ADG409BRZ-REEL7 [ADI]

LC2MOS ±15 V 4 Channel High Performance Analog Multiplexer;
ADG409BRZ-REEL7
型号: ADG409BRZ-REEL7
厂家: ADI    ADI
描述:

LC2MOS ±15 V 4 Channel High Performance Analog Multiplexer

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LC2MOS 4-/8-Channel  
High Performance Analog Multiplexers  
a
ADG408/ADG409  
FEATURES  
FUNCTIONAL BLOCK DIAGRAMS  
44 V Supply Maximum Ratings  
VSS to VDD Analog Signal Range  
Low On Resistance (100 max)  
Low Power (ISUPPLY < 75 A)  
Fast Switching  
ADG408  
ADG409  
S1  
S1A  
S4A  
DA  
DB  
Break-Before-Make Switching Action  
Plug-in Replacement for DG408/DG409  
D
APPLICATIONS  
S1B  
S4B  
Audio and Video Routing  
Automatic Test Equipment  
Data Acquisition Systems  
Battery-Powered Systems  
Sample-and-Hold Systems  
Communication Systems  
S8  
1-OF-8  
DECODER  
1-OF-4  
DECODER  
A0 A1 A2 EN  
A0 A1 EN  
GENERAL DESCRIPTION  
PRODUCT HIGHLIGHTS  
The ADG408 and ADG409 are monolithic CMOS analog  
multiplexers comprising eight single channels and four differen-  
tial channels, respectively. The ADG408 switches one of eight  
inputs to a common output as determined by the 3-bit binary  
address lines A0, A1, and A2. The ADG409 switches one of  
four differential inputs to a common differential output as  
determined by the 2-bit binary address lines A0 and A1. An  
EN input on both devices is used to enable or disable the  
device. When disabled, all channels are switched OFF.  
The ADG408/ADG409 are designed on an enhanced LC2MOS  
process that provides low power dissipation yet gives high  
switching speed and low on resistance. Each channel conducts  
equally well in both directions when ON and has an input signal  
range that extends to the supplies. In the OFF condition, signal  
levels up to the supplies are blocked. All channels exhibit break-  
before-make switching action, preventing momentary shorting  
when switching channels. Inherent in the design is low charge  
injection for minimum transients when switching the digital inputs.  
1. Extended Signal Range.  
The ADG408/ADG409 are fabricated on an enhanced  
LC2MOS process, giving an increased signal range that  
extends to the supply rails.  
2. Low Power Dissipation.  
3 Low RON  
.
4. Single-Supply Operation.  
For applications where the analog signal is unipolar, the  
ADG408/ADG409 can be operated from a single rail power  
supply. The parts are fully specified with a single 12 V power  
supply and will remain functional with single supplies as  
low as 5 V.  
The ADG408/ADG409 are improved replacements for the  
DG408/DG409 analog multiplexers.  
REV. B  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, norforanyinfringementsofpatentsorotherrightsofthirdpartiesthat  
may result from its use. No license is granted by implication or otherwise  
under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective companies.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
www.analog.com  
© 2003 Analog Devices, Inc. All rights reserved.  
ADG408/ADG409–SPECIFICATIONS  
DUAL SUPPLY1  
(VDD = +15 V, VSS = –15 V, GND = 0 V, unless otherwise noted.)  
B Version  
–40؇C to  
+85؇C  
T Version  
–55؇C to  
+25؇C +125؇C  
Parameter  
+25؇C  
Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
RON  
V
SS to VDD  
VSS to VDD  
V
40  
100  
15  
40  
100  
15  
W typ  
W max  
W max  
VD = ±10 V, IS = –10 mA  
125  
125  
DRON  
VD = +10 V, –10 V  
LEAKAGE CURRENTS  
Source OFF Leakage IS (OFF)  
±0.5  
±50  
±0.5  
±50  
nA max  
VD = ±10 V, VS = 10 V;  
Test Circuit 2  
Drain OFF Leakage ID (OFF)  
ADG408  
VD = ±10 V; VS = 10 V;  
±1  
±1  
±100  
±50  
±1  
±1  
±100  
±50  
nA max  
nA max  
Test Circuit 3  
ADG409  
Channel ON Leakage ID, IS (ON)  
ADG408  
VS = VD = ±10 V;  
Test Circuit 4  
±1  
±1  
±100  
±50  
±1  
±1  
±100  
±50  
nA max  
nA max  
ADG409  
DIGITAL INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current  
2.4  
0.8  
2.4  
0.8  
V min  
V max  
I
INL or IINH  
±10  
±10  
mA max  
pF typ  
VIN = 0 or VDD  
f = 1 MHz  
CIN, Digital Input Capacitance  
8
8
DYNAMIC CHARACTERISTICS2  
tTRANSITION  
120  
250  
120  
250  
ns typ  
RL = 300 W, CL = 35 pF;  
ns max  
VS1 = ±10 V, VS8 = 10 V;  
Test Circuit 5  
tOPEN  
10  
10  
10  
10  
ns min  
RL = 300 W, CL = 35 pF;  
VS = 5 V; Test Circuit 6  
RL = 300 W, CL = 35 pF;  
VS = 5 V; Test Circuit 7  
RL = 300 W, CL = 35 pF;  
VS = 5 V; Test Circuit 7  
VS = 0 V, RS = 0 W, CL = 10 nF;  
Test Circuit 8  
t
t
ON (EN)  
OFF (EN)  
85  
150  
125  
225  
65  
85  
150  
125  
225  
65  
ns typ  
ns max  
ns typ  
ns max  
pC typ  
150  
150  
Charge Injection  
OFF Isolation  
20  
20  
–75  
85  
–75  
85  
dB typ  
dB typ  
pF typ  
RL = 1 kW, f = 100 kHz;  
V
EN = 0 V; Test Circuit 9  
Channel-to-Channel Crosstalk  
CS (OFF)  
RL = 1 kW, f = 100 kHz;  
Test Circuit 10  
f = 1 MHz  
11  
11  
C
D (OFF)  
ADG408  
ADG409  
f = 1 MHz  
40  
20  
40  
20  
pF typ  
pF typ  
CD, CS (ON)  
ADG408  
f = 1 MHz  
54  
34  
54  
34  
pF typ  
pF typ  
ADG409  
POWER REQUIREMENTS  
IDD  
1
5
1
5
1
5
1
5
mA typ  
mA max  
mA typ  
mA max  
mA typ  
mA max  
VIN = 0 V, VEN = 0 V  
VIN = 0 V, VEN = 2.4 V  
ISS  
IDD  
100  
200  
100  
200  
500  
500  
NOTES  
1Temperature ranges are as follows: B Version: –40C to +85C; T Version: –55C to +125C.  
2Guaranteed by design, not subject to production test.  
Specifications subject to change without notice.  
–2–  
REV. B  
ADG408/ADG409  
SINGLE SUPPLY1  
(VDD = 12 V, VSS = 0 V, GND = 0 V, unless otherwise noted.)  
B Version  
T Version  
–40؇C to  
–55؇C to  
Parameter  
+25؇C  
+85؇C  
+25؇C +125؇C  
Unit  
Test Conditions/Comments  
ANALOG SWITCH  
Analog Signal Range  
RON  
0 to VDD  
0 to VDD  
90  
V
W typ  
90  
VD = 3 V, 10 V, IS = –1 mA  
LEAKAGE CURRENTS  
Source OFF Leakage IS (OFF)  
±0.5  
±50  
±0.5  
±50  
nA max  
VD = 8 V/0 V, VS = 0 V/8 V;  
Test Circuit 2  
Drain OFF Leakage ID (OFF)  
ADG408  
VD = 8 V/0 V, VS = 0 V/8 V;  
Test Circuit 3  
±1  
±1  
±100  
±50  
±1  
±1  
±100  
±50  
nA max  
nA max  
ADG409  
Channel ON Leakage ID, IS (ON)  
ADG408  
VS = VD = 8 V/0 V;  
Test Circuit 4  
±1  
±1  
±100  
±50  
±1  
±1  
±100  
±50  
nA max  
nA max  
ADG409  
DIGITAL INPUTS  
Input High Voltage, VINH  
Input Low Voltage, VINL  
Input Current  
2.4  
0.8  
2.4  
0.8  
V min  
V max  
I
INL or IINH  
±10  
±10  
mA max  
pF typ  
VIN = 0 or VDD  
f = 1 MHz  
CIN, Digital Input Capacitance  
8
8
DYNAMIC CHARACTERISTICS2  
tTRANSITION  
130  
130  
ns typ  
RL = 300 W, CL = 35 pF;  
V
S1 = 8 V/0 V, VS8 = 0 V/8 V;  
Test Circuit 5  
tOPEN  
10  
140  
60  
5
10  
140  
60  
5
ns typ  
ns typ  
ns typ  
pC typ  
dB typ  
dB typ  
pF typ  
RL = 300 W, CL = 35 pF;  
VS = 5 V; Test Circuit 6  
RL = 300 W, CL = 35 pF;  
VS = 5 V; Test Circuit 7  
RL = 300 W, CL = 35 pF;  
VS = 5 V; Test Circuit 7  
VS = 0 V, RS = 0 W, CL = 10 nF;  
Test Circuit 8  
t
t
ON (EN)  
OFF (EN)  
Charge Injection  
OFF Isolation  
–75  
85  
11  
–75  
85  
11  
RL = 1 kW, f = 100 kHz;  
V
EN = 0 V; Test Circuit 9  
Channel-to-Channel Crosstalk  
CS (OFF)  
RL = 1 kW, f = 100 kHz;  
Test Circuit 10  
f = 1 MHz  
C
D (OFF)  
ADG408  
ADG409  
f = 1 MHz  
40  
20  
40  
20  
pF typ  
pF typ  
CD, CS (ON)  
ADG408  
f = 1 MHz  
54  
34  
54  
34  
pF typ  
pF typ  
ADG409  
POWER REQUIREMENTS  
IDD  
1
5
1
5
mA typ  
mA max  
mA typ  
mA max  
VIN = 0 V, VEN = 0 V  
VIN = 0 V, VEN = 2.4 V  
IDD  
100  
200  
100  
200  
500  
500  
NOTES  
1Temperature ranges are as follows: B Version: –40C to +85C; T Version: –55C to +125C.  
2Guaranteed by design, not subject to production test.  
Specifications subject to change without notice.  
REV. B  
–3–  
ADG408/ADG409  
ABSOLUTE MAXIMUM RATINGS1  
(TA = 25C, unless otherwise noted.)  
ORDERING GUIDE  
Temperature Range  
Model1  
Package Option2  
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 V  
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V  
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V  
Analog, Digital Inputs2 . . . VSS – 2 V to VDD + 2 V or 20 mA,  
Whichever Occurs First  
ADG408BN  
ADG408BR  
ADG408BRU  
ADG408TQ  
–40C to +85C  
–40C to +85C  
–40C to +85C  
–55C to +125C  
N-16  
R-16A  
RU-16  
Q-16  
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA  
Peak Current, S or D  
(Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA  
Operating Temperature Range  
ADG409BN  
ADG409BR  
ADG409BRU  
ADG409TQ  
–40C to +85C  
–40C to +85C  
–40C to +85C  
–55C to +125C  
N-16  
R-16A  
RU-16  
Q-16  
Industrial (B Version) . . . . . . . . . . . . . . . . –40C to +85C  
Extended (T Version) . . . . . . . . . . . . . . . –55C to +125C  
Storage Temperature Range . . . . . . . . . . . –65C to +150C  
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150C  
CERDIP Package, Power Dissipation . . . . . . . . . . . . 900 mW  
qJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 76C/W  
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300C  
PDIP Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW  
qJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 117C/W  
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 260C  
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 450 mW  
qJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 155C/W  
qJC, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 50C/W  
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW  
qJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 77C/W  
Lead Temperature, Soldering  
NOTES  
1To order MIL-STD-883, Class B processed parts, add /883B to T grade part  
numbers.  
2N = PDIP; Q = CERDIP; R = 0.15" Small Outline IC (SOIC);  
RU = Thin Shrink Small Outline Package (TSSOP).  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220C  
NOTES  
1 Stresses above those listed under Absolute Maximum Ratings may cause per-  
manent damage to the device. This is a stress rating only; functional operation  
of the device at these or any other conditions above those listed in the opera-  
tional sections of this specification is not implied. Exposure to absolute maxi-  
mum rating conditions for extended periods may affect device reliability. Only  
one absolute maximum rating may be applied at any one time.  
2 Overvoltages at A, EN, S, or D will be clamped by internal diodes. Current  
should be limited to the maximum ratings given.  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection.  
Although the ADG408/ADG409 feature proprietary ESD protection circuitry, permanent  
damage may occur on devices subjected to high energy electrostatic discharges. Therefore,  
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.  
–4–  
REV. B  
ADG408/ADG409  
PIN CONFIGURATIONS (DIP/SOIC/TSSOP)  
TERMINOLOGY  
VDD  
VSS  
Most positive power supply potential.  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
1
2
3
4
5
6
7
8
16  
A0  
EN  
A1  
A0  
EN  
A1  
Most negative power supply potential in dual  
supplies. In single supply applications, it may  
be connected to ground.  
15 GND  
A2  
V
14  
13  
12  
11  
10  
9
V
DD  
V
GND  
SS  
SS  
ADG408  
S1A  
S1B  
S2B  
S3B  
S4B  
DB  
S1  
V
ADG409  
TOP VIEW  
DD  
TOP VIEW  
GND  
Ground (0 V) reference.  
S2A  
S3A  
S4A  
DA  
S2  
S3  
S4  
D
S5  
S6  
S7  
S8  
(Not to Scale)  
(Not to Scale)  
RON  
Ohmic resistance between D and S.  
DRON  
Difference between the RON of any two channels.  
Source leakage current when the switch is off.  
Drain leakage current when the switch is off.  
Channel leakage current when the switch is on.  
Analog voltage on terminals D, S.  
IS (OFF)  
ID (OFF)  
ID, IS (ON)  
ADG408 Truth Table  
V
D (VS)  
CS (OFF)  
D (OFF)  
ON  
SWITCH  
A2  
A1  
A0  
EN  
Channel input capacitance for OFF condition.  
Channel output capacitance for OFF condition.  
C
X
0
0
0
0
1
1
1
1
X
0
0
1
1
0
0
1
1
X
0
1
0
1
0
1
0
1
0
1
1
1
1
1
1
1
1
NONE  
1
2
3
4
5
6
7
8
CD, CS (ON) ON switch capacitance.  
CIN  
Digital input capacitance.  
t
ON (EN)  
Delay time between the 50% and 90% points of  
the digital input and switch ON condition.  
t
OFF (EN)  
Delay time between the 50% and 90% points of  
the digital input and switch OFF condition.  
tTRANSITION  
Delay time between the 50% and 90% points of  
the digital inputs and the switch ON condition  
when switching from one address state to another.  
ADG409 Truth Table  
tOPEN  
OFF time measured between the 80% point  
of both switches when switching from one  
address state to another.  
ON SWITCH  
PAIR  
Al  
A0  
EN  
X
0
0
1
1
X
0
1
0
1
0
1
1
1
1
NONE  
VINL  
VINH  
Maximum input voltage for Logic 0.  
Minimum input voltage for Logic 1.  
Input current of the digital input.  
1
2
3
4
IINL (IINH  
)
Crosstalk  
A measure of unwanted signal that is coupled  
through from one channel to another as a result  
of parasitic capacitance.  
Off Isolation A measure of unwanted signal coupling through  
an OFF channel.  
Charge  
Injection  
A measure of the glitch impulse transferred  
from the digital input to the analog output  
during switching.  
IDD  
ISS  
Positive supply current.  
Negative supply current.  
REV. B  
–5–  
ADG408/ADG409  
–Typical Performance Characteristics  
120  
180  
T
= 25؇C  
A
T
= 25؇C  
A
V
V
= 5V  
= 0V  
160  
140  
120  
100  
80  
V
V
= +5V  
= –5V  
DD  
SS  
DD  
SS  
100  
80  
V
V
= +12V  
= –12V  
DD  
SS  
V
V
= +10V  
= –10V  
DD  
SS  
V
= 12V  
V
V
= 10V  
= 0V  
DD  
DD  
SS  
60  
V
= 0V  
SS  
40  
20  
V
= 15V  
= 0V  
V
V
= +15V  
= –15V  
DD  
DD  
SS  
60  
V
SS  
40  
–15  
–10  
–5  
0
5
10  
15  
0
3
6
9
12  
15  
V
(V ) – V  
S
V
(V ) – V  
S
D
D
TPC 1. RON as a Function of VD (VS): Dual Supply Voltage  
TPC 4. RON as a Function of VD (VS): Single Supply  
Voltage  
100  
130  
V
V
= +15V  
= –15V  
DD  
SS  
V
V
= 12V  
= 0V  
DD  
SS  
90  
80  
70  
60  
50  
40  
30  
120  
110  
100  
90  
125؇C  
125؇C  
85؇C  
85؇C  
25؇C  
80  
25؇C  
70  
60  
–15  
–10  
–5  
0
5
10  
15  
0
2
4
6
8
10  
12  
V
(V ) – V  
S
D
V (V ) – V  
D S  
TPC 2. RON as a Function of VD (VS) for Different  
Temperatures  
TPC 5. RON as a Function of VD (VS) for Different  
Temperatures  
0.2  
0.04  
T
= 25؇C  
A
T
V
V
= 25؇C  
A
V
V
= +15V  
= –15V  
DD  
SS  
= 12V  
= 0V  
DD  
SS  
0.02  
0
0.1  
0
I
(OFF)  
S
I
(ON)  
D
I
(OFF)  
D
I
(OFF)  
D
I
(OFF)  
S
–0.02  
–0.04  
–0.06  
I
(ON)  
D
–0.1  
–0.2  
–15  
–10  
–5  
0
5
10  
15  
0
2
4
6
8
10  
12  
V
(V ) – V  
S
D
V
(V ) – V  
S
D
TPC 3. Leakage Currents as a Function of VD (VS)  
TPC 6. Leakage Currents as a Function of VD (VS)  
–6–  
REV. B  
ADG408/ADG409  
120  
100  
80  
140  
120  
100  
80  
V
V
= +15V  
= –15V  
V
V
= 12V  
= 0V  
DD  
SS  
DD  
SS  
t
TRANSITION  
t
TRANSITION  
t
(EN)  
ON  
t
(EN)  
ON  
60  
t
(EN)  
OFF  
40  
60  
t
(EN)  
9
OFF  
20  
40  
1
3
5
7
9
11  
13  
15  
1
3
5
7
11  
13  
V
– V  
V
– V  
IN  
IN  
TPC 7. Switching Time vs. VIN (Bipolar Supply)  
TPC 10. Switching Time vs. VIN (Single Supply)  
300  
400  
V
= 5V  
V
= 5V  
IN  
IN  
300  
200  
100  
0
200  
100  
0
t
TRANSITION  
t
TRANSITION  
t
(EN)  
ON  
t
(EN)  
ON  
t
(EN)  
OFF  
t
(EN)  
7
OFF  
5
9
11  
– V  
13  
15  
؎5  
؎7  
؎9  
؎11  
– V  
؎13  
؎15  
V
V
SUPPLY  
SUPPLY  
TPC 8. Switching Time vs. Single Supply  
TPC 11. Switching Time vs. Bipolar Supply  
4
4
10  
10  
10  
10  
10  
10  
10  
10  
V
V
= +15V  
= –15V  
DD  
SS  
V
V
= +15V  
= –15V  
DD  
SS  
3
2
1
0
3
EN = 2.4V  
EN = 0V  
100k  
EN = 2.4V  
EN = 0V  
2
–1  
10  
10  
100  
1k  
10k  
100k  
1M  
10M  
10  
100  
1k  
10k  
1M  
10M  
FREQUENCY – Hz  
FREQUENCY – Hz  
TPC 9. Positive Supply Current vs. Switching Frequency  
TPC 12. Negative Supply Current vs. Switching  
Frequency  
REV. B  
–7–  
ADG408/ADG409  
110  
110  
100  
90  
V
V
= +15V  
= –15V  
V
V
= +15V  
= –15V  
DD  
SS  
DD  
SS  
100  
90  
80  
80  
70  
70  
1k  
60  
10k  
100k  
1M  
1k  
10k  
100k  
1M  
FREQUENCY – Hz  
FREQUENCY – Hz  
TPC 13. Off Isolation vs. Frequency  
TPC 14. Crosstalk vs. Frequency  
Test Circuits  
I
DS  
V1  
V
V
SS  
DD  
V
V
SS  
DD  
S1  
S2  
S8  
D
I
(OFF)  
D
0.8V  
S
D
A
EN  
GND  
V
S
V
S
V
D
R
= V1/I  
ON  
DS  
Test Circuit 3. ID (OFF)  
Test Circuit 1. On Resistance  
V
V
SS  
DD  
V
V
SS  
DD  
V
V
SS  
DD  
V
V
SS  
DD  
S1  
S1  
S8  
D
I
(OFF)  
S
I
(ON)  
D
S2  
S8  
D
A
A
2.4V  
0.8V  
EN  
EN  
GND  
V
V
GND  
S
D
V
V
D
S
Test Circuit 2. IS (OFF)  
Test Circuit 4. ID (ON)  
–8–  
REV. B  
ADG408/ADG409  
V
V
SS  
DD  
3V  
t < 20ns  
r
V
V
SS  
t < 20ns  
DD  
f
ADDRESS  
DRIVE (V  
50%  
50%  
)
A0  
A1  
A2  
IN  
S1  
V
S1  
S8  
0V  
V
IN  
50  
S2 THRU S7  
t
t
TRANSITION  
TRANSITION  
V
S8  
90%  
ADG408*  
OUTPUT  
D
OUTPUT  
2.4V  
EN  
300⍀  
GND  
35pF  
90%  
*SIMILAR CONNECTION FOR ADG409  
Test Circuit 5. Switching Time of Multiplexer, tTRANSlTlON  
V
V
SS  
DD  
3V  
V
V
SS  
DD  
ADDRESS  
A0  
A1  
A2  
DRIVE (V  
)
IN  
S1  
V
S
V
IN  
50⍀  
0V  
S2 THRU S7  
S8  
ADG408*  
80%  
80%  
OUTPUT  
OUTPUT  
D
2.4V  
EN  
300⍀  
GND  
35pF  
t
OPEN  
*SIMILAR CONNECTION FOR ADG409  
Test Circuit 6. Break-Before-Make Delay, tOPEN  
V
V
SS  
DD  
3V  
V
V
SS  
DD  
ENABLE  
A0  
A1  
A2  
50%  
50%  
DRIVE (V  
)
IN  
S1  
V
S
0V  
S2 THRU S8  
t
(EN)  
t
(EN)  
OFF  
ON  
ADG408*  
OUTPUT  
0.9V  
0.9V  
O
O
D
EN  
OUTPUT  
300  
GND  
35pF  
V
IN  
50⍀  
*SIMILAR CONNECTION FOR ADG409  
Test Circuit 7. Enable Delay, tON (EN), tOFF (EN)  
REV. B  
–9–  
ADG408/ADG409  
V
V
DD  
SS  
V
V
SS  
DD  
3V  
A0  
A1  
A2  
V
IN  
ADG408*  
R
V
S
OUT  
V  
S
D
OUT  
V
OUT  
EN  
Q
= C 
؋
 V  
C
INJ  
L
OUT  
L
V
S
GND  
10nF  
V
IN  
*SIMILAR CONNECTION FOR ADG409  
Test Circuit 8. Charge Injection  
V
V
DD  
V
SS  
V
DD  
SS  
V
V
SS  
DD  
V
V
SS  
DD  
2.4V  
A0  
A0  
A1  
A2  
EN  
D
A1  
A2  
S1  
ADG408  
ADG408  
V
D
OUT  
V
OUT  
S1  
S8  
EN  
1k  
1k⍀  
1k⍀  
S2  
S8  
0V  
V
S
GND  
V
S
GND  
CROSSTALK = 20 LOG V  
/V  
OUT IN  
OFF ISOLATION = 20 LOG V  
/V  
OUT IN  
Test Circuit 9. OFF Isolation  
Test Circuit 10. Channel-to-Channel Crosstalk  
–10–  
REV. B  
ADG408/ADG409  
OUTLINE DIMENSIONS  
16-Lead Standard Small Outline Package [SOIC]  
16-Lead Plastic Dual In-Line Package [PDIP]  
(N-16)  
Narrow Body  
(R-16)  
Dimensions shown in inches and (millimeters)  
Dimensions shown in millimeters and (inches)  
0.700 (17.78)  
0.295 (7.49)  
BSC  
0.285 (7.24)  
0.275 (6.99)  
10.00 (0.3937)  
9.80 (0.3858)  
16  
1
9
8
16  
1
9
8
6.20 (0.2441)  
5.80 (0.2283)  
4.00 (0.1575)  
3.80 (0.1496)  
0.325 (8.26)  
0.310 (7.87)  
0.300 (7.62)  
0.100 (2.54)  
BSC  
0.015 (0.38)  
MIN  
0.150 (3.81)  
0.135 (3.43)  
0.120 (3.05)  
1.75 (0.0689)  
1.35 (0.0531)  
1.27 (0.0500)  
BSC  
0.50 (0.0197)  
0.25 (0.0098)  
0.180 (4.57)  
MAX  
؋
 45؇  
0.25 (0.0098)  
0.10 (0.0039)  
0.150 (3.81)  
0.135 (3.43)  
0.120 (3.05)  
8؇  
0؇  
0.015 (0.38)  
0.010 (0.25)  
0.008 (0.20)  
SEATING  
PLANE  
0.51 (0.0201)  
0.33 (0.0130)  
SEATING  
PLANE  
1.27 (0.0500)  
0.40 (0.0157)  
0.060 (1.52)  
0.050 (1.27)  
0.045 (1.14)  
0.022 (0.56)  
0.018 (0.46)  
0.014 (0.36)  
0.25 (0.0098)  
0.19 (0.0075)  
COPLANARITY  
0.10  
COMPLIANT TO JEDEC STANDARDS MS-012AC  
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN  
COMPLIANT TO JEDEC STANDARDS MO-095AC  
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN  
16-Lead Ceramic Dual In-Line Package [CERDIP]  
(Q-16)  
16-Lead Thin Shrink Small Outline Package [TSSOP]  
(RU-16)  
Dimensions shown in inches and (millimeters)  
Dimensions shown in millimeters  
0.005  
(0.13)  
MIN  
0.098 (2.49)  
MAX  
5.10  
5.00  
4.90  
0.310 (7.87)  
0.220 (5.59)  
16  
9
8
PIN 1  
1
16  
9
8
0.060 (1.52)  
0.015 (0.38)  
0.320 (8.13)  
0.290 (7.37)  
0.200 (5.08)  
MAX  
0.840 (21.34) MAX  
4.50  
4.40  
4.30  
6.40  
BSC  
0.150 (3.81)  
MIN  
0.015 (0.38)  
0.008 (0.20)  
0.200 (5.08)  
0.125 (3.18)  
15  
0
1
SEATING  
PLANE  
0.070 (1.78)  
0.030 (0.76)  
0.100  
(2.54)  
BSC  
PIN 1  
0.023 (0.58)  
0.014 (0.36)  
1.20  
MAX  
0.15  
0.05  
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS  
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR  
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN  
0.20  
0.09  
0.75  
0.60  
0.45  
8؇  
0؇  
0.30  
0.19  
0.65  
BSC  
SEATING  
PLANE  
COPLANARITY  
0.10  
COMPLIANT TO JEDEC STANDARDS MS-153AB  
REV. B  
–11–  
ADG408/ADG409  
Revision History  
Location  
Page  
3/03—Data Sheet changed from REV. A to REV. B.  
Changes to Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
–12–  
REV. B  

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