ADG708CRUZ-REEL7 [ADI]
CMOS, 1.8 V to 5.5 V/ 2.5 V, 3 Low Voltage 4-/8-Channel Multiplexers; CMOS ， 1.8 V至5.5 V / 2.5 V ， 3低压4- / 8通道多路复用器
| 型号： | ADG708CRUZ-REEL7 |
| 厂家： | 
ADI |
| 描述： | CMOS, 1.8 V to 5.5 V/ 2.5 V, 3 Low Voltage 4-/8-Channel Multiplexers |
| 文件： | 总20页 (文件大小：332K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CMOS, 1.8 V to 5.5 V/ 2.5 V, 3 Ω
Low Voltage 4-/8-Channel Multiplexers
Data Sheet
ADG708/ADG709
FEATURES
FUNCTIONAL BLOCK DIAGRAMS
1.8 V to 5.5 V single supply
2.5 V dual supply
3 Ω on resistance
ADG708
S1
0.75 Ω on resistance flatness
100 pA leakage currents
14 ns switching times
D
Single 8-to-1 multiplexer ADG708
Differential 4-to-1 multiplexer ADG709
16-lead TSSOP package
S8
1 OF 8
DECODER
Low power consumption
TTL-/CMOS-compatible inputs
Qualified for automotive applications
A0 A1
A2 EN
APPLICATIONS
Figure 1.
Data acquisition systems
Communication systems
Relay replacement
Audio and video switching
Battery-powered systems
ADG709
S1A
S4A
DA
DB
GENERAL DESCRIPTION
The ADG708/ADG709 are low voltage, CMOS analog
multiplexers comprising eight single channels and four
differential channels, respectively. The ADG708 switches one of
eight inputs (S1 to S8) to a common output, D, as determined
by the 3-bit binary address lines A0, A1, and A2. The ADG709
switches one of four differential inputs to a common differential
output as determined by the 2-bit binary address lines A0 and
A1. An EN input on both devices is used to enable or disable
the device. When disabled, all channels are switched off.
S1B
S4B
1 OF 4
DECODER
A0 A1 EN
Figure 2.
Low power consumption and an operating supply range of
1.8 V to 5.5 V make the ADG708/ADG709 ideal for battery-
powered, portable instruments. All channels exhibit break-
before-make switching action preventing momentary shorting
when switching channels.
PRODUCT HIGHLIGHTS
1. Single-/dual-supply operation. The ADG708/ADG709 are
fully specified and guaranteed with 3 V and 5 V single-supply
and ±2.5 V dual-supply rails.
These switches are designed on an enhanced submicron process
that provides low power dissipation yet gives high switching
speed, very low on resistance, and leakage currents.
2. Low RON (3 Ω typical).
3. Low power consumption (<0.01 μW).
4. Guaranteed break-before-make switching action.
5. Small 16-lead TSSOP package.
On resistance is in the region of a few ohms and is closely matched
between switches and very flat over the full signal range. These parts
can operate equally well as either multiplexers or demultiplexers
and have an input signal range that extends to the supplies.
The ADG708/ADG709 are available in a 16-le ad T S S OP.
Rev. D
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ADG708/ADG709
Data Sheet
TABLE OF CONTENTS
Features.....................................................................................1
Truth Tables.........................................................................11
Typical Performance Characteristics.......................................12
Test Circuits.............................................................................15
Terminology............................................................................18
Applications Information........................................................19
Power Supply Sequencing....................................................19
Outline Dimensions ................................................................20
Ordering Guide ...................................................................20
Automotive Products...........................................................20
Applications...............................................................................1
General Description ..................................................................1
Functional Block Diagrams .......................................................1
Product Highlights ....................................................................1
Revision History........................................................................2
Specifications.............................................................................3
Dual Supply ...........................................................................7
Absolute Maximum Ratings ......................................................9
ESD Caution..........................................................................9
Pin Configurations and Function Descriptions.......................10
REVISION HISTORY
1/13−Rev. C to Rev. D
8/06−Rev. A to Rev. B
Changes to Ordering Guide.....................................................20
Updated Format ...........................................................Universal
Changes to Absolute Maximum Ratings Section.......................9
Added Table 7 and Table 8.......................................................10
Updated Outline Dimensions..................................................18
Changes to Ordering Guide.....................................................18
4/09−Rev. B to Rev. C
Changes to Table 1.....................................................................3
Changes to Table 2.....................................................................5
Changes to Table 3.....................................................................7
Moved Truth Tables Section ....................................................11
Changes to Figure 7, Figure 8, and Figure 9.............................12
Changes to Figure 13 and Figure 14.........................................13
Moved Terminology Section....................................................18
Changes to Ordering Guide.....................................................20
4/02—Rev. 0 to Rev. A
Edits to Features and Product Highlights..................................1
Change to Specifications .......................................................2–4
Edits to Absolute Maximum Ratings Notes...............................5
Edits to TPCs 2, 5, 6–9, 11, and 15 ........................................7–9
Edits to Test Circuits 9 and 10.................................................11
Addition of Test Circuit 11......................................................11
10/00—Revision0: Initial Version
Rev. D | Page 2 of 20
Data Sheet
ADG708/ADG709
SPECIFICATIONS
VDD = 5 V ꢀ1%, VSS = 1 V, GND = 1 V, unless otherwise noted.
Table 1.
B Version
C Version
−40°C to −40°C to
−40°C to −40°C to
Test Conditions/
Comments
Parameter
+25°C +85°C
+125°C
+25°C +85°C
+125°C
Unit
ANALOG SWITCH
Analog Signal Range
0 V to
VDD
0 V to
VDD
0 V to
VDD
V
On Resistance (RON
)
3
3
Ω typ
VS = 0 V to VDD, IDS = 10 mA;
see Figure 20
4.5
0.4
5
7
4.5
0.4
5
7
Ω max
Ω typ
On Resistance Match
Between Channels (ΔRON
)
0.8
1.2
1.5
1.65
0.8
1.2
1.5
1.65
Ω max
Ω typ
VS = 0 V to VDD, IDS = 10 mA
VS = 0 V to VDD, IDS = 10 mA
On Resistance Flatness
0.75
0.75
(RFLAT (ON)
)
Ω max
nA typ
LEAKAGE CURRENTS
Source Off Leakage, IS (Off)
VDD = 5.5 V
VD = 4.5 V/1 V, VS = 1 V/4.5 V;
see Figure 21
0.01
0.01
20
20
20
20
0.1
0.01
0.3
1
6
6
nA max
nA typ
Drain Off Leakage, ID (Off)
0.01
0.01
VD = 4.5 V/1 V, VS = 1 V/4.5 V;
see Figure 22
20
20
0.1
0.01
0.75
0.75
nA max
nA typ
Channel On Leakage, ID, IS (On)
VD = VS = 1 V or 4.5 V;
see Figure 23
0.1
nA max
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
2.4
0.8
2.4
0.8
V min
V max
IINL or IINH
0.005
2
0.005
2
μA typ
μA max
pF typ
VIN = VINL or VINH
0.1
0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS1
tTRANSITION
14
14
ns typ
RL = 300 Ω, CL = 35 pF;
see Figure 24
25
25
25
25
ns max
ns typ
VS1 = 3 V/0 V, VS8 = 0 V/3 V
RL = 300 Ω, CL = 35 pF
Break-Before-Make Time
Delay, tOPEN
8
8
1
1
1
1
ns min
ns typ
ns max
ns typ
ns max
pC typ
VS = 3 V; see Figure 25
RL = 300 Ω, CL = 35 pF
VS = 3 V; see Figure 26
RL = 300 Ω, CL = 35 pF
VS = 3 V; see Figure 26
tON (EN)
tOFF (EN)
14
7
14
7
25
12
25
12
25
12
25
12
Charge Injection
Off Isolation
3
3
VS = 2.5 V, RS = 0 Ω,
CL = 1 nF; See Figure 27
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF,
−60
−80
−60
−80
dB typ
dB typ
f = 1 MHz; see Figure 28
Rev. D | Page 3 of 20
ADG708/ADG709
Data Sheet
B Version
C Version
−40°C to −40°C to
−40°C to −40°C to
Test Conditions/
Comments
Parameter
+25°C +85°C
+125°C
+25°C +85°C
+125°C
Unit
Channel-to-Channel
Crosstalk
−60
−80
55
−60
−80
55
dB typ
RL = 50 Ω, CL = 5 pF,
f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 29
dB typ
−3 dB Bandwidth
MHz typ RL = 50 Ω, CL = 5 pF;
see Figure 30
CS (Off)
CD (Off)
13
13
pF typ
f = 1 MHz
ADG708
ADG709
85
42
85
42
pF typ
pF typ
f = 1 MHz
f = 1 MHz
CD, CS (On)
ADG708
ADG709
96
48
96
48
pF typ
pF typ
f = 1 MHz
f = 1 MHz
POWER REQUIREMENTS
IDD
VDD = 5.5 V
Digital inputs = 0 V or 5.5 V
0.001
0.001
μA typ
1.0
1.0
1.0
1.0
μA max
1 Guaranteed by design, not subject to production test.
Rev. D | Page 4 of 20
Data Sheet
ADG708/ADG709
VDD = 3 V 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 2.
B Version
C Version
−40°C to −40°C to
−40°C to −40°C to
Test Conditions/
Comments
Parameter
+25°C
+85°C
+125°C +25°C +85°C
+125°C
Unit
ANALOG SWITCH
Analog Signal Range
0 V to
VDD
0 V to
VDD
V
On Resistance (RON)
8
8
Ω typ
VS = 0 V to VDD, IDS = 10 mA;
see Figure 20
11
12
14
2
11
12
14
2
Ω max
Ω typ
On ResistanceMatch Between 0.4
Channels (ΔRON)
0.4
VS = 0 V to VDD,
IDS = 10 mA
1.2
1.2
Ω max
nA typ
LEAKAGE CURRENTS
VDD = 3.3 V
VS = 3 V/1 V, VD = 1 V/3 V;
see Figure 21
Source Off Leakage, IS (Off)
Drain Off Leakage, ID (Off)
Channel On Leakage, ID, IS (On)
±0.01
±0.01
±20
±20
±20
±20
±20
±20
±0.1
±0.01
±0.3
±1
±±
±±
nA max
nA typ
±0.01
±0.01
VS = 3 V/1 V, VD = 1 V/3 V;
see Figure 22
±0.1
±0.75
±0.75
nA max
nA typ
±0.01
VS = VD = 1 V or 3 V;
see Figure 23
±0.1
nA max
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
2.0
0.8
2.0
0.8
V min
V max
IINL or IINH
0.005
2
0.005
2
μA typ
μA max
pF typ
VIN = VINL or VINH
±0.1
30
±0.1
30
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS1
tTRANSITION
18
18
ns typ
RL = 300 Ω, CL = 35 pF;
see Figure 24
VS1 = 2 V/0 V, VS2 = 0 V/2 V
RL = 300 Ω, CL = 35 pF
30
30
ns max
ns typ
Break-Before-Make Time
Delay, tOPEN
8
8
1
1
1
1
ns min
ns typ
ns max
ns typ
ns max
pC typ
VS = 2 V; see Figure 25
RL = 300 Ω, CL = 35 pF
VS = 2 V; see Figure 2±
RL = 300 Ω, CL = 35 pF
VS = 2 V; see Figure 2±
tON (EN)
tOFF (EN)
18
8
18
8
30
15
30
15
30
15
30
15
Charge Injection
Off Isolation
±3
±3
VS = 1.5 V, RS = 0 Ω,
CL = 1 nF;see Figure 27
−±0
−80
−±0
−80
55
−±0
−80
−±0
−80
55
dB typ
dB typ
dB typ
dB typ
RL = 50 Ω, CL = 5 pF,
f = 10 MHz
RL = 50 Ω, CL = 5 pF,
f = 1 MHz;see Figure 28
RL = 50 Ω, CL = 5 pF,
f = 10 MHz
Channel-to-Channel Crosstalk
−3 dB Bandwidth
RL = 50 Ω, CL = 5 pF,
f = 1 MHz;see Figure 29
MHz typ RL = 50 Ω, CL = 5 pF;
see Figure 30
Rev. D | Page 5 of 20
ADG708/ADG709
Data Sheet
B Version
C Version
−40°C to −40°C to
−40°C to −40°C to
+125°C
Test Conditions/
Comments
Parameter
CS (Off)
+25°C
+85°C
+125°C +25°C +85°C
Unit
13
13
pF typ
f = 1 MHz
CD (Off)
ADG708
ADG709
85
42
85
42
pF typ
pF typ
f = 1 MHz
f = 1 MHz
CD, CS (On)
ADG708
ADG709
9±
48
9±
48
pF typ
pF typ
f = 1 MHz
f = 1 MHz
POWER REQUIREMENTS
IDD
VDD = 3.3 V
0.001
0.001
μA typ
Digital inputs = 0 Vor 3.3 V
1.0
1.0
1.0
1.0
μA max
1 Guaranteed by design, not subject to production test.
Rev. D | Page ± of 20
Data Sheet
ADG708/ADG709
DUAL SUPPLY
VDD = 2.5 V 10%, VSS = –2.5 V 10%, GND = 0 V, unless otherwise noted.
Table 3.
B Version
C Version
−40°C to −40°C to
−40°C to −40°C to
Test Conditions/
Comments
Parameter
+25°C +85°C
+125°C
+25°C +85°C
+125°C
Unit
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
VSS to VDD
VSS to VDD
V
2.5
2.5
Ω typ
VS = VSS to VDD, IDS = 10 mA;
see Figure 20
4.5
5
7
4.5
0.4
5
7
Ω max
Ω typ
On Resistance Match Between 0.4
Channels (ΔRON)
0.8
1.0
1.5
0.8
1.0
1.5
Ω max
Ω typ
VS = VSS to VDD, IDS = 10 mA
VS = VSS to VDD, IDS = 10 mA
On ResistanceFlatness (RFLAT (ON)
)
0.±
0.±
1.±5
1.±5
Ω max
LEAKAGE CURRENTS
VDD = +2.75 V, VSS = −2.75 V
Source Off Leakage, IS (Off)
±0.01
±0.01
nA typ
VS = +2.25 V/−1.25 V,
VD = −1.25 V/+2.25V;
see Figure 21
±20
±20
±0.1
±0.3
±1
nA max
nA typ
Drain Off Leakage, ID (Off)
±0.01
±0.01
±0.01
VS = +2.25 V/−1.25 V,
VD = −1.25 V/+2.25 V;
see Figure 22
±20
±20
±20
±20
±0.1
±0.01
±0.75
±0.75
±±
±±
nA max
nA typ
Channel On Leakage, ID, IS (On)
VS = VD = +2.25 V/−1.25 V;
see Figure 23
±0.1
nA max
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
1.7
0.7
1.7
0.7
V min
V max
IINL or IINH
0.005
2
0.005
2
μA typ
μA max
pF typ
VIN = VINL or VINH
±0.1
25
±0.1
25
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS1
tTRANSITION
14
14
ns typ
RL = 300 Ω, CL = 35 pF;
see Figure 24
25
25
ns max
ns typ
VS = 1.5 V/0 V;seeFigure 24
RL = 300 Ω, CL = 35 pF
Break-Before-Make Time Delay,
tOPEN
8
8
1
1
1
1
ns min
ns typ
ns max
ns typ
ns max
pC typ
VS = 1.5 V; see Figure 25
RL = 300 Ω, CL = 35 pF
VS = 1.5 V;see Figure 2±
RL = 300 Ω, CL = 35 pF
VS = 1.5 V; see Figure 2±
tON (EN)
tOFF (EN)
14
8
14
8
25
15
25
15
25
15
25
15
Charge Injection
Off Isolation
±3
±3
VS = 0 V, RS = 0 Ω, CL = 1 nF;
see Figure 27
−±0
−80
−±0
−80
dB typ
dB typ
RL = 50 Ω, CL = 5 pF,
f = 10 MHz
RL = 50 Ω, CL = 5 pF,
f = 1 MHz; see Figure 28
Rev. D | Page 7 of 20
ADG708/ADG709
Data Sheet
B Version
C Version
−40°C to −40°C to
−40°C to −40°C to
Test Conditions/
Comments
Parameter
+25°C +85°C
+125°C
+25°C +85°C
+125°C
Unit
Channel-to-Channel Crosstalk
−±0
−80
55
−±0
−80
55
dB typ
RL = 50 Ω, CL = 5 pF,
f = 10 MHz
dB typ
RL = 50 Ω, CL = 5 pF,
f = 1 MHz; see Figure 29
−3 dB Bandwidth
MHz typ RL = 50 Ω, CL = 5 pF;
see Figure 30
CS (Off)
CD (Off)
13
13
pF typ
f = 1 MHz
ADG708
ADG709
85
42
85
42
pF typ
pF typ
f = 1 MHz
f = 1 MHz
CD, CS (On)
ADG708
ADG709
9±
48
9±
48
pF typ
pF typ
f = 1 MHz
f = 1 MHz
POWER REQUIREMENTS
IDD
VDD = 2.75 V
0.001
0.001
0.001
0.001
μA typ
μA max
μA typ
μA max
Digital inputs = 0 Vor 2.75 V
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
ISS
VSS = −2.75 V
Digital inputs = 0 Vor 2.75 V
1 Guaranteed by design not subject to production test.
Rev. D | Page 8 of 20
Data Sheet
ADG708/ADG709
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 4.
Parameter
VDD to VSS
VDD to GND
VSS to GND
Analog Inputs1
Rating
7 V
−0.3 V to +7 V
+0.3 V to −3.5 V
VSS − 0.3 VtoVDD + 0.3 V
or 30 mA, whichever
occurs first
Only one absolute maximum rating can be applied atany one time.
Digital Inputs1
−0.3 V toVDD + 0.3 V or
30 mA, whichever
occurs first
ESD CAUTION
Peak Current, S or D (Pulsed at 1 ms,
10% Duty Cycle Maximum)
100 mA
Continuous Current, S or D
OperatingTemperature
Industrial Temperature Range
Storage Temperature Range
Junction Temperature
30 mA
−40°C to +125°C
−±5°C to +150°C
150°C
TSSOP Package, Power Dissipation
θJA Thermal Impedance
θJC Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (±0 sec)
432 mW
150.4°C/W
27.±°C/W
215°C
220°C
Infrared (15 sec)
1 Overvoltages at A, EN, S, or D are clamped by internal codes. Current should
be limited to the maximum ratings given.
Rev. D | Page 9 of 20
ADG708/ADG709
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
A0
EN
1
2
3
4
5
6
7
8
16 A1
1
2
3
4
5
6
7
8
16
15
14
13
12
A0
A1
15
14
13
12
11
10
9
A2
EN
GND
V
V
GND
SS
S1A
S2A
S3A
S4A
DA
V
SS
S1
S2
S3
S4
D
DD
ADG708
TOP VIEW
(Not to Scale)
V
ADG709
TOP VIEW
(Not to Scale)
S1B
S2B
DD
S5
S6
S7
S8
11 S3B
S4B
DB
10
9
Figure 3. ADG708 Pin Configuration
Figure 4. ADG709 Pin Configuration
Table 5. ADG708 Pin FunctionDescriptions
Pin No.
Mnemonic Description
1
2
A0
EN
VSS
S1
Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7).
Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7).
3
4
Most Negative PowerSupply Pin in Dual-Supply Applications. For single-supplyapplications, it shouldbe tiedtoGND.
Source Terminal. Can be an input or output.
5
S2
Source Terminal. Can be an input or output.
±
S3
Source Terminal. Can be an input or output.
7
S4
Source Terminal. Can be an input or output.
8
D
Drain Terminal. Can be an input or output.
9
S8
Source Terminal. Can be an input or output.
10
11
12
13
14
15
1±
S7
S±
S5
VDD
GND
A2
A1
Source Terminal. Can be an input or output.
Source Terminal. Can be an input or output.
Source Terminal. Can be an input or output.
Most Positive Power Supply Pin.
Ground (0 V) Reference.
Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7).
Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7).
Table 6. ADG709 Pin FunctionDescriptions
Pin No.
Mnemonic Description
1
A0
Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 8).
2
3
4
EN
VSS
Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 8).
Most Negative PowerSupply Pin in Dual-Supply Applications. For single-supplyapplications, it shouldbe tiedtoGND.
Source Terminal. Can be an input or output.
S1A
S2A
S3A
S4A
DA
5
±
7
Source Terminal. Can be an input or output.
Source Terminal. Can be an input or output.
Source Terminal. Can be an input or output.
8
Drain Terminal. Can be an input or output.
9
DB
Drain Terminal. Can be an input or output.
10
11
12
13
14
15
1±
S4B
S3B
S2B
S1B
VDD
GND
A1
Source Terminal. Can be an input or output.
Source Terminal. Can be an input or output.
Source Terminal. Can be an input or output.
Source Terminal. Can be an input or output.
Most Positive Power Supply Pin.
Ground (0 V) Reference.
Digital Input. Controls the configuration of the switch, as shown in the truth table (see Tab le 8).
Rev. D | Page 10 of 20
Data Sheet
ADG708/ADG709
TRUTH TABLES
Table 7. ADG708 Truth Table
A2
X1
0
0
0
A1
X1
0
0
1
A0
X1
0
1
0
EN
0
Switch Condition
None
1
1
1
1
2
3
4
5
±
7
8
0
1
1
1
1
0
0
1
1
0
1
0
1
1
1
1
1
1
1
1
1 X = Don’t care.
Table 8. ADG709 Truth Table
A1
X1
0
0
1
A0
X1
0
1
0
EN
0
On Switch Pair
None
1
1
1
1
2
3
4
1
1
1
1 X = Don’t care.
Rev. D | Page 11 of 20
ADG708/ADG709
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
8
8
7
V
V
= 3V
= 0V
T
= 25°C
DD
SS
A
V
= 0V
SS
7
6
5
+125°C
6
5
4
3
2
V
= 2.7V
DD
+85°C
V
= 3.3V
DD
4
3
2
1
0
V
= 4.5V
DD
–40°C
V
= 5.5V
DD
+25°C
1
0
0
1
2
3
4
5
0
0.5
1.0
1.5
2.0
2.5
3.0
V
OR V – DRAIN OR SOURCE VOLTAGE (V)
V
OR V – DRAIN OR SOURCE VOLTAGE (V)
D
S
D
S
Figure 5. On Resistance as a Function of VD (VS) for Single Supply
Figure 8. On Resistance as a Function of VD (VS) for Different Temperatures,
Single Supply
6
8
V
V
= +2.5V
= –2.5V
DD
SS
T
= 25°C
A
7
6
5
5
4
3
2
1
0
+125°C
+85°C
+25°C
4
3
2
1
0
V
V
= +2.25V
= –2.25V
DD
SS
–40°C
V
V
= +2.75V
= –2.75V
DD
SS
–2.5 –2.0 –1.5 –1.0 –0.5
0
0.5
1.0
1.5
2.0 –2.5
–3.0 –2.5 –2.0 –1.5 –1.0 –0.5
0
0.5 1.0 1.5 2.0 2.5 3.0
V
OR V – DRAIN OR SOURCE VOLTAGE (V)
S
V
OR V – DRAIN OR SOURCE VOLTAGE (V)
D
D
S
Figure 6. On Resistance as a Function of VD (VS) for Dual Supply
Figure 9. On Resistance as a Function of VD (VS) for Different Temperatures,
Dual Supply
0.12
8
V
V
= 5V
= 0V
= 25°C
DD
SS
V
V
= 5V
= 0V
DD
SS
T
A
7
6
0.08
I
(ON)
D
0.04
0
5
4
3
2
1
0
+125°C
+85°C
+25°C
I
(OFF)
S
–0.04
–0.08
–0.12
I
(OFF)
D
4
–40°C
0
1
2
3
5
0
1
2
3
4
5
V , (V = V – V ) (V)
DD
S
D
S
V
OR V – DRAIN OR SOURCE VOLTAGE (V)
D
S
Figure 10. Leakage Currents as a Function of VD (VS)
Figure 7. On Resistance as a Function of VD (VS) for Different Temperatures,
Single Supply
Rev. D | Page 12 of 20
Data Sheet
ADG708/ADG709
0.12
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
V
V
= 3V
= 0V
= 25°C
V
= +3V
DD
SS
DD
T
A
0.08
I
(ON)
D
0.04
0
–0.04
–0.08
I
(OFF)
S
I
(OFF)
I
(ON)
I
D
D
(OFF)
D
I
(OFF)
S
–0.12
0
20
40
60
80
100
120
0
0.5
1.0
1.5
2.0
2.5
3.0
V
, (V = V – V ) (V)
D
S
DD
D
TEMPERATURE (°C)
Figure 14. Leakage Currents as a Function of Temperature
Figure 11. Leakage Currents as a Function of VD (VS)
0.12
0.08
10m
1m
V
V
= +2.5V
= –2.5V
= 25°C
DD
SS
T
= 25°C
A
T
A
V
V
= +2.5V
= –2.5V
DD
SS
100µ
10µ
1µ
I
(ON), V = V
S D
0.04
D
V
= +5V
DD
0
–0.04
–0.08
V
= +3V
DD
I
(OFF)
S
I
(OFF)
D
100n
10n
1n
–0.12
–3.0 –2.5 –2.0 –1.5 –1.0 –0.5
0
0.5 1.0 1.5 2.0 2.5 3.0
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
V , (V = V – V ) (V)
S
D
DD
S
Figure 15. Supply Current vs. Input Switching Frequency
Figure 12. Leakage Currents as a Function of VD (VS)
0
–20
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
V
= 5V
DD
= 25°C
V
V
AND
V
V
= +5V
= 0V
DD
SS
T
A
= +2.5V
= –2.5V
DD
SS
–40
–60
–80
I
(OFF)
I
(OFF)
D
S
I
(ON)
D
–100
–120
0
20
40
60
80
100
120
30k
100k
1M
10M
100M
FREQUENCY (Hz)
TEMPERATURE (°C)
Figure 16. Off Isolation vs. Frequency
Figure 13. Leakage Currents as a Function of Temperature
Rev. D | Page 13 of 20
ADG708/ADG709
Data Sheet
20
10
0
V
= 5V
T
= 25°C
DD
= 25°C
A
T
A
–20
V
V
= +5V
= 0V
DD
SS
0
–40
–60
V
V
= +3V
= 0V
DD
SS
–10
–80
–20
–30
–40
V
V
= +2.5V
= –2.5V
DD
SS
–100
–120
–3
–2
–1
0
1
2
3
4
5
30k
100k
1M
10M
100M
FREQUENCY (Hz)
VOLTAGE (V)
Figure 17. Crosstalk vs. Frequency
Figure 19. Charge Injection vs. Source Voltage
0
–5
V
= 5V
DD
= 25°C
T
A
–10
–15
–20
100k
1M
10M
100M
30k
FREQUENCY (Hz)
Figure 18. On Response vs. Frequency
Rev. D | Page 14 of 20
Data Sheet
ADG708/ADG709
TEST CIRCUITS
I
DS
V
V
V
V
DD
SS
V1
DD
SS
S1
S2
I
(OFF)
A
D
S
D
D
S8
V
V
D
S
0.8V
EN
V
GND
S
R
= V1/I
ON
DS
Figure 20. On Resistance
Figure 22. ID (OFF)
V
V
V
V
DD
SS
V
V
V
V
DD
SS
DD
SS
DD
SS
I (OFF)
S
S1
S2
S8
I
(ON)
A
A
D
S1
S8
D
D
V
S
V
D
V
S
0.8V
EN
2.4V
EN
V
D
GND
GND
Figure 21. IS (OFF)
Figure 23. ID (ON)
V
V
DD
SS
3V
0V
V
V
DD
SS
ADDRESS
DRIVE (V
50%
50%
)
IN
V
S1
S1
A2
A1
A0
V
IN
50Ω
S2 TO S7
S8
V
R
S8
ADG708*
V
S1
90%
V
D
OUT
2.4V
EN
V
C
35pF
OUT
L
L
GND
300Ω
90%
V
S8
tTRANSITION
tTRANSITION
*SIMILAR CONNECTION FOR ADG709.
Figure 24. Switching Time of Multiplexer, tTRANSITION
V
V
V
V
3V
DD
SS
ADDRESS
DRIVE (V
)
DD
SS
IN
V
S1
S
A2
A1
A0
0V
V
S2 TO S7
IN
50Ω
S8
ADG708*
V
D
OUT
80%
80%
2.4V
EN
V
OUT
C
35pF
R
300Ω
L
L
GND
tOPEN
*SIMILAR CONNECTION FOR ADG709.
Figure 25. Break-Before-Make Delay, tOPEN
Rev. D | Page 15 of 20
ADG708/ADG709
Data Sheet
V
V
V
3V
DD
SS
ENABLE
50%
50%
V
DRIVE (V
)
DD
SS
IN
A2
A1
A0
V
S1
S
0V
S2 TO S8
tOFF (EN)
0.9V
V
O
ADG708*
0.9V
O
O
V
OUTPUT
0V
EN
D
OUT
C
35pF
R
300Ω
GND
L
V
IN
L
50Ω
tON (EN)
*SIMILAR CONNECTION FOR ADG709.
Figure 26. Enable Delay, tON (EN), tOFF (EN)
V
V
V
V
3V
DD
SS
SS
LOGIC INPUT
(V
)
IN
DD
A2
A1
A0
0V
ADG708*
R
S
D
S
V
V
C
1nF
ΔV
OUT
OUT
OUT
V
L
S
EN
Q
= C × ΔV
OUT
INJ
L
V
GND
IN
*SIMILAR CONNECTION FOR ADG709.
Figure 27. Charge Injection
V
V
SS
DD
0.1µF
0.1µF
NETWORK
ANALYZER
V
V
SS
DD
A2
A1
A0
S
50Ω
50Ω
V
S
D
V
OUT
2.4V
EN
R
L
50Ω
GND
V
OUT
OFF ISOLATION = 20 log
V
S
Figure 28. Off Isolation
V
V
SS
DD
0.1µF
0.1µF
V
V
DD
SS
A2
A1
A0
S1
EN
2.4V
NETWORK
ANALYZER
ADG708*
50Ω
D
NETWORK
V
OUT
ANALYZER
R
50Ω
L
50Ω
S2
S8
GND
V
S
*SIMILAR CONNECTION FOR ADG709.
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
V
OUT
V
S
Figure 29. Channel-to-Channel Crosstalk
Rev. D | Page 1± of 20
Data Sheet
ADG708/ADG709
V
V
SS
DD
0.1µF
0.1µF
NETWORK
ANALYZER
V
V
SS
DD
A2
A1
A0
S
50Ω
V
S
D
V
OUT
2.4V
EN
R
L
50Ω
GND
V
WITH SWITCH
OUT
INSERTION LOSS = 20 log
V
WITHOUT SWITCH
OUT
Figure 30. Bandwidth
Rev. D | Page 17 of 20
ADG708/ADG709
TERMINOLOGY
Data Sheet
VDD
tTRANSITION
Most positive power supply potential.
Delay time measured between the 50% and 90% points of the
digital inputs and the switch on condition when switching from
one address state to another.
VSS
Most negative power supply in a dual-supply application. In
single-supply applications, tie VSS to ground at the device.
tON (EN)
Delay time between the 50% and 90% points of the EN digital
input and the switch on condition.
GND
Ground (0 V) reference.
tOFF (EN)
S
Delay time between the 50% and 90% points of the EN digital
input and the switch off condition.
Source terminal. Can be an input or output.
D
tOPEN
Drain terminal. Can be an input or output.
Off time measured between the 80% points of both switches
when switching from one address state to another.
Ax
Logic control input.
Off Isolation
A measure of unwanted signal coupling through an off switch.
EN
Active high enable.
Crosstalk
A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance.
RON
Ohmic resistance between D and S.
Charge
RF L AT (ON)
A measure of the glitch impulse transferred from injection of
the digital input to the analog output during switching.
Flatness is defined as the difference between the maximum and
minimum value of on resistance as measured over the specified
analog signal range.
Bandwidth
The frequency at which the output is attenuated by 3 dB.
IS (Off)
Source leakage current with the switch off.
On Response
The frequency response of the on switch.
ID (Off)
Drain leakage current with the switch off.
On Loss
The loss due to the on resistance of the switch.
ID, IS (On)
Channel leakage current with the switch on.
VINL
Maximum input voltage for Logic 0.
VD (VS)
Analog voltage on Terminal D and Terminal S.
VINH
Minimum input voltage for Logic 1.
CS (Off)
Off switch source capacitance. Measured with reference to ground.
IINL (IINH
)
Input current of the digital input.
CD (Off)
Off switch drain capacitance. Measured with reference to ground.
IDD
Positive supply current.
CD, CS (On)
On switch capacitance. Measured with reference to ground.
ISS
Negative supply current.
CIN
Digital input capacitance.
Rev. D | Page 18 of 20
Data Sheet
ADG708/ADG709
APPLICATIONS INFORMATION
POWER SUPPLY SEQUENCING
When using CMOS devices, take care to ensure correct power
supply sequencing. Incorrect power supply sequencing can
result in the device being subjected to stresses beyond the
maximum ratings listed in Figure 4.
Always apply digital and analog inputs after power supplies and
ground. For single-supply operation, tie VSS to GND as close to
the device as possible.
Rev. D | Page 19 of 20
ADG708/ADG709
Data Sheet
OUTLINE DIMENSIONS
5.10
5.00
4.90
16
9
8
4.50
4.40
4.30
6.40
BSC
1
PIN 1
1.20
MAX
0.15
0.05
0.20
0.09
0.75
0.60
0.45
8°
0°
0.30
0.19
0.65
BSC
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model1, 2
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
Package Option
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
RU-1±
ADG708BRU
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
1±-Lead Thin Shrink Small Outline Package [TSSOP]
ADG708BRU-REEL
ADG708BRU-REEL7
ADG708BRUZ
ADG708BRUZ-REEL
ADG708BRUZ-REEL7
ADG708CRU
ADG708CRU-REEL
ADG708CRUZ
ADG708CRUZ-REEL
ADG708CRUZ-REEL7
ADW54008-0REEL7
ADG709BRU
ADG709BRU-REEL
ADG709BRU-REEL7
ADG709BRUZ
ADG709BRUZ-REEL
ADG709BRUZ-REEL7
ADG709CRU-REEL7
ADG709CRUZ
ADG709CRUZ-REEL
ADG709CRUZ-REEL7
1 Z = RoHS Compliant Part.
2 W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The ADW54008 models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
©2000–2013 Analog Devices, Inc. All rights reserved. Trademarksand
registered trademarks are the property of their respective owners.
D00041-0-1/13(D)
Rev. D | Page 20 of 20
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