ADG419BRZ-REEL71 [ADI]
LC2MOS Precision Mini-DIP Analog Switch; LC2MOS精密的Mini- DIP模拟开关
| 型号： | ADG419BRZ-REEL71 |
| 厂家： | 
ADI |
| 描述： | LC2MOS Precision Mini-DIP Analog Switch |
| 文件： | 总16页 (文件大小：317K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LC2MOS Precision
Mini-DIP Analog Switch
ADG419
FUNCTIONAL BLOCK DIAGRAM
FEATURES
44 V supply maximum ratings
D
S2
VSS to VDD analog signal range
Low on resistance: <35 Ω
S1
Ultralow power dissipation: < 35 μW
Fast transition time: 160 ns maximum
Break-before-make switching action
Plug-in replacement for DG419
IN
ADG419
SWITCH SHOWN FOR A
LOGIC 1 INPUT
Figure 1.
APPLICATIONS
Precision test equipment
Precision instrumentation
Battery-powered systems
Sample hold systems
GENERAL DESCRIPTION
The ADG419 is a monolithic CMOS SPDT switch. This switch
is designed on an enhanced LC2MOS process that provides low
power dissipation yet gives high switching speed, low on resistance,
and low leakage currents.
PRODUCT HIGHLIGHTS
1. Extended Signal Range.
The ADG419 is fabricated on an enhanced LC2MOS
process, giving an increased signal range that extends to
the supply rails.
The on resistance profile of the ADG419 is very flat over the full
analog input range, ensuring excellent linearity and low distortion.
The part also exhibits high switching speed and high signal
bandwidth. CMOS construction ensures ultralow power
dissipation, making the parts ideally suited for portable and
battery-powered instruments.
2. Ultralow Power Dissipation.
3. Low RON
.
4. Single-Supply Operation.
For applications where the analog signal is unipolar, the
ADG419 can be operated from a single rail power supply.
The part is fully specified with a single 12 V power supply
and remains functional with single supplies as low as 5 V.
Each switch of the ADG419 conducts equally well in both
directions when on and has an input signal range that extends
to the supplies. In the off condition, signal levels up to the
supplies are blocked. The ADG419 exhibits break-before-make
switching action.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.461.3113
www.analog.com
©2009 Analog Devices, Inc. All rights reserved.
ADG419
TABLE OF CONTENTS
Features .............................................................................................. 1
Absolute Maximum Ratings ............................................................5
ESD Caution...................................................................................5
Pin Configuration and Function Descriptions..............................6
Typical Performance Characteristics ..............................................7
Test Circuits........................................................................................9
Terminology.................................................................................... 11
Outline Dimensions....................................................................... 12
Ordering Guide .......................................................................... 13
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Dual Supply ................................................................................... 3
Single Supply ................................................................................. 4
REVISION HISTORY
8/09—Rev. B to Rev. C
Updated Format..................................................................Universal
Changes to Table 1............................................................................ 3
Changes to Table 2............................................................................ 4
Updated Outline Dimensions....................................................... 12
Changes to Ordering Guide .......................................................... 13
Rev. B | Page 2 of 16
ADG419
SPECIFICATIONS
DUAL SUPPLY
VDD = 15 V 10%, VSS = −15 V 10%, VL = 5 V 10%, GND = 0 V, unless otherwise noted.
Table 1.
B Version
−40°C to
+25°C +85°C
T Version
−55°C to
+25°C +125°C
−40°C to
+125°C
Parameter1
ANALOG SWITCH
Analog Signal Range
RON
Unit
Test Conditions/Comments
VSS to VDD
45
VSS to VDD
45
25
35
25
35
Ω typ
Ω max
VD = 12.5 V, IS = −10 mA
VDD = +13.5 V, VSS = −13.5 V
VDD = +16.5 V, VSS = −16.5 V
45
5
LEAKAGE CURRENTS
Source Off Leakage, IS (Off)
0.1
0.1
nA typ
VD = 15.5 V, VS = ∓15.5 V;
see Figure 12
0.25
0.1
15
0.25
0.1
15
nA max
nA typ
Drain Off Leakage, ID (Off)
VD = 15.5 V, VS = ∓15.5 V;
see Figure 12
0.ꢀ5
0.4
0.ꢀ5
5
5
30
30
0.ꢀ5
0.4
0.ꢀ5
30
30
nA max
nA typ
nA max
Channel On Leakage, ID, IS (On)
VS = VD = 15.5 V; see Figure 13
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
2.4
0.8
2.4
0.8
2.4
0.8
V min
V max
IINL or IINH
0.005
0.5
0.005
0.5
0.005
0.5
μA typ
μA max
VIN = VINL or VINH
DYNAMIC CHARACTERISTICS2
tTRANSITION
160
200
200
145
200
ns max RL = 300 Ω, CL = 35 pF; VS1 = 10 V,
VS2 = ∓10 V; see Figure 14
Break-Before-Make Time Delay, tD 30
5
30
ns typ
RL = 300 Ω, CL = 35 pF;
VS1 = VS2 = 10 V; see Figure 15
5
ns min
dB typ
dB typ
pF typ
pF typ
Off Isolation
Channel-to-Channel Crosstalk
CS (Off)
80
90
6
80
ꢀ0
6
RL = 50 Ω, f = 1 MHz; see Figure 16
RL = 50 Ω, f = 1 MHz; see Figure 1ꢀ
f = 1 MHz
CD, CS (On)
55
55
f = 1 MHz
POWER REQUIREMENTS
IDD
VDD = +16.5 V, VSS = −16.5 V
VIN = 0 V or 5 V
0.0001
1
0.0001
1
0.0001
1
0.0001
1
0.0001
1
0.0001
1
μA typ
μA max
μA typ
μA max
μA typ
μA max
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
ISS
IL
VL = 5.5 V
1 Temperature ranges are as follows: B Version: −40°C to +125°C; T Version: −55°C to +125°C.
2 Guaranteed by design, not subject to production test.
Rev. B | Page 3 of 16
ADG419
SINGLE SUPPLY
VDD = 12 V 10%, VSS = 0 V, VL = 5 V 10%, GND = 0 V, unless otherwise noted.
Table 2.
B Version
T Version
−40°C to −40°C to
−55°C to
+25°C +125°C
Parameter1
ANALOG SWITCH
Analog Signal Range
RON
+25°C +85°C
+125°C
0 to VDD
ꢀ0
Unit
Test Conditions/Comments
0 to VDD
V
40
40
Ω typ
Ω max
VD = 3 V, 8.5 V, IS = −10 mA
VDD = 10.8 V
60
5
ꢀ0
LEAKAGE CURRENT
Source OFF Leakage, IS (Off)
VDD = 13.2 V
VD = 12.2 V/1 V, VS = 1 V/12.2 V;
see Figure 12
0.1
0.1
nA typ
0.25
0.1
15
0.25
0.1
15
nA max
nA typ
Drain OFF Leakage, ID (Off)
VD = 12.2 V/1 V, VS = 1 V/12.2 V;
see Figure 12
0.ꢀ5
0.4
0.ꢀ5
5
5
30
30
0.ꢀ5
0.4
0.ꢀ5
30
30
nA max
nA typ
nA max
Channel ON Leakage, ID, IS (On)
VS = VD = 12.2 V/1 V; see Figure 13
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
2.4
0.8
2.4
0.8
2.4
0.8
V min
V max
IINL or IINH
0.005
0.5
0.005
0.5
0.005
0.5
μA typ
μA max
VIN = VINL or VINH
DYNAMIC CHARACTERISTICS2
tTRANSITION
180
250
250
1ꢀ0
250
ns max RL = 300 Ω, CL = 35 pF; VS1 = 0 V/8 V,
VS2 = 8 V/0 V; see Figure 14
Break-Before-Make Time Delay, tD 60
60
ns typ
RL = 300 Ω, CL = 35 pF;
VS1 = VS2 = 8 V; see Figure 15
Off Isolation
Channel-to-Channel Crosstalk
CS (Off)
80
90
13
65
80
ꢀ0
13
65
dB typ
dB typ
pF typ
pF typ
RL = 50 Ω, f = 1 MHz; see Figure 16
RL = 50 Ω, f = 1 MHz; see Figure 1ꢀ
f = 1 MHz
CD, CS (On)
f = 1 MHz
POWER REQUIREMENTS
IDD
VDD = 13.2 V
VIN = 0 V or 5 V
0.0001
1
0.0001
1
0.0001
1
0.0001
1
μA typ
μA max
μA typ
μA max
2.5
2.5
2.5
2.5
2.5
2.5
IL
VL = 5.5 V
1 Temperature ranges are as follows: B Version: −40°C to +125°C; T Version: −55°C to +125°C.
2 Guaranteed by design, not subject to production test.
Rev. B | Page 4 of 16
ADG419
ABSOLUTE MAXIMUM RATINGS
TA= 25°C unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 3.
Parameter
Rating
VDD to VSS
44 V
VDD to GND
VSS to GND
VL to GND
Analog, Digital Inputs1
−0.3 V to +25 V
+0.3 V to −25 V
−0.3 V to VDD + 0.3 V
VSS − 2 V to VDD + 2 V
or 30 mA, whichever
occurs first
ESD CAUTION
Continuous Current, S or D
30 mA
Peak Current, S or D (Pulsed at 1 ms,
10% Duty-Cycle Maximum)
100 mA
Operating Temperature Range
Industrial (B Version)
Extended (T Version)
Storage Temperature Range
Junction Temperature
−40°C to +125°C
−55°C to +125°C
−65°C to +150°C
150°C
CERDIP Package, Power Dissipation
θJA, Thermal Impedance
600 mW
110°C/W
Lead Temperature, Soldering (10 sec)
PDIP Package, Power Dissipation
θJA, Thermal Impedance
300°C
400 mW
100°C/W
Lead Temperature, Soldering (10 sec)
SOIC Package, Power Dissipation
θJA, Thermal Impedance
260°C
400 mW
155°C/W
MSOP Package, Power Dissipation
θJA, Thermal Impedance
315 mW
205°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
215°C
220°C
1Overvoltages at IN, S or D is clamped by internal diodes. Limit current to the
maximum ratings given.
Rev. B | Page 5 of 16
ADG419
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
8
7
6
5
S2
V
D
S1
ADG419
TOP VIEW
(Not to Scale)
SS
GND
IN
V
V
DD
L
Figure 2. Pin Configuration
Table 4. Pin Function Description
Pin No.
Mnemonic
Description
1
2
3
4
5
6
ꢀ
D
S1
GND
VDD
VL
Drain terminal. May be an input or an output.
Source terminal. May be an input or an output.
Ground (0 V) reference.
Most positive power supply potential.
Logic power supply (5 V).
IN
VSS
Logic control input.
Most negative power supply potential in dual-supply applications. In single-supply applications, it may be
connected to GND.
8
S2
Source terminal. May be an input or an output.
Table 5. Truth Table
Logic
Switch 1
On
Off
Switch 2
Off
On
0
1
Rev. B | Page 6 of 16
ADG419
TYPICAL PERFORMANCE CHARACTERISTICS
50
100
T
= 25°C
T = 25°C
A
A
V
V
= +5V
= –5V
DD
SS
V
V
= 5V
= 0V
DD
SS
40
80
60
40
30
20
V
V
= +10V
= –10V
DD
V
V
= 10V
= 0V
DD
SS
SS
V
V
= 12V
= 0V
DD
SS
V
V
= +12V
= –12V
SS
DD
20
0
10
0
V
V
= +15V
= –15V
DD
V
V
= 15V
= 0V
DD
SS
SS
–15
–10
–5
0
V , V (V)
5
10
15
0
5
10
15
V , V (V)
S
D
S
D
Figure 3. RON as a Function of VD (VS), Dual-Supply Voltage
Figure 6. RON as a Function of VD (VS), Single-Supply Voltage
50
100
80
60
40
20
0
V
V
V
= +15V
= –15V
= +5V
V
V
V
= 12V
= 0V
= 5V
DD
SS
DD
SS
L
L
40
30
20
10
0
125°C
125°C
85°C
–5
85°C
25°C
10
25°C
–15
–10
0
5
15
0
3
6
9
12
V , V (V)
V , V (V)
S D
S
D
Figure 4. RON as a Function of VD (VS) for Different Temperatures
Figure 7. RON as a Function of VD (VS) for Different Temperatures
0.02
0.006
I
(ON)
V
V
= +15V
= –15V
V
V
= 12V
= 0V
D
DD
SS
DD
SS
T
= 25°C
T = 25°C
A
A
I
(ON)
0.01
0
0.004
0.002
0
D
I
(OFF)
S
I
(OFF)
S
I
(OFF)
D
I
(OFF)
–0.01
–0.02
–0.03
D
–0.002
–0.004
–15
–10
–5
0
5
10
15
0
2
4
6
V , V (V)
8
10
12
V , V (V)
S
D
S
D
Figure 5. Leakage Currents as a Function of VS (VD)
Figure 8. Leakage Currents as a Function of VS (VD)
Rev. B | Page ꢀ of 16
ADG419
10mA
220
200
180
160
140
V
V
V
= +15V
= –15V
= +5V
DD
SS
1mA
100µA
10µA
1µA
L
I+, I–
SINGLE SUPPLY
= 0V/+5V
V
IN
I
L
100nA
10nA
120
100
DUAL SUPPLY
V
= ±5V
IN
1nA
100
80
1k
10k
100k
1M
10M
6
8
10
12
14
16
FREQUENCY (Hz)
SUPPLY VOLTAGE (V)
Figure 9. Supply Current (ISUPPLY) vs. Input Switching Frequency
Figure 10. Transition Time (tTRANSITION) vs. Power Supply Voltage
Rev. B | Page 8 of 16
ADG419
TEST CIRCUITS
I
DS
V1
I
(OFF)
A
I
(OFF)
A
I
(ON)
A
S
D
D
S
D
S
D
S
D
V
S
V
S
V
D
V
V
D
S
R
= V /I
DS
ON
1
Figure 12. Off Leakage
Figure 11. On Resistance
Figure 13. On Leakage
+15V
+5V
3V
V
V
L
V
50%
50%
DD
IN
S1
0V
D
V
V
V
OUT
S1
S2
tTRANSITION
tTRANSITION
90%
S2
IN
R
300Ω
C
L
L
35pF
OUTPUT
V
V
SS
IN
GND
90%
–15V
Figure 14. Transition Time, tTRANSITION
+15V
+5V
V
V
L
DD
3V
S1
D
V
V
OUT
ADDRESS
DRIVE (V
S1
S2
)
IN
S2
IN
V
R
300Ω
C
L
L
0V
35pF
tD
tD
V
OUT
0.9V
O
0.9V
0.9V
0.9V
O
V
V
O
O
IN
GND
SS
–15V
Figure 15. Break-Before-Make Time Delay, tD
Rev. B | Page 9 of 16
ADG419
+15V
0.1µF
+5V
0.1µF
V
V
L
DD
S1
+15V
0.1µF
+5V
0.1µF
D
50Ω
V
S
V
V
L
DD
S
D
S2
V
V
OUT
OUT
R
L
R
50Ω
L
50Ω
V
IN
IN
V
GND
SS
V
SS
GND
V
S
V
0.1µF
–15V
IN
0.1µF
–15V
CHANNEL-TO-CHANNEL CROSSTALK = 20 × log | V /V
S
|
OUT
Figure 17. Crosstalk
Figure 16. Off Isolation
Rev. B | Page 10 of 16
ADG419
TERMINOLOGY
CS (Off)
Off switch source capacitance.
VDD
Most positive power supply potential.
CD, CS (On)
On switch capacitance.
VSS
Most negative power supply potential in dual-supply applications.
In single-supply applications, it may be connected to GND.
tTRANSITION
Delay time between the 50% and 90% points of the digital
inputs and the switch on condition when switching from one
address state to another.
VL
Logic power supply (5 V).
GND
tD
Ground (0 V) reference.
Off time or on time measured between the 90% points of both
switches when switching from one address state to the other.
S
Source terminal. May be an input or an output.
VINL
D
Maximum input voltage for Logic 0.
Drain terminal. May be an input or an output.
VINH
IN
Minimum input voltage for Logic 1.
Logic control input.
I
INL (IINH)
RON
Input current of the digital input.
Ohmic resistance between D and S.
Crosstalk
IS (Off)
A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance.
Source leakage current with the switch off.
ID (Off)
Off Isolation
Drain leakage current with the switch off.
A measure of unwanted signal coupling through an off channel.
ID, IS (On)
IDD
Channel leakage current with the switch on.
Positive supply current.
VD (VS)
ISS
Analog voltage on terminals D, S.
Negative supply current.
Rev. B | Page 11 of 16
ADG419
OUTLINE DIMENSIONS
0.400 (10.16)
0.365 (9.27)
0.355 (9.02)
8
1
5
4
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.100 (2.54)
BSC
0.060 (1.52)
MAX
0.195 (4.95)
0.130 (3.30)
0.115 (2.92)
0.210 (5.33)
MAX
0.015
(0.38)
MIN
0.150 (3.81)
0.130 (3.30)
0.115 (2.92)
0.015 (0.38)
GAUGE
0.014 (0.36)
0.010 (0.25)
0.008 (0.20)
PLANE
SEATING
PLANE
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.430 (10.92)
MAX
0.005 (0.13)
MIN
0.070 (1.78)
0.060 (1.52)
0.045 (1.14)
COMPLIANT TO JEDEC STANDARDS MS-001
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.
Figure 18. 8-Lead Plastic Dual In-Line Package [PDIP]
Narrow Body
(N-8)
Dimensions shown in inches and (millimeters)
0.005 (0.13)
MIN
0.055 (1.40)
MAX
8
5
0.310 (7.87)
0.220 (5.59)
1
4
0.100 (2.54) BSC
0.405 (10.29) MAX
0.320 (8.13)
0.290 (7.37)
0.060 (1.52)
0.015 (0.38)
0.200 (5.08)
MAX
0.150 (3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.015 (0.38)
0.008 (0.20)
SEATING
PLANE
0.023 (0.58)
0.014 (0.36)
15°
0°
0.070 (1.78)
0.030 (0.76)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 19. 8-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-8)
Dimensions shown in inches and (millimeters)
Rev. B | Page 12 of 16
ADG419
3.20
3.00
2.80
8
1
5
4
5.15
4.90
4.65
3.20
3.00
2.80
PIN 1
0.65 BSC
0.95
0.85
0.75
1.10 MAX
0.80
0.60
0.40
8°
0°
0.15
0.00
0.38
0.22
0.23
0.08
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 20. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
5.00 (0.1968)
4.80 (0.1890)
8
1
5
4
6.20 (0.2441)
5.80 (0.2284)
4.00 (0.1574)
3.80 (0.1497)
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
BSC
45°
1.75 (0.0688)
1.35 (0.0532)
0.25 (0.0098)
0.10 (0.0040)
8°
0°
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 21. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-8)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model
Temperature Range Package Description
Package Option Branding
ADG419BN
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
8-Lead Plastic Dual In-Line Package [PDIP]
8-Lead Plastic Dual In-Line Package [PDIP]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Ceramic Dual In-Line Package [CERDIP]
N-8
N-8
R-8
R-8
R-8
R-8
R-8
R-8
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
Q-8
ADG419BNZ1
ADG419BR
ADG419BR-REEL
ADG419BR-REELꢀ
ADG419BRZ1
ADG419BRZ-REEL1
ADG419BRZ-REELꢀ1
ADG419BRM
ADG419BRM-REEL
ADG419BRM-REELꢀ
ADG419BRMZ1
ADG419BRMZ-REEL1
SBB
SBB
SBB
SBB#
SBB#
SBB#
ADG419BRMZ-REELꢀ1 −40°C to +125°C
ADG419TQ −55°C to +125°C
1 Z = RoHS Compliant Part, # denotes that RoHS compliant part is top or bottom marked.
Rev. B | Page 13 of 16
ADG419
NOTES
Rev. B | Page 14 of 16
ADG419
NOTES
Rev. B | Page 15 of 16
ADG419
NOTES
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07850-0-8/09(B)
Rev. B | Page 16 of 16
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