ADF5709BEZ-R7 [ADI]
9.85 GHz to 20.5 GHz, Wideband, MMIC VCO;
| 型号： | ADF5709BEZ-R7 |
| 厂家： | 
ADI |
| 描述： | 9.85 GHz to 20.5 GHz, Wideband, MMIC VCO |
| 文件： | 总9页 (文件大小：265K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
9.85 GHz to 20.5 GHz,
Wideband, MMIC VCO
Data Sheet
ADF5709
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Wide output frequency range: 9.85 GHz to 20.5 GHz
Wide tuning bandwidth
Low single sideband phase noise: −83 dBc/Hz at 100 kHz offset
No external resonator needed
Supply current: 70 mA typical at VCC = 5 V
24-terminal, 3.90 mm × 3.90 mm, ceramic LCC package
24 23 22 21 20 19
18
17
16
15
14
13
1
2
3
4
5
6
NC
NC
NC
NC
ADF5709
NC
GND
RFOUT
GND
NC
V
TUNE
NC
NC
7
8
9 10 11 12
PACKAGE
BASE
APPLICATIONS
GND
Figure 1.
Industrial and medical equipment
Test and measurement equipment
Military radars, electronic warfare (EW), and electronic
countermeasures (ECMs)
Point to point and multipoint radios
Very small aperture terminals (VSATs)
Wireless communication infrastructure
The low input impedance on the VTUNE pin of the ADF5709
enables high tuning speed and modulation bandwidth, which
allows faster frequency sweeps and lock times when used as
part of a frequency synthesizer, for example, in radar or in test
and measurement applications.
GENERAL DESCRIPTION
The ADF5709 wideband, monolithic microwave integrated
circuit (MMIC), voltage controlled oscillator (VCO) supports
an output frequency (fOUT) range of 9.85 GHz to 20.5 GHz while
maintaining −83 dBc/Hz phase noise at 100 kHz offset without
subharmonic tones. The wide frequency tuning range and low
phase noise allow phase-locked loop (PLL) solutions for a variety
of frequency bands and limit the need for multiple narrow-band
VCOs. The broad frequency coverage reduces the board design
complexity and simplifies the bill of materials when designing
RF and microwave applications.
The ADF5709 is encapsulated into a tiny, 3.90 mm × 3.90 mm,
RoHS compliant, ceramic leadless chip carrier (LCC) package.
The package includes through vias to the exposed pad,
enhancing thermal characteristics.
The small size, optimal noise performance, low power
consumption, and wide tuning range of the ADF5709 make
the device ideal for many applications requiring flexibility,
high performance, a small footprint, and a tight power budget.
The VCO operates from a single 5 V supply and consumes
only 70 mA of supply current that results in minimal power
dissipation. The ADF5709 low power consumption is ideal
for high performance applications with limited or no airflow.
The monolithic construction of the VCO allows optimal output
power and noise characteristics over temperature variations.
The ADF5709 is pin to pin compatible with the HMC733 and
other Analog Devices, Inc., wideband VCOs.
The VCO is fully integrated and incorporates a resonator, a
negative resistance device, and a varactor diode that minimize
the number of external components and reduces board space.
Rev. A
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice.
No license is granted by implication or otherwise under any patent or patent rights of Analog
Devices. Trademarks and registeredtrademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2020 Analog Devices, Inc. All rights reserved.
www.analog.com
ADF5709
Data Sheet
TABLE OF CONTENTS
Features.............................................................................................. 1
ESD Caution ..................................................................................4
Pin Configuration and Function Descriptions .............................5
Interface Schematics .....................................................................5
Typical Performance Characteristics .............................................6
Applications Information ................................................................8
Outline Dimensions..........................................................................9
Ordering Guide .............................................................................9
Applications ...................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications .................................................................................... 3
Absolute Maximum Ratings ........................................................... 4
Thermal Resistance...................................................................... 4
Electrostatic Discharge (ESD) Ratings...................................... 4
REVISION HISTORY
12/2020—Revision A: Initial Version
Rev. A | Page 2 of 9
Data Sheet
ADF5709
SPECIFICATIONS
TA = −40°C to +85°C and VCC = 5 V, unless otherwise noted.
Table 1.
Parameter
FREQUENCY
fOUT
Min
Typ
Max
Unit
Test Conditions/Comments
9.85
20.5
GHz
Drift Rate
Pulling
Pushing
0.5
15
−240
MHz/°C
MHz p-p
MHz/V
Pulling into a 2.0:1 voltage standing wave ratio (VSWR)
Frequency = 20.5 GHz
OUTPUT POWER (POUT
RFOUT
)
−4.5
−6
0
+2
+4
87
dBm
dBm
mA
Temperature = 25°C
Supply Current (ICC
)
70
HARMONICS, SUBHARMONICS
Second
Third
−15
−30
dBc
dBc
Measured to 16.67 GHz due to test equipment limitation
TUNING
Voltage (VTUNE
Sensitivity
Tune Port Leakage Current
OUTPUT RETURN LOSS
SINGLE SIDEBAND PHASE NOISE
10 kHz Offset
)
−0.5
220
+23
870
100
V
MHz/V
μA
9.8 GHz to 20.5 GHz only
VTUNE = 23 V
10
dB
−51
100 kHz Offset
1 MHz Offset
10 MHz Offset
−83
−115
−135
−70
dBc/Hz
dBc/Hz
Rev. A | Page 3 of 9
ADF5709
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Parameter
Rating
VCC
VTUNE
5.5 V dc
−1 V to +25 V
Temperature
Operating
Storage
Nominal Junction (to Maintain 1 Million
Hours Mean Time to Failure (MTTF))
Nominal Junction (TA = 85°C)
Peak Reflow (Moisture Sensitivity
Level 3 (MSL3) Rating)
θ
JA is specified for the worst-case conditions, that is, a device
−40°C to +85°C
−65°C to +150°C
135°C
soldered in a circuit board for surface-mount packages. θJC is
the thermal resistance from the operating portion of the device
to the outside surface of the package (case) closest to the device
mounting area.
119°C
260°C
Table 3. Thermal Resistance
Package Type1
θJA
θJC
Unit
E-24-2
58.6
21.9
°C/W
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
1 The thermal impedance simulated values are based on the JESD-51 standard
using 2S2P on FR4 with four standard JEDEC vias (0.3 mm diameter,
0.025 mm plating, and 1.2 mm pitch).
ELECTROSTATIC DISCHARGE (ESD) RATINGS
The following ESD information is provided for handling of
ESD-sensitive devices in an ESD protected area only.
Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.
ESD Ratings for ADF5709
Table 4. ADF5709, 24-Terminal Ceramic LCC
ESD Model Withstand Threshold (V)
HBM1
250
Class
1A
ESD CAUTION
Rev. A | Page 4 of 9
Data Sheet
ADF5709
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
ADF5709
24 23 22 21 20 19
18
17
16
15
14
13
1
2
3
4
5
6
NC
NC
NC
NC
NC
GND
RFOUT
GND
NC
TOP VIEW
(Not to Scale)
V
TUNE
NC
NC
7
8
9 10 11 12
NOTES
1. NC = NO CONNECT. HOWEVER, THESE PINS CAN BE CONNECTED
TO RF OR DC GROUND WITHOUT AFFECTING THE PERFORMANCE
OF THE DEVICE.
2. EXPOSED PAD. THE PACKAGE BOTTOM HAS AN EXPOSED METAL
PAD THAT MUST BE CONNECTED TO RF OR DC GROUND.
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
Mnemonic Description
1 to 3, 5 to 11, 13, 17 to 24 NC
No Connect. However, these pins can be connected to RF or dc ground without affecting the
performance of the device.
4
VTUNE
Control Voltage and Modulation Input. The modulation bandwidth is dependent on the drive
source impedance.
12
VCC
Supply Voltage (5 V dc).
14, 16
15
GND
RFOUT
Ground. The GND pins must be connected to RF or dc ground.
RF Output. The RFOUT pin is ac-coupled and a VSWR load of ≤2.0:1 must be maintained across
frequency. Connect a 100 nF coupling capacitor to the RFOUT pin for protection.
EP
Exposed Pad. The package bottom has an exposed metal pad that must be connected to RF or
dc ground.
INTERFACE SCHEMATICS
GND
50Ω
V
TUNE
1.4pF
13.6pF
3.7pF
Figure 3. VTUNE Interface
Figure 5. GND Interface
RFOUT
20Ω
V
CC
12pF
27pF
1.9Ω
Figure 6. RFOUT Interface
Figure 4. VCC Interface
Rev. A | Page 5 of 9
ADF5709
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
23
T
T
T
= +85°C
= +25°C
= –40°C
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
A
A
A
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
–1
–1
1
3
5
7
9
11 13 15 17 19 21 23
(V dc)
1
3
5
7
9
11 13 15 17 19 21 23
(V dc)
V
V
TUNE
TUNE
Figure 10. ICC vs. VTUNE for Various Temperatures
Figure 7. fOUT vs. VTUNE for Various Temperatures
–30
6
5
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
–40
–50
10kHz
4
3
–60
–70
2
1
100kHz
–80
0
–1
–2
–3
–4
–5
–6
–90
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
–100
–110
1MHz
–120
–130
–1
1
3
5
7
9
11 13 15 17 19 21 23
(V dc)
–1
1
3
5
7
9
11 13 15 17 19 21 23
(V dc)
V
V
TUNE
TUNE
Figure 8. POUT vs. VTUNE for Various Temperatures
Figure 11. Single Sideband Phase Noise vs. VTUNE for
Various Temperatures and Frequencies
2000
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
T
T
T
= +85°C
= +25°C
= –40°C
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
A
A
A
1800
1600
1400
1200
1000
800
–110
–120
–130
–140
–150
–160
–170
600
400
200
0
1k
10k
100k
1M
10M
40M
–1
1
3
5
7
9
11 13 15 17 19 21 23
(V dc)
OFFSET FREQUENCY (Hz)
V
TUNE
Figure 12. Single Sideband Phase Noise vs. Offset Frequency for
Various Temperatures at VTUNE = 10 V
Figure 9. Tuning Sensitivity vs. VTUNE for Various Temperatures
Rev. A | Page 6 of 9
Data Sheet
ADF5709
0
0
T
T
T
= +85°C
= +25°C
= –40°C
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
A
A
A
–5
–5
–10
–15
–20
–10
–15
–20
–25
–25
–30
–30
–35
–40
–45
–35
–40
–45
–1
1
3
5
7
9
11 13 15 17 19 21 23
(V dc)
–1
0
1
2
3
4
5
6
7
8
9
10 11
V
V
(V dc)
TUNE
TUNE
Figure 13. Second Harmonic vs. VTUNE for Various Temperatures
Figure 15. Third Harmonic vs. VTUNE for Various Temperatures,
Measured Up to 11 V Only due to Equipment Limitation
0
50
T
T
T
= +85°C
= +25°C
= –40°C
A
A
A
0
–50
–2
–4
–100
–150
–200
–250
–300
–6
–8
–10
V
V
= 5V
= 10V
= 25°C
CC
TUNE
–12
–14
T
A
0.50
6.62
12.75
18.87
25.00
–1
1
3
5
7
9
11 13 15 17 19 21 23
(V dc)
FREQUENCY (GHz)
V
TUNE
Figure 14. Output Return Loss vs. Frequency at VTUNE = 10 V
Figure 16. VCC Pushing vs. VTUNE for Various Temperatures
Rev. A | Page 7 of 9
ADF5709
Data Sheet
APPLICATIONS INFORMATION
The ADF5709 serves as the local oscillator (LO) in microwave
synthesizer applications. The primary applications for this
device are point to point and multipoint radios, military radars,
test and measurement, industrial and medical equipment, and
wireless communication infrastructure. The low phase noise
allows higher orders of modulation and offers improved bit
error rates in communication systems. The linear, monotonic
tuning sensitivity allows a stable loop filter design. The higher
output power minimizes the gain required to drive subsequent
stages. The cascode output buffer amplifier stage guarantees
stability over a wide range of output load conditions and
improves the pulling performance of the VCO.
The wide frequency range of the VCO suggests the use of a low
noise, PLL synthesizer, such as the ADF41513. The wide input
bandwidth of this synthesizer (1 GHz to 26.5 GHz) makes the
ADF41513 an ideal synthesizer for use with the ADF5709. The
variable charge pump current allows compensation for VCO
sensitivity variation by allowing charge pump currents to be
increased or decreased as required. Ensure that optimal RF
layout practices are used for the layout of the interconnecting
circuits. Give first priority to the microwave power splitter
network from the output buffer of the VCO to the RF input pin
(RFIN1A) of the ADF41513. Give the next highest priority to the
highly sensitive VTUNE line with the first pole placed as close to
the ADF41513 CP output pin as possible, and the final RC pole
of the filter placed as close to the ADF5709 VTUNE pin as possible.
The wide tuning range of the ADF5709 requires the use of a
high voltage, low noise, op amp. The ADA4625-1 is acceptable
to use for such applications.
To achieve optimal performance of the VCO, high power
supply rejection ratio (PSRR) and low dropout (LDO) regulators
are recommended to minimize any spurious frequencies from the
power supply and to achieve the lowest phase noise native to
the VCO. The ADM7150 and the LT3042 meet these
requirements and are acceptable LDO regulators to use.
The suggested PCB stack up consists of a high quality dielectric
material, such as Rogers 4003. The transmission lines carrying
the high frequency signal must be carefully controlled, 50 Ω
characteristic impedances.
V
DD
V
P
2
3
6
7
8
9
2200pF
24 23 22 21 20 19
75nF
62Ω
POWER
SPLITTER
1
2
3
4
5
6
18
ADF5709
V
P
22
17
16
15
14
13
RFOUT1
220Ω
V /2
V
RFOUT
TUNE
100nF
–
+
24
36Ω
RFOUT1
RFOUT2
1nF
CP
REF
REF
RFIN
GND
10
IN
IN
P
ADF41513
240pF
15nF
ADA4625-1
7
8
9
10 11 12
13
CE
14 CLK
LOCK
DETECT
LOCK
DETECT
11
17
DLD
DATA
15
16
V
CC
LE
MUXOUT
1pF
23
R
SET
5
4
RF 1A
IN
RF 1B
IN
DC1
DC2
4.7kΩ
20
21
1pF
19
EP
18
1
NOTES
THIS IS A SIMPLIFIED SCHEMATIC, DECOUPLING CAPACITORS AND SPI CONNECTION DETAILS HAVE BEEN OMITTED FOR CLARITY.
Figure 17. Typical Application Diagram
Rev. A | Page 8 of 9
Data Sheet
ADF5709
OUTLINE DIMENSIONS
4.05
3.90 SQ
3.75
0.36
0.30
0.24
PIN 1
INDICATOR
AREA
0.08
REF
PIN 1
24
19
18
1
0.50
BSC
2.60
2.50 SQ
2.40
EXPOSED
PAD
13
6
12
7
0.38
0.32
0.26
0.20
MIN
BOTTOM VIEW
2.50 REF
TOP VIEW
SIDE VIEW
1.20
1.10
1.00
3.10 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 18. 24-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-24-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
MSL Rating2
MSL3
Package Description
Package Option
E-24-2
E-24-2
ADF5709BEZ
ADF5709BEZ-R7
EV-ADF5709
−40°C to +85°C
−40°C to +85°C
24-Terminal Ceramic Leadless Chip Carrier [LCC]
24-Terminal Ceramic Leadless Chip Carrier [LCC]
Evaluation Board
MSL3
1 Z = RoHS Compliant Part.
2 See the Absolute Maximum Ratings section.
©2020 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D20685-12/20(A)
Rev. A | Page 9 of 9
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