference Counter  
Control  
Bits  
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9  
DB8  
R7  
DB7  
R6  
DB6  
R5  
DB5  
R4  
DB4  
R3  
DB3  
R2  
DB2  
R1  
DB1  
DB0  
RF CPI 2 RF CPI 1 RF CPI 0  
P12  
P11  
P10  
R15  
P9  
R14  
R13 R12  
R11  
R10  
R9  
R8  
C2(1) C1(0)  
Table 3.  
IF/RF R Counter D ivide Ratios  
D ivide Ratio  
R14 R13 R12 R11 R10  
R9  
0
0
*
*
R8 R7  
R6  
0
0
*
*
R5  
0
0
*
*
R4  
R3  
R2  
R1  
1
0
1
2
*
*
0
0
0
0
*
*
1
1
0
0
*
*
1
1
0
0
*
*
1
1
0
0
*
*
1
1
0
0
*
*
1
1
0
0
*
*
1
1
0
0
*
*
1
1
0
0
*
*
1
1
0
1
*
*
1
1
*
*
1
1
*
0
1
16382  
16383  
1
1
1
1
1
1
NOTES  
1. Divideratio: 1to16383  
REV.PrD 07/99  
–9 –  
Preliminary TechnicalData  
ADF4210/ADF4211/ADF4212/ADF4213  
P RO G RAM M AB LE N C O U NT E R  
P u lse Swallow F u n ction  
If control bits C2, C1 are 0, 1 then the data in the input  
register is used to program the IFN (A + B) counter. If  
the control bits 1,1 then the data is transferred to the RFN  
counter. T he N counter consists of a 6-bit swallow counter  
(A counter) and 12-bit programmable counter (B counter).  
T able 4 shows the input register data format for program-  
ming the N counters. T able 5 and 6 show the truth table  
for the RF and IF A counters. T able 7 is the truth table  
for the RF/IF B counter.  
T he A and B counters, in conjunction with the dual modu-  
lus prescaler make it possible to generate output frequen-  
cies which are spaced only by the Reference Frequency  
divided by R . T he equation for the VCO frequency is as  
follows:  
fVCO = [(P x B) + A] x fREFIN /R  
fVCO  
:
Ouput Frequency of external voltage controlled  
oscillator (VC O).  
P :  
B:  
A:  
Preset modulus of dual modulus prescaler.  
Preset Divide Ratio of binary 12-bit counter (3  
Preset Divide Ratio of binary 6-bit swallow  
counter.  
fREFIN: Ouput frequency of the external reference  
frequency oscillator.  
R :  
Preset divide ratio of binary 14-bit  
programmable reference counter (3 to 16383).  
Table 4a. IF N Counter  
Control  
Bits  
6-Bit A Counter  
12-Bit B Counter  
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9  
P6 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2  
DB8  
B1  
DB7  
A6  
DB6  
A5  
DB5  
A4  
DB4  
A3  
DB3  
A2  
DB2  
A1  
DB1  
DB0  
C2(0) C1(1)  
P8  
P7  
B12  
Table 4b. RF N Counter  
Control  
Bits  
6-Bit A Counter  
12-Bit B Counter  
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9  
P14 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2  
DB8  
B1  
DB7  
A6  
DB6  
A5  
DB5  
A4  
DB4  
A3  
DB3  
A2  
DB2  
A1  
DB1  
DB0  
C2(1) C1(1)  
P16  
B12  
P15  
Table 6. IF Swallow Counter (A Counter )  
Table 5. RF Swallow Counter (A Counter )  
Divide Ratio  
Divide Ratio  
A6 A5 A4 A3  
A2 A1  
A6 A5 A4 A3 A2 A1  
0
1
*
X
X
*
X
X
*
0
0
*
0
0
*
0
0
*
1
0
1
*
1
0
1
*
0
0
*
0
0
*
0
0
*
0
0
*
0
0
*
0
1
*
15  
X
X
1
1
127  
1
1
1
1
1
1
NOTES  
1. Divideratio: 0to127.  
2.BisgreaterthanorequaltoA  
NOTES  
1. Divideratio: 0to15  
2.BisgreaterthanorequaltoA  
3.Xequalsdontcarecondition.  
Table 7. B Counter D ivide Ratio  
D ivide Ratio  
N17 N16 N15 N14 N13 N12 N11 N10 N9  
N8  
0
1
*
*
N7  
1
0
*
*
N6  
1
0
*
*
3
4
*
0
0
*
*
1
0
0
*
*
1
0
0
*
*
1
0
0
*
*
1
0
0
*
*
1
0
0
*
*
1
0
0
*
*
1
0
0
*
*
1
0
0
*
*
1
*
4095  
1
1
1
NOTES  
1.Divide ratios less than 3 are prohibited.  
2.Divide ratio: 3 to 4095.  
3.B is must be greater than or equal to A.  
REV.PrD 07/99  
–1 0 –  
Preliminary TechnicalData  
ADF4210/ADF4211/ADF4212/ADF4213  
M U XO U T C on t r ol  
IF P ower D own  
T he on-chip multiplexer is controlled by P12, P11, P4,  
P3 on the ADF4210 Family.  
If P8 has been set to a "1" and P2 has been set to “0”  
(normal operation), then a synchronous power down is  
conducted in the IF section. T he device will automati-  
cally put the IF charge pump into 3-state and then com-  
plete the IF power down. See table 8.  
Table 9. MUXO UT Control  
If P8 has been set to a "1" and P2 has been set to “1”  
(normal operation), then an asynchronous power down is  
conducted in the IF section. T he IF stage of the device  
will go into powerdown on the rising edge of LE which  
latches the "1" to the IF powerdown bit. See table 8.  
P12 P11  
P4  
P3  
Muxout  
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Logic low state  
IF Analog Lock Detect  
IF Reference Divider Output  
IF N Divider Output  
RF Analog Lock Detect  
RF/IF Analog Lock Detect  
IF Digital Lock Detect  
Logic high state  
RF Reference Divider  
RF N Divider  
3-State Output  
IF Counter Reset  
RF Digital Lock Detect  
RF/IF Digital Lock Detect  
RF Counter Reset  
Activation of either synchronous or asynchronous  
powerdown forces the IF loop's R and N dividers to their  
load state conditions and the IFIN section is debiased to a  
high impedance state  
T he REF oscillator circuit is only disabled if both the IF  
and RF Powerdowns are set.  
T he IF section of the devicewill return to normal pow-  
ered-up operation immediately on LE latching a "0" to the  
IF powerdown bit (P8). See table 8.  
IF and RF Counter Reset  
RF P ower D own  
If P16 has been set to a "1" and P10 has been set to “0”  
(normal operation), then a synchronous power down is  
conducted in the RF section. T he device will automati-  
cally put the RF charge pump into 3-state and then com-  
plete the RF power down. See table 8.  
IF P h ase D etector P olar ity  
P1 sets the IF Phase Detector Polarity. When the IF VCO  
characteristics are positive this should be set to “1”.  
When they are negative it should be set to “0”.  
If P16 has been set to a "1" and P10 has been set to “1”  
(normal operation), then an asynchronous power down is  
conducted in the RF section. T he RF stage of the device  
will go into powerdown on the rising edge of LE which  
latches the "1" to the RF powerdown bit. See table 8.  
RF P h ase D etector P olar ity  
P9 sets the IF Phase Detector Polarity. When the RF  
VCO characteristics are positive this should be set to “1”.  
When they are negative it should be set to “0”.  
Activation of either synchronous or asynchronous  
powerdown forces the RF loop's R and N dividers to their  
load state conditions and the RFIN section is debiased to a  
high impedance state  
IF C har ge P um p 3-State  
P2 puts the IF charge pump into 3-state mode when pro-  
grammed to a “1”. It should be set to “0” for normal  
operation.  
T he REF oscillator circuit is only disabled if both the IF  
and RF Powerdowns are set.  
T he RF section of the devicewill return to normal pow-  
ered-up operation immediately on LE latching a "0" to the  
RF powerdown bit (P16). See table 8.  
RF C har ge P um p 3-State  
P10 puts the RF charge pump into 3-state mode when  
programmed to a “1”. It should be set to “0” for normal  
operation.  
IF P r escaler Value  
Table 8. P ower-D own Modes  
P7 and P6 in the IF A,B Counter Latch set the IF  
prescaler values. See T able 10.  
P 10  
P 2  
P 16  
P 8  
RF Mode  
IF Mode  
RF P r escaler Value  
P15 and P14 in the RF A,B Counter Latch set the RF  
prescaler values. See T able 10.  
NOTES  
1. The prescaler value should be chosen so that the  
prescaler output frequency is always less than or  
equal to 125MHz. Thus, with an RF frequency of  
2GHz, a prescaler value of 16/17 is valid but a value  
of 8/9 is not valid.  
X
0
1
0
1
1
Normal Operation  
Synchronous Power-Down  
Asynchronous Power-Down  
REV.PrD 07/99  
–1 1 –  
Preliminary TechnicalData  
ADF4210/ADF4211/ADF4212/ADF4213  
maximum value. Also an extra loop filter damping  
resistor to ground is switched in using the FLO pin.  
thus compensating for the change in loop characteris-  
tics while in Fastlock. Since the RF CP Gain bit is  
contained in the RF N Counter, only one write is  
needed to both program a new output frequency and  
also initiate Fastlock. T o come out of fastlock, the  
RF CP Gain bit on the RF N register must be set to  
"0".  
Table 10. P r escaler Values  
P15  
P7  
0
0
1
P14  
P6  
0
Prescaler Value1  
8/9  
1
0
1
16/17  
32/33  
64/65  
1
IF C h ar ge P u m p C u r r en ts  
IFCP2, IFCP1, IFCP0 program Current Setting for the  
IF charge pump. See T able 11.  
RF C har ge P um p C ur r ents  
RFCP2, RFCP1, RFCP0 program Current Setting for the  
RF charge pump. See T able 11.  
Table 11. Char ge P um p Cur r ents  
RFCP2 RFCP1 RFCP0  
IFCP2 IFCP1 IFCP0 Output  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0.625 mA  
1.25 mA  
1.875 mA  
2.5 mA  
3.125 mA  
3.75 mA  
4.375 mA  
5.0 mA  
D evice P r ogr am m in g After In itial P ower - Up.  
After initially powering up the device, there are three ways  
to program the device.  
IF F astlock  
T he IF CP Gain bit of the IF N register in the  
ADF4210 family is the Fastlock Enable Bit. Only  
when this is “1” is IF Fastlock enabled. When  
Fastlock is enabled, the IF CP current is set to it's  
maximum value. Also an extra loop filter damping  
resistor to ground is switched in using the FLO pin.  
thus compensating for the change in loop characteris-  
tics while in Fastlock. Since the IF CP Gain bit is  
contained in the IF N Counter, only one write is  
needed to both program a new output frequency and  
also initiate Fastlock. T o come out of fastlock, the IF  
CP Gain bit on the IF N register must be set to "0".  
RF F astlock  
T he RF CP Gain bit of the RF N register in the  
ADF4210 family is the Fastlock Enable Bit. Only  
when this is “1” is RF Fastlock enabled. When  
Fastlock is enabled, the RF CP current is set to it's  
REV.PrD 07/99  
–1 2 –  

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